Immersion Cooling Platform

Abstract

To provide a computing system and a cooling system which utilize pressure and / or steam management and is immersed and cooled.SOLUTION: A two-phase immersion cooling system in which a heat generation computer component vaporizes a dielectric fluid in its liquid phase is used to condense the dielectric fluid back to the liquid phase to cool a computer component. The system operates below atmospheric pressure by using a pressure control vessel and a pressure controller. The system exerts influence on a temperature at which the dielectric fluid is vaporized by controlling operating pressure, and thereby achieves performance that increased from a given computer component 170. A self-heating type computing system is formed by utilizing an internal robot arm 230 and a slot-in type computing component.SELECTED DRAWING: Figure 7-1

Description

[Technical Field]

[0001] The present invention relates to a computing system that is immersion cooled, i.e., pressure and / or vapor cooled. This invention relates to an immersion-cooled computing system that utilizes air management. Summary of the Invention

[0002] Conventional computing and / or server systems cool various components. Traditional liquid or water-cooled computers use air to cool the computer components. It uses a flowing liquid to remove heat from the computer, but there is no direct contact between the computer components and the liquid itself. The development of non-conductive and / or dielectric fluids will allow for direct contact with components. Computer components and other electronic parts must be dielectric or non-conductive to transfer heat to the liquid in contact with them. This allows for the use of immersion cooling, whereby the computer components can be immersed in a liquid. can be used to reduce the total energy required to cool the It also reduces the amount of space and equipment required.

[0003] In the embodiments of the present disclosure described below, steam and pressure management systems and power pipes The use of these systems has resulted in significantly improved computer systems that utilize liquid immersion cooling. These can be used individually or in combination to

[0004] Inventive embodiments of the present disclosure are directed to housing a liquid-immersion cooled computing system. In one embodiment, the pressure-controlled vessel is a heat-generating condenser. a liquid dielectric fluid in a sufficient amount to substantially immerse the computer components, and an atmospheric gas-containing dielectric Embodiments also include a method for cooling a gas dielectric fluid to convert it into a liquid dielectric fluid. The disclosed pressure management system further comprises a condensation system. This allows the dielectric fluid to evaporate and the computing The temperature at which the system operates is reduced. The disclosed embodiments provide an improved thermal management system. This allows for higher density of computer components and / or higher performance of computers. do. [Brief explanation of the drawings]

[0005] [Figure 1] FIG. 1 shows a schematic diagram of a pressure controlled vessel according to an example embodiment. [Figure 2] FIG. 2 shows a schematic diagram of a pressure controlled vessel according to an example embodiment. [Figure 3] FIG. 3 shows an external view of an exemplary embodiment of the pressure controlled vessel 110. [Figure 4] FIG. 4 illustrates an exemplary embodiment of a superstructure including multiple pressure-controlled vessels. [Figure 5] FIG. 5 illustrates an example data center embodiment showing multiple pressure-controlled vessels connected to a central power supply. [Figure 6] FIG. 6 illustrates an example data center embodiment showing multiple pressure-controlled vessels connected in series with one another. [Figure 7-1] 7A and 7B illustrate an example embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. [Figure 7-2]Figure 7C illustrates an example embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. Figure 7D illustrates an example embodiment of a cooled computing system having an internal robotic arm, an airlock, and an external robotic arm. [Figure 8A] FIG. 8A shows an exemplary embodiment of a rack system. [Figure 8B] FIG. 8B illustrates an exemplary embodiment of a rack system. [Figure 8C] FIG. 8C illustrates an exemplary embodiment of a rack system. [Figure 9A] FIG. 9A shows an exemplary embodiment of a chassis for mounting various components. [Figure 9B] FIG. 9B shows an exemplary embodiment of a chassis for mounting various components. [Figure 9C] FIG. 9C shows an exemplary embodiment of a chassis for mounting various components. [Figure 9D] FIG. 9D shows an exemplary embodiment of a chassis for mounting various components. [Figure 9E] FIG. 9E shows an exemplary embodiment of a chassis for mounting various components. [Figure 9F] FIG. 9F shows an exemplary embodiment of a chassis for mounting various components. [Figure 9G] FIG. 9G shows an exemplary embodiment of a chassis for mounting various components. [Figure 10A] FIG. 10A shows an exemplary embodiment of a pressure controlled vessel. [Figure 10B] FIG. 10B shows an exemplary embodiment of a pressure-controlled vessel. [Figure 10C] FIG. 10C shows an exemplary embodiment of a pressure-controlled vessel. [Figure 10D] FIG. 10D shows an exemplary embodiment of a pressure-controlled vessel. [Figure 10E] FIG. 10E shows an exemplary embodiment of a pressure-controlled vessel. [Figure 10F]FIG. 10F shows an exemplary embodiment of a pressure-controlled vessel. [Figure 11] FIG. 11 illustrates an exemplary cooling and steam management system for a pressure controlled vessel. [Figure 12A] FIG. 12A shows another embodiment of the container. [Figure 12B] FIG. 12B shows another embodiment of the container. [Figure 12C] FIG. 12C shows another embodiment of the container. [Figure 12D] FIG. 12D shows another embodiment of the container. [Figure 12E] FIG. 12E shows another embodiment of the container. [Figure 13] FIG. 13 shows an example of a self-contained container. [Figure 14] FIG. 14 shows an example of an external housing for a self-contained container. [Figure 15A] FIG. 15A shows an exemplary magazine located on a platform that can protrude from the container. [Figure 15B] FIG. 15B shows an exemplary magazine located on a platform that can protrude from the container. [Figure 15C] FIG. 15C shows an exemplary magazine located on a platform that can protrude from the container. [Figure 15D] FIG. 15D shows an exemplary magazine located on a platform that can protrude from the container. [Figure 16] FIG. 16 illustrates a vapor recovery system according to an example embodiment. [Figure 17] FIG. 17 illustrates an example embodiment of a rack power distribution system. DETAILED DESCRIPTION OF THE INVENTION

[0006] In the following description, specific examples are provided to provide a thorough understanding of the presently disclosed embodiments. Specific details such as quantity, size, arrangement, configuration, components, etc. are described, but this disclosure does not limit the scope of the present disclosure. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Therefore, details regarding such considerations and the like are provided only to the extent that such details are necessary to obtain a complete understanding of the present disclosure. are omitted because they are not necessary for the purpose and are within the skill of those skilled in the art.

[0007] The devices, components, systems, and subsystems of the following several disclosed embodiments are commercial products. This disclosure does not imply that such components may be developed and / or sold under specific trade names. that the invention may be implemented with many similar components, whether or not they are part of a specific product name; The features and / or invention characteristics associated with the elements are not necessary to practice the disclosed invention. It will be clear to those skilled in the art that

[0008] Dielectric fluid One aspect of immersion cooling is a thermally conductive but electrically substantially non-conductive or substantially Use of dielectric fluids. Examples of such fluids include Novec 7100 from 3M (trademark ), but the inventions described The description is not limited to a particular dielectric fluid. Depending on the immersion fluid, the All of the computers in the disclosed system have a desired boiling point at which they operate. The data components and other aspects are preferably not fusible and, if not, dielectric. It is made of a material that does not break down when in contact with the fluid in the pressure-controlled vessel. The boiling point of the dielectric fluid at subatmospheric pressure is less than about 100°C, less than about 80°C, less than about 60°C, It may be less than about 50° C. or even lower. In some embodiments, the dielectric flow at standard atmospheric pressure The boiling point of the body may be greater than about 60°C, greater than about 40°C, greater than about 30°C, or greater than about 20°C. Certain embodiments of the fluid generally have a low vapor pressure. is a fluorocarbon and / or a fluorinated ketone. Particular embodiments of the dielectric fluid are , (CF3)2CFCF2OCH3, C4F9OCH3 or CF3CF2CF2CF 2OCH3, or a similar chemical formula. Contains fluoroethers, methoxy-nonafluorobutane.

[0009] Other desirable properties of the immersion cooling fluid include low toxicity, non-flammability, and / or low surface tension. In certain embodiments, the immersion cooling fluid is at a pressure and temperature suitable for immersion cooling. computer components and / or the connections, wiring, cables, and enclosures associated with the computer components Some dielectric fluids have a pH in the range of about 1.8 to about 8. It has a dielectric constant of about 1.5 and a dielectric strength of about 15 megavolts per meter (MV / m). In some embodiments, the MV / m is at least about 5 MV / m, at least about 8 MV / m, or at least about 10 MV / m. MV / m or at least about 12 MV / m. The fluid may have a dielectric strength of up to about 3 MV / m, up to about 5 MV / m, or up to about 8 MV / m. In the disclosed embodiment, any liquid in contact with computer components 170 is Do not damage computer components at specified application intervals and conditions. It has a sufficiently high dielectric strength so that

[0010] Some dielectric fluids have a dielectric constant of at least about 10 W / cm 2 , at least about 15 W / cm 2 , few At most about 18W / cm 2 or at least about 20 W / cm 2It has a critical heat flux of The maximum electric current is about 15 W / cm 2 , up to about 10W / cm 2 , maximum of about 8W / cm 2 or a maximum of approximately 5W / cm 2 has a critical heat flux of

[0011] FIG. 1 shows a schematic diagram of a cooled computing system 110 according to an example embodiment. The disclosed cooled computing system 110 (or computing system , system, vessel or pressure controlled vessel, all of which may be used interchangeably. An embodiment cools computer components 170 by immersing the components in a bath of fluid. The liquid dielectric fluid 140 may be used to cool the electrical current as it passes through the component 170. As the component 170 heats up, the performance of the component The components will degrade or become damaged to the point of failure. It is advantageous to maintain the cooling components at a stable, relatively low temperature. The computer components 170 may be heated to temperatures below about 80°C, below about 70°C, below about 65°C, below about 60°C. In one embodiment, the computer component 170 may be maintained at or below about 55°C. The temperature may be maintained at above about 60°C, above about 50°C, above about 40°C, above about 35°C, or above about 30°C. As the computer component 170 heats up, the heat is transferred to the liquid dielectric flow surrounding the component 170. When the liquid dielectric fluid reaches its boiling point, it transitions from the liquid phase to the gas phase. The component 1 in the dielectric fluid bath 142 is then transferred to the dielectric fluid bath 142 and rises out of the liquid bath 142. 70 may be generally maintained near the boiling point of the particular dielectric fluid 140 being used.

[0012] The liquid dielectric fluid is heated to its vaporization point at the pressure employed for a given application. When heated to a gaseous state, bubbles of dielectric vapor rise from the liquid bath 142 and enter the system 110. The vapor rises to the top of the condenser 130 where it is cooled to the condensation point. Depending on the configuration of the system 110, heating and cooling of the dielectric fluid from the liquid phase to the vapor phase to the liquid phase may occur. The cooling can generate convection currents as shown in FIG.

[0013] In one embodiment, the computer component 170 controls the liquid dielectric flow during system operation. In other words, the computer component 170 The upper part of the dielectric liquid 140 is below the level of the dielectric liquid 140. The dielectric fluid changes from a liquid to a gas phase, allowing tiny bubbles of the dielectric fluid to penetrate into computer components. It should be clear that such components will still be in contact with the liquid phase dielectric. In some embodiments, the computer component is considered to be completely immersed in the conductive fluid. The element 170 may be immersed in the liquid phase of the dielectric fluid 140. In one exemplary embodiment, Including but not limited to motherboards, chips, servers, cards, blades, GPUs or CPUs of computer components, including any part of the U and / or any peripheral components If any part is in direct contact with the liquid phase dielectric fluid 140, the computer component is considered to be immersed. In a particular embodiment, computer component 170 The computer component 1 may be at least partially immersed in the dielectric fluid 140 in the liquid phase. If 70 is not immersed but is sufficiently cooled by dielectric vapor, the computer component is considered to be at least partially immersed.

[0014] In some existing immersion cooling systems, the fluid is constantly boiling, so the dielectric fluid Failure to add dielectric fluid to reservoir 142 will result in the reservoir The height of the dielectric fluid at 142 is such that the components are exposed to a gaseous atmosphere and are not adequately cooled. This can result in degradation or damage to the component 170. possible.

[0015] In some embodiments, the fluid management system may include a dielectric fluid in its liquid state. There are several modes of operation that can be considered: (1) when the dielectric fluid is stored; (2) initial fill, which is the process by which additional fluid is added to the vessel; (3) continuous leveling, which is a process in which excess fluid is removed from a vessel; (4) extraction, which is the process of fluid being diverted and placed in a storage system; and Active filtration is a process in which the air is continuously circulated through the system to ensure the removal of any particulates. It may include

[0016] In one embodiment, the first three fluid management challenges are addressed: initial fill, continuous leveling, Inlet and outlet withdrawal can be accomplished entirely through the same set of piping, pumps and valves. Dedicated tanks for storing liquid refrigerants are being treated for new fluids and vapors that have been removed. The set of pipes and pumps can be used for storage of excess fluid that is recondensed into During filling and leveling, the refrigerant (or dielectric fluid) is transferred from the storage system to the vessel, and the withdrawal It can be used to transport the material from the container back to the storage system during operation.

[0017] In one embodiment, the fourth of the fluid management challenges, namely, operating filters, The filtering can be achieved by a series of skimmers and / or filters. It can be a large particle filter located in the bottom. The purpose of this filter is to filter out particles that are too large for later stages. The second objective is to prevent particles that cannot be handled from entering the rest of the system. The stage is a medium particulate filter located in-line in the piping system between the first and third stages. This second stage medium particulate filter can be used to filter out particles that are too small for the first stage filter. It cannot remove particles that are too large for the third stage filter to handle. A small barrel filter can be used to remove the ions. It may consist of one or more parallel filters with supports for the filter configuration. In this paper, a specific type of filter is used to analyze the fluid after it has been exposed to and placed in the container environment. It is dedicated by working with a set of hardware components that Different hardware and / or components can be used to improve the longevity and effectiveness of the dielectric fluid. different types of particulates and particles that may need to be filtered to ensure and chemicals are more likely to be produced.

[0018] Pressure Management Generally, the immersion cooling fluid must be kept free of dust, water and / or other contaminants. Since the computer components 170 are in direct contact with the immersion cooling fluid 140, only Even minor contaminants can short out or damage computer components. Water or water vapor that can contaminate a reactive fluid will, as it becomes contaminated, Although the dielectric strength of the dielectric fluid is not reduced, it can reduce its dielectric properties, including its dielectric strength. If this occurs, computer components may short out or otherwise be damaged during operation. One way to reduce contamination is to maintain the pressure slightly above atmospheric pressure or higher. The objective of the present invention is to operate an immersion cooling system in an enclosure where the cooling system is installed.

[0019] As the computer component 170 operates, the The heat generated by the immersion cooling system causes some of the dielectric fluid 140 to evaporate into a gas. When the gas is contained within a substantially sealed housing, this evaporation is typically Increase atmospheric pressure. Pressure relief valves, expansion enclosures and / or other techniques may be used to Limit the pressure increase and / or maintain the pressure at or slightly above atmospheric pressure. It can be used to maintain pressure within the enclosure. Maintaining the immersion cooling of computing systems is essential for maintaining the integrity of the system. This may help reduce infiltration.

[0020] The current embodiment is a sealed pressure-controlled vessel 110 (or cooled computing system 110) to provide a computing component 170 and immersion cooling equipment, and associated The pressure-controlled vessel contains the power supply, networking connections, and wiring connections. In contrast to the pressure control vessel 110, at least a slight vacuum is maintained, thereby 1. Lowering the boiling point of the dielectric fluid 140 to a temperature below its boiling point at standard atmospheric pressure. can be done.

[0021] By operating the computing and immersion cooling system under vacuum, the components The dielectric fluid 170 can be maintained at a reduced low pressure boiling point of the dielectric fluid 140. Allowing electricity to flow through various components 170 resulting in greater component performance By controlling the pressure in the pressure control vessel 110, Thus, the boiling point of the dielectric fluid 140 can also be controlled, allowing the same fluid 140 to be used in a wider range of applications. Many embodiments benefit from lower temperatures. However, there is an ideal range for a particular computer component 170, and temperatures below that range By controlling the pressure in the pressure controlled vessel 110, The boiling point of the immersion cooling fluid 140 may also be controlled. In certain embodiments, the disclosed pressure management system The system is used when a computing system is started up, shut down, or undergoes other changes. It is used to dynamically control the pressure and thereby the boiling point of the dielectric fluid 140 depending on the conditions. This may also be done.

[0022] Operating in a pressure-controlled vessel 110 below atmospheric pressure reduces the boiling point of the dielectric fluid 140. In addition to lowering the temperature, the computer components 170 themselves can dissipate heat more efficiently. The liquid dielectric fluid 140 may be modified to transmit from and to the dielectric fluid 140. By increasing the surface area of ​​the component 170, e.g., the chip, exposed to the Heat transfer between the element 170 and the reservoir 142 of dielectric fluid 140 can be increased. An exemplary device for this purpose may be a copper boiler or a copper disk, which may be used in conjunction with other computers. The chip may be attached to the data component 170. In certain embodiments, the adhesive used may be , will be selected based on its heat transfer capabilities and its solubility in the dielectric cooling fluid. Suitable adhesives exhibit high thermal conductivity and low solubility in the selected dielectric fluid.

