Substrate Processing Equipment

Abstract

To provide a substrate processing device which enables reduction of a protruding length of an air supply unit protruding upward from a processing housing.SOLUTION: A substrate processing device 1 includes a processing housing 22 and an air supply unit 30. The processing housing 22 processes a substrate W in the processing housing 22. The air supply unit 30 supplies a gas to the interior of the processing housing 22. The air supply unit 30 includes a filter 31, a duct 32, and a fan 41. The filter 31 is disposed at an upper part of the processing housing 22. The filter 31 blows out the gas into the processing housing 22. The duct 32 is provided outside the processing housing 22. The duct 32 is connected to the filter 31. The fan 41 is provided outside the processing housing 22. The fan 41 is connected to the duct 32. The fan 41 is disposed at a position that does not overlap with the filter 31 in a plan view. At least a part of the fan 41 is disposed at the same height position as the processing housing 22.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates, such as semiconductor wafers, liquid crystal display substrates, organic electroluminescence (EL) substrates, flat panel display (FPD) substrates, optical display substrates, magnetic disk substrates, optical disk substrates, magneto-optical disk substrates, photomask substrates, and solar cell substrates. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus. The substrate processing apparatus includes a processing housing and an air supply unit. The processing housing processes a substrate inside the processing housing. The air supply unit supplies gas (for example, air) into the processing housing.

[0003] The air supply unit includes a filter, a duct, and a fan. The filter is disposed on top of the processing housing. The filter blows gas into the processing housing. The duct is provided outside the processing housing. The duct is connected to the filter. The fan is provided outside the processing housing. The fan is connected to the duct.

[0004] The fan is disposed above the filter. The fan is disposed at a position overlapping the filter in a plan view. The fan and the filter are aligned vertically. The duct extends vertically between the filter and the fan. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-200193 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the substrate processing apparatus of Patent Document 1 has the following problems: The filter is disposed on the top of the processing housing. The fan is disposed above the filter. Therefore, the entire fan is disposed above the processing housing. Therefore, the air supply unit protrudes upward from the processing housing by a large amount. In other words, the protruding length of the air supply unit that protrudes upward from the processing housing is relatively large.

[0007] By arranging multiple processing casings vertically, the processing capacity of the substrate processing apparatus can be improved without increasing the footprint of the substrate processing apparatus. However, if the air supply unit protrudes significantly upward from the processing casing, it is difficult to easily increase the number of processing casings arranged vertically, because the vertical length of the substrate processing apparatus would become excessively long.

[0008] The present invention has been made in view of the above circumstances, and has an object to provide a substrate processing apparatus that can reduce the protruding length of the air supply unit that protrudes upward from the processing housing. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention has the following configuration: That is, the present invention provides a substrate processing apparatus comprising: a first processing housing for processing a substrate therein; and a first air supply unit for supplying gas into the first processing housing, the first air supply unit comprising: a filter disposed above the first processing housing and blowing gas into the first processing housing; a duct disposed outside the first processing housing and connected to the filter; and a fan disposed outside the first processing housing and connected to the duct, the fan being disposed at a position not overlapping the filter in a plan view, and at least a portion of the fan being disposed at the same height as the first processing housing.

[0010] The substrate processing apparatus includes a first processing housing and a first air supply unit. The first processing housing processes a substrate inside the first processing housing. The first air supply unit supplies gas into the inside of the first processing housing. The first air supply unit includes a filter, a duct, and a fan. The filter is disposed on top of the first processing housing. The filter blows gas into the inside of the first processing housing. The duct and fan are each provided outside the first processing housing. The duct is connected to the filter. The fan is connected to the duct.

[0011] Here, the fan is positioned so as not to overlap the filter in a plan view. Therefore, the filter and the fan are not aligned vertically. Furthermore, at least a portion of the fan is positioned at the same height as the first processing housing. Therefore, at least a portion of the fan does not protrude upward from the first processing housing. Therefore, the protruding length of the first air supply unit extending upward from the first processing housing is reduced.

[0012] As described above, according to the substrate processing apparatus of the present invention, the protruding length of the first air supply unit extending upward from the first processing casing can be reduced. Hereinafter, the protruding length of the first air supply unit extending upward from the first processing casing will be simply referred to as the "protruding length of the first air supply unit."

[0013] In the substrate processing apparatus described above, it is preferable that at least a portion of the fan is disposed at a position lower than the filter, and the height position of the fan is relatively low, thereby suitably reducing the protruding length of the first air supply unit.

[0014] In the substrate processing apparatus described above, it is preferable that the fan is disposed at a position that does not overlap with the first processing housing in a plan view. The fan is not disposed above the first processing housing. Therefore, the protruding length of the first air supply unit is effectively reduced.

[0015] In the substrate processing apparatus described above, it is preferable that the protruding length of the first gas supply unit extending upward from the first processing casing is equal to or less than twice the length of the filter in the vertical direction. The protruding length of the first gas supply unit is sufficiently small.

[0016] In the substrate processing apparatus described above, the duct preferably includes a first horizontal section extending substantially horizontally from the filter, a vertical section extending downward from the first horizontal section, and a second horizontal section extending substantially horizontally from the vertical section to the fan and positioned lower than the first horizontal section. The vertical section makes it easy to position the second horizontal section lower than the first horizontal section. The second horizontal section makes it easy to lower the height position of the fan. Therefore, the protruding length of the first air supply unit is suitably reduced.

[0017] In the above-described substrate processing apparatus, the first processing housing preferably includes an upper plate, the upper plate including a first upper plate portion on which the filter is installed, and a second upper plate portion disposed below the vertical portion and the second horizontal portion, the second upper plate portion being lower than the first upper plate portion. The second upper plate portion is lower than the first upper plate portion. This allows the height position of the vertical portion to be easily lowered. Furthermore, the height position of the second horizontal portion to be easily lowered. This allows the height position of the fan to be easily lowered. This advantageously reduces the protruding length of the first air supply unit.

[0018] In the substrate processing apparatus described above, it is preferable that a portion of the duct overlaps with the filter in a front view. In other words, it is preferable that a portion of the duct is disposed at the same height as the filter. The height position of the duct is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.

[0019] In the substrate processing apparatus described above, the duct preferably includes a flat portion disposed above the filter, extending horizontally, and blowing gas downward, the flat portion having a vertical length shorter than the vertical length of the filter. The vertical length of the flat portion is shorter than the vertical length of the filter. In other words, the flat portion is thinner than the filter. Therefore, the protruding length of the first air supply unit is preferably reduced.

[0020] In the substrate processing apparatus described above, the overall length of the flat portion and the filter in the vertical direction is preferably less than twice the length of the filter in the vertical direction. The height position of the flat portion is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.

[0021] In the substrate processing apparatus described above, the height position of the upper surface of the flat portion preferably corresponds to the upper end of the duct, and the upper end of the duct is relatively low, so that the protruding length of the first air supply unit is suitably reduced.

[0022] In the substrate processing apparatus described above, the duct preferably includes an outer groove portion connected to the periphery of the flat portion and configured to send gas to the flat portion, and the length of the outer groove portion in the vertical direction is preferably greater than the length of the flat portion in the vertical direction. The length of the outer groove portion in the vertical direction is therefore greater than the length of the flat portion in the vertical direction. Thus, the outer groove portion can smoothly supply gas to the flat portion.

[0023] In the substrate processing apparatus described above, the outer groove preferably has a ring shape surrounding the flat portion in a plan view, and the outer groove can supply gas to the entire peripheral edge of the flat portion.

[0024] In the above-described substrate processing apparatus, it is preferable that the outer groove portion extends downward from the peripheral edge of the flat portion, and at least a portion of the outer groove portion overlaps with the filter in a front view. The outer groove portion extends downward from the peripheral edge of the flat portion. Therefore, the height position of the outer groove portion can be easily lowered. At least a portion of the outer groove portion overlaps with the filter in a front view. Therefore, the height position of the outer groove portion is relatively low. Therefore, the protruding length of the first air supply unit is suitably reduced.

[0025] In the substrate processing apparatus described above, the duct preferably includes a baffle plate installed in the outer groove portion and guiding a portion of the gas flowing through the outer groove portion to the flat portion. The baffle plate allows the gas to flow more smoothly from the groove portion to the flat portion. Therefore, the filter properly blows out the gas. Therefore, the substrate can be properly processed inside the first processing housing.

[0026] In the above-described substrate processing apparatus, the baffle plate preferably intersects with the direction in which the outer groove portion extends, and the baffle plate can suitably guide a part of the gas flowing through the outer groove portion to the flat portion.

[0027] In the above-described substrate processing apparatus, the substrate processing apparatus includes a transfer space extending in a horizontal first direction and adjacent to the first processing casing, a transfer mechanism installed in the transfer space and configured to transfer substrates into the first processing casing, and a piping space adjacent to the first processing casing, wherein the first processing casing and the transfer space are preferably orthogonal to the first direction and aligned in a horizontal second direction in a plan view, the first processing casing and the piping space are aligned in the first direction, the fan is open to the piping space, and the fan sends gas in the piping space to a filter. The transfer space extends in the first direction. The first processing casing and the transfer space are aligned in the second direction in a plan view. The first processing casing and the piping space are aligned in the first direction in a plan view. Therefore, the transfer space and the piping space are adjacent to the first processing casing without interfering with each other. The fan is open to the piping space adjacent to the first processing casing. The fan sends gas in the piping space adjacent to the first processing casing to the filter. Therefore, the fan can be easily disposed near the first processing casing without interfering with the transport mechanism, and the first air supply unit can be easily made smaller.

[0028] In the substrate processing apparatus described above, it is preferable that the first processing casing includes an exhaust port formed at a position facing the piping space, and the fan is disposed above the exhaust port so as not to interfere with the exhaust port.

[0029] In the above-described substrate processing apparatus, the substrate processing apparatus includes a horizontal exhaust section provided in the piping space, connected to the exhaust port, and extending in a horizontal direction, and a vertical exhaust section provided in the piping space, connected to the horizontal exhaust section, and extending in a vertical direction, and the fan is preferably disposed at a position higher than the horizontal exhaust section, and the fan and the vertical exhaust section are aligned in the second direction when viewed from the front. The fan is disposed at a position higher than the horizontal exhaust section. Therefore, the fan does not interfere with the horizontal exhaust section. The fan and the vertical exhaust section are aligned in the second direction when viewed from the first direction. Therefore, the fan does not interfere with the vertical exhaust section.

[0030] In the substrate processing apparatus described above, the vertical exhaust unit includes a first vertical exhaust pipe extending vertically and a second vertical exhaust pipe extending vertically, and the horizontal exhaust unit includes a switching mechanism that switches the exhaust path of the first processing housing to one of the first vertical exhaust pipe and the second vertical exhaust pipe, and it is preferable that the fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are aligned in the second direction when viewed from the first direction. The switching mechanism and the first vertical exhaust pipe and the second vertical exhaust pipe enable gas to be appropriately exhausted from inside the first processing housing. Therefore, substrates can be appropriately processed inside the first processing housing. The fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are aligned in the second direction when viewed from the front. Therefore, the fan does not interfere with the first vertical exhaust pipe and the second vertical exhaust pipe.

[0031] In the above-described substrate processing apparatus, the substrate processing apparatus preferably includes a pressure sensor that measures the pressure of the gas inside the first processing housing, and a control unit that controls the fan based on the detection result of the pressure sensor. The control unit can suitably control the pressure of the gas inside the first processing housing. Therefore, substrates can be appropriately processed inside the first processing housing.

[0032] In the above-described substrate processing apparatus, it is preferable that the apparatus comprises an adjustment unit installed inside the first processing housing, receiving the gas blown out from the filter, and blowing the gas downward; and a substrate holding unit installed inside the first processing housing, located below the adjustment unit, and holding a substrate, wherein the filter blows the gas downward; the adjustment unit comprises an adjustment chamber located below the filter, extending horizontally, and larger than the filter in a planar view; a guide member provided in the adjustment chamber, guiding the gas downward in the adjustment chamber; and a blow-out plate located below the adjustment chamber, extending horizontally, and having a plurality of blow-out holes, wherein all of the guide member is located outside the filter in a planar view, and all of the guide member is located outside the substrate held by the substrate holding unit in a planar view.

[0033] The filter blows out the gas downward. The adjustment chamber is disposed below the filter. Therefore, the adjustment unit can suitably receive the gas blown out from the filter in the adjustment chamber.

[0034] The blow-out plate is disposed below the adjustment chamber. The blow-out plate extends horizontally. The blow-out plate has a plurality of blow-out holes. Therefore, the adjustment unit can suitably blow out gas downward from the blow-out plate through the blow-out holes.

[0035] The substrate holding unit is installed inside the first processing housing. The substrate holding unit is disposed below the adjustment unit. The substrate holding unit holds a substrate. Therefore, the adjustment unit can suitably supply gas to the substrate held by the substrate holding unit.

[0036] The adjusting chamber extends horizontally. The adjusting chamber is larger than the filter in plan view. The guide member is provided in the adjusting chamber. The guide member guides gas downward in the adjusting chamber. The entire guide member is arranged outside the filter in plan view. Therefore, the guide member prevents the blow-out plate from including a defective blow-out portion. The defective blow-out portion is a portion of the blow-out plate that does not substantially blow out gas. In other words, the blow-out plate does not include an outlet that does not substantially blow out gas. All of the blow-out holes blow out gas.

[0037] The entire guide member is positioned outward from the substrate held by the substrate holding unit in a plan view. Here, the portion of the blow-out plate located below the guide member is referred to as the guide zone. The airflow blown out by the guide zone is referred to as the third blow-out flow. The guide zone is positioned outward from the substrate held by the substrate holding unit in a plan view. The third blow-out flow is relatively strong. Therefore, the third blow-out flow protects the substrate held by the substrate holding unit from the atmosphere outside the third blow-out flow. Therefore, the third blow-out flow keeps the substrate held by the substrate holding unit clean. As a result, the substrate processing apparatus can process the substrate held by the substrate holding unit with high quality.

[0038] In the substrate processing apparatus described above, it is preferable that the guide member is disposed only in the upper part of the adjustment chamber and extends in the vertical direction. The guide member can suitably guide the gas downward in the adjustment chamber. Furthermore, the gas flows smoothly through the lower part of the adjustment chamber. Therefore, the gas in the adjustment chamber flows smoothly along the blow-out plate. As a result, the guide member further prevents the blow-out plate from having poor blow-out portions.

[0039] In the substrate processing apparatus described above, it is preferable to provide a blocking wall that closes the side of the conditioning chamber. The blocking wall prevents gas from flowing out of the conditioning chamber through the side of the conditioning chamber. Therefore, all of the gas in the conditioning chamber is discharged from the blow-out plate through the blow-out holes. Therefore, the blocking member further prevents the blow-out plate from having defective blow-out portions.

[0040] The substrate processing apparatus described above further includes a discharge unit installed inside the first processing housing and configured to discharge a processing liquid onto a substrate held by the substrate holding unit, the discharge unit including a tip portion movable between a discharge position and a standby position, the tip portion being disposed outwardly of the substrate held by the substrate holding unit when the tip portion is positioned at the standby position, and the guide member being disposed between the tip portion and the substrate held by the substrate holding unit when the tip portion is positioned at the standby position, in a plan view. When the tip portion is positioned at the standby position, the guide member is disposed between the tip portion and the substrate held by the substrate holding unit when the tip portion is positioned at the standby position. Therefore, when the tip portion is positioned at the standby position, the guide zone is disposed between the tip portion and the substrate held by the substrate holding unit when the tip portion is positioned at the standby position. When the tip portion is positioned at the standby position, the third outlet flow is blown toward between the tip portion and the substrate held by the substrate holding unit. Therefore, when the tip portion is positioned at the standby position, the third outlet flow protects the substrate held by the substrate holding unit from the tip portion. Therefore, the third outlet flow keeps the substrates held by the substrate holders even cleaner, and as a result, the substrate processing apparatus can process the substrates held by the substrate holders with high quality.

[0041] In the above-described substrate processing apparatus, it is preferable that the apparatus further includes a cup installed inside the first processing housing, arranged around the substrate holding unit, and configured to receive the processing liquid, and at least a portion of the guide member overlaps with the cup in a plan view. At least a portion of the guide member overlaps with the cup in a plan view. Therefore, at least a portion of the guide zone overlaps with the cup in a plan view. At least a portion of the third outlet flow is blown toward the cup. Therefore, the third outlet flow effectively protects the substrate held by the substrate holding unit. Therefore, the third outlet flow effectively keeps the substrate held by the substrate holding unit clean. As a result, the substrate processing apparatus can process the substrate held by the substrate holding unit with high quality.

[0042] In the above-described substrate processing apparatus, it is preferable that the blow-off plate is detachable from the first processing casing, which allows for easy maintenance of the blow-off plate.

[0043] In the above-described substrate processing apparatus, the blow plate preferably includes a first member and a second member adjacent to the first member. The blow plate includes a first member and a second member. The first member is smaller than the entire blow plate. This allows for easier maintenance of the first member. The second member is smaller than the entire blow plate. This allows for easier maintenance of the second member. This allows for easier maintenance of the blow plate.

