Ultrasonic water jet device

Abstract

To prevent air from accumulating on a concave spherical surface of an ultrasonic vibration plate.SOLUTION: Washing water 500 injected from a ring supply port 253 into a second chamber 222 flows along a concave spherical surface 33, from an outer periphery of the concave spherical surface 33 towards a center thereof, to be supplied to the second chamber 222, as shown by an arrow 301. Therefore, even when air accumulates on the concave spherical surface 33 pointing downward, the air can be removed from the concave spherical surface 33 and then can be ejected through an injection port 241 together with the washing water 500, by flow of the washing water flowing from the outer periphery of the concave spherical surface 33 to the center thereof. This can prevent air from accumulating on the concave spherical surface 33 of an ultrasonic vibration plate 30.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an ultrasonic water jetting device. [Background technology]

[0002] The cleaning nozzle (ultrasonic water spraying device) for cleaning an object to be cleaned disclosed in Patent Documents 1 and 2 includes a water reservoir with a jet nozzle at the bottom for temporarily storing water, and a dome-shaped ultrasonic vibration plate with a concave spherical surface that is positioned opposite the jet nozzle and propagates ultrasonic vibrations into the water stored in the water reservoir. The ultrasonic water generated by propagating ultrasonic vibrations from the concave spherical surface into the water in the water reservoir is sprayed from the jet nozzle to clean the surface of the object to be cleaned. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-000995 [Patent Document 2] Japanese Patent Application Publication No. 2020-044460 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, the cleaning nozzle is placed above the table, and ultrasonic water is sprayed from the cleaning nozzle toward the object to be cleaned held on the table. In this case, the concave spherical surface of the dome-shaped ultrasonic vibration plate, which is located opposite the spray nozzle, faces downward. This can cause air to accumulate in the concave spherical surface.

[0005] This air absorbs the ultrasonic vibrations, which can make it difficult to transmit them to the water temporarily stored in the water reservoir. As a result, the ultrasonic vibrations are not transmitted to the water sprayed from the nozzle, resulting in a decrease in cleaning power.

[0006] Therefore, an object of the present invention is to prevent air from accumulating on the concave spherical surface of the ultrasonic vibration plate, thereby allowing ultrasonic water in which ultrasonic vibrations have been sufficiently propagated to be sprayed from the nozzle. [Means for solving the problem]

[0007] The ultrasonic water jetting device of the present invention (the present ultrasonic water jetting device) is an ultrasonic water jetting device that jets ultrasonic water that has been propagated with ultrasonic vibrations, and is equipped with a cylindrical water reservoir that temporarily stores water supplied from a water supply source, an injection port that injects the water from the bottom of the water reservoir, a dome-shaped ultrasonic vibration plate that is positioned above the water reservoir and faces the injection port, and has a concave spherical underside, and a water supply unit that has a supply port that supplies water to the water reservoir along the concave spherical surface from the outer periphery of the ultrasonic vibration plate toward the center, the supply port extends obliquely upward toward the water reservoir and opens below the outer periphery of the ultrasonic vibration plate on the inner wall of the water reservoir, A larger amount of water than that coming out of the injection port is supplied from the supply port to the water reservoir, and the water flows along the concave spherical surface from the outer periphery toward the center and is collected in the water reservoir, and ultrasonic water obtained by propagating ultrasonic vibrations to the water is injected from the injection port. In this ultrasonic water injection device, the supply port may be a ring supply port that opens in a ring shape into the water reservoir portion, and the water supplied to the water reservoir portion from the ring supply port may flow along the concave spherical surface from the entire outer periphery of the concave spherical surface toward the center and be collected in the water reservoir portion, or the water may be made to flow down from the center of the concave spherical surface toward the injection port, and ultrasonic vibrations may be propagated through the water, thereby obtaining ultrasonic water that is injected from the injection port. [Effects of the Invention]

[0008] In this ultrasonic water jet device, the water supplied from the water supply port into the water reservoir flows along the concave spherical surface of the ultrasonic vibration plate, from the periphery of the concave spherical surface toward the center. Therefore, even if air accumulates on the downward-facing concave spherical surface, the water flowing from the periphery to the center of the concave spherical surface removes the air from the concave spherical surface and discharges it from the jet port along with the water.

