Indication device

Abstract

To provide an angle adjusting device which can maintain a desired angle.SOLUTION: The present invention relates to an angle adjusting device which can fix the relative positions of a first component and a second component and hold the positions. A supporting tool, which is formed by combining the angle adjusting device and a component such as a flat plate, can hold a shape of being expanded in a flat surface as a whole, a shape of being bent, or a shape of maintaining a desired angle. Also, the angle adjusting device can allow a device to bend in one direction and can prohibit the device to bent in the opposite direction. A device having the angle adjusting device can be therefore prevented from bending unexpectedly and can be avoided from being broken.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an object, a method, or a manufacturing method. Alternatively, the present invention relates to a process, a machine, a manufacture, or a composition of matter. In particular, one aspect of the present invention relates to a semiconductor device, a light-emitting device, a display device, an electronic device, a lighting device, a driving method thereof, or a manufacturing method thereof. In particular, one aspect of the present invention relates to an angle adjustment device, a support for a flexible component, and a display device having the support for the flexible component.

[0002] In this specification and the like, a semiconductor device refers to any device that can function by utilizing semiconductor characteristics. A transistor, a semiconductor circuit, an arithmetic device, a memory device, and the like are examples of a semiconductor device. In addition, a light-emitting device, a display device, a lighting device, and an electronic device may include a semiconductor device. [Background technology]

[0003] Electronic devices such as mobile phones, smartphones, tablet computers, and laptop computers are made to an appropriate size depending on their functions, ease of use, design, portability, and so on. However, it is inconvenient to carry multiple electronic devices with overlapping functions. Therefore, a form that can integrate the functions of multiple electronic devices is desired. For example, Patent Document 1 discloses a tri-fold light-emitting panel. By using this light-emitting panel, it is possible to integrate the functions of multiple electronic devices and create an electronic device with a variable size. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-130320 Summary of the Invention [Problem to be solved by the invention]

[0005] In a display device with a foldable display unit, at least a portion of a display panel formed on a flexible substrate is fixed to a support, and the support is bent to perform a folding operation, etc. In this case, if the support is bent in a direction opposite to the intended design, the display panel and the hinge portion of the support may be damaged, so it is preferable that the display device has a mechanism that prevents it from easily bending in the opposite direction.

[0006] Furthermore, the display device is used in various deformed states. For example, it is expected to be used in a flat state, a folded state, or a state bent at a desired angle (intermediate state). Therefore, it is preferable that the support can maintain its shape regardless of the state.

[0007] Therefore, one object of one embodiment of the present invention is to provide an angle adjustment device that adjusts the relative angle between components. Alternatively, it is an object of one embodiment of the present invention to provide an angle adjustment device that can fix the relative angle between components to a desired angle. Alternatively, it is an object of one embodiment of the present invention to provide a support for supporting a flexible component. Alternatively, it is an object of one embodiment of the present invention to provide a support for performing a bending operation without impairing the reliability of the flexible component. Alternatively, it is an object of one embodiment of the present invention to provide a novel support for a flexible component. Alternatively, it is an object of one embodiment of the present invention to provide a novel light-emitting device.

[0008] Another object is to provide a foldable display device with excellent portability. Another object is to provide a foldable display device with excellent display visibility. Another object is to provide a foldable display device with a power-saving function. Another object is to provide a novel display device.

[0009] Note that the description of these problems does not preclude the existence of other problems. One embodiment of the present invention does not necessarily solve all of these problems. Furthermore, problems other than those described above will become apparent from the description of the specification, etc., and problems other than those described above can be extracted from the description of the specification, etc. [Means for solving the problem]

[0010] One aspect of the present invention relates to an angle adjustment device capable of maintaining a desired angle, a support having the angle adjustment device, or a display device having the support.

[0011] One aspect of the present invention is a method for manufacturing a gyro having a first base part, a second base part, a first connecting part, a second connecting part, a first columnar part, a second columnar part, a third columnar part, and a fourth columnar part, wherein the first base part and the second base part each have a first region and a second region, and the first connecting part and the second connecting part each have a first opening and a notch, and the first opening and the notch are formed along the length of the first connecting part and the second connecting part. The angle adjustment device is arranged side by side in the hand direction, a first columnar part or a third columnar part is inserted into the first opening, a second columnar part or a fourth columnar part is inserted into the cutout part, a first region of the first base part is connected to a second region of the second base part via the first columnar part, the first connecting part and the fourth columnar part, and the first region of the second base part is connected to the second region of the first base part via the third columnar part, the second connecting part and the second columnar part.

[0012] the first basic part and the second basic part each have a first surface, a second surface, a third surface, a fourth surface, and a fifth surface, the first surface and the second surface have the same shape, the third surface and the fourth surface have the same shape, the first surface is parallel to the second surface, the first surface is located opposite the second surface, the third surface is adjacent to the first surface, and the fourth surface is adjacent to the second surface; The angle formed between the third surface and the first surface is greater than 180° and less than 270°, the angle formed between the fourth surface and the second surface is greater than 180° and less than 270°, and the angle formed between the third surface and the fourth surface is greater than 180° and less than 360°, the fifth surface is adjacent to each of the first surface to the fourth surface, and the first region and the second region can be provided on the fifth surface.

[0013] The first rod-shaped component is inserted into the first opening of the first connecting component, the second rod-shaped component is inserted into the notch of the second connecting component, the third rod-shaped component is inserted into the first opening of the second connecting component, and the fourth rod-shaped component is inserted into the notch of the first connecting component, and the long axes of the first to fourth rod-shaped components can be parallel to each other.

[0014] The first pillar-shaped component can be fixed to a first region of the first base component, the second pillar-shaped component can be fixed to a second region of the first base component, the third pillar-shaped component can be fixed to the first region of the second base component, and the fourth pillar-shaped component can be fixed to the second region of the second base component.

[0015] The first connecting part and the second connecting part have elasticity, and can elastically deform the shape of the notch.

[0016] The cutout portion has a third region, a fourth region, and a fifth region, the fourth region being between the third region and the fifth region, the fifth region being between the third region and the first opening, and the top surfaces of the third region to the fifth region may have a shape including an arc.

[0017] The relative angle between the first base part and the second base part can be switched by switching the position of the second columnar part from one of the third area or the fourth area of ​​the second connecting part to the other, and by switching the position of the fourth columnar part from one of the third area or the fourth area of ​​the first connecting part to the other.

[0018] When the second pillar-shaped part is in the third region of the second connecting part and the fourth pillar-shaped part is in the third region of the first connecting part, the first surface of the first base part can face the second surface of the second base part.

[0019] When the second pillar-shaped part is in the third region of the second connecting part and the fourth pillar-shaped part is in the third region of the first connecting part, the third surface of the first base part can face the fourth surface of the second base part.

[0020] The device further includes a third connecting part, a fourth connecting part, and a fifth columnar part, the third connecting part and the fourth connecting part having second openings, the third connecting part being fixed to the first base part, the fourth connecting part being fixed to the second base part, the fifth columnar part being inserted into the second opening of the third connecting part and the second opening of the fourth connecting part, the long axis of the fifth columnar part being parallel to the long axes of the first to fourth columnar parts, and the fifth columnar part being located near the area where the first base part and the second base part are in contact.

[0021] By providing the angle adjustment device to a hinge portion, a support for a flexible component can be constructed. Also, by providing the support with a flexible display panel, a display device can be constructed.

[0022] The display panel preferably comprises a light emitting device. [Effects of the Invention]

[0023] By using one embodiment of the present invention, it is possible to provide an angle adjustment device that adjusts the relative angle between components. It is possible to provide an angle adjustment device that can fix the relative angle between components to a desired angle. Or, it is possible to provide a support for supporting a flexible component. Or, it is possible to provide a support for performing a bending operation without impairing the reliability of the flexible component. Or, it is possible to provide a novel support for a flexible component. Or, it is possible to provide a novel light-emitting device.

[0024] Alternatively, it is possible to provide a foldable display device with excellent portability. Alternatively, it is possible to provide a foldable display device with excellent display visibility. Alternatively, it is possible to provide a foldable display device with a power-saving function. Alternatively, it is possible to provide a foldable display device that is easy to hold. Alternatively, it is possible to provide a novel display device.

[0025] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these will become apparent from the description in the specification, drawings, claims, etc., and it is possible to extract other effects from the description in the specification, drawings, claims, etc. [Brief explanation of the drawings]

[0026] [Figure 1] FIG. 1 is a diagram illustrating the angle adjustment device. [Figure 2] Fig. 2A is a diagram illustrating a base part, and Fig. 2B is a diagram illustrating a connecting part. [Figure 3] 3A to 3C are diagrams illustrating the connecting parts. [Figure 4] FIG. 4 is a diagram illustrating the angle adjustment device. [Figure 5] 5A to 5D are diagrams illustrating the angle adjustment device. [Figure 6] 6A and 6B are diagrams illustrating the angle adjustment device. [Figure 7] 7A to 7D are diagrams illustrating the angle adjustment device. [Figure 8] 8A and 8B are diagrams illustrating the angle adjustment device. [Figure 9] 9A to 9C are diagrams illustrating the angle adjustment device. [Figure 10] 10A and 10B are diagrams illustrating the angle adjustment device. [Figure 11] 11A to 11C are diagrams illustrating a support tool. [Figure 12] 12A and 12B are diagrams illustrating a support tool. [Figure 13] 13A and 13B are diagrams illustrating a support tool. [Figure 14] 14A and 14B are diagrams illustrating a display device. [Figure 15] 15A and 15B are diagrams illustrating a display device. [Figure 16] 16A to 16C are diagrams illustrating a support tool. [Figure 17] 17A to 17C are diagrams illustrating a support tool. [Figure 18] 18A and 18B are diagrams illustrating a display device. [Figure 19] 19A to 19D are diagrams illustrating a display device. [Figure 20] FIG. 20 is a diagram illustrating an example of the configuration of a display panel. [Figure 21] FIG. 21 is a diagram illustrating an example of the configuration of a display panel. [Figure 22] FIG. 22 is a diagram illustrating an example of the configuration of a display panel. [Figure 23] Figure 23A is a block diagram of a display panel, and Figures 23B and 23C are circuit diagrams of pixels. [Figure 24] Figures 24A, 24C and 24D are circuit diagrams of the pixel, and Figure 24B is a timing chart illustrating the operation of the pixel. [Figure 25] 25A to 25E are diagrams illustrating examples of pixel configurations. DETAILED DESCRIPTION OF THE INVENTION

[0027] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art will readily understand that various modifications in form and detail may be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same parts or parts having similar functions will be designated by the same reference numerals in different drawings, and repeated description thereof may be omitted. Hatching of the same elements constituting the drawings may be omitted or changed as appropriate between different drawings.

[0028] Furthermore, even if a circuit diagram shows a single element, that element may be configured as multiple elements as long as there is no functional problem. For example, multiple transistors operating as switches may be connected in series or parallel. Also, a capacitor may be divided and placed in multiple locations.

[0029] Furthermore, a single conductor may have multiple functions, such as wiring, an electrode, and a terminal, and in this specification, multiple names may be used for the same element. Also, even when elements are shown as being directly connected to each other on a circuit diagram, in reality, the elements may be connected via one or more conductors, and in this specification, such a configuration is also included in the category of direct connection.

