Frame unit manufacturing method and workpiece processing method
The method of adhering a workpiece to a sheet with a stimulus-hardening resin forms customizable frame units, addressing the issues of cost and complexity in stainless steel frame systems, achieving cost-effective and efficient frame production and reuse.
Patent Information
- Application Number
- JP2021149602
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-09-14
- Publication Date
- 2025-12-15
- Estimated Expiration
- 2041-09-14
AI Technical Summary
Stainless steel ring frames used for dividing semiconductor wafers and package workpieces are heavy, expensive, and require time-consuming cleaning of adhesive tape, with the need for multiple sizes complicating reuse and increasing costs.
A method involving adhering a workpiece to a sheet with a liquid resin that hardens in response to an external stimulus, forming a frame around the workpiece, and integrating the sheet and frame, allowing for customizable shape, thickness, and color based on the workpiece type.
Enables the cost-effective production of frame units with frames of any shape, reducing material waste and simplifying reuse by eliminating the need for multiple frame sizes and adhesive cleaning, while allowing easy identification of workpiece type.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present invention relates to a method for manufacturing a frame unit and a method for processing a workpiece. [Background technology]
[0002] BACKGROUND ART Stainless steel ring frames (see, for example, Patent Documents 1 and 2) are currently widely used for dividing semiconductor wafers, various package workpieces, and the like. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-216161 [Patent Document 2] Patent No. 5244548 Summary of the Invention [Problem to be solved by the invention]
[0004] Stainless steel ring frames are heavy and expensive. To reuse them, the adhesive tape remaining on the surface must be washed away after use, which is time-consuming. Also, different sizes of frames must be prepared depending on the size of the workpiece, which leads to high costs.
[0005] An object of the present invention is to provide a method for manufacturing a frame unit that is inexpensive and capable of manufacturing a frame unit having a frame of any shape. [Means for solving the problem]
[0006] In order to solve the above-mentioned problems and achieve the object, the manufacturing method of the frame unit of the present invention is a method of manufacturing a frame unit by adhering a workpiece to a sheet covering an opening of an annular frame. and is configured by only the frame, the sheet, and the workpiece.A method for manufacturing a frame unit, comprising: a workpiece adhering step of adhering the workpiece to the sheet; and a step of applying a liquid resin that hardens in response to an external stimulus to the outer periphery of the workpiece adhered to the sheet. is applied to the outer edge of the sheet all around The method is characterized by comprising a frame forming step in which the resin is supplied in a ring shape surrounding the workpiece, the liquid resin is hardened by an external stimulus to form the frame, and the sheet and the frame are integrated.
[0007] The present invention How to manufacture frame units The law , A method for manufacturing a frame unit in which a workpiece is attached to a sheet covering an opening of an annular frame, the method comprising: a workpiece attaching step of attaching the workpiece to the sheet; and a frame forming step of supplying a liquid resin that hardens in response to an external stimulus in a ring shape around the outer periphery of the workpiece attached to the sheet, the liquid resin being hardened by the external stimulus to form the frame, and integrating the sheet and the frame, The workpiece is attached to one side of the sheet, and the frame is formed on the other side of the sheet. It is characterized by:
[0008] In the method for manufacturing a frame unit, the liquid resin may be colored in a color selected according to the type of the workpiece.
[0009] In the method for manufacturing the frame unit, the amount of the liquid resin to be supplied may be selected depending on the type of workpiece, and the frame may be formed to a desired thickness and shape.