[0023] FIG. 1 shows a schematic diagram of an exemplary embodiment of the disclosed computing system. An embodiment of the system includes a pressure-controlled vessel 110 (or a cooled computing system 110). 10), a pressure controller 150, at least a volume of dielectric fluid 140 and a condensation structure. 130, as well as the desired computer components 170. The force system may be configured to maintain a desired degree of vacuum. including, but not limited to, power, data, networking, cooling and / or communication systems While allowing multiple penetrations into the pressure control vessel 110 for various connections, including systems It may be configured to maintain a negative pressure. Some embodiments may have airtight and / or marine-grade connections. Operate the computing system in a pressure-controlled vessel 110 at sub-atmospheric pressure. Making it work requires a series of changes to the system as a whole. These changes are: Some are described below and some will be immediately apparent to those skilled in the art.

[0024] 3 shows an exterior view of an exemplary embodiment of the pressure-controlled vessel 110. In one embodiment, the disclosed The pressure control vessel 110 is at least 2 feet high, at least 3 feet high, Both are 4 feet tall or at least 5 feet tall. The container may be up to approximately 3 feet tall, up to approximately 4 feet tall, or up to approximately 5 feet tall. is.

[0025] In certain embodiments, the pressure-controlled vessel has a volume of at least about 100 cubic feet, at least Approximately 150 cubic feet, at least approximately 200 cubic feet, at least approximately 250 cubic feet at least about 300 cubic feet, at least about 350 cubic feet, or at least It also has an internal volume of about 400 cubic feet.

[0026] In one embodiment, the pressure control vessel has a vertical flow of fluid dielectric of approximately 12 inches during operation. The dielectric fluid vapor is configured to contain the dielectric fluid vapor within the body and approximately 36 inches vertically. In this state, the ratio of gas volume to liquid volume is such that the gas is transported to the condensing structure, generating convection and converting the vapor back to liquid. In some embodiments, the pressure-controlled vessel is configured to direct the dielectric vapor during operation. The volume of the liquid dielectric fluid is configured to contain a ratio of about 1:6 to the volume of the solid dielectric fluid. In another embodiment, the pressure-controlled vessel has a pressure of about 1000 psi per volume of gaseous dielectric fluid during operation. a volume of liquid dielectric fluid in a ratio of about 1:3, about 1:5, about 1:8, about 1:10, or about 1:15. It is configured to

[0027] In one exemplary embodiment, the pressure management system may include a pressure controller 150. The force controller 150 may be a vacuum source, for example, a pressure controller. The control vessel 110 may be connected to a vacuum pump. In some embodiments, the vacuum pump 150 may be remote and the vacuum may be conveyed to the pressure control vessel 110 using piping. In a preferred embodiment, a pressure sensor 180 is included within the pressure control vessel 110. It is used to adjust and / or maintain a desired negative pressure within the container 110. In one embodiment, The pressure sensor 180 and / or the pressure regulator 190 measure the pressure using the pressure sensor 180. The pressure in the force control vessel 110 is monitored and adjusted using a pressure regulator 190. The processor may be connected to:

[0028] Certain embodiments include an operator protection mechanism. In one exemplary embodiment, The protection mechanism will shut down if either the lid or the service panel to the pressure control vessel is not in place. It may be a locking mechanism that prevents the stem from moving. The data protection mechanism will immediately shut down if one of the doors or panels of the pressure control vessel is tampered with. A controller may be included to shut down power to the system. In addition, operator protection mechanisms are enhanced for deployments where sensitive data is contained within the vessel. A security configuration may be provided that allows normal operation without interrupting power to the system. Improves the effectiveness of disk protection mechanisms by ensuring that devices are inaccessible during operation. Furthermore, in some embodiments, a high level of assurance in efficiency can be achieved. The data protection mechanism uses a runtime stored encryption key to protect data stored on the pressure control vessel. It's fine.

[0029] In certain embodiments, in addition to denying unsafe access to the pressure controlled vessel: Sensors may be placed to verify that the system is operating as designed. The essential sensor package consists of a temperature sensor in the vapor space, a temperature sensor in the liquid space, This may include a humidity sensor in the vapor space and / or a pressure sensor in the vapor space. These sensor readings are used to ensure the system is operating in a safe and healthy manner. It may be monitored by software and / or a human operator for In an embodiment, the sensor data is recorded or later analyzed.

[0030] In some embodiments, additional sensors may be included within the vessel or superstructure (defined below). Such sensors may be used, for example, to detect leakage of dielectric fluid into the surrounding environment. Thermal imaging cameras by FLIR, VESDA, or other forms of smoke extraction designed to The device may include a detector and / or a refrigerant leak detector.

[0031] In some embodiments, the vessel and / or superstructure may include indicators regarding the operating status of the system. Indicator lights may also be provided.

[0032] The cooled computing system 110 may also be referred to as a pressure-controlled system 110. However, those skilled in the art will recognize that some, if not all, of the cooled computing systems 110 However, it is important to recognize that many benefits can be achieved without using a "pressure controlled system." do.

[0033] Steam Management System Immersion cooling systems can be operated in different ways. Some operate by continuously supplying immersion fluid directly to the Some operate by cooling the liquid to its maximum liquidus temperature. It can operate by boiling a liquid from its liquid phase into the vapor phase. An immersion cooling system that operates in this way is called a two-phase immersion cooling system. The reactive fluid is boiled and / or vaporized, and additional fluid is periodically added to replace the fluid lost to the atmosphere. Often substitutes.

[0034] The disclosed embodiment utilizes an immersion cooling system contained within a pressure-controlled vessel 110. This has the advantage that the dielectric fluid 140 is not lost even after being converted into gaseous form. In the sealed or substantially sealed pressure-controlled vessel 110, the gaseous dielectric fluid is A liquid that is condensed and actively used to cool the computing components 170 The dielectric fluid 140 is added back to the reservoir 142. The condensation step can be performed, for example, by Condensation can be carried out in any suitable manner by passing the treated water through a heat transfer pipe. The structure 130 may include heat sink fins and / or similar devices that increase the surface area of ​​the condenser. may be present, thereby allowing for greater and / or faster condensation of the gaseous dielectric fluid. In some embodiments, the treated water is at ambient temperature and is actively In other embodiments, the treated water is cooled by evaporative cooling, dry cooling towers and / or treatment The water may be cooled using other methods known in the art for cooling the water.

[0035] In one embodiment, there are two interfaces between the pressure controlled vessel and the external system. The first interface may be a treated water supply interface. The cooled treated water is delivered from the equipment that supplies it to the distribution manifold on the pressure control vessel. The second interface is the treated water return interface. This can be a pipe returning treated water to a facility that supplies cooled water. The treated water may be returned to the facility after flowing through the pressure control vessel and associated cooling components. Cooling components may include, for example, a condenser, condensing coils and / or radiators within the vessel, as well as, for example, motors. of any powered components, including motors, pumps and / or utility cabinets. It may include a coil to insulate heat from the exhaust. There may be two interfaces between the pressure control volume and the The two interfaces between the device and the external system may be similar or substantially similar.

[0036] In some embodiments, the location of the condensation structure 130 within the pressure-controlled vessel 110 is determined by the vapor phase dielectric constant. The condensation device may be configured to optimize the flow of condensing fluid to increase the rate and / or efficiency of condensation. In some embodiments, the geometry of the pressure control vessel 110 itself may affect the rate and / or efficiency of condensation. may be controlled to increase

[0037] As shown in Figures 1-3, in one exemplary embodiment, the pressure controlled vessel is approximately 10 feet long. , approximately 4 feet wide, and approximately 4 feet high. The tank 142 contains approximately 130 gallons of Nov The pressure control vessel 110 may be formed using an ec™ dielectric fluid 140. Leave a layer of liquid dielectric fluid approximately 12 inches deep in the immersion cooling tank at the bottom of the pressure control vessel. On the other hand, most of the volume of the pressure control vessel is gas. The ceiling of the pressure control vessel has a vertical structure. The ceiling and / or lid 120 is angled upward to allow the pressure control vessel to The condensation structure 130 is located at the side of the pressure control vessel 110. The condensation structure 130 in this exemplary embodiment is approximately 12 inches wide and 12 inches high. Approximately 24 inches and extends substantially the entire length of the pressure control vessel 110. includes a radiator such as a material with large surface area fins that is cooled using flowing process water. Some embodiments may additionally or alternatively include a heat exchanger.

[0038] As shown in FIG. 2, the structural arrangement within the pressure-controlled vessel 110 is such that the dielectric fluid vapor is The structural arrangement directs convection of the dielectric fluid vapor as it rises from the liquid bath 142. The convection current is directed towards the ceiling of the pressure control vessel, where a large surface area condensation structure 13 0 and recondenses into liquid form. In this embodiment, the total amount of dielectric fluid 140 is contained within this sealed house. By using convection to circulate the dielectric fluid vapor, the dielectric The disclosed embodiments can operate without a mechanical pump to circulate the reactive liquid. , thereby allowing the total energy usage of the disclosed system to be reduced.

[0039] Certain embodiments may require the pressure controlled vessel to be opened and / or the liquid dielectric to be opened. To enable redundant and robust control of the active fluid height, the system is started and / or shut down. Utilizing additional tanks and / or storage vessels of dielectric fluid that can be used during shutdown Good too.

[0040] FIG. 11 illustrates an exemplary cooling and steam management system 600 for the pressure controlled vessel 110. In this exemplary embodiment, the cooling and vapor management system 600 is configured to The cooling coil 132 may include a reservoir 611 of cooled treated water. After passing through the cooling coil 132, the treated water may proceed to treated water return reservoir 612. The vapor management system 600 also includes a tank 614 for the vapor reservoir and a tank 616 for the dielectric fluid reservoir. Tanks 614 and 615 may include, for example, a tank 615. During start-up and / or shutdown of the device, a dielectric fluid or vapor may be supplied. In the illustrated embodiment, tanks 614 and 615 are coupled via a condensation structure 616. If there is an excess supply of steam in tank 614, condensation structure 616 may remove the steam. and add it to the fluid reservoir tank 615 as a dielectric fluid.

[0041] In one embodiment, during operation, the pressure control vessel is maintained at approximately 3 psi below atmospheric pressure. , which lowers the boiling point of the dielectric fluid, thereby improving the boiling point of computer chips and other components. In one embodiment, the pressure controlled vessel 110 is heated to atmospheric pressure. at least about 2 psi lower than the pressure, at least about 4 psi lower than the pressure, at least about 6 psi lower than the pressure low, at least about 8 psi below, or at least about 10 psi below atmospheric pressure. can be.

[0042] In some embodiments, components may be selected that have some tolerance to pressure fluctuations. By adjusting the operating pressure of the system, the boiling point of the refrigerant and its It can withstand a wide range of pressures to allow operation over the approximate operating temperature of the entire system. Considering the nature of operation of two-phase systems, it is preferable to use components. Standard operating conditions for this configuration are ±4 PSIg. or during shutdown, a difference of 3 additional PSIg may be introduced. In some embodiments, these variables can be better controlled, making them more controlled and defined. System level adjustments can be made to keep the signal within the specified range.

[0043] In certain embodiments, the computer component 170 is at least about 3% above atmospheric pressure. Low pressure, pressure at least about 5% below atmospheric pressure, pressure at least about 10% below atmospheric pressure, at least about 15% lower pressure, at least about 20% lower pressure, at least about 25% lower pressure, Or operated at a pressure that is at least about 30% lower.

[0044] In some embodiments, the pressure-controlled vessel may be operated at a pressure of less than about 750 torr, about 710 torr, or less than about 750 torr. Less than about 650 torr, less than about 600 torr, less than about 550 torr, less than about 5 Maintained at or below about 400 torr, about 450 torr, about 400 torr, or less In some embodiments, the pressure controlled vessel is configured to provide a pressure of greater than about 650 torr, greater than about 600 torr, during operation. over torr, over about 550 torr, over about 500 torr, over about 450 torr, about 400 torr or above about 300 torr.

[0045] Some embodiments may employ a vapor scrubbing process to control the gas atmosphere within the pressure-controlled vessel. and / or utilize an initial purging process, which involves removing the gas atmosphere from the pressure-controlled vessel. Removes unwanted parts of the atmosphere such as air and water vapor. and other undesirable portions of the atmosphere can be separated based on the temperature at which the vapor condenses into a liquid. Due to the specialized properties and boiling points of dielectric fluids, many naturally occurring contaminants can be present in this manner. The removal of the fluid that is not readily condensable can be achieved by using the dielectric fluid. The fluid acts to maintain purity. The condensation point of the fluid is the same as that of the dielectric fluid at standard atmospheric pressure. More than approximately 20°C below the condensation point, or if the condensation point of the fluid is 10°C at standard atmospheric pressure If it is less than 1000 kJ / cm, it is not considered to be immediately condensable.

[0046] During maintenance, start-up and / or shutdown operations, the pressure control vessel is opened and / or or nitrogen gas to reduce the amount of dielectric fluid lost when exposed to atmospheric conditions. Any layer of inert gas may be introduced into the pressure-controlled vessel. The vapor management system 600 may include an inert gas tank 613, which stores inert gas. A gas can be provided to reduce the loss of the dielectric fluid.

[0047] Certain disclosed embodiments may include a substantially self-contained server and / or computing system. In some embodiments, specialized seals and / or connections may be provided to the pressure control volume. This can be used to reduce the total number of penetrations into the vessel 110. In some embodiments, the system To minimize penetrations into the pressure control vessel to reduce the possibility of leaks while under vacuum , power, water, vacuum and networking connections into a bundle of lines.

[0048] FIG. 4 illustrates an exemplary embodiment of a superstructure including multiple pressure-controlled vessels. In this embodiment, two pressure controlled vessels 110 are pre-assembled within the modular superstructure 210. This allows the embodiment to be prefabricated and substantially It can be delivered as a complete, self-contained system. Modular system may be connected to other modular embodiments of the disclosed computing system. In one embodiment, the modular superstructure 210 may be configured with a single power connection. It only requires a power connection and supplies the necessary voltages to computer components and / or other electronic parts. The device will be pre-wired with the appropriate electronics.

[0049] FIG. 5 illustrates an exemplary data center implementation showing multiple pressure-controlled vessels connected to a central power source. FIG. 6 illustrates an exemplary data center showing multiple pressure-controlled vessels connected in series with one another. In these exemplary embodiments, the pressure-controlled vessel 110 is It may or may not be located within a structure.

[0050] 7A-D show a cooled robot having an inner robot arm, an airlock, and an outer robot arm. 1 illustrates an exemplary embodiment of a computing system. A pressure controlled airlock is used to remove component 170 and transport the removed component to airlock 220. An internal robotic arm 230 contained within the vessel 110 may be used. , airlock 220 is used to control the pressure, atmosphere, dielectric fluid and / or or other conditions can be removed without substantially impairing or disturbing them. Once the element 170 is removed from the pressure controlled vessel 110, replacement components are installed in the airlock 220. The replacement component can then be introduced into the pressure controlled vessel 110 using the internal robotic arms. The server can be installed by a "slot-in" system such as a blade server or a chassis. This process is greatly facilitated by the use of components that can be installed in a " obtain.

[0051] Disturbances to the conditions within the pressure controlled vessel are detected by sensors located within the pressure controlled vessel, e.g. The disturbance can be detected by a pressure sensor. A large external force relative to the conditions in the pressure-controlled vessel can be indicated by a deviation of at least 10%. Disturbance is indicated by a deviation of at least 30% outside the normal range of operating conditions at that condition. obtain.

[0052] In certain embodiments, a self-contained diagnostic analyzes the performance of components within the pressure control vessel 110. A diagnostic program may be executed. If component 170 is not operating as desired, The robot arm 230 can be used to automatically remove and / or replace the components. In this manner, a self-healing, self-contained server and / or computing system In certain embodiments, such self-healing systems can significantly increase Shipped or delivered to remote locations using conventional methods to provide efficient computing power pre-fabricated and pre-wired to form a modular unit that can be delivered Requires limited setup and / or maintenance.

[0053] In one embodiment, the vapor is cooled to condense it from the gas state back into the liquid state. The first vapor management challenge is accomplished entirely within the closed system of the vessel through the use of condensing coils. The treated water is piped through a condensation coil inside the vessel. The shape and geometry of the vessel itself The shape of the coil promotes vapor flow from the vessel area to the coil area, and gravity draws out the recondensed liquid. This acts to return the water to the tank area.

[0054] In some embodiments, a second vapor management task is to monitor and maintain the internal pressure of the vessel. This problem is achieved through the use of an integrated pressure sensor in the vessel and the use of a purge system. In some embodiments, the purge system removes excess vapor from the container and directs it into the liquid storage tank. It is used to condense the water back into a liquid for storage in the refrigerator.

