Sensor

Abstract

To properly remove inside air.SOLUTION: The present invention relates to a sensor in which a substrate 30 and a connector 40 are integrated with resin, and the sensor includes: a connector pin 42 for connecting the substrate 30 and the connector 40; a filling unit S2 provided on a facing side which faces a surface 30a of the substrate 30 in the connector 40; and a through-hole 43 for connecting the filling unit S2 and an engagement unit S1 in which the connector 40 is engaged with a mating connector.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a sensor in which a substrate and a connector are integrated. [Background technology]

[0002] BACKGROUND ART There is a known technique for preventing air bubbles from forming in a resin-filled connector in which electric wires connecting hydraulic equipment to the outside are sealed with a rubber plug within a connector housing and insulated and fixed with a resin material. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 6-208863 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, when molding connectors and circuit boards for electronic devices such as sensors with resin, if the ends of the resin flow paths do not face the exterior, the air inside may become trapped and not escape from the surface. This can lead to thinned portions in the mold, which can cause cracks. Furthermore, providing an air vent at the end of the flow path can allow water to seep inside.

[0005] In view of the above circumstances, the present disclosure aims to provide a sensor that can properly remove internal air. [Means for solving the problem]

[0006] According to the present disclosure, there is provided a sensor in which a substrate and a connector are integrated with resin, the sensor comprising: a connector pin that connects the substrate and the connector; a filling portion provided on the opposite side of the connector facing the surface of the substrate; and a through hole that connects the filling portion with a mating portion where the connector mates with a mating connector. [Effects of the Invention]

[0007] According to the present disclosure, the internal air can be properly vented. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a sensor according to an embodiment, as viewed from the left front. [Figure 2] FIG. 2 is a cross-sectional view of the sensor according to the embodiment. [Figure 3] FIG. 3 is a perspective view of the sensor according to the embodiment as seen from the left rear. [Figure 4] FIG. 4 is a partially enlarged cross-sectional view of the connector and the board as viewed from the left rear. [Figure 5] FIG. 5 is a partially enlarged view of the connector as seen from the rear left. [Figure 6] FIG. 6 is a partially enlarged cross-sectional view of the connector as seen from the left side. [Figure 7] FIG. 7 is a partial enlarged view of the connector as seen from the rear. [Figure 8] FIG. 8 is a partially enlarged cross-sectional view of the connector and the board as viewed from the upper left. [Figure 9] FIG. 9 is a partially enlarged view of FIG. [Figure 10] FIG. 10 is a schematic diagram illustrating a method for forming a through hole in a connector. [Figure 11] FIG. 11 is a schematic diagram illustrating a molding method. [Figure 12] FIG. 12 is a schematic diagram illustrating the lower metal mold. [Figure 13] FIG. 13 is a schematic diagram illustrating the state in which the lower and upper dies of the mold are combined. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, but the present disclosure is not limited thereto. The components of the embodiments described below can be combined as appropriate. In addition, some components may not be used.

[0010] (Embodiment) [Sensor] FIG. 1 is a perspective view of the sensor according to the embodiment, as seen from the front left. FIG. 2 is a cross-sectional view of the sensor according to the embodiment. FIG. 3 is a perspective view of the sensor according to the embodiment, as seen from the rear left. FIGS. 1 to 3 show a contact-type stroke sensor 1. In this disclosure, the sensor 1 measures a piston that operates a swash plate of a variable displacement hydraulic pump. The sensor 1 is used as a swash plate angle sensor by detecting the amount of movement of the piston.

[0011] The sensor 1 includes a case 10, a shaft 20, a substrate 30, a connector 40, and a resin mold 50. The sensor 1 integrates the substrate 30 and the connector 40 using the mold 50. In the present disclosure, the sensor 1 integrates the assembled case 10, shaft 20, substrate 30, and connector 40 using the mold 50. As shown in FIG. 1 , the longitudinal direction of the case 10 of the stroke sensor 1 is defined as the up-down direction, and the opening direction of the connector 40 is defined as the front-rear direction. The direction perpendicular to the up-down direction and the front-rear direction is defined as the left-right direction.