[0030] Although the present specification deals with display panels as a representative example of flexible components, other components may also be used, such as solar cells, primary batteries, secondary batteries, antennas, charging coils, speakers, microphones, cables, lighting, various terminals, various wiring, various sensors, various circuits, and composite devices of any of these.

[0031] In this specification, the term "display device" refers to any device that has a display function. That is, electronic devices that have a display unit are included in the display device. For example, electronic devices that have a display unit, such as mobile phones, smartphones, smart watches, tablet computers, and television sets, are included in the display device.

[0032] (Embodiment 1) In this embodiment, an angle adjustment device, a support, and a display device according to one embodiment of the present invention will be described with reference to the drawings.

[0033] One aspect of the present invention is an angle adjustment device having a first base part and a second base part and a mechanism for switching the relative angle between them. Another aspect of the present invention is a support tool having the angle adjustment device.

[0034] The angle adjustment device can fix and maintain the relative positions of the first and second base components. For example, a support that combines the angle adjustment device with a component such as a flat plate can maintain the entire structure in a flat, folded, or at a desired angle.

[0035] Furthermore, the angle adjustment device allows bending in one direction and prevents bending in the opposite direction, which prevents unexpected bending of the device and damage to the device.

[0036] <Angle adjustment device> 1A is a diagram illustrating an angle adjustment device 100 according to one embodiment of the present invention. The angle adjustment device 100 includes base components 101a and 101b, connecting components 102a and 102b, and columnar components 103a, 103b, 104a, and 104b. The base component 101a is connected to the base component 101b via other components. Cylindrical or polygonal columnar components can be used for the columnar components 103a, 103b, 104a, and 104b, and an example using columnar components will be described in this embodiment.

[0037] 2A is a perspective view illustrating the shapes of base components 101a and 101b. Base components 101a and 101b may have the same shape and have surfaces 111, 112, 113, 114, and 115, respectively. Surfaces 111 and 112 may have the same shape. Furthermore, surfaces 113 and 114 may have the same shape.

[0038] Surface 111 and surface 112 are parallel and located opposite each other. Surface 113 is located adjacent to surface 111. Surface 114 is located adjacent to surface 112. Surface 113 is inclined relative to surface 111 at an angle greater than 180° and less than 270°. Surface 114 is inclined relative to surface 112 at an angle greater than 180° and less than 270°. Surface 113 is inclined relative to surface 114 at an angle greater than 180° and less than 360°. Surface 115 is located adjacent to each of surfaces 111 to 114.

[0039] By adjusting the inclination angles of surfaces 113 and 114, it is possible to adjust the relative angle generated between base component 101a and base component 101b by the operation of angle adjustment device 100. Here, the relative angle refers to the angle generated between the same parts when the positions of base component 101a and base component 101b are changed according to the mechanism of the angle adjustment device.

[0040] Furthermore, surface 115 has regions 151 and 152. Openings may be provided in regions 151 and 152. In this embodiment, regions 151 and 152 of base part 101a are referred to as regions 151a and 152a, respectively. Regions 151 and 152 of base part 101b are referred to as regions 151b and 152b, respectively.

[0041] It is preferable that base components 101a and 101b and columnar components 103a, 103b, 104a, and 104b do not deform during operation, and are preferably made of a hard material such as metal, resin, ceramics, or a composite containing at least one of these.

[0042] 2B is a top view illustrating the shapes of the connecting parts 102a and 102b. The connecting parts 102a and 102b can have the same shape, and each has an opening 121 and a notch 122.

[0043] In the top view, the center of the opening 121 can be located on a straight line that is parallel to the longitudinal direction of the cutout 122 and passes through the center of the cutout 122. The shapes of the connecting parts 102a and 102b can be symmetrical with respect to the straight line. The columnar part 103a or 103b can be inserted into the opening 121.

[0044] The cutout portion 122 has regions 122a, 122b, and 122c. The columnar part 104a or the columnar part 104b can be inserted into the region 122a or the region 122b. The region 122a and the region 122b are connected, and each of the upper surfaces has two arcs.

[0045] 2B, one arc of region 122a has point A, the other arc has point B, one arc of region 122b has point C, the other arc has point D, and points A and B face each other, and points C and D face each other. In this case, the distance L1 between points A and B and between points C and D is preferably approximately the same as or smaller than the diameter of a cross section perpendicular to the major axis of columnar parts 104a and 104b. Furthermore, in the region where region 122a and region 122b are connected, a region is provided in which the width in the minor axis direction of notch portion 122 is L2, which is smaller than L1.

[0046] The two arcs can sandwich the columnar part 104a or the columnar part 104b, so that the columnar part 104a or the columnar part 104b inserted into the cutout part 122 can be easily fixed in position.

[0047] Furthermore, the region 122c is provided between the opening 121 and the region 122b. The regions 122b and 122c are connected, and the top surface of the region 122c has an arc shape.

[0048] The connecting components 102a and 102b are preferably formed of a hard material such as metal, resin, or a composite thereof, and having elasticity. Here, let the shortest distance between the point E on the arc of the region 122c and the outer periphery of the connecting component 102a (or 102b) excluding the notch 122 be L4. At this time, by setting L4 to an appropriate value, a part of the connecting component 102a (or 102b) can be elastically deformed with the vicinity of the region 122c as a fulcrum, and the lengths of L1 and L2 can be changed.

[0049] For example, in the connecting component 102a, as shown in FIG. 3A, it is assumed that the columnar component 104b is inserted into the region 122b in the initial state. Next, as shown in FIG. 3B, when a force acting in the direction of the region 122a is applied to the columnar component 104b, the connecting component 102a elastically deforms with the vicinity of the region 122c as a fulcrum, and temporarily L1 changes to L1' (L1 < L1'). Also, L2 changes to L2' (L2 < L2').

[0050] Then, as shown in FIG. 3C, when a force acting in the same direction is further applied to the columnar component 104b, when the columnar component 104b enters the region 122a, the elastic deformation of the connecting component returns to its original state. Therefore, the columnar component 104b is inserted into the region 122a. If a force acting in the reverse direction is applied to the columnar component 104b, it can return from the state shown in FIG. 3C to the state shown in FIG. 3A. The regions 122a and 122b can also be referred to as stable positions of the columnar component 104b in the notch 122. In this embodiment, an example in which two stable positions, the region 122c and the region 122b, are provided in the shown notch 122 is shown, but the number of stable regions may be three or more.

[0051] The degree of the above elastic deformation can be adjusted by the length of L4 shown in FIG. 2B. The longer the length of L4, the more difficult it is to elastically deform, and the shorter the length of L4, the easier it is to elastically deform. Therefore, the length of L4 may be adjusted according to the application.

[0052] The degree of elastic deformation can also be adjusted by adjusting the length L3, which is the shortest distance between point F in the region between region 122c and region 122b and the outer periphery of connecting part 102a (or 102b) excluding notch 122. The degree of elastic deformation may also be adjusted by changing the thickness (length in the depth direction in FIG. 2B) of connecting part 102a (or 102b).

[0053] 4 is an exploded view of the angle adjustment device 100. In one embodiment of the angle adjustment device 100, the base part 101a and the base part 101b are arranged so that a surface 111 and a surface 112 thereof are in contact with each other.

[0054] One of the longitudinal ends of the columnar part 103a is connected to the region 151a. One of the longitudinal ends of the columnar part 104a is connected to the region 152a. One of the longitudinal ends of the columnar part 103b is connected to the region 151b. One of the longitudinal ends of the columnar part 104b is connected to the region 152b.

[0055] In this case, the respective long axes of the columnar components 103a, 103b and the columnar components 104a, 104b are parallel and perpendicular to the surfaces 115 of the base components 101a and 101b. The columnar components 103a, 103b and the columnar components 104a, 104b may be fixed to the base components 101a and 101b, respectively. Alternatively, the columnar components 103a, 103b and the columnar components 104a, 104b may be rotatable about their center lines. Alternatively, the columnar components 103a, 104a and the base component 101a may be a single structure. Alternatively, the columnar components 103b, 104b and the base component 101b may be a single structure.

[0056] In the above state, the columnar part 103b is inserted into the opening 121 of the connecting part 102b, and the columnar part 104a is inserted into the region 122a of the cutout part 122 of the connecting part 102b. Also, the columnar part 103a is inserted into the opening 121 of the connecting part 102a, and the columnar part 104b is inserted into the region 122a of the cutout part 122 of the connecting part 102a. With this configuration, the shape shown in FIG. 1 is obtained.

[0057] At this time, the connecting part 102b is in a state where it can rotate around the center line of the columnar part 103b as an axis, and the connecting part 102a is in a state where it can rotate around the center line of the columnar part 103a as an axis.

[0058] 5A, let us consider the side between faces 111 and 113 of base part 101a be side H, and let base parts 101a and 101b be rotated about side H as the central axis, changing the state in which face 111 of base part 101a and face 112 of base part 101b are in contact (FIG. 5A) to the state in which face 113 of base part 101a and face 114 of base part 101b are in contact (FIG. 5B). Side H can also be considered the side between faces 112 and 114 of base part 101b.

[0059] 1, when the same operation as above is applied, as shown in Figures 5C and 5D, connecting part 102b moves so as to rotate around the center line of columnar part 103b as an axis, and the position of columnar part 104a inserted into cutout part 122 changes from region 122a to region 122b. Also, connecting part 102a moves so as to rotate around the center line of columnar part 103a as an axis, and the position of columnar part 104b inserted into cutout part 122 changes from region 122a to region 122b.

[0060] Furthermore, to change from the state of FIG. 5C to the state of FIG. 5D, or vice versa, it is necessary to apply a force that elastically deforms the connecting parts 102a and 102b. Therefore, the state of FIG. 5C or the state of FIG. 5D can be maintained unless this force is applied. The change from the state of FIG. 5C to the state of FIG. 5D, or vice versa, can be said to change the relative angle between the base part 101a and the base part 101b. Therefore, one embodiment of the present invention can be used as an angle adjustment device.

[0061] 6A and 6B, connecting parts 131a and 131b may be added to the angle adjustment device of one embodiment of the present invention, and a physical rotation axis (columnar part 105) may be provided at the position of side H.

[0062] Fig. 6A is a diagram showing the state in which connecting parts 131a and 131b are assembled to base parts 101a and 101b. Fig. 6B is an exploded view thereof. By providing connecting parts 131a and 131b and columnar part 105, the operation of angle adjustment device 100 can be made smoother and the mechanical strength can be further increased.

[0063] The base components 101a and 101b have cutouts 106 into which the columnar components 105 can be inserted, in an area corresponding to the position of side H shown in FIG. 5A and its surrounding area. The cutouts 106 are divided into a cutout area provided in the base component 101a and a cutout area provided in the base component 101b. A cylindrical component can be used as the columnar component 105, and at least one end of the columnar component is inserted into the cutout 106. It is preferable that the central axis of the columnar component 105 overlaps with side H shown in FIG. 5A.

[0064] Connecting part 131a has openings 141a and 142a, and columnar part 104a is inserted into opening 141a. Connecting part 131b has openings 141b and 142b, and columnar part 104b is inserted into opening 141b. Connecting part 131a and connecting part 131b are positioned so as to overlap, and columnar part 105 is inserted into openings 142a and 142b.

[0065] 6A and 6B, connecting component 131b is located on the inside and connecting component 131a is located on the outside when viewed from the base components 101a and 101b side, so a spacer 132 is provided on connecting component 131a to stabilize its position. The thickness of spacer 132 is preferably the same as or thicker than that of connecting component 131b. When connecting component 131b is located on the outside and connecting component 131a is located on the inside when viewed from the base components 101a and 101b side, spacer 132 can be provided on connecting component 131b.

