Inertial sensor devices and sensor modules

Abstract

To provide an inertia sensor device that reduces the burden of adjustment on a host side.SOLUTION: An inertia sensor device 100 includes: a first interface 110; a second sensor 102; a second interface 120; a host interface 140; and a processing circuit 130. The first interface 110 is an interface with a first sensor 1 for detecting a first physical amount P1 at a first detection axis, a second physical amount P2 at a second detection axis; and a third physical amount P3 at a third detection axis. The second sensor 102 detects the physical amount P3 at the third detection axis as an accurate third physical amount HP3 more accurately than the first sensor does. The processing circuit 130 outputs the first physical amount P1 and the second physical amount P2 to a host 200 by the host interface 140, and outputs the accurate third physical amount HP3 instead of the third physical amount P3 to the host 200 by the host interface 140.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an inertial sensor device, a sensor module, and the like. [Background technology]

[0002] Patent Document 1 describes a three-axis angular velocity sensor and a three-axis acceleration sensor, each having a movable portion made of silicon, formed on the substrate of a single host device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-031358 Summary of the Invention [Problem to be solved by the invention]

[0004] If detection data with higher accuracy than that provided by these sensors is required, it is necessary to add a separate sensor. However, if a separate sensor is connected to the host device, there is a problem that the interface specifications of the host device must be changed, and adjustments to be made on the host device side become more complicated as a result of adding a sensor. [Means for solving the problem]

[0005] One aspect of the present disclosure relates to an inertial sensor device including: a first interface that is an interface with a first sensor that detects a first physical quantity on a first detection axis, a second physical quantity on a second detection axis, and a third physical quantity on a third detection axis; a second sensor that detects the physical quantity on the third detection axis as a high-precision third physical quantity with higher accuracy than the first sensor; a second interface that is an interface with the second sensor; a host interface that is an interface with a host; and a processing circuit, wherein the processing circuit outputs the first physical quantity and the second physical quantity to the host via the host interface and outputs the high-precision third physical quantity to the host via the host interface in place of the third physical quantity.

[0006] Another aspect of the present disclosure relates to a sensor module including the above-described inertial sensor device and the first sensor. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a block diagram showing an example of the configuration of an embodiment of the present invention. [Figure 2] FIG. 2 is a diagram illustrating an example of a communication relationship according to the present embodiment. [Figure 3] FIG. 10 is a diagram illustrating another configuration example of the present embodiment. [Figure 4] FIG. 10 is a diagram illustrating another example of a communication relationship according to the present embodiment. [Figure 5] FIG. 3 is a diagram illustrating a first detection axis, a second detection axis, and a third detection axis. [Figure 6] 10A and 10B are diagrams illustrating the influence of a measurement error of a third physical quantity. [Figure 7] 3A and 3B are diagrams illustrating an example of data communication according to the embodiment. [Figure 8] FIG. 10 is a diagram illustrating another example of data communication according to the embodiment. [Figure 9] 4 is a time chart illustrating the method of the present embodiment. [Figure 10] 10 is a time chart illustrating another method of the present embodiment. [Figure 11]10 is a time chart illustrating another method of the present embodiment. [Figure 12] FIG. 10 is a block diagram showing a modified example of the present embodiment. [Figure 13] FIG. 10 is a diagram illustrating an example of a communication relationship according to a modified example of the present embodiment. [Figure 14] 10 is a time chart illustrating a method according to a modified example of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Preferred embodiments of the present disclosure will be described in detail below. Note that the embodiments described below do not unduly limit the scope of the claims, and not all of the configurations described in the embodiments are necessarily essential components.

[0009] FIG. 1 is a block diagram showing an example of the configuration of an inertial sensor device 100 of this embodiment. The inertial sensor device 100 of this embodiment includes a second sensor 102, a first interface 110 that is an interface with the first sensor 1, a second interface 120, a processing circuit 130, and a host interface 140 that is an interface with a host 200. The inertial sensor device 100 of this embodiment constitutes a predetermined semiconductor package. The predetermined semiconductor package is, for example, an insertion-mount type DIP (Dual In-line Package) or a surface-mount type QFP (Quad Flat Package). In the following description, the semiconductor package may be simply referred to as a package.

[0010] The first sensor 1 detects a physical quantity in, for example, the X-axis direction and outputs digital X-axis physical quantity data. The X-axis physical quantity data is digital data representing the physical quantity in the X-axis direction. Note that in the following description, digital data may be simply referred to as data. Furthermore, the first sensor 1 detects a physical quantity in, for example, the Y-axis direction and outputs digital Y-axis physical quantity data, and detects a physical quantity in the Z-axis direction and outputs digital Z-axis physical quantity data. Similarly, the Y-axis physical quantity data is digital data representing the physical quantity in the Y-axis direction, and the Z-axis physical quantity data is digital data representing the physical quantity in the Z-axis direction. Here, the X-axis and Y-axis are axes perpendicular to each other and perpendicular to the Z-axis. In other words, the first sensor 1 is a three-axis physical quantity sensor. The physical quantity may be, for example, acceleration, but it may also be angular velocity or another physical quantity. For example, if the physical quantity is acceleration, the first sensor 1 is a three-axis acceleration sensor, and can be realized, for example, by a capacitive Si-MEMS sensor device that can detect acceleration in the X-axis, Y-axis, and Z-axis directions. However, the first sensor 1 is not limited to this, and may be realized by a frequency change type quartz acceleration sensor, a piezoresistive acceleration sensor, or a thermal detection acceleration sensor. Furthermore, if the physical quantity is angular velocity, for example, the first sensor 1 is an angular velocity sensor, and can be realized by a Si-MEMS sensor device or the like. Incidentally, angular velocity sensors are also called gyro sensors.

