Thermoelectric Module

Abstract

A thermoelectric module according to one embodiment of the present invention includes a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, a second substrate disposed on the second electrode, and a heat sink disposed on the second substrate, the heat sink including a protrusion disposed on at least one surface on a path through which a fluid passes.

Description

[Technical Field]

[0001] The present invention relates to thermoelectric modules, and more particularly to heat sinks for thermoelectric elements. [Background technology]

[0002] Thermoelectricity is a phenomenon that occurs due to the movement of electrons and holes within a material, and refers to the direct energy conversion between heat and electricity.

[0003] Thermoelectric elements are a general term for elements that utilize the thermoelectric phenomenon, and have a structure in which a P-type thermoelectric material and an N-type thermoelectric material are joined between metal electrodes to form a PN junction pair.

[0004] Thermoelectric elements can be classified into elements that utilize a temperature change in electrical resistance, elements that utilize the Seebeck effect, which is a phenomenon in which an electromotive force is generated by a temperature difference, and elements that utilize the Peltier effect, which is a phenomenon in which heat is absorbed or generated by an electric current.

[0005] Thermoelectric elements are widely used in home appliances, electronic components, communication components, etc. For example, thermoelectric elements can be used in cooling devices, heating devices, power generation devices, etc. Accordingly, the demand for thermoelectric performance of thermoelectric elements is increasing.

[0006] The thermoelectric element includes a substrate, an electrode, and a thermoelectric leg, the thermoelectric leg being disposed between an upper substrate and a lower substrate, the upper electrode being disposed between the thermoelectric leg and the upper substrate, and the lower electrode being disposed between the thermoelectric leg and the lower substrate.

[0007] Meanwhile, a heat sink is disposed on at least one of the upper and lower substrates of the thermoelectric device, and the fluid can pass through the heat sink. In this case, the flow velocity in the middle region of the heat sink may be faster than the flow velocity in the edge region, and the difference in flow velocity between the middle region and the edge region may become larger as the fluid travels longer. In other words, the amount of heat exchange between the fluid and the heat sink may decrease as the distance from the fluid inlet increases. Summary of the Invention [Problem to be solved by the invention]

[0008] The technical problem that the present invention aims to achieve is to provide a thermoelectric module with improved heat transfer performance between a substrate and a heat sink. [Means for solving the problem]

[0009] A thermoelectric module according to one embodiment of the present invention includes a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, a second substrate disposed on the second electrode, and a heat sink disposed on the second substrate, the heat sink including a protrusion disposed on at least one surface on a path through which a fluid passes.

[0010] The heat sink may have a shape in which predetermined patterns are regularly repeated and connected, and the protrusions may be arranged in each of the patterns.

[0011] Each of the patterns may include a first surface disposed on the second substrate, a second surface connected to the first surface and disposed in a direction perpendicular to the second substrate, a third surface connected to the second surface and disposed opposite the second substrate, and a fourth surface connected to the third surface, perpendicular to the second substrate, and disposed opposite the second surface, wherein the distance between the second substrate and the third surface is greater than the distance between the second substrate and the first surface, the first surface, the second surface, the third surface, and the fourth surface each extend along the direction in which the fluid passes, and the protrusion may be disposed on at least one of the first surface, the second surface, the third surface, and the fourth surface.

[0012] The protrusion may be disposed within an area formed by the second surface, the third surface, the fourth surface, and the second substrate.

[0013] The protrusions may be disposed on the second surface and the fourth surface.

[0014] The length of the protrusion along the direction in which the fluid passes may be 4 to 10% of the length of each of the second surface and the fourth surface, the thickness of the protrusion along a direction perpendicular to the direction in which the fluid passes and parallel to the second substrate may be 10 to 20% of the distance between the second surface and the fourth surface, and the height of the protrusion along a direction perpendicular to the second substrate may be 30 to 50% of the distance between the second substrate and the third surface.

[0015] The thickness of the protrusion may decrease along the direction in which the fluid passes.

[0016] The protrusion may be spaced apart from the second substrate.

[0017] The protrusion may be disposed on the third surface.

[0018] The protrusion may further be disposed on the first surface.

[0019] The protrusions may be disposed on at least one of the second surface and the fourth surface.

[0020] The protrusions disposed on at least one of the second surface and the fourth surface may not be symmetrical with respect to at least one of the second surface and the fourth surface.

[0021] A pair of protrusions arranged on the second surface and the fourth surface, respectively, within the area formed by the second surface, the third surface, the fourth surface, and the second substrate may be arranged symmetrically with respect to each other with respect to the direction in which the fluid passes, and another pair of protrusions arranged on the second surface and the fourth surface, respectively, outside the area formed by the second surface, the third surface, the fourth surface, and the second substrate may be arranged symmetrically with respect to each other with respect to the direction in which the fluid passes.

[0022] A thermoelectric module according to another embodiment of the present invention includes a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, a second substrate disposed on the second electrode, and a plurality of heat sinks disposed on the second substrate and spaced apart from each other at predetermined intervals, the plurality of heat sinks being spaced apart from each other by a first distance along a first direction in which a fluid passes, the first distance being 2.5 to 12.5% ​​of the width of the second substrate in the first direction.

[0023] The plurality of heat sinks may include a first heat sink and a second heat sink spaced apart from each other by the first distance along the first direction, and an area of ​​the first heat sink may be different from an area of ​​the second heat sink.

[0024] The separation area between the first heat sink and the second heat sink may be disposed between a point that is 50% and a point that is 100% of the width of the second substrate based on one end of the second substrate.

[0025] The separation area between the first heat sink and the second heat sink may be disposed between a point that is 60% and a point that is 90% of the width of the second substrate based on one end of the second substrate.

[0026] The first direction may be a direction from one end of the second substrate to another end opposite the one end of the second substrate.

[0027] The plurality of heat sinks may include a first heat sink and a second heat sink spaced apart from each other by the first distance along the first direction, the first heat sink may include a 1-1 heat sink and a 1-2 heat sink spaced apart from each other by the second distance along a second direction perpendicular to the first direction, and the second heat sink may include a 2-1 heat sink and a 2-2 heat sink spaced apart from each other by the second distance along the second direction.

[0028] The first distance may be greater than the second distance.

[0029] The first distance may be 1.1 to 2.8 times the second distance.

[0030] The second substrate may include a plurality of sub-substrates spaced apart from each other, and at least one heat sink may be disposed on each of the sub-substrates.

[0031] The sub-substrates may be connected by an insulating structure.

[0032] The substrate may further include a shield structure disposed to cover the separation areas between the plurality of sub-substrates.

[0033] Each heat sink has a shape in which a predetermined pattern is regularly repeated and connected, and each pattern may include a first surface disposed on the second substrate, a second surface extending upward from one end of the first surface, a third surface extending from the second surface to face the second substrate, and a fourth surface extending upward from the other end opposite the one end of the first surface.

[0034] A power generation device according to one embodiment of the present invention includes a first fluid-flow section, a thermoelectric element disposed on the first fluid-flow section, and a second fluid-flow section disposed on the thermoelectric element, the thermoelectric element including a first substrate disposed on the first fluid-flow section, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, the second fluid-flow section including a heat sink disposed on the second substrate, and the heat sink including protrusions disposed on at least one surface on a path through which a fluid passes.

[0035] A power generating device according to another embodiment of the present invention includes a first fluid-flow unit, a thermoelectric element disposed on the first fluid-flow unit, and a second fluid-flow unit disposed on the thermoelectric element, wherein the thermoelectric element includes a first substrate disposed on the first fluid-flow unit, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, wherein the second fluid-flow unit includes a plurality of heat sinks disposed on the second substrate and spaced apart from each other at a predetermined interval, wherein the plurality of heat sinks are disposed to be spaced apart from each other by a first distance along a first direction in which a fluid passes, and the first distance is 2.5 to 12.5% ​​of the width of the second substrate in the first direction. [Effects of the Invention]

[0036] According to the embodiments of the present invention, a thermoelectric module having excellent performance and high reliability can be obtained, and in particular, a thermoelectric module having high heat transfer performance between a substrate and a heat sink can be obtained.

