Adhesive sheet for fixing a polishing pad, adhesive sheet for fixing a polishing pad with release sheet, polishing pad with adhesive layer A, polishing pad with release sheet and adhesive layer A, and method for fixing a polishing pad to a surface plate

Abstract

To provide a double-sided adhesive sheet for fixing a polishing pad to a surface plate, which is an adhesive sheet for fixing a polishing pad for high-precision CMP processing, has an excellent adhesive feeling when applied, is easy to adjust the position when reapplied, has excellent air release properties, and is excellent in adhesive properties. The sheet-like substrate has adhesive layer A and adhesive layer B on each side, and a predetermined probe is brought close to adhesive layer A at a speed of 0.01 mm / sec, brought into contact with said adhesive layer A, and then peeled off at the same speed, so that the probe tack value is: (1) Apply a load of 0.5 N, contact for 1 second, and peel off the probe. The probe tack value PT(0.5,1) is 0.5 N / cm 2 ~2.5N / cm 2 ,and (2) Apply a load of 3.0 N, contact for 1 second, and peel off the probe. The probe tack value PT(3.0,1) is 5 N / cm 2 ~11N / cm 2 ,and (3) An adhesive sheet for fixing a polishing pad, wherein the value obtained by dividing the PT(3.0,1) by the PT(0.5,1) is 4 or more.

Description

[Technical Field]

[0001] The present invention relates to an adhesive sheet for fixing a polishing pad to a surface plate. The present invention also relates to an adhesive sheet with a release sheet, in which an adhesive layer for fixing a polishing pad to a surface plate is covered with a release sheet. The present invention also relates to a polishing pad with an adhesive layer, which has a specific adhesive layer and a polishing pad. The present invention also relates to a polishing pad with a release sheet and an adhesive layer, which has a release sheet, a specific adhesive layer, and a polishing pad. The present invention also relates to a method for fixing a polishing pad to a surface plate via a specific adhesive layer. [Background technology]

[0002] Recent developments in semiconductors have required higher integration and higher quality, and therefore higher polishing precision is also required for the wafers that are the raw materials.In addition to simple abrasive excavation, there are also polishing methods such as CMP (Chemical Mechanical Polishing), which utilize chemical reactions to alter only the surface.In CMP as well, development of methods to obtain even smoother polished surfaces than before is progressing. A double-sided adhesive sheet is used to attach the polishing pad to the surface plate. Specifically, one side of the double-sided adhesive sheet is attached to one side of the polishing pad (the side opposite to the side intended to polish the object to be polished), and a polishing pad with a single-sided adhesive layer is prepared in advance, and the adhesive layer of the polishing pad with the single-sided adhesive layer is attached to the surface plate.

[0003] Various adhesive sheets for fixing polishing pads have been proposed (Patent Documents 1 to 3, etc.). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-122069 [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-168714 [Patent Document 3] Japanese Patent Application Laid-Open No. 2012-057135 Summary of the Invention [Problem to be solved by the invention]

[0005] Various polishing pads are required depending on the stage of polishing, and polishing pads used for final polishing in particular have increasingly complex structures, with layers of various hardness and thicknesses. The more complex the polishing pad structure, the more difficult it becomes to attach the polishing pad to the surface plate. When attaching a highly multi-layered, thick polishing pad with a single-sided adhesive layer to a surface plate, in order to attach it to the desired position, it is often necessary to temporarily attach it, check the position, peel it off, and then re-attach it, thereby adjusting the position. The most desirable polishing pad is one that has just the right amount of tack when aligning the pad, a comfortable adhesive feel (meaning it is difficult for gaps to form between the adhesive layer and the pad, and even if gaps do form, they naturally disappear), and excellent adhesion after bonding. From the viewpoint of improving productivity, it is desirable to minimize the number of times that repositioning is required and to shorten the time as much as possible. The use of an adhesive layer with low adhesive strength is effective in terms of ease of repositioning. However, the adhesive layer used to secure the polishing pad to the platen must have strong adhesive strength and cohesion (holding power) to withstand polishing.

[0006] Furthermore, even if a polishing pad with a single-sided adhesive layer can be quickly temporarily fixed to the desired position on the surface plate, there is a problem of air getting trapped between the surface plate and the adhesive layer when the polishing pad is firmly fixed to the surface plate using a roller or press. If air gets trapped between the surface plate and the adhesive layer and remains locally, the parallelism between the outermost surface of the polishing pad and the surface of the surface plate is lost, making it impossible to polish the object to be polished smoothly with high precision, which affects the polishing accuracy. One way to prevent air entrapment is to create grooves on the surface of the adhesive layer that comes into contact with the surface platen to allow air to pass through. However, even if air channels are created, when the polishing pad is firmly fixed to the surface platen, the soft adhesive layer can block the air channels, making it impossible to completely remove voids, or if it takes a long time for the air to escape, slowing down the semiconductor production speed.

[0007] The adhesive layer of the adhesive sheet that makes up the double-sided adhesive sheet used to secure the polishing pad to the surface plate must have strong adhesive strength, cohesive strength (holding power) that can withstand the shear forces applied during the polishing process, and chemical resistance, such as strong alkali and strong acid resistance, to the polishing solution used during polishing.

[0008] The present invention has been made in view of the above background, and aims to provide a double-sided adhesive sheet for fixing a polishing pad to a base plate, which is intended for high-precision CMP processing and has an excellent adhesive feel when applied, is easy to adjust the position when re-applied, has excellent air release properties, and has excellent adhesive properties. [Means for solving the problem]

[0009] The present invention has solved the above problems by setting the probe tack value of the adhesive layer on the side that is attached to the surface plate within a predetermined range. That is, the present invention relates to the following [1] to

[14] .

[0010] [1] The present invention provides a sheet-like substrate having an adhesive layer A and an adhesive layer B on each side thereof, The adhesive sheet for fixing a polishing pad has a probe tack value that satisfies the following conditions (1) to (3) when a stainless steel cylindrical probe having a diameter of 5 mm is brought into contact with the adhesive layer A at a speed of 0.01 mm / sec and then pulled away at the same speed. (1) Apply a load of 0.5 N, contact for 1 second, and peel off the probe. The probe tack value PT(0.5,1) is 0.5 N / cm 2 ~2.5N / cm 2 is. (2) Apply a load of 3.0 N, contact for 1 second, and peel off the probe. The probe tack value PT(3.0,1) is 5 N / cm 2 ~11N / cm 2 is. (3) The value obtained by dividing the probe tack value PT(3.0,1) by the probe tack value PT(0.5,1) is 4 or more.

[0011] [2] The present invention relates to an adhesive sheet for fixing a polishing pad according to [1] above, which satisfies the following conditions (4) and (5) when a stainless steel cylindrical probe having a diameter of 5 mm is brought close to the adhesive layer A at a speed of 0.01 mm / sec, a load of 0.5 N is applied, the probe is kept in contact with the adhesive layer A for 10 seconds, 30 seconds, and 60 seconds, and the probe is peeled off at the same speed, with the probe tack values ​​being PT(0.5,10), PT(0.5,30), and PT(0.5,60), respectively. (4) The value obtained by dividing the probe tack value PT(0.5,30) by the probe tack value PT(0.5,10) is 1 to 1.4. (5) The value obtained by dividing the probe tack value PT(0.5,60) by the probe tack value PT(0.5,10) is 1 to 1.6.

[0012] [3] The present invention relates to an adhesive sheet for fixing a polishing pad according to [1] or [2], characterized in that the surface of the adhesive layer A that is not in contact with the sheet-like substrate has irregularities, and the average height Rc of the surface irregularities of the adhesive layer A is 10 to 40 μm.

[0013] [4] The present invention relates to an adhesive sheet for fixing a polishing pad according to any one of [1] to [3] above, characterized in that the cut level difference Rδc of the contour curve of the surface irregularities of the adhesive layer A is 5 to 25 μm, and the kurtosis Rku is less than 3.

[0014] [5] The present invention relates to the pressure-sensitive adhesive sheet for fixing a polishing pad according to any one of [1] to [4] above, wherein the shape of the convex portions on the surface of the pressure-sensitive adhesive layer A in plan view is irregular and shapeless.

[0015] [6] The present invention relates to the pressure-sensitive adhesive sheet for fixing a polishing pad according to any one of [1] to [5] above, wherein the pressure-sensitive adhesive layer A is an acrylic pressure-sensitive adhesive layer.

[0016] [7] The present invention provides an adhesive sheet for fixing a polishing pad with a release sheet FA, comprising the adhesive sheet for fixing a polishing pad according to any one of [1] to [6] above and a release sheet FA, The surface of adhesive layer A contacts the release surface of release sheet FA, This relates to an adhesive sheet for fixing a polishing pad with a release sheet FA, characterized in that the material of the release sheet FA is a plastic film that does not contain paper.

[0017] [8] The present invention provides a polishing pad fixing adhesive sheet with a release sheet FA according to the above [7], and a release sheet FB, The release sheet FB is in contact with the surface of the adhesive layer B that is not in contact with the sheet-like substrate, The present invention relates to an adhesive sheet for fixing a polishing pad with a release sheet FA and a release sheet FB, characterized in that the material of the release sheet FB is a plastic film that does not contain paper.

[0018] [9] The present invention relates to an adhesive sheet for fixing a polishing pad with a release sheet FA according to the above [7], which is wound into a roll and has a width of 1000 mm or less.