[0066] Here, it is preferable that the connecting part 131a is fixed to the base part 101a. Alternatively, the connecting part 131a may be fixed to a columnar part 104a fixed to the base part 101a. Also, it is preferable that the connecting part 131b is fixed to the base part 101b. Alternatively, the connecting part 131b may be fixed to a columnar part 104b fixed to the base part 101b. Alternatively, the base part 101a, the columnar part 104a, and the connecting part 131a may be a single structure. Alternatively, the base part 101b, the columnar part 104b, and the connecting part 131b may be a single structure.

[0067] Furthermore, it is preferable that columnar part 105 is fixed to either connecting part 131a or connecting part 131b. Alternatively, columnar part 105 may be fixed to either a cutout region provided in base part 101a that forms cutout 106 or a cutout region provided in base part 101b. With this configuration, base parts 101a and 101b can rotate around columnar part 105 as an axis, as shown in Figures 7A and 7B.

[0068] In the state of FIG. 7A, columnar part 105 is the rotation axis, and surface 111 of base part 101a and surface 112 of base part 101b are in contact with each other, so that rotation in the opposite direction can be suppressed.

[0069] 7C and 7D show a configuration in which the columnar components 103a and 103b and connecting components 102a and 102b are added to the configuration shown in Figures 6A and 6B, and the shape changes due to the operation of the configuration. By using this configuration, the reliability and strength of the angle adjustment device 100 can be improved.

[0070] Although the minimum configuration in which a pair of basic components 101a and 101b is used has been described above, the total number of basic components 101a and 101b may be three or more. Figures 8A and 8B show, as an example, a configuration in which the total number of basic components 101a and 101b is seven. Figures 8A and 8B show only basic components 101a and 101b.

[0071] In this embodiment, the expression "folding" is used to refer to the operation for changing from the state of Fig. 8A to the state of Fig. 8B, and the expression "unfolding" is used to refer to the operation for changing from the state of Fig. 8B to the state of Fig. 8A.

[0072] The relative angle between base parts 101a and 101b that occurs when bending can be changed by adjusting the inclination angles of surfaces 113 and 114 of base parts 101a and 101b. The smaller the inclination of surface 113 relative to surface 114, the smaller this angle becomes, and the greater the inclination of surface 113 relative to surface 114, the larger this angle becomes. Furthermore, by adjusting the number of base parts 101a and 101b, the maximum angle at which bending can be achieved by the entire angle adjustment device can be adjusted.

[0073] 8A and 8B, the base components 101a and 101b are arranged alternately, and therefore, notches 106 are provided between all adjacent base components 101a and 101b.

[0074] 9A and 9B are diagrams showing a state in which connecting parts 131a and 131b are combined with the configurations of FIGS. 8A and 8B, with FIG. 9A showing the unfolded state and FIG. 9B showing the folded state.

[0075] Here, connecting parts 131a and 131b have a configuration different from that shown in Fig. 6B. As shown in Fig. 9C, connecting part 131a has opening 143a formed therein so as to be symmetrical with opening 142a about opening 141a. Connecting part 131b has opening 143b formed therein so as to be symmetrical with opening 142b about opening 141b.

[0076] 9A and 9B, a connecting part 131a is provided on base part 101a, and a connecting part 131b is provided on base part 101b. Openings 142a and 142b overlap, and columnar parts 105 are inserted into both. Openings 143a and 143b overlap, and columnar parts 105 are inserted into both.

[0077] 10A and 10B are diagrams showing a state in which connecting parts 102a and 102b are combined with the configurations of FIGS. 9A and 9B, with FIG. 10A showing the unfolded state and FIG. 10B showing the folded state.

[0078] 10A and 10B, base parts 101a and base parts 101b are arranged alternately, and therefore, connecting parts 102a and 102b are provided between all adjacent base parts 101a and 101b.

[0079] This configuration allows the device to bend in a number of different ways and maintain these shapes, making it suitable for use as a hinge for the support tool described below.

[0080] <Support> Fig. 11A is a perspective view illustrating a support tool 200 equipped with an angle adjustment device 100 according to one embodiment of the present invention. The support tool 200 has two angle adjustment devices 100 (angle adjustment devices 100a and 100b), flat plate portions 161 and 162, and a bending portion 165. Fig. 11A shows the support tool 200 in an unfolded state.

[0081] The bending portion 165 has a plurality of pillars 166, and one of the longitudinal ends of the pillars 166 is connected to the base component 101a or 101b of the angle adjustment device 100a. The other longitudinal end of the pillars 166 is connected to the base component 101a or 101b of the angle adjustment device 100b. Such a combination of the bending portion 165 and the angle adjustment device 100 can be called a hinge. The flat plate portion 161 is connected to one end of the hinge, and the flat plate portion 162 is connected to the other end of the hinge.

[0082] Fig. 11B is a perspective view showing a cross section taken along line A1-A2 in Fig. 11A. The cross section of pillar 166 perpendicular to the long axis is trapezoidal or approximately trapezoidal, and as shown in Fig. 11C, pillar 166 has side surface 167a (the surface including one leg of the trapezoid), side surface 167b (the surface including the other leg of the trapezoid), side surface 167c (the surface including the lower base of the trapezoid), and side surface 167d (the surface including the upper base of the trapezoid). Bending portion 165 has multiple pillars 166, and between two adjacent pillars 166, side surface 167a of one pillar 166 and side surface 167b of the other pillar 166 are adjacent to each other.

[0083] The pillars 166 are connected such that their side surfaces 167c (surfaces including the lower bases of the trapezoids) are continuous and form a substantial surface. The side surface 167c of the pillar 166 at one end of the hinge is connected so as to be continuous with the first surface of the flat plate portion 161. The side surface 167c of the pillar 166 at the other end of the hinge is connected so as to be continuous with the first surface of the flat plate portion 162. The shape of the side surface 167d (surfaces including the upper bases of the trapezoids) of each pillar 166 is arbitrary as long as it does not interfere with other pillars 166 and the flat plate portions 161 and 162. Therefore, the cross section perpendicular to the major axis of the pillar 166 may be triangular or approximately triangular.

[0084] As described above, the flat plate portion 161, the bent portion 165 (bottom surfaces of the multiple columnar parts 166), and the flat plate portion 162 are a continuous plane, and the distance between any point A3 on the flat plate portion 162 and any point A4 on the flat plate portion 161 shown in FIG. 11B is constant regardless of the state of the bent portion 165. Therefore, when attaching a flexible component to a support, it is preferable to attach it to this plane. A support according to one embodiment of the present invention can maintain its shape even in the unfolded state shown in FIGS. 11A and 11B. It is more preferable that this plane be designed to be below a plane including the axes of the multiple columnar parts 105, and that the plane including the axes of the multiple columnar parts 105 be close to the neutral plane of the flexible component.

[0085] Fig. 12A is a diagram showing an example of a transitional state (intermediate state) when support device 200 is transformed from an unfolded state to a folded state, or vice versa. Fig. 12B is a perspective view showing a cross section taken along line B1-B2 shown in Fig. 12A.

[0086] 12A and 12B show a configuration in which, in two adjacent columns 166, there is a region where the side surface 167a of one column 166 faces and contacts the side surface 167b of the other column 166, and, in two other adjacent columns 166, there is a region where the side surface 167a of one column 166 does not contact the side surface 167b of the other column. A support according to one embodiment of the present invention can maintain its shape even in a transient state as shown in FIGS. 12A and 12B.

[0087] Fig. 13A is a diagram showing a bent state of the support tool 200. Fig. 13B is a perspective view showing a cross section taken along line C1-C2 shown in Fig. 13A.

[0088] 13A and 13B show a configuration in which, for every pair of adjacent columns 166, side surface 167a of one column faces side surface 167b of the other column. A support according to one embodiment of the present invention can maintain its shape even when bent as shown in FIGS. 13A and 13B.

[0089] <Display device> The support 200 can be used to support a flexible component. If a display panel is used as the flexible component, a flexible display device can be formed.

[0090] 14A and 14B are diagrams illustrating an example of a display device that can be folded in half. Note that angle adjustment devices 100a and 100b of support tool 200 are illustrated in a simplified manner. Fig. 14A shows the display device in an unfolded state, and Fig. 14B shows it in a folded state.

[0091] The display panel 170 is flexible, and may be, for example, an EL display device provided on a thin plate of resin or glass.

[0092] 11A etc., the display panel 170 can be provided along a continuous flat surface portion of the flat plate portion 161, the bent portion 165 (bottom surfaces of the plurality of pillars 166), and the flat plate portion 162. Therefore, as shown in FIG. 14B, in the folded state, the display surface of the display panel forms a convex curved surface.

[0093] 14A and 14B show angle adjustment devices 100a and 100b, flat plate portion 161, flat plate portion 162, etc., but these may be housed in the housing of the display device.

[0094] 15A and 15B are diagrams illustrating an example of a display device that can be folded into three. Note that angle adjustment devices 100a, 100b, 100c, and 100d of support tool 200 are illustrated in a simplified manner. Fig. 15A shows the display device in an unfolded state, and Fig. 15B shows it in a folded state.

[0095] The tri-fold display device differs from the halved display device in that the support is provided with angle adjustment devices 100c and 100d and a flat plate portion 163. Flat plate portion 163 is connected to flat plate portion 162 via angle adjustment devices 100c and 100d.

[0096] 15A and 15B show angle adjustment devices 100a, 100b, 100c, 100d, flat plate portion 161, flat plate portion 162, and flat plate portion 163, but these may be stored in the housing of the display device.

[0097] 15B, a concave curved surface is formed on the display surface of the display panel from flat plate portion 162 to flat plate portion 163. Therefore, it is preferable that angle adjustment devices 100c and 100d have a different configuration from angle adjustment devices 100a and 100b.

[0098] For example, the angle adjustment devices 100c and 100d can have the configurations shown in Figures 16A to 16C. Note that the angle adjustment devices shown in Figures 16A to 16C have a continuous configuration of the angle adjustment devices 100c and 100d shown in Figures 15A and 15B, so only one of the reference numerals is shown.

[0099] The angle adjustment device 100c has a plurality of pillars 181 each having a rectangular or approximately rectangular cross section perpendicular to the long axis. The pillars 181 have a first side surface (a surface including one side of the approximately rectangle) and a second side surface (a surface including a side opposite to the one side of the approximately rectangle). The plurality of pillars 181 are configured such that the first side surface of one pillar 181 of two adjacent pillars is adjacent to the second side surface of the other pillar 181.

[0100] The pillars 181 are connected so that their third side faces (faces including a side that is approximately perpendicular to one side) form a continuous plane. The third side face of the pillar 181 at one end of the angle adjustment device 100c is connected so as to be continuous with the first face of the flat plate portion 162. The third side face of the pillar 181 at the other end of the angle adjustment device 100c is connected so as to be continuous with the first face of the flat plate portion 163. The shape of the fourth side face (face opposite the third side face) of each pillar 181 can be any shape as long as it does not interfere with other pillars or the housing.

[0101] 16A, two adjacent columns 181 can be bent by deforming them so that the first side surface of one column 181 and the second side surface of the other column 181 move away from each other. In this case, the third side surfaces of the multiple columns 181 are connected at a certain angle, forming a region whose overall cross section is roughly arc-shaped. Therefore, a flexible display panel can form a concave curved surface in the area that overlaps with this region.