[0037] The thermoelectric device according to the embodiment of the present invention can be applied not only to small-scale applications but also to large-scale applications such as vehicles, ships, steel mills, and incinerators. [Brief explanation of the drawings]

[0038] [Figure 1] FIG. 2 is a cross-sectional view of a thermoelectric element. [Figure 2] FIG. 2 is a perspective view of a thermoelectric element. [Figure 3] 1 is a cross-sectional view of an example of a thermoelectric module in which a heat sink is disposed on a thermoelectric element. [Figure 4] FIG. 4 is a perspective view of a substrate and a heat sink in the thermoelectric module illustrated in FIG. 3. [Figure 5] Figure 4 shows the fluid flow within one fin of the heat sink. [Figure 6] 1 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention. [Figure 7]3 is a perspective view of one fin in a heat sink included in a thermoelectric module according to an embodiment of the present invention. FIG. [Figure 8] 4 is a cross-sectional view of one fin in a heat sink included in a thermoelectric module according to an embodiment of the present invention. [Figure 9] 4 is a cross-sectional view of one fin in a heat sink included in a thermoelectric module according to an embodiment of the present invention. [Figure 10] 10 shows the structure of a protrusion according to another embodiment of the present invention. [Figure 11] 10 shows the structure of a protrusion according to another embodiment of the present invention. [Figure 12] 10 shows the structure of a protrusion according to yet another embodiment of the present invention. [Figure 13] 10 shows the structure of a protrusion according to yet another embodiment of the present invention. [Figure 14] 10 shows the results of an experiment on the temperature difference and pressure difference of a fluid relative to the size of the protrusion according to an embodiment of the present invention. [Figure 15] 10 shows the results of an experiment on the temperature difference and pressure difference of a fluid relative to the size of the protrusion according to an embodiment of the present invention. [Figure 16] 10 shows the results of an experiment on the temperature difference and pressure difference of a fluid relative to the size of the protrusion according to an embodiment of the present invention. [Figure 17] 3 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to an embodiment of the present invention. FIG. [Figure 18] 4 illustrates the flow of fluid within a heat sink of a thermoelectric module according to one embodiment of the present invention. [Figure 19] FIG. 10 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to another embodiment of the present invention. [Figure 20] FIG. 10 is a cross-sectional view of a thermoelectric module according to still another embodiment of the present invention. [Figure 21] 21 is a perspective view of a second substrate and a heat sink of the thermoelectric module of FIG. 20. FIG. [Figure 22] FIG. 10 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to yet another embodiment of the present invention. [Figure 23]FIG. 10 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to yet another embodiment of the present invention. [Figure 24] FIG. 10 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to yet another embodiment of the present invention. [Figure 25] 10 is a result of simulating the flow of fluid through the thermoelectric module according to the example. [Figure 26] 10 is a graph comparing the amount of power generation and the pressure difference of a fluid for the thermoelectric modules according to an example and a comparative example. [Figure 27] 1 is a perspective view of an example of a heat conversion device to which a thermoelectric module according to an embodiment of the present invention is applied; [Figure 28] FIG. 28 is an exploded perspective view of the heat exchanger of FIG. 27. [Figure 29] 10 is a perspective view of another example of a heat conversion device to which a thermoelectric module according to an embodiment of the present invention is applied. FIG. [Figure 30] FIG. 30 is an exploded perspective view of the heat exchanger of FIG. 29. DETAILED DESCRIPTION OF THE INVENTION

[0039] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0040] However, the technical concept of the present invention is not limited to the described embodiments and may be embodied in various different forms, and one or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical concept of the present invention.

[0041] Furthermore, unless otherwise clearly defined and described, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted in a way that would be commonly understood by a person of ordinary skill in the art to which the present invention belongs, and commonly used terms, such as dictionary-defined terms, may be interpreted in light of the contextual meaning of the relevant art.

[0042] Furthermore, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not intended to limit the present invention.

[0043] In this specification, the singular can also include the plural unless otherwise specified in the context, and when it is stated as "A and (and) at least one (or more) of B and C," it can include one or more of all possible combinations of A, B, and C.

[0044] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of embodiments of the present invention.

[0045] Such terms are merely used to distinguish a component from other components, and are not intended to limit the nature, order, or sequence of the components.

[0046] Furthermore, when a component is described as being "coupled," "coupled," or "connected" to another component, it can include not only cases where the component is directly coupled, coupled, or connected to the other component, but also cases where the component is "coupled," "coupled," or "connected" by yet another component between the component and the other component.

[0047] Furthermore, when something is described as being formed or disposed "above or below" a component, "above" or "below" includes not only the case where two components are in direct contact with each other but also the case where one or more other components are formed or disposed between the two components. Furthermore, when something is described as "above or below," it can mean not only the upper direction but also the lower direction based on one component.

[0048] FIG. 1 is a cross-sectional view of a thermoelectric element, and FIG. 2 is a perspective view of the thermoelectric element.

[0049] Referring to FIGS. 1 and 2, the thermoelectric device 100 includes a lower substrate 110 , a lower electrode 120 , a P-type thermoelectric leg 130 , an N-type thermoelectric leg 140 , an upper electrode 150 and an upper substrate 160 .

[0050] The lower electrode 120 is disposed between the lower substrate 110 and the lower bottom surfaces of the P-type thermoelectric legs 130 and the N-type thermoelectric legs 140, and the upper electrode 150 is disposed between the upper substrate 160 and the upper bottom surfaces of the P-type thermoelectric legs 130 and the N-type thermoelectric legs 140. Accordingly, the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 are electrically connected by the lower electrode 120 and the upper electrode 150. A pair of the P-type thermoelectric legs 130 and the N-type thermoelectric legs 140 disposed between and electrically connected to the lower electrode 120 and the upper electrode 150 may form a unit cell.

[0051] For example, when a voltage is applied to the lower electrode 120 and the upper electrode 150 via the lead wires 181, 182, the substrate through which current flows from the P-type thermoelectric leg 130 to the N-type thermoelectric leg 140 due to the Peltier effect absorbs heat and acts as a cooling part, and the substrate through which current flows from the N-type thermoelectric leg 140 to the P-type thermoelectric leg 130 heats up and acts as a heating part. Alternatively, when a temperature difference is applied between the lower electrode 120 and the upper electrode 150, charges in the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 move due to the Seebeck effect, generating electricity.

[0052] Although the output wires 181 and 182 are illustrated as being arranged on the lower substrate 110 in FIGS. 1 and 2, this is not limited thereto, and the output wires 181 and 182 may be arranged on the upper substrate 160, or one of the output wires 181 and 182 may be arranged on the lower substrate 110 and the other on the upper substrate 160.

[0053] Here, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be bismuth telluride (Bi-Te)-based thermoelectric legs containing bismuth (Bi) and tellurium (Te) as main materials. The P-type thermoelectric leg 130 may be a bismuth telluride (Bi-Te)-based thermoelectric leg containing at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the P-type thermoelectric leg 130 may contain 99 to 99.999 wt% of Bi-Sb-Te as a main raw material, and 0.001 to 1 wt% of at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In), based on a total weight of 100 wt%. The N-type thermoelectric leg 140 may be a bismuth telluride (Bi-Te)-based thermoelectric leg containing at least one of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the N-type thermoelectric leg 140 may contain 99 to 99.999 wt% of Bi-Se-Te as a main raw material, and 0.001 to 1 wt% of at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In), based on a total weight of 100 wt%. Accordingly, in this specification, the thermoelectric leg may be referred to as a semiconductor structure, semiconductor element, semiconductor material layer, semiconductor material layer, conductive semiconductor structure, thermoelectric structure, thermoelectric material layer, thermoelectric material layer, thermoelectric material layer, thermoelectric semiconductor structure, thermoelectric semiconductor element, thermoelectric semiconductor material layer, thermoelectric semiconductor material layer, thermoelectric semiconductor material layer, thermoelectric semiconductor material layer, etc.

