Multilayer ceramic electronic component

Abstract

The disclosure provides a multilayer ceramic electronic component including: a ceramic main body including a capacitance forming part, an edge part, and a cover part, the capacitance forming part including a dielectric layer, a first internal electrode, and a second internal electrode, the first and second internal electrodes being disposed to be stacked in a third direction with the dielectric layer interposed therebetween, the edge part being disposed on both surfaces of the capacitance forming part in a second direction, the cover part being disposed on both surfaces of the capacitance forming part in the third direction; first and second external electrodes disposed on first and second surfaces of the ceramic main body opposite to each other in a first direction, respectively; and an auxiliary electrode spaced apart from the capacitance forming part and disposed to be in contact with one of the first and second external electrodes. The auxiliary electrode is spaced apart from the first and second surfaces of the ceramic main body in the first direction.

Description

[0001] This application is a divisional application of the invention patent application "Multilayer Ceramic Electronic Components" filed on September 18, 2020, with application number 202010984914.1. Technical Field

[0002] This disclosure relates to a multilayer ceramic electronic component, and more specifically, to a multilayer ceramic electronic component with excellent reliability. Background Technology

[0003] In recent years, with the miniaturization, thinning, and multifunctionality of electronic products, there has been a need for the miniaturization of multilayer ceramic capacitors, and the mounting of multilayer ceramic capacitors has also become highly integrated.

[0004] Multilayer ceramic capacitors (an electronic component) are mounted on printed circuit boards of various electronic products such as video devices (such as liquid crystal displays (LCDs), plasma display panels (PDPs), etc.), computers, personal digital assistants (PDAs), and mobile phones for charging or discharging.

[0005] Multilayer ceramic capacitors are used as components in a variety of electronic devices due to their advantages of small size, high capacitance and easy installation.

[0006] Furthermore, with the recent increase in industry interest in electronic components, there is a growing demand for high reliability and strength characteristics in multilayer ceramic capacitors used in automotive or infotainment systems.

[0007] In particular, when multilayer ceramic capacitors are exposed to harsh environments, electrode peeling or cracking may occur due to oxidation of the external electrodes, bending caused by external forces, etc., and moisture penetration may cause IR degradation and / or short circuits. In such harsh environments, it is necessary to improve the internal and external structures to enhance moisture resistance reliability and mechanical strength. Summary of the Invention

[0008] One aspect of this disclosure is to provide a multilayer ceramic electronic component with excellent flexural strength.

[0009] Another aspect of this disclosure is to provide a multilayer ceramic electronic component with excellent moisture resistance and reliability.

[0010] Another aspect of this disclosure is to provide a multilayer ceramic electronic component with improved mechanical strength.

[0011] According to one aspect of this disclosure, a multilayer ceramic electronic component is provided. The multilayer ceramic electronic component includes: a ceramic body comprising a capacitor forming portion, an edge portion, and a cover portion; the capacitor forming portion comprising a dielectric layer, a first inner electrode, and a second inner electrode, the first inner electrode and the second inner electrode being stacked in a third direction with the dielectric layer between the first inner electrode and the second inner electrode; the edge portion being disposed on two surfaces of the capacitor forming portion in a second direction; the cover portion being disposed on two surfaces of the capacitor forming portion in the third direction; and the ceramic body comprising a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction; a first outer electrode and a second outer electrode, respectively disposed on the first surface and the second surface of the ceramic body; and an auxiliary electrode spaced apart from the capacitor forming portion and configured to contact one of the first outer electrode and the second outer electrode. The auxiliary electrode is spaced apart from the first surface and the second surface of the ceramic body.

[0012] According to another aspect of this disclosure, a multilayer ceramic electronic component includes: a ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in a third direction, and the ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode stacked in the third direction, with the dielectric layer between the first inner electrode and the second inner electrode; a first outer electrode and a second outer electrode disposed on the first surface and the second surface of the ceramic body, respectively; and an auxiliary electrode exposed on one of the fifth surface and the sixth surface and connected to one of the first outer electrode and the second outer electrode. Attached Figure Description

[0013] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0014] Figure 1 This is a schematic perspective view illustrating a multilayer ceramic electronic assembly according to an embodiment of the present disclosure;

[0015] Figure 2 This is a schematic diagram illustrating a ceramic body according to an embodiment of the present disclosure;

[0016] Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I' in the diagram;

[0017] Figure 4It is along Figure 1 A cross-sectional view taken from line II-II';

[0018] Figure 5 yes Figure 3 Enlarged view of region A;

[0019] Figure 6 yes Figure 4 Enlarged view of region B;

[0020] Figure 7 This is a cross-sectional view taken along line II-II' of a multilayer ceramic electronic assembly according to another embodiment of the present disclosure; and

[0021] Figure 8 and Figure 9 This is a schematic diagram illustrating a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present disclosure. Detailed Implementation

[0022] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the present disclosure may be exemplified in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. In the drawings, the shape and size of elements may be exaggerated for clarity. Furthermore, in the drawings, elements having the same function within the same scope of the inventive concept will be indicated by the same reference numerals.

[0023] In the accompanying drawings, irrelevant descriptions will be omitted to clearly depict this disclosure, and thicknesses may be enlarged to clearly represent multiple layers and regions. Identical elements having the same function within the scope of the same concept will be described using the same reference numerals. Throughout the specification, unless otherwise expressly stated, when a component is referred to as "comprising" or "including," it means that it may also include other components, but does not exclude them.

