Plated molded body of thermoplastic resin composition
A plated molded article with Fe-Si-Al alloy powder and a conductive metal coating addresses the challenge of shielding low-frequency electromagnetic waves, providing effective and lightweight electromagnetic wave shielding for electronic devices and electric vehicles.
Patent Information
- Application Number
- JP2022547008
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-09-07
- Filing Date
- 2021-09-07
- Publication Date
- 2025-12-24
- Estimated Expiration
- 2041-09-07
AI Technical Summary
Existing soft magnetic materials for shielding low-frequency electromagnetic waves below 1 MHz are excessively thick and heavy, making them unsuitable for lighter, thinner, and smaller electronic devices and electric vehicles.
A plated molded article composed of a thermoplastic resin containing Fe-Si-Al alloy powder and a conductive metal coating, produced through melt-kneading and plating processes, to achieve effective electromagnetic wave shielding.
The plated molded article exhibits excellent shielding properties against low-frequency electromagnetic waves, with attenuation rates of 10 dB or more at 0.3 MHz and 15 dB or more at 1 MHz, while maintaining a thin and lightweight structure.
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Abstract
Description
[Technical Field]
[0001] The present invention relates to a plated molded article made of a thermoplastic resin composition containing a soft magnetic powder that has low-frequency electromagnetic wave shielding properties, capable of shielding or absorbing electromagnetic waves with a frequency of 1 MHz or less (hereinafter often referred to as low-frequency electromagnetic waves) generated from the inside of various electronic devices, particularly from power conversion devices and data processing devices mounted on electric vehicles, thereby suppressing electromagnetic wave noise. [Background technology]
[0002] Unwanted electromagnetic waves generated by various electronic devices can affect other electronic devices and cause them to malfunction. Electromagnetic wave shielding materials are used to suppress the harmful effects of such unwanted electromagnetic waves.
[0003] Soft magnetic materials have been proposed as such electromagnetic wave shielding materials, and among such soft magnetic materials, permalloys are generally known to exhibit excellent shielding properties against electromagnetic waves with frequencies from several hundred MHz to several GHz.
[0004] One example of a soft magnetic material is an Fe-Si-Al alloy, which was discovered in 1937. Fe-Si alloys and Fe-Si-Cr alloys are also well-known soft magnetic materials. There are known examples in which the shielding properties of these soft magnetic materials have been evaluated against electromagnetic waves with frequencies of 300 MHz to 3 GHz.
[0005] On the other hand, there have been very few studies on shielding materials for low-frequency electromagnetic waves with frequencies of 1 MHz or less. For example, Patent Document 1 proposes a laminate in which a magnetic layer is formed between two or more carbon fiber reinforced resin layers using a magnetic shielding paint in which soft magnetic powder is dispersed in an organic solvent, and Patent Document 2 proposes an electromagnetic field shielding sheet in which soft magnetic powder is impregnated and fixed by applying soft magnetic paint to a mesh structure and drying it.
[0006] Furthermore, molded articles having a plated layer on the surface of a resin molded article have also been proposed. Patent Document 3 describes a molded article made of a resin composition that maintains plateability while exhibiting excellent mechanical properties and flame retardancy, while Patent Document 4 describes a plated molded article characterized by having a plated layer on a molded article made of a thermoplastic elastomer composition. [Prior art documents] [Patent documents]
[0007] [Patent Document 1] Patent Publication No. 2017-126644 [Patent Document 2] Patent Publication No. 2018-85391 [Patent Document 3] International Publication WO2014 / 115475 [Patent Document 4] Patent Publication No. 11-29663 Summary of the Invention [Problem to be solved by the invention]
[0008] However, until now, in order to effectively shield low-frequency electromagnetic waves below 1 MHz, existing soft magnetic materials have been made thicker, laminated, or enclosed in a case. However, these methods have had the problem of making the shielding section excessively heavy. In order to achieve lighter, thinner, shorter, and smaller electronic devices and lighter electric vehicles, there has been a strong demand for molded products that are effective at shielding low-frequency electromagnetic waves and that can be made thin and have complex part shapes.
[0009] That is, the object is to provide a molded article having excellent shielding properties (shielding properties) against low-frequency electromagnetic waves of 1 MHz or less. [Means for solving the problem]
[0010] According to the present invention, there is provided a plated molded article having a resin layer made of a thermoplastic resin composition containing soft magnetic powder including an Fe—Si—Al alloy, and a coating layer made of a conductive metal.