[0054] The P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be formed in a bulk or laminated form. Generally, the bulk P-type thermoelectric leg 130 or the bulk N-type thermoelectric leg 140 can be obtained by heat-treating a thermoelectric material to produce an ingot, crushing and sieving the ingot to obtain powder for the thermoelectric legs, sintering the powder, and cutting the sintered compact. In this case, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be polycrystalline thermoelectric legs. For polycrystalline thermoelectric legs, the powder for the thermoelectric legs can be compressed at 100 MPa to 200 MPa when sintering. For example, when sintering the P-type thermoelectric leg 130, the powder for the thermoelectric legs can be sintered at 100 MPa to 150 MPa, preferably 110 MPa to 140 MPa, and more preferably 120 MPa to 130 MPa. When sintering the N-type thermoelectric legs 140, the powder for the thermoelectric legs can be sintered at a pressure of 150 to 200 MPa, preferably 160 to 195 MPa, and more preferably 170 to 190 MPa. In this way, when the P-type thermoelectric legs 130 and the N-type thermoelectric legs 140 are polycrystalline thermoelectric legs, the strength of the P-type thermoelectric legs 130 and the N-type thermoelectric legs 140 can be increased. The stacked P-type thermoelectric legs 130 or the stacked N-type thermoelectric legs 140 can be obtained by applying a paste containing a thermoelectric material onto a sheet-like substrate to form unit members, and then stacking and cutting the unit members.

[0055] In this case, the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 may have the same shape and volume or may have different shapes and volumes. For example, since the P-type thermoelectric legs 130 and N-type thermoelectric legs 140 have different electrical conduction characteristics, the height or cross-sectional area of ​​the N-type thermoelectric legs 140 may be formed to be different from the height or cross-sectional area of ​​the P-type thermoelectric legs 130.

[0056] In this case, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may have a cylindrical, polygonal, or elliptical columnar shape.

[0057] Alternatively, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may have a stacked structure. For example, the P-type thermoelectric leg or the N-type thermoelectric leg may be formed by stacking multiple structures in which a semiconductor material is coated on a sheet-like substrate and then cutting the stacked structures. This prevents material loss and improves electrical conductivity. Each structure may further include a conductive layer with an opening pattern, which increases adhesion between the structures, reduces thermal conductivity, and increases electrical conductivity.

[0058] Alternatively, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may be formed so that the cross-sectional area varies within the same thermoelectric leg. For example, the cross-sectional area of ​​both ends of a single thermoelectric leg that face the electrodes may be larger than the cross-sectional area between the ends. This can increase the temperature difference between the ends, thereby increasing thermoelectric efficiency.

[0059] The performance of the thermoelectric device according to an embodiment of the present invention can be expressed by a thermoelectric figure of merit (ZT). The thermoelectric figure of merit (ZT) can be expressed as in Equation 1.

[0060]

number

[0061] where α is the Seebeck coefficient [V / K], σ is the electrical conductivity [S / m], and α 2 σ is the power factor (PowerFactor [W / mK 2 ]), where T is the temperature and k is the thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, and a is the thermal diffusivity [cm 2 / S], cp is the specific heat [J / gK], and ρ is the density [g / cm 3 ].

[0062] To obtain the thermoelectric figure of merit of a thermoelectric element, a Z meter is used to measure the Z value (V / K), and the measured Z value can be used to calculate the thermoelectric figure of merit (ZT).

[0063] Here, the lower electrode 120 disposed between the lower substrate 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the upper electrode 150 disposed between the upper substrate 160 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may include at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni) and may have a thickness of 0.01 mm to 0.3 mm. If the thickness of the lower electrode 120 or the upper electrode 150 is less than 0.01 mm, it may function poorly as an electrode and its electrical conductivity may be reduced, and if it exceeds 0.3 mm, its conductivity may be reduced due to increased resistance.

[0064] The opposing lower substrate 110 and upper substrate 160 may be metal substrates, and their thickness may be 0.1 mm to 1.5 mm. If the thickness of the metal substrate is less than 0.1 mm or more than 1.5 mm, the heat dissipation characteristics or thermal conductivity may be excessively high, which may reduce the reliability of the thermoelectric device. Furthermore, if the lower substrate 110 and upper substrate 160 are metal substrates, an insulating layer 170 may be further formed between the lower substrate 110 and the lower electrode 120 and between the upper substrate 160 and the upper electrode 150, respectively. The insulating layer 170 may include a material having a thermal conductivity of 1 to 20 W / mK.

[0065] In this case, the lower substrate 110 and the upper substrate 160 may be formed to have different sizes. For example, the volume, thickness, or area of ​​one of the lower substrate 110 and the upper substrate 160 may be larger than the volume, thickness, or area of ​​the other. Accordingly, the heat absorption or heat dissipation performance of the thermoelectric module may be improved. For example, at least one of the volume, thickness, or area of ​​a substrate disposed in a high-temperature region for the Seebeck effect, a heat-generating region for the Peltier effect, or a substrate on which a sealing member for protecting the thermoelectric module from the external environment is disposed may be larger than the volume, thickness, or area of ​​the other substrate.

[0066] In addition, a heat dissipation pattern, for example, a concave-convex pattern, may be formed on the surface of at least one of the lower substrate 110 and the upper substrate 160. This can improve the heat dissipation performance of the thermoelectric device. If a concave-convex pattern is formed on the surface that contacts the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, the bonding characteristics between the thermoelectric leg and the substrate can also be improved. The thermoelectric device 100 includes a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate 160.

[0067] Although not shown, a sealing member may further be disposed between the lower substrate 110 and the upper substrate 160. The sealing member may be disposed on sides of the lower electrode 120, the P-type thermoelectric legs 130, the N-type thermoelectric legs 140, and the upper electrode 150 between the lower substrate 110 and the upper substrate 160. Accordingly, the lower electrode 120, the P-type thermoelectric legs 130, the N-type thermoelectric legs 140, and the upper electrode 150 may be sealed from external moisture, heat, contamination, etc. Here, the sealing member may include a sealing case disposed a predetermined distance from sides of the outermost edges of the plurality of lower electrodes 120, the outermost edges of the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140, and the outermost edges of the plurality of upper electrodes 150, a sealant disposed between the sealing case and the lower substrate 110, and a sealant disposed between the sealing case and the upper substrate 160. In this way, the sealing case can be in contact with the lower substrate 110 and the upper substrate 160 via the sealant. Accordingly, if the sealing case were in direct contact with the lower substrate 110 and the upper substrate 160, thermal conduction would occur through the sealing case, thereby preventing a decrease in the temperature difference between the lower substrate 110 and the upper substrate 160. The sealant may include at least one of epoxy resin and silicone resin, or a tape coated with at least one of epoxy resin and silicone resin on both sides. The sealant serves to seal between the sealing case and the lower substrate 110 and between the sealing case and the upper substrate 160, and can enhance the sealing effect of the lower electrode 120, the P-type thermoelectric leg 130, the N-type thermoelectric leg 140, and the upper electrode 150. The sealant may be used in combination with a finishing material, a finishing layer, a waterproofing material, a waterproofing layer, etc.

[0068] However, the above description of the sealing member is merely an example, and the sealing member may be modified in various ways. Although not shown, a heat insulating material may be further included to surround the sealing member. Alternatively, the sealing member may include a heat insulating component.

