Substrate processing apparatus and substrate processing method

Abstract

A substrate treatment device according to an aspect of the present disclosure is provided with: a substrate holding part (31); an optical sensor (60); and a control unit (18). The substrate holding part (31) holds and rotates a substrate to be treated. The optical sensor (60) irradiates the substrate that is held and rotated by the substrate holding part (31) with light and receives reflection light. The control unit (18) controls each part. In addition, the control unit (18) has a generation unit (18a) and a determination unit (18c). The generation unit (18a) causes the optical sensor (60) to irradiate the substrate that is held and rotated by the substrate holding part (31) with light and acquires changes in intensity of the reflection light in a time period during which the substrate is rotating, thus generating periodic fluctuation data. The determination unit (18c) determines whether or not the holding state of the substrate that is held by the substrate holding part (31) is normal on the basis of the periodic fluctuation data.

Description

[Technical Field]

[0001] The disclosed embodiments relate to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] BACKGROUND ART Conventionally, single-wafer processing, in which substrates such as semiconductor wafers (hereinafter also referred to as wafers) are processed one by one, is performed while the substrate is held and rotated in a substrate holder (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5661022 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can accurately detect the holding state of a substrate. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a substrate holding unit, an optical sensor, and a control unit. The substrate holding unit holds and rotates a substrate to be processed. The optical sensor irradiates light onto the substrate held and rotating in the substrate holding unit and receives reflected light. The control unit controls each unit. The control unit also includes a creation unit and a determination unit. The creation unit irradiates light from the optical sensor onto the substrate held and rotating in the substrate holding unit, obtains changes in the intensity of the reflected light while the substrate is rotating, and creates periodic fluctuation data. The determination unit determines whether the holding state of the substrate held in the substrate holding unit is normal based on the periodic fluctuation data. [Effects of the Invention]

[0006] According to the present disclosure, the holding state of the substrate can be detected with high accuracy. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing a schematic configuration of a substrate processing system according to an embodiment. [Figure 2] FIG. 2 is a schematic diagram showing an example of a specific configuration of a processing unit according to the embodiment. [Figure 3] FIG. 3 is a block diagram illustrating an example of the configuration of the control device according to the embodiment. [Figure 4] FIG. 4 is a diagram illustrating an example of periodic variation data according to the embodiment. [Figure 5] FIG. 5 is a diagram for explaining the state of the wafer held by the substrate holder according to the embodiment. [Figure 6] FIG. 6 is a diagram illustrating an example of difference data according to the embodiment. [Figure 7] FIG. 7 is a flowchart showing an example of a procedure of a control process executed by the substrate processing system according to the embodiment. [Figure 8] FIG. 8 is a flowchart showing an example of a procedure of a holding abnormality detection process executed by the substrate processing system according to the embodiment. [Figure 9] FIG. 9 is a flowchart showing an example of the procedure of the time-dependent change detection process executed by the substrate processing system according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method disclosed herein will be described in detail with reference to the accompanying drawings. Note that the present disclosure is not limited to the embodiments described below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of elements may differ from the actual situation. Furthermore, the dimensional relationships and ratios may differ between the drawings.

[0009] Conventionally, single-wafer processing, in which substrates such as semiconductor wafers (hereinafter also referred to as wafers) are processed one by one, is performed while the substrate is held and rotated in a substrate holder. Therefore, if the substrate is processed while not being held firmly, there is a risk of problems such as insufficient substrate processing or large splashes of processing liquid on the inner walls of the chamber.

[0010] The causes of such deterioration in the holding condition include, for example, defective parts or improper assembly of the holding clamp or pin, deterioration due to wear or thermal deformation of the holding clamp or pin, and improper centering adjustment of the transfer arm position.

[0011] Therefore, a technique is known in which an image of the held substrate is captured using an imaging device and the captured image is compared with a reference image to detect the holding state of the substrate. However, this conventional technique leaves room for further improvement in terms of accurately detecting the holding state of the substrate.

[0012] Therefore, there is a need for a technology that can overcome the above-mentioned problems and detect the holding state of a substrate with high accuracy.

[0013] <Outline of the substrate processing system> First, a schematic configuration of a substrate processing system 1 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing a schematic configuration of the substrate processing system 1 according to an embodiment. The substrate processing system 1 is an example of a substrate processing apparatus. In the following, to clarify the positional relationship, mutually orthogonal X-axis, Y-axis, and Z-axis are defined, and the positive direction of the Z-axis is defined as the vertically upward direction.

[0014] 1, the substrate processing system 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are provided adjacent to each other.

[0015] The carry-in / out station 2 includes a FOUP placement section 11 and a transport section 12. On the FOUP placement section 11, a plurality of FOUPs H are placed, each accommodating a plurality of substrates, in this embodiment, semiconductor wafers W (hereinafter referred to as wafers W), in a horizontal position.