[0010] The method for processing a workpiece is characterized by comprising a workpiece adhering step of adhering the workpiece to the sheet constituting the frame unit, a frame forming step of supplying a liquid resin that hardens in response to an external stimulus to the area of the sheet to which the workpiece is adhered that surrounds the workpiece, hardening the liquid resin in response to the external stimulus to form the frame, and integrating the sheet and the frame, and a processing step of processing the workpiece fixed to the frame by the sheet. [Effects of the Invention]
[0011] The present invention has the effect of enabling a frame unit having a frame of any shape to be manufactured inexpensively. [Brief explanation of the drawings]
[0012] [Figure 1]FIG. 1 is a perspective view showing a workpiece to be processed by the method for processing a workpiece according to the first embodiment. [Figure 2] FIG. 2 is a flowchart showing the flow of the method for processing a workpiece according to the first embodiment. [Figure 3] FIG. 3 is a perspective view schematically showing a workpiece adhering step in the method for processing a workpiece shown in FIG. [Figure 4] FIG. 4 is a perspective view schematically showing a frame forming step of the method for processing the workpiece shown in FIG. [Figure 5] FIG. 5 is a cross-sectional view schematically showing a frame unit in which a frame is formed by the frame forming step of the method for processing a workpiece shown in FIG. [Figure 6] 6A to 6C are side views, partly in section, schematically showing processing steps of the method for processing the workpiece shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view schematically showing a frame unit in which a frame is formed by the frame forming step of the method for processing a workpiece according to the second embodiment. [Figure 8] FIG. 8 is a side view, partly in section, schematically showing processing steps of a method for processing a workpiece according to the second embodiment. [Figure 9] FIG. 9 is a cross-sectional view schematically showing a frame unit in which a frame is formed by the frame forming step of the method for processing a workpiece according to the first embodiment and the first modified example of the second embodiment. [Figure 10] FIG. 10 is a plan view schematically showing a frame unit in which a frame is formed by the frame forming step of the method for processing a workpiece according to the first embodiment and the second modification of the second embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0013] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.
[0014] [Embodiment 1] A method for processing a workpiece according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a workpiece to be processed by the method for processing a workpiece according to the first embodiment. Fig. 2 is a flowchart showing the flow of the method for processing a workpiece according to the first embodiment.
[0015] (workpiece) The method for processing a workpiece according to the first embodiment is a method for processing a workpiece 1 shown in Fig. 1. The workpiece 1 to be processed in the method for processing a workpiece according to the first embodiment is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, which has a substrate 2 made of silicon, sapphire, gallium arsenide, or the like.
[0016] 1, the workpiece 1 has a surface 4 divided by a plurality of mutually intersecting planned division lines 3, and devices 5 are formed in each region of the surface 4. The devices 5 are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations), image sensors such as CCDs (Charge Coupled Devices) or CMOSs (Complementary Metal Oxide Semiconductors), MEMS (Micro Electro Mechanical Systems), or various types of memories (semiconductor memory devices).
[0017] 1, the workpiece 1 is attached to a sheet 13 that covers an opening 12 of an annular frame 11 whose inner diameter is larger than the outer diameter of the workpiece 1, thereby constituting a frame unit 10, and then processed. That is, the frame unit 10 is configured by attaching the workpiece 1 to the sheet 13 that covers the opening 12 of the annular frame 11.
[0018] In the first embodiment, the sheet 13 is formed in a disk shape with an outer diameter larger than that of the workpiece 1. In the first embodiment, the workpiece 1 has one surface 131 of the sheet 13 attached to the back surface 6 behind the front surface 4. That is, in the first embodiment, the workpiece 1 is attached to the front surface 131 of the sheet 13. Also, in the first embodiment, the frame unit 10 has a frame 11 formed on the outer edge of the front surface 131 of the sheet 13.
[0019] In the first embodiment, the sheet 13 is an adhesive tape having a base layer made of a flexible, non-adhesive resin and an adhesive layer laminated on the base layer and made of a flexible, adhesive resin. In the first embodiment, the surface of the adhesive layer of the sheet 13 is the aforementioned surface 131 attached to the back surface 6 of the workpiece 1.
[0020] In embodiment 1, sheet 13 is an adhesive tape having a base layer and an adhesive layer, but in the present invention, it is not limited to adhesive tape, and may be composed only of a base layer made of a thermoplastic resin such as polyethylene, polypropylene, polystyrene, or polyester, and may not have an adhesive layer.