[0069] Although the terms lower substrate 110, lower electrode 120, upper electrode 150, and upper substrate 160 have been used above, these are merely arbitrarily referred to as upper and lower for ease of understanding and convenience of explanation, and the positions may be reversed so that the lower substrate 110 and lower electrode 120 are disposed on the upper side and the upper electrode 150 and upper substrate 160 are disposed on the lower side. Hereinafter, for convenience of explanation, the lower substrate 110, lower electrode 120, upper electrode 150, and upper substrate 160 may be referred to as the first substrate 110, first electrode 120, second electrode 150, and second substrate 160, respectively.

[0070] FIG. 3 is an example of a cross-sectional view of a thermoelectric module in which a heat sink is disposed on a thermoelectric element, FIG. 4 is a perspective view of the substrate and heat sink in the thermoelectric module illustrated in FIG. 3, and FIG. 5 shows the fluid flow within one fin of the heat sink in FIG. 4.

[0071] 3 and 4, a heat sink 200 is disposed on the second substrate 160 of the thermoelectric device 100. As described above, the thermoelectric device 100 includes a first substrate 110, a first electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, a second electrode 150, a second substrate 160, and an insulating layer 170, and lead wires 181 and 182 may be connected to the first electrode 120.

[0072] In this case, the heat sink 200 may be embodied to form an air passage using a flat substrate to allow surface contact with a fluid, e.g., air, passing through the heat sink 200 in a first direction. That is, the heat sink 200 may have a folding structure in which the substrate is folded to form a repeating pattern having a predetermined pitch P and height H. Each unit of the repeating pattern, i.e., each pattern, may be referred to as a fin (200f).

[0073] According to an embodiment of the present invention, the heat sink 200 may have a shape in which predetermined patterns are regularly repeated and connected. That is, the heat sink 200 may include a first pattern X1, a second pattern X2, and a third pattern X3, and these patterns may be an integral flat plate that is sequentially connected.

[0074] According to an embodiment of the present invention, each of the patterns X1, X2, and X3 may include a first surface 201, a second surface 202, a third surface 203, and a fourth surface 204 connected in sequence.

[0075] The first surface 201 may be disposed on the second substrate 160 and may be in contact with the adhesive layer 500. The adhesive layer 500 may be a thermally conductive material layer or a thermal grease layer. In some embodiments, the adhesive layer 500 may be omitted, and the second substrate 160 and the heat sink 200 may be connected to each other using a bonding member. The second surface 202 may be connected to the first surface 201 and may be disposed perpendicular to the second substrate 160. That is, the second surface 202 may extend upward from one end of the first surface 201. The third surface 203 may be connected to the second surface 202 and may be disposed opposite the second substrate 160. In this case, the distance between the second substrate 160 and the third surface 203 may be greater than the distance between the second substrate 160 and the first surface 201. The fourth surface 204 may be connected to the third surface 203, may be perpendicular to the second substrate 160, and may be disposed opposite the second surface 202.

[0076] The first surface 201, the second surface 202, the third surface 203 and the fourth surface 204 may be a single flat plate having a structure that is folded sequentially, and one set of the first surface 201, the second surface 202, the third surface 203 and the fourth surface 204 may form one fin 200f, and each fin 200f may extend along the direction in which the fluid passes, i.e., the first direction.

[0077] 5, it can be seen that the flow rate of the fluid flowing in the middle region of one fin 200f may be faster than the flow rate of the fluid flowing in the edge region. According to the principle of laminar flow entrance length, the difference in flow rate between the edge region and the middle region of the fluid may increase as the distance from the fluid inlet increases, i.e., as the length of one fin in the first direction (the direction of fluid flow) increases. As a result, a portion of the fluid flowing in the middle region of the fin 200f may be discharged without exchanging heat with the heat sink.

[0078] According to an embodiment of the present invention, a structure that creates vortices in the fluid is disposed in the heat sink to improve the efficiency of heat exchange between the fluid and the heat sink.

[0079] Fig. 6 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention, Fig. 7 is a perspective view of one fin in a heat sink included in a thermoelectric module according to an embodiment of the present invention, and Figs. 8 and 9 are cross-sectional views of one fin in a heat sink included in a thermoelectric module according to an embodiment of the present invention. Here, the detailed structure of the thermoelectric element 100, i.e., the lower substrate 110, lower electrode 120, P-type thermoelectric leg 130, N-type thermoelectric leg 140, upper electrode 150, upper substrate 160, and insulating layer 170, can be applied in the same manner as the description of Figs. 1 and 2, and therefore, for convenience of description, redundant description will be omitted.

[0080] 6 to 9, an adhesive layer 500 is disposed on the second substrate 160, and a heat sink 200 is disposed on the adhesive layer 500. The second substrate 160 and the heat sink 200 may be bonded together by the adhesive layer 500. The adhesive layer 500 may be a thermally conductive material layer or a thermal grease layer. However, depending on the embodiment, the adhesive layer 500 may be omitted, and the second substrate 160 and the heat sink 200 may be bonded together by a bonding member. Here, the heat sink 200 is described as being disposed on the upper substrate 160, i.e., the second substrate 160, but this is for convenience of explanation and is not intended to be limiting. That is, the heat sink 200 having the same structure as that of the embodiment of the present invention may be disposed on the lower substrate 110, i.e., the first substrate 110, or may be disposed on both the first substrate 110 and the second substrate 160.

[0081] The heat sink 200 according to the embodiment of the present invention has a shape in which predetermined patterns are regularly repeated and connected, and each pattern extends in the direction in which a fluid passes, i.e., the first direction. The details regarding each pattern can be applied in the same manner as those described with reference to FIGS. 3 and 4.

[0082] According to an embodiment of the present invention, the heat sink 200 includes protrusions 300 disposed on at least one surface of a fluid passageway. Accordingly, when the fluid passing through the heat sink 200 encounters the protrusions 300, the flow of the fluid changes from laminar flow to turbulent flow, slowing the flow velocity and increasing the amount of heat exchange between the heat sink 200 and the fluid.

[0083] More specifically, the protrusions 300 may be arranged in the patterns X1, X2, and X3, respectively, so that the flow rate of the fluid passing through the patterns X1, X2, and X3 may be controlled uniformly across the entire heat sink 200.

[0084] As described above, the first surface 201 may be disposed on the second substrate 160 and may be disposed so as to be in contact with the adhesive layer 500. The second surface 202 may be connected to the first surface 201 and may be disposed in a direction perpendicular to the second substrate 160. That is, the second surface 202 may extend upward from one end of the first surface 201. The third surface 203 may be connected to the second surface 202 and may be disposed so as to face the second substrate 160. In this case, the distance between the second substrate 160 and the third surface 203 may be greater than the distance between the second substrate 160 and the first surface 201. The fourth surface 204 may be connected to the third surface 203 and may be disposed so as to be perpendicular to the second substrate 160 and face the second surface 202.

[0085] According to an embodiment of the present invention, the protrusions 300 may be disposed on at least one of the first surface 201, the second surface 202, the third surface 203, and the fourth surface 204. For example, as shown in FIGS. 6 to 9, the protrusions 300 may be disposed in the region formed by the second surface 202, the third surface 203, the fourth surface 204, and the second substrate 106, and in particular, may be disposed on the second surface 202 and the fourth surface 204. Referring to FIGS. 8 to 9, a fluid that flows into the region formed by the second surface 202, the third surface 203, the fourth surface 204, and the second substrate 106, i.e., into the interior of the fin 200f, flows along a first direction within the fin 200f. When the fluid encounters the protrusions 300, turbulence occurs, slowing the flow velocity of the fluid, which may increase the amount of heat exchange between the fin 200f and the fluid. At this time, in order to efficiently generate turbulence, the protrusions 300 may be arranged symmetrically to each other, as arranged on the second surface 202 and the fourth surface 204.

