Fast-response dual-zone pedal assembly for selective pre-wash

Abstract

A substrate support pedestal connectable to the shaft includes a thermally conductive body, a first fluid channel disposed within an outer zone of the thermally conductive body, and a second fluid channel disposed within an inner zone of the thermally conductive body, wherein the first fluid channel and the second fluid channel are not in fluid communication with each other and are thermally isolated from each other by a thermal barrier within the substrate support channel.

Description

[Technical Field]

[0001] The embodiments described herein relate generally to a substrate support pedestal for use in a pre-clean chamber, and more particularly to a substrate support pedestal that enables rapid heating and cooling of a substrate placed on the substrate support pedestal and independent temperature control of inner and outer zones of the substrate support pedestal. [Background technology]

[0002] Integrated circuits are manufactured by processes that create intricately patterned layers of material on substrate surfaces. The surfaces of substrates, such as crystalline and epitaxial silicon layers, can be oxidized and / or susceptible to foreign particles, such as carbon or oxygen, present during the manufacturing process, which can directly affect the final product. Therefore, substrate surfaces are routinely pre-cleaned prior to the manufacturing process.

[0003] Conventionally, pre-cleaning processes are performed in a vacuum processing chamber having a substrate support pedestal on which the substrate is placed. Temperature variations can occur across the substrate surface. For example, the edge of the substrate support pedestal may have a higher temperature than the center of the substrate support pedestal due to heated chamber walls of the vacuum processing chamber, which can cause edge roll-off of the substrate. These temperature variations can affect manufacturing processes performed on or with the substrate, often reducing the uniformity of deposited films or etched structures along the substrate. Depending on the extent of the variations along the surface of the substrate, device failures can occur due to inconsistencies created by the application.

[0004] Additionally, conventional substrate support pedestals made of ceramic materials to prevent metal contamination have poor thermal conductivity, making temperature control of the substrate support pedestal inefficient and time-consuming.

[0005] Therefore, there is a need in the art for an improved substrate support pedestal for use in a pre-clean chamber. Summary of the Invention

[0006] In one embodiment, a substrate support pedestal connectable to a shaft includes a thermally conductive body, a first fluid channel disposed within an outer zone of the thermally conductive body, and a second fluid channel disposed within an inner zone of the thermally conductive body, wherein the first fluid channel and the second fluid channel are not in fluid communication with each other and are thermally isolated from each other by a thermal barrier within the substrate support pedestal.

[0007] In another embodiment, a substrate support pedestal assembly includes a shaft including a first pair of cooling pipes and a second pair of cooling pipes, the first pair of cooling pipes configured to be fluidly coupled to a first heating fluid source and the second pair of cooling pipes configured to be fluidly coupled to a second heating fluid source, and a substrate support pedestal coupled to the shaft, the substrate support pedestal including a first fluid channel in fluid communication with the first pair of cooling pipes and a second fluid channel in fluid communication with the second pair of cooling pipes, wherein the first fluid channel is configured to circulate a first heat exchange fluid at a first temperature in an outer zone of the substrate support pedestal and the second fluid channel is configured to circulate a second heat exchange fluid at a second temperature, different from the first temperature, in an inner zone of the substrate support pedestal disposed within the outer zone.

[0008] In yet another embodiment, a processing chamber includes a chamber body, a shaft disposed within the chamber body, the shaft including a first pair of cooling pipes and a second pair of cooling pipes, the first pair of cooling pipes configured to be fluidly coupled to a first heating fluid source and the second pair of cooling pipes configured to be fluidly coupled to a second heating fluid source, a substrate support pedestal disposed within the chamber body and coupled to the shaft, the first fluid channel being disposed within an outer zone of the substrate support pedestal and in fluid communication with the first pair of cooling pipes, and a second fluid channel being disposed within an inner zone of the substrate support pedestal and in fluid communication with the second pair of cooling pipes. a substrate support pedestal, the substrate support pedestal including a first fluid channel configured to circulate a first heat exchange fluid at a first temperature in an outer zone of the substrate support pedestal, and a second fluid channel configured to circulate a second heat exchange fluid at a second temperature different from the first temperature in an inner zone of the substrate support pedestal disposed within the outer zone; and a controller configured to determine temperatures of the outer zone and the inner zone of the substrate support pedestal and to adjust the first temperature and the second temperature based on the determined temperatures of the outer zone and the inner zone of the substrate support pedestal.