[0021] (Processing method of workpiece) The method for processing a workpiece according to the first embodiment is a method for processing the workpiece 1 described above. The method for processing a workpiece according to the first embodiment is also a method for manufacturing a frame unit for manufacturing the frame unit 10 having the above-described configuration. In the first embodiment, the method for processing the workpiece 1 is also a method for cutting the workpiece 1 along the planned division lines 3 to divide the workpiece 1 into individual devices 5. As shown in FIG. 2 , the method for processing the workpiece 1 according to the first embodiment includes a workpiece adhering step 1001, a frame forming step 1002, and a processing step 1003.
[0022] (Workpiece attachment step) Fig. 3 is a perspective view schematically showing a workpiece adhering step of the workpiece processing method shown in Fig. 2. Workpiece adhering step 1001 is a step of adhering workpiece 1 to sheet 13 constituting frame unit 10.
[0023] In the first embodiment, in the workpiece attachment step 1001, as shown in FIG. 3 , the center of the front surface 131 of the disk-shaped sheet 13 is placed on the back surface 6 of the workpiece 1, and a roller (not shown) that moves along the sheet 13 and rolls on the sheet 13 presses the sheet 13 against the back surface 6 of the workpiece 1 to attach the sheet 13 to the back surface 6 of the workpiece 1. However, in the present invention, the sheet 13 may be attached to the workpiece 1 by a vacuum mounter that houses the workpiece 1 and the sheet 13 in a vacuum chamber whose interior is depressurized, and attaches the sheet 13 to the back surface 6 of the workpiece 1 by utilizing the air pressure difference between the spaces separated by the sheet 13 in the vacuum chamber. Also, in the present invention, if the sheet 13 is composed only of a base layer made of a thermoplastic resin, it is desirable to heat at least the sheet 13 both when pressing the sheet 13 against the workpiece 1 with a roller and when attaching the sheet 13 to the workpiece 1 with the vacuum mounter.
[0024] (Frame formation step) Fig. 4 is a perspective view that schematically shows the frame forming step of the method for processing a workpiece shown in Fig. 2. Fig. 5 is a cross-sectional view that schematically shows a frame unit in which a frame is formed by the frame forming step of the method for processing a workpiece shown in Fig. 2. The frame forming step 1002 is a step in which liquid resin 51 that hardens in response to an external stimulus is supplied in a ring shape around the outer periphery of workpiece 1 that is attached to sheet 13, and the liquid resin 51 is hardened by the external stimulus to form frame 11, thereby integrating sheet 13 and frame 11.
[0025] In the frame forming step 1002, the coating device 50 sucks and holds the back surface 132, which is the other surface of the sheet 13 to which the workpiece 1 is attached, on the holding surface of the holding table, and brings the coating nozzle 54, which is connected to the liquid resin supply source 52 via an on-off valve 53, opposite the outer edge of the sheet 13 to which the workpiece 1 is attached, which is the area surrounding the workpiece 1. In the first embodiment, the back surface 132 of the sheet 13 is the surface of the base layer of the sheet 13.
[0026] In the frame forming step 1002, the coating device 50 moves the coating nozzle 54 and the sheet 13 to which the workpiece 1 is attached relatively along the outer edge of the sheet 13 as illustrated by the arrow 100 in Figure 4, while opening the on-off valve 53 to supply liquid resin 51 from the coating nozzle 54, which hardens in response to an external stimulus.
[0027] In the frame forming step 1002, the applicator 50 supplies the liquid resin 51 from the applicator nozzle 54 to the entire outer edge of the surface 131 of the sheet 13. Thus, in the frame forming step 1002, the applicator 50 supplies the liquid resin 51 that hardens when exposed to an external stimulus to the outer edge of the sheet 13 to which the workpiece 1 is attached, which is the area surrounding the workpiece 1, and supplies the liquid resin 51 that hardens when exposed to an external stimulus to the outer periphery of the workpiece 1 attached to the sheet 13 in a ring shape surrounding the workpiece 1.
