Light emitting device package and lighting device including the same

Abstract

The lighting device disclosed in the embodiment of the present invention includes a circuit board, a plurality of light emitting device packages arranged on the circuit board, a resin layer covering the plurality of light emitting device packages, and a layer on the resin layer for diffusing or reflecting light, wherein each light emitting device package includes a body having a cavity in which a first side portion facing the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, and a portion of a front portion are opened, a plurality of frames arranged at a bottom of the cavity, and a plurality of lead frames each having a bonding portion bent from each of the plurality of frames to the first side portion, and a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity, wherein the cavity may have a length equal to the length of the body in a first direction.

Description

[Technical Field]

[0001] An embodiment of the present invention relates to a light emitting device package and a lighting device including the same. [Background technology]

[0002] The light emitting device package may be, for example, a device having a light emitting diode (LED). The LED is a semiconductor device that converts electrical energy into light and is gaining attention as a next-generation light source that replaces fluorescent lamps and incandescent lamps. Because the LED generates light using a semiconductor device, it consumes significantly less power than incandescent lamps, which generate light by heating tungsten, or fluorescent lamps, which generate light by irradiating phosphors with ultraviolet light generated through high-voltage discharge. Because the LED generates light using a semiconductor device, it has longer lifespans, faster response characteristics, and is environmentally friendly compared to existing light sources. Furthermore, LEDs are used in various indoor and outdoor lighting devices, such as lamps, liquid crystal displays, electric signage, vehicle lighting, and street lights. Summary of the Invention [Problem to be solved by the invention]

[0003] An embodiment of the present invention provides a side-view type light emitting device package capable of emitting light from multiple sides and a lighting device having the same. An embodiment of the present invention provides a side-view type light emitting device package that emits light from two side surfaces adjacent to a front surface and a lighting device having the same. An embodiment of the present invention provides a lighting device having a member disposed on an upper portion of the light emitting device package and blocking light emitted from the front surface and both side surfaces of the light emitting device package. An embodiment of the present invention provides a lighting device that provides surface light using light emitted from the front surface and both side surfaces of the light emitting device package. [Means for solving the problem]

[0004] An illumination device disclosed in an embodiment of the present invention includes a circuit board, a plurality of light emitting device packages arranged on the circuit board, a resin layer covering the plurality of light emitting device packages, and a layer on the resin layer for diffusing or reflecting light, wherein each of the light emitting device packages includes a body having a cavity with a first side portion facing the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, and a front portion partially opened, a plurality of frames arranged at a bottom of the cavity, a plurality of lead frames each having a plurality of bonding portions bent from each of the plurality of frames to the first side portion, and a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity, wherein the third side portion and the fourth side portion of the body are arranged in a first direction of the body, and the front portion and the rear portion of the body are arranged on both sides of a second direction perpendicular to the first direction, and the cavity may have a length equal to the length of the body in the first direction.

[0005] According to an embodiment of the present invention, the cavity includes a first reflective support member arranged on one of the frames adjacent to the third side portion and a second reflective support member arranged on another of the frames adjacent to the fourth side portion, and the first and second reflective support members may be arranged concavely from the front surface at the bottom of both sides in the first direction of the cavity.

[0006] According to an embodiment of the present invention, a molding member may be included in the cavity, and the length of the molding member may be the same as the length of the cavity in the first direction. The molding member may be exposed to a front portion and third and fourth side portions of the body, respectively.

[0007] According to an embodiment of the present invention, the light-emitting device may include a diffusion layer on the resin layer for diffusing light, and a light-transmitting layer and a light-shielding portion between the resin layer and the diffusion layer, and the light-shielding portion may vertically overlap the light-emitting device package. The light-shielding portion may cover a front portion of the light-emitting device package, and the light-shielding portion may include first and second sub-light-shielding portions covering third and fourth side portions of a body of the light-emitting device package. The first and second sub-light-shielding portions may be spaced apart from each other in a first direction and extend further on both sides in the first direction and rearward in the second direction than the third and fourth side portions of the light-emitting device package.

[0008] According to an embodiment of the present invention, the light-shielding part may include a diffusion layer disposed on the resin layer, and a light-shielding part having an optical pattern part between the resin layer and the diffusion layer, and the optical pattern part of the light-shielding part may have a plurality of recesses that vertically overlap the light-emitting device package.

[0009] According to an embodiment of the present invention, a first reflective layer that reflects light may be provided on the resin layer, and the circuit board, the resin layer, and the first reflective layer may include a plurality of convex surfaces that protrude from the front surface of the light emitting device package with convex curved surfaces.

[0010] According to an embodiment of the present invention, the lead frame includes a first lead frame and second and third lead frames on both sides of the first lead frame, the light emitting chips include a plurality of light emitting chips mounted in a flip shape on each of the frames of the first, second, and third lead frames, and the frame of the first lead frame may include a groove region where the top layer is removed between the plurality of light emitting chips.

[0011] An illumination device according to an embodiment of the present invention includes a circuit board and a plurality of light emitting device packages arranged on the circuit board, each of the light emitting device packages including a body having a first side portion facing the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, and a cavity with a front portion partially opened; a plurality of lead frames arranged on a bottom of the cavity and each of the lead frames having a plurality of bonding portions bent from each of the plurality of frames to the first side portion; a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity; and a molding member within the cavity, wherein the third side portion and the fourth side portion of the body are arranged in a first direction of the body, and the front and rear portions of the body are arranged on both sides of a second direction perpendicular to the first direction, the cavity may have the same length as the length of the body in the first direction, and the length of the molding member may be the same as the length of the cavity in the first direction.

[0012] According to an embodiment of the present invention, the cavity includes a first reflective support member arranged on one of the frames adjacent to the third side portion and a second reflective support member arranged on another of the frames adjacent to the fourth side portion, and the first and second reflective support members are arranged concavely from the front portion at the bottom of both sides in the first direction of the cavity and may contact the molding member. [Effects of the Invention]

[0013] The present invention may improve the light extraction efficiency and heat dissipation efficiency of a light emitting device package. The present invention may improve the uniformity of surface light using light emitted from the light emitting device package, and may improve the luminous flux of the light emitting device package and a lighting device including the same. The present invention may improve the reliability of the light emitting device package and a lighting device including the same. [Brief explanation of the drawings]

[0014] [Figure 1]1 is a plan view showing a light emitting device package according to a first embodiment of the present invention. [Figure 2] 2 is a cross-sectional view of the light-emitting device package of FIG. 1 taken along the AA side. [Figure 3] FIG. 2 is an example of a bottom view of the light-emitting element package of FIG. [Figure 4] 2 is an example of a lighting module in which the light emitting element package of FIG. 1 is disposed on a circuit board. [Figure 5] 5 is another side view of the lighting module of FIG. 4. FIG. [Figure 6] 2 is a plan view showing an example of a lighting device having the light-emitting element package of FIG. 1. FIG. [Figure 7] 7A and 7B are diagrams for explaining the shape of a light blocking portion and light distribution in the lighting device of FIG. 6. [Figure 8] 7 is a cross-sectional view of the CC side of the lighting device of FIG. 6. [Figure 9] 7 is a modified example of the light blocking portion in the lighting device of FIG. [Figure 10] 1. FIG. 4 is a plan view showing another example of a lighting device having the light-emitting element package of FIG. [Figure 11] FIG. 11 is a side cross-sectional view of the lighting device of FIG. [Figure 12] 11A and 11B are diagrams illustrating light distributions according to the shapes of the convex portions of the lighting device of FIG. [Figure 13] 1 is a plan view of a vehicle to which a lamp having a lighting device or a lighting module according to an embodiment of the present invention is applied; [Figure 14] 14 shows a lamp having the lighting module or lighting device of FIG. 13. Best Mode for Carrying Out the Invention

[0015] Hereinafter, with reference to the accompanying drawings, preferred embodiments that will enable those skilled in the art to easily implement the present invention will be described in detail. However, it should be understood that the embodiments described herein and the configurations shown in the drawings are merely preferred embodiments of the present invention, and that various equivalents and modifications may exist at the time of filing this application. In describing the operating principles of preferred embodiments of the present invention in detail, if a detailed description of related known functions or configurations is deemed to unnecessarily obscure the gist of the present invention, such detailed description will be omitted. The terms used below are defined in consideration of the functions in the embodiments of the present invention, and the meaning of each term should be interpreted based on the content of the entire specification. The same drawing numbers will be used throughout the drawings for parts having similar functions and functions. The embodiments described herein and the configurations shown in the drawings are preferred embodiments of the present invention, and do not represent all technical concepts of the present invention. Therefore, various equivalents and modifications may exist at the time of filing this application. Hereinafter, embodiments will become clear through the accompanying drawings and explanations of the embodiments. In the description of the embodiments, when a layer (film), region, pattern, or structure is described as being formed "on" or "under" a substrate, layer (film), region, pad, or pattern, "on" and "under" include those formed "directly" or "indirectly" through another layer. Furthermore, the terms "on" and "under" refer to those formed with reference to the drawings. Throughout this specification, "front" or "front face" and "rear" or "rear face" refer to the direction of viewing the package from the Y direction, "left side" and "right side" refer to the direction of viewing the package from the X direction, and the "upper" and "lower" directions may refer to the direction of viewing the package from the Z direction.

