Optical image stabilization actuator and method for assembling same

Abstract

To provide a sensor shift type optical image stabilization actuator, an assembly method, and an assembly device thereof, which reduce the manufacturing cost of a sensor shift type actuator.SOLUTION: After assembling an FPC including a wiring to an actuator case, a board on which an image sensor is mounted is electrically connected to the FPC, the assembling of the FPC with the image sensor mounted on the actuator case is avoided to reduce costly image sensor scrap due to actuator assembly failure, and reduce the manufacturing cost of the sensor shift type actuator.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to the field of optical elements, and more particularly to a sensor-shift type optical image stabilization actuator and an assembly method thereof. [Background technology]

[0002] With the development of image processing hardware technology and the increasing needs of users for taking images, functions such as optical image stabilization (OIS) have been applied to camera modules mounted on mobile devices (e.g., smartphones, PDAs, and standalone camera devices).

[0003] The Optical Image Stabilization (OIS) function improves image clarity by adaptively moving the bracket holding the lens in a direction that corrects the lens shake caused by vibration.

[0004] In the prior art, there is known a sensor-shift optical image stabilization (Sensor-Shift OIS) technology, in which a photosensitive element (image sensor) is fixed to a platform that can slide in parallel by electromagnetic effect, and when photographing, the platform stops the photosensitive element for a short time due to electromagnetic hysteresis, thereby achieving a certain degree of optical image stabilization.

[0005] In the prior art, the image sensor is easily damaged during assembly of the sensor-shift type optical image stabilization actuator, which increases the cost of the sensor-shift type actuator. Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present disclosure is to provide a sensor-shift type optical image stabilization actuator and an assembly method thereof that reduce the manufacturing cost of the sensor-shift type actuator. [Means for solving the problem]

[0007] In order to solve the above technical problems, the present disclosure is realized as follows. As a first aspect, there is provided a method for assembling a sensor-shift type optical image stabilization (OIS) actuator, comprising the steps of: Mounting a flexible printed circuit (FPC) on which the image sensor wiring is set to the case of the OIS actuator; This includes electrically connecting the substrate on which the image sensor is mounted to the FPC in the case. A second aspect is a sensor-shift type optical image stabilization OIS actuator, which is assembled by the method described in the first aspect. In a third aspect, there is provided an assembly device for a sensor-shift type optical image stabilization (OIS) actuator, comprising a processor, a memory, and a program or instructions stored in the memory and executable on the processor, which, when executed by the processor, realizes the assembly method described in the first aspect. In a fourth aspect, there is provided a computer readable storage medium having stored thereon a program or instructions which, when executed by the processor, implements the assembly method described in the first aspect. [Effects of the Invention]

[0008] In the examples of the present disclosure, an FPC including wiring is assembled into the actuator case, and then a substrate on which an image sensor is mounted is electrically joined to the FPC. This avoids assembling the FPC on which an image sensor is mounted into the actuator case, thereby reducing the costly disposal of image sensors due to defects in the actuator assembly and reducing the manufacturing costs of sensor-shift type actuators. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of an assembly flow of an actuator. [Figure 2] FIG. 1 is a schematic diagram of an assembly flow of an actuator according to an embodiment of the present disclosure. [Figure 3] FIG. 1 is a schematic diagram showing electrical bonding between an FPC and a substrate in an embodiment of the present disclosure. [Figure 4] FIG. 10 is another schematic diagram of electrically joining an FPC and a substrate in an embodiment of the present disclosure. [Figure 5] 1 is a schematic diagram of a configuration of an actuator assembly device according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0010] The following clearly and completely describes the technical solutions of the embodiments of the present disclosure, along with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, but not all of them. Based on the embodiments of the present disclosure, any other embodiments that can be made by those skilled in the art without any creative work are all within the scope of protection of the present disclosure.

[0011] The terms "first," "second," etc., used in the specification and claims of the present disclosure are intended to distinguish between similar objects and do not necessarily describe a particular order or priority. It should be understood that the data used in this manner may be interchanged as appropriate, so that the embodiments of the present disclosure described herein may be practiced, for example, in an order other than that shown or described herein. Furthermore, objects distinguished by the terms "first," "second," etc., are generally of the same type and do not limit the number of objects. For example, the first object may be one or more. Note that "and / or" in the specification and claims indicates at least one of the connected objects. The character " / " generally indicates that related objects are in an "or" relationship.

[0012] Hereinafter, a sensor-shift type OIS actuator assembly method according to an embodiment of the present disclosure will be described in detail with reference to specific examples and application scenarios, along with the accompanying drawings.

