Multilayer electronic components

Abstract

To provide a multilayer electronic component having improved flexural strength characteristics and having a structure in which defects of a dummy electrode such as visibility from the outside are suppressed.SOLUTION: A multilayer electronic component includes: a body 110 including an active portion Ac in which dielectric layers 11 and internal electrodes 121, 122 are alternately disposed in a first direction, an upper cover portion C1 and lower cover portion C2 that are disposed on the upper and lower of the active portion in the first direction and include dummy electrodes 140, first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and external electrodes 131, 132 including band portions B1, B2 and including electrode layers 131a, 132a and conductive resin layers 131b, 132b disposed on the electrode layers. In a cross-section of the body in the first and second directions, a ratio of area occupied by the dummy electrodes and the internal electrodes in an area of an isosceles right triangle having a line along which a band portion of a conductive resin layer is in contact with the first surface is taken as a base and a length of the base from an end of the band portion in a direction perpendicular to the first surface is taken as a height, is 20% or more.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layer ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are attached to the printed circuit boards of various electronic products, such as visual devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small in size, yet having high capacitance, and being easy to mount, and therefore can be used as components in various electronic devices. As various electronic devices, such as computers and mobile devices, become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors that are smaller in size and have higher capacitance.

[0004] Furthermore, in recent years, there has been growing interest in automotive electrical components in the industry, and multilayer ceramic capacitors are also being required to have high reliability and high strength characteristics for use in automobiles or infotainment systems.

[0005] In particular, multilayer ceramic capacitors installed in ECUs (Electronic Control Units) are exposed to external shocks, and thermal shock in high-temperature and humid environments can cause stress, which can lead to chip defects.

[0006] In order to ensure high reliability and high strength characteristics, a method has been proposed in which the external electrode, which is conventionally composed of an electrode layer, is changed to a two-layer structure of an electrode layer and a conductive resin layer.

[0007] The two-layer structure of an electrode layer and a conductive resin layer can improve flexural strength characteristics by applying a resin composition containing a conductive substance onto the electrode layer, thereby absorbing external impacts and eliminating internal stress, and can also improve reliability by preventing penetration of plating solution.

[0008] Furthermore, by disposing cover portions including dummy electrodes above and below the active portion, the bending strength characteristics are further improved.

[0009] However, the addition of dummy electrodes increases the manufacturing process time and costs, and therefore there is a need to develop an optimized structure. Summary of the Invention [Problem to be solved by the invention]

[0010] One of the various objects of the present invention is to provide a multilayer electronic component with improved flexural strength characteristics.

[0011] One of various objects of the present invention is to provide a multilayer electronic component having a structure in which defects such as show-through of dummy electrodes are suppressed.

[0012] However, the scope of the present invention is not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0013] A multilayer electronic component according to one embodiment of the present invention includes an active portion in which dielectric layers and internal electrodes are alternately arranged in a first direction, an upper cover portion arranged at an upper portion of the active portion in the first direction, and a lower cover portion arranged at a lower portion of the active portion in the first direction, the main body having first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces facing the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing the third direction, and electrode layers arranged on the main body, the electrode layers including connecting portions arranged on the third and fourth surfaces and band portions extending from the connecting portions to portions of the first and second surfaces. and an external electrode including a conductive resin layer arranged on the electrode layer, wherein the upper cover portion and the lower cover portion include dummy electrodes, and in a cross section of the main body cut in the first and second directions at the center of the third direction of the main body, when the area of ​​a right-angled isosceles triangle having d as the line where the band portion of the conductive resin layer meets the first surface, d as the base, and d as the height of an extension line extended from the tip of the band portion of the electrode layer in a direction perpendicular to the first surface by the length of d, and when K2 is the proportion of the area occupied by the dummy electrodes and internal electrodes in K1, K2 is 20% or more. [Effects of the Invention]

[0014] One of the various effects of the present invention is that the arrangement of the dummy electrodes and internal electrodes is optimized to improve the bending strength characteristics.

[0015] One of the various effects of the present invention is that defects such as the see-through of the dummy electrodes are suppressed.

[0016] One of the many advantages of the present invention is that it reduces manufacturing process time and manufacturing costs.