[0024] Values ​​of parameters used to describe elements, such as 1D dimensions (including but not limited to "length", "width", "thickness", "diameter", "distance", "gap" and / or "size"), 2D dimensions (including but not limited to "area" and / or "size"), 3D dimensions (including but not limited to "volume" and / or "size"), and properties of elements (including but not limited to "roughness", "density", "weight", "weight ratio" and / or "molar ratio"), can be obtained by the methods and / or tools described in this disclosure. However, this disclosure is not limited thereto. Other methods and / or tools, even those not described in this disclosure, may also be used, as understood by those skilled in the art.

[0025] In the accompanying drawings, the X direction can be defined as a first direction, the L direction, or the longitudinal direction; the Y direction can be defined as a second direction, the W direction, or the width direction; and the Z direction can be defined as a third direction, the T direction, or the thickness direction.

[0026] In the following text, reference will be made to Figures 1 to 6 A detailed description of a multilayer ceramic electronic assembly according to embodiments of the present disclosure.

[0027] Reference Figures 1 to 6 The multilayer ceramic electronic component 100 includes: a ceramic body 110, including a capacitor forming portion (α... W α T ), edge portion (m) and covering portion (c), capacitor forming portion (α) W α T The capacitor includes a dielectric layer 111 and a first inner electrode 121 and a second inner electrode 122 stacked in a third direction (Z direction), with the dielectric layer 111 located between the first inner electrode 121 and the second inner electrode 122. An edge portion (m) is provided in the capacitor forming portion (α). W α T On the two surfaces of the capacitor forming part (α) in the second direction (Y direction), the covering part (c) is provided. W α T The ceramic body 110 includes a first surface S1 and a second surface S2 opposite to each other in the first direction (X direction), a third surface S3 and a fourth surface S4 opposite to each other in the second direction (Y direction), and a fifth surface S5 and a sixth surface S6 opposite to each other in the third direction (Z direction); a first external electrode 131 and a second external electrode 132 are respectively disposed on the first surface S1 and the second surface S2 of the ceramic body 110; and two or more auxiliary electrodes 141 and 142 are disposed on the capacitor forming portion (α). W α T The auxiliary electrodes 141 and 142 are spaced apart and configured to contact the first external electrode 131 and the second external electrode 132 and to be spaced apart from the first surface S1 and the second surface S2 of the ceramic body 110. The auxiliary electrodes 141 and 142 may be disposed on the third direction (Z direction) of the ceramic body 110.

[0028] In the following, multilayer ceramic electronic components according to embodiments of the present disclosure will be described; however, while multilayer ceramic capacitors are specifically described, they are not limited thereto.

[0029] In embodiments of this disclosure, the ceramic body 110 may include: a capacitor forming portion (α) W α T ), including a dielectric layer 111 and a first inner electrode 121 and a second inner electrode 122; an edge portion (m) is disposed in the capacitor forming portion (α).W α T On the two surfaces of the capacitor forming part (α) in the second direction (Y direction); and on the two surfaces of the capacitor forming part (c) in the second direction (Y direction); and on the two surfaces of the capacitor forming part (α) in the second direction (Y direction); and on the two surfaces of the capacitor forming part (c) in the second direction (Y direction). W α T On the two surfaces of the third direction (Z direction).

[0030] While there are no particular limitations on the specific shape of the ceramic body 110, as shown in the figure, the ceramic body 110 can be formed into a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder contained in the ceramic body 110 during the firing process, the ceramic body 110 can have a substantially hexahedral shape, rather than a hexahedral shape with perfectly straight lines. The ceramic body 110 may have a first surface S1 and a second surface S2 that are opposite to each other in the longitudinal direction (X direction), a third surface S3 and a fourth surface S4 that are connected to the first surface S1 and the second surface S2 and are opposite to each other in the width direction (Y direction), and a fifth surface S5 and a sixth surface S6 that are connected to the first surface S1 and the second surface S2, connected to the third surface S3 and the fourth surface S4, and opposite to each other in the thickness direction (Z direction).

[0031] The ceramic body 110 can be formed by alternately stacking ceramic green sheets with a first internal electrode 121 printed on them and ceramic green sheets with a second internal electrode 122 printed on them in the thickness direction (Z direction).

[0032] Capacitor Forming Section (α) W α T The capacitor can be formed by alternately stacking dielectric layers 111 and internal electrodes 121 and 122 in the third direction (Z direction). The plurality of dielectric layers 111 forming the capacitor can be in a sintered state, and the boundaries between adjacent dielectric layers 111 can be integrated to the point that they may be difficult to identify without the use of a scanning electron microscope (SEM).

[0033] According to embodiments of this disclosure, there are no particular limitations on the raw materials used to form the dielectric layer 111, as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead-based perovskite composite materials, strontium titanate-based materials, etc., can be used.

[0034] In addition, for the purposes of this disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., can be added to powder particles such as barium titanate (BaTiO3) as materials for forming dielectric layer 111.