[0086] In this case, the height a of the protrusion 300 along a direction perpendicular to the second substrate 160 may be 30 to 50% of the distance A between the second substrate 160 and the third surface 203, the thickness b of the protrusion 300 along a direction perpendicular to the fluid passage direction and parallel to the second substrate 160 may be 10 to 20% of the distance B between the second surface 202 and the fourth surface 204, and the length c of the protrusion 300 along the fluid passage direction may be 4 to 10% of the lengths of the second surface 202 and the fourth surface 204. If the protrusion 300 is above the lower limit of this numerical range, turbulence may be formed inside the heat sink 200, and if the protrusion 300 is below the upper limit of this numerical range, the pressure difference between the fluid flowing into the heat sink 200 and the fluid discharged from the heat sink 200 may be minimized.

[0087] In this case, the protrusion 300 may be disposed spaced apart from the second substrate 160. Accordingly, a vortex may be formed in the fluid flowing at an intermediate height among the fluids passing between the second substrate 160 and the third surface 203, and thus a vortex may also be formed in the fluid flowing at a low height along the second substrate 160 and the fluid flowing at a high height along the third surface 203.

[0088] Here, the protrusions 300 may be made of a metal material. For example, the protrusions 300 may be made of the same type of metal material as the heat sink 200. For example, the protrusions 300 may be integrally formed with the heat sink 200 as shown in FIG. 7. That is, when the protrusions 300 are disposed on the second surface 202, recessed grooves may be formed on one surface of the second surface 202, and the protrusions 300 may be formed on the opposite surface. In this way, the fluid in contact with the protrusions 300 may also exchange heat, thereby increasing the amount of heat exchange of the fluid.

[0089] Meanwhile, the protrusion 300 may have a rectangular cross section, i.e., a hexahedron shape, as shown in Fig. 8. Alternatively, the protrusion 300 may have a triangular cross section, i.e., a triangular prism shape, as shown in Fig. 9. In this manner, when the protrusion 300 has a triangular shape, if the thickness b of the protrusion 300 gradually decreases along the first direction, which is the direction in which the fluid passes, the fluid can also flow into the region G, thereby increasing the heat exchange area and amount between the heat sink 200 and the fluid.

[0090] 10 and 11 show the structure of a protrusion according to another embodiment of the present invention, and FIGS. 12 and 13 show the structure of a protrusion according to yet another embodiment of the present invention.

[0091] 10 and 11 , protrusions 300 are disposed within the region formed by second surface 202, third surface 203, fourth surface 204, and second substrate 106, but may also be disposed on third surface 203. Although not shown, protrusions 300 disposed on second surface 202 and fourth surface 204 and protrusions 300 disposed on third surface 203 may both be formed within a single fin 200f. Alternatively, protrusions 301 may also be disposed on first surface 201. In this case, vortexes of fluid may be generated not only within the region formed by second surface 202, third surface 203, fourth surface 204, and second substrate 106, but also outside the region formed by second surface 202, third surface 203, fourth surface 204, and second substrate 106, thereby improving heat exchange efficiency.

[0092] 12 and 13, protrusions 300 may be arranged on second surface 202 and fourth surface 204 within the region formed by second surface 202, third surface 203, fourth surface 204, and second substrate 106, and protrusions 301 may be arranged on second surface 202 and fourth surface 204 outside the region formed by second surface 202, third surface 203, fourth surface 204, and second substrate 106. That is, protrusions 300 and 301 may be arranged on both surfaces of second surface 202 and / or fourth surface 204. This may increase heat exchange efficiency because vortexes of fluid may be generated not only within the region formed by second surface 202, third surface 203, fourth surface 204, and second substrate 106, but also outside the region formed by second surface 202, third surface 203, fourth surface 204, and second substrate 106. In this case, two protrusions 300 arranged on the second surface 202 and the fourth surface 204 within the region formed by the second surface 202, the third surface 203, the fourth surface 204, and the second substrate 106 can be arranged symmetrically with respect to each other with respect to the fluid passage direction. And two protrusions 301 arranged on the second surface 202 and the fourth surface 204 outside the region formed by the second surface 202, the third surface 203, the fourth surface 204, and the second substrate 106 can be arranged symmetrically with respect to each other with respect to the fluid passage direction. And the protrusions 300 can be arranged asymmetrically with the protrusions 301 with respect to the second surface 202 and the fourth surface 204. As a result, the position where the vortex is formed within the area formed by the second surface 202, the third surface 203, the fourth surface 204 and the second substrate 106 can be different from the position where the vortex is formed outside the area formed by the second surface 202, the third surface 203, the fourth surface 204 and the second substrate 106, so that the heat exchange positions can be uniformly distributed along the direction of fluid flow, thereby improving the heat exchange efficiency.

[0093] 14 to 16 show the results of experiments on the temperature difference and pressure difference of a fluid relative to the size of the protrusion according to an embodiment of the present invention.

[0094] Here, in Examples 1 and 2, as shown in Figures 6 to 9, protrusions 300 are arranged on second surface 202 and fourth surface 204 within the area formed by second surface 202, third surface 203, fourth surface 204, and second substrate 106. Example 1 is a case where protrusions 300 have a hexahedral shape as shown in Figure 8, and Example 2 is a case where protrusions 300 have a triangular prism shape as shown in Figure 9. The temperature difference refers to the temperature difference between the fluid flowing into heat sink 200 and the fluid discharged from heat sink 200, and the pressure difference refers to the pressure difference between the fluid flowing into heat sink 200 and the fluid discharged from heat sink 200. A larger temperature difference means higher heat exchange performance, and a larger pressure difference means lower heat exchange performance.

[0095] In Figure 14, the temperature difference and pressure difference were tested while increasing the length c of the protrusion 300 relative to the length C of each of the second surface 202 and the fourth surface 204 along the direction in which the fluid passes. As a result, it was found that the temperature difference becomes large when the length c of the protrusion 300 along the direction in which the fluid passes is 4% or more (P1) of the length of each of the second surface 202 and the fourth surface 204, and the pressure difference becomes large when it exceeds 10% (P2).

[0096] In Figure 15, the temperature difference and pressure difference were tested while increasing the thickness b of the protrusion 300 relative to the distance B between the second surface 202 and the fourth surface 204 along the direction parallel to the second substrate 160. As a result, it was found that the temperature difference increases when the thickness b of the protrusion 300 along the direction parallel to the second substrate 160 is more than 10% (P1) of the distance B between the second surface 202 and the fourth surface 204, and the pressure difference increases when it exceeds 20%.

[0097] In Figure 16, the temperature difference and pressure difference were tested while increasing the height a of the protrusion 300 relative to the distance A between the second substrate 160 and the third surface 203 along the direction perpendicular to the second substrate 160. As a result, it was found that the temperature difference increases when the height a of the protrusion 300 along the direction perpendicular to the second substrate 160 is more than 30% (P1) of the distance A between the second substrate 160 and the third surface 203, and the pressure difference increases when it exceeds 50%.

[0098] Fig. 17 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to another embodiment of the present invention, and Fig. 18 shows the flow of fluid within the heat sink of the thermoelectric module according to another embodiment of the present invention. Regarding the structure of the thermoelectric element, duplicated descriptions of the same content as those described with reference to Figs. 1 to 4 will be omitted. The following embodiments are described separately from the embodiments of Figs. 6 to 13, but are not limited thereto, and the following embodiments may be combined with the embodiments of Figs. 6 to 13.

[0099] Referring to FIG. 17, a heat sink 200 may include a plurality of heat sinks 210, 220 spaced apart at predetermined intervals, and fluid may pass through the plurality of heat sinks 210, 220 in a first direction.