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a light emitting device package, a lighting module and a lighting device having the same according to embodiments of the present invention will be described with reference to the accompanying drawings.

[0017] FIG. 1 is a plan view showing a light-emitting element package according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the light-emitting element package of FIG. 1 taken along line AA, FIG. 3 is an example of a bottom view of the light-emitting element package of FIG. 1, FIG. 4 is an example of a lighting module in which the light-emitting element package of FIG. 1 is arranged on a circuit board, and FIG. 5 is another side view of the lighting module of FIG. 4.

[0018] 1 to 3, a light emitting device package 100 according to an embodiment of the present invention includes a body 10 having a cavity 15A, a plurality of lead frames 20, 30, and 40 at the bottom of the cavity 15A, and at least one of the plurality of lead frames 20, 30, and 40. The light emitting device package 100 may be implemented as a side-view type package and may be applied to mobile phones, mobile computers, various lighting fields, vehicle lamps, or display devices. For convenience of explanation, in the light emitting device package 100, a first direction may be an X direction or a longitudinal direction of the package, a second direction may be a Y direction or a width direction of the package, and a third direction may be a Z direction or a thickness direction of the package.

[0019] The light emitting device package 100 is a package having a length in one direction longer than in other directions. For example, the length of the body 10 in the first direction X may be at least twice, for example, in a range of 2 to 4.5 times, the thickness T1 in the third direction Z. The length of the body 10 in the first direction X may be at least twice the lengths of the body 10 in the second and third directions. The length of the body 10 in the first direction X may be 3 mm or more, for example, in a range of 3 mm to 7 mm, or in a range of 4.5 mm to 6 mm. The thickness T1 of the light emitting device package 100 may be 1.5 mm or less, for example, in a range of 0.6 mm to 1.5 mm. The light emitting device package 100 may have a relatively thin thickness T1, thereby reducing the thickness of a lighting module or lamp including the light emitting device package 100. The thickness T1 of the light emitting device package 100 may be the same as or greater than the thickness of the body 10.

[0020] Because the body 10 has a long length in the first direction X, the exit area or light-emitting area of ​​the cavity 15A may be larger in the first direction X than in other directions. Furthermore, because the light-emitting area of ​​the cavity 15A is larger in the first direction X, each of the light-emitting chips 71 and 72 may have a length (e.g., length in the X direction) greater than its width (e.g., length in the Z direction), e.g., a rectangular shape. Each of the light-emitting chips 71 and 72 may have a length that is at least twice as long as its width, e.g., between two and three times. The light-emitting device package 100 is provided as a package having a thin body 10 and a long length in the first direction, thereby further reducing the thickness of the light-emitting module as shown in FIGS. 5 and 6 and providing a larger light directivity angle in the first direction X. Because the light-emitting device package 100 has a long length in the first direction X, the number of light-emitting chips 71 and 72 arranged in the first direction can be increased.

[0021] The body 10 may be coupled to a plurality of lead frames 20, 30, and 40. The body 10 may be formed of an insulating material. The body 10 may be formed of a reflective material. The body 10 may be formed of a material having a higher reflectivity than a higher transmittance for the wavelengths emitted from the light emitting chips 71 and 72. The body 10 may be formed of a resin-based insulating material, for example, a thermosetting resin including polyphthalamide (PPA), a silicone-based material, an epoxy-based material, or a plastic material, or a highly heat-resistant and light-resistant material. The body 10 may include a white-based resin. The body 10 may include a reflective material, for example, a resin material containing a metal oxide, and the metal oxide may include at least one of TiO2, SiO2, and Al2O3. Such a body 10 may effectively reflect incident light. As another example, the body 10 may be formed of a translucent resin material or a resin material containing a phosphor that converts the wavelength of incident light.

[0022] The body 10 may include a first side portion 11 and a second side portion 12 disposed on both sides in the third direction Z, and third and fourth side portions 13 and 14 disposed on both sides in the first direction X. The first side portion 11 and the second side portion 12 may be the lower and upper sides of the body 10. The third and fourth side portions 13 and 14 may be adjacent to the first side portion 11 and the second side portion 12, respectively, and may be one side and the other side of the body 10. The body 10 may include a front portion 15 and a rear portion 16 on both sides in the second direction Y, and the front portion 15 and the rear portion 16 may be the front (i.e., front side) and rear (i.e., rear side) of the body 10.

[0023] The first and second side portions 11 and 12 may be long sides having the length of the body 10, the third and fourth side portions 13 and 14 may be short sides having the width of the body 10, and the front portion 15 and rear portion 16 may be long sides having the length of the body 10. The first side portion 11 of the body 10 may be a side facing the circuit board 401 disclosed in FIG. 4. The third and fourth side portions 13 and 14 may be sides perpendicular to the top surface of the circuit board 401. The length of the body 10 in the first direction X is the distance between the third and fourth side portions 13 and 14, and may be more than twice the distance (i.e., thickness) between the first and second side portions 11 and 12. The front portion 15 of the body 10 may be a surface where the cavity 15A is opened and may be a surface perpendicular to the top surface of the circuit board 401. The rear surface 16 opposite to the front surface 15 is perpendicular to the circuit board 401 and may include a recess 16B recessed toward the front surface 15.

[0024] The lead frames 20, 30, and 40 may be spaced apart from the bottom of the cavity 15A in the first direction X. Two or three of the lead frames 20, 30, and 40 may be disposed on the bottom of the cavity 15A and may be electrically connected to the light emitting chips 71 and 72. When there are three lead frames 20, 30, and 40, one of them may be positive polarity and the other two may be negative polarity. The lead frames 20, 30, and 40 may include three frames, for example, a first lead frame 20, a second lead frame 30, and a third lead frame 40.

[0025] The cavity 15A may include first and second inner surfaces 11A and 12A. The first inner surface 11A is adjacent to the first side surface 11 and may be inclined or curved from the front surface 15 toward the bottom of the cavity 15A. The second inner surface 12A is adjacent to the second side surface 12 and may be inclined or curved from the front surface 15 toward the bottom of the cavity 15A. The first and second inner surfaces 11A and 12A may face each other. The cavity 15A of the body 10 may be open at the front surface 15 and on both sides in the first direction X. Light emitted from the light emitting chips 71 and 72 may be emitted from a front light emitting surface 111 of the cavity 15A. The lengths of the first and second inner surfaces 11A and 12A of the cavity 15A may be the same as the length of the body 10 in the first direction X. The length of the bottom of the cavity 15A may be the same as the length of the body 10 in the first direction X. The body 10 may include a first bottom support 13A disposed on one side of the bottom of the cavity 15A between the lead frames 20, 30, and 40 and the third side surface 13, and a second bottom support 14A disposed on the other side of the bottom of the cavity 15A between the lead frames 20, 30, and 40 and the fourth side surface 14.

[0026] The first bottom support 13A of the body 10 supports the second lead frame 30 on one side of the bottom of the cavity 15A adjacent to the third side portion 13, and the second bottom support 14A supports the third lead frame 40 on the other side of the bottom of the cavity 15A adjacent to the fourth side portion 14. The first bottom support 13A and / or the second bottom support 14A may be removed, in which case, surfaces of the second and third lead frames 30 and 40 may be exposed on one and the other sides of the bottom of the cavity 15A. As shown in FIG. 2, the first and second bottom support portions 13A and 14A may be positioned lower than the top surfaces of the light emitting chips 71 and 72. A gap A2 between the top surfaces of the first and second bottom support portions 13A and 14A and the top surfaces of the light emitting chips 71 and 72 may be 30% or more of the thickness of the light emitting chips 71 and 72, for example, in the range of 30% to 90%. The cavity 15A includes side emission surfaces 112 and 113 that are open to the tops of the third and fourth side surfaces 13 and 14. The side emission surfaces 112 and 113 are open areas of the first and second bottom support portions 13A and 14A, and light emitted from the light emitting chips 71 and 72 can be emitted in both directions. The side emission surfaces 112 and 113 may be defined as first and second emission surfaces 112 and 113. The first bottom support portion 13A may extend from the upper surface of the second frame 31 of the second lead frame 30 to the third side surface 13, and the second bottom support portion 14A may extend from the upper surface of the third frame 41 of the third lead frame 40 to the fourth side surface 14. The first and second bottom support portions 13A and 14A may have inclined inner surfaces or have an inclined overall upper surface.

