Cover tape for packaging electronic components and electronic component packaging

Abstract

To provide a cover tape for packaging electronic components that is not easily damaged by "piercing" or "bending".SOLUTION: A cover tape for packaging electronic components comprises: a base material layer; a polyamide-containing layer disposed on one side of the base material layer; and a sealant layer disposed on a side of the polyamide-containing layer opposite from the base material layer. In this cover tape, if FMD and FTD respectively refer to the tear strength in the MD direction and the tear strength in the TD direction that are measured according to JIS K 7128-3, then FMD / FTD is from 0.95 to 1.05.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cover tape for packaging electronic components and an electronic component package, and more specifically to a cover tape for packaging electronic components and an electronic component package in which electronic components are packaged using the cover tape. [Background technology]

[0002] 2. Description of the Related Art When transporting, storing, etc. electronic components, carrier tapes and cover tapes are often used. Specifically, electronic components (such as semiconductor chips) are placed in recesses formed in the carrier tape for storing electronic components, and then a cover tape is heat-sealed to the top surface of the carrier tape to enclose the electronic components. The carrier tape is then wound up into a reel for transportation / storage. This prevents contamination of the electronic components during transportation / storage.

[0003] Prior art for cover tapes can be found, for example, in Patent Document 1. Patent Document 1 describes a cover tape for an embossed carrier tape for surface mounting, which includes the following outer layer, intermediate layer, and adhesive layer. Outer layer: Biaxially oriented polyester or polypropylene film Middle layer: Tear strength (JIS K 7128) of 100 kg / cm or more, tensile impact strength (ASTM D1822) of 100 kg-cm / cm 2 Ethylene-α-olefin copolymer with a haze (JIS K 7105) of 15% or less Adhesive layer: An adhesive made of any one of polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene vinyl acetate resin, polyester resin, butadiene resin, styrene resin, or a combination of these that can be heat-sealed to a plastic carrier tape, with conductive fine powder of either tin oxide or zinc oxide dispersed in the adhesive. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 8-258888 Summary of the Invention [Problem to be solved by the invention]

[0005] From the viewpoint of "protecting electronic components," which is one of the original purposes of cover tapes for packaging electronic components, it is important that the cover tape has sufficient strength. There are various viewpoints for "strength." For example, considering the definition of "intermediate layer" in the above-mentioned Patent Document 1, the cover tape in Patent Document 1 is understood to be a cover tape that has high strength against "tear" and "tensile."

[0006] In the course of investigations into further improving the strength of the cover tape, the present inventors have recently found that conventional cover tapes need improvement in that they are easily punctured when pierced by a sharp object, and that they are also easily damaged when bent.

[0007] In light of the above-mentioned points requiring improvement, the present inventors have carried out investigations with the aim of providing a cover tape for packaging electronic components that is resistant to damage even when "pierced" or "bent." [Means for solving the problem]

[0008] As a result of investigations, the present inventors have completed the invention provided below and solved the above-mentioned problems.

[0009] The present invention is as follows.

[0010] 1. a substrate layer; a polyamide-containing layer provided on one surface of the base material layer; a sealant layer provided on the surface of the polyamide-containing layer opposite to the substrate layer; A cover tape for packaging electronic components, comprising: The tear strength of the cover tape in the MD direction measured in accordance with JIS K 7128-3 is F MD , the tear strength of the cover tape in the TD direction is F TD When F MD / F TD Cover tape with a viscosity of 0.95 to 1.05. 2. 1. The cover tape according to claim 1, F MD is 550 to 1400N / cm, F TD Cover tape with a strength of 600 to 1400 N / cm. 3. 1. or 2. The cover tape according to The polyamide-containing layer of the cover tape contains at least one resin selected from the group consisting of nylon 6, nylon 66, nylon 11, and nylon 12. 4. The cover tape according to any one of 1. to 3., The thickness of the polyamide-containing layer of the cover tape is 5 to 30 μm. 5. The cover tape according to any one of 1. to 4., The polyamide-containing layer is a bar tape made of a biaxially oriented polyamide film. 6. The cover tape according to any one of 1. to 5., The cover tape further comprises an intermediate layer provided between the polyamide-containing layer and the sealant layer. 7. 6. The cover tape according to claim 6, The intermediate layer of the cover tape comprises a polyethylene-based resin. 8. The cover tape according to any one of 1. to 7., The cover tape includes a base layer containing a polyester resin. 9. The cover tape according to any one of 1. to 8., The cover tape, wherein the sealant layer contains a (meth)acrylic resin. 10. The cover tape according to any one of 1. to 9., A cover tape having a tensile modulus of elasticity measured in accordance with JIS K 7161 of 1500 to 2000 MPa. 11. A carrier tape having electronic components housed in recesses and the cover tape according to any one of 1. to 10. An electronic component package in which the sealant layer is adhered to the carrier tape so as to seal the electronic component. [Effects of the Invention]

