Integrated structure, two Radar Modular Assemblies (RMA) stackable radars

Abstract

A radar array assembly is provided that includes a first chassis and a first vertical stiffener. The first chassis is configured to house a first set of array electronics and a second set of array electronics. The first vertical stiffener is disposed within and operatively coupled to the first chassis, enabling the first chassis to be resistant to buckling and defining a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed. The first vertical stiffener is configured to be incorporated within the first set of array electronics and the second set of array electronics, and the first vertical stiffener includes a first integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics.

Description

[Technical Field]

[0001] Embodiments of the present disclosure relate generally to devices, systems, and methods for operating devices such as radar systems. More particularly, the present disclosure describes embodiments relating to devices, systems, and methods for creating modular, scalable, and stackable phased array radar systems. [Background technology]

[0002] Antenna arrays for radar systems may include active electronically scanned array (AESA) antennas, as known in the art. Typically, the basic building block of an AESA is a transmit / receive (T / R) module, which can be packaged to form an AESA antenna element and can include a radiator, a receive low-noise amplifier (LNA), a transmit power amplifier (PA), and various digitally controlled phase or delay and gain components. Several of these T / R modules are arranged in an antenna panel in a grid format for transmitting and receiving radar signals. By digitally controlling the transmit and receive gain and phase, the AESA antenna can steer or point the resulting antenna beam without physically moving the antenna panel. Modern low-cost AESA antenna panels use printed circuit radiators connected to surface-mount monolithic microwave integrated circuit (MMIC) devices. The MMIC devices include the LNA, PA, and phase / gain control circuitry, all implemented on a single printed circuit board (PCB).

[0003] In recent years, AESA antenna array architectures have been developed using modular and / or stackable components. FIG. 1 is a diagram of a prior art antenna array 100 architecture constructed using modular, stackable components as described in several commonly assigned patents and patent applications, including U.S. Pat. No. 8,810,448, entitled "Modular Architecture for Scalable Phased Array Radars," issued August 19, 2014; U.S. Pat. No. 9,116,222, entitled "Modular Architecture for Scalable Phased Array Radars," issued August 25, 2015 (a division of U.S. Pat. No. 8,810,448); and U.S. Patent Publication No. 20210083399, entitled "Modular and Stackable Antenna Array," having application serial number 16 / 573,954, filed September 17, 2019, and published March 18, 2021 (hereinafter the "'954 application"), the disclosure of each of which is incorporated herein by reference.

[0004] As shown in FIG. 1 and further described in the above-referenced patents, multiple power and beamforming building blocks 102 can be arranged in rows and columns in an array 116. Each modular building block (MBB) 102 (also referred to herein as a radar modular assembly (RMA) and / or functional building block (FBB)) can include multiple transmit / receive integrated multi-channel module (TRIMM) cards 110 and their associated power and signal electronics cards, such as multiple TRIMMs, synthesizer cards, DREX (digital receiver exciter) cards 106, synthesizers 108, and auxiliary power controller cards 104. In some embodiments, the RMA 102 can be based on the radar module 10 shown in FIG. 2, similar to the radar module 10 of FIG. 1A of the '448 patent.

[0005] As described in the '448 patent, the radar module 10 includes a chassis 11 including a top cold plate 12, a supply manifold 14a with an inlet port 42, a return manifold 14b with an outlet port 22, a bottom cold plate 16, and a front plate 18. The chassis 11 is configured to hold LRUs (e.g., circuit cards) such as a transmit / receive integrated microwave module (TRIMM) 32, which includes a transmit / receive (T / R) module 33, a dual digital receiver exciter (DDREX) module 34, a synthesizer module 36, and an auxiliary / controller module 40. The chassis 11 performs cooling functions. For example, the T / R module 33 generates a large amount of heat that must be dissipated or active circuitry (e.g., a power amplifier) ​​will not operate properly. The supply manifold 14a includes channels that receive coolant at the inlet port 42. Coolant circulates throughout the chassis 11, is removed by the return manifold 14b, and exits through the outlet port 22. In particular, the chassis 11 acts as a heat sink, drawing heat away from the active circuitry (e.g., in the T / R module 33). The chassis 11 includes set screws 46 attached to the supply manifold 14a and the return manifold 14b.

[0006] In this exemplary architecture of the RMA 102, each individual TRIMM card 110 may be replaceable, and the architecture may be modular in modular building blocks. Multiple MBB / RMAs 102 may be combined to form a modular radar assembly (MRA), and multiple MRAs may be combined together to form a radar antenna array 114. As further described in the aforementioned '954 application, in the example of FIG. 1, groups of RMAs 102, along with their own support structures 122, may be combined to form building block sections 112 of the modular radar assembly (MRA) 114, where each section 112 is configured with its own respective connections for power, cooling, control signals, and beamforming, coupled in parallel so that each section 112 can function independently of each other section. In the antenna array 100 of FIG. 1, this allows antenna arrays of any desired size to be created, including by combining sections 112 (e.g., by stacking or placing them adjacent to each other) and forming the array surface 120 by aligning the faces of each respective MRA subsection 112 to create a single uniform array surface 120. Summary of the Invention

[0007] The following presents a simplified summary in order to provide a basic understanding of one or more aspects of the embodiments described herein. This summary is not an extensive overview of all possible embodiments, and is not intended to identify key or essential elements of the embodiments or to delineate their scope. Rather, the primary purpose of this summary is to present some concepts of the embodiments described herein in a simplified form as a prelude to the more detailed description that is presented later.

[0008] For example, the embodiment described in the '954 application, as shown in FIG. 1, can provide a useful, scalable, stackable option for creating radar systems capable of manufacturing antenna arrays of any size while maintaining the ability to easily increase the size, sensitivity, and functionality of the antenna array. However, due to the large size and weight of the support structure 122 (FIG. 1) located behind the array 114 itself (and, indeed, behind each section 112), the embodiment may not be well suited for smaller radar systems that may require only a few RMAs 102 (e.g., two to eight RMAs 102). Several applications are being developed that require smaller radars, such as radars with sizes in the range of two to six MBBs. One problem with these applications is that the smaller radars do not use support structures 122 due to their size and weight, so each size and configuration may require a new structural design. Thus, if a radar built using a standard MBB 102 becomes smaller, it may be necessary to design a new support structure for each smaller radar configuration.

[0009] Another issue with the arrangement of FIG. 1 is that it can be difficult to maintain a grid structure along the edges or along each MRA 114, such as in some embodiments of the modular radar assembly (MRA) 114. As a result, gaps may exist between the edges of the MRAs in some implementations. As understood in the art, maintaining consistent grid spacing is important in antenna operation. For example, the higher the frequency at which an antenna operates, the tighter the grid spacing between active elements is required, leaving less space for active circuitry or other functions. If λ / 2 (half a wavelength at the transmit frequency) spacing is required for wide scan angles, the grid spacing becomes even tighter. Gaps in the grid can cause problems such as undesirable changes in the antenna pattern and grounding issues. When multiple antenna elements operate together to create an antenna pattern (e.g., when the antenna elements are excited in unison), having a common ground potential between the elements can also be very important. If the grounds are separated, or if the grid spacing becomes inconsistent and / or becomes too large, those skilled in the art will appreciate that the quality of the resulting antenna pattern (produced by multiple antenna elements at once) may be degraded and problems including signal loss, resonance effects, "suckout" (nulls), etc. may occur.

[0010] The use of a structure such as the radar module 10 (FIG. 1) as part of the RMA 102 and / or MRA 114 can present challenges in maintaining the aforementioned grid spacing because this design (e.g., as shown in FIG. 1A of the '448 patent and described above in the description of FIG. 1) includes its cooling manifolds (e.g., supply manifold 14a and return manifold 14b), including inlet ports 42 and outlet ports 22, along the outer wall of the chassis 11. The space and thickness that this manifold arrangement occupies (on both sides of the chassis 11) can increase the size of the gap between the MRAs (especially when adjacent MRAs 102 each have this same structure to position the cooling manifolds from one MRA relative to the cooling manifolds from another MRA). The space occupied by these manifolds on the outside of the chassis can make it difficult to maintain the grid and grid spacing at the edges of the antenna array.