[0027] A height A3 of the side light-emitting surfaces 112, 113 of the cavity 15A may be smaller than the height from the upper surfaces of the second and third frames 31, 41 to the upper end of the cavity 15A or the upper end of the body 10, and may be larger than the distance from the upper surfaces of the light-emitting chips 71, 72 to the upper end of the cavity 15A or the upper end of the body 10. A distance A1 between the third side surface portion 13 and the first light-emitting chip 71 and between the fourth side surface portion 14 and the second light-emitting chip 72 may be smaller than the distance between the first and second light-emitting chips 71, 72 and larger than the length of the upper surfaces of the first and second bottom support portions 13A, 14A.

[0028] The depth of the cavity 15A is the distance from the front surface 15 of the body 10 to the bottom of the cavity 15A, and may be less than one-third of the length of the body 10 in the second direction Y, for example, in the range of 0.3 mm±0.05 mm. If the depth of the cavity 15A is less than this range, it may be difficult to control the light beam angle, and if it exceeds this range, there may be problems such as an increase in the length of the body 10 in the second direction Y or a narrow light beam angle. Here, the depth of the cavity 15A may be minimum on the top surfaces of the first and second bottom support parts 13A and 14A.

[0029] The lead frames 20, 30, and 40 are disposed at the bottom of the cavity 15A and may be partially bent to extend toward the first side surface 11 of the body 10. The lead frames 20, 30, and 40 may include a first lead frame 20 and second and third lead frames 30 and 40 spaced apart from the first lead frame 20. The first lead frame 20 may be disposed between the second and third lead frames 30 and 40. The lead frames 20, 30, and 40 may include at least one of Cu, Al, Ni, Au, and Ag and may be formed as a single layer or multiple layers. Au may be formed on the surfaces of the lead frames 20, 30, and 40 for bonding. The thickness of the lead frames 20, 30, and 40 may be 0.08 mm or greater, for example, in the range of 0.08 mm to 0.2 mm. If the thickness is less than this range, heat dissipation efficiency and heat conduction efficiency may be reduced, and if the thickness is greater than this range, the package thickness may be increased.

[0030] The first lead frame 20 may include a first frame 21 disposed at the center of the bottom of the cavity 15A and a first bonding portion 22 bent from the first frame 21 to the first side surface 11. The second lead frame 30 may include a second frame 31 disposed on one side of the bottom of the cavity 15A and a second bonding portion 32 bent from the second frame 31 toward the first side surface 11. The third lead frame 40 may include a third frame 41 disposed on the other side of the bottom of the cavity 15A and a second bonding portion 42 bent from the third frame 41 toward the first side surface 11.

[0031] The light emitting chips 71 and 72 may include a first light emitting chip 71 bonded and electrically connected to the first frame 21 and the second frame 31, and a second light emitting chip 72 bonded and electrically connected to the first frame 21 and the third frame 41. The first and second light emitting chips 71 and 72 may be arranged using a flip-chip method. Alternatively, the first and second light emitting chips 71 and 72 may be selectively connected to at least one of the first, second, and third frames 21, 31, and 41 using wires. An Au layer or a top layer bonded to pads of the light emitting chips 71 and 72 may be formed on the surfaces (or upper surfaces) of the first, second, and third frames 21, 31, and 41. To reduce the area of ​​the Au layer or top layer, a groove region 21A in which the Au layer or top layer is removed may be formed in a portion of the surface (or upper surface) of the first frame 21, i.e., a center region. The groove region 21A may be lower than the surface (or upper surface) of the first frame 21, exposing a layer below the uppermost layer, such as a Cu, Al, or Ag layer. This reduces the plating area of ​​the Au layer, thereby reducing the spacing between lead frames. The length of the groove region 21A in the first direction X may be longer than the lengths of the light emitting chips 71 and 72, and the width in the third direction Z may be the width of the bottom of the cavity 15A.

[0032] The body 10 includes separators 18 and 19 disposed at the bottom of the cavity 15A, and the separators 18 and 19 may be disposed between the first frame 21 and the second frame 31, and between the first frame 21 and the third frame 41, respectively. The separators 18 and 19 may be disposed parallel to each other or in a diagonal line shape. The separators 18 and 19 and the first and second bottom support portions 13A and 14A may be made of the same material or different materials.

[0033] 1 and 3, the first bonding portion 22 of the first lead frame 20 may be disposed at the center of the first side surface 11 of the body 10 and bent toward the rear surface 16. The first lead frame 20 may include a plurality of connecting portions 25, 26, and 27 and a plurality of coupling holes H1 and H2 disposed between the connecting portions 25, 26, and 27. The connecting portions 25, 26, and 27 and the coupling holes H1 and H2 may be part of the first bonding portion 22. The connecting portions 25, 26, and 27 may be bent from the first frame 21 toward the first side surface 11 and disposed in a direction from the second bonding portion 32 to the third bonding portion 42, respectively. The coupling holes H1 and H2 may be disposed between the connecting portions 25, 26, and 27, respectively. For example, the number of the connecting portions 25, 26, and 27 may be greater than the number of the coupling holes H1 and H2. The connecting portions 25, 26, and 27 may include a first connecting portion 25, a second connecting portion 26, and a third connecting portion 27 spaced apart in the first direction X, and the connecting holes H1 and H2 may include a first connecting hole H1 and a second connecting hole H2 spaced apart in the first direction X. The second connecting portion 26 may be disposed between the first connecting portion 25 and the third connecting portion 27. The second connecting portion 26 may be disposed between the first connecting hole H1 and the second connecting hole H2. The first connecting hole H1 may be disposed between the first connecting portion 25 and the second connecting portion 26, and the second connecting hole H2 may be disposed between the second connecting portion 26 and the third connecting portion 27.

[0034] The second bonding portion 32 of the second lead frame 30 may be disposed on one side of the first side surface 11 of the body 10 and bent toward the rear. The third bonding portion 42 may be disposed on the other side of the first side surface 11 of the body 10 and bent toward the rear. The second bonding portion 32 of the second lead frame 30 includes a first extension portion 33 to increase the heat dissipation area. The first extension portion 33 extends from a portion of the second bonding portion 32 toward the third side surface 13 of the body 10, and a portion 33A of the first extension portion 33 may be bent to face the third side surface 13. The portion 33A of the first extension portion 33 may be disposed facing or adjacent to the third side surface 13 of the second body 10B.

[0035] The third bonding portion 42 of the third lead frame 40 includes a second extension portion 43 to increase the heat dissipation area. The second extension portion 43 extends from a portion of the third bonding portion 42 toward the fourth side surface 14 of the body 10B, and a portion 43A of the second extension portion 43 may be bent to face the fourth side surface 14. The portion 43A of the second extension portion 43 may be disposed facing or adjacent to the fourth side surface 14 of the second body 10B. The heat dissipation area may be increased by the first and second extension portions 33 and 43. As shown in FIG. 1, gaps 17A and 17B may be formed between the portion 33A of the first extension portion 33 and the third side surface 13 and between the portion 43A of the second extension portion 43 and the fourth side surface 14. That is, a portion 33A of the first extension 33 may be spaced apart from the third side surface 13 by a distance greater than the thickness of the second lead frame 30, and a portion 43A of the second extension 43 may be spaced apart from the fourth side surface 14 by a distance greater than the thickness of the third lead frame 40. As a result, the portion 33A of the first extension 33 and the portion 43A of the second extension 43 may be disposed at the outermost edges of both sides of the body 10. As shown in FIGS. 1 and 3, the first side surface 11 of the body 10 includes recessed regions 11B and 11C adjacent to the third and fourth side surfaces 13 and 14, and the second and third bonding portions 32 and 42 of the second and third lead frames 30 and 40 may be placed in the recessed regions 11B and 11C.

[0036] The light emitting chips 71 and 72 may have a horizontal chip or flip chip structure. The light emitting chips 71 and 72 may selectively emit light within a wavelength range from ultraviolet to visible light. The light emitting chips 71 and 72 may be selected from, for example, a red LED chip, a blue LED chip, a green LED chip, and a yellow-green LED chip. The light emitting chips 71 and 72 may emit light with a red peak wavelength. The light emitting chips 71 and 72 may include at least one of a II-VI compound and a III-V compound. The light emitting chips 71 and 72 may be formed of, for example, a compound selected from the group consisting of GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP, and mixtures thereof. The light emitting chips 71 and 72 are bonded to different frames 21, 31, and 41, respectively, so that heat generated from the light emitting chips 71 and 72 can be effectively dissipated, preventing a decrease in light output.