[0035] For example, dielectric layer 111 can be formed by the following steps: coating a slurry formed by powder including barium titanate (BaTiO3) onto a carrier film and drying it to prepare multiple ceramic sheets. The ceramic sheets can be formed by the following steps: mixing ceramic powder, binder and solvent to prepare a slurry and manufacturing the slurry into sheets with a thickness of several μm by a doctor blade.

[0036] The multilayer ceramic electronic component of this disclosure can be configured such that a plurality of internal electrodes 121 and 122 are arranged opposite each other and a dielectric layer 111 is disposed between the plurality of internal electrodes 121 and 122. The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122, the first internal electrode 121 and the second internal electrode 122 being alternately arranged opposite each other and the dielectric layer 111 being disposed between them.

[0037] The first inner electrode 121 is exposed on a surface S1 of the ceramic body 110 in the first direction (X direction), and the portion exposed on the surface S1 in the first direction (X direction) is connected to the first outer electrode 131. The second inner electrode 122 is exposed on another surface S2 of the ceramic body 110 in the first direction (X direction), and the portion exposed on the other surface S2 in the first direction (X direction) is connected to the second outer electrode 132. The first inner electrode 121 and the second inner electrode 122 can be electrically separated from each other by a dielectric layer 111 disposed between them.

[0038] There are no particular limitations on the materials used to form the first internal electrode 121 and the second internal electrode 122. For example, the first internal electrode 121 and the second internal electrode 122 can be formed using a conductive paste containing one or more materials selected from silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. Screen printing, gravure printing, and other methods can be used as printing methods for the conductive paste, but this disclosure is not limited thereto.

[0039] In the multilayer ceramic electronic assembly according to this disclosure, the edge portion (m) may be disposed in the capacitor forming portion (α). W α T On the two surfaces of the capacitor forming portion (α) in the second direction (Y direction). The edge portion may be provided on the capacitor forming portion (α). W α T On two surfaces in the second direction (Y direction), the second direction (Y direction) is perpendicular to the first direction and the third direction (X direction and Z direction), respectively, or, taking into account errors, margins, or tolerances that may exist during manufacturing and / or measurement, the second direction (Y direction) is substantially perpendicular to the first direction and the third direction (X direction and Z direction), respectively. The edge portion (m) can be used to prevent damage to the internal electrode due to physical or chemical stress.

[0040] The edge portion (m) may be made of an insulating material and may also be made of a ceramic material such as barium titanate. In this case, the edge portion (m) may include the same ceramic material as the ceramic material included in the dielectric layer 111, or may be made of the same material as the dielectric layer 111.

[0041] There are no particular limitations on the method for forming the edge portion (m). For example, it includes the capacitance forming portion (α). W α T The area of ​​the dielectric layer in the capacitor is formed to be larger than the area of ​​the inner electrode, so that an edge region is formed on the remaining surrounding portion of the inner electrode excluding the portion connected to the outer electrode. Alternatively, the edge (m) can be formed by coating a paste including ceramic, or the edge (m) can be formed by attaching a dielectric sheet to the capacitor forming portion (α). W α T It is formed by two surfaces in the second direction (Y direction).

[0042] The multilayer ceramic electronic assembly may include a cover (c). The cover (c) may be disposed on the outermost sides of the first inner electrode 121 and the second inner electrode 122. The cover (c) may be disposed below the inner electrode located at the bottom of the ceramic body 110 and above the inner electrode located at the top of the ceramic body 110. In this case, the cover (c) may be made using the same composition as the dielectric layer 111 and may be formed by stacking one or more dielectric layers, excluding the inner electrode, respectively above the inner electrode located at the top of the body 110 and below the inner electrode located at the bottom of the body 110. The cover (c) may substantially serve to prevent damage to the inner electrode due to physical or chemical stress.

[0043] In the multilayer ceramic electronic assembly according to this disclosure, a first external electrode 131 and a second external electrode 132 may be disposed on two surfaces of the ceramic body 110 in a first direction (X direction), that is, disposed on the first surface S1 and the second surface S2 of the ceramic body. The first external electrode 131 may be connected to the first internal electrode 121, and the second external electrode 132 may be connected to the second internal electrode 122.

[0044] In one example, the first external electrode 131 and the second external electrode 132 may be disposed on the first surface S1 and the second surface S2 in the longitudinal direction (first direction) of the ceramic body 110, respectively, and may be configured to extend to the third surface S3 and the fourth surface S4 in the width direction (second direction) and the fifth surface S5 and the sixth surface S6 in the thickness direction (third direction) of the ceramic body 110. The first external electrode 131 and the second external electrode 132, which are configured to extend to the third surface S3 to the sixth surface S6 of the ceramic body 110, may contact the auxiliary electrode, which will be described later, to improve the moisture resistance reliability and mechanical strength of the multilayer ceramic electronic assembly 100 according to the present disclosure.

[0045] According to embodiments of the present disclosure, the outer electrodes 131 and 132 may be configured to cover the first surface S1 and the second surface S2 of the ceramic body 110, and may include first electrode layers 131a and 132a connected to the inner electrodes 121 and 122, and second electrode layers 131b and 132b disposed on the first electrode layers 131a and 132a.