[0011] A resin composition having electromagnetic wave shielding properties in the low frequency range, in which the soft magnetic powder according to the present invention is blended with a thermoplastic resin, can be obtained by melt-kneading the thermoplastic resin at an appropriate temperature range for heating and melting the resin using a known internal mixer or extruder, and the melt-kneaded mixture can be molded into a sheet, hose, or other shape using an appropriate die or mold to obtain a molded product. Furthermore, a plated molded product can be obtained by forming a plating layer on the surface of the molded product using a known plating method.
[0012] Various embodiments of the present invention will be described below as examples, and the embodiments shown below can be combined with each other. Preferably, the conductive metal is copper. Preferably, the plated molded body has a plated molded body sheet with a thickness of 1.0 mm, and the attenuation rate of the magnetic field component at a frequency of 0.3 MHz measured by the KEC method is 10 dB or more, and the attenuation rate of the magnetic field component at 1 MHz is 15 dB or more.
[0013] The thermoplastic resin composition can be subjected to a heat-melt molding process to provide a molded article. By subjecting this molded body to a plating treatment, a plated molded body having a coating layer (plated layer) formed on the surface is provided. [Effects of the Invention]
[0014] According to the present invention, it is possible to provide a plated molded article of a thermoplastic resin composition having excellent electromagnetic wave shielding properties against electromagnetic waves in the low frequency range. [Brief explanation of the drawings]
[0015] [Figure 1] FIG. 2 is a schematic cross-sectional view of a case molded body molded using a case mold. [Figure 2] FIG. 2 is a schematic top view of a case molded body molded using a case mold. DETAILED DESCRIPTION OF THE INVENTION
[0016] Hereinafter, embodiments for carrying out the present invention will be described in detail. Note that the embodiments described below are examples of typical embodiments of the present invention, and the scope of the invention should not be construed as being narrow.
[0017] The plated molded article of the present invention has a resin layer made of a thermoplastic resin composition containing soft magnetic powder mainly composed of Fe-Si-Al alloy powder, and a coating layer made of a conductive metal. The coating layer is a layer of conductive metal formed on the resin layer directly or via another layer. In one example, a molded article (resin layer) obtained by heat-melting and molding a thermoplastic resin composition containing soft magnetic powder is plated with a conductive metal (coating layer). Examples of molded articles include sheets, cases, and hoses.
[0018] In the present invention, a double-sided plated sheet obtained by forming a coating layer after sheet molding, or a plated case obtained by plating both sides of the case molded body shown in Figures 1 and 2, is cut out from a square sheet portion (hereinafter referred to as the plated sheet), and the resulting plated sheet with a thickness of 1.0 mm can be used for KEC measurement.
[0019] In the plated molded product of the present invention, the attenuation rate of the magnetic field component at frequencies of 0.3 MHz and 1 MHz (measured by the KEC method using a 1.0 mm thick sheet of the plated molded product for electromagnetic waves of frequencies of 0.3 MHz and 1 MHz) is preferably 10 dB or more at 0.3 MHz and 15 dB or more at 1 MHz. The plated molded product of the present invention has excellent shielding properties against electromagnetic waves in the low frequency range of 1 MHz or less.
[0020] The attenuation rate of the magnetic field component at a frequency of 0.3 MHz measured by the KEC method on a 1.0 mm thick sheet of the plated molded body is preferably 10 dB or more, more preferably 15 dB or more, and even more preferably 20 dB or more.
[0021] The attenuation rate of the magnetic field component at a frequency of 1 MHz measured by the KEC method on a 1.0 mm thick sheet of the plated molded body is preferably 15 dB or more, more preferably 20 dB or more, and even more preferably 25 dB or more.
[0022] Furthermore, it is preferable that the plated molded body has shielding properties against electromagnetic waves of 3 MHz and 10 MHz in addition to shielding properties against electromagnetic waves of 1 MHz or less. The attenuation rate of the magnetic field component at a frequency of 3 MHz, measured by the KEC method on a 1.0 mm thick sheet of the plated molded body, is preferably 20 dB or more. The attenuation rate of the magnetic field component at a frequency of 10 MHz, measured by the KEC method on a 1.0 mm thick sheet of the plated molded body, is preferably 30 dB or more.
[0023] The soft magnetic powder is a powder containing an Fe—Si—Al alloy having soft magnetic properties.
