Dual-diaphragm speakers and electronic devices

Abstract

An embodiment of the present application provides a dual diaphragm speaker and electronic device. The speaker includes a ring-shaped housing, a magnetic circuit system axially dividing the ring-shaped housing into a first cavity and a second cavity, a first diaphragm disposed at a first end of the ring-shaped housing and forming a first front cavity with the first cavity and a first rear cavity with a first component, and a first voice coil disposed in the first front cavity, one end of the first voice coil connected to the first diaphragm and the other end of the first voice coil extending into a first magnetic gap. The speaker includes a voice coil, a second diaphragm disposed at a second end of the ring-shaped housing, forming a second rear cavity together with the second cavity and forming a second front cavity together with the second component, the second rear cavity not communicating with the first front cavity, and a second voice coil disposed in the second rear cavity, one end of the second voice coil being connected to the second diaphragm and the other end of the second voice coil extending into the second magnetic gap. The first front cavity communicates with the second front cavity through a first channel, the first channel being disposed in at least one of the magnetic circuit system and the ring-shaped housing. The dual diaphragm speaker in the embodiment of the present application has a small volume and can improve low and mid-frequency sensitivity.

Description

[Technical Field]

[0002] This application relates to the field of electroacoustics, and in particular to dual diaphragm speakers and electronic devices. [Background technology]

[0003] Although in-ear earphones have advantages such as good airtightness and sound insulation, good sound quality, and no sound leakage, wearing in-ear earphones can cause ear strain or pain, and most importantly, the stethoscope effect (i.e., mechanical waves generated by external collisions or air friction with the earphone cable or unit are transmitted directly to the ear canal through the earphone cable, causing unpleasant noise, and in-ear cables are usually stiff and contribute to conducting vibrations). However, semi-in-ear earphones have a semi-open architecture, do not have the stethoscope effect, and are comfortable to wear, making them popular with most consumers. However, due to the leaky architecture of semi-in-ear earphones, there is a large leakage of low- and mid-frequency sound waves (including low- and mid-frequency signals in the target signal and / or low- and mid-frequency signals in the noise-canceling signal), which results in poor low- and mid-frequency performance of semi-in-ear earphones. For example, when music is played, the effect of low and mid-frequency waves is insufficient, or the active noise canceling (ANC) function has insufficient noise canceling effect on low and mid-frequency noise.

[0004] Currently, the solution to this problem is to increase the low- and mid-frequency sensitivity of the speaker (speaker sensitivity is the sound pressure level generated at a distance of 1 m from the speaker axis when an electrical signal with a rated power of 1 W is applied to the speaker's input terminal. This reflects the efficiency of converting electrical energy into sound energy, and higher sensitivity indicates a higher probability of being driven by a power amplifier). However, while existing speakers improve their low- and mid-frequency sensitivity, their volume can increase, making them unable to be applied to miniaturized electronic devices or save space, and therefore not helpful in better meeting user demands. Therefore, the current challenge is how to realize and miniaturize speakers and earphones with high low- and mid-frequency sensitivity. Summary of the Invention

[0005] The embodiments of the present application provide a dual-diaphragm speaker and an electronic device. The sound transmission paths of the front and rear cavities of the two diaphragms are separated to avoid acoustic short-circuiting. Furthermore, sound wave overlap and high sound pressure can be achieved while maintaining low volume. Low- and mid-frequency performance is enhanced, and low- and mid-frequency sensitivity is further improved. [Means for solving the problem]

[0006] Therefore, in the embodiments of the present application, the following technical solutions are used:

[0007] According to a first aspect, an embodiment of the present application provides a dual diaphragm speaker. The dual diaphragm speaker includes a ring-shaped housing, a magnetic circuit system disposed within the ring-shaped housing and dividing a space within the ring-shaped housing into a first cavity and a second cavity in a direction of a main axis of the ring-shaped housing, the magnetic circuit system including a first magnetic gap and a second magnetic gap disposed at a distance around the main axis, a first diaphragm disposed at a first end of the ring-shaped housing to form a first front cavity together with the first cavity, the first diaphragm being configured to form a first rear cavity together with a first component on a side of the first diaphragm remote from the magnetic circuit system, a first voice coil disposed within the first front cavity, one end of the first voice coil connected to the first diaphragm and the other end of the first voice coil extending into the first magnetic gap, and the second cavity. the second diaphragm is disposed at a second end of the ring-shaped housing so as to form a second rear cavity together with the second component, the second diaphragm being configured to form a second front cavity with the second component on a side of the second diaphragm away from the magnetic circuit system, the second rear cavity not communicating with the first front cavity; and a second voice coil disposed in the second rear cavity, one end of the second voice coil being connected to the second diaphragm and the other end of the second voice coil extending into the second magnetic gap, the first front cavity communicating with the second front cavity via at least one first channel, the first channel being disposed in at least one of the magnetic circuit system and the ring-shaped housing, the second rear cavity being closed, or the second rear cavity communicating with the first rear cavity or the atmosphere via at least one second channel.

[0008] The first channel may be disposed in at least one of an outer peripheral wall of the magnetic circuit system and an inner wall of the ring-shaped housing, or within a housing wall of the ring-shaped housing.

[0009] High-frequency sound waves are less likely to short-circuit, while low- and mid-frequency sound waves have longer wavelengths and are more likely to short-circuit. This short-circuiting reduces the sound pressure of low- and mid-frequency waves and causes loss of acoustic performance. Therefore, in this embodiment of the present application, the sound transmission paths of the front and rear cavities of the two diaphragms are separated, thereby avoiding sound short-circuiting. When sound waves are superimposed, the low- and mid-frequency sound waves (including the low- and mid-frequency waves of the target signal and / or the low- and mid-frequency waves of the noise-canceling signal) can be improved, improving the low- and mid-frequency sensitivity of the speaker, achieving better low- and mid-frequency noise-canceling effects, and / or enhancing the low- and mid-frequency waves of the target signal. Furthermore, communication between the first front cavity and the second front cavity is achieved through a first channel disposed inside or within the ring-shaped housing, which facilitates connection to the acoustic output pipe of the electronic device. Compared with a solution in which a pipe is arranged outside the ring-shaped housing to connect the first and second front cavities, this helps reduce the volume and achieve miniaturization. Also, because the diaphragm can be arranged on the end face of the ring-shaped housing, the diaphragm area is larger, more air is forced in, and the sound pressure is higher, which further improves the low and mid-frequency sensitivity of the speaker.

[0010] In a possible embodiment, the outer peripheral wall of the magnetic circuit system is sealingly connected to the inner wall of the ring-shaped housing, the outer peripheral edge of the second diaphragm is sealingly connected to the magnetic circuit system, the first channel includes a first open groove disposed on the inner wall of the ring-shaped housing and / or the outer peripheral wall of the magnetic circuit system, the first diaphragm is sealingly connected to the entire end face of the first end of the ring-shaped housing, and the first open groove extends from the first front cavity to the end face of the second end of the ring-shaped housing, or the first diaphragm is sealingly connected to the magnetic circuit system, and a first notch communicating with the front cavity is disposed in the magnetic circuit system, the first channel further includes a first notch, and the first open groove extends from the first notch to the end face of the second end of the ring-shaped housing. In this embodiment, the first channel can be formed by providing an open groove in the inner wall of the ring-shaped housing, by providing an open groove in the outer peripheral wall of the magnetic circuit system, or by providing open grooves in the inner wall of the ring-shaped housing and the outer peripheral wall of the magnetic circuit system, respectively. In this case, the first diaphragm can be sealingly connected to the ring-shaped housing or the magnetic circuit system, and the second diaphragm can be sealingly connected to the magnetic circuit system.

[0011] In a possible embodiment, the second rear cavity communicates with the first rear cavity or the atmosphere via a second channel, a second notch communicating with the second rear cavity is disposed in the magnetic circuit system, the second channel includes a second port, the second notch, and a second open groove disposed in an inner wall of the ring-shaped housing and / or an outer circumferential wall of the magnetic circuit system, the second port is disposed in the outer circumferential wall of the ring-shaped housing, and the second open groove extends from the second notch to the second port, or the first diaphragm is sealingly connected to the magnetic circuit system, and the second channel includes a second notch and a second open groove disposed in the inner wall of the ring-shaped housing and / or an outer circumferential wall of the magnetic circuit system, and the second open groove extends from the second notch to an end face of the first end of the ring-shaped housing. In this embodiment, the second rear cavity can be connected to the atmosphere through a second channel, or the second rear cavity can be connected to the first rear cavity through a second channel, thereby increasing the volume of the rear cavity and thereby increasing the vibration amplitude of the corresponding diaphragm, thereby generating high sound pressure. This helps improve the low- and mid-frequency sensitivity of the speaker. The second open groove can also be formed by arranging an open groove in the inner wall of the ring-shaped housing, by arranging an open groove in the outer peripheral wall of the magnetic circuit system, or by arranging an open groove in both the inner wall of the ring-shaped housing and the outer peripheral wall of the magnetic circuit system.

[0012] In one possible embodiment, a first ring-shaped boss is disposed on an inner wall of the first end of the ring-shaped housing, the first diaphragm is sealingly connected to the first ring-shaped boss, the magnetic circuit system is connected to a side of the first ring-shaped boss away from the first diaphragm, an outer peripheral wall of the magnetic circuit system is sealingly connected to the inner wall of the ring-shaped housing, an outer peripheral edge of the second diaphragm is sealingly connected to the magnetic circuit system, a first notch communicating with the first front cavity is disposed in at least one of the first ring-shaped boss and the magnetic circuit system, the first channel includes the first notch and a first open groove disposed in the inner wall of the ring-shaped housing and / or the outer peripheral wall of the magnetic circuit system, the first open groove extending from the first notch to an end face of the second end of the ring-shaped housing. In this embodiment, the first ring-shaped boss is disposed to facilitate positioning and attachment of the magnetic circuit system and to prevent the magnetic circuit system from moving axially of the ring-shaped housing.

[0013] In a possible embodiment, the second rear cavity communicates with the first rear cavity or the atmosphere via a second channel, a second notch communicating with the second rear cavity is disposed in the magnetic circuit system, the second channel includes a second port, the second notch, and a second open groove disposed in the inner wall of the ring-shaped housing and / or the outer circumferential wall of the magnetic circuit system, the second port is disposed in the outer circumferential wall of the ring-shaped housing, and the second open groove extends from the second notch to the second port, or the second channel includes a second notch and a second open groove disposed in the inner wall of the ring-shaped housing and / or the outer circumferential wall of the magnetic circuit system, and the second open groove extends from the second notch to an end face of the first end of the ring-shaped housing and penetrates the first ring-shaped boss. In this embodiment, the second rear cavity can be connected to the atmosphere through a second channel, or the second rear cavity can be connected to the first rear cavity through a second channel, thereby increasing the volume of the rear cavity, thereby increasing the vibration amplitude of the corresponding diaphragm and generating high sound pressure, which helps improve the low and mid-frequency sensitivity of the speaker.

[0014] In a possible embodiment, a second ring-shaped boss is disposed on an inner wall of the second end of the ring-shaped housing, the second diaphragm is sealingly connected to the second ring-shaped boss, the magnetic circuit system is connected to a side of the second ring-shaped boss away from the second diaphragm, the first channel includes a first open groove disposed on the inner wall of the ring-shaped housing and / or the outer circumferential wall of the magnetic circuit system, the first diaphragm is sealingly connected to the entire end face of the first end of the ring-shaped housing, the first open groove extends from the first front cavity to the end face of the second end of the ring-shaped housing and penetrates the second ring-shaped boss, or the first diaphragm is sealingly connected to the magnetic circuit system, a first notch communicating with the front cavity is disposed in the magnetic circuit system, the first channel further includes a first notch, and the first open groove extends from the first notch to the end face of the second end of the ring-shaped housing. In this embodiment, a second ring-shaped boss is provided to facilitate positioning and mounting of the magnetic circuit system and to prevent the magnetic circuit system from moving in the axial direction of the ring-shaped housing.