[0016] The transfer section 12 is provided adjacent to the FOUP placement section 11 and includes a substrate transfer device 13 and a transfer section 14. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. The substrate transfer device 13 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the FOUP H and the transfer section 14 using the wafer holding mechanism.

[0017] The processing station 3 is provided adjacent to the transport section 12. The processing station 3 includes a transport section 15 and a plurality of processing units 16. The plurality of processing units 16 are provided side by side on both sides of the transport section 15.

[0018] The transfer section 15 includes a substrate transfer device 17 therein. The substrate transfer device 17 includes a wafer holding mechanism that holds the wafer W. The substrate transfer device 17 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the delivery section 14 and the processing unit 16 using the wafer holding mechanism.

[0019] The processing unit 16 performs predetermined substrate processing on the wafer W transferred by the substrate transfer device 17 .

[0020] The substrate processing system 1 also includes a control device 4. The control device 4 is, for example, a computer, and includes a control unit 18 and a storage unit 19. The storage unit 19 stores programs that control various processes executed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the programs stored in the storage unit 19.

[0021] Such a program may be recorded on a computer-readable storage medium and installed from that storage medium into the storage unit 19 of the control device 4. Examples of computer-readable storage media include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnetic optical disks (MOs), and memory cards.

[0022] In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 in the loading / unloading station 2 removes the wafer W from the FOUP H placed on the FOUP placement unit 11 and places the removed wafer W on the delivery unit 14. The wafer W placed on the delivery unit 14 is then removed from the delivery unit 14 by the substrate transfer device 17 in the processing station 3 and carried into the processing unit 16.

[0023] The wafer W carried into the processing unit 16 is processed by the processing unit 16, and then carried out of the processing unit 16 by the substrate transfer device 17 and placed on the delivery section 14. Then, the processed wafer W placed on the delivery section 14 is returned to the FOUP H of the FOUP placement section 11 by the substrate transfer device 13.

[0024] <Processing unit configuration> Next, the configuration of the processing unit 16 according to the embodiment will be described with reference to Fig. 2. Fig. 2 is a schematic diagram showing an example of a specific configuration of the processing unit 16. As shown in Fig. 2, the processing unit 16 includes a chamber 20, a substrate processing section 30, a liquid supply section 40, a collection cup 50, an optical sensor 60, and an imaging device 70.

[0025] The chamber 20 accommodates a substrate processing unit 30, a liquid supply unit 40, a collection cup 50, an optical sensor 60, and an imaging device 70. A fan filter unit (FFU) 21 is provided on the ceiling of the chamber 20. The FFU 21 forms a downflow within the chamber 20.

[0026] The substrate processing unit 30 includes a substrate holding unit 31, a support unit 32, and a drive unit 33, and performs a given substrate processing on a placed wafer W. The substrate holding unit 31 holds the wafer W horizontally. The support unit 32 is a member extending in the vertical direction, and its base end is rotatably supported by the drive unit 33, with its tip end supporting the substrate holding unit 31 horizontally. The drive unit 33 rotates the support unit 32 around a vertical axis.

[0027] The substrate processing unit 30 rotates the support column 32 using the drive unit 33, thereby rotating the substrate holding unit 31 supported by the support column 32, and thereby rotating the wafer W held by the substrate holding unit 31.

[0028] A holding member 31a for holding the wafer W from the side is provided on the upper surface of the substrate holding unit 31 included in the substrate processing unit 30. The wafer W is held horizontally by the holding member 31a while being slightly spaced apart from the upper surface of the substrate holding unit 31. The wafer W is held by the substrate holding unit 31 with the surface on which substrate processing is performed facing upward.

[0029] The substrate holder 31 is not limited to holding the substrate by the holding member 31a, and may hold the wafer W horizontally, for example, by adsorbing the lower surface of the wafer W. Furthermore, the substrate holder 31 may be an electrostatic chuck or the like.

[0030] The liquid supply unit 40 supplies a processing fluid to the wafer W. The liquid supply unit 40 includes nozzles 41a and 41b, an arm 42 that horizontally supports the nozzles 41a and 41b, and a pivoting and lifting mechanism 43 that pivots and raises and lowers the arm 42.

[0031] Nozzle 41a is connected to processing liquid supply source 46a via valve 44a and flow rate regulator 45a. Processing liquid supply source 46a is a tank that stores processing liquid. The processing liquid is used, for example, for liquid processing of wafer W (e.g., etching processing, cleaning processing, etc.).

[0032] The nozzle 41b is connected to a DIW supply source 46b via a valve 44b and a flow rate regulator 45b. The DIW supply source 46b is, for example, a tank that stores DIW (Deionized Water). The DIW is used, for example, for rinsing the wafer W.