[0100] In this case, the plurality of heat sinks 210, 220 may be arranged to be spaced apart from each other by a first distance d1 along a first direction, which is a direction in which the fluid flows. For convenience of explanation, the first heat sink 210 and the second heat sink 220 are illustrated to be spaced apart from each other by the first distance d1 along the first direction, which is a direction in which the fluid flows, but this is not limited thereto, and the plurality of heat sinks may include two or more heat sinks sequentially arranged to be spaced apart from each other by the first distance d1 along the first direction.

[0101] Although not shown, in one heat sink, the flow velocity of the fluid in the middle region may be faster than the flow velocity of the fluid in the edge region. As the length of one heat sink in the first direction, which is the direction in which the fluid flows, increases, the difference in the fluid flow velocities may increase, thereby allowing for more efficient heat exchange.

[0102] 18, the heat sinks 210, 220 may be arranged to be spaced apart from each other by a first distance d1 along a first direction, which is the direction in which the fluid flows. As a result, a vortex of the fluid occurs in the space between the first heat sink 210 and the second heat sink 220, causing a portion of the fluid that has passed through the first heat sink 210 to be discharged to the outside, and a portion of the external fluid to flow into the second heat sink 220 through the space between the first heat sink 210 and the second heat sink 220, thereby improving heat exchange performance.

[0103] That is, at least a portion of the fluid that has passed through the first heat sink 210, i.e., the fluid whose temperature has decreased through heat exchange with the first heat sink 210, may be discharged to the outside through the separation region between the first heat sink 210 and the second heat sink 220. At this time, the fluid discharged to the outside may be fluid that has passed through the middle region of the first heat sink 210 at a faster speed. Then, to fill the space vacated by the fluid discharged to the outside through the separation region between the first heat sink 210 and the second heat sink 220, an external fluid, i.e., a fluid having a higher temperature than the fluid that passed through the first heat sink 210, may flow into the second heat sink 220 through the separation region between the first heat sink 210 and the second heat sink 220 and exchange heat through the second heat sink 220.

[0104] This allows high-temperature fluid to be replenished through the space between the first heat sink 210 and the second heat sink 220, thereby reducing the pressure difference between the fluid before passing through the first heat sink 210 and after passing through the second heat sink 220, thereby enabling the thermoelectric module to have uniform heat exchange performance throughout, regardless of the position from the fluid inlet to the outlet.

[0105] In this case, the first distance d1 in the first direction between the first heat sink 210 and the second heat sink 220 may be 2.5 to 12.5%, preferably 3.5 to 11.5%, and more preferably 5 to 10% of the width W in the first direction of the second substrate 160. If the first distance d1 is shorter than this value, it may be difficult for the internal fluid to be discharged to the outside or for the external fluid to flow into the inside through the separation space between the first heat sink 210 and the second heat sink 220. If the first distance d1 is longer than this value, the area of ​​the heat sink that can come into contact with the fluid may be reduced, resulting in reduced heat exchange performance.

[0106] 19 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to another embodiment of the present invention. Descriptions that are the same as those described above will be omitted.

[0107] 19, the first heat sink 210 and the second heat sink 220 may be disposed to be spaced apart from each other by a first distance d1 along a first direction, which is a direction in which a fluid flows. In this case, the area of ​​the first heat sink 210 may be different from the area of ​​the second heat sink 220.

[0108] When the first heat sink 210 and the second heat sink 220 are sequentially arranged along a first direction, which is a direction from the fluid inlet to the fluid outlet, the area of ​​the first heat sink 210 may be larger than the area of ​​the second heat sink 220. That is, the separation area between the first heat sink 210 and the second heat sink 220 may be located between 50% and 100%, more preferably between 60% and 90%, of the width W of the second substrate 160, based on one end 162 of the second substrate 160.

[0109] Generally, fluid pressure may increase as one approaches the fluid outlet from the fluid inlet. In particular, the fluid flow rate, fluid viscosity, the pitch P of the heat dissipation fins forming the heat sink, or the length of the heat sink may affect the fluid pressure difference between the fluid inlet and outlet. In applications where the fluid at the inlet side is forced to flow in the heat sink 200 area, the greater the fluid pressure difference between the fluid inlet and outlet, the higher the fluid resistance, and accordingly, the fluid pressure in the adjacent area increases. As a result, some of the fluid that stagnates without passing through the heat sink 200 may flow back, adversely affecting the surrounding system, and the air that has passed through the heat sink 200 may not flow at an appropriate rate. Therefore, to prevent a decrease in the efficiency of a thermoelectric module or a thermoelectric system using the same, it is preferable to minimize the pressure difference between the fluid before and after passing through the heat sink 200 area. As in the embodiment of the present invention, when the separation area between the first heat sink 210 and the second heat sink 220 is positioned closer to the fluid discharge section than the fluid inlet section, the fluid pressure difference between the fluid inlet section and the fluid discharge section can be reduced, thereby further improving the heat exchange efficiency.

[0110] Meanwhile, a heat sink 200 may be bonded onto the second substrate 160, allowing high-temperature fluid to pass through the heat sink 200. Generally, the thermal expansion coefficient of the heat sink 200 is greater than that of the second substrate 160. As a result, shear stress may be applied to the interface between the heat sink 200 and the second substrate 160, which may cause the thermoelectric module to bend. In an embodiment of the present invention, the heat sink 200 is divided to minimize the shear stress applied to the interface between the heat sink 200 and the second substrate 160.

[0111] FIG. 20 is a cross-sectional view of a thermoelectric module according to still another embodiment of the present invention, and FIG. 21 is a perspective view of a second substrate and a heat sink of the thermoelectric module of FIG.

[0112] 20 and 21, the heat sinks 230 and 240 may be arranged to be spaced apart from each other by a second distance d2 along a second direction perpendicular to the first direction in which the fluid passes.

[0113] In this manner, when multiple heat sinks 230, 240 are disposed spaced apart on one second substrate 160, it is possible to minimize shear stress applied to the interface between the second substrate 160 and the heat sink 200 due to the difference in thermal expansion coefficients between the second substrate 160 and the heat sink 200. That is, the shear stress applied to the second substrate 160 may be the product of the thermal expansion coefficient of the second substrate 160 and the difference in length of the second substrate 160, and the shear stress applied to the heat sink 200 may be the product of the thermal expansion coefficient of the heat sink 200 and the difference in length of the heat sink 200. Here, the difference in length of the second substrate 160 refers to the difference between the length L1 of the second substrate 160 before thermal deformation and the length after thermal deformation, and the difference in length of the heat sink 200 refers to the difference between the lengths L2 and L3 of the heat sink 200 before thermal deformation and the length after thermal deformation.

[0114] When the heat sink 200 is implemented as a plurality of heat sinks 230, 240 spaced apart from each other, as in the embodiment of the present invention, the difference in length of the heat sink 200 can be reduced compared to when a single heat sink 200 is implemented along the second direction perpendicular to the first direction of fluid flow. As a result, even if the thermal expansion coefficient of the heat sink 200 is greater than that of the second substrate 160, the shear stress applied to the interface between the second substrate 160 and the heat sink 200 can be reduced, thereby preventing the thermoelectric module from bending.

[0115] FIG. 22 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to yet another embodiment of the present invention, and FIG. 23 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to yet another embodiment of the present invention.

[0116] 22 and 23, the heat sink 200 may include a plurality of heat sinks spaced apart by a first distance d1 along a first direction in which a fluid flows and spaced apart by a second distance d2 along a second direction perpendicular to the first direction.

[0117] 22, the heat sink 200 may include a first heat sink 210 and a second heat sink 220 spaced apart by a first distance d1 along a first direction of fluid flow, the first heat sink 210 may include a first heat sink 210-1 and a second heat sink 210-2 spaced apart by a second distance d2 along a second direction perpendicular to the first direction, and the second heat sink 220 may include a second heat sink 220-1 and a second heat sink 220-2 spaced apart by the second distance d2 along the second direction. This may improve the heat exchange performance described in the embodiments of FIGS. 17 to 19 and the structural stability of the thermoelectric module described in the embodiments of FIGS. 20 to 21.