[0019]

[10] The present invention relates to an adhesive sheet for fixing a polishing pad with the release sheet FA and release sheet FB according to [8] above, which is wound into a roll and has a width direction length of 1000 mm or less.

[0020]

[11] The present invention relates to an adhesive sheet for fixing a polishing pad with the release sheet FA and release sheet FB according to the above item [8], which has a short side length of 1000 mm or less.

[0021]

[12] The present invention provides a polishing pad with an adhesive layer, comprising a polishing pad and the adhesive sheet for fixing a polishing pad according to any one of [1] to [6] above, The polishing pad has an adhesive layer A, and the adhesive layer B is in contact with the polishing pad.

[0022]

[13] The present invention provides a polishing pad with an adhesive layer, comprising a polishing pad and an adhesive sheet for fixing a polishing pad with the release sheet FA described in [7] above, The polishing pad is provided with a release sheet FA and an adhesive layer A, in which the polishing pad and the adhesive layer B are in contact with each other.

[0023]

[14] The present invention relates to a method for removing the release sheet FA from the polishing pad with the release sheet FA and adhesive layer A described in

[13] above, and fixing the polishing pad to a surface plate via the adhesive layer A. [Effects of the Invention]

[0024] According to the present invention, there is provided a double-sided pressure-sensitive adhesive sheet for fixing a polishing pad to a surface plate, which is easy to reposition, provides a comfortable adhesive feel, has excellent air release properties, and has excellent adhesive properties and chemical resistance, such as resistance to strong alkalis and strong acids. The pressure-sensitive adhesive sheet for fixing a polishing pad of the present invention can improve workability during application and can significantly improve polishing accuracy in high-precision CMP processing. Furthermore, the pressure-sensitive adhesive sheet for fixing a polishing pad of the present invention is unlikely to leave an adhesive layer on the surface plate when the polishing pad is peeled off from the surface plate after polishing. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a schematic cross-sectional view showing an embodiment of an adhesive sheet for fixing a polishing pad and its usage. [Figure 2] 1 is an image diagram illustrating the unevenness (cross section) of the surface of adhesive layer A. FIG. [Figure 3] 1 is an image diagram illustrating the unevenness (cross section) of the surface of adhesive layer A. FIG. [Figure 4] 1 is an example of an image illustrating the unevenness of the surface of adhesive layer A. [Figure 5] 1 is an image diagram for explaining the unevenness (plan view) of the surface of adhesive layer A. FIG. [Figure 6] 1 is a cross-sectional schematic diagram showing an example of a method for manufacturing an adhesive sheet for fixing a polishing pad, and a usage form of the adhesive sheet for fixing a polishing pad. [Figure 7] FIG. 1 is a schematic diagram for explaining a method for evaluating lamination workability. [Figure 8] FIG. 2 is a schematic diagram illustrating a method for evaluating air release properties. DETAILED DESCRIPTION OF THE INVENTION

[0026] An example of an embodiment to which the present invention is applied will be described below. Note that in this specification, the numerical values ​​"A to B" indicate a numerical value of A or more and B or less.

[0027] <Adhesive sheet for fixing polishing pads> As shown in Figure 1-1, the adhesive sheet 1 for fixing a polishing pad of the present invention (hereinafter also referred to as adhesive sheet) comprises an adhesive layer A and an adhesive layer B on both sides of a sheet-like substrate F. The surface of adhesive layer A (the surface not in contact with the sheet-like substrate F) has a specific probe tack value. In order to protect the surface of adhesive layer A, the surface of adhesive layer A is covered with the release surface of release sheet FA, and the adhesive sheet 2 for fixing a polishing pad is provided with release sheet FA. The adhesive sheet 2 for fixing a polishing pad with release sheet FA can be provided in two forms: one in which the surface of adhesive layer B (the side not in contact with sheet-like substrate F) is covered with release sheet FB, as shown in Figure 1-2, and one in which no release sheet FB is provided to cover the surface of adhesive layer B, as shown in Figure 1-3. In the form of Figure 1-3, the adhesive sheet 2 for fixing a polishing pad with release sheet FA is wrapped around a cylindrical member called a core (also called a core material), as shown in Figure 1-3', and the surface of adhesive layer B is covered with the other side of release sheet FA (the side not in contact with adhesive layer A). As shown in Figure 1-4, a polishing pad PP is laminated in advance on adhesive layer B of adhesive sheet 2 for fixing a polishing pad with release sheet FA, to form polishing pad 4 with release sheet FA and adhesive layer A. Next, release sheet FA is peeled off to expose adhesive layer A, and polishing pad 3 with adhesive layer A is attached to a surface plate SP. Adhesive layer A of adhesive sheet 1 for fixing a polishing pad contacts the surface plate, and adhesive layer B contacts the polishing pad. That is, the polishing pad PP is fixed to the platen SP via the adhesive sheet 1 having a laminated structure of adhesive layer A / sheet-like substrate F / adhesive layer B.

[0028] When attaching the polishing pad PP to a surface platen via the adhesive sheet 1, in many cases, the polishing pad PP has been attached by gently bending and flexing it while slowly squeezing the surface of the polishing pad PP from the edges with a roll or squeegee, squeezing the surface of the polishing pad PP from the edges to push out the air from the edges. When attaching the adhesive layer A to the surface platen, if the adhesive sheet becomes distorted or an uneven force is applied to the adhesive sheet, a large air pocket will occur locally between the surface platen SP and the adhesive layer A. Recently, polishing pads PP have tended to become thicker, extremely hard, or extremely soft. A thicker or extremely hard polishing pad PP is too rigid and cannot be bent as before, making it impossible to fully apply a pressing roll or squeegee to the surface of the polishing pad PP. On the other hand, extremely softened PP polishing pads are prone to bending and flexing, making it difficult to maintain the bent state when squeezing the surface of the polishing pad with a roll or squeegee. In either case, the air at the adhesion interface cannot be quickly expelled or evenly distributed across the entire interface, and large air pockets tend to remain in localized areas. Furthermore, when squeezing the surface of the polishing pad PP with a roll or squeegee, pressure is applied locally to the surface of the polishing pad PP. Although the pressure is applied sequentially to the entire surface of the polishing pad, there is also a demand to avoid applying too much force to the surface of the polishing pad PP, since this is the surface that will come into contact with the object to be polished (the workpiece).

[0029] <Probe tack value> The surface of the adhesive layer A in the adhesive sheet of the present invention (the surface that will come into contact with the platen SP) has a specific probe tack value. The probe tack value is the tack (instantaneous adhesive strength) that occurs when a cylindrical probe is brought into contact with a test object for a short time and then peeled off. In the present invention, a Tack Tester T-500 manufactured by UBM is used to measure the probe tack value, and the adhesive sheet fixing jig, probe temperature, and measurement environment temperature are 23°C. The probe is made of stainless steel with a diameter of 5 mm, and the average height Rc of the surface that will come into contact with the test object is 0.5 μm or less. In addition, the probe speed when approaching the test object and peeling it off after contact is 0.01 mm / s. It was decided.

[0030] It is important that the adhesive layer A on one side of the adhesive sheet of the present invention satisfies all of the following conditions (1) to (3). (1) Apply a load of 0.5 N, contact for 1 second, and peel off the probe. The probe tack value PT(0.5,1) is 0.5 N / cm 2 ~2.5N / cm 2 is. (2) Apply a load of 3.0 N, contact for 1 second, and peel off the probe. The probe tack value PT(3.0,1) is 5 N / cm 2 ~11N / cm 2 is. (3) The value obtained by dividing the probe tack value PT(3.0,1) by the probe tack value PT(0.5,1) is 4 or more.

[0031] The probe tack value PT(0.5,1) when a load of 0.5N is applied is 0.5 to 2.5N / cm 2 As mentioned above, it is important that the resistance is 0.5 to 2 N / cm 2 It is preferable that the resistance is 0.5 to 1.5 N / cm 2 It is more preferable that: Having a probe tack value PT (0.5, 1) within the above range makes it easy to align the film when it is attached to a surface plate (also known as temporary attachment or temporary fixation), and even if air gets trapped at the interface during attachment (full attachment), it can be quickly pushed out, resulting in excellent attachment workability.

[0032] The probe tack value PT(3.0,1) when a load of 3.0 N is applied is 5 to 11 N / cm 2 As mentioned above, it is important that the strength is 6 to 10 N / cm 2 Preferably, the strength is 8 to 10 N / cm 2 It is more preferable that: By having the probe tack value PT(3.0,1) within the above range, the adhesive sheet is firmly fixed to the surface plate, preventing the polishing pad from shifting during polishing, improving chemical resistance and polishing accuracy, and allowing the sheet to be easily peeled off after polishing is complete without leaving any adhesive residue.

[0033] Furthermore, it is important that the value obtained by dividing the probe tack value PT(3.0,1) by the probe tack value PT(0.5,1), PT(3.0,1) / PT(0.5,1), is 4 or greater, and preferably 5 or greater. Having PT(3.0,1) / PT(0.5,1) 4 or greater ensures ease of attachment to a polishing device during temporary fixation and satisfactory polishing performance.