[0033] In the example of Figure 2, an example is shown in which the liquid supply unit 40 supplies a processing liquid and a rinsing liquid (DIW) to the wafer W, but the present disclosure is not limited to such an example and may be configured to supply other chemical liquids to the wafer W.

[0034] Recovery cup 50 is disposed to surround substrate holding part 31, and collects the processing liquid scattered from wafer W due to the rotation of substrate holding part 31. A drainage port 51 is formed in the bottom of recovery cup 50, and the processing liquid collected by recovery cup 50 is discharged from drainage port 51 to the outside of processing unit 16. In addition, an exhaust port 52 is formed in the bottom of recovery cup 50, which discharges gas supplied from FFU 21 to the outside of processing unit 16.

[0035] The optical sensor 60 irradiates light onto the wafer W held and rotating by the substrate holder 31, and receives light reflected from the wafer W. The optical sensor 60 is disposed, for example, above the peripheral edge of the wafer W, and irradiates light vertically downward onto the peripheral edge of the wafer W. The optical sensor 60 then receives the light reflected from the peripheral edge of the wafer W and detects the intensity of this reflected light.

[0036] The imaging device 70 is disposed, for example, above the wafer W, and captures an image of the wafer W being processed with the processing fluid from the liquid supply unit 40 while being held by the substrate holder 31.

[0037] <Detection process details> Next, details of the detection process according to the embodiment will be described with reference to Fig. 3 to Fig. 6. Fig. 3 is a block diagram showing an example of the configuration of the control device 4 according to the embodiment. As shown in Fig. 3, the control device 4 includes a control unit 18 and a storage unit 19.

[0038] The control device 4 is also connected to the above-described substrate processing unit 30, liquid supply unit 40, optical sensor 60, and imaging device 70. In addition to the functional units shown in Fig. 3, the control device 4 may also have various functional units that known computers have, such as various input devices and audio output devices.

[0039] The storage unit 19 is realized by, for example, a semiconductor memory element such as RAM or flash memory, or a storage device such as a hard disk or optical disk. The storage unit 19 has a reference period variation data storage unit 19a, a captured image storage unit 19b, and a difference data storage unit 19c. Details of these storage units will be described later. The storage unit 19 also stores information used for various processes in the control unit 18.

[0040] The control unit 18 is realized by, for example, a CPU, a micro processing unit (MPU), a graphics processing unit (GPU), or the like executing a program stored in the storage unit 19 using the RAM as a working area.

[0041] Furthermore, the control unit 18 may be realized by an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array).

[0042] Control unit 18 has creation unit 18a, calculation unit 18b, determination unit 18c, abnormality response unit 18d, and prediction unit 18e, and realizes or executes the functions and actions of the control processing described below. Note that the internal configuration of control unit 18 is not limited to the configuration shown in Fig. 3, and may be any other configuration that performs the control processing described below.

[0043] The creation unit 18a irradiates the wafer W held and rotating by the substrate holder 31 with light from the optical sensor 60, and creates periodic fluctuation data by acquiring changes in the intensity of the reflected light during the rotation of the wafer W. Details of such periodic fluctuation data will be described with reference to FIG.

[0044] 4 is a diagram showing an example of periodic fluctuation data according to an embodiment. As shown in Fig. 4, the periodic fluctuation data according to an embodiment is expressed as a curve showing the transition of the intensity of reflected light over one entire rotation of the wafer W (i.e., in the range of rotation angles from 0 (deg) to 360 (deg)).

[0045] 4 also shows actual measurement values ​​using a gauge, which is conventionally performed to check the holding state of the wafer W. The actual measurement values ​​using the gauge are data obtained by placing the gauge against the peripheral portion of the wafer W held by the substrate holding part 31, measuring the position of the peripheral portion in the height direction, and measuring the transition of the height position over the entire circumference of the wafer W.

[0046] Conventionally, the quality of the holding state of the wafer W is determined based on the actual measurement value of this gauge. For example, if the fluctuation in the height position of the peripheral portion of the wafer W is not within a given range, it can be determined that the holding state of the wafer W is poor.

[0047] On the other hand, this method requires the processing unit 16 to be opened and the worker to place the gauge on the wafer W inside, which is very time-consuming and does not allow measurements to be taken while the wafer W is being processed.

[0048] Therefore, in the embodiment, an optical sensor 60 installed inside the processing unit 16 is used to generate periodic fluctuation data that indicates changes in the intensity of reflected light over one entire circumference of the wafer W. As shown in Fig. 4, a high correlation is observed between the actual measurement values ​​using a gauge in the prior art and the periodic fluctuation data of the present disclosure.