[0044] The present invention is a substrate processing apparatus comprising: a first processing housing for processing substrates therein; and a first gas supply unit for supplying gas into the inside of the first processing housing; the first gas supply unit comprising: a filter disposed on top of the first processing housing and blowing gas into the inside of the first processing housing; and a duct disposed outside the first processing housing and connected to the filter; the duct comprising: a flat portion disposed above the filter, extending horizontally, and blowing gas downward; and an outer groove portion connected to the peripheral portion of the flat portion and sending gas to the flat portion; and the length of the outer groove portion in the vertical direction is greater than the length of the flat portion in the vertical direction.

[0045] The length of the outer groove portion in the vertical direction is greater than the length of the flat portion in the vertical direction. Therefore, the outer groove portion can smoothly supply gas to the flat portion. As a result, the flat portion can be easily made thinner. Therefore, the protruding length of the first air supply unit is suitably reduced. [Effects of the Invention]

[0046] According to the substrate processing apparatus of the present invention, the protruding length of the first air supply unit that protrudes upward from the first processing casing can be reduced. [Brief explanation of the drawings]

[0047] [Figure 1] FIG. 2 is a plan view showing the inside of the substrate processing apparatus according to the embodiment. [Figure 2] FIG. 2 is a front view of the processing block. [Figure 3] FIG. 2 is a right side view showing the configuration of the left part of the substrate processing apparatus. [Figure 4] FIG. [Figure 5] FIG. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. 2 is a vertical cross-sectional view of the processing housing. [Figure 9] FIG. 1 is a vertical cross-sectional view of a portion of a duct. [Figure 10] FIG. 1 is a horizontal cross-sectional view of a portion of a duct. [Figure 11] 10A and 10B are diagrams illustrating the flow of gas in a flat portion and an outer groove portion. [Figure 12] 10A and 10B are diagrams illustrating the flow of gas in a flat portion and an outer groove portion. [Figure 13] FIG. 2 is a plan view showing the inside of the processing housing. [Figure 14] FIG. 2 is a control block diagram of the substrate processing apparatus. [Figure 15] FIG. 10 is a side view of a processing housing according to a modified embodiment. [Figure 16] FIG. 10 is a side view of a processing housing according to a modified embodiment. [Figure 17] FIG. 10 is a plan view showing the inside of a processing housing in a modified embodiment. [Figure 18] FIG. 10 is a vertical cross-sectional view of a processing housing according to a modified embodiment. [Figure 19] FIG. 10 is a plan view of an adjustment section in a modified embodiment. [Figure 20] FIG. 10 is a plan view showing the inside of a processing housing in a modified embodiment. [Figure 21] FIG. 10 is a vertical cross-sectional view of a processing housing according to a modified embodiment. [Figure 22] FIG. 10 is a plan view of a blow-off plate in a modified embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0048] The substrate processing apparatus of the present invention will be described below with reference to the drawings.

[0049] <1. Overview of substrate processing equipment> 1 is a plan view showing the inside of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 processes a substrate (for example, a semiconductor wafer) W.

[0050] The substrate W is, for example, a semiconductor wafer, a liquid crystal display substrate, an organic EL (Electroluminescence) substrate, an FPD (Flat Panel Display) substrate, an optical display substrate, a magnetic disk substrate, an optical disk substrate, a magneto-optical disk substrate, a photomask substrate, or a solar cell substrate. The substrate W has a thin, flat plate shape. The substrate W has a substantially circular shape in a plan view.

[0051] The substrate processing apparatus 1 includes an indexer unit 3 and a processing block 11. The processing block 11 is connected to the indexer unit 3. The indexer unit 3 supplies substrates W to the processing block 11. The processing block 11 processes the substrates W. The indexer unit 3 recovers the substrates W from the processing block 11.

[0052] For convenience, in this specification, the direction in which the indexer unit 3 and the processing block 11 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the processing block 11 toward the indexer unit 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, rear, right, left, top, and bottom are indicated as appropriate.

[0053] The front-rear direction X is an example of a first direction in the present invention, and the width direction Y is an example of a second direction in the present invention.

[0054] When there is no particular distinction between "forward," "backward," "rightward," and "leftward," they are referred to as "horizontal" or "lateral."

[0055] The indexer unit 3 includes a plurality of (for example, four) carrier placement units 4. The carrier placement units 4 are arranged in the width direction Y. Each carrier placement unit 4 places one carrier C thereon. The carrier C stores a plurality of substrates W. The carrier C is, for example, a FOUP (front opening unified pod).

[0056] The indexer unit 3 includes a transport space 5. The transport space 5 is disposed behind the carrier placement unit 4.

[0057] The indexer unit 3 includes a transport mechanism 6. The transport mechanism 6 is installed in the transport space 5. The transport mechanism 6 is disposed behind the carrier platform 4. The transport mechanism 6 transports substrates W. The transport mechanism 6 is accessible to the carriers C placed on the carrier platform 4.

[0058] The structure of the transport mechanism 6 will be described. The transport mechanism 6 includes a hand 7 and a hand drive unit 8. The hand 7 supports one substrate W in a horizontal position. The hand drive unit 8 is connected to the hand 7. The hand drive unit 8 moves the hand 7.

[0059] The structure of the hand driver 8 is illustrated below. The hand driver 8 includes a first driver 8a and a second driver 8b. The first driver 8a itself is unable to move horizontally. The first driver 8a supports the second driver 8b. The first driver 8a moves the second driver 8b in the vertical direction Z. The first driver 8a further rotates the second driver 8b around a rotation axis parallel to the vertical direction Z. The second driver 8b supports the hand 7. The second driver 8b moves the hand 7 back and forth horizontally relative to the first driver 8a. The second driver 8b is configured, for example, as an articulated arm.

[0060] According to the above-described hand driving unit 8, the hand 7 can move in the vertical direction Z. The hand 7 can move in the horizontal direction. The hand 7 can rotate within a horizontal plane.

[0061] The processing block 11 includes a transport space 12A. The transport space 12A is disposed in the center of the processing block 11 in the width direction Y. The transport space 12A extends in the front-rear direction X. The front of the transport space 12A is connected to the transport space 5 of the indexer unit 3.

[0062] The processing block 11 includes a transport mechanism 13A. The transport mechanism 13A is installed in the transport space 12A. The transport mechanism 13A transports the substrates W.

[0063] The processing block 11 includes a substrate placement part 16A. The substrate placement part 16A is installed in the transport space 12A. The substrate placement part 16A is disposed in front of the transport mechanism 13A. The transport mechanism 13A is accessible to the substrate placement part 16A. The transport mechanism 6 of the indexer unit 3 is also accessible to the substrate placement part 16A. The substrate placement part 16A places a substrate W to be transported between the transport mechanism 6 and the transport mechanism 13A.

[0064] 2 is a front view of the processing block 11. The processing block 11 includes a transport space 12B in addition to the transport space 12A. The transport space 12B is located below the transport space 12A. In a plan view, the transport space 12B is located at the same position as the transport space 12A. The transport space 12B is connected to the transport space 5 of the indexer unit 3.

[0065] The processing block 11 includes one partition wall 17. The partition wall 17 is disposed below the transport space 12A and above the transport space 12B. The partition wall 17 has a horizontal plate shape. The partition wall 17 separates the transport space 12A from the transport space 12B.

[0066] The processing block 11 includes a transport mechanism 13B in addition to the transport mechanism 13A. The transport mechanism 13B is installed in the transport space 12B. The transport mechanism 13B is installed below the transport mechanism 13A. The transport mechanism 13B transports the substrates W.

[0067] Although not shown, the processing block 11 includes a substrate rest portion provided in the transport space 12B, so that the transport mechanism 6 and the transport mechanism 13B can transfer the substrate W to each other.

[0068] The transport mechanisms 13A and 13B have the same structure, and will be referred to as the transport mechanism 13 when there is no need to distinguish between them.

[0069] The structure of the transport mechanism 13 will be described. The transport mechanism 13 includes a hand 14 and a hand drive unit 15. The hand 14 supports one substrate W in a horizontal position. The hand drive unit 15 is connected to the hand 14. The hand drive unit 15 moves the hand 14. The hand drive unit 15 moves the hand 14 in the front-rear direction X, the width direction Y, and the vertical direction Z.

[0070] The structure of the hand driving unit 15 is illustrated below. The hand driving unit 15 includes, for example, two support columns 15a, a vertical moving section 15b, a horizontal moving section 15c, a rotating section 15d, and an advancing / retreating moving section 15e. The support columns 15a are fixedly installed. The support columns 15a are arranged on the sides of the transport space 12A. The two support columns 15a are aligned in the front-to-rear direction X. Each support column 15a extends in the vertical direction Z. Each support column 15a supports a vertical moving section 15b. The vertical moving section 15b extends in the front-to-rear direction X between the two support columns 15a. The vertical moving section 15b moves parallel to the support columns 15a in the vertical direction Z. The vertical moving section 15b supports the horizontal moving section 15c. The horizontal moving section 15c moves parallel to the front-to-rear direction X relative to the vertical moving section 15b. The horizontal moving section 15c supports the rotating section 15d. The rotating unit 15d rotates relative to the horizontal moving unit 15c. The rotating unit 15d rotates around a rotation axis that is parallel to the vertical direction Z. The rotating unit 15d supports the advancing and retreating moving unit 15e. The advancing and retreating moving unit 15e supports the hand 14. The advancing and retreating moving unit 15e moves the hand 14 forward and backward relative to the rotating unit 15d. The advancing and retreating moving unit 15e moves the hand 14 back and forth in one horizontal direction determined by the orientation of the rotating unit 15d.

[0071] According to the above-described hand driving unit 15, the hand 14 can move parallel to the vertical direction Z. The hand 14 can move parallel to the front-rear direction X. The hand 14 can rotate within a horizontal plane. The hand 14 can move forward and backward relative to the rotating unit 15d.

[0072] When there is no need to distinguish between the transport spaces 12A and 12B, they will be referred to as the transport space 12 as appropriate.

[0073] The processing block 11 includes processing towers 21A, 21B, 21C, and 21D. The processing towers 21A and 21B are disposed on the left side of the transport space 12. The processing towers 21A and 21B are aligned in the front-to-rear direction X. The processing towers 21C and 21D are disposed on the right side of the transport space 12. The processing towers 21C and 21D are aligned in the front-to-rear direction X.

[0074] The processing block 11 includes piping spaces 51A, 51B, 51C, and 51D. The piping spaces 51A and 51B are located to the left of the transfer space 12. The piping space 51A is adjacent to the processing tower 21A. The piping space 51B is adjacent to the processing tower 21B. The piping spaces 51C and 51D are located to the right of the transfer space 12. The piping space 51C is adjacent to the processing tower 21C. The piping space 51D is adjacent to the processing tower 21D. Each of the piping spaces 51A-51D is separated from the transfer space 12.

[0075] 3 is a right side view showing the configuration of the left part of the substrate processing apparatus. The processing tower 21A includes a plurality of (e.g., six) processing casings 22. All processing casings 22 belonging to the processing tower 21A are aligned in a row in the vertical direction Z. The processing casings 22 belonging to the processing tower 21A are stacked on top of each other.

[0076] The piping space 51A extends in the vertical direction Z. The piping space 51A is adjacent to each processing casing 22 belonging to the processing tower 21A.

[0077] The piping space 51A is open to the outside of the substrate processing apparatus 1. For example, the processing block 11 has an opening 52 formed above the piping space 51A.

[0078] 2, each processing casing 22 belonging to the processing tower 21A is adjacent to the transfer space 12. Some processing casings 22 belonging to the processing tower 21A are adjacent to the transfer space 12A. Other processing casings 22 belonging to the processing tower 21A are adjacent to the transfer space 12B.

[0079] 1-3, the processing tower 21B includes a plurality of (e.g., six) processing casings 22. The processing casings 22 belonging to the processing tower 21B are arranged in the same manner as the processing casings 22 belonging to the processing tower 21A. The piping space 51B is configured in the same manner as the piping space 51A. Therefore, each processing casing 22 belonging to the processing tower 21B is adjacent to the piping space 51B. Each processing casing 22 belonging to the processing tower 21B is adjacent to the transfer space 12.

[0080] Each of the processing towers 21C and 21D includes a plurality of (e.g., six) processing casings 22. The processing casings 22 belonging to the processing towers 21C and 21D are arranged in the same manner as the processing casings 22 belonging to the processing tower 21A. The piping spaces 51C and 51D are configured in the same manner as the piping space 51A. Therefore, each processing casing 22 belonging to the processing tower 21C is adjacent to the piping space 51C. Each processing casing 22 belonging to the processing tower 21C is adjacent to the transfer space 12. Each processing casing 22 belonging to the processing tower 21D is adjacent to the piping space 51D. Each processing casing 22 belonging to the processing tower 21D is adjacent to the transfer space 12.

[0081] The transport mechanism 13 transports the substrate W to all of the processing casings 22 belonging to the processing towers 21A-21D. Specifically, the transport mechanism 13A transports the substrate W to the processing casing 22 adjacent to the transport space 12A. The transport mechanism 13B transports the substrate W to the processing casing 22 adjacent to the transport space 12B.

[0082] 1, the processing casing 22 and the transport space 12 are aligned in the width direction Y in a plan view. For example, the processing casing 22 and the transport space 12 belonging to the processing tower 21A are aligned in the width direction Y in a plan view. For example, the processing casing 22 and the transport space 12 belonging to the processing tower 21C are aligned in the width direction Y in a plan view.

[0083] When piping spaces 51A-51D are not distinguished from one another, they will be referred to as piping spaces 51 as appropriate. The processing casing 22 and the piping space 51 are aligned in the front-to-rear direction X in a plan view. For example, the processing casing 22 belonging to the processing tower 21A and the piping space 51A adjacent to the processing tower 21A are aligned in the front-to-rear direction X in a plan view. For example, the processing casing 22 belonging to the processing tower 21C and the piping space 51C adjacent to the processing tower 21C are aligned in the front-to-rear direction X in a plan view.

[0084] 2. Internal configuration of processing housing 22 Referring to FIG. 1, the processing casings 22 belonging to the processing towers 21A-21D have the same structure. The processing casings 22 process the substrates W therein. The processing casings 22 define a processing space for processing the substrates W therein. The substrate processing apparatus 1 includes a substrate holding unit 26 and a discharge unit 27. The substrate holding unit 26 is disposed inside the processing casing 22. The substrate holding unit 26 holds the substrates W. The discharge unit 27 is disposed inside the processing casing 22. The discharge unit 27 discharges a processing liquid onto the substrates W held by the substrate holding unit 26.

[0085] Fig. 4 is a perspective view of the processing housing 22. Fig. 5 is a plan view of the processing housing 22. Fig. 6 is a front view of the processing housing 22. Fig. 7 is a side view of the processing housing 22. The processing housing 22 has a substantially box shape.

[0086] The processing housing 22 has a transfer opening 25. The transfer opening 25 is arranged at a position adjacent to the transfer space 12. The transfer opening 25 faces the transfer space 12. The substrate W can pass through the transfer opening 25. The transfer mechanism 13 transfers the substrate W into the processing housing 22. The transfer mechanism 13 transfers the substrate W to the substrate holder 26 through the transfer opening 25.

[0087] Fig. 8 is a vertical cross-sectional view of the processing housing. For convenience, the discharge unit 27 is not shown in Fig. 8. The substrate holder 26 holds one substrate W in a horizontal position.

[0088] The substrate processing apparatus 1 includes a rotation drive unit 28. The rotation drive unit 28 is installed inside the processing housing 22. The rotation drive unit 28 is connected to the substrate holding unit 26. The rotation drive unit 28 rotates the substrate holding unit 26. The substrate W held by the substrate holding unit 26 rotates integrally with the substrate holding unit 26.

[0089] The substrate processing apparatus 1 includes a cup 29. The cup 29 is provided inside the processing housing 22. The cup 29 has a generally cylindrical shape. The cup 29 is arranged around the substrate holding part 26. The cup 29 receives the processing liquid splashed from the substrate W held by the substrate holding part 26.

[0090] The processing housing 22 has an upper plate 24. The upper plate 24 is disposed on the upper portion of the processing housing 22. The upper plate 24 extends in a substantially horizontal direction.

[0091] The upper plate 24 has a recessed space S that is recessed downward. Specifically, the upper plate 24 has a first upper plate portion 24a and a second upper plate portion 24b. The second upper plate portion 24b is lower than the first upper plate portion 24a. The first upper plate portion 24a is disposed above the substrate holding portion 26. The second upper plate portion 24b is disposed in a position close to the piping space 51. The recessed space S is located above the second upper plate portion 24b.

[0092] <3. Air supply unit configuration> 2 and 3, the substrate processing apparatus 1 includes a plurality of (for example, 24) gas supply units 30. The gas supply units 30 supply gas (for example, air) into the processing housing 22.

[0093] One gas supply unit 30 is provided for each processing housing 22. Each gas supply unit 30 supplies gas to only one processing housing 22. Each gas supply unit 30 does not supply gas to more than one processing housing 22.

