resin composition

Abstract

To provide a novel resin composition capable of giving a cured product which exhibits good dielectric characteristics, has good smear removability, and also has good crack resistance.SOLUTION: The resin composition contains (A) an epoxy resin, (B) an active ester resin, and (C) a (meth)acrylate compound having a C10 or higher aliphatic group.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition, and further to a resin sheet, a cured product, a circuit board, and a semiconductor device. [Background technology]

[0002] Resin compositions containing epoxy resins and their curing agents produce cured products with excellent insulating properties, heat resistance, adhesion, and other properties, and have therefore been widely used as insulating materials for circuit boards such as printed wiring boards and rewiring boards for semiconductor chip packages.

[0003] On the other hand, with the recent increase in communication speeds, insulating materials for circuit boards are required to have excellent dielectric properties (low dielectric dissipation factor) in order to reduce transmission loss when operating in a high-frequency environment. As insulating materials with excellent dielectric properties, those that use specific curing agents such as active ester resins that can reduce or suppress the generation of polar groups such as secondary hydroxyl groups during the curing reaction of epoxy resins have been reported (for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-157027 [Patent Document 2] Japanese Patent Publication No. 2020-94213 Summary of the Invention [Problem to be solved by the invention]

[0005] In this regard, if an active ester resin is blended to such an extent that good dielectric properties are achieved, the smear removability during desmearing tends to deteriorate and cracks tend to occur easily after desmearing.

[0006] An object of the present invention is to provide a novel resin composition that can provide a cured product that exhibits good dielectric properties, good smear removal properties, and good crack resistance. [Means for solving the problem]

[0007] As a result of extensive investigations, the present inventors have found that the above problems can be solved by a resin composition having the following constitution, and have thus completed the present invention.

[0008] That is, the present invention includes the following. [1] (A) epoxy resin, (B) an activated ester resin, and (C) (Meth)acrylate compounds containing an aliphatic group having 10 or more carbon atoms A resin composition comprising: [2] The resin composition according to [1], wherein the mass ratio of the component (B) to the component (A) [component (B) / component (A)] is 0.8 or more. [3] The resin composition according to [1] or [2], wherein the content of component (C) is 0.5% by mass or more when the resin component in the resin composition is taken as 100% by mass. [4] The resin composition according to any one of [1] to [3], wherein the component (C) contains a divalent aliphatic group represented by the following formula (1): [ka] (In formula (1), A C each independently represents a single bond or a divalent aliphatic group, Ring Z C represents an aliphatic ring which may have a substituent, * represents a bond, Two A's C and Ring Z C The total number of carbon atoms is 10 or more.) [5] The resin composition according to any one of [1] to [4], wherein the component (C) has a structure represented by the following formula (C1): [ka] (In formula (C1), X's each independently represent a (meth)acryloyl group; A 1 each independently represents a divalent aliphatic group, A 2 each independently represents a divalent aliphatic group having 10 or more carbon atoms, L 1 each independently represents a divalent linking group, n1 represents a number equal to or greater than 1.) [6] The resin composition according to any one of [1] to [5], wherein the component (C) has a structure represented by the following formula (C1-1): [ka] (In formula (C1-1), X's each independently represent a (meth)acryloyl group; A 11 each independently represents an alkylene group having 1 to 12 carbon atoms, A 21 each independently represents an alkylene group having 1 to 12 carbon atoms or an alkenylene group having 2 to 12 carbon atoms, Ring Z 1 each independently represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, Ring Z 2 each independently represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent, n11 represents a number from 1 to 10.) [7] In formula (C1-1), X's each independently represent a (meth)acryloyl group; A 11represents an alkylene group having one carbon atom, A 21 represents an alkylene group having 7 carbon atoms, Ring Z 1 represents a tricyclodecane ring, Ring Z 2 represents a cyclohexane ring substituted with two alkyl groups having 5 to 8 carbon atoms, The resin composition according to [6], wherein n11 represents a number from 1 to 5. [8] The resin composition according to any one of [1] to [7], further comprising (E) an inorganic filler. [9] The resin composition according to [8], wherein the content of the component (E) is 40% by mass or more when the nonvolatile components in the resin composition are taken as 100% by mass.

[10] The resin composition according to any one of [1] to [9], further comprising (F) a compound (excluding component (C)) containing a radically polymerizable unsaturated group.

[11] The resin composition according to any one of [1] to

[10] , which is used for an insulating layer of a circuit board.

[12] A resin sheet comprising a support and a layer of the resin composition according to any one of [1] to

[11] provided on the support.

[13] The resin sheet according to

[12] , wherein the support is a thermoplastic resin film or a metal foil.

[14] A cured product of the resin composition according to any one of [1] to

[11] .

[15] A circuit board comprising an insulating layer made of a cured product of the resin composition according to any one of [1] to

[11] .

[16] A semiconductor device comprising the circuit board according to

[15] . [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a novel resin composition that can give a cured product that exhibits good dielectric properties, as well as good smear removal properties and good crack resistance. DETAILED DESCRIPTION OF THE INVENTION

[0010] <Terminology> As used herein, the term "aliphatic group" refers to a group obtained by removing one or more hydrogen atoms from an aliphatic compound. Specifically, a monovalent aliphatic group refers to a group obtained by removing one hydrogen atom from an aliphatic compound, and a divalent aliphatic group refers to a group obtained by removing two hydrogen atoms from an aliphatic compound. Here, the aliphatic compound may be a heteroatom-free aliphatic compound composed only of carbon and hydrogen atoms, or a heteroatom-containing aliphatic compound composed of carbon and hydrogen atoms as well as heteroatoms. As used herein, the term "heteroatom" refers to an atom other than carbon and hydrogen atoms, and examples thereof include oxygen atoms, nitrogen atoms, sulfur atoms, silicon atoms, and halogen atoms.

[0011] As used herein, the term "aliphatic hydrocarbon group" refers to a group obtained by removing one or more hydrogen atoms from a heteroatom-free aliphatic compound composed only of carbon atoms and hydrogen atoms. Specifically, a monovalent aliphatic hydrocarbon group refers to a group obtained by removing one hydrogen atom from a heteroatom-free aliphatic compound, and a divalent aliphatic hydrocarbon group refers to a group obtained by removing two hydrogen atoms from a heteroatom-free aliphatic compound. Examples of monovalent aliphatic hydrocarbon groups include optionally substituted alkyl groups, optionally substituted cycloalkyl groups, optionally substituted alkenyl groups, optionally substituted cycloalkenyl groups, and optionally substituted alkapolyenyl groups (the number of double bonds is preferably 2 to 10, more preferably 2 to 6, even more preferably 2 to 4, and even more preferably 2), and may be a combination of two or more of these groups. Examples of divalent aliphatic hydrocarbon groups include alkylene groups which may have a substituent, cycloalkylene groups which may have a substituent, alkenylene groups which may have a substituent, cycloalkenylene groups which may have a substituent, and alkapolyenylene groups which may have a substituent (the number of double bonds is preferably 2 to 10, more preferably 2 to 6, even more preferably 2 to 4, and even more preferably 2), and may be a combination of two or more of these. Here, the alkyl group, alkenyl group, alkapolyenyl group, alkylene group, alkenylene group, and alkapolyenylene group may be either linear or branched. In this specification, unless otherwise specified, the number of carbon atoms in the aliphatic hydrocarbon group is preferably 1 or more, more preferably 2 or more, or 3 or more, and preferably 100 or less, more preferably 80 or less, even more preferably 60 or less, 50 or less, or 40 or less. The number of carbon atoms in the substituent is not included in the number of carbon atoms.

[0012] As used herein, the term "heteroatom-containing aliphatic group" refers to a group obtained by removing one or more hydrogen atoms from an aliphatic compound containing a heteroatom. Specifically, a monovalent heteroatom-containing aliphatic group refers to a group obtained by removing one hydrogen atom from an aliphatic compound containing a heteroatom, and a divalent heteroatom-containing aliphatic group refers to a group obtained by removing two hydrogen atoms from an aliphatic compound containing a heteroatom. In the "heteroatom-containing aliphatic group" herein, the heteroatom may be bonded to any of the carbon atoms constituting the group. For example, the heteroatom may be bonded to (i) a terminal carbon or (ii) an intermediate carbon-carbon bond. Furthermore, in the "heteroatom-containing aliphatic group" herein, the bond may extend from either a carbon atom or a heteroatom. The heteroatom-containing aliphatic group may be either a saturated or unsaturated heteroatom-containing aliphatic group and may have a cyclic structure. Examples of the monovalent heteroatom-containing aliphatic group include an optionally substituted heteroalkyl group, an optionally substituted heteroalkenyl group, an optionally substituted heteroalkynyl group, an optionally substituted heteroalkapolyenyl group, and an optionally substituted monovalent aliphatic heterocyclic group, and may be a combination of two or more of these. Examples of the monovalent heteroatom-containing aliphatic group also include a monovalent group formed by bonding a divalent group selected from the group consisting of -O-, -S-, -C(=O)-, -S(=O)-, -S(=O)2-, -N(R')-, -Si(R')2-, and combinations thereof to a bond of a monovalent aliphatic carbocyclic group or a monovalent aliphatic heterocyclic group (wherein R' represents a hydrogen atom or a substituent as described below, the same applies hereinafter). Examples of the divalent heteroatom-containing aliphatic group include an optionally substituted heteroalkylene group, an optionally substituted heteroalkenylene group, an optionally substituted heteroalkynylene group, an optionally substituted heteroalkapolyenylene group, and an optionally substituted divalent aliphatic heterocyclic group, and may be a combination of two or more of these.Examples of divalent heteroatom-containing aliphatic groups also include divalent groups formed by bonding a divalent group selected from the group consisting of -O-, -S-, -C(=O)-, -S(=O)-, -S(=O)2-, -N(R')-, -Si(R')2-, and combinations thereof to at least one bond of a divalent aliphatic carbocyclic group or a divalent aliphatic heterocyclic group. In this specification, unless otherwise specified, the number of heteroatoms in the heteroatom-containing aliphatic group is preferably 1 or more, 2 or more, or 3 or more, and preferably 30 or less, 25 or less, or 20 or less. Unless otherwise specified, the number of carbon atoms is preferably 1 or more, more preferably 2 or more, or 3 or more, and preferably 100 or less, more preferably 80 or less, and even more preferably 60 or less, 50 or less, or 40 or less. The number of heteroatoms and carbon atoms does not include the number of heteroatoms and carbon atoms of substituents.

[0013] As used herein, the term "aliphatic ring" refers to a ring other than an aromatic ring. The aliphatic ring may have a double bond in part of the ring. The aliphatic ring may be a monocyclic aliphatic ring or a bridged aliphatic ring such as a bicyclo ring or a tricyclo ring. The aliphatic ring may be an aliphatic carbocycle having only carbon atoms as ring-constituting atoms, or an aliphatic heterocycle having heteroatoms in addition to carbon atoms as ring-constituting atoms. Unless otherwise specified, the number of carbon atoms in the aliphatic ring is preferably 3 or more, more preferably 4 or more or 5 or more, and even more preferably 6 or more, and the upper limit is preferably 24 or less, more preferably 18 or less or 14 or less, and even more preferably 10 or less. Examples of monocyclic aliphatic rings include a cyclopropane ring, a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring, a cyclononane ring, a cyclodecane ring, a cycloundecane ring, and a cyclododecane ring. Examples of bridged aliphatic rings include bicycloheptane rings such as bicyclo[4.1.0]heptane, bicyclo[3.2.0]heptane, bicyclo[3.1.1]heptane, and bicyclo[2.2.1]heptane; bicyclooctane rings such as bicyclo[4.2.0]octane, bicyclo[4.1.1]octane, bicyclo[3.2.1]octane, and bicyclo[2.2.2]octane; bicyclononane rings such as bicyclo[4.2.1]nonane and bicyclo[3.3.1]nonane; bicyclodecane rings such as bicyclo[4.4.0]decane, bicyclo[4.2.2]decane, and bicyclo[3.3.2]decane; bicyclodecane rings such as bicyclo[4.3.2]undecane, bicyclo[3 bicyclododecane rings such as bicyclo[4.3.3]dodecane; tricycloheptane rings such as tricyclo[2.2.1.0(2,6)]heptane and [2.2.1.0(3,5)]heptane; tricyclooctane rings such as tricyclo[3.2.1.0(2,4)]octane and tricyclo[3.2.1.0(2,7)]octane; tricyclononane rings such as tricyclo[4.2.1.0(3,7)]nonane and tricyclo[4.2.1.0(4,8)]nonane; and tricyclodecane rings such as tricyclo[5.2.1.0(2,6)]decane and tricyclo[3.3.1.1(3,7)]decane.