[0011] According to the present invention, a cover tape for packaging electronic components is provided that is resistant to damage even when "pierced" or "bent." [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is a diagram schematically illustrating the layer structure of a cover tape. [Figure 2] FIG. 2 is a diagram schematically illustrating an electronic component package. [Figure 3] FIG. 1 is a diagram for supplementing the method for measuring "tear strength" in the examples. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, similar components are denoted by similar reference numerals and descriptions thereof will be omitted where appropriate. To avoid complexity, (i) when there are multiple identical components in the same drawing, only one of them is given a symbol, and not all of them, or (ii) particularly in Figure 2 and subsequent figures, components similar to those in Figure 1 are not given a symbol again. All drawings are for illustrative purposes only, and the shapes and dimensional ratios of the components in the drawings do not necessarily correspond to the actual products.

[0014] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0015] In the description of groups (atomic groups) in this specification, when a notation does not specify whether the group is substituted or unsubstituted, it encompasses both groups having no substituents and groups having a substituent. For example, the term "alkyl group" encompasses not only alkyl groups having no substituents (unsubstituted alkyl groups) but also alkyl groups having a substituent (substituted alkyl groups). In this specification, the term "(meth)acrylic" represents a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." In this specification, the terms "MD direction" and "TD direction" are used in the same sense as they are commonly used in the field of resin films. Just to be clear, the "MD" in "MD direction" is an abbreviation for machine direction. The MD direction is sometimes referred to as the flow direction. Furthermore, the "TD" in "TD direction" is an abbreviation for transverse direction, and is sometimes referred to as the perpendicular direction. In a long cover tape, the long direction is usually the MD direction, and the width direction is the TD direction.

[0016] <Cover tape> FIG. 1 is a schematic diagram showing the layer structure of a cover tape 10 for packaging electronic components (also simply referred to as "cover tape 10") according to this embodiment. 1, the cover tape 10 comprises a base layer 1, a polyamide-containing layer 2 provided on one side of the base layer 1, and a sealant layer 3 provided on the side of the polyamide-containing layer 2 opposite the side of the base layer 1. In other words, the cover tape 10 comprises, in this order, the base layer 1, the polyamide-containing layer 2, and the sealant layer 3. There may or may not be additional layers between these layers. The cover tape 10 also preferably includes an intermediate layer 2B between the polyamide-containing layer 2 and the sealant layer 3.

[0017] The sealant layer 3 is usually present on the outermost surface of the cover tape 10 and constitutes one side of the cover tape 10. This allows the cover tape 10 to adhere closely to the carrier tape 20 described below. Typically, the substrate layer 1, the polyamide-containing layer 2, and the sealant layer 3 all have substantially the same width and length and are present without any breaks or divisions. When an intermediate layer 2B is present, it is preferable that the intermediate layer 2B also has substantially the same width and length as the substrate layer 1, the polyamide-containing layer 2, and the sealant layer 3 and is present without any breaks or divisions.

[0018] The cover tape 10 is typically used to seal a carrier tape 20 having pockets 21 for accommodating electronic components, as shown in Fig. 2. That is, the cover tape 10 is heat-sealed so that the sealant layer 3 of the cover tape 10 contacts the carrier tape 20.

[0019] The tear strength of the cover tape 10 in the MD direction measured in accordance with JIS K 7128-3 is F MD , the tear strength of the cover tape 10 in the TD direction is F TD When F MD / F TD is 0.95 to 1.05, preferably 0.97 to 1.03, and more preferably 0.97 to 1.01.

[0020] Based on past findings and preliminary studies, the inventors have discovered that the reason why conventional cover tapes are vulnerable to punctures and bending is likely due to the weakness of the material that makes up the cover tape itself, as well as the difference in strength between the MD and TD directions of the cover tape. Cover tapes with a difference in strength between the MD and TD directions cannot absorb external impacts "evenly" across the entire cover tape, and it is believed that this leads to their vulnerability to punctures and bending.