[0017] However, the various beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 2] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 3] 1 is an exploded perspective view schematically illustrating a main body according to an embodiment of the present invention. [Figure 4] FIG. 3 is an enlarged view of region P in FIG. 2. [Figure 5] FIG. 3 is a diagram schematically illustrating a modified example of an embodiment of the present invention, and corresponds to FIG. 2. [Figure 6] FIG. 3 is a diagram schematically illustrating another example of an embodiment of the present invention, and corresponds to FIG. 2. [Figure 7] FIG. 10 is a diagram for explaining a bending test method. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation.

[0020] In order to clearly explain the present invention, parts not relevant to the description are omitted in the drawings, thicknesses are exaggerated to clearly show various layers and regions, and components having the same function within the same concept are denoted by the same reference numerals. Furthermore, throughout the specification, the term "comprises" a certain component does not mean that it excludes other components, but that it may further include other components, unless otherwise specified.

[0021] In the drawings, the first direction may be defined as the thickness direction or stacking direction of the body, the second direction may be defined as the length direction of the body, and the third direction may be defined as the width direction of the body.

[0022] [Multilayer electronic components] FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line II' in FIG. 1, FIG. 3 is an exploded perspective view showing a schematic exploded view of a main body according to one embodiment of the present invention, and FIG. 4 is an enlarged view of region P in FIG. 2.

[0023] A multilayer electronic component 100 according to one embodiment of the present invention will now be described with reference to FIGS.

[0024] A multilayer electronic component 100 according to an embodiment of the present invention includes an active portion Ac in which dielectric layers 111 and internal electrodes 121, 122 are alternately arranged in a first direction, an upper cover portion C1 arranged at an upper portion of the active portion in the first direction, and a lower cover portion C2 arranged at a lower portion of the active portion in the first direction. The multilayer electronic component 100 includes a main body 110 having first and second surfaces 1, 2 facing the first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing the third direction. The main body 110 also includes connection portions A1, A2 arranged on the third and fourth surfaces, and band portions B1, B2 extending from the connection portions to portions of the first and second surfaces. and external electrodes 131, 132 including electrode layers 131a, 132a formed on the upper and lower cover parts and conductive resin layers 131b, 132b arranged on the electrode layers, wherein the upper and lower cover parts include dummy electrodes 140, and in a cross section of the main body cut in the first and second directions at the center of the third direction of the main body, when the area of ​​a right-angled isosceles triangle T1 is d, the triangle has d as its base and a height as an extension line extended from the tip of the band portion of the electrode layer in a direction perpendicular to the first surface, the triangle has K1 as its area, and K2 is the proportion of the area occupied by the dummy electrodes and internal electrodes in K1, K2 is 20% or more.

[0025] The body 110 is formed by alternately laminating dielectric layers 111 and internal electrodes 121 and 122 .

[0026] The specific shape of the body 110 is not particularly limited, but as shown in the drawing, the body 110 may have a hexahedral shape or a shape similar thereto. Furthermore, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfect straight lines, due to shrinkage of the ceramic powder contained in the body 110 during firing.

[0027] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2 and also connected to the third and fourth surfaces 3, 4 and facing each other in the third direction.

[0028] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to the extent that they are difficult to identify without using a scanning electron microscope (SEM).

[0029] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as it can provide sufficient capacitance. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material can include a BaTiO3-based ceramic powder, and examples of the ceramic powder include BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), etc. 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, or Ba(Ti 1-y Zr y)O3, etc.

[0030] Furthermore, the material forming the dielectric layer 111 may be a powder of barium titanate (BaTiO3) or the like to which various ceramic additives, organic solvents, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0031] The main body 110 may include an active part Ac disposed inside the main body 110, in which dielectric layers 111 and internal electrodes 121, 122 are alternately arranged in a first direction to form capacitance, an upper cover part C1 disposed at the top of the active part in the first direction, and a lower cover part C2 disposed at the bottom of the active part in the first direction.

[0032] The active portion Ac is a portion that contributes to forming the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 sandwiched therebetween.

[0033] The internal electrodes 121 and 122 may be disposed to face each other with the dielectric layer 111 sandwiched therebetween.

[0034] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122 that are alternately arranged to face each other with a dielectric layer sandwiched therebetween.