[0011] Certain embodiments herein help address at least this issue by further elaborating on the RMA designs described in the '448 patent and the '354 application, for example, by creating a single two-RMA structure with a single shared cooling manifold arrangement disposed between the two RMAs, allowing the outer walls of the two-RMA arrangement to be thinner because they do not need to have both manifolds housed within them. Thus, the overall arrangement of the two RMAs according to embodiments herein allows for closer grid spacing on the antenna plane compared to using two RMAs 102 of FIG. 1 using the chassis 11 shown in FIG. 1 . Furthermore, the central shared manifold between the two RMAs is also configured within the array grid (between the TRIMMs) to act as an internal support structure for the RMAs within the building block itself. For example, in certain embodiments, additional structure is added to modify the chassis 11 by providing additional internal support via a stiffener structure that is also configured to house the cooling manifold. The additional support and strength added by the stiffener structure allows the two-RMA structure to be stackable without the need for the bulky and heavy support structure 122 of Figure 1. In certain embodiments, stackability may allow for the creation of smaller sized radars, such as up to three double-RMA units high, depending on any desired width.

[0012] Additionally, certain embodiments herein extend and improve upon the above-described system by allowing radars to be formed using the double RMA structures described in certain embodiments herein without requiring significant additional structure behind the array. For example, certain embodiments provide RMA structures with built-in self-support via the vertical manifold and array plate. Thus, the double RMA structures herein are self-supporting (i.e., have built-in self-support, particularly via the vertical stiffeners and array plate, described further below) and stackable, allowing for many possible configurations with little to no NRE (non-recurring engineering) costs. Limited custom structure may be provided to allow the formed radar to have the correct height (e.g., by placing it on a tower, pedestal, or other separate structure), movement (e.g., by placing it on a rotating structure), and / or mobility (e.g., by placing it on a ship, moving vehicle, truck, aircraft, etc.).

[0013] In one aspect, a radar array assembly is provided that includes a first chassis and a first vertical stiffener. The first chassis is configured to house a first set of array electronics and a second set of array electronics. The first vertical stiffener is disposed within and operably coupled to the first chassis, enabling the first chassis to be buckling resistant and defining a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed. The first vertical stiffener is configured to be integrated within the first set of array electronics and the second set of array electronics, and the first vertical stiffener includes a first integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics.

[0014] In some embodiments, the first chassis includes a first channel configured to allow coolant to flow therethrough, the first vertical stiffener includes a second channel configured to allow coolant to flow therethrough, the first and second channels being in operative communication. In some embodiments, the radar array assembly further includes a first array plate having a first side and a second side opposite the first side, the first array plate coupled to the first vertical stiffener, the first array plate including a third channel configured to allow coolant to flow therethrough, the third channel being in operative communication with at least one of the first and second channels.

[0015] In some embodiments, the radar array assembly further includes a first array plate having a first side and a second side opposite the first side, the first array plate coupled to the first vertical stiffener, the first array plate configured to support a first radiator assembly and a second radiator assembly, the first radiator assembly and the second radiator assembly being in operative communication with the first set of array electronics and the second set of array electronics, respectively, the first array plate configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface. In some embodiments, the first vertical stiffener and the first array plate, when combined with the first chassis, provide built-in self-support to the radar array assembly. In some embodiments, the first vertical stiffener and the first array plate, when combined with the first chassis, are configured to allow the first chassis to be stacked on a second chassis identical to the first chassis, doubling the size of the single monolithic array surface.

[0016] In some embodiments, the radar array assembly further includes a first array plate having a first side and a second side opposite the first side, the first array plate coupled to the first vertical stiffener, the first array plate having a first portion associated with a first set of array electronics and a second portion associated with a second set of array electronics; a first radiator assembly operably coupled to the first portion of the first array plate and configured to be in operative communication with the first set of array electronics; and a second radiator assembly operably coupled to the second portion of the first array plate and configured to be in operative communication with the second set of array electronics, wherein the first array plate is configured to support the first radiator assembly and the second radiator assembly and to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface.

[0017] In some embodiments, the radar array assembly includes a first array plate having a first side and a second side opposite the first side, the first array plate coupled to a first vertical stiffener, the first array plate configured to support a first radiator assembly and a second radiator assembly, the first radiator assembly and the second radiator assembly being in operative communication with a first set of array electronics and a second set of array electronics, respectively, the first array plate being configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface; a second chassis operatively coupled to the first chassis, the second chassis configured to house a third set of array electronics and a fourth set of array electronics, the third set of array electronics and the fourth set of array electronics being coupled to the second chassis by respective second support structures housed within the second chassis; and a second chassis operatively coupled to the first chassis, the second chassis being buckling resistant and the third a second vertical stiffener disposed within and operably coupled to the second chassis to enable the second chassis to define a third cavity in which a third set of array electronics is disposed and a fourth cavity in which a fourth set of array electronics is disposed, the second vertical stiffener being configured to be incorporated within the third set of array electronics and the fourth set of array electronics, the second vertical stiffener including a second integrated cooling manifold configured to cool both the third set of array electronics and the fourth set of array electronics; and a second array plate having a first side and a second side opposite the first side, the second array plate coupled to the second vertical stiffener, the second array plate configured to support a third radiator assembly and a fourth radiator assembly, the third radiator assembly and the fourth radiator assembly being in operative communication with the third set of array electronics and the fourth set of array electronics, respectively, the second array plate supporting the third radiator assembly and the fourth radiator assembly as part of a single monolithic array surface;and a second array plate configured to enable the first radiator assembly and the second radiator assembly to be interlocked and aligned.

[0018] In certain embodiments, the first chassis includes a first side disposed adjacent to the first cavity and a second side disposed adjacent to the second cavity, and the second chassis is operably coupled to the first chassis along one of the first side and the second side. In certain embodiments, the second chassis is stacked on top of the first chassis.

[0019] In some embodiments, the first chassis includes a first side positioned adjacent to the first cavity and a second side positioned adjacent to the second cavity, the second chassis includes a third side positioned adjacent to the third cavity and a fourth side positioned adjacent to the fourth cavity, and the radar array assembly further includes a splice plate configured to secure at least one of the first side and the second side of the first chassis to at least one of the third side and the fourth side of the second chassis.

[0020] In some embodiments, the radar array assembly further includes a top plate operably coupled to the top of the first chassis and configured to cover the top surface of the first vertical stiffener and the top side of the first cavity, and a bottom plate operably coupled to the bottom of the first chassis and configured to cover the bottom surface of the first vertical stiffener and the bottom side of the first cavity and the bottom side of the second cavity, the top plate, the bottom plate, and the first chassis cooperating to provide a watertight, electromagnetic interference (EMI) resistant housing for the first set of array electronics and the second set of array electronics.

[0021] In another aspect, a radar module is provided that includes a first set of array electronics, a second set of array electronics, a chassis, a vertical stiffener, and an array plate. The first set of array electronics is in operative communication with a first set of radiators integrated within a first radiator assembly. The second set of array electronics is in operative communication with a second set of radiators integrated within a second radiator assembly. The chassis is configured to house the first set of array electronics and the second set of array electronics, and the first set of array electronics and the second set of array electronics are coupled to the chassis by respective support structures housed within the chassis. a vertical stiffener disposed within the chassis and operably coupled to the chassis to enable the chassis to be buckling resistant, the vertical stiffener configured to be incorporated within the first set of array electronics and the second set of array electronics, the vertical stiffener configured to define within the chassis a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, the vertical stiffener including an integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics; an array plate having a first side and a second side opposite the first side, the array plate coupled to the vertical stiffener and configured to support the first radiator assembly and the second radiator assembly, the array plate configured to enable the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface of the radar module.

