Position correction system, position correction method, program, and machining system

The position correction system addresses positioning issues in glass molding by calculating and adjusting the center-of-gravity position of enclosed glass materials, improving yield and optical quality through precise alignment.

JP7777771B2Active Publication Date: 2025-12-01PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
JP2021089475
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-05-27
Publication Date
2025-12-01
Estimated Expiration
2041-05-27

AI Technical Summary

Technical Problem

Existing glass molding devices face issues with defects such as insufficient wall thickness and cracks due to improper positioning of the glass material in the mold, which is exacerbated by the inability to photograph the material when it is enclosed, leading to inconsistent yield and optical quality.

Method used

A position correction system that utilizes a load detection device to calculate the center-of-gravity position of a workpiece on a mounting surface and corrects its position using an impact device until it aligns within a predetermined threshold, enabling precise placement without visual exposure.

Benefits of technology

This method improves yield and optical quality by ensuring accurate positioning of glass materials during molding, even when they are not exposed, thereby reducing defects and enhancing productivity.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a position correcting system capable of correcting a position of a workpiece even when the workpiece is not exposed to improve yield; to provide a position correcting method; to provide a program; and to provide a processing system.SOLUTION: A position correcting system 10 includes: a load detection device 30 detecting a load of a holding part 1 having a placing surface 1a on which a workpiece 5 is placed; an impact device 7 applying impact to the holding part 1; and an arithmetic device 50 executing a gravity center position calculating processing for calculating a gravity center position of the workpiece 5 on the placing surface 1a on the basis of a detection result by the load detection device 30, and a correction processing for correcting the position of the workpiece 5 by applying impact to the holding part 1 by the impact device 7 until a distance between the gravity center position calculated by the gravity center position calculating processing and a reference position on the placing surface 1a becomes equal to or lower than a prescribed distance threshold value.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present disclosure relates to a position correction system, a position correction method, a program (computer program), and a processing system. [Background technology]

[0002] Conventionally, processing systems have been proposed for performing various processes such as molding, punching, sheet metal processing, and laser processing. For example, Patent Document 1 discloses a glass forming apparatus for forming a glass material to obtain a glass formed product of a predetermined shape. The glass forming apparatus disclosed in Patent Document 1 includes a binarization means for binarizing an image of a bottom mold containing a molten glass gob captured by an imaging camera through image processing; a CRT for outputting and displaying the distance from the mold wall to the contained molten glass gob and the position of the center of gravity of the molten glass gob as images and numerical values; a positional deviation output means for outputting deviation amounts in the x and y directions from reference values ​​of the distance to the molten glass gob / the position of the center of gravity of the molten glass gob; a funnel drive control means for driving and controlling a funnel that corrects the position according to the deviation amount; and a press-forming means for press-forming the molten glass gob. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-85754 Summary of the Invention [Problem to be solved by the invention]

[0004] In glass molding devices, depending on the position of the glass material in the bottom mold, defects such as insufficient wall thickness and cracks can occur in the molded glass product due to factors such as the outflow of molten glass material. To address this issue, workers manually correct the position, but this has the drawback of not achieving a stable yield due to differences in experience among workers and limitations in visual control ability. In contrast, the glass molding device disclosed in Patent Document 1 can correct the position of the glass material in the bottom mold, thereby improving yield. However, the glass molding device disclosed in Patent Document 1 is premised on the ability to photograph the glass material with an imaging camera, which requires the glass material to be exposed from the mold. For example, in the configuration of a mold for press-molding glass lenses, the glass material is placed on the bottom mold, and then the top mold closes the lid, preventing the glass material from being exposed from the mold, which poses a problem: the glass material cannot even be photographed with an imaging camera.

[0005] The present disclosure provides a position correction system, a position correction method, a program, and a processing system that can correct the position of a workpiece even when the workpiece is not exposed, thereby improving yield. [Means for solving the problem]

[0006] A position correction system according to one aspect of the present disclosure includes a load detection device that detects the load on a holding part having a mounting surface on which a workpiece is placed, an impact device that strikes the holding part, and a computing device that executes a center-of-gravity position calculation process that calculates the center-of-gravity position of the workpiece on the mounting surface based on the detection result of the load detection device, and a correction process that corrects the position of the workpiece by striking the holding part with the impact device until the distance between the center-of-gravity position calculated by the center-of-gravity position calculation process and a reference position on the mounting surface becomes equal to or less than a predetermined distance threshold.

[0007] A position correction method according to one aspect of the present disclosure is a position correction method executed by a calculation device connected to a load detection device that detects the load on a holding part having a mounting surface on which a workpiece is placed and an impact device that applies an impact to the holding part, and includes a center-of-gravity position calculation process that calculates the center-of-gravity position of the workpiece on the mounting surface based on the detection result of the load detection device, and a correction process that corrects the position of the workpiece by applying an impact to the holding part with the impact device until the distance between the center-of-gravity position calculated by the center-of-gravity position calculation process and a reference position on the mounting surface becomes equal to or less than a predetermined distance threshold.

[0008] A program according to one aspect of the present disclosure is a program for causing a computing device to execute the position correction method described above.

[0009] A processing system according to one aspect of the present disclosure includes the position correction system described above and a processing device that processes a workpiece placed on a placement surface. [Effects of the Invention]

[0010] According to the aspects of the present disclosure, even when the workpiece is not exposed, the position of the workpiece can be corrected, thereby improving yield. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a block diagram illustrating a configuration example of a machining system according to an embodiment; [Figure 2] A block diagram of a configuration example of a processing device in the processing system of FIG. [Figure 3] A cross-sectional view illustrating how the workpiece is machined when it is in the correct position [Figure 4] Cross-sectional view illustrating how a workpiece is machined when it is in the wrong position [Figure 5] An explanatory diagram illustrating the results of machining a workpiece when the workpiece is in the correct position. [Figure 6] An explanatory diagram illustrating the results of machining a workpiece when the workpiece is in an incorrect position. [Figure 7] FIG. 2 is an explanatory diagram illustrating a configuration example of a load detection device of the processing system of FIG. 1. [Figure 8] FIG. 10 is an explanatory diagram of an example of the relationship between the center of gravity of the workpiece and the reference position of the placement surface; [Figure 9] FIG. 10 is an explanatory diagram of another example of the relationship between the center of gravity of the workpiece and the reference position of the placement surface; [Figure 10] FIG. 2 is a cross-sectional view illustrating an example of impact processing in the correction processing of the machining system of FIG. 1; [Figure 11] FIG. 2 is a plan view illustrating an example of impact processing in the correction processing of the machining system of FIG. 1; [Figure 12] A graph showing the relationship between the impact force setting value and the movement amount of the workpiece in the processing system of Figure 1. [Figure 13] A graph showing the relationship between the number of impacts and the movement distance of the workpiece in the processing system of Figure 1. [Figure 14] FIG. 2 is a plan view showing an example of impact position correction in the correction process of the machining system of FIG. 1; [Figure 15] 1. A flowchart showing an example of the operation of the machining system of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] [1. Embodiment] [1.1 Overview] FIG. 1 is a block diagram of an example configuration of a processing system 100 according to one embodiment. The processing system 100 of FIG. 1 processes a workpiece 5 to produce a processed product from the workpiece 5. The workpiece 5 is, for example, a glass material. The processing is, for example, a molding process. The processed product is, for example, a molded glass product. The molded glass product is, for example, a glass lens. The glass material is pre-processed into a predetermined shape to obtain the desired shape of the glass lens. The predetermined shape is, for example, an ellipsoid or a sphere. In this embodiment, the workpiece 5 is a spherical glass material. In this embodiment, the processing system 100 is a glass molding system, particularly a glass lens molding system that mass-produces glass products such as lenses, which are representative optical elements, using molding techniques that use molds.