[0028] In the frame forming step 1002, an external stimulus is applied for a predetermined time to the liquid resin 51 supplied around the entire outer edge of the sheet 13, causing the liquid resin 51 to harden with the external stimulus, forming a frame 11 on the outer edge of the surface 131 of the sheet 13, and integrating the sheet 13 and the frame 11 to manufacture a frame unit 10 as shown in Fig. 5. In the frame forming step 1002, the flow rate at which the liquid resin 51 is supplied from the application nozzle 54, the relative movement speed between the application nozzle 54 and the outer edge of the sheet 13, and the number of times the application nozzle 54 moves relative to the outer edge of the sheet 13 are appropriately selected depending on the type of workpiece 1, and the amount of liquid resin 51 to be supplied is selected.
[0029] In the frame forming step 1002, the amount of liquid resin 51 to be supplied is selected to form a frame 11 with a desired thickness, width, and shape according to the type of workpiece 1. The number of times that the application nozzle 54 moves relative to the outer edge of the sheet 13 refers to the number of times that the application nozzle 54 moves around the entire outer edge of the sheet 13.
[0030] In the frame forming step 1002, an external stimulus such as ultraviolet radiation, ultrasonic waves, or heat is applied to the liquid resin 51. That is, the liquid resin 51 is a liquid resin that hardens when an external stimulus such as ultraviolet radiation, ultrasonic waves, or heat is applied, and becomes the frame 11 when hardened.
[0031] The method for manufacturing a frame unit of the present invention is composed of workpiece attachment step 1001 and frame formation step 1002. That is, in frame formation step 1002, the liquid resin 51 may be layered on the sheet 13 in multiple layers to thicken the frame 11, increase the width of the frame 11, or form the frame 11 into any shape.
[0032] (Processing step) Fig. 6 is a side view, partly in section, schematically showing the processing steps of the method for processing the workpiece shown in Fig. 2. Processing step 1003 is a step of processing workpiece 1 fixed to frame 11 by sheet 13.
[0033] In the first embodiment, in the processing step 1003, the cutting device 60 suction-holds the workpiece 1 on the holding surface 62 of the chuck table 61 via the sheet 13, and clamps the frame 11 with the clamping parts 63 arranged around the chuck table 61. In the first embodiment, in the processing step 1003, the cutting device 60 uses the imaging unit to capture an image of the workpiece 1 suction-held on the chuck table 61, and performs alignment.
[0034] In the first embodiment, in the processing step 1003, the cutting device 60 supplies processing water while moving the cutting blade 21 and the workpiece 1 relatively along the planned dividing lines 3, and causes the cutting blade 64 to cut into the planned dividing lines 3 of the workpiece 1 until it reaches the sheet 13. In the first embodiment, the cutting device 60 cuts all of the planned dividing lines 3 of the workpiece 1 based on the processing conditions, and divides the workpiece 1 into individual devices 5.
[0035] In the first embodiment, in the processing step 1003, cutting is performed on the workpiece 1. However, the present invention is not limited to cutting, and various other processes may be performed, such as laser processing in which a laser beam is irradiated, grinding processing in which an exposed surface (e.g., back surface 6) of the workpiece 1 is ground, and polishing processing in which an exposed surface (e.g., back surface 6) of the workpiece 1 is polished.
[0036] As described above, the method for processing a workpiece and the method for manufacturing a frame unit according to the first embodiment supply liquid resin 51 to sheet 13 and harden liquid resin 51 with an external stimulus to form frame 11, thereby making it possible to inexpensively form frame 11 of any shape. As a result, the method for processing a workpiece according to the first embodiment has the effect of being able to inexpensively manufacture frame unit 10 including frame 11 of any shape.
[0037] Furthermore, the method for processing a workpiece and the method for manufacturing a frame unit according to the first embodiment can inexpensively form the frame 11 in any shape, which has the effect of making the frame 11 disposable together with the sheet 13. As a result, the method for processing a workpiece according to the first embodiment can reduce the effort and man-hours required to reuse the frame 11.
[0038] Furthermore, the method for processing a workpiece and the method for manufacturing a frame unit according to embodiment 1 can arbitrarily form the shape of the frame 11 depending on the type of workpiece 1, which eliminates the need to prepare frames 11 of various sizes in advance, and also has the effect of making it possible to distinguish the type of workpiece 1 at a glance.