[0009] Implementations of the present disclosure, briefly summarized above and described in more detail below, can be understood by reference to exemplary implementations of the present disclosure that are illustrated in the accompanying drawings. It should be noted, however, that because the present disclosure may admit of other equally effective implementations, the accompanying drawings merely illustrate typical implementations of the present disclosure and therefore should not be considered as limiting the scope of the present invention. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view of a pre-clean processing chamber according to some embodiments of the present disclosure. [Figure 2A] FIG. 1 is a cross-sectional top view of a dual-zone heater in a dual-zone fast response pedestal according to some embodiments of the present disclosure. [Figure 2B]1 is a schematic side view of a dual-zone fast response pedestal according to some embodiments of the present disclosure; [Figure 3A] FIG. 1 is a side view of a substrate support assembly including a dual-zone fast response pedestal according to some embodiments of the present disclosure. [Figure 3B] FIG. 10 is a top view of a chiller plate in a dual-zone fast response pedestal according to some embodiments of the present disclosure. [Figure 4] 1 is a flow diagram of an embodiment of a method for controlling the temperature of a substrate support surface of a dual-zone fast response substrate support pedestal in accordance with an implementation of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] To facilitate understanding, the same reference numerals have been used, where possible, to designate identical elements common to the figures. The figures are not drawn to scale and may be simplified for clarity. It is contemplated that elements and features of one implementation may be beneficially incorporated in other implementations without further recitation.

[0012] The embodiments described herein relate generally to a substrate support pedestal for use in a pre-clean chamber, and more particularly to a substrate support pedestal that enables rapid heating and cooling of a substrate placed on the substrate support pedestal and independent temperature control of inner and outer zones of the substrate support pedestal.

[0013] The substrate support pedestal described herein is made of a metal plate and a ceramic coating on the top metal plate. Therefore, the substrate support pedestal can be efficiently heated and cooled, while the ceramic coating prevents contamination of a substrate placed on the substrate support pedestal. The substrate support pedestal described herein further includes heater and cooling fluid channels that are independently temperature-controlled for inner and outer zones of the substrate support pedestal, thereby enabling a substrate placed on the substrate support pedestal to be maintained at a more uniform or desired offset temperature profile across its surface.

[0014] 1 is a cross-sectional view of a pre-clean processing chamber 100 adapted to remove contaminants, such as oxides, from the surface of a substrate. Exemplary processing chambers that can be adapted to perform abatement processes include Siconi™ processing chambers available from Applied Materials, Inc. of Santa Clara, Calif. Chambers from other manufacturers can also be adapted to benefit from the inventions disclosed herein.

[0015] The processing chamber 100 may be particularly useful for performing thermal or plasma-based cleaning processes and / or plasma-assisted dry etching processes. The processing chamber 100 includes a chamber body 102, a lid assembly 104, and a substrate support assembly 106. The lid assembly 104 is disposed on top of the chamber body 102, and the substrate support assembly 106 is disposed at least partially within the chamber body 102. Gases can be removed from the processing chamber 100 using a vacuum system including a vacuum pump 108 and a vacuum port 110. The vacuum port 110 is disposed within the chamber body 102, and the vacuum pump 108 is coupled to the vacuum port 110. The processing chamber 100 also includes a controller 112 for controlling processes within the processing chamber 100. The controller 112 may include a central processing unit (CPU), memory, and support circuits (or I / O). The CPU may be any form of computer processor used in industrial environments to control various processes and hardware (e.g., pattern generators, motors, and other hardware) and monitor processes (e.g., process time and substrate position or location). The CPU may include a real-time proportional-integral-derivative (PID) controller that controls solid-state relay (SSR) drives to power in-line heaters in the inner and outer fluid channels and constantly monitor and maintain the temperatures of the inner and outer zones of the substrate support assembly 106. Memory is connected to the CPU and may be one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or any other form of local or remote digital storage. Software instructions, algorithms, and data may be coded and stored in the memory to instruct the CPU. Support circuits (not shown) are also connected to the CPU to support the processor in a conventional manner. The support circuits may include conventional cache, power supplies, clock circuits, input / output circuits, subsystems, etc. A program (or computer instructions) readable by the controller determines which tasks can be performed on the substrate.The program may be software readable by the controller and may include, for example, code for monitoring and controlling process time and substrate position or location. The program includes software for communicating with and controlling the PID controller and SSR drive.