[0012] As shown in FIG. 2, the case 10 accommodates the shaft 20 therein. The case 10 has a tubular portion 11 and a flange 12. The tubular portion 11 is formed in a cylindrical shape. In the present disclosure, the axial direction of the tubular portion 11 is parallel to the up-down direction. The upper axial end of the tubular portion 11 is closed. The lower axial end of the tubular portion 11 is open. A flange 12 is provided at the middle portion of the tubular portion 11. The flange 12 extends radially outward from the tubular portion 11. The flange 12 is fixed to a casing of the hydraulic pump.

[0013] The shaft 20 is formed in a cylindrical shape. In the present disclosure, the axial direction of the shaft 20 is parallel to the vertical direction. The shaft 20 is housed inside the cylindrical portion 11 of the case 10. The shaft 20 is provided so as to be able to advance and retreat along the axial direction of the cylindrical portion 11.

[0014] A permanent magnet 21 is provided at the upper axial end of the shaft 20. The permanent magnet 21 moves forward and backward in conjunction with the shaft 20. A Hall element 22 is provided on the outer surface of the cylindrical portion 11 of the case 10. The permanent magnet 21 and the Hall element 22 are provided at positions facing each other with the cylindrical portion 11 of the case 10 in between. The Hall element 22 detects the magnetic field of the permanent magnet 21 through the case 10 and outputs an electrical signal corresponding to the detected magnetic field.

[0015] In the sensor 1 configured as described above, the axial end of the shaft 20 is brought into contact with a piston, which is a swash plate mechanism (not shown) of the hydraulic pump. When the piston moves to change the swash plate angle of the hydraulic pump, the shaft 20 moves up and down. As the shaft 20 moves back and forth, the magnetic field change of the permanent magnet 21 is detected by the Hall element 22. In this way, the swash plate angle of the hydraulic pump is detected based on the electrical signal output from the Hall element 22.

[0016] The substrate 30 is a substrate on which various electronic components of the sensor 1 are provided. The substrate 30 is provided with a Hall element 22. The Hall element 22 is provided on the surface of the substrate 30. The substrate 30 is fixed to the outer peripheral surface of the case 10. The substrate 30 is provided on the upper axial side of the case 10. The substrate 30 is provided above the flange 12 of the case 10. In the present disclosure, the substrate 30 is provided perpendicular to the front-to-rear direction. The substrate 30 is connected to the connector 40 via a connector pin 42. The substrate 30 and the connector pin 42 are connected by soldering or the like.

[0017] Figure 4 is a partially enlarged cross-sectional view of the connector and the board, viewed from the left rear. As shown in Figure 4, in this disclosure, the connector 40 is a male connector. The connector 40 can be mated with a mating connector (not shown). In this disclosure, the mating direction of the mating connector is the forward direction. When the connector 40 is mated with the mating connector, the connector 40 and the mating connector are electrically connected. The connector 40 has a housing 41 and connector pins 42. The connector 40 is electrically connected to the board 30 via the connector pins 42.

[0018] The housing 41 is fixed to the upper end in the axial direction of the cylindrical portion 11 of the case 10. The housing 41 has a cylindrical portion 411 and a wall portion 412. The cylindrical portion 411 is formed in a cylindrical shape. In the present disclosure, the axial direction of the cylindrical portion 411 is parallel to the front-to-rear direction. The rear portion in the axial direction of the cylindrical portion 411 is fixed to the upper end in the axial direction of the cylindrical portion 11 of the case 10. A wall portion 412 is provided at the rear portion of the cylindrical portion 411. The wall portion 412 divides the interior of the cylindrical portion 411 in the front-to-rear direction.

[0019] The mating portion S1, which is the space in front of the wall portion 412 in the cylindrical portion 411, is mated with a mating connector. The front portions of the connector pins 42 are located in the mating portion S1. The mating portion S1 is open to the outside when not mated with the mating connector. The mating portion S1 is not exposed to the outside when mated with the mating connector.