[0013] Referring to FIG. 1 , the present disclosure provides a flow for assembling a sensor shift type OIS actuator. In S11, a PCB (Printed Circuit Board) 104 is bonded to flexible printed circuits (FPCs) 102-103, etc. The FPC is used to wire the image sensor, and an image sensor 101 is mounted on a substrate 104. Specifically, the substrate 104 may be a PCB. In S12, an infrared cutoff filter assembly 105 is mounted on the PCB 104 so as to be positioned above the image sensor 101, resulting in the configuration shown in S13. Next, an OIS actuator base 106 is bonded to the PCB 104, resulting in the structure shown in S14. In S15, the structure to which the OIS actuator base 106 is bonded is assembled into an actuator case 107, resulting in the assembled actuator structure shown in S16.

[0014] Mounting the image sensor to the FPC while it is flat is easier to work with, so with the above assembly method, the image sensor is first mounted to the FPC before starting actuator assembly. However, with this method, the FPC with the mounted image sensor must be assembled into a case during subsequent actuator assembly, which could damage the image sensor, which is the most expensive component. There is also the risk that if there is a defect during actuator assembly, the image sensor, which is a costly component, will have to be discarded along with the FPC. Furthermore, factories that handle image sensors typically require clean rooms of class 100 or lower. The actuator assembly process typically does not require such a high level of cleanliness, so capital investment is required for the actuator assembly process.

[0015] The above assembly method carries the risk of damaging or destroying the expensive image sensor during actuator assembly. It also carries the risk of having to discard the expensive image sensor due to defects during actuator assembly. Furthermore, the above assembly method requires a clean room to handle the FPC equipped with the image sensor, which increases the burden on actuator suppliers.

[0016] To solve the problems of conventional methods, the embodiment of the present disclosure separates the substrate on which the image sensor is mounted from the FPC for wiring, and after assembling the FPC including the wiring to the actuator, the substrate on which the image sensor is mounted is electrically joined to the FPC. This reduces the costly disposal of image sensors due to defective actuator assembly and reduces the production cost of the sensor-shift actuator.

[0017] Specifically, in the method for assembling a sensor-shift type OIS actuator according to the embodiment of the present disclosure, an FPC on which the wiring of the image sensor is set is mounted on a case of the OIS actuator, and then the substrate on which the image sensor is mounted is electrically connected to the FPC in the case.

[0018] According to the above-described assembly method, the embodiments of the present disclosure separate the FPC and image sensor after assembling the actuator or during assembling the actuator, and then electrically connect the FPC to the image sensor substrate after assembling the FPC to the OIS actuator case. This avoids problems such as damage to the image sensor during actuator assembly and disposal of the image sensor due to defective actuator assembly. Furthermore, the sensor-shift actuator can be assembled without the need for a costly clean room during actuator assembly, further reducing the production costs of the sensor-shift actuator.

[0019] Referring to FIG. 2 , in an embodiment of the present disclosure, in S21, a base 206 of an OIS actuator is mounted to an FPC. Here, 202, 203, and 204 indicate the integration of the FPC. Then, in S22, the FPC with the mounted base is assembled into a case 207 of the OIS actuator, thereby mounting the FPC on the case of the OIS actuator as shown in S23. In S24, an image sensor 209 is mounted on a substrate 208. In S25, the substrate 208 with the mounted image sensor is electrically connected to the FPC in the case 207, resulting in an assembled OIS actuator as shown in S26.

[0020] Furthermore, in S24, after mounting the image sensor 209 on the substrate 208, the present disclosure may mount an infrared cutoff filter assembly 205 on the substrate 208, the infrared cutoff filter assembly 205 being positioned above the image sensor 209. Specifically, the infrared cutoff filter assembly 205 includes a support and an infrared cutoff filter fixed to the support and connected to the substrate via the support.

[0021] As can be seen from the above steps, embodiments of the present disclosure improve the efficiency of actuator assembly by electrically connecting the substrate on which the image sensor is mounted after mounting the FPC to the case in S23. For example, the actuator assembly steps (e.g., S21, S22, S23, S24, S26) can be performed by the actuator supplier, and the image sensor substrate attachment (e.g., S24) can be performed by the image sensor module manufacturer, thereby eliminating the need for the actuator manufacturer to handle the image sensor attachment, thereby reducing the burden and cost for the actuator manufacturer.