[0102] 16A, when a deformation operation (unfolding operation) is performed from the state shown in Fig. 16A, the first side surface of one of the two adjacent pillars 181 and the second side surface of the other pillar 181 move closer to each other, and the radius of curvature of the approximately circular arc increases, as shown in Fig. 16B. At this time, the radius of curvature of the curved surface of the display panel also increases.

[0103] When further deformation is performed from the state shown in Figure 16B, the first surface of flat plate portion 162, the third side surfaces of each columnar body 181, and the first surface of flat plate portion 163 are connected to form a flat surface, as shown in Figure 16C. At this time, the curved surface portions of the display panel also become flat, and the entire panel is in a flat, unfolded state. If deformation is performed in the reverse order to the above, the panel can be folded.

[0104] Since the cross section of the pillars 181 is rectangular, when two adjacent pillars 181 are unfolded flat, the first side surface of one pillar 181 comes into contact with the second side surface of the other pillar 181. Therefore, the angle adjustment device 100c does not cause the display panel to bend in the opposite direction, and a mechanism to suppress the reverse bending may not be necessary. A spacer may be provided to maintain a gap between the housings when folded.

[0105] 17A to 17C are diagrams illustrating other examples of angle adjustment devices 100c and 100d. Note that although the angle adjustment device 100d will be described below, the angle adjustment device 100c also has a similar configuration.

[0106] The angle adjustment device 100d has a gear 186a and a gear 186b. The gear 186a is fixed to the flat plate portion 162. The gear 186b is fixed to the flat plate portion 163. It is preferable that the central axis of the gear 186a overlaps with the first surface of the flat plate portion 162. It is also preferable that the central axis of the gear 186b overlaps with the first surface of the flat plate portion 163.

[0107] 17A, when the display panel is bent, gears 186a and 186b are meshed at a specific position. At this time, the central axis of gear 186a is on the first surface of flat plate portion 162, and the central axis of gear 186b is on the first surface of flat plate portion 161, so a gap is created between flat plate portion 162 and flat plate portion 163 (between the opposing display surfaces of the display panel). Therefore, the flexible display panel can form a concave curved surface with a curvature radius that is approximately half of the gap.

[0108] 17A, flat plate portions 162 and 163 synchronize with each other in accordance with the meshing of gears 186a and 186b, and move to open around angle adjustment device 100d as a fulcrum (see FIG. 17B). At this time, the display panel also changes so that the radius of curvature of the curved surface portion increases.

[0109] When further deformation is performed from the state shown in Figure 17B, the first surface of flat plate portion 162 and the first surface of flat plate portion 163 are connected so as to become flat, as shown in Figure 17C. At this time, the curved surface portion of the display panel also becomes flat, and the entire panel is in a flat, unfolded state. If deformation is performed in the reverse order to the above, the panel can be folded.

[0110] A mechanism for maintaining the meshing of gears 186a and 186b may be provided. When unfolded flat, the side of flat plate portion 162 and the side of flat plate portion 163 come into contact with each other. Therefore, since angle adjustment device 100d does not cause reverse bending of the display panel, a mechanism for suppressing reverse bending may not be necessary. A spacer may be provided to maintain the gap between flat plate portion 162 and flat plate portion 163 when folded. Alternatively, a mechanism for maintaining the gap may be provided to gears 186a and 186b.

[0111] <Application example> 18A is a diagram showing an example in which the flexible display device described in this embodiment is applied to an information terminal such as a smartphone. Elements common to the display devices described above are denoted by the same reference numerals. Display device 250 shown in FIG. 18A includes display panel 170, audio input / output units 235a and 235b, cameras 236a and 236b, sensors 237 and 220.

[0112] When one of the audio input / output units 235a, 235b functions as a microphone, the other can function as a speaker. Therefore, when using the telephone function, for example, conversation can be carried out without any inconvenience no matter which way the device is held. The microphone function and speaker function can be switched by the sensor 220 that detects the tilt. Similarly, the sensor 220 can be used to prioritize the function of either of the cameras 236a, 236b.

[0113] The input / output units 235a and 235b may have both a device that functions as a microphone and a device that functions as a speaker, or may have one device that has both functions.

[0114] In addition, both input / output units 235a and 235b can be used as microphones to record stereo sound, and both input / output units 235a and 235b can be used as speakers to play stereo sound.

[0115] It is also possible to use both cameras 236a and 236b to capture 3D images. Sensor 237 is an optical sensor that can adjust the brightness of the display to match the ambient illuminance so that it is easy to see.

[0116] 18B, a display panel 171 may be provided on the rear surface of the display device 250, opposite the front surface on which the display panel 170 is provided. The display panel 171 can display the same image as the display panel 170, and can also be used as a sub-display that displays simple information, pictures, patterns, photographs, etc., or as lighting. The display panel 171 may be a display panel using a light-emitting device or a liquid crystal device, or may be low-power electronic paper, etc. The display panel 171 may also be a display panel that uses a hard substrate as a support.

[0117] 19A, a display panel 171 may be provided on the flat plate portion 161, a display panel 172 may be provided on the flat plate portion 162, and a display panel 173 may be provided on the flat plate portion 163. The display panels 172 and 173 may be the same as the display panel 171.

[0118] 19B, a flexible display panel 175 may be provided on the rear surface of the display device 250. In this case, the display panel 175 can be bent, and therefore can be provided across the flat plate portions 161 to 163, similar to the display panel 170 provided on the front surface.

[0119] 19C, a solar cell 240 may be provided on the rear surface of the display device 250. The power generated by the solar cell 240 can be used to charge a battery in the display device 250, and can also be supplied to the outside via an external interface 245.

[0120] 19C shows an example of a solar cell having a hard support, which may be, for example, a silicon solar cell with a crystalline silicon photoelectric conversion layer, or a solar cell with a tandem structure of a silicon solar cell and a perovskite solar cell.

[0121] 19D, the solar cell may have a flexible substrate as a support. For example, a thin-film solar cell 141 such as an amorphous silicon solar cell, a CIGS (Cu-In-Ga-Se) solar cell, an organic solar cell, or a perovskite solar cell can be used. The solar cell having a flexible substrate as a support can be provided across the flat plate portions 161 to 163, similar to the display panel 171.

[0122] (Embodiment 2) In this embodiment, a structural example of a display panel that can be used for a display device according to one embodiment of the present invention will be described.

[0123] <Configuration example> 20 shows a top view of a display panel 700. A flexible support substrate 745 is applied to the display panel 700, and the display panel 700 can be used as a flexible display. The display panel 700 has a pixel portion 702 provided over the flexible support substrate 745. A source driver circuit portion 704, a pair of gate driver circuit portions 706, wirings 710, and the like are provided over the support substrate 745. The pixel portion 702 is provided with a plurality of display devices.

[0124] Furthermore, an FPC terminal portion 708 to which an FPC (Flexible Printed Circuit) 716 is connected is provided on a part of the support substrate 745. Various signals and the like are supplied by the FPC 716 to each of the pixel portion 702, the source driver circuit portion 704, and the gate driver circuit portion 706 via the FPC terminal portion 708 and wiring 710.

[0125] A pair of gate driver circuit units 706 are provided on both sides of the pixel unit 702. The gate driver circuit unit 706 and the source driver circuit unit 704 may each be formed separately on a semiconductor substrate or the like and may be in the form of a packaged IC chip. The IC chip can be mounted on a support substrate 745 by COF (Chip On Film) technology or the like.

[0126] It is preferable to use OS transistors as transistors included in the pixel portion 702, the source driver circuit portion 704, and the gate driver circuit portion 706.

[0127] A light-emitting device or the like can be used as the display device provided in the pixel unit 702. Examples of the light-emitting device include self-luminous light-emitting devices such as LEDs (Light Emitting Diodes), OLEDs (Organic LEDs), QLEDs (Quantum-dot LEDs), and semiconductor lasers. Liquid crystal devices such as transmissive liquid crystal devices, reflective liquid crystal devices, and semi-transmissive liquid crystal devices can also be used as the display device. Display devices that employ shutter-type or optical interference-type MEMS (Micro Electro Mechanical Systems) devices, microcapsule-type, electrophoretic-type, electrowetting-type, or electronic liquid powder (registered trademark)-type devices can also be used.

[0128] 20 shows an example in which a portion of the support substrate 745 where the FPC terminal portion 708 is provided has a protruding shape. A part of the support substrate 745 including the FPC terminal portion 708 can be folded back to the rear side in an area P1 in FIG. 20. By folding back a part of the support substrate 745, the display panel 700 can be mounted in an electronic device or the like with the FPC 716 disposed so as to overlap the rear side of the pixel portion 702, thereby enabling space saving and miniaturization of the electronic device or the like.

[0129] An IC 717 is mounted on an FPC 716 connected to the display panel 700. The IC 717 functions as, for example, a source driver circuit. In this case, the source driver circuit unit 704 in the display panel 700 can be configured to include at least one of a protection circuit, a buffer circuit, a demultiplexer circuit, and the like.

[0130] <Example of cross-sectional configuration> A configuration using an organic EL display as a display device will be described below with reference to Figures 21 and 22. Figures 21 and 22 are each a schematic cross-sectional view of display panel 700 shown in Figure 20 taken along dashed line ST.

[0131] First, common parts of the display panels shown in FIGS. 21 and 22 will be described.

[0132] 21 and 22 show cross sections including a pixel portion 702, a gate driver circuit portion 706, and an FPC terminal portion 708. The pixel portion 702 includes a transistor 750 and a capacitor 790. The gate driver circuit portion 706 includes a transistor 752.

[0133] The transistor 750 and the transistor 752 are transistors in which an oxide semiconductor is used for a semiconductor layer in which a channel is formed. Note that the present invention is not limited to this, and a transistor in which silicon (amorphous silicon, polycrystalline silicon, or single crystal silicon) or an organic semiconductor is used for the semiconductor layer can also be used.

[0134] The transistor used in this embodiment includes a highly purified oxide semiconductor film in which the formation of oxygen vacancies is suppressed. The off-state current of the transistor can be significantly reduced. Therefore, a pixel including such a transistor can hold an electric signal such as an image signal for a long time and can set a long interval between writing of the image signal or the like. Therefore, the frequency of a refresh operation can be reduced, leading to reduced power consumption.

[0135] Furthermore, the transistor used in this embodiment can achieve relatively high field-effect mobility and thus can be driven at high speed. For example, by using such a transistor capable of high-speed driving in a display panel, a switching transistor in a pixel portion and a driver transistor used in a driver circuit portion can be formed over the same substrate. That is, a configuration without using a driver circuit formed using a silicon wafer or the like is possible, and the number of components in a display device can be reduced. Furthermore, by using a transistor capable of high-speed driving in the pixel portion, a high-quality image can be provided.

[0136] The capacitor 790 has a lower electrode formed by processing the same film as the first gate electrode of the transistor 750, and an upper electrode formed by processing the same metal oxide film as the semiconductor layer. The upper electrode has low resistance, similar to the source and drain regions of the transistor 750. A portion of an insulating film that functions as the first gate insulating layer of the transistor 750 is provided between the lower and upper electrodes. That is, the capacitor 790 has a stacked structure in which an insulating film that functions as a dielectric film is sandwiched between a pair of electrodes. The upper electrode is connected to wiring obtained by processing the same film as the source and drain electrodes of the transistor 750.