[0015] In possible embodiments, the second rear cavity communicates with the first rear cavity or the atmosphere via a second channel, a second notch communicating with the second rear cavity is disposed in at least one of the second ring-shaped boss and the magnetic circuit system, the second channel includes a second port, the second notch, and a second open groove disposed in an inner wall of the ring-shaped housing and / or an outer circumferential wall of the magnetic circuit system, the second port is disposed in the outer circumferential wall of the ring-shaped housing, and the second open groove extends from the second notch to the second port, or the first diaphragm is sealingly connected to the magnetic circuit system, and the second channel includes a second notch and a second open groove disposed in the inner wall of the ring-shaped housing and / or the outer circumferential wall of the magnetic circuit system, and the second open groove extends from the second notch to an end face of the first end of the ring-shaped housing. In this embodiment, the second rear cavity can be connected to the atmosphere through a second channel, or the second rear cavity can be connected to the first rear cavity through a second channel, thereby increasing the volume of the rear cavity, thereby increasing the vibration amplitude of the corresponding diaphragm and generating high sound pressure, which helps improve the low and mid-frequency sensitivity of the speaker.

[0016] In a possible embodiment, a first ring-shaped boss is disposed on the inner wall of the first end of the ring-shaped housing, a second ring-shaped boss is disposed on the inner wall of the second end of the ring-shaped housing, the magnetic circuit system is connected between the first ring-shaped boss and the second ring-shaped boss, the outer peripheral wall of the magnetic circuit system is sealingly connected to the inner wall of the ring-shaped housing, the outer peripheral edge of the first diaphragm is sealingly connected to the first ring-shaped boss, and the outer peripheral edge of the second diaphragm is sealingly connected to the second ring-shaped boss, a first notch communicating with the first front cavity is disposed in at least one of the first ring-shaped boss and the magnetic circuit system, the first channel includes the first notch and a first open groove disposed in the inner wall of the ring-shaped housing and / or the outer peripheral wall of the magnetic circuit system, and the first open groove extends from the first notch to the end face of the second end of the ring-shaped housing and penetrates the second ring-shaped boss. In this embodiment, a first ring-shaped boss and a second ring-shaped boss are provided to facilitate positioning and mounting of the magnetic circuit system and to prevent the magnetic circuit system from moving in the axial direction of the ring-shaped housing.

[0017] In a possible embodiment, the second rear cavity communicates with the first rear cavity or the atmosphere via a second channel, and a second notch communicating with the second rear cavity is disposed in at least one of the second ring-shaped boss and the magnetic circuit system, and the second channel includes a second port, the second notch, and a second open groove disposed in an inner wall of the ring-shaped housing and / or an outer circumferential wall of the magnetic circuit system, and the second port is disposed in the outer circumferential wall of the ring-shaped housing and the second open groove extends from the second notch to the second port, or the second channel includes a second notch and a second open groove disposed in the inner wall of the ring-shaped housing and / or the outer circumferential wall of the magnetic circuit system, and the second open groove extends from the second notch to an end face of the first end of the ring-shaped housing and penetrates the first ring-shaped boss. In this embodiment, the second rear cavity can be connected to the atmosphere through a second channel, or the second rear cavity can be connected to the first rear cavity through a second channel, thereby increasing the volume of the rear cavity, thereby increasing the vibration amplitude of the corresponding diaphragm and generating high sound pressure, which helps improve the low and mid-frequency sensitivity of the speaker.

[0018] In one possible embodiment, the outer peripheral wall of the magnetic circuit system is sealingly connected to the inner peripheral wall of the ring-shaped housing, and the first channel includes a first through-hole disposed in the magnetic circuit system or the ring-shaped housing, with one end of the first through-hole connected to the first front cavity and the other end of the first through-hole extending to the end face of the second end of the ring-shaped housing. In this embodiment, the first channel can be formed by disposing a through-hole in the housing wall of the ring-shaped housing or by disposing a through-hole in the magnetic circuit system. In this case, the first diaphragm can be sealingly connected to the ring-shaped housing or the magnetic circuit system, and the second diaphragm can be sealingly connected to the ring-shaped housing or the magnetic circuit system.

[0019] In one possible embodiment, the second rear cavity communicates with the first rear cavity or with the atmosphere through a second channel. The outer peripheral wall of the magnetic circuit system is sealingly connected to the inner peripheral wall of the ring-shaped housing. The second channel includes a second through-hole disposed in the magnetic circuit system or the ring-shaped housing. A first end of the second through-hole communicates with the second rear cavity, and the other end of the second through-hole extends to the end face of the first end of the ring-shaped housing or to the outer peripheral wall of the ring-shaped housing. In this embodiment, the second channel can be formed by disposing a through-hole in the housing wall of the ring-shaped housing or by disposing a through-hole in the magnetic circuit system. In this case, the first diaphragm can be sealingly connected to the ring-shaped housing or the magnetic circuit system, and the second diaphragm can be sealingly connected to the ring-shaped housing or the magnetic circuit system.

[0020] In one possible embodiment, the first ring-shaped boss is disposed on the inner wall of the first end of the ring-shaped housing, and the magnetic circuit system is sealingly connected to the first ring-shaped boss on a side of the first ring-shaped boss facing away from the first diaphragm, and / or the second ring-shaped boss is disposed on the inner wall of the second end of the ring-shaped housing, and the magnetic circuit system is sealingly connected to the second ring-shaped boss on a side of the second ring-shaped boss facing away from the second diaphragm. In this embodiment, the first ring-shaped boss and the second ring-shaped boss are disposed to facilitate positioning and mounting of the magnetic circuit system and to prevent the magnetic circuit system from moving axially of the ring-shaped housing. In this case, the first diaphragm can be sealingly connected to the first ring-shaped boss, and the second diaphragm can be sealingly connected to the second ring-shaped boss.

[0021] In a possible embodiment, three or more first channels are arranged in the dual diaphragm speaker, and the three or more first channels are arranged at intervals around the circumference of the ring-shaped housing, so that the first channels are evenly arranged, the sound produced is good, and the force applied to the ring-shaped housing is balanced.

[0022] In a possible embodiment, three or more second channels are arranged in the dual diaphragm speaker, and the three or more second channels are arranged at intervals around the circumference of the ring-shaped housing, so that the second channels are evenly arranged, the sound produced is good, and the force applied to the ring-shaped housing is balanced.

[0023] In one possible embodiment, a positioning boss is disposed on the outer peripheral wall of the ring-shaped housing, and a plurality of through-holes are disposed in the positioning boss, communicating with the inside and outside of the ring-shaped housing. A first voice coil line is disposed in the first voice coil, and a second voice coil line is disposed in the second voice coil. The first voice coil line and the second voice coil line are electrically connected to a power amplifier device via the plurality of through-holes, respectively. The positioning boss and the at least one first channel or the at least one second channel are disposed at intervals around the circumference of the ring-shaped housing. In this embodiment, the positioning boss may be configured to position the dual-diaphragm speaker and attach it to an electronic device. A structure enabling the voice coil line to communicate with an external circuit may be disposed in the positioning boss, for example, a through-hole or embedded metal solder pad connected to the inside and outside of the ring-shaped housing. In this manner, the voice coil line may be connected to an external circuit via the through-hole, or the voice coil line may be connected to a metal solder pad in the ring-shaped housing, and the metal solder pad is connected to the external circuit. In addition, the positioning bosses and channels are spaced apart in the circumferential direction of the ring-shaped housing, so that the sound wave conduction is uniform, the structural design is reasonable, and the force is balanced.

[0024] In a possible embodiment, the ring-shaped housing includes a first housing and a second housing arranged in the direction of the main axis, wherein a first ring-shaped step is arranged on the end face of the first housing at the end remote from the second housing, a first ring-shaped mounting portion is arranged on the outer circumferential edge of the first diaphragm, and the first ring-shaped mounting portion is arranged on the first ring-shaped step to realize a sealed connection between the outer circumferential edge of the first diaphragm and the end face of the first end of the ring-shaped housing, and / or a second ring-shaped step is arranged on the end face of the second housing at the end remote from the first housing, a second ring-shaped mounting portion is arranged on the outer circumferential edge of the second diaphragm, and the second ring-shaped mounting portion is arranged on the second ring-shaped step to realize a sealed connection between the outer circumferential edge of the second diaphragm and the end face of the second end of the ring-shaped housing. In this embodiment, the ring-shaped housing may be divided into a first housing and a second housing for ease of installation and manufacturing. The first ring-shaped step may be disposed on the inner or outer side of the end face of the first housing for ease of positioning and installation of the first diaphragm, and the first ring-shaped mounting portion, such as a steel ring of the first diaphragm, may be disposed on the first ring-shaped step, thereby achieving a good sealing effect between the first diaphragm and the first housing. Similarly, the second ring-shaped step may be disposed on the inner or outer side of the end face of the second housing for ease of positioning and installation of the second diaphragm, and the second ring-shaped mounting portion, such as a steel ring of the second diaphragm, may be disposed on the second ring-shaped step, thereby achieving a good sealing effect between the second diaphragm and the second housing. It will be understood that the first housing and the second housing may also be fabricated as a whole when operational requirements and processing conditions are met.

[0025] In one possible embodiment, when the first and second voice coils are connected to an AC current, the first and second diaphragms vibrate in the same direction, thereby achieving superposition of sound waves to generate high sound pressure and thereby improving low and mid-frequency sensitivity.

[0026] In one possible embodiment, the first component is a first structure of the electronic device to which the dual-diaphragm speaker is attached, and the second component is a sound output tube of the electronic device. In other words, the dual-diaphragm speaker may cooperate with the first structure of the electronic device to form a first rear cavity and cooperate with the sound output tube of the electronic device to form a second front cavity. In this way, a separate cover body is not required for the dual-diaphragm speaker to form the first rear cavity and the second front cavity, thereby reducing the volume and contributing to product miniaturization. Furthermore, the sound output tube and the dual-diaphragm speaker form the second front cavity, which facilitates the transmission of sound waves generated by the diaphragms to the sound output tube.

[0027] In one possible embodiment, the dual-diaphragm speaker further includes a first cover body, the first cover body being sealingly connected to the first diaphragm as a first component to form a first rear cavity, and a second cover body, the second cover body being sealingly connected to the second diaphragm as a second component to form a second front cavity, the second front cavity being configured to communicate with a sound output tube of an electronic device. The first rear cavity may be closed or may communicate with the atmosphere. The first and second cover bodies are disposed within the dual-diaphragm speaker, the first cover body being sealingly connected to the first diaphragm to form the first rear cavity, and the second cover body being sealingly connected to the second diaphragm to form the second front cavity. In this way, the first rear cavity and the second front cavity do not need to be formed using the structure of the electronic device, which slightly improves the structure of the electronic device. Therefore, the dual diaphragm speaker has a wider range of application and can be used in more types of existing electronic devices.

[0028] In one possible embodiment, the first component is a first structure of an electronic device to which a dual-diaphragm speaker is attached, and the dual-diaphragm speaker further includes a second cover body, the second cover body being sealingly connected to the second diaphragm as the second component to form a second front cavity, the second front cavity being configured to communicate with a sound output tube of the electronic device. The second cover body may be disposed within the dual-diaphragm speaker, the second cover body being sealingly connected to the second diaphragm to form the second front cavity, and the first structure of the electronic device and the first diaphragm may form the first rear cavity. In this way, the second front cavity does not need to be formed using the structure of the electronic device, slightly improving the structure of the electronic device.

[0029] In one possible embodiment, the second component is used as a sound output tube of an electronic device, and the dual-diaphragm speaker further includes a first cover body, the first cover body being sealingly connected to the first diaphragm on a side of the first diaphragm facing away from the magnetic circuit system to form a first rear cavity. The first rear cavity may be closed or may be open to the atmosphere. The first cover body is disposed within the dual-diaphragm speaker, and the first cover body is sealingly connected to the first diaphragm to form the first rear cavity. In this manner, the first rear cavity does not need to be formed using the structure of the electronic device, slightly improving the structure of the electronic device. Furthermore, the sound output tube of the electronic device and the second diaphragm of the dual-diaphragm speaker form a second front cavity, which is convenient for transmitting sound waves generated by the two diaphragms to the sound output tube.

[0030] According to a second aspect, an embodiment of the present application provides an electronic device. The electronic device includes the dual diaphragm speaker according to the first aspect, a first structure as a first component connected to the first diaphragm of the dual diaphragm speaker on a side of the first diaphragm away from the magnetic circuit system to form a first rear cavity, and a sound output tube as a second component connected to the second diaphragm of the dual diaphragm speaker on a side of the second diaphragm away from the magnetic circuit system to form a second front cavity. The first rear cavity may be closed or may be open to the atmosphere.