[0020] The rear of the connector pin 42 is located in the filling section S2, which is a space behind the wall section 412 of the cylindrical section 411 and in front of the substrate 30. The filling section S2 faces the surface 30a, which is the front surface of the substrate 30 in the connector 40. The substrate 30 is provided in contact with the rear end of the cylindrical section 411. In the present disclosure, the substrate 30 is in contact with an upper end 415 and a lower end 416 of the cylindrical section 411. The filling section S2 is closed at the rear by the substrate 30 and is open on the right and left sides. The openings are referred to as inflow sections P. Resin is filled into the filling section S2 from the inflow section P.

[0021] In the present disclosure, at least two resin inflow portions P for filling the filling portion S2 between the wall portion 412 and the substrate 30 are arranged opposite to each other.

[0022] FIG. 5 is a partially enlarged view of the connector as seen from the left rear. FIG. 6 is a partially enlarged view of a cross section of the connector as seen from the left side. FIG. 7 is a partially enlarged view of the connector as seen from the rear. The connector 40 will be described using FIGS. 4 to 7. The board 30 is not shown in FIGS. 5 to 7. In the present disclosure, as shown in FIGS. 5 to 7, a recess 413 is provided in the wall portion 412. The recess 413 is provided on the side of the connector 40 facing the surface 30a (see FIG. 4) of the board 30. The recess 413 is provided on the opposite side of the mating portion S1 in the mating direction of the mating connector. The recess 413 opens toward the filling portion S2 (see FIG. 4) and is recessed toward the mating portion S1. In the present disclosure, the recess 413 is provided in the middle of the wall portion 412 in the left-right direction. The recess 413 extends in the up-down direction.

[0023] The wall portion 412 is provided with insertion holes 414 through which the connector pins 42 are inserted. In the present disclosure, the connector 40 is formed by insert molding, in which the connector pins 42 are placed in a mold in advance and resin is injected. As a result of being formed by insert molding, four insertion holes 414 are provided, the same number as the connector pins 42. When it is not necessary to distinguish between the four insertion holes 414, they will be described as insertion holes 414. In the present disclosure, the four insertion holes 414 are provided side by side, two in the left-right direction and two in the up-down direction. The insertion holes 414 are provided in a portion of the wall portion 412 other than the recessed portion 413. The connector pin 421 is inserted into the insertion hole 4141. The connector pin 422 is inserted into the insertion hole 4142. The connector pin 423 is inserted into the insertion hole 4143. The connector pin 424 is inserted into the insertion hole 4144.

[0024] The connector pins 42 electrically connect the substrate 30 and the connector 40. The connector pins 42 supply power to the Hall element 22 and output the electrical signal output from the Hall element 22 to the mating connector. A plurality of connector pins 42 are provided. In the present disclosure, four connector pins 42 are provided. When it is not necessary to distinguish between the four connector pins 421, 422, 423, and 424, they will be described as connector pins 42. In the present disclosure, the four connector pins 42 are provided in a row, two in the left-right direction and two in the up-down direction. The connector pins 42 are provided in a portion of the wall portion 412 other than the recessed portion 413. The connector pins 42 penetrate the wall portion 412. The axial front end of the connector pin 42 is exposed in the fitting portion S1. The axial front end of the connector pin 42 is electrically connected to the mating connector. The axial rear end of the connector pin 42 is exposed in the filling portion S2. The axial rear ends of the connector pins 42 are electrically connected to the substrate 30 .

[0025] Connector pin 421 is provided at the upper left. Connector pin 422 is provided at the lower left. Connector pin 423 is provided at the upper right. Connector pin 424 is provided at the lower right. Recesses 413 are located between connector pins 421 and 423 and between connector pins 422 and 424.