[0037] A molding member 80 is disposed in the cavity 15A of the body 10. The molding member 80 may be formed of a single layer or multiple layers and may contain a translucent resin such as silicone or epoxy. When the light emitting chips 71 and 72 are red LED chips, the molding member 80 may be free of impurities such as phosphors. The top and both side surfaces of the molding member 80 may be exposed from the body 10. The top surface of the molding member 80 may be concave, convex, or flat, and both side surfaces may be disposed on the third and fourth side surfaces 13 and 14. The length of the molding member 80 in the first direction X may be the same as the length of the cavity 15A. The length of the molding member 80 in the first direction X may be the same as the length of the body 10. A phosphor for changing the wavelength of light emitted may be included on the surface of the molding member 80 or the light emitting chips 71 and 72. The phosphor excites a portion of the light emitted from the light emitting chips 71 and 72 to emit light of a different wavelength. The phosphor may be selected from quantum dot, YAG, TAG, silicate, nitride, and oxynitride-based materials. The phosphor may include, but is not limited to, at least one of red phosphor, yellow phosphor, and green phosphor. As another example, a light-transmitting film or a transparent or red optical plate having a phosphor may be further disposed on the upper portion of the cavity 15A or on the package. A lens may be further formed on the upper portion of the body 10. The lens may have a concave lens and / or convex lens structure to adjust the light distribution of the light emitted from the light emitting device package 100. Semiconductor elements such as a light receiving element and a protection element may be mounted on the body 10 or one of the lead frames. The protection element may be embodied as a thyristor, a Zener diode, or a transient voltage suppression (TVS), and the Zener diode protects the light emitting chips 71 and 72 from electrostatic discharge (ESD). The light emitting chips 71 and 72 may be connected in parallel by the first to third lead frames 20, 30, and 40, or may be driven individually.

[0038] 4 and 5 are diagrams illustrating a light emitting module including the light emitting device package of FIG. 1. Referring to FIGS. 4 and 5, the light emitting module includes a circuit board 401 and one or more light emitting device packages 100 arranged on the circuit board 401. The circuit board 401 includes a substrate having a circuit pattern printed on an insulating layer, and may include, for example, a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. The circuit board 401 includes a metal core PCB, which further includes a metal layer that has better heat dissipation efficiency than other resin-based substrates. For example, the metal core PCB includes a layered structure including a metal layer, an insulating layer on the metal layer, and the wiring layer on the insulating layer. The metal layer is made of a thermally conductive metal with a thickness of 0.3 mm or more to increase heat dissipation efficiency.

[0039] The first to third lead frames 20, 30, and 40 of the light emitting device package 100 may be bonded to the pad units 122, 123, and 124 of the circuit board 401 by a bonding member 250. The bonding member 250 may include solder or conductive tape. The light emitting device package 100 may have a light emitting surface perpendicular to the upper surface of the circuit board 401. The light emitting device package 100 may have a front surface and both side surfaces. A reflective member 410 is disposed on the upper surface of the circuit board 401. The reflective member 410 may prevent solder from overflowing, protect the patterns of the pad units 122, 123, and 124, and reflect light emitted from the light emitting device package 100. Since the front surface and both side surfaces of the cavity 15A of the front surface 15 of the light emitting device package 100 are open, the light emitting device package 100 may have a directivity angle of 160 degrees or more in a first direction, for example, in a range of 160 degrees to 220 degrees. Therefore, light emitted from the light emitting device package 100 is emitted in the front and both side directions, and a part of the light may travel backward through both side faces.

[0040] 6 is a plan view showing a lighting device having the light-emitting element package of FIG. 1 or the light-emitting module of FIG. 5, FIG. 7 is a diagram showing an example of the light-shielding portion of FIG. 6, and FIG. 8 is a cross-sectional view of the CC side of the lighting device of FIG. 6.

[0041] 6 to 8, a lighting device 400 according to an embodiment of the present invention may include a circuit board 401, the plurality of light emitting device packages 100 arranged on the circuit board 401, a resin layer 420 covering the light emitting device packages 100 arranged on the circuit board 401, and a diffusion layer 430 on the resin layer 420. The lighting device 400 may include a reflective member 410 arranged on the circuit board 401. The lighting device 400 according to an embodiment of the present invention may direct light emitted from the light emitting device packages 100 to a surface light source. The plurality of light emitting device packages 100 may be arranged on the circuit board 401 at regular intervals G1 or at different intervals.

[0042] The circuit board 401 may be electrically connected to the light emitting device packages 100. The circuit board 401 may include a wiring layer (not shown) on an upper portion thereof, and the wiring layer may be electrically connected to the light emitting device packages 100. A plurality of light emitting device packages 100 may be connected in series, parallel, or series-parallel by the wiring layer. The circuit board 401 may function as a base member or a support member disposed under the light emitting device packages 100 and the resin layer 420. The circuit board 401 may include a light-transmitting material that transmits light through its upper and lower surfaces. The light-transmitting material may include at least one of PET (Polyethylene terephthalate), PS (Polystyrene), and PI (Polyimide).

[0043] The light emitting device package 100 is disposed on the circuit board 401 and emits light toward the front and third and fourth side surfaces 13 and 14 (see FIG. 1). That is, as shown in FIG. 7, the light emitted from the light emitting device package 100 may be distributed as a main beam F0 and side beams F1 and F2. The light emitting device package 100 emits the main beam F0, which has the highest intensity, in the second direction Y. The light emitting device package 100 may be electrically connected to a pad portion (e.g., 123) of the circuit board 401 by a conductive bonding member on the circuit board 401. The bonding member may be made of a solder material or a metal material.

[0044] The light emitting device package 100 may be arranged as a first light emitting device package and a second light emitting device package from one end of the circuit board 401 in the emission direction of the first light emitting device package. The first light emitting device package and the second light emitting device package emit light toward the other end or second direction of the circuit board 401. That is, the first light emitting device package emits light toward the second light emitting device package, and the second light emitting device package emits light toward the other end of the circuit board 401 or the opposite direction from where the first light emitting device package is arranged. The light emitting device package 100 may be referred to as a package disclosed above, and a detailed description thereof will be omitted.

[0045] The reflective member 410 may be disposed between the circuit board 401 and the resin layer 420. The reflective member 410 may be provided in the form of a film made of a metallic or non-metallic material. The reflective member 410 may be attached to the upper surface of the circuit board 401. The reflective member 410 may have an area smaller than the area of ​​the upper surface of the circuit board 401. The reflective member 410 may be spaced apart from the edge of the circuit board 401, and the resin layer 420 may be attached to the circuit board 401 in the spaced apart area. At this time, peeling of the edge portion of the reflective member 410 may be prevented. The reflective member 410 may include an opening 417 in which the lower portion of the light emitting device package 100 is disposed. The upper surface of the circuit board 401 may be exposed through the opening 417 of the reflective member 410, and a portion where the lower portion of the light emitting device package 100 is bonded may be disposed in the opening 417. The size of the opening 417 may be the same as or larger than the size of the light emitting device package 100, but is not limited thereto. The reflective member 410 may contact the upper surface of the circuit board 401 or may be bonded between the resin layer 420 and the circuit board 401, but is not limited thereto. Here, the reflective member 410 may be removed when a highly reflective material is coated on the upper surface of the circuit board 401. The reflective member 410 may be formed to a thickness thinner than that of the light emitting device package 100. The thickness of the reflective member 410 may be in the range of 0.2 mm±0.02 mm. A lower portion of the light emitting device package 100 may penetrate through an opening 417 of the reflective member 410, and an upper portion of the light emitting device package 100 may protrude. The light emitting surface 111 of the light emitting device package 100 may be provided in a direction perpendicular to the upper surface of the reflective member 410.

[0046] The reflective member 410 may include a plurality of open areas 411 and 413. The plurality of open areas 411 and 413 may include a plurality of first and second open areas 411 and 413, where the first open areas 411 may be arranged in the second direction Y, and the second open areas 413 may be arranged in the second direction Y. The first and second open areas 411 and 413 may be spaced apart in the first direction X. The first open areas 411 and the second open areas 413 may be adjacent to both sides of the circuit board 401. Each of the first open areas 411 may overlap with each of the second open areas 413 in the first direction X. The first and second open areas 411 and 413 may not overlap with the light emitting device package 100 in the first direction X. Each of the first and second open areas 411 and 413 may have an elliptical, circular, or polygonal shape. Since the first and second open areas 411 and 413 of the reflective member 410 are each long in the second direction, it is possible to prevent a decrease in adhesive strength in an area adjacent to a long side edge of the circuit board 401. The resin layer 420 may be disposed on the first and second open areas 411 and 413 and the reflective member 410. The resin layer 420 may be attached to the upper surface of the circuit board 401 via the first and second open areas 411 and 413 to fix the outer portion of the reflective member 410.

[0047] The resin layer 420 may be disposed on the circuit board 401. The resin layer 420 may face the circuit board 401. The resin layer 420 may be disposed on all or part of the upper surface of the circuit board 401. The lower surface area of ​​the resin layer 420 may be equal to or smaller than the upper surface area of ​​the circuit board 401. The resin layer 420 may be formed of a transparent material. The resin layer 420 may include a resin material such as silicone or epoxy. The resin layer 420 is provided as a layer for guiding light to the resin, and therefore may be provided with a thinner thickness than glass and may be provided as a flexible plate. The resin layer 420 may emit a point light source emitted from the light emitting device package 100 in the form of linear light or planar light. Since the resin layer 420 is disposed on the light emitting device package 100, it can protect the light emitting device package 100 and reduce loss of light emitted from the light emitting device package 100. The light emitting device package 100 may be embedded under the resin layer 420 .

