Receptor substrate, receptor substrate manufacturing method, transfer method, LED panel manufacturing method, and device manufacturing method

Abstract

[Problem] To provide a receptor substrate with which it is possible to increase the rate of success of picking-up of a transferred object to be transferred during a transfer using a stamper, a method for manufacturing the receptor substrate, and a transfer method and an LED panel manufacturing method using the receptor substrate. [Solution] A receptor substrate on which a plurality of transferred objects to be transferred onto another substrate using a stamper are disposed, the receptor substrate comprising: a plurality of sections in each of which a group of transferred objects to be simultaneously transferred in a single transfer operation of the stamper are disposed; and a non-disposed region outside the sections in which the transferred objects are not disposed, each of the plurality of sections being surrounded by the non-disposed region.

Description

[Technical Field]

[0001] The present invention relates to a receptor substrate, a method for manufacturing a receptor substrate, a transfer method, a method for manufacturing an LED panel, and a stamper. [Background technology]

[0002] In recent years, nitride semiconductor optical devices have come to be used as backlights for liquid crystal displays and signage displays. These applications require large numbers of optical devices to be used at once, so high-speed transfer technology is required. High-speed transfer technology generally involves bulk transfer using a stamping method that uses a stamper, and it has become possible to transfer between 1,000 and tens of thousands of devices at a time.

[0003] Optical devices are mass-produced on sapphire substrates, for example, using semiconductor processes. To produce a 4-inch display substrate using LEDs called micro LEDs, which are 100 μm square or less, several million micro LEDs are required. Micro LEDs, which are tiny devices measuring several tens of μm, are used after being separated from the sapphire substrate, which is the epitaxial substrate.

[0004] The separation method is generally to bond a support substrate as a donor precursor substrate to the optical devices arranged on a sapphire substrate, and then separate the optical devices from the sapphire substrate by laser lift-off, thereby obtaining a donor substrate with a large number of optical devices arranged on its surface.

[0005] Such a method is not limited to optical devices, but can also be applied to manufacturing a donor substrate having a plurality of transfer objects, such as minute semiconductor devices, arranged on its surface.

[0006] In addition, the object to be transferred on the donor substrate can be transferred onto a receptor substrate so that it is arranged in a manner corresponding to the circuit board of the product, and then transferred from this receptor substrate to another substrate, such as the circuit board of the product, using a stamping method.

[0007] For example, Patent Document 1 proposes a method for transferring an object to be transferred from a donor substrate to a receptor substrate with high precision using laser irradiation. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 2020-4478 Summary of the Invention [Problem to be solved by the invention]

[0009] Conventionally, when transferring from a receptor substrate to another substrate using the stamp method, problems such as failing to pick up part of the transfer target or mistakenly picking up a device adjacent to the transfer target have occurred, which has reduced the productivity of products with multiple transfer targets.

[0010] The present invention has been made to solve the above problems, and aims to provide a receptor substrate that can increase the success rate of picking up an object to be transferred when using a stamper, a method for manufacturing this receptor substrate, a transfer method and a method for manufacturing an LED panel using this receptor substrate, and a stamper. [Means for solving the problem]

[0011] In order to solve the above problems, the present invention provides a receptor substrate on which a plurality of transfer objects are arranged, the transfer objects being to be transferred to another substrate using a stamper, the receptor substrate comprising: a plurality of compartments in which a group of the transfer objects to be simultaneously transferred in a single transfer operation by the stamper is arranged; a non-placement area in which the transfer object is not placed outside the compartment; A receptor substrate is provided in which each of the plurality of compartments is surrounded by the non-placement region.

[0012] The receptor substrate of the present invention has multiple sections in which a group of transfer objects are arranged to be transferred simultaneously in a single transfer operation using a stamper, so that transfer can be performed section by section, eliminating the need to use a large stamper to transfer all of the transfer objects at once.As a result, pickup failures caused by warping in the surface direction of the stamper or receptor substrate used can be prevented.

[0013] Furthermore, in the receptor substrate of the present invention, each compartment is surrounded by a non-placement area where no transfer object is placed, so that it is possible to prevent the mistaken picking up of a device placed in an adjacent compartment during a single transfer operation using the stamper.