[0022] In some embodiments, the chassis includes a first channel configured to allow coolant to flow therethrough, the vertical stiffener includes a second channel configured to allow coolant to flow therethrough, the first and second channels being in operative communication. In some embodiments, the array plate includes a third channel configured to allow coolant to flow therethrough, the third channel being in operative communication with at least one of the first and second channels. In some embodiments, the first channel is in operative communication with at least one of a coolant inlet port and a coolant outlet port integrated within the vertical stiffener. In some embodiments, the integrated cooling manifold further includes a supply manifold in operative communication with the coolant inlet port and a return manifold in operative communication with the coolant outlet port.

[0023] In some embodiments, each of the first set of array electronics and the second set of array electronics includes a respective plurality of radar transmit / receive (T / R) modules, each T / R module including a power source and a beamforming signal, the power source and the beamforming signal being connected in parallel to each of the first set of radiators and the second set of radiators.

[0024] In another aspect, an antenna array is provided that includes a plurality of stacked radar modules, each radar module including a first set of array electronics, a second set of array electronics, a chassis, a vertical stiffener, and an array plate.

[0025] The first set of array electronics is in operative communication with a first set of radiators integrated within a first radiator assembly. The second set of array electronics is in operative communication with a second set of radiators integrated within a second radiator assembly. The chassis is configured to house the first set of array electronics and the second set of array electronics, with the first set of array electronics and the second set of array electronics coupled to the chassis by respective support structures housed within the chassis. The vertical stiffener is disposed within the chassis to enable the chassis to be buckling resistant, and is operatively coupled to the chassis, the vertical stiffener configured to be incorporated within the first set of array electronics and the second set of array electronics, and configured to define within the chassis a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, the vertical stiffener including an integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics. The array plate has a first side and a second side opposite the first side, the array plate is coupled to the vertical stiffener and configured to support the first radiator assembly and the second radiator assembly, the array plate being configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface for each radar module.

[0026] In some embodiments, the chassis, vertical stiffener, and array plate of each radar module are configured to allow the respective monolithic array surface for each radar module to align with the respective monolithic array surfaces for each other respective radar module in the plurality of radar modules to create a single monolithic array surface of the antenna array, the single monolithic array surface having no interruptions in the array lattice of the single monolithic array surface of the antenna array.

[0027] It should be understood that individual elements of different embodiments described herein can be combined to form other embodiments not specifically described above. Various elements described in the context of a single embodiment may be provided separately or in any suitable subcombination. It should be understood that other embodiments not specifically described herein are also within the scope of the claims contained herein.

[0028] Details regarding these and other embodiments are described more fully herein.

[0029] Advantages and aspects of the described embodiments, as well as the embodiments themselves, will be more fully understood in conjunction with the following detailed description and accompanying drawings. [Brief explanation of the drawings]

[0030] [Figure 1] FIG. 1 is a diagram of a prior art antenna array constructed using a radar modular assembly (RMA), according to one embodiment. [Figure 2] FIG. 1 is a diagram of a prior art radar module, according to one embodiment. [Figure 3] FIG. 1 is a diagram of an exemplary radar building block assembly made using two Radar Modular Assembly (RMA) radar building blocks ("IS2RMA"), including an array plate and vertical stiffener assembly, according to one embodiment. [Figure 4] FIG. 4 is a diagram of the array plate and vertical stiffener assembly of FIG. 3 according to one embodiment. [Figure 5] FIG. 10 is a first view of the chassis of the IS2RMA showing the array plate and vertical stiffener assemblies installed and the top cover plate removed, according to one embodiment. [Figure 6] FIG. 6 is a second view of the chassis of the IS2RMA of FIG. 5 with a top cover plate installed, according to one embodiment. [Figure 7]FIG. 7 is a third view of the chassis of the IS2RMA of FIG. 6 with array electronics installed and both rear covers removed, according to one embodiment. [Figure 8A] FIG. 10 is a diagram of another embodiment of an IS2RMA chassis with an array plate and vertical stiffeners showing cooling manifold routing, according to one embodiment. [Figure 8B] FIG. 8B is an exemplary block diagram of the RMA's S-band array electronics installed within the chassis of FIG. 8A, according to one embodiment. [Figure 9A] FIG. 1 is a diagram of an exemplary 4-RMA radar made from a stack of two IS2RMAs joined together and including a splice plate, according to one embodiment. [Figure 9B] 9B is an illustration of a cutaway view of the exemplary 4-RMA radar of FIG. 9A, according to one embodiment. [Figure 10A] 9B is a partial exploded view of the partially assembled chassis of the 4-RMA radar of FIG. 9A showing a front view of the array plate and vertical stiffeners before the antenna radiator is installed, according to one embodiment. [Figure 10B] 9A and 10A, showing a front view of the partially assembled chassis after the antenna radiator has been installed, according to one embodiment. [Figure 10C] 10B is a diagram of a partially assembled chassis of the 4-RMA radar of FIG. 9A showing a front view of the fully assembled exploded assembly of FIG. 10A before the antenna radiator is installed, according to one embodiment. [Figure 10D] FIG. 1 is a rear view of a partially assembled chassis of a 2-RMA radar showing a rear view of the array plate and vertical stiffeners installed within the chassis, according to one embodiment. [Figure 11A] FIG. 9B is a front view of a partially assembled chassis of the 4-RMA radar of FIG. 9A showing the top cover plate not yet attached, according to one embodiment. [Figure 11B]FIG. 9B is a front view of a partially assembled chassis of the 4-RMA radar of FIG. 9A showing the top and bottom RMAs before being assembled together, according to one embodiment. [Figure 12A] FIG. 2 is a front view of a first portion of an exemplary radar doubling arrangement, according to one embodiment. [Figure 12B] FIG. 10 is an exploded front view of a second portion of an exemplary radar doubling arrangement, according to one embodiment. [Figure 12C] FIG. 10 is a front view of a third portion of an exemplary radar doubling arrangement, according to one embodiment. [Figure 12D] FIG. 10 is a front view of another radar doubling arrangement showing a side-by-side arrangement, according to one embodiment. [Figure 13A] FIG. 1 illustrates a rear perspective view of an exemplary single RMA radar in a 1x1 configuration, according to one embodiment. [Figure 13B] FIG. 1 illustrates a rear perspective view of an exemplary RMA radar in a 2x2 configuration, according to one embodiment. [Figure 13C] FIG. 1 illustrates a rear perspective view of an exemplary RMA radar in a 2x3 configuration, according to one embodiment. [Figure 13D] FIG. 1 illustrates a rear perspective view of an exemplary RMA radar in a 4x1 configuration, according to one embodiment. [Figure 13E] FIG. 1 illustrates a rear perspective view of an exemplary RMA radar in a 4x2 configuration, according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0031] The drawings are not to scale, emphasis instead being placed upon illustrating the principles and features of embodiments of the present disclosure.

[0032] Before describing the details of particular systems, devices, and methods, it should be noted that the concepts disclosed herein include, but are not limited to, novel structural combinations of components and circuits, and are not necessarily limited to their particular detailed configurations. Accordingly, the structure, method, function, control, and arrangement of components and circuits have been illustrated in the drawings, for the most part, by easily understood simplified block diagrams and schematic illustrations, so as not to obscure the disclosure with structural details that will be readily apparent to those skilled in the art having the benefit of the present description.

[0033] Furthermore, the following detailed description is provided, in at least some examples, using the particular context of a target detection system (e.g., a radar system) configured to detect, track, monitor, and / or identify targets, where the targets may include, but are not limited to, aircraft (both unmanned and manned), unmanned aerial vehicles, unmanned autonomous vehicles, robots, ships, spacecraft, autonomous vehicles, and celestial bodies, as well as birds, insects, and rain. At least some embodiments herein may be used with any system associated with any radar application, including, but not limited to, military radar, air traffic control radar, weather surveillance radar, etc.

[0034] It is believed that radar system users and purchasers will prefer to avoid the cost, risk, and extended time required to develop and deploy new radars. Recent radar developments and advancements have focused on the modulation of scalable phased array technology to reduce the design required to tune radar sensitivity and aperture. Examples of such modularization are described in several of the commonly assigned patents and patent applications referenced above. The use of scalable systems, such as the scalable phased array antennas described in the patent documents referenced above, may mean that radar users and customers will be more willing to adapt these mature, available radar solutions to new mission spaces.