[0137] An insulating layer 770 functioning as a planarization film is provided over the transistor 750, the transistor 752, and the capacitor 790.

[0138] The transistor 750 included in the pixel portion 702 and the transistor 752 included in the gate driver circuit portion 706 may have different structures. For example, a top-gate transistor may be used for one of them, and a bottom-gate transistor may be used for the other. Note that the source driver circuit portion 704 is similar to the gate driver circuit portion 706.

[0139] The FPC terminal portion 708 includes a wiring 760, a part of which functions as a connection electrode, an anisotropic conductive film 780, and an FPC 716. The wiring 760 is electrically connected to a terminal of the FPC 716 via the anisotropic conductive film 780. Here, the wiring 760 is formed using the same conductive film as the source and drain electrodes of the transistor 750 and the like.

[0140] Next, a display panel 700 shown in FIG. 21 will be described.

[0141] 21 includes a support substrate 745 and a support substrate 740. As the support substrate 745 and the support substrate 740, for example, a flexible substrate such as a glass substrate or a plastic substrate can be used.

[0142] A transistor 750, a transistor 752, a capacitor 790, and the like are provided over an insulating layer 744. A supporting substrate 745 and the insulating layer 744 are attached to each other with an adhesive layer 742.

[0143] The display panel 700 also includes a light-emitting device 782, a colored layer 736, a light-shielding layer 738, and the like.

[0144] The light-emitting device 782 includes a conductive layer 772, an EL layer 786, and a conductive layer 788. The conductive layer 772 is electrically connected to a source electrode or a drain electrode of the transistor 750. The conductive layer 772 is provided over an insulating layer 770 and functions as a pixel electrode. An insulating layer 730 is provided to cover an edge of the conductive layer 772, and an EL layer 786 and a conductive layer 788 are stacked over the insulating layer 730 and the conductive layer 772.

[0145] The conductive layer 772 can be formed using a material that reflects visible light. For example, a material containing aluminum, silver, or the like can be used. The conductive layer 788 can be formed using a material that transmits visible light. For example, an oxide material containing indium, zinc, tin, or the like can be used. Therefore, the light-emitting device 782 is a top-emission light-emitting device that emits light to the side opposite to the formation surface (the supporting substrate 740 side).

[0146] The EL layer 786 includes an organic compound or an inorganic compound such as quantum dots, etc. The EL layer 786 includes a light-emitting material that emits blue light when a current flows through it.

[0147] Examples of luminescent materials include fluorescent materials, phosphorescent materials, thermally activated delayed fluorescence (TADF) materials, inorganic compounds (quantum dot materials, etc.), etc. Examples of materials that can be used for quantum dots include colloidal quantum dot materials, alloy-type quantum dot materials, core-shell-type quantum dot materials, and core-type quantum dot materials.

[0148] The light-shielding layer 738 and the coloring layer 736 are provided on one surface of the insulating layer 746. The coloring layer 736 is provided at a position overlapping with the light-emitting device 782. The light-shielding layer 738 is provided in a region of the pixel portion 702 that does not overlap with the light-emitting device 782. The light-shielding layer 738 may also be provided to overlap with the gate driver circuit portion 706, etc.

[0149] The support substrate 740 is bonded to the other surface of the insulating layer 746 by an adhesive layer 747. The support substrate 740 and the support substrate 745 are bonded to each other by a sealing layer 732.

[0150] Here, a light-emitting material that emits white light is used as the EL layer 786 of the light-emitting device 782. The white light emitted by the light-emitting device 782 is colored by the coloring layer 736 and emitted to the outside. The EL layer 786 is provided across pixels that exhibit different colors. In the pixel portion 702, pixels each provided with a coloring layer 736 that transmits any of red (R), green (G), and blue (B) light are arranged in a matrix, so that the display panel 700 can display full colors.

[0151] Alternatively, a conductive film having transparency and reflectivity may be used as the conductive layer 788. In this case, a microresonator (microcavity) structure may be realized between the conductive layer 772 and the conductive layer 788, so that light of a specific wavelength can be intensified and emitted. In this case, an optical adjustment layer for adjusting the optical distance may be disposed between the conductive layer 772 and the conductive layer 788, and the thickness of the optical adjustment layer may be made different between pixels of different colors, thereby increasing the color purity of the light emitted from each pixel.

[0152] When the EL layer 786 is formed in an island shape for each pixel or in a striped shape for each pixel column, that is, when it is formed by coloring, the colored layer 736 or the optical adjustment layer described above may not be provided.

[0153] Here, it is preferable to use an inorganic insulating film that functions as a barrier film with low moisture permeability for each of the insulating layers 744 and 746. By sandwiching the light-emitting device 782, the transistor 750, and the like between the insulating layers 744 and 746, deterioration of these components is suppressed, and a highly reliable display panel can be realized.

[0154] 22 includes a resin layer 743 between the adhesive layer 742 and the insulating layer 744 shown in FIG.

[0155] The resin layer 743 is a layer containing an organic resin such as polyimide or acrylic. The insulating layer 744 contains an inorganic insulating film such as silicon oxide, silicon oxynitride, or silicon nitride. The resin layer 743 and the support substrate 745 are bonded together by an adhesive layer 742. The resin layer 743 is preferably thinner than the support substrate 745.

[0156] The protective layer 749 is attached to the sealing layer 732. A glass substrate, a resin film, or the like can be used as the protective layer 749. Furthermore, as the protective layer 749, an optical member such as a polarizing plate (including a circular polarizing plate), a scattering plate, or an input device such as a touch sensor panel, or a configuration in which two or more of these are stacked may be used.

[0157] The EL layer 786 of the light-emitting device 782 is provided in an island shape on the insulating layer 730 and the conductive layer 772. By creating the EL layer 786 so that each subpixel emits a different light color, a color display can be realized without using the coloring layer 736.

[0158] A protective layer 741 is provided to cover the light-emitting device 782. The protective layer 741 has a function of preventing impurities such as water from diffusing into the light-emitting device 782. The protective layer 741 has a layered structure in which an insulating layer 741a, an insulating layer 741b, and an insulating layer 741c are layered in this order from the conductive layer 788 side. In this case, it is preferable to use an inorganic insulating film that has a high barrier property against impurities such as water for the insulating layer 741a and the insulating layer 741c, and an organic insulating film that functions as a planarizing film for the insulating layer 741b. It is also preferable that the protective layer 741 is provided so as to extend to the gate driver circuit unit 706.

[0159] Furthermore, the organic insulating film covering the transistor 750, the transistor 752, and the like is preferably formed in an island shape inside the sealing layer 732. In other words, the edge of the organic insulating film is preferably located inside the sealing layer 732 or in a region overlapping with the edge of the sealing layer 732. FIG. 22 illustrates an example in which the insulating layer 770, the insulating layer 730, and the insulating layer 741b are processed into an island shape. For example, in the portion overlapping with the sealing layer 732, the insulating layer 741c and the insulating layer 741a are provided in contact with each other. In this manner, the surface of the organic insulating film covering the transistor 750 and the transistor 752 is not exposed outside the sealing layer 732, which can suitably prevent water or hydrogen from diffusing from the outside to the transistor 750 and the transistor 752 through the organic insulating film. This suppresses fluctuations in the electrical characteristics of the transistors, thereby achieving a highly reliable display device.

[0160] 22, the bendable region P1 includes a support substrate 745, an adhesive layer 742, and a portion that is not provided with an inorganic insulating film such as an insulating layer 744. In the region P1, an insulating layer 770 containing an organic material covers the wiring 760 to prevent the wiring 760 from being exposed. By providing as little inorganic insulating film as possible in the bendable region P1 and using a stacked configuration in which only a conductive layer containing a metal or alloy and a layer containing an organic material are stacked, it is possible to prevent cracks from occurring when the display panel 700A is bent. Furthermore, by not providing a support substrate 745 in the region P1, a portion of the display panel 700A can be bent with an extremely small radius of curvature.

[0161] 22, a conductive layer 761 is provided over the protective layer 741. The conductive layer 761 can be used as a wiring or an electrode.

[0162] Furthermore, when a touch sensor is provided over the display panel 700A, the conductive layer 761 can function as an electrostatic shielding film for preventing electrical noise generated when a pixel is driven from being transmitted to the touch sensor. In this case, a predetermined constant potential may be applied to the conductive layer 761.

[0163] Alternatively, the conductive layer 761 can be used as, for example, an electrode of a touch sensor. This allows the display panel 700A to function as a touch panel. For example, the conductive layer 761 can be used as an electrode or wiring of a capacitive touch sensor. In this case, the conductive layer 761 can be used as a wiring or electrode to which a detection circuit is connected or a wiring or electrode to which a sensor signal is input. In this way, by forming a touch sensor on the light-emitting device 782, the number of components can be reduced, and the manufacturing costs of electronic devices and the like can be reduced.

[0164] The conductive layer 761 is preferably provided in a portion that does not overlap with the light-emitting device 782. For example, the conductive layer 761 can be provided in a position that overlaps with the insulating layer 730. This eliminates the need to use a transparent conductive film with relatively low conductivity as the conductive layer 761, and allows the use of a metal or alloy with high conductivity, thereby improving the sensitivity of the sensor.

[0165] Note that the type of the touch sensor that can be configured using the conductive layer 761 is not limited to a capacitance type, and various types such as a resistive film type, a surface acoustic wave type, an infrared type, an optical type, and a pressure-sensitive type can be used. Alternatively, two or more of these types may be used in combination.

[0166] <Components> Components such as transistors that can be applied to a display device will be described below.

[0167] [Transistor] The transistor includes a conductive layer functioning as a gate electrode, a semiconductor layer, a conductive layer functioning as a source electrode, a conductive layer functioning as a drain electrode, and an insulating layer functioning as a gate insulating layer.

[0168] Note that the structure of a transistor included in a display device of one embodiment of the present invention is not particularly limited. For example, a planar transistor, a staggered transistor, or an inverted staggered transistor may be used. Furthermore, a top-gate or bottom-gate transistor structure may be used. Alternatively, gate electrodes may be provided above and below a channel.

[0169] The crystallinity of the semiconductor material used for the transistor is not particularly limited, and any of an amorphous semiconductor, a single-crystal semiconductor, and a semiconductor having crystallinity other than single crystal (a microcrystalline semiconductor, a polycrystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. The use of a single-crystal semiconductor or a crystalline semiconductor is preferable because it can suppress deterioration of the transistor characteristics.

[0170] In the following, a transistor using a metal oxide film as a semiconductor layer in which a channel is formed will be described in particular.

[0171] As a semiconductor material for a transistor, a metal oxide having an energy gap of 2 eV or more, preferably 2.5 eV or more, and more preferably 3 eV or more can be used. A typical example is an oxide semiconductor containing indium, such as CAAC-OS or CAC-OS, which will be described later. CAAC-OS has stable atoms constituting the crystal, making it suitable for transistors where reliability is important. Furthermore, CAC-OS exhibits high mobility, making it suitable for transistors that operate at high speed.

[0172] Because of the large energy gap of the semiconductor layer, OS transistors can exhibit extremely low off-state currents of several yA / μm (current value per 1 μm of channel width). Furthermore, unlike Si transistors, OS transistors have characteristics such as the absence of impact ionization, avalanche breakdown, and short-channel effects, making them suitable for the formation of highly reliable circuits. Furthermore, OS transistors are less susceptible to variations in electrical characteristics due to non-uniformity in crystallinity, which is a problem with Si transistors.