[0118] In this case, the first distance d1 may be equal to or greater than the second distance d2. Preferably, the first distance d1 is 1.1 to 2.8 times the second distance d2. If the first distance d1 is less than 1.1 times the second distance d2, it may be difficult for the internal fluid to be discharged to the outside or for the external fluid to be introduced into the inside through the space between the first heat sink 210 and the second heat sink 220. Also, if the first distance d1 is more than 2.8 times the second distance d2, the area of ​​the heat sink that can come into contact with the fluid may be reduced, resulting in reduced heat exchange performance. This allows for a thermoelectric module with improved heat exchange performance and structural stability.

[0119] Referring to FIG. 23, the heat sink 200 includes a first heat sink 210 and a second heat sink 220 arranged to be spaced apart from each other by a first distance d1 along a first direction in which a fluid flows, the first heat sink 210 includes a 1-1 heat sink 210-1, a 1-2 heat sink 210-2, and a 1-3 heat sink 210-3 arranged to be spaced apart from each other by a second distance d2 along a second direction perpendicular to the first direction, and the second heat sink 220 includes a 2-1 heat sink 220-1, a 2-2 heat sink 220-2, and a 2-3 heat sink 220-3 arranged to be spaced apart from each other by a second distance d2 along the second direction.

[0120] As such, the number and arrangement of the heat sinks 200 can be varied in various ways depending on the size of the thermoelectric module.

[0121] Although the above description has focused on an embodiment in which a plurality of heat sinks are arranged on one second substrate 160, the present invention is not limited to this.

[0122] FIG. 24 is a perspective view of a second substrate and a heat sink of a thermoelectric module according to yet another embodiment of the present invention.

[0123] 24, the heat sink 200 includes a first heat sink 210 and a second heat sink 220 spaced apart by a first distance d1 along a first direction of fluid flow, the first heat sink 210 includes a first heat sink 210-1 and a second heat sink 210-2 spaced apart by a second distance d2 along a second direction perpendicular to the first direction, and the second heat sink 220 includes a second heat sink 220-1 and a second heat sink 220-2 spaced apart by the second distance d2 along the second direction. This can improve the heat exchange performance described in the embodiments of FIGS. 17 to 19 and the structural stability of the thermoelectric module described in the embodiments of FIGS. 20 and 21.

[0124] Meanwhile, in general, a heat sink is disposed on a high-temperature substrate, and the shear stress applied to the interface between the high-temperature substrate and the electrode and the shear stress applied to the interface between the low-temperature substrate and the electrode may differ depending on the temperature difference between the high-temperature substrate and the low-temperature substrate, which may cause the thermoelectric module to bend structurally and reduce its durability.

[0125] To solve this problem, similar to the heat sink 200, the second substrate 160 may also include a plurality of sub-substrates 160-1, 160-2, 160-3, and 160-4 spaced apart from one another, with at least one heat sink disposed on each sub-substrate. That is, although the thermoelectric element includes a first substrate (not shown) and a second substrate 160, the first substrate (not shown) is a low-temperature side substrate and the second substrate 160 is a high-temperature side substrate, and for one first substrate (not shown), the second substrate 160 may include a plurality of sub-substrates 160-1, ..., 160-4. This may minimize the difference in thermal deformation between the high-temperature side substrate and the low-temperature side substrate.

[0126] Although not shown, an insulating structure may be disposed between each of the plurality of sub-substrates 160-1, 160-2, 160-3, and 160-4 that are spaced apart from one another, or a shielding structure may be disposed to cover the entire area between the plurality of sub-substrates 160-1, 160-2, 160-3, and 160-4. The shielding structure may be disposed to cover the spaced apart area between the plurality of sub-substrates 160-1, 160-2, 160-3, and 160-4, or may be disposed such that the side surface of the heat sink 200 covers the edges of each sub-substrate 160-1, 160-2, 160-3, and 160-4 as well as the spaced apart area between the plurality of sub-substrates 160-1, 160-2, 160-3, and 160-4. This allows the plurality of sub-substrates 160-1, 160-2, 160-3, and 160-4 to be structurally stably supported and to reduce thermal deformation of the plurality of sub-substrates 160-1, 160-2, 160-3, and 160-4. Also, the thermoelectric elements can be sealed from external moisture, heat, contamination, etc. Alternatively, each of the sub-substrates 160-1, ..., 160-4 can be coupled to the first substrate (not shown) through a coupling member.

[0127] FIG. 25 shows the results of simulating the flow of fluid through the thermoelectric module according to the example, and FIG. 26 is a graph comparing the amount of power generation and the pressure difference of the fluid for the thermoelectric modules according to the example and the comparative example.

[0128] In the thermoelectric module according to the example, the second substrate has a size of 100 mm*100 mm, and four heat sinks are arranged on the second substrate so as to be spaced apart from each other with a first distance d1 and a second distance d2.

[0129] In the thermoelectric module according to the comparative example, the second substrate had a size of 100 mm*100 mm, and a single heat sink was disposed on the second substrate.

[0130] Two thermoelectric modules according to the example and two thermoelectric modules according to the comparative example were placed, and a fluid was passed through them.

[0131] Referring to FIG. 25, it can be seen that the pressure difference between the fluid inlet and outlet in the thermoelectric module according to the embodiment is not large.

[0132] Furthermore, referring to FIG. 26, it can be seen that in the thermoelectric module according to the embodiment, the greater the separation distance between the heat sinks along the first direction in which the fluid flows, the lower the fluid pressure difference between the fluid inlet and outlet. It can also be seen that when the separation distance between the heat sinks is 2.5 to 12.5 mm, a higher amount of power generation can be obtained compared to the thermoelectric module according to the comparative example.

[0133] In addition, embodiments of the present invention may be combined in various ways.

[0134] The thermoelectric modules according to the embodiments of the present invention described above can be applied to thermal conversion devices.

[0135] FIG. 27 is a perspective view of an example of a heat exchanger to which a thermoelectric module according to an embodiment of the present invention is applied, and FIG. 28 is an exploded perspective view of the heat exchanger of FIG.

[0136] FIG. 29 is a perspective view of another example of a heat exchanger to which a thermoelectric module according to an embodiment of the present invention is applied, and FIG. 30 is an exploded perspective view of the heat exchanger of FIG.

[0137] 17 to 30, the thermal exchange device 1000 includes a duct 1100, a first thermoelectric module 1200, a second thermoelectric module 1300, and a gas guide member 1400. Here, the thermal exchange device 1000 can generate electricity by utilizing the temperature difference between a cooling fluid flowing through the inside of the duct 1100 and a high-temperature gas passing through the outside of the duct 1100.

[0138] For this purpose, the first thermoelectric module 1200 may be disposed on one surface of the duct 1100, and the second thermoelectric module 1300 may be disposed on the other surface of the duct 1100. In this case, of both surfaces of the first thermoelectric module 1200 and the second thermoelectric module 1300, the surface facing the duct 1100 serves as a low-temperature portion, and electricity can be generated by utilizing the temperature difference between the low-temperature portion and the high-temperature portion. The thermoelectric module according to an embodiment of the present invention may be applied to the first thermoelectric module 1200 or the second thermoelectric module 1300.

[0139] The cooling fluid flowing into the duct 1100 may be, but is not limited to, water, and may be any of various types of fluids with cooling properties. The temperature of the cooling fluid flowing into the duct 1100 may be, but is not limited to, less than 100°C, preferably less than 50°C, and more preferably less than 40°C. The temperature of the cooling fluid discharged after passing through the duct 1100 may be higher than the temperature of the cooling fluid flowing into the duct 1100.