[0049] Furthermore, in the present disclosure, such periodic fluctuation data can be used to accurately detect minute deflections of the wafer W caused by deterioration of the holding state over the entire circumference of the wafer W. This is because, at the locations where the wafer W is deflected and tilted, even if the amount of deflection is small, light is reflected vertically upward from the wafer W, and the amount of light incident on the optical sensor 60 is reduced.

[0050] As shown in Fig. 4, three regions with low values ​​are observed in the periodic fluctuation data and the actual measured values ​​by the gauge, which are due to three depressions Wa formed in the wafer W when the wafer W is supported by the three holding members 31a, as shown in Fig. 5. Fig. 5 is a diagram for explaining the state of the wafer W held by the substrate holding part 31 according to the embodiment.

[0051] In this manner, in the embodiment, data including the presence or absence and state of the bending of the wafer W (here, the depression Wa) and even the position information of such bending can be generated as periodic fluctuation data.

[0052] In the embodiment, the creation unit 18a controls the substrate processing unit 30 to rotate the wafer W in the range of 1 (rpm) to 100 (rpm), while measuring the transition of the intensity of reflected light over one entire rotation of the wafer W with the optical sensor 60. This reduces the influence of bending of the wafer W caused by an excessively high rotation speed, and therefore makes it possible to create periodic fluctuation data with high accuracy.

[0053] Returning to the explanation of Fig. 3, calculation unit 18b calculates the difference between pre-stored reference period variation data and the period variation data created by creation unit 18a. This reference period variation data is period variation data created by creation unit 18a, for example, immediately after substrate holding unit 31 is returned to a normal state (for example, immediately after substrate holding unit 31 is replaced with a new one).

[0054] That is, the difference between the reference period fluctuation data calculated by calculation unit 18b and the period fluctuation data indicates the difference in the holding state between substrate holding unit 31 in a normal state and substrate holding unit 31 at the time the period fluctuation data was created. The reference period fluctuation data is stored in reference period fluctuation data storage unit 19a of storage unit 19, for example.

[0055] The determination unit 18c determines whether the holding state of the wafer W held by the substrate holding unit 31 is normal or not, based on the periodic fluctuation data created by the creation unit 18a. For example, the determination unit 18c determines that the holding state of the wafer W is normal when the difference between the reference periodic fluctuation data and the periodic fluctuation data is within a given range.

[0056] On the other hand, when the difference between the reference periodic fluctuation data and the periodic fluctuation data is not within a given range, the determining unit 18c determines that the holding state of the wafer W is not normal.

[0057] As described above, in the embodiment, the holding state of the wafer W can be detected with high accuracy by determining whether the holding state of the wafer W is good or bad based on the periodic fluctuation data.

[0058] In addition, in the embodiment, the difference in the holding state between the substrate holding part 31 in a normal state and the substrate holding part 31 at the time of measurement is evaluated by the difference between the reference periodic fluctuation data and the periodic fluctuation data, so that the difference between the devices for each of the multiple processing units 16 can be included in the judgment of the quality of the holding state.

[0059] Therefore, according to the embodiment, the holding state of the wafer W can be detected with higher accuracy.

[0060] In addition, in an embodiment, periodic fluctuation data created for a certain wafer W before substrate processing may be used as reference periodic fluctuation data when the calculation unit 18b performs calculation processing after substrate processing has been performed on the same wafer W.

[0061] This allows for detection of deterioration in the holding state that occurs during a given substrate processing (e.g., processing involving a sudden temperature change) immediately after the processing. Therefore, according to the embodiment, the holding state of the wafer W can be detected with even greater accuracy.

[0062] In this case, the periodic fluctuation data created for a certain wafer W before the substrate processing is preferably stored in the reference periodic fluctuation data storage unit 19a of the storage unit 19 as the reference periodic fluctuation data for that wafer W.

[0063] The abnormality handler 18d executes various abnormality handling processes when the determining unit 18c determines that the holding state of the wafer W is not normal.

[0064] The abnormality handling process according to the embodiment is, for example, to notify an operator that the holding state of the wafer W in the processing unit 16 is not normal. This allows the operator to recognize the abnormal state of the substrate holding part 31.

[0065] Furthermore, the abnormality handling process according to the embodiment may involve, for example, temporarily returning the wafer W to the substrate transfer device 17 (see FIG. 1) and re-holding it by the substrate holder 31. This allows the holding state of the target wafer W to be restored to normal if the abnormality in the holding state is temporary.

[0066] Furthermore, when the determination unit 18c determines that the holding state of the wafer W after the substrate processing is not normal, the abnormality handler 18d may store the captured images during the processing of the wafer W. The captured images are, for example, moving images, and are stored in the captured image storage unit 19b of the storage unit 19.