[0094] For convenience, Figure 8 illustrates the entire air supply unit 30. The air supply unit 30 includes a filter 31, a duct 32, and a fan 41. The filter 31 is disposed on top of the processing housing 22. The filter 31 blows gas into the interior of the processing housing 22. The duct 32 is provided outside the processing housing 22. The duct 32 is connected to the filter 31. The fan 41 is provided outside the processing housing 22. The fan 41 is connected to the duct 32.

[0095] The filter 31 is installed on the upper plate 24. The filter 31 is installed on the first upper plate portion 24a. The filter 31 is disposed above the substrate holding portion .

[0096] The fan 41 sends gas. The gas flows from the fan 41 through the duct 32 to the filter 31. One fan 41 sends gas to only one filter 31. The filter 31 filters the gas. The filter 31 blows out the filtered gas. The filter 31 is, for example, a ULPA (UltraLow ​​Penetration Air) filter. The gas flows from the filter 31 into the inside of the processing housing 22. One fan 41 sends gas to only one processing housing 22. The airflow volume of one fan 41 corresponds to the amount of gas supplied to one processing housing 22.

[0097] The fan 41 sends gas horizontally. The filter 31 blows the gas downward. FIG. 8 schematically shows the flow of gas sent by the fan 41 and the flow of gas blown out by the filter 31. The airflow direction of the fan 41 is different from the airflow direction of the filter 31. For example, the airflow direction of the fan 41 is perpendicular to the airflow direction of the filter 31.

[0098] The gas blown out from the filter 31 reaches the substrate holder 26. A downward airflow (downflow) is formed around the substrate W held by the substrate holder 26.

[0099] The arrangement of the processing casing 22, the filter 31, the duct 32, and the fan 41 will be described.

[0100] At least a part of the filter 31 is disposed at a position higher than the processing housing 22. For example, the entire filter 31 is disposed at a position higher than the processing housing 22. For example, the entire filter 31 is disposed above the processing housing 22.

[0101] A portion of the duct 32 is disposed at a position higher than the processing housing 22. The other portion of the duct 32 is disposed at the same height as the processing housing 22. Specifically, the processing housing 22 has an upper end 23t and a lower end 23b. For example, the height position of the upper plate 24 corresponds to the upper end 23t. A portion of the duct 32 is disposed at a position higher than the upper end 23t. The other portion of the duct 32 is disposed at a position equal to or lower than the upper end 23t and equal to or higher than the lower end 23b. The entire duct 32 is disposed at a position equal to or higher than the lower end 23b.

[0102] At least a portion of the duct 32 is disposed above the processing housing 22. The duct 32 is disposed adjacent to the upper plate 24. The duct 32 extends along the upper plate 24.

[0103] The duct 32 has a portion that is positioned higher than the filter 31 and a portion that is positioned lower than the filter 31. Thus, the duct 32 extends from a position higher than the filter 31 to a position lower than the filter 31.

[0104] The duct 32 has a portion that is disposed above the filter 31. The duct 32 covers the upper side of the filter 31. The duct 32 extends in a substantially horizontal direction from the filter 31. The duct 32 extends from the filter 31 to the piping space 51.

[0105] At least a portion of the fan 41 is disposed at the same height as the processing housing 22. At least a portion of the fan 41 is disposed at a position equal to or lower than the upper end 23t and equal to or higher than the lower end 23b.

[0106] The entire fan 41 is disposed at a position higher than the lower end 23b.

[0107] The fan 41 includes a portion that is disposed at a position higher than the processing housing 22. Therefore, the fan 41 extends from a position higher than the upper end 23t to a position lower than the upper end 23t.

[0108] The fan 41 has a portion that is located at a position lower than the second upper plate portion 24B. Therefore, the fan 41 extends from a position higher than the first upper plate portion 24a to a position lower than the second upper plate portion 24B.

[0109] The fan 41 is disposed on the side of the processing housing 22. The entire fan 41 is disposed on the side of the processing housing 22. The fan 41 is not disposed above the processing housing 22.

[0110] At least a portion of the fan 41 is disposed at a position lower than the filter 31.

[0111] The fan 41 includes a portion that is positioned higher than the filter 31. Therefore, the fan 41 extends from a position higher than the filter 31 to a position lower than the filter 31.

[0112] The fan 41 is disposed to the side of the filter 31. The entire fan 41 is disposed to the side of the filter 31. The fan 41 is not disposed above the filter 31. The filter 31 and the fan 41 are not aligned in the vertical direction Z.

[0113] At least a portion of the fan 41 is disposed at a position equal to or lower than the duct 32. Specifically, the duct 32 has an upper end 32t. At least a portion of the fan 41 is disposed at a position equal to or lower than the upper end 32t.

[0114] In this embodiment, the entire fan 41 is disposed at a position lower than the upper end 32t. Therefore, the upper end 32t corresponds to the upper end of the air supply unit 30.

[0115] 5, the filter 31 is indicated by a broken line. The filter 31 has a substantially rectangular shape in a plan view. The entire filter 31 overlaps with the processing casing 22 in a plan view.

[0116] A large portion of the duct 32 overlaps with the processing housing 22 in a plan view. The other portion of the duct 32 does not overlap with the processing housing 22 in a plan view. The other portion of the duct 32 is disposed in the piping space 51.

[0117] The duct 32 overlaps the entire filter 31 in a plan view.

[0118] The fan 41 is disposed at a position where it does not overlap with the processing housing 22 in a plan view. The fan 41 does not have a portion that overlaps with the processing housing 22 in a plan view.

[0119] The fan 41 is disposed at a position where it does not overlap with the filter 31 in a plan view. The fan 41 does not have a portion that overlaps with the filter 31 in a plan view.

[0120] The fan 41 is disposed in the piping space 51. For example, the entire fan 41 is disposed in the piping space 51.

[0121] The fan 41 is open to the piping space 51. The fan 41 takes in gas from the piping space 51. The fan 41 sends the gas from the piping space 51 to the filter 31.

[0122] 6, a part of the filter 31 is indicated by a broken line. A part of the duct 32 overlaps with the filter 31 when the processing housing 22 is viewed from the front.

[0123] 7 shows a part of the processing housing 22 by a dashed line. A part of the duct 32 overlaps with the filter 31 in a side view of the processing housing 22. At least a part of the fan 41 overlaps with the processing housing 22 in a side view of the processing housing 22.

[0124] <4. Detailed configuration of filter 31 and duct 32> 8, the filter 31 extends in the horizontal direction. The filter 31 has a flat shape. The length L1 of the filter 31 in the vertical direction Z is shorter than the length of the filter 31 in the horizontal direction.

[0125] The filter 31 has an upper surface 31a and a lower surface 31b. The upper surface 31a and the lower surface 31b are each approximately horizontal. The filter 31 takes in gas from the upper surface 31a. The filter 31 discharges gas from the lower surface 31b. The lower surface 31b corresponds to the blowing surface of the filter 31.

[0126] An upper surface 31a of the filter 31 is disposed at a position higher than the processing casing 22. A lower surface 31b of the filter 31 is disposed at approximately the same height as the first upper plate portion 24a.

[0127] 4 and 6, the duct 32 includes a first horizontal section 33, a vertical section 38, and a second horizontal section 39. The first horizontal section 33 extends horizontally from the filter 31. The vertical section 38 extends downward from the first horizontal section 33. The second horizontal section 39 extends horizontally from the vertical section 38 to the fan 41. The second horizontal section 39 is positioned lower than the first horizontal section 33.

[0128] 5, the entire first horizontal portion 33 overlaps with the processing housing 22 in a plan view. The entire vertical portion 38 overlaps with the processing housing 22 in a plan view. The second horizontal portion 39 has a portion that overlaps with the processing housing 22 and a portion that does not overlap with the processing housing 22 in a plan view.

[0129] The first horizontal portion 33 overlaps the entire filter 31 in a plan view. The vertical portion 38 does not overlap the filter 31 in a plan view. The second horizontal portion 39 does not overlap the filter 31 in a plan view.

[0130] The first horizontal portion 33 includes a flat portion 34. The flat portion 34 has a peripheral edge portion 35. The flat portion 34 has a substantially rectangular shape in a plan view.

[0131] In a plan view, the flat portion 34 overlaps the entire filter 31. In a plan view, the flat portion 34 has approximately the same area as the filter 31. In a plan view, the flat portion 34 is slightly larger than the filter 31.

[0132] The first horizontal portion 33 has an outer groove portion 36. In a plan view, the outer groove portion 36 is arranged around the flat portion 34. In a plan view, the outer groove portion 36 has a ring shape that surrounds the flat portion 34. The outer groove portion 36 is connected to and communicates with the peripheral portion 35 of the flat portion 34. The outer groove portion 36 is connected to the entire peripheral portion 35 of the flat portion 34. The outer groove portion 36 is connected to the entire circumference of the peripheral portion 35 of the flat portion 34.

[0133] In plan view, the outer groove portion 36 has a ring shape that surrounds the filter 31. In plan view, the outer groove portion 36 does not overlap with the filter 31.

[0134] Furthermore, the outer groove 36 extends from a part of the peripheral edge 35 of the flat portion 34 to the vertical portion 38. The flat portion 34 is indirectly connected to the vertical portion 38 via the outer groove 36. The outer groove 36 delivers gas to the flat portion 34.

[0135] Referring to FIG. 8, the first horizontal portion 33 is disposed above the first upper plate portion 24a. The first horizontal portion 33 extends along the first upper plate portion 24a. The vertical portion 38 is disposed above the second upper plate portion 24b. The vertical portion 38 extends to a position lower than the first upper plate portion 24a. The second horizontal portion 39 is disposed above the second upper plate portion 24b. At least a portion of the second horizontal portion 39 is disposed at a position lower than the first upper plate portion 24a. The vertical portion 38 and the second horizontal portion 39 are each disposed in the recessed space S. The second horizontal portion 39 extends along the second upper plate portion 24b. The second horizontal portion 39 extends to the piping space 51.

[0136] The first horizontal portion 33 includes an upper end 32 t of the duct 32 .

[0137] The flat portion 34 extends in the horizontal direction. The flat portion 34 is disposed above the filter 31. The flat portion 34 covers the upper side of the filter 31. The flat portion 34 is disposed in close proximity to the filter 31. The flat portion 34 blows out gas downward.

[0138] Fig. 8 shows the length L1 of the filter 31 in the vertical direction. Fig. 8 also shows the overall length L2 of the flat portion 34 and the filter 31 in the vertical direction Z. The length L2 is greater than the length L1. The length L2 is less than twice the length L1.

[0139] The outer groove portion 36 extends downward from the flat portion 34. The outer groove portion 36 extends to a position lower than the upper surface 31a of the filter 31. The entire outer groove portion 36 is positioned higher than the lower surface 31b of the filter 31. The outer groove portion 36 is positioned close to the side of the filter 31.

[0140] The outer groove 36 does not extend upward from the flat portion 34. The outer groove 36 does not extend to a position higher than the flat portion 34. The entire outer groove 36 is positioned at a position equal to or lower than the flat portion 34.

[0141] 6 corresponds to the outer groove 36. The outer groove 36 extends in a substantially horizontal direction. At least a portion of the outer groove 36 overlaps with the filter 31 when the processing casing 22 is viewed from the front.

[0142] 9 is a vertical cross-sectional view of a portion of the duct 32. The flat portion 34 has an upper surface 34a. The height position of the upper surface 34a corresponds to the upper end 32t of the duct 32. The height position of the upper surface 34a corresponds to the upper end of the air supply unit 30.

[0143] The flat portion 34 has a lower surface 34b and an opening 34c. The lower surface 34b and the opening 34c are disposed below the upper surface 34a. The opening 34c is formed in the lower surface 34b. The opening 34c covers most of the lower surface 34b. The position of the lower surface 34b corresponds to the peripheral edge 35 of the flat portion 34.

[0144] In a plan view, the opening 34c has approximately the same area as the filter 31. The opening 34c is disposed above the upper surface 31a of the filter 31. The opening 34c is disposed close to the upper surface 31a of the filter 31. The flat portion 34 supplies gas to the filter 31 through the opening 34c.

[0145] The outer groove 36 extends downward from the peripheral edge 35 of the flattened portion 34 .

[0146] 9 shows the length L3 of the flat portion 34 in the vertical direction Z and the length L4 of the outer groove portion 36 in the vertical direction Z. The length L3 is smaller than the length L1. The length L4 is larger than the length L3.

[0147] 10 is a horizontal cross-sectional view of a portion of the duct 32. The peripheral edge 35 includes a first side 35a, a second side 35b, a third side 35c, and a fourth side 35d. The outer groove 36 includes a first portion 36a, a second portion 36b, a third portion 36c, and a fourth portion 36d. The first portion 36a is connected to the first side 35a. The first portion 36a extends along the first side 35a. Similarly, the second to fourth portions 36b-36d are connected to the second to fourth sides 35b-35d, respectively. The second to fourth portions 36b-36d extend along the second to fourth sides 35b-35d, respectively. The first to fourth portions 36a-36d are connected in an annular shape.

[0148] The first portion 36a and the second portion 36b each extend to the vertical portion 38. The first portion 36a and the second portion 36b are close to the vertical portion 38. The third portion 36c and the fourth portion 36d are far from the vertical portion 38. The third portion 36c is narrower than the first portion 36a and the second portion 36b in a plan view. The fourth portion 36d is narrower than the first portion 36a and the second portion 36b in a plan view.

[0149] The duct 32 includes one or more baffles 37. The baffles 37 are also called baffles. The baffles 37 are installed in the outer groove portion 36. The baffles 37 guide a portion of the gas flowing through the outer groove portion 36 to the flat portion 34.

[0150] The baffle plate 37 intersects with the extension direction of the outer groove portion 36. For example, the baffle plate 37 is perpendicular to the extension direction of the outer groove portion 36. For example, the baffle plate 37 has a substantially vertical plate shape.

[0151] The baffle plate 37 narrows the flow path of the outer groove portion 36. The baffle plate 37 blocks only a part of the flow path of the outer groove portion 36. The baffle plate 37 is disposed, for example, only in the lower portion of the outer groove portion 36.

[0152] In this embodiment, the duct 32 includes three baffles 37a, 37b, and 37c. The baffle 37a is provided in the second portion 36b. The baffle 37b is provided in the third portion 36c. In a plan view, the baffle 37b is disposed at the center of the third portion 36c in the direction in which the third portion 36c extends. The baffle 37c is provided in the fourth portion 36d. In a plan view, the baffle 37c is disposed at the center of the fourth portion 36d in the direction in which the fourth portion 36d extends.

[0153] The effect of the baffle plate 37 will now be described. The inventors performed a simulation of the gas flow in the flat portion 34 and the outer groove portion 36. Figures 11 and 12 are diagrams that schematically show the simulation results. Figures 11 and 12 are diagrams that schematically show the gas flow in the flat portion 34 and the outer groove portion 36, respectively.

[0154] 11 shows the results of a simulation in which the duct 32 does not include the baffle plate 37. When the duct 32 does not include the baffle plate 37, the gas tends to swirl in the flat portion .

[0155] Specifically, when the baffle plate 37 is not installed, the gas easily flows in the direction in which the outer groove portion 35 extends. When the baffle plate 37 is not installed, the gas does not easily flow from the outer groove portion 36 to the flat portion 34. For example, the amount of gas flowing from the first portion 36a to the fourth portion 36d is relatively large. In other words, the amount of gas flowing from the first portion 36a to the first side 35a is relatively small. The amount of gas flowing from the second portion 36b to the third portion 36c is relatively large. In other words, the amount of gas flowing from the second portion 36b to the second side 35b is relatively small. The portion where the third portion 36c and the fourth portion 36d are connected to each other is called the "connection portion J." The amount of gas flowing from the third portion 36c to the connection portion J is relatively large. The amount of gas flowing from the fourth portion 36d to the connection portion J is relatively large. The gas hits the connection portion J, bounces off, and then flows to the flat portion 34. For this reason, A relatively large amount of gas flows from the connecting portion J to the third side 35c and the fourth side 35d of the flat portion 34. The portion of the flat portion 34 close to the connecting portion J is called the "deep portion K." Gas vortices are likely to occur in the deep portion K. In the region where gas vortices occur, most of the gas flows horizontally, with little gas flowing downward. As a result, in the region where gas vortices occur, the amount or speed of gas flowing from the flat portion 34 to the filter 31 is significantly reduced.

[0156] 12 shows the results of a simulation in which the duct 32 is provided with the baffle plate 37. When the duct 32 is provided with the baffle plate 37, the gas is less likely to swirl in the flat portion .