[0048] The resin layer 420 may contact the surface of the light emitting device package 100 and may contact the surface of the light emitting device package 100's light emitting surface (111, 112, 113 in FIG. 2). A portion of the resin layer 420 may be disposed in the opening 417 of the reflective member 410. A portion of the resin layer 420 may contact the upper surface of the circuit board 401 through the opening 417 of the reflective member 410. As a result, the reflective member 410 can be fixed between the resin layer 420 and the circuit board 401 by contacting a portion of the resin layer 420 with the circuit board 401. The thickness of the resin layer 420 may be 1.8 mm or more, for example, in the range of 1.8 to 2.5 mm. If the thickness of the resin layer 420 is thicker than this range, the luminous intensity may decrease, and the increased thickness of the module may make it difficult to provide it as a flexible module. If the thickness of the resin layer 420 is less than this range, it is difficult to provide a surface light source with uniform luminous intensity.

[0049] The resin layer 420 may be provided in a size sufficient to cover a plurality of light emitting device packages 100 or may be connected to one another. The resin layer 420 may be separated into light emitting devices each having a size sufficient to cover each light emitting device package 100, and each light emitting device package 100 / each resin layer 420 may be separated into light emitting cells.

[0050] A transparent layer 415 may be disposed between the resin layer 420 and the diffusion layer 430. The transparent layer 415 may attach the diffusion layer 430 to the resin layer 420. The transparent layer 415 may include an adhesive material, such as silicone or epoxy, or a diffusion material. The diffusion material may include at least one of polyester (PET), PMMA (Poly Methyl Methacrylate), or PC (Poly Carbonate). The transparent layer 415 may include an adhesive region that adheres to the upper surface of the resin layer 420 and a non-adhesive region that is not adhered to or spaced apart from the upper surface of the resin layer 420. The transparent layer 415 may be disposed over 60% or more, for example, 80% or more to 95% or less, of the upper surface area of ​​the resin layer 420, to adhere the diffusion layer 430 to the resin layer 420 or a lower diffusion layer (not shown). Here, when a plurality of diffusion layers 430 are arranged, the diffusion layers 430 may be divided into a lower diffusion layer adjacent to the resin layer 430 and an upper diffusion layer thereon. A light-shielding portion 425 may be arranged between the resin layer 420 and the diffusion layer 430. The light-shielding portion 425 may contact the light-transmitting layer 415. The light-shielding portion 425 may overlap the light emitting device package 100 in the vertical direction or the third direction Z. The light-shielding portion 425 may face the upper surface of the resin layer 420. Each of the plurality of light-shielding portions 425 may overlap each of the plurality of light emitting device packages 100 in the vertical direction. When a plurality of diffusion layers 430 are arranged, the light-shielding portion 425 may be arranged between the plurality of diffusion layers.

[0051] The light-shielding portion 425 may be disposed within the transparent layer 415. The light-shielding portion 425 may penetrate the transparent layer 415 and contact at least one of the resin layer 420 or the diffusion layer 430. The light-shielding portion 425 may include a gap 427 spaced apart from the inner surface of the transparent layer 415 and / or the upper surface of the resin layer 420. The gap 427 may provide a refractive index different from that of the light-shielding portion 425, thereby improving light diffusion efficiency. A distance Q2 between the light-shielding portion 425 and other light-emitting device packages 100 may be smaller than a distance Q1 between the light-emitting device packages 100. The light-shielding portion 425 may be spaced apart from the outer surface of the resin layer 420. A plurality of the light-shielding portions 425 may be arranged along the light-emitting device packages 100 and may have the same shape. Each of the light-shielding parts 425 has an area larger than the upper surface area of ​​each of the light-emitting device packages 100, and can prevent hot spots caused by light emitted through the light-emitting device packages 100.

[0052] The light-shielding portion 425 may be disposed higher than the upper surface of the resin layer 420. The light-shielding portion 425 may have an area on the light emitting device package 100 that is equal to or greater than the area of ​​the upper surface of the light emitting device package 100, or may have an area in the range of 1 to 10 times the area of ​​the upper surface of the light emitting device package 100. The light-shielding portion 425 may be a region printed with a white material. The light-shielding portion 425 may be printed using a reflective ink containing any one of TiO2, Al2O3, CaCO3, BaSO4, and silicon. The light-shielding portion 425 may reflect light emitted through the light-emitting device package 100's light-emitting surface to reduce hot spots on the light emitting device package 100. The light-shielding portion 425 may have a light-shielding pattern printed thereon using a light-shielding ink. The light-shielding portion 425 may be formed by printing on the lower surface of the diffusion layer 430. The light-shielding portion 425 is made of a material that does not block 100% of incident light, and may have a transmittance lower than a reflectance, thereby performing the functions of blocking and diffusing light. The light-shielding portion 425 may be formed as a single layer or multiple layers and may have the same pattern shape or different pattern shapes. The light-shielding portion 425 may be formed to have the same thickness. The light-shielding portion 425 may be formed to have different thicknesses depending on the region. The thickness of the light-shielding portion 425 may be thickest in the center region and thinner in the edge regions. The thickness of the light-shielding portion 425 may increase in proportion to the intensity of incident light.

[0053] The size of the light-shielding portion 425 is arranged to be larger than the top surface area of ​​the light-emitting device package 100, thereby reducing the problem of the light-emitting device package 100 being visible from the outside and reducing hot spots on the area of ​​the light-emitting device package 100, thereby providing uniform light distribution over the entire area.

[0054] 7, the width C1 of the light-shielding part 425 in the first direction X may be small in the rear region of the light-emitting device package 100 and gradually increase toward the center of the light-shielding part 425, with the width (e.g., C0) in the first direction X being largest at the center. The width in the second direction Y may gradually decrease as the distance from the light-emitting device package 100 increases from the center of the light-shielding part 425. The maximum width C3 in the second direction Y may be largest at the center of the light-shielding part 425 and the width in the first direction X may gradually decrease as the distance from the center of the light-shielding part 425 increases in the first direction X. The light-shielding part 425 may include first and second sub-light-shielding parts 425A and 425B spaced apart in the first direction X based on the light-emitting device package 100. The first sub-light-shielding part 425A shields the first sub-beam F1 from the side of the light emitting device package 100, and the second sub-light-shielding part 425B shields the second sub-beam F2. To this end, the first sub-light-shielding part 425A extends outward and backward from above the third side surface portion (FIGS. 1 to 13) of the light emitting device package 100 and covers the upper part of the third side surface portion (FIGS. 1 to 13) and its surrounding area. The second sub-light-shielding part 425B extends outward and backward from above the fourth side surface portion (FIGS. 1 to 14) of the light emitting device package 100 and covers the upper part of the fourth side surface portion (FIGS. 1 to 14) and its surrounding area. The first and second sub-light-shielding parts 425A and 425B may have a polygonal, circular, or elliptical shape in top view.

[0055] When the maximum length of the light-shielding portion 425 in the second direction Y is B0, the length of the first and second sub-light-shielding portions 425A and 425B relative to the light source center P0 is B1, and the length of the main beam shielding region is B2, the ratio of B1:B2 may be in the range of 1:2 to 1:10. Here, when the width of the light emitting device package 100 in the second direction Y is D2, the ratio of D2:B1 may be in the range of 1:1.5 to 1:3. Such first and second sub-light-shielding portions 425A and 425B cover the rear side surfaces of the light emitting device package 100 and can effectively block light from the first and second side emission surfaces (112 and 113 in FIG. 2) and the upper portions of their surrounding regions. When the length of the rear region of the light-shielding portion 425 in the first direction X is C1 and the width of each sub-light-shielding portion 425A and 425B is C2, the ratio of C1:C2 may be in the range of 1:0.2 to 1:0.4. Here, when the length of the light emitting device package 100 in the first direction X is D1, the ratio of D1:C2 may be in the range of 1:0.5 to 1:1.2. The first and second sub-light-shielding portions 425A and 425B cover the rear side surfaces of the light emitting device package 100 and can effectively block light from the first and second side emission surfaces (112 and 113 in FIG. 2) and the upper portions of their surrounding areas. The width C0 of the light-shielding portion 420 in the first direction X may be 10 mm or more, for example, in the range of 10 mm to 20 mm, and the maximum length B0 in the second direction Y may be less than the width C0 and may be 9 mm or more, for example, in the range of 9 mm to 18 mm. The width C2 of the sub-light-shielding portions 425A and 425B may be 5 mm or less, for example, in the range of 2 mm to 5 mm. The length B1 of the first and second sub-light-shielding portions 425A and 425B may be 5 mm or less, for example, in the range of 2 mm to 5 mm, and may be smaller than the width C2.