[0014] As used herein, the term "optionally substituted" in reference to a compound or group means both a case where the hydrogen atoms of the compound or group are not substituted with substituents, and a case where some or all of the hydrogen atoms of the compound or group are substituted with substituents.

[0015] In this specification, unless otherwise specified, the term "substituent" means a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, a cycloalkyloxy group, an alkylthio group, a cycloalkylthio group, an aryl group, an aryloxy group, an arylthio group, an arylalkyl group, an arylalkoxy group, a monovalent heterocyclic group, an alkylidene group, an acyl group, an acyloxy group, a hydroxy group, an amino group, a silyl group, a carboxy group, a sulfo group, a cyano group, a nitro group, a mercapto group, or an oxo group.

[0016] Examples of halogen atoms used as substituents include fluorine, chlorine, bromine, and iodine atoms. The alkyl group used as a substituent may be either linear or branched. The alkyl group preferably has 1 to 12 carbon atoms, more preferably 1 to 10, and even more preferably 1 to 8 carbon atoms. The alkenyl group used as a substituent may be either linear or branched. The alkenyl group preferably has 2 to 12 carbon atoms, more preferably 2 to 10, and even more preferably 2 to 8 carbon atoms. The cycloalkyl group used as a substituent preferably has 3 to 12 carbon atoms, more preferably 3 to 10 carbon atoms. The alkoxy group used as a substituent may be either linear or branched. The alkoxy group preferably has 1 to 12 carbon atoms, more preferably 1 to 10, and even more preferably 1 to 8 carbon atoms. The cycloalkyloxy group used as a substituent preferably has 3 to 12 carbon atoms, more preferably 3 to 10 carbon atoms. The alkylthio group used as a substituent may be either linear or branched. The alkylthio group preferably has 1 to 12 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 1 to 8 carbon atoms. The cycloalkylthio group used as a substituent preferably has 3 to 12 carbon atoms, more preferably 3 to 10 carbon atoms. The aryl group used as a substituent preferably has 6 to 14 carbon atoms, more preferably 6 to 10 carbon atoms. The aryloxy group used as a substituent preferably has 6 to 14 carbon atoms, more preferably 6 to 10 carbon atoms. The arylthio group used as a substituent preferably has 6 to 14 carbon atoms, more preferably 6 to 10 carbon atoms. The arylalkyl group used as a substituent preferably has 7 to 15 carbon atoms, more preferably 7 to 11 carbon atoms. The arylalkoxy group used as a substituent preferably has 7 to 15 carbon atoms, more preferably 7 to 11 carbon atoms. The monovalent heterocyclic group used as a substituent refers to a group in which one hydrogen atom has been removed from the heterocycle of a heterocyclic compound. The monovalent heterocyclic group preferably has 3 to 15 carbon atoms, more preferably 3 to 9 carbon atoms. The monovalent heterocyclic group also includes a monovalent aromatic heterocyclic group (heteroaryl group).The alkylidene group used as a substituent refers to a group in which two hydrogen atoms have been removed from the same carbon atom of an alkane. The number of carbon atoms in the alkylidene group is preferably 1 to 12, more preferably 1 to 6, and particularly preferably 1 to 3. The acyl group used as a substituent refers to a group represented by the formula -C(=O)-R (wherein R is an alkyl group or an aryl group). The alkyl group represented by R may be either linear or branched. The number of carbon atoms in the acyl group is preferably 2 to 13, more preferably 2 to 7. The acyloxy group used as a substituent refers to a group represented by the formula -OC(=O)-R (wherein R is as defined above). The number of carbon atoms in the acyloxy group is preferably 2 to 13, more preferably 2 to 7. The above-mentioned substituents may further have a substituent (sometimes referred to as a "secondary substituent"). Unless otherwise specified, the secondary substituent may be the same as the above-mentioned substituent.

[0017] In this specification, the term "(meth)acrylate compound" includes both acrylate compounds and methacrylate compounds and refers to a compound containing one or more acryloyloxy groups or methacryloyloxy groups in the molecule. In this specification, the term "(meth)acryloyloxy group" refers to both an acryloyloxy group and a methacryloyloxy group, and the term "(meth)acryloyl group" refers to both an acryloyl group and a methacryloyl group.

[0018] The present invention will be described in detail below with reference to embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and can be implemented with any modifications within the scope of the claims of the present invention and their equivalents.

[0019] [Resin composition] The resin composition of the present invention is characterized by containing (A) an epoxy resin, (B) an active ester resin, and (C) a (meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms.

[0020] As described above, insulating materials for circuit boards are required to exhibit good dielectric properties (low dielectric dissipation factor) in order to reduce transmission loss when they are operated in a high-frequency environment. In this regard, the present inventors have found that when an active ester resin is blended to an extent that good dielectric properties are achieved, the resulting insulating material tends to have poor smear removability during desmearing and to be prone to cracking after desmearing.

[0021] In contrast, the present invention, which uses a (meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms in combination with an epoxy resin and an active ester resin, can provide a cured product that exhibits good dielectric properties, as well as good smear removal and crack resistance. Thus, the present invention can provide a cured product that exhibits good dielectric properties, good smear removal, and good crack resistance, and significantly contributes to realizing a circuit board equipped with a circuit that advantageously reduces transmission loss when operating in a high-frequency environment and exhibits desired properties.

[0022] Each component will be described below.

[0023] <(A) Epoxy resin> The resin composition of the present invention contains an epoxy resin as component (A).

[0024] Examples of epoxy resins include bisphenol-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, tert-butyl-catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, glycidylamine-type epoxy resins, glycidyl ester-type epoxy resins, cresol novolac-type epoxy resins, biphenyl-type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane-type epoxy resins, cyclohexanedimethanol-type epoxy resins, naphthylene ether-type epoxy resins, trimethylol-type epoxy resins, and tetraphenylethane-type epoxy resins. Bisphenol-type epoxy resins refer to epoxy resins having a bisphenol structure, such as bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, and bisphenol AF-type epoxy resins. Biphenyl-type epoxy resin refers to an epoxy resin having a biphenyl structure, where the biphenyl structure may have a substituent such as an alkyl group, an alkoxy group, or an aryl group. Therefore, bixylenol-type epoxy resins and biphenylaralkyl-type epoxy resins are also included in the biphenyl-type epoxy resin. The epoxy resins may be used alone or in combination of two or more.

[0025] The epoxy resin is preferably an aromatic epoxy resin, which means an epoxy resin having an aromatic ring in its molecule.

[0026] The epoxy resin preferably has two or more epoxy groups in one molecule. When the non-volatile components of the epoxy resin are taken as 100% by mass, the proportion of the epoxy resin having two or more epoxy groups in one molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more.

[0027] Epoxy resins include those that are liquid at a temperature of 20°C (hereinafter referred to as "liquid epoxy resins") and those that are solid at a temperature of 20°C (hereinafter referred to as "solid epoxy resins").

[0028] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0029] Preferred liquid epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, naphthalene type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, phenol novolac type epoxy resins, alicyclic epoxy resins such as alicyclic epoxy resins having an ester skeleton, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, and epoxy resins having a butadiene structure.

[0030] Specific examples of liquid epoxy resins include "HP-4032," "HP-4032-D," and "HP-4032-SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US," "jER828EL," "825," and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "630" and "630LSD" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation. Examples include "ZX1059" manufactured by Nippon Steel Chemical & Material Co., Ltd. (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); "EX-721" manufactured by Nagase ChemteX Corporation (glycidyl ester type epoxy resin); "Celloxide 2021P" manufactured by Daicel Corporation (alicyclic epoxy resin with an ester skeleton); "PB-3600" manufactured by Daicel Corporation (epoxy resin with a butadiene structure); and "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.

[0031] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferred.

[0032] Preferred solid epoxy resins include bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, cresol novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, and tetraphenylethane-type epoxy resins.

[0033] Specific examples of solid epoxy resins include "HP-4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200HH", "HP-7200H", and "HP-7200" (dicyclopentadiene epoxy resins) manufactured by DIC Corporation. DIC Corporation's "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", and "HP6000" (naphthylene ether type epoxy resin); Nippon Kayaku Corporation's "EPPN-502H" (trisphenol type epoxy resin); Nippon Kayaku Corporation's "NC-7000L" (naphthol novolac type epoxy resin); Nippon Kayaku Corporation's "NC-3000H", "NC-3000", and "NC-3000" L, "NC-3100" (biphenyl-type epoxy resin); "ESN-475V" (naphthol-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN-485" (naphthol novolac-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YL6121" (biphenyl-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX4000HK" (bixylenol-type epoxy resin) manufactured by Mitsubishi Chemical Corporation. Examples of epoxy resins include "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd.; "YL7760" (bisphenol AF-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (solid bisphenol A-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "jER1031S" (tetraphenylethane-type epoxy resin) manufactured by Mitsubishi Chemical Corporation.

[0034] The resin composition of the present invention may contain only a liquid epoxy resin as the epoxy resin, only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin. When a liquid epoxy resin and a solid epoxy resin are used in combination, the ratio by mass between them (liquid epoxy resin:solid epoxy resin) is preferably 1:0.01 to 1:50, more preferably 1:0.05 to 1:20, and even more preferably 1:0.1 to 1:10.

[0035] The epoxy equivalent of the epoxy resin is preferably 50 g / eq to 5000 g / eq, more preferably 50 g / eq to 3000 g / eq, even more preferably 80 g / eq to 2000 g / eq, and even more preferably 110 g / eq to 1000 g / eq. The epoxy equivalent is the mass of an epoxy resin containing one equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0036] The weight average molecular weight (Mw) of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and even more preferably 400 to 1500. The Mw of the epoxy resin can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0037] In combination with the (B) and (C) components described below, a cured product exhibiting good dielectric properties, good desmear removability, and crack resistance as well as excellent mechanical properties can be obtained. From this viewpoint, the content of the (A) component in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 12% by mass or more, 14% by mass or more, or 15% by mass or more, based on 100% by mass of the resin components in the resin composition. The upper limit of the content is not particularly limited and may be determined depending on the properties required of the resin composition, but may be, for example, 60% by mass or less, 50% by mass or less, or 40% by mass or less.

[0038] In the present invention, the term "resin component" in relation to the resin composition refers to the non-volatile components constituting the resin composition excluding the inorganic filler described below.

[0039] <(B) Active ester resin> The resin composition of the present invention contains an active ester resin as component (B).

[0040] As the active ester curing agent, a compound having one or more active ester groups per molecule can be used. Among them, preferred active ester curing agents are compounds having two or more highly reactive ester groups per molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds. The active ester curing agent is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, active ester curing agents derived from carboxylic acid compounds are preferred, active ester curing agents obtained from a carboxylic acid compound and a hydroxy compound are more preferred, and active ester curing agents obtained from a carboxylic acid compound and an aromatic hydroxy compound are even more preferred.

[0041] The carboxylic acid compound may be either an aromatic carboxylic acid compound or an aliphatic carboxylic acid compound, and examples thereof include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, and halides thereof.

[0042] Examples of aromatic hydroxy compounds include (i) polyaddition products of unsaturated aliphatic cyclic compounds containing two double bonds per molecule with phenols, (ii) various bisphenol compounds, (iii) aromatic polyols having two or more hydroxy groups bonded to a carbon atom on an aromatic ring, and (iv) aromatic monools having one hydroxy group bonded to a carbon atom on an aromatic ring. Examples of polyaddition products of unsaturated aliphatic cyclic compounds with phenols include polyaddition products of unsaturated aliphatic cyclic compounds such as dicyclopentadiene, tetrahydroindene, norbornadiene, limonene, and vinylcyclohexene with optionally substituted phenols (e.g., phenol, cresol, xylenol, ethylphenol, propylphenol, vinylphenol, allylphenol, phenylphenol, benzylphenol, and halophenols), and specific examples thereof include dicyclopentadiene-phenol polyaddition products. Examples of bisphenol compounds include bisphenol A, bisphenol F, bisphenol AF, bisphenol AP, bisphenol B, bisphenol BP, bisphenol C, and bisphenol M. Examples of aromatic polyols in which two or more hydroxy groups are bonded to carbon atoms on an aromatic ring include hydroquinone, resorcinol, catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, benzenetriol, and phenol novolak. Examples of aromatic monools having one hydroxy group bonded to a carbon atom on an aromatic ring include phenol, cresol, xylenol, ethylphenol, propylphenol, vinylphenol, allylphenol, phenylphenol, benzylphenol, halophenols, naphthol, methylnaphthol, dimethylnaphthol, ethylnaphthol, propylnaphthol, vinylnaphthol, allylnaphthol, phenylnaphthol, benzylnaphthol, and halonaphthol.

