Vehicle lighting device and vehicle lamp

Abstract

To provide a vehicular lighting device and a vehicular lighting fixture capable of improving light extraction efficiency and suppressing attachment of a resin to a light emission surface of a light emitting element.SOLUTION: A vehicular lighting device includes: a socket; a substrate disposed at one end portion side of the socket; at least one light emitting element disposed on the substrate; a frame portion disposed at a side of the light emitting element, of the substrate, having a frame shape, and surrounding the light emitting element; and a joining portion disposed between the substrate and the frame portion, and having reflectivity to the light emitted from the light emitting element, higher than that of the substrate. In a direction orthogonal to a central axis of the frame portion, a formula of L / 3(mm)≤L1(mm)<L / 2(mm) is satisfied when a distance between an end portion at a substrate side, of an inner wall of the frame portion and a side face of the light emitting element is L (mm), and a distance between an end portion at a light emitting element side and the end portion at the substrate side of the inner wall of the frame portion is L1 (mm).SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] FIELD An embodiment of the present invention relates to a vehicle lighting device and a vehicle lamp. [Background technology]

[0002] 2. Description of the Related Art From the viewpoint of energy saving and long life, vehicle lighting devices equipped with light emitting elements such as light emitting diodes are becoming increasingly popular instead of vehicle lighting devices equipped with filaments. In recent years, there has been a demand for miniaturization of vehicle lighting devices. To this end, a vehicle lighting device has been proposed that includes a substrate, a chip-shaped light-emitting element mounted on the substrate, a frame that surrounds the light-emitting element, and a sealing portion that is provided inside the frame and covers the light-emitting element.

[0003] If a frame is provided surrounding the light emitting element, the light emitted from the light emitting element and incident on the inner wall of the frame can be reflected toward the front side of the vehicle lighting device, thereby improving the light extraction efficiency.

[0004] Here, light leaking from the side of the chip-shaped light-emitting element or light reflected at the interface between the sealing portion and the outside air may be incident on the surface of the substrate exposed inside the frame. Therefore, if the light incident on the surface of the substrate exposed inside the frame can be reflected toward the front side of the vehicle lighting device, the light extraction efficiency can be further improved.

[0005] For example, it is conceivable to apply a highly reflective resin to the surface of the substrate exposed inside the frame. However, because a chip-shaped light-emitting element is provided inside the frame, the resin applied to the surface of the substrate may adhere to the light-emitting surface (top surface) of the light-emitting element. If the resin adheres to the light-emitting surface of the light-emitting element, the amount of light emitted may be reduced. Therefore, there has been a demand for the development of a technology that can improve the light extraction efficiency and prevent the resin from adhering to the light emitting surface of the light emitting element. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-010948 Summary of the Invention [Problem to be solved by the invention]

[0007] The problem that the present invention aims to solve is to provide a vehicle lighting device and a vehicle lamp that can improve light extraction efficiency and prevent resin from adhering to the light emission surface of the light-emitting element. [Means for solving the problem]

[0008] A vehicle lighting device according to an embodiment includes a socket, a substrate provided on one end of the socket, at least one light-emitting element provided on the substrate, a frame portion provided on the side of the substrate where the light-emitting element is provided, the frame-shaped frame portion surrounding the light-emitting element, and a joint portion provided between the substrate and the frame portion and having a reflectance higher than that of the substrate for light emitted from the light-emitting element. In a direction perpendicular to the central axis of the frame portion, the distance between the end of the inner wall of the frame portion on the substrate side and the side of the light-emitting element is defined as L (mm), and the distance between the end of the light-emitting element side of the part of the joint portion provided inside the frame portion and the end of the inner wall of the frame portion on the substrate side is defined as L1 (mm). , the thickness of the light-emitting element is 0.12 mm or less, and the distance L (mm) is 0.57 mm or less. In this case, the following equation is satisfied: L / 3 (mm) ≦ L1 (mm) <L / 2(mm) [Effects of the Invention]

[0009] According to an embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can improve light extraction efficiency and prevent resin from adhering to the light emission surface of the light-emitting element. [Brief explanation of the drawings]

[0010] [Figure 1]1 is a schematic exploded view illustrating a vehicle lighting device according to an embodiment of the present invention; [Figure 2] 2 is a cross-sectional view of the vehicle lighting device taken along line AA in FIG. 1. [Figure 3] FIG. 3 is a schematic enlarged view of part B in FIG. [Figure 4] FIG. 2 is a schematic partial cross-sectional view illustrating a vehicle lamp. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments will be illustrated with reference to the drawings. In the drawings, like components are designated by like reference numerals and detailed descriptions thereof will be omitted where appropriate.