[0014] As a result, the receptor substrate of the present invention can increase the success rate of picking up the transfer object, and as a result, can improve the productivity of products equipped with the transfer object.

[0015] For example, the transfer object may be a micro LED or a semiconductor chip.

[0016] The object to be transferred is not particularly limited, but may be, for example, a micro LED or a semiconductor chip.

[0017] The present invention also provides a method for manufacturing a receptor substrate on which a plurality of transfer objects to be transferred to another substrate using a stamper are arranged, comprising the steps of: preparing a donor substrate having the transfer object and a receptor precursor substrate; transferring the object from the donor substrate to the receptor precursor substrate by laser lift-off to obtain a receptor substrate; Including, The present invention provides a method for manufacturing a receptor substrate, in which, in the step of obtaining the receptor substrate, a plurality of sections are formed on the receptor precursor substrate in which a group of the transfer objects to be transferred simultaneously in a single transfer operation using the stamper is placed, and non-placement areas in which the transfer objects are not placed are formed outside the sections, and the transfer objects are transferred by laser lift-off so that each of the plurality of sections is surrounded by the non-placement area.

[0018] According to this method for manufacturing a receptor substrate, the success rate of picking up the transfer object can be increased, and as a result, the receptor substrate of the present invention can be manufactured, which can improve the productivity of products equipped with the transfer object.

[0019] The present invention also provides a transfer method for transferring a plurality of transfer objects from the receptor substrate of the present invention to another substrate using a stamper, the method comprising the steps of: A transfer method is provided, which includes a stamping step in which the group of transfer objects is simultaneously transferred from at least one of the plurality of sections of the receptor substrate to the other substrate, section by section, using the stamper in a single transfer operation.

[0020] In such a transfer method, the receptor substrate of the present invention is used, so the success rate of picking up the transfer object can be increased, and as a result, excellent transfer efficiency can be achieved.

[0021] Further, the present invention provides a method for manufacturing an LED panel, the method comprising the steps of: preparing a receptor substrate according to the present invention, the receptor substrate being a micro LED; providing an LED panel substrate; a step of simultaneously transferring the group of micro LEDs, which are the transfer objects, from at least one of the plurality of sections of the receptor substrate to the LED panel substrate by section using a stamper in a single transfer operation; The present invention provides a method for manufacturing an LED panel, comprising:

[0022] In such a manufacturing method of an LED panel, the receptor substrate of the present invention is used for transfer, which increases the success rate of picking up the micro LED, and as a result, LED panels can be manufactured with high productivity.

[0023] Further, in the present invention, there is provided a stamper having a stamper head provided on one surface of a substrate, A stamper is provided having a region on one surface of the substrate where the stamper head is not provided, the region having been subjected to a mold release treatment.

[0024] With such a stamper, even if the stamper comes into contact with part of a compartment adjacent to the compartment to be transferred, the presence of the release-treated area prevents unintended pick-up of the adjacent compartment, thereby increasing the success rate of picking up the transfer target. Furthermore, a stamper that has undergone such release treatment is not limited to use in picking up each compartment, but is particularly effective for repair (re-transferring a transfer target to a part of a substrate on which transfer targets have been arranged and from which a defective transfer target has been removed).

[0025] For example, the mold release treatment may be the formation of a mold release film.

[0026] The release treatment is not particularly limited, but may be, for example, the formation of a release film.

[0027] For example, the release film may be a fluororesin film or a metal film.

[0028] The release film is not particularly limited, but may be, for example, a fluororesin film or a metal film.

[0029] For example, the surface of the stamper head that picks up the transfer object may have a protrusion.

[0030] By providing the pick-up surface with protrusions, better pick-up properties can be achieved.

[0031] In this case, the protrusions are preferably arranged in a matrix.

[0032] By providing the protrusions in a matrix, more stable pickup can be achieved.

[0033] Furthermore, the size of the protrusion is preferably such that the diameter of the circumscribing circle circumscribing the protrusion is 0.5 to 1.5 times the diameter of the circumscribing circle circumscribing the object to be transferred.