[0035] Several applications are being developed that require smaller radars, such as radars with sizes in the range of two to six RMAs. One problem with these applications is that each size and configuration may require a new structural design and / or significant design engineering for each configuration. Certain embodiments herein help to at least address this issue by further expanding on RMA designs known in the art (e.g., those described in the aforementioned '448 patent and '354 application) by including the support structure for the RMA within a building block within the array grid (e.g., between the TRIMMs), thereby eliminating the need for a separate support structure or other structure behind the array. For example, certain embodiments herein are self-supporting and stackable, enabling many possible configurations with little to no NRE (non-recurring engineering) costs.

[0036] In certain embodiments herein, described further below, an integrated structure (IS2RMA) with two stackable RMAs is provided as a building block for constructing even more radar configurations. Because the IS2RMA building blocks are self-supporting, they can be stacked to create many configurations with little to no non-return. In some embodiments, radar configurations are created using a single RMA (half of an IS2RMA), and similar combinations can be created if an odd number of RMAs are required. In certain embodiments, the IS2RMA building block is configured with an integrated internal structure that can support several more building blocks on top, providing a suitable arrangement and configuration for smaller 2-6 RMA radars, allowing the radar to be easily configured to perform mission requirements with little or no new development.

[0037] As further described below, the stackable IS2RMA radar, in certain embodiments, provides the following advantageous features: To provide a fully enclosed, electromagnetic interference (EMI) shielded, weatherproof, integrated structure for a scalable phased array that can be formed into many different types of radar array assemblies and antenna arrays having a single monolithic array surface; providing a chassis having a vertical stiffener including an integrated cooling manifold; Enables delivery and field installation of a fully integrated, calibrated and tested radar; It has an integrated structure that allows for rapid sensitivity improvement by stacking more IS2RMA radars on or along the sides, and allows for multiple units to be stacked without interrupting the array grid; Certain embodiments may adapt, utilize, and / or reuse mature array technology to enable a tower-based radar product line.

[0038] Before describing the details of certain improved systems, devices, and methods, it should be noted that the concepts disclosed herein include, but are not limited to, novel structural combinations of software, components, and / or circuits, and are not necessarily limited to their particular detailed configurations. Accordingly, the structure, method, function, control, and arrangement of components and circuits have been illustrated in the drawings, for the most part, by easily understood simplified mechanical representations and simplified diagrams so as not to obscure the description of the structure with details of external components (e.g., power supplies, control electronics, communications) and cabling and connections that will be readily apparent to those skilled in the art having the benefit of the description herein.

[0039] According to one embodiment, Figure 3 is a diagram 300 of an exemplary radar building block assembly IS2RMA 302 fabricated using two radar modular assembly (RMA) radar building blocks 308, and Figure 4 is a diagram of the array plate and vertical stiffener assembly 310 of Figure 3. The assembly of two RMAs 308 in the particular configuration herein of Figure 3 is referred to as "IS2RMA" and is configured to include a particular chassis 315 (described further herein) and array plate and vertical stiffener assembly 310 (shown in Figure 3 and in more detail in Figure 4) according to one embodiment, along with associated array electronics 317 (see also Figure 8A). The radar building block assembly IS2RMA 302, also referred to herein as IS2RMA 302, includes two RMAs 308 (one shown cut away in Figure 3, exposing the synthesizer card 108). Each RMA 308 is substantially similar to the MBB / RMA 102 previously described in FIG. 1 and includes half of the array electronics 317 in an IS2RMA 302.

[0040] Each RMA 308 contains the same functional components and includes its own respective array electronics set, each of which includes several Transmit / Receive Integrated Multi-Channel Module (TRIMM) cards 110 and their associated power and signal electronics cards, synthesizer cards, DREX (Digital Receiver Exciter) cards 106, synthesizers 108, and auxiliary power controller cards 104. In a particular embodiment, the array electronics set housed in the MBB / RMA 308 includes all of the antenna's electronic hardware and functionality, including radiators, beamformers, TRIMMs, DREXs, and AC / DC power conversion. In a particular embodiment, the set of array electronics 317 is in operative communication with each set of radiators in a radiator assembly 314 integrated into the radome assembly 312. In a particular embodiment, each set of array electronics includes multiple radar transmit / receive (T / R) modules, each including a power source and a beamforming signal, which are connected in parallel to a respective set of radiators within a radiator assembly 314 integrated into the radome assembly 312.

[0041] The building blocks of the MBB / RMA 308 operate in parallel, are standalone (smaller) radars, and can be augmented to adjust the radar's sensitivity, performance, and size, as will be appreciated. It will be appreciated that the exact array electronics 317 shown in the figure is provided by way of example and not limitation, and that one skilled in the art will recognize that the array electronics 317 can be implemented in a number of different ways. Furthermore, each of these functional components within the array electronics 317 is not specifically depicted in FIG. 3 due to the focus in this figure on the chassis structure and elements therein.

[0042] Each of the two MBB / RMAs 308 in the IS2RMA assembly 302 has its own respective integrated radiator assembly 312, which includes multiple radiators (heat dissipation elements) as part of the radiator assembly 314. The integrated radiator 312 is approximately the same size as the radiator assembly 314, consisting of multiple heat dissipation elements. The integrated radiator 312 includes a radome 309, which in certain embodiments is a protective composite cover. Advantageously, as will be appreciated, the radome 309 is also modular, allowing for stacking. The integrated radiator 312 is configured to attach directly to the radiator assembly 314 and to be part of each MBB / RMA 308. In certain embodiments, the integrated radiators 312 are configured to allow for close and consistent spacing along the array face through the placement of interlocking edges 319, as understood in the art. Thus, the integrated radiator 312 of each MBB / RMA 308 forms part of the array surface in the resulting radar when, for example, IS2RMA assemblies 302 are stacked and combined as described herein, as will be understood. Furthermore, when multiple IS2RMA assemblies 302 are stacked or otherwise combined, the integrated radiator 312 allows the overall array structure to be the same size as the active array surface, rather than extending beyond the edges of the active array surface.

[0043] As can be seen, because the built-in supports provided as part of the IS2RMA 302 assembly do not extend beyond the active area of ​​the array face formed by the multiple integrated radiators 312 interconnected via lattice structure interlocking edges 319, the IS2RMA assemblies 302 can be stacked without interrupting the block spacing between adjacent stacked IS2RMA assemblies 302. Thus, all IS2RMA assemblies 302 can operate identically regardless of array size. The integrated radiators 312 (including their radomes 309) enable the modular stacking approach described herein without interrupting the unit cell spacing between adjacent stacked IS2RMA 308 assemblies, which would adversely affect the system's RF performance. Additionally, the design of the chassis 315 and the array plate and vertical stiffener assembly 310 further strengthen the assembly for stacking, further facilitating reduced spacing between assemblies, as described further herein.

[0044] 5-8B provide further views of the IS2RMA assembly 302 chassis 315 and the array electronics 317 disposed therein. FIG. 5 is a first view 500 of the IS2RMA chassis showing the array plate and vertical stiffener assembly 310 installed and the top cover plate removed, according to one embodiment. FIG. 6 is a second view 600 of the IS2RMA chassis of FIG. 5 with the top cover plate 304 installed, according to one embodiment. FIG. 7 is a third view 700 of the IS2RMA chassis 315 of FIG. 6 with the array electronics 317 installed and both rear doors 313 removed, according to one embodiment. FIG. 8A is another view 800A of the IS2RMA chassis 315 with the array plate and vertical stiffeners showing the cooling manifold routing, according to one embodiment. FIG. 8B is an exemplary block diagram of the RMA's S-band array electronics 317 installed within the chassis of FIG. 8A, according to one embodiment. 8B shows that the array electronics assembly 317 includes a first portion 317a and a second portion 317b, which are separable at a division point 804. Each array electronics assembly 317a, 317b includes its own respective support structure 808a, 808b. Several cooling manifolds 802, 804, 805 are also part of the array electronics assembly 317.