[0055] In some embodiments, the non-condensable components of the steam present during system start-up are controlled and removed. The third vapor management objective is accomplished through the same mechanism as the second objective. The system is designed to release any non-condensable gases from the system as it pressurizes during its initial start-up. It can be used to remove the body.

[0056] In one embodiment, a fourth vapor management challenge, controlling the inert gas overlay, is addressed by dedicated This can be achieved by using a nitrogen overlay supply system. The overlay is achieved by placing the refrigerant below the top of the vessel. to minimize refrigerant loss during periods when the vessel is opened to service components therein. A dedicated set of nitrogen storage tanks is connected to the dedicated set of layered pipes inside the vessel. The service piping allows for the addition of an inert overlay if the operator wishes to open the system. This gas, along with any other non-condensables, may be present during system startup. The overall steam management process is controlled by user commands and the system. Managed and monitored through condition-based control system software obtain.

[0057] Ballast Blocks In certain embodiments of the disclosed system, such as that shown in FIG. a deep reservoir portion 142 for containing a majority of the conductive fluid 140 and a wide shelf region 112 adjacent to the reservoir; It may include a board, card, chip, blade, and / or any other computer configuration. Element 170 is substantially contained within deep section 142 of pressure control vessel 110. 12 also contains a liquid dielectric fluid 140 and / or a dielectric fluid that is recondensed from the vapor phase to the liquid phase. The fluid 140 may be collected. In certain embodiments, the dielectric liquid in the pressure-controlled vessel 110 The depth of the can be increased by utilizing ballast blocks 160. The ballast blocks 160 are , are used to occupy unnecessary volume on the shelf, thereby The existing dielectric liquid 140 is removed and the liquid is then removed without the need to add additional dielectric liquid 140. In one embodiment, the ballast blocks 160 can raise the water level of the flow. The condensed liquid flows into the deep tank of the pressure control vessel without being obstructed by the ballast block 160. The ballast block 160 is configured to allow fluid to flow under the ballast block 160 so that the fluid can continue to flow into the ballast block 160. The riser legs 161 are included.

[0058] The ballast block 160 may be made of any material that does not interfere with the operation of the disclosed immersion cooling system. The ballast blocks may be made of materials including, but not limited to, metal, rubber, and silicone. and / or polymer-containing materials. Suitable materials are those that are substantially soluble in the dielectric fluid. Not possible. The block must be denser than the dielectric fluid, but it does not need to be solid. In a preferred embodiment, the blocks are arranged in a manner that makes them easier to handle and manipulate. Some ballast blocks 160 have handles or cutouts that allow them to be operated. An embodiment may include interlocking blocks so that the blocks can be stacked on top of each other in a fixed manner. The interlocking top and bottom sections allow the blocks to slide and or the risk of the block damaging nearby components if displaced from its desired position. In some embodiments, the bottom block does not impede fluid flow and provides a large volume. To occupy the block, a block is fixedly stacked on top of the bottom block, thereby The dielectric liquid level can be increased without the need for additional dielectric liquid to be added. The interlocking top has recesses on the bottom that align with the legs and / or risers so that the Includes parts.

[0059] In one embodiment, the ballast block 160 is located in the pressure controlled vessel 110 and / or the shelf 11. In another embodiment, the ballast block 160 is configured to span the entire length of the block. The lock may be of virtually any size that allows it to be handled. In this case, multiple modular ballast blocks can be installed in as large or small a volume as desired. In one embodiment, one ballast block may be configured to eliminate feet, about 3 feet long, about 4 feet long or more, about 6 inches wide, about 8 inches wide inch, width about 12 inches or more, and height about 1 inch, height about 3 inches, height about 6 inches It has exterior dimensions of approximately 8 inches or more and a height of approximately 8 inches or more.

[0060] superstructure The disclosed computing system comprises various components, all of which are shown in FIG. As shown, the superstructure 210 may be attached directly or indirectly to the physical superstructure 210. 210 includes any required electrical sensors, controls, power, fluid controls, pressure controls, and This allows for pre-wiring and pre-piping of electrical and / or communication systems, which is faster and simpler. Allows for field deployment and factory testing prior to delivery to customer.

[0061] The superstructure 210 is typically made from metal components and is skid mounted or It may be configured to be handled by a forklift, hoist or crane. In one embodiment, the superstructure 210 fits within a standard container to facilitate shipping. The superstructure 210 and associated components have a total capacity of approximately 58,000 liters. It is constructed to weigh less than 100 lbs, facilitating shipping without the need for special equipment. In one embodiment, the superstructure 210 and and related components are less than about 50,000 lbs, less than about 40,000 lbs, less than about 30,000 lbs In one embodiment, the superstructure 2 weighs less than about 20,000 lbs. 10 and related components are greater than about 5,000 lbs, greater than about 10,000 lbs, and greater than about 20,000 lbs. lbs or greater than about 30,000 lbs. Many embodiments may include multiple pressure-controlled vessels 110, sub-vessels, and / or sub-vessels. - Barrack 310 and associated immersion cooling equipment, and power transmission and distribution and networks It is large enough to contain the equipment necessary to manage the connections.

[0062] The overall design of the superstructure 210 is customizable to fit the needs of existing facilities. to accommodate the unique aspects of each deployment, including the size and number of interconnections for power and treated water. can be adjusted.

[0063] The control and management system for all of the components within the disclosed pressure controlled vessel is A preferred embodiment of the disclosed system includes: Necessary pumps, valves, regulators, steam management systems, pressure management systems and other related equipment All of the mechanical systems required to maintain and operate a two-phase immersion cooling environment, including all related components. Includes.

[0064] The superstructure 210 may be an open frame design, with side panels and access doors. This allows for deployment inside existing structures or off-site. The superstructure 210 may be modified to include weatherproof construction to withstand harsh environments. In one embodiment, the superstructure is a skid / module. It may be a framework.

[0065] Various systems, configurations and / or capabilities may be used to interface with other components of the pressure controlled vessel and the pressure controlled vessel. Any equipment that is designed to support, monitor and control the environment contained within or associated with the equipment. In some embodiments, such a system may be included in the superstructure 210. Among other things, fire detection and / or suppression capabilities, dedicated air conditioning and / or environmental controls This may include security configurations such as authentication capabilities, access control, and / or monitoring configurations.

[0066] Power System Some superstructure 210 embodiments may accept various means of electrical input and connect them to the superstructure. It is designed to connect to an existing electrical distribution system built into the structure. One configuration involves a 415V input to the main breaker, which then supplies the 415V AC input. The power is distributed to a series of power shelves that converts the power to a 12V DC output. In the preferred embodiment, this conversion is It is essentially a single conversion step, thereby eliminating the damage normally associated with such conversion. Traditional computer server locations typically consume a large amount of power from the incoming industrial This converts power from a high AC voltage such as 415V to a reduced AC voltage such as 120V. The conversion results in a loss of energy to heat. Under typical circumstances, this is about 6% of the energy And the 120V voltage can be a major source of energy loss for various computer components. This second conversion is then converted to DC current for use in the energy The second loss of about 6% is from energy to heat. By directly converting it into heat, the total loss of energy to heat can be reduced.

[0067] Another exemplary embodiment is a 400V AC to 480V DC power supply to a power shelf that converts a 480V AC input to a 48V DC output. This includes connecting an 80V input and a 48V DC output, which can then be connected to a 12V DC power supply. A series of relay voltage converters that convert various DC outputs including V, 5V, 3.5V, 3.3V and others Distributed to the source.

[0068] In some embodiments, there may be a single set of power supplies operating at different input and output voltages. There may be multiple power sources connected to the power supply. The exact configuration will depend on the needs of the particular equipment being installed. The specific design of the power system is adjusted to suit the application conditions. , to suit the needs of the particular environment in which the disclosed computing system is deployed. Customization can be achieved for both the power input and output to the system. This may include type, capacity and interface.

[0069] In some embodiments, the rack power distribution system may include a modular power system and / or a modular A set of one or more modular power systems may be included. The specific configuration may be any suitable configuration, particularly as long as it is capable of transmitting the desired amount and type of power to the rack. So, the modular power system can be used with one, two or even multiple power distribution lines. They can be configured in parallel or in series or a combination thereof to provide a path to the rack. The specific path may be direct or indirect, and the components involved, the amount of power, and If desired, the route to the rack may be This may involve distributing power to chassis located within the rack. The distributed power may be distributed according to configuration and components. The desired voltage may be transmitted at one or more desired voltages, which may vary depending on the , for example, 12V, 5V, and / or 3.5V. In some embodiments, the chassis If employed, it may employ one or more subsystems. The system may be configured with any desired sub-system that does not interfere with the desired amount and type of power transmitted to the rack. For example, a power-on-package subsystem may be employed. Such a package can receive AC current and transmit DC current, depending on what is desired. and / or vice versa. For example, a particularly useful power-on- Cage subsystems include AC208, 240, 380, 400, 415, 480 and / or Or it receives input power at 600 volts and converts that power directly to DC power, e.g., DC48V. It can be designed to convert

[0070] The modular power system or systems may be directly or indirectly supplied in any suitable manner. For example, a modular power system may be powered through a main power distribution system within the chassis. Depending on the type and quantity of power and other components, the chassis may be powered by a set of Using an interface such as a spring-loaded pin or other suitable connector interface Electrical continuity may be established between the power distribution path and the chassis itself, and the continuity interface connector and the desired server or other computer located on the chassis. The power supply may be established between any desired power input interface in the power supply component. In one embodiment, the power-on-package module is located in the chassis itself. This may be used within each chassis to directly convert the voltage to the appropriate level. It can be used for various types of power distribution, but may be particularly useful for 48V power distribution, for example. FIG. 17 illustrates an example embodiment of a rack power distribution system 950. In this example embodiment, The rack 310 is connected to an AC input 96 at an AC interface 311 of the rack 310. The power distribution system 950 generates DC output 320 and receives DC output 3 20 can be distributed among one or more chassis 400.

[0071] In one embodiment, reliable power is reliably supplied to computer components within a rack. To that end, some embodiments may select a particular input voltage. blades that can be supplied to provide the required output voltages to the blade and / or component level power supplies. Some embodiments use a level power supply or a computer component level power supply to provide redundancy. Each blade contains multiple power supplies to accommodate the

[0072] In some embodiments, one or more switches may require power. Appropriate interfaces connect to the backplane to provide rack-level communication to each blade. The switch may be a standard data center grade switch with a It distributes the voltage between the power rail and each of the blades. This can be achieved by a power rail and interface system with connectors, Located directly on the power supply input rail or between the power supply power leads and the rack level voltage distribution system The voltage is transmitted via a relay connector placed in the

[0073] In one embodiment, there are one or more power rails that distribute the main voltage along the bottom of the rack. This rail may be connected to one or more main power adjustment units, which are often located external to the pressure control vessel. The power is supplied from the power source and transmitted to each rack via a cable or bus bar system. The use of higher voltages at the power distribution level, e.g., 48 volts, reduces the need for power distribution systems. Reduced current carrying capacity required for efficient connection between distribution rail and load interface Can interface.

[0074] In one embodiment, two main power distribution systems located within the superstructure platform The first main distribution system is the Primary Equipment Power System (PEPS) and the second main distribution system is the The system is a Secondary Equipment Power System (SEPS). The purpose of the PEPS is to provide electrical services. The system provides electrical power to components within the enclosure. It receives input through the system and transmits it to the chassis, computer components and / or other critical A high-voltage, high-current distribution system that transmits power to the main power supply, which is responsible for supplying the necessary load equipment with the necessary current. Power enters the host structure at a specified point and is connected to the master service disconnect breaker. All power redundancy configurations used in electrical services and systems The element is upstream of this point. This input is, for example, 415 or 480 volts AC. The main equipment loads are supplied from the breaker panel downstream of the master disconnect breaker. It is driven by a power supply or rectifier.

[0075] The purpose of SEPS is to The primary objective of the secondary equipment infrastructure is to provide electrical services to all Since the components involved may assume a lower input voltage, the SEPS must be connected to the PEPS master service. Powered by a step-down converter connected via a secondary service disconnect upstream of the disconnect breaker It is possible.

[0076] This arrangement allows the SEP to be used even if primary power is not being transmitted to the rest of the system components. The upper structural support and infrastructure systems, including all of the components powered by S, are on. All management and control systems and steam control systems are capable of operating in accordance with the Aspects of the present invention may be capable of operating independently of the operation of the PEPS.

[0077] In some embodiments, an uninterruptible power supply (UPS) is provided as part of or in conjunction with the power distribution system. In addition to the UPS, the UPS provides protection in the event of a temporary interruption to the external power source. The disclosed computing system allows for continuous operation.

[0078] Components of the disclosed power distribution system include, but are not limited to, uninterruptible power supplies; DC power systems, AC power systems and / or power control and monitoring systems Such components may include, but are not limited to, any commercially available component. Vertiv products, such as Liebert and / or ChlorideUPS products, Al conversion online UPS, line interactive UPS, standby UPS, lithium UPS products may include single-phase or three-phase UPSs and combinations thereof. Other exemplary power distribution system components include, for example, Emerson Network Power wer Products, NetSureDC Power Systems, Vertiv, Liebert, Chl oride and / or NetSure power distribution units, as well as e.g. inverters, rectifiers, It may include associated components such as transfer switches and combinations thereof. Commercially available monitoring units, controller units and / or software that It may be included in the specific embodiment shown.

[0079] Pressure control vessel and pressure management system Embodiments of the disclosed system include a pressure The pressure controlled vessel 110 includes a reservoir 142 of dielectric cooling fluid 140, a vapor phase dielectric a condenser 130 having a cooling coil 132 for condensing the fluid into a liquid, and a computer configuration The pressure control vessel 110 is connected to the power supply 170 and the power supply 170 is connected to the power supply 170. Includes the physical mechanisms and / or equipment required to dispense the components.

[0080] During operation, the pressure controlled vessel 110 may be maintained at a slight vacuum. Various specialized connections for operating computing systems within the control vessel 110 It should be clear that further consideration must be given to the following:

[0081] Certain disclosed system embodiments penetrate panels and cable trays to route fiber. In addition to distributing the data to the block 310, a series of optical fiber media transport protocols (MTP) ) interface to allow fiber connection to the pressure controlled vessel 110. The arrangement reduces the total number of penetrations into the pressure control vessel 110, thereby reducing the likelihood of leaks in the vessel. Decrease.

[0082] Some embodiments of the pressure controlled vessel 110 include sensors to ensure safe operation. The sensor may include, but is not limited to, temperature sensors to ensure and / or automate system operation. Sensors, fluid height sensors, pressure sensors 180, gas partial pressure sensors, position sensors, electrical sensors The device may include a microphone and / or a camera.

[0083] In one exemplary embodiment, the temperature sensor is located within, but not limited to, the pressure controlled vessel 110. a sensor for measuring the temperature of the gas phase in a pressure-controlled vessel; sensors for measuring the temperature of the water and / or other process fluids, and / or The temperature sensor 170 may include sensors for measuring the temperature of other components, including the computer component 170. In some embodiments, thermocouples, thermistors and / or silicone sensors are used in computer configurations. In some embodiments, the system may be used to measure the temperature of the component itself. Information provided by the device and via device-provided APIs or HTTP or SNMP Other programmatic interfaces such as JSON are generally accepted Determine equipment temperature by relying on information obtained or monitored through the use of communication protocols. It may be determined.

[0084] Some embodiments may include various life safety features to ensure the safety of the user. These configurations include, but are not limited to, automatic electromagnetic locking mechanisms, fail-safe systems, Fire and / or smoke detection and / or suppression systems, ventilation systems and / or In certain embodiments, these configurations may include a comprehensive platform. It may be included as part of the form.

[0085] Certain embodiments ensure that any loss of fluid in the pressure controlled vessel is quickly detected. These systems include automatic steam detection systems that ensure substantial leak detection. pressure sensor in pressure control vessel 110 that monitors the pressure to ensure there is no The presence of any dielectric vapors that may have leaked from the pressure-controlled vessel. The pressure control vessel may include a gas sensor located external to the vessel that detects

[0086] The particular design, arrangement and / or layout of an embodiment of the disclosed system may vary depending on the system in which it is deployed. In some embodiments, the size, materials, internal systems, and structure may be adjusted based on the conditions. Component packaging and configuration options, pressure control vessel 110, computer components 170 and All interfaces between power systems are adjusted based on the conditions under which the systems are used. It is possible.

[0087] Rack System 8A-C show an example embodiment of a rack system 310 (or rack 310). The rack 310 is connected to the electrical and communication systems installed in the pressure control vessel 110. 0. The computer component 170 is a computer component 170 in the pressure control vessel 110. The racks 310 may be mounted to control spacing, orientation, position and / or configuration. In one embodiment, each computer component 170 is The power supply 400 may be mounted on the chassis 400.

[0088] The rack 310 may include, but is not limited to, a frame, bracket, support, or other structure. Any physical structure that can be used to mount computer components 170, including buildings The computer components 170 may be directly or indirectly connected to the rack 310. and held in a substantially fixed position. Some embodiments may use dedicated mechanical guide plates as mounting mechanisms, bulk Wiring harness attached to head fitting and / or power and signal wrap This may include the use of relayed power and backplane receivers 331 to distribute power within the network.