[0034] By setting the range in this way, transfer can be performed with higher precision.

[0035] The surface of the stamper head that picks up the transfer object may have an adhesive layer.

[0036] The stamper of the present invention may be one that realizes pick-up by means of an adhesive layer.

[0037] The surface of the stamper head that picks up the transfer object may be made of adhesive.

[0038] The stamper of the present invention may be one that realizes pick-up by adhesive.

[0039] The stamper head may be made of silicone resin.

[0040] The stamper head may be made of, for example, silicone resin.

[0041] The stamper of the present invention is used, for example, in repair processing.

[0042] As described above, the stamper of the present invention is particularly effective for repair. [Effects of the Invention]

[0043] As described above, the receptor substrate of the present invention can increase the success rate of picking up the transfer object, and as a result, can improve the productivity of products equipped with the transfer object.

[0044] Furthermore, the method for manufacturing the receptor substrate of the present invention can increase the success rate of picking up the transfer object, and as a result, it is possible to manufacture the receptor substrate of the present invention which can improve the productivity of products equipped with the transfer object.

[0045] Furthermore, the transfer method of the present invention can increase the success rate of picking up the transfer target, thereby achieving excellent transfer efficiency.

[0046] Furthermore, the LED panel manufacturing method of the present invention allows LED panels to be manufactured with high productivity.

[0047] Furthermore, the stamper of the present invention can increase the success rate of picking up the transfer target object. [Brief explanation of the drawings]

[0048] [Figure 1] FIG. 1 is a schematic plan view showing an example of a receptor substrate of the present invention. [Figure 2] FIG. 1 is a schematic flow diagram showing an example of a transfer method using an example of a receptor substrate of the present invention. [Figure 3] FIG. 1 is a schematic flow diagram showing a part of a method for manufacturing an LED panel using an example of a receptor substrate of the present invention. [Figure 4] FIG. 1 is a schematic flow diagram showing a part of an example of a method for producing a receptor substrate of the present invention. [Figure 5] FIG. 1 is a schematic flow chart showing another part of an example of the method for producing a receptor substrate of the present invention. [Figure 6] FIG. 1 is a schematic flow chart showing another part of an example of the method for producing a receptor substrate of the present invention. [Figure 7] FIG. 1 is a schematic flow chart showing another part of an example of the method for producing a receptor substrate of the present invention. [Figure 8] FIG. 1 is a schematic flow chart showing another part of an example of the method for producing a receptor substrate of the present invention. [Figure 9] FIG. 1 is a schematic flow chart showing another part of an example of the method for producing a receptor substrate of the present invention. [Figure 10] FIG. 1 is a schematic flow chart showing another part of an example of the method for producing a receptor substrate of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0049] As described above, there has been a demand for the development of a receptor substrate that can increase the success rate of picking up an object to be transferred when a stamper is used for transfer.

[0050] As a result of extensive research into the above-mentioned problems, the inventors discovered that if a receptor substrate has multiple sections in which a group of transfer objects to be transferred simultaneously in a single transfer operation using a stamper is placed, and each of these multiple sections is surrounded by a non-placement area in which no transfer objects are placed, it is possible to prevent failure to pick up some of the transfer objects or erroneous picking up of devices adjacent to the transfer objects, and thus completed the present invention.

[0051] That is, the present invention provides a receptor substrate on which a plurality of transfer objects are arranged, which are to be transferred to another substrate using a stamper, a plurality of compartments in which a group of the transfer objects to be simultaneously transferred in a single transfer operation by the stamper is arranged; a non-placement area in which the transfer object is not placed outside the compartment; The receptor substrate has a plurality of compartments, each of which is surrounded by a non-placement region.

[0052] The present invention also provides a method for manufacturing a receptor substrate on which a plurality of transfer objects to be transferred to another substrate using a stamper are arranged, comprising the steps of: preparing a donor substrate having the transfer object and a receptor precursor substrate; transferring the object from the donor substrate to the receptor precursor substrate by laser lift-off to obtain a receptor substrate; Including, In the process of obtaining the receptor substrate, a plurality of sections are formed on the receptor precursor substrate in which a group of the transfer objects to be transferred simultaneously in a single transfer operation using the stamper is placed, and non-placement areas in which the transfer objects are not placed are formed outside the sections, and the transfer objects are transferred by laser lift-off so that each of the plurality of sections is surrounded by the non-placement area.