[0016] The lid assembly 104 includes multiple stacked components bonded, welded, fused, or otherwise coupled together and configured to provide precursor gases and / or plasma to a processing region 114 within the processing chamber 100. The lid assembly 104 may be connected to a remote plasma source 116 to generate plasma byproducts that then pass through the remainder of the lid assembly 104. The remote plasma source 116 is coupled to a gas source 118 (or the gas source 118 may be directly coupled to the lid assembly 104 in the absence of the remote plasma source 116). The gas source 118 may include helium, argon, or other inert gases that energize the plasma provided to the lid assembly 104. In some embodiments, the gas source 118 may include a process gas that is activated for reaction with substrates within the processing chamber 100.

[0017] The substrate support assembly 106 includes a dual-zone, fast-response substrate support pedestal (hereinafter also referred to as a "dual-zone, fast-response pedestal" or simply a "pedestal") 120 and a shaft 122 coupled to the dual-zone, fast-response pedestal 120. During processing, a substrate 124 can be placed on an upper surface 126 of the pedestal 120 of the substrate support assembly 106. In some embodiments, the upper surface 126 of the pedestal 120 is covered with a ceramic coating 128 to prevent metallic contamination of the substrate 124. Suitable ceramic coatings include aluminum oxide, aluminum nitride, silica, silicon, yttria, YAG, or other non-metallic coating materials. The coating 128 has a thickness ranging from 50 microns to 1000 microns. The substrate 124 is configured to be vacuum-chucked against the ceramic coating 128 disposed on the upper surface 126 during processing.

[0018] The pedestal 120 is coupled to an actuator 130 by a shaft 122 that extends through a centrally located opening formed in the bottom of the chamber body 102. The actuator 130 may be flexibly sealed to the chamber body 102 by a bellows (not shown) that prevents vacuum leakage around the shaft 122. The actuator 130 enables the pedestal 120 to move vertically within the chamber body 102 between one or more processing positions and a release or transfer position. The transfer position is slightly below a slit valve opening formed in the sidewall of the chamber body 102 and enables a substrate 124 to be transferred into and out of the processing chamber 100 by a robot.

[0019] In some processing operations, the substrate 124 may be spaced from the upper surface 126 by lift pins to perform additional thermal processing operations, such as performing an annealing step. The substrate 124 may be lowered so that it is placed in direct contact with the pedestal 120 to facilitate cooling of the substrate 124.

[0020] FIG. 2A illustrates a cross-sectional top view of a dual-zone heater 200 within a dual-zone fast response pedestal 120 according to some embodiments of the present invention. FIG. 2B illustrates a schematic side view of the dual-zone fast response pedestal 120 according to some embodiments of the present invention. In some embodiments, the dual-zone heater 200 has heater elements disposed in at least a first zone 202 and a second zone 204 within the pedestal 120, as shown in FIG. 2A. In some embodiments, the heater element 206 in the first zone 202 and the heater element 208 in the second zone 204 are connected to a power source 210, as shown in FIG. 2B. In some embodiments, as shown in FIGS. 2A and 2B, the first zone 202 is an outer zone, and the second zone 204 is an inner zone disposed within the outer zone. The inner and outer zones may substantially correspond to inner and outer portions of a substrate supported on the pedestal 120. In some embodiments, power supply 210 is an approximately 190 to approximately 240 VAC, or approximately 208 VAC power supply. Other size power supplies may be used depending on the application and device design. In some embodiments, power supply 210 operates at a 60 Hz cycle. In some embodiments, as shown in FIG. 2B , power supply 210 provides power to first zone 202 via first feed 212 and to second zone 204 via second feed 214.