[0043] Specific examples of preferred active ester resins from the viewpoint of further enjoying the effects of the present invention include active ester resins containing a dicyclopentadiene-type diphenol structure, active ester resins containing a naphthalene structure, active ester resins containing an acetylated product of phenol novolac, and active ester resins containing a benzoylated product of phenol novolac. Among these, active ester resins containing a naphthalene structure and active ester resins containing a dicyclopentadiene-type diphenol structure are more preferred from the viewpoint of realizing a cured product that exhibits even better dielectric properties, even better smear removal properties, and even better crack resistance when combined with component (C) described below. The "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0044] Component (B) may be a commercially available product. Examples of such commercially available products include activated ester resins containing a dicyclopentadiene-type diphenol structure, such as "EXB-9451," "EXB-9460," "EXB-9460S," "HPC-8000-65T," "HPC-8000H-65MT," and "HPC-8000L-65MT" (manufactured by DIC Corporation); activated ester resins containing a naphthalene structure, such as "EXB-8100L-65T," "EXB-8150-60T," "EXB-8150-62T," "EXB-9416-70BK," "HPC-8150H-65MT," and "HPC-8000L-65MT." Examples of such active ester resins include PC-8150-62T and HP-B-8151-62T (manufactured by DIC Corporation); a phosphorus-containing active ester resin, EXB9401 (manufactured by DIC Corporation); an active ester resin which is an acetylated product of phenol novolac, DC808 (manufactured by Mitsubishi Chemical Corporation); active ester resins which are benzoylated products of phenol novolac, YLH1026, YLH1030, and YLH1048 (manufactured by Mitsubishi Chemical Corporation); and an active ester resin containing a styryl group and a naphthalene structure, PC1300-02-65MA (manufactured by Air Water Inc.).

[0045] The component (B) may be used alone or in combination of two or more types in any ratio.

[0046] The active ester group equivalent of component (B) is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 400 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The active ester group equivalent is the mass of the active ester resin per equivalent of the active ester group.

[0047] From the viewpoint of easily realizing a resin composition that provides good dielectric properties, the content of component (B) in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 25% by mass or more or 30% by mass or more, based on 100% by mass of the resin components in the resin composition. The upper limit of the content is not particularly limited and may be determined depending on the properties required of the resin composition, but may be, for example, 60% by mass or less, 55% by mass or less, or 50% by mass or less.

[0048] In the resin composition of the present invention, the mass ratio of component (B) to component (A) (component (B) / component (A)) is preferably 0.6 or more, more preferably 0.8 or more, and even more preferably 1 or more, from the viewpoint of providing a cured product exhibiting good dielectric properties. As described above, the resin composition of the present invention using component (C) can provide a cured product exhibiting good smear removability and good crack resistance, even when component (B) is contained to an extent that excellent dielectric properties can be achieved. For example, in the resin composition of the present invention, the mass ratio of component (B) to component (A) may be increased to 1.1 or more, 1.2 or more, or 1.25 or more. The upper limit of the mass ratio (component (B) / component (A)) may be, for example, 2 or less, 1.9 or less, or 1.8 or less.

[0049] <(C) (Meth)acrylate Compounds Containing Aliphatic Groups Having 10 or More Carbon Atoms> The resin composition of the present invention is characterized by containing, as component (C), a (meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms.

[0050] In order to provide a cured product that exhibits good dielectric properties, as well as good smear removal and crack resistance when combined with components (A) and (B), component (C) preferably contains two or more (meth)acryloyl groups in the molecule.

[0051] In order to provide a cured product that exhibits good dielectric properties, as well as good smear removability and crack resistance when combined with components (A) and (B), it is important that component (C) contains an aliphatic group having 10 or more carbon atoms.

[0052] The aliphatic group having 10 or more carbon atoms contained in component (C) may be either linear or branched, and may contain an aliphatic ring within its structure. The number of carbon atoms in the aliphatic group is as described above, but from the viewpoint of further enjoying the effects of the present invention, it is preferably 12 or more, more preferably 14 or more, 16 or more, 18 or more, or 20 or more, and even more preferably 22 or more, 24 or more, 26 or more, 28 or more, or 30 or more, and the upper limit is preferably 100 or less, more preferably 80 or less, 60 or less, 50 or less, or 40 or less.

[0053] From the viewpoint of realizing a cured product exhibiting even better dielectric properties, even better smear removability, and even better crack resistance when combined with components (A) and (B), the aliphatic group having 10 or more carbon atoms is preferably an aliphatic group containing an aliphatic ring (preferably an aliphatic carbon ring). From the same viewpoint, the aliphatic group having 10 or more carbon atoms is preferably an aliphatic hydrocarbon group. In a preferred embodiment, component (C) contains an aliphatic group having 10 or more carbon atoms and containing an aliphatic ring, more preferably an aliphatic hydrocarbon group having 10 or more carbon atoms and containing an aliphatic carbon ring. The preferred range of the number of carbon atoms in the aliphatic group is as described above.

[0054] Among these, from the viewpoint of being able to enjoy the effects of the present invention more effectively in combination with components (A) and (B), the aliphatic group having 10 or more carbon atoms contained in component (C) is preferably an alkylene group which may have a substituent, a cycloalkylene group which may have a substituent, an alkenylene group which may have a substituent, a cycloalkenylene group which may have a substituent, an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 4, and even more preferably 2), or a divalent aliphatic group formed by a combination of two or more of these.

[0055] The substituents that these aliphatic groups may have are as described above, but from the viewpoint of being able to further enjoy the effects of the present invention, preferred are one or more selected from the group consisting of a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, and a cycloalkyloxy group, and more preferred are one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms.

[0056] In a preferred embodiment that can further enjoy the effects of the present invention, the component (C) contains a divalent aliphatic group represented by the following formula (1).

[0057] [ka] (In formula (1), A C each independently represents a single bond or a divalent aliphatic group, Ring Z C represents an aliphatic ring which may have a substituent, * represents a bond, Two A's C and Ring Z C The total number of carbon atoms is 10 or more.)

[0058] The divalent aliphatic group represented by formula (1) is a group consisting of two A C and Ring ZC The total number of carbon atoms is 10 or more, which corresponds to the aforementioned "aliphatic group having 10 or more carbon atoms."

[0059] In formula (1), A C A each independently represents a single bond or a divalent aliphatic group. C The divalent aliphatic group represented by the formula (I) is as described above, but from the viewpoint of being able to further enjoy the effects of the present invention, it is preferably an alkylene group which may have a substituent or an alkenylene group which may have a substituent, and more preferably an alkylene group having 1 to 12 carbon atoms which may have a substituent or an alkenylene group having 2 to 12 carbon atoms which may have a substituent.

[0060] In formula (1), ring Z C represents an aliphatic ring which may have a substituent. C The aliphatic ring in is as described above, but from the viewpoint of being able to enjoy the effects of the present invention more, an aliphatic carbon ring is preferred, and a cycloalkane ring or a cycloalkene ring is more preferred. Here, the cycloalkane ring or cycloalkene ring may be a bridged ring such as a bicyclo ring or a tricyclo ring. The number of carbon atoms in the aliphatic ring is as described above, but from the viewpoint of being able to enjoy the effects of the present invention more, it is preferably 4 or more, more preferably 6 or more, and the upper limit is preferably 14 or less, more preferably 10 or less. Therefore, in a preferred embodiment, ring Z C is a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent.

[0061] In formula (1), A C Divalent aliphatic groups and rings Z CThe substituents that the aliphatic ring in the formula (I) may have are as described above, but from the viewpoint of being able to enjoy the effects of the present invention more effectively, preferred are one or more selected from the group consisting of a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, and a cycloalkyloxy group, and more preferred are one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms.

[0062] As mentioned above, in equation (1), two A C and Ring Z C The total number of carbon atoms is 10 or more, and from the viewpoint of being able to enjoy the effects of the present invention more effectively, it is preferably 50 or less, more preferably 40 or less.

[0063] Particularly preferred examples of the divalent aliphatic group represented by formula (1) are shown below, from the viewpoint of realizing a cured product that exhibits even better dielectric properties, and even better smear removal and crack resistance when combined with the components (A) and (B).

[0064] In one preferred embodiment, in formula (1), A C each independently represents an alkylene group having 1 to 12 carbon atoms or an alkenylene group having 2 to 12 carbon atoms, Ring Z C represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent, wherein the substituent is one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms; Two A's C and Ring Z C The total number of carbon atoms is 10 or more and 50 or less.

[0065] In a more preferred embodiment, in formula (1), A C each independently represents an alkylene group having 1 to 8 carbon atoms or an alkenylene group having 2 to 8 carbon atoms, Ring Z C represents a cycloalkane ring having 6 to 10 carbon atoms which may have a substituent, or a cycloalkene ring having 6 to 10 carbon atoms which may have a substituent, wherein the substituent is one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, and an alkenyl group having 2 to 10 carbon atoms; Two A's C and Ring Z C The total number of carbon atoms is 10 or more and 40 or less.

[0066] In order to realize a cured product exhibiting even better dielectric properties and even better smear removal and crack resistance when combined with components (A) and (B), component (C) preferably contains one or more, more preferably two or more, and even more preferably three or more divalent aliphatic groups represented by formula (1) in the molecule. The upper limit for the number of divalent aliphatic groups represented by formula (1) in the molecule is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less.

[0067] In a preferred embodiment, the component (C) has a structure represented by the following formula (C1):

[0068] [ka] (In formula (C1), X's each independently represent a (meth)acryloyl group; A 1 each independently represents a divalent aliphatic group, A 2 each independently represents a divalent aliphatic group having 10 or more carbon atoms, L 1 each independently represents a divalent linking group, n1 represents a number equal to or greater than 1.)

[0069] -divalent aliphatic group A 1 - In formula (C1), A 1 A each independently represents a divalent aliphatic group. 1 The divalent aliphatic group represented by the formula (I) is as described above, but is preferably an alkylene group which may have a substituent, a cycloalkylene group which may have a substituent, an alkenylene group which may have a substituent, a cycloalkenylene group which may have a substituent, an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 4, and even more preferably 2), or a divalent aliphatic group consisting of a combination of two or more of these. The suitable ranges for the number of carbon atoms of the alkylene group, cycloalkylene group, alkenylene group, cycloalkenylene group, and alkapolyenylene group in these divalent aliphatic groups are as described above for the aliphatic hydrocarbon group.

[0070] A 1 From the viewpoint of better enjoying the effects of the present invention, the number of carbon atoms in the divalent aliphatic group represented by the following formula is preferably 2 or more, more preferably 4 or more, and even more preferably 6 or more, and the upper limit thereof is preferably 40 or less, more preferably 30 or less, 20 or less, or 15 or less.

[0071] Among these, from the viewpoint of being able to enjoy the effects of the present invention more effectively, A 1 The divalent aliphatic group represented by the following formula (C2) is preferably a divalent aliphatic group represented by the following formula (C2).

[0072] [ka] (In formula (C2), A 11 each independently represents a single bond or a divalent aliphatic group, Ring Z 1 represents an aliphatic ring which may have a substituent, * represents a bond.)

[0073] In formula (C2), A 11A each independently represents a single bond or a divalent aliphatic group. 11 The divalent aliphatic group represented by the formula (I) is as described above, but from the viewpoint of being able to enjoy the effects of the present invention more effectively, a divalent aliphatic hydrocarbon group is preferred, and an alkylene group which may have a substituent, an alkenylene group which may have a substituent, or an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 4, and even more preferably 2). 11 The preferred ranges of the number of carbon atoms of the alkylene group, alkenylene group, and alkapolyenylene group in the above are as described above for the aliphatic hydrocarbon group, and the preferred types of the substituents are also as described above. In particular, from the viewpoint of being able to enjoy the effects of the present invention more effectively, they are preferably selected from the group consisting of A C This may be similar to what was explained above.

[0074] In formula (C2), ring Z 1 represents an aliphatic ring which may have a substituent. 1 The aliphatic ring in is as described above, but from the viewpoint of being able to enjoy the effects of the present invention more, an aliphatic carbon ring is preferable, and a cycloalkane ring which may have a substituent or a cycloalkene ring which may have a substituent is more preferable. Here, the cycloalkane ring or cycloalkene ring may be a bridged ring such as a bicyclo ring or a tricyclo ring. Ring Z 1 The preferred ranges of the number of carbon atoms in the cycloalkane ring and the cycloalkene ring are as described above for the aliphatic ring, and the preferred types of substituents are also as described above. In particular, from the viewpoint of being able to enjoy the effects of the present invention more effectively, they are the ring Z in the above formula (1). C This may be similar to what was explained above.