[0046] Specifically, the first external electrode 131 may be disposed on the first surface S1 of the ceramic body 110, and may include a first electrode layer 131a connected to the first internal electrode 121 and a second electrode layer 131b configured to cover the first electrode layer 131a. Additionally, the second external electrode 132 may be disposed on the second surface S2 of the ceramic body 110, and may include a first electrode layer 132a connected to the second internal electrode 122 and a second electrode layer 132b configured to cover the first electrode layer 132a.

[0047] The first electrode layers 131a and 132a may comprise conductive metal and glass. There are no particular limitations on the conductive metal used in the first electrode layers 131a and 132a, as long as it is a material that can be electrically connected to the inner electrode to form an electrostatic capacitance. For example, the conductive metal may be one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

[0048] The first electrode layers 131a and 132a can be formed by coating a conductive paste prepared by adding glass frit to conductive metal powder and then firing it. The first electrode layers 131a and 132a can be configured to extend to the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110.

[0049] The second electrode layers 131b and 132b may be formed using conductive metal and glass, or may include a conductive polymer containing conductive metal, etc. The second electrode layers 131b and 132b may be formed on the first electrode layers 131a and 132a, and may be formed to completely cover the first electrode layers 131a and 132a.

[0050] There are no particular limitations on the conductive metals used in the second electrode layers 131b and 132b, as long as they are materials that can be electrically connected to the inner electrode to form an electrostatic capacitance. For example, the conductive metal can be one or more selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof. The second electrode layers 131b and 132b can be formed by the following steps: coating a conductive paste prepared by adding glass frit to conductive metal powder and then firing it, or curing a conductive polymer containing conductive metal powder.

[0051] According to embodiments of this disclosure, the second electrode layers 131b and 132b may include a different conductive metal than the first electrode layers 131a and 132a. When the second electrode layers 131b and 132b include a different conductive metal than the first electrode layers 131a and 132a, even if the outer electrode peels off due to external stress or the like, the second electrode layers 131b and 132b can peel off first, thereby further improving moisture-proof reliability.

[0052] In embodiments of this disclosure, in the multilayer ceramic electronic assembly 100 according to this disclosure, two or more auxiliary electrodes 141 and 142 may be configured to contact the first external electrode 131 and the second external electrode 132. For example, two or more auxiliary electrodes 141 and 142 may be configured to contact the first electrode layers 131a and 132a or the second electrode layers 131b and 132b. The two or more auxiliary electrodes 141 and 142 may contact the first external electrode 131 and the second external electrode 132, and simultaneously, may contact the capacitor forming portion (α). W α T The auxiliary electrodes are spaced apart and can be disposed on the third direction (Z direction) of the ceramic body 110. In this specification, W and V are spaced apart, which means that W and V do not contact each other and that W and V are disposed at a predetermined interval. In addition, in this specification, the auxiliary electrodes are disposed on the third direction, which means that the direction in which the surface of the auxiliary electrodes faces is within a predetermined angle between the third direction and the third direction. When two or more auxiliary electrodes 141 and 142 contact the first external electrode 131 and the second external electrode 132, and simultaneously with the capacitor forming portion (α) W α T When the sheets are spaced apart and positioned in the third direction (Z direction) of the ceramic body 110, bending strength can be improved and breakage of the sheets can be prevented.

[0053] In embodiments of this disclosure, auxiliary electrodes 141 and 142 may be exposed on the fifth surface S5 and the sixth surface S6 of the ceramic body 110 and disposed in the capacitor forming portion (α). W α T On the opposite side of ). (Refer to) Figures 2 to 4 The auxiliary electrodes 141 and 142 disposed on the third direction (Z direction) of the ceramic body 110 can be exposed to the surface of the ceramic body 110 through the fifth surface S5 and the sixth surface S6 of the ceramic body 110. The auxiliary electrodes 141 and 142 exposed on the fifth surface S5 and the sixth surface S6 of the ceramic body 110 can contact the first external electrode 131 and the second external electrode 132. The auxiliary electrodes 141 and 142 exposed on the fifth surface S5 and the sixth surface S6 of the ceramic body 110 can be bonded to the first external electrode 131 and the second external electrode 132 in the firing process described later, thereby improving the flexural strength of the multilayer ceramic electronic assembly 100 according to the present disclosure.

[0054] In one example, the maximum absolute value of the angle θ of the auxiliary electrodes 141 and 142 of the multilayer ceramic electronic assembly according to this disclosure relative to a third direction (Z direction) may be less than 45°. There is no particular limitation on the minimum absolute value of the angle, but it may, for example, be greater than or equal to 0°. Figure 4 This is a cross-sectional view taken along line II-II' of a multilayer ceramic electronic assembly according to an embodiment of the present disclosure. Figure 6 yes Figure 4 A magnified view of region B. (Refer to...) Figure 4 and Figure 6 The angle θ of auxiliary electrodes 141 and 142 relative to a third direction (Z direction) can mean a value measured based on the YZ plane at the point where auxiliary electrodes 141 and 142 are exposed to the fifth surface S5 or the sixth surface S6 of the ceramic body 110. The maximum absolute value of angle θ can mean the maximum value among the multiple angles θ of auxiliary electrodes 141 and 142. When the maximum absolute value of the angle θ of auxiliary electrodes 141 and 142 relative to a third direction (Z direction) is less than 45°, auxiliary electrodes 141 and 142 can effectively disperse the bending stress applied to the multilayer ceramic electronic assembly according to this disclosure to prevent sheet breakage.