[0013] The machining system 100 in FIG. 1 includes a position correction system 10 and a machining device 20. The position correction system 10 corrects the position of the workpiece 5 on the mounting surface 1a of the holder 1. The system also includes a load detection device 30, an impact device 7, and a calculation device 50. The load detection device 30 detects the load of the holder 1, which has the mounting surface 1a on which the workpiece 5 is placed. The impact device 7 impacts the holder 1. The calculation device 50 executes a center-of-gravity position calculation process and a correction process. The center-of-gravity position calculation process calculates the center-of-gravity position of the workpiece 5 on the mounting surface 1a based on the detection result of the load detection device 30. The correction process corrects the position of the workpiece 5 by having the impact device 7 impact the holder 1 until the distance between the center-of-gravity position calculated in the center-of-gravity position calculation process and a reference position on the mounting surface 1a becomes equal to or less than a predetermined distance threshold.

[0014] In this way, the position correction system 10 calculates the center of gravity of the workpiece 5 on the mounting surface 1a based on the detection results of the load detection device 30, and then uses the impact device 7 to strike the holder 1 until the distance between the center of gravity of the workpiece 5 and a reference position on the mounting surface 1a becomes equal to or less than a predetermined distance threshold. This allows the workpiece 5 to be positioned appropriately on the mounting surface 1a. This avoids problems caused by the workpiece 5 not being positioned appropriately on the mounting surface 1a. For example, if the workpiece 5 is a glass material and a glass molded product is manufactured by molding the glass material, if the workpiece 5 is not positioned appropriately on the mounting surface 1a, the molten glass material may leak out, resulting in defects such as insufficient wall thickness or cracks in the molded glass product, reducing yield and insufficient optical properties. The position correction system 10 prevents problems caused by the workpiece 5 not being positioned appropriately on the mounting surface 1a. The position correction system 10 calculates the position of the center of gravity of the workpiece 5 on the placement surface 1a based on the load of the holder 1 detected by the load detection device 30, rather than on an image of the workpiece 5 captured by a camera or the like, and corrects the position of the workpiece 5 using this position of the center of gravity of the workpiece 5. Therefore, the position correction system 10 can correct the position of the workpiece 5 even when the workpiece 5 is not exposed, thereby improving yield.

[0015] [1.2 Details] The processing system 100 of this embodiment will be described in detail below. The processing system 100 is used to manufacture glass lenses by forming glass materials. As shown in FIG. 1, the processing system 100 includes a position correction system 10 and a processing device 20. The processing system 100 determines the position of the center of gravity of the workpiece 5 using the position correction system 10 and corrects the position of the workpiece 5. After correcting the position of the workpiece 5 using the position correction system 10, the processing system 100 forms a glass lens using the processing device 20.

[0016] As described above, in this embodiment, the workpiece 5 is a glass material. The holding unit 1 is a mold for forming the glass material. As shown in FIG. 1 , the holding unit 1 includes an upper mold 2, a lower mold 3, and a sleeve 4. The lower mold 3 has a mounting surface 1a on which the workpiece 5 is placed. The reference position on the mounting surface 1a is, for example, the center position of the mounting surface 1a. The upper mold 2 sandwiches the workpiece 5 placed on the mounting surface 1a between the lower mold 3 and the upper mold 2. The workpiece 5 is sandwiched between the upper mold 2 and the lower mold 3. The upper mold 2 and the lower mold 3 are arranged to face each other. The sleeve 4 holds the opposing upper mold 2 and lower mold 3. For example, the upper mold 2 and the lower mold 3 are cylindrical, and the sleeve 4 is cylindrical enough to accommodate the upper mold 2 and the lower mold 3 inside. The upper mold 2 is movable within the sleeve 4 along the central axis 11 of the holding unit 1 relative to the lower mold 3. The central axis 11 of the holder 1 coincides with the central axes of the upper mold 2, the lower mold 3, and the sleeve 4. The shapes of the mounting surface 1a of the lower mold 3 and the surface of the upper mold 2 facing the mounting surface 1a (the lower surface) are set according to the desired shape of the glass lens. The work of assembling the holder 1, that is, the work of placing the workpiece 5 between the upper mold 2 and the lower mold 3 and accommodating them in the sleeve 4, may be performed manually or may be automated by machine. machine By automating this, productivity can be increased.

[0017] The processing device 20 performs forming processing on the workpiece 5 using a holder 1, which is a mold. The forming processing is press molding. FIG. 2 is a block diagram of an example configuration of the processing device 20. The processing device 20 of FIG. 2 includes a housing 25 arranged on a stand 27. The interior of the housing 25 forms a processing chamber 25a. The processing chamber 25a is controlled in a vacuum or nitrogen atmosphere to prevent oxidation of the mold. The housing 25 includes an input shutter 26a at an entrance through which the holder 1 is input into the processing chamber 25a, and an output shutter 26b at an exit through which the holder 1 is removed from the processing chamber 25a. The processing device 20 includes multiple processing blocks 28-1 to 28-4 (hereinafter collectively referred to as 28) for processing the workpiece 5 within the processing chamber 25a of the housing 25. The processing block 28 includes a lower heater block 22a and an upper heater block 22b. Each of the lower heater block 22a and the upper heater block 22b has a plurality of rod-shaped heaters 21. The lower heater block 22a is placed on a heat insulating plate 23 arranged on the bottom surface of the housing 25. The upper heater block 22b is arranged to face the lower heater block 22a in the vertical direction and can be moved in the vertical direction by a press shaft (drive shaft) 24. The processing device 20 in FIG. 2 is an example of a glass lens molding device that can produce glass lenses by dividing the press molding process of the glass lens. The press molding process includes a throwing process, a heating process, a molding process, a first cooling process, a second cooling process, and a removal process. The multiple processing blocks 28-1 to 28-4 of the processing device 20 are responsible for the heating process, the molding process, the first cooling process, and the second cooling process, respectively. In each of the processing blocks 28-1 to 28-4 corresponding to the heating process, molding process, first cooling process, and second cooling process, the temperatures of the lower heater block 22a and the upper heater block 22b are controlled to the predetermined temperature for the corresponding process. In the processing device 20, the holder 1 is sequentially transferred and transported to locations corresponding to the processes at regular time intervals, thereby simultaneously molding and processing a plurality of glass lenses. In FIG. 2, the locations corresponding to the loading process, heating process, molding process, first cooling process, second cooling process, and removal process in the processing device 20 are labeled "loading," "heating," "molding," "cooling 1," "cooling 2," and "removal" to clearly indicate the locations.

[0018] Each step of the press forming will be described below. In the following description, in order to easily distinguish between the workpiece 5 before and after the shape change by the processing device 20, the workpiece 5 before the shape change by the processing device 20 will be given the symbol 5a, and the workpiece 5 after the shape change by the processing device 20 will be given the symbol 5b.

[0019] In the loading step, the holder 1 is transported, for example, by a transfer / transport mechanism from the position correction system 10 into the processing chamber 25a of the housing 25 of the processing device 20 and placed at the center of the lower heater block 22a of the processing block 28-1 corresponding to the heating step. The loading step is performed after the position correction system 10 determines that the distance between the center of gravity of the workpiece 5 and a reference position on the placement surface 1a is equal to or less than a predetermined distance threshold, or after the position correction system 10 corrects the distance between the center of gravity of the workpiece 5 and the reference position on the placement surface 1a so that it is equal to or less than the predetermined distance threshold. The loading unit shutter 26a opens immediately before the holder 1 is transferred and transported, and closes immediately after the holder 1 is placed at the center of the lower heater block 22a of the processing block 28-1, thereby preventing a drop in the ambient temperature in the processing chamber 25a.