[0024] The soft magnetic powder preferably contains Fe-Si-Al alloy powder as its main component. The soft magnetic powder may contain Fe-Si alloy powder, Fe-Si-Cr alloy powder, or other soft magnetic powders, as long as the effects of the present invention are not impaired. When Fe-Si-Al alloy powder is the main component, preferably 50 mass% or more of the soft magnetic powder is Fe-Si-Al alloy powder, more preferably the soft magnetic powder consists essentially of Fe-Si-Al alloy powder alone, and particularly preferably the soft magnetic powder is Fe-Si-Al alloy powder.
[0025] The Fe-Si-Al alloy is an alloy containing Fe, Si, and Al. The composition of the Fe-Si-Al alloy is preferably 3 to 12 atomic % of Si, 4 to 12 atomic % of Al, and the remainder of Fe. An example of a typical composition of the Fe-Si-Al alloy is Fe 85 Si 10 Al5 and Fe 84.7 Si 9.5 Al 5.8and the like. The Si composition in the Fe-Si-Al alloy is, for example, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12 atomic %, and may be within a range between any two of the numerical values exemplified here. The Al composition in the Fe-Si-Al alloy is, for example, 4, 5, 6, 7, 8, 9, 10, 11, or 12 atomic %, and may be within a range between any two of the numerical values exemplified here. In this specification, the tilde symbol "~" is used to indicate a numerical range that includes the numerical values written before and after it. Specifically, the expression "X~Y" (X and Y are both numerical values) indicates "greater than or equal to X and less than or equal to Y."
[0026] The shape of the soft magnetic powder may be spherical, flat, or irregular, and similar shielding effects will be exhibited. This soft magnetic powder has a maximum diameter of 500 μm, preferably 100 μm, and can be obtained by a known sieving procedure. Note that the maximum diameter of the powder refers to the maximum diameter of each particle in the case of irregular or flat powder. If the maximum diameter of the powder exceeds 500 μm, there is a risk that the electromagnetic wave shielding properties will become inhomogeneous within the molded product or that defects will occur, which is undesirable.
[0027] The thermoplastic resin composition preferably contains 20 to 80 volume % of soft magnetic powder, more preferably 30 to 70 volume %. If the soft magnetic powder content is less than 20 volume %, satisfactory electromagnetic shielding properties are not achieved, while if it exceeds 80 volume %, the fluidity during kneading or molding is insufficient, making it impossible to mold into the desired shape. Furthermore, the kneaded product becomes brittle, which is undesirable. Specific examples of the soft magnetic powder content in the thermoplastic resin composition are 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, and 80 volume %, and it may be within a range between any two of the values exemplified here.
[0028] The thermoplastic resin contained in the thermoplastic resin composition is not particularly limited as long as it is a resin that can be electrolessly plated, and may be at least one selected from the group consisting of polyethylene (PE), polypropylene (PP), polystyrene (PS), ABS resin, polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), ethylene-vinyl acetate resin (EVA), polyurethane (PU), acrylic resin (PMMA), polycarbonate (PC), polyamide (PA), polyimide (PI), polyphenylene sulfide (PPS), polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), polybutylene terephthalate (PBT), nylon, polyphenylene ether (PPE), liquid crystal polymer (LCP), and modified products thereof. Polymer alloys made of multiple types of resins may also be used. ABS resin, polyvinyl chloride, acrylic resin, ethylene-vinyl acetate resin, etc. may be preferred in terms of ease of dispersing the soft magnetic powder and achieving uniform electromagnetic wave shielding properties.
[0029] Furthermore, molding processing aids and various compounding agents other than those mentioned above can be added within a range that does not significantly impair the low-frequency electromagnetic wave shielding properties of the present invention. When a processing aid is added, the processing aid is preferably contained in an amount of 0.1 to 1 mass %, more preferably 0.3 to 0.5 mass %, based on the total amount of the thermoplastic resin and the soft magnetic powder. Examples of processing aids include polyethylene glycol fatty acid esters.
[0030] The kneading method can employ a known melt kneader such as an internal mixer or extruder. Known optimum conditions for the kneading temperature and kneading time that enable kneading and molding of each thermoplastic resin are selected. To improve the dispersibility of the soft magnetic powder, high-speed rotation and high shear conditions are preferred, as long as the thermoplastic resin does not clearly deteriorate or the soft magnetic powder does not break down. The kneading order of the soft magnetic powder may be added all at once with the thermoplastic resin, or it may be added after or during the heat-melting of the thermoplastic resin (post-addition), and is selected appropriately from the viewpoints of improving dispersibility and suppressing resin deterioration.