[0053] The present invention also provides a transfer method for transferring a plurality of objects from the receptor substrate of the present invention to another substrate using a stamper, the method comprising the steps of: This is a transfer method that includes a stamping step in which the group of transfer objects is simultaneously transferred from at least one of the multiple sections of the receptor substrate to the other substrate, section by section, using the stamper in a single transfer operation.

[0054] The present invention also provides a method for manufacturing an LED panel, comprising: A step of preparing a receptor substrate of the present invention, wherein the transfer object is a micro LED; providing an LED panel substrate; a step of simultaneously transferring the group of micro LEDs, which are the transfer objects, from at least one of the plurality of sections of the receptor substrate to the LED panel substrate by section using a stamper in a single transfer operation; The LED panel manufacturing method includes:

[0055] The present invention also provides a stamper having a stamper head provided on one surface of a substrate, The area on one surface of the substrate where the stamper head is not provided is a stamper having an area that has been subjected to a mold release treatment.

[0056] The present invention will be described in detail below, but the present invention is not limited thereto.

[0057] FIG. 1 shows a schematic plan view of the receptor substrate of the present invention. A plurality of transfer objects 4 are arranged on the receptor substrate 1 in Fig. 1. The receptor substrate 1 in Fig. 1 also has a plurality of compartments 2 in which groups of transfer objects 4 are arranged, and has non-arrangement areas 3 outside the compartments 2 in which no transfer objects 4 are arranged. Each of the plurality of compartments 2 is surrounded by a non-arrangement area 3.

[0058] An example of a transfer method using such a receptor substrate 1 will be described with reference to FIG.

[0059] First, as shown in FIG. 2(A), the receptor substrate 1 is fixed on the receptor stage 11, and another substrate 9 is fixed on the substrate stage 91.

[0060] Next, a group of transfer objects 4 arranged in one of the compartments 2 of the receptor substrate 1 are simultaneously transferred onto another substrate 9 in a single transfer operation using a stamper 8.

[0061] Specifically, as shown by the arrow in Figure 2(A), a stamper 8 equipped with a stamper head 81 at its bottom end is lowered, and the stamper head 81 is brought into contact with a group of transfer objects 4 arranged in one compartment 2. This allows the stamper 8 to pick up the group of transfer objects 4 in one compartment, as shown in Figure 2(B). The stamper 8 then moves onto another substrate 9 as shown by the arrow in Figure 2(B), and then rises, leaving the group of transfer objects 4 on the other substrate 9, as shown in Figure 2(C).

[0062] The above-described transfer is carried out section by section from at least one section.

[0063] If a large stamper is used to pick up all of the transfer objects at once, the pickup surface of the stamper head will warp, significantly affecting the pick-up, resulting in some objects being unable to be picked up. On the other hand, with the receptor substrate 1 of the present invention, a group of transfer objects 4 to be simultaneously transferred in a single transfer operation using the stamper 8 is arranged in each of multiple compartments 2, eliminating the need for a large stamper capable of picking up all of the transfer objects 4 on the receptor substrate 1 at once. The receptor substrate 1 of the present invention allows the use of a stamper equipped with a stamper head 81 sized to fit the size of each compartment 2, eliminating the problem of warping of the pickup surface of the stamper head 81 and allowing the group of transfer objects 4 in one compartment 2 to be picked up uniformly without leaving any behind. Although this increases the number of stamps, it ultimately increases the success rate of pick-up. Furthermore, even if the receptor substrate is warped, the effects of the warp on the receptor substrate can be reduced by picking up the objects by compartment as described above.

[0064] Furthermore, in the receptor substrate 1 of the present invention, each of the multiple compartments 2 is surrounded by a non-placement area 3, so that when picking up a transfer object 4 from one compartment 2 with a stamper 8, as shown in Figure 2 (B), it is possible to prevent the transfer object 4 placed in an adjacent compartment 2 from adhering to the stamper 8, and to prevent the mistaken picking up of a device adjacent to the desired transfer object 4.