[0075] Two A's 11 and Ring Z 1 From the viewpoint of better enjoying the effects of the present invention, the total number of carbon atoms is preferably 6 or more, more preferably 8 or more, and even more preferably 10 or more, and the upper limit is preferably 40 or less, more preferably 30 or less, 20 or less, or 15 or less.

[0076] Two A's 11 and Ring Z 1 When the total number of carbon atoms of formula (C2) is 10 or more, the divalent aliphatic group represented by formula (C2) may be a divalent aliphatic group having 10 or more carbon atoms and represented by formula (1) described above.

[0077] -divalent aliphatic group A 2 - In formula (C1), A 2 A each independently represents a divalent aliphatic group having 10 or more carbon atoms. 2 The divalent aliphatic group having 10 or more carbon atoms represented by the formula (I) is as described above, including its preferred examples.

[0078] Among these, from the viewpoint of being able to enjoy the effects of the present invention more effectively, A 2 The divalent aliphatic group having 10 or more carbon atoms and represented by the formula (C1) is preferably a divalent aliphatic group represented by the following formula (C3).

[0079] [ka] (In formula (C3), A 21 each independently represents a single bond or a divalent aliphatic group, Ring Z 2 represents an aliphatic ring which may have a substituent, * represents a bond, Two A's 21 and Ring Z 2 The total number of carbon atoms is 10 or more.)

[0080] In formula (C3), A 21 A each independently represents a single bond or a divalent aliphatic group. 21 The divalent aliphatic group represented by the formula (I) is as described above, but from the viewpoint of being able to enjoy the effects of the present invention more effectively, a divalent aliphatic hydrocarbon group is preferred, and an alkylene group which may have a substituent, an alkenylene group which may have a substituent, or an alkapolyenylene group which may have a substituent (the number of double bonds is preferably 2 to 4, and even more preferably 2). 21The preferred ranges of the number of carbon atoms of the alkylene group, alkenylene group, and alkapolyenylene group in the above are as described above for the aliphatic hydrocarbon group, and the preferred types of the substituents are also as described above. In particular, from the viewpoint of being able to enjoy the effects of the present invention more effectively, they are preferably selected from the group consisting of A C This may be similar to what was explained above.

[0081] In formula (C3), ring Z 2 represents an aliphatic ring which may have a substituent. 2 The aliphatic ring in is as described above, but from the viewpoint of being able to enjoy the effects of the present invention more, an aliphatic carbon ring is preferable, and a cycloalkane ring which may have a substituent or a cycloalkene ring which may have a substituent is more preferable. Here, the cycloalkane ring or cycloalkene ring may be a bridged ring such as a bicyclo ring or a tricyclo ring. Ring Z 2 The preferred ranges of the number of carbon atoms in the cycloalkane ring and the cycloalkene ring are as described above for the aliphatic ring, and the preferred types of substituents are also as described above. In particular, from the viewpoint of being able to enjoy the effects of the present invention more effectively, they are the ring Z in the above formula (1). C This may be similar to what was explained above.

[0082] Two A's 21 and Ring Z 2 The total number of carbon atoms is 10 or more, and from the viewpoint of being able to enjoy the effects of the present invention more effectively, it is preferably 50 or less, more preferably 40 or less.

[0083] From the viewpoint of further enjoying the effects of the present invention, the divalent aliphatic group having 10 or more carbon atoms and represented by formula (C3) is preferably a divalent aliphatic group having 10 or more carbon atoms and represented by the aforementioned formula (1).

[0084] -divalent linking group L 1 - In formula (C1), L 1 each independently represents a divalent linking group.

[0085] L 1The divalent linking group represented by the formula (I) is not particularly limited as long as it is a divalent group consisting of one or more (for example, 1 to 50, 1 to 30, 1 to 20, or 1 to 10) skeletal atoms selected from carbon atoms, oxygen atoms, nitrogen atoms, and sulfur atoms. However, from the viewpoint of being able to further enjoy the effects of the present invention, a divalent linking group selected from the group consisting of a divalent hydrocarbon group having 1 to 10 carbon atoms which may have a substituent, -O-, -CO-, -S-, -SO-, -SO2-, -CONH-, -NHCO-, -COO-, or -OCO-, and a combination thereof is preferred.

[0086] L 1 From the viewpoint of better enjoying the effects of the present invention, the number of carbon atoms in the divalent linking group represented by the following formula is preferably 10 or less, more preferably 6 or less, and even more preferably 4 or less, and the lower limit is 1 or more.

[0087] In particular, from the viewpoint of being able to enjoy the effects of the present invention more effectively, L 1 The divalent linking group represented by the formula: is preferably -CONH-, -NHCO-, -COO-, or -OCO-.

[0088] -n1- In formula (C1), n1 represents a number of 1 or more.

[0089] From the viewpoint of being able to enjoy the effects of the present invention more effectively, n1 is preferably a number of 20 or less, more preferably 15 or less, and even more preferably 10 or less, 8 or less, 6 or less, or 5 or less.

[0090] In one embodiment that is preferred from the viewpoint of realizing a cured product that exhibits even better dielectric properties, smear removal properties, and crack resistance in combination with the components (A) and (B), the component (C) has a structure represented by the following formula (C1-1):

[0091] [ka] (In formula (C1-1), X, A 11 , A 21 , ring Z 1, ring Z 2 has the same meaning as above. Also, n11 indicates a number equal to or greater than 1.)

[0092] X, A 11 , A 21 , ring Z 1 and ring Z 2 is as described above, including preferred examples thereof. Furthermore, n11 represents a number of 1 or more, and from the viewpoint of being able to further enjoy the effects of the present invention, represents a number of preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, 8 or less, 6 or less, or 5 or less.

[0093] In the combination of component (A) and component (B), a cured product exhibiting even better dielectric properties, and even better smear removal and crack resistance can be realized. 11 -Ring Z 1 -A 11 A block consisting of 21 -Ring Z 2 -A 21 and the blocks consisting of the above are preferably both divalent aliphatic groups having 10 or more carbon atoms and represented by the above formula (1).

[0094] Examples of structures represented by formula (C1-1) that are particularly suitable from the viewpoint of realizing a cured product that exhibits even better dielectric properties, smear removal properties, and crack resistance in combination with component (A) and component (B) are shown below.

[0095] In one preferred embodiment, in formula (C1-1), X's each independently represent a (meth)acryloyl group; A 11 and A 21 each independently represents an alkylene group having 1 to 12 carbon atoms or an alkenylene group having 2 to 12 carbon atoms, Ring Z 1 and ring Z 2each independently represents a cycloalkane ring having 4 to 14 carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have a substituent, wherein the substituent is one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms; n11 represents a number from 1 to 10.

[0096] In a more preferred embodiment, in formula (C1-1), X's each independently represent a (meth)acryloyl group; A 11 each independently represents an alkylene group having 1 to 12 carbon atoms (preferably 1 to 6, more preferably 1 to 4), A 21 each independently represents an alkylene group having 1 to 12 carbon atoms (preferably 1 to 10, more preferably 4 to 10) or an alkenylene group having 2 to 12 carbon atoms (preferably 2 to 10, more preferably 4 to 10), Ring Z 1 each independently represents a cycloalkane ring having 4 to 14 (preferably 6 to 10) carbon atoms which may have a substituent, wherein the substituent is one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms; Ring Z 2each independently represents a cycloalkane ring having 4 to 14 (preferably 6 to 10) carbon atoms which may have a substituent, or a cycloalkene ring having 4 to 14 (preferably 6 to 10) carbon atoms which may have a substituent, wherein the substituent represents one or more selected from the group consisting of a fluorine atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyloxy group having 3 to 10 carbon atoms; n11 represents a number from 1 to 10.

[0097] In one particularly preferred embodiment, in formula (C1-1), X's each independently represent a (meth)acryloyl group; A 11 represents an alkylene group having one carbon atom, A 21 represents an alkylene group having 7 carbon atoms, Ring Z 1 represents a tricyclodecane ring, Ring Z 2 represents a cyclohexane ring substituted with two alkyl groups having 5 to 8 carbon atoms, n11 represents a number from 1 to 5.

[0098] In order to realize a cured product exhibiting even better dielectric properties and even better smear removal and crack resistance when combined with components (A) and (B), the (meth)acryloyl group equivalent of component (C) is preferably 300 g / eq or more, more preferably 350 g / eq or more, 400 g / eq or more, or 450 g / eq or more, and its upper limit is preferably 4000 g / eq or less, more preferably 3000 g / eq or less, 2500 g / eq or less, 2400 g / eq or less, 2200 g / eq or less, or 2000 g / eq or less. The (meth)acryloyl group equivalent represents the mass of component (C) per equivalent of (meth)acryloyl groups.

[0099] The component (C) is, for example, an aliphatic dihydroxy compound (HO-A1 -OH, preferably HO-A 11 -Ring Z 1 -A 11 -OH; in the formula, A 1 , A 11 , ring Z 1 has the same meaning as above) and an aliphatic dicarboxylic acid compound (HOOC-A 2 -COOH, preferably HOOC-A 21 -Ring Z 2 -A 21 -COOH; in the formula, A 2 , A 21 , ring Z 2 has the same meaning as above.) and the terminal of the ester compound obtained by reacting with (meth)acrylate (in the above formula (C1), L 1 is an ester bond). In this case, n1 in (C1) above and n11 in (C1-1) above can be adjusted by adjusting the degree of reaction between the aliphatic dihydroxy compound and the aliphatic dicarboxylic acid compound.

[0100] Component (C) may be a commercially available product, such as "PEAM1769" (manufactured by Designer Molecules), which is a (meth)acrylate compound containing a divalent aliphatic group having 10 or more carbon atoms and represented by formula (1).

[0101] From the viewpoint of realizing a cured product exhibiting even better dielectric properties, smear removability, and crack resistance when combined with components (A) and (B), the content of component (C) in the resin composition is preferably 0.5% by mass or more, more preferably 1% by mass or more, even more preferably 1.5% by mass or more, 2% by mass or more, 2.5% by mass or more, 3% by mass or more, 3.5% by mass or more, or 4% by mass or more, based on 100% by mass of the resin components in the resin composition. The upper limit of the content is not particularly limited and may be determined depending on the properties required of the resin composition, but from the viewpoint of realizing a cured product exhibiting even better dielectric properties, smear removability, and crack resistance when combined with components (A) and (B), the content is preferably 20% by mass or less, more preferably 15% by mass or less, even more preferably 12% by mass or less, 10% by mass or less, 8% by mass or less, or 6% by mass or less.

[0102] From the viewpoint of being able to enjoy the effects of the present invention more effectively, the mass ratio of the (C) component to the aforementioned (B) component ((C) component / (B) component) is preferably 0.05 or more, more preferably 0.06 or more, 0.08 or more, or 0.1 or more, and the upper limit thereof is preferably 0.5 or less, more preferably 0.4 or less, 0.3 or less, or 0.2 or less.

[0103] <(D) Other hardeners> The resin composition of the present invention may further contain, as component (D), a curing agent other than component (B) (also referred to as "other curing agent").

[0104] Examples of the component (D) include phenol-based curing agents, naphthol-based curing agents, acid anhydride-based curing agents, cyanate ester-based curing agents, carbodiimide-based curing agents, amine-based curing agents, etc. The component (D) may be used alone or in combination of two or more.

[0105] As the phenol-based curing agent and naphthol-based curing agent, those having a novolac structure are preferred from the viewpoint of heat resistance and water resistance. Furthermore, from the viewpoint of adhesion to the conductor layer, nitrogen-containing phenol-based curing agents and nitrogen-containing naphthol-based curing agents are preferred, and triazine skeleton-containing phenol-based curing agents and triazine skeleton-containing naphthol-based curing agents are more preferred.

[0106] Specific examples of phenol-based curing agents and naphthol-based curing agents include "MEH-7700," "MEH-7810," "MEH-7851," and "MEH-8000H" manufactured by Meiwa Chemical Industry Co., Ltd.; "NHN," "CBN," and "GPH" manufactured by Nippon Kayaku Co., Ltd.; and "SN-170," "SN-180," "SN-190," "SN-475," "SN-485," "SN-495," "SN-495V," and "SN-37" manufactured by Nippon Steel Chemical & Material Co., Ltd. 5" and "SN-395" manufactured by DIC Corporation; "TD-2090", "TD-2090-60M", "LA-7052", "LA-7054", "LA-1356", "LA-3018", "LA-3018-50P", "EXB-9500", "HPC-9500", "KA-1160", "KA-1163", and "KA-1165" manufactured by Gun-ei Chemical Co., Ltd.; and "GDP-6115L", "GDP-6115H", and "ELPC75" manufactured by Gun-ei Chemical Co., Ltd.