[0011] Although not shown in FIG. 1, the first sensor 1 includes a sensor element for detecting the physical quantity of each axis, an analog circuit having an amplifier circuit or the like for amplifying the detection signal from the sensor element, and an A / D conversion circuit for converting the analog signal from the analog circuit into digital data. Similarly, in FIGS. 2, 9, and 10 described below, the sensor element, analog circuit, A / D conversion circuit, and the like are not shown for the first sensor 1. The output data of the A / D conversion circuit or digital data obtained by performing temperature correction or other correction processing on the output data is output to the first interface 110 as X-axis physical quantity data. A single sensor element may be capable of detecting physical quantities in all of the X-axis, Y-axis, and Z-axis directions, or there may be separate sensor elements for detecting the physical quantity in the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0012] In the following description, the detection axis parallel to the X-axis may be referred to as the first detection axis, the detection axis parallel to the Y-axis as the second detection axis, and the detection axis parallel to the Z-axis as the third detection axis. Furthermore, the X-axis physical quantity data output by the first sensor 1 may be referred to as the first physical quantity P1, the Y-axis physical quantity data as the second physical quantity P2, and the Z-axis physical quantity data as the third physical quantity P3. Similarly, in the examples described below, the X-axis angular velocity data may be referred to as the first angular velocity G1, the Y-axis angular velocity data as the second angular velocity G2, and the Z-axis angular velocity data as the third angular velocity G3. Similarly, the X-axis acceleration data may be referred to as the first acceleration A1, the Y-axis acceleration data as the second acceleration A2, and the Z-axis acceleration data as the third acceleration A3. From the above, the first sensor 1 detects the first physical quantity P1 on the first detection axis, the second physical quantity P2 on the second detection axis, and the third physical quantity P3 on the third detection axis.

[0013] The first interface 110 is a circuit that performs interface processing related to sending and receiving digital data to and from the first sensor 1 in accordance with a predetermined communication method. The predetermined communication method is, for example, a predetermined serial communication method, but may also be a parallel communication method. Furthermore, the predetermined serial communication method is a synchronous SPI (Serial Peripheral Interface), but may also be an I2C (Inter-Integrated Circuit) or UART (Universal Asynchronous Receiver Transmitter), or may be a communication method that is a partial improvement or modification of these communication methods.

[0014] The second sensor 102 is a physical quantity sensor that can detect a physical quantity with higher accuracy than the first sensor 1. High accuracy means, for example, high resolution, high S / N, or low error. More specifically, being able to detect a physical quantity with higher accuracy than the first sensor 1 means that the smallest unit of the physical quantity that the second sensor 102 can detect is smaller than the smallest unit of the physical quantity that the first sensor 1 can detect. For example, when the signal strengths output by the sensor elements of the first sensor 1 and the second sensor 102 are the same, the ratio of noise strength to the signal strength is smaller in the second sensor 102. Alternatively, the ratio of error to the signal strength output by the sensor elements of the second sensor 102 is smaller than the ratio of error to the signal strength output by the sensor elements of the first sensor 1. The second sensor 102 detects a physical quantity in, for example, the Z-axis direction and outputs a high-accuracy third physical quantity HP3, which is high-accuracy Z-axis physical quantity data. Here, the high-accuracy Z-axis physical quantity data may be digital data. That is, although not shown in detail, the second sensor 102 may include a sensor element for detecting a physical quantity on the Z axis, an analog circuit having an amplifier circuit or the like for amplifying a detection signal from the sensor element, and an A / D conversion circuit for converting the analog signal from the analog circuit into digital data. The digital data of the high-precision third physical quantity HP3 thus converted has a more reliable lower-order bit value than the digital data of the third physical quantity P3 output from the first sensor 1. If the physical quantity detected by the second sensor 102 is, for example, angular velocity, the second sensor 102 is an angular velocity sensor, such as a resonant frequency change type quartz angular velocity sensor made of quartz that detects angular velocity from the Coriolis force acting on a vibrating object. If the physical quantity detected by the second sensor 102 is, for example, acceleration, the second sensor 102 is an acceleration sensor, such as a frequency change type quartz acceleration sensor. As described above, the second sensor 102 detects the physical quantity on the third detection axis as the high-precision third physical quantity HP3 with higher accuracy than the first sensor 1.

[0015] Similar to the first interface 110, the second interface 120 is a circuit that performs interface processing related to the transmission and reception of digital data with the second sensor 102 in accordance with a predetermined communication method. The predetermined communication method is as described above. Note that the communication method followed by the second interface 120 may be the same as or different from the communication method followed by the first interface 110.

[0016] The processing circuit 130 performs processing for each component of the inertial sensor device 100. For example, the processing circuit 130 performs processing to control the second sensor 102 and the like. In other words, when communicating with the second sensor 102 and the like via digital data, the processing circuit 130 serves as a master controller for the second sensor 102. The processing circuit 130 is configured with the following hardware. The hardware includes a circuit for processing digital signals and may also include a circuit for processing analog signals. For example, the hardware may be configured with one or more circuit devices and one or more circuit elements mounted on a circuit board. The one or more circuit devices may be, for example, an integrated circuit (IC) or a field-programmable gate array (FPGA). The one or more circuit elements may be, for example, resistors, capacitors, etc. The processing circuit 130 is also realized by including at least one of the following processors. The processing circuit 130 includes a memory (not shown in FIG. 1) that stores information and a processor that operates based on the information stored in the memory. The information may be, for example, a program and various data. The processor includes hardware. Various types of processors, such as a central processing unit (CPU), a graphics processing unit (GPU), or a digital signal processor (DSP), can be used. The memory may be a semiconductor memory such as a static random access memory (SRAM) or a dynamic random access memory (DRAM), a register, a magnetic storage device such as a hard disk drive (HDD), or an optical storage device such as an optical disk drive. For example, the memory stores computer-readable instructions, and the processor executes these instructions to realize some or all of the functions of the components of the processing circuit 130. The instructions may be instructions from an instruction set constituting a program, or instructions that instruct the processor's hardware circuitry to operate.

[0017] The host interface 140 is a circuit that performs interface processing related to sending and receiving data with the host 200 in accordance with a predetermined communication method. The predetermined communication method is as described above. The communication method followed by the host interface 140 may be the same as or different from the communication method followed by the first interface 110 or the second interface 120.

[0018] The host 200 is electrically connected to the inertial sensor device 100 and other devices and acquires physical quantities output from the inertial sensor device 100. The host 200 includes a processing unit (not shown), which can be implemented by a processor similar to the processing circuit 130 described above. For example, the host 200 is included in a measurement system (not shown) and controls each component of the measurement system. Based on the physical quantities acquired by the host 200, the measurement system can calculate the position of a predetermined measurement object. Examples of the predetermined measurement object include, but are not limited to, moving objects such as bicycles, four-wheeled automobiles, motorcycles, trains, airplanes, and ships, as well as electronic devices such as personal computers, smartphones, tablet devices, watches, car navigation systems, and various measuring instruments. For example, the measurement system can calculate the position of a predetermined measurement object by including the host 200 and a GPS receiver and a GPS receiving antenna (not shown). Specifically, the GPS receiver receives signals from GPS satellites via an antenna, and the host 200 detects GPS positioning data representing the position, speed, and orientation of a specific measurement object based on the signals received by the GPS receiver. The position of the specific measurement object is, for example, latitude, longitude, or altitude. The host 200 also performs inertial navigation calculation processing on the physical quantity data acquired from the inertial sensor device 100 to obtain inertial navigation positioning data. The inertial navigation positioning data includes acceleration data and attitude data of the measurement object. The host 200 then calculates the position of the specific measurement object based on the obtained inertial navigation positioning data and GPS positioning data. For example, if the specific measurement object is a four-wheeled vehicle, the host 200 calculates the position of the four-wheeled vehicle on the ground.