[0012] (Vehicle lighting device) The vehicle lighting device 1 according to this embodiment can be installed in, for example, an automobile, a railway vehicle, etc. Examples of the vehicle lighting device 1 installed in an automobile include those used as front combination lights (for example, an appropriate combination of daytime running lamps (DRLs), position lamps, turn signal lamps, etc.) and rear combination lights (for example, an appropriate combination of stop lamps, tail lamps, turn signal lamps, backup lamps, fog lamps, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

[0013] FIG. 1 is a schematic exploded view illustrating a vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG. As shown in FIGS. 1 and 2, a vehicle lighting device 1 includes, for example, a socket 10, a light-emitting module 20, a power supply unit 30, and a heat transfer unit 40.

[0014] The socket 10 includes, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on one surface 13a of the flange 13. The outer shape of the mounting portion 11 can be columnar. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

[0015] The bayonet 12 is provided, for example, on the side surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 may be provided. The bayonet 12 is used when mounting the vehicle lighting device 1 to, for example, a housing 101 of a vehicle lamp 100 described below. The bayonet 12 can be used for a twist lock.

[0016] The flange 13 has, for example, a plate shape. The flange 13 has, for example, a substantially circular plate shape. The flange 13 has a surface 13a and a surface 13b opposite to the surface 13a. The side surface of the flange 13 is located outward from the side surface of the bayonet 12 to the vehicle lighting device 1.

[0017] The heat dissipation fins 14 are provided, for example, on the surface 13b of the flange 13. At least one heat dissipation fin 14 can be provided. For example, as shown in FIG. 2, the socket 10 can be provided with a plurality of heat dissipation fins 14. The plurality of heat dissipation fins 14 can be arranged side by side in a predetermined direction. The heat dissipation fins 14 are, for example, plate-shaped or cylindrical.

[0018] The connector holder 15 is provided, for example, on the surface 13b of the flange 13. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 is cylindrical, and a connector 105 having a seal member 105a therein is inserted into the connector holder 15.

[0019] The socket 10 has the function of holding the light-emitting module 20 and the power supply unit 30, and the function of conducting heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably made of a material with high thermal conductivity. For example, the socket 10 can be made of a metal such as an aluminum alloy.

[0020] In recent years, it has become desirable for the socket 10 to be lightweight and capable of efficiently dissipating heat generated in the light-emitting module 20. Therefore, it is more preferable that the socket 10 be formed from, for example, a highly thermally conductive resin. The highly thermally conductive resin includes, for example, a resin and a filler using an inorganic material. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler using carbon, aluminum oxide, or the like.

[0021] If the socket 10 contains a highly thermally conductive resin and has the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 integrally molded, the heat generated in the light-emitting module 20 can be efficiently dissipated. The weight of the socket 10 can also be reduced. In this case, the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 can be integrally molded using injection molding or the like. Alternatively, the socket 10 and the heat transfer portion 40 can be integrally molded using insert molding, or the socket 10, power supply portion 30, and heat transfer portion 40 can be integrally molded.

[0022] The light emitting module 20 (substrate 21) is provided on one end side of the socket 10. The light emitting module 20 includes, for example, a substrate 21, a light emitting element 22, a frame 23, a sealing portion 24, an element 25, and a bonding portion 26.

[0023] The substrate 21 is adhered to the surface 40a of the heat transfer unit 40. In this case, the adhesive is preferably an adhesive with high thermal conductivity. For example, the adhesive may be an adhesive mixed with a filler using an inorganic material.