[0009] In this way, the ultrasonic water jetting device can prevent air from accumulating on the concave spherical surface of the ultrasonic vibration plate. Therefore, the concave spherical surface can effectively transmit ultrasonic vibrations to the water stored in the water reservoir. Therefore, ultrasonic water with sufficient ultrasonic vibrations can be jetted from the jet nozzle. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 10 is an explanatory diagram showing a spinner cleaning mechanism equipped with an ultrasonic water jetting device. [Figure 2] 1 is a cross-sectional view showing the configuration of an ultrasonic water jetting device. [Figure 3] FIG. 2 is an explanatory diagram showing a concave spherical surface and its vicinity from above. [Figure 4] FIG. 10 is a cross-sectional view showing another configuration of the ultrasonic water jetting device. [Figure 5] FIG. 2 is an explanatory diagram showing a concave spherical surface and its vicinity from above. [Figure 6] FIG. 2 is an explanatory diagram showing a concave spherical surface and its vicinity from above. DETAILED DESCRIPTION OF THE INVENTION

[0011] The spinner cleaning mechanism 1 shown in Figure 1 includes a spinner table 10 that holds the wafer 100 to be cleaned, an ultrasonic water spraying device 20 that sprays cleaning water onto the wafer 100 held on the spinner table 10, and a control unit 7 that controls the operation of the spinner cleaning mechanism 1.

[0012] The wafer 100 is, for example, a circular semiconductor wafer, and the upper surface 101 facing upward in Fig. 1 is the surface to be cleaned. The lower surface 102 of the wafer 100 facing downward in Fig. 1 is protected by, for example, a protective tape (not shown) attached thereto.

[0013] The spinner table 10 includes a porous member 11 and a frame 13 that supports the porous member 11. The porous member 11 is connected to a suction source (not shown), and is thereby able to suction-hold the wafer 100 on its upper surface, which is a holding surface 12. The spinner table 10 can be rotated in a horizontal plane, as indicated by arrow 401, by a spinner table rotation mechanism 14 disposed below the spinner table 10.

[0014] The ultrasonic water jetting device 20 is connected to a high-frequency power supply 39 and is attached to the tip of a rotatable water supply pipe 16 above the spinner table 10. The water supply pipe 16 extends horizontally and is connected to a water supply source 19. The water supply source 19 is equipped with a pump and the like and is configured to supply cleaning water such as pure water to the water supply pipe 16.

[0015] A rotating shaft 18 that can be rotated by a rotating motor 17 is connected to the rear end of the water supply pipe 16. The water supply pipe 16 has a length that extends from the upper end of the rotating shaft 18 to at least the center of the spinner table 10.

[0016] Therefore, in the spinner cleaning mechanism 1, the water supply pipe 16 rotates in accordance with the rotation of the rotation shaft 18 (arrow 402) by the rotation motor 17, and the ultrasonic water spray device 20 arranged at the tip of the water supply pipe 16 can move over the wafer 100 held on the spinner table 10 from its outer edge to its center.

[0017] The ultrasonic water jetting device 20 is a device that jets ultrasonic water that has been generated by propagating ultrasonic vibrations. As shown in Figure 2, the ultrasonic water spraying device 20 includes a case 21 having a second chamber 222 which is a water storage section for temporarily storing cleaning water 500 supplied from a water supply source 19 via a water supply pipe 16, an injection port 241 for injecting the cleaning water 500, a dome-shaped ultrasonic vibration plate 300 arranged on top of the second chamber 222 of the case 21, and a water supply section 250 having a ring supply port 253 for supplying water to the second chamber 222 of the case 21.