[0019] In this embodiment, as shown in FIG. 1 , the host 200 is electrically connected to the inertial sensor device 100 and also to the first sensor 1. Specifically, for example, a package for the first sensor 1 and a package for the inertial sensor device 100 are mounted on a circuit board of the host 200. As a result, a processor constituting a processing unit of the host 200 is electrically connected to terminals of the package for the first sensor 1 and terminals of the package for the inertial sensor device 100 via predetermined signal lines. As a result, when the host 200 performs serial communication with the first sensor 1 and the inertial sensor device 100 according to, for example, the SPI standard, the processing unit of the host 200 can function as a master controller for the first sensor 1 and the inertial sensor device 100. Specifically, as shown in FIG. 2 , the host 200 is connected to the first sensor 1 and the inertial sensor device 100 via signal lines CS, CLK, and DIN. Furthermore, the first sensor 1 and the inertial sensor device 100 are connected via a signal line DOUT1. The inertial sensor device 100 and the host 200 are further connected by a signal line DOUT2. For example, as shown in FIG. 2, the host 200 can transmit and receive digital data by connecting a signal line CS to the first sensor 1 and the inertial sensor device 100 and setting a negative logic signal passing through the signal line CS to an L level for a desired slave. In this case, the host 200 can separately acquire desired physical quantities, which are digital data, from the first sensor 1 and the inertial sensor device 100. Alternatively, as shown in FIG. 2, the host 200 can also connect the signal line DOUT1 of the first sensor 1 to the inertial sensor device 100. This allows the host 200 to acquire data only from the inertial sensor device 100. In other words, the host 200 does not distinguish between the first sensor 1 and the inertial sensor device 100 based on the logic level of the signal passing through the signal line CS. Furthermore, the connection of the signal lines CS, CLK, DIN, and DOUT2 on the host 200 side is no different from when only the inertial sensor device 100 is provided. Therefore, the host 200 can acquire desired physical quantities from the first sensor 1 and the inertial sensor device 100 through serial communication as if it were communicating only with the inertial sensor device 100.

[0020] In the following description, for example, the symbol CS may refer to a signal line as shown in FIG. 2, but may also be written or illustrated as a signal passing through the signal line. The same applies to the symbols CLK, DIN, DOUT1, DOUT2, CSA, CLKA, DINA, DOUTA, CSB, CLKB, DINB, DOUTB, DRDYB, CS3, CLK3, DIN3, DOUT3, CS4, CLK4, DIN4, DOUT4, and DRDY4 described below. Although not shown in FIG. 1, the inertial sensor device 100 includes, for example, a first buffer BF1, as shown in FIG. 2. The first buffer BF1 can be realized by, for example, a register included in the processing circuit 130 or an output register included in the host interface 140.

[0021] When the inertial sensor device 100 is connected to the first sensor 1 via a signal line as shown in FIG. 2 , the first interface 110 of the inertial sensor device 100 receives a first physical quantity P1, a second physical quantity P2, and a third physical quantity P3, which are sensor data, from the first sensor 1. The second interface 120 of the inertial sensor device 100 also receives a high-precision third physical quantity HP3, which is sensor data, from the second sensor 102 at the same timing. "Same timing" includes "approximately the same timing." The processing circuit 130 then outputs the first physical quantity P1 and the second physical quantity P2 received by the first interface 110 to the host 200 via the host interface 140. Meanwhile, the processing circuit 130 does not transmit the third physical quantity P3 received by the first interface 110 to the host 200, but outputs the high-precision third physical quantity HP3 received by the second interface 120 to the host 200 via the host interface 140.

[0022] Such communication can be achieved, for example, by the following method. For example, the first sensor 1 transmits the first physical quantity P1, the second physical quantity P2, and the third physical quantity P3 as serial data conforming to the SPI standard to the first interface 110 via the signal line DOUT1. The processing circuit 130 transmits this serial data from the first sensor 1 directly to the signal line DOUT2 via the host interface 140 without performing serial-to-parallel conversion or the like. However, the processing circuit 130 replaces the portion of the serial data from the first sensor 1 corresponding to the third physical quantity P3 with data of the high-precision third physical quantity HP3 and transmits the data to the signal line DOUT2. At this time, the processing circuit 130 or the host interface 140 converts the high-precision third physical quantity HP3 into serial data conforming to the SPI standard by parallel-to-serial conversion or the like and transmits the data to the signal line DOUT2.

[0023] As described above, the inertial sensor device 100 of this embodiment includes the first interface 110, the second sensor 102, the second interface 120 that is an interface with the second sensor 102, the host interface 140 that is an interface with the host 200, and the processing circuit 130. The first interface 110 is an interface with the first sensor 102 that detects a first physical quantity P1 on a first detection axis, a second physical quantity P2 on a second detection axis, and a third physical quantity P3 on a third detection axis. The second sensor 102 detects the physical quantity on the third detection axis as a high-precision third physical quantity HP3 with higher accuracy than the first sensor. The processing circuit 130 outputs the first physical quantity P1 and the second physical quantity P2 to the host 200 via the host interface 140, and outputs the high-precision third physical quantity HP3 to the host 200 via the host interface 140 instead of the third physical quantity P3.

[0024] As described above, the inertial sensor device 100 of this embodiment includes the first interface 110 and the second interface 120, and is therefore able to acquire the first physical quantity P1, the second physical quantity P2, and the third physical quantity P3 from the first sensor 1, and to acquire the high-precision third physical quantity HP3 from the second sensor 102. Furthermore, the inertial sensor device 100 of this embodiment includes the processing circuit 130, and is therefore able to output the first physical quantity P1 and the second physical quantity P2 acquired from the first sensor 1, and the high-precision third physical quantity HP3 acquired from the second sensor 102, to the host 200 via the host interface 140. When the accuracy of the physical quantity on the third detection axis is required to be higher than the accuracy of the physical quantities on the first detection axis and the second detection axis, conventional methods have required the host 200 to be provided with an interface for connecting to the second sensor 102 and adjustments such as swapping sensor data in order for the host 200 to acquire the high-precision third physical quantity HP3. In this regard, by applying the method of this embodiment, the host 200 can acquire the high-precision third physical quantity HP3 in place of the third physical quantity P3 without changing the specifications on the host 200 side. Note that although the above describes an example in which the high-precision third physical quantity HP3 is acquired for the third detection axis, which is the Z axis, the same can be applied to the first physical quantity P1 for the first detection axis, which is the X axis, or the second physical quantity P2 for the second detection axis, which is the Y axis. In other words, by applying the method of this embodiment, the host 200 can acquire the physical quantity of any axis as a high-precision physical quantity without changing the specifications on the host 200 side.