[0140] The cooling fluid flows into the duct 1100 through the cooling fluid inlet and is discharged through the cooling fluid outlet.

[0141] Although not shown, heat dissipation fins may be arranged on the inner wall of the duct 1100. The shape, number, and area of ​​the heat dissipation fins on the inner wall of the duct 1100 may be varied in various ways depending on the temperature of the cooling fluid, the temperature of the waste heat, the required power generation capacity, etc.

[0142] Meanwhile, the first thermoelectric module 1200 is disposed on one side of the duct 1100, and the second thermoelectric module 1300 is disposed on the other side of the duct 1100 so as to be symmetrical to the first thermoelectric module 1200.

[0143] Here, the first thermoelectric module 1200 and the second thermoelectric module 1300 arranged symmetrically to the first thermoelectric module 1200 may be referred to as a pair of thermoelectric modules or a unit thermoelectric module. Each of the first thermoelectric module 1200 and the second thermoelectric module 1300 may include a thermoelectric module according to an embodiment of the present invention. For example, each of the first thermoelectric module 1200 and the second thermoelectric module 1300 may include a thermoelectric element 100 according to an embodiment of the present invention and a plurality of heat sinks 200 arranged spaced apart from each other on the second substrate 160 of the thermoelectric element 100, and the first substrate 110 of the thermoelectric element 100 may be arranged facing the duct 1100. In this specification, the duct 1100 may be referred to as a first fluid-flow portion, and the heat sink 200 may be referred to as a second fluid-flow portion.

[0144] The duct 1100 may further include a gas guide member 1400, a sealing member 1800, and a heat insulating member 1700 arranged in the direction of air flow.

[0145] However, application examples of the thermoelectric module according to the embodiment of the present invention are not limited thereto.

[0146] The thermoelectric module according to the embodiment of the present invention may be used in power generation devices, cooling devices, heating devices, etc. Specifically, the thermoelectric module according to the embodiment of the present invention may be mainly applied to optical communication modules, sensors, medical devices, measuring devices, the aerospace industry, refrigerators, chillers, automotive ventilation seats, cup holders, washing machines, dryers, wine cellars, water purifiers, power supplies for sensors, thermopiles, etc.

[0147] In addition, the thermoelectric module according to the embodiment of the present invention can be applied to other industrial fields for power generation, cooling, and heating.

[0148] Although the present invention has been described above with reference to preferred embodiments, it will be understood that those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention as set forth in the following claims.

Claims

1. A first substrate, a first electrode disposed on the first substrate; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; a second substrate disposed on the second electrode; and a heat sink disposed on the second substrate; The heat sink includes a protrusion disposed on at least one surface on a path for a fluid to pass through, The heat sink has a shape in which a predetermined pattern is regularly repeated and connected, Each pattern is a first surface disposed on the second substrate; a second surface connected to the first surface and disposed perpendicular to the second substrate; a third surface coupled to the second surface and positioned opposite the second substrate; and a fourth surface connected to the third surface, perpendicular to the second substrate, and disposed opposite the second surface; the first surface, the second surface, the third surface, and the fourth surface are an integral flat plate having a structure that can be folded sequentially; a distance between the second substrate and the third surface is greater than a distance between the second substrate and the first surface; the first surface, the second surface, the third surface, and the fourth surface each extend along a direction in which the fluid passes; a pair of protrusions arranged on the second surface and the fourth surface in an area formed by the second surface, the third surface, the fourth surface, and the second substrate, respectively, are opposed to each other and are arranged symmetrically with respect to a direction in which the fluid passes; a length of the protrusion along a direction for the fluid to pass through is 4 to 10% of a length of each of the second surface and the fourth surface; a thickness of the protrusion along a direction perpendicular to the direction for the fluid to pass and parallel to the second substrate is 10 to 20% of a distance between the second surface and the fourth surface; a height of the protrusion along a direction perpendicular to the second substrate is 30 to 50% of a distance between the second substrate and the third surface; A thermoelectric module, wherein the thickness of the protrusions decreases along the direction in which the fluid passes.

2. The thermoelectric module according to claim 1 , wherein the protrusions are further disposed on at least one of the first surface and the third surface of each of the patterns.

3. The thermoelectric module according to claim 1 , wherein the protrusions are disposed on at least one of the second surface and the fourth surface.

4. 2. The thermoelectric module of claim 1, wherein the heat sink is disposed on the second substrate and includes a plurality of sub-heat sinks spaced apart from each other at predetermined intervals, the plurality of sub-heat sinks being spaced apart from each other by a first distance along a first direction in which a fluid passes, the first distance being 2.5 to 12.5% ​​of the width of the second substrate in the first direction.

5. The thermoelectric module of claim 1 , further comprising an adhesive layer disposed between the second substrate and the first surface.

6. 2. The thermoelectric module according to claim 1, wherein another pair of protrusions arranged on the second surface and the fourth surface, respectively, outside the area formed by the second surface, the third surface, the fourth surface, and the second substrate are arranged symmetrically with respect to the direction in which the fluid passes.

7. 5. The thermoelectric module of claim 4, wherein the plurality of sub-heatsinks include a first sub-heatsink and a second sub-heatsink arranged to be spaced apart from each other by the first distance along the first direction, and an area of ​​the first sub-heatsink is different from an area of ​​the second sub-heatsink.

8. 8. The thermoelectric module of claim 7, wherein the separation area between the first sub-heatsink and the second sub-heatsink is disposed between a point that is 50% and a point that is 100% of the width of the second substrate based on one end of the second substrate.

9. 5. The thermoelectric module of claim 4, wherein the plurality of sub-heatsinks include a first sub-heatsink and a second sub-heatsink spaced apart from each other by the first distance along the first direction, the first sub-heatsink includes a first sub-heatsink and a first sub-heatsink spaced apart from each other by the second distance along a second direction perpendicular to the first direction, and the second sub-heatsink includes a second sub-heatsink and a second sub-heatsink spaced apart from each other by the second distance along the second direction.

10. The thermoelectric module of claim 9 , wherein the first distance is greater than the second distance.

11. a first fluid-flow section; a thermoelectric element disposed on the first fluid-flow portion; a second fluid-flow portion disposed above the thermoelectric element; the thermoelectric element includes a first substrate disposed on the first fluid-flow portion, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode; the second fluid-flow portion includes a heat sink disposed on the second substrate, and the heat sink includes protrusions disposed on at least one surface on a path for a fluid to pass through; The heat sink has a shape in which a predetermined pattern is regularly repeated and connected, Each pattern is a first surface disposed on the second substrate; a second surface connected to the first surface and disposed perpendicular to the second substrate; a third surface coupled to the second surface and positioned opposite the second substrate; and a fourth surface connected to the third surface, perpendicular to the second substrate, and disposed opposite the second surface; the first surface, the second surface, the third surface, and the fourth surface are an integral flat plate having a structure that can be folded sequentially; a distance between the second substrate and the third surface is greater than a distance between the second substrate and the first surface; the first surface, the second surface, the third surface, and the fourth surface each extend along a direction in which the fluid passes; a pair of protrusions arranged on the second surface and the fourth surface in an area formed by the second surface, the third surface, the fourth surface, and the second substrate, respectively, are opposed to each other and are arranged symmetrically with respect to a direction in which the fluid passes; a length of the protrusion along a direction for the fluid to pass through is 4 to 10% of a length of each of the second surface and the fourth surface; a thickness of the protrusion along a direction perpendicular to the direction for the fluid to pass and parallel to the second substrate is 10 to 20% of a distance between the second surface and the fourth surface; a height of the protrusion along a direction perpendicular to the second substrate is 30 to 50% of a distance between the second substrate and the third surface; The power generating device, wherein the thickness of the protrusions decreases along the direction in which the fluid passes.

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