[0031] According to a third aspect, an embodiment of the present application provides an electronic device including a sound output tube and the dual diaphragm speaker according to the first aspect. The dual diaphragm speaker includes a first cover body and a second cover body, the first cover body being sealingly connected to the first diaphragm as a first component to form a first rear cavity, and the second cover body being sealingly connected to the second diaphragm as a second component to form a second front cavity, the second front cavity of the dual diaphragm speaker communicating with the sound output tube.

[0032] According to a fourth aspect, an embodiment of the present application provides an electronic device. The electronic device includes the dual diaphragm speaker according to the first aspect. The dual diaphragm speaker includes: a second cover body, the second cover body being sealingly connected to the second diaphragm as a second component to form a second front cavity; a first structure, the first component being connected to the first diaphragm of the dual diaphragm speaker on a side of the first diaphragm away from the magnetic circuit system to form a first rear cavity; and a sound output tube, the second front cavity of the dual diaphragm speaker communicating with the sound output tube. The first rear cavity may be closed or may be open to the atmosphere.

[0033] According to a fifth aspect, an embodiment of the present application provides an electronic device. The electronic device includes the dual diaphragm speaker according to the first aspect. The dual diaphragm speaker includes a first cover body sealingly connected as a first component to a side of the first diaphragm away from a magnetic circuit system of the first diaphragm to form a first rear cavity, and a sound output tube as a second component connected to a second diaphragm of the dual diaphragm speaker at a side of the second diaphragm away from the magnetic circuit system to form a second front cavity.

[0034] Other features and advantages of the present invention are described in detail in the following sections of specific embodiments.

[0035] The accompanying drawings used in the description of the embodiments or the prior art will be briefly described below. [Brief explanation of the drawings]

[0036] [Figure 1A] 1 is a schematic diagram of a structure of an electronic device according to an embodiment of the present application; [Figure 1B] 1B is a curve diagram of the sound pressure level obtained after the sound waves of the two diaphragms of the electronic device of FIG. 1A are superimposed. [Figure 2] FIG. 1 is a three-dimensional view of a dual diaphragm speaker according to a first embodiment of the present application. [Figure 3] FIG. 3 is a schematic diagram of an exploded structure of the dual diaphragm speaker shown in FIG. 2. [Figure 4] FIG. 3 is a top view of the dual diaphragm speaker shown in FIG. 2. [Figure 5] FIG. 5 is a schematic diagram of a cross-sectional structure taken along line VV in FIG. [Figure 6] 6 is a schematic diagram of the current flow direction in the two voice coils of the magnetic circuit system shown in FIG. 5. [Figure 7] FIG. 6 is a three-dimensional top view of a first housing of the ring-shaped housing shown in FIG. 5. [Figure 8] FIG. 6 is a three-dimensional bottom view of the first housing of the ring-shaped housing shown in FIG. 5. [Figure 9] FIG. 6 is a three-dimensional top view of the second housing of the ring-shaped housing shown in FIG. 5. [Figure 10] FIG. 6 is a three-dimensional bottom view of the second housing of the ring-shaped housing shown in FIG. 5. [Figure 11] FIG. 2 is a top view of another dual diaphragm speaker according to the first embodiment of the present application. [Figure 12] FIG. 12 is a schematic diagram of an exploded structure of another dual diaphragm speaker shown in FIG. 11. [Figure 13] FIG. 12 is a schematic diagram of a cross-sectional structure taken along line MM in FIG. [Figure 14] FIG. 4 is a schematic diagram of a cross-sectional structure of a dual diaphragm speaker according to a second embodiment of the present application. [Figure 15] FIG. 10 is a schematic diagram of a cross-sectional structure of a dual diaphragm speaker according to a third embodiment of the present application. [Figure 16] 12 is a top view of the other dual diaphragm speaker shown in FIG. 11 with a cover body disposed thereon. FIG. [Figure 17] FIG. 17 is a schematic diagram of a cross-sectional structure taken along line NN in FIG. 16. DETAILED DESCRIPTION OF THE INVENTION

[0037] The following describes the technical solutions of the embodiments of the present application with reference to the accompanying drawings of the embodiments of the present application.

[0038] In the description of this application, positions or positional relationships indicated by terms such as "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," etc. are based on positions or positional relationships shown in the accompanying drawings, and are intended merely to facilitate and simplify the description of this application, and therefore should not be understood as limitations on this application, and do not indicate or imply that the referenced devices or components are required to be provided in or constructed and operated in a particular location.

[0039] It should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "attached," "coupled," and "connected" should be understood broadly, and may refer to, for example, a fixed connection, a detachable connection, a butt joint connection, or an integral connection. Those skilled in the art may interpret the specific meaning of the above terms in this application based on specific cases.

[0040] In the description herein, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more of the embodiments or examples.

[0041] Semi-in-ear earphones are popular with most consumers because they lack the stethoscope effect and are comfortable to wear. However, due to their semi-open architecture, semi-in-ear earphones suffer from the problem of significant leakage of low- and mid-frequency sound waves (including target signals and / or noise-canceling signals). The target signal may be an audio signal, such as music or voice, that needs to be reproduced and transmitted by a speaker controlled by a processor or controller within the earphone. The noise-canceling signal is a signal with an opposite phase to the noise, so the noise-canceling signal and the noise can cancel each other out, thereby achieving the purpose of noise cancellation. When a speaker is used to play music and leaks a large amount of the target signal, such as the low- and mid-frequency music, the sound quality is affected. When a speaker is used for noise cancellation and leaks a large amount of the low- and mid-frequency noise of the noise-canceling signal, the active noise cancellation (ANC) effect is poor due to the low- and mid-frequency noise. The above problem can be solved by improving the low- and mid-frequency sensitivity of the speaker. In other words, the low and mid-frequency sound waves generated by the speaker can be increased to ensure that the remaining low and mid-frequency sound waves can still meet the usage requirements when the low and mid-frequency sound waves have a certain leakage, thereby ensuring the sound quality and / or ANC effect.

[0042] Existing solutions for improving the low-frequency sensitivity of speakers include two concepts: one is to improve the speaker's force coefficient (BL), which typically requires increasing the magnetic energy density and the number of coil turns. However, there are limitations to the development of magnetic materials, earphone stacking space, and the expansion of high-frequency bandwidth, which also impose certain limitations on improving the force coefficient. The other is to increase the diaphragm area, which is typically achieved by increasing the speaker diameter of single-diaphragm speakers. For example, for comfort, earphone speakers are typically designed with a diameter of less than 14 mm. Therefore, in miniaturized devices, the speaker space that can be accommodated is limited, and the diaphragm area is also limited, which does not contribute to better improving low- and mid-frequency performance.

[0043] Another solution to increasing the diaphragm area is the dual-diaphragm speaker. However, in conventional technology, the two diaphragms of a dual-diaphragm speaker either affect each other or fail to achieve the dual benefits of small volume and good low- and mid-frequency performance. In other words, the areas of the two diaphragms cannot be increased while maintaining a small volume. This results in poor low- and mid-frequency sensitivity in miniaturized devices.

[0044] FIG. 1A is a schematic diagram of the structure of an electronic device according to one embodiment of the present application. As shown in FIG. 1A, the electronic device includes a dual-diaphragm speaker 30, which typically includes a ring-shaped housing 1, a magnetic circuit system 2 disposed within the ring-shaped housing 1, a first diaphragm 3, a second diaphragm 5, etc. The magnetic circuit system 2 divides the space within the ring-shaped housing 1 into a first cavity Q1 and a second cavity Q2 in the axial direction. The magnetic circuit system 2 includes a first magnetic gap C1 and a second magnetic gap C2 (C1 and C2 are not shown in FIG. 1A; see FIG. 5 for details) spaced apart around a main axis. The second magnetic gap C2 is disposed inside the first magnetic gap C1. A first voice coil (not shown in FIG. 1A) connected to the inner surface of the first diaphragm 3 extends into the first magnetic gap C1, and a second voice coil (not shown in FIG. 1A) connected to the inner surface of the second diaphragm 5 extends into the second magnetic gap. A first front cavity may be formed on a side of the first diaphragm 3 facing the first cavity Q1, and a first rear cavity may be formed on a side of the first diaphragm 3 away from the first cavity Q1. A second front cavity may be formed on a side of the second diaphragm 5 facing the second cavity Q2, and a second rear cavity may be formed on a side of the second diaphragm 5 away from the second cavity Q2.

[0045] The front and rear cavities of the two diaphragms of existing dual-diaphragm speakers are not separated from each other, making high-frequency sound waves less likely to short-circuit, while low- and mid-frequency sound waves have longer wavelengths and are more likely to short-circuit. This short-circuit reduces the sound pressure of low- and mid-frequency waves and causes a loss of acoustic performance. Furthermore, existing dual-diaphragm speakers cannot simultaneously achieve the two advantages of small volume and good low- and mid-frequency performance (because both diaphragms have large areas). Two types of dual-diaphragm speakers in the prior art are described below.

[0046] The dual-diaphragm speaker in the prior art solution 1 includes a treble unit and a bass unit. To extend the frequency response of the speaker to higher frequencies, the sound from the bass unit's diaphragm (corresponding to the second diaphragm 5 in FIG. 1A) where the voice coil is located passes through the hole in the second magnetic gap C2 and is superimposed on the treble unit. Because the bass unit emits sound through the hole in the second magnetic gap, the diameter of the treble unit's diaphragm (corresponding to the first diaphragm 3 in FIG. 1A) cannot be larger than the hole in the second magnetic gap (if the diameter is larger than the hole, the hole will be blocked). In this case, the area of ​​the treble unit's diaphragm cannot be increased, and the improvement in sensitivity is very limited.

[0047] The dual-diaphragm speaker in Solution 2 of the prior art assumes that the speaker has a large amplitude. To reduce the vibration of the speaker and improve the sound effect, the two diaphragms are vibrated in opposite directions to generate sound. The sound pressure of the two diaphragms is directed to the sound output port through the cavity structure of the entire speaker. Because the diaphragms vibrate in opposite directions to generate sound, the cavity of the entire speaker must conduct and superimpose the sound waves of the two diaphragms. Therefore, the entire speaker requires a large space, which does not contribute to achieving product miniaturization and has a limited range of application.

[0048] In consideration of this, embodiments of the present application provide a dual-diaphragm speaker and an electronic device including the dual-diaphragm speaker. The dual-diaphragm speaker separates the sound transmission paths of the front and rear cavities of the two diaphragms, thereby avoiding sound short-circuiting. This improves low- and mid-frequency sound waves (including the low- and mid-frequency signals of target signals such as music and / or noise-canceling signals) and achieves high low- and mid-frequency sensitivity. Furthermore, when a small volume is achieved, the diaphragm has a large area, which allows more air to be compressed, resulting in high sound pressure, which can further improve low- and mid-frequency sensitivity. In other words, the dual-diaphragm speaker in embodiments of the present application simultaneously possesses the advantages of small volume and high low- and mid-frequency sensitivity, and can be used in small or thin applications for electronic devices such as earphones, mobile phones, notebook computers, tablet computers, speakers, and televisions, for example, for high-fidelity audio playback or mid-bass enhancement. In addition, it is advantageous for the rear cavities of the two diaphragms of a dual diaphragm speaker to be in communication with the atmosphere, which can increase the amplitude of the diaphragms, generate high sound pressure, and better improve low and mid-frequency sensitivity.

[0049] Continuing with reference to FIG. 1A , an electronic device may include a first structure 10, a sound output tube 20, and a dual-diaphragm speaker 30. The first structure 10 may be a battery or another structure of the electronic device, such as a housing or a circuit board. The first diaphragm 3 and magnetic circuit system 2 of the dual-diaphragm speaker 30 form a first front cavity F1, and the first structure 10 of the electronic device is connected to the first diaphragm 3 on a side of the first diaphragm 3 away from the magnetic circuit system 2 to form a first rear cavity B1. The second diaphragm 5 of the dual-diaphragm speaker, together with the magnetic circuit system 2, forms a second cavity B2. The sound output tube 20 of the electronic device is connected to the second diaphragm 5 on a side of the second diaphragm 5 away from the magnetic circuit system 2 to form a second front cavity F2. The first forward cavity F1 communicates with the second forward cavity F2 through a first pipe P1 disposed in at least one of the magnetic circuit system 2 and the ring-shaped housing 1. The first pipe P1 is disposed in at least one of the outer peripheral wall of the magnetic circuit system 2 and the inner wall of the ring-shaped housing 1, or within the housing wall of the ring-shaped housing 1. In FIG. 1A , one end of the first channel P1 is connected to the first forward cavity F1, and a port K1 at the other end of the first channel P1 is disposed on the end face of the second end of the ring-shaped housing 1. The second rear cavity B2 may be closed or may communicate with the first rear cavity B1 or the atmosphere through at least one second channel P2. One end of the second channel P2 is connected to the second rear cavity B2, and a port K2 at the other end of the second channel P2 may be disposed on the outer rear wall of the ring-shaped housing 1 or the end face of the first end of the ring-shaped housing 1. The first rear cavity B1 may be closed or may be in communication with the atmosphere.