[0035] The first and second internal electrodes 121 and 122 may be exposed to the third and fourth surfaces 3 and 4 of the body 110, respectively.

[0036] 2, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0037] That is, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Therefore, the first internal electrode 121 is formed at a certain distance from the fourth surface 4, and the second internal electrode 122 is formed at a certain distance from the third surface 3.

[0038] The first and second internal electrodes 121 and 122 may be electrically isolated from each other by a dielectric layer 111 disposed therebetween.

[0039] There are no particular limitations on the material for forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on a ceramic green sheet.

[0040] The conductive paste for the internal electrodes may be printed by a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0041] The upper cover part C1 and the lower cover part C2 basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0042] Additionally, the upper cover part C1 and the lower cover part C2 may include a dummy electrode 140. The upper cover part C1 and the lower cover part C2 may be vulnerable to cracks due to the brittleness of the dielectric, but the dummy electrode 140, which has higher ductility than ceramics, may be disposed to improve the bending strength.

[0043] The upper cover portion C1 and the lower cover portion C2 can be formed by stacking dielectric layers in the vertical direction on the upper and lower surfaces of the active portion Ac, respectively, and arranging the dummy electrode 140 between the dielectric layers.

[0044] The dielectric layers included in the upper cover portion C1 and the lower cover portion C2 may include the same material as the dielectric layer 111 of the active portion Ac.

[0045] The material for forming the dummy electrode 140 is not particularly limited, and any material with excellent electrical conductivity can be used. For example, the dummy electrode 140 can be formed by printing a conductive paste containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. The dummy electrode 140 can also include the same material as the internal electrodes 121 and 122.

[0046] Referring to FIG. 3, the body 110 can be formed by alternately stacking dielectric layers 111 on which the first internal electrodes 121 are printed and dielectric layers 111 on which the second internal electrodes 122 are printed in the thickness direction (Z direction), stacking dielectric layers on which the dummy electrodes 140 are printed on the upper and lower parts, and then firing the stacked dielectric layers.

[0047] The external electrodes 131 and 132 are disposed on the main body 110 and include electrode layers 131a and 132a and conductive resin layers 131b and 132b.

[0048] The external electrodes 131 and 132 may include first and second external electrodes 131 and 132 connected to the first and second internal electrodes 121 and 122, respectively.

[0049] The first external electrode 131 may include a first electrode layer 131a and a first conductive resin layer 131b, and the second external electrode 132 may include a second electrode layer 132a and a second conductive resin layer 132b.

[0050] The first and second electrode layers 131a and 132a may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc.

[0051] For example, the first and second electrode layers 131a, 132a may include a conductive metal and glass.

[0052] The conductive metal used for the electrode layers 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the internal electrodes to form capacitance, and may include, for example, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0053] The electrode layers 131a and 132a may be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder, and then firing the paste.

[0054] In addition, the first and second electrode layers 131a and 132a may be formed using an atomic layer deposition (ALD) method, a molecular layer deposition (MLD) method, a chemical vapor deposition (CVD) method, a sputtering method, or the like.

[0055] Alternatively, the first and second electrode layers 131a and 132a may be formed on the body 110 by transferring a sheet containing a conductive metal.

[0056] The conductive resin layers 131b and 132b may contain a conductive metal and a base resin.

[0057] The conductive metal contained in the conductive resin layers 131b and 132b serves to electrically connect the conductive resin layers 131b and 132b to the electrode layers 131a and 132a.

[0058] The conductive metal contained in the conductive resin layers 131b and 132b is not particularly limited as long as it is a material that can be electrically connected to the electrode layers 131a and 132a, and may include, for example, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0059] The conductive metal contained in the conductive resin layers 131b and 132b may contain one or more of spherical powder and flaky powder, i.e., the conductive metal may consist of only flaky powder, only spherical powder, or a mixture of flaky powder and spherical powder.

[0060] Here, the spherical powder may include a shape that is not perfectly spherical, for example, a shape in which the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is 1.45 or less.

[0061] The flake-like powder means a powder having a flat and elongated shape, and is not particularly limited, but may have, for example, a ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) of 1.95 or more.