[0157] Specifically, when the baffle plate 37 is installed, the gas flows more easily from the outer groove portion 36 to the flat portion 34. When the baffle plate 37 is installed, the gas flows less easily in the direction in which the outer groove portion 35 extends. For example, the baffle plate 37a increases the amount of gas flowing from the second portion 36b to the second side 35b. The baffle plate 37a decreases the amount of gas flowing from the second portion 36b to the third portion 36c. The baffle plate 37b increases the amount of gas flowing from the third portion 36c to the third side 35c. The baffle plate 37b decreases the amount of gas flowing from the third portion 36c to the connecting portion J. The baffle plate 37c increases the amount of gas flowing from the fourth portion 36d to the fourth side 35d. The baffle plate 37c decreases the amount of gas flowing from the fourth portion 36d to the connecting portion J. As a result, the amount of gas flowing from the connecting portion J to the flat portion 34 decreases. Gas vortexes are unlikely to occur in the deep portion K. Gas vortexes are unlikely to occur in parts of the flat portion 34 other than the deep portion K. That is, gas vortexes are unlikely to occur throughout the flat portion 34. As a result, gas flows from the flat portion 34 to the filter 31 approximately uniformly throughout the entire flat portion 34.

[0158] The inventors also performed a simulation of the wind speed distribution on the outlet surface of the filter 31. The simulation results for the case where the duct 32 does not include the baffle plate 37 are as follows.

[0159] Average velocity of gas across the entire blowing surface Va1: 0.18 m / s Maximum gas velocity Vmax1: 0.194 m / s Minimum gas velocity Vmin1: 0.153 m / s Speed ​​uniformity U1:23%

[0160] Here, the velocity uniformity U1 is the difference between the maximum velocity Vmax1 and the minimum velocity Vmin1 divided by the average velocity Va1. U1=(Vmax1-Vmin1) / Va1*100

[0161] Although not shown in the figure, the portion of the filter 31 located directly below the deep portion K is referred to as the "deep portion F." The gas velocity in the deep portion F is significantly lower than the average velocity Va1. The gas velocity in the deep portion F is close to the minimum velocity Vmin1.

[0162] The simulation results for the case where the duct 32 is provided with the baffle plate 37 are as follows.

[0163] Average velocity of gas over the entire blowing surface Va2: 0.18 m / s Maximum gas velocity Vmax2: 0.190 m / s Minimum gas velocity Vmin2: 0.176 m / s Speed ​​uniformity U2:8%

[0164] Here, the velocity uniformity U2 is the difference between the maximum velocity Vmax2 and the minimum velocity Vmin2 divided by the average velocity Va2. U2=(Vmax2-Vmin2) / Va2*100

[0165] In this way, the baffle plate 37 effectively uniforms the wind speed on the blowing surface of the filter 31. The baffle plate 37 improves the uniformity of the wind speed on the blowing surface of the filter 31. As a result, the filter 31 blows out gas from the blowing surface of the filter 31 in a substantially uniform manner.

[0166] Refer to FIG. 8. In this embodiment, no straightening member is provided below the filter 31 or above the substrate holding unit 26. The straightening member is a member that straightens the flow of gas. The straightening member is, for example, a plate with a plurality of small holes formed therein. Therefore, while the gas flows from the filter 31 to the substrate holding unit 26, the flow path of the gas is not narrowed to a size smaller than the area of ​​the blowing surface of the filter 31. In other words, the gas reaches the substrate holding unit 26 from the filter 31 without being narrowed to a size smaller than the area of ​​the blowing surface of the filter 31.

[0167] <5. Protrusion length of air supply unit> 6 shows the protruding length L5 of the air supply unit 30 that protrudes upward from the processing housing 22. In this specification, the protruding length L5 of the air supply unit 30 that protrudes upward from the processing housing 22 is appropriately referred to as the "protruding length L5 of the air supply unit 30." The protruding length L5 of the air supply unit 30 is equal to or less than twice the length L1 of the filter 31 in the vertical direction Z.

[0168] The protruding length L5 of the air supply unit 30 is defined, for example, as follows: The protruding length L5 of the air supply unit 30 is the distance in the vertical direction Z between the upper end of the overlapping portion and the upper end 23t of the processing housing 22. Here, the "overlapping portion" is the portion of the air supply unit 30 that overlaps with the processing housing 22 in a plan view.

[0169] In this embodiment, the overlapping portion of the air supply unit 30 includes the entire filter 31 and a part of the duct 32. The overlapping portion of the air supply unit 30 does not include the fan 41. This is because the fan 41 does not overlap with the processing housing 22 in a plan view. Therefore, the fan 41 is not a factor in the protrusion length L5. The upper end of the overlapping portion of the air supply unit 30 corresponds to the upper end 32t of the duct 32. Therefore, the discharge length L5 of the air supply unit 30 is the distance in the vertical direction Z between the upper end 32t and the upper end 23t.

[0170] Of the two processing casings 22 adjacent to each other in the vertical direction Z, the lower processing casing 22 is referred to as the "first processing casing 22A" and the upper processing casing 22 is referred to as the "second processing casing 22B." The air supply unit 30 that supplies gas to the inside of the first processing casing 22A is referred to as the "first air supply unit 30A." In this case, the second processing casing 22B is disposed above the duct 32 of the first air supply unit 30A. The second processing casing 22B is disposed adjacent to the duct 32 of the first air supply unit 30A.

[0171] The fan 41 of the first air supply unit 30A does not overlap with the second processing casing 22B in a plan view, and therefore the fan 41 of the first air supply unit 30A does not interfere with the second processing casing 22B.

[0172] 6. Exhaust Configuration of Processing Housing 22 7, the processing housing 22 includes an exhaust port 53. The exhaust port 53 is formed at a position facing the piping space 51. Gas inside the processing housing 22 is discharged to the outside of the processing housing 22 through the exhaust port 53. The exhaust port 53 is disposed at the same height as the processing housing 22. All of the exhaust ports 53 are disposed at a position equal to or lower than the upper end 23t and equal to or higher than the lower end 23b. The exhaust port 53 is disposed at the bottom of the processing housing 22.

[0173] The exhaust port 53 is disposed below the fan 41. The fan 41 and the exhaust port 53 are aligned in the vertical direction Z when the processing housing 22 is viewed from the side.

[0174] The fan 41 and the exhaust port 53 are each located near the transfer space 12 .

[0175] 2 and 4-6. The substrate processing apparatus 1 includes a plurality of (e.g., 24) horizontal exhaust units 55. One horizontal exhaust unit 55 is provided for each processing housing 22. The horizontal exhaust units 55 are provided in the piping space 51. The horizontal exhaust units 55 are connected to the exhaust ports 53. The horizontal exhaust units 55 extend in the horizontal direction. The horizontal exhaust units 55 are disposed at the same height as the processing housing 22. All of the horizontal exhaust units 55 are disposed at positions equal to or lower than the upper end 23t and equal to or higher than the lower end 23b.

[0176] The horizontal exhaust section 55 is disposed at a position lower than the fan 41. A portion of the horizontal exhaust section 55 is disposed at a position close to the transport space 12. A portion of the horizontal exhaust section 55 is disposed below the fan 41. A portion of the horizontal exhaust section 55 overlaps with the fan 41 in a plan view.

[0177] See Figure 6. As described above, the fan 41 of the first air supply unit 30A is disposed at a position lower than the upper end 32t of the duct 32 of the first air supply unit 30A. The second processing casing 22B is disposed above the duct 32 of the first air supply unit 30A. Therefore, the fan 41 of the first air supply unit 30A is disposed at a position lower than the second processing casing 22B.

[0178] The horizontal exhaust section 55 connected to the second processing casing 22B is referred to as the "second horizontal exhaust section 55B." The entire second horizontal exhaust section 55B is disposed at the same height as the second processing casing 22B. Therefore, the fan 41 of the first air supply unit 30A is disposed at a lower position than the second horizontal exhaust section 55B. Therefore, the fan 41 of the first air supply unit 30A does not interfere with the second horizontal exhaust section 55B. For the same reason, the fan 41 of the first air supply unit 30A does not interfere with the exhaust port (not shown) of the second processing casing 22B.

[0179] 2, 4, and 5. The substrate processing apparatus 1 includes a plurality of (e.g., four) vertical exhaust units 60. One vertical exhaust unit 60 is provided for each of a plurality of (e.g., six) processing casings 22 arranged in a row in the vertical direction Z. The vertical exhaust units 60 are provided in the piping space 51. The vertical exhaust units 60 are connected to horizontal exhaust units 55. Each vertical exhaust unit 60 is connected to a plurality of (e.g., six) horizontal exhaust units 55. The vertical exhaust units 60 extend in the vertical direction Z.

[0180] The vertical exhaust section 60 includes a first vertical exhaust pipe 61, a second vertical exhaust pipe 62, and a third vertical exhaust pipe 63. The first to third vertical exhaust pipes 61-63 are each connected to the horizontal exhaust section 55. The first to third vertical exhaust pipes 61-63 each extend in the vertical direction Z.

[0181] Referring to Figure 2, the vertical exhaust section 60 extends from a position lower than the fan 41 to a position higher than the fan 41. The fan 41 and the vertical exhaust section 60 are aligned in the width direction Y when viewed from the front-rear direction X. The fan 41 is disposed at a position close to the transport space 12. The vertical exhaust section 60 is disposed at a position far from the transport space 12.

[0182] The first to third vertical exhaust pipes 61-63 are aligned in the width direction Y when viewed from the front-rear direction X. The first to third vertical exhaust pipes 61-63 each extend from a position lower than the fan 41 to a position higher than the fan 41. The fan 41 and the first to third vertical exhaust pipes 61-63 are aligned in the width direction Y when viewed from the front-rear direction X.

[0183] 13 is a plan view of the processing housing 22. The horizontal exhaust section 55 is equipped with a switching mechanism 56. The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first to third vertical exhaust pipes 61-63. Here, the exhaust path of the processing housing 22 is divided by the horizontal exhaust section 55 and the vertical exhaust section 60. More specifically, each horizontal exhaust section 55 divides the exhaust path of one processing housing 22. Each vertical exhaust section 60 divides the exhaust paths of all the processing housings 22 lined up in a row in the vertical direction Z. The exhaust path of the processing housing 22 is not open to the piping space 51.

[0184] Specifically, the switching mechanism 56 switches between a first state, a second state, and a third state. In the first state, the switching mechanism 56 connects the processing housing 22 to the first vertical exhaust pipe 61 and isolates the processing housing 22 from the second and third vertical exhaust pipes 62 and 63. In the first state, only the first vertical exhaust pipe 61 exhausts gas from the processing housing 22. That is, in the first state, the second vertical exhaust pipe 62 does not exhaust gas from the processing housing 22, and the third vertical exhaust pipe 63 does not exhaust gas from the processing housing 22 either. In the second state, the switching mechanism 56 connects the processing housing 22 to the second vertical exhaust pipe 62 and isolates the processing housing 22 from the first and third vertical exhaust pipes 61 and 63. In the second state, only the second vertical exhaust pipe 62 exhausts gas from the processing housing 22. In the third state, the switching mechanism 56 connects the processing housing 22 to the third vertical exhaust pipe 63 and isolates the processing housing 22 from the first and second vertical exhaust pipes 61, 62. In the third state, the third vertical exhaust pipe 63 exclusively exhausts gas from the processing housing 22.

[0185] For example, the switching mechanism 56 is provided inside the horizontal exhaust unit 55. The switching mechanism 56 includes a first opening / closing unit 57, a second opening / closing unit 58, and a third opening / closing unit 59. The first opening / closing unit 57 connects the processing casing 22 to a first vertical exhaust pipe 61 and isolates the processing casing 22 from the first vertical exhaust pipe 61. The second opening / closing unit 58 connects the processing casing 22 to a second vertical exhaust pipe 62 and isolates the processing casing 22 from the second vertical pipe 62. The third opening / closing unit 59 connects the processing casing 22 to a third vertical exhaust pipe 63 and isolates the processing casing 22 from the third vertical exhaust pipe 63. Each of the first to third opening / closing units 57-59 is, for example, a valve.

[0186] 7. Configuration for controlling the gas pressure inside the processing housing 22 The substrate processing apparatus 1 includes an exhaust damper 65. The exhaust damper 65 is provided in the exhaust path of the processing housing 22. The exhaust damper 65 adjusts the flow rate of gas flowing through the exhaust path of the processing housing 22. For example, the exhaust damper 65 is provided inside the horizontal exhaust unit 55.

[0187] The substrate processing apparatus 1 includes a pressure sensor 67. The pressure sensor 67 measures the pressure of the gas inside the processing housing 22. The pressure sensor 67 is installed inside the processing housing 22.

[0188] 14 is a control block diagram of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control unit 69. The control unit 69 acquires the detection result of the pressure sensor 67. The control unit 69 controls at least one of the fan 41 and the exhaust damper 65 based on the detection result of the pressure sensor 67. In this way, the control unit 69 adjusts the pressure of the gas inside the processing housing 22. For example, the control unit 69 controls both the fan 41 and the exhaust damper 65 based on the detection result of the pressure sensor 67. The control unit 69 is connected to the fan 41, the exhaust damper 65, and the pressure sensor 67 so as to be able to communicate with them.

[0189] For example, the control unit 69 adjusts the airflow rate of the fan 41. For example, the control unit 69 adjusts the opening degree of the exhaust damper 65.

[0190] For example, the control unit 69 adjusts the detection result of the pressure sensor 67 so that it is kept constant. For example, the control unit 69 adjusts the pressure of the gas inside the processing casing 22 so that it is kept constant. For example, the control unit 69 adjusts the detection result of the pressure sensor 67 so that it becomes a preset target value. For example, the control unit 69 adjusts the pressure of the gas inside the processing casing 22 so that it becomes a preset target value.

[0191] Furthermore, the control unit 69 controls the transfer mechanism 6, the transfer mechanism 13, the substrate holder 26, the discharge unit 27, the rotation driver 28, and the switching mechanism 56.

[0192] The control unit 69 is realized by a central processing unit (CPU) that executes various processes, a random-access memory (RAM) that serves as a work area for the processes, a storage medium such as a fixed disk, etc. The storage medium stores various types of information in advance. For example, the storage medium stores information (processing recipes) that define the operating conditions for the processes performed on the substrate W inside each processing housing 22. For example, the storage medium stores information that defines the conditions or target values ​​for the pressure of the gas inside the processing housing 22. For example, the storage medium stores information that defines the operating conditions for switching the exhaust path performed by the switching mechanism 56.

[0193] <8. Operation Example of Substrate Processing Apparatus 1> An example of the operation of the substrate processing apparatus 1 will now be briefly described.

[0194] The indexer unit 3 supplies the substrate W to the processing block 11. Specifically, the transport mechanism 6 transfers the substrate W from the carrier C to the transport mechanism 13 of the processing block 11.

[0195] The transport mechanism 13 transports the substrate W from the indexer unit 3 to the inside of one of the processing housings 22 (substrate holder 26).

[0196] The air supply unit 30 supplies gas to the processing housing 22. Specifically, the fan 41 sends the gas to the duct 32. The duct 32 sends the gas to the filter 31. Specifically, the gas flows through the second horizontal section 39, the vertical section 38, and the first horizontal section 33 in this order. In the first horizontal section 33, the gas flows from the outer groove section 36 to the flat section 34, and from the flat section 34 to the filter 31. The filter filters the gas. The filter 31 blows the filtered gas into the processing housing 22. The gas flows downward inside the processing housing 22. That is, a downflow is formed inside the processing housing 22.

[0197] The switching mechanism 56 switches the exhaust path of the processing housing 22 to any one of the first to third vertical exhaust pipes 61-63. For example, the switching mechanism 56 switches the exhaust path of the processing housing 22 depending on the type of processing liquid discharged by the discharge part 27.

[0198] For example, the switching mechanism 56 switches the exhaust path of the processing housing 22 to the first vertical exhaust pipe 61. In this case, the gas inside the processing housing 22 is exhausted to the first vertical exhaust pipe 61 through the exhaust port 53 and the horizontal exhaust unit 55.

[0199] The control unit 69 controls at least one of the fan 41 and the exhaust damper 65 based on the detection result of the pressure sensor 67. In this way, the control unit 69 adjusts the pressure of the gas inside the processing housing 22.

[0200] The substrate W is processed inside the processing housing 22. Specifically, the substrate holding unit 26 holds the substrate W. The rotation drive unit 28 rotates the substrate W held by the substrate holding unit 26. The discharge unit 27 supplies the processing liquid to the substrate W held by the substrate holding unit 26. The cup 29 receives the processing liquid splashed from the substrate W.

[0201] After the substrate W has been processed inside the processing housing 22, the processing block 11 returns the processed substrate W to the indexer unit 3. Specifically, the transport mechanism 13 takes the substrate W from inside the processing housing 22 (substrate holder 26). Then, the transport mechanism 13 hands it over to the transport mechanism 6 of the indexer unit 3.

[0202] The indexer unit 3 retrieves the substrate W from the processing block 11. Specifically, the transport mechanism 6 transports the substrate W from the processing block 11 to the carrier C.

[0203] <9. Effects of the embodiment> The substrate processing apparatus 1 includes a processing housing 22 and an air supply unit 30. The processing housing 22 processes the substrate W inside the processing housing 22. The air supply unit 30 supplies gas into the inside of the processing housing 22. The air supply unit 30 includes a filter 31, a duct 32, and a fan 41. The filter 31 is disposed on the top of the processing housing 22. The filter 31 blows gas into the inside of the processing housing 22. The duct 32 and the fan 41 are each provided outside the processing housing 22. The duct 32 is connected to the filter 31. The fan 41 is connected to the duct 32.