[0045] 3-8A, the chassis 315 of the IS2RMA assembly 302 (which is part of the housing of the IS2RMA assembly 302) includes a top plate 304, two side plates 306 (only one is visible in FIG. 3), a bottom plate 360, two rear corner supports 311 (only one is visible in FIG. 3), an array plate and vertical stiffener assembly 310, and a respective rear door 313 (only one rear door 313 is shown in FIG. 3 for clarity and to allow additional detail to be seen) on each RMA 308 housed in the IS2RMA assembly 302. As will be appreciated, the top plate 304 and bottom plate 360, as well as the rear doors 313, help ensure that the entire chassis of the IS2RMA assembly 302 is watertight and resistant to electromagnetic interference (EMI). As further shown herein, when IS2RMA assemblies 302 are stacked, either the top plate 304 or the bottom plate 360 ​​is removed so that there is no structure between a first IS2RMA assembly 302 stacked on top of a second IS2RMA assembly 302 (e.g., as further shown in Figures 9A-9B, 10A-10D, 11A-11B, etc., described further herein below) other than the built-in housing 808 of the array electronics 317. This helps minimize the spacing between IS2RMA assemblies 302.

[0046] Each side plate 306 is fabricated using a material that can help ensure that the IS2RMA assembly 302 is watertight and EMI resistant, such as, but not limited to, aluminum. In certain embodiments, the side plates 306 are fabricated from a conductive material. The overall thickness of the side plates 306 (also referred to as side panels 306) is configured and sized to help ensure that when the IS2RMA assemblies 302 are stacked in parallel, all of the resulting antenna elements in the array are on a grid. The side plates 306 differ from the supply manifolds 14a and return manifolds 14b that form the side covers of the chassis 11 of the radar module 10 in FIG. 1 because the side plates 306 are thinner and do not need to include part of the cooling manifold structure (thus increasing the thickness of the side plates). In certain embodiments, the side plates 306 are held in place by a plurality of screws 319, as shown in FIG. 3 (for clarity, not all of the screws 319 are shown, but it should be understood).

[0047] The array plate and vertical stiffener assembly 310 includes a vertical stiffener 334 and an array plate 332 that are operably coupled together. In certain embodiments, grooves or other mating structures are formed on the array plate 332 to allow for coupling the vertical stiffener 334 thereto. The vertical stiffener 334 has a top and bottom surface as well as sides that face each cavity formed in the chassis 315, as shown in FIG. 4 . The array plate 332 and the vertical stiffener 334 each have a first side and a second side opposite the first side. In certain embodiments, the vertical stiffener 334 is coupled to the array plate 332 by a plurality of screws (not shown). In certain embodiments, the vertical stiffener 334 is coupled to the array plate 332 by an adhesive. Those skilled in the art will understand that there are numerous ways to couple the array plate 332 and the vertical stiffener 334 together, and the examples provided herein are illustrative and not intended to be limiting. For example, in some embodiments, the array plate 332 and vertical stiffeners 334 are bolted together, as will be appreciated, and may optionally use pins for alignment in certain embodiments. The vertical stiffeners 334 are not coupled to the array plate 332, but rather are coupled directly to the chassis 315 in some embodiments.

[0048] The array plate 332 is a sheet of material configured to provide extra support to the rear of each integrated radiator 312 associated with each RMA in the IS2RMA assembly 302. The array plate 332, in certain embodiments, is sized to provide structural integrity and support for each integrated radiator 312, including when the IS2RMA assemblies 302 are stacked. In certain embodiments, the array plate 332 is implemented as a single sheet configured to support two integrated radiators 312. In certain embodiments, the array plate 332 can be formed as an array plate structure that can include one portion supporting two radiators, or as two separate array plate portions (not shown, but readily understood), each configured to support a respective integrated radiator 312, with each separate array plate portion coupled to a vertical stiffener 334. In some embodiments, the array plate 332 is formed using a single sheet of high-strength or sufficiently rigid material, such as aluminum, but this is not limiting. The array plate 332 can be configured to allow the radome assemblies 312 coupled to it to be interlocked and aligned to create a single monolithic array surface.

[0049] Those skilled in the art will appreciate that various materials may be suitable for use in implementing the array plate 332, depending on the overall weight of the IS2RMA assembly 302, the environmental conditions in which it must operate, cost, etc. The array plate 332 also helps reduce the need for additional supports (such as the support structure 122) in the overall structure of the IS2RMA assembly 302. In certain embodiments, as shown in FIG. 4 , the array plate 332 includes one or more channels 342, which can be used for routing wiring and / or cabling, routing coolant and / or coolant tubing, etc., as needed. For example, in at least one embodiment, the channels 342 on the array plate are configured to receive coolant. Furthermore, when the array plate 332 is used to help support cooling, the array plate 332 is advantageously made from a material with good thermal conductivity. In some embodiments, as shown in FIG. 4, the array plate includes a plurality of holes or bores 321 that are used as pass-throughs for various purposes as needed, as will be understood by those skilled in the art, for example, for RF connection between the T / R module and the integrated radiator assembly, for mounting front-end electronics, etc.

[0050] The vertical stiffeners 334 are formed from a material (e.g., aluminum) with appropriate strength and rigidity to allow the chassis 315 to resist buckling when stacked. Additionally, in certain embodiments, the material used to fabricate the vertical stiffeners 334 is a material with good thermal conductivity to support the cooling functionality described further below. The vertical stiffeners 334 include a plurality of holes or bores into which set screws 350 can be installed, as will be appreciated, allowing the vertical stiffeners 334 to have components or other elements of the IS2RMA 304 assembly coupled thereto, as well as to couple internal features of the stiffeners (e.g., cooling manifold features). In certain embodiments, the vertical stiffeners 334 include one or more internal channels (not visible) that can be in operative communication with corresponding channels 342 on the array plate 332, thereby allowing for the continuous flow of coolant between the cooling hoses and channels and the array plate 332. For example, in at least one embodiment, the channels in the vertical stiffeners are configured to receive coolant and are in operative communication with one or more other channels to direct coolant into and receive coolant from those channels (e.g., channels 342 on the array plate) or into channels that are part of cooling ribs 511 (see below). Additionally, as described further below, cable tray cooling plate 504 (FIG. 5) also includes internal channels for coolant flow.

[0051] In certain embodiments, vertical stiffener 334 also performs the cooling function of chassis 315 and provides features (e.g., internal manifolds 335, 337 for providing cooling inlet and return connections) within chassis 11 of FIG. 1 to provide equivalent and / or complementary functions to separate supply and return manifolds 14a, 14b located as part of the chassis 11's exterior wall. Having separate supply and return manifolds 14a, 14b, as done in the device of FIG. 1, on the other side of chassis 11, in addition to the hoses associated with directing coolant flow, while also providing space for cabling and wiring, contributes to the overall width and thickness of chassis 11 of FIG. 1 due to the need to provide connections and space for these features, for example, on their exterior sides, which can result in increased spacing between MRAs and their radiator assemblies on the face of the array. This increased spacing can degrade the antenna pattern and cause grounding issues, as discussed above. In contrast, this increased spacing can be reduced by implementing certain aspects of the cooling functionality, coolant flow, and / or cable supports coupled to the vertical stiffener 334 or portions thereof. In certain embodiments, this is achieved by relocating some of the inlet and outlet hoses to the vertical stiffener 334 and by providing a cable tray / cooling plate structure coupled between the outer plate and the vertical stiffener, as described below in connection with FIG. 5 . In some embodiments herein, with some of the hoses and cooling functionality / cooling manifold(s) embedded within the vertical stiffener 334 and / or the array electronics 317 (particularly within the active array electronics), overall space is saved within the dimensions of the chassis 315, yet still providing the necessary cooling functionality for the active array electronics 317. Indeed, in certain embodiments, embedding the cooling manifold functionality within the active array electronics can provide improved cooling over providing cooling manifolds on the outer wall of the chassis.