[0025] The method of this embodiment may also be realized as a sensor module. That is, the sensor module of this embodiment includes the inertial sensor device 100 and the first sensor 1. By doing so, it is possible to obtain the same effects as those described above.

[0026] Specifically, for example, the sensor module of this embodiment can be realized by mounting the inertial sensor device 100 and the first sensor 1 on one substrate and packaging them as one semiconductor package, thereby reducing the number of components to be mounted on the host 200.

[0027] The method of this embodiment is not limited to the above, and various modifications are possible. For example, while the host 200 is electrically connected to the first sensor 1 in the examples of FIGS. 1 and 2, the host 200 may not be electrically connected to the first sensor 1, as shown in the block diagram of FIG. 3. In this case, as shown in FIG. 4, the first sensor 1 and the inertial sensor device 100 are connected via signal lines CSA, CLKA, DINA, and DOUTA, and the processing circuit 130 of the inertial sensor device 100 serves as the master with respect to the first sensor 1. Furthermore, the host 200 and the inertial sensor device 100 are connected via signal lines CSB, CLKB, DINB, and DOUTB, and the host 200 serves as the master with respect to the processing circuit 130 of the inertial sensor device 100. Furthermore, although not shown in FIG. 4, the inertial sensor device 100 includes a second buffer BF2 in addition to the first buffer BF1 described above in FIG. 2. Like the first buffer BF1, the second buffer BF2 can be implemented by a register or the like of the processing circuit 130 or the host interface 140. Furthermore, as shown in FIG. 4, the host 200 may further connect the inertial sensor device 100 to a signal line DRDYB. This configuration can also achieve the same effect as described above. The number of terminals required for the package of the inertial sensor device 100 differs between the example of FIG. 1 and the example of FIG. 3. As described above, the method of this embodiment can be implemented using multiple configuration examples with different specifications, thereby improving the design flexibility of the package to be mounted on the substrate of the host 200. For example, if it is desired to minimize the package size of the inertial sensor device 100, the configuration example of FIG. 1 is advantageous in terms of design.

[0028] Here, using FIGS. 5 and 6, an example will be described in which higher accuracy of the physical quantity in the third detection axis is required than that of the physical quantities in the first detection axis and the second detection axis. As described above, the host 200 including the first sensor 1 and the inertial sensor device 100 is included in a measurement system. The measurement system is fixedly mounted on the aforementioned moving body. FIG. 5 is a diagram illustrating the relationship between the moving direction of a four-wheeled automobile, which is an example of the aforementioned moving body, and the coordinate systems of the first sensor 1 and the second sensor 102 included in the measurement system. Hereinafter, the coordinate systems of the first sensor 1 and the second sensor 102 will be simply referred to as the sensor coordinate system. It is also assumed that the X-axis, Y-axis, and Z-axis directions of the coordinate system of the first sensor 1 and the coordinate system of the second sensor 102 are the same. The X-axis of the sensor coordinate system corresponds to the front-to-rear direction of the moving body, with the forward direction being the positive X-axis direction. The Y-axis of the sensor coordinate system corresponds to the left-to-right direction of the moving body, with the rightward direction being the positive Y-axis direction. The Z axis of the sensor coordinate system is perpendicular to the X and Y axes, and the downward direction of the moving body is the positive Z axis direction. Because the moving body moves on a nearly horizontal plane, the XY plane is the moving body's plane of movement, and the positive Z axis direction can be considered to coincide with the direction of gravity. The attitude of the moving body is expressed by the roll angle around the X axis, the pitch angle around the Y axis, and the yaw angle around the Z axis. As described above, because the moving body moves on a nearly horizontal plane, the roll angle, which is an attitude, corresponds to the moving body's left-right tilt, the pitch angle corresponds to the moving body's forward-backward tilt, and the yaw angle corresponds to the moving body's change of direction or orientation. In inertial navigation calculations, the attitude is calculated by time-integrating the angular velocity, which is the output signal of the first sensor 1, etc. In other words, in FIG. 5, if the first sensor 1 and the second sensor 102 are angular velocity sensors, the roll angle can be obtained by integrating the first angular velocity G1 acquired by the measurement system over time, the pitch angle can be obtained by integrating the second angular velocity G2 over time, and the yaw angle can be obtained by integrating the third angular velocity G3 or the high-precision third angular velocity HG3 over time.

[0029] FIG. 6 is a diagram illustrating position errors. FIG. 6 shows a bird's-eye view of the moving object from above, i.e., an XY plane diagram in the sensor coordinate system. The actual moving direction is indicated by a solid line as the original moving direction. Because the forward direction of the moving object is the positive direction of the X axis, the actual moving direction is also the positive direction of the X axis. The position shown in B1 is the moving object's position at the first time t1 and is assumed to be known. The position shown in B2 is the moving object's actual position at the second time t2, and the position shown in B3 is the moving object's position calculated by inertial navigation calculation using the measurement system at the second time t2. The distance between the positions shown in B2 and B3 is the position error caused by a bias error in the output signal of the first sensor 1 while the moving object moves from the first time t1 to the second time t2. As mentioned above, since the moving object moves on a substantially horizontal plane, this positional deviation is caused by an error in the yaw angle, which is its attitude. This yaw angle error increases over time. As described above, it is desirable that the error in the yaw angle be smaller than the error in the roll angle and the error in the pitch angle. In other words, it is desirable that the measurement accuracy of the angular velocity around the Z axis be higher than the measurement accuracy of the angular velocity around the X axis and the measurement accuracy of the angular velocity around the Y axis. In this regard, by applying the technique of this embodiment, the measurement system can acquire the yaw angle based on the high-precision third physical quantity HP3, which has higher accuracy than the third physical quantity P3, instead of the third physical quantity P3. This makes it possible to more appropriately predict the position of a moving object, etc.

[0030] From the above, in the inertial sensor device 100 of this embodiment, the third physical quantity P3 and the high-precision third physical quantity HP3 are angular velocities around the third detection axis, which is the Z axis. In this way, the host 200 can acquire the high-precision third angular velocity HG3 without changing the specifications on the host 200 side.