[0067] In this case, the judgment unit 18c may use the periodic fluctuation data created before the substrate processing is performed on the target wafer W as reference periodic fluctuation data when the calculation unit 18b performs calculation processing after the substrate processing is performed on the same wafer W.

[0068] Furthermore, the abnormality handler 18d may associate the captured image during substrate processing stored in the captured image storage unit 19b as described above with log information indicating that an abnormal state has been reported for the same wafer W.

[0069] In this way, for wafers W whose holding state is determined to be abnormal, by storing the captured images during processing in storage unit 19, the operator can later check the details of the defect again using the stored captured images. Also, by associating the captured images during substrate processing with log information indicating that an abnormal state has been notified, the operator can easily check the captured images at the time of the abnormality.

[0070] In addition to the above calculation process, the calculation unit 18b calculates the difference between the reference periodic fluctuation data and the periodic fluctuation data for each of multiple wafers W that are subsequently loaded into the processing unit 16, and calculates the maximum value of such differences as the difference data.

[0071] In this case, the reference periodic fluctuation data is the periodic fluctuation data created by the creating unit 18a immediately after the substrate holding unit 31 is returned to a normal state (for example, immediately after the substrate holding unit 31 is replaced with a new one). This difference data is then stored in the difference data storage unit 19c of the storage unit 19 and plotted, for example, as shown in FIG.

[0072] 6 is a diagram showing an example of differential data according to the embodiment. As shown in Fig. 6, the differential data according to the embodiment is, for example, data for a plurality of wafers W plotted in an XY space in which the horizontal axis represents time (or the number of processed wafers W) and the vertical axis represents the maximum value of the difference between the reference periodic fluctuation data and the periodic fluctuation data.

[0073] The prediction unit 18e predicts the holding state of the substrate holding unit 31 based on the change over time of the difference data as shown in Fig. 6. The prediction unit 18e predicts the holding state of the substrate holding unit 31 by, for example, linear regression analysis.

[0074] For example, in the example of Fig. 6, in the period up to time T0, the time course of the maximum difference regresses to a straight line with the maximum difference = 0. That is, in the example of Fig. 6, up to time T0, there is no noticeable change in the holding state of substrate holding unit 31 compared to immediately after substrate holding unit 31 is returned to its normal state, and it is estimated that a good holding state is being maintained.

[0075] On the other hand, after time T0, the time course of the maximum difference regresses to a sloped straight line L. Therefore, the prediction unit 18e predicts at time T1 that the holding state will become abnormal at time T2, which is the point of intersection between the straight line L and the upper limit (or lower limit) of the maximum difference at which the holding state is considered to be maintained in a good state.

[0076] In this way, in the embodiment, it is possible to accurately predict the holding state of the substrate holding unit 31 based on the change over time in the differential data. Therefore, according to the embodiment, based on the obtained prediction, the worker can prepare parts such as the substrate holding unit 31 in advance and plan maintenance.

[0077] In the above embodiment, an example is shown in which the difference between the reference periodic fluctuation data and the periodic fluctuation data is calculated for each of multiple wafers W that are successively loaded into the processing unit 16, and the maximum value of such differences is calculated as the difference data, but the present disclosure is not limited to such an example.

[0078] For example, in the present disclosure, the difference between the reference periodic fluctuation data and the periodic fluctuation data may be calculated for each of a plurality of wafers W successively loaded into the processing unit 16, and the average value of these differences may be calculated as the difference data.

[0079] Then, the prediction unit 18e may predict the holding state of the substrate holding unit 31 based on the change over time of the difference data. This also makes it possible to predict the holding state of the substrate holding unit 31 with high accuracy.

[0080] Furthermore, in the example of FIG. 6, the prediction unit 18e predicts the holding state of the substrate holding unit 31 by linear regression analysis, but the present disclosure is not limited to such an example, and the holding state of the substrate holding unit 31 may be predicted using various analysis methods.

[0081] The substrate processing apparatus (substrate processing system 1) according to the embodiment includes a substrate holding unit 31, an optical sensor 60, and a control unit 18. The substrate holding unit 31 holds and rotates a substrate (wafer W) to be processed. The optical sensor 60 irradiates the substrate (wafer W) held and rotated by the substrate holding unit 31 with light and receives reflected light. The control unit 18 controls each unit. The control unit 18 also includes a creation unit 18a and a determination unit 18c. The creation unit 18a irradiates the substrate (wafer W) held and rotated by the substrate holding unit 31 with light from the optical sensor 60, acquires changes in the intensity of the reflected light while the substrate (wafer W) is rotating, and creates periodic fluctuation data. The determination unit 18c determines whether the substrate (wafer W) held by the substrate holding unit 31 is in a normal state based on the periodic fluctuation data. This allows the holding state of the wafer W to be detected with high accuracy.