[0173] The semiconductor layer can be a film represented by an In-M-Zn oxide containing, for example, indium, zinc, and M (M is one or more metals selected from aluminum, titanium, gallium, germanium, yttrium, zirconium, lanthanum, cerium, tin, neodymium, hafnium, etc.). The In-M-Zn oxide can be formed by, for example, sputtering, atomic layer deposition (ALD), or metal organic chemical vapor deposition (MOCVD).

[0174] When forming an In-M-Zn oxide film by sputtering, the atomic ratio of the metal elements in the sputtering target preferably satisfies In≧M and Zn≧M. Preferred atomic ratios of the metal elements in such sputtering targets are In:M:Zn=1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=3:1:2, In:M:Zn=4:2:3, In:M:Zn=4:2:4.1, In:M:Zn=5:1:6, In:M:Zn=5:1:7, In:M:Zn=5:1:8, etc. The atomic ratios of the semiconductor layer to be formed each have a variation of ±40% of the atomic ratio of the metal elements contained in the sputtering target.

[0175] The semiconductor layer is a metal oxide film with a low carrier density. For example, the semiconductor layer is a metal oxide film with a carrier density of 1×10 17 / cm 3 Less than 1 × 10 15 / cm 3 or less, more preferably 1 × 10 13 / cm 3 Less than 1×10, more preferably 11 / cm 3 or less, more preferably 1 × 10 10 / cm 3 Less than 1 x 10 -9 / cm 3The above metal oxides can be used. Such metal oxides are called high-purity intrinsic or substantially high-purity intrinsic metal oxides. Such oxide semiconductors can be said to be metal oxides with low defect state density and stable characteristics.

[0176] Note that the present invention is not limited to these, and an oxide semiconductor having an appropriate composition may be used depending on the semiconductor characteristics and electrical characteristics (field-effect mobility, threshold voltage, etc.) of the transistor. In order to obtain the semiconductor characteristics of the transistor, it is preferable to appropriately set the carrier density, impurity concentration, defect density, atomic ratio of metal element to oxygen, interatomic distance, density, and the like of the semiconductor layer.

[0177] If the metal oxide constituting the semiconductor layer contains silicon or carbon, which is one of the group 14 elements, oxygen vacancies increase in the semiconductor layer, causing it to become n-type. For this reason, the concentration of silicon or carbon in the semiconductor layer (concentration obtained by secondary ion mass spectrometry) is set to 2×10 18 atoms / cm 3 Less than or equal to 2 x 10 17 atoms / cm 3 The following applies.

[0178] In addition, alkali metals and alkaline earth metals may generate carriers when bonded to metal oxides, which may increase the off-state current of a transistor. Therefore, the concentration of alkali metals or alkaline earth metals in the semiconductor layer obtained by secondary ion mass spectrometry is calculated as 1×10 18 atoms / cm 3 Less than or equal to 2 x 10 16 atoms / cm 3 Do the following:

[0179] Furthermore, if the metal oxide that makes up the semiconductor layer contains nitrogen, electrons that act as carriers are generated, increasing the carrier density and making the transistor more likely to be n-type. As a result, transistors that use metal oxides that contain nitrogen tend to have normally-on characteristics. For this reason, the nitrogen concentration in the semiconductor layer obtained by secondary ion mass spectrometry is 5×1018 atoms / cm 3 It is preferable to do the following:

[0180] Furthermore, if hydrogen is contained in an oxide semiconductor constituting a semiconductor layer, it may react with oxygen bonded to metal atoms to form water, which may form oxygen vacancies in the oxide semiconductor. If oxygen vacancies are present in the channel formation region of an oxide semiconductor, the transistor may exhibit normally-on characteristics. Furthermore, defects in which hydrogen enters the oxygen vacancies may function as donors and generate electrons that serve as carriers. Furthermore, some of the hydrogen may bond with oxygen that is bonded to metal atoms to generate electrons that serve as carriers. Therefore, a transistor using an oxide semiconductor containing a large amount of hydrogen is likely to exhibit normally-on characteristics.

[0181] A defect in which hydrogen is introduced into an oxygen vacancy can function as a donor in an oxide semiconductor. However, it is difficult to quantitatively evaluate such defects. Therefore, oxide semiconductors are sometimes evaluated using carrier concentration instead of donor concentration. Therefore, in this specification and the like, a carrier concentration assuming a state in which no electric field is applied may be used as a parameter of an oxide semiconductor instead of donor concentration. In other words, the "carrier concentration" described in this specification and the like may be rephrased as "donor concentration."

[0182] Therefore, it is preferable that the hydrogen concentration in the oxide semiconductor be reduced as much as possible. Specifically, the hydrogen concentration in the oxide semiconductor measured by secondary ion mass spectrometry (SIMS) is 1×10 20 atoms / cm 3 Less than 1 x 10 19 atoms / cm 3 less than 5 × 10 18 atoms / cm 3 less than 1×10 18 atoms / cm 3When an oxide semiconductor in which impurities such as hydrogen are sufficiently reduced is used for a channel formation region of a transistor, stable electrical characteristics can be obtained.

[0183] Oxide semiconductors (metal oxides) are divided into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include c-axis aligned crystalline oxide semiconductors (CAAC-OS), polycrystalline oxide semiconductors, nanocrystalline oxide semiconductors (nc-OS), amorphous-like oxide semiconductors (a-like OS), and amorphous oxide semiconductors. Among non-single-crystal structures, the amorphous structure has the highest density of defect states, and the CAAC-OS has the lowest density of defect states.

[0184] An amorphous oxide semiconductor film has, for example, a disordered atomic arrangement and does not contain any crystalline components, or an amorphous oxide film has, for example, a completely amorphous structure and does not contain any crystalline parts.

[0185] The semiconductor layer may be a mixed film having two or more of an amorphous structure region, a microcrystalline structure region, a polycrystalline structure region, a CAAC-OS region, and a single-crystal structure region. The mixed film may have a single layer structure or a multilayer structure including two or more of the above-mentioned regions.

[0186] Further, a semiconductor layer of the transistor disclosed in one embodiment of the present invention may be formed using cloud-aligned composite oxide semiconductor (CAC-OS).

[0187] Note that the semiconductor layer of the transistor disclosed in one embodiment of the present invention can preferably be formed using the above-described non-single-crystalline oxide semiconductor or CAC-OS. As the non-single-crystalline oxide semiconductor, an nc-OS or a CAAC-OS can preferably be used.

[0188] In one aspect of the present invention, it is preferable to use CAC-OS as the semiconductor layer of the transistor. By using CAC-OS, high electrical characteristics or high reliability can be imparted to the transistor.

[0189] Note that the semiconductor layer may be a mixed film having two or more of the regions of CAAC-OS, polycrystalline oxide semiconductor, nc-OS, pseudo-amorphous oxide semiconductor, and amorphous oxide semiconductor. The mixed film may have, for example, a single-layer structure or a laminated structure including any two or more of the above-described regions.

[0190] <Configuration of CAC-OS> Hereinafter, the configuration of CAC (Cloud-Aligned Composite)-OS that can be used for the transistor disclosed in one aspect of the present invention will be described.

[0191] CAC-OS is, for example, a configuration of a material in which elements constituting a metal oxide are unevenly distributed in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 2 nm or less, or in the vicinity thereof. Hereinafter, in the metal oxide, one or more metal elements are unevenly distributed, and a region having the metal element is in a state of being mixed in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 2 nm or less, or in the vicinity thereof, which is also referred to as a mosaic state or a patch state.

[0192] Note that the metal oxide preferably contains at least indium. Particularly, it preferably contains indium and zinc. In addition to these, one or more selected from aluminum, gallium, yttrium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium may be contained.

[0193] For example, CAC-OS in In-Ga-Zn oxide (In-Ga-Zn oxide among CAC-OS may be particularly referred to as CAC-IGZO) is an indium oxide (hereinafter referred to as InO X1 (X1 is a real number greater than 0) or indium zinc oxide (hereinafter referred to as In X2 Zn Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0.) and gallium oxide (hereinafter referred to as GaO X3 (X3 is a real number greater than 0) or gallium zinc oxide (Ga X4 Zn Y4 O Z4 (X4, Y4, and Z4 are real numbers greater than 0).) The material is separated into mosaics, and the mosaic InO X1 , or In X2 Zn Y2 O Z2 However, the structure is such that the particles are uniformly distributed in the film (hereinafter also referred to as a cloud-like structure).

[0194] In other words, CAC-OS is X3 The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 In this specification, for example, when the atomic ratio of In to element M in the first region is greater than the atomic ratio of In to element M in the second region, the first region is said to have a higher In concentration than the second region.

[0195] IGZO is a common name and may refer to a compound made of In, Ga, Zn, and O. A typical example is InGaO3(ZnO). m1 (m1 is a natural number), or In (1+x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is an arbitrary number).

[0196] The crystalline compounds have a single crystal structure, a polycrystalline structure, or a CAAC structure, where multiple IGZO nanocrystals are connected together with their c-axis orientation and no orientation in the ab plane.

[0197] On the other hand, CAC-OS refers to a metal oxide material structure. CAC-OS is a material structure containing In, Ga, Zn, and O, in which some regions observed as nanoparticles mainly composed of Ga and some regions observed as nanoparticles mainly composed of In are randomly dispersed in a mosaic pattern. Therefore, the crystal structure is a secondary element in CAC-OS.

[0198] Note that CAC-OS does not include a stacked structure of two or more films with different compositions, such as a two-layer structure consisting of a film mainly containing In and a film mainly containing Ga.

[0199] In addition, GaO X3 The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 In some cases, a clear boundary between the region where the main component is the chromatic aberration and the region where the chromatic aberration is the main component may not be observed.

[0200] When one or more elements selected from aluminum, yttrium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, and magnesium are contained instead of gallium, the CAC-OS has a structure in which some regions observed to be nanoparticles containing the metal element as the main component and some regions observed to be nanoparticles containing In as the main component are randomly dispersed in a mosaic pattern.

[0201] The CAC-OS can be formed, for example, by a sputtering method under conditions where the substrate is not intentionally heated. When the CAC-OS is formed by a sputtering method, one or more of an inert gas (typically argon), oxygen gas, and nitrogen gas may be used as the deposition gas. The lower the flow rate ratio of oxygen gas to the total flow rate of deposition gas during deposition, the better. For example, the flow rate ratio of oxygen gas is preferably 0% or more and less than 30%, and more preferably 0% or more and 10% or less.

[0202] CAC-OS has the characteristic that no clear peaks are observed when measured using the θ / 2θ scan by the out-of-plane X-ray diffraction (XRD) method, which indicates that the ab-plane and c-axis orientations of the measured region are not observed.

[0203] In addition, in the electron beam diffraction pattern obtained by irradiating CAC-OS with an electron beam (also called nanobeam electron beam) with a probe diameter of 1 nm, a bright ring-shaped region and multiple bright spots are observed within the ring-shaped region. Therefore, the electron beam diffraction pattern indicates that the CAC-OS has a nano-crystal (nc) structure that does not have orientation in the planar and cross-sectional directions.

[0204] For example, in the case of CAC-OS made of In-Ga-Zn oxide, EDX mapping obtained using energy dispersive X-ray spectroscopy (EDX) revealed that GaO X3 The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 It can be seen that the region where the main component is the crystalline silicon is unevenly distributed and mixed.