[0031] Next, a specific method in which the inertial sensor device 100 outputs the first physical quantity P1 and the second physical quantity P2 to the host 200 and also outputs the high-precision third physical quantity HP3 to the host 200 instead of the third physical quantity P3 will be described with reference to FIGS. 7, 8, 9, and 10. FIG. 7 illustrates a basic example of a communication method used in this embodiment, for example, in which the master host 200 communicates with a specific physical quantity sensor as a slave. In the following description, the transmission and reception of data via a communication interface (not shown) of the host 200 will be simply referred to as the host 200 transmitting and receiving data. First, the master host 200 sets the negative logic signal CS to an L level. This causes the specific physical quantity sensor to be chip-selected. Chip select is also called slave select. Then, the master host 200 transmits an 8-bit read command RC to the specific physical quantity sensor via the signal line DIN in synchronization with the clock of the signal CLK. In other words, the clock of the signal CLK here is based on an oscillator circuit (not shown) of the host 200. Here, the read command RC includes, for example, a bit instructing a read / write in the first bit, and the host 200 sets a value instructing a read to that bit. Thereafter, the predetermined physical quantity sensor transmits 8 bits of sensor data to the host using the signal line DOUT2 in synchronization with the clock signal on the signal line CLK. Note that the "*" in FIG. 7 indicates "don't care," and this also applies to FIG. 8 and subsequent figures. Also, hereinafter, explanations of synchronization with the clock from the signal CLK may be omitted. Also, illustration of the clock of the signal CLK is omitted from FIG. 8 and subsequent figures. The same applies to signals CLKA, CLKB, CLK3, and CLK4, which will be described later.

[0032] In this way, for example, if a predetermined physical quantity sensor detects a physical quantity in only one axis direction, three predetermined physical quantity sensors are prepared and their respective detection axes are set to the first, second, and third detection axes. This allows the host 200 to acquire the first physical quantity P1, the second physical quantity P2, and the third physical quantity P3. However, the method of this embodiment is not limited to this. For example, when one master sends one read command RC to a slave, the master may read multiple pieces of data from the slave. This function is called a burst read function. FIG. 8 shows an example in which the master host 200 communicates with a predetermined triaxial physical quantity sensor as a slave. By applying the burst read function described above, as shown in FIG. 8, the master host 200 can read physical quantities corresponding to the first physical quantity P1, the second physical quantity P2, and the third physical quantity P3 from the predetermined triaxial physical quantity sensor by sending one read command RC to the predetermined triaxial physical quantity sensor.

[0033] 9 is a diagram illustrating an example of a timing chart in which the host 200 acquires the high-precision third physical quantity HP3 and the like by applying the method of this embodiment. The first sensor 1, the inertial sensor device 100, and the host 200 are assumed to be connected by the signal lines shown in FIG. 2. The second interface 120 of the inertial sensor device 100 is assumed to periodically sample the high-precision third physical quantity HP3 from the second sensor 102. In this embodiment, it is assumed that there is no problem with the timing of data transmission and reception between the first sensor 1, the inertial sensor device 100, the host 200, and the like.

[0034] The host 200 sets the signal CS to an L level to chip select both the first sensor 1 and the inertial sensor device 100, and transmits a read command RC via the signal line DIN to the communication interface of the first sensor 1 and the host interface 140 of the inertial sensor device 100. The processing circuit 130 of the inertial sensor device 100 stores digital data of the high-precision third physical quantity HP3 in the first buffer BF1, as shown in C1. Furthermore, upon receiving the read command RC from the host 200, the first sensor 1 transmits the first physical quantity P1, the second physical quantity P2, and the third physical quantity P3 to the first interface 110 of the inertial sensor device 100 via the signal line DOUT1. In other words, by setting a predetermined address in the second bit and subsequent bits of the read command RC transmitted by the host 200, the first sensor 1 can transmit the first physical quantity P1, the second physical quantity P2, and the third physical quantity P3, and the processing circuit 130 can store the high-precision third physical quantity HP3 in the first buffer BF1.

[0035] Then, as shown in C2, the processing circuit 130 transmits the first physical quantity P1 and the second physical quantity P2 received via the first interface 110 to the host 200 via the host interface 140 and the signal line DOUT2 as they are. Furthermore, as shown in C3, at the timing of transmitting the third physical quantity P3, the processing circuit 130 replaces the third physical quantity P3 with the high-precision third physical quantity HP3 stored in the first buffer BF1 and transmits it to the host 200 via the host interface 140 and the signal line DOUT2. In this way, the host 200 can receive the high-precision third physical quantity instead of the third physical quantity P3.

[0036] While the first sensor 1 has been described above as a three-axis sensor, the method of this embodiment is not limited to this and various modifications are possible. For example, the first sensor 1 may be a six-axis sensor. A six-axis sensor is, for example, a combination of a three-axis physical quantity sensor capable of independently detecting physical quantities in the X-axis, Y-axis, and Z-axis directions and a three-axis physical quantity sensor capable of independently detecting physical quantities in the X-axis, Y-axis, and Z-axis directions. For example, if the first sensor 1 is a combination of a three-axis acceleration sensor and a three-axis angular velocity sensor, the first sensor 1 detects a first angular velocity G1, a second angular velocity G2, a third angular velocity G3, a first acceleration A1, a second acceleration A2, and a third acceleration A3. As described above with reference to FIGS. 5 and 6 , if the angular velocity in the Z direction needs to be more accurate than the third angular velocity G3, the inertial sensor device 100 acquires a high-accuracy third angular velocity HG3 using the second sensor 102 as a Z-axis angular velocity sensor. 10, by applying the above-mentioned method, the host interface 140 can transmit the first angular velocity G1, the second angular velocity G2, the high-precision third angular velocity HG3, the first acceleration A1, the second acceleration A2, and the third acceleration A3 to the host 200. Note that a sensor unit consisting of an acceleration sensor and an angular velocity sensor is sometimes called an IMU (Inertial Measurement Unit).