[0020] In the heating process, the heater 21 of the processing block 28-1 raises the temperature of the workpiece 5, which is a glass material, to a temperature at which the workpiece 5 can be softened and formed. Because the heating process aims to heat the workpiece 5, the press shaft 24 is lowered and the upper heater block 22b rarely applies a load to the workpiece 5. Instead, the upper heater block 22b approaches or contacts the upper mold 2 of the holding unit 1 to raise the temperature of the upper mold 2. This is because applying a large load to the glass material workpiece 5a when its temperature is low could cause the workpiece 5a to crack or cause scratches or dents on the surfaces of the upper mold 2 and lower mold 3. After being heated for a certain period of time in the heating process, the holding unit 1 is transferred and transported to the processing block 28-2 corresponding to the forming process, and the next holding unit 1 is loaded into the processing block 28-1 corresponding to the heating process in the loading process.

[0021] In the forming process, as the press shaft 24 descends, a load is applied to the workpiece 5a by the upper heater block 22b, and the workpiece 5a is thermally deformed, so that the shape of the mold is transferred to the workpiece 5a, thereby obtaining a workpiece 5b with a changed shape. After a certain period of time has passed again, the holding unit 1 is sent to the processing block 28-3 corresponding to the first cooling process, and the next holding unit 1 from the processing block 28-1 corresponding to the heating process is placed in the processing block 28-2 corresponding to the forming process.

[0022] In the first cooling step, a load is applied to the upper mold 2 in the same manner as in the molding step. The load applied in the first cooling step is intended to hold the holder 1 for transfer, and is therefore smaller than the load applied in the molding step. The temperature of the heater 21 in the first cooling step is controlled to be lower than the temperature of the heater 21 in the molding step. In the first cooling step, the temperature of the workpiece 5b drops, causing the workpiece 5b to shrink, completing the transfer of the mold shapes of the upper mold 2 and lower mold 3 to the workpiece 5b. After a certain time has passed, the holder 1 is sent to the processing block 28-4 corresponding to the second cooling step, and the next holder 1 from the processing block 28-2 corresponding to the molding step is placed in the processing block 28-3 corresponding to the first cooling step.

[0023] In the second cooling step, the press shaft 24 lowers the upper heater block 22b, bringing it close to or into contact with the upper mold 2, thereby cooling the holder 1 and the workpiece 5b. The purpose of the second cooling step is to cool the workpiece 5b so that it can be removed from the processing chamber 25a in the subsequent removal step. Therefore, the temperature of the heater 21 in the second cooling step is controlled to be much lower than the temperature of the heater 21 in the first cooling step. After a certain time has passed, the holder 1 is removed from the processing chamber 25a, and the next holder 1 from the processing block 28-3 corresponding to the first cooling step is placed in the processing block 28-4 corresponding to the second cooling step. The removal unit shutter 26b opens just before the holder 1 is transferred and transported, and closes immediately after the holder 1 is removed from the processing chamber 25a, thereby preventing a drop in the ambient temperature in the processing chamber 25a.

[0024] In the removal step, the holder 1 removed from the processing chamber 25a is disassembled, and the workpiece 5b is removed from the holder 1. The step of disassembling the holder 1 and removing the workpiece 5b may be automated by a machine to increase productivity.

[0025] Thereafter, the holder 1 is assembled to accommodate a new workpiece 5a, and then provided to the position correction system 10. After the position correction system 10 has determined that the distance between the center of gravity of the workpiece 5 and the reference position on the placement surface 1a is equal to or less than a predetermined distance threshold, or after the position correction system 10 has corrected the distance between the center of gravity of the workpiece 5 and the reference position on the placement surface 1a so that it is equal to or less than the predetermined distance threshold, the holder 1 is loaded into the processing chamber 25a of the processing device 20 by a loading step.

[0026] In the above-described process of press-molding a glass lens using the processing apparatus 20, the heating process and cooling process may be divided into multiple stages depending on the type of glass material and the molding takt time. Furthermore, the temperatures of the lower heater block 22a and the upper heater block 22b often differ depending on the process, with the temperatures generally being higher in the heating process and molding process and lower in cooling processes such as the first cooling process and the second cooling process.

[0027] Next, the change in shape of the workpiece 5a due to press-molding of a glass lens by the processing device 20 will be described with reference to Fig. 3. Fig. 3 is a cross-sectional view showing press-molding of the workpiece 5a by the processing device 20 of the processing system 100. In particular, Fig. 3 is a cross-sectional view illustrating the processing when the workpiece 5a is in the correct position.

[0028] 3A shows the state of the holder 1 and workpiece 5a before press-molding by the processing device 20. The holder 1 is assembled by manually or mechanically placing the glass material 5a in the center of the lower mold 3 and then covering it with the sleeve 4 and upper mold 2. After the holder 1 is assembled, the workpiece 5a is sandwiched between the upper mold 2 and the lower mold 3, and the upper mold 2 and the lower mold 3 are held by the sleeve 4. After the holder 1 is assembled, as shown in FIG. 2, a load P1 is applied to the upper mold 2 by the processing block 28-1 corresponding to the molding process, and the workpiece 5a is press-molded in the direction of the central axis 11 of the holder 1.

[0029] In FIG. 3, (b) shows the state of the holder 1 and workpiece 5b after press molding by the processing device 20. The workpiece 5a is heated in the heating process, and is pressed in a melted and softened state to form the workpiece 5b having a lens surface shape. In the molding process shown in FIG. 2, only the lens surface shape is formed in the workpiece 55b, and the portion corresponding to the outer peripheral surface of the glass lens is not formed at the same time. When the temperature of the heater 21 drops after the press molding by the processing device 20 is completed, the workpiece 5b having the lens surface shape is cooled, and as a result, the workpiece 5b is solidified.

[0030] Thereafter, after the workpiece 5b is removed from the holder 1, the workpiece 5 is centered and centered to obtain a glass lens having a predetermined diameter, thereby forming a portion corresponding to the outer periphery of the glass lens. This completes the glass lens. In FIG. 3(a), since the center of the workpiece 5a is on the central axis 11 of the holder 1, the central axis of the workpiece 5b after press molding (i.e., the optical axis of the glass lens) coincides with the central axis 11 of the holder 1. In this way, by deforming the workpiece 5 symmetrically about the central axis 11 of the holder 1, it is possible to obtain a glass lens with sufficient optical properties.

[0031] However, in the press forming process, there are cases where the workpiece 5 is deformed asymmetrically with respect to the central axis 11 of the holder 1. A case where asymmetric deformation occurs in the workpiece 5 will be explained using Fig. 4. Fig. 4 is a cross-sectional view showing the process of asymmetric deformation occurring in press forming. In other words, Fig. 4 is a cross-sectional view explaining the state of processing when the workpiece 5a is in an incorrect position.

[0032] 4A shows the state of the holder 1 and the workpiece 5a before press-forming by the processing device 20, and FIG. 4B shows the state of the holder 1 and the workpiece 5a after press-forming by the processing device 20. Ideally, the center of the workpiece 5 should be located on the central axis 11 of the holder 1 (see FIG. 3A). However, as shown in FIG. 4B, the workpiece 5a may be placed at a position offset from the center of the lower mold 3 of the holder 1. Causes of the workpiece 5a being placed at a position offset from the center of the lower mold 3 include human error during assembly of the holder 1 or a misalignment due to an automatic machine driving error, and vibration during the transfer and transportation process before the holder 1 is inserted into the processing device 20. If press-forming is performed by the processing device 20 with the workpiece 5a placed at a position offset from the center of the lower mold 3, the workpiece 5b after forming will have a shape that is asymmetrically deformed with respect to the central axis 11 of the holder 1, as shown in FIG. 4B. With an asymmetrically shaped workpiece 5b, sufficient optical characteristics may not be obtained due to misalignment of the optical axis, and the workpiece 5b may also have uneven thickness or a defective shape.

[0033] The problem with the asymmetrically shaped workpiece 5b will be described in more detail with reference to Figures 5 and 6. Figures 5 and 6 are diagrams showing the state of the outer peripheral surface of the workpiece 5b after press forming.