[0065] As described above, the receptor substrate 1 of the present invention can prevent failure to pick up part of the transfer object 4 or mistakenly picking up a device adjacent to the transfer object 4, thereby increasing the success rate of picking up the transfer object.

[0066] The transfer object 4 is not particularly limited, but may be, for example, a micro LED or a semiconductor chip.

[0067] 1 shows a schematic example of an arrangement of a plurality of transfer objects 4 each consisting of a red micro light emitting diode (LED) 41, a green micro LED 42, and a blue micro LED 43. For the sake of explanation, FIG. 1 shows each of the micro LEDs 41 to 43 so that they can be seen, but in reality, the micro LEDs are integrated at a density that is not visible to the naked eye.

[0068] 1, for example, micro LEDs 41 to 43 that can be mounted directly on the backplane of one smart watch can be arranged at a pixel pitch as a group of transfer objects 4. In the example of FIG. 1, the micro LEDs 41 to 43 equivalent to nine smart watches are arranged at a pixel pitch on the receptor substrate 1.

[0069] 3, the receptor substrate 1 can be used to transfer the micro LEDs, which are the transfer objects 4, from at least one of the sections 2 of the receptor substrate 1 to another substrate, an LED panel substrate 9, for each section 2, and then arrange them on the substrate 9 to manufacture a single LED panel 10. Here, the LED panel substrate 9 can be, for example, a backplane.

[0070] In this way, by transferring the transfer object 4 using the receptor substrate 1 of the present invention, not only small products such as smart watches but also large devices such as large LED panels can be manufactured with high productivity. In particular, even when manufacturing large devices, by using multiple receptor substrates 1 of the present invention according to the size and performing transfer using a stamper in succession, large devices can be manufactured efficiently without changing the size of the stamper 8 used. In other words, the receptor substrate 1 of the present invention can be easily adapted to changes in product size and is also easily applied to the manufacture of large devices.

[0071] When applying to a large device, multiple stampers may be used at the same time. In this case, the transfer of the transfer object 4 from at least one of the multiple compartments 2 is performed simultaneously in one transfer operation using one stamper for each compartment 2.

[0072] The size of the applicable device is not particularly limited, but for example, 25 mm 2 More than 100m 2 The following circuit boards can be used to manufacture devices:

[0073] In the example shown in Figure 1, red 41, green 42, and blue 43 micro LEDs are arranged in each section 2, but the receptor substrate 1 on which the micro LEDs are arranged may also be one in which one or two of these three color LEDs are arranged in each section 2.

[0074] The shape of the compartment is preferably a rectangle as shown in Figure 1. A rectangle shape can improve productivity and ease of application to large devices. Furthermore, in cases where one device is manufactured in one compartment, the shape of the compartment is not limited to a rectangle, but can be a circle, ellipse, or polygon other than a rectangle, thereby expanding the possibilities for device design.

[0075] The width of the non-placement region 3 is not particularly limited, but is preferably 10 μm or more and 50 mm or less. In another aspect, the width of the non-placement region 3 is preferably 0.025 to 0.1 times the width of each section 2. In the case of a receptor substrate 1 on which red 41, green 42, and blue 43 micro LEDs are arranged, the width is preferably 2 to 100 times the shortest distance between the LEDs.

[0076] Furthermore, it is preferable that no transfer objects are present in the non-placement area, but there may be a small number of transfer objects unintentionally present due to manufacturing precision, or there may be a small number of transfer objects or dummy transfer objects present for the purpose of stress relief, etc. In such cases, the total area of ​​the transfer objects present is preferably 10% or less of the area of ​​the non-placement area, more preferably 1% or less, particularly preferably 0.1% or less, extremely preferably 0.01% or less, and most preferably 0.001% or less.

[0077] The main body of the receptor substrate 1 (receptor precursor substrate 6 described below) is not particularly limited, and any substrate commonly used as a receptor substrate can be used. For example, the receptor precursor substrate can be a glass substrate such as a synthetic quartz glass substrate, and can have an adhesive layer on the surface of the glass substrate. The adhesive strength of this adhesive layer is preferably strong enough to allow the transfer target to be picked up by a stamper in a subsequent process.