[0204] The fan 41 is disposed at a position that does not overlap the filter 31 in a plan view. In other words, the fan 41 does not have a portion that overlaps with the filter 31 in a plan view. Therefore, the filter 31 and the fan 41 are not aligned in the vertical direction Z. Furthermore, at least a portion of the fan 41 is disposed at the same height as the processing housing 22. In other words, at least a portion of the fan 41 is disposed at a position equal to or lower than the upper end 23t of the processing housing 22 and equal to or higher than the lower end 23b of the processing housing 22. Therefore, at least a portion of the fan 41 does not protrude upward from the processing housing 22. Even when the filter 31 is disposed at the top of the processing housing 22, the fan 41 can be prevented from protruding significantly upward from the processing housing 22. Therefore, the protrusion length L5 of the air supply unit 30 is reduced.

[0205] As described above, according to the substrate processing apparatus 1, the protruding length L5 of the air supply unit 30 can be reduced.

[0206] As a result, two processing casings 22 adjacent to each other in the vertical direction Z can be disposed close to each other. In other words, the separation distance between two processing casings 22 adjacent to each other in the vertical direction Z can be reduced. Therefore, even if the number of processing casings 22 arranged in the vertical direction Z increases, the length of the substrate processing apparatus 1 in the vertical direction Z does not become excessively large. Therefore, the number of processing casings 22 arranged in the vertical direction Z can be easily increased. This makes it possible to improve the processing capacity of the substrate processing apparatus 1 while suppressing an increase in the footprint of the substrate processing apparatus 1.

[0207] At least a portion of the fan 41 is disposed at a position lower than the filter 31. Therefore, the height position of the fan 41 is relatively low, and the protruding length L5 of the air supply unit 30 is suitably reduced.

[0208] At least a portion of the duct 32 is disposed at a position lower than the filter 31. Therefore, at least a portion of the fan 41 can be easily disposed at a position lower than the filter 31.

[0209] The fan 41 is disposed at a position that does not overlap with the processing housing 22 in a plan view. In other words, the fan 41 does not have a portion that overlaps with the processing housing 22 in a plan view. Therefore, the fan 41 is not disposed above the processing housing 22. Therefore, the fan 41 is not a factor in the protruding length L5 of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is effectively reduced.

[0210] The protruding length L5 of the air supply unit 30 is equal to or less than twice the length L1 of the filter in the vertical direction Z. The protruding length L5 of the air supply unit 30 is sufficiently small.

[0211] The protruding length L5 of the air supply unit 30 is the distance in the vertical direction Z between the upper end of the overlapping portion of the air supply unit 30 and the upper end 22t of the processing casing 22. Therefore, reducing the protruding length L5 of the air supply unit 30 is equivalent to thinning the overlapping portion of the air supply unit 30. Therefore, by reducing the protruding length L5 of the air supply unit 30, the separation distance between two processing casings 22 adjacent in the vertical direction Z can be reduced.

[0212] The upper end 32t of the duct 32 corresponds to the upper end of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0213] The duct 32 includes a first horizontal section 33, a vertical section 38, and a second horizontal section 39. The first horizontal section 33 extends substantially horizontally from the filter 31. The vertical section 38 extends downward from the first horizontal section 33. The second horizontal section 39 extends substantially horizontally from the vertical section 38 to the fan 41. The second horizontal section 39 is disposed at a lower position than the first horizontal section 33. In this way, the vertical section 38 makes it easy to dispose the second horizontal section 39 at a lower position than the first horizontal section 33. The second horizontal section 39 makes it easy to lower the height position of the fan 41. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0214] The processing housing 22 has an upper plate portion 24. The upper plate 24 has a first upper plate portion 24a and a second upper plate portion 24b. The filter 31 is installed on the first upper plate portion 24a. The second upper plate portion 24b is disposed below the vertical portion 38 and the second horizontal portion 39. The second upper plate portion 24b is lower than the first upper plate portion 24a. Therefore, the height position of the vertical portion 38 can be easily lowered. Furthermore, the height position of the second horizontal portion 39 can be easily lowered. Therefore, the height position of the fan 41 can be easily lowered. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0215] A portion of the duct 32 overlaps with the filter 31 in a front view. In other words, a portion of the duct 32 is disposed at the same height as the filter 31. Therefore, the height position of the duct 32 is relatively low. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0216] The duct 32 has a flat portion 34. The flat portion 34 is disposed above the filter 31. The flat portion 34 extends horizontally. The flat portion 34 blows gas downward. The length L3 of the flat portion 34 in the vertical direction Z is smaller than the length L1 of the filter 31 in the vertical direction Z. In other words, the flat portion 34 is thinner than the filter 31. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0217] The overall length L2 of the flat portion 34 and the filter 31 in the vertical direction Z is less than twice the length L1 of the filter 31 in the vertical direction Z. Therefore, the height position of the flat portion 34 is relatively low. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0218] The height position of the upper surface 34a of the flat portion 34 corresponds to the upper end 32t of the duct 32. Therefore, the upper end 32t of the duct 32 is relatively low. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0219] The height position of the upper surface 34a of the flat portion 34 corresponds to the upper end of the air supply unit 30. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0220] The duct 32 has an outer groove portion 36. The outer groove portion 36 is connected to the peripheral edge portion 35 of the flat portion 34. The outer groove portion 36 sends gas to the flat portion 34. The length L4 of the outer groove portion 36 in the vertical direction Z is greater than the length L3 of the flat portion 34 in the vertical direction Z. Therefore, the outer groove portion 36 can smoothly supply gas to the flat portion 34.

[0221] In a plan view, the outer groove portion 36 has a ring shape that surrounds the flat portion 34. Therefore, the outer groove portion 36 can supply gas to the entire peripheral portion 35 of the flat portion 34.

[0222] The outer groove portion 36 extends downward from the peripheral edge portion 35 of the flat portion 34. This allows the height position of the outer groove portion 36 to be easily lowered. At least a portion of the outer groove portion 36 overlaps with the filter 31 in a front view. This makes the height position of the outer groove portion 36 relatively low. This allows the protruding length L5 of the air supply unit 30 to be suitably reduced.

[0223] The duct 32 includes a baffle plate 37. The baffle plate 37 is installed in the outer groove portion 36. The baffle plate 37 guides a portion of the gas flowing in the outer groove portion 36 to the flat portion 34. The baffle plate 37 allows the gas to flow more smoothly from the outer groove portion 36 to the flat portion 34. For example, the gas is distributed substantially uniformly throughout the flat portion 34. For example, the gas is less likely to swirl in the flat portion 34. Therefore, the filter 31 appropriately blows out the gas. For example, the filter 31 blows out the gas substantially uniformly from the entire blowing surface of the filter 31. For example, the filter 31 blows out the gas at substantially the same wind speed from the entire blowing surface of the filter 31. Therefore, the substrate W can be appropriately processed inside the processing housing 22.

[0224] The baffle plate 37 intersects with the direction in which the outer groove portion 36 extends. Therefore, the baffle plate 37 can suitably guide a part of the gas flowing through the outer groove portion 36 to the flat portion 34.

[0225] The substrate processing apparatus 1 comprises a transport space 12, a transport mechanism 13, and a piping space 51. The transport space 12 extends in the front-to-rear direction X. The transport space 12 is adjacent to the processing casing 22. The transport mechanism 13 is installed in the transport space 12. The transport mechanism 13 transports the substrate W into the processing casing 22. The piping space 51 is adjacent to the processing casing 22. The processing casing 22 and the transport space 12 are aligned in the width direction Y in a plan view. The processing casing 22 and the piping space 51 are aligned in the front-to-rear direction X. Therefore, the transport space 12 and the piping space 51 do not interfere with each other.

[0226] The fan 41 is open to the piping space 51. The fan 41 sends the gas in the piping space 51 to the filter 31. Therefore, the fan 41 does not interfere with the transfer mechanism 13, and the fan 41 can be easily disposed near the processing housing 22. Therefore, the air supply unit 30 can be easily made compact.

[0227] The processing housing 22 includes an exhaust port 53. The exhaust port 53 is formed at a position facing the piping space 51. The fan 41 is disposed above the exhaust port 53. Therefore, the fan 41 does not interfere with the exhaust port 53.

[0228] The substrate processing apparatus 1 includes a horizontal exhaust section 55 and a vertical exhaust section 60. The horizontal exhaust section 55 is provided in the piping space 51. The horizontal exhaust section 55 is connected to the exhaust port 53. The horizontal exhaust section 55 extends in the horizontal direction. The vertical exhaust section 60 is provided in the piping space 51. The vertical exhaust section 60 is connected to the horizontal exhaust section 55. The vertical exhaust section 60 extends in the vertical direction Z. The fan 41 is positioned higher than the horizontal exhaust section 55. Therefore, the fan 41 does not interfere with the horizontal exhaust section 55. The fan 41 and the vertical exhaust section 60 are aligned in the width direction Y when viewed from the front-rear direction X. Therefore, the fan 41 does not interfere with the vertical exhaust section 60.

[0229] The vertical exhaust unit 60 includes a first vertical exhaust pipe 61 and a second vertical exhaust pipe 62. The horizontal exhaust unit 55 includes a switching mechanism 56. The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first vertical exhaust pipe 61 and the second vertical exhaust pipe 62. This allows gas to be appropriately exhausted from inside the processing housing 22.

[0230] Furthermore, the vertical exhaust unit 60 includes a third vertical exhaust pipe 63. The switching mechanism 56 switches the exhaust path of the processing housing 22 to one of the first to third vertical exhaust pipes 61-63. This allows gas to be more appropriately exhausted from the inside of the processing housing 22.

[0231] The fan 41, the first vertical exhaust pipe 61, and the second vertical exhaust pipe 62 are aligned in the width direction Y when viewed from the front-rear direction X. Therefore, the fan 41 does not interfere with the first vertical exhaust pipe 61 and the second vertical exhaust pipe 62.

[0232] The fan 41, the first vertical exhaust pipe 61, the second vertical exhaust pipe 62, and the third vertical exhaust pipe 63 are aligned in the width direction Y when viewed from the front-rear direction X. Therefore, the fan 41 does not interfere with the first to third vertical exhaust pipes 61-63.

[0233] The substrate processing apparatus 1 includes a pressure sensor 67 and a control unit 69. The pressure sensor 67 measures the pressure of the gas inside the processing housing 22. The control unit 69 controls the fan 41 based on the detection result of the pressure sensor 67. For example, the control unit 69 adjusts the airflow rate of the fan 41 by controlling the fan 41. This allows the control unit 69 to adjust the amount of gas supplied to the processing housing 22. Therefore, the control unit 69 can suitably control the pressure of the gas inside the processing housing 22. Therefore, the substrate W can be suitably processed inside the processing housing 22.

[0234] The fan 41 sends gas only to the processing housing 22. The airflow rate of the fan 41 corresponds to the amount of gas supplied to the processing housing 22. Therefore, the amount of gas supplied to the processing housing 22 can be easily adjusted.

[0235] The vertical exhaust unit 60 passes gas exhausted from two or more processing casings 22. Therefore, the pressure of the gas inside a processing casing 22 may be affected by the other processing casings 22. Specifically, the vertical exhaust unit 60 passes gas exhausted from all the processing casings 22 lined up in a row in the vertical direction Z. Therefore, the pressure of the gas inside the processing casing 22 may affect each other among all the processing casings 22 lined up in a row in the vertical direction Z. Therefore, the pressure of the gas inside the processing casing 22 is likely to fluctuate. Even in this case, the control unit 69 can suitably suppress fluctuations in the pressure of the gas inside the processing casing 22.

[0236] In particular, when the switching mechanism 56 switches the exhaust path of the processing housing 22 between the first to third vertical exhaust pipes 61-63, the pressure of the gas inside the processing housing 22 is likely to fluctuate. Even in this case, the control unit 69 can suitably suppress the fluctuation of the pressure of the gas inside the processing housing 22.

[0237] The substrate processing apparatus 1 includes an exhaust damper 65. The exhaust damper 65 is provided in the exhaust path of the processing housing 22. The control unit 69 controls the fan 41 and the exhaust damper 65 based on the detection result of the pressure sensor 67. For example, the control unit 69 adjusts the opening degree of the exhaust damper 65 by controlling the exhaust damper 65. This allows the control unit 69 to adjust the amount of gas discharged from the processing housing 22. Therefore, the control unit 69 can more appropriately control the pressure of the gas inside the processing housing 22. Therefore, the substrate W can be more appropriately processed inside the processing housing 22.

[0238] The substrate processing apparatus 1 includes a processing housing 22 and an air supply unit 30. The air supply unit 30 includes a filter 31 and a duct 32. The duct 32 includes a flat portion 34 and an outer groove portion 35. The length L4 of the outer groove portion 35 in the vertical direction Z is greater than the length L3 of the flat portion 34 in the vertical direction Z. Therefore, the outer groove portion 35 can smoothly supply gas to the flat portion 34. As a result, the flat portion 34 can be easily made thinner. Therefore, the protruding length L5 of the air supply unit 30 is suitably reduced.

[0239] The present invention is not limited to the embodiments, and can be modified as follows.

[0240] In the embodiment, a portion of the fan 41 is disposed at the same height as the processing housing 22. However, this is not limited to this. The entire fan 41 may be disposed at the same height as the processing housing 22. Specifically, the entire fan 41 may be disposed at a position equal to or lower than the upper end 23t of the processing housing 22 and equal to or higher than the lower end 23b.

[0241] In the embodiment, the fan 41 does not overlap with the processing housing 22 in a plan view. However, this is not limited to this. At least a portion of the fan 41 may overlap with the processing housing 22 in a plan view. For example, the entire fan 41 may overlap with the processing housing 22 in a plan view.

[0242] In the embodiment, the fan 41 is disposed in the piping space 51. However, this is not limited to this. For example, at least a portion of the fan 41 may be disposed above the processing housing 22. For example, at least a portion of the fan 41 may be disposed above the second upper plate portion 24b of the processing housing 22. For example, at least a portion of the fan 41 may be disposed in the recessed space S.

[0243] In the above-described embodiment, the fan 41 is not a factor in determining the protruding length L5 of the air supply unit 30. However, this is not limitative. The fan 41 may be a factor in determining the protruding length L5 of the air supply unit 30.

[0244] In the above-described embodiment, the protruding length L5 of the air supply unit 30 is the distance in the vertical direction Z between the upper end of the overlapping portion of the air supply unit 30 and the upper end 23t of the processing housing 22. However, this is not limited to this. For example, the protruding length L5 of the air supply unit 30 may be the distance in the vertical direction Z between the upper end of the air supply unit 30 and the upper end 23t of the processing housing 22.

[0245] In the above-described embodiment, the entire fan 41 is disposed at a position lower than the upper end 32t of the duct 32. However, this is not limited to this. At least a part of the fan 41 may be disposed at a position higher than the upper end 32t of the duct 32.

[0246] In the above-described embodiment, the upper end 32t of the duct 32 corresponds to the upper end of the air supply unit 30. However, this is not limited to this. The upper end of the fan 41 may also correspond to the upper end of the air supply unit 30.

[0247] In the embodiment, the number of processing casings 22 arranged in the vertical direction Z is six. However, this is not limited to this. The number of processing casings 22 arranged in the vertical direction Z may be changed as appropriate.

[0248] In the embodiment, the vertical exhaust section 60 includes the third vertical exhaust pipe 63. However, this is not limiting, and the third vertical exhaust pipe 63 may be omitted.

[0249] In the embodiment, the exhaust damper 65 is provided inside the horizontal exhaust section 55. However, this is not limiting. At least a part of the exhaust damper 65 may be disposed outside the horizontal exhaust section 55. For example, at least a part of the exhaust damper 65 may be disposed inside the processing housing 22. For example, it may be disposed near the exhaust port 53.

[0250] In the embodiment, the exhaust port 53 is disposed at a position close to the transfer space 12. However, this is not limited to this. The position of the exhaust port 53 may be changed as appropriate. In conjunction with the change in the position of the exhaust port 53, the position of the horizontal exhaust section 55 may also be changed as appropriate.

[0251] 15 and 16 are side views of a processing housing according to a modified embodiment. The same components as those in the embodiment are designated by the same reference numerals, and detailed descriptions thereof will be omitted. The vertical exhaust unit 60 and other components are omitted from FIG. 15.

[0252] 15. In a modified embodiment, the processing housing 22 includes an exhaust port 73 instead of the exhaust port 53. The exhaust port 73 is disposed at a position far from the transfer space 12. The exhaust port 73 is not disposed below the fan 41. The fan 41 and the exhaust port 73 are not aligned in the vertical direction Z when viewed from the side of the processing housing 22.

[0253] See FIG. 16. In a modified embodiment, the substrate processing apparatus 1 includes a horizontal exhaust section 75 instead of the horizontal exhaust section 55. The horizontal exhaust section 75 is connected to the exhaust port 73. The horizontal exhaust section 75 extends horizontally from the exhaust port 73. The horizontal exhaust section 75 extends to the vertical exhaust section 60. The vertical exhaust section 60 is connected to the horizontal exhaust section 75. A portion of the horizontal exhaust section 75 is disposed at a position far from the transport space 12. The horizontal exhaust section 75 does not have a portion close to the transport space 12. Although not shown in the figure, the entire horizontal exhaust section 75 does not overlap with the fan 41 in a plan view.