[0052] 5, arrows 572, 574 indicate the direction of coolant flow within a cable tray cooling plate 504, which itself has internal channels for coolant flow, as will be understood. Referring to the RMA on the left side of the image, the cable tray / cooling plate 504 and side RMA cooling manifolds 554 transport coolant from the central vertical stiffener 334 in the direction of arrows 572 and 574 to a supply in the side plate 306. The coolant then flows through the side RMA cooling manifolds 554 and back to the central vertical stiffener 334. For the RMA on the right side of the image, the internal channels in the cable tray / cooling plate 504 return the (now heated) coolant to the vertical stiffener 334 in the direction of arrow 570.

[0053] As is known, the array electronics 317, particularly the active array electronics such as transmit / receive (T / R) modules, generate a large amount of heat that must be dissipated; without this heat, the active circuitry (e.g., power amplifiers) will not operate properly. To provide cooling as part of the vertical stiffener 334, the vertical stiffener 334 includes a supply manifold 335 having channels that receive coolant at ports 322, for example, by supply hoses 326. While FIG. 8A illustrates the locations of the supply manifold 335 and return manifold 337, it should be understood that these locations are not limiting. For example, the locations may be reversed. In certain embodiments, the cooling manifolds (e.g., supply manifold 335 and return manifold 337) of the vertical stiffener 334 are integrated manifolds built into the vertical stiffener 334. Coolant circulates throughout the chassis 315, is removed through return manifold 337 (FIGS. 6, 8A), and exits through coolant outlet port 320 via coolant return hose 324. As will be appreciated, in certain embodiments, chassis 315 also functions as a heat sink, drawing heat away from active circuitry (e.g., within the T / R module), especially if chassis 315 is formed using a material with good thermal conductivity, such as a metallic material. In some embodiments, as shown in FIG. 4, vertical stiffener 334 includes set screws 350 attached to supply manifold 335 and return manifold 337.

[0054] 3-8A, vertical stiffener 334 provides cooling intake port 322 (FIG. 4) which can be coupled to supply hose 326 for intake of coolant, and cooling connections which are coupled to cooling return hose 324 (FIG. 4). When vertical stiffener 334 is coupled to array plate 332 and positioned between side plate 306, cover plate 304 and bottom plate 360, it forms four cavities 510, 512, 514, 516 (FIG. 5) in which array electronics 317 (FIG. 8B) are located.

[0055] 5, in certain embodiments, chassis 315 includes additional cooling features within cavities 510, 512, 514, and 516. Additionally, in certain embodiments, further cooling is provided via a top cold plate 523 and a bottom cold plate 508 disposed on the top and bottom sides of each cavity 510, 512, 514, and 516, respectively. Additionally, cooling is provided to the edges of the trimm within cavities 510, 512, 514, and 516. Note that when IS2RMA assembly 302 is stacked on top of another IS2RMA assembly 302 (e.g., as described herein in connection with FIGS. 9A-12c), bottom cold plate 508 serves to hold the various electronics and modules, while bottom plate 360 ​​(the bottom cover) is not present, as IS2RMA assembly 302 is bonded directly to the top of another IS2RMA assembly 302 (whose top cold plate 523 has also been removed). The chassis 315 may also include additional built-in supports for routing cables, such as a cable tray 503. The chassis 315 also includes a plurality of slots (not visible) for holding the TRIMMs 110 and other array electronics, the slots being located on either side of a plurality of cooling ribs 511. In certain embodiments, the slots and cooling ribs 511 together form a support structure for the array electronics. In certain embodiments, the top cold plate 523 and the bottom cold plate 508 each also include cooling ribs 511 with channels (not shown) for carrying coolant. Slots (not visible but well understood) are formed in the gaps between the cooling ribs 511 to hold the TRIMMs 110 and other array electronics in a side-by-side configuration that contributes to efficient cooling of the array electronics.

[0056] The self-supporting built-ins of the IS2RMA assembly 302 described above provide a fully enclosed, EMI-shielded, weatherproof, stackable, and integrated structure for a scalable phased array. For example, FIG. 9A is a diagram of an exemplary 4-RMA radar 900 made from a stack of a first IS2RMA 302a and a second IS2RMA 302b bonded together. FIG. 9B is an illustration of a cutaway view 950 of the exemplary 4-RMA radar 900 of FIG. 9A , including a splice plate, according to one embodiment. To show the internal details of the first IS2RMA 302a, the rear doors 313a and 313b of the first IS2RMA 302a are shown removed, while the rear doors 313c and 313d of the second IS2RMA 302b are in place. The rear door 313 is also EMI-resistant and watertight. It will be appreciated that the rear door 313 may alternatively be replaced with a corresponding rear cover. Additionally, in the 4-RMA radar 900, the connector feedthroughs are also selected to be EMI resistant and watertight.

[0057] Referring first to Figure 9A, the top plate 304 coupled to the top of the first IS2RMA 302a ensures that the 4-RMA radar 900 has a watertight and EMI-resistant enclosure on top of it. Similarly, the bottom plate 360 ​​coupled to the bottom of the second IS2RMA 302b ensures that the 4-RMA radar 900 has a watertight and EMI-resistant enclosure on its bottom. As both Figures 9A and 9B show, there is no structure or other support required between the first IS2RMA 302a and the second IS2RMA 302b.

[0058] To further ensure that the entire enclosure of the 4-RMA radar 900 is watertight and EMI resistant, in certain embodiments, a splice plate 902 is attached to a side of the 4-RMA radar 900, for example, by a plurality of set screws 904, and the splice plate 902 is configured to couple the first IS2RMA 302a to the second IS2RMA 302b. The splice plate 902 is coupled to the side plate 306a of the first IS2RMA 302a and the side plate 306b of the second IS2RMA 302b, as shown in FIG. 9A. Although not visible in the perspective view of FIG. 9A, in certain embodiments, the other sides of the 4-RMA radar 900 also have corresponding splice plates 902 similarly attached to their other side panels of each of the first IS2RMA 302a and the second IS2RMA 302b. 10A-12C (further described herein). In embodiments where the IS2RMA assemblies 302 are not stacked but are instead arranged side-by-side (e.g., FIG. 12D), it will be appreciated that splice plates 902 are not required along the sides, but instead splice plates can be arranged along the top or bottom sides.

[0059] Figure 10A is a partially exploded view of the partially assembled chassis 315 of the 4-RMA radar of Figure 9A, showing a front view of the array plates 332a, 332b and vertical stiffener 334b ​​(vertical stiffener 334a is not visible in Figure 10A) before the antenna radiator 312 (not shown in Figure 10A) is installed. The sawtooth portion 1002b is configured as part of the bottom plate 306c as shown in Figure 10A, so that it can fit into the radiator 312b as shown in Figure 10B. Figure 10B is a partially exploded view 1-25 of the partially assembled chassis 315 of the 4-RMA radar of Figures 9A and 10A, showing a front view of the partially assembled chassis after the antenna radiators 312a, 312b, 312c, and 312d have been installed, according to one embodiment. As shown in Figures 10A and 10B, the sawtooth region 1004 on the bottom of the array plate 332a of the top IS2RMA chassis is configured to mate with a corresponding sawtooth edge on the top of the array plate 332b of the bottom IS2RMA chassis. However, when the integrated radiators 312a, 312b, 312c, and 312d are installed (Figure 10B), the top two integrated radiators 312a and 312b are configured so that their top sawtooth edges mate with sawtooth edges on the cover plate 304 and their bottom sawtooth edges (e.g., 1006a) mate with the top sawtooth edges of the corresponding bottom two integrated radiators 312c and 312d. In turn, the bottom sawtooth edges of the bottom two integrated radiators 312c and 312d mate with sawtooth edges on the bottom plate 360. This arrangement helps minimize the spacing between the integrated radiators 312 of the 4-RMA radar 900.

[0060] Figure 10C is a diagram 1050 of the partially assembled chassis of the 4-RMA radar of Figure 9A showing a front view of the fully assembled exploded assembly of Figure 10A before the antenna radiator 312 is installed, according to one embodiment. Figure 10D is a rear view of the partially assembled chassis 315 of the 2-RMA radar showing a rear view of the array plate 332 and vertical stiffeners 334 installed within the chassis 315, according to one embodiment.