[0107] Examples of acid anhydride curing agents include curing agents having one or more acid anhydride groups in one molecule. Specific examples of acid anhydride curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of acid anhydrides include biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric acid anhydrides such as styrene-maleic acid resins (copolymers of styrene and maleic acid). Commercially available acid anhydride curing agents include "MH-700" manufactured by New Japan Chemical Co., Ltd.

[0108] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl)thioether, and bis(4-cyanatephenyl)ether; polyfunctional cyanate resins derived from phenol novolac, cresol novolac, etc.; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester curing agents include "PT30" and "PT60" (phenol novolac type multifunctional cyanate ester resins), "ULL-950S" (multifunctional cyanate ester resin), "BA230" and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been triazine converted to a trimer), all of which are manufactured by Lonza Japan.

[0109] Specific examples of carbodiimide-based curing agents include Carbodilite (registered trademark) V-03 (carbodiimide group equivalent: 216 g / eq.), V-05 (carbodiimide group equivalent: 262 g / eq.), V-07 (carbodiimide group equivalent: 200 g / eq.), and V-09 (carbodiimide group equivalent: 200 g / eq.), all manufactured by Nisshinbo Chemical Inc.; and Stavaxol (registered trademark) P (carbodiimide group equivalent: 302 g / eq.), all manufactured by Rhein Chemie.

[0110] Examples of the amine-based curing agent include curing agents having one or more amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, and aromatic amines. Specific examples of the amine-based curing agent include 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxybenzoyl)methylpropional. Examples of suitable amine curing agents include 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, and bis(4-(3-aminophenoxy)phenyl)sulfone. Commercially available amine curing agents may be used, such as "KAYABOND C-200S," "KAYABOND C-100," "KAYAHARD AA," "KAYAHARD AB," and "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure W" manufactured by Mitsubishi Chemical Corporation.

[0111] When the resin composition of the present invention contains component (D), the content of component (D) in the resin composition may be determined depending on the properties required of the resin composition, but when the resin components in the resin composition are taken as 100% by mass, it is, for example, 0.1% by mass or more, preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 3% by mass or more. The upper limit of the content of component (D) is not particularly limited, but may be, for example, 20% by mass or less, 15% by mass or less, or 10% by mass or less.

[0112] As described above, the resin composition of the present invention contains an active ester resin, i.e., component (B), from the viewpoint of producing a cured product exhibiting good dielectric properties. In the resin composition of the present invention, when the total of the non-volatile components of components (B) and (D) is taken as 100% by mass, the content of component (B) is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more, 75% by mass or more, or 80% by mass or more. The upper limit of the content of component (B) relative to the total of components (B) and (D) is not particularly limited and may be 100% by mass, but may also be, for example, 95% by mass or less, 90% by mass or less, etc.

[0113] <(E) Inorganic filler> The resin composition of the present invention may further contain an inorganic filler as component (E). By including component (E), the coefficient of thermal expansion and the dielectric loss tangent tend to be further reduced.

[0114] Examples of materials for component (E) include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum silicate, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Spherical silica is preferred. Component (E) may be used alone or in combination of two or more.

[0115] Commercially available products of component (E) include, for example, "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C," "YA050C," "YA050C-MJE," "YA010C," "SC2500SQ," "SO-C4," "SO-C2," and "SO-C1" manufactured by Admatechs Co., Ltd.; "UFP-30," "DAW-03," and "FB-105FD" manufactured by Denka Company, Limited; "Silfil NSS-3N," "Silfil NSS-4N," and "Silfil NSS-5N" manufactured by Tokuyama Corporation; "CellSpheres" and "MGH-005" manufactured by Taiheiyo Cement Corporation; and "Sferique" and "BA-1" manufactured by JGC Catalysts and Chemicals Co., Ltd.

[0116] The average particle size of component (E) is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 3 μm or less, 2 μm or less, 1 μm or less, or 0.7 μm or less. The lower limit of the average particle size is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.07 μm or more, 0.1 μm or more, or 0.2 μm or more. The average particle size of component (E) can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is prepared on a volume basis using a laser diffraction / scattering particle size distribution analyzer, and the median diameter is used as the average particle size. A measurement sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and ultrasonically dispersing for 10 minutes. The measurement sample was measured using a laser diffraction particle size distribution analyzer, with blue and red light source wavelengths used, and the particle size distribution of the inorganic filler on a volume basis was measured using a flow cell system, and the average particle size was calculated as the median diameter from the particle size distribution obtained. An example of a laser diffraction particle size distribution analyzer is the "LA-960" manufactured by Horiba, Ltd.

[0117] The specific surface area of ​​component (E) is not particularly limited, but is preferably 0.1 m 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more, 3m 2 / g or more or 5m 2 The upper limit of the specific surface area is not particularly limited, but is preferably 100 m 2 / g or less, more preferably 80m 2 / g or less, more preferably 60m 2 / g or less, 50m 2 / g or less or 40m 2 The specific surface area of ​​component (E) is determined in accordance with the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) and calculating the specific surface area using the BET multipoint method.

[0118] Component (E) is preferably surface-treated with an appropriate surface treatment agent. Surface treatment can enhance the moisture resistance and dispersibility of component (E). Examples of surface treatment agents include silane coupling agents such as vinyl-based silane coupling agents, epoxy-based silane coupling agents, styryl-based silane coupling agents, (meth)acrylic-based silane coupling agents, amino-based silane coupling agents, isocyanurate-based silane coupling agents, ureido-based silane coupling agents, mercapto-based silane coupling agents, isocyanate-based silane coupling agents, and acid anhydride-based silane coupling agents; non-silane coupling alkoxysilane compounds such as methyltrimethoxysilane and phenyltrimethoxysilane; and silazane compounds. One type of surface treatment agent may be used alone, or two or more types may be used in combination.

[0119] Examples of commercially available surface treatment agents include "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd.

[0120] The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with 0.2 to 5% by mass of the surface treatment agent.

[0121] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition or the melt viscosity in the form of a sheet, it is more preferable that the melt viscosity is 1.0 mg / m 2 Less than 0.8 mg / m is preferred 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred. The carbon amount per unit surface area of ​​component (E) can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. The supernatant is removed, the solid content is dried, and then the carbon amount per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. An "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used as the carbon analyzer.

[0122] When the resin composition of the present invention contains component (E), the content of component (E) in the resin composition is, for example, 40% by mass or more, preferably 50% by mass or more, more preferably 60% by mass or more, 65% by mass or more, or 70% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition, from the viewpoint of easily realizing a resin composition that provides an even lower dielectric tangent and thermal expansion coefficient. The upper limit of the content of component (E) is not particularly limited, but can be, for example, 90% by mass or less, 85% by mass or less, etc.

[0123] <(F) Compound containing a radically polymerizable unsaturated group> The resin composition of the present invention may further include, as component (F), a compound containing a radically polymerizable unsaturated group different from component (C). By including component (F) in combination with component (C), it is easy to realize a resin composition that provides a cured product exhibiting even better dielectric properties, which is advantageous.

[0124] The type of component (F) is not particularly limited, as long as it has one or more (preferably two or more) radically polymerizable unsaturated groups per molecule. Examples of component (F) include compounds having one or more radically polymerizable unsaturated groups selected from maleimide, vinyl, allyl, styryl, vinylphenyl, acryloyl, methacryloyl, fumaroyl, and maleoyl groups. In particular, component (F) preferably contains one or more compounds selected from maleimide compounds, allyl compounds, styryl compounds, and (meth)acrylic compounds, in order to facilitate the realization of a resin composition that, when combined with component (C), results in a cured product exhibiting even better dielectric properties.

[0125] The type of maleimide compound is not particularly limited as long as it has one or more (preferably two or more) maleimide groups (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl groups) in one molecule. Examples of the maleimide compound include (1) "BMI-3000J", "BMI-5000", "BMI-1400", "BMI-1500", "BMI-1700", and "BMI-689" (all manufactured by DigiCner Molecules), "SLK-6895", and "SLK-1500" (manufactured by Shin-Etsu Chemical Co., Ltd.), which have an aliphatic skeleton (a divalent aliphatic group having 10 or more carbon atoms as described for component (C), particularly preferably a dimer acid or dimer). (2) maleimide compounds containing an indane skeleton, as described in the Japan Institute of Invention and Innovation's Technical Journal Publication No. 2020-500211; and (3) maleimide compounds containing an aromatic ring skeleton directly bonded to the nitrogen atom of the maleimide group, such as "MIR-3000-70MT" (manufactured by Nippon Kayaku Co., Ltd.), "BMI-4000" (manufactured by Daiwa Kasei Co., Ltd.), and "BMI-80" (manufactured by Keiai Kasei Co., Ltd.).

[0126] The allyl compound is not particularly limited in type, and may be a monomer or oligomer, as long as it has one or more (preferably two or more) allyl groups in one molecule. Examples of allyl compounds include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylate, and diallyl 2,3-naphthalenecarboxylate; isocyanuric acid allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; epoxy-containing aromatic allyl compounds such as 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane; benzoxazine-containing aromatic allyl compounds such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane; ether-containing aromatic allyl compounds such as 1,3,5-triallyl ether benzene; allyl silane compounds such as diallyl diphenyl silane; and resins containing multiple benzene rings and multiple allyl groups. Commercially available allyl compounds include "TAIC" (1,3,5-triallyl isocyanurate) manufactured by Nippon Kasei Chemical Industry Co., Ltd., "DAD" (diallyl diphenate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "TRIAM-705" (triallyl trimellitate) manufactured by Wako Pure Chemical Industries, Ltd., "DAND" (diallyl 2,3-naphthalenecarboxylate) manufactured by Nippon Distillation Industry Co., Ltd., and "ALP-d" (bis[3-allyl-4- (3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane), Nippon Kayaku's "RE-810NM" (2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane), Shikoku Kasei's "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate), and DIC's "NE-V-1100-70T" (resin containing multiple benzene rings and multiple allyl groups).

[0127] The styryl compound may be a monomer or an oligomer, and may be any styryl compound having one or more (preferably two or more) styryl or vinylphenyl groups per molecule. Examples of the styryl compound include low-molecular-weight (molecular-weight less than 1000) styryl compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl)ether; and high-molecular-weight (molecular-weight 1000 or more) styryl compounds such as vinylbenzyl-modified polyphenylene ether resin and styrene-divinylbenzene copolymer. Commercially available styryl compounds include, for example, "ODV-XET(X03)," "ODV-XET(X04)," and "ODV-XET(X05)" (styrene-divinylbenzene copolymers) manufactured by Nippon Steel Chemical & Material Co., Ltd., and "OPE-2St 1200" and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether resins) manufactured by Mitsubishi Gas Chemical Company, Inc.

[0128] The (meth)acrylic compound is not particularly limited in type as long as it has one or more (preferably two or more) (meth)acryloyl groups in one molecule, and may be a monomer or oligomer (however, compounds corresponding to component (C) are excluded). Examples of the (meth)acrylic compound include cyclohexane-1,4-dimethanol di(meth)acrylate, cyclohexane-1,3-dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and the like. (meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerin tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, and other low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylic acid ester compounds; dioxane glycol di(meth)acrylate, 3,6-dioxa-1,8-octanediol di(meth)acrylate, low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compounds such as acrylate, 3,6,9-trioxaundecane-1,11-diol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, ethoxylated bisphenol A di(meth)acrylate, and propoxylated bisphenol A di(meth)acrylate; low molecular weight (molecular weight less than 1000) isocyanurate-containing (meth)acrylic acid ester compounds such as tris(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, and ethoxylated isocyanuric acid tri(meth)acrylate; and high molecular weight (molecular weight 1000 or more) acrylic acid ester compounds such as (meth)acrylic-modified polyphenylene ether resins.Examples of commercially available (meth)acrylic compounds include "A-DOG" (dioxane glycol diacrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" (tricyclodecane dimethanol diacrylate) and "DCP" (tricyclodecane dimethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "KAYARAD R-684" (tricyclodecane dimethanol diacrylate) and "KAYARAD R-604" (dioxane glycol diacrylate) manufactured by Nippon Kayaku Co., Ltd., and "SA9000" and "SA9000-111" (methacrylic-modified polyphenylene ether) manufactured by SABIC Innovative Plastics.

[0129] The component (F) may be used alone or in a combination of two or more types in any ratio.

[0130] The radical polymerizable unsaturated group equivalent of component (F) is preferably 250 g / eq. to 1200 g / eq., more preferably 300 g / eq. to 1100 g / eq. The radical polymerizable unsaturated group equivalent represents the mass of component (F) per equivalent of radical polymerizable unsaturated group. When the radical polymerizable unsaturated group equivalent of component (F) is within the above range, the effects of the present invention can be significantly achieved.