[0031] The thermoplastic resin composition (molding raw material) containing the obtained soft magnetic powder is molded into the desired shape using a heat press or melt extruder with appropriate dies or molds. Shapes include, for example, sheets, hoses, cases, etc., and various shapes can be molded by selecting the appropriate mold. It is also possible to produce laminated sheets using multiple extruders, and multi-layered laminated sheets using adhesives, etc.
[0032] The molded article may be a molded member used to shield low-frequency electromagnetic waves from various devices, and as an example, may be processed into a sheet as described above. Note that by forming the sheet into multiple layers, the shielding effect may be amplified even if the sheet has the same thickness. Even in one embodiment of the present invention, a high shielding effect can be expected when the sheet is made of multiple layers. Meanwhile, in the present invention, a sufficient shielding effect can be obtained even in an embodiment in which the sheet is formed of a single layer.
[0033] Next, the plating method for the molded article made of the thermoplastic resin composition is not particularly limited, but electroless plating is preferred. Copper is preferred as the metal component of the plating layer from the viewpoints of cost, stability, and conductivity. The thickness of the copper plating layer is 0.05 to 20 μm, preferably 0.1 to 10 μm, and more preferably 0.1 to 5 μm. In the electroless plating method, the alloy powder is washed to activate the surface, added to an aqueous solution containing a complexing agent and a reducing agent, and copper salt is added dropwise thereto. Examples of complexing agents include aqueous ammonia, aminocarboxylic acid salts such as ethylenediaminetetraacetic acid (EDTA), diethylenetriaminepentaacetic acid (DTPA), triethylenetetraminehexaacetic acid (TTHA), hydroxyethylethylenediaminetriacetic acid (HEDTA), nitrilotriacetic acid (NTA), and iminodiacetic acid (IDA); polyamines such as ethylenediamine, tetramethylenediamine, hexamethylenediamine, diethylenetriamine, tetraethylenepentamine, and pentaethylenehexamine; aminoalcohols such as monoethanolamine, diethanolamine, and triethanolamine; oxycarboxylic acid salts such as citric acid, tartaric acid, lactic acid, and malic acid; thioglycolic acid; and glycine. The reducing agent includes boron hydride compounds, amine boranes, hypophosphorous acids, phosphorous acids, aldehydes, ascorbic acids, hydrazines, polyhydric phenols, polyhydric naphthols, phenolsulfonic acids, naphtholsulfonic acids, and the like. Soluble copper salts include copper sulfate, copper oxide, copper chloride, copper pyrophosphate, copper carbonate, copper carboxylates such as copper acetate, copper oxalate, and copper citrate, or copper organic sulfonates such as copper methanesulfonate and copper hydroxyethanesulfonate.
[0034] In the present invention, the above-described plating layer is formed on the surface layer of the molded article of the thermoplastic resin composition as the base, and from the viewpoint of exhibiting stable electromagnetic wave shielding properties over the entire surface of the molded article, it is preferable to form the plating layer uniformly. If desired, an electroless plating layer or an electrolytic plating layer can be superimposed on this plating layer.
[0035] One method for evaluating the shielding (blocking) properties of electromagnetic noise is the KEC method, developed by the Kansai Electronics Industry Development Center (KEC), a general incorporated foundation. It is introduced, for example, in the Journal of Textile Product Consumption Science (Senshōshi) Vol. 40, No. 2 (1999) and at https: / / www.kec.jp / testing-division / kec-method / . The KEC method measures the shielding effectiveness of electromagnetic waves generated in the near field by separating them into electric and magnetic components. Electromagnetic waves transmitted from a transmitting antenna (transmitting fixture) are received by a receiving antenna (receiving fixture) via a sheet-like measurement sample. The attenuated electromagnetic waves are measured and quantified as an attenuation rate (measurement unit: dB). In this invention, the attenuation rate of the magnetic field component was measured at room temperature using a fixed-thickness sample (1.0 mm thick after double-sided plating) in the frequency range of 0.1 MHz to 1000 MHz. The electromagnetic wave shielding properties (magnetic field components) at frequencies below 1 MHz, which is important in the present invention, were judged by comparing the measured values of attenuation rates at 0.3 MHz and 1 MHz. [Example]
[0036] The effects of the present invention will be described below with reference to examples and comparative examples of the present invention.