[0062] The lengths of the major and minor axes of the spherical powder and flaky powder can be measured from images obtained by scanning a cross section (LT cross section) in the first and second directions cut at the center of the third direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0063] The base resin contained in the conductive resin layers 131b and 132b serves to ensure bonding and absorb shock.

[0064] The base resin contained in the conductive resin layers 131b and 132b is not particularly limited as long as it has bonding and shock absorbing properties and can be mixed with conductive metal powder to produce a paste, and may include, for example, one or more of epoxy resin and acrylic resin.

[0065] The conductive resin layers 131b and 132b may contain a conductive metal, an intermetallic compound, and a base resin.

[0066] Meanwhile, the external electrodes 131 and 132 may further include a plating layer disposed on the conductive resin layers 131b and 132b in order to improve mounting characteristics.

[0067] For example, the plating layer may be a Ni plating layer or a Sn plating layer, and may be formed in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the conductive resin layers 131b and 132b, or may include a plurality of Ni plating layers and / or a plurality of Sn plating layers. Also, the plating layer may be formed in a form in which a Ni plating layer and a Pd plating layer are sequentially formed.

[0068] The external electrodes 131, 132 may include connection portions A1, A2 arranged on the third and fourth surfaces of the main body 110, and band portions B1, B2 arranged extending from the connection portions to the first and second surfaces.

[0069] Referring to FIG. 2, when the area of ​​the first external electrode 131 is divided according to its placement position, the first external electrode 131 may include a first connection portion A1 arranged on the third surface 3 of the main body, and a first band portion B1 extending from the first connection portion A1 to a portion of the first and second surfaces 1 and 2.

[0070] When the area of ​​the second external electrode 132 is divided according to its placement position, the second external electrode 132 can include a second connection portion A2 arranged on the fourth surface 4 of the main body, and a second band portion B2 extending from the second connection portion A2 to a portion of the first and second surfaces 1 and 2.

[0071] 2 and 4, in a cross section of the main body 110 cut in the first and second directions at the center of the third direction of the main body, the line where the band portion B1 of the conductive resin layer 131b meets the first surface of the main body 110 is defined as d, the area of ​​a right-angled isosceles triangle T1 is defined as K1, and the height of the triangle is h, with the line d being the base and the line extended from the tip of the band portion B1 of the electrode layer 131a in a direction perpendicular to the first surface by the length of d being defined as K2. K2 may be 20% or more.

[0072] Flex cracks usually occur at the tip of the band and propagate in a 45 degree direction. To prevent such flex cracks, a method has been proposed to change the external electrode, which is conventionally composed of an electrode layer, to a two-layer structure consisting of an electrode layer and a conductive resin layer.

[0073] The two-layer structure of the electrode layer and the conductive resin layer can improve the flexural strength by applying a resin composition containing a conductive material to the electrode layer, absorbing external impacts and relieving internal stresses. In addition, the flexural strength can be further improved by disposing cover sections containing dummy electrodes above and below the active section.

[0074] However, the addition of dummy electrodes increases manufacturing process time and costs, and therefore, the development of an optimized structure is required. According to one embodiment of the present invention, by setting K2 to 20% or more, it is possible to improve the bending strength characteristics while minimizing the dummy electrodes. Furthermore, minimizing the dummy electrodes can shorten the manufacturing process time and reduce manufacturing costs.

[0075] If K2 is less than 20%, the effect of suppressing the propagation of flexure cracks may be insufficient.

[0076] K2 can be the average value of the values ​​obtained for the right-angled isosceles triangle T1 on the side of the first external electrode 131 and the right-angled isosceles triangle T2 on the side of the second external electrode 132. Since flexure cracks can occur at either of the tips of the band portions B1 and B2 of the first and second external electrodes, K2 can be obtained by averaging the values ​​obtained for T1 and T2.

[0077] In this case, the distance L1 from the first surface of the body 110 to the nearest dummy electrode 140 may be 30 μm or more.

[0078] If L1 is less than 30 μm, the dummy electrode 140 may be visible to the outside of the main body 110, possibly resulting in poor appearance.

[0079] Furthermore, since L1 is 30 μm or more, in order to control K2 to 20% or more, the length of the line d where the band portion B1 of the conductive resin layer 131b contacts the first surface of the main body 110 can be 43.5 μm or more.