[0021] In consideration of the above, the inventors decided to use a polyamide-containing layer 2, the material of which has a relatively high strength, as one of the layers constituting the cover tape 10. In addition, the tear strength F in the MD direction of the cover tape 10 was MD and the tear strength F of the cover tape 10 in the TD direction. TD are the same or substantially the same (F MD / F TD The tear strength was adjusted to 0.95 to 1.05. In other words, a cover tape 10 was manufactured in which the tear strength required in the MD and TD directions was the same or almost the same. This enabled the production of a cover tape 10 with good resistance to "punctures" and "bending."

[0022] F MD / F TD The cover tape 10 having a F of 0.95 to 1.05 can be manufactured only by selecting an appropriate material and employing an appropriate manufacturing method. In particular, by using a "custom-made" polyamide (nylon) film with highly controlled longitudinal and transverse stretching ratios, F MD / F TD To the best of the inventor's knowledge, it is easy to manufacture a cover tape 10 having a F of 0.95 to 1.05. MD / F TD It is difficult to manufacture a cover tape 10 having a coefficient of elasticity of 0.95 to 1.05.

[0023] The description of the cover tape 10 continues.

[0024] [Base material layer 1] There are no particular limitations on the material that constitutes the base material layer 1. Typically, a material that provides sufficient mechanical strength to withstand external forces when producing the cover tape 10 and adhering the cover tape 10 to the carrier tape is preferred. Also, a material that is heat-resistant enough to withstand the heat generated when adhering the cover tape 10 to the carrier tape is preferred. The material constituting the base layer 1 is preferably in the form of a film from the viewpoint of ease of processing.

[0025] Specific examples of materials constituting the base material layer 1 include polyester-based resins, polyamide-based resins, polyolefin-based resins, polyacrylate-based resins, polymethacrylate-based resins, polyimide-based resins, polycarbonate-based resins, ABS resins, etc. Among these, polyester-based resins are preferred from the viewpoint of improving the mechanical strength of the cover tape 10 and from the viewpoint of cost, and polyethylene terephthalate (PET)-based resins are more preferred. The base layer 1 may or may not contain additives such as lubricants. In order to protect the electronic components from static electricity, the base layer 1 is preferably subjected to an antistatic treatment.

[0026] The base layer 1 may be a single layer or may be composed of two or more layers. For example, the base layer 1 may be formed of a multilayer film in which the above-mentioned materials are laminated. The film used to form the base layer 1 may be an unstretched film or a uniaxially or biaxially stretched film. From the viewpoint of further improving the mechanical strength of the cover tape 10, a uniaxially or biaxially stretched film is preferred.

[0027] There are no particular limitations on the thickness of the base layer 1. The thickness of the base layer 1 is preferably 5 μm or more, more preferably 8 μm or more, and more preferably 10 μm or more. The thickness of the base layer 1 is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. By setting the thickness of the base layer 1 to 50 μm or less, the rigidity of the cover tape 10 is not too high. As a result, even if a torsional stress is applied to the carrier tape after sealing, the cover tape 10 can easily follow the deformation of the carrier tape. Therefore, it is possible to prevent the cover tape 10 from unintentionally peeling off from the carrier tape. A thickness of the base material layer 1 of 5 μm or more can provide sufficiently good mechanical strength to the cover tape 10. Therefore, even when the cover tape 10 is peeled off from the carrier tape at high speed, for example, the cover tape 10 can be prevented from breaking.

[0028] The total light transmittance of the base layer 1 is preferably 80% or more, and more preferably 85% or more. This ensures the transparency required to inspect whether the electronic components are properly housed in the electronic component package consisting of the cover tape 10 and the carrier tape. In other words, by making the total light transmittance of the base layer 1 80% or more, the electronic components housed inside the package consisting of the cover tape 10 and the carrier tape can be easily visually confirmed from the outside. The total light transmittance can be measured in accordance with JIS-K-7361.

[0029] [Polyamide-containing layer 2] The polyamide-containing layer 2 is not particularly limited as long as it contains polyamide. From the viewpoint of further suppressing damage to the cover tape 10 due to "piercing" or "bending," the content of polyamide in the polyamide-containing layer 2 is preferably 50% by mass or more, more preferably 75% by mass or more, even more preferably 90% by mass or more, and particularly preferably 95% by mass or more.