[0018] The case 21 includes a cylindrical portion 22, a conical nozzle portion 23 integrally formed below the cylindrical portion 22, a top plate 24 that covers the top of the cylindrical portion 22, and a fixing device 25 for fixing the top plate 24 to the cylindrical portion 22.

[0019] The interior of case 21 is divided by ultrasonic vibration plate 30 into two upper and lower chambers, namely, a first chamber 221 above ultrasonic vibration plate 30 and a second chamber 222 below ultrasonic vibration plate 30. A water supply section 250 is formed in a portion of cylindrical section 22 corresponding to second chamber 222, and water supply source 19 is connected to water supply section 250 via water supply pipe 16. Therefore, cleaning water 500 supplied from water supply source 19 is temporarily stored in second chamber 222, which is a cylindrical (conical cylindrical) water reservoir section of case 21.

[0020] Nozzle portion 23 of case 21 is formed at the lower end of cylindrical portion 22 so as to protrude in the -Z direction. Nozzle portion 23 gradually reduces in diameter toward the tip. Nozzle portion 23 is provided at its tip with an ejection port 241 that ejects cleaning water 500 stored in second chamber 222 of case 21 from the bottom of second chamber 222. Note that second chamber 222 of case 21 is made up of the interior of nozzle portion 23 and the interior of cylindrical portion 22 below ultrasonic vibration plate 30.

[0021] The ultrasonic vibration plate 30 is disposed above the second chamber 222, which is a water reservoir, and faces the injection port 241. It has a dome shape with a concave spherical underside. The ultrasonic vibration plate 30 is configured to receive high-frequency power and generate ultrasonic vibrations. That is, the ultrasonic vibration plate 30 propagates ultrasonic vibrations to the cleaning water 500 stored in the second chamber 222 of the case 21.

[0022] The ultrasonic vibration plate 30 includes a first electrode plate 31 and a second electrode plate 32 . The second electrode plate 32 is the main body of the ultrasonic vibration plate 30. The second electrode plate 32 is formed to have a circular dome shape when viewed from above, and the lower surface, which is the surface facing the jet nozzle 241, is a downward-facing concave spherical surface (radiation surface) 33. The jet nozzle 241 is disposed opposite this concave spherical surface 33. The concave spherical surface 33 radiates ultrasonic vibrations toward the cleaning water 500 supplied between the ultrasonic vibration plate 30 and the jet nozzle 241.

[0023] The second electrode plate 32 also has a flange 34 on its outer periphery that protrudes radially outward. The flange 34 is placed on a base 231 provided on the inner wall of the cylindrical portion 22 of the case 21 via a first elastic member 232 made of, for example, a rubber plate. The flange 34 is further pressed from above by a fixing member 233 attached to the inner wall of the cylindrical portion 22 via a second elastic member 234 made of, for example, a rubber plate. This causes the flange 34 to be sandwiched between the base 231 and the fixing member 233, and the second electrode plate 32 including the flange 34 is fixed to the inner wall of the cylindrical portion 22.

[0024] The first electrode plate 31 has a circular dome shape similar to that of the second electrode plate 32, but has a smaller diameter than the second electrode plate 32. The first electrode plate 31 is placed on the second electrode plate 32 so that the lower surface of the first electrode plate 31 is in close contact with the upper surface of the second electrode plate 32.

[0025] The first electrode plate 31 and the second electrode plate 32 are made of, for example, a piezoelectric element, which is a type of ceramic. The first electrode plate 31 and the second electrode plate 32 are electrically connected to a high-frequency power supply 39.

[0026] The water supply unit 250 is used to supply cleaning water 500 to the second chamber 222 between the ultrasonic vibration plate 30 and the jet nozzle 241 inside the case 21 .