[0034] FIG. 5 is an explanatory diagram illustrating the results of processing (workpiece 5b1 after press molding) when workpiece 5a is in the correct position. That is, FIG. 5 shows the state of the outer peripheral surface of workpiece 5b1 under normal conditions. In FIG. 5, the outer peripheral surface of the glass lens is formed along planned centering line 5c1 by centering after press molding. For the completed glass lens to fully exhibit its optical performance, it is desirable to deform symmetrically about the center position O of the mounting surface of holder 1, as in the shape of workpiece 5b1 after press molding, so that the center of the glass lens after centering coincides with the optical axis. Symmetrical deformation about the center position O of the mounting surface of holder 1 is not strictly defined; it is sufficient that the distance from the center position O of the mounting surface of holder 1 to any point on the outer periphery of workpiece 5a is within a specified range. As long as the center of gravity of workpiece 5a is within a certain range from the center position of the mounting surface of holder 1, workpiece 5a can be deformed symmetrically about the center position O of the mounting surface of holder 1.

[0035] FIG. 6 is an explanatory diagram illustrating the results of processing (workpiece 5b2 after press molding) when the workpiece 5a is in an incorrect position. That is, FIG. 6 shows the state of the outer peripheral surface of workpiece 5b2 in an abnormal state. In FIG. 6, the outer peripheral surface of the glass lens is formed along the centering line 5c2 by the centering process after press molding. If asymmetric deformation occurs with respect to the center position O of the mounting surface 1a of the holder 1, as in the shape of workpiece 5b2 in FIG. 6, the center of the glass lens after centering and the optical axis may not coincide, and sufficient optical properties may not be obtained. If the distance from the center position O of the mounting surface 1a of the holder 1 to any point on the outer periphery of workpiece 5a is outside the specified range, this can be considered as asymmetric deformation with respect to the center position O of the mounting surface 1a of the holder 1. Furthermore, as shown in FIG. 6, in some cases, the centering line 5c2 being outside the workpiece 5b2 may result in a defect in which centering is impossible in the first place.

[0036] Thus, if the workpiece 5a is not in the proper position on the mounting surface 1a of the holder 1, defects such as insufficient wall thickness or cracks may occur in the molded glass product, resulting in reduced yields and insufficient optical properties. Therefore, in the processing system 100, the position correction system 10 determines the position of the center of gravity of the workpiece 5 and corrects the position of the workpiece 5 on the mounting surface 1a of the holder 1. More specifically, the position correction system 10 adjusts the distance between the center of gravity of the workpiece 5 and a reference position on the mounting surface 1a to be equal to or less than a predetermined distance threshold. The position correction system 10 can be considered a center of gravity position determination and correction device.

[0037] The position correction system 10 in FIG. 1 includes a plate 6, a striking device 7, a striking position correction device 8, a load detection device 30, a control unit 40, and a calculation device 50.

[0038] The plate 6 is a platform on which the holder 1 is placed. The holder 1 is always positioned relative to the plate 6 by positioning using a knock pin or a jig, or by controlling a mechanism that installs the holder 1 on the plate 6. This allows the holder 1 to move integrally with the plate 6, and the holder 1 also rotates when the plate 6 is rotated by an impact position correction device 8 (described later). The holder 1 placed on the plate 6 is corrected by a position correction system 10 as necessary before being introduced into the processing device 20. The operation of placing the holder 1 on the plate 6 may be performed manually or may be automated by a machine. The operation of introducing the holder 1 into the processing device 20, i.e., the operation of transferring or transporting the holder 1 on the plate 6 to the processing device 20, may be performed manually or may be automated by a machine.

[0039] The impact device 7 impacts the holder 1. More specifically, as shown in FIG. 1 , the impact device 7 applies a small impact force to the outer surface of the sleeve 4 of the holder 1. This impact force generates vibrations in the holder 1, causing the workpiece 5 sandwiched between the upper and lower dies 2 and 3 of the holder 1 to move across the mounting surface 1a. The impact device 7 does not directly impact the workpiece 5, but rather propagates the impact through the holder 1 (sleeve 4), thereby moving the workpiece 5. The impact device 7 is configured to apply impact force to the object to move it using a piezoelectric actuator. The impact device 7 is configured to generate an impact force corresponding to a given setting value. In other words, the impact force of the impact device 7 is adjustable. An impact actuator (model number PP104) manufactured by THK Precision Co., Ltd. can be used for this impact device 7. In this embodiment, the impact device 7 is fixed in a direction from the outer cylindrical surface of the sleeve 4 toward the center of the holder 1. The impact device 7 may be held directly or indirectly via a jig on a structural part such as a beam or the tip of an arm provided in the position correction system 10. The impact device 7 may be held, for example, by a clamping mechanism or a chucking mechanism using screw fastening. The position of the impact device 7 is set so that the holder 1 does not interfere with the trajectory of the workpiece 5 as it is transferred or conveyed from the plate 6 of the position correction system 10 to the processing device 20. Furthermore, the height position of the impact device 7 can be adjusted to match the position of the workpiece 5 in the direction of the central axis 11 of the holder 1 (the height position of the workpiece 5). For example, the height position of the impact device 7 can be finely adjusted within a range of approximately 10 to 20 mm. Methods for adjusting the height position of the impact device 7 include, for example, fine adjustment of the arm angle, fine adjustment of the clamping / chucking position, and fine adjustment of the fastening position between the jig and the structure (using a slot, for example).

[0040] The impact position correction device 8 corrects the impact position of the impact device 7 relative to the holder 1. More specifically, the impact position correction device 8 corrects the impact position of the impact device 7 relative to the holder 1 by moving the holder 1 relative to the impact device 7. The impact position correction device 8 includes a rotation device that rotates the holder 1 around a normal direction at a reference position on the mounting surface 1a. The rotation device is, for example, a turntable that includes a turntable on which an object to be rotated is placed and a base that rotates the turntable. In this embodiment, the reference position is the center position of the mounting surface 1a, and therefore the normal direction at the reference position on the mounting surface 1a is the direction of the central axis 11 of the holder 1. In this embodiment, the plate 6 is placed on the impact position correction device 8 and rotated by the impact position correction device 8. When the impact position correction device 8 rotates the plate 6, the holder 1 moves relative to the impact device 7, thereby making it possible to correct the impact position of the impact device 7 relative to the holder 1.

[0041] The load detection device 30 detects the load on the holding unit 1. In this embodiment, the load detection device 30 includes a plurality of load sensors 31 and an amplifier 32 that amplifies detection signals from the plurality of load sensors 31 and outputs the signals to the calculation device 50. In the load detection device 30, the plurality of load sensors 31 are installed below the impact position correction device 8. In the load detection device 30, the plurality of load sensors 31 detect the load on the holding unit 1 at corresponding positions and output detection signals indicating the load on the holding unit 1. The detection signals from the plurality of load sensors 31 are amplified by the amplifier 32 and output to the calculation device 50.

[0042] Figure 7 is ,load7 is an explanatory diagram of an example of the configuration of the load detection device 30. In particular, FIG. 7 is an explanatory diagram of an example of the arrangement (planar arrangement) of the multiple load sensors 31 (31-1 to 31-4) of the load detection device 30. In FIG. 7, the X-axis and Y-axis are horizontal axes, and the Z-axis is a vertical axis. The pressing direction of the processing device 20 is the direction of the Z-axis. The XY plane defined by the X-axis and Y-axis is an action plane F that is perpendicular to the drive shaft 24 of the processing device 20, and the action plane F is used as a virtual plane for deriving the position of the load center G. In FIG. 7, the origin of the XY coordinates is set to coincide with the center position O of the placement surface 1a. The center position O of the placement surface 1a coincides with the center of gravity of the holder 1. Therefore, when the workpiece 5 is placed on the placement surface 1a of the holder 1, the load center G corresponds to the center of gravity of the workpiece 5.