[0254] In the embodiment, the substrate processing apparatus 1 does not include an adjusting unit that adjusts the gas blown out from the filter 31. However, this is not limited to this. The substrate processing apparatus 1 may include an adjusting unit. The substrate processing apparatus 1 according to the modified embodiment will be described in detail below.

[0255] Fig. 17 is a plan view showing the inside of the processing casing 22 in the modified embodiment. Fig. 18 is a vertical cross-sectional view of the processing casing 22 in the modified embodiment. Note that the same components as those in the embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0256] First, the configuration of the processing housing 22, the substrate holder 26, the cup 29, the discharge unit 27, and the filter 31 will be described.

[0257] The processing housing 22 defines a processing space 81 inside the processing housing 22. The processing space 81 is an open space.

[0258] The processing housing 22 has a plurality of (for example, four) side walls 82. Each side wall 82 is disposed on a side of the processing housing 22. Each side wall 82 extends in the vertical direction Z.

[0259] When distinguishing between the side walls 82, they are referred to as side walls 82a, 82b, 82c, and 82d. The side walls 82a and 82c each extend in the width direction Y in a plan view. The side walls 82a and 82c face each other. The side walls 82b and 82d each extend in the front-rear direction X in a plan view. The side walls 82b and 82d face each other. The side wall 82b extends from the side wall 82a to the side wall 82c. The side wall 82d also extends from the side wall 82a to the side wall 82c. The side wall 82d is in contact with the transport space 12. The transport opening 25 is formed in the side wall 82d.

[0260] As described in the embodiment, the substrate processing apparatus 1 includes a substrate holding unit 26. The substrate holding unit 26 is disposed inside the processing housing 22. The substrate holding unit 26 holds a substrate W. Figures 17 and 18 show a central axis Q. The central axis Q passes through the center of the substrate W supported by the substrate holding unit 26 and is parallel to the vertical direction Z.

[0261] As described in the embodiment, the substrate processing apparatus 1 includes the cup 29. The cup 29 is installed inside the processing housing 22. The cup 29 is installed in the processing space 81. The cup 29 is disposed around the substrate holder 26. The cup 29 receives the processing liquid.

[0262] The cup 29 has a vertical wall portion 83, an inclined portion 84, and an upper opening 85. The vertical wall portion 83 extends in the vertical direction Z. The vertical wall portion 83 has a cylindrical shape centered on the central axis Q. The inclined portion 84 is connected to the vertical wall portion 83. The inclined portion 84 extends upward from the vertical wall portion 83 and approaches the central axis Q. The inclined portion 84 has a truncated cone shape centered on the central axis Q. The inclined portion 84 has an annular shape in a planar view. The upper opening 85 is positioned inside the inclined portion 84 in a planar view. The upper opening 85 is formed at approximately the same height as the upper end of the inclined portion 84. The upper opening 85 extends in the horizontal direction. The upper opening 85 has a circular shape centered on the central axis Q. The upper opening 85 is wider than the substrate W in a planar view. The upper opening 85 completely overlaps with the substrate W held by the substrate holding portion 26 in plan view.

[0263] As described in the embodiment, the substrate processing apparatus 1 includes one or more (e.g., three) discharge units 27. The discharge units 27 are installed inside the processing housing 22. The discharge units 27 are installed in the processing space 81. The discharge units 27 discharge a processing liquid onto the substrate W held by the substrate holder 26.

[0264] When distinguishing between the discharge units 27, they are referred to as discharge units 27a, 27b, and 27c. Each of the discharge units 27a-27c is, for example, a nozzle. Each of the discharge units 27a-27c is disposed at a position higher than the substrate W held by the substrate holder 26.

[0265] The substrate processing apparatus 1 includes one or more (for example, three) moving mechanisms 86. The moving mechanisms 86 move the discharge part 27.

[0266] When distinguishing between the individual moving mechanisms 86, they are referred to as moving mechanisms 86a, 86b, and 86c. The moving mechanism 86a is connected to the discharge portion 27a. The moving mechanism 86a moves the discharge portion 27a. The moving mechanism 86a rotates the discharge portion 27a around the rotation axis Ra. Similarly, the moving mechanisms 86b and 86c are connected to the discharge portions 27b and 27c, respectively. The moving mechanisms 86b and 86c move the discharge portions 27b and 27c, respectively. The moving mechanisms 86b and 86c rotate the discharge portions 27b and 27c around the rotation axes Rb and Rc, respectively. The rotation axes Ra-Rc are each parallel to the vertical direction Z. The rotation axes Ra-Rc pass through the moving mechanisms 86a-86c, respectively.

[0267] Discharge portion 27a has a base end portion 87a. Base end portion 87a is connected to moving mechanism 86a. Base end portion 87a is disposed outside cup 29 in plan view. Similarly, discharge portions 27b and 27c have base ends 87b and 87c, respectively. Base ends 87b and 87c are connected to moving mechanisms 86b and 86c, respectively. Base ends 87b and 87c are disposed outside cup 29 in plan view.

[0268] Discharge unit 27a has a tip 88a. Tip 88a is movable between a processing position and a standby position. Specifically, moving mechanism 86a moves tip 88a between the processing position and the standby position. Similarly, discharge units 27b and 27c have tip 88b and 88c, respectively. Tip 88b and 88c are movable between the processing position and the standby position. Specifically, moving mechanisms 86b and 86c move tip 88b and 88c between the processing position and the standby position, respectively.

[0269] 17 shows the tip portions 88a-88c positioned at the standby position using solid lines. When the tip portion 88a is positioned at the standby position, the tip portion 88a is positioned outward of the substrate W held by the substrate holding portion 26 in a planar view. In other words, when the tip portion 88a is positioned at the standby position, the tip portion 88a does not overlap with the substrate W held by the substrate holding portion 26 in a planar view. Similarly, when the tip portions 88b, 88c are positioned at their respective standby positions, the tip portions 88b, 88c are positioned outward of the substrate W held by the substrate holding portion 26 in a planar view. In other words, when the tip portions 88b, 88c are positioned at their respective standby positions, the tip portions 88b, 88c do not overlap with the substrate W held by the substrate holding portion 26 in a planar view.

[0270] Furthermore, when tip portion 88a is located at the standby position, tip portion 88a is located outside cup 29 in a plan view. Similarly, when tip portions 88b and 88c are located at their respective standby positions, tip portions 88b and 88c are located outside cup 29 in a plan view.

[0271] When tip 88a is in the standby position, discharge portion 27a extends along side wall 82a. Similarly, when tip portions 88b and 88c are in the standby position, discharge portions 27b and 27c extend along side walls 82b and 82c, respectively.

[0272] 17 shows tips 88a-88c positioned at the processing position by dashed lines. When tip 88a is positioned at the processing position, tip 88a overlaps, in a plan view, with the substrate W held by substrate holding part 26. Similarly, when tips 88b and 88c are positioned at their respective processing positions, tip 88b and 88c overlap, in a plan view, with the substrate W held by substrate holding part 26.

[0273] 18, the tip 88a has a discharge port 89a. The discharge port 89a is an opening for discharging the processing liquid. Similarly, the tip 88b has a discharge port 89b. The tip 88c also has a discharge port (not shown).

[0274] Hereinafter, when there is no need to distinguish between the tip portions 88a-88c, they will be referred to as tip portion 88.

[0275] As described in the embodiment, the substrate processing apparatus 1 includes the filter 31. The filter 31 is disposed in the upper part of the processing housing 22. The filter 31 is installed on the upper plate 24. The filter 31 is installed on the first upper plate portion 24a. The filter 31 blows out gas downward. The filter 31 blows out gas from the lower surface 31b of the filter 31.

[0276] The substrate processing apparatus 1 includes an adjusting unit 91. The adjusting unit 91 receives the gas (for example, air) blown out from the filter 31. The adjusting unit 91 adjusts the flow of the gas. The adjusting unit 91 blows out the gas downward.

[0277] The adjustment unit 91 is disposed below the filter 31 .

[0278] The adjustment unit 91 is disposed inside the processing housing 22. The adjustment unit 91 is disposed above the processing space 81. The adjustment unit 91 is in contact with the processing space 81. The adjustment unit 91 is disposed above the substrate holding unit 26. The adjustment unit 91 is disposed above the discharge unit 27. The adjustment unit 91 is disposed above the cup 29.

[0279] The adjusting section 91 includes an adjusting chamber 92. The adjusting chamber 92 is a space. The adjusting chamber 92 is disposed below the filter 31. The adjusting chamber 92 contacts the filter 31. The adjusting chamber 92 contacts the lower surface 31b of the filter 31.

[0280] The adjustment chamber 92 is disposed below the upper plate 24 of the processing housing 22. The adjustment chamber 92 contacts the upper plate 24. More specifically, the adjustment chamber 92 is disposed below the first upper plate portion 24a. The adjustment chamber 92 contacts the first upper plate portion 24a.

[0281] The adjusting chamber 92 extends in the horizontal direction. The length of the adjusting chamber 92 in the horizontal direction is longer than the length of the filter 31 in the horizontal direction.

[0282] The adjustment chamber 92 has a flat shape. The length of the adjustment chamber 92 in the vertical direction Z is sufficiently shorter than the length of the adjustment chamber 92 in the horizontal direction. The adjustment chamber 92 corresponds to a horizontal flow path for causing gas to flow radially from the filter 31.

[0283] The adjusting unit 91 includes a blow-out plate 93. The blow-out plate 93 is disposed below the adjusting chamber 92. The blow-out plate 93 contacts the adjusting chamber 92. The blow-out plate 93 contacts the processing space 81.

[0284] The blow-out plate 93 has a plate shape. The blow-out plate 93 extends horizontally. The blow-out plate 93 has an upper surface 93a and a lower surface 93b. The upper surface 93a contacts the conditioning chamber 92. The lower surface 93b contacts the processing space 81.

[0285] The length of the blow-out plate 93 in the horizontal direction is longer than the length of the filter 31. The length of the blow-out plate 93 in the horizontal direction is equal to or longer than the length of the adjustment chamber 92 in the horizontal direction.

[0286] The blow-out plate 93 has a plurality of blow-out holes 94. The blow-out holes 94 are formed in the blow-out plate 93. The blow-out holes 94 penetrate the blow-out plate 93. The blow-out holes 94 penetrate the blow-out plate 93 in the vertical direction Z. The blow-out holes 94 are small holes that are sufficiently smaller than the blow-out plate 93. The blow-out holes 94 are arranged closely together. The blow-out holes 94 connect the adjustment chamber 92 and the processing space 81 to each other. The lower surface 93b of the blow-out plate 93 corresponds to the blow-out surface of the adjustment unit 91.

[0287] The blow-out plate 93 is detachable from the housing 22 .

[0288] Specifically, the adjustment unit 91 includes a support pin 95. The support pin 95 is attached to the housing 22. The support pin 95 protrudes, for example, from the side wall 82 of the housing 22. The support pin 95 extends horizontally. The support pin 95 supports the blow-out plate 93. The blow-out plate 93 is placed on the support pin 95. A lower surface 93b of the blow-out plate 93 contacts the support pin 95.

[0289] When the support pins 95 support the blow-out plate 93, the support pins 95 prohibit the blow-out plate 93 from moving downward relative to the support pins 95. When the support pins 95 support the blow-out plate 93, the support pins 95 allow the blow-out plate 93 to move upward relative to the support pins 95 (processing housing 22). Therefore, the blow-out plate 93 can be easily attached to and detached from the housing 22.

[0290] The adjustment unit 91 includes a blocking wall 96. The blocking wall 96 closes the side of the adjustment chamber 92. The blocking wall 96 prevents gas from flowing out of the adjustment chamber 92 through the side of the adjustment unit 91 from the adjustment chamber 92 to the outside of the adjustment chamber 92.

[0291] The blocking wall 96 is disposed at the peripheral edge of the adjustment chamber 92. The blocking wall 96 is disposed between the upper plate 24 and the blow-out plate 93. The blocking wall 96 extends in the vertical direction Z. For example, the blocking wall 96 is supported on the upper plate 24 (specifically, the first upper plate portion 24a). The blocking wall 96 extends downward from the upper plate 24 (specifically, the first upper plate portion 24a). Alternatively, the blocking wall 96 is supported on the blow-out plate 93. The blocking wall 96 extends upward from the blow-out plate 93.

[0292] The blocking wall 96 allows the blow-out plate 93 to move slightly upward relative to the processing housing 22. Therefore, the blow-out plate 93 can be easily attached to the housing 22. The blow-out plate 93 can be easily removed from the housing 22.

[0293] Specifically, a clearance is provided either between the blocking wall 96 and the upper plate 24 or between the blocking wall 96 and the blow-out plate 93. The clearance is a space.

[0294] The clearance is small enough to substantially prevent gas from escaping through the clearance from the adjustment chamber 92. The clearance is, for example, 1 mm.

[0295] As described above, the adjustment chamber 92 is defined by the filter 31, the upper plate 24 (first upper plate portion 24a), the blow-out plate 93, and the blocking wall 96.

[0296] The adjustment unit 91 includes a guide member 97. The guide member 97 is provided in the adjustment chamber 92. The guide member 97 is disposed between the filter 31 and the blocking wall 96. The guide member 97 guides gas downward in the adjustment chamber 92. The guide member 97 forms a relatively strong downward airflow in the vicinity of the guide member 97.

[0297] The guide member 97 is disposed at the upper part of the adjusting chamber 92. The guide member 97 is not disposed at the lower part of the adjusting chamber 92. The guide member 97 is disposed only at the upper part of the adjusting chamber 92. The guide member 97 extends in the vertical direction Z. The guide member 97 blocks the upper part of the adjusting chamber 92. The guide member 97 prohibits gas from flowing horizontally in the upper part of the adjusting chamber 92. The guide member 97 opens the lower part of the adjusting chamber 92. The guide member 97 opens the lower part of the adjusting chamber 92 in the horizontal direction. The guide member 97 allows gas to flow horizontally in the lower part of the adjusting chamber 92. Therefore, the guide member 97 can suitably guide gas downward in the adjusting chamber 92. Furthermore, the gas flows smoothly in the lower part of the adjusting chamber 92. The gas in the adjusting chamber 92 flows smoothly along the upper surface 93a of the blow-out plate 93. The gas in the adjustment chamber 92 does not stagnate in the vicinity of the upper surface 93 a of the blow-out plate 93 .

[0298] Specifically, the guide member 97 has a generally plate shape. The guide member 97 is supported by the upper plate 24 (specifically, the first upper plate portion 24a). The guide member 97 contacts the upper plate 24 (specifically, the first upper plate portion 24a). The guide member 97 extends downward from the upper plate 24 (specifically, the first upper plate portion 24a). A lower portion of the guide member 97 is higher than the blowout plate 93. The guide member 97 is spaced apart from the blowout plate 93. The guide member 97 does not contact the blowout plate 93.

[0299] The length of the guide member 97 in the vertical direction Z is shorter than the length of the adjustment chamber 92 in the vertical direction Z. For example, the length of the guide member 97 in the vertical direction Z is less than half the length of the adjustment chamber 92 in the vertical direction Z.

[0300] The blow-out plate 93 and the guide member 97 form a narrow passage 98 between the blow-out plate 93 and the guide member 97. The narrow passage 98 is a space. The narrow passage 98 is located below the guide member 97 and above the blow-out plate 93. Gas can pass through the narrow passage 98. For example, the length of the narrow passage 98 in the vertical direction Z is more than half the length of the adjustment chamber 92 in the vertical direction Z. For example, the length of the narrow passage 98 in the vertical direction Z is 4 mm or more.

[0301] Fig. 19 is a plan view of an adjustment section 91 in a modified embodiment. For convenience, Fig. 19 shows the blow-out plate 93, the blocking wall 96, and the guide member 97 by hatching.

[0302] The blow-out plate 93 includes a first member 101 and a second member 102. The first member 101 and the second member 102 are separable from each other. The blow-out plate 93 can be divided into the first member 101 and the second member 102. The first member 101 and the second member 102 are aligned in the horizontal direction. The second member 102 is adjacent to the first member 101. In a plan view, the second member 102 does not substantially overlap with the first member 101.

[0303] 19, the filter 31 is indicated by a dashed line. In plan view, the filter 31 has a substantially rectangular shape.

[0304] In a plan view, the blow-out plate 93 is larger than the filter 31. In a plan view, the blow-out plate 93 overlaps the entire filter 31. In a plan view, the first member 101 overlaps the entire filter 31. In a plan view, the entire second member 102 is disposed outside the filter 31. In a plan view, the second member 102 does not overlap the filter 31.

[0305] In a plan view, the entire blocking wall 96 is disposed outside the filter 31. In a plan view, the blocking wall 96 does not overlap with the filter 31. In a plan view, the blocking wall 96 has a closed ring shape. In a plan view, the blocking wall 96 surrounds the periphery of the filter 31.