[0050] In the electronic device of the present application, the first front cavity F1 of the first diaphragm 3 is isolated from the first rear cavity B1, and the second front cavity F2 of the second diaphragm 5 is isolated from the second rear cavity B2, which is not connected to the first front cavity F1. As a result, the two diaphragms do not affect each other. The two diaphragms vibrate together to generate sound. The first front cavity F1 can communicate with the second front cavity F2 through the first channel P1, and the first rear cavity B1 can communicate with the second rear cavity B2 through the second channel P2, thereby achieving sound pressure superposition. This improves the speaker's low- and mid-frequency sensitivity and enhances the low- and mid-frequency sound waves of the noise-canceling signal or target signal, providing consumers with a better active noise-canceling effect and / or sound quality experience. Furthermore, because the first channel P1 is located close to the ring-shaped housing 1 and inside the ring-shaped housing, the areas of the first diaphragm 3 and the second diaphragm 5 are large, improving low- and mid-frequency performance. Furthermore, there is no need to install a separate tube outside the ring-shaped housing 1 to connect the two cavities, thereby effectively reducing the speaker's volume. This contributes to the miniaturization of electronic devices and can further improve other performance aspects, such as product comfort and battery life.

[0051] FIG. 1B is a curve diagram of the sound pressure level obtained after the sound waves of the two diaphragms of the electronic device of FIG. 1A are superimposed. As shown in FIG. 1B, "Φ12 Unit" indicates the sound pressure level curve of a 12 mm diameter diaphragm, i.e., the curve positioned lower, while "Two-in-One" indicates the sound pressure level curve of the superimposed two diaphragms, i.e., the curve positioned higher. From FIG. 1B, it can be seen that after the two diaphragms are superimposed, both low- and mid-frequency sound waves and high-frequency sound waves are improved.

[0052] The following describes the structure of a dual-diaphragm speaker in an electronic device in an embodiment of the present application. The dual-diaphragm speaker in this embodiment has characteristics such as high sensitivity, a wide high-frequency bandwidth, and a small occupying space. The two diaphragms vibrate in the same direction to generate sound. A magnetic circuit system 2 and a ring-shaped housing 1 are used to form a channel. The large areas of the first diaphragm 3 and the second diaphragm 5 allow the sound pressure to overlap. Given the small volume, the speaker's low- and mid-frequency sensitivity is improved, thereby improving the ANC performance and / or sound quality experience of electronic devices such as earphones that use the semi-open speaker architecture.

[0053] It should be noted that in the dual-diaphragm speaker of the present application, the second rear cavity B2 may be closed. In this case, the second channel P2 does not exist, and only the first channel P1 exists. Alternatively, the second rear cavity B2 may communicate with the first rear cavity B1 or the atmosphere via at least one second channel P2. In this case, the first channel P1 and the second channel P2 may exist simultaneously, and the first channel P1 does not communicate with the second channel P2. In the following, an example will be described in which the dual-diaphragm speaker has both the first channel P1 and the second channel P2.

[0054] A first damping cloth may be disposed in the port K1 of the first channel P1 for sealing. A second damping cloth may be disposed in the port K2 of the second channel P2 for sealing. The damping cloth can prevent the intrusion of foreign matter and adjust acoustic performance, such as the frequency response curve, phase curve, and distortion curve, to a specific degree. There are several options for the specific structure of the ports K1 and K2. The ports may be entirely open or may be formed by multiple small openings. For example, a porous structure or mesh structure may be disposed in the port to form multiple small openings.

[0055] Alternatively, three or more first channels P1 may be arranged in a dual diaphragm speaker, with the three or more first channels P1 being spaced apart in the circumferential direction of the ring-shaped housing 1. Three or more second channels P2 may be arranged in a dual diaphragm speaker, with the three or more second channels P2 being spaced apart in the circumferential direction of the ring-shaped housing 1. In this way, the channels are evenly arranged, the sound produced is good, and the forces applied to the ring-shaped housing 1 are balanced.

[0056] Alternatively, the entire outer peripheral wall of the magnetic circuit system 2 may be sealingly connected to the entire inner peripheral wall of the ring-shaped housing 1, and the first channel P1 may include a first through hole disposed in the magnetic circuit system 2 or the ring-shaped housing 1. That is, the first through hole may be disposed inside the housing wall of the ring-shaped housing 1, or the first through hole may be disposed in the magnetic circuit system 2. One end of the first through hole is connected to the first front cavity F1, and the other end of the first through hole extends to the end face of the second end of the ring-shaped housing 1. The second channel P2 may include a second through hole disposed in the magnetic circuit system 2 or the ring-shaped housing 1. The second through hole may be disposed inside the housing wall of the ring-shaped housing 1, or the second through hole may be disposed in the magnetic circuit system 2. One end of the second through hole is connected to the second rear cavity B2, and the other end extends to the end face of the first end of the ring-shaped housing 1 or to the outer peripheral wall of the ring-shaped housing 1. Furthermore, to facilitate positioning and mounting of the magnetic circuit system 2 within the ring-shaped housing 1 and prevent the magnetic circuit system 2 from moving axially of the ring-shaped housing 1, a first ring-shaped boss L1 is disposed on the inner wall of the first end of the ring-shaped housing 1, and the magnetic circuit system 2 is sealingly connected to the first ring-shaped boss L1 on a side of the first ring-shaped boss L1 remote from the first diaphragm 3. A second ring-shaped boss L2 may be disposed on the inner wall of the second end of the ring-shaped housing 1, and the magnetic circuit system 2 is sealingly connected to the second ring-shaped boss L2 on a side of the second ring-shaped boss L2 remote from the second diaphragm 5.

[0057] Alternatively, the first channel P1 may include a first open groove N1 (see FIG. 3 or FIG. 12 described later) disposed in at least one of the inner wall of the ring-shaped housing 1 and the outer circumferential wall of the magnetic circuit system 2. The inner wall of the ring-shaped housing 1 and the outer circumferential wall of the magnetic circuit system 2 are in sealing contact with each other to form the first channel P1 in the open groove N1. In other words, the first open groove N1 may be disposed only in the inner wall of the ring-shaped housing 1, and the first channel P1 may be formed between the first open groove N1 and the outer circumferential wall of the magnetic circuit system 2 corresponding to the first open groove N1. Alternatively, the first open groove N1 may be disposed only in the magnetic circuit system 2, and the first channel P1 may be formed between the first open groove N1 and the inner wall of the ring-shaped housing 1 corresponding to the first open groove N1. Alternatively, the first open groove N1 may be disposed in both the outer wall of the magnetic circuit system 2 and the inner wall of the ring-shaped housing 1, and the two first open grooves N1 of the magnetic circuit system 2 and the ring-shaped housing 1 together form the first channel P1. Similarly, the second channel P2 may include a second open groove N2 (see FIG. 3 or FIG. 12 described later) disposed in at least one of the inner wall of the ring-shaped housing 1 and the outer peripheral wall of the magnetic circuit system 2. The inner wall of the ring-shaped housing 1 and the outer wall of the magnetic circuit system 2 are in sealing contact with each other, and form the second channel P2 in the second open groove N2.

[0058] In the following, the specific structure of the dual diaphragm speaker in the embodiment of the present application will be described using an example in which the opening grooves are separately arranged on the ring-shaped housing 1 or the opening grooves are separately arranged on the magnetic circuit system 2 to form the first channel P1 and the second channel P2.

[0059] Fig. 2 is a three-dimensional view of a dual diaphragm speaker according to a first embodiment of the present application. Fig. 3 is a schematic diagram of an exploded structure of the dual diaphragm speaker shown in Fig. 2. As shown in Figs. 2 and 3, the dual diaphragm speaker includes a ring-shaped housing 1, a magnetic circuit system 2, a first diaphragm 3, a first voice coil 4, a second diaphragm 5, and a second voice coil 6. The magnetic circuit system 2 may include a first magnetically permeable member 21, a first magnet 22, a second magnetically permeable member 23, a second magnet 24, and a third magnetically permeable member 25.

[0060] FIG. 4 is a top view of the dual-diaphragm speaker shown in FIG. 2. FIG. 5 is a schematic cross-sectional view taken along line VV in FIG. 4. As shown in FIG. 5, a magnetic circuit system 2 is disposed within a ring-shaped housing 1 and divides the space within the ring-shaped housing 1 into a first cavity Q1 and a second cavity Q2 along the main axis of the ring-shaped housing 1. A first diaphragm 3 is disposed at a first end of the ring-shaped housing 1 and forms a first front cavity F1 together with the first cavity Q1. A first voice coil is disposed in the first front cavity F1. One end of a first voice coil 4 is connected to the first diaphragm 3, and the other end of the first voice coil 4 extends into a first magnetic gap C1. The second diaphragm 5 is disposed at the second end of the ring-shaped housing 1 and forms a second rear cavity B2 together with the second cavity Q2. A second front cavity F2 is formed on the side of the second diaphragm 5 away from the magnetic circuit system 2 together with a second component, such as the sound output tube 20 of the electronic device. The second rear cavity B2 does not communicate with the first front cavity F1. The second voice coil 6 is disposed in the second rear cavity B2. One end of the second voice coil 6 is connected to the second diaphragm 5, and the other end of the second voice coil 6 extends into the second magnetic gap C2. The first voice coil 3 may be adhesively connected to the first diaphragm 3, and the second voice coil 6 may be bonded to the second diaphragm 5. The first diaphragm 3 and the second diaphragm 5 may be attached to each other in a bonded manner.

[0061] The first ring-shaped boss L1 may be arranged at a first end of the ring-shaped housing 1, and the second ring-shaped boss L2 may be arranged at a second end of the ring-shaped housing 1. Based on when the ring-shaped bosses are arranged on the ring-shaped housing 1, the following four solutions can be classified:

[0062] Solution 1: The first ring-shaped boss L1 and the second ring-shaped boss L2 are not disposed on the ring-shaped housing 1.

[0063] 5 , the outer peripheral wall of the magnetic circuit system 2 is sealingly connected to the inner wall of the ring-shaped housing 1, the outer peripheral edge of the second diaphragm 5 is sealingly connected to the magnetic circuit system 2, the first channel P1 includes a first open groove N1 disposed in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, the first diaphragm 3 is sealingly connected to the entire end face of the first end of the ring-shaped housing 1, and the first open groove N1 extends from the first front cavity F1 to the end face of the second end of the ring-shaped housing 1. Alternatively, the first diaphragm 3 is sealingly connected to the magnetic circuit system 2, and a first notch E1 communicating with the front cavity F1 is disposed in the magnetic circuit system 2, the first channel P1 further includes the first notch E1, and the first open groove N1 extends from the first notch E1 to the end face of the second end of the ring-shaped housing 1.

[0064] The second rear cavity B2 may also be connected to the first rear cavity B1 or the atmosphere via a second channel P2, and a second notch E2 communicating with the second rear cavity B2 is arranged in the magnetic circuit system 2, and the second channel P2 includes a port K2, a second notch E2, and a second open groove N2 arranged in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and the port K2 is arranged in the outer peripheral wall of the ring-shaped housing 1, and the second open groove N2 extends from the second notch E2 to the port K2.

[0065] Solution 2: The first ring-shaped boss L1 is disposed on the ring-shaped housing 1, but the second ring-shaped boss L2 is not disposed.