[0131] The Mw of the component (F) is preferably 1000 to 40000, and more preferably 1500 to 35000. The Mw of the component (F) can be measured by the GPC method as a polystyrene-equivalent value.

[0132] When the resin composition contains the component (F), from the viewpoint of being able to realize a resin composition that, in combination with the component (C), provides a cured product exhibiting even better dielectric properties and even better smear removability and crack resistance, the content of the component (F) in the resin composition is preferably 2% by mass or more, more preferably 3% by mass or more, or 4% by mass or more, and the upper limit is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less, based on the resin components in the resin composition being taken as 100% by mass.

[0133] <(G)Organic filler> The resin composition of the present invention may further contain an organic filler as component (G).

[0134] A wide variety of organic fillers containing rubber components can be used as the organic filler. Examples of rubber components contained in the organic filler include silicone elastomers such as polydimethylsiloxane; olefin thermoplastic elastomers such as polybutadiene, polyisoprene, polychlorobutadiene, ethylene-vinyl acetate copolymer, styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-isobutylene copolymer, acrylonitrile-butadiene copolymer, isoprene-isobutylene copolymer, isobutylene-butadiene copolymer, ethylene-propylene-diene terpolymer, and ethylene-propylene-butene terpolymer; and thermoplastic elastomers such as acrylic thermoplastic elastomers such as polypropyl(meth)acrylate, polybutyl(meth)acrylate, polycyclohexyl(meth)acrylate, and polyoctyl(meth)acrylate. Furthermore, silicone rubbers such as polyorganosiloxane rubbers may be mixed into the rubber component. The rubber component contained in the rubber particles has a Tg of, for example, 0°C or lower, preferably -10°C or lower, more preferably -20°C or lower, and even more preferably -30°C or lower.

[0135] In one embodiment, the organic filler is a core-shell rubber particle comprising a core particle containing the above-mentioned rubber component and a shell portion obtained by graft copolymerization of a monomer component copolymerizable with the rubber component contained in the core particle. Here, the term "core-shell" does not necessarily refer only to those in which the core particle and the shell portion are clearly distinguishable, but also includes those in which the boundary between the core particle and the shell portion is unclear, and the core particle does not necessarily have to be completely covered with the shell portion.

[0136] Specific examples of organic fillers containing rubber components include "CHT" manufactured by Cheil Industries; "B602" manufactured by UMGABS; "Paraloid EXL-2602," "Paraloid EXL-2603," "Paraloid EXL-2655," "Paraloid EXL-2311," "Paraloid EXL2313," "Paraloid EXL-2315," "Paraloid KM-330," "Paraloid KM-336P," and "Paraloid KCZ-201" manufactured by Dow; and "Metabrene C-2" manufactured by Mitsubishi Rayon Co., Ltd. 23A," "Metablen E-901," "Metablen S-2001," "Metablen W-450A," "Metablen SRK-200," "Kane Ace M-511," "Kane Ace M-600," "Kane Ace M-400," "Kane Ace M-580," and "Kane Ace MR-01" manufactured by Kaneka Corporation, and "Staphyloid AC3355," "Staphyloid AC3816," "Staphyloid AC3832," "Staphyloid AC4030," and "Staphyloid AC3364" manufactured by Aica Kogyo Co., Ltd. These are core-shell type rubber particles.

[0137] When the resin composition contains the component (G), the content of the component (G) in the resin composition is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass or more, based on 100% by mass of the resin components in the resin composition. The upper limit of the content is preferably 10% by mass or less, more preferably 8% by mass or less, 6% by mass or less, or 5% by mass or less.

[0138] <(H) Curing accelerator> The resin composition of the present invention may contain a curing accelerator as the component (H).

[0139] Examples of component (H) include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, peroxide-based curing accelerators, etc. The curing accelerators may be used alone or in combination of two or more.

[0140] When the resin composition of the present invention contains component (H), the content of component (H) in the resin composition, when the resin components in the resin composition are taken as 100% by mass, is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more, and the upper limit is preferably 5% by mass or less, more preferably 4% by mass or less, 3% by mass or less, or 2.5% by mass or less.

[0141] <Optional additives> The resin composition of the present invention may further contain any additives. Examples of such additives include radical polymerization initiators such as peroxide radical polymerization initiators and azo radical polymerization initiators; thermoplastic resins such as phenoxy resins, polyvinyl acetal resins, polysulfone resins, polyethersulfone resins, polyetheretherketone resins, and polyester resins; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone leveling agents and acrylic polymer leveling agents; thickeners such as bentone and montmorillonite; antifoaming agents such as silicone antifoaming agents, acrylic antifoaming agents, fluorine-based antifoaming agents, and vinyl resin antifoaming agents; and ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers. Examples of suitable additives include ultraviolet absorbers; adhesion improvers such as urea silane; adhesion promoters such as triazole-based adhesion promoters, tetrazole-based adhesion promoters, and triazine-based adhesion promoters; antioxidants such as hindered phenol-based antioxidants; fluorescent brighteners such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, and red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic acid anhydride-based stabilizers. The content of such additives may be determined depending on the properties required for the resin composition.

[0142] <Organic solvents> The resin composition of the present invention may further contain an organic solvent as a volatile component. Examples of the organic solvent include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, and diphenyl ether; alcohol solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, and methyl methoxypropionate. Examples of suitable organic solvents include ether ester solvents such as ethanol; ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. These organic solvents may be used singly or in combination of two or more.

[0143] The resin composition of the present invention can be produced, for example, by adding components (A), (B), and (C) to any preparation vessel, and optionally components (D), (E), (F), (G), and (H), as well as other additives and organic solvents, in any order and / or all at once, and mixing them. The temperature can be appropriately set during the process of adding and mixing each component, and heating and / or cooling may be performed temporarily or throughout the process. During or after the process of adding and mixing, the resin composition may be stirred or shaken using a stirring or shaking device such as a mixer to uniformly disperse the components. Simultaneous with the stirring or shaking, degassing may be performed under low-pressure conditions, such as under vacuum.

[0144] As described above, the resin composition of the present invention, which contains the component (C) in combination with the components (A) and (B), can provide a cured product that exhibits good dielectric properties, as well as good smear removal properties and crack resistance.

[0145] In one embodiment, the cured product of the resin composition of the present invention is characterized by a low dielectric loss tangent (Df). For example, when measured at 5.8 GHz and 23°C as described in the <Measurement of Dielectric Loss Tangent> section below, the dielectric loss tangent (Df) of the cured product of the resin composition of the present invention may be preferably 0.0035 or less, 0.0034 or less, 0.0032 or less, 0.003 or less, 0.0028 or less, or 0.0026 or less.

[0146] As described above, the resin composition of the present invention can provide a cured product exhibiting good dielectric properties and excellent smear removal and crack resistance. Therefore, the resin composition of the present invention can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for an insulating layer of a printed wiring board), and more suitably used as a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for an interlayer insulating layer of a printed wiring board). The resin composition of the present invention can also be suitably used when the printed wiring board is a circuit board with built-in components. The resin composition of the present invention can also be suitably used as a resin composition for forming an insulating layer of a rewiring board for a semiconductor package (resin composition for an insulating layer of a rewiring board). In the present invention, printed wiring boards and rewiring boards are collectively referred to as "circuit boards," and therefore the resin composition of the present invention can be suitably used for an insulating layer of a circuit board.

[0147] The resin composition of the present invention can further be used in a wide range of applications requiring a resin composition, such as sheet-like laminate materials such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, hole filling resins, sealing resins, and component embedding resins.

[0148] [Sheet-type laminated materials (resin sheets, prepregs)] The resin composition of the present invention can be used as it is, but may also be used in the form of a sheet-like laminate material containing the resin composition.

[0149] As the sheet-like laminate material, the following resin sheets and prepregs are preferred.

[0150] In one embodiment, the resin sheet includes a support and a layer of a resin composition (hereinafter simply referred to as a "resin composition layer") provided on the support, and is characterized in that the resin composition layer is formed from the resin composition of the present invention.

[0151] The thickness of the resin composition layer varies depending on the application, and may be appropriately determined depending on the application. For example, from the viewpoint of thinning printed wiring boards and semiconductor packages, the thickness of the resin composition layer is preferably 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, 40 μm or less, or 30 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but may usually be 1 μm or more, 5 μm or more, etc.

[0152] Examples of the support include a thermoplastic resin film, a metal foil, and a release paper, and a thermoplastic resin film or a metal foil is preferred. Therefore, in a preferred embodiment, the support is a thermoplastic resin film or a metal foil.

[0153] When a thermoplastic resin film is used as the support, examples of the thermoplastic resin include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, with inexpensive polyethylene terephthalate being particularly preferred.

[0154] When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, with copper foil being preferred. The copper foil may be a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

[0155] The surface of the support to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment. Alternatively, a support having a release layer on the surface to be bonded to the resin composition layer may be used as the support. Examples of the release agent used in the release layer of the support having a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Commercially available products may be used as the support having a release layer, such as "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Uni-Peel" manufactured by Unitika Limited, which are PET films having a release layer primarily composed of an alkyd resin-based release agent.

[0156] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the thickness of the entire support with a release layer is in the above range.

[0157] When a metal foil is used as the support, a metal foil with a support substrate may be used, which is a thin metal foil with a peelable support substrate attached thereto. In one embodiment, the metal foil with a support substrate includes a support substrate, a release layer provided on the support substrate, and a metal foil provided on the release layer. When a metal foil with a support substrate is used as the support, the resin composition layer is provided on the metal foil.

[0158] In the metal foil with a supporting substrate, the material of the supporting substrate is not particularly limited, but examples thereof include copper foil, aluminum foil, stainless steel foil, titanium foil, copper alloy foil, etc. When copper foil is used as the supporting substrate, it may be electrolytic copper foil or rolled copper foil. Furthermore, the release layer is not particularly limited as long as it allows the metal foil to be released from the supporting substrate, and examples thereof include an alloy layer of an element selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, and P; an organic coating, etc.

[0159] In the metal foil with a supporting substrate, the material of the metal foil is preferably, for example, copper foil or copper alloy foil.

[0160] In the metal foil with a supporting substrate, the thickness of the supporting substrate is not particularly limited, but is preferably in the range of 10 μm to 150 μm, more preferably in the range of 10 μm to 100 μm. The thickness of the metal foil may be, for example, in the range of 0.1 μm to 10 μm.

[0161] In one embodiment, the resin sheet may further include an optional layer, if necessary. Examples of such optional layers include a protective film provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dust and the like to the surface of the resin composition layer and scratches can be suppressed.

[0162] The resin sheet can be produced, for example, by preparing a liquid resin composition as is or a resin varnish by dissolving the resin composition in an organic solvent, applying this onto a support using a die coater or the like, and then drying to form a resin composition layer.

[0163] The organic solvent may be the same as the organic solvent described as a component of the resin composition. The organic solvent may be used alone or in combination of two or more.

[0164] Drying may be carried out by known methods such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is carried out so that the content of organic solvent in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. Although this varies depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when a resin composition or resin varnish containing 30% by mass to 60% by mass of organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0165] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0166] In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention.

[0167] The sheet-like fiber substrate used for the prepreg is not particularly limited, and commonly used prepreg substrates such as glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. From the viewpoint of thinning printed wiring boards and semiconductor chip packages, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. There is no particular lower limit to the thickness of the sheet-like fiber substrate. It is usually 10 μm or more.

[0168] The prepreg can be produced by a known method such as a hot melt method or a solvent method.

[0169] The thickness of the prepreg may be in the same range as that of the resin composition layer in the resin sheet described above.

[0170] The sheet-like laminate material of the present invention can be suitably used to form an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and can be more suitably used to form an interlayer insulating layer of a printed wiring board (for an interlayer insulating layer of a printed wiring board). The sheet-like laminate material of the present invention can also be suitably used to form an insulating layer of a rewiring board of a semiconductor package (for an insulating layer of a rewiring board). That is, the sheet-like laminate material of the present invention can be suitably used as an insulating layer of a circuit board.

[0171] [Circuit board] The resin composition of the present invention can be used to form an insulating layer for a circuit board. The present invention also provides such a circuit board, i.e., a circuit board comprising an insulating layer made of a cured product of the resin composition of the present invention.

[0172] <Printed wiring board> In one embodiment, the circuit board of the present invention is a printed wiring board.

[0173] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing (e.g., thermally curing) the resin composition layer to form an insulating layer.

[0174] The "inner layer substrate" used in step (I) is a member that will become the substrate of a printed wiring board, and examples thereof include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be referred to as an "inner layer circuit board." Furthermore, the "inner layer substrate" of the present invention also includes intermediate products on which an insulating layer and / or a conductor layer is to be further formed during the production of a printed wiring board. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0175] The inner layer substrate and the resin sheet can be laminated, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of a member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as a "thermocompression bonding member") include a heated metal plate (such as a SUS end plate) or a metal roll (SUS roll). The thermocompression bonding member may be pressed directly onto the resin sheet, or may be pressed via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently conform to the surface irregularities of the inner layer substrate.