[0030] From the viewpoints of good strength and easy availability of materials, the polyamide-containing layer 2 preferably contains at least one resin selected from the group consisting of 6-nylon, 6,6-nylon, and nylon 12. Of course, polyamides other than these can also be used, and any polyamide that can be molded into a film can be used without particular limitation.

[0031] From the viewpoint of particularly increasing the strength of the cover tape 10 against "puncture" and "bending," MD / F TD From the viewpoint of precisely controlling the value of , the polyamide-containing layer 2 is preferably made of a biaxially stretched polyamide film. The biaxially oriented polyamide film is preferably a simultaneously biaxially oriented polyamide film. The stretching ratio of the biaxially stretched polyamide film is not particularly limited, but is, for example, 2 to 7 times, preferably 3 to 6 times, and more preferably 4 to 6 times. The stretching ratio in the MD direction and the stretching ratio in the TD direction are usually almost the same. However, the F of the cover tape 10 MD / F TD As long as the stretch ratio is 0.95 to 1.05, the stretching ratios in the longitudinal and transverse directions of the biaxially stretched polyamide film may be different.

[0032] The polyamide-containing layer 2 may have a single layer structure or a multi-layer structure. The thickness of the polyamide-containing layer 2 is preferably 5 to 30 μm, more preferably 10 to 20 μm, from the viewpoint of particularly increasing the strength of the cover tape 10 against punctures and bending, and from the viewpoint of making the cover tape 10 thinner to improve handleability.

[0033] [Middle layer 2B] The cover tape 10 preferably includes an intermediate layer 2B between the polyamide-containing layer 2 and the sealant layer 3. The presence of the intermediate layer 2B can further enhance the cushioning properties and impact resistance of the cover tape 10.

[0034] Examples of materials for forming the intermediate layer include olefin resins, styrene resins, cyclic olefin resins, etc. Among these, from the viewpoint of improving the cushioning properties of the entire cover tape 10, olefin resins are preferred. Examples of olefin-based resins include polyethylene-based resins and polypropylene-based resins, with polyethylene-based resins being preferred. From the standpoint of cushioning properties, low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is particularly preferred. High-density polyethylene (HDPE) is also preferred from the standpoint of achieving both cushioning properties and strength. The intermediate layer 2B may or may not contain various additives, examples of which include those listed for the other layers.

[0035] When the intermediate layer 2B is provided, the intermediate layer 2B may have a single layer structure or a multi-layer structure. When the intermediate layer 2B is provided, its thickness is preferably 10 to 45 μm, more preferably 15 to 40 μm, from the viewpoint of improving the cushioning properties of the entire cover tape 10 without excessively impairing other performances.

[0036] [Sealant layer 3] The sealant layer 3 can contain any resin as long as it softens or melts appropriately under normal heat sealing conditions and can be heat-sealed to the carrier tape 20 .

[0037] The sealant layer 3 usually contains a thermoplastic resin, such as an ionomer resin, a polyester resin, a vinyl chloride-vinyl acetate copolymer, a (meth)acrylic resin, a polyurethane resin, an ethylene-vinyl acetate copolymer, an ethylene-(meth)acrylic acid copolymer, an ethylene-(meth)acrylic acid ester copolymer, or a maleic acid resin. In particular, (meth)acrylic resins and ethylene-vinyl acetate copolymers are preferably used because they can be heat-sealed to a wide variety of carrier tapes and there is little variation in heat seal strength due to changes in heat seal conditions.

[0038] The sealant layer 3 preferably contains inorganic particles in addition to the resin. The inorganic particles may contribute to optimizing the peel strength and improving the antistatic properties. Examples of inorganic particles include sulfide particles such as zinc sulfide, copper sulfide, cadmium sulfide, nickel sulfide, and palladium sulfide, metal oxides such as aluminum oxide, tin oxide, zinc oxide, indium oxide, and titanium oxide, carbon fine particles, and silica. Metal oxides are preferred as inorganic particles because of their availability and ease of adjusting the peel strength. In order to improve antistatic properties, it is preferable to use tin-doped indium oxide (ITO) or antimony-doped tin oxide (ATO) as the inorganic particles. These inorganic particles are transparent, and are therefore preferable in that they maintain the light transmittance of the cover tape 10 and ensure the visibility of the electronic components.