[0022] Generally, image sensors have multiple pins (PINs), which requires a large amount of wiring. To efficiently route wiring in a small area, the present disclosure electrically connects the substrate 208 to the FPC using a flip chip in S25. Here, corresponding lands are provided on the backside of the substrate and the FPC. As shown in FIG. 3, a plurality of lands 210 are provided on the backside of the substrate 208, and a plurality of lands 211 are provided on the FPC 204. The lands 210 and 211 correspond to each other and are connected by a flip chip. Of course, in the embodiment of the present disclosure, the substrate and FPC may also be electrically connected by soldering. As shown in FIG. 4, a plurality of lands are provided on the FPC, a plurality of pins are provided on the substrate, and the pins are soldered to the corresponding lands to electrically connect the substrate and FPC.

[0023] According to the above flow, an embodiment of the present disclosure provides a sensor-shift type OIS actuator, which is assembled according to the above method flow.

[0024] Optionally, as shown in Fig. 5, an embodiment of the present disclosure provides an electronic device 400. The electronic device 400 includes a processor 401, a memory 402, and a program or instruction stored in the memory 402 and executable on the processor. When the program or instruction is executed by the processor 401, each process in the above-described embodiment of the assembly method is realized and the same technical effects can be achieved. Therefore, to avoid redundancy, the description thereof will not be repeated here.

[0025] An embodiment of the present disclosure provides a readable storage medium, which stores a program or instruction, and when the program or instruction is executed by a processor, each process in the above-described assembly method embodiment can be realized and the same technical effect can be achieved, so that the description thereof will not be repeated here to avoid redundancy.

[0026] The processor is the processor of the assembly device in the above embodiment. The readable storage medium includes a computer-readable storage medium such as a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0027] It should be noted that the terms "comprises," "having," and any variations thereof are intended to cover a non-exclusive inclusion, and a process, method, product, or apparatus comprising a set of elements is not limited to those elements and may include other elements not expressly stated or inherent in the process, method, product, or apparatus. Absent further limitations, an element limited by "comprises one of" does not exclude the inclusion of other similar elements in the process, method, product, or apparatus that includes that element. It should be noted that the scope of the methods and apparatuses in the embodiments of the present disclosure is not limited to performing functions in the order shown or discussed, but also includes performing functions essentially simultaneously or in the reverse order based on such functionality. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Furthermore, features described with reference to one example may be combined with other examples.

[0028] From the description of the above embodiments, it is obvious to those skilled in the art that the methods of the above embodiments can be realized in the form of a general-purpose hardware platform that requires software, and of course, can also be realized by hardware, and in many cases the former is a more preferable embodiment. Based on this understanding, the substantial part of the technical means of the present disclosure or the part that contributes to the prior art appears in the form of a software product. The computer software product is stored in a storage medium (e.g., ROM / RAM, magnetic disk, optical disk) and includes several instructions that cause a terminal device (such as a mobile phone, computer, server, or network device) to execute the methods of each embodiment of the present disclosure.

[0029] Although the embodiments of the present disclosure have been described above based on the drawings, the present invention is not limited to the above-mentioned specific embodiments. The above-mentioned specific embodiments are illustrative and not limiting. Many modifications that a person skilled in the art can make based on the teachings of the present disclosure without departing from the spirit of the present disclosure and the scope of the claims are all included in the scope of protection of the present disclosure.

Claims

1. A method for assembling a sensor-shift type optical image stabilization (OIS) actuator, comprising the steps of: Mounting a flexible printed circuit (FPC) on which wiring of the image sensor is set to the case of the OIS actuator; electrically connecting the substrate on which the image sensor is mounted to the FPC in the case; The electrically connecting the substrate on which the image sensor is mounted and the FPC in the case includes: A method comprising electrically joining the substrate and the FPC by flip chip, and providing corresponding lands on the backside of the substrate and the FPC, respectively.

2. 2. The method of claim 1, Mounting the flexible printed circuit FPC to a case of the OIS actuator includes: Mounting a base of an OIS actuator on the FPC; and assembling the base-mounted FPC to a case of the OIS actuator.

3. 3. The method according to claim 1 or 2, The method includes mounting the image sensor to a substrate before electrically connecting the substrate on which the image sensor is mounted to an FPC in the case.

4. 4. The method of claim 3, and after mounting the image sensor on the substrate, attaching an infrared cutoff filter assembly disposed above the image sensor to the substrate.

5. 5. The method of claim 4, wherein the infrared cutoff filter assembly includes a support and an infrared cutoff filter fixed to the support and connected to the substrate via the support.

6. 6. An optical image stabilization OIS actuator of a sensor shift type, characterized in that the OIS actuator is assembled by a method according to any one of claims 1 to 5.

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