[0034] Furthermore, when a load of 0.5 N is applied to the adhesive layer A on one side of the adhesive sheet of the present invention, the adhesive layer A is kept in contact with the adhesive for 10 seconds, 30 seconds, and 60 seconds, and then peeled off at the same speed, the probe tack values ​​are PT(0.5,10), PT(0.5,30), and PT(0.5,60), respectively. (4) The value obtained by dividing the probe tack value PT(0.5,30) by the probe tack value PT(0.5,10) is preferably within a range of 1 to 1.4, and more preferably 1 to 1.2. moreover, (5) The value obtained by dividing the probe tack value PT(0.5,60) by the probe tack value PT(0.5,10) is preferably within a range of 1 to 1.6, and more preferably 1 to 1.4. By ensuring that PT(0.5,10), PT(0.5,30), and PT(0.5,60) are within the ranges (4) and (5) above, it becomes easier to adjust the position by peeling off the adhesive sheet and re-applying it even if some time has passed since the adhesive sheet touched the surface plate, which broadens the range of control for the position adjustment work and increases the degree of freedom.

[0035] The pressure-sensitive adhesive sheet for fixing a polishing pad of the present invention can be attached to a surface plate with a feeling of sticking to it, and the surface of the pressure-sensitive adhesive layer A preferably has irregularities so that alignment can be easily performed. The shape of the irregularities (cross section) on the surface of the adhesive layer A will be described. From the viewpoint of improving alignment, it is preferable that the top of the convex portion be gently rounded as shown in Figure 2-1 rather than flat as shown in Figure 2-2. Also, in order to achieve a sticky feel, Figure 2-1, which has a wider recess in adhesive layer A, is preferable to Figure 2-2. Figure 2-3 has a wider recess in adhesive layer A than Figure 2-2, which ensures a flow path for air during application and is expected to improve the sticky feel somewhat. However, the wider recess in adhesive layer A may result in a decrease in polishing accuracy.

[0036] Therefore, to improve alignment and achieve a sticky feel without reducing polishing accuracy, the average height Rc of the roughness curve elements on the surface of the adhesive layer A (hereinafter referred to as "average height Rc") is preferably 10 to 40 μm, more preferably 15 to 35 μm, and even more preferably 20 to 30 μm. An average height Rc of 10 μm or more results in relatively deep recesses, making it easier for the probe tack value under each condition to fall within a preferred range, improving alignment and the sticky feel. Furthermore, maintaining a constant air flow path makes it easier to peel the polishing pad and adhesive sheet from the surface plate after polishing is completed. An average height Rc of 40 μm or less improves polishing accuracy on the surface plate.

[0037] The shape of the unevenness on the surface of the adhesive layer A in the present invention, such as the roundness and inclination of the convex parts and the spacing between the convex parts, can be more specifically understood from two parameters: the difference in cutting level of the contour curve: Rδc and the kurtosis: Rku. Rδc is preferably 5 to 25 μm, more preferably 10 to 20 μm, and even more preferably 12.5 to 19.0 μm. Rδc is the difference in height level that corresponds to any two load length ratios from a load curve (a curve in which the ratio of the solid body length to the measured length is plotted in order of height), and in the present invention, the two load length ratios are defined as 0% and 50%. By setting Rδc to 5 μm or more, air pockets are less likely to form in the very early stages of application, and the tops of the convex portions of adhesive layer A come into loose (light) contact with the surface plate. In other words, the adhesive layer does not adhere very firmly to the surface plate, so when peeling adhesive layer A from the surface plate once it has come into contact with it, it can be peeled off with little resistance, making it easier to adjust the position. Incidentally, because adhesive layer A is adhesive, it is thought that it will deform to some extent when it is attached to a surface plate. In other words, it is thought that, microscopically, the convex parts on the surface of adhesive layer A will be crushed, albeit slightly, during attachment, and the concave parts will become somewhat shallower in comparison. By setting Rδc to 25 μm or less, adhesive layer A will be less likely to be crushed when it is firmly attached to the surface plate, preventing excessive tack, while maintaining the depth of the concave parts and preserving the air flow path.

[0038] Furthermore, the kurtosis (Rku) of the surface of the adhesive layer A is preferably less than 3. An Rku of less than 3 indicates a rounded convex shape. By contacting the rounded tops of the convex portions with the surface plate during application, alignment can be performed with a feeling of adhesion. In particular, an Rku in the range of 1.5 or more and less than 3 is particularly preferable because it improves workability during alignment and provides strong adhesion when firmly pressed against the surface to prevent problems such as peeling during polishing.

[0039] Rc, Rδc, and Rku will be explained using a schematic diagram. Figures 2-1, 2-4, and 2-5 show cases where Rc is about the same. If Figure 2-1 shows a case where Rδc is 5 to 25 μm and Rku is less than 3, in the case of Figure 2-4, where the slope of the convex part is steeper than in Figure 2-1, Rδc is larger than in Figure 2-1, and Rku is less than 3. Similarly, in Figure 2-5, where the slope of the convex part is steeper than in Figure 2-1, Rδc is larger than in Figure 2-1, and because the top of the convex part is pointed, Rku is larger than 3. Also, Figures 2-6 and 2-7 imagine a case where Rc is about the same as in Figure 2-1, but because the spacing between the protrusions and recesses is wider than in Figure 2-1, Rδc is smaller than in Figure 2-1, and in Figure 2-6 Rku is 3 smaller, while in Figure 2-7 Rku is greater than 3.

[0040] Rc, Rδc, and Rku are values ​​measured based on JIS B 0601 (2013) and can be measured using a digital microscope (Keyence VHX-7000). Specifically, at 400x magnification, five images are taken continuously in each direction across a field of view approximately 460 μm long and 640 μm wide (25 images in total), and the entire observation field is defined as an area of ​​approximately 2300 μm long and 3200 μm wide. The measurement field is defined as an area of ​​approximately 1840 μm long and 2560 μm wide in the center of the entire observation field. Rc, Rδc, and Rku are measured along two diagonals of the measurement field, and the average values ​​are calculated. The same applies to the measurement of Rc etc. of the release sheet FA described later.

[0041] Unlike the so-called "matt" unevenness intended to provide an optically matte finish, the unevenness on the surface of the adhesive layer A in the present invention is large and rough. An image of the unevenness on the surface of the adhesive layer A in the present invention is shown in Figure 3-1, and an image of the so-called "matt" unevenness is shown in Figure 3-2. Rc, Rδc, and Rku in the above ranges represent an ideal shape, with a larger difference in height between the concaves and convexes and a wider spacing between the concaves and convexes than the so-called "matt" that is generally known for its optically matte finish, allowing for initial positioning adjustment, air release during application, and fixing the polishing pad to the surface plate in a parallel and smooth manner.

[0042] The unevenness (plan view) on the surface of the adhesive layer A will be described. The unevenness (in plan view) on the surface of the adhesive layer A in the present invention may be a regular pattern or design such as a lattice pattern or polka dot pattern, but is preferably irregular and amorphous as shown below. An example of an image of the surface of adhesive layer A observed with a laser microscope is shown in Figure 4. The black parts in the upper images of Figures 4-1 and 4-2 are convex parts, which are irregular and amorphous in plan view. Examples of irregular and amorphous patterns and designs in the present invention include patterns and designs such as those shown in Figures 5(1) to (4). Figure 5(1) is sometimes called sand grain, leather grain, rock grain, pebble grain, or matte. Figure 5(2) is a type of ink-like pattern and design called mottling in the field of ink and paint. Figure 5(3) is also called mottling, but is a pattern and design seen on decorative stickers for plastic models, etc. Figure 5(4) is sometimes called a Dalmatian pattern. In the patterns and designs shown in Figures 5(1) to (4), there is no regularity in the position of either the convex parts (black parts) or the concave parts (white parts), and no regularity can be recognized in the shape either.

[0043] As long as the probe tack value of the surface of adhesive layer A is within the above range, whether the shape of the unevenness in plan view is irregular and amorphous or regular and regular, there is no difference in terms of positioning when applying to a surface plate or the feeling of adhesion. However, an irregular and irregular pattern or design in plan view makes it easier to reduce bias in the force applied during application and makes it easier to apply evenly. Furthermore, even if unevenness occurs on adhesive layer A to a degree that does not affect performance, an irregular and irregular pattern or design in plan view is preferable in that it is less noticeable.

[0044] The following methods can be used to obtain an adhesive layer A having a probe tack value within a predetermined range. That is, a release sheet FA' having a release layer is prepared, and then, as shown in Figure 6-1, the release sheet FA' is passed at high temperature between a metal roll R1 and a rubber roll R2, which have been processed to the desired surface shape, thereby inverting and transferring the surface shape of the metal roll R1 to produce a release sheet FA having irregularities with an average height Rc of 12 to 42 μm. Note that when the surface shape of the release sheet FA is inverted and transferred by the rotation of the metal roll R1, the surface shape will have a certain periodicity, but this periodicity is different from the regularity in the plan view described above.

[0045] and, (1) Adhesive a is applied onto the release layer of the release sheet FA and dried as necessary to form adhesive layer A. (2) A sheet-like substrate is placed on the surface of the adhesive layer A that is not in contact with the release sheet FA. (3) The adhesive b is applied to the release-treated surface of the release sheet FB and dried as necessary to form an adhesive layer B. (4) The surface of the sheet-like substrate that is not in contact with the adhesive layer A is coated with the adhesive layer B. The surface not in contact with the release sheet FB is overlapped. As a result, an adhesive sheet for fixing a polishing pad with a release sheet FA and a release sheet FB having a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB] as shown in Figure 6-2 can be produced.