[0306] The adjusting chamber 92 is an area inside the blocking wall 96 in plan view. In plan view, the adjusting chamber 92 is larger than the filter 31. In plan view, the adjusting chamber 92 overlaps the entire filter 31.

[0307] In a plan view, the blow-out plate 93 overlaps the entire blocking wall 96. In a plan view, the blow-out plate 93 overlaps the entire adjusting chamber 92. In a plan view, the blow-out plate 93 is equal to or larger than the adjusting chamber 92. In a plan view, the blow-out plate 93 overlaps the entire guide member 97.

[0308] In a plan view, the entire guide member 97 is disposed outside the filter 31. In a plan view, the guide member 97 does not overlap with the filter 31. In a plan view, the entire guide member 97 is disposed inside the blocking wall 96. In a plan view, the guide member 97 has an open ring shape. The guide member 97 has a first end connected to the blocking wall 96 and a second end connected to the blocking wall 96.

[0309] In plan view, it is preferable that the distance between the filter 31 and the guide member 97 is approximately equal to the distance between the guide member 97 and the blocking wall 96 .

[0310] The blocking wall 96 has blocking portions 96a, 96b, 96c, and 96d. The blocking portions 96a-96d are each a part of the blocking wall 96. The blocking portions 96a-96d each extend linearly in a plan view. The blocking portions 96a and 96c each extend in the width direction Y. The blocking portions 96b and 96d each extend in the front-to-rear direction X. The blocking portion 96a is adjacent to the side wall 82a in a plan view. Similarly, the blocking portions 96b-96d are adjacent to the side walls 82b-82d in a plan view.

[0311] The guide member 97 has guide portions 97a, 97b, and 97c. The guide portions 97a, 97b, and 97c are each part of the guide member 97. The guide portions 97a, 97b, and 97c each extend linearly in a plan view. The guide portions 97a and 97c each extend in the width direction Y. The guide portion 97b extends in the front-rear direction X.

[0312] The guide portion 97a is disposed between the blocking portion 96a and the filter 31. The guide portion 97b is disposed between the blocking portion 96b and the filter 31. The guide portion 97c is disposed between the blocking portion 96c and the filter 31. The blocking portion 97a, the guide portion 97a, the filter 31, the guide portion 97c, and the blocking portion 96c are arranged in this order in the front-to-rear direction X. The blocking portion 96b, the guide portion 97b, the filter 31, and the blocking portion 96d are arranged in this order in the width direction Y.

[0313] FIG. 19 shows distances Da-Dc and distances Ea-Ec. Distance Da is the separation distance between filter 31 and guide portion 97a. Distance Db is the separation distance between filter 31 and guide portion 97b. Distance Dc is the separation distance between filter 31 and guide portion 97c. Distance Ea is the separation distance between guide portion 97a and blocking portion 96a. Distance Eb is the separation distance between guide portion 97b and blocking portion 96b. Distance Ec is the separation distance between guide portion 97b and blocking portion 96c.

[0314] It is preferable that the distance Ea is approximately equal to the distance Da, the distance Eb is approximately equal to the distance Db, and the distance Ec is approximately equal to the distance Dc.

[0315] It is preferable that the distance Db is approximately equal to the distance Da. It is preferable that the distance Dc is approximately equal to the distance Da.

[0316] It is preferable that the distance Eb is approximately equal to the distance Ea, and it is preferable that the distance Ec is approximately equal to the distance Ea.

[0317] Fig. 20 is a plan view showing the inside of the processing housing 22 in the modified embodiment. In Fig. 20, each of the tip portions 88a-88c is located at a standby position. In Fig. 20, the filter 31, the blocking wall 96, and the guide member 97 are shown by dashed lines.

[0318] In a plan view, the filter 31 overlaps with the substrate W held by the substrate holding portion 26. In a plan view, the filter 31 overlaps with a majority of the substrate W held by the substrate holding portion 26. In a plan view, the filter 31 overlaps with the cup 29. In a plan view, the filter 31 overlaps with the inclined portion 84. In a plan view, the filter 31 overlaps with the upper opening 85. When the tip portion 88a is located in the standby position, the tip portion 88a is located outward from the filter 31 in a plan view. When the tip portions 88b, 88c are located in the standby positions, the tip portions 88b, 88c are each located outward from the filter 31 in a plan view.

[0319] The entire blocking wall 96 is disposed outward from the substrate W held by the substrate holding portion 26 in a plan view. The blocking wall 96 does not overlap with the substrate W held by the substrate holding portion 26 in a plan view. The blocking wall 96 surrounds the periphery of the substrate W held by the substrate holding portion 26 in a plan view. At least a portion of the blocking wall 96 is disposed outward from the cup 29 in a plan view. At least a portion of the blocking wall 96 is disposed outward from the inclined portion 84 in a plan view. The entire blocking wall 96 is disposed outward from the upper opening 85 in a plan view. When the tip portion 88a is located in the standby position, the tip portion 88a is disposed outward from the blocking wall 96 in a plan view. When the tip portion 88a is located in the standby position, a portion of the discharge portion 27a is disposed inside the blocking wall 96 in a plan view. When the tip portion 88b is located in the standby position, the tip portion 88b is disposed inside the blocking wall 96 in a plan view. When tip portion 88b is located in the standby position, the entirety of discharge portion 27b is located inside blocking wall 96 in a plan view. When tip portion 88c is located in the standby position, a portion of tip portion 88c is located outside blocking wall 96 in a plan view. When tip portion 88c is located in the standby position, a portion of discharge portion 27c is located inside blocking wall 96 in a plan view.

[0320] The entire guide member 97 is disposed, in plan view, outside the substrate W held by the substrate holding portion 26. The guide member 97 does not overlap the substrate W held by the substrate holding portion 26, in plan view.

[0321] At least a portion of the guide member 97 overlaps with the cup 29 in a plan view. In this modified embodiment, a portion of the guide member 97 overlaps with the cup 29 in a plan view. Another portion of the guide member 97 is disposed outward from the cup 29 in a plan view. However, this is not limited to this. The entire guide member 97 may overlap with the cup 29 in a plan view. At least a portion of the guide member 97 overlaps with the inclined portion 84 in a plan view. In this modified embodiment, a portion of the guide member 97 overlaps with the inclined portion 84 in a plan view. Another portion of the guide member 97 is disposed outward from the inclined portion 84 in a plan view. However, this is not limited to this. The entire guide member 97 may overlap with the inclined portion 84 in a plan view. The entire guide member 97 is disposed outward from the upper opening 85 in a plan view. The guide member 97 does not overlap with the upper opening 85 in a plan view.

[0322] When tip portion 88 is located at the standby position, at least a portion of discharge portion 27 is disposed outside guide member 97 in a plan view. Specifically, when tip portion 88a is located at the standby position, the entirety of discharge portion 27a is disposed outside guide member 97 in a plan view. When tip portion 88b is located at the standby position, the entirety of discharge portion 27b is disposed outside guide member 97 in a plan view. When tip portion 88c is located at the standby position, a portion of discharge portion 27c is disposed outside guide member 97 in a plan view.

[0323] When tip portion 88 is located at the standby position, tip portion 88 is disposed outward from guide member 97 in a plan view. Specifically, when tip portion 88a is located at the standby position, the entire tip portion 88a is disposed outward from guide member 97 in a plan view. Similarly, when tip portions 88b, 88c are located at their respective standby positions, tip portions 88b, 88c are disposed outward from guide member 97 in a plan view.

[0324] When the tip end 88a is located at the standby position, the guide portion 97a is disposed between the tip end 88a and the substrate W held by the substrate holding portion 26 in a plan view. When the tip end 88a is located at the standby position, the guide portion 97a extends to separate the tip end 88a and the substrate W held by the substrate holding portion 26 in a plan view. Similarly, when the tip ends 88b, 88c are located at the standby position, the guide portions 97b, 97c are disposed between the tip ends 88b, 88c and the substrate W held by the substrate holding portion 26, respectively, in a plan view. When the tip ends 88b, 88c are located at the standby position, the guide portions 97b, 97c extend to separate the tip ends 88b, 88c and the substrate W held by the substrate holding portion 26, respectively, in a plan view.

[0325] Fig. 21 is a vertical cross-sectional view of a processing housing 22 in a modified embodiment, in which the flow of gas is schematically shown by dashed lines.

[0326] The filter 31 blows out the gas downward. The adjustment unit 91 receives the gas blown out from the filter 31. The adjustment unit 91 blows out the gas downward. Specifically, the adjustment chamber 92 receives the gas from the filter 31. The blow-out plate 93 blows out the gas into the processing space 81.

[0327] 22 is a plan view of the blow-out plate 93 in a modified embodiment. For convenience, a core zone 103 and a peripheral zone 104 are defined for the blow-out plate 93. The core zone 103 is a portion of the blow-out plate 83 located below the filter 31. In other words, the core zone 103 is a portion of the blow-out plate 83 that overlaps with the filter 31 in a plan view. The peripheral zone 104 is a portion of the blow-out plate 83 located outward from the core zone 103 and inward from the blocking wall 96.

[0328] The peripheral zone 104 is defined by a guide zone 104g, a first zone 104a, and a second zone 104b. The guide zone 104g is a portion of the peripheral zone 104 located below the guide member 97. The guide zone 104g may further include a portion of the peripheral zone 104 located near the guide member 97 in a plan view. The first zone 104a is a portion of the peripheral zone 104 located inside the guide zone 104g. The second zone 104b is a portion of the peripheral zone 104 located outside the guide zone 104g.

[0329] Refer to Figure 21. For convenience, the airflows blown out from the blowout plate 93 are defined as a core blowout flow G0, a first blowout flow G1, a second blowout flow G2, and a third blowout flow G3. The core blowout flow G0 is an airflow blown out from the core zone 103. The first blowout flow G1 is an airflow blown out from the first zone 104a. The second blowout flow G2 is an airflow blown out from the second zone 104b. The third blowout flow G3 is an airflow blown out from the guide zone 104g.

[0330] For convenience, the processing space 81 is defined as a core area 107, a first area 108, and a second area 109. The core area 107 is the portion of the processing space 81 located directly below the core zone 103. The first area 108 is the portion of the processing space 81 located directly below the first zone 104a. The second area 109 is the portion of the processing space 81 located directly below the second zone 104b.

[0331] The gas flow in the conditioning chamber 92 and the processing space 81 will now be described. In the conditioning chamber 92, the gas starts from the filter 31 and reaches the blow-out plate 83. The airflow in the conditioning chamber 92 is classified into a straight flow and a curved flow. The straight flow flows straight downward without turning horizontally. The straight flow reaches the core zone 103. The curved flow turns horizontally and then turns downward to reach the blow-out plate 83. The curved flow reaches the peripheral zone 104.

[0332] The curved flows are further classified into first to third air flows. The first flow bends downward before reaching the guide member 97. The first flow reaches the first zone 104a. The second flow bends downward after passing through the guide member 97 (narrow passage 98). The second flow reaches the second zone 104b. The third flow bends downward near the guide member 97. The third flow reaches the guide zone 104g. The third flow is stronger than the first flow. The third flow is stronger than the second flow.

[0333] The core outlet flow G0 flows downward from the core zone 103. The core outlet flow G0 enters the core area 107. The first outlet flow G1 flows downward from the first zone 104a. The first outlet flow G1 enters the first area 108. The second outlet flow G2 flows downward from the second zone 104b. The second outlet flow G2 enters the second area 109. The third outlet flow G3 flows downward from the guide zone 104g. The third outlet flow G3 enters between the first area 108 and the second area 109.

[0334] The third blown-out flow G3 is stronger than the first blown-out flow G1. The speed of the third blown-out flow G3 is greater than the speed of the first blown-out flow G1. The third blown-out flow G3 is stronger than the second blown-out flow G2. The speed of the third blown-out flow G3 is greater than the speed of the second blown-out flow G2. The first blown-out flow G1 is located inside the third blown-out flow G3. The second blown-out flow G2 is located outside the third blown-out flow G3. Therefore, the third blown-out flow G3 branches into an inner flow G3a and an outer flow G3b.

[0335] The internal flow G3a flows downward and inward. As the internal flow G3a flows downward, it approaches the central axis Q. As the internal flow G3a flows downward, it enters the first area 108. Due to the internal flow G3a, the first blown flow G1 also flows downward and approaches the central axis Q. The first blown flow G1 enters the core area 107 from the first area 108. The core blown flow G0 and the first blown flow G1 pass through the upper opening 85. The core blown flow G0 and the first blown flow G1 are supplied to the substrate W held by the substrate holding part 26. Furthermore, the internal flow G3a may also enter the core area 107 from the first area 108. The internal flow G3a may also pass through the upper opening 85.

[0336] The external flow G3b flows downward and outward. As it flows downward, the external flow G3b moves away from the central axis Q. As it flows downward, the external flow G3b enters the second area 109. The external flow G3b causes the second blown flow G2 to also flow downward and move away from the central axis Q. The external flow G3b prevents the atmosphere in the second area 109 from reaching the first area 108. The external flow G3b prevents the atmosphere in the second area 109 from passing through the upper opening 85. The external flow G3b prevents the atmosphere in the second area 109 from reaching the substrate W held by the substrate holder 26. Thus, the external flow G3b protects the substrate W held by the substrate holder 26 from the atmosphere in the second area 109. The external flow G3b keeps the substrate W held by the substrate holder 26 clean.

[0337] The effects of the modified embodiment will be described. The filter 31 blows out gas downward. The substrate processing apparatus 1 includes an adjustment unit 91. The adjustment unit 91 is installed inside the processing housing 22. The adjustment unit 91 includes an adjustment chamber 92. The adjustment chamber 92 is disposed below the filter 31. Therefore, the adjustment unit 91 can suitably receive the gas blown out from the filter 31 in the adjustment chamber 92.

[0338] The adjustment unit 91 includes a blow-out plate 93. The blow-out plate 93 is disposed below the adjustment chamber 92. The blow-out plate 93 extends horizontally. The blow-out plate 93 has a plurality of blow-out holes 94. Therefore, the adjustment unit 91 can suitably blow out gas downward from the blow-out plate 93 through the blow-out holes 94.

[0339] The substrate holding unit 26 is installed inside the processing housing 22. The substrate holding unit 26 is disposed below the adjustment unit 91. The substrate holding unit 26 holds the substrate W. Therefore, the adjustment unit 91 can suitably supply gas to the substrate W held by the substrate holding unit 26. Specifically, the adjustment unit 91 can form a downflow of gas around the substrate W held by the substrate holding unit 26.

[0340] The adjustment chamber 92 extends horizontally. The adjustment chamber 92 is larger than the filter 31 in a plan view. The adjustment unit 91 includes a guide member 97. The guide member 97 is provided in the adjustment chamber 92. The guide member 97 guides gas downward in the adjustment chamber 92. Therefore, the guide member 97 prevents the blow-out plate 93 from including a poor blow-out portion. A poor blow-out portion is a portion of the blow-out plate 93 that does not substantially blow out gas. In other words, the blow-out plate 93 does not include an outlet 94 that does not substantially blow out gas. All of the blow-out holes 94 blow out gas. In this way, the guide member 97 adjusts the flow of gas in the adjustment chamber 92.

[0341] The core zone 103 is close to the filter 31. The peripheral zone 104 is far from the filter 31. Therefore, discharge defects are more likely to occur in the peripheral zone 104 than in the core zone 103. The entire guide member 97 is disposed outside the filter 31 in a plan view. That is, the entire guide member 97 is disposed above the peripheral zone 104. Therefore, the guide member 97 prevents the peripheral zone 104 from including discharge defects. Specifically, the guide member 97 prevents the velocity of the first outlet flow G1 from becoming substantially zero. The guide member 97 prevents the velocity of the second outlet flow G2 from becoming substantially zero. The guide member 97 prevents the velocity of the third outlet flow G3 from becoming substantially zero.

[0342] The entire guide member 97 is disposed outward of the substrate W held by the substrate holding unit 26 in a plan view. Therefore, the guide zone 104g is disposed outward of the substrate W held by the substrate holding unit 26 in a plan view. The third blown air G3 blown out from the guide zone 104g is relatively strong. Therefore, the third blown air G3 protects the substrate W held by the substrate holding unit 26 from the atmosphere outside the third blown air G3. Therefore, the third blown air G3 keeps the substrate W held by the substrate holding unit 26 clean. As a result, the substrate processing apparatus 1 can process the substrate W held by the substrate holding unit 26 with good quality.

[0343] Furthermore, the third blown airflow G3 increases the amount of gas supplied to the substrate W held by the substrate holding part 26. Therefore, the substrate processing apparatus 1 can process the substrate W held by the substrate holding part 26 with good quality.

[0344] The guide member 97 is disposed in the upper part of the adjustment chamber 92. The guide member 97 extends in the vertical direction Z. Therefore, the guide member 97 can suitably guide the gas downward in the adjustment chamber 92.