[0024] The substrate 21 has a plate-like shape. The planar shape of the substrate 21 is, for example, a rectangle. The substrate 21 can be formed from, for example, an inorganic material such as ceramics (e.g., aluminum oxide or aluminum nitride), or an organic material such as paper phenol or glass epoxy. The substrate 21 may also be a metal core substrate in which the surface of a metal plate is coated with an insulating material. When the light emitting element 22 generates a large amount of heat, it is preferable to form the substrate 21 using a material with high thermal conductivity from the perspective of heat dissipation. Examples of materials with high thermal conductivity include ceramics such as aluminum oxide or aluminum nitride, highly thermally conductive resins, and metal core substrates. The substrate 21 may have a single-layer structure or a multi-layer structure.

[0025] Furthermore, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a is made of, for example, a material containing silver as a main component or a material containing copper as a main component.

[0026] It is also possible to provide a covering portion that covers the wiring pattern 21a, a film-like resistor (to be described later), etc. The covering portion may contain, for example, a glass material.

[0027] The light emitting element 22 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.

[0028] The light emitting element 22 is provided on the substrate 21 (the side opposite to the heat transfer section 40). The light emitting element 22 is electrically connected to the wiring pattern 21a. At least one light emitting element 22 can be provided. When a plurality of light emitting elements 22 are provided, the plurality of light emitting elements 22 can be connected in series with each other.

[0029] The light-emitting element 22 may be a chip-type light-emitting element. If the light-emitting element 22 is a chip-type light-emitting element, the light-emitting module 20 can be made smaller, and therefore the vehicle lighting device 1 can be made smaller. The chip-type light-emitting element 22 can be mounted on the wiring pattern 21a by COB (Chip On Board). The chip-type light-emitting element 22 may be, for example, an upper electrode type light-emitting element, a top and bottom electrode type light-emitting element, or a flip-chip type light-emitting element. The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those exemplified, and can be changed as appropriate depending on the size, use, etc. of the vehicle lighting device 1.

[0030] The frame portion 23 has a frame shape and is provided on the side of the substrate 21 where the light emitting element 22 is provided. The frame portion 23 surrounds the light emitting element 22. The frame portion 23 has, for example, a function of defining the formation area of ​​the sealing portion 24 and a function of a reflector.

[0031] The frame 23 is formed from, for example, a resin, such as a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

[0032] In order to increase the reflectance of the light emitted from the light emitting element 22, the resin may contain particles of titanium oxide or may be a white resin.

[0033] Furthermore, the inner wall of frame portion 23 may be perpendicular to the surface of substrate 21 or may be inclined relative to the surface of substrate 21. For example, as shown in Fig. 2, the inner wall of frame portion 23 may be inclined toward the outside of frame portion 23 as it approaches the end of frame portion 23 opposite to the substrate 21 side.

[0034] If the reflectance of the frame portion 23 is high or if the inner wall of the frame portion 23 is an inclined surface, it becomes easier for the light incident on the inner wall of the frame portion 23 to be emitted toward the front side of the vehicle lighting device 1. Therefore, the light extraction efficiency can be improved.

[0035] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a light-transmitting resin. The sealing portion 24 is formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, a silicone resin or the like.

[0036] Furthermore, the sealing portion 24 may contain a phosphor. The phosphor may be, for example, a YAG-based phosphor (yttrium-aluminum-garnet-based phosphor). However, the type of phosphor may be changed as appropriate to obtain a predetermined emission color depending on the application of the vehicle lighting device 1.

[0037] The element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The element 25 is provided, for example, on the periphery of the frame portion 23 and electrically connected to the wiring pattern 21a. At least one element 25 can be provided.

[0038] The element 25 may be, for example, a resistor 25a and a control element 25b. However, the type of element 25 is not limited to the exemplified ones, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to the above-mentioned ones, the element 25 may also be a capacitor, a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, an inductor, a surge absorber, a varistor, a transistor such as an FET or a bipolar transistor, an integrated circuit, an arithmetic element, or the like.

[0039] The resistor 25a is provided on the substrate 21. The resistor 25a is electrically connected to the wiring pattern 21a. The resistor 25a may be, for example, a surface-mount resistor, a resistor with leads (metal oxide film resistor), or a film resistor formed by screen printing or the like. The resistor 25a illustrated in FIG. 1 is a film resistor.

[0040] The film resistor is made of, for example, ruthenium oxide (RuO2). The film resistor is formed by, for example, screen printing and firing. If the resistor 25a is a film resistor, the contact area between the resistor 25a and the substrate 21 can be increased, thereby improving heat dissipation. Furthermore, multiple resistors 25a can be formed at once, thereby improving productivity. Furthermore, variations in the resistance values ​​of the multiple resistors 25a can be suppressed.