[0039] [Embodiment 2] A method for processing a workpiece according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 7 is a cross-sectional view schematically showing a frame unit in which a frame is formed by the frame formation step of the method for processing a workpiece according to the second embodiment. Fig. 8 is a side view, partially in cross section, schematically showing the processing step of the method for processing a workpiece according to the second embodiment. In Figs. 7 and 8, the same parts as those in the first embodiment are designated by the same reference numerals, and their description will be omitted.
[0040] The method for processing a workpiece according to the second embodiment is the same as that of the first embodiment, except that in the frame forming step 1002, liquid resin 51 is supplied onto the outer edge of the back surface 132 of the sheet 13 to form a frame 11 on the outer edge of the back surface 132 of the sheet 13, thereby manufacturing the frame unit 10-1. That is, in the second embodiment, the workpiece 1 is attached to the front surface 131, which is one surface of the sheet 13, and the frame 11 is formed on the back surface 132, which is the other surface of the sheet 13.
[0041] The method for processing a workpiece and the method for manufacturing a frame unit according to the second embodiment supply liquid resin 51 to a sheet 13 and harden the liquid resin 51 with an external stimulus to form a frame 11, and therefore, similar to the first embodiment, it has the effect of being able to manufacture a frame unit 10-1 having a frame 11 of any shape at low cost.
[0042] Furthermore, in the method for processing a workpiece according to the second embodiment, since the frame 11 is formed on the rear surface 132 of the sheet 13, in processing step 1003, the frame 11 is positioned behind the front surface 131 of the sheet 13 on which the workpiece 1 is processed, as shown in Fig. 8. As a result, in processing step 1003, in the method for processing a workpiece according to the second embodiment, the processing water does not accumulate on the inner edge of the frame 11, but can be drained from the outer edge of the sheet 13 along the front surface 131 as shown by arrow 200 in Fig. 8, thereby preventing processing waste from adhering to the sheet 13 or the frame 11 and preventing the adhering processing waste from scattering in the subsequent processing steps. Note that the clamp unit 63 is omitted from Fig. 6.
[0043] [Variation 1] A method for processing a workpiece according to Modification 1 of Embodiment 1 and Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 9 is a cross-sectional view schematically showing a frame unit in which a frame is formed by the frame forming step of the method for processing a workpiece according to Modification 1 of Embodiment 1 and Embodiment 2. In Fig. 9, the same parts as those in Embodiment 1 are designated by the same reference numerals, and their description will be omitted.
[0044] The method for processing a workpiece according to Modification 1 is the same as that of Embodiment 1, except that in frame forming step 1002, liquid resin 51 is colored in a color selected according to the type of workpiece 1 by mixing a colorant of a color selected according to the type of workpiece 1 into liquid resin 51, and frame unit 10-2 is manufactured that includes frame 11-2 colored in a color selected according to the type of workpiece 1, as shown in Fig. 9. Note that in Modification 1, workpiece 1 may be attached to front surface 131 of sheet 13, and frame 11 may be formed on back surface 132 of sheet 13, as in Embodiment 2.
[0045] The method for processing a workpiece and the method for manufacturing a frame unit according to variant example 1 supply liquid resin 51 to sheet 13 and harden the liquid resin 51 with an external stimulus to form frame 11-2, and therefore, similar to embodiment 1, has the effect of being able to manufacture a frame unit 10-2 at low cost and equipped with a frame 11-2 of any shape.
[0046] In addition, the method for processing a workpiece and the method for manufacturing a frame unit according to variant example 1 have the frame 11-2 colored in a color corresponding to the type of workpiece 1, which also has the effect of making it possible to distinguish the type of workpiece 1 at a glance.
[0047] [Variation 2] A method for processing a workpiece according to the first embodiment and the second modification of the second embodiment of the present invention will be described with reference to the drawings. Fig. 10 is a plan view schematically showing a frame unit in which a frame is formed by the frame forming step of the method for processing a workpiece according to the first embodiment and the second modification of the second embodiment. In Fig. 10, the same parts as those in the first embodiment are designated by the same reference numerals, and their description will be omitted.