[0176] The lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination may be carried out under reduced pressure conditions, preferably at a pressure of 26.7hPa or less.

[0177] The lamination can be performed using a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch vacuum pressure laminator.

[0178] After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for lamination. The smoothing treatment may be performed using a commercially available laminator. Note that lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0179] The support may be removed between step (I) and step (II), or after step (II). When a metal foil is used as the support, the conductor layer may be formed using the metal foil without peeling off the support. When a metal foil with a supporting substrate is used as the support, the supporting substrate (and the release layer) may be peeled off. Then, the conductor layer can be formed using the metal foil.

[0180] In step (II), the resin composition layer is cured (for example, by heat curing) to form an insulating layer made of a cured product of the resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions typically employed for forming insulating layers for printed wiring boards may be used.

[0181] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 140° C. to 250° C., more preferably 150° C. to 240° C., and even more preferably 160° C. to 230° C. The curing time is preferably 5 minutes to 240 minutes, more preferably 10 minutes to 150 minutes, and even more preferably 15 minutes to 120 minutes.

[0182] Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C to 140°C, preferably 60°C to 135°C, more preferably 70°C to 130°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0183] When manufacturing a printed wiring board, the following steps may be further performed: (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer. These steps (III) to (V) may be performed according to various methods known to those skilled in the art and used in manufacturing printed wiring boards. When the support is removed after step (II), the removal of the support may be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating layer and the conductor layer in steps (I) to (V) may be repeated to form a multilayer wiring board.

[0184] In another embodiment, the printed wiring board of the present invention can be produced using the above-mentioned prepreg. The production method is basically the same as when a resin sheet is used.

[0185] Step (III) is a step of drilling holes in the insulating layer, thereby forming holes such as via holes and through holes in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, or the like, depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be determined appropriately depending on the design of the printed wiring board.

[0186] Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smear removal (desmear) is also performed. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions commonly used in forming insulating layers for printed wiring boards can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

[0187] The swelling liquid used in the roughening treatment is not particularly limited, but examples thereof include alkaline solutions and surfactant solutions, and is preferably an alkaline solution, with sodium hydroxide solution and potassium hydroxide solution being more preferred. Commercially available swelling liquids include "Swelling Dip Securigance P" and "Swelling Dip Securigance SBU" manufactured by Atotech Japan. The swelling treatment using a swelling liquid is not particularly limited, but can be carried out by, for example, immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40°C to 80°C for 5 to 15 minutes.

[0188] The oxidizing agent used in the roughening treatment is not particularly limited, but examples include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidizing agent such as alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass. Commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP," "Concentrate Compact P," and "Dosing Solution Securigance P" manufactured by Atotech Japan.

[0189] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and examples of commercially available products include "Reduction Solution Securigant P" manufactured by Atotech Japan.

[0190] Treatment with a neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in a neutralizing solution at 30° C. to 80° C. for 5 to 30 minutes. From the standpoint of workability, etc., a method in which the object that has been roughened with an oxidizing agent is immersed in a neutralizing solution at 40° C. to 70° C. for 5 to 20 minutes is preferred.

[0191] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0192] The conductor layer may have a single layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

[0193] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0194] In one embodiment, the conductor layer may be formed by plating. From the viewpoint of facilitating the formation of fine wiring, it is preferable to form the conductor layer by a semi-additive method. An example of forming the conductor layer by a semi-additive method will be described below.

[0195] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like, thereby forming a conductor layer having the desired wiring pattern.

[0196] In another embodiment, the conductor layer may be formed using a metal foil. When a metal foil is used to form the conductor layer, step (V) is preferably performed between steps (I) and (II). For example, after step (I), the support is removed, and a metal foil is laminated on the exposed surface of the resin composition layer. The lamination of the resin composition layer and the metal foil may be performed by a vacuum lamination method. The lamination conditions may be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Thereafter, a conductor layer having a desired wiring pattern can be formed using the metal foil on the insulating layer by a conventional known technique such as a modified semi-additive method.

[0197] The metal foil can be produced by a known method such as an electrolytic method, a rolling method, etc. Examples of commercially available metal foils include HLP foil and JXUT-III foil manufactured by JX Nippon Mining & Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0198] Alternatively, when a metal foil or a metal foil with a supporting substrate is used as the support for the resin sheet, the conductor layer may be formed using the metal foil, as described above.

[0199] <Rewiring substrate for semiconductor packages> In one embodiment, the circuit board of the present invention is a rewiring substrate (rewiring layer) of a semiconductor package. Hereinafter, a method for manufacturing a semiconductor package will be described.

[0200] The semiconductor package includes an insulating layer made of a cured product of the resin composition of the present invention as an insulating layer of a rewiring substrate. The semiconductor package may also include a sealing layer made of a cured product of the resin composition of the present invention.

[0201] A semiconductor package can be produced, for example, by a method including the following steps (1) to (6) using the resin composition and resin sheet of the present invention. The resin composition and resin sheet of the present invention can be used to form a rewiring formation layer (insulating layer for forming a rewiring substrate) in step (5) or a sealing layer in step (3). An example of forming a rewiring formation layer or a sealing layer using a resin composition or a resin sheet will be shown below. However, techniques for forming a rewiring formation layer or a sealing layer for a semiconductor package are known, and a person skilled in the art can produce a semiconductor package using the resin composition and resin sheet of the present invention according to known techniques. (1) a step of laminating a temporary fixing film on a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A step of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0202] -Process (1)- The material used for the substrate is not particularly limited. Examples of the substrate include semiconductor wafers such as silicon wafers, glass wafers, glass substrates, metal substrates such as copper, titanium, stainless steel, and cold-rolled steel sheets (SPCC), substrates in which glass fibers are impregnated with epoxy resin or the like and then thermoset (e.g., FR-4 substrates), and substrates made of bismaleimide triazine resin (BT resin).

[0203] The material of the temporary fixing film is not particularly limited as long as it can be peeled off from the semiconductor chip in step (4) and can temporarily fix the semiconductor chip. Commercially available products can be used as the temporary fixing film. Examples of commercially available products include Riva Alpha manufactured by Nitto Denko Corporation.

[0204] -Process (2)- The semiconductor chips can be temporarily fixed using known devices such as a flip chip bonder, a die bonder, etc. The layout and number of semiconductor chips to be arranged can be appropriately set depending on the shape and size of the temporary fixing film, the number of semiconductor packages to be produced, etc., and for example, the semiconductor chips can be temporarily fixed by arranging them in a matrix of multiple rows and multiple columns.

[0205] -Process (3)- The resin composition layer of the resin sheet of the present invention is laminated on a semiconductor chip, or the resin composition of the present invention is applied to a semiconductor chip and cured (for example, thermally cured) to form a sealing layer.

[0206] For example, lamination of a semiconductor chip and a resin sheet can be performed by removing the protective film from the resin sheet and then thermocompressing the resin sheet to the semiconductor chip from the support side. Examples of a member for thermocompressing the resin sheet to the semiconductor chip (hereinafter also referred to as a "thermocompression member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). It is preferable to press the thermocompression member not directly onto the resin sheet, but via an elastic material such as heat-resistant rubber, so that the resin sheet can adequately conform to the surface irregularities of the semiconductor chip. The semiconductor chip and resin sheet can also be laminated by a vacuum lamination method, and the lamination conditions and preferred ranges are the same as those described in relation to the method for manufacturing a printed wiring board.

[0207] After lamination, the resin composition is thermally cured to form the sealing layer under the same conditions as those described in relation to the method for producing a printed wiring board.

[0208] The support of the resin sheet may be peeled off after the resin sheet is laminated on the semiconductor chip and thermally cured, or the support may be peeled off before the resin sheet is laminated on the semiconductor chip.

[0209] When forming a sealing layer by applying the resin composition of the present invention, the application conditions are the same as the application conditions when forming the resin composition layer described in relation to the resin sheet of the present invention, and the preferred ranges are also the same.

[0210] -Process (4)- The method for peeling off the substrate and the temporary fixing film can be changed as appropriate depending on the material of the temporary fixing film, etc., and examples include a method in which the temporary fixing film is heated and foamed (or expanded) to peel it off, and a method in which ultraviolet light is irradiated from the substrate side to reduce the adhesive strength of the temporary fixing film and peel it off.

[0211] In the method of heating and foaming (or expanding) the temporary fixing film to peel it off, the heating conditions are usually 100 to 250°C for 1 to 90 seconds or 5 to 15 minutes. In the method of irradiating ultraviolet light from the substrate side to reduce the adhesive strength of the temporary fixing film to peel it off, the irradiation dose of ultraviolet light is usually 10 mJ / cm. 2 ~1000mJ / cm 2 is.

[0212] -Process (5)- The resin composition and resin sheet of the present invention are used to form a rewiring formation layer (insulating layer of a rewiring substrate).

[0213] After forming the redistribution layer, via holes may be formed in the redistribution layer to connect the semiconductor chip to a conductor layer (described later). The via holes may be formed by a known method depending on the material of the redistribution layer.

[0214] -Process (6)- The formation of the conductor layer on the rewiring formation layer may be carried out in the same manner as in step (V) described in relation to the method for producing a printed wiring board. Note that steps (5) and (6) may be repeated to alternately stack (build up) the conductor layer (rewiring layer) and the rewiring formation layer (insulating layer).

[0215] The manufacturing of the semiconductor package may further include steps of (7) forming a solder resist layer on the conductor layer (rewiring layer), (8) forming bumps, and (9) dicing the multiple semiconductor packages into individual semiconductor packages. These steps may be performed according to various methods known to those skilled in the art that are used in the manufacturing of semiconductor packages.

[0216] By forming a rewiring formation layer (insulating layer) using the resin composition or resin sheet of the present invention, which can provide a cured product exhibiting good dielectric properties, good smear removal properties, and crack resistance, a semiconductor package with extremely low transmission loss can be realized without concerns about cracking, regardless of whether the semiconductor package is a fan-in package or a fan-out package. In one embodiment, the semiconductor package of the present invention is a fan-out package. The resin composition or resin sheet of the present invention can be applied to both a fan-out panel level package (FOPLP) and a fan-out wafer level package (FOWLP). In one embodiment, the semiconductor package of the present invention is a fan-out panel level package (FOPLP) or a fan-out wafer level package (FOWLP).

[0217] [Semiconductor Devices] The semiconductor device of the present invention includes a layer made of a cured product of the resin composition layer of the present invention. The semiconductor device of the present invention can be produced using the circuit board of the present invention.

[0218] Examples of semiconductor devices include various semiconductor devices used in electrical appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). [Example]

[0219] The present invention will be described in more detail below with reference to examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified.

[0220] <Synthesis Example 1: Synthesis of Active Ester Resin A> A flask equipped with a thermometer, dropping funnel, condenser, distillation column, and stirrer was charged with 203.0 g of isophthalic acid chloride (molar number of acid chloride groups: 2.0 mol) and 1400 g of toluene. The system was then vacuum-purged with nitrogen and dissolved. Next, 113.9 g (0.67 mol) of orthophenylphenol and 240 g of benzyl-containing dihydroxynaphthalene (molar number of phenolic hydroxyl groups: 1.33 mol) were added, and the system was vacuum-purged with nitrogen and dissolved. Next, 0.70 g of tetrabutylammonium bromide was dissolved. While purging with nitrogen gas, the system was controlled to below 60°C, and 400 g of 20% aqueous sodium hydroxide solution was added dropwise over 3 hours. Stirring was then continued under these conditions for 1.0 hour. After the reaction was completed, the mixture was allowed to stand, allowing the reaction mixture to separate, and the aqueous layer was removed. Water was then added to the toluene layer containing the dissolved reactant, and the mixture was stirred and mixed for 15 minutes. The mixture was then allowed to stand, allowing the aqueous layer to be removed. This operation was repeated until the pH of the aqueous layer reached 7. The water was then removed by decanting, yielding an active ester resin A (an active ester resin containing a naphthalene structure) in the form of a toluene solution with a nonvolatile content of 65% by mass. The active ester group equivalent of the resulting active ester resin A was 238 g / eq.

[0221] <Synthesis Example 2: Synthesis of maleimide compound A> According to Synthesis Example 1 in Japan Institute of Invention and Innovation Disclosure Technical Bulletin No. 2020-500211, an MEK solution (62% by mass of non-volatile components) of maleimide compound A represented by the following formula (M) was prepared. The Mw / Mn of this maleimide compound A was 1.81, and t″ in formula (M) was 1.47 (mainly 1, 2, or 3).