[0078] The stamper 8 is not particularly limited, and a stamper commonly used for stampers 8 can be used. It is preferable that the area of ​​the stamper surface where the stamper head is provided, where the stamper head is not provided, is subjected to a release treatment using a release film such as a fluororesin film or a metal film. Here, the metal film can be formed, for example, by vapor deposition, sputtering, plating, or the like. Such a release film can prevent unintended pickup of adjacent compartments even when the stamper touches a part of a compartment adjacent to the compartment to be transferred. Furthermore, a stamper subjected to such a release treatment is not limited to use in picking up individual compartments, but is particularly effective for repair (re-transferring a transfer target to a portion of a substrate on which transfer targets are arranged, from which a defective transfer target has been removed). When a release-treated stamper is used for repair, the stamper head can accommodate repairs of various sizes, such as dimensions equivalent to one to three transfer targets or dimensions equivalent to a compartment. The surface of the stamper head that picks up the transfer target can have an adhesive layer or be made of an adhesive, for example. Furthermore, protrusions can be provided on the surface of the stamper head that picks up the transfer target, and providing protrusions can improve pickup performance. In particular, when picking up a single transfer target, using a stamper head with a single protrusion enables highly accurate transfer. There are no particular restrictions on the size of this protrusion, but the diameter of the circumscribing circle circumscribing the protrusion is preferably 0.5 to 1.5 times, more preferably 0.7 to 1.3 times, and particularly preferably 0.9 to 1.1 times the diameter of the circumscribing circle circumscribing the transfer target. By setting the size within these ranges, highly accurate transfer can be achieved.

[0079] Such stampers can be manufactured by forming a stamper head using silicone resin or the like on a substrate of, for example, a circular, elliptical, rectangular, or polygonal shape other than a rectangle. The size of the stamper can vary depending on the object to be transferred and the process to be applied. However, the diameter (in the case of a circle), the major axis (in the case of an ellipse), and the longest side (in the case of a rectangle or a polygonal shape other than a rectangle) of the substrate are preferably 10 to 200 mm, and the thickness is preferably 0.5 to 3 mm, since this allows for compatibility with many objects to be transferred and many processes. Furthermore, when applied to large quantities of objects to be transferred or large objects to be transferred, the length of the substrate is preferably 200 to 1000 mm, and the thickness is preferably 0.5 to 6 mm. The stamper head is preferably smaller than the substrate, and its length is preferably about 2 to 20 mm shorter than the length of the substrate in terms of stamper head formability and ensuring an effective area. The protrusions are preferably sized so that the diameter of the circumscribed circle is 1 to 150 μm, and the height of the protrusions is preferably 1 to 500 μm. When many protrusions are provided on the stamper head, they are preferably arranged in a matrix. In this case, protrusions do not need to be provided on the outer edge of the stamper head. When protrusions are arranged in a matrix, the pitch between the protrusions is preferably about 5 to 1000 μm.

[0080] The other substrate 9 is not limited to a product substrate such as an LED panel substrate, but may be another receptor precursor substrate for transferring the transfer object 4 to the product substrate.

[0081] The transfer object 4 transferred from the receptor substrate 1 of the present invention can be connected to a circuit board by, for example, flip-chip bonding.

[0082] Next, an example of a method for producing the receptor substrate 1 of the present invention will be described with reference to Figures 4 to 10. The receptor substrate 1 of the present invention can also be produced by methods other than the methods described below.

[0083] First, as shown in Figure 4(R1), a receptor precursor substrate 6 and a donor substrate 5 on which a plurality of red micro LEDs 41 are arranged are prepared. In Figure 4(R1), the red micro LEDs 41 are arranged on the upward surface of the donor substrate 5.

[0084] Next, as shown in Figure 4(R2), the donor substrate 5 is turned over so that the surface on which the red micro LEDs 41 are arranged faces the receptor precursor substrate 6 as shown in Figure 4(R3). In addition, a laser light source 7 is prepared and aligned.