[0056] The thickness of the light-shielding portion 425 may be 0.1 times or less, for example, in the range of 0.05 to 0.1 times, that of the resin layer 420. The thickness of the light-shielding portion 425 may be 100 μm or more, for example, in the range of 100 to 200 μm. If the thickness of the light-shielding portion 425 is less than this range, there is a limit to reducing hot spots, and if it is greater than this range, light uniformity may be reduced. The distance between the upper surface of the light-emitting device package 100 and the lower surface of the light-shielding portion 425 may be 0.4 mm or more, for example, in the range of 0.4 mm to 0.6 mm. The distance between the upper surface of the light-emitting device package 100 and the upper surface of the reflective member 410 may be 0.8 mm or more, for example, in the range of 0.8 mm to 1.4 mm. The area of ​​the light-shielding portion 425 may not vertically overlap the area of ​​the transparent layer 415. The light-shielding part 425 may be provided with a size or area sufficient to prevent hot spots caused by light emitted in the emission direction and side directions of the light emitting device package 100 on each light emitting device package 100. In addition, the light-shielding part 425 uses sub-light-shielding parts 425A and 425B to block light emitted in both directions of the light emitting device package 100, i.e., in the first direction X and the rear direction based on the light source center P0, thereby improving the surface light distribution of light emitted through the diffusion layer 430.

[0057] The diffusion layer 430 may be disposed on the resin layer 420. The lower surface of the diffusion layer 430 may be disposed on the transparent layer 415 and the light-shielding portion 425. The light-shielding portion 425 may be printed on the lower surface of the diffusion layer 430 and may be fixed to the resin layer 420 via the transparent layer 415. The diffusion layer 430 may include at least one of a polyester (PET) film, a PMMA (Poly Methyl Methacrylate) material, and a PC (Poly Carbonate). The diffusion layer 430 may be a film made of a resin material such as silicone or epoxy. The diffusion layer 430 may include a single layer or multiple layers. The thickness of the diffusion layer 430 is 25 micrometers or more, for example, in the range of 25 to 250 micrometers or 100 to 250 micrometers. The diffusion layer 430 having the above thickness range can provide incident light as a uniform surface light source. The diffusion layer 430 may include at least one of a diffusing agent such as beads, a phosphor, and ink particles. The phosphor may include at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, and a white phosphor. The ink particles may include at least one of a metallic ink, a UV ink, and a curable ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be green, red, yellow, or blue. The type of ink may be selected from PVC (Polyvinyl Chloride) ink, PC (Polycarbonate) ink, ABS (Acrylonitrile Butadiene Styrene Copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP (Polypropylene) ink, water-based ink, plastic ink, PMMA (Polymethyl Methacrylate) ink, and PS (Polystyrene) ink. The ink particles may include at least one of a metallic ink, a UV ink, and a curable ink.

[0058] In this embodiment, light diffused by the resin layer 420 may be transmitted through the light-transmitting layer 415 and emitted to the surface light source through the diffusion layer 430. The light-shielding unit 425 may prevent hot spots caused by the incident light. In another embodiment of the present invention, a reflective layer or an upper substrate may be disposed on the resin layer 420. The reflective layer or the upper substrate may face the upper surface of the resin layer 420. The light-emitting device packages 100 may be arranged in at least one row or column, and the light-emitting device packages 100 may have the same spacing as one side of the resin layer 420, thereby emitting light through one side of the resin layer 420. As another example, the light-shielding unit 425 may be formed as an optical pattern unit having a concave-convex pattern on the upper surface of the resin layer 420, as shown in FIG. 9. The top view shape of the optical pattern unit 600 having a light-shielding function in FIG. 9 may be the same as that in FIG. 7, and the pattern structure will be described below.

[0059] Referring to FIG. 9 , the optical pattern unit 600 includes a plurality of recesses Pa1 and Pa2 recessed in the upper surface of the resin layer 420. The top view shapes of the recesses Pa1 and Pa2 may be polygonal (e.g., triangular, rectangular, or pentagonal), circular, or elliptical. The top surface areas of the recesses Pa1 and Pa2 may be the same or different. The top surface areas of the recesses Pa1 and Pa2 may be the same size depending on the region, or may be different sizes in different regions. The recesses Pa1 and Pa2 may be spaced apart at a predetermined interval, and the interval may be smaller than the lengths of the recesses Pa1 and Pa2 in the first and second directions X and Y. The intervals between the recesses Pa1 and Pa2 may be the same. The intervals between the recesses Pa1 and Pa2 may include regions with a constant interval and regions with a smaller or larger interval than the interval. The intervals between the recesses Pa1 and Pa2 in the first direction X and the second direction Y may be the same or different. The optical pattern unit 600 may have the recesses Pa1 and Pa2 and the protrusions Pb1 and Pb2 alternately arranged. The width of the recesses Pa1 and Pa2 in the first direction X and / or the second direction Y may be smaller than the depth h1. The recesses Pa1 and Pa2 may have a columnar shape with a depth h1. The width w1 of the recesses Pa1 and Pa2 may be the same at the top and bottom. The bottoms of the recesses Pa1 and Pa2 may include a flat surface. The top surfaces of the protrusions Pb1 and Pb2 between the recesses Pa1 and Pa2 may have a constant width or different widths w3 depending on the region. The protrusions Pb1 and Pb2 may be connected to each other, and the recesses Pa1 and Pa2 may be recessed downward from the inner regions of the protrusions Pa1 and Pa2. The recesses Pa1 and Pa2 may reflect, refract, and diffuse incident light. The convex portions Pb1 and Pb2 can reflect or refract incident light, or guide it upward and diffuse it.

[0060] The optical pattern unit 600 may be divided into different pattern units 610, 620 according to a pattern size (e.g., width). The optical pattern unit 600 may have different widths w1 of the pattern units 610, 620 arranged in the first direction X. The pattern units 610, 620 may extend in the second direction Y. For example, the pattern units 610, 620 may be arranged at the same depth h1, and the pitch P1 between adjacent recesses Pa1, Pa2 in the first and second directions X, Y may be the same or may increase as they move away from the light-emitting surface 111 of the light-emitting device package 100. The width of a protrusion Pb1 between the pattern units 610, 620 may be smaller than the width w1 of the adjacent recesses Pa1, Pa2, and the width w3 of the protrusion Pb1 in the far region may be equal to or smaller than the width w1. For example, the width w1 of the recesses Pa1 and Pa2 may be 0.4 mm or more, for example, in the range of 0.4 mm to 0.6 mm, and the width w3 may be 0.3 mm or less, for example, in the range of 0.29 mm to 0.38 mm. As a result, the area of ​​the recesses of the first pattern unit 610 may be largest in the region adjacent to the light emitting device package 100, and the area of ​​the recesses may decrease in the more distant regions, so that a pattern that can diffuse light in proportion to the light intensity can be arranged.

[0061] 10 to 12 show other examples of lighting devices having the light-emitting element package of FIG.

[0062] 10 and 11, the lighting device 400A may include a circuit board 401, a resin layer 420, a plurality of reflective layers 410 and 440, and one or more light emitting device packages 100 as disclosed above. The lighting device 400A includes a plurality of light emitting device packages 100 and irradiates light emitted from the plurality of light emitting device packages 100 as surface light having a line width or a resin thickness. The light emitted from the light emitting device packages 100 may be emitted as surface light having a line width or a thin height. The lighting device 400A may be a flexible module or a rigid module. The lighting device 400A may be flat or curved in at least one of the first and second directions Y and X. The lighting device 400A may include two side surfaces corresponding to each other in the first direction X and two side surfaces corresponding to each other in the second direction Y. The line width from which light is emitted in the lighting device 400A is the height in the vertical direction Z and may be 3 mm or less, for example, in the range of 2.4 mm to 3 mm. The lighting by such lighting device 400A can be provided in modules such as linear, curved, or wave-shaped, which can improve the freedom of lighting design and can be effectively installed at the lamp position on the bracket or housing.

[0063] As shown in FIG. 11, the lighting device 400A may have a hemispherical light emitting surface. The centers of the light emitting device packages 100, 101A, and 101D and the convex portions P11 may be aligned toward the target point Ta so that the light from each of the light emitting device packages 100, 101A, and 101D can be focused toward the target point Ta. That is, the inclination angle of each of the packages 100, 101A, and 101D may be greater with respect to the light emitting device package 100 perpendicular to the target point Ta. A line passing through the center of the convex portion P11 and the convex surface S11 corresponding to each of the light emitting device packages 100, 101A, and 101D and the center of each of the light emitting device packages 100, 101A, and 101D may intersect at the target point Ta. The distance between the target point Ta and each convex portion P11 may vary depending on the type of lamp.

[0064] 12, the plurality of reflective layers 410 and 440 may include a first reflective layer 440 disposed on an upper surface of the resin layer 420 and a second reflective layer 410 disposed on a lower surface of the resin layer 420. The resin layer 420 may include a first surface S1 and a second surface S2 disposed on opposite sides in the second direction Y. The first and second surfaces S1 and S2 may correspond to each other in the second direction Y or may correspond to each other based on an imaginary line connecting the plurality of light emitting device packages 100. The light emitting surface 111 of each of the plurality of light emitting device packages 100 may correspond to the first surface S1. Light emitted from the light emitting device package 100 may be emitted through the first surface S1, and a portion of the light may be emitted through the other surface. That is, most of the light emitted from the light emitting device package 100 may be emitted through the first surface S1. The thickness of the first surface S1 of the resin layer 420 may be less than 3 mm.