[0037] 3 and 4, the host 200 can acquire the high-precision third physical quantity HP3, for example, according to the timing chart shown in FIG. 11. The processing circuit 130 of the inertial sensor device 100 acts as a master for the first sensor 1 and sets the signal CSA to L level. The processing circuit 130 then stores the high-precision third angular velocity HG3 acquired from the second sensor 102 in the first buffer BF1. The inertial sensor device 100 also transmits a read command RC to the first sensor 1 via the signal line DINA in synchronization with the signal CLKA, and reads the first angular velocity G1, the second angular velocity G2, the third angular velocity G3, the first acceleration A1, the second acceleration A2, and the third acceleration A3 from the first sensor 1 via the signal line DOUTA. The processing circuit 130 then stores the read first angular velocity G1, second angular velocity G2, first acceleration A1, second acceleration A2, and third acceleration A3, as well as the high-precision third angular velocity HG3 stored in the first buffer BF1, in the second buffer BF2. At this timing, the processing circuit 130 also sets the signal DRDYB to H level to notify the host 200 that data transmission is possible. The host 200 then becomes the master for the inertial sensor device 100, sets the signal CSB to L level, and transmits a read command RC to the host interface 140 via the signal line DINB in ​​synchronization with the signal CLKB. The host 200 then reads the first angular velocity G1, second angular velocity G2, high-precision third angular velocity HG3, first acceleration A1, second acceleration A2, and third acceleration A3 via the signal line DOUTB.

[0038] Furthermore, although the above description is of an example in which the inertial sensor device 100 of this embodiment outputs the high-precision third angular velocity HG3 to the host 200 instead of the third angular velocity G3, the method of this embodiment is not limited to this. For example, the inertial sensor device 100 may output the high-precision third acceleration HA3 to the host 200 instead of the third acceleration A3. That is, in the inertial sensor device 100 of this embodiment, the third physical quantity P3 and the high-precision third physical quantity HP3 are accelerations around the third detection axis, which is the Z axis. By doing so, when higher accuracy is required for the acceleration of a predetermined axis compared to the accelerations of other axes, the host 200 can acquire the high-precision third acceleration HA3 without changing the specifications of the host 200. Note that a case in which higher accuracy is required for the acceleration of a predetermined axis compared to the accelerations of other axes is, for example, a case in which accurate measurement and control of the position of an object including a linear motion mechanism is required, specifically, a linear motor car.

[0039] Note that configuring a six-axis sensor using the aforementioned Si-MEMS inertial sensor can achieve miniaturization, but it is not possible to obtain sensor data with sufficient accuracy to meet the requirements described above in FIG. 5 and other figures. On the other hand, configuring the first sensor 1 so that it can acquire the six physical quantities using only the aforementioned quartz inertial sensor can obtain highly accurate sensor data, but it is not possible to achieve miniaturization. Therefore, in this embodiment, the first sensor 1, which is a compact six-axis sensor, can be configured using an Si-MEMS inertial sensor, and the second sensor 102 can be configured as a quartz inertial sensor to acquire physical quantities only in directions requiring high accuracy. Therefore, in the inertial sensor device 100 of this embodiment, the first sensor 1 is a MEMS inertial sensor, and the second sensor 102 is a quartz inertial sensor. This configuration makes it possible to realize a physical quantity sensor that is both compact and highly accurate.

[0040] The method of this embodiment is not limited to the above, and various modifications are possible. For example, the inertial sensor device 100 of this embodiment may be configured as shown in the block diagram of FIG. 12 as a modified example. The example shown in FIG. 12 differs from the examples of FIGS. 1 and 3 in that the inertial sensor device 100 further includes an inspection interface 150 connectable to an inspection apparatus 300 and a memory 160. Note that other reference numerals are the same as those in FIGS. 1 and 3, and detailed description thereof will be omitted.

[0041] 12, the signal lines may be connected as shown in FIG. 13. Specifically, the inertial sensor device 100 is connected to the first sensor via signal lines CS3, CLK3, DNI3, and DOUT3. The inertial sensor device 100 is connected to the host 200 via signal lines CS4, CLK4, DNI4, DOUT4, and DRDY4. The inertial sensor device 100 is connected to the inspection apparatus 300 via signal lines SCL and SDA. Although not shown in FIG. 12, the inertial sensor device 100 includes a third buffer BF3 in addition to the first buffer BF1 and the second buffer BF2 described above in FIGS. 2 and 4. The third buffer BF3, like the first buffer BF1 and the second buffer BF2, can be implemented by a register or the like of the processing circuit 130 or the host interface 140.

[0042] 12, the memory 160 further includes a first table 162 and a second table 164. The first table 162 is a table storing, for example, zero-point correction coefficients. Specifically, for example, for a predetermined temperature range, zero-point data is obtained for each constant temperature, and the obtained data group is plotted, thereby obtaining a function approximating an n-th degree polynomial related to temperature as a correction function. The n+1 coefficients of degrees n to 0 in the n-th degree polynomial are the zero-point correction coefficients. Based on these coefficients, when no physical action is acting on the first sensor 1 and the second sensor 102, the first sensor 1 and the second sensor 102 output a signal indicating that the physical quantity is zero within the aforementioned predetermined temperature range.

[0043] The second table 164 stores misalignment correction coefficients related to misalignment correction. Misalignment is also called mounting error. For example, in the measurement system described above with reference to FIG. 5 and other figures, mounting errors of the first sensor 1 and other sensors on the substrate of the host 200 may cause the X-, Y-, and Z-axis directions of the moving object to not accurately match the directions of the first, second, and third detection axes of the first sensor 1 and other sensors. Therefore, taking misalignment into consideration, the first physical quantity P1 and other values ​​output by the first sensor 1 and other sensors are corrected using a matrix such as that shown in the following equation (1). In other words, the misalignment correction coefficients are the elements M11, M12, M13, M21, M22, M23, M31, M32, and M33 of the matrix shown in equation (1). Note that a method for calculating the misalignment correction coefficients is well known, and a detailed description thereof will be omitted.

number

[0044] The memory 160 is, for example, a nonvolatile memory, and can be realized by, for example, an EEPROM (Electrically Erasable Programmable Read Only Memory) or a flash memory. The EEPROM can be realized by, for example, floating gate memory cells. The flash memory can be realized by, for example, MONOS (Metal Oxide Nitride Oxide Silicon) memory cells.

[0045] The test interface 150 is a circuit that performs interface processing for transmitting and receiving digital data to and from the test device 300 according to a specific communication method. The specific communication method may be, for example, I2C, but it may also be another communication standard or a communication standard that is an improved or modified version of one of these standards. The test device 300 is a device that writes zero-point correction coefficients, misalignment correction coefficients, etc. to the memory 160. It is desirable to assign dedicated terminals to the package terminals of the inertial sensor device 100 for connecting to the test device 300 so that the inertial sensor device 100 can communicate independently with the test device 300 after being mounted on the board of the host 200. By using I2C as the specific communication method, the test interface 150 can communicate with the test device 300 using two signal lines, signal lines SCL and SDA, as shown in Figure 13, thereby minimizing the number of dedicated terminals. This allows the number of terminals on the package of the inertial sensor device 100 to be reduced, thereby avoiding unnecessary increases in package size.