[0085] Next, as shown in Figure 4 (R4), a line laser beam is emitted from the laser light source 7 toward the donor substrate 5. The line laser light of the laser beam flashes. The red micro LEDs 41 hit by the laser beam fly toward the receptor precursor substrate 6 as shown in Figure 4 (R4) and are attached to a predetermined position on the receptor precursor substrate 6. When transferring micro LEDs to the receptor substrate at a pitch different from the pitch of the micro LEDs on the donor substrate, laser lift-off can be performed not while the donor substrate and receptor substrate are in contact with each other, but by, for example, spacing the donor substrate and receptor substrate apart to make them non-contact, and by changing the moving speed of the donor substrate and receptor substrate.

[0086] As shown in Figure 4 (R5), by moving the receptor precursor substrate 6 and the donor substrate 5 while keeping the laser light source 7 fixed, multiple red micro LEDs 41 fly sequentially toward the receptor precursor substrate 6 in time with the flashing of the laser and are attached to the pattern at a predetermined position.

[0087] Subsequently, as shown in Figure 4(R6) and Figure 5(R7) to Figure 5(R12), alignment and laser irradiation are repeated, thereby transferring multiple red micro LEDs 41 to the receptor precursor substrate 6 in a desired pattern.

[0088] Next, as shown in FIG. 6(R13), they are returned to their initial positions (FIG. 4(R3)), and the donor substrate 5 is removed as shown in FIG. 6(R14).

[0089] Next, as shown in Figure 6(G1), a donor substrate 5 on which multiple green micro LEDs 42 are arranged is prepared, and as shown in Figures 6(G2) to (G4) and Figures 7(G5) to (G10), alignment and laser irradiation are repeated in the same manner as in the case of the red micro LEDs 41. This allows multiple green micro LEDs 42 to be transferred to the receptor precursor substrate 6 in a desired pattern.

[0090] Next, as shown in FIG. 8(G11), they are returned to their initial positions (FIG. 6(G2)), and the donor substrate 5 is removed as shown in FIG. 8(G12).

[0091] Next, as shown in Figure 8(B1), a donor substrate 5 on which multiple blue micro LEDs 43 are arranged is prepared, and as shown in Figures 8(B2) to (B4) and 9(B5) to (B10), alignment and laser irradiation are repeated in the same manner as in the case of the red micro LEDs 41. This allows the blue micro LEDs 43 to be transferred to the receptor precursor substrate 6 in a desired pattern.

[0092] Next, as shown in FIG. 10(B11), they are returned to their original positions (FIG. 8(B2)). B As shown in 12), the donor substrate 5 is removed.

[0093] The above alignment is performed so that multiple sections 2 are formed in which a group of micro LEDs 41 to 43 are arranged, non-arrangement areas 3 in which no micro LEDs 41 to 43 are arranged are formed outside the sections 2, and each of the multiple sections 2 is surrounded by the non-arrangement areas 3, and each micro LED 41 to 43 is transferred (selective laser lift-off), thereby manufacturing the receptor substrate 1 of the present invention.

[0094] The donor substrate 5 and light source 7 used are not particularly limited, and those generally used in laser lift-off can be used. Specifically, the donor substrate refers to a substrate (supply substrate) provided with an object to be transferred for laser lift-off. In addition to the above-mentioned receptor substrate, a glass substrate such as a synthetic quartz glass substrate having an ablation layer such as a polyimide layer on its surface can also be used. The presence of this ablation layer facilitates laser lift-off.

[0095] Furthermore, from the viewpoint of the supply substrate, instead of a donor substrate, a receptor substrate may be obtained by transferring an object to be transferred from a wafer on which micro LEDs or semiconductor chips are formed to a receptor precursor substrate by laser lift-off.

[0096] The present invention is not limited to the above-described embodiments, which are merely examples, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and that provides similar effects is included within the technical scope of the present invention.

Claims

1. A receptor substrate on which a plurality of transfer objects to be transferred to another substrate using a stamper are arranged, a plurality of compartments in which a group of the transfer objects to be simultaneously transferred in a single transfer operation by the stamper is arranged; a non-placement area in which the transfer object is not placed outside the compartment; Each of the plurality of sections is surrounded by the non-placement area, A receptor substrate in which the width in one of the plurality of compartments of the non-placement area sandwiched between two adjacent compartments in the adjacent direction is greater than the distance between the adjacent objects to be transferred in the adjacent direction within each of the two adjacent compartments.