[0089] The specific design of the rack system 310 is tailored based on the conditions under which the system will be deployed. Some rack 310 embodiments may include dedicated switches. Uplink interfaces are connected via fiber infrastructure and / or downlink The link access interface is a backplane receiver 331 interface or or the computers in the rack via any other suitable manner of connecting computing equipment. The device may be connected to a calling device 170.

[0090] In certain embodiments, the rack system 310 provides the appropriate voltage from the power interface. A housing for one or more relay power supplies that can be distributed to other devices installed in the rack 310. The interface that interconnects power from the distribution system to the intermediate power source may include various By disconnecting the interfaces between the individual racks, power and communication systems, Rack 3 may be removed and / or replaced with an alternative rack configuration. 10 may be included in the design.

[0091] 8A shows a top view of rack 310. In this exemplary embodiment, rack 310 includes: The rack 310 includes an AC interface 311 and a data interface 312. The power supply 313 and the redundant power supply 314 (or backup power supply) are also included as a pair of power supplies. The power supply 310 may also include a rectifier and a controller. The equipment and controllers must be able to quickly repair the rack 310 or even ensure that the main power is working. (This allows the rack 310 to continue functioning even if the power supply is stopped.) The rack 310 can receive a plurality of chassis 400 and mount the chassis 400 thereon. It is configured to hold it in a substantially fixed position.

[0092] In some embodiments, the entire rack 310 may be immersed in the dielectric fluid. immersing the rectifier, power connections and / or data connections in a dielectric liquid in the To reduce and / or eliminate plastic contamination of the dielectric fluid, some embodiments In such an embodiment, the plastic insulation and / or cable jacket may be eliminated. In this case, the dielectric fluid is applied to the cables and / or connections that would otherwise be exposed. may act to insulate the

[0093] FIG. 8B shows a perspective view of a rack 310 containing multiple chassis 400. The configuration facilitates hot-swappability of the chassis 400. In this exemplary embodiment, the rack The AC interface 310 connects the AC interface 311 to the power supply 313 and / or the redundant power supply 314. The power supply 313 and / or redundant power supply 314 may include multiple AC cables 318. The backplane receiver 331 generates a DC output 320 that can be transmitted via a DC cable 321. The rack 310 can be configured to include a data interface 312 on a backplane. It may also include a number of data cables 319 that connect to the receiver 331. 331 connects the data connection on the bottom of the chassis 400 to the data connection on the top of the rack. It can be used to provide data.

[0094] 8C shows a side view of the rack 310. In one embodiment, the rack 310 It provides mechanical stability and / or housing for the rack 400 and its components. 310 is a diagram showing the structure of the power cable and the data cable in the enclosure where the cables are generally accessible. The cables connect to the chassis 400 from the top of the rack 310, which is accessible. This facilitates routing to the bottom of the rack 310.

[0095] Chassis and Interface Systems In one exemplary embodiment, the disclosed chassis system 400 is intended to accommodate conventional and / or Standardization Between Dedicated Computing Components 170 and the Disclosed Rack System 310 In one exemplary embodiment, the backplane acts as a physical relay component. The purpose of the lane receiver 331 is to provide a slot-in type interface between the chassis 400 and the rack 310. provides an interface for various computing components installed within the chassis 400. A power supply in a power system and a network switch in a communication system having a The purpose of this is to enable the distribution of power and signals between the switches.

[0096] In some embodiments, the pressure controlled vessel of the present disclosure may be used with one or more servers, e.g., blade servers. Each server may include a chassis 400 ( 9A to 9G show various components. 170. The chassis 400 includes a pressure control The container may facilitate the installation of servers on the rack or their removal from the system. In an embodiment, other electronic components of the pressure control vessel may be mounted on the chassis. Computer components such as the motherboard, chip, card, any part of the GPU or CPU Other components or hardware that can be installed in the chassis include power supplies, power interfaces, and Components such as interface or network communication interface can be mounted on the chassis. It is Noh.

[0097] In one exemplary embodiment, the chassis comprises a component (e.g., a server) and a pressure-controlled vessel. The chassis can act as a common interface between the components. or provide a variety of mounting, power and connection configurations that can be customized based on the design. In other words, various aspects of the chassis can be changed based on the design specifications of the components. In this way, the chassis can accommodate almost any model or type of hardware. For example, a chassis can be made of specifically designed hardware or off-the-shelf hardware. This can promote the use of hardware.

[0098] Embodiments of chassis 400 may be implemented using a combination of existing off-the-shelf components, custom-designed components, or both. and / or allow the use of specialized chassis for specific applications. Embodiments may include components designed to support standard motherboards and specialized components. In certain embodiments, such components may include an adaptation kit for NVi Gigabyte motherboard with Dia GPU and / or Intel CPU Includes ultra-compact motherboards.

[0099] FIG. 9A illustrates a chassis 400 for mounting servers on a rack according to an example embodiment. In this exemplary embodiment, the chassis 400 includes a back wall 410 and two side walls 420. The rear wall 410 may be a rectangular box containing a The chassis 400 may include a plurality of guide rails 411 on each side wall 420. 21 may be included.

[0100] FIG. 9B shows several components inside the chassis 400 according to an example embodiment. In the illustrated embodiment, the back wall 410 is removed. module 431, GPU module 432, CPU module 433 and interface 4. In one exemplary embodiment, the server 430 includes a card 434. The components are components used in blade servers, such as CPU modules 4 33 and GPU module 432. Additionally, the components inside the chassis 400 include: , other components not traditionally included in servers, such as power supply modules 431 or The chassis 400 may also include an interface card 434. The chassis 400 is a conventional air-cooled Since no fan or heat sink is required, chassis 400 does not include a fan or heat sink within the chassis. In this way, the chassis offers a very thin processor for the computing power of the chassis. Has a file.

[0101] FIG. 9C shows a schematic diagram of the components within the chassis. In this exemplary embodiment, the server master a power supply board 445, a plurality of power supply modules 431, and an interface card 434; The chassis 400 also includes a backplane. and / or power and communication system modules. Both may be mounted on a chassis 400 .

[0102] In one example, an on-board interface is a piece of hardware that is fixed to the chassis. On the inner surface of the chassis 400 are , components (e.g., motherboard, GPU, CPU, interface card and other Provisions can be made to allow the components (including the associated components) to be mounted on the chassis. The specific layout of the chassis system 400 is 400 and / or the equipment and / or components mounted on the rack. Some chassis 400 embodiments may include interchangeable mounting plates that can be used for mounting equipment. A set of standard mounting plates may be used to accommodate common or frequently used configurations. May be used for elements.

[0103] The power and network interface module in the chassis system 400 The file and form elements may be based on the needs and requirements of specific components and / or user-specified equipment. In one example, the power subsystem of a chassis can be tailored to the needs of a particular component. In another example, the chassis size can be changed to accommodate one of any size. In yet another example, the chassis may be designed to accommodate a single piece of hardware. Different networking options depending on the network connection card installed in the chassis These and other configurations of the chassis allow the chassis to be As a result, assembly of these components of the pressure control vessel For example, the chassis can be easily installed and removed. The robot may include a power server, and the robot may accommodate the chassis relative to the rack of the pressure-controlled vessel. In this way, the robot can be easily installed or removed without human intervention. The dossier can be removed and replaced, thereby minimizing human exposure to the dielectric fluid It is possible.

[0104] In one exemplary embodiment, the chassis includes a microphone capable of communicating with the pressure controlled vessel management system. The microcontroller may be located within the chassis or externally. Sensor data can be received from various sensors. For example, the chassis The server may include a sensor for detecting whether the server is properly positioned in the rack. If the rack can be connected to the sensor, the sensor is placed in the rack. It can be determined whether the chassis is properly positioned in the rack. The sensors can send data to a microcontroller, which can then use the data to The microcontroller sends a signal indicating whether the chassis is properly positioned in the rack. The data can be fed to a management system.

[0105] In one embodiment, the microcontroller controls the components mounted within the chassis. The microcontroller may be coupled to a switch that can turn the power on or off. , can receive a power on or off signal from the management system, and in response to receiving the signal, The microcontroller then controls the components, such as a switch that powers the server on or off. In one exemplary embodiment, the microcontroller can transmit a signal to The microcontroller can manage this data and receive the performance data from the server. The operational data is an indicator of the server's critical performance. The operational data can indicate the speed of the calculation operation, the time required for the calculation operation, and the like. These may include degradation, power consumption, circuit temperature and system bandwidth.

[0106] In one exemplary embodiment, the microcontroller controls the electrical and communication equipment of the blade server. For example, current (i.e., amperes) can be monitored, managed, and controlled. and voltage indications to ensure that the system can protect itself, e.g., overcurrent or It will be monitored to ensure there are no shortfalls.

[0107] In one exemplary embodiment, the chassis is configured to allow a robot to grasp and remove the chassis. For example, the chassis may include a front wall, a rear wall, The chassis may be in the shape of a rectangular box having a top wall and a bottom wall. The top wall of the chassis may have a plate that can be connected to the robot arm. Using this plate, the robotic arm can perform unloading and other handling operations. The plate can be grasped for operation.

[0108] In one exemplary embodiment, the chassis is configured to properly align and insert the chassis in the rack. It may also include mechanical guide rails and locating pins to ensure proper alignment. The rails may be disposed on the side walls of the chassis.

[0109] In one exemplary embodiment, the chassis may include various features that facilitate fluid flow. For example, the chassis may be in the shape of a rectangular box having a front wall, a back wall, and side walls. The chassis may also include a top wall and a bottom wall. In this example, some of the chassis walls may be At least one of the walls may include fluid flow holes throughout the wall. For example, the back wall may include facilitating fluid flow to and from the chassis when the chassis is immersed in a liquid bath; The nozzle may include a plurality of holes that are accessible.

[0110] In one exemplary embodiment, the chassis is configured to: The rack may include an opening to ensure that all fluid within the rack can drain. , may be located in a liquid bath that cools the computer components held by the rack. To remove the chassis, the robot grasps the chassis plate and lifts the chassis from the rack. The chassis can be lifted (thereby removing it from the liquid bath). When the fluid is removed from the reservoir, a certain amount of fluid may remain within the chassis. The bottom wall of the chassis ensures fluid evacuation even if the container is not perfectly level. The notch or drain may be located at the corner of the bottom wall. It may exist in the part.

[0111] In one exemplary embodiment, the chassis includes a power interface and / or a communication interface. The interface may include a label interface for connecting components mounted in the chassis. The power interface and / or pressure control vessel may be electrically coupled to the power supply. The communication interface and / or the communication interface may be located on a backplane. The servers mounted on the chassis are connected to the chassis interface via various wiring and cables. When the chassis is placed in the rack, the interface (i.e., backplane receiver) and / or other interface connected to the pressure control vessel. The two interfaces (i.e., the backplane) The electrical coupling between the power supply and the backplane receiver provides power to the server and It can be connected to a communication network inside or outside the pressure control vessel. The coupling between the interface can be performed automatically during mechanical insertion of the chassis into the rack. Similarly, removing the chassis from the rack removes the rack and / or pressure controlled vessel from the server. can be separated from

[0112] In one embodiment, the backplane interface 330 and the communication system interface By providing standardized interoperability over data interfaces, Minimizes the possibility of misconnecting sources, reducing the need for troubleshooting connections It is possible.

[0113] In a particular embodiment, the chassis 400 includes a standard power and network interface. The network interface is a 1Gb / s network interface on the device's motherboard. Or Cat6A or Cat7 compatible for connection to 10G Ethernet interfaces In such an embodiment, the power interface may be in the form of an RJ45 interface. The interface uses standard Molex connectors for connection to standard motherboard and / or peripheral components. It may include a set of x-style connectors.

[0114] In one exemplary embodiment, the pressure control vessel is The pressure control volume may include an internal database for storing information. For example, an internal database may be a repository of components installed in the system. The system can store the configuration and model of each server and power supply installed in the system. The components are replaced or substituted, for example, by robots, so that the management system Changes and updates to the information stored in the database can be tracked. , and can also be connected to an external database via a network.

[0115] In one exemplary embodiment, each chassis is labeled, for example, as a bar code on the chassis. The components may be located within a chassis and associated with a unique serial number. If so, the component specifications (or the component configuration and model) are used as unique serial numbers. The chassis is then installed in the pressure controlled vessel. Once installed, the pressure control vessel can look up the unique serial number in an external database. For example, a robot arm can be referenced by a The barcode can be scanned, and the management system can use the barcode to access the external database. The management system can retrieve data from an external database. The information can be used to update the internal database. Once removed from the container, the robotic arm scans the barcode associated with the chassis. The management system can then determine if the components installed in the chassis are no longer configured in the system. The internal database can be updated to indicate that the

[0116] In one exemplary embodiment, the chassis may include an RFID tag. The arm may include a scanner capable of emitting radio frequencies to detect RFID tags. When the robot arm is handling the chassis, it scans the RFID tag. and provides the unique serial number to the management system to update its internal database. It is possible.

[0117] In one exemplary embodiment, the chassis includes an identification plate that may include a user-specific asset identification number. This asset identification number may be stored in association with the components installed within the chassis. In some embodiments, the identification plate is configured to store an asset identification number. It can be a chip.

[0118] In one exemplary embodiment, the chassis includes a pump that enhances fluid flow within the chassis. To maximize heat exchange between the components within the chassis and the liquid bath, the chassis is The chassis may include a pump capable of circulating fluid through the chassis and around the components. It draws fluid from various conduits spread around the periphery and pushes the fluid out of the chassis. It is possible to do this or vice versa.

[0119] In one exemplary embodiment, the chassis is adapted to dry the chassis and the components mounted thereon. The chassis may contain various conduits around the periphery to allow for easy access to the fluid. When the chassis is opened, a predetermined amount of liquid may remain within the chassis or components therein. Induce gas flow within the chassis or around components to promote drying of the chassis and components In one exemplary embodiment, the pressure controlled vessel may include various conduits that may The chassis can be exposed to a gas flow before being delivered to a user. For example, The chassis may include an input pipe for receiving a flow of gas, and the pressure control vessel can provide a gas flow through an input pipe.

[0120] 9D shows the bottom wall 415 of the chassis 400 according to an exemplary embodiment. In one embodiment, the bottom wall 415 includes a power interface 416 and a communication interface 417. 9D also shows guide rails 421 on the side walls 420 of the chassis 400.

[0121] 9E shows the top wall 425 of the chassis 400 according to an exemplary embodiment. In this embodiment, the upper wall 425 may include a plate 426 and a pair of handles 427. The arm can be used to remove the chassis 400 using the plate 426.

[0122] 9F shows the side wall 420 of the chassis 400 according to an example embodiment. In this configuration, the side walls 420 may include guide rails 421. FIG. 9F also shows the rear wall 410 , handle 427 and power interface 416 are shown.

[0123] FIG. 9G shows an exploded view of the bottom drain hole 450 of the chassis 400 according to an example embodiment. In this exemplary embodiment, the bottom drain hole 450 is formed through the bottom wall 415, the side wall 420 and the back wall. It can be placed at the corner of the face wall 410.

[0124] 10A-F show an exemplary embodiment of a pressure-controlled vessel 500. In particular, FIG. 10A shows the vessel An exemplary embodiment of a generator 500, e.g., a 600 KW skid, is shown. The vessel 500 includes a modular skid to facilitate movement and transport of the vessel 500 to a desired location. The container 500 may include a plurality of forklift tubes 514 for propelling the container. The vessel receives treated water from the outlet 511 and treated water pipe 512 with minimal penetration through the vessel itself. These connections allow the sealed packaging of modular enclosures in data centers to be In some embodiments, the connection may be located at the top of the container to facilitate data center connectivity. The front and / or sides of the container are provided to accommodate the vertical load of multiple modular containers. In some embodiments, the containers may be stacked vertically on top of each other. The vertical space may be provided between the containers to facilitate the separation of the containers. This may provide additional space for connections, airflow and / or insulation. By using a 1000 Watt Max power supply, very high power densities can be achieved per square foot. The vessel 500 receives an input 511 and provides power and network connectivity across the vessel 500. The container 515 may include a power and communication box configured to distribute a sealing lid 51 that may facilitate the addition and / or removal of components from the container 500; It may include 5.

[0125] 10B shows another view of the container 500. In one embodiment, the container can be opened without opening it. An inventory of replacement components so that components can be replaced using a robotic system within the vessel The robot system may be housed within the container 500. The robot system uses a gantry motor 516. In such an embodiment, if a component breaks or requires repair, Replacement components are installed in the system and components that are removed, damaged or not damaged. may be stored in the cassette until the cassette is full, at which point the removed The cassette containing the component is removed from the container and a new cassette with a new replacement component is inserted. A container can be inserted into the container for future use. In certain embodiments, the containers disclosed are approximately 100 mm long. 15 feet, approximately 7 feet wide and approximately 10 feet tall. The system provides 600KW of computing power in approximately 150 square feet. supplies power.