[0027] The water supply unit 250 is provided at the lower end of the cylindrical portion 22 in the case 21. The water supply unit 250 has a connection portion 251 provided on the outer wall of the cylindrical portion 22, a ring water passage 252 communicating with the connection portion 251, and a ring supply port 253 serving as a supply port extending from the ring water passage 252 to the second chamber 222 inside the cylindrical portion 22.

[0028] The water supply pipe 16 is connected to the connection part 251. The connection part 251 supplies the cleaning water 500 that flows in from the water supply source 19 via the water supply pipe 16 to the ring water channel 252.

[0029] The ring water passage 252 is a circumferential pipe, and is provided in the side wall at the lower end of the cylindrical portion 22 in the shape of a ring that surrounds the entire circumference of the second chamber 222. A portion of the ring water passage 252 is connected to the connection portion 251, and is configured so that cleaning water 500 is supplied from the water supply source 19 via the water supply pipe 16 and the connection portion 251. The cleaning water 500 supplied to the ring water passage 252 spreads around the entire circumference of the ring water passage 252 and is supplied into the interior of the second chamber 222 from the ring supply port 253.

[0030] The ring supply port 253 is opened in a ring shape in the second chamber 222, which is a water reservoir. Specifically, the ring supply port 253 is a ring-shaped slit formed so as to extend obliquely upward in the side wall of the cylindrical portion 22 from the entire circumference of the ring water channel 252 toward the second chamber 222, and is opened below the ultrasonic vibration plate 30 in the second chamber 222. The ring supply port 253 supplies water to the second chamber 222 from the outer periphery toward the center of the ultrasonic vibration plate 30, along the concave spherical surface 33 of the second electrode plate 32.

[0031] The control unit 7 shown in FIG. 1 controls each member of the spinner cleaning mechanism 1 to perform a cleaning operation on the wafer 100 held on the spinner table 10. The cleaning operation of the wafer 100 by the spinner cleaning mechanism 1 will be described below.

[0032] First, an operator places the wafer 100 on the holding surface 12 of the spinner table 10. Thereafter, the control unit 7 activates a suction source (not shown) to apply suction force to the holding surface 12. As a result, the holding surface 12 holds the wafer 100 by suction.

[0033] Thereafter, control unit 7 rotates spinner table 10 in the direction of arrow 401 using spinner table rotation mechanism 14. Control unit 7 also rotates rotation shaft 18 as shown by arrow 402 using rotation motor 17, thereby moving ultrasonic water jetting device 20 from the retracted position outside spinner table 10 to above wafer 100. As a result, jet nozzle 241 of ultrasonic water jetting device 20 faces upper surface 101 of wafer 100.

[0034] Thereafter, the control unit 7 starts sending out cleaning water 500 from the water supply source 19. The cleaning water 500 passes through the water supply pipe 16 and is supplied to the ring water passage 252 via the connection part 251 of the water supply unit 250 shown in FIG. 2. The cleaning water 500 supplied to the ring water passage 252 spreads around the entire circumference of the ring water passage 252. The cleaning water 500 is then supplied (sprayed) from the ring supply port 253 into the second chamber 222.

[0035] Here, the ring supply port 253 is a ring-shaped slit that extends obliquely upward from the entire circumference of the ring water channel 252 toward the second chamber 222, and is opened below the ultrasonic vibration plate 30 within the second chamber 222. Therefore, the cleaning water 500 supplied from the ring supply port 253 flows along the concave spherical surface 33 of the second electrode plate 32, from the outer periphery of the concave spherical surface 33 toward the center, and is accumulated in the second chamber 222.

[0036] 2 and 3, which shows the concave spherical surface 33 from above, cleaning water 500 supplied from the ring supply port 253 flows along the concave spherical surface 33 from the entire outer periphery of the concave spherical surface 33 toward the center 331, and is supplied to and stored in the second chamber 222. In other words, the cleaning water 500 that flows from the outer periphery of the concave spherical surface 33 toward the center 331 flows downward from the center 331 and is stored in the second chamber 222.