[0021] The pedestal 120 includes a thermocouple 216 embedded in the second zone 204. The thermocouple 216 is connected to the controller 112 and further connected to the power supply 210. The controller 112 uses the thermocouple 216 to determine the temperature of the second zone 204 of the pedestal 120.

[0022] The temperature of the first zone 202 of the pedestal 120 can be determined by first measuring the current and voltage drawn by the first zone 202 of the dual-zone heater 200. The current and voltage drawn by the first zone 202 can be measured using a resistance measuring device 218 capable of simultaneously measuring the current and voltage. As used herein, simultaneously includes measurements taken within up to about 110 milliseconds of each other. In some embodiments, the resistance measuring device 218 can be a high-frequency Hall-effect current sensor (e.g., having a sampling rate of about 200 kHz or greater) for capturing the instantaneous current supplied to the first zone 202 as well as the applied voltage.

[0023] For example, in some embodiments, the resistance measuring device 218 is coupled to the first power supply 212 to measure the current and voltage drawn by the first zone 202. The resistance measuring device 218 may also be coupled to the controller 112. In some embodiments, the resistance measuring device 218 and the controller 112 may be integrated (e.g., provided within the same housing or device).

[0024] Based on the measured current and voltage of the first zone 202, the controller 112 determines the resistance of the first zone 202 using Ohm's Law, which is equal to voltage divided by current (R=V / I). The controller 112 further determines the temperature of the first zone 202 based on a predetermined relationship between the resistance and the temperature of the first zone 202. Simultaneous measurement of current and voltage is necessary to ensure accuracy of the calculated resistance value. Because the resistance of a heater is directly related to its temperature in a linear relationship, the accuracy of the resistance calculation is directly related to the accuracy of the temperature determination. In some embodiments, the resistance of the first zone 202 can be used to correlate the temperature of the first zone 202. The controller 112 also records resistance measurements over a range of temperatures.

[0025] In some embodiments, the controller 112 may determine the temperature of the first zone 202 using an additional thermocouple (not shown) embedded in the first zone 202 of the pedestal 120 .

[0026] FIG. 3A shows a side view of a substrate support assembly 106 including a dual-zone fast response pedestal 120 according to some embodiments of the present invention. FIG. 3B shows a top view of a chiller plate 302 within the dual-zone fast response pedestal 120 according to some embodiments of the present invention. In some embodiments, the dual-zone fast response pedestal 120 has a first fluid channel 304 in the first zone 202 and a second fluid channel 306 in the second zone 204 embedded within the chiller plate 302. The first fluid channel 304 and the second fluid channel 306 are not fluidly connected to each other. The dual-zone fast response pedestal 120 includes a thermally conductive body, which may be multiple plates, including the chiller plate 302, brazed together to ensure thermal conduction or fabricated as a single component by, for example, lost foam casting or 3D printing. Each of the multiple plates of the dual-zone fast response pedestal 120 is fabricated from a thermally conductive material, such as a metal, for example, aluminum. The first fluid channel 304 includes an upper portion 308 and a lower portion 310 between an inlet 312 (shown in FIG. 3B ) and an outlet (not shown). The lower portion 310 of the first fluid channel 304 can be positioned directly below or above the upper portion 308 of the first fluid channel 304. Alternatively, the lower portion 310 of the first fluid channel 304 can be horizontally offset from the upper portion 308 of the first fluid channel 304. While FIGS. 3A and 3B show a single loop of the first fluid channel 304, any number of loops can be provided based on the orientation and dimensions of the channel and the dimensions of the pedestal. The second fluid channel 306 includes an upper portion 314 and a lower portion 316 between an inlet 318 and an outlet 320. The lower portion 316 of the second fluid channel 306 can be positioned directly below or above the upper portion 314 of the second fluid channel 306. Alternatively, the lower portion 316 of the second fluid channel 306 may be horizontally offset from the upper portion 314 of the second fluid channel 306. Like the first fluid channel 304, the second fluid channel 306 may include any number of connected or spiral loops around the second zone 204.In some embodiments, the second fluid channels 306 are arranged in a coil pattern as shown in FIG. 3B, but may alternatively be arranged in a spiral pattern or other geometric pattern for circulation of fluid.