[0061] Figure 11A is a front view 1100 of the partially assembled chassis 315 of the 4-RMA radar 900 of Figure 9A, showing the top cover plate 304 not yet attached and the first and second splice plates 902c and 902d not yet attached, according to one embodiment. Figure 11B is another front view 1150 of the partially assembled chassis 315 of the 4-RMA radar 900 of Figure 9A, showing the top and bottom IS2RMAs 302a and 302b before they are assembled together (the array electronics 317 is not visible in these views), according to one embodiment.

[0062] 12A-12C show high-level steps depicting a method for doubling radars in a particular embodiment using the above configuration. FIG. 12A is a front view of a first portion 1200 of an exemplary radar doubling arrangement, according to one embodiment. In FIG. 12A, we start with a two-RMA radar assembly, IS2RMA 302a. FIG. 12B is an exploded front view 1210 of a second portion of an exemplary arrangement doubling radar 302a of FIG. 12A, according to one embodiment. As shown in FIG. 12B, the top plate of IS2RMA 302a is removed, and another IS2RMA radar 302b is placed on top, but its bottom plate 360 ​​is removed so there is no divider between the top IS2RMA 301a and bottom IS2RMA 301b. Splice plates 902a, 902b are then bolted to the sides. FIG. 12C is a front view 1250 of a third portion of an exemplary radar doubling arrangement, showing a 4-RMA radar assembly, according to one embodiment.

[0063] As will be appreciated, many different combinations of IS2RMA assemblies 302 can be combined and stacked in a manner similar to that described above. For example, FIG. 12D is a front view of another radar doubling arrangement 1260, according to one embodiment, showing a side-by-side arrangement of a first IS2RMA assembly 302c and a second IS2RMA assembly 302d. As will be appreciated in the art, in certain embodiments, an additional bottom splice plate (not shown) may be used to couple the first IS2RMA assembly 302c to the second IS2RMA assembly 302d. In some embodiments, the IS2RMA assemblies may include one or more lifting rings 1262. Furthermore, FIGS. 13A-13E illustrate additional combinations or portions of combinations that may be possible (note that the splice plate in FIG. 13C is modified to accommodate the attachment of three IS2RMAs with three IS2RMAs 302 stacked together).

[0064] FIG. 13A is a rear perspective view of an exemplary single RMA radar 1300 in a 1x1 configuration, according to one embodiment. The single RMA radar 1300 differs from the RMA of FIG. 1 because the single RMA radar of FIG. 13A has a chassis incorporating features of those shown in FIGS. 3-4 for the IS2RMA assembly 302. That is, the single RMA radar includes not only an array plate and vertical stiffener assembly with an array plate 332 (not visible, but the location is indicated) behind the integrated radiator 312, but also a vertical stiffener 334 with built-in cooling, having a supply manifold 335, a return manifold 337, a coolant inlet port 322, and a coolant outlet port 320. The single RMA radar 1300 may, in certain embodiments, be coupled to the side of the IS2RMA assembly 302 or stacked on top of other single RMA radars 1300 if an odd number of RMAs (e.g., three) are desired. For example, assume a 3x2 radar is desired. A single RMA radar 1300 can be stacked on top of another single RMA radar 1300 and then combined into a 2x2 radar (e.g., as shown in FIG. 13B). Furthermore, as will be appreciated by those skilled in the art, a stack that is the width of a single RMA will require covers over the cooling ports in the vertical stiffener assembly 310.

[0065] FIG. 13B is a rear perspective view of an exemplary RMA radar with a 2x2 configuration, according to one embodiment. This configuration is similar to the 4-RMA radar of FIG. 12C, but shown from a rear view. FIG. 13B also shows the coolant distribution within the chassis side panel 306 for each IS2 RMA 301a, 302b. For example, connection 1302 is for coolant intake and correlates to approximately the same location as cooling manifold 554 of FIG. 5. Connection 1303 is for the exit direction of heated coolant. FIG. 13C is a rear perspective view of an exemplary RMA radar with a 2x3 configuration, according to one embodiment. The 2x3 radar of FIG. 13C has a modified splice plate 903 configured to mate and bond (and provide a watertight and EMI-resistant seal) a stack of three IS2 RMA assemblies 302. FIG. 13D is a rear perspective view of an exemplary RMA radar with a 4x1 configuration, according to one embodiment. The 4x1 radar of Figure 13D is similar to the 4x1 radar of Figure 12D, but shown from a rear view. Figure 13E is a rear perspective view of an exemplary RMA radar in a 4x2 configuration, according to one embodiment.

[0066] It will be appreciated that the IS2RMA assembly 302 can be implemented as a building block for creating and configuring many different types of radar systems other than those explicitly shown and described herein, including non-military applications, such as 5G systems, commercial radar systems (such as FAA (Federal Aviation Administration), weather, mapping, navigation, and commercial surveillance radar systems. As one skilled in the art will appreciate, the IS2RMA assembly 302 and its advantageous features (such as the array plate and vertical stiffener assembly with integrated cooling functionality) also have commercial applicability, including as part of any type of stackable back-end processing that may require integrated cooling, even when radar functionality is not required.

[0067] The terms "comprises," "comprising," "includes," "including," "having," and compounds thereof mean at least "including, but not limited to." As used herein, the singular forms "a," "an," and "the" include plural references unless the context clearly indicates otherwise. Various elements that are described in the context of a single embodiment may also be provided separately or in any suitable subcombination. Furthermore, it will be understood that various changes in the details, materials, and arrangements of parts described and illustrated herein may be made by those skilled in the art without departing from the scope of the following claims.

[0068] Throughout this disclosure, individual elements as described should be understood to be singular or plural unless the context clearly dictates otherwise. For example, the terms "circuit," "circuitry," and "module" can include either a single component or multiple components, either active and / or passive, connected or coupled together to provide the described functionality. Within the drawings, like or related elements have like or related alphabetic, numeric, or alphanumeric designators. Furthermore, while the disclosed embodiments have been described in the context of implementations using separate components, with some components comprising one or more integrated circuit chips, the functionality of any component or circuit may alternatively be implemented using one or more appropriately programmed processors, depending on the signal frequency or data rate to be processed and / or the function to be accomplished.

[0069] Similarly, and further, in the figures of the present application, the total number of elements or components shown is not intended to be limiting, and one skilled in the art will recognize that the number of particular components or element types may be selected, in some cases, to suit the needs of a particular user.

[0070] In describing and illustrating the embodiments herein, specific terminology (e.g., language, phrases, product brand names, etc.) may be used in the text and drawings for the sake of clarity. These designations are merely exemplary and not limiting. The embodiments described herein are not limited to the specific terminology so selected, and each specific term includes at least all grammatical, literal, scientific, technical, and functional equivalents, as well as any other equivalents that operate in a similar manner to accomplish a similar purpose. Furthermore, in the drawings, diagrams, and text, specific names may be used to refer to particular features, elements, circuits, modules, tables, software modules, systems, etc. However, such terminology as used herein is for purposes of description and not limitation.

[0071] While the embodiments contained herein have been described and illustrated in a preferred manner with a particular degree of detail, it will be understood that the present disclosure has been described by way of example only, and that many changes in the details of construction and the combination and arrangement of parts may be made without departing from the spirit and scope of the described embodiments. While at least some principles of the technology have been described and illustrated with reference to specific implementations, it will be recognized that the technology and embodiments described herein can be implemented in many other different forms and in many different environments. The technology and embodiments disclosed herein can be used in combination with other technologies. Furthermore, all publications and references cited herein are expressly incorporated herein by reference in their entirety. Individual elements of different embodiments described herein can be combined to form other embodiments not specifically described above. Various elements described in the context of a single embodiment may be provided separately or in any suitable subcombination. Other embodiments not specifically described herein should be understood to be within the scope of the following claims.

Claims

1. A radar array assembly, comprising: a first chassis configured to house a first set of array electronics and a second set of array electronics; a first vertical stiffener disposed within and operably coupled to the first chassis to enable the first chassis to be buckling resistant and to define a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, the first vertical stiffener being configured to be incorporated within the first set of array electronics and the second set of array electronics, the first vertical stiffener having a first integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics; a first array plate having a first side and a second side opposite the first side, the first array plate coupled to the first vertical stiffener; Including, A radar array assembly, wherein the combination of the first vertical stiffener, the first array plate, and the first chassis provides the radar array assembly with a self-supporting function.