[0037] Then, within the second chamber 222, a portion of the cleaning water 500 forms a vortex within the second chamber 222, as shown by arrow 302 in Figure 2, while another portion of the cleaning water 500 flows down from the center of the concave spherical surface 33 toward the nozzle 241 along the center line 310 of the second chamber 222, which passes through the center 331 of the concave spherical surface 33 and the nozzle 241, as shown by arrow 303, and is sprayed downward from the nozzle 241.

[0038] The amount of cleaning water 500 in the second chamber 222 is maintained at a predetermined amount by continuously supplying a predetermined amount of cleaning water 500 from the water supply source 19. In this embodiment, for example, the control unit 7 supplies a larger amount of cleaning water 500 than the amount of cleaning water 500 sprayed from the spray nozzle 241 to the second chamber 222 via the ring supply port 253.

[0039] At this time, the control unit 7 also jets ultrasonic water obtained by propagating ultrasonic vibrations through the cleaning water 500 from the jetting port 241.

[0040] Specifically, the control unit 7 controls the high-frequency power supply 39 to supply high-frequency power to the first electrode plate 31 and the second electrode plate 32 of the ultrasonic vibration plate 30. That is, the control unit 7 repeatedly turns on and off the application of voltage at a predetermined frequency (for example, 1 MHz to 3 MHz) by the high-frequency power supply 39, thereby generating an expansion and contraction movement in the up and down direction in the first electrode plate 31. This expansion and contraction movement then becomes mechanical ultrasonic vibration.

[0041] The second electrode plate 32 resonates with the vibration of the first electrode plate 31, and thereby propagates ultrasonic vibrations 600 from the concave spherical surface 33, which is a gently concave surface when viewed from the nozzle 241 side, to the cleaning water 500 stored in the second chamber 222. In addition, the ultrasonic vibrations 600 propagated from the concave spherical surface 33 to the cleaning water 500 are concentrated toward the nozzle 241.

[0042] The ultrasonic vibrations 600 are focused on the upper surface 101 of the wafer 100, which is positioned at a predetermined position, for example, within a range of several millimeters to several tens of millimeters below the injection port 241, and are concentrated at this position. That is, the focal point of the ultrasonic vibrations 600 is formed on the upper surface 101 of the wafer 100 shown in FIG.

[0043] By such propagation of ultrasonic vibrations, ultrasonic water, which is cleaning water 500 propagated with ultrasonic vibrations 600, can be sprayed from the spray nozzle 241 toward the top surface 101 of the wafer 100. Then, the top surface 101 of the wafer 100 is cleaned by this ultrasonic water.

[0044] As described above, in this embodiment, in the ultrasonic water injection device 20 of the spinner cleaning mechanism 1, the cleaning water 500 supplied from the ring supply port 253 into the second chamber 222, which is the water reservoir, flows along the concave spherical surface 33 from the outer periphery toward the center of the concave spherical surface 33, as shown by arrow 301 in Figure 2, and is supplied to the second chamber 222.

[0045] Therefore, even if air accumulates near the center of the downward-facing concave spherical surface 33, the air can be removed from the concave spherical surface 33 by the water flow of cleaning water 500 flowing from the outer periphery of the concave spherical surface 33 toward the center, and can be discharged from the injection port 241 together with the cleaning water 500.

[0046] In this way, in this embodiment, it is possible to prevent air from accumulating on the concave spherical surface 33 of the ultrasonic vibration plate 30. Therefore, the concave spherical surface 33 can effectively transmit ultrasonic vibrations to the cleaning water 500 stored in the second chamber 222, and ultrasonic water in which ultrasonic vibrations have been sufficiently propagated can be sprayed from the spray nozzle 241. Therefore, it is possible to prevent a decrease in the cleaning power of the ultrasonic water, and the wafer 100 can be effectively cleaned with the ultrasonic water.