[0065] The first surface S1 of the resin layer 420 may be an emission surface through which light emitted from the light emitting device package 100 is emitted. The first surface S1 may be a front surface or an emission surface, and the second surface S2 may be a rear surface or a non-emission surface. The first surface S1 may have a plurality of convex portions P11 arranged in a vertical direction along a first direction X. The first surface S1 may be a side surface on which a regular uneven shape or uneven structure is arranged. The first surface S1 may have a larger surface area than the surface area of ​​the second surface S2 on the opposite side. The first surface S1 may include a plurality of convex surfaces S11 corresponding to each light emitting device package 100 and a plurality of concave portions arranged between the plurality of convex surfaces S11. The side surfaces of the circuit board 401, the resin layer 420, and the first reflective layer 440, i.e., the vertical surfaces of the convex portions P11, may be arranged on the same plane.

[0066] The resin layer 420 may be disposed between the first and second reflective layers 440 and 410. The first and second reflective layers 440 and 410 may have the same area and face the upper and lower surfaces of the resin layer 420. The first and second reflective layers 440 and 410 may be made of the same material or different materials. Thus, the resin layer 420 may diffuse light emitted from the light emitting device package 100 and light reflected by the first and second reflective layers 440 and 410, and guide the diffused light toward the first surface S1.

[0067] The thickness Zc of the second reflective layer 410 may be smaller than the thickness Za of the circuit board 401. The thickness Zc of the second reflective layer 410 is 0.5 times or more and less than 1 time the thickness Za of the circuit board 401, thereby reducing the transmission loss of incident light. The thickness Zc of the second reflective layer 410 may be in the range of 0.2 mm to 0.4 mm. If the thickness Zc is smaller than this range, light transmission loss may occur, and if the thickness Zc is thicker than this range, the thickness Z1 of the lighting device 400A may increase. The first reflective layer 440 is disposed over the entire upper surface of the resin layer 420, thereby reducing the light loss. The resin layer 420 may be formed to a thickness Zb that is thicker than the thickness of the light emitting device package 100.

[0068] The thickness Zb of the resin layer 420 is the distance between the first and second reflective layers 440 and 410 and may be smaller than the distance between the first surface S1 and the second surface S2. By setting the distance between the first and second reflective layers 440 and 410 smaller than the length or minimum width of the lighting device 400A in the first direction, a linear surface light source can be provided in the first direction, improving luminous intensity and preventing hot spots. The lighting device may have a constant thickness and flexibility with a convex or concave shape in the third direction Z. The thickness Zb of the resin layer 420 may be less than twice the thickness of the light emitting device package 100, for example, more than 1 to 2 times the thickness of the light emitting device package 100. The thickness Zb of the resin layer 420 may be 2 mm or less, for example, in the range of 1.5 mm to 1.9 mm, or in the range of 1.6 mm to 1.8 mm. Since the difference in thickness Z1 between the resin layer 420 and the lighting device 400A is set to 1.2 mm or less, the reduction in light efficiency of the lighting device 400A can be prevented and flexibility can be enhanced.

[0069] The convex portion P11 or convex surface S11 disposed on the first surface S1 of the resin layer 420 may have a first curvature. Here, the radius of curvature of the convex portion P11 may be 5 mm or more, for example, in the range of 5 mm to 50 mm, or in the range of 8 mm to 30 mm. If the radius of curvature of each convex portion P11 is smaller than the above range, the improvement in luminous intensity may be minimal, and if it is larger than the above range, dark areas may occur. The region of the resin layer 420 where the convex portion P11 is formed may be provided as a lens portion. The lens portion of the resin layer 420 is provided in a lens shape having a convex convex surface and may have a hemispherical shape, a semicircular shape, a semi-elliptical shape, or an aspherical shape when viewed from the top. The lens may include a collimator lens. The closer the vertex of the lens portion is to the center of the light emitting device package 100, the greater the distance from the light emitting device package 100. Therefore, each convex surface S11 of the resin layer 420 can emit light emitted through each of the light emitting device packages 100. Here, the thickness Zd of the first reflective layer 440 may be in the range of 0.2 mm to 0.4 mm. If it is smaller than this range, light transmission loss may occur, and if it is thicker than this range, the thickness Z1 of the lighting device 400A may increase. As shown in Fig. 10, the lighting device 400A emits light with a directivity angle distribution through each convex portion P11, so that more light can be concentrated in a target area or in the traveling direction of the light.

[0070] As shown in FIG. 12, the light emitting device package 100 emits light through the front and both side surfaces as shown in FIG. 1, and therefore the convex surface S11 may be elliptical. The elliptical convex surface S11 may provide a wider light distribution than the circular convex surface S16 of the comparative example. As a result, a wider gap may be provided between the light emitting device packages 100, minimizing the occurrence of dark areas in the regions between the light emitting device packages 100. In this case, the distance from the light source center P0 of the light emitting device package 100 to the convex surface S11 may be three times or less the width of the light emitting device 100, and the distance from the light source center P0 to the convex surface S16 of the comparative example may be 3.3 times or more the width of the light emitting device 100. As a result, the light emitting device package 100 has a wide light-emitting area and provides wide light in the first direction. Therefore, the length of the lighting device may be reduced by reducing the distance to the convex surface S11, and the emitted luminous intensity may be improved.

[0071] FIG. 13 is a plan view of a vehicle to which a vehicle lamp incorporating a lighting module according to an embodiment is applied, and FIG. 14 is a diagram showing a vehicle lamp incorporating a lighting module or lighting device disclosed in the embodiment.

[0072] 13 and 14, the rear lamp 800 of the vehicle 900 may include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source for functioning as a turn signal light, the second lamp unit 814 may be a light source for functioning as a side light, and the third lamp unit 816 may be a light source for functioning as a brake light, but is not limited thereto. At least one or all of the first to third lamp units 812, 814, and 816 may include the lighting module disclosed in the embodiments. The housing 810 accommodates the first to third lamp units 812, 814, and 816 and may be made of a light-transmitting material. In this case, the housing 810 may have a curve according to the design of the vehicle body, and the first to third lamp units 812, 814, and 816 may embody a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp can be applied to a tail lamp, a brake lamp, or a turn signal lamp of a vehicle when the lamp unit is applied to a tail lamp, a brake lamp, or a turn signal lamp of a vehicle.

[0073] The lighting module or lighting device can be applied to various lamps that require illumination, such as vehicle lamps, home lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, the lighting module or lighting device can be applied to headlamps, side mirror lights, side marker lights, fog lamps, tail lamps, brake lights, daytime running lights, vehicle interior lighting, door scarves, rear combination lamps, backup lamps, etc. The lighting device of the present invention can also be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle fields, as well as all lighting-related and advertising-related fields that are currently developed and commercialized or that will be realized with future technological developments.

Claims

1. A circuit board; a plurality of light emitting device packages arranged on the circuit board; a resin layer covering the plurality of light emitting device packages; a light diffusing or reflecting layer on the resin layer, Each of the plurality of light emitting device packages includes: a body having a first side portion facing an upper surface of the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, a front portion, a rear portion, and a cavity with a portion of the front portion opened; a plurality of lead frames each having a bonding portion bent from a plurality of frames arranged on a bottom of the cavity to the first side surface portion; a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity; the third side surface portion and the fourth side surface portion of the body are disposed on both sides of the body in the first direction, the front and rear portions of the fuselage are disposed on both sides in a second direction of the fuselage perpendicular to the first direction, The cavity in the front portion of the body has the same length as the length of the body in the first direction, the length of the body in the first direction is the distance between the third and fourth side surfaces; the fuselage includes a first bottom support disposed on one of the frames adjacent to a third side surface of the fuselage and a second bottom support disposed on another of the frames adjacent to a fourth side surface of the fuselage; the first and second bottom support portions are disposed on both side bottom portions of the cavity in the first direction so as to be recessed from the front surface portion; a height in the second direction from an upper surface of a first bottom support part at the bottom of the cavity to an upper end of the cavity is smaller than a height in the second direction from an upper surface of any one frame adjacent to a third side portion of the body at the bottom of the cavity to the upper end of the cavity; A lighting device, wherein the height in the second direction from the upper surface of the second bottom support portion at the bottom of the cavity to the upper end of the cavity is smaller than the height in the second direction from the upper surface of any other frame adjacent to the fourth side portion of the body at the bottom of the cavity to the upper end of the cavity.

2. a molding member within the cavity; The lighting device of claim 1 , wherein the length of the molding member is the same as the length of the cavity in the first direction.

3. The lighting device of claim 2 , wherein a front surface of the molding member is exposed to a front surface of the body, and both side surfaces of the molding member in the first direction are exposed to the outside of the third and fourth side surfaces, respectively.