[0043] 7, each of the four load sensors 31-1, 31-2, 31-3, and 31-4 is a uniaxial load sensor capable of detecting a load in the pressing direction (direction of the Z axis) of the processing device 20. The four load sensors 31-1, 31-2, 31-3, and 31-4 are arranged symmetrically (point-symmetrically) with respect to the origin of the XY coordinate system, i.e., the center position O of the mounting surface 1a. The load sensors 31-1, 31-2, 31-3, and 31-4 are arranged at positions ±m away from the X axis and ±n away from the Y axis in a plane (action plane F) perpendicular to the drive shaft 24. More specifically, in the XY coordinate system, the coordinates of the load sensor 31-1 are (+n, -m), the coordinates of the load sensor 31-2 are (-n, -m), the coordinates of the load sensor 31-3 are (-n, +m), and the coordinates of the load sensor 31-4 are (+n, +m). In this way, the load sensors 31 are arranged symmetrically with respect to the origin of the XY coordinate system. x ,a y ) to make it easier to calculate

[0044] When holder 1, with workpiece 5 placed on mounting surface 1a, is placed on plate 6, load sensors 31-1 to 31-4 of load detection device 30 detect Z-axis loads z1, z2, z3, and z4, respectively. The Z-axis load on action surface F1, i.e., the load applied by holder 1, is the sum of z1 to z4. In this case, moment Mx about the X-axis centered at the origin of the XY coordinate system is calculated using the following equation (1), and moment My about the Y-axis centered at the origin of the XY coordinate system is calculated using the following equation (2).

[0045]

number

[0046] Coordinates of the load center G (a x ,a y ) can be calculated using the following equations (3) and (4).

[0047]

number

[0048] In the configuration example of the load detection device 30 shown in Figure 7, four load sensors 31, which are uniaxial load sensors, are arranged, but since the center of gravity position can be calculated with at least three or more load sensors 31, they may be arranged in three locations that are not on a straight line (for example, in three of the four areas from the first quadrant to the fourth quadrant on the XY plane).

[0049] The control unit 40 includes an impact control device 41 that controls the impact device 7, and an impact position control device 42 that controls the impact position correction device 8. The impact control device 41 controls the impact device 7 based on an impact control signal provided by the arithmetic device 50. If the impact device 7 is an impact actuator (model number PP104) manufactured by THK Precision Co., Ltd., the impact control device 41 can use a controller driver (model number SD301) manufactured by THK Precision Co., Ltd. The impact position control device 42 controls the impact position correction device 8 based on the impact position control signal provided by the arithmetic device 50.

[0050] The arithmetic device 50 includes a processing unit 51 and a storage unit 52 .

[0051] The storage device 52 is used to store information used by the processing device 51 and information generated by the processing device 51. The storage device 52 includes one or more storages (non-transitory storage media). The storage may be, for example, a ROM, an EEPROM, a RAM, a USB memory, a magnetic disk, an optical disk, a magneto-optical disk, a hard disk drive, or a solid-state drive (SSD). The storage may also be an internal type, an external type, or a network-attached storage (NAS) type. The information stored in the storage device 52 includes, for example, a program 53 executed by the processing device 51. The program 53 includes a calculation unit 53a and a determination unit 53b. The calculation unit 53a and the determination unit 53b will be described later.

[0052] The processing device 51 is a circuit that controls the operation of the position correction system 10. In particular, the processing device 51 is connected to the load detection device 30 and the control unit 40, and can access the storage device 52. The processing device 51 can be realized, for example, by a computer system including one or more processors (microprocessors) and one or more memories. The one or more processors execute a program 53 (stored in one or more memories or the storage device 52), thereby realizing the functions of the processing device 51. Here, the program 53 is pre-recorded in the storage device 52, but it may also be provided via a telecommunications line such as the Internet, or recorded on a non-transitory recording medium such as a memory card.

[0053] The processing device 51 executes a center-of-gravity position calculation process and a determination process. The center-of-gravity position calculation process is realized by the processing device 51 executing the calculation unit 53a. The determination process is realized by the processing device 51 executing the determination unit 53b.

[0054] The center of gravity position calculation process calculates the center of gravity position G1 of the workpiece 5 on the placement surface 1a based on the detection result of the load detection device 30. The center of gravity position G1 of the workpiece 5 is calculated by the coordinates (a x ,a y ) is given by a x can be calculated using the above formula (3), and a y can be calculated using the above formula (4).

[0055] The determination process includes a process of determining whether the distance d between the center of gravity position G1 of the workpiece 5 calculated in the center of gravity position calculation process and a reference position on the placement surface 1a is equal to or less than a predetermined distance threshold r. In this embodiment, the reference position on the placement surface 1a is the center position O of the placement surface 1a. The determination process will be further described with reference to FIGS. 8 and 9.

[0056] 8 and 9 are explanatory diagrams illustrating an example of the relationship between the center of gravity G1 of the workpiece 5 and the reference position (center position O) of the mounting surface 1a. In FIGS. 8 and 9, R1 is a circular region centered at the center position O of the mounting surface 1a, and the radius of region R1 is equal to the distance threshold r. In other words, whether the distance d between the center of gravity G1 of the workpiece 5 and the reference position on the mounting surface 1a is equal to or less than the predetermined distance threshold r is equivalent to whether the center of gravity G1 of the workpiece 5 is within region R1. The distance threshold r is set so that even if asymmetric deformation occurs in the workpiece 5 due to processing by the processing device 20, it is acceptable in terms of the optical characteristics of the glass lens. In other words, region R1 defines the center of gravity position allowable region. In FIG. 8, the center of gravity G1 of the workpiece 5 is located within region R1. Therefore, a good glass lens can be manufactured by processing using the processing device 20. If the distance d between the center of gravity G1 of the workpiece 5 calculated in the center of gravity position calculation process and the reference position on the placement surface 1a is equal to or less than a predetermined distance threshold r, the holder 1 is sent to the processing device 20, and processing of the workpiece 5 is performed. Note that the distance threshold r varies depending on the type and shape of the glass material used as the workpiece 5, and the materials and shapes of the upper mold 2 and lower mold 3 that sandwich the workpiece 5.

[0057] 9, the center of gravity G1 of the workpiece 5 is not located within the region R1. Therefore, a defective glass lens will be produced if the workpiece 5 is processed using the processing device 20. Therefore, the determination process executes a correction process when the distance d between the center of gravity G1 of the workpiece 5 calculated in the center of gravity calculation process and the reference position on the placement surface 1a exceeds a predetermined distance threshold r.

[0058] In the correction process, the impact device 7 and the impact position correction device 8 are used to correct the position G1 of the center of gravity of the workpiece 5.

[0059] The correction process includes an impact process in which the impact device 7 impacts the holder 1 until the distance d between the center of gravity position G1 calculated in the center of gravity position calculation process and a reference position (center position O) on the placement surface 1a becomes equal to or less than a predetermined distance threshold r, thereby correcting the position of the workpiece 5. The impact process will be further described with reference to Figs. 10 and 11.

[0060] Fig. 10 is a cross-sectional view illustrating an example of the impact process. In Fig. 10, (a) shows the position of the workpiece 5 relative to the holder 1 before the impact process is performed, and (b) shows the position of the workpiece 5 relative to the holder 1 after the impact process is performed. As shown in Fig. 10, in the impact process, the impact device 7 applies a small impact force to the sleeve 4 of the holder 1, and the impact force generates vibrations in the holder 1, causing the workpiece 5 to move toward the placement surface 1a. The impact device 7 does not directly apply the impact force to the workpiece 5, which is the object to be moved, but rather moves the workpiece 5 by transmitting the impact through the holder 1 (sleeve 4).