[0222] [ka]

[0223] <Synthesis Example 3: Synthesis of vinyl compound A> According to Example 1 of WO 2017 / 115813, 3.0 moles (390.6 g) of divinylbenzene, 1.8 moles (229.4 g) of ethylvinylbenzene, 10.2 moles (1066.3 g) of styrene, and 15.0 moles (1532.0 g) of n-propyl acetate were charged into a 5.0 L reactor, and 600 mmol of boron trifluoride diethyl ether complex was added at 70 °C and allowed to react for 4 hours. After the polymerization solution was terminated with aqueous sodium bicarbonate, the oil layer was washed three times with pure water, and the mixture was devolatilized under reduced pressure at 60 °C to recover the polymer. The resulting product was weighed, confirming that 896.7 g of vinyl compound A was obtained. The Mw of vinyl compound A was 41,300.

[0224] [Examples 1 to 9, Comparative Examples 1 to 3] (1) Preparation of resin composition Each component was weighed according to the formulation shown in Table 1, and then 10 parts of MEK and 10 parts of cyclohexanone were added and mixed together, followed by uniform dispersion using a high-speed rotating mixer to obtain a resin composition (resin varnish).

[0225] (2) Manufacturing of resin sheets A polyethylene terephthalate film ("AL5" manufactured by Lintec Corporation, thickness 38 μm) with a release layer was prepared as a support. The obtained resin varnish was uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying would be 40 μm. The resin composition was then dried at 80°C to 100°C (average 90°C) for 4 minutes to obtain a resin sheet A having a layer structure of resin composition layer / support. Furthermore, a resin sheet B was obtained in the same manner as above, except that the resin varnish was applied uniformly so that the thickness of the resin composition layer after drying would be 25 μm.

[0226] <Measurement of dielectric loss tangent> The resin sheet A obtained in each of the examples and comparative examples was heated in an oven at 190°C for 90 minutes to cure the resin composition layer. The support was then peeled off to obtain a cured product of the resin composition layer. The cured product was cut into a length of 80 mm and a width of 2 mm to prepare a cured product for evaluation.

[0227] For each cured product for evaluation, the dielectric loss tangent (Df value) was measured by the cavity resonance perturbation method using an Agilent Technologies HP8362B at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on two test pieces, and the average was calculated.

[0228] <Evaluation of smear removal> (1) Preparation of inner layer board Both sides of a glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with an inner layer circuit formed on it were etched 1 μm deep with a microetching agent (MEC "CZ8101") to roughen the copper surface.

[0229] (2) Lamination of resin sheet A Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., two-stage build-up laminator "CVP700"), the resin sheets A obtained in the Examples and Comparative Examples were laminated on both sides of the inner layer substrate so that the resin composition layer was in contact with the inner layer substrate. Lamination was performed by reducing the pressure for 30 seconds to adjust the air pressure to 13 hPa or less, followed by pressure bonding at 120°C and a pressure of 0.74 MPa for 30 seconds. The laminate was then heat-pressed at 100°C and a pressure of 0.5 MPa for 60 seconds to smooth the laminate.

[0230] (3) Thermal curing of the resin composition layer The inner layer substrate laminated with resin sheet A was then placed in an oven at 130°C and heated for 30 minutes, and then transferred to an oven at 170°C and heated for 30 minutes to thermally cure the resin composition layer and form an insulating layer. The support was then peeled off to obtain a cured substrate having a structure of insulating layer / inner layer substrate / insulating layer.

[0231] (4) Formation of via holes The insulating layer of the obtained cured substrate was drilled using a CO2 laser processing machine ("LK-2K212 / 2C" manufactured by Via Mechanics) under the conditions of a frequency of 2000 Hz, a pulse width of 3 μs, an output of 0.95 W, and a shot count of 3. In this way, a via hole with a top diameter of 50 μm on the surface of the insulating layer and a diameter of 50 μm on the bottom surface of the insulating layer was formed, and Substrate A was obtained.

[0232] (5) Roughening treatment Substrate A was subjected to a desmear treatment as a roughening treatment, which was the following wet desmear treatment. (wet desmear treatment) The cured substrate was immersed in a swelling solution (Atotech Japan's "Swelling Dip Securigant P," an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 10 minutes, then in an oxidizing solution (Atotech Japan's "Concentrate Compact P," an aqueous solution of approximately 6% potassium permanganate and 4% sodium hydroxide) at 80°C for 25 minutes, and finally in a neutralizing solution (Atotech Japan's "Reduction Solution Securigant P," an aqueous sulfuric acid solution) at 40°C for 5 minutes. It was then dried at 80°C for 15 minutes. The resulting substrate is referred to as Evaluation Substrate A.

[0233] (6) Evaluation of smear removal For evaluation substrate A, the periphery of the bottom of the via hole was observed with a scanning electron microscope (SEM), and the maximum smear length from the wall surface of the bottom of the via hole was measured from the obtained image and evaluated according to the following criteria. ○: Maximum smear length is less than 5 μm ×: Maximum smear length is 5 μm or more

[0234] <Evaluation of crack resistance after desmear treatment> (1) Preparation of inner layer board The core material was prepared as a lattice-like material (Hitachi Chemical Co., Ltd. "E705GR", thickness 400 μm) consisting of circular copper pads (copper thickness 35 μm) with a diameter of 350 μm, spaced 400 μm apart, to achieve a remaining copper ratio of 60%.

[0235] (2) Lamination of resin sheet B Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., two-stage build-up laminator "CVP700"), the resin sheets B obtained in the Examples and Comparative Examples were laminated on both sides of the inner layer substrate so that the resin composition layer was in contact with the inner layer substrate. Lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, followed by pressure bonding at 100°C and a pressure of 0.74 MPa for 30 seconds. The laminate was then heat-pressed at 100°C and a pressure of 0.5 MPa for 60 seconds to smooth the laminate.

[0236] (3) Thermal curing of the resin composition layer The inner layer substrate laminated with resin sheet B was then placed in a 130°C oven and heated for 30 minutes, and then transferred to a 175°C oven and heated for 40 minutes to thermally cure the resin composition layer and form an insulating layer. The support was then peeled off to obtain a cured substrate having a structure of insulating layer / inner layer substrate / insulating layer.

[0237] (4) Desmearing The resulting cured substrate was immersed in a swelling solution (Atotech Japan's "Swelling Dip Securigant P," an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 10 minutes, then in an oxidizing solution (Atotech Japan's "Concentrate Compact P," an aqueous solution of approximately 6% potassium permanganate and 4% sodium hydroxide) at 80°C for 30 minutes, and finally in a neutralizing solution (Atotech Japan's "Reduction Solution Securigant P," an aqueous sulfuric acid solution) at 40°C for 5 minutes. It was then dried at 80°C for 15 minutes. The resulting substrate is referred to as Evaluation Substrate B.

[0238] (5) Evaluation of crack resistance For the evaluation substrate B, 100 copper pad portions were observed to check for the presence or absence of cracks in the insulating layer, and the results were evaluated according to the following criteria. ○: 10 or less cracks ×: More than 10 cracks

[0239] The results of Examples 1 to 9 and Comparative Examples 1 to 3 are shown in Table 1.

[0240] [Table 1]

[0241] The details of each component listed in Table 1 are as follows: (A) Epoxy resin ZX1059: Functional group equivalent weight 169g / eq, manufactured by Nippon Steel Chemical & Material Co., Ltd., a 1:1 mixture of bisphenol A epoxy resin and bisphenol F epoxy resin HP-4032-SS: Functional group equivalent weight 144g / eq, manufactured by DIC, naphthalene-type epoxy resin NC-3000L: Functional group equivalent weight 269g / eq, manufactured by Nippon Kayaku Co., Ltd., biphenyl type epoxy resin (B) Active ester resin HPC-8150-62T: Functional group equivalent weight 223 g / eq, non-volatile content 61.5 mass% in toluene solution, manufactured by DIC Corporation, activated ester resin with naphthalene structure HPC-8000L-65MT: Functional group equivalent weight 229 g / eq, toluene / MEK solution with non-volatile content of 65% by mass, manufactured by DIC Corporation, active ester resin containing dicyclopentadiene-type diphenol structure Active ester resin A: Active ester resin synthesized in Synthesis Example 1 -(C) (meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms- PEAM1769: a (meth)acrylate compound having a structure represented by the following formula (C-1), manufactured by Desiigner Molecules, Inc. (wherein R S1 is a C8 alkyl group, R S2 is a C5 or C6 alkyl group, and n is 1 to 5) [ka] (D) Other hardeners LA-3018-50P: 1-methoxy-2-propanol solution with functional group equivalent of 151 g / eq and non-volatile content of 50% by mass, manufactured by DIC Corporation (E) Inorganic filler SO-C2: Spherical silica surface-treated with an amino-silane coupling agent (Shin-Etsu Chemical Co., Ltd. "KBM573"), average particle size 0.5 μm, specific surface area 5.8 m 2 / g, manufactured by Admatechs Co., Ltd. (F) Compound containing a radically polymerizable unsaturated group Maleimide compound A: The maleimide compound synthesized in Synthesis Example 2 MIR-3000-70MT: toluene / MEK solution with a nonvolatile content of 70% by mass, manufactured by Nippon Kayaku Co., Ltd. A maleimide compound having an aromatic ring skeleton directly bonded to the nitrogen atom of the maleimide group, having a structure represented by the following formula (wherein n is 1 to 100): [ka] SLK-6895: A maleimide compound containing an aliphatic skeleton, manufactured by Shin-Etsu Chemical Co., Ltd. SLK-1500: A maleimide compound containing an aliphatic skeleton, manufactured by Shin-Etsu Chemical Co., Ltd. OPE-2St-1200: toluene solution with 65% non-volatile content, manufactured by Mitsubishi Gas Chemical Co., Ltd. Vinyl compound A: the vinyl compound synthesized in Synthesis Example 3 NE-V-1100-70T: toluene solution with 70% non-volatile content, manufactured by DIC Corporation ·A-DOG: Manufactured by Shin-Nakamura Chemical Industry Co., Ltd. -(G)Organic filler- EXL-2655: Organic filler containing rubber components, manufactured by Dow -(H) Curing accelerator- 1B2PZ: Shikoku Chemicals Corporation, imidazole-based curing accelerator

Claims

1. (A) an epoxy resin, (B) an active ester resin, and (C) (meth)acrylate compound containing an aliphatic group having 10 or more carbon atoms A resin composition comprising: The component (C) has a structure represented by the following formula (C1-1): A resin composition, wherein the content of component (C) is 0.5% by mass or more and 20% by mass or less, when the resin component in the resin composition is 100% by mass. 【Chemistry 1】 (In formula (C1-1), Each X independently represents a (meth)acryloyl group; A 11 represents an alkylene group having 1 to 4 carbon atoms; A 21 represents an alkylene group having 4 to 10 carbon atoms; Ring Z 1 represents a cycloalkane ring having 4 to 14 carbon atoms; ring Z 2 represents a cycloalkane ring having 4 to 14 carbon atoms which may have an alkyl group having 1 to 10 carbon atoms as a substituent, or a cycloalkene ring having 4 to 14 carbon atoms which may have an alkyl group having 1 to 10 carbon atoms as a substituent; n11 represents a number from 1 to 5.

2. The resin composition according to claim 1, wherein the mass ratio of the component (B) to the component (A) [component (B) / component (A)] is 0.8 or more.

3. In formula (C1-1), Each X independently represents a (meth)acryloyl group; A １１ represents an alkylene group having one carbon atom, A ２１ represents an alkylene group having 7 carbon atoms, Ring Z １ represents a tricyclodecane ring, Ring Z ２ represents a cyclohexane ring substituted with two alkyl groups having 5 to 8 carbon atoms; The resin composition according to claim 1, wherein n11 represents a number from 1 to 5.

4. The resin composition according to claim 1 , further comprising (E) an inorganic filler.

5. The resin composition according to claim 4, wherein the content of the component (E) is 40% by mass or more when the nonvolatile components in the resin composition are 100% by mass.

6. The resin composition according to claim 1 , further comprising (F) a compound containing a radically polymerizable unsaturated group (excluding component (C)).

7. The resin composition according to claim 1, which is used for an insulating layer of a circuit board.

8. A resin sheet comprising a support and a layer of the resin composition according to any one of claims 1 to 7 provided on the support.

9. The resin sheet according to claim 8 , wherein the support is a thermoplastic resin film or a metal foil.

10. A cured product of the resin composition according to any one of claims 1 to 7.

11. A circuit board comprising an insulating layer made of a cured product of the resin composition according to any one of claims 1 to 7.

12. A semiconductor device comprising the circuit board according to claim 11.

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