[0041] Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the voltage applied between the anode terminal and the ground terminal is kept constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitted from the light-emitting element 22. Therefore, to keep the brightness of the light emitted from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is controlled to be within a predetermined range by using the resistor 25a connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25a is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

[0042] If the resistor 25a is a surface-mount resistor or a resistor with leads, the resistor 25a should have an appropriate resistance value depending on the forward voltage characteristics of the light-emitting element 22. If the resistor 25a is a film resistor, the resistance value can be increased by removing a portion of the resistor 25a. For example, a portion of the film resistor can be easily removed by irradiating it with laser light. The number and size of the resistors 25a are not limited to those illustrated, and can be changed as appropriate depending on the number and specifications of the light-emitting elements 22.

[0043] The control element 25b is provided on the substrate 21. The control element 25b is electrically connected to the wiring pattern 21a. The control element 25b is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from being applied from the reverse direction to the light-emitting element 22. The control element 25b is, for example, a surface-mounted diode or a diode with leads. The control element 25b illustrated in FIG. 1 is a surface-mounted diode.

[0044] The joint 26 is provided between the frame 23 and the substrate 21. The joint 26 bonds the frame 23 onto the substrate 21. The details of the joint 26 will be described later.

[0045] The power supply unit 30 includes, for example, a plurality of power supply terminals 31 and a holding unit 32 . The plurality of power supply terminals 31 may be rod-shaped. One end of each of the plurality of power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. The plurality of power supply terminals 31 are arranged, for example, lined up in a predetermined direction. One end of each of the plurality of power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of each of the plurality of power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted into the plurality of power supply terminals 31 exposed inside the hole of the connector holder 15. The plurality of power supply terminals 31 are formed of a metal such as a copper alloy. The shape, arrangement, material, etc. of the plurality of power supply terminals 31 are not limited to those exemplified and can be changed as appropriate.

[0046] For example, if the socket 10 is made of a metal such as an aluminum alloy or a highly thermally conductive resin containing a carbon-based filler, the socket 10 will be electrically conductive. Therefore, the retaining portion 32 is provided to insulate the multiple power supply terminals 31 from the electrically conductive socket 10. The retaining portion 32 also has the function of holding the multiple power supply terminals 31. The retaining portion 32 is made of, for example, an insulating resin. For example, the retaining portion 32 can be press-fitted into a hole in the socket 10 or adhered to the inner wall of the hole. Note that if the socket 10 is made of, for example, a highly thermally conductive resin containing an aluminum oxide-based filler, the socket 10 will be electrically insulating. In such a case, the retaining portion 32 can be omitted.

[0047] The heat transfer section 40 is plate-shaped and is provided between the socket 10 and the light-emitting module 20 (substrate 21). A surface 40a of the heat transfer section 40 is exposed from the end of the socket 10 on the side where the light-emitting module 20 is provided. The heat transfer section 40 can be embedded in the bottom surface 11a1 of the recess 11a, or can be adhered to the bottom surface 11a1 of the recess 11a, or can be adhered to a convex pedestal provided on the bottom surface 11a1 of the recess 11a.

[0048] The heat transfer section 40 is provided to facilitate the transfer of heat generated in the light-emitting module 20 to the socket 10. For this reason, the heat transfer section 40 is preferably formed from a material with high thermal conductivity (for example, a metal such as aluminum, an aluminum alloy, copper, or a copper alloy).

[0049] The heat transfer section 40 can be omitted. However, in recent years, there has been a demand for higher luminous flux in the vehicle lighting device 1, and the current flowing through the light-emitting element 22 tends to increase. This has resulted in an increase in the amount of heat generated in the light-emitting module 20. Furthermore, in recent years, there has been a demand for smaller vehicle lighting devices 1, and the cross-sectional area of ​​the mounting section 11 tends to become smaller. If the cross-sectional area of ​​the mounting section 11 becomes smaller, it becomes more difficult for the heat generated in the light-emitting module 20 to be transferred to the heat dissipation fins 14, and heat dissipation via the heat dissipation fins 14 may become more difficult. Therefore, in consideration of the need for higher luminous flux and smaller size in the vehicle lighting device 1, it is preferable to provide the heat transfer section 40.