[0061] FIG. 11 is a plan view illustrating an example of the impact process of the correction process. In FIG. 11, (a) shows the position of the workpiece 5 relative to the holder 1 before the impact process is performed, and (b) shows the position of the workpiece 5 relative to the holder 1 after the impact process is performed. As shown in FIG. 11(a), the center of gravity G1 of the workpiece 5 is outside the region R1. When the impact device 7 applies an impact force P2 to the outer surface of the sleeve 4, the direction of movement of the workpiece 5 coincides with the direction of the impact force P2. In FIG. 11(a), the center of gravity G1 is located on a line connecting the impact position S1 of the impact device 7 and the center position O of the mounting surface 1a. Therefore, as shown in FIG. 11(b), the impact force P2 applied by the impact device 7 moves the center of gravity G1 of the workpiece 5 toward the reference position of the mounting surface 1a of the holder 1 (the center position O in FIG. 11).

[0062] In the impact processing, the impact control signal described above is output to the impact control device 41 in order for the impact device 7 to apply an impact force P2 to the holder 1. The impact control signal indicates an impact instruction. The impact instruction is determined based on the distance d between the center of gravity G1 of the workpiece 5 and a reference position (center position O) on the placement surface 1a. Since the reference position on the placement surface 1a is set at the origin of the coordinates of the center of gravity G1, the distance d is calculated based on the coordinates (a x ,a y ) can be calculated using the following equation (5).

[0063]

number

[0064] The impact instruction includes, for example, at least one of the magnitude of the impact force and the number of impacts by the impact device 7. The amount of movement of the workpiece 5 by the impact device 7 depends on the magnitude (set value) of the impact force of the impact device 7 and the number of impacts.

[0065] FIG. 12 is a graph showing the relationship between the set value of the impact force of the impact device 7 and the movement amount of the workpiece 5. As is clear from the graph in FIG. 12, the greater the impact force, the greater the movement amount of the workpiece 5. In other words, the magnitude of the impact force is proportional to the movement amount of the workpiece 5 (the position of its center of gravity). The relationship between the set value of the impact force of the impact device 7 and the movement amount of the workpiece 5 may be stored in the storage device 52 of the computing device 50. Note that the slope of the graph shown in FIG. 12 varies depending on the material and shape of the workpiece 5 and the holder 1. Therefore, the relationship between the set value of the impact force of the impact device 7 and the movement amount of the workpiece 5 may be stored in the storage device 52 for each combination of the material and shape of the workpiece 5 and the holder 1.

[0066] FIG. 13 is a graph showing the relationship between the number of impacts of the impact device 7 and the movement distance of the workpiece 5 when the impact force setting value of the impact device 7 is a predetermined value. The relationship between the movement distance of the workpiece 5 and the number of impacts can be calculated from the relationship between the impact force setting value of the impact device 7 and the movement distance of the workpiece 5 shown in FIG. 12. As is clear from the graph in FIG. 13, the movement distance of the workpiece 5 increases as the number of impacts increases. In other words, the number of impacts is proportional to the movement distance of the workpiece 5 (the center of gravity position). The relationship between the number of impacts of the impact device 7 and the movement distance of the workpiece 5 may be stored in the storage device 52 of the computing device 50. If the impact force setting value of the impact device 7 is variable, the relationship between the number of impacts and the movement distance may be stored for each setting value. Note that the slope of the graph shown in FIG. 13 varies depending on the material and shape of the workpiece 5 and the holder 1. Therefore, the storage device 52 may store the relationship between the number of strikes of the striking device 7 and the amount of movement of the workpiece 5 for each combination of the material and shape of the workpiece 5 and the holder 1.

[0067] In this way, the movement amount of the workpiece 5 can be controlled by the magnitude of the impact force and the number of impacts of the impact device 7. Therefore, the correction process determines the magnitude of the impact force and the number of impacts of the impact device 7 so that the distance d between the center of gravity position G1 calculated in the center of gravity position calculation process and the reference position (center position O) on the mounting surface 1a is equal to or less than a predetermined distance threshold r. The number of impacts of the impact device 7 for the distance required for the distance d between the center of gravity position G1 and the reference position on the mounting surface 1a to be equal to or less than the predetermined distance threshold r is determined from the relationship between the movement amount of the workpiece 5 and the number of impacts. As shown in FIG. 10 , the movement amount of the workpiece 5 varies depending on the set value of the impact force, and therefore the number of impacts of the impact device 7 varies depending on the set value of the impact force of the impact device 7.

[0068] The correction process includes a striking position correction process that outputs a striking position correction instruction to cause the striking position correction device 8 to correct the striking position so that the striking device 7 strikes in a direction from the center of gravity position G1 toward the reference position (center position O). The striking position correction process is executed before the striking process. In this embodiment, the striking position correction process outputs the aforementioned striking position control signal to the striking position control device 42. The striking position control signal indicates the striking position correction instruction. The striking position correction instruction indicates the relative movement amount of the holding part 1 by the striking position correction device 8. The striking position correction process will be further described with reference to FIG. 14.

[0069] FIG. 14 is a plan view illustrating an example of the impact position correction process. As shown in FIG. 14(a), the center of gravity G1 of the workpiece 5 is outside the region R1. When the impact device 7 applies an impact force P2 to the outer surface of the sleeve 4, the direction of movement of the workpiece 5 coincides with the direction of the impact force P2. Therefore, to move the center of gravity G1 of the workpiece 5 toward the reference position (center position O in FIG. 14) on the mounting surface 1a of the holder 1, it is advisable to apply the impact force P2 toward the center position O of the mounting surface 1a of the holder 1 and position the center of gravity G1 of the workpiece 5 on a line connecting the impact position S1 of the impact device 7 and the center position O of the mounting surface 1a. However, depending on the shape of the holder 1 or the manner in which the holder 1 is placed on the plate 6, the center of gravity G1 of the workpiece 5 does not necessarily lie on a line connecting the impact position S1 of the impact device 7 and the center position O of the mounting surface 1a. Therefore, the position correction system 10 executes a striking position correction process, and the striking position correction device 8 corrects the striking position so that the striking device 7 strikes in a direction from the center of gravity position G1 toward the reference position (center position O).

[0070] The impact position correction process determines the relative movement amount of the holder 1 by the impact position correction device 8 based on the center of gravity position G1 calculated in the center of gravity position calculation process. In this embodiment, the impact position correction device 8 rotates the holder 1 around its central axis 11. Therefore, the relative movement amount of the holder 1 by the impact position correction device 8 is the rotation angle of the holder 1. Here, as shown in FIG. 14(a), the distance between the center of gravity position G1 and the center position O is defined as d. The angle of the line connecting the center position O and the center of gravity position G1 with respect to the line connecting the center position O and the impact position S1 is defined as θ. When θ is 0°, the center of gravity position G1 is located on the line connecting the center position O and the impact position S1, so that the impact device 7 can deliver an impact along the direction from the center of gravity position G1 toward the reference position (center position O). As shown in FIG. 14(b), the impact position correction process determines the rotation angle of the holder 1 by the impact position correction device 8 so that θ becomes 0°. In this case, the rotation angle is −θ. θ is the coordinate of the center of gravity G1 (a x ,a y ) can be calculated using the following equation (6).

[0071]

number

[0072] In this embodiment, the impact position correction device 8 rotates the plate 6 on which the holder 1 is placed, but the load sensor 31 is located below the impact position correction device 8. Therefore, the positional relationship of the load sensor 31 does not change. When the center of gravity position G1 is detected again after the impact position correction process, the coordinate system does not change. When rotating the holder 1 to correct the impact position S1, the rotation axis of the turntable of the impact position correction device 8 is aligned with the central axis 11 of the holder 1. The impact position correction device 8 may have a positioning structure that positions the holder 1 on the turntable so that the rotation axis of the turntable coincides with the central axis 11 of the holder 1. The positioning structure may include multiple positioning pins that are arranged on the turntable and contact the outer periphery of the holder 1 to position the holder 1 at a position where the central axis 11 of the holder 1 coincides with the rotation axis of the turntable. This ensures that the holder 1 is installed in the same position on the turntable every time. Even when holding parts 1 of different sizes (e.g., outer diameters) are used to manufacture glass lenses of different sizes, the central axis 11 of the holding part 1 can be aligned with the rotation axis of the turntable by changing the positions of multiple positioning pins on the turntable.