[0039] The average particle size of the inorganic particles is preferably 10 to 1000 nm, and more preferably 50 to 500 nm. When the sealant layer 3 contains inorganic particles, the amount thereof is, for example, 1 to 20 parts by mass, and preferably 1 to 10 parts by mass, relative to 100 parts by mass of the resin (thermoplastic resin).

[0040] To impart an antistatic effect to the sealant layer 3, the sealant layer 3 may contain a conductive filler such as a metal oxide, a polymeric copolymer-type antistatic agent, etc. (The inorganic particles described above may also serve as a conductive filler.) The sealant layer 3 may further contain additives such as a dispersant, a filler, and a plasticizer, as necessary.

[0041] The thickness of the sealant layer 3 is preferably 0.1 to 5 μm, more preferably 0.5 to 3 μm, from the viewpoint of obtaining sufficient heat sealing properties without excessively impairing other performances.

[0042] [Other layers] The cover tape 10 may or may not include layers other than those described above. For example, an adhesive layer may be present between the base layer 1 and the polyamide-containing layer 2. In other words, an adhesive layer may be provided for bonding the film constituting the base layer 1 and the film constituting the polyamide-containing layer 2 together.

[0043] As a material for forming the adhesive layer, a combination of a polyol such as polyester polyol or polyether polyol with an isocyanate compound can generally be used. The adhesive layer can be formed from a known solvent-based or water-based anchor coating agent, such as an isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, or alkyl titanate-based anchor coating agent. Furthermore, examples of materials for forming the adhesive layer include urethane-based adhesive resin materials for dry lamination.

[0044] Incidentally, adhesion can be further improved by subjecting the adhesive surface to corona treatment. The conditions for corona treatment can be adjusted appropriately.

[0045] When an adhesive layer is present, its thickness is preferably 0.001 to 10 μm, more preferably 0.01 to 5 μm. By setting the thickness to an appropriate value, it is possible to obtain sufficient adhesiveness while suppressing a decrease in visibility.

[0046] An adhesive layer may also be present between the polyamide-containing layer 2 and the intermediate layer 2B. In this case, the specific embodiment of the adhesive layer may be the same as the adhesive layer that may be present between the base layer 1 and the polyamide-containing layer 2.

[0047] [F MD and F TD About F MD / F TD In addition to the value of 0.95 to 1.05, F MD , F TD By setting these values ​​appropriately, the cover tape 10 tends to be more resistant to "puncture" and "bending." MD , F TD When each of these values ​​is appropriate, the cover tape 10 also tends to be resistant to "tear."

[0048] From the viewpoint of further increasing the strength of the cover tape 10 and from the viewpoint of material availability and manufacturability, F MD , F TD The preferred ranges for each are as follows: F MD Preferably 550 to 1900 N / cm, more preferably 650 to 1800 N / cm, and even more preferably 750 to 1700 N / cm F TD Preferably 600 to 2000 N / cm, more preferably 700 to 1900 N / cm, and even more preferably 800 to 1800 N / cm

[0049] By the way, F MD / F TD is preferably 0.97 to 1.03, more preferably 0.99 to 1.01.

[0050] [Other characteristics of Cover Tape 10] The tensile modulus of elasticity measured in accordance with IS K 7161 is preferably 1500 to 2000 MPa. When the tensile modulus of elasticity of the bar tape 10 is appropriate, the cover tape 10 also tends to be strong against "tension."

[0051] [Method of manufacturing the cover tape 10] As mentioned above, F MD / F TD The cover tape 10 having a coefficient of elasticity of 0.95 to 1.05 can be manufactured by selecting an appropriate material and employing an appropriate manufacturing method.

[0052] In particular, the key to obtaining the cover tape 10 is to use a polyamide (nylon) film whose longitudinal and transverse stretching ratios are highly controlled, thereby ensuring appropriate values ​​for the tear strength in the MD direction and the tear strength in the TD direction, and the ratio between these. Specifically, the value of (MD tear strength) / (TD tear strength) of the film for forming the polyamide-containing layer is preferably about 0.80 to 1.80. Furthermore, the MD tear strength of the film for forming the polyamide-containing layer is preferably about 3000 to 5000 N / cm. Furthermore, the TD tear strength of the film for forming the polyamide-containing layer is preferably about 1900 to 4000 N / cm. Such films can be obtained, for example, by "custom-ordering" them from a film manufacturer. Just to be clear, it is not difficult to manufacture a polyamide (nylon) film with the same level of tear strength in the MD and TD directions, as described above. By starting with the manufacturing conditions for existing polyamide (nylon) films and conducting several "trial experiments" in which the stretching conditions and other conditions are changed, and understanding the relationship (trend) between the changed conditions and the tear strength in the MD / TD directions, it is entirely possible to manufacture a polyamide (nylon) film with the same level of tear strength in the MD and TD directions.