[0055] In another example, the sum of the absolute values ​​of the angles of the plurality of auxiliary electrodes 141 and 142 included in the multilayer ceramic electronic assembly according to this disclosure relative to a third third direction (Z direction) may be less than or equal to 90°. As described above, the sum of the absolute values ​​of the angles of the auxiliary electrodes 141 and 142 relative to the third third direction may mean the sum of the values ​​of all the angles of the auxiliary electrodes 141 and 142 relative to the third third direction, measured based on the YZ plane, at the point where the auxiliary electrodes 141 and 142 are exposed to the fifth surface S5 or the sixth surface S6 of the ceramic body 110. There is no particular limitation on the minimum value of the sum of the absolute values ​​of the angles of the auxiliary electrodes 141 and 142 relative to the third third direction, but it may, for example, be greater than or equal to 0°. The minimum sum of the absolute values ​​of the angles of auxiliary electrodes 141 and 142 relative to the third direction is 0°. This means that all auxiliary electrodes 141 and 142 are parallel to the third direction (Z direction) of the ceramic body 110, and that auxiliary electrodes 141 and 142 are perpendicular to the fifth surface S5 and the sixth surface S6 of the ceramic body 110, or substantially perpendicular to the fifth surface S5 and the sixth surface S6 of the ceramic body 110, taking into account errors, allowances, or tolerances that may exist during manufacturing and / or measurement. When the sum of the absolute values ​​of the angles of auxiliary electrodes 141 and 142 relative to the third direction is kept within a predetermined range, the bending strength of the multilayer ceramic electronic assembly according to this disclosure can be further improved.

[0056] In embodiments of this disclosure, auxiliary electrodes 141 and 142 may be disposed between the ends of the first electrode layers 131a and 132a and the inflection points of the ceramic body 110. The ends of the first electrode layers 131a and 132a may refer to the ends of the points where the ceramic body 110 intersects with the first electrode layers 131a and 132a, and may also refer to the points where the ceramic body 110, the first electrode layers 131a and 132a, and the second electrode layers 131b and 132b all intersect. In this specification, an inflection point may refer to the point where a straight line intersects a circle, and may also refer to the point where the straight line ends. (Refer to...) Figure 5 The inflection point can be the point where the straight line shape of the fifth surface of the body ends. As described above, when the auxiliary electrodes 141 and 142 are disposed between the ends of the first electrode layers 131a and 132a and the inflection point of the ceramic body 110, even if the second electrode layers 131b and 132b are peeled off when bending stress is applied to the multilayer ceramic electronic assembly according to the present disclosure, the first electrode layers 131a and 132a and the auxiliary electrodes 141 and 142 can still bond together, thereby ensuring excellent moisture-proof reliability.

[0057] In another embodiment of this disclosure, auxiliary electrodes 141 and 142 may be disposed between the ends of the first external electrode 131 and the second external electrode 132 and the inflection point of the ceramic body 110. The ends of the first external electrode 131 and the second external electrode 132 may refer to the ends of the points where the ceramic body 110 intersects with the first external electrode 131 and the second external electrode 132, and may also refer to the ends of the second electrode layers 131b and 132b formed on the ceramic body 110. When the auxiliary electrodes 141 and 142 are disposed between the ends of the first external electrode 131 and the second external electrode 132 and the inflection point of the ceramic body 110, the auxiliary electrodes 141 and 142 can enhance the fixing strength of the first external electrode 131 and the second external electrode 132, thereby improving the mechanical strength of the multilayer ceramic electronic assembly according to this disclosure.

[0058] In embodiments of this disclosure, the thickness of the auxiliary electrodes 141 and 142 can be in the range of 30% to 50% of the thickness of the cover (c). See also... Figure 5 The thickness d1 of the auxiliary electrodes 141 and 142 can represent the length of the auxiliary electrodes 141 and 142 in the Z direction. Additionally, the thickness d2 of the cover (c) can represent the thickness of the dielectric layer in which no internal electrode is disposed. When the thickness d1 of the auxiliary electrodes 141 and 142 is less than 30% of the thickness d2 of the cover (c), the bending strength may be weakened and the moisture resistance reliability may deteriorate. Furthermore, when the thickness d1 of the auxiliary electrodes 141 and 142 exceeds 50% of the thickness d2 of the cover (c), the electrical properties may be degraded due to the connection to the effective internal electrode via printing dispersion and / or coating.

[0059] In one example, thickness d1 may mean the dimension of one of the auxiliary electrodes 141 and 142 in the thickness direction (Z), and may be one of the average thickness, the maximum thickness, and the thickness measured at the central portion of one of the auxiliary electrodes 141 and 142. Thickness d2 may be defined similarly to thickness d1.

[0060] In one example, based on a cross-section cut in the XZ plane (an image scanned by, for example, a scanning electron microscope (SEM)), thickness d1 can be determined by measuring the thickness of each of the points at equal (or alternatively, non-equal) intervals to the left and to the right, defined from a reference center point of one of the auxiliary electrodes 141 and 142, and obtaining an average of these measurements. The reference center point may be at the same distance from the opposite edge of one of the auxiliary electrodes 141 and 142 in the cut cross-section, or at substantially the same distance to account for measurement errors. In this case, thickness d1 may be the average thickness of one of the auxiliary electrodes 141 and 142. Thickness d2 may be defined similarly to thickness d1.