[0073] [1.3 Operation] Next, an example of the operation of the position correction system 10 will be described with reference to the flowchart of FIG.

[0074] First, the holder 1 with the workpiece 5 placed on the placement surface 1a is placed on the plate 6 of the position correction system 10. The load detection device 30 detects the load of the holder 1 using the load sensor 31. The calculation device 50 of the position correction system 10 executes a center of gravity position calculation process and calculates the center of gravity position G1 of the workpiece 5 on the placement surface 1a based on the detection result of the load detection device 30 (S10). In a determination process, the calculation device 50 determines whether the distance d between the center of gravity position G1 of the workpiece 5 calculated in the center of gravity position calculation process and a reference position on the placement surface 1a is equal to or less than a predetermined distance threshold r (S20).

[0075] If the distance d between the center of gravity position G1 of the workpiece 5 calculated in the center of gravity position calculation process and the reference position on the mounting surface 1a is less than or equal to a predetermined distance threshold r (S20: YES), the workpiece 5 is in an appropriate position on the mounting surface 1a of the holding unit 1, so the holding unit 1 is sent to the processing device 20, processing by the processing device 20 is started, and the desired processed product (in this embodiment, a glass lens) is manufactured (S30).

[0076] If the distance d between the center of gravity G1 of the workpiece 5 calculated in the center of gravity calculation process and the reference position on the placement surface 1a is not equal to or less than the predetermined distance threshold r (S20: NO), the calculation device executes a correction process to correct the center of gravity G1 (S40). In the correction process, an impact position correction instruction is output to the impact position control device 42 to cause the impact position correction device 8 to correct the impact position so that the impact device 7 delivers an impact along the direction from the center of gravity G1 toward the reference position (center position O). As a result, the state in which the center of gravity G1 is not on the straight line connecting the center position O and the impact position S1 as shown in Figure 14(a) changes to a state in which the center of gravity G1 is on the straight line connecting the center position O and the impact position S1 as shown in Figure 14(b). Subsequently, in the correction process, an impact instruction is output to the impact control device 41 to instruct the impact device 7 to impact the holder 1 until the distance d between the center of gravity G1 calculated in the center of gravity calculation process and a reference position (center position O) on the mounting surface 1a becomes equal to or less than a predetermined distance threshold r. The impact instruction includes at least one of the magnitude of the impact force and the number of impacts to be applied by the impact device 7, which are determined by the distance d. The relationship between the set value of the impact force of the impact device 7 and the movement amount of the workpiece 5, and the relationship between the number of impacts of the impact device 7 and the movement amount of the workpiece 5, are stored in the storage device 52. Therefore, it is expected that the impact process will change the state in which the center of gravity G1 is not within region R1, as shown in FIG. 11(a), to a state in which the center of gravity G1 is within region R1, as shown in FIG. 11(b). However, in an actual process, variations in the movement amount of the workpiece 5 occur due to errors in the shapes and surface roughness of the holder 1 and the workpiece 5. Therefore, after the impact process, the center of gravity G1 of the workpiece 5 may not be located within the region R1. Therefore, after the impact process, the calculation device 50 again determines whether the distance d between the center of gravity G1 of the workpiece 5 calculated in the center of gravity position calculation process and the reference position on the placement surface 1a is equal to or less than the predetermined distance threshold r (S20).

[0077] In this way, the center of gravity position G1 is corrected until the distance d between the center of gravity position G1 of the workpiece 5 calculated in the center of gravity position calculation process and the reference position on the placement surface 1a becomes equal to or less than the predetermined distance threshold r. Therefore, only the holder 1 in which the workpiece 5 is in the correct position on the placement surface 1a of the holder 1 is sent to the processing device 20. This reduces the rate of defects and improves the yield.

[0078] [1.4 Effects, etc.] The position correction system 10 described above includes a load detection device 30 that detects the load on the holder 1 having a mounting surface 1a on which the workpiece 5 is placed, an impact device 7 that applies impact to the holder 1, and a calculation device 50 that executes a center-of-gravity position calculation process that calculates the center-of-gravity position G1 of the workpiece 5 on the mounting surface 1a based on the detection result of the load detection device 30, and a correction process that applies impacts to the holder 1 by the impact device 7 until the distance d between the center-of-gravity position G1 calculated in the center-of-gravity position calculation process and a reference position O on the mounting surface 1a becomes equal to or less than a predetermined distance threshold r. With this configuration, the position of the workpiece 5 can be corrected even when the workpiece 5 is not exposed, thereby improving yield.

[0079] The position correction system 10 also includes an impact position correction device 8 that moves the holder 1 relative to the impact device 7 to correct the impact position S1 of the impact device 7 relative to the holder 1. In the correction process, the impact position correction device 8 corrects the impact position S1 so that the impact device 7 strikes in a direction from the center of gravity position G1 toward the reference position O. With this configuration, the position of the workpiece 5 can be corrected even when the workpiece 5 is not exposed, thereby improving yield.

[0080] Furthermore, in the position correction system 10, the impact position correction device 8 rotates the holder 1 around the normal direction at the reference position O on the placement surface 1a. With this configuration, even when the workpiece 5 is not exposed, the position of the workpiece 5 can be corrected, improving yield.

[0081] In addition, in the position correction system 10, the reference position O is the center position O of the placement surface 1a. According to this configuration, even when the workpiece 5 is not exposed, the position of the workpiece 5 can be corrected, thereby improving the yield.

[0082] In other words, the position correction system 10 executes the following method (position correction method). The position correction method is executed by a load detection device 30 that detects the load on the holder 1, which has a mounting surface 1a on which the workpiece 5 is placed, and a calculation device 50 connected to an impact device 7 that applies impact to the holder 1. The position correction method includes a center-of-gravity position calculation process that calculates the center-of-gravity position G1 of the workpiece 5 on the mounting surface 1a based on the detection result of the load detection device 30, and a correction process that corrects the position of the workpiece 5 by impacting the holder 1 with the impact device 7 until the distance d between the center-of-gravity position G1 calculated in the center-of-gravity position calculation process and a reference position O on the mounting surface 1a becomes equal to or less than a predetermined distance threshold r. With this configuration, the position of the workpiece 5 can be corrected even when the workpiece 5 is not exposed, thereby improving yield.

[0083] The above-described position correction method can be realized by the calculation device 50 executing the program 53. This program 53 is a computer program for causing the calculation device 50 to execute the above-described position correction method. According to this configuration, even when the workpiece 5 is not exposed, the position of the workpiece 5 can be corrected, thereby improving yield.

[0084] The processing system 100 described above includes a position correction system 10 and a processing device 20 that processes the workpiece 5 placed on the placement surface 1a. With this configuration, even if the workpiece 5 is not exposed, the position of the workpiece 5 can be corrected, thereby improving yield.

[0085] In the processing system 100, the workpiece 5 is a glass material. The holding unit 1 includes a lower mold 3 having a mounting surface 1a, and an upper mold 2 that sandwiches the workpiece 5 placed on the mounting surface 1a between the lower mold 3. The processing device 20 uses the holding unit 1 to perform a forming process on the workpiece 5. With this configuration, even if the workpiece 5 is not exposed, the position of the workpiece 5 can be corrected, thereby improving yield.

[0086] [2. Modifications] The embodiments of the present disclosure are not limited to the above-described embodiments. The above-described embodiments can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Modifications of the above-described embodiments are listed below. The modifications described below can be applied in appropriate combinations.

[0087] In one modified example, the impact position correction device 8 may move the holding unit 1 relative to the impact device 7 by moving the impact device 7 relative to the holding unit 1. The impact position correction device 8 may, for example, include a mechanism that rotates the holding unit 1 around the central axis 11 of the holding unit 1 without rotating the holding unit 1, while keeping the direction in which the impact force of the impact device 7 is applied facing the central position O of the holding unit 1. The impact position correction device 8 may move the holding unit 1 relative to the impact device 7 by moving the impact device 7 and the holding unit 1.