[0082] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the control unit 18 further includes a calculation unit 18b that calculates the difference between pre-stored reference periodic fluctuation data and the periodic fluctuation data created by the creation unit 18a. Furthermore, the determination unit 18c determines that the holding state of the substrate (wafer W) is normal if the difference is within a given range, and determines that the holding state of the substrate (wafer W) is abnormal if the difference is not within the given range. This allows the holding state of the wafer W to be detected with even greater accuracy.

[0083] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the reference period variation data is period variation data created for another substrate held in the substrate holding unit before the substrate (wafer W) held in the substrate holding unit 31 is loaded in. This makes it possible to obtain the reference period variation data when the substrate holding unit 31 is normal.

[0084] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the creation unit 18a creates individual periodic fluctuation data each time one of the plurality of substrates (wafers W) is loaded. The calculation unit 18b calculates the maximum value of the differences among the plurality of substrates (wafers W) as difference data. The control unit 18 further includes a prediction unit 18e that predicts the holding state of the substrate holding unit 31 based on changes over time in the difference data. This allows the holding state of the substrate holding unit 31 to be predicted with high accuracy.

[0085] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the creation unit 18a creates individual periodic fluctuation data each time a plurality of substrates (wafers W) are loaded. The calculation unit 18b calculates an average value of the differences for the plurality of substrates (wafers W) as differential data. The control unit 18 further includes a prediction unit 18e that predicts the holding state of the substrate holding unit 31 based on changes over time in the differential data. This allows the holding state of the substrate holding unit 31 to be predicted with high accuracy.

[0086] In the substrate processing apparatus (substrate processing system 1) according to the embodiment, the control unit 18 further includes an abnormality handling unit 18d that executes an abnormality handling process when the determination unit 18c determines that the holding state of the substrate (wafer W) is abnormal. This allows the operator to recognize the abnormal state of the substrate holding unit 31.

[0087] The substrate processing apparatus (substrate processing system 1) according to the embodiment further includes an imaging device 70 that captures an image of the substrate (wafer W) held by the substrate holder 31. The creation unit 18a creates periodic fluctuation data of the processed substrate (wafer W). When the determination unit 18c determines that the holding state of the processed substrate (wafer W) is abnormal, the abnormality handler 18d stores the captured images of the substrate during processing. This allows an operator to check the details of the malfunction again at a later date using the stored captured images.

[0088] <Control processing procedure> Next, the procedure of the control process according to the embodiment will be described with reference to Figures 7 to 9. Figure 7 is a flowchart showing an example of the procedure of the control process executed by the substrate processing system 1 according to the embodiment.

[0089] In the control process according to the embodiment, first, the control unit 18 holds the wafer W carried into the processing unit 16 by the substrate holding unit 31 (step S101). Then, the control unit 18 performs a holding abnormality detection process to detect an abnormality in the holding state of the wafer W held by the substrate holding unit 31 (step S102). The holding abnormality detection process will be described in detail later.

[0090] Next, the control unit 18 performs a time-dependent change detection process to detect a time-dependent change in the holding state of the wafer W held by the substrate holding unit 31 (step S103). The time-dependent change detection process will be described in detail later.

[0091] Next, the control unit 18 supplies a processing liquid and a rinse liquid to the wafer W while rotating the wafer W held by the substrate holding unit 31, thereby performing a given process on the wafer W (step S104).

[0092] In the processing of step S104, for example, the control unit 18 controls the substrate processing unit 30, etc. to rotate the wafer W at a given rotation speed, and controls the liquid supply unit 40, etc. to supply the processing liquid onto the wafer W at a given supply amount.

[0093] Furthermore, the control unit 18 performs a rinse process using DIW on the wafer W after the liquid process using the processing liquid has been completed. Furthermore, the control unit 18 performs a drying process such as spin drying on the wafer W after the rinse process has been completed.

[0094] Finally, the control unit 18 performs a holding abnormality detection process to detect an abnormality in the holding state of the wafer W held by the substrate holding unit 31 (step S105), and ends the series of control processes.

[0095] FIG. 8 is a flowchart showing an example of the procedure of the holding abnormality detection process executed by the substrate processing system 1 according to the embodiment.

[0096] In this holding abnormality detection process, first, the control unit 18 rotates the wafer W at a given rotation speed (for example, in the range of 1 (rpm) to 100 (rpm)) and measures the peripheral edge of the wafer W with the optical sensor 60 (step S201).

[0097] Next, the control unit 18 creates periodic fluctuation data of the wafer W based on the measurement results of the optical sensor 60 (step S202). Then, the control unit 18 calculates the difference between pre-stored reference periodic fluctuation data and the periodic fluctuation data of the wafer W (step S203).