[0027] The shaft 122 includes one or more cooling pipe pairs 322, 324. The first cooling pipe pair 322 supplies and receives, respectively, a first heat exchange fluid to the first zone 202 of the pedestal 120 through a first fluid channel 304. The second cooling pipe pair 324 supplies and receives, respectively, a second heat exchange fluid to the second zone 204 of the pedestal 120. In some embodiments, one of the first cooling pipe pair 322 supplies the first heat exchange fluid to the upper portion 308 of the first fluid channel 304 through an inlet 312, where it circulates within the upper portion 308 of the first fluid channel 304. The first heat exchange fluid is then transported to the lower portion 310 of the first fluid channel 304, where it circulates in a reverse pattern from the upper portion 308 of the first fluid channel 304, and exits the other of the first cooling pipe pair 322 via an outlet (not shown). In some embodiments, one of the second cooling tube pair 324 supplies a second heat exchange fluid through an inlet 318 to an upper portion 314 of a second fluid channel 306 in the center of the chiller plate 302, where it is supplied outward toward a distal location of the upper portion 314 of the second fluid channel 306. The second heat exchange fluid is then transported to a lower portion 316 of the second fluid channel 306, where it circulates back to the chiller plate 302 in a reverse pattern from the upper portion 314 of the second fluid channel 306, and exits the other of the second cooling tube pair 324 via an outlet 320.

[0028] The first and second heat exchange fluids may be the same or different fluids and may be provided at the same or different temperatures to maintain the first and second zones 202, 204 at similar or different temperatures. The first and second cooling pipe pairs 322, 324 are fluidly coupled to a first fluid source (not shown) connected to an in-line heater 326 and a second fluid source (not shown) connected to an in-line heater 328, respectively. The controller 112 adjusts the in-line heaters 326, 328 to independently control the temperatures of the first and second heat exchange fluids. For example, the first heat exchange fluid may be provided at a higher or lower temperature than the second heat exchange fluid, thereby allowing the first zone 202 to be at a higher or lower temperature than the second zone 204, respectively. Circulation of the heat exchange fluid allows the substrate temperature to be maintained at relatively low temperatures, for example, from about −20° C. to about 80° C., as well as at much higher temperatures. Alternatively, the temperature can be maintained between about 0° C. and 100° C. Exemplary heat exchange fluids include ethylene glycol and water, although other fluids can be utilized.

[0029] Alternatively, the temperature of the first zone 202 may be increased to be higher than the temperature of the second zone 204. In some embodiments, the temperature of the first zone 202 may be adjusted to maintain a temperature differential between the first zone 202 and the second zone 204. For example, in some embodiments, the second zone 204 may be maintained at a higher temperature than the first zone 202, e.g., up to about 40 degrees higher. In some embodiments, the second zone 204 may be maintained at a lower temperature than the first zone 202, e.g., up to about 15 degrees lower. In some embodiments, the first zone 202 may be heated to a first temperature, e.g., about 90°C, and once the first temperature is reached, the second zone 204 may be heated to a desired second temperature. In some embodiments, once the second zone 204 is heated to the desired second temperature, both the first and second zones 202, 204 may be increased to a desired third and / or fourth temperature.