[0205] CAC-OS has a different structure from IGZO compounds, in which metal elements are uniformly distributed, and has different properties from IGZO compounds. X3 The region where In is the main component. X2 Zn Y2 O Z2 , or InO X1 The structure is such that the regions are separated into a mosaic of regions each containing one of the elements as the main component and a region each containing one of the elements as the main component.

[0206] Here, In X2 Zn Y2 O Z2 , or InO X1 The region where is the main component is GaO X3 This region has higher conductivity than the region where In is the main component. X2 Zn Y2 O Z2 , or InO X1 When carriers flow through the region where In is the main component, the conductivity of the metal oxide is exhibited. X2 Zn Y2 O Z2 , or InO X1 The cloud-like distribution of regions containing the main component in the metal oxide allows for high field-effect mobility (μ).

[0207] On the other hand, GaO X3 The region where the main components are In X2 Zn Y2 O Z2 , or InO X1 This region has higher insulating properties than the region where GaO is the main component. X3 By distributing regions in which the main components are such as these in the metal oxide, leakage current can be suppressed and good switching operation can be achieved.

[0208] Therefore, when CAC-OS is used in a semiconductor device, GaO X3 Insulation due to X2 Zn Y2 O Z2 , or InO X1The conductivity due to the gate insulating layer and the gate insulating layer work in a complementary manner, resulting in a high on-state current (I on ), and high field-effect mobility (μ) can be achieved.

[0209] Furthermore, semiconductor elements using CAC-OS have high reliability, making them ideal for a variety of semiconductor devices, including displays.

[0210] Furthermore, since a transistor having a CAC-OS semiconductor layer has high field-effect mobility and high driving capability, a display device with a narrow frame width (also referred to as a narrow frame) can be provided by using the transistor in a driver circuit, typically a scan line driver circuit that generates gate signals.Furthermore, a display device with a small number of wirings connected to the display device can be provided by using the transistor in a signal line driver circuit (particularly, a demultiplexer connected to an output terminal of a shift register in the signal line driver circuit).

[0211] Furthermore, unlike transistors using low-temperature polysilicon, transistors having a CAC-OS semiconductor layer do not require a laser crystallization process. This allows for reduced manufacturing costs even for display devices using large-area substrates. Furthermore, in large-sized display devices with high resolutions such as ultra-high definition (4K resolution, 4K2K, or 4K) and super high definition (8K resolution, 8K4K, or 8K), using transistors having a CAC-OS semiconductor layer in the driver circuits and display units enables writing in a short time and reduces display defects, which is preferable.

[0212] Alternatively, silicon may be used as a semiconductor in which a channel of a transistor is formed. Although amorphous silicon may be used as the silicon, it is preferable to use silicon having crystallinity. For example, it is preferable to use microcrystalline silicon, polycrystalline silicon, single crystal silicon, or the like. In particular, polycrystalline silicon can be formed at a lower temperature than single crystal silicon, and has higher field-effect mobility and higher reliability than amorphous silicon.

[0213] <Conductive layer> Materials that can be used for conductive layers such as the gate, source, and drain of a transistor, as well as various wirings and electrodes that constitute a display device, include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, or alloys containing these metals as their main components. Films containing these materials can be used as single layers or multilayer structures. Examples include a single-layer structure of an aluminum film containing silicon, a bilayer structure in which an aluminum film is stacked on a titanium film, a bilayer structure in which an aluminum film is stacked on a tungsten film, a bilayer structure in which a copper film is stacked on a copper-magnesium-aluminum alloy film, a bilayer structure in which a copper film is stacked on a titanium film, a bilayer structure in which a copper film is stacked on a tungsten film, a three-layer structure in which a titanium film or titanium nitride film is stacked on an aluminum film or copper film, and a three-layer structure in which a titanium film or titanium nitride film is further stacked on top of that, and a three-layer structure in which a molybdenum film or molybdenum nitride film is stacked on an aluminum film or copper film, and a molybdenum film or molybdenum nitride film is further stacked on top of that. Alternatively, oxides such as indium oxide, tin oxide, or zinc oxide may be used. Furthermore, copper containing manganese is preferably used because it improves the controllability of the shape by etching.

[0214] <Insulating layer> Examples of insulating materials that can be used for each insulating layer include resins such as acrylic and epoxy, resins having siloxane bonds, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.

[0215] Furthermore, the light emitting device is preferably provided between a pair of insulating films with low water permeability, which can prevent impurities such as water from entering the light emitting device and prevent a decrease in the reliability of the device.

[0216] Examples of insulating films with low water permeability include films containing nitrogen and silicon, such as silicon nitride films and silicon nitride oxide films, and films containing nitrogen and aluminum, such as aluminum nitride films. Furthermore, silicon oxide films, silicon oxynitride films, aluminum oxide films, etc. may also be used.

[0217] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / (m 2 ·day)] or less, preferably 1 × 10 -6 [g / (m 2 ·day)] or less, more preferably 1 × 10 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·day)] or less.

[0218] This concludes the description of the components.

[0219] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be implemented by combining them appropriately with other configuration examples or drawings.

[0220] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0221] (Embodiment 3) In this embodiment, a configuration example of a display device will be described with reference to FIGS. 23A, 23B, and 23C.

[0222] 23A includes a pixel portion 502, a driver circuit portion 504, a protective circuit 506, and a terminal portion 507. Note that the protective circuit 506 does not necessarily have to be provided.

[0223] The pixel section 502 has a plurality of pixel circuits 501 that drive a plurality of display devices arranged in X rows and Y columns (X and Y are each independently a natural number of 2 or more).

[0224] The driver circuit unit 504 includes driver circuits such as a gate driver 504a that outputs scan signals to the gate lines GL_1 to GL_X and a source driver 504b that supplies data signals to the data lines DL_1 to DL_Y. The gate driver 504a may include at least a shift register. The source driver 504b may include, for example, a plurality of analog switches. Alternatively, the source driver 504b may include a shift register.

[0225] The terminal section 507 is a section provided with terminals for inputting power, control signals, image signals, and the like from an external circuit to the display device.

[0226] The protection circuit 506 is a circuit that, when a potential outside a certain range is applied to a wiring connected to the protection circuit 506, brings the wiring into a conductive state with another wiring. The protection circuit 506 shown in Fig. 23A is connected to various wirings, such as a gate line GL that is a wiring between the gate driver 504a and the pixel circuit 501, or a data line DL that is a wiring between the source driver 504b and the pixel circuit 501. Note that in Fig. 23A, the protection circuit 506 is hatched to distinguish it from the pixel circuit 501.

[0227] Furthermore, the gate driver 504a and the source driver 504b may be provided on the same substrate as the pixel unit 502, or a substrate on which a gate driver circuit or a source driver circuit is separately formed (for example, a drive circuit substrate formed of a single crystal semiconductor or a polycrystalline semiconductor) may be mounted on the substrate using COF, TCP (Tape Carrier Package), COG (Chip On Glass), or the like.

[0228] Furthermore, the plurality of pixel circuits 501 shown in FIG. 23A can have the configurations shown in FIGS. 23B and 23C, for example.

[0229] 23B includes a liquid crystal device 570, a transistor 550, and a capacitor 560. The pixel circuit 501 is also connected to a data line DL_n, a gate line GL_m, a potential supply line VL, and the like.

[0230] The potential of one of the pair of electrodes of the liquid crystal device 570 is set appropriately according to the specifications of the pixel circuit 501. The alignment state of the liquid crystal device 570 is set by written data. A common potential may be applied to one of the pair of electrodes of the liquid crystal device 570 of each of the plurality of pixel circuits 501. Alternatively, a different potential may be applied to one of the pair of electrodes of the liquid crystal device 570 of the pixel circuit 501 of each row.

[0231] 23C includes transistors 552 and 554, a capacitor 562, and a light-emitting device 572. The pixel circuit 501 is also connected to a data line DL_n, a gate line GL_m, a potential supply line VL_a, a potential supply line VL_b, and the like.

[0232] A high power supply potential VDD is applied to one of the potential supply lines VL_a and VL_b, and a low power supply potential VSS is applied to the other. The current flowing through the light-emitting device 572 is controlled in accordance with the potential applied to the gate of the transistor 554, thereby controlling the luminance of light emitted from the light-emitting device 572.

[0233] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be implemented by combining them appropriately with other configuration examples or drawings.

[0234] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0235] (Fourth embodiment) The following describes a pixel circuit having a memory for correcting the gray scale displayed in a pixel, and a display device having the same.

[0236] <Circuit configuration> 24A shows a circuit diagram of a pixel circuit 400. The pixel circuit 400 includes a transistor M1, a transistor M2, a capacitor C1, and a circuit 401. The pixel circuit 400 is also connected to a wiring S1, a wiring S2, a wiring G1, and a wiring G2.

[0237] The transistor M1 has a gate connected to the wiring G1, one of a source and a drain connected to the wiring S1, and the other connected to one electrode of the capacitor C1. The transistor M2 has a gate connected to the wiring G2, one of a source and a drain connected to the wiring S2, and the other connected to the other electrode of the capacitor C1 and the circuit 401.

[0238] The circuit 401 is a circuit including at least one display device. Various devices can be used as the display device, but typically, a light-emitting device such as an organic EL device or an LED device, a liquid crystal device, or a MEMS (Micro Electro Mechanical Systems) device can be applied.

[0239] The node connecting the transistor M1 and the capacitor C1 is referred to as a node N1, and the node connecting the transistor M2 and the circuit 401 is referred to as a node N2.

[0240] In the pixel circuit 400, the potential of the node N1 can be maintained by turning off the transistor M1. In addition, the potential of the node N2 can be maintained by turning off the transistor M2. In addition, by writing a predetermined potential to the node N1 via the transistor M1 while the transistor M2 is in the off state, the potential of the node N2 can be changed in accordance with the change in the potential of the node N1 due to capacitive coupling via the capacitor C1.

[0241] Here, the transistor including an oxide semiconductor, as exemplified in Embodiment 2, can be used as one or both of the transistors M1 and M2. Therefore, the potentials of the nodes N1 and N2 can be held for a long period of time due to an extremely low off-state current. Note that when the period for holding the potentials of the nodes is short (specifically, when the frame frequency is 30 Hz or higher), a transistor including a semiconductor such as silicon may be used.

[0242] <Driving method example> Next, an example of an operation method of pixel circuit 400 will be described with reference to Fig. 24B. Fig. 24B is a timing chart relating to the operation of pixel circuit 400. To simplify the explanation, the influence of various resistances such as wiring resistance, parasitic capacitance of transistors or wiring, and threshold voltage of transistors will not be taken into consideration.

[0243] 24B, one frame period is divided into period T1 and period T2. Period T1 is a period in which a potential is written to node N2, and period T2 is a period in which a potential is written to node N1.

[0244] In the period T1, a potential that turns on the transistor is applied to both the wiring G1 and the wiring G2. In addition, a fixed potential V ref is supplied to the line S2, and the first data potential V w supply.

[0245] The node N1 is connected to the line S1 via the transistor M1. refThe node N2 is supplied with a first data potential V w Therefore, the capacitance C1 has a potential difference V w -V ref is maintained.

[0246] Subsequently, in a period T2, a potential that turns on the transistor M1 is applied to the wiring G1, and a potential that turns off the transistor M2 is applied to the wiring G2. data A predetermined constant potential is applied to the wiring S2, or the wiring S2 may be in a floating state.