[0053] For reference, let us consider conventional "non-custom" polyamide (nylon) film. Among commercially available polyamide (nylon) films, some have the same longitudinal and transverse stretch ratios listed in their catalogs. At first glance, the MD and TD strengths of such films appear to be comparable. However, according to the inventors' findings and research, for example, the longitudinal and transverse stretch ratios may not be strictly controlled due to production costs, or factors other than stretching may exist in process conditions that cause differences in MD and TD strengths. Furthermore, even in biaxial stretching, sequential biaxial stretching tends to result in differences in MD and TD strengths in the resulting film. Furthermore, depending on the resin structure and physical properties of the polyamide (nylon), it may not always be possible to produce films with substantially the same MD and TD strengths, even when the longitudinal and transverse stretch ratios are the same. In other words, it may not have been common to find polyamide (nylon) films with the same or nearly the same tear strength in the MD and TD directions. Furthermore, it was not known to apply such polyamide (nylon) films to cover tapes.

[0054] Incidentally, the cover tape 10 has a multi-layer structure, and to the best of the inventor's knowledge, the strength in the MD direction and the strength in the TD direction of the polyamide-containing film for constituting the polyamide-containing layer 2 are different from the strength in the F of the cover tape 10. MD / F TD The film and material constituting the base layer 1, the intermediate layer 2B and the sealant layer 3 contribute particularly to the value of F MD / F TD The contribution of the polyamide-containing layer 2 to the value of is small compared to the contribution of the polyamide-containing layer 2. (Of course, the base layer 1, the intermediate layer 2B, and the sealant layer 3 may also be different depending on the materials constituting these layers.) MD / F TD The value of can be less than 0.95 or greater than 1.05.)

[0055] <Electronic component packaging> FIG. 2 is a diagram schematically illustrating the electronic component packaging body 100. As shown in FIG. The electronic component packaging body 100 is composed of the above-mentioned cover tape 10 and the carrier tape 20 in which the electronic components are accommodated in the pockets 21 (recesses).

[0056] 2, the cover tape 10 is used as a lid for a strip-shaped carrier tape 20 having a continuous series of recessed pockets 21 formed to fit the shapes of electronic components. Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire openings of the pockets 21 of the carrier tape 20.

[0057] The electronic component packaging body 100 can be produced, for example, by the following procedure. First, electronic components are placed in the pockets 21 of the carrier tape 20 . Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by a heat sealing method so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the sealant layer 3 of the cover tape 10 is in contact with the carrier tape 20 (that is, the heat sealing is performed so that the "back surface" of the cover tape 10 in FIG. 2 becomes the sealant layer 3). In this way, a structure (electronic component packaging body 100) in which electronic components are hermetically housed is obtained.

[0058] The specific method and conditions for heat sealing are not particularly limited as long as the cover tape 10 is sufficiently strongly adhered to the carrier tape 20. Typically, a known taping machine is used, and the heat sealing can be performed at a heating temperature of 100 to 240°C, a load of 0.1 to 10 kgf (0.98 to 98 N), and a heating time of 0.0001 to 1 second.

[0059] The material of the carrier tape 20 is not particularly limited as long as it can adhere the cover tape 10 by heat sealing. The material can be made of resin, such as a material containing polystyrene resin, a material containing polycarbonate resin, or a material containing polyethylene terephthalate resin, or paper. Among these, resin is preferred from the viewpoint of effectively improving peel strength.

[0060] The electronic component package 100 is wound, for example, on a reel and then transported to a work area where the electronic components are mounted on an electronic circuit board, etc. The reel may be made of metal, paper, plastic, or the like.

[0061] After the electronic component package 100 is transported to the work area, the cover tape 10 is peeled off from the carrier tape 20, and the housed electronic components are taken out.

[0062] There are no particular limitations on the electronic components housed in the electronic component packaging 100. Examples include general components used in the manufacture of electrical and electronic devices, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes.