[0050] Next, the joint 26 will be further described. FIG. 3 is a schematic enlarged view of part B in FIG. As described above, the joint 26 bonds the frame 23 to the substrate 21. The joint 26 is, for example, a hardened adhesive. In this case, as shown in FIG. 3 , the joint 26 can be made to protrude into the inside of the frame 23. By making the joint 26 protrude into the inside of the frame 23, it is possible to prevent the occurrence of a portion (a gap) without the joint 26 between the frame 23 and the substrate 21. This makes it possible to improve the adhesive strength between the frame 23 and the substrate 21 and to prevent moisture and the like from penetrating into the inside of the frame 23 via the joint 26.

[0051] Here, a portion of the light emitted from the light-emitting element 22 is reflected at the interface between the sealing portion 24 and the outside air (air) and heads toward the substrate 21. At this time, a portion of the light headed toward the substrate 21 is incident on the portion 26a of the joint 26 provided inside the frame portion 23. Therefore, if the reflectance of the portion 26 with respect to the light emitted from the light-emitting element 22 is higher than the reflectance of the substrate 21, the light that has entered the portion 26a is more likely to be reflected toward the interface between the sealing portion 24 and the outside air. This makes it possible to improve the light extraction efficiency.

[0052] For example, the bonding portion 26 may contain a resin such as silicone or epoxy, and particles such as titanium oxide. For example, the bonding portion 26 may contain a white resin. For example, the bonding portion 26 may be formed by curing an adhesive containing particles such as titanium oxide or an adhesive containing a white resin.

[0053] In this case, as shown in Figure 3, if the distance L1 (mm) between the end 26a1 of portion 26a on the light-emitting element 21 side and the end 23a of the inner wall of frame portion 23 on the substrate 21 side is increased in a direction perpendicular to the central axis 23b of frame portion 23, the amount of light incident on portion 26a increases, thereby improving the light extraction efficiency.

[0054] However, when the frame 23 is adhered to the substrate 21, if the adhesive reaches the side surface 22a of the light emitting element 22 that is closest to the inner wall of the frame 23, there is a risk that the adhesive will creep up onto the light emitting surface of the light emitting element 22. If the adhesive creeps up onto the light emitting surface of the light emitting element 22, there is a risk that the amount of light emitted from the light emitting element 22 will decrease.

[0055] In recent years, the light-emitting element 22 has become smaller in size, and the thickness of the light-emitting element 22 has become thinner. Furthermore, there is a demand for a smaller light-emitting module 20 in order to reduce the size of the vehicle lighting device 1. In order to reduce the size of the light-emitting module 20, it is necessary to reduce the size of the frame portion 23. When the frame portion 23 is reduced in size, the distance L (mm) between the end 23a of the inner wall of the frame portion 23 on the substrate 21 side and the side surface 22a of the light-emitting element 22 closest to the inner wall of the frame portion 23 becomes smaller in a direction perpendicular to the central axis 23b of the frame portion 23. For example, in recent years, the distance L (mm) may be 0.57 mm or less, and the thickness of the light emitting element 22 may be 0.12 mm or less. Therefore, the adhesive can easily reach the side surface 22a of the light emitting element 22 that is closest to the inner wall of the frame portion .

[0056] According to the findings obtained by the present inventor, if "L / 3 (mm) ≤ L1 (mm)", it is possible to obtain substantially the same light extraction efficiency as when "L1 (mm) = L (mm)" (when the adhesive reaches the side surface 22a of the light emitting element 22).

[0057] That is, in recent years, the size of the frame portion 23 has been reduced and the distance L (mm) has become shorter. Therefore, if "L / 3 (mm) ≤ L1 (mm)", it is possible to obtain substantially the same light extraction efficiency as when "L1 (mm) = L (mm)".

[0058] On the other hand, in order to prevent the adhesive from creeping onto the light emitting surface of the light emitting element 22, it is sufficient to set "L1 (mm) < L (mm)". However, the position of the end portion 26a1 on the light emitting element 21 side of the portion 26a varies depending on the viscosity and amount of the adhesive, the force for pressing the frame portion 23 against the adhesive, and the like.