[0066] As shown in FIG. 5 , a first ring-shaped boss L1 is disposed on the inner wall of the first end of the ring-shaped housing 1, a first diaphragm 3 is sealingly connected to the first ring-shaped boss L1, a magnetic circuit system 2 is connected to a side of the first ring-shaped boss L1 away from the first diaphragm 3, an outer peripheral wall of the magnetic circuit system 2 is sealingly connected to the inner wall of the ring-shaped housing 1, and an outer peripheral edge of the second diaphragm 5 is sealingly connected to the magnetic circuit system 2, a first notch E1 communicating with the first front cavity F1 is disposed in at least one of the first ring-shaped boss L1 and the magnetic circuit system 2, and a first channel P1 includes the first notch E1 and a first open groove N1 disposed in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and the first open groove N1 extends from the first notch E1 to the end face of the second end of the ring-shaped housing 1.

[0067] The second rear cavity B2 may also be connected to the first rear cavity B1 or the atmosphere via a second channel P2, and a second notch E2 communicating with the second rear cavity B2 is arranged in the magnetic circuit system 2, and the second channel P2 includes a port K2, a second notch E2, and a second open groove N2 arranged in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and the port K2 is arranged in the outer peripheral wall of the ring-shaped housing 1, and the second open groove N2 extends from the second notch E2 to the port K2.

[0068] The first ring-shaped boss L1 includes at least one first arcuate section, and the first arcuate section is disposed in a portion of the inner wall of the first end of the ring-shaped housing 1 where the first open groove N1 is not disposed. In other words, to facilitate communication between the first open groove N1 and the first front cavity F1, the first ring-shaped boss L1 does not have to be disposed in the first open groove N1, and the first ring-shaped boss L1 does not have to be disposed over the entire inner circumferential wall of the ring-shaped housing 1. When only one first open groove N1 is disposed in the ring-shaped housing 1, the first ring-shaped boss L1 may include a first arcuate section, and both ends of the first arcuate section may be disposed at intervals from the first open groove N1, so that the first open groove N1 may communicate with the first front cavity F1. When two first open grooves N1 are disposed in the ring-shaped housing 1, the first ring-shaped boss L1 may include two first arcuate sections, and the two first arcuate sections are disposed at an interval from the first open groove N1, so that the first open groove N1 may communicate with the first front cavity F1. When three first open grooves N1 are disposed in the ring-shaped housing 1, the first ring-shaped boss L1 may include three first arcuate sections, and two adjacent first arcuate sections of the three first arcuate sections are disposed at an interval from the first open groove N1, so that the first open groove N1 may communicate with the first front cavity F1. As shown in FIGS. 7 and 8 (described later), the first ring-shaped boss L1 includes three first arcuate sections in the circumferential direction of the ring-shaped housing 1.

[0069] Solution 3: The first ring-shaped boss L1 is not disposed on the ring-shaped housing 1, but the second ring-shaped boss L2 is disposed.

[0070] As shown in FIG. 5 , a second ring-shaped boss L2 is disposed on the inner wall of the second end of the ring-shaped housing 1, a second diaphragm 5 is sealingly connected to the second ring-shaped boss L2, a magnetic circuit system 2 is connected to a side of the second ring-shaped boss L2 that is remote from the second diaphragm 5, the first channel P1 includes a first open groove N1 disposed on the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and the first diaphragm 3 is sealingly connected to the end of the first end of the ring-shaped housing 1. The first diaphragm 3 is sealingly connected to the magnetic circuit system 2, and a first open groove N1 extends from the first front cavity F1 to the end face of the second end of the ring-shaped housing 1 and penetrates the second ring-shaped boss L2, or the first diaphragm 3 is sealingly connected to the magnetic circuit system 2, and a first notch E1 communicating with the front cavity F1 is arranged in the magnetic circuit system 2, and the first channel P1 further includes a first notch E1, and the first open groove N1 extends from the first notch E1 to the end face of the second end of the ring-shaped housing 1.

[0071] Furthermore, the second rear cavity B2 communicates with the first rear cavity B1 or the atmosphere via a second channel P2, and a second notch E2 communicating with the second rear cavity B2 is disposed in at least one of the second ring-shaped boss L2 and the magnetic circuit system 2, and the second channel P2 includes a port K2, a second notch E2, and a second open groove N2 disposed in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, the port K2 being disposed in the outer peripheral wall of the ring-shaped housing 1, and the second open groove N2 extending from the second notch E2 to the port K2.

[0072] Solution 4: The first ring-shaped boss L1 and the second ring-shaped boss L2 are disposed on the ring-shaped housing 1.

[0073] As shown in FIG. 5 , a first ring-shaped boss L1 is disposed on the inner wall of a first end of the ring-shaped housing 1, a second ring-shaped boss L2 is disposed on the inner wall of a second end of the ring-shaped housing 1, the magnetic circuit system 2 is connected between the first ring-shaped boss L1 and the second ring-shaped boss L2, the outer peripheral wall of the magnetic circuit system 2 is sealingly connected to the inner wall of the ring-shaped housing 1, the outer peripheral edge of the first diaphragm 3 is sealingly connected to the first ring-shaped boss L1, and the outer peripheral edge of the second diaphragm 5 is sealingly connected to the second ring-shaped boss L2. A first notch E1, which is sealingly connected to the ring-shaped boss L2 and communicates with the first forward cavity F1, is arranged in at least one of the first ring-shaped boss L1 and the magnetic circuit system 2, and the first channel P1 includes the first notch E1 and a first open groove N1 arranged in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and the first open groove N1 extends from the first notch E1 to the end face of the second end of the ring-shaped housing 1 and penetrates the second ring-shaped boss L2.

[0074] Furthermore, the second rear cavity B2 communicates with the first rear cavity B1 or the atmosphere via a second channel P2, and a second notch E2 communicating with the second rear cavity B2 is disposed in at least one of the second ring-shaped boss L2 and the magnetic circuit system 2, and the second channel P2 includes a port K2, a second notch E2, and a second open groove N2 disposed in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, the port K2 being disposed in the outer peripheral wall of the ring-shaped housing 1, and the second open groove N2 extending from the second notch E2 to the port K2.

[0075] 3 and 5, in the above four solutions, the first magnetically permeable member 21 includes a recess 211 and a ring-shaped flange 212 disposed around the opening of the recess 211. The recess 211 includes a bottom wall and a side wall disposed around the bottom wall. The opening of the recess 211 faces the second diaphragm 5 or the first diaphragm 3. The first magnet 22 and the second magnetically permeable member 23 are stacked in the recess 211. The first magnet 22 is disposed between the bottom wall of the recess 211 and the second magnetically permeable member 23. The magnetic circuit system 2 includes a first magnetic gap C1 and a second magnetic gap C2 spaced apart around the main axis. Specifically, the first magnet 22 and the second magnetically permeable member 23 are spaced apart from the side wall of the recess 211 to form the second magnetic gap C2. The second magnet 24 and the third magnetically permeable member 25 are stacked on the ring-shaped flange 212 around the recess 211, and the second magnet 24 is disposed between the ring-shaped flange 212 and the third magnetically permeable member 25. The second magnet 24 and the third magnetically permeable member 25 are spaced apart from the sidewall of the recess 211 to form a first magnetic gap C1. At least one of the ring-shaped flange 212, the second magnet 24, and the third magnetically permeable member 25 is connected to the ring-shaped housing 1.

[0076] All components of the magnetic circuit system 2 may have the same principal axis. The first magnet 22 is joined to the second magnetic permeable member 23 on a side of the first magnet 22 that faces away from the first magnetic permeable member 21. The second magnet 24 is joined to the third magnetic permeable member 25 on a side of the second magnet 24 that faces away from the first magnetic permeable member 21. The magnetic circuit system 2 formed by the first magnetic permeable member 21, the first magnet 22, the second magnetic permeable member 23, the second magnet 24, and the third magnetic permeable member 25 divides the internal space of the ring-shaped housing 1 into a first cavity Q1 and a second cavity Q2, and the first cavity Q1 does not communicate with the second cavity Q2. The first voice coil 4 and the second voice coil 6 are coaxially installed within the magnetic gap. One end of the first voice coil 4 is suspended, and the other end of the first voice coil 4 is bonded to the first diaphragm 3. One end of the second voice coil 6 is suspended, and the other end of the second voice coil 6 is bonded to the second diaphragm 5. The outer periphery of the first diaphragm 3 is fastened to the ring-shaped housing 1, and the outer periphery of the second diaphragm 5 is fastened to the ring-shaped housing 1. Sound waves near the voice coil surface of the first diaphragm 3 (in the first front cavity F1) are conducted via the first pipe P1, and sound waves near the voice coil surface of the second diaphragm 5 (in the second rear cavity B2) are conducted via the second pipe P2. The first diaphragm 3 and the second diaphragm 5 emit sound simultaneously, and the sound waves are superimposed by conduction through the pipes, thereby achieving an expanded frequency range and enhanced mid- and low-range sounds. Compared with the single diaphragm speaker, the purpose of improving the high and low frequencies simultaneously can be achieved.

[0077] The magnetic field lines of the two magnets, resulting from the closed loop formed by the magnetic force convergence of the three magnetically permeable members and the two voice coils, are coaxially arranged in the center of the magnetic gap. The magnetic circuit system 2 allows the first diaphragm 3 and the second diaphragm 5 to share the magnetic circuit. This eliminates the need for two magnetic circuit systems, improving the utilization of magnetic energy, saving space, reducing the speaker volume, and facilitating the miniaturization of electronic devices. As a result, electronic devices that use speakers, such as earphones, can be more comfortable to wear, and more space can be used to install batteries, improving the battery life of the electronic device.

[0078] To achieve sound wave superposition, when the first voice coil 4 and the second voice coil 6 of the magnetic circuit system are connected to an AC current, the vibration directions of the first diaphragm 3 and the second diaphragm 5 are the same. Specifically, there are two possible cases, but not limited to these:

[0079] Case 1: The magnetic field of the first magnet 22 in the direction of its main axis is opposite to the magnetic field of the second magnet 24, and the second magnet 24 and first magnet 22, which are axially magnetized and have opposite directions to each other, are coaxially connected using a first permeable member 21 shared by the second magnet 24 and the first magnet 22. The three permeable members function as magnetic force convergers, and the magnetic field lines of the first magnet 22 and the second magnet 24 form two closed loops around the first magnetic gap C1 and the second magnetic gap C2, respectively, due to the magnetic force convergence of the three permeable members. Specifically, the second magnet 24 and the first magnet 22 are magnetized in the axial direction, with their magnetization directions being opposite to each other. For example, the magnetic field of the first magnet 22 in the direction from the second diaphragm 5 to the first diaphragm 3 is such that the south pole points to the north pole, and the magnetic field of the second magnet 24 in the direction from the second diaphragm 5 to the first diaphragm 3 is such that the north pole points to the south pole, and the magnetic lines of force form a closed loop of second magnet 24 > first magnetic permeable member 21 > second permeable member 23 > first magnet 22 > first magnetic permeable member 21 > third permeable member 25 > second magnet 24.

[0080] FIG. 6 is a schematic diagram of the current flow direction in the two voice coils of the magnetic circuit system of the dual-diaphragm speaker shown in FIG. 5. As shown in FIG. 6, the magnetic field in the direction of the primary axis of the first magnet 22 is opposite to the magnetic field in the direction of the primary axis of the second magnet 24, and the current directions in the first voice coil 4 and the second voice coil 6 are opposite, so the vibration directions of the first diaphragm 3 and the second diaphragm 5 are the same. In other words, referring to the magnetization directions of the magnets, the voice coil windings, and the positive and negative wiring of the speaker unit, the current directions in the two voice coils are guaranteed to be opposite at the same moment, so that the two diaphragms vibrate simultaneously in the same direction, achieving sound wave superposition and maximizing the output sound pressure level.

[0081] Case 2: The magnetic field in the direction of the main axis of the first magnet 22 is the same as the magnetic field in the direction of the main axis of the second magnet 24, and the current direction in the first voice coil 4 and the second voice coil 6 is the same, so the vibration direction of the first diaphragm 3 and the second diaphragm 5 is the same.

[0082] Furthermore, it should be noted that the magnetic circuit system 2 of the dual diaphragm speaker in this embodiment of the present application can have multiple structures, provided that when disposed within the ring-shaped housing 1, the magnetic circuit system 2 can axially divide the space within the ring-shaped housing 1 into a first cavity Q1 and a second cavity Q2 that are not in communication, and a first magnetic gap C1 and a second magnetic gap C2 exist.