[0037] [Examples 1 to 3] Resin compositions containing Fe—Si—Al alloy powder were prepared according to the formulations shown in Table 1. The alloy powder used was Fe—Si—Al alloy powder with an average particle size of 50 μm (FME3D-AH, manufactured by Sanyo Special Steel Co., Ltd., specific gravity 6.9, containing 9.6 atomic % Si, 5.9 atomic % Al, and the remainder being Fe). The thermoplastic resin used was ABS resin (ABS resin ME, manufactured by Denka Co., Ltd., specific gravity 1.04). Using a Toyo Seiki Labo Plastomill (internal volume 60 mL) as the kneading device, the ABS resin alone was pre-kneaded at 210°C for 3 minutes at 20 rpm to obtain the composition shown in Table 1. The alloy powder according to the present invention was then added and kneaded at 50 rpm at 210°C for 10 minutes to obtain an alloy powder-containing resin composition (hereinafter simply referred to as the composition). This composition was melt-molded using a heat press set at 210°C and a 1 mm thick sheet mold to produce a square molded sheet with a thickness of 1.0 mm and dimensions of 120 mm x 120 mm.
[0038] Copper plating of a 1.0 mm thick molded sheet was carried out using the following procedure. The molded sheet prepared using the above procedure was immersed in a 5 mol / L potassium hydroxide aqueous solution at 50°C for 5 minutes and then thoroughly rinsed with pure water. Separately, a copper ammine complex solution used for electroless copper plating was prepared using the following procedure. Copper sulfate pentahydrate with a concentration of 0.2 mol / L was weighed and dissolved in 300 mL of pure water. 400 mL of 25% ammonia water was then added, and the solution was then diluted to 1 L with pure water to prepare a copper ammine complex solution containing 10% ammonia water and 0.2 mol / L copper sulfate. This process was repeated three times to prepare a total of 3 L of copper amine complex solution. The square sheet prepared using the above procedure was immersed in this copper ammine complex solution for 5 minutes to allow copper ions to adsorb, and then rinsed with pure water. The molded sheet was then immersed in a 0.05 mol / L aqueous solution of sodium borohydride at 25°C for 5 minutes to reduce the copper ions adsorbed on the surface of the molded sheet made of the alloy powder-containing resin composition, depositing a metallic copper film on both sides of the sheet. The molded sheet with the copper film formed thereon was then heat-treated at 110°C for 2 hours in a nitrogen gas atmosphere, finally obtaining a plated molded product according to the present invention. Cross-sectional SEM observation of the molded sheet revealed that the copper plating thickness was 0.40 μm on each side.
[0039] [Examples 4 to 6] In Examples 1 to 3, the immersion time of the 1.0 mm thick square sheet in the copper aluminide complex solution was set to 10 minutes, and the copper plating thickness was 0.57 μm in all cases.
[0040] [Comparative Examples 1 to 3] In the above-described Examples 1 to 3, a square molded sheet having a thickness of 1.0 mm and dimensions of 120 mm×120 mm before copper plating was used.
[0041] The electromagnetic wave shielding properties (magnetic field components) of the molded sheets of the examples and comparative examples were measured at the Kansai Electronics Industry Promotion Center (KEC Kansai Electronics Industry Promotion Center, Seika-cho, Soraku-gun, Kyoto Prefecture). The molded sheets were sandwiched between a pair of magnetic field shielding effect evaluation cells (Fig. 6) described in "Science of Textile Products Consumption (Senshōshi) Vol. 40, No. 2 (1999)" and the measurements were taken using the apparatus shown in Fig. 7. The applied frequency in the measurements was continuously varied from 0.1 MHz to 1000 MHz. The attenuation rates (relative values) calculated from the transmit / receive intensity values at 0.3 MHz and 1 MHz were used as representative values of the magnetic field shielding effect in this invention. The results are shown in Tables 1 and 2. The copper-plated molded products of the soft magnetic powder-containing resin composition of this invention exhibited an attenuation rate of 10 dB or more at 0.3 MHz and an attenuation rate of 15 dB or more at 1 MHz, demonstrating excellent electromagnetic wave (magnetic field component) shielding properties. Tables 1 and 2 also show the attenuation rates at 3 MHz and 10 MHz. The plated molded body of the present invention has an improved attenuation rate even in the frequency range above 1 MHz, and has excellent shielding properties. Compared with molded bodies that are not copper-plated (Comparative Examples 1 to 3), copper plating improves the electromagnetic wave shielding properties (magnetic field component) by 3 dB or more at 0.3 MHz and 10 dB or more at 1 MHz.