[0063] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0064] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. However, it should be noted that the present invention is not limited to the Examples.

[0065] <Preparation of polyamide film> We requested a film manufacturer to prepare the following polyamide films.

[0066] [Used in Example 1] Nylon 6, thickness: 20 μm, stretch ratio: 5x lengthwise, 5x widthwise (Note 1), tear strength in MD direction of film alone: ​​3580 N / cm, tear strength in TD direction of film alone: ​​2580 N / cm (Note 2) (Note 1: The stretching ratio was adjusted to 5 times vertically and 5 times horizontally as standard, so that the tear strength in the MD and TD of the film alone would be the values ​​listed above.) (Note 2: The tear strength is measured by the method described below.) MD , tear strength in the TD direction F TD However, the measurement was carried out three times, and the average values ​​of the MD tear strength and TD tear strength were reported above.

[0067] [Used in Example 2] Nylon 6, thickness: 20 μm, stretch ratio: 6 times vertically and 6 times horizontally (Note 3), tear strength in MD direction of film alone: ​​4400 N / cm, tear strength in TD direction of film alone: ​​5020 N / cm (Note 4) (Note 3: The stretching ratio was adjusted to 6 times vertically and 6 times horizontally as a standard, so that the tear strength in the MD and TD of the film alone would be the values ​​listed above.) (Note 4: The tear strength was measured using the same method as in Example 1 above.)

[0068] [Used in Example 3] Nylon 6, thickness: 30 μm, stretch ratio: 5x lengthwise, 5x widthwise (Note 5), tear strength in MD direction of film alone: ​​3500 N / cm, tear strength in TD direction of film alone: ​​2000 N / cm (Note 6) (Note 5: The stretching ratio was adjusted to 5 times vertically and 5 times horizontally as standard, and the tear strength in the MD and TD directions of the film alone was adjusted to the values ​​shown above.) (Note 6: The tear strength was measured using the same method as in Example 1 above.)

[0069] [Used in Comparative Example 1] Nylon 6, thickness: 20 μm, tear strength in MD direction of film alone: ​​4300 N / cm, tear strength in TD direction of film alone: ​​2100 N / cm (This film is also a stretched film, but the "fine adjustment" of the stretch ratio as described above has not been performed.)

[0070] <Cover tape manufacturing> The films (cover tapes) of Examples 1 to 3 and Comparative Example 1 were produced according to the following procedure. (1) As a substrate layer, a 9 μm thick polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., Espet (registered trademark) E5100) that had been subjected to antistatic treatment was prepared. (2) The polyamide film was laminated on the corona-treated surface of the substrate layer by dry lamination using a urethane adhesive, thereby providing a polyamide-containing layer. (3) After the exposed surface of the polyamide-containing layer was subjected to a corona treatment, a polyethylene film (Sumitomo Chemical Co., Ltd.'s "Sumikathene L705" film thickness 25 μm) was laminated to the surface by dry lamination using a urethane adhesive in Examples 1 and 2 and Comparative Example 1, and a polyethylene film (Sumitomo Chemical Co., Ltd.'s "Sumikathene L705" film thickness 15 μm) was laminated to the surface by dry lamination in Example 3. (4) A coating solution containing 30% by mass of acrylic sealant resin (DIC Corporation, A450A), 2% by mass of aluminum oxide with an average particle size of 100 nm, and 68% by mass of toluene was applied and dried at 70°C to form a sealant layer. The amount of coating was adjusted so that the film thickness after drying would be 2 μm.

[0071] In addition, the film of Comparative Example 2 was produced in the same manner as above, except that (2) was not performed and in (3) a polyethylene film having a thickness of 45 μm (Sumitomo Chemical Co., Ltd.'s "Sumikasen L705" having a thickness of 45 μm) was laminated by the dry lamination method.

[0072] In addition, the film of Comparative Example 3 was produced in the same manner as above, except that (2) was not performed and in (3) a polyethylene film having a thickness of 15 μm (Sumitomo Chemical Co., Ltd.'s "Sumikasen L705", thickness 15 μm) was laminated by the dry lamination method.