2. The receptor substrate according to claim 1 , wherein the object to be transferred is a micro LED or a semiconductor chip.

3. A receptor substrate as described in claim 1, wherein the object to be transferred is placed on the adhesive layer of a receptor precursor substrate having an adhesive layer on its surface.

4. 2. The receptor substrate according to claim 1, wherein the width of the non-positioning area is 10 [mu]m or more and 50 mm or less.

5. 2. The receptor substrate according to claim 1, wherein the width of the non-positioning region is 0.025 to 0.1 times the width of each of the plurality of sections.

6. the transfer object is the micro LED, The receptor substrate according to claim 2 , wherein the width of the non-placement area is between 2 and 100 times the shortest distance between the micro-LEDs.

7. A method for manufacturing a receptor substrate on which a plurality of transfer objects to be transferred to another substrate are arranged using a stamper, comprising: preparing a supply substrate having the transfer object and a receptor precursor substrate; transferring the object from the supply substrate to the receptor precursor substrate by a laser to obtain a receptor substrate; Including, A method for manufacturing a receptor substrate, in which, in the process of obtaining the receptor substrate, a plurality of sections are formed on the receptor precursor substrate in which a group of transfer objects to be transferred simultaneously in a single transfer operation using the stamper is placed, non-placement areas in which the transfer objects are not placed are formed outside the sections, each of the plurality of sections is surrounded by the non-placement area, and the width in the adjacent direction of the non-placement area sandwiched between two adjacent sections in one adjacent direction among the plurality of sections is greater than the distance between the transfer objects adjacent in the adjacent direction within each of the two adjacent sections.

8. 8. The method for producing a receptor substrate according to claim 7, wherein in the step of obtaining the receptor substrate, the width of the non-disposition region is set to 10 [mu]m or more and 50 mm or less.

9. 9. The method for producing a receptor substrate according to claim 7, wherein in the step of obtaining the receptor substrate, the width of the non-disposition region is set to be 0.025 to 0.1 times the width of each of the plurality of sections.

10. The transfer object is a micro LED, 9. The method for producing a receptor substrate according to claim 7, wherein in the step of obtaining the receptor substrate, the width of the non-arrangement region is set to be 2 to 100 times the shortest distance of the micro-LEDs.

11. A method for producing a receptor substrate according to claim 7 or 8, wherein the receptor precursor substrate has an adhesive layer on its surface.

12. A method for manufacturing a receptor substrate as described in claim 7 or 8, wherein the supply substrate carrying the transfer object is a substrate having an adhesive layer on its surface and carrying the transfer object on the adhesive layer, or an epitaxial substrate on which the transfer object is formed.

13. A method for manufacturing a receptor substrate as described in claim 7 or 8, wherein the transfer is performed in a state where the object to be transferred on the supply substrate and the receptor precursor substrate are not in contact with each other.

14. A transfer method for transferring a plurality of transfer objects from the receptor substrate according to any one of claims 1 to 6 to another substrate using a stamper, comprising: A transfer method including a stamping step of simultaneously transferring the group of transfer objects from at least one of the plurality of sections of the receptor substrate to the other substrate, section by section, in a single transfer operation using the stamper.

15. A method for manufacturing an LED panel, comprising: A step of preparing a receptor substrate according to any one of claims 1 to 6, wherein the transfer object is a micro LED; providing an LED panel substrate; a step of simultaneously transferring the group of micro LEDs, which are the transfer objects, from at least one of the plurality of sections of the receptor substrate to the LED panel substrate by section using a stamper in a single transfer operation; A method for manufacturing an LED panel comprising:

16. A method for manufacturing a device, comprising: A step of preparing a receptor substrate according to any one of claims 1 to 6; providing a circuit board; a step of simultaneously transferring the group of transfer objects from at least one of the plurality of sections of the receptor substrate to the circuit board by a single transfer operation using a stamper for each section; A method for manufacturing a device comprising:

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