[0061] Optionally, based on a cross-section cut in the XZ plane (image scanned by, for example, a scanning electron microscope (SEM)), thickness d1 can be determined by measuring the thickness of each of the points at equal (or alternatively, non-equal) intervals from a reference center point of one of the auxiliary electrodes 141 and 142, defining a predetermined number (e.g., 5) points to the left and a predetermined number (e.g., 5) points to the right, and obtaining the maximum value therefrom. In this case, thickness d1 can be the maximum thickness of one of the auxiliary electrodes 141 and 142. Thickness d2 can be defined similarly to thickness d1.

[0062] Optionally, based on a cross-section cut in the XZ plane (image scanned by, for example, a scanning electron microscope (SEM)), thickness d1 can be the thickness of a reference center point of one of the auxiliary electrodes 141 and 142. The reference center point may be at the same distance from the opposite edge of one of the auxiliary electrodes 141 and 142 in the cut cross-section, or may be at substantially the same distance to account for measurement errors. Thickness d2 can be defined similarly to thickness d1.

[0063] In one example, auxiliary electrodes 141 and 142 may be disposed in the edge portion (m). Figure 8 This is a schematic diagram illustrating a portion of the manufacturing process of a multilayer ceramic electronic component according to this disclosure. (Refer to...) Figure 8 The auxiliary electrodes 141 and 142 can be pre-set in the edge portion (m) and then attached to the capacitor forming portion. In this case, the process of forming separate auxiliary electrodes in the ceramic body is not required, thus simplifying the process.

[0064] In another example, auxiliary electrodes 141 and 142 may be disposed in the cover. Figure 9 This is a schematic diagram illustrating a portion of the manufacturing process of a multilayer ceramic electronic component according to this disclosure. (Refer to...) Figure 9 Auxiliary electrodes 141 and 142 can be attached to the capacitor forming portion after being pre-set in the cover portion (c). In this case, the terminal portion of the external electrode can be securely fixed, while multiple auxiliary electrodes can be arranged as described later to further improve the bending strength and moisture resistance reliability of the multilayer ceramic electronic assembly according to the present disclosure.

[0065] According to embodiments of this disclosure, auxiliary electrodes 141 and 142 may include a first to an eighth auxiliary electrode. That is, at least one auxiliary electrode 141 and 142 may be provided at each corner side of the hexahedral ceramic body 110. In this case, the terminal portions of the outer electrode that are easily penetrated by external substances such as moisture can be securely fixed to improve bending strength and moisture resistance.

[0066] In embodiments of this disclosure, six or more auxiliary electrodes may be exposed on the fifth and sixth surfaces of the ceramic body, respectively. Three or more auxiliary electrodes 241 and 251 may be exposed at locations on the fifth surface S5 of the ceramic body 210 that contact the first surface S1, and three or more auxiliary electrodes 241 and 251 may be exposed at locations on the fifth surface S5 of the ceramic body 210 that contact the second surface S2. Additionally, three or more auxiliary electrodes 242 and 252 may be exposed at locations on the sixth surface S6 of the ceramic body 210 that contact the first surface S1, and three or more auxiliary electrodes 242 and 252 may be exposed at locations on the sixth surface S6 of the ceramic body 210 that contact the second surface S2. There is no particular upper limit to the number of auxiliary electrodes 241, 242, 251, and 252 exposed on the fifth surface S5 and sixth surface S6 of the ceramic body 210; for example, it may be less than or equal to 100 or less than or equal to 50.

[0067] In other words, three or more auxiliary electrodes 241, 242, 251 and 252 can be disposed at any corner of the ceramic body 210 where the auxiliary electrodes 241, 242, 251 and 252 are exposed. Figure 7 This is a cross-sectional view of ten auxiliary electrodes of a multilayer ceramic electronic component, exposed on the fifth and sixth surfaces of the ceramic substrate. (Refer to...) Figure 7 When the auxiliary electrodes 241, 242, 251 and 252 are configured such that six or more of them are exposed to the fifth surface S5 and the sixth surface S6 of the ceramic body 210, the adhesive strength between the auxiliary electrodes and the external electrodes can be maximized, thereby increasing the mechanical strength of the multilayer ceramic electronic assembly and further improving its moisture-proof reliability.

[0068] Table 1 below shows the results of the bending strength test for the ratio of the thickness of the auxiliary electrode to the thickness of the cover. In the bending strength test, 60 sample pieces were subjected to bending of up to 6 mm at a rate of 1 mm / sec, and those that deviated from the initial capacity by more than ±10% were classified as defective.

[0069] [Table 1]

[0070]

[0071] Referring to Table 1, it can be seen that when the ratio of the thickness of the auxiliary electrode to the thickness of the cover is reduced from 30% to 0%, defective samples are produced, and even when the ratio is 60%, it has excellent bending strength and does not produce defects.

[0072] Table 2 below shows the results of moisture-proof reliability tests for the ratio of auxiliary electrode thickness to cover thickness. Moisture-proof reliability was investigated by counting the number of multilayer ceramic electronic components with defects in 500 samples after applying a voltage of 2V for 48 hours at 85°C and 85% relative humidity.