[0030] The pedestal 120 further includes one or more purge channels in a purge plate 330, which is a plate disposed below and brazed to the chiller plate 302 to provide purge flow channels. For example, a first purge channel 332 may be defined by a portion of the purge plate 330. The first purge channel 332 may circulate purge fluid throughout the pedestal 120, which is exhausted through multiple purge outlets 334 in the pedestal 120. While FIG. 3A shows two purge outlets 334, any number of purge outlets may be included in various configurations.

[0031] The first purge channel 332 may be formed in any number of patterns within the pedestal 120. For example, the first purge channel 332 may be formed in a coil pattern throughout the pedestal 120 to provide thermal isolation between the pedestal 120 and the shaft 122, which may be heated by a heating element (not shown), such as a resistive heating element, to maintain the shaft 122 at a particular temperature. Alternatively, multiple straight channels may be formed within the pedestal 120 that direct purge fluid directly to the purge outlet 334. The purge fluid may be supplied from a fluid tube 336 within the shaft 122, through the first purge channel 332, and out through the purge outlet 334. The purge fluid may be a gas, including an inert gas, utilized to limit or prevent the formation of process by-products within the pores or channels of the pedestal 120. When deposition and / or etching processes are performed, process by-products routinely condense on areas within the substrate processing chamber, including on the substrate support assembly 106. If these by-products accumulate on and within the pedestal 120, a subsequent substrate placed on the surface may tilt, which may result in uneven deposition or etching. A purge gas supplied through the pedestal 120 may facilitate flushing and removal of reactants from the pedestal 120.

[0032] The first purge channel 332 may further include a first isolation cavity 338 at a distal portion thereof that extends vertically through the purge plate 330 and the chiller plate 302. The first isolation cavity 338 may be disposed around the first zone 202 and configured to receive a portion of the purge gas flow through the first purge channel 332, where the portion of the purge gas is maintained within the first isolation cavity 338 to provide thermal isolation between the first zone 202 and the second zone 204. In some embodiments, multiple purge channels are included to separately supply gas to the first isolation cavity 338 and the purge outlet 334. One or more channels coupled to the first isolation cavity 338 may be outwardly closed so that the channels can be pressurized with a fluid. A pressurized gas or fluid can be supplied to or pressurized within the first isolation cavity 338 to provide a barrier or temperature barrier at that location in the first isolation cavity 338. The first isolation cavity 338 can be arranged as a channel that can separate the first zone 202 and the second zone 204 around the entire pedestal 120. The purge gas or fluid can be heated or cooled and supplied to the first isolation cavity 338 so as not to affect the temperature control of the heat exchange fluid circulating within the pedestal 120. Alternatively, the purge gas can be supplied at a temperature selected to tailor the temperature profile throughout the pedestal 120.

[0033] Because the first separation cavity 338 extends through the chiller plate 302 and the purge plate 330, the first separation cavity 338 can create a thermal barrier between the first fluid channel 304 and the second fluid channel 306, and between the first zone 202 and the second zone 204 of the pedestal 120.

[0034] The pedestal 120 may also include a second purge channel 340 that may be defined along the interface between the shaft 122 and the pedestal 120. The second purge channel 340 may be configured to provide a second purge flow path for purge gas, which may create an additional thermal barrier between the shaft 122 and the pedestal 120. Thus, heat applied to the shaft 122 to limit the amount of process by-product deposition may not affect the temperature control scheme applied through the pedestal 120. The second purge channel 340 may additionally include a second isolation cavity 342 and a purge outlet 344. The second isolation cavity 342 and the purge outlet 344 may be configured to receive a portion of the purge gas delivered through the second purge channel 340, which may provide additional thermal isolation between the edge of the pedestal 120 and the second zone 204 of the pedestal 120. Thus, the interface between the pedestal 120 and the shaft 122 can be heated in a similar manner to the shaft 122 to reduce the amount of by-product deposition on the apparatus, while providing a barrier to the pedestal 120 so that a uniform temperature profile can be more easily provided on the pedestal 120 in the second zone 204.