[0047] In this embodiment, the water supply unit 250 may include an arc-shaped water channel 254 and an arc-shaped supply port 255 instead of the ring water channel 252 and the ring supply port 253, as shown in FIGS.

[0048] Arc-shaped water channel 254 is a semicircular pipe that is provided within the side wall at the lower end of tubular portion 22 so as to surround half the circumference of second chamber 222. A portion of arc-shaped water channel 254 is connected to connecting portion 251, and is configured so that flush water 500 is supplied from water supply source 19 via water supply pipe 16 and connecting portion 251. Flush water 500 supplied to arc-shaped water channel 254 spreads throughout the entire arc-shaped water channel 254 and is supplied into second chamber 222 from arc-shaped supply port 255.

[0049] The arc-shaped supply port 255 opens semicircularly into the second chamber 222, which is a water reservoir. Specifically, the arc-shaped supply port 255 is an arc-shaped slit formed so as to extend obliquely upward within the side wall of the tubular portion 22 from the entire arc-shaped water channel 254 toward the second chamber 222, and opens below the ultrasonic vibration plate 30 within the second chamber 222. The arc-shaped supply port 255 supplies water to the second chamber 222 from the outer periphery toward the center of the ultrasonic vibration plate 30, along the concave spherical surface 33 of the second electrode plate 32.

[0050] 4 and 5 , cleaning water 500 supplied from arc-shaped supply port 255 flows along concave spherical surface 33 from half the outer periphery of concave spherical surface 33 toward center 331, and is supplied to and stored in second chamber 222. In this case, cleaning water 500 passes through center 331 and reaches end 332 of concave spherical surface 33 that is farther from arc-shaped supply port 255, and then flows downward from end 332 to be stored in second chamber 222.

[0051] Then, within the second chamber 222, a portion of the cleaning water 500 forms a vortex within the second chamber 222, as shown by arrow 305 in Figure 4, while another portion of the cleaning water 500 flows down along the inner wall of the nozzle portion 23 from the end 332 of the concave spherical surface 33 towards the outlet 241, as shown by arrow 306, and is sprayed downward from the outlet 241.

[0052] Furthermore, the arc-shaped water channel 254 may be a pipe that is shorter than a semicircular pipe, and the arc-shaped supply port 255 may also open to the second chamber 222, which is a water reservoir, at a length that is shorter than a semicircular pipe. In this case, as shown by arrow 307 in Fig. 6 , cleaning water 500 supplied from the arc-shaped supply port 255 flows along the concave spherical surface 33 from a part of the concave spherical surface 33 toward the center 331, and is supplied to and stored in the second chamber 222. In this case as well, the cleaning water 500 passes through the center 331 and reaches the end 332 of the concave spherical surface 33 that is farther from the arc-shaped supply port 255, and then flows downward from this end 332 to be stored in the second chamber 222. A plurality of pores may be arranged in the circumferential direction.

[0053] In this case, too, a portion of the cleaning water 500 forms a vortex within the second chamber 222, as shown by arrow 305 in Figure 4, while another portion of the cleaning water 500 flows down along the inner wall of the nozzle portion 23 from the end 332 of the concave spherical surface 33 toward the outlet 241, as shown by arrow 306, and is sprayed downward from the outlet 241.

[0054] 4 to 6, cleaning water 500 supplied into second chamber 222 flows along concave spherical surface 33 from the outer periphery toward the center of concave spherical surface 33, so that air accumulated in concave spherical surface 33 can be removed by the flow of cleaning water 500 and discharged together with cleaning water 500 from outlet 241. Therefore, air is prevented from accumulating in concave spherical surface 33, and ultrasonic vibrations can be effectively transmitted to cleaning water 500 accumulated in second chamber 222 by concave spherical surface 33.