[0026] FIG. 8 is a partially enlarged cross-sectional view of the connector and the substrate as viewed from the upper left. FIG. 9 is a partially enlarged cross-sectional view of FIG. 8. The through-hole 43 serves as an escape route for air in the filling section S2 when the resin is injected. The through-hole 43 is provided at the end of the resin flow path in the filling section S2. In the present disclosure, the resin flows into the filling section S2 from inlet sections P on the right and left sides of the substrate 30. Therefore, the recess 413 located in the middle in the left-right direction is the end of the resin flow path. In the present disclosure, the through-hole 43 is provided at the front end of the recess 413.

[0027] The through hole 43 connects the recess 413 and the fitting portion S1. The through hole 43 connects the filling portion S2 and the fitting portion S1. The through hole 43 is provided by penetrating the wall portion 412. The through hole 43 extends in the front-to-rear direction. The diameter of the through hole 43 is smaller at the front end than at the rear end. The diameter of the through hole 43 is large enough to prevent resin from passing through but allow air to pass through.

[0028] The through holes 43 are provided between the connector pins 42. The through holes 43 are provided at positions different from the insertion holes 414 of the connector pins 42. The through holes 43 are located in the middle of the inlet sections P. In the present disclosure, the through holes 43 are located in the middle between the two inlet sections P. In the present disclosure, two through holes 43 are provided. When it is not necessary to distinguish between the two through holes 43, they will be described as through holes 43.

[0029] Through hole 431 is provided at the upper side. Through hole 431 is provided above connector pin 421 and connector pin 423. Through hole 432 is provided at the lower side. Through hole 432 is provided below connector pin 422 and connector pin 424.

[0030] The mold 50 defines a part of the outer shape of the sensor 1. The mold 50 is formed of a thermoplastic resin such as a hot melt. The mold 50 covers the assembled case 10, board 30, and connector 40 above the flange 12. The mold 50 fills the filling portion S2, the recess 413, and the through-hole 43.

[0031] [Method of forming connector through holes] FIG. 10 is a schematic diagram illustrating a method for molding a through hole in a connector. A method for molding through hole 43 in connector 40 will be described using FIG. 10. A description of the method for molding portions of connector 40 other than through hole 43 will be omitted. Connector 40 is molded using a mold 100. FIG. 10 shows a portion of mold 100 that corresponds to through hole 43 in housing 41 of connector 40. The shape of through hole 43 in housing 41 is defined by wall portion 101, protrusion 102, recess 103, wall portion 104, and columnar portion 105 of mold 100. Columnar portion 105 has a cylindrical main body 106, a conical tip portion 107, and a disk-shaped protrusion 108.

[0032] More specifically, wall portion 101 corresponds to the outer shape of the front side of wall portion 412 of housing 41. Protrusion 102 is provided to protrude from surface 101a of wall portion 101 toward wall portion 104. Protrusion 102 is provided at a position corresponding to through hole 43 of housing 41. Recess 103 is provided in protrusion 102. Recess 103 has a larger recess than protrusion 108. Protrusion 108 fits into recess 103. Wall portion 104 corresponds to the outer shape of recess 413 of housing 41. A pillar-shaped portion 105 is provided between wall portion 101 and wall portion 104. Pillar portion 105 corresponds to the outer shape of through hole 43 of housing 41. Tip portion 107 is provided at the tip of main body portion 106. The diameter of tip portion 107 decreases from main body portion 106 toward the tip. The protrusion 108 is provided at the tip of the tip portion 107. The protrusion 108 has a cylindrical shape with the same diameter as the tip of the tip portion 107. The protrusion 108 fits into the recess 103.

[0033] By molding using the mold 100 configured in this manner, the connector 40 having the through hole 43 shown in FIG. 11 is molded. More specifically, when the resin for molding the connector 40 is poured into the mold 100, the housing 40 having the through hole 43 is molded by the wall portion 101, the protrusion 102, the recess 103, the wall portion 104, and the columnar portion 105. By using such a mold 100, burrs that occur at the tip of the through hole 43 during molding of the housing 41 are guided toward the recess 103. This prevents the tip of the through hole 43 of the housing 41 from being blocked by burrs.