[0035] The second separation cavity 342 can function and be arranged similarly to the first separation cavity 338. Purge gas or fluid can be supplied through the second purge channel 340 from the same fluid tube 336 in the shaft 122 that supplies purge gas to the first purge channel 332, or through a different fluid tube in the shaft 122. The purge gas supplied from the first and second purge channels 332, 340 can be the same or different. Purge gas can be supplied to the second separation cavity 342 through the second purge channel 340 and then discharged through a purge outlet 344 at the top of the second separation cavity 342. The purge outlet 344 at the top of the second separation cavity 342 can be similar to the purge outlet 334 to which the first purge gas is supplied. Alternatively, a space can be created around the entire top of the second separation cavity 342 for purge gas flow. Alternatively, the second isolation cavity 342 may be closed outwardly so that fluid can be accumulated or pressurized within the second isolation cavity 342 to provide an enhanced thermal barrier at the outer edge of the pedestal.

[0036] In some embodiments, the controller 112 determines the temperatures of the first zone 202 and the second zone 204 and adjusts the temperatures of the first and second heat exchange fluids at a frequency between about 60 Hz and 90 Hz, with a response time (i.e., the time required for the temperatures of the first zone 202 and the second zone 204 to reach their respective target temperatures) of less than 60 seconds.

[0037] 4 is a flow diagram of one embodiment of a method 400 for controlling the temperature of the substrate support surface of the dual-zone fast response pedestal 120. The method 400 1st zone 202 The process begins at block 402 by determining the temperature of the

[0038] In block 404 , the temperature of the second zone 204 is measured using the thermocouple 216 .

[0039] In block 406, based on the determined temperature of the first zone 202 and the measured temperature of the second zone 204, the controller 112 determines target temperatures for the first zone 202 and the second zone 204 and adjusts the heating and cooling of the first zone 202 and the second zone 204 by adjusting the temperatures of the first heat exchange fluid circulating in the first zone 202 and the second heat exchange fluid circulating in the second zone 204.

[0040] In the above-described exemplary embodiments, methods and systems are provided for controlling the temperature profile of a dual-zone heated substrate support (and thus a substrate disposed thereon) to be either uniform or controllably non-uniform. For example, in some embodiments, a uniform thermal profile may be provided. Alternatively, a centrally low temperature profile or a centrally high temperature profile may be provided.

[0041] While certain specific embodiments have been described, these embodiments are presented by way of example only and are not intended to limit the scope of the invention. Indeed, the novel embodiments described herein may be embodied in a variety of other forms. Furthermore, various omissions, substitutions, and changes may be made in the form of the embodiments described herein without departing from the spirit of the invention. The accompanying claims and their equivalents are intended to cover such forms or modifications as fall within the scope and spirit of the invention.

Claims

1. 1. A substrate support pedestal assembly comprising: a shaft including a first pair of cooling tubes and a second pair of cooling tubes, the first pair of cooling tubes configured to be fluidly coupled to a first fluid source and the second pair of cooling tubes configured to be fluidly coupled to a second fluid source; a substrate support pedestal coupled to the shaft, a first fluid channel in fluid communication with the first pair of cooling tubes, the first fluid channel configured to circulate a first heat exchange fluid at a first temperature in an outer zone of the substrate support pedestal; a second fluid channel in fluid communication with the second pair of cooling tubes, the second fluid channel configured to circulate a second heat exchange fluid at a second temperature different from the first temperature in an inner zone of the substrate support pedestal disposed within the outer zone; a first power feed configured to supply power from a power source to a first heater element in the outer zone; a second power feed configured to supply power from the power source to a second heater element in the inner zone; a thermocouple embedded in the inner zone; and a resistance meter coupled to the first power supply; a substrate support pedestal including: a first in-line heater connected to the first fluid source external to the shaft and the substrate support pedestal; a second in-line heater connected to the second fluid source external to the shaft and the substrate support pedestal; and a controller, determining a temperature of the outer zone of the substrate support pedestal using the resistance measuring device and a temperature of the inner zone of the substrate support pedestal using the thermocouple; adjusting the first in-line heater and the second in-line heater to independently control the first temperature of the first heat exchange fluid and the second temperature of the second heat exchange fluid; and adjusting the first temperature of the first heat exchange fluid and the second temperature of the second heat exchange fluid based on the determined temperature of the outer zone of the substrate support pedestal and the determined temperature of the inner zone of the substrate support pedestal. The controller is configured as follows: Including, A substrate support pedestal assembly.