[0098] Next, the control unit 18 determines whether the calculated difference is within a given range (step S204). If the difference is within the given range (step S204, Yes), the control unit 18 determines that the holding state of the wafer W is normal, and ends a series of holding abnormality detection processes.

[0099] On the other hand, if the difference is not within the given range (No at step S204), the control unit 18 determines that the holding state of the wafer W is not normal, and executes various abnormality handling processes (step S205).

[0100] Next, the control unit 18 determines whether the wafer W whose holding state is deemed abnormal has undergone a given substrate process (step S206). If the given substrate process has been performed on the target wafer W (step S206, Yes), the control unit 18 stores the captured image of the substrate process of the wafer W that was performed immediately before in the storage unit 19 (step S207), and ends the series of holding abnormality detection processes.

[0101] On the other hand, if the target wafer W has not yet undergone the given substrate processing (No at step S206), the series of holding abnormality detection processes is ended.

[0102] FIG. 9 is a flowchart showing an example of the procedure of the time-dependent change detection process executed by the substrate processing system 1 according to the embodiment.

[0103] In this time-dependent change detection process, first, the control unit 18 calculates the maximum or average value of the difference between the pre-stored reference period variation data and the period variation data created in the above-mentioned time-dependent change detection process as difference data (step S301).

[0104] Next, the control unit 18 plots the maximum or average value of the difference between the reference period variation data and the period variation data in an XY space as shown in Fig. 6 (step S302). Then, the control unit 18 performs linear regression analysis of the change over time of the difference data in the XY space in which the maximum or average value of the differences for the multiple wafers W is plotted (step S303).

[0105] Next, the control unit 18 determines whether there is a significant difference in the slope of the line created by the linear regression analysis (step S304). If it is determined that there is a significant difference in the slope of the line created by the linear regression analysis (step S304, Yes), the control unit 18 predicts the timing when the maximum or average value of the difference will deviate from the allowable range (step S305).

[0106] Furthermore, the control unit 18 notifies the operator of the predicted deviation timing (step S306) and ends the series of time-dependent change detection processes. On the other hand, if it is determined that there is no significant difference in the slope of the line created by the linear regression analysis (step S304, No), the series of time-dependent change detection processes ends.

[0107] The substrate processing method according to the embodiment includes a holding step (step S101), a creating step (step S202), and a determining step (step S204). In the holding step (step S101), the substrate (wafer W) is held by the substrate holding unit 31. In the creating step (step S202), periodic fluctuation data is created at least either before or after processing the substrate (wafer W). The periodic fluctuation data is created by irradiating the substrate (wafer W) held and rotating by the substrate holding unit 31 with light from an optical sensor 60 that emits light and receives reflected light, and acquiring changes in the intensity of the reflected light while the substrate (wafer W) is rotating. In the determining step (step S204), it is determined whether the holding state of the substrate (wafer W) held by the substrate holding unit 31 is normal based on the periodic fluctuation data. This allows the holding state of the wafer W to be detected with high accuracy.

[0108] The substrate processing method according to the embodiment further includes a calculating step (step S203). The calculating step (step S203) calculates the difference between pre-stored reference periodic fluctuation data and the periodic fluctuation data created in the creating step (step S202). The determining step (step S204) determines that the holding state of the substrate (wafer W) is normal if the difference is within a given range, and determines that the holding state of the substrate (wafer W) is abnormal if the difference is not within the given range. This allows the holding state of the wafer W to be detected with even greater accuracy.

[0109] Furthermore, in the substrate processing method according to the embodiment, the reference period variation data is period variation data created for another substrate held by substrate holding unit 31 before the substrate (wafer W) to be held by substrate holding unit 31 is loaded in. This makes it possible to obtain reference period variation data when substrate holding unit 31 is normal.

[0110] In the substrate processing method according to the embodiment, the creating step (step S202) creates individual periodic fluctuation data each time a plurality of substrates (wafers W) are loaded. In addition, the calculating step (step S203) calculates an average value of the differences for the plurality of substrates (wafers W) as the difference data. In addition, the substrate processing method according to the embodiment further includes a step (step S305) of predicting the holding state of the substrate holding part 31 based on changes in the difference data over time. This allows the holding state of the substrate holding part 31 to be predicted with high accuracy.

[0111] Furthermore, the substrate processing method according to the embodiment further includes a step of performing an abnormality response process (step S205) when the determining step (step S204) determines that the holding state of the substrate (wafer W) is abnormal, thereby enabling the operator to recognize the abnormal state of the substrate holding unit 31.