[0046] or, (5) An adhesive agent a is applied to one surface of the sheet-like substrate and dried as necessary to form an adhesive layer A. (6) The surface of the adhesive layer A that is not in contact with the sheet-like substrate is overlaid with the surface of a release sheet FA that has been subjected to a release treatment and has an average height Rc of the irregularities on the surface of 12 to 42 μm. (7) The adhesive b is applied to the release-treated surface of the release sheet FB and dried as necessary to form an adhesive layer B. (8) The surface of the sheet-like substrate that is not in contact with the adhesive layer A is superimposed on the surface of the adhesive layer B that is not in contact with the release sheet FB. Using this method, it is possible to produce an adhesive sheet for fixing a polishing pad with a release sheet FA and a release sheet FB having a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB] as shown in Figure 6-2.

[0047] or, (9) The adhesive b is applied to the release-treated surface of the release sheet FB and dried as necessary to form an adhesive layer B. (10) A sheet-like substrate is placed on the surface of the adhesive layer B that is not in contact with the release sheet FB. (11) An adhesive agent a is applied to the release-treated surface of a release sheet FA having an average height Rc of the irregularities on the release-treated surface of 12 to 42 μm, and dried as necessary to form an adhesive layer A. (12) The surface of the adhesive layer A that is not in contact with the release sheet FA is superimposed on the surface of the sheet-like substrate that is not in contact with the adhesive layer B. Using this method, it is possible to produce an adhesive sheet for fixing a polishing pad with a release sheet FA and a release sheet FB having a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB] as shown in Figure 6-2. In either case, it is preferable that the surface of adhesive layer B (the surface that will come into contact with the polishing pad) is free of irregularities, and therefore the release surface of release sheet FB onto which adhesive b is applied is preferably smooth.

[0048] The adhesive can be applied by a known method such as a roll coater method, a comma coater method, a lip coater method, a die coater method, a reverse coater method, a silk screen method, a gravure coater method, etc. After application, the adhesive can be dried using a hot air oven, an infrared heater, or the like.

[0049] By peeling off the release sheet FB from the adhesive sheet 2 for fixing a polishing pad, which has a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB] obtained by various methods, and attaching the polishing pad PP to the exposed adhesive layer B as shown in Figure 6-3, a polishing pad 4 with a release sheet FA and adhesive layer A, which has a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / polishing pad PP], can be obtained. Next, by peeling off the release sheet FA that covered the adhesive layer A from the resulting polishing pad 4 with the release sheet FA and adhesive layer A, the unevenness of the release sheet FA is inversely transferred to the adhesive layer A, resulting in an adhesive layer A with the desired probe tack value and surface unevenness. Then, as shown in Figure 6-4, by attaching the exposed adhesive layer A to a surface plate SP, the polishing pad PP can be fixed to the surface plate SP via the adhesive sheet 1.

[0050] In addition to the transfer method described above, another method for forming an adhesive layer A with the desired roughness is to eject adhesive onto the surface of an adhesive layer with a smooth surface using an inkjet, create a pattern with the desired surface shape, and then dry and harden it. Alternatively, the desired roughness can be obtained by pressing a metal plate having the desired roughness against a smooth adhesive layer at a high temperature. Alternatively, the surface of the smooth adhesive layer can be processed by laser to burn off a part of the adhesive layer. Among the above, the method of forming an adhesive layer on a release sheet having the desired unevenness and transferring the unevenness of the release sheet to the adhesive layer to obtain adhesive layer A is preferred because it provides stable production quality and fast production speed.

[0051] <Adhesive layer> In the pressure-sensitive adhesive sheet for fixing a polishing pad of the present invention, the pressure-sensitive adhesive layer A and the pressure-sensitive adhesive layer B are located on the outermost surfaces of the pressure-sensitive adhesive sheet, respectively. The sheet-like substrate may be a single layer or may be a laminate of various members, and the number of layers is not particularly limited. The thickness of the adhesive layer A of the adhesive sheet for fixing a polishing pad is preferably 15 to 100 μm, more preferably 30 to 70 μm. By making the thickness of the adhesive layer A 15 μm or more, adhesive strength is easily exerted, and by making it 100 μm or less, the desired uneven shape of the present invention is easily formed. A thickness within this more preferred range provides excellent adhesiveness and prevents the adhesive layer from shifting in the shear direction when the adhesive sheet becomes hot during polishing. The thickness is the average value measured at five random points using a Mitutoyo Litematic VL-50B thickness gauge with a 7.5 mm diameter probe at a pressure of 0.01 N. The thickness of adhesive layer B is not particularly limited as long as it can fix various polishing pads, but by making the combined thickness of adhesive layer A excluding the thickness of the base layer 200 μm or less, the proportion of the adhesive layer, which is a low-elastic material, in the entire adhesive sheet is reduced, thereby improving polishing accuracy.

[0052] In order to achieve a specific probe tack value, the adhesive layer A preferably has a tensile storage modulus in the following range: Specifically, the storage modulus Er' in the tensile direction at 25°C is 1×10 4 ~1×10 6 Pa is preferred, 2 x 10 4 ~9×10 5 Pa is more preferable, 3 × 10 4 ~6×10 5 Pa is particularly preferred. Er' is 1×10 4 By ensuring a resistance of 1×10 Pa or more, collapse is suppressed and it becomes easier to ensure an air flow path to eliminate voids. 6 Pa or less, it ensures excellent wetting properties for various types of surface plates, giving a sticky feeling, and its excellent adhesive strength prevents slippage and peeling during polishing.

[0053] The adhesive layers A and B of the adhesive sheet of the present invention can be made of acrylic adhesives, elastomer adhesives, urethane adhesives, or silicone adhesives, and two or more types may be used in combination. Acrylic adhesives are preferred from the viewpoints of less gel formation, less likelihood of local differences in elastic modulus, and ease of control of adhesive strength. Elastomer-based and urethane-based adhesives often use metal catalysts during synthesis, and silicone-based adhesives often use metal catalysts during curing. However, acrylic adhesives contain a low amount of metal catalyst, making them less likely to affect CMP processing and more chemically resistant, making them preferable. Furthermore, for adhesive layer B, it is preferable to select an acrylic adhesive with a wide variety of monomer species in order to accommodate the wide variety of polishing pad materials.

[0054] <Acrylic adhesive> The acrylic adhesive contains an acrylic copolymer and a curing agent. The acrylic copolymer preferably has a carboxyl group or a hydroxyl group, and is more preferably a (meth)acrylate resin having a hydroxyl group.

[0055] <(Meth)acrylate resin> The (meth)acrylate resin is obtained by copolymerizing a monomer having a hydroxyl group with another monomer not having a hydroxyl group, i.e., the (meth)acrylate resin is a copolymer consisting of a unit derived from the monomer having a hydroxyl group and a unit derived from the other monomer.

[0056] Examples of the monomer having a hydroxyl group include hydroxyalkyl (meth)acrylate and a compound in which ε-caprolactone is added to the hydroxyalkyl (meth)acrylate, with hydroxyalkyl (meth)acrylate being preferred.

[0057] Specific examples of hydroxyalkyl (meth)acrylates include hydroxyalkyl (meth)acrylates in which the alkyl group has 1 to 4 carbon atoms, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Specific examples of compounds in which ε-caprolactone is added to hydroxyalkyl (meth)acrylates include ε-caprolactone adducts of hydroxyalkyl (meth)acrylates having 1 to 4 carbon atoms, such as an ε-caprolactone 1-mol adduct of 2-hydroxyethyl (meth)acrylate, an ε-caprolactone 2-mol adduct of 2-hydroxyethyl (meth)acrylate, and an ε-caprolactone 3-mol adduct of 2-hydroxyethyl (meth)acrylate, but the present invention is not limited to these examples. These hydroxyl group-containing monomers may be used alone or in combination. 2-Hydroxyethyl (meth)acrylate is particularly preferred from the viewpoint of improving chemical resistance due to the relatively short intermolecular distance when crosslinked with an isocyanate curing agent.

[0058] Examples of other monomers not having a hydroxyl group include the following various monomers: Examples of alkyl (meth)acrylates include alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, isoamyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isononyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, and tert-butylhexyl (meth)acrylate, as well as 2-acetoacetoxyethyl (meth)acrylate and phenoxyethyl (meth)acrylate. Ethyl acrylate is preferably copolymerized because it has appropriate rigidity and flexibility and is likely to exhibit cohesive strength and a desirable tackiness. The amount of ethyl acrylate is preferably 10% by mass or less, more preferably 1 to 9% by mass, and even more preferably 3 to 8% by mass, based on 100% by mass of the monomers used in the copolymerization.

[0059] The weight-average molecular weight (Mw) of the acrylic copolymer is preferably 200,000 to 1,500,000, and more preferably 500,000 to 1,000,000. When the weight-average molecular weight (Mw) is 200,000 or more, the adhesive can easily obtain cohesive strength capable of withstanding strong shearing force, and when it is 1,500,000 or less, the adhesive has excellent heat resistance and adhesion to the abrasive is less likely to decrease, and when it is in the more preferred range, performance is improved.

[0060] Examples of methods for polymerizing the monomer include solution polymerization, bulk polymerization, suspension polymerization, and emulsion polymerization, but the present invention is not limited to these polymerization methods. Among these polymerization methods, solution polymerization is preferred because the resulting reaction mixture can be used as is.

[0061] <Elastomer-based adhesive> The elastomeric pressure-sensitive adhesive preferably contains an elastomer and a tackifying resin, and the elastomer preferably contains a styrene-isoprene block copolymer.