[0073] [Table 2]

[0074]

[0075]

[0076] Referring to Table 2, it can be seen that when the ratio of the thickness of the auxiliary electrode to the thickness of the cover portion decreases from 30% to 0%, defective parts are generated in the samples. Furthermore, it can be seen that defective parts are generated in samples where the ratio exceeds 50%. Therefore, it can be seen that the thickness of the auxiliary electrode of this disclosure should fall within the range of 30% to 50% of the thickness of the cover portion.

[0077] As described above, according to one aspect of this disclosure, a multilayer ceramic electronic component with excellent flexural strength can be provided by applying auxiliary electrodes.

[0078] According to another aspect of this disclosure, multilayer ceramic electronic components with excellent moisture resistance and reliability can be provided by applying auxiliary electrodes.

[0079] According to another aspect of this disclosure, auxiliary electrodes may be applied to prevent breakage and enhance mechanical strength.

[0080] However, the various advantages and effects of this disclosure, as well as the beneficial advantages and effects, are not limited to those described above and will be more readily understood in the process of describing specific embodiments of this disclosure.

[0081] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer ceramic electronic component, comprising: A ceramic body includes a capacitor forming portion, an edge portion, and a cover portion. The capacitor forming portion includes a dielectric layer, a first inner electrode, and a second inner electrode. The first inner electrode and the second inner electrode are stacked in a third direction, and the dielectric layer is located between the first inner electrode and the second inner electrode. The edge portion is disposed on two surfaces of the capacitor forming portion in a second direction. The cover portion is disposed on two surfaces of the capacitor forming portion in the third direction. The ceramic body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction. The first external electrode and the second external electrode are respectively disposed on the first surface and the second surface of the ceramic body; as well as A first auxiliary electrode is spaced apart from the capacitor forming portion and is disposed in the covering portion to contact one of the first and second external electrodes. The first auxiliary electrode is spaced apart from the first surface and the second surface of the ceramic body.

2. The multilayer ceramic electronic component according to claim 1, wherein, The first external electrode and the second external electrode extend to the third, fourth, fifth and sixth surfaces of the ceramic body.

3. The multilayer ceramic electronic component according to claim 1, wherein, The number of the first auxiliary electrodes is less than or equal to 100.

4. The multilayer ceramic electronic component according to claim 1, wherein, The maximum absolute value of the angle of the first auxiliary electrode relative to the third direction is less than 45°.

5. The multilayer ceramic electronic component according to claim 1, wherein the multilayer ceramic electronic component further comprises a second auxiliary electrode spaced apart from the first surface and the second surface of the ceramic body. in, The first auxiliary electrode and the second auxiliary electrode are disposed on opposite sides of the capacitor forming portion, and The sum of the absolute values ​​of the angles of the first auxiliary electrode and the second auxiliary electrode relative to the third direction is less than or equal to 90°.

6. The multilayer ceramic electronic component according to claim 1, wherein, The first external electrode and the second external electrode each include a first electrode layer connected to the first internal electrode and the second internal electrode, respectively, and a second electrode layer disposed on the first electrode layer. The first auxiliary electrode is disposed between the end of the first electrode layer and the inflection point of the ceramic body.

7. The multilayer ceramic electronic component according to claim 1, wherein, The first auxiliary electrode is disposed between the end of one of the first and second external electrodes and the inflection point of the ceramic body.

8. The multilayer ceramic electronic component according to any one of claims 1-7, wherein, The thickness of the first auxiliary electrode is in the range of 30% to 50% of the thickness of the cover portion.

9. The multilayer ceramic electronic component according to claim 1, wherein the multilayer ceramic electronic component further comprises a second auxiliary electrode, a third auxiliary electrode, a fourth auxiliary electrode, a fifth auxiliary electrode, a sixth auxiliary electrode, a seventh auxiliary electrode, and an eighth auxiliary electrode.

10. The multilayer ceramic electronic component according to claim 9, wherein, Six or more of the following auxiliary electrodes—the first, the second, the third, the fourth, the fifth, the sixth, the seventh, and the eighth—are exposed on the fifth and sixth surfaces of the ceramic body.

11. A multilayer ceramic electronic component, comprising: A ceramic body includes a capacitor forming portion, an edge portion, and a cover portion. The capacitor forming portion includes a dielectric layer, a first inner electrode, and a second inner electrode. The first inner electrode and the second inner electrode are stacked in a third direction, and the dielectric layer is located between the first inner electrode and the second inner electrode. The edge portion is disposed on two surfaces of the capacitor forming portion in a second direction. The cover portion is disposed on two surfaces of the capacitor forming portion in the third direction. The ceramic body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction. The first external electrode and the second external electrode are respectively disposed on the first surface and the second surface of the ceramic body; as well as The first auxiliary electrode is spaced apart from the capacitor forming portion in the third direction and is configured to contact one of the first and second external electrodes. The first auxiliary electrode is spaced apart from the first surface and the second surface of the ceramic body.

12. The multilayer ceramic electronic component according to claim 11, wherein, The first external electrode and the second external electrode extend to the third, fourth, fifth and sixth surfaces of the ceramic body.

13. The multilayer ceramic electronic component according to claim 11, wherein, The number of the first auxiliary electrodes is less than or equal to 100, and / or the first auxiliary electrodes are configured not to be parallel to the first inner electrode and the second inner electrode.