[0345] The guide member 97 is disposed only in the upper part of the adjusting chamber 92. In other words, the guide member 97 is not disposed in the lower part of the adjusting chamber 92. The guide member 97 opens the lower part of the adjusting chamber 92. Therefore, the gas flows smoothly through the lower part of the adjusting chamber 92. In other words, the gas does not stagnate in the lower part of the adjusting chamber 92. Therefore, the gas in the adjusting chamber 92 flows smoothly along the blow-out plate 93. As a result, the guide member 97 more effectively prevents the blow-out plate 93 from including poor blow-out portions.

[0346] The guide member 97 is disposed above the adjustment chamber 92. That is, the guide member 97 does not open the top of the adjustment chamber 92. Therefore, when the gas passes through the guide member 97 (narrow passage 98), the gas does not bend upward. Therefore, the gas flows smoothly through the lower part of the adjustment chamber 92. As a result, the guide member 92 can more effectively prevent the blow-out plate 93 from including poor blow-out portions.

[0347] The distance Ea is approximately equal to the distance Da. Therefore, the difference in size between the first zone 104a and the second zone 104b is small. Therefore, the difference in speed between the first blown-out flow G1 and the second blown-out flow G2 is small. Therefore, the guide member 97 can effectively prevent the peripheral zone 104 from including a poorly blown-out portion. Similarly, the distance Eb is approximately equal to the distance Db. The distance Ec is approximately equal to the distance Dc. Therefore, the guide member 97 can even more effectively prevent the peripheral zone 104 from including a poorly blown-out portion.

[0348] Distance Eb is approximately equal to distance Ea. Therefore, the speed of the first outlet flow G1 does not vary excessively across the first zone 104a. Therefore, the guide member 97 can effectively prevent the first zone 103 from including a poorly-air-out portion. Similarly, distance Ec is approximately equal to distance Ea. Therefore, the guide member 97 can even more effectively prevent the first zone 104a from including a poorly-air-out portion.

[0349] It is preferable that the distance Db is approximately equal to the distance Da. Therefore, the speed of the second outlet flow G2 does not vary excessively across the second zone 104b. Therefore, the guide member 97 can suitably prevent the second zone 104b from including a poorly-air-out portion. Similarly, the distance Dc is approximately equal to the distance Da. Therefore, the guide member 97 can even more suitably prevent the second zone 104b from including a poorly-air-out portion.

[0350] The substrate processing apparatus 1 includes a blocking wall 96. The blocking wall 96 closes the side of the adjustment chamber 92. The blocking wall 96 prevents gas from flowing out of the adjustment chamber 92 through the side of the adjustment chamber 92. Therefore, all of the gas in the adjustment chamber 92 is discharged from the blow-out plate 93 through the blow-out holes 94. Therefore, the blocking wall 96 further prevents the blow-out plate 93 from including defective blow-out portions.

[0351] The substrate processing apparatus 1 includes a discharge unit 27. The discharge unit 27 is installed inside the processing housing 22. The discharge unit 27 discharges a processing liquid onto the substrate W held by the substrate holding unit 26. The discharge unit 27 includes a tip portion 88 that is movable between a discharge position and a standby position. When the tip portion 88 is located at the standby position, the tip portion 88 is located outward from the substrate W held by the substrate holding unit 26 in a planar view. When the tip portion 88 is located at the standby position, the guide member 97 is located between the tip portion 88 and the substrate W held by the substrate holding unit 26 in a planar view. Therefore, when the tip portion 88 is located at the standby position, the guide zone 104g is located between the tip portion 88 and the substrate W held by the substrate holding unit 26 in a planar view. When the tip portion 88 is located at the standby position, the third blown air G3 is blown out toward between the tip portion 88 and the substrate W held by the substrate holding unit 26. Therefore, when the tip portion 88 is located at the standby position, the third blown air flow G3 protects the substrate W held by the substrate holding portion 26 from the tip portion 88. For example, the third blown air flow G3 prevents the atmosphere near the tip portion 88 from reaching the substrate W held by the substrate holding portion 26. For example, the third blown air flow G3 prevents particles from moving from the tip portion 88 to the substrate W held by the substrate holding portion 26. Therefore, the third blown air flow G3 keeps the substrate W held by the substrate holding portion 26 even cleaner. As a result, the substrate processing apparatus 1 can process the substrate W held by the substrate holding portion 26 with good quality.

[0352] The substrate processing apparatus 1 includes a cup 29. The cup 29 is installed inside the processing housing 22. The cup 29 is arranged around the substrate holding part 26. The cup 29 receives the processing liquid. At least a portion of the guide member 97 overlaps with the cup 29 in a plan view. Therefore, at least a portion of the guide zone 104g overlaps with the cup 29 in a plan view. At least a portion of the third blown air G3 is blown out toward the cup 29. Therefore, the third blown air G3 effectively protects the substrate W held by the substrate holding part 26. Therefore, the third blown air G3 effectively keeps the substrate W held by the substrate holding part 26 clean. As a result, the substrate processing apparatus 1 can process the substrate W held by the substrate holding part 26 with good quality.

[0353] For example, the third blown flow G3 effectively prevents gas from flowing along the upper surface of the inclined portion 84 toward the central axis Q. For example, the third blown flow G3 effectively prevents gas from flowing inward along the upper surface of the inclined portion 84 of the cup 29. For example, the third blown flow G3 effectively prevents gas from passing near the upper surface of the inclined portion 84 and entering the upper opening 85. Therefore, the third blown flow G3 effectively protects the substrate W held by the substrate holding unit 26 from the upper surface of the inclined portion 84. For example, the third blown flow G3 prevents the atmosphere near the upper surface of the inclined portion 84 from reaching the substrate W held by the substrate holding unit 26. For example, the third blown flow G3 prevents particles from moving from the upper surface of the inclined portion 84 to the substrate W held by the substrate holding unit 26.

[0354] The blow-out plate 93 is detachable from the processing housing 22. The blow-out plate 93 can be easily maintained.

[0355] The blow-out plate 93 includes a first member 101 and a second member 102. The second member 102 is adjacent to the first member 101. The first member 101 is smaller than the entire blow-out plate 93. This allows for easier maintenance of the first member 101. The second member 102 is smaller than the entire blow-out plate 93. This allows for easier maintenance of the second member 102. This allows for easier maintenance of the blow-out plate 93.

[0356] In a plan view, the first member 101 overlaps the entire filter 31. In a plan view, the entire second member 102 is disposed outside the filter 31. Therefore, by removing only the first member 101 from the processing housing 22, the filter 31 can be preferably maintained. The filter 31 can be preferably maintained without removing the second member 102 from the processing housing 22.

[0357] The embodiment and each modified embodiment may be further modified as appropriate by replacing or combining each configuration with the configuration of another modified embodiment. [Explanation of symbols]

[0358] 1... Substrate processing equipment 11 ... Processing block 12A, 12B, 12...Transport space 13A, 13B, 13 ... conveying mechanism 22... Processing enclosure 22A: First processing enclosure 22B: Second processing enclosure 23t ... Top of processing enclosure 23b ... Lower end of processing housing 24 ... Upper board 24a … First upper plate 24b ... Second upper plate 26 … Board holding part 27 … Discharge part 29 … cups 30...Air supply unit 30A...First air supply unit 31 … Filter 31a … Top of filter 31b … Underside of filter (blowout surface of filter) 32... duct 33 … 1st horizontal section 34... Flat part 34a ... Upper surface of flat part 34b ... Lower surface of flat part 34c ... Flat opening 35... Periphery of flat part 36 ... outer groove 37, 37a, 37b, 37c ... Baffle plates 38 ... vertical section 39 … 2nd horizontal section 41... Fan 51A, 51B, 51C, 51D, 51 … Piping space 53, 73 ... Exhaust port 55, 75 ... Horizontal exhaust section 56...Switching mechanism 60 … Vertical exhaust section 61 ... First vertical exhaust section 62 ... Second vertical exhaust section 63 ... Third vertical exhaust section 65 ... Exhaust damper 67... Pressure sensor 69 ... Control section 88, 88a, 88b, 88c ... Tip of the discharge part 91 … Adjustment section 92 … Control room 93 ... Outlet plate 94…Blowout hole 95 ... Support pin 96... Barrier 97 ... Guide member 101 ... First member 102 ... Second member 104g ... Guidance zone G3 … 3rd outlet flow G3a ... Internal flow G3b … Outflow L1: Vertical length of the filter L2: Overall length of the flat section and filter in the vertical direction L3: Length of the flat part in the vertical direction L4: Vertical length of outer groove L5: The length of the air supply unit that extends upward from the processing housing S...recessed space W: Substrate X…Anteroposterior direction (first direction) Y: Width direction (second direction) Z: vertical direction

Claims

1. A substrate processing apparatus, a first processing housing for processing substrates therein; a first gas supply unit that supplies gas to the inside of the first processing housing; Equipped with The first air supply unit is a filter disposed in an upper portion of the first processing housing and blowing out gas into the first processing housing; a duct provided outside the first processing housing and connected to the filter; a fan provided outside the first processing housing and connected to the duct; Equipped with the fan is disposed at a position not overlapping with the filter in a plan view, At least a part of the fan is disposed at the same height as the first processing casing, The duct is a first horizontal portion extending horizontally from the filter; a vertical portion extending downward from the first horizontal portion; a second horizontal portion extending horizontally from the vertical portion to the fan and positioned lower than the first horizontal portion; Equipped with the first processing housing includes a top plate; The upper plate is a first upper plate portion on which the filter is installed; a second upper plate portion disposed below the vertical portion and the second horizontal portion; Equipped with The second upper plate portion is lower than the first upper plate portion. Substrate processing equipment.

2. A substrate processing apparatus, a first processing housing for processing substrates therein; a first gas supply unit that supplies gas to the inside of the first processing housing; Equipped with The first air supply unit is a filter disposed in an upper portion of the first processing housing and blowing out gas into the first processing housing; a duct provided outside the first processing housing and connected to the filter; a fan provided outside the first processing housing and connected to the duct; Equipped with the fan is disposed at a position not overlapping with the filter in a plan view, At least a part of the fan is disposed at the same height as the first processing casing, The duct is a flat portion disposed above the filter, extending horizontally, and blowing gas downward; an outer groove portion connected to a peripheral edge portion of the flat portion and configured to send gas to the flat portion; Equipped with The length of the outer groove portion in the vertical direction is greater than the length of the flat portion in the vertical direction. Substrate processing equipment.

3. In the substrate processing apparatus according to claim 2, The length of the flat portion in the vertical direction is smaller than the length of the filter in the vertical direction. Substrate processing equipment.

4. In the substrate processing apparatus according to claim 2 or 3, The overall length of the flat portion and the filter in the vertical direction is less than twice the length of the filter in the vertical direction. Substrate processing equipment.

5. In the substrate processing apparatus according to any one of claims 2 to 4, The height position of the upper surface of the flat portion corresponds to the upper end of the duct. Substrate processing equipment.

6. In the substrate processing apparatus according to any one of claims 2 to 5, The outer groove portion has a ring shape surrounding the flat portion in a plan view. Substrate processing equipment.

7. A substrate processing apparatus according to any one of claims 2 to 6, the outer groove portion extends downward from the peripheral edge portion of the flat portion, At least a part of the outer groove portion overlaps with the filter in a front view. Substrate processing equipment.

8. A substrate processing apparatus according to any one of claims 2 to 7, The duct is provided with a baffle plate that is installed in the outer groove portion and guides a portion of the gas flowing through the outer groove portion to the flat portion. Substrate processing equipment.

9. In the substrate processing apparatus according to claim 8, The baffle plate is oriented in a direction intersecting the direction in which the outer groove portion extends. Substrate processing equipment.

10. A substrate processing apparatus, a first processing housing for processing substrates therein; a first gas supply unit that supplies gas to the inside of the first processing housing; Equipped with The first air supply unit is a filter disposed in an upper portion of the first processing housing and blowing out gas into the first processing housing; a duct provided outside the first processing housing and connected to the filter; a fan provided outside the first processing housing and connected to the duct; Equipped with the fan is disposed at a position not overlapping with the filter in a plan view, At least a part of the fan is disposed at the same height as the first processing casing, The substrate processing apparatus includes: a transport space extending in a horizontal first direction and adjacent to the first processing housing; a transport mechanism installed in the transport space and configured to transport a substrate into the first processing housing; a piping space adjacent to the first processing housing; Equipped with the first processing casing and the transport space are aligned in a horizontal second direction perpendicular to the first direction in a plan view, the first processing casing and the piping space are aligned in the first direction, The fan is open to the piping space, The fan sends the gas in the piping space to the filter. Substrate processing equipment.

11. The substrate processing apparatus according to claim 10, The first processing housing includes: an exhaust port formed at a position facing the piping space; Equipped with The fan is positioned above the exhaust port. Substrate processing equipment.

12. The substrate processing apparatus according to claim 11, The substrate processing apparatus includes: a horizontal exhaust portion provided in the piping space, connected to the exhaust port, and extending in a horizontal direction; a vertical exhaust section provided in the piping space, connected to the horizontal exhaust section, and extending in a vertical direction; Equipped with The fan is disposed at a position higher than the horizontal exhaust section, The fan and the vertical exhaust unit are aligned in the second direction when viewed from the first direction. Substrate processing equipment.

13. The substrate processing apparatus according to claim 12, The vertical exhaust section is a first vertical exhaust pipe extending in a vertical direction; a second vertical exhaust pipe extending in a vertical direction; Equipped with The horizontal exhaust section is a switching mechanism that switches the exhaust path of the first processing housing to one of the first vertical exhaust pipe and the second vertical exhaust pipe; Equipped with The fan, the first vertical exhaust pipe, and the second vertical exhaust pipe are aligned in the second direction when viewed from the first direction. Substrate processing equipment.

14. A substrate processing apparatus, a first processing housing for processing substrates therein; a first gas supply unit that supplies gas to the inside of the first processing housing; Equipped with The first air supply unit is a filter disposed in an upper portion of the first processing housing and blowing out gas into the first processing housing; a duct provided outside the first processing housing and connected to the filter; a fan provided outside the first processing housing and connected to the duct; an adjusting unit that is installed inside the first processing housing, receives the gas blown out from the filter, and blows the gas downward; a substrate holding unit that is installed inside the first processing housing and disposed below the adjustment unit and that holds a substrate; Equipped with the fan is disposed at a position not overlapping with the filter in a plan view, At least a part of the fan is disposed at the same height as the first processing casing, The filter blows gas downward, The adjustment unit an adjustment chamber disposed below the filter, extending horizontally, and larger than the filter in a plan view; a guide member provided in the adjustment chamber and guiding the gas downward in the adjustment chamber; a blowout plate disposed below the adjustment chamber, extending horizontally, and having a plurality of blowout holes; Equipped with the entire guide member is disposed outside the filter in a plan view, the entire guide member is disposed outward of the substrate held by the substrate holding portion in a plan view, the blowing plate includes a core zone; The airflow blown out by the blowing plate includes a core blowing flow, the core outlet flow is an airflow blown downward from the core zone, The core zone overlaps with the substrate held by the substrate holder in a plan view. Substrate processing equipment.

15. The substrate processing apparatus according to claim 14, The guide member is disposed only in the upper portion of the adjustment chamber and extends vertically. Substrate processing equipment.

16. The substrate processing apparatus according to claim 14 or 15, A blocking wall is provided to close the side of the adjustment chamber. Substrate processing equipment.

17. The substrate processing apparatus according to claim 14, wherein: a discharge unit that is installed inside the first processing housing and that discharges a processing liquid onto the substrate held by the substrate holder; Equipped with the discharge portion includes a tip portion that is movable between a discharge position and a standby position; when the tip portion is located at a standby position, the tip portion is disposed outward of the substrate held by the substrate holding portion in a plan view, When the tip portion is located at the standby position, the guide member is disposed between the tip portion and the substrate held by the substrate holder in a plan view. Substrate processing equipment.

18. The substrate processing apparatus according to claim 14, wherein: a cup disposed inside the first processing housing, the cup being arranged around the substrate holder and receiving a processing liquid; At least a portion of the guide member overlaps with the cup in a plan view. Substrate processing equipment.

19. The substrate processing apparatus according to claim 14, wherein: The blow-out plate is detachable from the first processing housing. Substrate processing equipment.

20. The substrate processing apparatus according to claim 14, wherein: The blowing plate is A first member; a second member adjacent to the first member; Equipped with Substrate processing equipment.

21. The substrate processing apparatus according to claim 1, At least a portion of the fan is positioned lower than the filter. Substrate processing equipment.

22. The substrate processing apparatus according to claim 1, The fan is disposed at a position where it does not overlap with the first processing casing in a plan view. Substrate processing equipment.

23. The substrate processing apparatus according to claim 1, The protruding length of the first air supply unit extending upward from the first processing casing is equal to or less than twice the length of the filter in the vertical direction. Substrate processing equipment.

24. The substrate processing apparatus according to claim 1, A part of the duct overlaps with the filter in a front view. Substrate processing equipment.

25. The substrate processing apparatus according to claim 1, The substrate processing apparatus includes: a pressure sensor that measures the pressure of the gas inside the first processing housing; a control unit that controls the fan based on a detection result of the pressure sensor; Equipped with Substrate processing equipment.

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