[0048] 10, the method for processing a workpiece according to Modification 2 is the same as that of Embodiment 1, except that the planar shape of workpiece 1-3 is formed to be rectangular, and the planar shapes of the inner and outer edges of frame 11-3 manufactured in sheet 13-3 and frame forming step 1002 are formed to be quadrangular. Note that in Modification 2, similar to Embodiment 2, workpiece 1-3 may be attached to front surface 131 of sheet 13-3, and frame 11-3 may be formed on back surface 132 of sheet 13-3.
[0049] In addition, in variant example 2, the workpiece 1-3 is a resin package substrate such as a rectangular QFN (Quad Flat No leaded) package substrate having multiple devices sealed with resin, a ceramic substrate, a ferrite substrate, or a substrate containing at least one of nickel and iron, or a glass substrate.
[0050] The method for processing a workpiece and the method for manufacturing a frame unit according to variant example 2 supply liquid resin 51 to sheet 13-3 and harden the liquid resin 51 with an external stimulus to form frame 11-3, and therefore, as with embodiment 1, has the effect of being able to manufacture a frame unit 10-3 at low cost and equipped with a frame 11-3 of any shape.
[0051] The present invention is not limited to the above-described embodiment and modifications. In other words, various modifications can be made without departing from the gist of the present invention. For example, an IC tag such as an RFID tag may be embedded in the frames 11, 11-2, and 11-3, allowing information to be read and written to each frame 11, 11-2, and 11-3. The workpieces 1, 1-3 may be managed by the IC tag for each frame unit 10, 10-1, 10-2, and 10-3. After the workpieces 1, 1-3 are peeled from the sheets 13, 13-3, the sheets 13, 13-3 and the frames 11, 11-2, and 11-3 may be crushed to reduce their volume before disposal, or may be dissolved in a liquid (solvent, etc.) before disposal. [Explanation of symbols]
[0052] 1,1-3 Workpiece 10, 10-1, 10-2, 10-3 Frame Unit 11,11-2,11-3 Frame, 12 aperture 13,13-3 sheets 51 Liquid Resin 131 Surface (One Side) 132 Back (other side) 1001 Workpiece attachment step 1002 Frame Formation Step 1003 Processing Steps
Claims
1. A method for manufacturing a frame unit comprising a sheet covering an opening of an annular frame and a workpiece attached to the sheet, the frame unit consisting of only the frame, the sheet, and the workpiece, a workpiece adhering step of adhering the workpiece to the sheet; A method for manufacturing a frame unit, comprising: a frame forming step of supplying a liquid resin that hardens when exposed to an external stimulus to the outer periphery of the workpiece attached to the sheet in a ring shape surrounding the entire outer edge of the sheet, hardening the liquid resin when exposed to an external stimulus to form the frame, and integrating the sheet and the frame.
2. A method for manufacturing a frame unit in which a workpiece is attached to a sheet that covers an opening of an annular frame, comprising: a workpiece adhering step of adhering the workpiece to the sheet; a frame forming step of supplying a liquid resin that hardens in response to an external stimulus in a ring shape around the outer periphery of the workpiece attached to the sheet, surrounding the workpiece, hardening the liquid resin in response to the external stimulus to form the frame, and integrating the sheet and the frame; The method for manufacturing a frame unit comprises attaching the workpiece to one side of the sheet and forming the frame on the other side of the sheet.
3. 3. The method for manufacturing a frame unit according to claim 1, wherein the liquid resin is colored in a color selected according to the type of the workpiece.
4. 4. The method for manufacturing a frame unit according to claim 1, 2 or 3, wherein the amount of the liquid resin to be supplied is selected depending on the type of workpiece, and the frame is formed to a desired thickness and shape.
5. A method for processing a workpiece, comprising: a workpiece adhering step of adhering a workpiece to the sheet constituting the frame unit according to claim 1, claim 2, claim 3 or claim 4; a frame forming step of supplying a liquid resin that hardens in response to an external stimulus to an area of the sheet to which the workpiece is attached, surrounding the workpiece, hardening the liquid resin in response to the external stimulus to form the frame, and integrating the sheet and the frame; and a processing step of processing the workpiece fixed to the frame with the sheet.
Citation Information
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