[0034] Fig. 11 is a schematic diagram illustrating a molding method. As shown in Fig. 11, the through hole 43 of the housing 41 molded using the mold 100 shown in Fig. 10 has a cylindrical main body portion 431, a conical tip portion 432, and a disk-shaped connecting portion 433. The tip portion 432 is provided at the tip of the main body portion 431. The diameter of the tip portion 432 decreases from the main body portion 431 toward the tip. The connecting portion 433 is provided at the tip of the tip portion 432. The connecting portion 433 is wider radially outward than the tip of the tip portion 432. The connecting portion 432 is connected to the fitting portion S1.

[0035] [Mold forming method and function] Fig. 12 is a schematic diagram illustrating the lower die of the mold. Fig. 13 is a schematic diagram illustrating the state in which the lower die and upper die of the mold are combined. The sensor 1 is in a state in which the case 10, shaft 20, substrate 30, and connector 40 are assembled. As shown in Fig. 12, the sensor 1, in which the mating connector, plug 60, is attached to the connector 40, is placed on the lower die 200. By attaching the plug 60 to the connector 40, the sensor 1 is positioned in the lower die 200. The lower die 200 is provided with a die 201 that abuts against the tip of the through hole 43.

[0036] 11, the shape of the metal mold 201 that is brought into contact with the tip of the through-hole 43 when filling the resin to form the mold 50 will be described. The end 201a of the metal mold 201 is provided shifted toward the fitting side with respect to the end S1a of the fitting portion S1. In other words, the end 201a of the metal mold 201 is spaced apart from the connecting portion 433 of the through-hole 43.

[0037] By using such a die 201 to form the mold 50, burrs generated at the tip of the through hole 43 are prevented from interfering with the die 201 during the formation of the mold 50. As a result, the burrs are crushed by the die 201, and are prevented from remaining in the fitting portion S1 of the connector 40.

[0038] 13, the upper mold 210 is assembled to the lower mold 200. The upper mold 210 and the lower mold 200 are fixed together by applying pressure.

[0039] Resin for forming the mold 50 is injected through the injection port 220 between the upper mold 210 and the lower mold 200. The injected resin covers the assembled case 10, board 30, and connector 40. The resin flows into the gaps between the case 10, board 30, and connector 40. As shown in FIGS. 8 and 9, the resin flows into the filling section S2 from inlet sections P on the right and left sides of the board 30. As the resin flows in, air escapes to the outside through gaps between the upper mold 210 and the lower mold 200. The air in the filling section S2 escapes through the through holes 43 to the mating section S1. This prevents air from accumulating in the filling section S2, allowing the resin to fill the filling section S2 without leaving any gaps. The injected resin then solidifies within several tens of seconds. The diameter of the tip 432 is molded to a diameter that allows air to escape but not resin to escape. Even if the resin flows out from the tip portion 432, the gap between the end portion 201a and the end portion S1a provides a gap to stop the resin from flowing out.

[0040] After the resin has solidified, the pressure is released and the upper mold 210 is removed from the lower mold 200. Then, the sensor 1 is taken out from the lower mold 200. In this way, the sensor 1 is produced.

[0041] [effect] In the present disclosure, the connector 40 is provided with a through hole 43 that connects the recess 413 facing the filling portion S2 and the mating portion S1 where the connector 40 mates with a mating connector. In the present disclosure, the through hole 43 is located at the end of a flow path for the resin used to form the mold 50. According to the present disclosure, when the resin used to form the mold 50 is injected, air in the filling portion S2 can be released through the through hole 43 to the mating portion S1. According to the present disclosure, air can be prevented from accumulating on the filling portion S2 side. In this way, the present disclosure can appropriately release air from inside the mold 50. The present disclosure can prevent a portion of the mold 50 from thinning due to air accumulating inside the mold 50. The present disclosure can increase the strength of the sensor 1.