[0126] In some embodiments, the vessel 500 may also include one or more bellows tanks 517. The pressure tank 517 can be used to regulate the pressure within the vessel. When the lubrication and / or cooling system is first activated, the expanding dielectric fluid is released into the environment. Orient the bellows tank to avoid loss and / or pressure buildup within the vessel. In one embodiment, the bellows tank 517 contains approximately twice the amount of liquid dielectric fluid. The container may be large enough to hold the entire container.

[0127] 10C shows a cross-sectional view of the container 500. The bottom of the container 500 contains a computing structure. The rack 310 containing the components and / or the chassis 400 may include any dielectric vapor Condenser coils 132 are located on the rack to cool and condense the This allows power to be distributed among the individual power supplies in a hot swappable manner. Power bus bar 518 allows power to be distributed to the computing components. , allowing the enclosure to receive external power using only one or a few penetrations through the enclosure. This design simplifies the installation and operation of the vessel system. The power bus bar can provide 600 amps to power five racks. In such an embodiment, there may be two sets of bus bars, one on each side of the container. In some embodiments, the busbar does not include plastic insulation. These may be considered contaminants of the dielectric fluid and are generally avoided in some embodiments. This will be the case.

[0128] In some embodiments, the container 500 may include a desiccant 519. The condensable vapor is removed from the head space of the vessel 500 and any non-condensable components are removed from the dielectric flow. Water may be condensed in a manner that allows it to be removed from the body. It will not condense under the same conditions. Thus, this system removes water contaminants from the dielectric fluid. It can be used to remove

[0129] In one embodiment, the vessel 500 includes a fluid filter 520, a fluid pipe 521, and a fluid pump. In some embodiments, the dielectric fluid may include a pump 522. may be added to the container in a manner that allows the container to overflow from the box 310 into the reservoir area 523, and The fluid is filtered using a fluid filter 520 and pumped through a fluid pump 522 and a fluid pump. The system can be pumped distally into the vessel using a new filter. The dielectric fluid is circulated through the container, so that the dielectric fluid It can be reused to cool components.

[0130] 10D shows a cross-sectional view of the vessel 500. In this embodiment, the liquid dielectric fluid level is , a fluid height greater than the height of the rack 310 and / or the computing components therein. As a result, the rack 310 and / or computing configuration The element is immersed in a dielectric fluid. A saturated dielectric vapor is placed above the fluid level 524, e.g. For example, the saturated dielectric vapor may be present up to an intermediate height 525. 525, which may be approximately half the height of the condenser coil 132. A head space exists above the saturated vapor that may contain a low density dielectric vapor.

[0131] communication systems The disclosed communication system embodiment includes the disclosed superstructure 210, pressure controlled vessel 110, and and / or a standard level for equipment within or associated with a computing system. It is designed to provide connectivity and management interfaces for ears 1-3.

[0132] In one embodiment, a series of MTP interfaces are provided for multiple high density multimode fibers. The pressure control vessel 110 includes a pressure control valve 112 for connecting the pressure control vessel 110 to the power supply 114. When connecting to a fiber optic cable, a dedicated breakout cable or breakout interface is required. , patch panels and / or sets of distribution patch panels to racks 310, It can be divided into switch level connections.

[0133] One embodiment of the disclosed system is a short patch panel with switches installed therein. Dedicated fiber patch panels are installed in each rack 310 to allow connection to the switch system. In other embodiments, the NI PXI-8111 may include a dedicated patch panel port. or patch panel cells extending from each switch system to the MTP distribution interface. There may also be a cot.

[0134] In one embodiment, the interface between the switch system and the chassis 400 is: This may be via a backplane interface 330 and / or It may also be through some other mechanism which may or may not involve the use of a connector. In some embodiments, the relay rack level switch system may be omitted. Some embodiments may utilize pressure-controlled devices to connect to various computing devices located therein. A centralized set of switches within the container 110 may be used.

[0135] The standard interface between the switch system and the chassis 400 is This is achieved by using a patch panel attached to the switch. Wired to the backplane system 330 with patch cables that connect to the appropriate ports on the system It can be done.

[0136] In one embodiment, the communication system cabinet is connected to the MTP in each pressure control vessel 110. A small (6U) rack rail area containing patch panels that interconnect interfaces, and centralized communication systems that serve to interconnect switch systems with each other and / or to the outside world. In such an embodiment, the end user or customer may They set up their own routing means within the space and connect the disclosed computing system with the outside world. providing external connections thereto, or connecting between the pressure control vessel 110 or a higher level structure; Choose between providing a fiber connection between the structure 210 and the existing network environment. It is possible.

[0137] Access, communication and / or networking functions utilized within embodiments of a communication system environment Rack components may be standard equipment or user specified. 10 and backplane interface 330 system eliminates the existing switch , replace it with some standard switch (such as a 1U switch) and to the backplane network interface panel. The switch system located within block 310 may include functionality for switching.

[0138] In certain embodiments, the backplane system 330 may be configured to interface directly with the backplane system 330. Such products may be used in specialized, dedicated, and interconnected networks. via a working interface, via a commercially available protocol, or via a network Chassis 400 via Specification for the Design of Network-Level Interconnect Interfaces Specifically designed to interconnect patch panel systems and / or switch ports A direct electrical interface can be utilized.

[0139] In some embodiments, the connection between each blade or chassis and the switch may be multiple interfaces. One interface may be available on a commercially available switch. A common interface may be a standard switch port, which may be a standard port that can be used 1GBA using a Cat6 or Cat7 twisted pair copper connection between the switch and the host device It can be SE-T or 10GBASE-T. Other interfaces are standard switch ports. A patch panel with a standard patch cable going from the port to the front of the patch panel and its Hard-wired connections from the rear side of the patch panel to the signal interfaces on the signal backplane The switch may be a backplane repeater that can consist of any of the following sets: Alternatively, this may be done to establish a connection between a standard switch port and a backplane. Specialized cables and / or standard RJ45 interfaces from the switch ports to the board Still other interfaces may consist of a signal path from a standard switch port to a Interface system signal backplane that distributes signals from the One or more of the signal paths can be lanes. Still other interfaces may be terminated with connectors on the corresponding PCBs. This may be a signaling backplane interface. Connectors located on the chassis itself that mate with connectors on the stem signal backplane. It can be a data bus that interfaces the system signal backplane with the chassis itself. Yet another interface is the chassis network. This can be a network interface from the chassis network interface. Patch cable to RJ45 interface on chassis mounted server The patch cable may be a standard patch interface that allows the connection of

[0140] Robot System In one disclosed system embodiment, hot swapping of components within the pressure controlled vessel 110 This paper presents a promising approach to addressing the need for robustness. The need for interchangeable functions can be addressed by robots.

[0141] Certain embodiments of the disclosed system combinations include an internal robotic arm 230 and / or an external robotic arm 230. The robotic arm 240 may include a dedicated robot arm 240. Certain embodiments, such as those for a computing environment, may include hot swapping of components. Other hyperscale GPU and CPU environments may require this can be a basic requirement. The disclosed robotic system embodiments can be implemented without requiring any other components. This allows for replacement of the chassis and / or other computer components without disruption. In some embodiments, failed cards and / or components may be automatically and / or programmatically repaired. This allows for short-term use of embodiments of the disclosed system. and fully remote and autonomous operation for moderate periods.

[0142] The mechanism of the internal robotic arm 230 is located within the environment of the pressure controlled vessel 110. As shown in Figures 1A-D, in the illustrated embodiment, if a card or component is not working properly, If so, a removal sequence may be initiated. When the removal sequence is initiated, the inner arm 230 The appropriate computer components 170 and / or associated chassis 400 are removed from the rack 310. and transporting it to the airlock 220 located within the pressure controlled vessel 110, and Once this sequence is complete, the inner airlock door will close. 222 closes, the airlock pressure is equalized to the outside air pressure, and the outer airlock door 22 When the external door 224 is opened, the external robot arm 240 moves to the chassis 4. Remove 00 from Airlock 220 and place it in an empty storage slot.

[0143] In one embodiment, airlock 220 is opened to the outside environment before it is opened to the outside environment. The system is purged with nitrogen, other inert gases, and / or non-condensable gases. This has the effect of reducing or eliminating dielectric vapor loss when the airlock is opened and closed. In certain embodiments, the airlock is matched with a one-way valve, either internally, externally, or both. In embodiments with one-way valves both inside and outside the airlock, Purging the pressure control vessel 110 prevents cross-contamination of the internal atmosphere of the vessel 110 by the external environment. This also prevents the loss of dielectric vapor.

[0144] When a card or component exchange sequence is initiated, the external robotic arm 240 3. Remove the replacement component and / or chassis 400 from the storage slot and place the component in the airlock. 220. Once complete, the outer airlock door 224 closes and the airlock pressure The internal pressure of the pressure control vessel 110 is equalized and the inner door 222 is opened. Once opened, the internal robotic arm 230 removes the chassis 400 from the airlock 220. and insert it into the appropriate rack 310.

[0145] When coupled with a remotely accessible management system, the internal and external robotic arms 23 0 and 240 enable remote operation and management of data center environments. Reduced need for operators on standby, reducing costs and / or downtime In one embodiment, the external robotic arm 240 is mounted on a movable base, Thereby, one external robotic arm system can be connected to the disclosed computing system. It is possible to operate in multiple embodiments.

[0146] When integrated with custom-developed workflow management systems and virtualization technologies, the disclosed robots The system must be fully autonomous and self-regulating, providing the highest level of system reliability. This enables the development of a holistic data center solution.

[0147] In some embodiments, a unique human and / or machine readable serial number and / or product code may be used. An asset tag with a tag code is included with each computer component and / or chassis. In these embodiments, the asset tag may be a unique serial number. The tag may include a printed barcode or a QR code and may be used by embodiments of the disclosed robotic system. The tag code may be used for detailed inventory control and automation systems. It may also be used in conjunction with a management software system that provides detailed component information. The material and any associated adhesives or other components are preferably compatible with the dielectric fluid. The tag preferably has a slot that is readable when the chassis is inserted into the rack. In one embodiment, a secondary or additional tag is located on the chassis in the pot. may be located in other areas of the chassis to aid in component and / or inventory control identification. good.

[0148] Embodiments of the disclosed robotic system may include a robotic arm that is configured to allow any individual chassis to be temporarily removed and This allows for a process known as "reseating" which can be used to troubleshoot issues. , is useful when it is determined that a hard power cycle of the component is desired. This is accomplished by disconnecting all power, waiting a moment, and then reconnecting it.

[0149] In some embodiments, individual cards and / or chassis are inserted into a pressure-controlled vessel through an airlock. In one embodiment, the robotic system allows the robot to be removed from the rack. Remove the chassis from its slot, move it to the airlock, and when the airlock is opened signaling the completion of this task allowing the card and / or chassis to be removed. Some embodiments allow replacement components to be routed through the same airlock used for removal. and / or allow the chassis to be placed in a specific rack slot. In this state, the robotic system removes the chassis from the airlock and places it in the appropriate rack. Place it in the lot, signaling the completion of this task.

[0150] Internal System Robot Embodiments of the disclosed system may include a "robot-intra-robot" robotic system. In such an embodiment, the pressure-controlled vessel may be configured to house a robotic arm operating within the vessel. The enclosure may be expanded to accommodate computers on a rack containing operational computer components. The system may be configured to accommodate movement or transportation of computer components and / or chassis. It is understood that pressure-controlled vessels may also be referred to as tanks, pods, and / or vacuum chambers. Alternatively, certain components of a pressure-controlled vessel may be referred to as tanks or pods. You will probably find out something.

[0151] FIG. 10E illustrates a chassis 400 of a computing component, e.g., a rack 310. Disclosure having a gantry robot 526 configured to remove, replace and / or install 5 illustrates an embodiment of the system. In one embodiment, the gantry robot 526 To remove, replace and / or install DC rectifiers and / or other components of the electrical system Some embodiments of the disclosed computer components and power distribution components may be configured It may be designed to be hot swappable and can be hand-operated by a gantry robot 526. It should be appreciated that the device may include a handle or other structure to facilitate handling. In one embodiment, the gantry robot 526 is configured to travel in both the x and y directions. and can be lowered in the z-direction to remove and / or install replacement components. In one embodiment, the gantry robot 526 grasps the chassis 400 and / or the power supply. For example, the gripping tool can grip the plate 426.

[0152] FIG. 10E illustrates a top cross-sectional view of an exemplary embodiment of the disclosed tank. An array of blocks 310 is mounted on a chassis 400 and / or a computing board. In one embodiment, each chassis 400 utilizes approximately 6 KW of power, and each rack 31 0 may contain 10 chassis. This allows for a rack 310 containing 10 such chassis. In an embodiment, the vessel has approximately 600 KW of power available for computing. In some embodiments, additional racks 310 and / or magazines 527 in the chassis 400 may be and a DC power rectifier housed in the vessel 500 and used as a replacement component; and / or Space may be provided to store components removed from the container 500 .

[0153] Robots in external systems 12A-E show another embodiment of the container. In particular, FIG. 12A shows a chassis 400 and and / or a gantry robot external to the tank 710 housing the computing components. 526 is shown in the embodiment of the vessel 700. In this embodiment, the tank 710 , a smaller, external gantry robot 526 is mounted on the chassis 400 inside the tank 710. and / or need to be opened more frequently to access the power supply. The vessels are housed in a modular enclosure, such as reservoir 716, external to tank 710. In one embodiment, the tank 710 may have multiple doors 711. , which allows for easy removal, installation and / or replacement of components or the chassis 400. To limit exposure of the interior of the tank 710 when one door 711 is opened for replacement purposes. In such an embodiment, the replacement component may be used to prevent unnecessary opening of the tank. To avoid this, the liquid may be stored outside the tank 710.

[0154] Additionally, the vessel 700 includes one or more transformers 712, a power distribution panel 713, and treated water pipes 5 12 and an electrical chase 714. The vessel 700 may include a Programmable logic controller (PLC) cabinet for monitoring and controlling the The transformer 712, the power distribution panel 713, the treated water pipes 512, the electric The chase 714 and PLC cabinet 715 may be located outside the tank 710. good.

[0155] FIG. 12B illustrates a container 70 in which the tank 710 is accessible to an external gantry robot 526. In this exemplary embodiment, the condenser coil 132, the rack 310, and the base Rose 717 is located in tank 710. FIG. 12C shows the external gantry robot and multiple 7 shows a side view of a vessel 700 having a tank 710 with multiple doors 711. In an embodiment, the tank 710 removes fluid from the reservoir area and directs the fluid to the fluid filter 520. The container 700 includes a fluid pump for pumping fluid through the fluid pipe 521. It also includes a magazine 718 for storage. In this exemplary embodiment, the magazine 718 contains In one embodiment, the amount of liquid dielectric fluid in the tank 710 is Spacers and / or ballast blocks 160 may be used to reduce the overall volume. good.

[0156] 12D illustrates a rack 310 according to an example embodiment. 314 may be located on the opposite side of the rack 310 rather than adjacent to the primary power source 313 . Additionally, power and / or data cables 318 and 319 may be connected to the power and / or data cables 318 and 319 depending on the specific requirements of a particular deployment. In this exemplary embodiment, the battery The top plane receiver 331 is located at the bottom of the rack 310 .

[0157] FIG. 12E illustrates an exemplary hinged door that may be used in an alternative embodiment of the disclosed tank 710. 711. In some embodiments, to reduce or avoid induced currents in the dielectric vapor, Sliding doors may be used instead of hinged doors. Opening the door by swinging it open is much more costly than swinging a hinged door open to create mixed currents. This results in less fluctuation in dielectric vapors overall.

[0158] Management System The management system provides a means for communicating between users of the disclosed computing system and the computing system. An embodiment of the management system is a web-based interface between the system and the system itself. The pressure control vessel 110, the robotic system, and the computing system are shown in FIG. various systems and components, including In one exemplary embodiment, the management system , may be implemented in the PLC cabinet 715 of FIG. The management system may be implemented in the power and communications box 513 of FIG. In an embodiment, the power management system may include a controller or other suitable device, such as a computer. It can be implemented as a software program on a computer.

[0159] In certain embodiments, data points accessible through a simple network management protocol are used. A set of components monitors key operating parameters via a third-party monitoring system. A log of all activities may be made available to users of the management system to enable tracking. may be maintained and a chart may be provided for user updating of operating condition data.

[0160] Routine maintenance of system components is scheduled and maintained through a management system. The user may be given periodic reminders for scheduled maintenance, The user will see it as running within the interface. All data may be retained as part of the performance log information for historical performance review.

[0161] In some embodiments, operational functionality may be achieved by remotely controlling the computing system and associated components. API interface to allow remote programmatic monitoring and management may be published via the may include a full set of performance monitoring and alerting features.

[0162] Centralized server version or hosted cloud-based management version The management system for the system is available to customers using multiple pressure control vessel computing systems. This can be used as a single point of contact for the management of a group of pressure controlled vessel computing systems. A single programmatic user-accessible interface is provided to the operator.