[0247] The node N1 receives a second data potential V data At this time, the second data potential V data In other words, the potential of the node N2 changes by a potential dV in response to the first data potential V w The potential obtained by adding the second data potential V to the potential dV is input. Note that although the potential dV is shown as a positive value in FIG. 24B, it may be a negative value. That is, data is the potential V ref It may be lower.

[0248] Here, the potential dV is roughly determined by the capacitance value of the capacitor C1 and the capacitance value of the circuit 401. When the capacitance value of the capacitor C1 is sufficiently larger than the capacitance value of the circuit 401, the potential dV is equal to the second data potential V data The potential is close to

[0249] In this way, the pixel circuit 400 can combine two types of data signals to generate a potential to be supplied to the circuit 401 including the display device, and therefore, it is possible to perform grayscale correction within the pixel circuit 400.

[0250] The pixel circuit 400 can also generate a potential that exceeds the maximum potential that can be supplied to the wirings S1 and S2. For example, when a light-emitting device is used, high dynamic range (HDR) display or the like can be performed. Furthermore, when a liquid crystal device is used, overdrive driving or the like can be realized.

[0251] <Application example> [Example using a liquid crystal device] The pixel circuit 400LC shown in Fig. 24C includes a circuit 401LC. The circuit 401LC includes a liquid crystal device LC and a capacitor C2.

[0252] The liquid crystal device LC has one electrode connected to the node N2 and one electrode of the capacitance C2, and the other electrode connected to the potential V com2 The other electrode of the capacitor C2 is connected to a wiring that has a potential V com1 Connect with the wiring given.

[0253] The capacitor C2 functions as a storage capacitor. Note that the capacitor C2 can be omitted if not required.

[0254] The pixel circuit 400LC can supply a high voltage to the liquid crystal device LC, which makes it possible to, for example, achieve high-speed display by overdriving, apply a liquid crystal material with a high driving voltage, etc. Furthermore, by supplying a correction signal to the line S1 or the line S2, it is possible to correct the gradation according to the operating temperature or the deterioration state of the liquid crystal device LC, etc.

[0255] [Example using a light-emitting device] The pixel circuit 400EL shown in Figure 24D includes a circuit 401EL. The circuit 401EL includes a light-emitting device EL, a transistor M3, and a capacitor C2.

[0256] The transistor M3 has a gate connected to the node N2 and one electrode of the capacitor C2, a source and a drain connected to a wiring to which a potential VH is applied, and the other connected to one electrode of the light-emitting device EL. comThe other electrode of the light-emitting device EL is connected to a wiring to which a potential V L Connect with the wiring given.

[0257] The transistor M3 has a function of controlling the current supplied to the light emitting device EL. The capacitor C2 functions as a storage capacitor. The capacitor C2 can be omitted if it is not necessary.

[0258] Although the anode side of the light emitting device EL is connected to the transistor M3 in this example, the transistor M3 may be connected to the cathode side. H and potential V L The value of can be changed as appropriate.

[0259] In the pixel circuit 400EL, a large current can be passed through the light-emitting device EL by applying a high potential to the gate of the transistor M3, thereby enabling, for example, HDR display. In addition, by supplying a correction signal to the wiring S1 or the wiring S2, it is possible to correct variations in the electrical characteristics of the transistor M3 and the light-emitting device EL.

[0260] It should be noted that the circuits are not limited to those illustrated in FIGS. 24C and 24D, and may be configured to include additional transistors, capacitors, and the like.

[0261] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0262] (Embodiment 5) An example of the structure of a pixel in a display panel of one embodiment of the present invention will be described below.

[0263] 25A to 25E show examples of the configuration of the pixel 300. FIG.

[0264] The pixel 300 has a plurality of pixels 301. Each of the plurality of pixels 301 functions as a sub-pixel. A single pixel 300 is made up of a plurality of pixels 301 each exhibiting a different color, so that full-color display can be achieved on the display unit.

[0265] 25A and 25B each have three sub-pixels. The pixel 301 of the pixel 300 shown in Fig. 25A exhibits a color combination of red (R), green (G), and blue (B). The pixel 301 of the pixel 300 shown in Fig. 25B exhibits a color combination of cyan (C), magenta (M), and yellow (Y).

[0266] Each of the pixels 300 shown in Figures 25C to 25E has four sub-pixels. The pixel 301 of the pixel 300 shown in Figure 25C exhibits a color combination of red (R), green (G), blue (B), and white (W). By using a sub-pixel that exhibits white, the brightness of the display unit can be increased. The pixel 301 of the pixel 300 shown in Figure 25D exhibits a color combination of red (R), green (G), blue (B), and yellow (Y). The pixel 301 of the pixel 300 shown in Figure 25E exhibits a color combination of cyan (C), magenta (M), yellow (Y), and white (W).

[0267] By increasing the number of sub-pixels that function as one pixel and appropriately combining sub-pixels that exhibit colors such as red, green, blue, cyan, magenta, and yellow, it is possible to improve the reproducibility of intermediate tones, thereby improving display quality.

[0268] The display device of one embodiment of the present invention can reproduce color gamuts of various standards, such as the PAL (Phase Alternating Line) standard and the NTSC (National Television System Committee) standard used in television broadcasting, the sRGB (standard RGB) standard and the Adobe RGB standard widely used in display devices used in electronic devices such as personal computers, digital cameras, and printers, the ITU-R BT.709 (International Telecommunication Union Radiocommunication Sector Broadcasting Service (Television) 709) standard used in HDTV (High Definition Television, also called Hi-Vision), the DCI-P3 (Digital Cinema Initiatives P3) standard used in digital cinema projection, and the ITU-R BT.2020 (REC.2020 (Recommendation 2020)) standard used in UHDTV (Ultra High Definition Television, also called Super Hi-Vision).

[0269] Furthermore, by arranging the pixels 300 in a 1920 × 1080 matrix, a display device capable of full-color display at a resolution of so-called full high-definition (also referred to as "2K resolution," "2K1K," or "2K") can be realized. Furthermore, by arranging the pixels 300 in a 3840 × 2160 matrix, for example, a display device capable of full-color display at a resolution of so-called ultra high-definition (also referred to as "4K resolution," "4K2K," or "4K") can be realized. Furthermore, by arranging the pixels 300 in a 7680 × 4320 matrix, for example, a display device capable of full-color display at a resolution of so-called super high-definition (also referred to as "8K resolution," "8K4K," or "8K") can be realized. By increasing the number of pixels 300, a display device capable of full-color display at a resolution of 16K or 32K can also be realized.

[0270] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification. [Explanation of symbols]

[0271] 100: angle adjustment device, 100a: angle adjustment device, 100b: angle adjustment device, 100c: angle adjustment device, 100d: angle adjustment device, 101a: base part, 101b: base part, 102a: connecting part, 102b: connecting part, 103a: columnar part, 103b: columnar part, 104a: columnar part, 104b: columnar part, 105: columnar part, 111: surface, 112: surface, 113: surface, 114: surface, 115: surface, 121: opening, 122: part, 122a: area, 122b: area, 122c: area, 131a: connecting part, 131b: connecting part, 132: spacer, 141 : thin-film solar cell, 141a: opening, 141b: opening, 142a: opening, 142b: opening, 143a: opening, 143b: opening, 151: area, 151a: area, 151b: area, 152: area, 152a: area, 152b: area, 161: flat plate portion, 162: flat plate portion, 163: flat plate portion, 165: bent portion, 166: pillar, 167a: side, 167b: side, 167c: side, 167d: side, 170: display panel, 171: display panel, 172: display panel, 173: display panel, 175: display panel, 181: pillar, 186a: gear, 186 b: gear, 200: support, 220: sensor, 235a: input / output unit, 235b: input / output unit, 236a: camera, 236b: camera, 237: sensor, 240: solar cell, 245: external interface, 250: display device, 300: pixel, 301: pixel, 400: pixel circuit, 400EL: pixel circuit, 400LC: pixel circuit, 401: circuit, 401EL: circuit, 401LC: circuit, 501: pixel circuit, 502: pixel section, 504: drive circuit section, 504a: gate driver, 504b: source driver, 506: protection circuit, 507: terminal section, 55 0: transistor, 552: transistor, 554: transistor, 560: capacitor, 562: capacitor, 570: liquid crystal device, 572: light-emitting device, 700: display panel, 700A: display panel, 702: pixel unit, 704: source driver circuit unit, 706: gate driver circuit unit, 708: FPC terminal unit, 710: wiring, 716: FPC, 717: IC, 730: insulating layer, 732: sealing layer, 736: colored layer, 738: light-shielding layer, 740: support substrate, 741: protective layer, 741a: insulating layer, 741b: insulating layer, 741c: insulating layer, 742: adhesive layer,743: resin layer, 744: insulating layer, 745: supporting substrate, 746: insulating layer, 747: adhesive layer, 749: protective layer, 750: transistor, 752: transistor, 760: wiring, 761: conductive layer, 770: insulating layer, 772: conductive layer, 780: anisotropic conductive film, 782: light-emitting device, 786: EL layer, 788: conductive layer, 790: capacitor,

Claims

1. a support having an angle adjustment device and a flat plate, and a flexible display panel provided along the support, The angle adjustment device is a first base part, a second base part, a first connecting part, a second connecting part, and first to fourth columnar parts; the first base part and the second base part each have a first region and a second region; the first connecting part and the second connecting part each have a first opening part of the same shape and a notch part of the same shape; the first opening and the notch are arranged side by side in the longitudinal direction of the first connecting component and the second connecting component, the first columnar part or the third columnar part is inserted into the first opening; the second columnar part or the fourth columnar part is inserted into the notch, the first region of the first base component is connected to the second region of the second base component via the first pillar component, the first connecting component, and the fourth pillar component; A display device, wherein the first region of the second base component is connected to the second region of the first base component via the third columnar component, the second connecting component, and the second columnar component.

2. In claim 1, the cutout portion has a third region, a fourth region, and a fifth region; the third region is between the fourth region and the fifth region, the fifth region is between the third region and the first opening, A display device, wherein the third region to the fifth region each have an upper surface shape including an arc.

3. In claim 2, switching a position of the second columnar component from one of the third region and the fourth region of the second connecting component to the other; A display device that switches the relative angle between the first base part and the second base part by switching the position of the fourth columnar part from one of the third region or the fourth region of the first connecting part to the other.

4. In claim 2 or 3, the second post-shaped component is in the fourth region of the second connecting component; When the fourth columnar component is in the fourth region of the first connecting component, A display device, wherein a first surface of the first base part is capable of contacting a second surface of the second base part.

5. In any one of claims 2 to 3, the second post-shaped component is in the third region of the second connecting component; When the fourth columnar component is in the third region of the first connecting component, A display device, wherein a third surface of the first base part is capable of contacting a fourth surface of the second base part.

6. In any one of claims 1 to 5, a third connecting part, a fourth connecting part, and a fifth columnar part; the third connecting part and the fourth connecting part have a second opening; the third connecting component is fixed to the first base component; the fourth connecting component is fixed to the second base component; the fifth columnar part is inserted into the second opening of the third connecting part and the second opening of the fourth connecting part; a long axis of the fifth columnar component is parallel to long axes of the first to fourth columnar components, The fifth columnar component is located near a region where the first base component and the second base component are in contact with each other.

Images