2. The substrate support pedestal assembly of claim 1 , wherein the substrate support pedestal comprises a thermally conductive body.

3. The substrate support pedestal assembly of claim 2 , wherein the thermally conductive body comprises aluminum.

4. a ceramic coating on the top surface of said substrate support pedestal further comprising the substrate support pedestal is configured to support a substrate to be processed on the upper surface of the substrate support pedestal. The substrate support pedestal assembly of claim 1 .

5. The substrate support pedestal assembly of claim 4 , wherein the ceramic coating comprises aluminum oxide.

6. 6. The substrate support pedestal assembly of claim 4, wherein the ceramic coating has a thickness of from 50 microns to 1000 microns.

7. the substrate support pedestal a plurality of purge channels for circulating a purge fluid throughout the substrate support pedestal; wherein: each of the plurality of purge channels in fluid communication with a fluid tube disposed in the shaft and an outlet formed in the substrate support pedestal; The substrate support pedestal assembly of claim 1 .

8. 1. A processing chamber comprising: Chamber body; a shaft disposed within the chamber body, the shaft including a first pair of cooling pipes and a second pair of cooling pipes, the first pair of cooling pipes configured to be fluidly coupled to a first fluid source and the second pair of cooling pipes configured to be fluidly coupled to a second fluid source; a substrate support pedestal disposed within the chamber body and coupled to the shaft, a first fluid channel disposed within an outer zone of the substrate support pedestal and in fluid communication with the first pair of cooling tubes, the first fluid channel configured to circulate a first heat exchange fluid at a first temperature in the outer zone of the substrate support pedestal; a second fluid channel disposed within an inner zone of the substrate support pedestal and in fluid communication with the second pair of cooling tubes, the second fluid channel configured to circulate a second heat exchange fluid at a second temperature different from the first temperature in the inner zone of the substrate support pedestal disposed within the outer zone; a first power feed configured to supply power from a power source to a first heater element in the outer zone; a second power feed configured to supply power from the power source to a second heater element in the inner zone; a thermocouple embedded in the inner zone; and a resistance meter coupled to the first power supply; Including, a substrate support pedestal; a first in-line heater connected to the first fluid source external to the shaft and the substrate support pedestal; a second in-line heater connected to the second fluid source external to the shaft and the substrate support pedestal; and a controller, determining a temperature of the outer zone of the substrate support pedestal using the resistance measuring device and a temperature of the inner zone of the substrate support pedestal using the thermocouple; adjusting the first in-line heater and the second in-line heater to independently control the first temperature of the first heat exchange fluid and the second temperature of the second heat exchange fluid; and adjusting the first temperature of the first heat exchange fluid and the second temperature of the second heat exchange fluid based on the determined temperature of the outer zone of the substrate support pedestal and the determined temperature of the inner zone of the substrate support pedestal; The controller is configured as follows: a processing chamber comprising:

9. 10. The processing chamber of claim 8, wherein the substrate support pedestal comprises a plurality of thermally conductive plates brazed together.

10. The processing chamber of claim 9 , wherein the plurality of thermally conductive plates comprises aluminum.

11. a ceramic coating on the top surface of said substrate support pedestal further comprising the substrate support pedestal is configured to support a substrate to be processed on the upper surface of the substrate support pedestal. The processing chamber of claim 8 .

12. The processing chamber of claim 11 , wherein the ceramic coating comprises aluminum oxide.

13. the substrate support pedestal a plurality of purge channels for circulating a purge fluid throughout the substrate support pedestal; further comprising each of the plurality of purge channels in fluid communication with a fluid tube disposed in the shaft and an outlet formed in the substrate support pedestal; The processing chamber of claim 8 .

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