[0163] In one embodiment, the software-based interface module is Software System Center and VMWare VCenter Interoperability with cloud computing platforms and third-party management utilities The API interface provided by the user and management system is It allows full interoperability with the internet system and the disclosed computing platform. This allows for complete remote and programmatic autonomous operation and management of the system.

[0164] In some embodiments, the control system controls operations including temperature, pressure, flow, and / or power management. In one embodiment, the user authentication system allows for the coordination and control of multiple unique Allows users to be authenticated to the system. Some embodiments may use role-based and / or In such an embodiment, an administrator may request that a user be associated with Configure multiple roles that can be assigned to individual users and / or grant specific permissions outside of their role assignments. This can be applied to users.

[0165] Some embodiments record video input from cameras that may be located within the vessel and / or superstructure. In some embodiments, the camera includes a video manager to provide users with the ability to record and retrieve video. The camera may acquire visual data that may be analyzed by a processor. The processor controls the vessel, the robot, and / or the superstructure in response to the acquired visual data. Computer vision techniques may be used to control the operation of the system.

[0166] In some embodiments, the control system and software may be implemented in accordance with the disclosed computing platform. The operation and status of the platform as a whole, its individual subsystems and / or components The system may be configured to generate reports relating to the

[0167] Exemplary Merging System Embodiments It should be understood that the disclosed systems may be utilized individually or in combination. There are numerous embodiments of the merged computing system that can be adapted to various use cases. be.

[0168] One exemplary embodiment is the Crypto series, which is a special-purpose computing Hardware, guide plates and wiring harnesses designed for that hardware 1 MW 1 is an ultra-high density embodiment of the disclosed technology utilizing a pressure controlled vessel 110 and power distribution system. A typical user of this embodiment uses a customized computing component. those wishing to carry out cryptocurrency mining or other ultra-power-intensive processing on the Computers wishing to develop a full-area two-phase immersion cooling system including their own hardware Manufacturer of the mounting components.

[0169] Another exemplary embodiment is the GPU series, which is a high density GPU of the disclosed technology. This is an example of supercomputing. This example demonstrates ultra-fast speeds for GPU communication. Gigabyte motherboard with NVidia NVLink technology to boost the GPU A custom chassis designed to contain the board and NVidia GPU, 400. It utilizes the technology of the rack 310 and backplane interface 330. Typical users include graphics rendering, particle simulation and general research activities. General-purpose parallel processing that can take advantage of GPU-based computing and memory capabilities Includes applications.

[0170] Yet another exemplary embodiment is the CPU series, which is a high density C This is an example of PU computing. This example is based on high-end Supermicro o-based motherboard, Intel Xeon CPU, high-speed network interface It utilizes semiconductor memory devices for interfaces, high-speed memory, and local storage. Typical users of the technology are those who use it for their own internal applications or for the purposes for which they provide third-party services to their customers. and data centers that utilize high performance computing for services provided to other organizations. , including enterprise and cloud / VPS hosting providers and service providers.

[0171] Yet another exemplary embodiment includes the Edge series, which is designed for remote / on-site deployment. specifically designed for or in or associated with traditional business and data center environments. 1 is a scaled-down example of a computing system of the disclosure. It is specialized for safe, weather-resistant environments with full remote monitoring and management capabilities. Target users of the technology include network operators and other organizations with distributed field infrastructure. operators of fielded and distributed technologies, and minimal changes to existing facilities or structures. Operators of existing facilities wishing to augment their computing capacity with new The system includes various extensions to the external structure, and is connected to electricity, water and networks. This may simplify connection to systems of utility services, including connections.

[0172] Self-Contained Embodiment Certain disclosed embodiments do not require an external water source. A closed-loop chiller for cooling water or other fluids that may be circulated through a condenser such as By using a closed-loop chiller rather than an external cooling water source, the system becomes essentially self-contained. This allows for a variety of molding embodiments.

[0173] Figure 13 illustrates an exemplary self-contained container 750. The exemplary embodiment of Figure 13 is is a skid tower for cooling water or other liquid used in the condenser in the immersion tank 710. By using a built-in closed loop chiller 719, This eliminates the need for a cooling water source and allows for external power and network connectivity for full operation. This provides a self-contained data center solution requiring only a network connection. 50 includes a bellows 717, a door 711, a gantry robot 526, a power distribution panel 713, A PLC cabinet 715 and magazine 718 may also be included.

[0174] In one embodiment, the closed loop chiller 719 is housed in the outer housing of a modular pressure controlled vessel. In such an embodiment, the chiller may be a skid-mounted closed-loop chiller enclosed within a cooling system. , heat is transferred from the computer components to the dielectric liquid in the tank 710. The dielectric liquid is converted into a dielectric vapor as described herein. The dielectric vapor is then transferred to a tank. 710 and is cooled by the condenser, thereby converting the dielectric vapor into a dielectric liquid. The heat transferred from the dielectric vapor to the condenser is then transferred from the condenser to the refrigerant in the condenser. or transferred to a condensed fluid and then transferred to a closed-loop chiller 719. In one embodiment, , Chiller 719 is a vapor compression, compressor, evaporator, heat exchanger, or refrigerant or condensing fluid Heat is removed from the refrigerant or condensing fluid using other methods of cooling in a closed loop. The heat from the fluid is ultimately dissipated via air cooling. In some embodiments, this is It will be a self-contained modular air-cooled two-phase immersion computing system. has generally taught the opposite to air cooling, especially for self-contained devices, The air cooling of the self-contained embodiment of is surprising.

[0175] Certain disclosed embodiments may be provided in a space-saving footprint form factor. The configuration is a single unit containing ten blades or servers immersed in a dielectric liquid as described above. In one embodiment, each server can draw approximately 6 kW of power. This provides approximately 60 kW of computer power in a small footprint.

[0176] The exemplary embodiment shown in FIG. 13 is approximately 4 feet 2 inches deep and 8 feet 8.5 inches wide. This exemplary embodiment falls within a footprint of approximately 8 feet 8 inches in height. It has 60 kW of computer power and other operating components and systems, and is approximately 36.3 m². Foot area. The vessel's operating components include, but are not limited to, a computer. A tank or pod containing the dielectric fluid, condenser, power and data connections for the controller components. It should be understood that the vessel may contain sensors, control equipment, power cabinets, Rose 717, vacuum systems, fluid filters, purge systems and / or other components Some self-contained embodiments may include an outer housing. an outer housing that encloses the vessel, provides structural support, and is skid-mountable; It may be ventilated, weather and / or water resistant, and / or decorative. In an embodiment, the outer housing of the self-contained enclosure includes a radiator coil, a fan grate, a heat transfer It may include air-cooled components to facilitate the use of components and / or closed-loop chillers.

[0177] In one embodiment, a self-contained computing system has a surface area of ​​1000 sq. ft. At least about 1.5 kW per square foot, at least about 1.6 kW per square foot, At least about 1.65 kW per square foot, at least about 1.8 kW per square foot, At least about 2.0 kW per ft, or at least about 3.0 kW per square foot In some embodiments, a self-contained computing The system produces approximately 1.5kW per square foot of space and up to 1.5kW per square foot. Approximately 1.6 kW per square foot, up to approximately 1.65 kW per square foot, up to approximately 1.8 kW, or a maximum of approximately 2.0 kW per square foot, or a maximum of approximately Provides 3.0kW of computing power. Self-contained system with adjustable height. This allows for more or fewer computing resources to be provided within a given installation area. It should be clear that this makes it possible to achieve high power consumption.

[0178] The dimensions, components, arrangement and configuration of the disclosed exemplary embodiments are intended to be illustrative and not restrictive. It is understood that modifications, additions, and / or deletions may be made to create various potential embodiments. It should be.

[0179] In some embodiments, the self-contained computing system may be, for example, a blade server. To remove, replace, and / or install a battery, power supply, or other component, such as the chassis 400 The robot system may include a gantry robot 526 configured as follows: A type system can be either an "internal robot" or an "external robot" of the system. In smaller footprint embodiments, a smaller magazine 7 of replacement components may be provided. 18 may be used. In one embodiment, the replacement component magazine 718 is shown in FIG. In some embodiments, the tank 710 may be mounted externally to the rack. The computer components, power supply, exchange magazine 718 and gantry robot 526 The gantry robot 526 moves substantially in only one direction while removing, replacing, and When the various components are arranged in a generally linear fashion, The gantry robot 526 removes and replaces the desired component without traveling in a second direction. and / or can travel along a single axis for placement. It is understood that the actuator may be capable of lifting and lowering components in addition to moving in a single linear direction. It should work.

[0180] By utilizing compact elements such as the embodiment shown in FIG. 13, a self-contained 2PL The IC system can be easily transported. The inclusion of the closed loop chiller 719 Thus, a two-phase immersion cooling system may not have access to a viable source of cooled water. It can be used in remote conditions and does not require external cooling water. In some embodiments, only two external connections are required: one power connection and one data connection. Thus, a self-contained computing system is formed.

[0181] In one embodiment, the computing system is housed in an outer housing such as that shown in FIG. In some embodiments, the components identified schematically in FIG. 13 and / or described herein may be included within the The components disclosed in may be included within the outer housing. The volume of the housing depends on the anticipated cooling requirements, the configuration of the closed loop chiller, and / or the self-contained cooling system. The computing system may be adapted based on the environment in which it is expected to be deployed.

[0182] The disclosed self-contained, self-healing and small form factor embodiments are Use as a standalone solution to provide logging capabilities in almost any location or environment In some applications, multiple small computing systems may They may be located nearby and / or linked together to form a cluster. The outer housing is designed for maintenance and access with access to only one or two sides of the outer housing. This arrangement allows for the carrying out of maintenance and / or service work. ,individual self-contained computing systems,decreased between each self-contained system. Or, they can be arranged at the minimum distance.

[0183] In one exemplary embodiment, four exemplary self-contained computing system classes are The computer is a self-contained computer with approximately 240 kW in a footprint of approximately 140 square feet. In some embodiments, these units may be strategically placed to allow for power , may be in power and / or data communication with each other, thereby providing a single external power connection and allows operation of a multi-unit cluster with only a single data connection. In an embodiment, a data center may include a plurality of small computing systems or other such computers. The network may be established using multiple clusters of computing systems.

[0184] Certain disclosed embodiments and / or the computing systems disclosed herein may be implemented using modern Although the disclosed self-contained computer may be utilized in a data center and / or climate-controlled environment, Some embodiments of the computing system may be deployed in remote locations and / or harsh environmental conditions. In some embodiments, the outer housing is weatherproof, water resistant, and and / or otherwise configured to withstand exposure to harsh environments for extended periods of time. Certain disclosed embodiments provide for the delivery of large amounts of computing resources to remote or difficult locations. Some self-contained embodiments require access to power and data connections. It can be deployed to be operational virtually anywhere that In some configurations, uninterruptible power supplies and / or generators provide a more reliable or constant source of electrical power. It may be operably connected to a computing system to provide access.

[0185] Certain disclosed self-contained embodiments are designed to be stackable. Certain embodiments may be designed to be low profile. Particular embodiments are approximately 5 feet 5 inches tall and 10 inches deep. It can be 5 feet 6 inches long and 9 feet wide. This covers a 42 square foot footprint. Such a unit would provide approximately 60 kW of computer power in the same 42 sq. Vertically loaded to provide 120kW of computer power in a 100-foot footprint This may be done.

[0186] The disclosed computing system embodiments are stacked and include multiple loads adjacent to each other. This reduces the need for aisle space between individual computing systems. This reduces the overall power density within the data center.

[0187] Some embodiments may require complete access to only one aspect of a self-contained computing system. Such an embodiment may be designed to be fully operational and maintainable. This is advantageous as it makes it easier to place self-contained systems in close proximity to one another. Additionally, in some self-contained embodiments, the entire dip tank is accessible to only one side of the device. In certain embodiments, the tanks may be individually modularized and / or replaced. They may be modular and / or skid-mounted.

[0188] In some embodiments, the self-contained computing system has a smaller footprint. Vertical design embodiments of the disclosed system provides approximately 60kW of computing power in a footprint of approximately 22.9 square feet. As with other disclosed embodiments, several vertically oriented self-contained components may be provided. The computing systems may be located in close proximity to one another. As described above, some vertically oriented self-contained computing systems In some embodiments, the entire tank can be operated and maintained with access to only one side. This arrangement allows for multiple blade servers and and / or other computing components may be rapidly replaced.

[0189] Mobile embodiment A self-contained computing system that does not require an external source of cooling water Novel computing applications are possible. In one embodiment, the generator Power is supplied to the system using the In some embodiments, the system relies on wireless data communication. may be.

[0190] In certain self-contained embodiments that do not rely on a fixed power source or wired data communication, The disclosed embodiments can be implemented in almost any environment. A self-contained in-vehicle computer that can be used to provide large amounts of computing power In one embodiment, the truck-mounted wireless computing system The system operates within the wireless communication range of an existing or temporary network, effectively It can provide a large amount of computing power with no setup or installation time.

[0191] Natural spring water embodiment In some embodiments, the computing system may be a boat, a ship, an oil rig, a floating used on a floating platform or other vessel or structure located in close proximity to a body of water In such an embodiment, the dielectric vapor may be arranged to The condenser used to convert back to a dielectric fluid may be cooled using water from a body of water. In one exemplary embodiment, the modular computing system includes a water intake, a water outlet, and and a pump or impeller. The pump and / or impeller may move water from the body of water to the condenser. Some embodiments may include condensers, piping, and other components. Designed to protect computing system components from sources of contamination in bodies of water It may include filters and / or processing components. In some embodiments, it may include condensers and other components. The element is arranged to withstand prolonged contact with brackish or salt water, for example seawater.

[0192] Horizontal Magazine Swap In one embodiment, a magazine of replacement components is installed in a computing system external to the tank. For example, the chassis, server, blade, and Replacement components, such as fuel and / or power components, are removed from the magazine and reassembled in the tank. The magazine can be used to exchange components from the magazine. configured to extend from the outer housing of the computing system to enable The platform may be a

[0193] In one non-limiting example, if a blade server in a tank malfunctions, a robotic arm The team removes the inoperative component from the tank and places the inoperative component in a magazine compartment. The robotic arm can then be used to move the machine from the magazine to a storage slot. Remove the functioning blade server and install it where the non-functioning server was previously located. A new operational server can then be installed, thereby replacing the inoperative server.

[0194] Over time, the magazines become more flexible and allow the robot system to continue operating for a longer period of time. , stores inoperative components that can be replaced with new operational components. So, the magazine is on a platform that can extend outside the outer housing. Advantageously, this allows an operator to access the magazine. In this case, the platform allows components to slide in and out of the magazine. The magazine is configured to rotate from a substantially vertical position to a substantially horizontal position to allow do.

[0195] In one embodiment, an adjustable height cart allows a human operator to load components into a magazine. The weight of the component must not be lifted or supported while it is being removed or replaced from the system. It can be used to move, load and / or receive components, as shown. The magazine is configured to load functional components into the magazine and to load non-functional components. It should be appreciated that removal of elements may also be facilitated.

[0196] 15A-D show a platform 820 that can extend outside the container. 15A shows an example magazine 810. In FIG. 15A, the magazine 810 includes a rotating member 821, a support member The platform may be connected to a platform including support members 822 and rails 823. In other words, the support member 822 is stored in the magazine 810 and the magazine. Rails 82 that allow the weight of any server or other component to be supported and moved 3. In the illustrated embodiment of FIG. 15A, platform 820 is in the extended position. is located.

[0197] As shown in FIG. 15B, during normal operation, the support member 822 During normal operation, the magazine 810 is retracted relative to the outer housing of the rail 823. In one embodiment, the weight of the magazine 810 can be supported by the support on the rails 823. Regardless of the position of the member 822, it is supported by the support member 822 and the rail 823.

[0198] In some embodiments, a computer, such as a server, utilized in the disclosed embodiments may The components may be denser and / or heavier than traditional computer components. In some embodiments, the weight of the blade server may be reduced due to the increased cooling capacity of the disclosed embodiments. At least about 50 lbs, at least about 60 lbs, at least about 70 lbs about 1 s, at least about 80 lbs, at least about 90 lbs, or at least about 1 In one embodiment, the blade server may weigh up to approximately 500 lbs. lbs, up to about 60 lbs, up to about 70 lbs, up to about 80 lbs For example, the maximum weight can be as much as about 90 lbs or as much as about 100 lbs. Thus, the magazine 810 can hold multiple chassis 400 or blade servers. Each blade server can weigh approximately 73 lbs. When such a server is loaded, the total weight of the Magazine 810 and the server is approximately 395 lbs. It could be.

[0199] In one embodiment, the servers used are blade servers mounted in a chassis. The server and / or chassis are used to install and operate the server in a computing system. In some embodiments, the server may include a backplane system to facilitate easy removal. In some embodiments, individual servers may be immersed servers that do not include fans or other air cooling devices. The board can be configured with 16 GPUs and draw approximately 6KW of power. In an embodiment, the server is a 1.5U server. Such a server may be an OIU server. Such a server is 1.5U high and has immersion cooling. In one embodiment, a single tank in a computing system is configured for , ten 1OIU servers are operated, and all ten servers are operating at full power. In one embodiment, the computer may be configured to provide approximately 60 KW of power when A heating system may include one or two of such tanks. In this embodiment, the computing system may manage multiple tanks, e.g., 10 such tanks. The tank may include:

[0200] In one embodiment, as shown in FIG. 15A, the magazine is When the computer is to be removed from the storage position, the support member moves along the rails from the storage position and The casing is cantilevered externally of the outer housing of the casing system.