[0062] Styrene-isoprene block copolymers exist in either a linear or radial structure. The linear structure provides excellent adhesion to a variety of substrates due to its high flexibility, and exhibits superior adhesive performance and heat resistance. Therefore, a linear structure consisting of a styrene-isoprene-styrene block triblock (SIS) or a styrene-isoprene diblock (SI) is preferred. A linear styrene-isoprene block copolymer is a linear copolymer in which a styrene block and an isoprene block are bonded.

[0063] The styrene-isoprene block copolymer preferably has a styrene content of 20 to 40% by weight and a diblock content of 15 to 70% by weight, based on 100% by weight. When the styrene content and diblock content are within the above ranges, the adhesive has excellent cohesive strength, and improves holding power and chemical resistance after exposure to a high-humidity environment.

[0064] Examples of styrene-isoprene block copolymers include Kraton D1119 (styrene content 22% by weight, diblock content 66% by weight), Kraton D1126 (styrene content 21% by weight, diblock content 30% by weight), and Kraton D1117 (styrene content 17% by weight, diblock content 33% by weight), all manufactured by Kraton Corporation, but are not limited to these. If necessary, two or more types may be used in combination.

[0065] Natural rubber may also be contained within a range that does not impair the required performance. The natural rubber is not particularly limited, but it is preferably masticated with a mastication roll to have a Mooney viscosity of, for example, 10 to 100. The other elastomers and natural rubbers are not limited to these, and one or a combination of two or more types may be used.

[0066] <Silicone-based adhesive> Silicone adhesives can be made from known silicone resins. Specifically, organopolysiloxanes with silanol groups at both ends of the molecular chain are combined with RSiO 0.5Examples include those obtained by partial dehydration condensation of an organopolysiloxane having triorganosiloxane units represented by the formula (where R represents a substituted or unsubstituted monovalent hydrocarbon group) and SiO2 units. These are available as silicone-based pressure-sensitive adhesives KR-101-10, KR-120, KR-130, and X-40-3068 (all manufactured by Shin-Etsu Chemical Co., Ltd.). Silicone-based pressure-sensitive adhesives are generally cured using peroxides such as benzoyl peroxide, or using a reaction between a platinum catalyst and an organopolysiloxane having Si-H bonds. Either method can be used, or they can be used in combination.

[0067] <Tackifying resin> Examples of tackifying resins include rosin-based resins such as rosin ester, polymerized rosin, hydrogenated rosin, disproportionated rosin, maleic acid-modified rosin, fumaric acid-modified rosin, and rosin phenolic resin; terpene-based resins such as α-pinene resin, β-pinene resin, dipentene resin, aromatic-modified terpene resin, hydrogenated terpene resin, terpene phenolic resin, acid-modified terpene resin, and styrenated terpene resin; alkylphenol resin, coumarone resin, styrene resin, petroleum-based resin, or copolymers thereof, with terpene phenolic resin being particularly preferred. The above tackifying resins can be used alone or in combination of two or more.

[0068] <Curing agent> A curing agent can be added to the adhesive as needed. The peel strength required when peeling from the polishing machine platen varies from high to low, so a curing agent can be added to control the adhesive strength. As the curing agent, an isocyanate-based curing agent, an aziridine-based curing agent, a metal chelate-based curing agent, an epoxy-based curing agent, or the like can be used as needed, as long as the desired performance is not impaired. In particular, an isocyanate-based curing agent is preferred as the curing agent added to an acrylic adhesive from the viewpoints of cohesive strength and heat resistance. These curing agents may be used alone or in combination of two or more.

[0069] <Other additives> The various adhesives for forming the adhesive layer in the adhesive sheet of the present invention may contain various additives as needed, such as known antioxidants such as antioxidants, fillers, pigments, dyes, diluents, plasticizers, polymerization inhibitors, UV absorbers, UV stabilizers, coupling agents, etc., and two or more of these may be used. The amount of additive added is not particularly limited, as long as it is an amount that provides the required physical properties.

[0070] <Release Sheet FA>, <Release Sheet FB> The release sheets FA and FB have a release layer formed by applying a release agent to a sheet-like substrate such as paper, plastic film, synthetic paper, etc. In CMP processing, a release film with a highly clean plastic film as the sheet-like substrate is preferred. As a plastic film for release sheet FA, a polyethylene terephthalate film is preferred because it is easy to process the texture with a metal roll and is inexpensive. For the texture processing of the release film with the exemplified metal roll, a thickness of 25 to 100 μm is preferred because it makes it easy to transfer the desired shape formed on the metal surface, and a thickness of 45 to 80 μm is even more preferred because it makes processing easier. The average height Rc of the release sheet FA is preferably 12 to 42 μm, more preferably 17 to 37 μm, and even more preferably 22 to 32 μm, in order to inversely transfer the irregularities of the release sheet FA onto the surface of the adhesive layer A. When the average height Rc is within the preferred range, the irregular surface can be inversely transferred onto the adhesive layer A with high accuracy.

[0071] The plastic film for the release sheet FB is preferably an inexpensive and highly smooth polyethylene terephthalate film. There is no particular restriction on the thickness of the release sheet FB, but it is preferably 10 to 200 μm, which gives the film stiffness and makes it easy to peel. Examples of the release agent include silicone resins, alkyd resins, melamine resins, fluorine resins, and acrylic resins, with silicone resins being preferred.

[0072] <Sheet-shaped substrate> The sheet-like substrate of the present invention is preferably a nonwoven fabric or a plastic film. Examples of the plastic film include films made of polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate, PPS (polyphenylene sulfide), nylon, triacetyl cellulose, cycloolefins, polyimides, polyamides, etc. In particular, polyethylene terephthalate films are preferred because of their low production costs, chemical resistance, and smoothness.

[0073] The thickness of the sheet-like substrate is not particularly limited, but is preferably 5 to 200 μm, more preferably 25 to 75 μm, and particularly preferably 50 to 75 μm. When the thickness is within the preferred range, the unevenness of adhesive layer A does not affect adhesive layer B or the polishing pad, and appropriate stiffness is imparted, improving workability during application. When the thickness is within the particularly preferred range, workability is further improved.

[0074] The sheet-like substrate in the present invention may be subjected to an adhesion-facilitating treatment in order to improve the adhesion between the adhesive layer A and the adhesive layer B. The adhesion-facilitating treatment can be performed by a known method such as a dry method involving corona discharge or a wet method involving coating with an anchor coating agent. When an acrylic adhesive is used to form the adhesive layer, it is preferable to use one that has been subjected to an easy-adhesion treatment in terms of improving adhesion. On the other hand, when an elastomeric adhesive is used, if it has been subjected to an easy-adhesion treatment by corona discharge, the adhesive layer is more likely to peel off from the sheet-like substrate, so it is preferable to apply the elastomeric adhesive to the surface that has not been subjected to the easy-adhesion treatment.

[0075] The thickness of the adhesive sheet for fixing a polishing pad, which is composed of adhesive layer A, sheet-like substrate, and adhesive layer B, is preferably 80 to 300 μm, and more preferably 100 to 200 μm. A thickness of 80 μm or more allows for uniform processing without bias in the lamination process when integrating with the polishing pad, and a thickness of 300 μm or less allows for the adhesive sheet to be formed into a roll shape during production, increasing productivity. A thickness within this more preferred range allows the force of the platen to be appropriately transmitted to the polishing pad during polishing, improving polishing precision.

[0076] <Usage form> An example of the use of the pressure-sensitive adhesive sheet for fixing a polishing pad of the present invention will be described. As shown in Figures 1-2 and 6-2, the adhesive sheet for fixing a polishing pad can be provided as an adhesive sheet for fixing a polishing pad with a release sheet FA, in which each side of the sheet is covered with a release sheet FA and FB, respectively, or as shown in Figure 1-3, the adhesive sheet for fixing a polishing pad can be provided in a state in which only the adhesive layer A side of the adhesive sheet for fixing a polishing pad is covered with a release sheet FA. In the case of the form shown in Figure 1-3', the adhesive sheet for fixing a polishing pad with a release sheet FA 2 can be wound around a cylindrical member called a core (also called a core material), and the surface of adhesive layer B can be covered with the other side of the release sheet FA (the side not in contact with adhesive layer A), and the adhesive sheet for fixing a polishing pad with a release sheet FA in roll form can be provided.

[0077] As shown in FIGS. 1-4 and 6-3, a polishing pad is laminated on the surface of adhesive layer B of an adhesive sheet for fixing a polishing pad with release sheet FA attached thereto, thereby forming a polishing pad 4 with release sheet FA and adhesive layer A attached thereto. Next, as shown in Figures 1-5 and 6-4, the release sheet FA is peeled off to expose the adhesive layer A, and the polishing pad 3 with the adhesive layer A is attached to a surface plate SP. The adhesive layer A of the adhesive sheet 1 for fixing a polishing pad contacts the surface plate, and the adhesive layer B contacts the polishing pad.

[0078] A polishing pad, also known as a polishing cloth, polishing pad, or polishing pad, is a component that comes into contact with the surface of the object to be polished and polishes it. Polishing pads are available in single-layer types made from a single component, and multi-layer types made from multiple laminated components. Materials for the top surface of polishing pads include urethane, nonwoven fabric, and suede. In the case of multi-layer types, urethane foam, polyethylene foam, or polypropylene foam is used as a cushioning material in the inner layer. [Example]

[0079] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples. In the examples, "parts" means "parts by weight" and "%" means "% by weight".