14. The multilayer ceramic electronic component according to claim 11, wherein, The maximum absolute value of the angle of the first auxiliary electrode relative to the third direction is less than 45°.

15. The multilayer ceramic electronic component according to claim 11, further comprising a second auxiliary electrode spaced apart from the first surface and the second surface of the ceramic body. in, The first auxiliary electrode and the second auxiliary electrode are disposed on opposite sides of the capacitor forming portion, and The sum of the absolute values ​​of the angles of the first auxiliary electrode and the second auxiliary electrode relative to the third direction is less than or equal to 90°.

16. The multilayer ceramic electronic component according to claim 11, wherein, The first external electrode and the second external electrode each include a first electrode layer connected to the first internal electrode and the second internal electrode, respectively, and a second electrode layer disposed on the first electrode layer. The first auxiliary electrode is disposed between the end of the first electrode layer and the inflection point of the ceramic body.

17. The multilayer ceramic electronic component according to claim 11, wherein, The first auxiliary electrode is disposed between the end of one of the first and second external electrodes and the inflection point of the ceramic body.

18. The multilayer ceramic electronic component according to any one of claims 11-17, wherein, The thickness of the first auxiliary electrode is in the range of 30% to 50% of the thickness of the cover portion.

19. The multilayer ceramic electronic component according to claim 11, wherein, The first auxiliary electrode is disposed in the edge portion.

20. The multilayer ceramic electronic component according to claim 11, wherein, The first auxiliary electrode is disposed in the cover portion.

21. The multilayer ceramic electronic component according to claim 11, wherein the multilayer ceramic electronic component further comprises a second auxiliary electrode, a third auxiliary electrode, a fourth auxiliary electrode, a fifth auxiliary electrode, a sixth auxiliary electrode, a seventh auxiliary electrode, and an eighth auxiliary electrode.

22. The multilayer ceramic electronic component according to claim 21, wherein, Six or more of the following auxiliary electrodes—the first, the second, the third, the fourth, the fifth, the sixth, the seventh, and the eighth—are exposed on the fifth and sixth surfaces of the ceramic body.

23. A multilayer ceramic electronic component, comprising: A ceramic body includes a capacitor forming portion, an edge portion, and a cover portion. The capacitor forming portion includes a dielectric layer, a first inner electrode, and a second inner electrode. The first inner electrode and the second inner electrode are stacked in a third direction, and the dielectric layer is located between the first inner electrode and the second inner electrode. The edge portion is disposed on two surfaces of the capacitor forming portion in a second direction. The cover portion is disposed on two surfaces of the capacitor forming portion in the third direction. The ceramic body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction. The first external electrode and the second external electrode are respectively disposed on the first surface and the second surface of the ceramic body; as well as The first auxiliary electrode is spaced apart from the capacitor forming portion and is configured to contact one of the first and second external electrodes. The first auxiliary electrode is spaced apart from the first and second surfaces of the ceramic body. Wherein, the maximum absolute value of the angle of the first auxiliary electrode relative to the third direction is less than 45°.

24. The multilayer ceramic electronic component according to claim 23, wherein, The first external electrode and the second external electrode extend to the third, fourth, fifth and sixth surfaces of the ceramic body.

25. The multilayer ceramic electronic component according to claim 23, wherein, The number of the first auxiliary electrodes is less than or equal to 100.

26. The multilayer ceramic electronic component according to claim 23, further comprising a second auxiliary electrode spaced apart from the first surface and the second surface of the ceramic body. in, The first auxiliary electrode and the second auxiliary electrode are disposed on opposite sides of the capacitor forming portion, and The sum of the absolute values ​​of the angles of the first auxiliary electrode and the second auxiliary electrode relative to the third direction is less than or equal to 90°.

27. The multilayer ceramic electronic component according to claim 23, wherein, The first external electrode and the second external electrode each include a first electrode layer connected to the first internal electrode and the second internal electrode, respectively, and a second electrode layer disposed on the first electrode layer. The first auxiliary electrode is disposed between the end of the first electrode layer and the inflection point of the ceramic body.

28. The multilayer ceramic electronic component according to claim 23, wherein, The first auxiliary electrode is disposed between the end of one of the first and second external electrodes and the inflection point of the ceramic body.

29. The multilayer ceramic electronic component according to any one of claims 23-28, wherein, The thickness of the first auxiliary electrode is in the range of 30% to 50% of the thickness of the cover portion.

30. The multilayer ceramic electronic component according to claim 23, wherein, The first auxiliary electrode is disposed in the edge portion.

31. The multilayer ceramic electronic component according to claim 23, wherein, The first auxiliary electrode is disposed in the cover portion.

32. The multilayer ceramic electronic component according to claim 23, wherein the multilayer ceramic electronic component further comprises a second auxiliary electrode, a third auxiliary electrode, a fourth auxiliary electrode, a fifth auxiliary electrode, a sixth auxiliary electrode, a seventh auxiliary electrode, and an eighth auxiliary electrode.

33. The multilayer ceramic electronic component according to claim 32, wherein, Six or more of the following auxiliary electrodes—the first, the second, the third, the fourth, the fifth, the sixth, the seventh, and the eighth—are exposed on the fifth and sixth surfaces of the ceramic body.

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