[0042] [Table 1]
[0043] [Table 2]
[0044] [Example 7, Comparative Example 4] Using a single-screw extruder with a 30 mm barrel diameter and L / D=16 and equipped with a kneading function and a 200 mm wide T-die with a 1 mm slit at the tip, the barrel was set at a temperature of 170-210°C and a rotation speed of 35 rpm. A predetermined amount of ABS resin (ME manufactured by Denka Co., Ltd.) and a processing aid (polyethylene glycol fatty acid ester (Emanon 1112 manufactured by Kao Corporation)) were added, along with a 53 μm average particle size Fe-Si-Al alloy powder (manufactured by Sanyo Special Steel Co., Ltd.) as the soft magnetic powder. The processing aid was added at 0.3 wt% based on the total weight of the EVA resin and Fe-Si-Al alloy powder. Next, this sheet-like molded product was cut into a 120 mm x 120 mm piece, and using a pre-prepared heat press and a mold for molding a shielding case heated to 210°C, the cut-out sheet-like molded product was inserted between the upper and lower surfaces of the mold. After leaving it to stand for 3 minutes, the lower surface was gradually raised to apply pressure, and finally, the mold was held at 20 MPa for 10 minutes to form the shielding case. Next, this shielding case mold was removed and transferred to a separately prepared water-cooled cooling press, where it was left to cool for 10 minutes. After cooling was complete, the shielding case molded product (Figures 1 and 2) was removed from the mold. The thickness t1 in Figure 1 is 1 mm. The height of the case molded product is 10 mm, as shown in Figure 1.
[0045] Using this molded article, copper plating was performed on the entire surface of the molded article under the same conditions as in Examples 4 to 6, thereby obtaining a plated molded article according to the present invention. A flat portion (100 mm x 100 mm) of this plated molded article was cut out and subjected to measurement of electromagnetic wave shielding property using the same method as in Example 1. The measurement results of the magnetic field components are shown in Example 7 in Table 1. A flat portion (100 mm x 100 mm) was cut out from the shielding case molded article before copper plating, and the results (magnetic field components) of measurement of the electromagnetic wave shielding property are shown in Comparative Example 4 in Table 2. The plated molded article according to the present invention exhibits an attenuation rate of 10 dB or more at a frequency of 0.3 MHz and an attenuation rate of 15 dB or more at 1 MHz, clearly demonstrating excellent shielding properties against electromagnetic waves in the low frequency range.
[0046] [Comparative Examples 5 to 9] Comparative Example 5 is a case where the Fe-Si-Al alloy powder of the present invention is not blended and no copper plating is applied. The attenuation rate is approximately 0.1 to 0.2 dB, showing almost no electromagnetic wave shielding properties. Comparative Examples 6 and 7 are cases where copper plating is applied to thermoplastic resin sheets that do not blend the Fe-Si-Al alloy powder of the present invention. Although copper plating improves the electromagnetic wave shielding rate by approximately 2 to 3 dB, no significant improvement in shielding properties is observed. Comparative Example 8 is a case where 10 volume % Fe-Si-Al alloy powder is blended but copper plating is not applied. The attenuation rate at 0.3 MHz and 1 MHz is approximately 5 dB. Comparative Example 9 is a case where 90 volume % Fe-Si-Al alloy powder is blended. The molded product was very brittle and could not maintain its sheet state, making KEC measurement impossible. These results clearly demonstrate that plated molded products made from thermoplastic compositions blended with the Fe-Si-Al alloy powder of the present invention have excellent electromagnetic wave shielding properties in the low frequency range below 1 MHz. [Industrial Applicability]
[0047] The plated molded article of the present invention, which is obtained by plating a conductive metal onto a molded article of a thermoplastic resin composition containing soft magnetic powder, has excellent shielding properties against electromagnetic noise in the low-frequency range of 1 MHz or less, and is therefore extremely useful industrially. [Explanation of symbols]
[0048] P: Planar section
Claims
1. A plated molded article having a resin layer made of a thermoplastic resin composition containing soft magnetic powder including an Fe—Si—Al alloy, and a coating layer made of a conductive metal, the conductive metal is copper; the coating layer is a layer having a thickness of 0.4 to 5 μm, A plated molded body characterized in that a plated molded body sheet having a thickness of 1.0008 to 1.01 mm has an attenuation rate of magnetic field components of 10 dB or more at a frequency of 0.3 MHz measured by the KEC method, and an attenuation rate of magnetic field components of 15 dB or more at a frequency of 1 MHz.
2. The plated molded article according to claim 1 , wherein the resin layer has the coating layer on both sides thereof.
Citation Information
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