4. a diffusion layer on the resin layer for diffusing light; and a light-transmitting layer and a light-shielding portion between the resin layer and the diffusion layer, The lighting device according to claim 1 , wherein the light-shielding portion overlaps with the light-emitting element package in a third direction perpendicular to the first and second directions.

5. the light-shielding part covers the front of the light-emitting device package; the light-shielding part includes first and second sub-light-shielding parts covering third and fourth side portions of the body of the light-emitting device package, The lighting device according to claim 4 , wherein the first and second sub-light-shielding parts extend further rearward from rear ends of the third and fourth side surfaces of the light-emitting device package than the rear surface part.

6. A circuit board; a plurality of light emitting device packages arranged on the circuit board; a resin layer covering the plurality of light emitting device packages; a light diffusing or reflecting layer on the resin layer, Each of the plurality of light emitting device packages includes: a body having a first side portion facing an upper surface of the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, a front portion, a rear portion, and a cavity with a portion of the front portion opened; a plurality of lead frames each having a bonding portion bent from a plurality of frames arranged on a bottom of the cavity to the first side surface portion; a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity; the third side surface portion and the fourth side surface portion of the body are disposed on both sides of the body in the first direction, the front and rear portions of the fuselage are disposed on both sides in a second direction of the fuselage perpendicular to the first direction, The cavity in the front portion of the body has the same length as the length of the body in the first direction, the length of the body in the first direction is the distance between the third and fourth side surfaces; a diffusion layer on the resin layer for diffusing light; and a light-transmitting layer and a light-shielding portion between the resin layer and the diffusion layer, the light-shielding portion overlaps the light-emitting device package in a third direction perpendicular to the first and second directions, the light-shielding part covers the front of the light-emitting device package; the light-shielding part includes first and second sub-light-shielding parts covering third and fourth side portions of the body of the light-emitting device package, a light emitting element package including a light source package and a light source package having a light emitting element package and a light source package having a light source ...

7. a diffusion layer disposed on the resin layer; and a light-shielding portion having an optical pattern portion between the resin layer and the diffusion layer, the optical pattern portion of the light-shielding portion has a plurality of recesses overlapping the light-emitting device package in a third direction; The lighting device according to claim 1 , wherein the third direction is orthogonal to the first and second directions.

8. a first reflective layer on the resin layer that reflects light; 6. The lighting device according to claim 1, wherein the circuit board, the resin layer, and the first reflective layer include a plurality of convex surfaces that protrude from the front surface of the light emitting device package with convex curved surfaces.

9. A circuit board; a plurality of light emitting device packages arranged on the circuit board; a resin layer covering the plurality of light emitting device packages; a light diffusing or reflecting layer on the resin layer, Each of the plurality of light emitting device packages includes: a body having a first side portion facing an upper surface of the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, a front portion, a rear portion, and a cavity with a portion of the front portion opened; a plurality of lead frames each having a bonding portion bent from a plurality of frames arranged on a bottom of the cavity to the first side surface portion; a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity; the third side surface portion and the fourth side surface portion of the body are disposed on both sides of the body in the first direction, the front and rear portions of the fuselage are disposed on both sides in a second direction of the fuselage perpendicular to the first direction, The cavity in the front portion of the body has the same length as the length of the body in the first direction, the length of the body in the first direction is the distance between the third and fourth side surfaces; the lead frame includes a first lead frame and second and third lead frames on both sides of the first lead frame; the light emitting chips include a plurality of light emitting chips mounted in a flip shape on the first, second, and third lead frames, respectively; a frame of the first lead frame including groove regions between the plurality of light emitting chips, the groove regions being formed by removing an uppermost layer; the body includes a first bottom support disposed on a second lead frame adjacent to a third side portion of the body, and a second bottom support disposed on a third lead frame adjacent to a fourth side portion of the body; the first and second bottom support portions are disposed on both side bottom portions of the cavity in the first direction so as to be recessed from the front surface portion; a height in the second direction from an upper surface of the first bottom support part at the bottom of the cavity to an upper end of the cavity is smaller than a height in the second direction from an upper surface of the second lead frame adjacent to a third side surface part of the body at the bottom of the cavity to an upper end of the cavity; A lighting device, wherein the height in the second direction from the upper surface of the second bottom support portion at the bottom of the cavity to the upper end of the cavity is smaller than the height in the second direction from the upper surface of the third lead frame adjacent to the fourth side portion of the body at the bottom of the cavity to the upper end of the cavity.

10. A circuit board; a plurality of light emitting device packages disposed on the circuit board; Each of the light emitting device packages comprises: a body having a first side portion facing the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, a front portion, a rear portion, and a cavity in which a portion of the front portion is opened; a plurality of lead frames each having a plurality of frames disposed on the bottom of the cavity and a plurality of bonding portions bent from each of the plurality of frames to a first side portion; a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity; a molding member within the cavity; the third side surface portion and the fourth side surface portion of the body are disposed on both sides of the body in a first direction, the front and rear portions of the fuselage are disposed on both sides in a second direction perpendicular to the first direction, The cavity in the front portion of the body has the same length as the length of the body in the first direction, The length of the molding member is the same as the length of the cavity in the first direction, the length of the body in the first direction is the distance between the third and fourth side surfaces; the body includes a first bottom support portion disposed on one of the frames adjacent to the third side portion and a second bottom support portion disposed on another of the frames adjacent to the fourth side portion, the first and second bottom support portions are recessed from the front surface portion at both bottom portions of the cavity in the first direction and contact the molding member; a height in the second direction from an upper surface of a first bottom support part at the bottom of the cavity to an upper end of the cavity is smaller than a height in the second direction from an upper surface of any one frame adjacent to a third side portion of the body at the bottom of the cavity to the upper end of the cavity; A lighting device, wherein the height in the second direction from the upper surface of the second bottom support portion at the bottom of the cavity to the upper end of the cavity is smaller than the height in the second direction from the upper surface of any other frame adjacent to the fourth side portion of the body at the bottom of the cavity to the upper end of the cavity.

11. A circuit board; a plurality of light emitting device packages arranged on the circuit board; a resin layer covering the plurality of light emitting device packages, Each of the light emitting device packages comprises: a body having a first side portion facing the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, a front portion, a rear portion, and a cavity in which a portion of the front portion is opened; a plurality of lead frames each having a plurality of frames disposed on the bottom of the cavity and a plurality of bonding portions bent from each of the plurality of frames to a first side portion; a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity; a molding member within the cavity; the third side surface portion and the fourth side surface portion of the body are disposed on both sides of the body in a first direction, the front and rear portions of the fuselage are disposed on both sides in a second direction perpendicular to the first direction, The cavity in the front portion of the body has the same length as the length of the body in the first direction, The length of the molding member is the same as the length of the cavity in the first direction, the length of the body in the first direction is the distance between the third and fourth side surfaces; a diffusion layer on the resin layer for diffusing light; and a light-transmitting layer and a light-shielding portion between the resin layer and the diffusion layer, the light-shielding portion overlaps the light-emitting device package in a third direction perpendicular to the first and second directions, the light-shielding part covers the front of the light-emitting device package; the light-shielding part includes first and second sub-light-shielding parts covering third and fourth side portions of the body of the light-emitting device package, a light emitting element package including a light source package and a light source package having a light emitting element package package, the light emitting element package package having a light source package and a light source package package, the light emitting element package package having a light source package and a light source package package package, the light emitting element package ... package, the light emitting element package package and a light source package package package package package, the light emitting element package package and a light source package package package package package package, the light emitting element package package and a light source package package package package package package package, the light emitting element package package and a light source package package package package package package package package package package package package package package package package package package package package package package package package package package package package package package package

12. A circuit board; a plurality of light emitting device packages disposed on the circuit board; Each of the light emitting device packages comprises: a body having a first side portion facing the circuit board, a second side portion opposite the first side portion, third and fourth side portions on both sides of the first and second side portions, a front portion, a rear portion, and a cavity in which a portion of the front portion is opened; a plurality of lead frames each having a plurality of frames disposed on the bottom of the cavity and a plurality of bonding portions bent from each of the plurality of frames to a first side portion; a plurality of light emitting chips electrically connected to the plurality of frames at the bottom of the cavity; a molding member within the cavity; the third side surface portion and the fourth side surface portion of the body are disposed on both sides of the body in a first direction, the front and rear portions of the fuselage are disposed on both sides in a second direction perpendicular to the first direction, The cavity in the front portion of the body has the same length as the length of the body in the first direction, The length of the molding member is the same as the length of the cavity in the first direction, the length of the body in the first direction is the distance between the third and fourth side surfaces; the lead frame includes a first lead frame and second and third lead frames on both sides of the first lead frame; the light emitting chips include a plurality of light emitting chips mounted in a flip shape on the first, second, and third lead frames, respectively; a frame of the first lead frame including groove regions between the plurality of light emitting chips, the groove regions being formed by removing the top layer;

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