[0201] As also shown in Figures 15C-D, the magazine can be pulled out or not. It can slide along the rail and be cantilevered outside the computing system. In an embodiment, as shown in FIGS. 15C-D, the magazine removal tool removes the entire magazine and the magazine. In such an embodiment, the method may be used to remove components contained within the gin. The magazine removal tool lifts the magazine from the support member for transport. It can be used to slide on rails.

[0202] In one embodiment, when the magazine is moved outside the computing system, the program The platform allows the magazine to be rotated to a nearly horizontal position. The servers contained in the magazine can slide out of the magazine.

[0203] 15A-D are exemplary diagrams for removing a server from a magazine, according to an exemplary embodiment. In the illustrated embodiment, the magazine is mounted on a linear guide behind the access door. As shown in Figures 15C-D, the magazine can be attached to a pull rail system. The magazine can be manually inserted and cantilevered outside the computing system. It may be extracted or powered or automated to the computing system. As shown in FIG. 15D, the magazine may be moved to the outside of the stem. The rack may be rotated approximately 90 degrees to orient the servers and / or other components mounted thereon in a generally horizontal position. Once in the generally horizontal position, the servers and / or other components slide out of the magazine. , on a cart or other tool configured to receive the server and / or other components. As shown in Figure 15C, the scissor lift cart can slide The height may be adjusted to accommodate other components. The server can load magazines without requiring a human operator to support the weight of the server. This may be used to allow the device to be transported from the gin onto a cart. Thus, when a server is slid onto a cart having a grinding or rotating surface, the server or other The components will be shipped to another location to be replaced or repaired. It should be appreciated that the magazine can be loaded using essentially the same steps in reverse order. be.

[0204] In an alternative embodiment, the magazine is supported on a rotatable and extendable arm without rails. In such an embodiment, the magazine may be held by the computing system during normal operation. The components in the magazine can be stored in a generally vertical position within the outer housing of the stem. Once it is determined that the magazine should be inserted, it is attached to the outer housing using an extendable arm. When the magazine is extended beyond the outer housing, the magazine The components stored in the magazine are adapted to be removed horizontally from the magazine. The display can be rotated from a substantially vertical position to a substantially horizontal position.

[0205] Bellows In some embodiments, a bellows and / or vapor collection system may be utilized. Before the embodiment is first operated, the dielectric fluid, computer components such as a server, and Other system components may be brought into thermal equilibrium. Computer components such as servers may begin to generate heat that can be dissipated into the dielectric fluid. This process causes a portion of the dielectric fluid to transition from a liquid state to a vapor state. As the body temperature increases, a greater portion of the dielectric fluid can transition to the vapor state. In this system, an increase in the volume of the dielectric vapor will result in an increase in pressure within the system. In some embodiments, the tank containing the dielectric fluid is in fluid and / or vapor communication with the recovery system. It can be a state.

[0206] 16 illustrates a vapor recovery system 900 according to an example embodiment. is connected to a tank 710 containing a dielectric vapor. The dielectric vapor is piped from the tank 710. 905 to one or more bellows 905. In one embodiment, the vapor recovery system The system 900 includes an expanding and contracting bellows 905 configured to receive a dielectric vapor. This reduces or eliminates any pressure buildup in tank 710. When the dielectric vapor is condensed into a dielectric liquid, the bellows It can be folded or contracted to substantially maintain pressure balance.

[0207] In one embodiment, the vapor recovery system 900 allows atmospheric air to be introduced into the vapor recovery system. In such an embodiment, the dielectric vapor is circulated through the atmosphere. By mixing the dielectric vapor with the atmosphere, the temperature of the dielectric vapor is reduced. In one embodiment, the mixed air / steam is directed through a carbon bed 911. The carbon media in the carbon bed 911 may be used to circulate the air through the carbon media. 900, for example, via outlet valve 913. In such an embodiment, the heated dielectric vapor , can be cooled and collected by a carbon medium.

[0208] After operating for a sufficient period of time, an embodiment of the computing system The cooling components reach a stable thermal state based on the power capacity utilized. If more or less computing power is utilized, more or less The dielectric fluid can be transitioned to a dielectric vapor, thereby allowing the bellows 905 to The material may expand and / or contract in response to heat dissipated therein.

[0209] In some embodiments, the bellows 905 may include one or more pouches. The bellows pouch may comprise a metal foil and polymer laminate structure. and may be connected in series or in parallel with each other. The total volume of the liquid fluid in the tank may be at least about 15% of the total liquid fluid volume in the tank. The total volume of the expanded bellows pouch is at least about 20% of the liquid fluid volume of the tank, It may be at least about 23% or at least about 25% or more. In this state, the total volume of the expanded bellows pouch is approximately 40% of the liquid volume of the tank. It may be up to about 30% or up to about 25% or less.

[0210] In some embodiments, once the computing system has substantially reached thermal stability, the steam The air recovery system 900 is closed to the cold atmosphere and the air is exhausted from the system. In some embodiments, the carbon bed may be closed by the valve. In some embodiments, the tank and bellows may be configured to open only using A desorption heater configured to circulate heat through the carbon medium increases the temperature of the carbon medium. As the temperature of the carbon media increases, the carbon dioxide previously captured by the carbon media is released. Any dielectric fluid that is drawn away from the carbon will be returned to the tank, which It can be condensed back into the dielectric fluid as previously described.

[0211] In some embodiments, if the computing system is powered on below its last steady state, In this case, the portion of the dielectric fluid in the vapor state may be reduced, and in some embodiments, the bellows In some embodiments, the bellows may be shrunk to accommodate the loss of dielectric vapor. The valve allowing air to enter the bellows is opened to further reduce the pressure difference. In some embodiments, nitrogen, rather than air, reduces the pressure difference and provides a This may also be used to avoid the introduction of potential contamination from these.

[0212] In some embodiments, the bellows and / or vapor recovery system may be entirely or substantially passive. In some embodiments, the bellows and / or vapor recovery system may be computer-implemented. Sensing from temperature, pressure and / or power sensors located throughout the operating system It can be powered and / or automated based on sensor data.

[0213] In one embodiment, a computing system having a vapor recovery system includes: In some embodiments, the system is emission-free, even if it is not a closed system. Nitrogen is introduced into the system with little or no dielectric fluid released into the surrounding atmosphere. and can be discharged from the system.

[0214] Illustrative Embodiments The disclosed embodiments provide for improved density of computer components and / or computing power. Two-phase immersion cooled computer components 1 in a pressure controlled vessel 110 In some embodiments, including 70, the components are less than about 1 inch, less than about 0.7 inches, or They may be spaced apart from one another by less than about 0.5 inches. In some embodiments, the individual components are: More than about 0.3 inches, more than about 0.5 inches, more than about 0.7 inches, more than about 1 inch, or about 1.5 They may be spaced apart by more than an inch.

[0215] Certain disclosed embodiments provide improved power utilization efficiency (P By using the disclosed embodiments, the computer component 170 This allows for a reduction in the amount of energy used to cool the data center, thereby reducing the total energy consumption. Energy usage is reduced, resulting in a PUE approaching 1.0. Regarding a data center with immersion-cooled computer components in a pressure-controlled vessel 110, , data centers are less than about 1.15, less than about 1.10, less than about 1.08, or less than about 1.05 In one embodiment, a two-phase immersion cooled computer component is pressure-controlled. Regarding the data center provided in the container 110, the data center is greater than about 1.05 and about 1.06 The PUE may be greater than about 1.08 or greater than about 1.10.

[0216] In some embodiments, a heat-conducting, condensable dielectric fluid is used in a two-phase immersion cooling system. The computer components are operated at sub-atmospheric pressure, which is provided by a dielectric fluid. reduces the temperature at which the dielectric fluid vaporizes, resulting in a lower liquid phase compared to standard atmospheric pressure. Computer components generate heat as they operate. Heat is transferred to the dielectric liquid in contact with the computer components, vaporizing the dielectric liquid into a gas. The gaseous dielectric fluid can be condensed using a condenser. Water is passed through a condenser. As the gaseous dielectric fluid is cooled by the condenser, it condenses. The fluid returns to the liquid phase and descends back into the bath of liquid dielectric fluid.

[0217] Some disclosed embodiments relate to high density data centers. Approximately 1 megawatt (MW) of computing power distributed over 10,000 square feet High-end data centers are distributed over approximately 6,000 square feet. The disclosed embodiments may include a two-phase immersion cooled The data center includes a pressure-controlled vessel 110 and a computer component 170 therein. The data centers are approximately 3,000 square feet, approximately 1,500 square feet, and approximately 1,000 square feet. 1MW distributed over approximately 800 square feet or approximately 600 square feet In one embodiment, the disclosed computing system Multiple pressure-controlled vessels containing the systems may be arranged in a row and powered by a central power source. In an embodiment, multiple embodiments of the disclosed computing system are connected in series with each other. It may be continued.

[0218] The disclosed embodiment includes computer components 17 that are immersion cooled within a pressure-controlled vessel 110. 0, whereby the components are immersed in a pressure-controlled vessel and in a dielectric liquid 140. Certain disclosed embodiments require minimal air filtration and and / or cleaning requirements. In one embodiment, the data center , without a HEPA filter or equivalent, and a MERV11 filter or equivalent It operates without a filter or MERV8 filter or its equivalent.

[0219] The disclosed embodiment includes computer components 17 that are immersion cooled within a pressure-controlled vessel 110. 0, so that the components are not cooled by gaseous air. Data that operates without a cooling fan and / or other similar device for circulating air Includes the center.

[0220] The disclosed embodiments relate to an environmentally friendly data center. The computer includes a computer component 170 that is immersion cooled within a pressure-controlled vessel 110. The process consumes little or no water. A closed-circuit dry cooling tower is used to cool the dielectric fluid vapor and condense it into a dielectric fluid liquid. This reduces the temperature of the water circulated through the disclosed condensing structure 130. The embodiment operates as a closed loop without significant water input or output, and the dry cooling tower provides evaporative cooling. It does not rely on water flow for cooling or cooling operations. Less than approximately 10,000 gallons of water per day, Less than approximately 1,000 gallons of water per day, Less than approximately 1,000 gallons of water per day Use less than 100 gallons of water, less than about 10 gallons of water per day, or 0 gallons of water per day Some data center embodiments use and / or discharge more than about 100 gallons per day. Water, more than approximately 1,000 gallons of water per day, more than approximately 10,000 gallons of water per day, and / or discharge.

[0221] The disclosed embodiments may include a pressure controller and / or a pressure regulator operably connected to a vacuum source. a pressure-controlled vessel having an interior and an exterior and configured to contain an atmosphere therein; a vessel containing a volume of a thermally conductive condensable dielectric fluid and a computer component. a rack for carrying out the heat transfer of a predetermined volume when computer components are mounted in the rack; a rack positioned to be at least partially immersed in the dielectric fluid; and a condensation structure. a volume of thermally conductive dielectric fluid, a rack, a computer component, and a condensation structure; In one embodiment, the article is contained within a pressure-controlled vessel. a pressure controller for reducing the internal pressure to below atmospheric pressure; a thermally conductive condensable liquid supply configured to be operably connected to said liquid and vapor phases and configured to condense a predetermined volume of said liquid and vapor phases; a pressure-controlled vessel configured with a dielectric fluid capable of being immersed in the pressure-controlled vessel; and one or more computer-implemented components. The element is at least partially immersed in the liquid phase of a predetermined volume of a thermally conductive, condensable dielectric fluid. and one or more computer components arranged to obtain a gas-phase dielectric fluid. and a condenser for condensing on the body.

[0222] In one embodiment, the pressure controlled vessel is mounted within a host structure and the blade servers are The pressure control vessel is designed to be swappable without interrupting the power supply system. a pressure control vessel operably connected to a water source, a water supply, and a networking connection; a lid configured to sealably close the mouth and the opening, the lid controlling the pressure of the rising steam; The pressure control vessel is configured to direct the pressure from the middle of the vessel to the side of the pressure control vessel, and the pressure control vessel is configured to direct the pressure from the middle of the vessel to the side of the pressure control vessel. 300 cubic feet and / or pressure-controlled vessels with an internal volume between 0.00 cubic feet and approximately 300 cubic feet. The dielectric fluid comprises a ratio of between about 1:3 and about 1:8 of liquid dielectric fluid to gaseous dielectric fluid. The embodiments include ballast blocks, blade servers and blade server chassis, robots, and the like. The airlock is a large disturbance to the atmosphere inside the pressure control vessel. A robot configured to allow access to the interior of a pressure-controlled vessel without Arm and airlock, and / or purge system with a volume of thermally conductive dielectric The system further includes a purge system configured to remove contaminants from the fluid. In this state, the purge system removes a portion of the atmosphere from the pressure control vessel and The dielectric fluid is configured to condense and discard any remaining vapor. In an embodiment, the purge system condenses at least a portion of the gaseous dielectric fluid to remove gaseous contaminants. The device is configured to dispose of the object.

[0223] One embodiment relates to a method of cooling a computer component, the method comprising: providing a housing containing a thermally conductive condensable dielectric fluid and a heat generating The housing contains computer components and is configured to withstand at least a slight vacuum. and a step of operating the computer components, The step of operating the computer components generates heat, and the computer components are in contact with the dielectric fluid. and creating a vacuum within the housing. and wherein the pressure is at least about 1 atmosphere below. maintaining a vacuum in the housing while the computer components are operating; the pressure in the housing is less than about 1 atmosphere; evaporating the dielectric fluid from a liquid state to a gaseous state using heat generated by the condensation; condensing the dielectric fluid from a gaseous state to a liquid state using a device; and removing non-condensable liquid. and / or replacing parts of the computer components while the system is running. The step of removing the non-condensable fluid may include isolating a portion of the gas atmosphere from within the housing. condensing any dielectric fluid from the gas atmosphere; Returning the dielectric fluid to the housing and discarding any remaining portion of the gas atmosphere. and / or the housing is configured to generate convection.

[0224] Some embodiments may be configured to place computer components in contact with the thermally conductive dielectric fluid at sub-atmospheric pressure. In one embodiment, the method comprises operating the computer at full power. The embodiment includes the steps of vaporizing the dielectric fluid and condensing the dielectric fluid at subatmospheric pressure. The device further includes a

[0225] One embodiment relates to a method of cooling a computer component, the method comprising: providing a condensable dielectric fluid in liquid and vapor phases; in at least partial contact with a thermally conductive, condensable dielectric fluid in the liquid phase in the presence of a dielectric fluid. and operating the computer components at sub-atmospheric pressure. The embodiment is configured to generate at least some of the heat generated by operating the computer components. vaporizing the dielectric fluid from a liquid phase to a gas phase using a portion of the dielectric fluid; condensing a portion from the gas phase to a liquid phase; and removing a non-readily condensable fluid from the dielectric fluid. and / or removing at least a portion of the computer component; and replacing at least one computer component while the can.

[0226] One embodiment relates to a method of cooling a computer component, the method comprising: operating the computer components at a pressure at least 1 psi below atmospheric pressure; The thermal component is at least partially in contact with a thermally conductive dielectric fluid, and the dielectric fluid has a boiling point An embodiment may be configured to keep computer components from exceeding approximately 80°C. The method further comprises the step of condensing the dielectric fluid under such conditions.

[0227] Various disclosed embodiments may incorporate some or all of the components even if not described herein. It should be understood that specific components and their characteristics may be included in each specific embodiment. The variations can be adjusted based on the characteristics of the system. and network connection systems, pressure management systems, steam management systems, and specialized This may include a selection of selected equipment and components.

[0228] From the above description, those skilled in the art can easily ascertain the essential features of this disclosure and and various modifications and variations may be made to adapt the present disclosure to various uses and conditions without departing from its scope. The above-described embodiments are for illustrative purposes only and are not intended to be limiting of the scope of the present disclosure. It should not be construed as a limitation of scope.