[0083] Figure 7 is a three-dimensional top view of the first housing of the ring-shaped housing shown in Figure 5. Figure 8 is a three-dimensional bottom view of the first housing of the ring-shaped housing shown in Figure 5. As shown in Figure 5, the ring-shaped housing 1 may include a first housing 11 and a second housing 12 arranged in the direction of the main axis. The first end of the ring-shaped housing 1 is the end of the first housing 11 remote from the second housing 12, and the second end of the ring-shaped housing 1 is the end of the second housing 12 remote from the first housing 11. 5, 7, and 8, the first ring-shaped step T1 is disposed on the outside or inside of the end of the first housing 11 remote from the second housing 12, and the first ring-shaped mounting portion A1 is disposed on the outer circumferential edge of the first diaphragm 3. The first ring-shaped mounting portion A1 is disposed on the first ring-shaped step T1, thereby realizing a sealed connection between the outer circumferential edge of the first diaphragm 3 and the end face of the first end of the ring-shaped housing 1. Also, as shown in FIGS. 7 and 8, a portion of the first opening groove N1, the first ring-shaped boss L1, the port K2, and a portion of a positioning boss D (described later) may be disposed on the first housing 11.

[0084] 9 is a three-dimensional top view of the second housing of the ring-shaped housing shown in FIG. 5. FIG. 10 is a three-dimensional bottom view of the second housing of the ring-shaped housing shown in FIG. 5. As shown in FIGS. 5, 9, and 10, a second ring-shaped step T2 is disposed on the outer or inner side of the end of the second housing 12 remote from the first housing 11, and a second ring-shaped mounting portion A2 is disposed on the outer circumferential edge of the second diaphragm 5. The second ring-shaped mounting portion A2 is disposed on the second ring-shaped step, thereby realizing a sealed connection between the outer circumferential edge of the second diaphragm 5 and the end face of the second end of the ring-shaped housing 1. Also, as shown in FIGS. 9 and 10, other parts of the first opening groove N1, the second opening groove N2, the second ring-shaped boss L2, and a positioning boss D (described later) may be disposed on the first housing 11.

[0085] In other words, for ease of installation and manufacturing, the ring-shaped housing 1 may be divided into a first housing 11 and a second housing 12. For ease of positioning and installation of the first diaphragm 3, the first ring-shaped step T1 may be disposed on an end surface of the first housing 11, and the first ring-shaped mounting portion A1, such as a steel ring, of the first diaphragm 3 may be disposed on the first ring-shaped step T1, thereby achieving a good sealing effect between the first diaphragm 3 and the first housing 11. Similarly, for ease of positioning and installation of the second diaphragm 5, the second ring-shaped step T2 may be disposed on an end surface of the second housing 12, and the second ring-shaped mounting portion A2, such as a steel ring, of the second diaphragm 5 may be disposed on the second ring-shaped step T2, thereby achieving a good sealing effect between the second diaphragm 5 and the second housing 12. It will be appreciated that the first housing 11 and the second housing 12 may also be fabricated as a whole when operational requirements and processing conditions are met.

[0086] As shown in FIGS. 7 to 10 , a positioning boss D is disposed on the outer peripheral wall of the ring-shaped housing 1, and a plurality of through-holes communicating with the inside and outside of the ring-shaped housing 1 are disposed in the positioning boss D. As shown in FIG. 3 , a first voice coil line X1 is disposed in the first voice coil 4, and a second voice coil line X2 is disposed in the second voice coil 6. The first voice coil line X1 and the second voice coil line X2 are electrically connected to a power amplifier device via the plurality of through-holes, and the positioning boss D and at least one port K1 are disposed at intervals around the circumferential direction of the ring-shaped housing 1. The positioning boss D and at least one port K2 may also be disposed at intervals around the circumferential direction of the ring-shaped housing 1. The positioning boss D is disposed to facilitate positioning and attachment of the dual diaphragm speaker to an electronic device and to ensure that the port K1 and the port K2 correspond to corresponding positions on the electronic device. The voice coil may include a ring-shaped support bracket and a voice coil line with multiple turns disposed around the ring-shaped support bracket. Alternatively, the voice coil may include a ring-shaped metal bracket and a voice coil line connected to the ring-shaped metal bracket. The voice coil and the power amplifier device may be electrically connected in the following two ways, but are not limited to these.

[0087] Method 1: During injection molding of the ring-shaped housing 1, metal solder pads H (as shown in FIG. 2) are embedded in the portions of the ring-shaped housing 1 where the positioning bosses D are formed, so that a portion of the metal solder pads H is positioned within the ring-shaped housing 1 and another portion of the metal solder pads H is exposed from the ring-shaped housing 1. The first voice coil line X1 and the second voice coil line X2 are connected to the metal solder pads H within the ring-shaped housing 1, and the metal solder pads H are connected to an external power amplifier device. This prevents the voice coil lines from being exposed from the ring-shaped housing 1, providing good protection for the voice coil lines and preventing them from being damaged. In other words, the positioning bosses D are disposed on the outer peripheral wall of the ring-shaped housing 1, not only serving the roles of positioning and assembly, but also facilitating the connection of the voice coil lines to external circuits.

[0088] Method 2: The voice coil line may be extended through the through-hole of the positioning boss D and connected to the power amplifier device, which helps to reduce the difficulty in processing the ring-shaped housing 1, improve the processing speed and reduce costs.

[0089] 5, the first open groove N1 and the second open groove N2 may be disposed on the inner wall of the ring-shaped housing 1, and the first open groove N1 and the second open groove N2 may be disposed in the magnetic circuit system. For details, see FIGS. 11 to 13 described later.

[0090] FIG. 11 is a top view of another dual diaphragm speaker according to the first embodiment of the present application. FIG. 12 is a schematic diagram of the exploded structure of the dual diaphragm speaker shown in FIG. 11. FIG. 13 is a schematic diagram of the cross-sectional structure along line MM in FIG. 11. As shown in FIGS. 11 to 13, the first opening groove N1 and the second opening groove N2 are disposed in the magnetic circuit system 2. As shown in FIG. 12, the first opening groove N1 may be disposed in the second magnet 24 and the third magnetically permeable member 25 of the magnetic circuit system 2. The second opening groove N2 is disposed on the first magnetically permeable member 21; that is, the length of the first opening groove N2 is short, and it may be disposed only on the first magnetically permeable member 21, but it may also be disposed on the second magnet 24 if necessary.

[0091] Fig. 14 is a schematic diagram of the cross-sectional structure of a dual-diaphragm speaker according to a second embodiment of the present application. As shown in Fig. 14, for the structure of the first channel P1 in four cases, namely, when the first ring-shaped boss L1 and the second ring-shaped boss L2 are not disposed on the ring-shaped housing 1, when only the first ring-shaped boss L1 is disposed, when only the second ring-shaped boss L2 is disposed, and when the first ring-shaped boss L1 and the second ring-shaped boss L2 are disposed, please refer to the description of Fig. 5 above. Below, only other structures of the second channel P2 in the four cases will be described with reference to Fig. 14.

[0092] When the first ring-shaped boss L1 and the second ring-shaped boss L2 are not arranged in the ring-shaped housing 1, the first diaphragm 3 is sealingly connected to the magnetic circuit system 2, and the second channel P2 may include a second notch E2 and a second open groove N2 arranged in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and the second open groove N2 extends from the second notch E2 to the end face of the first end of the ring-shaped housing 1.

[0093] When only the first ring-shaped boss L1 is arranged in the ring-shaped housing 1 and the second ring-shaped boss L2 is not arranged, the second channel P2 includes a second notch E2 and a second open groove N2 arranged in the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and the second open groove N2 extends from the second notch E2 to the end face of the first end of the ring-shaped housing 1 and penetrates the first ring-shaped boss L1.

[0094] When only the second ring-shaped boss L2 is arranged on the ring-shaped housing 1 and the first ring-shaped boss L1 is not arranged, the first diaphragm 3 is sealingly connected to the magnetic circuit system 2, and the second channel P2 may include a second open groove N2 arranged on the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and a second notch E2, and the second open groove N2 extends from the second notch E2 to the end face of the first end of the ring-shaped housing 1.

[0095] When the first ring-shaped boss L1 and the second ring-shaped boss L2 are arranged in the ring-shaped housing 1, the second channel P2 includes a second notch E2 and a second open groove N2 arranged on the inner wall of the ring-shaped housing 1 and / or the outer peripheral wall of the magnetic circuit system 2, and the second open groove N2 extends from the second notch E2 to the end face of the first end of the ring-shaped housing 1 and penetrates the second ring-shaped boss L2.

[0096] Please note that in the case where the second rear cavity B2 is closed (i.e., the second channel P2 does not exist), please refer to the design scheme of the first channel P1 in the previous embodiment described in Figures 5 to 14.

[0097] High-frequency sound waves are less likely to short-circuit, while low- and mid-frequency sound waves have longer wavelengths and are more likely to short-circuit. This short-circuiting reduces the sound pressure of low- and mid-frequency waves and causes loss of acoustic performance. Therefore, in this embodiment of the present application, the sound transmission paths of the front and rear cavities of the two diaphragms are separated, thereby avoiding sound short-circuiting. When sound waves are superimposed, the low- and mid-frequency sound waves (including the low- and mid-frequency waves of the target signal and / or the low- and mid-frequency waves of the noise-canceling signal) can be improved, improving the low- and mid-frequency sensitivity of the speaker, achieving better low- and mid-frequency noise-canceling effects, and / or enhancing the low- and mid-frequency waves of the target signal. Furthermore, communication between the first front cavity and the second front cavity is achieved through a first channel disposed inside or within the ring-shaped housing, which facilitates connection to the acoustic output pipe of the electronic device. Compared with a solution in which a pipe is arranged outside the ring-shaped housing to connect the first and second front cavities, this helps reduce the volume and achieve miniaturization. Also, because the diaphragm can be arranged on the end face of the ring-shaped housing, the diaphragm area is larger, more air is forced in, and the sound pressure is higher, which further improves the low and mid-frequency sensitivity of the speaker.

[0098] FIG. 15 is a schematic diagram of a cross-sectional structure of a dual-diaphragm speaker according to a third embodiment of the present application. As shown in FIG. 15, a port K1 is disposed on the outer peripheral wall of the ring-shaped housing 1, and a port K2 is disposed on the outer peripheral wall of the ring-shaped housing 1. At least one first open groove N1 is disposed on the inner wall of the ring-shaped housing 1, and the first open groove N1 extends from the first front cavity F1 to the port K1 and communicates with the port K1. A first diaphragm 3 seals and covers the entire end face of the first end of the ring-shaped housing 1. At least one second open groove N2 is disposed on the inner wall of the ring-shaped housing 1, and the second open groove N2 extends from the second rear cavity B2 to the port K2 and communicates with the port K2. A second diaphragm 5 seals and covers the entire end face of the second end of the ring-shaped housing 1. A portion of the outer peripheral wall of the magnetic circuit system 2 is sealingly connected to the inner wall of the ring-shaped housing 1, and the outer peripheral wall of the magnetic circuit system 2 corresponding to the first open groove N1 forms a first channel P1 together with the first open groove N1. The outer peripheral wall of the magnetic circuit system 2 corresponding to the second open groove N2 forms a second channel P2 together with the second open groove N2. The first open groove N1 may be disposed only on the outer peripheral wall of the magnetic circuit system 2. The second open groove N2 and the first open groove N1 cooperate with the inner wall of the ring-shaped housing 1 to form the first channel P1, and the second open groove N2 cooperates with the inner wall of the ring-shaped housing 1 to form the second channel P2. Alternatively, open grooves may be disposed simultaneously on the outer peripheral wall of the magnetic circuit system 2 and the inner wall of the ring-shaped housing 1 to form the first channel P1 and the second channel P2.

[0099] Furthermore, the port K1 may be disposed in the first housing 11 and / or the second housing 12. In other words, the port K1 may be disposed only in the first housing 11 or only in the second housing 12, or a portion of the port K1 may be disposed in the first housing 11 and another portion of the port K1 may be disposed in the second housing 12. The port K2 may be disposed in the first housing 11 and / or the second housing 12. In other words, the port K2 may be disposed only in the first housing 11 or only in the second housing 12, or a portion of the port K2 may be disposed in the first housing 11 and another portion of the port K2 may be disposed in the second housing 12.