2. 2. The radar array assembly of claim 1, wherein the first chassis includes a first channel, the first channel configured to allow a coolant to flow therethrough, the first vertical stiffener includes a second channel, the second channel configured to allow a coolant to flow therethrough, and the first channel and the second channel are in operative communication.

3. A radar array assembly as described in claim 2, wherein the first array plate includes a third channel, the third channel configured to allow coolant to flow therethrough, and the third channel in operative communication with at least one of the first channel and the second channel.

4. A radar array assembly as described in claim 1, wherein the first array plate is configured to support a first radiator assembly and a second radiator assembly, the first radiator assembly and the second radiator assembly being in operative communication with the first set of array electronics and the second set of array electronics, respectively, and the first array plate is configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface.

5. 5. The radar array assembly of claim 4, wherein the first vertical stiffener and the first array plate, when combined with the first chassis, are configured to allow the first chassis to be stacked on a second chassis identical to the first chassis, doubling the size of the single monolithic array surface.

6. a first portion of the first array plate associated with the first set of array electronics, a second portion of the first array plate associated with the second set of array electronics; The radar array assembly includes: a first radiator assembly operably coupled to the first portion of the first array plate and configured to be in operative communication with the first set of array electronics; a second radiator assembly operably coupled to the second portion of the first array plate and configured to be in operative communication with the second set of array electronics; further comprising 2. The radar array assembly of claim 1, wherein the first array plate is configured to support the first radiator assembly and the second radiator assembly and to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface.

7. The first array plate is configured to support a first radiator assembly and a second radiator assembly, the first radiator assembly and the second radiator assembly being in operative communication with the first set of array electronics and the second set of array electronics, respectively, and the first array plate is configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface; The radar array assembly includes: a second chassis operably coupled to the first chassis, the second chassis configured to house a third set of array electronics and a fourth set of array electronics, the third set of array electronics and the fourth set of array electronics coupled to the second chassis by respective second support structures housed within the second chassis; a second vertical stiffener disposed within and operably coupled to the second chassis to enable the second chassis to be buckling resistant and to define a third cavity in which the third set of array electronics is disposed and a fourth cavity in which the fourth set of array electronics is disposed, the second vertical stiffener configured to be incorporated within the third set of array electronics and the fourth set of array electronics, the second vertical stiffener having a second integrated cooling manifold configured to cool both the third set of array electronics and the fourth set of array electronics; a second array plate having a first side and a second side opposite the first side, the second array plate coupled to the second vertical stiffener, the second array plate configured to support a third radiator assembly and a fourth radiator assembly, the third radiator assembly and the fourth radiator assembly being in operative communication with the third set of array electronics and the fourth set of array electronics, respectively, the second array plate configured to allow the third radiator assembly and the fourth radiator assembly to be interlocked with and aligned with the first radiator assembly and the second radiator assembly as part of the single monolithic array surface; The radar array assembly of claim 1 further comprising:

8. 8. The radar array assembly of claim 7, wherein the first chassis includes a first side disposed adjacent the first cavity and a second side disposed adjacent the second cavity, and the second chassis is operably coupled to the first chassis along one of the first side and the second side.

9. The radar array assembly of claim 7 , wherein the second chassis is stacked on top of the first chassis.

10. 10. The radar array assembly of claim 9, wherein the first chassis includes a first side disposed adjacent the first cavity and a second side disposed adjacent the second cavity, the second chassis includes a third side disposed adjacent the third cavity and a fourth side disposed adjacent the fourth cavity, and the radar array assembly further includes a splice plate configured to secure at least one of the first side and the second side of the first chassis to at least one of the third side and the fourth side of the second chassis.

11. a top plate operably coupled to the top of the first chassis and configured to cover a top surface of the first vertical stiffener, a top side of the first cavity, and a top side of the second cavity; a bottom plate operably coupled to the bottom of the first chassis and configured to cover a bottom surface of the first vertical stiffener, a bottom side of the first cavity, and a bottom side of the second cavity; further comprising 2. The radar array assembly of claim 1, wherein the top plate, the bottom plate, and the first chassis cooperate to provide a housing for the first set of array electronics and the second set of array electronics, the housing being watertight and electromagnetic interference (EMI) resistant.

12. A radar module, comprising: a first set of array electronics in operative communication with a first set of radiators integrated within the first radiator assembly; a second set of array electronics in operative communication with a second set of radiators integrated within the second radiator assembly; a chassis configured to house the first set of array electronics and the second set of array electronics, the first set of array electronics and the second set of array electronics being coupled to the chassis by respective support structures housed within the chassis; a vertical stiffener operably coupled to the chassis and disposed within the chassis to enable the chassis to be buckling resistant, the vertical stiffener configured to be incorporated within the first set of array electronics and the second set of array electronics and configured to define within the chassis a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, the vertical stiffener having an integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics; an array plate having a first side and a second side opposite the first side, the array plate coupled to the vertical stiffener and configured to support the first radiator assembly and the second radiator assembly, the array plate configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface of the radar module such that the radar module is self-supporting in combination with the vertical stiffener, the array plate, and the chassis; a radar module including:

13. 13. The radar module of claim 12, wherein the chassis includes a first channel configured to allow coolant to flow therethrough, the vertical stiffener includes a second channel configured to allow coolant to flow therethrough, and the first channel and the second channel are in operative communication.

14. 14. The radar module of claim 13, wherein the array plate includes a third channel configured to allow coolant to flow therethrough, the third channel in operative communication with at least one of the first channel and the second channel.

15. The radar module of claim 13 , wherein the first channel is in operative communication with at least one of a coolant inlet port and a coolant outlet port integrated within the vertical stiffener.

16. The radar module of claim 12 , wherein the integrated cooling manifold further includes a supply manifold in operative communication with a coolant inlet port and a return manifold in operative communication with a coolant outlet port.

17. 13. The radar module of claim 12, wherein the first set of array electronics and the second set of array electronics each include a respective plurality of radar transmit / receive (T / R) modules, each T / R module associated with a power source and a beamforming signal, the power source and beamforming signal connected in parallel to the first set of radiators and the second set of radiators, respectively.

18. An antenna array including a plurality of stacked radar modules, each radar module comprising: a first set of array electronics in operative communication with a first set of radiators integrated within the first radiator assembly; a second set of array electronics in operative communication with a second set of radiators integrated within the second radiator assembly; a chassis configured to house the first set of array electronics and the second set of array electronics, the first set of array electronics and the second set of array electronics being coupled to the chassis by respective support structures housed within the chassis; a vertical stiffener operably coupled to the chassis and disposed within the chassis to enable the chassis to be buckling resistant, the vertical stiffener configured to be incorporated within the first set of array electronics and the second set of array electronics and configured to define within the chassis a first cavity in which the first set of array electronics is disposed and a second cavity in which the second set of array electronics is disposed, the vertical stiffener having an integrated cooling manifold configured to cool both the first set of array electronics and the second set of array electronics; an array plate having a first side and a second side opposite the first side, the array plate coupled to the vertical stiffener and configured to support the first radiator assembly and the second radiator assembly, the array plate configured to allow the first radiator assembly and the second radiator assembly to be interlocked and aligned to create a single monolithic array surface for the respective radar module such that the respective radar module is self-supporting in combination with the vertical stiffener and the array plate and the chassis; The antenna array.

19. 20. The antenna array of claim 18, wherein the chassis, the vertical stiffener, and the array plate of each radar module are configured to enable a respective monolithic array surface for each radar module to align with the respective monolithic array surfaces for each other respective radar module in the plurality of radar modules to create a single monolithic array surface of the antenna array, the single monolithic array surface having no interruptions in an array lattice of the single monolithic array surface of the antenna array.

20. The antenna array of claim 19, wherein the elements of the first radiator assembly and the second radiator assembly have a common ground potential.

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