[0229] Immersion cooling process 1. A method comprising: At least partially immersing the computer components in a thermally conductive, condensable dielectric fluid. The step of: The computer component includes a backplane for receiving power from the rack. It is mounted on a chassis that The computer component is configured to: configured to dissipate heat to the fluid; Steps and condensing the dielectric fluid in the gas phase into the dielectric fluid in the liquid phase using a condenser; The rack is provided with a pressure controller for decreasing or increasing the internal pressure of the tank. The method is described in the tank. 2. The tank shall have at least 300 watts of power distributed over each square foot of space. 2. The method of embodiment 1, wherein the computing power density is 1000 W. 3. The method further comprises the step of removing the chassis from the rack using a robot; 2. The method of embodiment 1, wherein the robot is located within the tank. 4. The method further comprises using the robot to transport the chassis to an airlock. The airlock allows the inside of the tank to be opened without significantly disturbing the pressure inside the tank. 4. The method of embodiment 3, configured to enable access to the section. 5. Opening the inner door of the airlock; placing the chassis in the airlock; closing the inner door of the airlock; Equalizing the pressure in the airlock to atmospheric pressure; opening the outer door of the airlock; 5. The method of embodiment 4, further comprising: 6. The method further includes the step of storing the chassis in a magazine using the robot. The method of embodiment 3. 7. The magazine is located on a platform including a support member, a rotating member, and a rail. The method of embodiment 6, 8. The robot includes a gantry configured to remove, replace, or install the chassis. The method of embodiment 3, wherein the robot is a robot. 9. The gantry robot is configured to move in a horizontal plane and descend vertically. The method of embodiment 8. 10. The robot is configured to remove, replace, or install components of an electrical distribution system. 10. The method of embodiment 9, 11. Embodiment 10, wherein the robot includes a gripping tool for gripping the chassis. How to do it. 12. The method of claim 1, wherein the tank is mounted within a superstructure containing multiple tanks. . 13. The method of embodiment 1, further comprising removing contaminants from the dielectric fluid. 14. The method of embodiment 1, further comprising removing gaseous contaminants. 15. The method further comprises providing power, a network connection, and process fluids to the tank. The method of embodiment 1. 16. The method of embodiment 1, wherein the tank comprises an opening at the top and a removable lid. 17. The tank has an internal volume of between about 100 cubic feet and about 300 cubic feet. The method of embodiment 1. 18. The method of embodiment 1, wherein the chassis does not include a heat sink or a fan. 19. The chassis may include blade servers, processors, power supplies, or interface cards. 2. The method of embodiment 1, comprising: 20. The backplane is for connecting to a 1G or 10G Ethernet interface. Cat6A or Cat7 compatible RJ45 interface for 20. The method of embodiment 19, wherein the device is electrically connected to a power supply.

[0230] Vessel design and construction for immersion cooling 1. An apparatus comprising: a tank configured to hold a thermally conductive condensable dielectric fluid; a pressure controller that decreases or increases the internal pressure of the tank; a rack at least partially immersed in the dielectric fluid; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to move a chassis within the rack; An apparatus comprising: 2. The apparatus includes a modular skid with multiple forklift tubes. , the device of embodiment 1. 3. The tank shall have at least 300 watts of power distributed over each square foot of space. 2. The apparatus of embodiment 1, having a computing power density of 1000 MHz. 4. The device of embodiment 1, wherein the exterior of the device includes a power input and a communications input. 5. The power input and the communication input are electrically connected to a box; The box connects the power input unit and the communication input unit to the rack using a plurality of wires. 5. The apparatus of embodiment 4, 6. The rack includes a backplane configured to distribute power and communication signals to the chassis. 6. The apparatus of embodiment 5, including a plain receiver. 7. The chassis receiving the power and the communication signals from the backplane receiver of the rack; Distributing the power and the communication signals to computer components within the chassis 7. The apparatus of embodiment 6, comprising a backplane configured to: 8. The apparatus of embodiment 5, wherein the plurality of wires does not include plastic insulation. 9. The apparatus of embodiment 5, wherein the rack includes a transformer. 10. The device of embodiment 1, wherein the device is stackable. 11. The device of embodiment 1, wherein the device comprises a magazine for storing replacement components. 12. The robot removes the chassis from the rack and places the chassis in the magazine. 12. The device of embodiment 11, configured to be placed in 13. The magazine is positioned on a platform including a rotating member, a support member, and a rail. The device of embodiment 12. 14. The platform is configured to guide the magazine out of the device. The device of embodiment 13. 15. The device includes a desiccant configured to remove water vapor contaminants from the device. , the device of embodiment 1. 16. Reservoir area and A pump and Filters and and a pump for pumping the dielectric fluid into the reservoir portion of the tank. The dielectric fluid is removed from the reservoir area and passed through the filter. The device of embodiment 1. 17. The apparatus of embodiment 1, wherein the dielectric fluid has a boiling point in the range of 20°C to 100°C. . 18. The dielectric fluid is (CF3)2CFCF2OCH3, C4F9OCH3 or Chemicals with the formula CF3CF2CF2CF2OCH3, hydrofluoroethers, or methacrylates 2. The device of embodiment 1, comprising methyl-nonafluorobutane. 19. The device must operate if any of the lids or doors of the device are not secured. 2. The apparatus of embodiment 1, further comprising a lock to prevent 20. A system that shuts down the power to the device in the event of unauthorized access to the lid or door. 20. The apparatus of embodiment 19, further comprising a controller configured to:

[0231] Robotics and Automation for Immersion Cooling 1. An apparatus comprising: a tank configured to hold a thermally conductive condensable dielectric fluid; a pressure controller that decreases or increases the internal pressure of the tank; a computer component at least partially immersed in the dielectric fluid; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to retrieve the computer component; An apparatus comprising: 2. The apparatus of embodiment 1, further comprising an airlock. 3. The apparatus of embodiment 2, wherein the airlock includes an inner door and an outer door. 4. The airlock permits the dielectric fluid in the gas phase to be pumped out before the outer door is opened. 4. The apparatus of embodiment 3, configured to receive an inert gas to be used. 5. The apparatus of embodiment 3, wherein the robot is located outside the tank. 6. The apparatus of embodiment 3, wherein the robot is located within the tank. 7. The robot removes the computer component from the rack and 7. The apparatus of embodiment 6, configured to transport components to the airlock. 8. The robot further comprises: opening the inner door of the airlock; placing said computer components in said airlock; closing the inner door of the airlock; Equalizing the pressure in the airlock to atmospheric pressure; Opening the outer door of the airlock The device of embodiment 7, configured as follows. 9. The apparatus of embodiment 8, further comprising a second robot located outside the tank. 10. The second robot activates the computer component when the outer door is opened. 10. The apparatus of embodiment 9, configured to remove from the airlock. 11. The second robot is configured to place the computer component into a storage slot. The device of embodiment 9 is configured as follows. 12. The airlock is configured to equalize the pressure in the airlock after the outer door is closed. 10. The apparatus of embodiment 9, configured to: 13. The device is configured to receive instructions from a server located external to the device. , the device of embodiment 1. 14. An embodiment in which the computer component is located within a chassis that displays an asset tag. State 1 device. 15. The robot scans the asset tag and stores the asset tag in a management system. 15. The apparatus of embodiment 14, configured to relay to 16. The robot is configured to remove, replace, or install the computer component. 2. The apparatus of embodiment 1, wherein the apparatus is a gantry robot. 17. An embodiment in which the gantry robot is configured to move horizontally and vertically. 8 devices. 18. The robot is configured to remove, replace, or install components of an electrical distribution system. The device of embodiment 1. 19. The apparatus of embodiment 18, wherein the component of the power distribution system is a transformer or a power supply. Place. 20. The robot includes a grasping tool for grasping the computer component. The device of embodiment 1.

[0232] Ballast blocks for immersion cooling 1. An apparatus comprising: A tank, A reservoir portion for holding a thermally conductive condensable dielectric fluid and computer components. and, a shelf portion configured to hold at least one ballast block; a tank comprising: a pressure controller that decreases or increases the internal pressure of the tank; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to retrieve the computer component; An apparatus comprising: 2. The device of embodiment 1, wherein the bottom point of the tub portion has a height that is lower than the height of the shelf portion. Place. 3. The bath portion is configured such that the computer components are at least partially immersed in the dielectric fluid. 2. The device of embodiment 1, configured to be immersed. 4. The computer component is a blade server, a processor, a power supply, or a transformer. The device of embodiment 3. 5. The height of the dielectric fluid is sufficient to cover at least a portion of the shelf portion. The device of embodiment 1. 6. The apparatus of embodiment 1, wherein the shelf portion is adjacent to the condenser. 7. An embodiment, wherein the shelf portion is configured to receive condensed dielectric fluid from the condenser. The apparatus of embodiment 6. 8. The ballast block displaces the dielectric fluid from the shelf to the area above the tank portion. 2. The apparatus of embodiment 1, configured to occupy a volume of the tank on the shelf so as to 9. The ballast block is configured so that the dielectric fluid flows under the ballast block. 2. The apparatus of embodiment 1, including a plurality of riser feet for enabling 10. The device of embodiment 1, wherein the ballast block is not soluble in the dielectric fluid. Place. 11. The ballast block is made of metal, rubber, silicone, or polymer. State 1 device. 12. The apparatus of embodiment 1, wherein the ballast block is denser than the dielectric fluid. . 13. The ballast block has a handle for removing or replacing the ballast block. 2. The device of embodiment 1, having a notch or plate. 14. The robot uses the handle, the notch, or the plate to 14. The apparatus of embodiment 13, configured to lift the lift block. 15. The ballast block is not attached to other ballast from the top or bottom side of the ballast block. 2. The apparatus of embodiment 1, configured to interlock with a block. 16. The interlock prevents the other ballast blocks from sliding. , The device of embodiment 15. 17. The other ballast block is located on the top or bottom side of the ballast block. 16. The apparatus of embodiment 15, configured to be present. 18. The ballast block has a recess on the upper side thereof, thereby The riser feet of the other ballast block are positioned in the recesses of the ballast block. 16. The device of embodiment 15, configured to lock together. 19. The ballast blocks are configured to span at least 40% of the total length of the shelf portion. The device of embodiment 1. 20. The ballast blocks are approximately 2 feet long, 8 inches wide, and 1 inch high. 2. The device of embodiment 1, having an exterior dimension.

[0233] Server case for immersion cooling 1. An apparatus comprising: a tank configured to hold a thermally conductive condensable dielectric fluid; a pressure controller that decreases or increases the internal pressure of the tank; a chassis at least partially immersed in the dielectric fluid; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to retrieve the chassis; An apparatus comprising: 2. The apparatus of embodiment 1, wherein the chassis does not require a heat sink or fan. 3. The apparatus of embodiment 1, wherein the chassis includes a blade server. 4. Embodiment 1, wherein the chassis includes a processor, a power supply, or an interface card. Equipment. 5. The interface card is a 1G or 10G Ethernet interface. Embodiment 4: A Cat6A or Cat7 compatible RJ45 interface for connection. Equipment. 6. The apparatus of embodiment 1, wherein the chassis is removably mounted to a rack. 7. The chassis has a slot-in type interface between the chassis and the rack. 7. The apparatus of embodiment 6, comprising the provided backplane. 8. The backplane divides the power and signals received from the rack within the chassis. 8. The apparatus of embodiment 7, configured to distribute 9. The backplane transmits power and data to the blade servers via cables. 9. The device of embodiment 8, configured to: 10. The chassis is a substantially rectangular box having a back wall and two side walls,

[0023] an embodiment in which a face wall has a plurality of holes to facilitate circulation of the dielectric fluid within the chassis. 1 device. 11. The chassis of embodiment 10, wherein the chassis includes a guide rail on each of the two side walls. Device. 12. The chassis has a mounting interface for holding computer components. The device of embodiment 1, comprising: 13. The chassis has a plane, and the robot uses the plate to move the chassis. 2. The device of embodiment 1, configured to lift a shi. 14. The apparatus of embodiment 1, wherein the chassis includes a microcontroller. 15. The microcontroller A sensor mounted on the chassis determines whether the chassis is properly positioned in the rack. receiving sensor data indicating whether Transmitting the sensor data to a management system The device of embodiment 14, configured as follows. 16. The microcontroller receiving a power signal from the management system; Sending the power signal to a switch configured to interrupt the power in the chassis do The device of embodiment 14, configured as follows. 17. The microcontroller receiving operational data from computer components mounted within the chassis; Transmitting the operational data to the management system The device of embodiment 14, configured as follows. 18. The microcontroller controls the electrical and communication equipment of the blade server. The device of embodiment 14, configured as follows: 19. The device of embodiment 1, wherein the chassis comprises an RFID tag. 20. The robot scans the RFID tag and sends a signal to a management system. The device of embodiment 19, configured as follows.

[0234] Vapor management for immersion cooling using bellows 1. An apparatus comprising: A thermally conductive condensable dielectric fluid and a computer component are configured to hold the thermally conductive condensable dielectric fluid. The tank and a pressure controller that decreases or increases the internal pressure of the tank; a vapor management system for condensing the dielectric fluid in a vapor phase; a robot configured to retrieve the computer component; An apparatus comprising: 2. The apparatus of embodiment 1, wherein the vapor management system includes a condensation structure within the tank. 3. The method of embodiment 2, wherein the condensation structure includes a heat-conducting tube, a coil, and a heat-dissipating fin. Device. 4. The condensation structure is connected to a source of cooling liquid so that the cooling liquid passes through the condensation structure. 3. The apparatus of embodiment 2, configured to be coupled to 5. The apparatus is configured to cool the cooling liquid using an evaporative or dry cooling tower. The device of embodiment 2. 6. The apparatus of embodiment 2, wherein the vapor management system includes an intake pipe and an exhaust pipe. 7. The intake pipe receives a refrigerant from a refrigerated refrigerant source and transfers the refrigerant to the condenser. 7. The apparatus of embodiment 6, configured to be guided to a structure. 8. The discharge pipe receives the coolant from the condensation structure and delivers the coolant to the cooled coolant. 7. The apparatus of embodiment 6, configured to return the refrigerant to a source. 9. The vapor management system includes a storage unit for storing the dielectric fluid. Form 1 device. 10. The vapor management system directs the dielectric fluid from the storage unit to the tank. 10. The device of embodiment 9, configured to direct 11. The vapor management system includes a vapor storage unit for storing vapor of the dielectric fluid. 2. The apparatus of embodiment 1, comprising: 12. The apparatus of embodiment 11, wherein the vapor storage unit is a bellows. 13. The bellows expands or contracts to maintain the internal pressure of the tank. 13. The apparatus of embodiment 12, configured 14. The device of embodiment 12, wherein the bellows comprises one or more pouches. 15. The vapor storage unit allows the introduction of air into the vapor management system. 12. The apparatus of embodiment 11, comprising a valve for reducing the temperature of said vapor of dielectric fluid. 16. The vapor storage unit comprises a carbon bed that separates the dielectric fluid vapor from the air. 16. The apparatus of embodiment 15, operably connected to 17. The carbon bed is heated to increase the temperature of the carbon bed. 17. The apparatus of embodiment 16, comprising a desorption heater configured to raise the temperature. 18. The apparatus of embodiment 1, wherein the vapor management system comprises a filter. 19. The device of embodiment 17, wherein the filter is configured to remove air and water vapor. Place. 20. The steam management system comprises: an inert gas storage unit; During start-up or shutdown operations, the inert gas storage unit may leak into the tank. 2. The apparatus of embodiment 1, configured to input an active gas.

Claims

1. 1. An apparatus comprising: a tank configured to contain a thermally conductive condensable dielectric fluid and computer components; a pressure control device for decreasing or increasing the internal pressure of the tank; a vapor management system for condensing the vapor phase of the dielectric fluid; a robot configured to pick up the computer component; the vapor management system includes a vapor storage unit for storing vapor of the dielectric fluid; The vapor storage unit comprises: an apparatus comprising a valve for admitting air into the vapor management system to reduce the temperature of the vapor of the dielectric fluid, and operably connected to a carbon bed to separate the vapor of the dielectric fluid from an air / vapor mixture of the air and the vapor of the dielectric fluid.

2. The apparatus of claim 1 , wherein the vapor management system includes a condensing structure within the tank.

3. The apparatus of claim 2 , wherein the condensation structure comprises a thermally conductive tube, a coil, or a heat dissipation fin.

4. The apparatus of claim 2 , wherein the condensing structure is connected to a source of cooling liquid, and the cooling liquid is configured to pass through the condensing structure.

5. The apparatus of claim 2 , wherein the apparatus is configured to cool the cooling liquid using evaporative cooling or a dry cooling tower.

6. The apparatus of claim 2 , wherein the vapor management system includes an intake pipe and an exhaust pipe.

7. The apparatus of claim 6 , wherein the intake pipe is configured to receive coolant from a source of chilled coolant and to direct the coolant to the condensing structure.

8. The apparatus of claim 6 , wherein the discharge pipe is configured to receive the cooling liquid from the condensing structure and return the cooling liquid to the cooled source.

9. The apparatus of claim 1 , wherein the vapor management system includes a storage unit for storing the dielectric fluid.

10. The apparatus of claim 9 , wherein the vapor management system is configured to direct the dielectric fluid in the tank from the storage unit.

11. The apparatus of claim 1 , wherein the vapor storage unit is a bellows.

12. 12. The apparatus of claim 11, wherein the bellows is configured to expand or contract to maintain the internal pressure of the tank.

13. The device of claim 11 , wherein the bellows comprises one or more pouches.

14. 10. The apparatus of claim 1, wherein the carbon bed comprises a desorption heater that heats the carbon bed to increase the temperature of the carbon bed.

15. 10. The apparatus of claim 1, wherein the vapor management system comprises an inert gas storage unit and is configured to introduce inert gas from the inert gas storage unit into the tank during startup or shutdown operations.

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