[0080] [Molecular weight] In the following examples, the molecular weights are polystyrene-equivalent weight-average molecular weights measured by GPC (gel permeation chromatography). The measurement was performed using a GPC-8020 (Tosoh Corporation) measuring instrument, tetrahydrofuran as the eluent, and three TSKgel SuperHM-M (Tosoh Corporation) columns at a column temperature of 40°C, a flow rate of 0.6 mL / min, a sample concentration of 0.3%, and an injection volume of 10 μL.

[0081] [Non-volatile content] The non-volatile content is calculated by dividing the mass of a sample before heating by the mass of the sample after heating when 1 g of the sample is heated at 170°C for 10 minutes. However, for commercially available products, the value calculated based on the method specified by the manufacturer may be used.

[0082] (adhesive) <Preparation of Acrylate Resin (A-1) Solution> 500 g of ethyl acetate was heated in a water bath while introducing nitrogen gas into a four-neck flask equipped with a stirrer, reflux condenser, nitrogen inlet, and thermometer. Subsequently, a mixture of 360 g of n-butyl acrylate (BA), 120 g of 2-ethylhexyl acrylate (2-EHA), 20 g of ethyl acrylate (EA), 5 g of hydroxyethyl acrylate (HEA), 10 g of acrylic acid (AA), and an appropriate amount of azobisisobutyronitrile (AIBN) as an initiator was added dropwise to the ethyl acetate and reacted for 8 hours while maintaining reflux. After the reaction, 110 g of ethyl acetate was added to obtain a solution of acrylate resin (A-1) with a weight-average molecular weight (Mw) of 700,000 (45% nonvolatile content).

[0083] <Production of Acrylate Resins (A-2) to (A-10)> According to the compositions shown in Table 1, solutions of acrylate resins (A-2) to (A-10) (non-volatile content 45%) were obtained in the same manner as in the case of acrylate resin (A-1).

[0084] <Production of acrylic adhesive (PA-1) solution> 100 parts of a solution of acrylate resin (A-1) and 5 parts of an isocyanate-based curing agent (Mitsubishi Chemical Corporation (Mytec GP105A): tolylene diisocyanate, trimethylolpropane adduct) were mixed with stirring, and methyl ethyl ketone was added to prepare a solution of acrylic adhesive (PA-1) (non-volatile content 45%).

[0085] <Production of acrylic adhesive solutions (PA-2) to (PA-10) and (PB-1)> Solutions of acrylic adhesives (PA-2) to (PA-10) and (PB-1) were prepared in the same manner as for the solution of acrylic adhesive (PA-1), except that the compositions were changed as shown in Table 1. The tackifier used was rosin ester (Pensel D-125 manufactured by Arakawa Chemical Industries, Ltd.: softening point 125±5° C., acid value 20 or less).

[0086] [Table 1]

[0087] <Preparation of elastomer adhesive (PE-1) solution> 100 parts by mass of Quintac 1119 (manufactured by Nippon Zeon Co., Ltd., styrene content 22% by weight, diblock content 66% by weight) as an elastomer, and appropriate amounts of methyl ethyl ketone and toluene as a solvent were charged. The flask was then gradually heated and continued to be heated for 3 hours at an internal temperature of approximately 50°C. After heating was completed, the flask was cooled, and when the internal temperature was below approximately 40°C, 2 parts by mass of Irganox 1010 (antiaging agent, manufactured by BASF Japan Ltd.) was added as an antioxidant, and the mixture was diluted with methyl ethyl ketone and toluene to obtain an elastomeric pressure-sensitive adhesive (PE-1) with a nonvolatile content of 49.0% and a viscosity of 1500 mPa s.

[0088] <Preparation of elastomer adhesive (PE-2) solution> A four-neck flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping device, and a nitrogen inlet tube was charged under a nitrogen atmosphere with 100 parts by mass of Quintac 1126 (manufactured by Zeon Corporation, styrene content 21% by weight, diblock content 30% by weight) as an elastomer, and appropriate amounts of methyl ethyl ketone and toluene as a solvent. The flask was then gradually heated and continued to heat for 3 hours at an internal temperature of approximately 50°C. After heating, the flask was cooled, and when the internal temperature reached approximately 40°C or below, 30 parts by mass of Pencel D-125 (Arakawa Chemical Industries, Ltd., softening point 125±5°C, acid value 20 mgKOH / g or less) as a tackifier resin and 2 parts by mass of Irganox 1010 (BASF Japan, antioxidant) as an antioxidant were added. The mixture was diluted with methyl ethyl ketone and toluene, and stirring was continued until the tackifier resin was dissolved, yielding a solution of elastomeric pressure-sensitive adhesive (PE-2) with a non-volatile content of 49% and a viscosity of 1500 mPa·s.

[0089] Peel-off sheet <fa-1>Manufacturing A PET release sheet "RF2PETCS001-50" (thickness: 50 μm, one side silicone release treatment, Rc: 0.2 μm) manufactured by Aim Co., Ltd., measuring approximately 30 cm x 30 cm, was passed between a metal roll and a rubber roll with a PG7 pattern (sand grain pattern) owned by Godo Resin Industries Co., Ltd. at a temperature of 220°C, a pressure of 5 MPa, and a speed of 3 m / min to obtain a release sheet FA-1 with the sand grain pattern transferred onto it. Rc measured by the above method using a digital microscope (Keyence VHX-7000) was 6.1 μm. The thickness of the PET release sheet was measured at five random points using a Litematic VL-50B thickness gauge (manufactured by Mitutoyo Corporation) with a Φ7.5 mm probe and a pressure of 0.01 N, and was calculated as an average value.

[0090] Peel-off sheet <fa-2> ~ <fa-7>Manufacturing Sand-grained release sheets FA-2 to FA-7 were obtained under the same processing conditions as for release sheet FA-1, except that metal rolls with PG16, PG12, PG14, PG18, PG68, and PG27 patterns owned by Godo Resin Industry Co., Ltd. were used instead of the metal roll with PG7 pattern owned by Godo Resin Industry Co., Ltd.

[0091] Peel-off sheet <fa-8> ~ <fa-12>Manufacturing After obtaining release sheets FA-3, FA-4, FA-5, and FA-6, each release sheet was passed between a smooth-surfaced metal roll and a rubber roll at a temperature of 110°C, a pressure of 3.0 MPa, and a speed of 0.5 m / min to obtain release sheets FA-8, FA-9, FA-10, FA-11, and FA-12.

[0092] The detailed Rc of each release sheet FA-1 to FA-12 is as follows: FA-1 PG7 (grained pattern) transfer. Rc: 6.1 μm FA-2 PG16 (grained pattern) transfer. Rc: 8.3 μm FA-3 PG12 (grained pattern) transfer. Rc: 11.5 μm FA-4 PG14 (grained pattern) transfer. Rc: 21.2 μm FA-5 PG18 (grained pattern) transfer. Rc: 33.1 μm FA-6 PG68 (grained pattern) transfer. Rc: 38.7 μm FA-7 PG27 (grained pattern) transfer. Rc: 48.0 μm FA-8: Processed with release sheet FA-3. Rc: 10.3 μm FA-9: Processed with release sheet FA-4. Rc: 16.2 μm FA-10: Processed with release sheet FA-5. Rc: 27.3 μm FA-11: Processed with release sheet FA-6. Rc: 35.8 μm FA-12: Processed with release sheet FA-7. Rc: 43.1 μm

[0093] <Release Sheet FB> FB-1 RF2PETCS001-50, manufactured by Aim Co., Ltd., PET release sheet (thickness: 50 μm, one side silicone release treatment, Rc: 0.2 μm)

[0094] <Sheet-shaped substrate F> F-1 PET75, PET film manufactured by Unitika (thickness: 75 μm)

[0095] [Example 1] <Production of adhesive sheets for fixing polishing pads and adhesive sheets for fixing polishing pads with release sheets> A solution of adhesive (PA-1) was applied onto the release layer of release sheet FA-1 so that the thickness after drying would be 50 μm, and the applied solution was dried at 100° C. for 2 minutes to form adhesive layer A (acrylic adhesive layer). Then, the surface of adhesive layer A was attached to the corona-treated surface of the sheet-like substrate F. Separately, a solution of adhesive (PB-1) was applied onto the release sheet FB-1 so that the thickness after drying was 50 μm, and the applied solution was dried at 100°C for 2 minutes to form adhesive layer B (acrylic adhesive layer). Then, adhesive layer B was attached to the side of the sheet-like substrate F where adhesive layer A was not attached (non-corona treated side), and left at 23°C-50% for one week to obtain an adhesive sheet (S-1) for fixing a polishing pad with release sheet FA and release sheet FB, having a laminated structure of [release sheet FA / adhesive layer A / sheet-like substrate F / adhesive layer B / release sheet FB]. The properties of the resulting adhesive sheet (probe tack value of the surface of the exposed adhesive layer A, average roughness Rc, cut level difference of the profile curve Rδc, kurtosis Rku) were determined according to the methods described below. Furthermore, the performance of the resulting pressure-sensitive adhesive sheets (ease of application, air release, adhesive strength, chemical resistance, holding power, polishing accuracy, and adhesive residue) was evaluated according to the methods described below.

[0096] <Examples 2 to 11> Adhesive sheets for fixing polishing pads with release sheets FA and FB were obtained in the same manner as in Example 1, except that instead of release sheet FA-1, the release films onto which the solution of adhesive P-1 was applied were FA-2, FA-8, FA-3, FA-9, FA-4, FA-10, FA-5, FA-11, FA-6, and FA-1, as shown in Table 1.