[0100] Furthermore, the positions of the two or more ports K1 in the direction of the major axis may be the same or different. The positions of the two or more ports K2 in the direction of the major axis may be the same or different. Hereinafter, port K2 will be used as an example for explanation. Specifically, one of the three or more ports K2 may be disposed on an end surface of the first housing 11 that contacts the second housing 12. For example, an open groove may be disposed on the end surface of the first housing 11, and the open groove may cooperate with the end surface of the second housing 12 to form port K2. The other of the three or more ports K2 may be disposed on an end surface of the second housing 12 that contacts the first housing 11. An open groove may be disposed on the end surface of the second housing 12, and the open groove may cooperate with the end surface of the first housing 11 to form port K2.

[0101] In one example, bosses may be disposed on the inner wall of the ring-shaped housing 1 to facilitate attachment of the magnetic circuit system 2 and prevent the magnetic circuit system 2 from moving in the direction of the main axis of the ring-shaped housing 1. Specifically, a first ring-shaped boss L1 is disposed in a portion of a first end of the ring-shaped housing 1 where the first open groove N1 is not disposed, and a second ring-shaped boss L2 is disposed in a portion of a second end of the ring-shaped housing 1 where the second open groove N2 is not disposed, and the magnetic circuit system 2 is disposed between the first ring-shaped boss L1 and the second ring-shaped boss L2 and fastened to the first ring-shaped boss L1 and the second ring-shaped boss L2.

[0102] In the dual-diaphragm speaker according to the third embodiment of the present application, both ports K1 and K2 are located on the outer peripheral wall of the ring-shaped housing 1. This eliminates the need to provide space for ports on the mounting surfaces of the diaphragms, i.e., the end surfaces of the ring-shaped housing. The first diaphragm 3 can seal and cover the entire opening at the first end of the ring-shaped housing 1, and the second diaphragm 5 can seal and cover the entire opening at the second end of the ring-shaped housing 1. This allows the first diaphragm 3 and the second diaphragm 5 to have larger areas and allow more air to be forced through. This helps generate more low- and mid-frequency sound waves and improve noise-canceling performance.

[0103] In the above embodiment, the dual diaphragm speaker needs to cooperate with the structure of the electronic device to form a first rear cavity B1 and a second front cavity F2. Also, a first cover body Z1 may be disposed on the dual diaphragm speaker to cooperate with the first diaphragm 3 to form the first rear cavity B1, and a second cover body Z2 may be disposed on the dual diaphragm speaker to cooperate with the second diaphragm 5 to form the second front cavity F2. Hereinafter, another dual diaphragm speaker of the first embodiment shown in Figures 11 to 13 will be used as an example for explanation.

[0104] FIG. 16 is a top view of the other dual diaphragm speaker shown in FIG. 11 with a cover body disposed thereon. FIG. 17 is a schematic diagram of a cross-sectional structure taken along line NN in FIG. 16. As shown in FIGS. 16 and 17, the dual diaphragm speaker may further include a first cover body Z1 and a second cover body Z2. The first cover body Z1 serves as a first component and is sealingly connected to the first diaphragm 3 to form a first rear cavity B1. The second cover body Z2 serves as a second component and is sealingly connected to the second diaphragm 5 to form a second front cavity F2. The first front cavity F1 of the dual diaphragm speaker communicates with the second front cavity F2 via the first channel 1. In this case, the electronic device to which the dual diaphragm speaker is attached may include a sound output tube, and the second front cavity F2 of the dual diaphragm speaker communicates with the sound output tube.

[0105] In one example, in the other dual diaphragm speaker of the first embodiment shown in FIGS. 11 to 13, only the second cover body Z2 may be provided. The second cover body Z2 is sealingly connected to the second diaphragm 5 as a second component to form a second front cavity F2. The first front cavity F1 communicates with the second front cavity F2 via a first channel P1. The first component is a first structure 10 of an electronic device to which the dual diaphragm speaker is attached. In other words, the electronic device to which the dual diaphragm speaker is attached may include the first structure 10 and a sound output tube. The first structure 10 is connected to the first diaphragm 3 of the dual diaphragm speaker on the side of the first diaphragm 3 away from the magnetic circuit system 2, forming a first rear cavity B1. The second front cavity F2 of the dual diaphragm speaker is connected to the sound output tube of the electronic device.

[0106] In another example, in the other dual diaphragm speaker of the first embodiment shown in FIGS. 11 to 13, only the first cover body Z1 may be provided, and the first cover body Z1 is sealingly connected to the first diaphragm 3 on the side of the first diaphragm 3 away from the magnetic circuit system 2 to form a first rear cavity B1. In this case, the second component is a sound output tube of the electronic device. In other words, the electronic device to which the dual diaphragm speaker is attached may include a sound output tube 20, and the sound output tube 20 is connected to the second diaphragm 5 of the dual diaphragm speaker on the side of the second diaphragm 5 away from the magnetic circuit system 2 to form a second rear cavity F2. The first front cavity F1 and the second front cavity F2 of the dual diaphragm speaker are connected via a first channel P1 on the dual diaphragm speaker.

[0107] In other words, in this embodiment of the present application, if a cover body is not disposed on the dual diaphragm speaker, the two diaphragms of the dual diaphragm speaker may cooperate with the structure of the electronic device to form the first rear cavity and the second front cavity. Because a cover body is not required, space can be saved. This helps to further reduce the volume of the electronic device or use the space for other structures, such as using a larger battery, thereby improving battery life. In this embodiment of the present application, if the first cover body Z1 and / or the second cover body Z2 are disposed on the dual diaphragm speaker, the corresponding structure of the electronic device to which the dual diaphragm speaker is attached does not need to be modified to form the first rear cavity and / or the second front cavity together with the diaphragms of the dual diaphragm speaker, and the structure of the electronic device is only slightly modified.

[0108] In conclusion, the dual-diaphragm speaker in this embodiment separates the sound wave transmission paths of the front and rear cavities of the two diaphragms, preventing sound short-circuiting and allowing the two diaphragms to vibrate in the same direction to generate sound. The cavity channel is formed using a magnetic circuit system and a ring-shaped housing, resulting in a sound pressure overlap effect and enhanced low and mid-frequency response, thereby improving the speaker's low and mid-frequency sensitivity, improving ANC performance in a semi-open architecture, and enhancing the low and mid-frequency range of the target signal. In addition, the dual-diaphragm speaker boasts a wide high-frequency bandwidth and a small footprint, improving sound quality and reducing volume, helping to improve the user experience.

[0109] TWS earphone modules cannot consider high-frequency extension for low- and mid-frequency noise cancellation. Multiple units are required, but encapsulating them takes up too much stacking space and results in low utilization of the magnetic circuit. The speaker of the present application's embodiment establishes a closed magnetic loop in which the magnetic circuits of the two speaker units reinforce and circulate each other, combining a dual vibration system with independent front and rear cavities. This improves utilization of the magnetic circuit, reduces volume, and increases the diaphragm area, thereby improving speaker sensitivity and expanding the frequency bandwidth.

[0110] The dual-diaphragm speaker in the embodiment of the present application has advantages such as high low- and mid-frequency sensitivity and small volume. It can be applied to portable electronic devices such as small earphones, or to speakers in audio products, where it reproduces music signals, supports the achievement of high sensitivity and wide high-frequency bandwidth goals, and provides a high-quality music experience. Specifically, the two PAs in the TWS earphones can separately drive the two diaphragms of the speaker and perform digital frequency division, which can be configured to implement effects such as TWS active noise cancellation, high-fidelity music playback, transparent transmission, and 3D sound effects. In one example, the dual-diaphragm speaker in the embodiment of the present application can improve low-frequency sensitivity by 8 dB compared to existing single-diaphragm speakers and by 10 dB compared to existing dual-diaphragm speakers. The channel connecting the two front cavities is arranged inside the ring-shaped housing, eliminating the need for an additional pipeline to connect the two front cavities. Furthermore, by sharing the magnetic circuit, the overall thickness can be reduced, and the volume can be reduced by 32%.

[0111] It should be noted that the above embodiments are only for illustrating the technical solutions of the present application, and do not limit the present application. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that, without departing from the scope of the technical solutions of the embodiments of the present application, modifications can still be made to the technical solutions described in the above embodiments, or equivalent substitutions can still be made to some technical features thereof. [Explanation of symbols]

[0112] 1 Ring-shaped housing 2. Magnetic circuit system 3 First diaphragm 4 First voice coil 5 Second diaphragm 6 Second voice coil 10 First Structure 11 First Housing 12 Second Housing 20 sound output tube 21 First magnetically permeable member 22 First Magnet 23 Second magnetically permeable member 24 Second Magnet 25 Third magnetically permeable member 30 Dual Diaphragm Speaker 211 recess 212 Ring-shaped flange

Claims

1. A ring-shaped housing (1), a magnetic circuit system (2) disposed within the ring-shaped housing (1) and dividing a space within the ring-shaped housing (1) into a first cavity (Q1) and a second cavity (Q2) in the direction of a main axis of the ring-shaped housing (1), the magnetic circuit system (2) comprising a first magnetic gap (C1) and a second magnetic gap (C2) disposed at an interval around the main axis; a first diaphragm (3) disposed at a first end of the ring-shaped housing (1) to form a first front cavity (F1) together with the first cavity (Q1), the first diaphragm (3) being configured to form a first rear cavity (B1) together with a first component on a side of the first diaphragm (3) away from the magnetic circuit system (2); a first voice coil (4) disposed in the first front cavity (F1), one end of the first voice coil (4) connected to the first diaphragm (3) and the other end of the first voice coil (4) extending into the first magnetic gap (C1); a second diaphragm (5) disposed at a second end of the ring-shaped housing (1) to form a second rear cavity (B2) together with the second cavity (Q2), the second diaphragm (5) being configured to form a second front cavity (F2) together with a second component on a side of the second diaphragm (5) away from the magnetic circuit system (2), the second rear cavity (B2) not communicating with the first front cavity (F1); a second voice coil (6) disposed in the second rear cavity (B2), one end of the second voice coil (6) connected to the second diaphragm (5) and the other end of the second voice coil (6) extending into the second magnetic gap (C2); A dual diaphragm speaker comprising: the first front cavity (F1) communicates with the second front cavity (F2) through at least one first channel (P1), the first channel (P1) being disposed in at least one of the magnetic circuit system (2) and the ring-shaped housing (1); the second rear cavity (B2) is closed or communicates with the first rear cavity (B1) or with the atmosphere via at least one second channel (P2); A dual diaphragm speaker, wherein an outer peripheral wall of the magnetic circuit system (2) is sealingly connected to an inner wall of the ring-shaped housing (1), an outer peripheral edge of the second diaphragm (5) is sealingly connected to the magnetic circuit system (2), and the first channel (P1) is formed together with a first open groove (N1) arranged in the inner wall of the ring-shaped housing (1) and / or the outer peripheral wall of the magnetic circuit system (2).

2. The first diaphragm (3) is sealed to the entire end face of the first end of the ring-shaped housing (1), and the first opening groove (N1) extends from the first front cavity (F1) to the end face of the second end of the ring-shaped housing (1), or 2. The dual diaphragm speaker of claim 1, wherein the first diaphragm (3) is sealingly connected to the magnetic circuit system (2), a first notch (E1) communicating with the front cavity (F1) is disposed in the magnetic circuit system (2), the first channel (P1) further comprises the first notch (E1), and the first opening groove (N1) extends from the first notch (E1) to an end face of the second end of the ring-shaped housing (1).

3. the second rear cavity (B2) communicates with the first rear cavity (B1) or the atmosphere through the second channel (P2), and a second notch (E2) communicating with the second rear cavity (B2) is disposed in the magnetic circuit system (2); the second channel (P2) comprises a second port (K2), the second notch (E2), and a second open groove (N2) disposed in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), the second port (K2) being disposed in the outer circumferential wall of the ring-shaped housing (1) and the second open groove (N2) extending from the second notch (E2) to the second port (K2); or 3. A dual diaphragm speaker as described in claim 2, wherein the first diaphragm (3) is sealingly connected to the magnetic circuit system (2), and the second channel (P2) comprises the second notch (E2) and a second open groove (N2) arranged in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), and the second open groove (N2) extends from the second notch (E2) to an end face of the first end of the ring-shaped housing (1).