[0088] In the above embodiment, the workpiece 5 is a glass material, and the holder 1 is a mold. The processing device 20 performs forming (press forming) of the workpiece 5, which is a glass material, using the holder 1, which is a mold. The processing device 20 is not limited to a device that performs press forming. The processing device 20 is appropriately selected depending on the target product, and the workpiece 5 and the holder 1 are appropriately changed by the processing device 20. The processing by the processing device 20 is not limited to forming, and may be punching, sheet metal processing, laser processing, etc. The position correction system according to the present disclosure can bring the center of gravity of the workpiece 5 closer to the reference position of the mounting surface 1a, and is therefore particularly useful for processing in which the center of gravity of the workpiece 5 affects the accuracy of the finished product.

[0089] [3. Aspects] As is clear from the above-described embodiment and modifications, the present disclosure includes the following aspects. In the following, reference numerals are given in parentheses only to clarify the correspondence with the embodiment.

[0090] The first aspect is a position correction system (10) including a load detection device (30) that detects the load of a holder (1) having a mounting surface (1a) on which a workpiece (5) is placed, an impact device (7) that impacts the holder (1), and a calculation device (50) that executes a center-of-gravity position calculation process that calculates the center-of-gravity position (G1) of the workpiece (5) on the mounting surface (1a) based on the detection result of the load detection device (30), and a correction process that impacts the holder (1) with the impact device (7) until the distance (d) between the center-of-gravity position (G1) calculated by the center-of-gravity position calculation process and a reference position (O) on the mounting surface (1a) becomes equal to or less than a predetermined distance threshold (r). According to this aspect, the position of the workpiece (5) can be corrected even when the workpiece (5) is not exposed, thereby improving yield.

[0091] A second aspect is a position correction system (10) based on the first aspect. In the second aspect, the position correction system (10) includes an impact position correction device (8) that corrects an impact position (S1) of the impact device (7) relative to the holding unit (1) by moving the holding unit (1) relative to the impact device (7). In the correction process, the impact position correction device (8) corrects the impact position (S1) so that the impact device (7) strikes along a direction from the center of gravity position (G1) toward the reference position (O). According to this aspect, the position of the workpiece (5) can be corrected even when the workpiece (5) is not exposed, thereby improving yield.

[0092] A third aspect is a position correction system (10) based on the second aspect. In the third aspect, the impact position correction device (8) rotates the holder (1) around a normal direction at the reference position (O) on the placement surface (1a). According to this aspect, even when the workpiece (5) is not exposed, the position of the workpiece (5) can be corrected, thereby improving yield.

[0093] A fourth aspect is a position correction system (10) based on any one of the first to third aspects. In the fourth aspect, the reference position (O) is the center position (O) of the placement surface (1a). According to this aspect, even when the workpiece (5) is not exposed, the position of the workpiece (5) can be corrected, thereby improving yield.

[0094] A fifth aspect is a position correction method executed by a calculation device (50) connected to a load detection device (30) that detects the load of a holder (1) having a mounting surface (1a) on which a workpiece (5) is placed and an impact device (7) that impacts the holder (1). The position correction method includes a center-of-gravity position calculation process that calculates the center-of-gravity position (G1) of the workpiece (5) on the mounting surface (1a) based on the detection result of the load detection device (30), and a correction process that corrects the position of the workpiece (5) by impacting the holder (1) with the impact device (7) until the distance (d) between the center-of-gravity position (G1) calculated in the center-of-gravity position calculation process and a reference position (O) on the mounting surface (1a) becomes equal to or less than a predetermined distance threshold (r). According to this aspect, the position of the workpiece (5) can be corrected even when the workpiece (5) is not exposed, thereby improving yield.

[0095] A sixth aspect is a program for causing the arithmetic device 50 to execute the position correction method of the fifth aspect. According to this aspect, even when the workpiece 5 is not exposed, the position of the workpiece 5 can be corrected, thereby improving yield.

[0096] A seventh aspect is a processing system (100) including the position correction system (10) of any one of the first to fourth aspects and a processing device (20) that processes the workpiece (5) placed on the placement surface (1 a). According to this aspect, even when the workpiece (5) is not exposed, the position of the workpiece (5) can be corrected, thereby improving yield.

[0097] An eighth aspect is a processing system (100) based on the seventh aspect. In the eighth aspect, the workpiece (5) is a glass material. The holding unit (1) includes a lower mold (3) having the placement surface (1a) and an upper mold (2) that sandwiches the workpiece (5) placed on the placement surface (1a) between the lower mold (3) and the upper mold (2). The processing device (20) performs a forming process on the workpiece (5) using the holding unit (1). According to this aspect, even if the workpiece (5) is not exposed, the position of the workpiece (5) can be corrected, thereby improving yield.

[0098] The second to fourth aspects can also be modified appropriately and applied to the fifth aspect. [Industrial Applicability]

[0099] The present disclosure is applicable to a position correction system, a position correction method, a program (computer program), and a processing system. Specifically, the present disclosure is applicable to a position correction system, a position correction method, and a program (computer program) for correcting the position of a workpiece placed on a placement surface, and a processing system equipped with the position correction system. [Explanation of symbols]

[0100] 1 Holding part 1a Placement surface 2 Upper mold 3 Lower mold 5 Workpiece 7. Percussion Device 8. Impact position correction device 10 Position correction system 20 Processing equipment 30 Load detection device 50 Arithmetic unit 100 Processing System G1 Center of gravity position O Reference position r distance threshold

Claims

1. a load detection device that detects the load of a holder having a mounting surface on which an ellipsoidal or spherical workpiece is placed; a striking device that strikes the holding portion; a calculation unit that executes a center-of-gravity position calculation process that calculates the center-of-gravity position of the workpiece on the placement surface based on the detection result of the load detection device, and a correction process that corrects the position of the workpiece by applying an impact to the holding unit with the impact device until the distance between the center-of-gravity position calculated in the center-of-gravity position calculation process and a reference position on the placement surface becomes equal to or less than a predetermined distance threshold; Equipped with the correction process corrects the position of the workpiece by controlling at least one of the magnitude of the impact force and the number of impacts by the impact device. Position correction system.

2. a striking position correction device that corrects a striking position of the striking device with respect to the holding part by moving the holding part relative to the striking device, the correction process corrects the impact position by the impact position correction device so that the impact device applies an impact along a direction from the center of gravity position toward the reference position; The position correction system of claim 1 .

3. the striking position correction device rotates the holding part around a normal direction at the reference position on the placement surface, The position correction system of claim 2 .

4. The reference position is the center position of the placement surface.

4. The position correction system according to claim 1.

5. A position correction method executed by a load detection device that detects a load on a holder having a mounting surface on which an ellipsoidal or spherical workpiece is placed, and a calculation device that is connected to an impact device that applies an impact to the holder, comprising: a center-of-gravity position calculation process for calculating the center-of-gravity position of the workpiece on the placement surface based on the detection result of the load detection device; a correction process for correcting the position of the workpiece by applying an impact to the holder by the impact device until a distance between the center of gravity position calculated in the center of gravity position calculation process and a reference position on the placement surface becomes equal to or less than a predetermined distance threshold; Including, the correction process corrects the position of the workpiece by controlling at least one of the magnitude of the impact force and the number of impacts by the impact device. Position correction method.

6. 6. A method for causing the arithmetic device to execute the position correction method according to claim 5, program.

7. a position correction system according to any one of claims 1 to 4; a processing device that processes the workpiece placed on the placement surface; Equipped with Processing system.

8. The workpiece is a glass material, the holding unit includes a lower mold having the placement surface, and an upper mold configured to sandwich the workpiece placed on the placement surface between the lower mold and the upper mold; The processing device performs a shaping process on the workpiece using the holding unit. The processing system according to claim 7 .

Citation Information

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