[0046] For example, if the inertial sensor device 100 is in the surface-mount package described above, the inertial sensor device 100 is aligned at a desired position on the substrate of the host 200, and then the inertial sensor device 100 and the host 200 are firmly joined by soldering using a reflow oven, achieving surface mounting. It is empirically known that the characteristics of a sensor device change after surface mounting on a desired substrate. For example, although not shown, it is empirically known that the position of the zero-point voltage at a given temperature and the temperature dependence of the zero-point voltage are different before and after surface mounting. Possible reasons for changes in the characteristics of a sensor device after surface mounting include excitation of holes or carriers in the piezoelectric thin film layer or electrode layer of the sensor element, generating minute currents, or changes in the in-plane stress distribution of the substrate, resulting in distortion that affects the sensor element.

[0047] For the reasons described above, the zero-point value or temperature dependence of the inertial sensor device 100 may change after surface mounting on the host. Therefore, the user may determine the aforementioned correction function after surface mounting and store the polynomial coefficients of the correction function in the memory 160. The processing circuit 130 then performs calculations based on the correction function before transmitting the first physical quantity P1, the second physical quantity P2, and the high-precision third physical quantity HP3 from the host interface 140 to the host. This allows the host interface 140 to output the corrected first physical quantity CP1, the corrected second physical quantity CP2, and the corrected high-precision third physical quantity CHP3 to the host 200. That is, the processing circuit 130 performs zero-point correction on the first physical quantity P1, the second physical quantity P2, and the high-precision third physical quantity HP3, and the host interface 140 outputs the first physical quantity CP1, the second physical quantity CP2, and the high-precision third physical quantity CHP3 corrected by the zero-point correction to the host 200. In this way, it is possible to correct the zero point that has changed due to thermal effects, etc. As a result, the host 200 can acquire the corrected first physical quantity CP1, second physical quantity CP2, and high-precision third physical quantity CHP3, which are appropriate data, even after the inertial sensor device 100 is surface-mounted on the substrate of the host 200.

[0048] Furthermore, as described above, after the inertial sensor device 100 is surface-mounted on the host, the direction of each detection axis of the first sensor 1 or the second sensor 102 may change due to distortion of the substrate or the like. Therefore, the user may determine the misalignment correction coefficient described above and store it in the memory 160. Then, the processing circuit 130 performs a calculation based on the above-described equation (1) before transmitting the first physical quantity P1, the second physical quantity P2, and the high-precision third physical quantity HP3 from the host interface 140 to the host. This allows the host interface 140 to output the corrected first physical quantity CP1, the corrected second physical quantity CP2, and the corrected high-precision third physical quantity CHP3 to the host 200. That is, the processing circuit 130 performs alignment correction between the detection axes for the first physical quantity P1, the second physical quantity P2, and the high-precision third physical quantity HP3, and the host interface 140 outputs the first physical quantity CP1, the second physical quantity CP2, and the high-precision third physical quantity CHP3 after the alignment correction to the host 200. In this manner, it is possible to correct the alignment between the detection axes that has changed due to thermal effects, etc. As a result, the host 200 can obtain the corrected first physical quantity CP1, the second physical quantity CP2, and the high-precision third physical quantity CHP3, which are appropriate data, even after the inertial sensor device 100 is surface-mounted on the substrate of the host 200. Note that the processing circuit 130 may perform the misalignment correction and the aforementioned zero-point correction simultaneously.

[0049] FIG. 14 is a diagram illustrating an example of a timing chart for a method according to a modified example. Note that in the description of FIG. 14, some of the same content as previously described will be omitted. The processing circuit 130 of the inertial sensor device 100 acts as a master with respect to the first sensor 1 and sets the signal CS3 to the L level. The processing circuit 130 then stores the high-precision third angular velocity HG3 acquired from the second sensor 102 in the first buffer BF1. The inertial sensor device 100 also transmits a read command RC to the first sensor 1 via signal line DIN3 and reads the first angular velocity G1, the second angular velocity G2, the third angular velocity G3, the first acceleration A1, the second acceleration A2, and the third acceleration A3 from the first sensor 1 via signal line DOUT3. That is, although not shown, the clock of the signal CLK3 is generated by an oscillator circuit (not shown) of the master inertial sensor device 100.

[0050] Then, the processing circuit 130 stores the read first angular velocity G1, second angular velocity G2, first acceleration A1, second acceleration A2, and third acceleration A3, as well as the high-precision third angular velocity HG3 stored in the first buffer BF1, in the second buffer BF2.

[0051] Thereafter, the processing circuit 130 performs the correction processes, such as the zero point correction, described above, on the first angular velocity G1, the second angular velocity G2, the first acceleration A1, the second acceleration A2, the third acceleration A3, and the high-precision third angular velocity HG3 stored in the second buffer BF2. This calculation requires the period shown in D in FIG.

[0052] After the correction process is completed, the processing circuit 130 stores the corrected first angular velocity CG1, the corrected second angular velocity CG2, the corrected high-precision third angular velocity CHG3, the corrected first acceleration CA1, the corrected second acceleration CA2, and the corrected third acceleration CA3 in the third buffer BF3. At this time, the processing circuit 130 also sets the signal DRDY4 to the H level to notify the host 200 that the corrected data is ready to be transmitted.

[0053] The host 200 then becomes the master for the inertial sensor device 100, sets the signal CS4 to the L level, and transmits a read command RC to the host interface 140 of the inertial sensor device 100 via the signal line DIN4 in synchronization with the signal CLK4. The host 200 then reads the corrected first angular velocity CG1, the corrected second angular velocity CG2, the corrected high-precision third angular velocity CHG3, the corrected first acceleration CA1, the corrected second acceleration CA2, and the corrected third acceleration CA3 via the signal line DOUT4. In this manner, the host 200 can acquire the corrected sensor data. The example timing chart shown in FIG. 14 differs from the examples of the timing charts in FIGS. 9 and 11 because the period indicated by D in FIG. 14 is longer than the period of the response to the read command RC transmitted from the host 200.

[0054] As described above, the inertial sensor device of this embodiment includes a first interface, a second sensor, a second interface that is an interface with the second sensor, a host interface that is an interface with the host, and a processing circuit. The first interface is an interface with the first sensor that detects a first physical quantity on a first detection axis, a second physical quantity on a second detection axis, and a third physical quantity on a third detection axis. The second sensor detects the physical quantity on the third detection axis as a high-precision third physical quantity with higher accuracy than the first sensor. The processing circuit outputs the first physical quantity and the second physical quantity to the host via the host interface, and outputs the high-precision third physical quantity to the host via the host interface in place of the third physical quantity.