4. A first ring-shaped boss (L1) is disposed on the inner wall of the first end of the ring-shaped housing (1), the first diaphragm (3) is sealingly connected to the first ring-shaped boss (L1), the magnetic circuit system (2) is connected to a side of the first ring-shaped boss (L1) away from the first diaphragm (3), the outer peripheral wall of the magnetic circuit system (2) is sealingly connected to the inner wall of the ring-shaped housing (1), the outer peripheral edge of the second diaphragm (5) is sealingly connected to the magnetic circuit system (2), and the first front cavity (F1) 2. The dual diaphragm speaker according to claim 1, wherein a first notch (E1) communicating with a first end of the ring-shaped housing (1) is disposed in at least one of the first ring-shaped boss (L1) and the magnetic circuit system (2), and the first channel (P1) comprises the first notch (E1) and a first open groove (N1) disposed in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), and the first open groove (N1) extends from the first notch (E1) to an end face of the second end of the ring-shaped housing (1).

5. the second rear cavity (B2) communicates with the first rear cavity (B1) or the atmosphere through the second channel (P2), and a second notch (E2) communicating with the second rear cavity (B2) is disposed in the magnetic circuit system (2); the second channel (P2) comprises a second port (K2), the second notch (E2), and a second open groove (N2) disposed in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), the second port (K2) being disposed in the outer circumferential wall of the ring-shaped housing (1) and the second open groove (N2) extending from the second notch (E2) to the second port (K2); or 5. The dual diaphragm speaker of claim 4, wherein the second channel (P2) comprises the second notch (E2) and a second open groove (N2) arranged in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), and the second open groove (N2) extends from the second notch (E2) to an end face of the first end of the ring-shaped housing (1) and penetrates the first ring-shaped boss (L1).

6. a second ring-shaped boss (L2) is disposed on an inner wall of the second end of the ring-shaped housing (1), the second diaphragm (5) is sealingly connected to the second ring-shaped boss (L2), the magnetic circuit system (2) is connected to a side of the second ring-shaped boss (L2) away from the second diaphragm (5), and the first channel (P1) comprises a first open groove (N1) disposed on the inner wall of the ring-shaped housing (1) and / or the outer peripheral wall of the magnetic circuit system (2); the first diaphragm (3) is sealingly connected to the entire end face of the first end of the ring-shaped housing (1), and the first open groove (N1) extends from the first front cavity (F1) to the end face of the second end of the ring-shaped housing (1) and passes through the second ring-shaped boss (L2); or 2. The dual diaphragm speaker of claim 1, wherein the first diaphragm (3) is sealingly connected to the magnetic circuit system (2), a first notch (E1) communicating with the front cavity (F1) is disposed in the magnetic circuit system (2), the first channel (P1) further comprises the first notch (E1), and the first opening groove (N1) extends from the first notch (E1) to an end face of the second end of the ring-shaped housing (1).

7. the second rear cavity (B2) communicates with the first rear cavity (B1) or the atmosphere through the second channel (P2), and a second notch (E2) communicating with the second rear cavity (B2) is disposed in at least one of the second ring-shaped boss (L2) and the magnetic circuit system (2); the second channel (P2) comprises a second port (K2), the second notch (E2), and a second open groove (N2) disposed in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), the second port (K2) being disposed in the outer circumferential wall of the ring-shaped housing (1) and the second open groove (N2) extending from the second notch (E2) to the second port (K2); or 7. A dual diaphragm speaker as described in claim 6, wherein the first diaphragm (3) is sealingly connected to the magnetic circuit system (2), and the second channel (P2) comprises the second notch (E2) and a second open groove (N2) arranged in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), and the second open groove (N2) extends from the second notch (E2) to an end face of the first end of the ring-shaped housing (1).

8. a first ring-shaped boss (L1) is disposed on the inner wall of the first end of the ring-shaped housing (1), a second ring-shaped boss (L2) is disposed on the inner wall of the second end of the ring-shaped housing (1), the magnetic circuit system (2) is connected between the first ring-shaped boss (L1) and the second ring-shaped boss (L2), the outer peripheral wall of the magnetic circuit system (2) is sealingly connected to the inner wall of the ring-shaped housing (1), the outer peripheral edge of the first diaphragm (3) is sealingly connected to the first ring-shaped boss (L1), and the outer peripheral edge of the second diaphragm (5) is sealingly connected to the second ring-shaped boss (L2); 2. The dual diaphragm speaker according to claim 1, wherein a first notch (E1) communicating with the first front cavity (F1) is disposed in at least one of the first ring-shaped boss (L1) and the magnetic circuit system (2), and the first channel (P1) comprises the first notch (E1) and a first open groove (N1) disposed in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), and the first open groove (N1) extends from the first notch (E1) to an end face of the second end of the ring-shaped housing (1) and penetrates the second ring-shaped boss (L2).

9. the second rear cavity (B2) communicates with the first rear cavity (B1) or the atmosphere through the second channel (P2), and a second notch (E2) communicating with the second rear cavity (B2) is disposed in at least one of the second ring-shaped boss (L2) and the magnetic circuit system (2); the second channel (P2) comprises a second port (K2), the second notch (E2), and a second open groove (N2) disposed in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), the second port (K2) being disposed in the outer circumferential wall of the ring-shaped housing (1) and the second open groove (N2) extending from the second notch (E2) to the second port (K2); or 9. The dual diaphragm speaker of claim 8, wherein the second channel (P2) comprises the second notch (E2) and a second open groove (N2) arranged in the inner wall of the ring-shaped housing (1) and / or the outer circumferential wall of the magnetic circuit system (2), and the second open groove (N2) extends from the second notch (E2) to an end face of the first end of the ring-shaped housing (1) and penetrates the first ring-shaped boss (L1).

10. 2. The dual diaphragm speaker of claim 1, wherein an outer peripheral wall of the magnetic circuit system (2) is sealingly connected to an inner peripheral wall of the ring-shaped housing (1), and the first channel (P1) comprises a first through hole disposed in the magnetic circuit system (2) or the ring-shaped housing (1), one end of the first through hole being connected to the first front cavity (F1), and the other end of the first through hole extending to an end face of the second end of the ring-shaped housing (1).

11. 11. The dual diaphragm speaker of claim 1, wherein the second rear cavity (B2) communicates with the first rear cavity (B1) or the atmosphere via the second channel (P2), an outer peripheral wall of the magnetic circuit system (2) is sealingly connected to an inner peripheral wall of the ring-shaped housing (1), and the second channel (P2) comprises a second through hole disposed in the magnetic circuit system (2) or the ring-shaped housing (1), a first end of the second through hole communicates with the second rear cavity (B2), and the other end of the second through hole extends to an end face of the first end of the ring-shaped housing (1) or the outer peripheral wall of the ring-shaped housing (1).

12. a first ring-shaped boss (L1) is arranged on the inner wall of the first end of the ring-shaped housing (1), and the magnetic circuit system (2) is sealingly connected to the first ring-shaped boss (L1) on a side of the first ring-shaped boss (L1) facing away from the first diaphragm (3); and / or 11. The dual diaphragm speaker of claim 10, wherein a second ring-shaped boss (L2) is disposed on the inner wall of the second end of the ring-shaped housing (1), and the magnetic circuit system (2) is sealingly connected to the second ring-shaped boss (L2) on a side of the second ring-shaped boss (L2) that is away from the second diaphragm (5).

13. 11. A dual diaphragm speaker as claimed in any one of claims 1 to 10, wherein three or more first channels (P1) are arranged in the dual diaphragm speaker, and the three or more first channels (P1) are arranged at intervals in the circumferential direction of the ring-shaped housing (1).

14. 10. A dual diaphragm speaker as claimed in any one of claims 3, 5, 7 and 9, wherein three or more second channels (P2) are arranged in the dual diaphragm speaker, and the three or more second channels (P1) are arranged at intervals around the circumference of the ring-shaped housing (1).

15. 2. The dual diaphragm speaker according to claim 1, wherein a positioning boss (D) is disposed on an outer peripheral wall of the ring-shaped housing (1), a plurality of through holes communicating with the inside and outside of the ring-shaped housing (1) are disposed in the positioning boss (D), a first voice coil line (X1) is disposed in the first voice coil (4), and a second voice coil line (X2) is disposed in the second voice coil (6), the first voice coil line (X1) and the second voice coil line (X2) are electrically connected to a power amplifier device via the plurality of through holes, and the positioning boss (D) and the at least one first channel (P1) or the at least one second channel (P2) are disposed at intervals in the circumferential direction of the ring-shaped housing (1).

16. The ring-shaped housing (1) comprises a first housing (11) and a second housing (12) arranged in the direction of the main axis, a first ring-shaped step (T1) is arranged on the end face of the first housing (11) at the end remote from the second housing (12), a first ring-shaped mounting portion (A1) is arranged on the outer periphery of the first diaphragm (3), the first ring-shaped mounting portion (A1) is arranged on the first ring-shaped step (T1) to realize a sealed connection between the outer periphery of the first diaphragm (3) and the end face of the first end of the ring-shaped housing (1); and / or 16. A dual diaphragm speaker as claimed in any one of claims 1, 4 to 10 and 15, wherein a second ring-shaped step (T2) is arranged on an end face of the second housing (12) at an end remote from the first housing (11), and a second ring-shaped mounting portion (A2) is arranged on the outer circumferential edge of the second diaphragm (5), and the second ring-shaped mounting portion (A2) is arranged on the second ring-shaped step to achieve a sealed connection between the outer circumferential edge of the second diaphragm (5) and the end face of the second end of the ring-shaped housing (1).

17. 16. A dual diaphragm speaker according to any one of claims 1 to 10 and 15, wherein when the first voice coil (4) and the second voice coil (6) are connected to an alternating current, the vibration directions of the first diaphragm (3) and the second diaphragm (5) are the same.

18. 16. A dual diaphragm speaker as claimed in any one of claims 1 to 10 and 15, wherein the first component is a first structure of an electronic device to which the dual diaphragm speaker is attached, and the second component is a sound output tube of the electronic device.

19. The dual diaphragm speaker comprises: a first cover body, said first cover body being sealingly connected to said first diaphragm (3) as said first component to form said first rear cavity (B1); 16. A dual diaphragm speaker as claimed in any one of claims 1 to 10 and 15, further comprising: a second cover body, said second cover body being sealingly connected to said second diaphragm (5) as said second component to form said second front cavity (F2), said second front cavity (F2) being configured to communicate with a sound output tube of an electronic device.

20. The first component is a first structure of an electronic device to which the dual diaphragm speaker is attached, and the dual diaphragm speaker comprises:

16. A dual diaphragm speaker as claimed in any one of claims 1 to 10 and 15, further comprising a second cover body, said second cover body being sealingly connected to said second diaphragm (5) as said second component to form said second front cavity (F2), said second front cavity (F2) being configured to communicate with a sound output tube of said electronic device.

21. The second component is used as a sound output tube of an electronic device, and the dual diaphragm speaker comprises:

16. A dual diaphragm speaker as claimed in any one of claims 1 to 10 and 15, further comprising a first cover body as the first component, the first cover body being sealingly connected to the first diaphragm (3) at the side of the first diaphragm (3) facing away from the magnetic circuit system (2) to form the first rear cavity (B1).

22. An electronic device, the electronic device comprising: A dual diaphragm speaker (30) according to claim 18; a first structure (10) connected to the first diaphragm (3) of the dual diaphragm speaker at the side of the first diaphragm (3) remote from the magnetic circuit system (2) to form the first rear cavity (B1); a sound output tube (20) connected to the second diaphragm (5) of the dual diaphragm speaker at the side of the second diaphragm (5) remote from the magnetic circuit system (2) to form the second front cavity (F2).

23. 20. An electronic device comprising: a sound output tube; and a dual diaphragm speaker according to claim 19, wherein the second front cavity (F2) of the dual diaphragm speaker is connected to the sound output tube.

24. An electronic device, the electronic device comprising: A dual diaphragm speaker according to claim 20; a first structure connected to the first diaphragm (3) of the dual diaphragm speaker at the side of the first diaphragm (3) away from the magnetic circuit system (2) to form the first rear cavity (B1); a sound output tube, wherein the second front cavity (F2) of the dual diaphragm speaker communicates with the sound output tube.

25. An electronic device, the electronic device comprising: A dual diaphragm speaker according to claim 21; and a sound output tube connected to the second diaphragm (5) of the dual diaphragm speaker at the side of the second diaphragm (5) away from the magnetic circuit system (2) to form the second front cavity (F2).

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