[0042] In the present disclosure, the through hole 43 connects to a mating portion S1 where the connector 40 mates with a mating connector. In the present disclosure, the through hole 43 is not exposed to the outside when the connector 40 is mated with the mating connector. According to the present disclosure, it is possible to prevent water from entering the inside of the connector 40 through the through hole 43.

[0043] In the present disclosure, the through holes 43 are provided between the connector pins 42 that electrically connect the substrate 30 and the connector 40. In the present disclosure, the through holes 43 can be disposed in positions different from the connector pins 42. In the present disclosure, the through holes 43 can prevent air from accumulating in the filling portion S2 when injecting resin to form the mold 50.

[0044] In the present disclosure, the recess 413 is provided on the opposite side of the mating direction of the mating connector with respect to the mating portion S1. In the present disclosure, when injecting resin to form the mold 50, the recess 413 and the through-hole 43 allow air in the filling portion S2 to be released into the mating portion S1.

[0045] In the present disclosure, the through hole 43 is located midway between the multiple inlet portions P. In the present disclosure, when injecting resin to form the mold 50, the air in the filling portion S2 can be appropriately released into the fitting portion S1.

[0046] In the present disclosure, at least two resin inlet portions P are arranged opposite to the filling portion S2. According to the present disclosure, the resin for forming the mold 50 can be quickly filled into the filling portion S2.

[0047] In the above description, the inflow portions P to the filling portion S2 are located on the right and left sides of the substrate 30, but are not limited to this. For example, the inflow portions to the filling portion S2 may be provided by opening holes in the substrate 30.

[0048] In the above description, the number of through holes 43 is two, but this is not limiting. It is sufficient that one or more through holes 43 are provided.

[0049] Although the stroke sensor has been used in the above description, the present invention is not limited to this and other sensors, such as an electromagnetic solenoid, may also be used. [Explanation of symbols]

[0050] 1...sensor, 10...case, 11...cylindrical portion, 12...flange, 20...shaft, 21...permanent magnet, 22...Hall element, 30...substrate, 40...connector, 41...housing, 411...cylindrical portion, 412...wall portion, 413...recess, 414...insertion hole, 42...connector pin, 43...through hole, 50...mold, P...inlet portion, S1...fitting portion, S2...filling portion, 100...mold, 200...mold, 201...mold, 210...mold.

Claims

1. A sensor in which a substrate and a connector are integrated with resin, a connector pin that connects the board and the connector; a filling portion provided on a side of the connector facing the surface of the board, the filling portion being provided at a position facing the surface of the board in a mating direction with the mating connector; a through hole connecting the filling portion and a fitting portion where the connector fits with a mating connector; a wall portion interposed between the filling portion and the fitting portion; a recessed portion disposed on a surface of the wall portion facing the filling portion, the recessed portion being open toward the filling portion and recessed toward the fitting portion; Equipped with The through hole is disposed at an end of the recess on the fitting portion side. Sensor.

2. The through hole has a cylindrical main body portion, a conical tip portion provided at a tip of the main body portion, and a disk-shaped connecting portion provided at a tip of the tip portion, The tip portion has a diameter that decreases from the main body portion toward the tip, The connecting portion is wider radially outward than the tip of the tip portion and is connected to the fitting portion. The sensor of claim 1 .

3. The connector pins are provided in plurality, The through holes are provided between the connector pins. The sensor of claim 1 .

4. The filling portion is provided on the opposite side of the fitting portion in the fitting direction of the mating connector. A sensor according to any one of claims 1 to 3.

5. At least two resin inlet portions for filling the space between the filling portion and the substrate are disposed opposite to each other. A sensor according to any one of claims 1 to 4.

6. The through hole is located at the middle of the plurality of inlet portions. The sensor of claim 5.

7. the through-hole is located at an end of a flow path of the resin that has flowed from the inlet portion into the space; 7. The sensor according to claim 5 or 6.

8. The through hole is provided in the filling portion. A sensor according to any one of claims 1 to 7.

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