[0080] On the other hand, when the number of layers of the internal electrodes 121, 122 in the active portion Ac is small and the protective portion does not include a dummy electrode, the bending strength characteristics may deteriorate further, especially when the number of layers of the internal electrodes 121, 122 is 100 or less. However, when a dummy electrode is included in the protective portion and K2 is controlled to 20% or more, as in one embodiment of the present invention, sufficient bending strength characteristics can be ensured even when the number of layers of the internal electrodes 121, 122 is 100 or less.

[0081] Furthermore, the right-angled isosceles triangle T1 does not have to include the internal electrodes 121 and 122. This is because, even if the right-angled isosceles triangle T1 does not include the internal electrodes 121 and 122, by controlling K2 to 20% or more using only the area occupied by the dummy electrode 140, it is possible to ensure the bending strength characteristics.

[0082] Additionally, the upper cover part C1 and the lower cover part C2 may each include a plurality of dummy electrodes 140.

[0083] However, since the bending strength can be ensured if K2 is 20% or more, there is no need to particularly limit the number of dummy electrodes 140.

[0084] Meanwhile, the internal electrodes 121, 122 may include a first internal electrode 121 having one end exposed to the third surface and a second internal electrode 122 having one end exposed to the fourth surface, and the external electrodes 131, 132 may include a first external electrode 131 arranged on the third surface and connected to the first internal electrode 121, and a second external electrode 132 arranged on the fourth surface and connected to the second internal electrode 122.

[0085] In this case, the location of the dummy electrode 140 does not need to be particularly limited, and as shown in Fig. 2, the dummy electrode 140 may be located apart from the first and second external electrodes 131 and 132. However, the present invention is not limited thereto, and the location of the dummy electrode 140 does not need to be particularly limited as long as K2 can be ensured to be 20% or more.

[0086] For example, as shown in FIG. 5, the dummy electrode 140′ may include a first dummy electrode 141 connected to the first external electrode 131, and a second dummy electrode 142 arranged on the same plane as the first dummy electrode and spaced apart from the first dummy electrode.

[0087] In addition, the dummy electrode 140'' may include a first dummy electrode 141 connected to the first external electrode 131, a second dummy electrode 142 arranged on the same plane as the first dummy electrode and spaced apart from the first dummy electrode, and a third dummy electrode 143 arranged between the first dummy electrode 141 and the second dummy electrode 142.

[0088] Meanwhile, the thickness of the dielectric layer included in the active portion Ac does not need to be the same as the thickness of the dielectric layer included in the upper and lower cover portions C1, C2. In order to enhance the flexural strength characteristics and more easily ensure K2 of 20% or more, the thickness of the dielectric layer included in the upper and lower cover portions C1, C2 may be thinner than the thickness of the dielectric layer included in the active portion Ac.

[0089] [(Example 1)] After preparing the chip described in Table 1 below, in a cross section cut in the first and second directions at the center of the third direction of the main body, the line where the band portion of the conductive resin layer meets the first surface of the main body 110 is defined as d, the area of ​​a right-angled isosceles triangle is defined as K1, and the height of an extension line extended from the tip of the band portion of the electrode layer in a direction perpendicular to the first surface by the length of d is defined as K2, and the proportion of the area occupied by the dummy electrode 140 and internal electrodes 121 and 122 in K1 is defined as K2.The K2 values ​​obtained for the right-angled isosceles triangle T1 on the side of the first external electrode 131 and the right-angled isosceles triangle T2 on the side of the second external electrode 132 and their average values ​​are listed in Table 1 below.

[0090] The bending strength was evaluated by a bending test.

[0091] Figure 7 is a diagram illustrating the bending test method. A sample chip (MLCC) was mounted on a substrate (PCB), and the surface opposite the mounting surface of the sample chip (MLCC) was pressed up to 5 mm. If a bending crack occurred, it was marked with an X, and if no bending crack occurred, it was marked with an O.

[0092] In Table 1 below, W, L, and T represent the width, length, and thickness of the body, respectively.