[0112] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments, and various modifications are possible without departing from the spirit thereof. For example, in the above embodiments, an example is shown in which the reference period variation data, captured images, difference data, etc. are stored in the memory unit 19 provided in the control device 4 of the substrate processing system 1, but the present disclosure is not limited to such an example. For example, in the present disclosure, the reference period variation data, captured images, difference data, etc. may be stored in a separate storage device connected to the control device 4 via a network.

[0113] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0114] W wafer (an example of a substrate) 1. Substrate processing system (an example of a substrate processing device) 4. Control device 16 Processing Unit 18 Control Unit 18a Creation Department 18b Calculation part 18c Judgment section 18d Abnormality Response Department 18e Prediction Department 19 Memory section 19a Reference period fluctuation data storage unit 19b Captured image storage unit 19c Differential data storage unit 31 Board holding part 60 Optical Sensor 70 Imaging device

Claims

1. a substrate holder that holds and rotates a substrate to be processed; an optical sensor that irradiates light onto the substrate that is held by the substrate holder and rotates, and receives reflected light; a control unit that controls each unit; Equipped with The control unit a creating unit that irradiates the substrate held by the substrate holder and rotates with light from the optical sensor, acquires a change in the intensity of the reflected light during the rotation of the substrate, and creates periodic fluctuation data; a determination unit that determines whether the holding state of the substrate held by the substrate holding unit is normal based on the periodic fluctuation data; a calculation unit that calculates a difference between pre-stored reference period variation data and the period variation data created by the creation unit, the determination unit determines that the holding state of the substrate is normal when the difference is within a given range, and determines that the holding state of the substrate is abnormal when the difference is not within the given range; the creation unit creates individual periodic fluctuation data each time the plurality of substrates are carried in one by one; the calculation unit calculates a maximum value of the differences among the plurality of substrates as difference data; The control unit a prediction unit that predicts the holding state of the substrate holder based on the change over time of the difference data. Substrate processing equipment.

2. A substrate holder that holds and rotates a substrate to be processed; an optical sensor that irradiates light onto the substrate that is held by the substrate holder and rotates, and receives reflected light; a control unit that controls each unit; Equipped with The control unit a creating unit that irradiates the substrate held by the substrate holder and rotates with light from the optical sensor, acquires a change in the intensity of the reflected light during the rotation of the substrate, and creates periodic fluctuation data; a determination unit that determines whether the holding state of the substrate held by the substrate holding unit is normal based on the periodic fluctuation data; a calculation unit that calculates a difference between pre-stored reference period variation data and the period variation data created by the creation unit, the determination unit determines that the holding state of the substrate is normal when the difference is within a given range, and determines that the holding state of the substrate is abnormal when the difference is not within the given range; the creation unit creates individual periodic fluctuation data each time the plurality of substrates are carried in one by one; the calculation unit calculates an average value of the differences for the plurality of substrates as difference data; The control unit a prediction unit that predicts the holding state of the substrate holder based on the change over time of the difference data. Substrate processing equipment.

3. The reference periodic fluctuation data is periodic fluctuation data created for another substrate held on the substrate holding unit before the substrate held on the substrate holding unit is carried in. The substrate processing apparatus according to claim 1 or 2.

4. The control unit The apparatus further includes an abnormality handling unit that executes an abnormality handling process when the determination unit determines that the substrate is not held normally. The substrate processing apparatus according to claim 1 or 2.

5. an imaging device that images the substrate held by the substrate holding unit, the creation unit creates the periodic fluctuation data of the processed substrate, The abnormality response unit When the determining unit determines that the holding state of the substrate after processing is not normal, the image captured during processing of the substrate is saved. The substrate processing apparatus according to claim 4 .

6. holding the substrate by a substrate holder; a step of irradiating the substrate held by the substrate holder and rotating with light from an optical sensor that irradiates light and receives reflected light at least either before or after processing the substrate, acquiring a change in intensity of the reflected light during the period when the substrate is rotating, and creating periodic fluctuation data; determining whether the holding state of the substrate held by the substrate holder is normal based on the periodic fluctuation data; calculating a difference between pre-stored reference periodic fluctuation data and the periodic fluctuation data created in the creating step; Including, The determining step determines that the substrate is held in a normal state when the difference is within a given range, and determines that the substrate is not held in a normal state when the difference is not within the given range; the creating step creates the periodic fluctuation data individually each time the plurality of substrates are carried in, the calculating step calculates an average value of the differences for the plurality of substrates as difference data; and predicting the holding state of the substrate holder based on the change over time of the difference data. Substrate processing method.

7. The reference periodic fluctuation data is periodic fluctuation data created for another substrate held on the substrate holding unit before the substrate held on the substrate holding unit is carried in. The substrate processing method according to claim 6 .

8. and executing an abnormality response process when the determining step determines that the substrate holding state is not normal.

8. The substrate processing method according to claim 6 or 7.

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