[0097] <Comparative Examples 1 to 3> In Comparative Example 1, instead of the release sheet FA-1, a polyester film (manufactured by Mitsui Chemicals ICT Materials, Inc., SPPET-O1-50-Bu6) was used as the release sheet FA-13. In Comparative Example 2, a matte grade polyester film (Unitika, Emblet "PTH-38") was used as the release sheet FA-14, and BYK's silicone treatment agent "BYK300" was applied to it with a coil bar at 0.1 g / m 2 The film that was applied and used as the release surface was In Comparative Example 3, FA-7 was used. Pressure-sensitive adhesive sheets for fixing a polishing pad with release sheets FA and FB were obtained in the same manner as in Example 1, except that the release sheets FA and FB were used instead.

[0098] <Examples 12 to 21> and <Comparative Example 4> Adhesive sheets for fixing polishing pads with release sheets FA and FB were obtained in the same manner as in Example 1, except that release sheet FA-4 was used instead of release sheet FA-1, and solutions of adhesives PA-2 to PA-10, PE-1, and PE-2 were used instead of the solution of adhesive PA-1, as shown in Table 3. In addition, Example 6 is listed again in Table 3.

[0099] [Properties of adhesive sheet] <Probe tack value> PT (load, contact time) The resulting adhesive sheets for fixing polishing pads with the release sheets FA and FB were left in a 40°C oven for one week, then removed and left in an atmosphere of 23°C and 50% RH for 24 hours. The release sheet FB was peeled off from the adhesive sheets left for 24 hours and attached to a stainless steel jig for measurement. The release sheet FA was then peeled off, and the probe tack value of the exposed adhesive layer A was measured under various conditions. The measurements were performed using a Tack Tester T-500 manufactured by UBM, with a stainless steel cylindrical probe diameter of 5 mm and a probe movement speed of 0.01 mm / sec. The sample was replaced with a new one each time a measurement was performed, and the following probe tack values ​​were measured. PT(0.5,1)-Load: 0.5N, Contact time: 1 second PT(3.0,1) - Load: 3.0N, Contact time: 1 second PT(0.5,10)-Load: 0.5N, Contact time: 10 seconds PT(0.5,30)-Load: 0.5N, Contact time: 30 seconds PT(0.5,60)-Load: 0.5N, Contact time: 60 seconds

[0100] <Rc、Rδc、Rku> Measurements were carried out using a digital microscope (Keyence VHX-7000) based on JIS B 0601 (2013).

[0101] [Measurement of storage modulus Er'] Each adhesive solution was coated onto the release layer of release sheet FA-13 to a dry thickness of 50 μm, and then dried at 100°C for 2 minutes to form adhesive layer A. Two of the coated sheets were laminated together with the adhesive layers A facing each other to form an intermediate laminate in which both sides of the 100 μm-thick adhesive layer A were covered with release sheet FA. Two of the intermediate laminates were prepared, and one of the release sheets FA of each laminate was peeled off to laminate the exposed 100 μm thick adhesive layers A together, forming a laminate in which both sides of the 200 μm thick adhesive layer A were covered with the release sheet FA. The obtained laminate was punched out into test pieces 10 mm long and 5 mm wide, and the release sheets FA on both sides were peeled off. The change in storage modulus (Er') was measured under the following conditions (load cell: 600 gf, heating rate: 10°C / min, frequency: 10 Hz, measurement range: -60 to 100°C) using a dynamic viscoelasticity measuring device DVA-200 (manufactured by IT Measurement Control Co., Ltd.), and the storage modulus (Er') at 25°C was calculated.

[0102] [Evaluation of adhesive sheets] <Pasting workability (position adjustment)> The procedure will be explained according to Figure 7. As shown in Figure 7-1, the adhesive sheets for fixing polishing pads with release sheets FA and FB prepared in the Examples and Comparative Examples were cut to a size of 210 mm square, the release sheet FB was peeled off to expose the adhesive layer B, and this was attached to a 200 mm square smooth glass plate (approximately 300 g) with a thickness of 3 mm in an atmosphere of 23 ° C and 50% RH, and the adhesive sheet that protruded from all sides of the glass plate was removed with a cutter to obtain a sample for evaluating the attachment workability (hereinafter referred to as the sample) with a configuration of 200 mm square [glass / adhesive sheet / release sheet FA]. Note that in Figure 7, the stacking state of the adhesive sheet and the stacking state of the adhesive sheet and the release sheet FA are omitted. As shown in Figure 7-2, two types of frame lines, 200 mm square and 150 mm square, were drawn in the approximate center of one side of a 300 mm square glass plate with a 1 mm thick oil-based marker to form the substrate for evaluation (hereinafter referred to as the substrate). As shown in Figure 7-3, peel off the release sheet FA from the sample to expose the adhesive layer A, and place the 200mm square sample on the adherend so that each of its two sides extends at least 10mm beyond the two sides of the 200mm square outer frame drawn on the adherend. The surface on which the sample is placed should be the opposite side to the side on which the two frames are drawn. Immediately after placement, the sample was peeled off the adherend, and as shown in Figure 7-4, the position was adjusted to fit within the 200 mm square frame of the adherend, and the time it took to re-place it (placed over the edge - peeled off - placed within the frame) was measured. Five people randomly selected to perform the work were given scores as follows, and the application workability was evaluated from the total scores of the five people. The ease of application was scored as follows: 3 points: Easily aligned to the frame within 10 seconds. 2 points: Alignment was achieved in more than 10 seconds but less than 15 seconds. 1 point: Alignment was achieved in more than 15 seconds but less than 30 seconds. 0 points: It took more than 30 seconds. The evaluation criteria for the ease of application are as follows. S:13-15 points A:10-12 points B: 7-9 points C: 4-6 points D: 0-3 points

[0103] <Evaluation of air release> As shown in Figure 8-1, immediately after completing the evaluation of lamination workability, a 500g weight for a top-pan balance, 41mm in diameter x 63mm in height, was placed on the center of the five evaluation samples and allowed to stand for 180 seconds. Next, as shown in Figure 8-2, the weight was removed, and the number of air pockets 5mm or larger in diameter within the 150mm square frame from the adherend side (the backside of the 300mm square glass plate) and the presence or absence of air pockets 10mm or larger were scored as follows. Air release ability was then evaluated from the total score of the five plates. The air release properties were scored according to the following criteria: 3 points: No air pockets with a diameter of 5mm or more within the frame 2 points: There are 1 or 2 air pockets with a diameter of 5 mm or more within the frame, and no air pockets with a diameter of 10 mm or more. 1 point: There are 3 to 5 air pockets with a diameter of 5 mm or more within the frame, and no air pockets with a diameter of 10 mm or more. 0 points: There are more than five air pockets with a diameter of 5 mm or more within the frame, and one air pocket with a diameter of 10 mm or more. The evaluation criteria for air release properties are as follows: S:13-15 points A:10-12 points B: 7-9 points C: 4-6 points D: 0-3 points

[0104] [Adhesive strength] <Evaluation of the initial adhesive strength of adhesive layer A> In an atmosphere of 23°C and 50% RH, the release sheet FB of the adhesive sheet for fixing a polishing pad with the release sheet FA and release sheet FB was peeled off, and the exposed adhesive layer B was bonded to a 25 μm PET film, and cut into a size of 25 mm wide x 100 mm long to prepare a sample for evaluating adhesive strength. The release sheet FA was then peeled off, and the exposed adhesive layer A was pressed against a stainless steel plate with a 2 kg roller in one stroke. After leaving it for 24 hours, the adhesive strength of adhesive layer A (to SUS) was measured in accordance with the JIS Z1528 measurement method using a tensile tester at a peel angle of 180° and a peel speed of 0.3 m / min in an atmosphere of 23°C and 50% RH. The measured values ​​are shown in Tables 2 and 3.

[0105] <<Chemical resistance (acid and alkali resistance)>> The release sheet FA was peeled off from the adhesive strength evaluation sample, and the exposed adhesive layer A was placed on a stainless steel plate and pressed back and forth with a 2 kg roller to adhere the adhesive layer A to the stainless steel plate. Within 30 minutes, the sample was immersed in a sulfuric acid solution of pH 1.5 and a sodium hydroxide solution of pH 11.5 while still attached to the stainless steel plate, and left for 24 hours in an environment of 40°C. It was then removed from the solution, washed with water, and left for 1 hour in an atmosphere of 23°C and 50% RH. The adhesive strength of adhesive layer A was measured using the same method as in the above <Measurement of initial adhesive strength> and was taken as the "adhesive strength after immersion." The difference between the initial adhesive strength and the adhesive strength after immersion was determined. The smaller this difference, the better the chemical resistance. If the adhesive strength is lower than the initial strength, it may affect polishing performance, but if it is higher, there is a possibility that glue may remain on the surface plate when the adhesive sheet and polishing pad are peeled off from the surface plate after polishing is completed, contaminating the surface plate. In the evaluation, S means suitable for use, A means practical use depending on the polishing liquid used during polishing, and D means unsuitable for practical use. The evaluation criteria are as follows: S: The difference in adhesive strength is less than 1.0N / 25mm A: The difference in adhesive strength is 1.0N / 25mm or more, or less than 1.5N / 25mm B: The difference in adhesive strength is 1.5N / 25mm or more, or less than 2.0N / 25mm C: The difference in adhesive strength is 2.0N / 25mm or more, or less than 2.5N / 25mm D: The difference in adhesive strength is 2.5N / 25mm or more

[0106] <Holding power> The release sheet FB was peeled off from the obtained adhesive sheet for fixing a polishing pad, and a 25 μm PET film was attached to the exposed adhesive layer B. Then, the sheet was cut into a size of 25 mm wide x 100 mm long, which was used as a sample. Next, in an atmosphere of 23°C and 50% RH, the release sheet FA was peeled off by a length of 25 mm and a width of 25 mm, and the exposed adhesive layer A was pressed back and forth once with a 2 kg roll to a stainless steel plate and left in an atmosphere of 23°C and 50% RH for 20 minutes. After that, a 1 kg weight was attached in an atmosphere of 80°C so that a force was applied in the 180° direction. After 24 hours, the number of millimeters of deviation of the sample from the adherend was measured. If the sample completely fell off the adherend, the time until it fell off was measured. The evaluation criteria are as follows: S: Deviation is less than 0.1 mm A: 0.1mm or more, less than 1.0mm B: Misalignment is 1.0 mm or more and 5.0 mm or less C: Falls after 180 minutes or more D: Falls in less than 180 minutes In terms of holding power, S and A are suitable, B and C are practical depending on the polishing process and polishing time, and D is not suitable for practical use.