[0055] In this way, the inertial sensor device of this embodiment can output the first physical quantity and the second physical quantity acquired from the first sensor and the high-precision third physical quantity acquired from the second sensor to the host via the host interface. In this way, the host can acquire the high-precision third physical quantity in place of the third physical quantity without changing the specifications on the host side.

[0056] Furthermore, the third physical quantity and the high-precision third physical quantity may be an angular velocity around a third detection axis.

[0057] In this way, the host can obtain the high-precision third angular velocity without changing the specifications on the host side.

[0058] Furthermore, the third physical quantity and the high-precision third physical quantity may be acceleration on a third detection axis.

[0059] By doing this, when the acceleration of a specific axis requires higher accuracy than the acceleration of other axes, the host can obtain the high-accuracy third acceleration without changing the specifications on the host side.

[0060] In addition, the processing circuit may perform zero-point correction of the first physical quantity, the second physical quantity, and the high-precision third physical quantity, and the host interface may output the first physical quantity, the second physical quantity, and the high-precision third physical quantity after the zero-point correction to the host.

[0061] In this way, it is possible to correct the zero point that has changed due to thermal effects, etc. As a result, the host can acquire the appropriately corrected first physical quantity, second physical quantity, and high-precision third physical quantity even after the inertial sensor device is surface-mounted on the host's substrate.

[0062] Furthermore, the processing circuit may perform alignment correction between detection axes for the first physical quantity, the second physical quantity, and the high-precision third physical quantity, and the host interface may output the first physical quantity, the second physical quantity, and the high-precision third physical quantity after the alignment correction to the host.

[0063] This makes it possible to correct the alignment between the detection axes that has changed due to thermal effects, etc. As a result, the host can acquire the appropriately corrected first physical quantity, second physical quantity, and high-precision third physical quantity even after the inertial sensor device is surface-mounted on the host.

[0064] Alternatively, the first sensor may be a MEMS inertial sensor and the second sensor may be a quartz inertial sensor.

[0065] In this way, a physical quantity sensor that is both compact and highly accurate can be realized.

[0066] The sensor module of this embodiment relates to a sensor module including the above-described inertial sensor device and a first sensor.

[0067] Although the present embodiment has been described in detail above, it will be readily apparent to those skilled in the art that many modifications are possible without substantially departing from the novel features and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure. For example, a term described at least once in the specification or drawings together with a different term having a broader or similar meaning may be replaced with that different term anywhere in the specification or drawings. Furthermore, all combinations of the present embodiment and modifications are also included within the scope of the present disclosure. Furthermore, the configuration and operation of the inertial sensor device or sensor module are not limited to those described in the present embodiment, and various modifications are possible. [Explanation of symbols]

[0068] 1...first sensor, 100...inertial sensor device, 102...second sensor, 110...first interface, 120...second interface, 130...processing circuit, 140...host interface, 150...inspection interface, 160...memory, 162...first table, 164...second table, 200...host, 300...inspection device, P1...first physical quantity, P2...second physical quantity, P3...third physical quantity, HP3...High precision third physical quantity, BF1...First buffer, BF2...Second buffer, BF3...Third buffer, CS...Signal line (signal), CLK...Signal line (signal), DIN...Signal line (signal), DOUT1...Signal line (signal), DOUT2...Signal line (signal), CSA...Signal line (signal), CLKA...Signal line (signal), DINA...Signal line (signal), DOUTA...Signal line (signal), CSB...Signal line (signal), CLKB... Signal line (signal), DINB...signal line (signal), DOUTB...signal line (signal), DRDYB...signal line (signal), CS3...signal line (signal), CLK3...signal line (signal), DIN3...signal line (signal), DOUT3...signal line (signal), CS4...signal line (signal), CLK4...signal line (signal), DIN4...signal line (signal), DOUT4...signal line (signal), DRDY4...signal line (signal), RC...read command, G1... First angular velocity, G2...second angular velocity, G3...third angular velocity, HG3...high-precision third angular velocity, A1...first acceleration, A2...second acceleration, A3...third acceleration, CG1...corrected first angular velocity, CG2...corrected third angular velocity, CG3...corrected third angular velocity, CHG3...corrected high-precision third angular velocity, CA1...corrected first acceleration, CA2...corrected second acceleration, CA3...corrected third acceleration, SCL...signal line, SDA...signal line

Claims

1. a first interface that interfaces with a first sensor that detects three-axis angular velocities including a first angular velocity about a first detection axis, a second angular velocity about a second detection axis, and a third angular velocity about a third detection axis; a second sensor that detects an angular velocity around the third detection axis as a high-precision third angular velocity with higher accuracy than the first sensor; a second interface that interfaces with the second sensor; a host interface that is an interface with a host; a processing circuit; a first package containing the first interface, the second sensor, the second interface, the host interface, and the processing circuit; Including, The processing circuitry an inertial sensor device configured to output a three-axis angular velocity including the first angular velocity, the second angular velocity, and the high-precision third angular velocity to the host via the host interface by replacing the third angular velocity among the three-axis angular velocities obtained from the first sensor provided outside the first package via the first interface with the high-precision third angular velocity obtained from the second sensor inside the first package via the second interface.

2. 2. The inertial sensor device according to claim 1, The processing circuitry performing zero point correction of the first angular velocity, the second angular velocity, and the high-precision third angular velocity; The host interface the first angular velocity, the second angular velocity, and the high-precision third angular velocity after the zero-point correction are output to the host.

3. 3. The inertial sensor device according to claim 1, The processing circuitry performing alignment correction between detection axes for the first angular velocity, the second angular velocity, and the high-precision third angular velocity; The host interface an inertial sensor device that outputs the first angular velocity, the second angular velocity, and the high-precision third angular velocity after the alignment correction to the host;

4. 4. The inertial sensor device according to claim 1, the first sensor is a MEMS inertial sensor; The inertial sensor device, wherein the second sensor is a quartz inertial sensor.

5. An inertial sensor device according to any one of claims 1 to 4, The inertial sensor device, wherein the first detection axis, the second detection axis, and the third detection axis are perpendicular to one another.

6. An inertial sensor device according to any one of claims 1 to 4, The first detection axis is An axis along the front-rear direction of the moving body, The second detection axis is an axis along the left-right direction of the moving body, The third detection axis is An inertial sensor device, characterized in that the axis is aligned with the direction of gravity of the moving body.

7. An inertial sensor device according to any one of claims 1 to 6; the first sensor; A sensor module comprising:

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