[0059] According to the findings obtained by the present inventor, if "L1 (mm) < L / 2 (mm)", even if the thickness of the light emitting element 22 becomes thin, the viscosity of the adhesive, the amount of the adhesive, and the force for pressing the frame portion 23 against the adhesive vary, it is possible to prevent the adhesive from creeping onto the light emitting surface of the light emitting element 22.

[0060] That is, if "L / 3 (mm) ≤ L1 (mm) < L / 2 (mm)", it is possible to improve the light extraction efficiency and prevent the resin from adhering to the light emitting surface of the light emitting element 22.

[0061] (Vehicle lighting fixture) Next, the vehicle lighting fixture 100 will be exemplified. In the following, as an example, a case where the vehicle lighting fixture 100 is a front combination light provided on an automobile will be described. However, the vehicle lighting fixture 100 is not limited to the front combination light provided on an automobile. The vehicle lighting fixture 100 may be any vehicle lighting fixture provided on an automobile, a railway vehicle, or the like.

[0062] FIG. 4 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG. As shown in FIG. 4, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0063] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end open. The housing 101 is formed, for example, from a light-opaque resin. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted. A recess is provided around the periphery of the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that although the case where the mounting hole 101a is directly provided in the housing 101 has been exemplified, a mounting member having the mounting hole 101a may also be provided on the housing 101.

[0064] When attaching the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 where the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in a fitting portion provided on the periphery of the mounting hole 101a. This type of attachment method is called a twist lock.

[0065] The cover 102 is provided so as to cover the opening of the housing 101. The cover 102 is made of a light-transmitting resin or the like. The cover 102 may also have a function such as a lens.

[0066] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in FIG. 4 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 and forms a predetermined light distribution pattern.

[0067] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 is annular and made of an elastic material such as rubber or silicone resin. When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the seal member 104 can seal the internal space of the housing 101. In addition, the elastic force of the seal member 104 presses the bayonet 12 against the housing 101. Therefore, it is possible to prevent the vehicle lighting device 1 from detaching from the housing 101.

[0068] The connector 105 is fitted to the ends of the plurality of power supply terminals 31 exposed inside the connector holder 15. A power source (not shown) and the like are electrically connected to the connector 105. Therefore, by fitting the connector 105 to the ends of the plurality of power supply terminals 31, the power source (not shown) and the light-emitting element 22 can be electrically connected.

[0069] Furthermore, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the inside of the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0070] Although several embodiments of the present invention have been described above, these embodiments are presented by way of example only and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention and its equivalents as set forth in the claims. Furthermore, the above-described embodiments can be implemented in combination with each other. [Explanation of symbols]

[0071] 1 Vehicle lighting device, 10 Socket, 11 Mounting portion, 20 Light emitting module, 21 Board, 22 Light emitting element, 22a Side, 23 Frame portion, 23a End, 23b Center axis, 24 Sealing portion, 26 Joint portion, 26a Portion, 26a1 End, 100 Vehicle lighting fixture, 101 Housing

Claims

1. Socket and; a substrate provided on one end side of the socket; at least one light emitting element disposed on the substrate; a frame portion provided on the side of the substrate where the light emitting element is provided, the frame portion having a frame shape and surrounding the light emitting element; a bonding portion provided between the substrate and the frame portion, the bonding portion having a reflectance higher than that of the substrate with respect to light emitted from the light-emitting element; Equipped with In a direction perpendicular to the central axis of the frame portion, The distance between the end of the inner wall of the frame portion on the substrate side and the side surface of the light-emitting element is L (mm), The distance between the end of the joint portion provided inside the frame portion on the light-emitting element side and the end of the inner wall of the frame portion on the substrate side is L1 (mm), The thickness of the light-emitting element is 0.12 mm or less, A vehicle lighting device that satisfies the following formula when the distance L (mm) is 0.57 mm or less. L / 3 (mm)≦L1 (mm)<L / 2 (mm)

2. The vehicle lighting device according to claim 1 , wherein the bonding portion contains a resin and particles of titanium oxide.

3. The vehicle lighting device according to claim 1 , wherein the joint portion includes a white resin.

4. The vehicle lighting device according to any one of claims 1 to 3; a housing to which the vehicle lighting device is attached; A vehicle lighting fixture equipped with:

Images