[0107] <Polishing precision> The release sheet FB was peeled off from the adhesive sheet for fixing the polishing pad with the release sheet attached, and the non-abrasive side of the polishing pad (CMP cloth, Φ200mm, normal type, manufactured by Musashino Electronics Co., Ltd.) was placed on the exposed adhesive layer B and bonded under the conditions of roll temperature: 80°C, pressure: 0.1MPa, speed: 1.0M / min to produce a polishing pad with an adhesive sheet. The polishing device used was the MA-200 manufactured by Musashino Electronics Co., Ltd. The release sheet FA was peeled off from the prepared polishing pad with adhesive sheet, and the exposed adhesive layer A was attached to an aluminum surface plate, and medium polishing was performed under the following conditions. (conditions) Table rotation speed: 100 rpm Head rotation speed: 105 rpm Polishing target: A 200 mm wafer (75 μm thick) with a polysilicon layer (500 nm) formed on its surface, cut into a 3 cm square specimen Polishing pressure: 10.0 kPa Polishing time: 15 min Polishing fluid: Musashino Electronics colloidal silica polishing agent #80 After polishing, the test piece was washed with water and water droplets were removed with an air blower. The thickness of the polysilicon was then measured at three arbitrary points: one at the center and two other points, using an Otsuka Electronics FE-300 film thickness measuring instrument. The polishing precision was evaluated using the difference between the maximum and minimum film thicknesses according to the following criteria. S: Less than 10 nm A: 10nm or more, less than 20nm B: 20nm or more, less than 30nm C: 30nm or more, less than 50nm D: 50nm or more In CMP polishing, which requires precision, S is the best, A is preferably used, B is for general use, C has limited uses, and D cannot be used.

[0108] <Adhesive residue test> As in the alignment evaluation test, a 200mm square sample for evaluating adhesive residue was prepared, consisting of glass / adhesive sheet / release sheet FA. The release sheet FA was peeled off, and the exposed adhesive layer A was placed on a 300mm square glass plate. The release sheet FA was then immediately peeled off. This "placement-peel-off" process was repeated 10 times at approximately the same position on the 300mm square glass plate, and adhesive residue was evaluated based on the number of "placement-peel-off" cycles until adhesive residue was observed on the 300mm square glass plate. The evaluation criteria were as follows: S: No adhesive residue was found after 10 tries of "placing and peeling." A: When the product is placed and peeled off 10 times, adhesive residue appears on the 9th time. B: Out of 10 times of "placing and peeling", adhesive residue occurs on the 8th time. D: When the product is placed and peeled off 10 times, adhesive residue appears within the 7th time. In terms of evaluation, S means suitable for use, and D means not suitable for practical use.

[0109] [Table 2]

[0110] [Table 3] [Explanation of symbols]

[0111] 1: Adhesive sheet for fixing polishing pads 2: Adhesive sheet for fixing polishing pads with release sheet FA 3: Polishing pad with adhesive layer A 4: Polishing pad with release sheet FA and adhesive layer A A: Adhesive layer A FA: Release sheet covering the surface of adhesive layer A FA': precursor of FA B: Adhesive layer B FB: Release sheet covering the surface of adhesive layer B F: Sheet-shaped substrate PP: Polishing pad R1: Metal roll R2: Rubber roll SP: Surface plate < / fa-8> < / fa-2>

Claims

1. The sheet-like substrate has an adhesive layer A and an adhesive layer B on each side thereof, the surface of the adhesive layer A that is not in contact with the sheet-like substrate has irregularities, and the average height Rc of the surface irregularities of the adhesive layer A is 5.6 to 42.1 μm; The cut level difference Rδc of the contour curve of the surface irregularities of the adhesive layer A is 2.8 to 28.3 μm, and the kurtosis Rku is less than 3, An adhesive sheet for fixing a polishing pad, wherein the probe tack value when a 5 mm diameter stainless steel cylindrical probe is brought into contact with the adhesive layer A at a speed of 0.01 mm / sec and then pulled away at the same speed satisfies the following conditions (1) to (3). (1) A load of 0.5 N is applied, the probe is brought into contact for 1 second, and the probe tack value PT(0.5,1) when peeled off is 0.5 N / cm ２ ~2.5N / cm ２ is. (2) A load of 3.0 N is applied, the probe is kept in contact for 1 second, and the probe tack value PT(3.0,1) when peeled off is 5 N / cm ２ ~11N / cm ２ is. (3) The value obtained by dividing the probe tack value PT(3.0,1) by the probe tack value PT(0.5,1) is 4 or greater.

2. An adhesive sheet for fixing a polishing pad as described in claim 1, wherein when a stainless steel cylindrical probe having a diameter of 5 mm is brought close to the adhesive layer A at a speed of 0.01 mm / sec, a load of 0.5 N is applied, and the probe is kept in contact with the adhesive layer A for 10 seconds, 30 seconds, and 60 seconds, and the probe tack values ​​when the probe is peeled off at the same speed are PT(0.5,10), PT(0.5,30), and PT(0.5,60), respectively, the following conditions (4) and (5) are satisfied. (4) The value obtained by dividing the probe tack value PT(0.5,30) by the probe tack value PT(0.5,10) is between 1 and 1.

4. (5) The value obtained by dividing the probe tack value PT(0.5,60) by the probe tack value PT(0.5,10) is 1 to 1.

6.

3. The adhesive sheet for fixing a polishing pad according to claim 2, characterized in that the surface of the adhesive layer A that is not in contact with the sheet-like substrate has irregularities, and the average height Rc of the surface irregularities of the adhesive layer A is 10 to 40 μm.

4. 4. The adhesive sheet for fixing a polishing pad according to claim 3, wherein the difference in cutting level Rδc of the contour curve of the surface irregularities of the adhesive layer A is 5 to 25 μm, and the kurtosis Rku is less than 3.

5. 5. The adhesive sheet for fixing a polishing pad according to claim 4, wherein the shape of the convex portions on the surface of said adhesive layer A in a plan view is irregular and shapeless.

6. 6. The adhesive sheet for fixing a polishing pad according to claim 5, wherein the adhesive layer A is an acrylic adhesive layer.

7. 10. A pressure-sensitive adhesive sheet for fixing a polishing pad with a release sheet FA, comprising the pressure-sensitive adhesive sheet for fixing a polishing pad according to claim 1 and a release sheet FA, The surface of the adhesive layer A is in contact with the release surface of the release sheet FA, An adhesive sheet for fixing a polishing pad with a release sheet FA, characterized in that the material of the release sheet FA is a plastic film that does not contain paper.

8. A polishing pad fixing device comprising the adhesive sheet for fixing a polishing pad with the release sheet FA according to claim 7 and a release sheet FB, The release sheet FB is in contact with the surface of the adhesive layer B that is not in contact with the sheet-like substrate, The adhesive sheet for fixing a polishing pad with a release sheet FA and a release sheet FB is characterized in that the material of the release sheet FB is a plastic film that does not contain paper.

9. 8. The adhesive sheet for fixing a polishing pad with a release sheet FA according to claim 7, which is wound in a roll shape and has a widthwise length of 1000 mm or less.

10. 9. The adhesive sheet for fixing a polishing pad with the release sheets FA and FB according to claim 8, which is wound in a roll shape and has a widthwise length of 1000 mm or less.

11. 9. The adhesive sheet for fixing a polishing pad with the release sheets FA and FB according to claim 8, wherein the length of the short side is 1000 mm or less.

12. A polishing pad with an adhesive layer, comprising a polishing pad and the adhesive sheet for fixing a polishing pad according to claim 1, The polishing pad has an adhesive layer A, and the polishing pad and the adhesive layer B are in contact with each other.

13. A polishing pad with an adhesive layer, comprising a polishing pad and an adhesive sheet for fixing a polishing pad with the release sheet FA according to claim 7, The polishing pad is provided with a release sheet FA and an adhesive layer A, in which the polishing pad and the adhesive layer B are in contact with each other.

14. A method for fixing a polishing pad to a surface platen via the adhesive layer A, comprising peeling off the release sheet FA from the polishing pad having the release sheet FA and the adhesive layer A according to claim 13.

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