[0073] <Tear strength in MD direction of cover tape F MD , tear strength in the TD direction F TD Measurement of Measurement was performed according to the "Right-Angle Tear Method" of JIS K 7128-3. Specifically, the manufactured cover tape was first cut out to prepare test pieces with right-angled portions of the shape and size shown in Figure 3. For each cover tape, two test pieces were prepared: one in which the direction indicated by arrow a in Figure 3 was the MD direction, and the other in which the direction indicated by arrow a in Figure 3 was the TD direction. Next, the prepared test specimen was torn at a test speed of 200 mm / min using a tensile tester RTH-1225 manufactured by A&D Co., Ltd. The maximum load at this time was defined as the tear strength (F MD or F TD ) was decided. Incidentally, the measurements were carried out three times in each direction, and the average value of the three measurements was used.

[0074] <Measurement of tensile modulus of cover tape> The test was carried out according to the method described in JIS K 7161. Specifically, the test was carried out as follows. First, the manufactured cover tape was cut into a No. 1 dumbbell-shaped test piece. Next, the prepared test piece was set in A&D's tensile testing machine "RTH-1225." It was then pulled at a test speed of 1 mm / min. The pulling direction was the longitudinal direction of the cover tape, i.e., the MD direction. The maximum stress at this time was taken as the tensile strength.

[0075] <Evaluation of puncture strength> The tip of a needle with a 0.5 mm radius of curvature was thrust into the resulting cover tape (laminated film) from the base layer side (polyethylene terephthalate side) and pushed perpendicularly into the cover tape at a speed of 500 mm / min. The load applied to the needle was then read at the moment the needle penetrated the cover tape. This reading was used as the "piercing strength."

[0076] <Evaluation of resistance to bending> The obtained cover tape (laminated film) was flexed using a Gelbo flex tester at a temperature of 23°C and 500 flexes in accordance with ASTM F392. After the test, the cover tape was visually inspected and the number of pinholes was counted.

[0077] The above is summarized in Table 1.

[0078] [Table 1]

[0079] From the table above, F MD / F TD It can be seen that the cover tapes of Examples 1 to 3, in which the value is close to 1, are strong against "piercing" and "bending" and are less likely to be damaged. [Explanation of symbols]

[0080] 1 Base material layer 2. Polyamide-containing layer 2B Middle layer 3 Sealant Layer 10 Cover tape (cover tape for packaging electronic components) 20 Carrier tape 21 pockets 100 Electronic component packaging body

Claims

1. a substrate layer; a polyamide-containing layer provided on one surface of the base material layer; a sealant layer provided on the surface of the polyamide-containing layer opposite to the substrate layer; A cover tape for packaging electronic components, comprising: The tear strength of the cover tape in the MD direction measured in accordance with JIS K 7128-3 is F ＭＤ , the tear strength of the cover tape in the TD direction is F ＴＤ When F ＭＤ / F ＴＤ The cover tape has a viscosity of 0.95 to 1.

05.

2. 2. The cover tape of claim 1, F ＭＤ is 550 to 1900 N / cm, and F ＴＤ The cover tape has a strength of 600 to 2000 N / cm.

3. The cover tape according to claim 1 or 2, The polyamide-containing layer of the cover tape comprises at least one resin selected from the group consisting of nylon 6, nylon 66, nylon 11, and nylon 12.

4. The cover tape according to claim 1 or 2, The polyamide-containing layer has a thickness of 5 to 30 μm.

5. The cover tape according to claim 1 or 2, The polyamide-containing layer of the cover tape is composed of a biaxially oriented polyamide film.

6. The cover tape according to claim 1 or 2, The cover tape further comprises an intermediate layer provided between the polyamide-containing layer and the sealant layer.

7. 7. The cover tape according to claim 6, The intermediate layer of the cover tape comprises a polyethylene-based resin.

8. The cover tape according to claim 1 or 2, The cover tape includes a base layer containing a polyester resin.

9. The cover tape according to claim 1 or 2, The cover tape, wherein the sealant layer contains a (meth)acrylic resin.

10. The cover tape according to claim 1 or 2, A cover tape having a tensile modulus of elasticity measured in accordance with JIS K 7161 of 1500 to 2000 MPa.

11. 7. The cover tape according to claim 6, The cover tape wherein the intermediate layer comprises low density polyethylene (LDPE) or linear low density polyethylene (L-LDPE).

12. A carrier tape having electronic components housed in recesses and the cover tape according to claim 1 or 2, An electronic component package in which the sealant layer is adhered to the carrier tape so as to seal the electronic component.

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