[0093] [Table 1]

[0094] Test No. 1 had K2 of less than 20% and flex cracks occurred. In contrast, test Nos. 2 to 4, in which K2 was 20% or more, did not have flex cracks, confirming that they had excellent flex strength characteristics.

[0095] [(Example 2)] The deflection strength and the presence or absence of transparency of the dummy electrode were evaluated while changing the distance L1 from the first surface to the nearest dummy electrode, and the results are shown in Table 2 below.

[0096] For each test number, 4,000 samples were prepared, and the first surface of each sample chip was observed with a magnifying glass. If the internal electrode was visible through the sample chip, it was judged to be defective. A defect rate of 0% was marked with a circle, a defect rate of less than 3% with a triangle, and a defect rate of more than 3% with an cross.

[0097] For each test number, 60 samples were prepared and then evaluated for flexural strength in the same manner as in Example 1, and the number of defective samples was recorded.

[0098] [Table 2]

[0099] It can be confirmed that in test numbers 10 to 17, where L1 is 30 μm or more, the dummy electrodes do not show through and no appearance defects occur.

[0100] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited only by the appended claims. Therefore, various substitutions, modifications, and alterations can be made by those skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention. [Explanation of symbols]

[0101] 100 Multilayer electronic components 110 Main Unit 111 Dielectric layer Ac active part C1, C2 Upper and lower cover parts 121, 122 Internal electrode 131, 132 External electrode 140 Dummy electrode 131a, 132a electrode layer 131b, 132b Conductive resin layer 131c, 132c plating layer

Claims

1. a main body including an active portion in which dielectric layers and internal electrodes are alternately arranged in a first direction, an upper cover portion disposed at an upper portion of the active portion in the first direction, and a lower cover portion disposed at a lower portion of the active portion in the first direction, the main body having first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces facing the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing the third direction; a connecting portion disposed on the third and fourth surfaces, and a band portion extending from the connecting portion to a portion of the first and second surfaces; an external electrode including an electrode layer disposed on the main body; and a conductive resin layer disposed on the electrode layer, the upper cover portion and the lower cover portion include dummy electrodes; a multilayer electronic component in which, in a cross section of the main body cut in the first and second directions at the center of the main body in a third direction, a line where the band portion of the conductive resin layer meets the first surface is defined as d, the area of ​​a right-angled isosceles triangle is defined as K1, and the height of the triangle is an extension line extended from the tip of the band portion of the electrode layer in a direction perpendicular to the first surface by the length of d, and K2 is a ratio of the area of ​​K1 occupied by the dummy electrodes and the internal electrodes, wherein K2 is 20% or more.

2. 2. The multilayer electronic component according to claim 1, wherein the distance from said first surface to the nearest dummy electrode is 30 [mu]m or more.

3. 3. The multilayer electronic component according to claim 2, wherein the length d is 43.5 μm or more.

4. 4. The multilayer electronic component according to claim 1, wherein the number of layers of the internal electrodes is 100 or less.

5. The multilayer electronic component according to claim 1 , wherein the internal electrodes are not included in the right-angled isosceles triangle.

6. The multilayer electronic component according to claim 1 , wherein the upper cover portion and the lower cover portion each include a plurality of dummy electrodes.

7. the internal electrodes include a first internal electrode having one end exposed at the third surface and a second internal electrode having one end exposed at the fourth surface; 7. The multilayer electronic component according to claim 1, wherein the external electrodes include a first external electrode disposed on the third surface and connected to the first internal electrode, and a second external electrode disposed on the fourth surface and connected to the second internal electrode.

8. 8. The multilayer electronic component according to claim 7, wherein the dummy electrodes are disposed apart from the first and second external electrodes.

9. 8. The multilayer electronic component according to claim 7, wherein the dummy electrodes include a first dummy electrode connected to the first external electrode, and a second dummy electrode disposed on the same plane as the first dummy electrode and spaced apart from the first dummy electrode.

10. 10. The multilayer electronic component according to claim 9, wherein the dummy electrodes include a third dummy electrode disposed between the first dummy electrode and the second dummy electrode.

11. 11. The multilayer electronic component according to claim 1, wherein the thickness of the dielectric layers included in the upper and lower cover portions is thinner than the thickness of the dielectric layer included in the active portion.

Images