[0055] Furthermore, the ultrasonic water jetting device 20 according to this embodiment can also be applied to devices other than the spinner cleaning mechanism 1. For example, the ultrasonic water jetting device 20 can also be used in the so-called KABRA process. The KABRA process is a processing technology in which a laser is continuously irradiated vertically from the top surface of an ingot to form a separation layer (KABRA layer) in the ingot, and then a portion of the ingot is peeled off from this KABRA layer to form a wafer. By using the ultrasonic water jetting device 20 to spray ultrasonic water onto the ingot on which the KABRA layer has been formed, the portion of the ingot can be easily peeled off.

[0056] Furthermore, the ultrasonic water jetting device 20 can also be used for so-called laser lift-off processing. Laser lift-off processing is a processing technique in which a high-power laser is irradiated onto a workpiece to heat and decompose the interface of the workpiece, and this interface serves as a boundary to peel off a portion of the workpiece into a wafer. By using the ultrasonic water jetting device 20 to spray ultrasonic water onto the workpiece where an interface has been formed, a portion of the workpiece can be easily peeled off.

[0057] The concave spherical surface 33 of the ultrasonic vibration plate 30 (second electrode plate 32) may be formed in a dome shape that is a part of a substantially spherical surface, or may be formed in a dome shape that is the inner surface of a mortar. In other words, the concave spherical surface 33 may be configured so that ultrasonic vibrations are concentrated toward the injection port 241.

[0058] In this embodiment, the nozzle portion 23 of the case 21 is formed in a conical cylindrical shape whose diameter tapers toward the injection port 241. In this regard, the nozzle portion 23 may also be in a cylindrical shape whose diameter does not taper toward the injection port 241. [Explanation of symbols]

[0059] 1: spinner cleaning mechanism, 7: control unit, 10: spinner table, 11: porous member, 12: holding surface, 13: frame body, 14: spinner table rotation mechanism, 16: water supply pipe, 17: turning motor, 18: pivot shaft, 19: water supply source, 20: ultrasonic water jetting device, 21: case, 22: cylindrical part, 23: nozzle part, 24: top plate, 25: fixture, 30: ultrasonic vibration plate, 31: first electrode plate, 32: second electrode plate, 33: concave spherical surface, 34: flange portion, 39: high frequency power source, 100: wafer, 101: upper surface, 102: lower surface, 221: first chamber, 222: second chamber, 231: base portion, 232: first elastic member, 233: fixing member, 234: second elastic member, 241: injection port, 250: water supply section, 251: connection section, 252: ring water channel, 253: ring supply port, 254: Arc-shaped waterway, 255: Arc-shaped supply port, 300: Ultrasonic diaphragm, 331: Center, 332: End, 600: Ultrasonic vibration

Claims

1. An ultrasonic water jetting device that jets ultrasonic water by propagating ultrasonic vibrations, a cylindrical water reservoir that temporarily stores water supplied from a water supply source; an injection port for injecting the water from a lower portion of the water reservoir; a dome-shaped ultrasonic vibration plate disposed above the water reservoir, facing the injection port, and having a concave spherical underside; a water supply unit having a supply port that supplies water to the water reservoir along the concave spherical surface from the outer periphery of the ultrasonic vibration plate toward the center; Equipped with the supply port extends obliquely upward toward the water reservoir and opens below the outer periphery of the ultrasonic vibration plate on the inner wall of the water reservoir, supplying a larger amount of water from the supply port to the water reservoir than the amount of water discharged from the injection port; The water flows along the concave spherical surface from the outer periphery toward the center thereof and is collected in the water reservoir. ultrasonic water obtained by propagating ultrasonic vibrations through the water is jetted from the jetting port; Ultrasonic water injection device.

2. the supply port is a ring supply port that opens in a ring shape into the water reservoir portion, The water supplied from the ring supply port to the water reservoir flows along the concave spherical surface from the entire outer periphery toward the center, and is collected in the water reservoir. The water is caused to flow downward from the center of the concave spherical surface toward the nozzle; ultrasonic water obtained by propagating ultrasonic vibrations through the water is jetted from the jetting port; 2. The ultrasonic water jetting device of claim 1.

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