Processing device and processing device control method

Abstract

To provide a processing device capable of preventing diffusion of fume generated by processing to the atmosphere and recovering the fume.SOLUTION: A processing device includes: a heating device 120 equipped with a heating head 122 for heating a local part 16 of an object 10 to be processed for melting the local part 16; a mist layer forming device 140 for forming a mist cover layer 40 outside a heating area 20 connecting the local part 16 and the heating head 122 together; a mist generation device 130 for generating mist 41 from liquid and supplying it to the mist layer forming device 140; and a processing position moving mechanism 30 for moving the local part 16 heated and melted by the heating head 122 to a processing place 12 for the object 10 to be processed. A mist cover layer 40 for covering the outer periphery of the heating area 20 is formed by the mist 41 sprayed from the mist layer forming device 140.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device for processing materials such as metals and a control method for controlling the processing device, and more particularly to a processing device having a function for suppressing the diffusion of fumes generated during material processing and a control method for the processing device for suppressing the diffusion of the fumes. [Background technology]

[0002] When processing materials such as metals, processing equipment that heats the processing area to high temperatures is currently widely used. Examples include processing equipment using lasers and processing equipment using plasma arcs. Such processing equipment has various advantages. However, because these processing equipment locally heats the processing area, the material melts at the locally heated area. As this melting occurs, the material, such as molten metal, vaporizes and generates fine, smoke-like dust called fumes. These fumes disperse into the air and, in some cases, remain suspended for long periods of time. The retention of fumes in the air can deteriorate the working environment. Furthermore, when processing items using valuable materials, such as electronic devices, it is desirable to prevent the valuable materials from dispersing in the air as fumes and ensure that they can be recovered. To achieve this, it is first necessary to suppress the dispersal of fumes into the air. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-139778 [Patent Document 2] Patent Publication No. 2021-62388 Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 discloses a processing device that processes metal materials by irradiating them with a laser, and Patent Document 2 discloses a processing device that processes metal materials by utilizing a plasma arc.

[0005] In paragraph "0015" of Patent Document 1, it is stated that assist gas is sprayed from the nozzle 25 to remove gas and molten parts generated during laser processing. In this description, removing gas generated during laser processing means moving the gas from the processed part of the workpiece W, which is the metal material to be processed, to another location, and does not mean recovering the released gas. Conversely, spraying assist gas helps to diffuse gas, including fumes generated during laser processing, into the air.

[0006] In addition, in paragraphs "0010" and "0015" of Patent Document 1, it is stated that mist FM is sprayed from nozzle 25, but this statement is a typographical error. The correct expression is "mist FM is sprayed from mist nozzle 1," as stated in paragraphs "0017" and "0021" of Patent Document 1. Paragraph "0032" of Patent Document 1 states the following: By spraying mist FM from mist nozzle 1, a liquid film can be formed on the surface of workpiece W1. This reduces the amount of spatter adhering to the surface of workpiece W1, and also makes it more difficult for spatter to adhere to nozzle 25. This allows nozzle 25 to be brought closer to workpiece W1.

[0007] Furthermore, in paragraphs "0073" to "0082," Patent Document 2 describes the generation of fumes during plasma welding. According to paragraphs "0074" and "0075," the following is stated: By flowing barrier gas BG from the opening 16b of the insert cap 16 to the vicinity of the tip hole 15b through each of the multiple grooves 15g shown in FIG. 7 , a gas flow of barrier gas BG surrounding the tip hole 15b can be formed around the tip hole 15b. The high-speed gas flow of barrier gas BG surrounding the tip hole 15b can form a barrier between the zinc plating layer 32 on the surface of the steel sheet 31 and the tip end surface 15a. This blocks both zinc fumes 33 and steel sheet spatter 34 during plasma welding, preventing them from adhering to or depositing on the tip end surface 15a of the insert tip 15.

[0008] Patent Documents 1 and 2 describe that fumes are generated by localized heating of the processed portion of a metal material. However, there is no disclosure or suggestion whatsoever about preventing the generated fumes from diffusing into the air. Furthermore, there is no disclosure or suggestion whatsoever about recovering the fumes.

[0009] An object of the present invention is to provide a processing device having a function of suppressing the diffusion of fumes generated during the processing of materials such as metals, or to provide a control method for controlling the processing device to suppress the diffusion of fumes generated during the processing of the material. [Means for solving the problem]

[0010] [First invention] The first invention to solve the above problem is: a heating device having a heating head for melting a local portion at a processing location of the object to be processed; a mist layer forming device that sprays mist to form a mist cover layer outside a heating area that connects the local portion of the object to the heating head of the heating device; a mist generating device that generates the mist from a liquid and supplies the mist to the mist layer forming device; a processing position moving mechanism that moves the local portion along the processing location of the object by relatively changing a positional relationship between the heating head and the object; Equipped with This processing device is characterized in that the mist sprayed from the mist layer forming device forms a mist cover layer outside the heating area that covers the outer periphery of the heating area, thereby suppressing fumes generated by melting the localized area from diffusing into the air.

[0011] [Effects of the first invention] When a localized portion of a workpiece is melted at a processing location, fumes are generated at the melted portion. These fumes diffuse into the air and remain there. To prevent this, a mist cover layer is formed in the present invention to prevent diffusion into the air. Patent Documents 1 and 2 do not disclose or suggest the configuration or function of forming a mist cover layer to prevent fumes from diffusing into the air.

[0012] In the following embodiment, we will explain the effect of the mist cover layer and fumes. Fumes generated by localized melting caused by heating to high temperatures are released in the form of vapor inside the mist cover layer. The released fumes are cooled and condensed by the mist cover layer. In this way, the fumes are trapped by the mist cover layer. This significantly reduces the amount of fumes that diffuse out of the mist cover layer.

[0013] According to paragraphs "0032" and "0038" of Patent Document 1, it is stated that the mist FM forms a water film on the surface of the workpiece W1. If we assume that the mist described in Patent Document 1 forms a mist cover layer and has the effect of trapping fumes, just like the mist of the first invention, then the water film on the surface of the workpiece W1 created by the mist of Patent Document 1, as described in Patent Document 1, would contain fumes. This contradicts the description in Patent Document 1.

[0014] In other words, not only fumes but also spatter are generated from the processing area. Therefore, if we interpret Patent Document 1 as having a mist cover layer, the mist cover layer would have the effect of trapping not only fumes but also spatter. Therefore, when a water film is formed on the surface of the workpiece W1, the mist cover layer will guide fumes and spatter to the surface of the workpiece W1. This is completely contradictory to the descriptions in paragraphs "0032" and "0038" of Patent Document 1. Therefore, we must conclude that the mist described in Patent Document 1 is completely different from something that forms a layer to suppress the diffusion of fumes into the air.

[0015] [Second Invention] The second invention to solve the above problem is the processing apparatus of the first invention, The processing apparatus further comprises a recovery device that sucks and recovers the mist cover layer.

[0016] [Effects of the second invention] Most of the fumes generated by melting localized portions of the workpiece are released in the form of vapor inside the mist cover layer, where they are cooled and most of them are captured by the mist cover layer. The mist cover layer is sucked in by a recovery device and recovered. As a result, the fumes captured by the mist cover layer are sucked in and recovered together with the mist cover layer. As described above, most of the generated fumes are captured by the mist cover layer, so the generated fumes can be recovered efficiently.

[0017] Patent Documents 1 and 2 do not describe at all a recovery device for recovering the mist cover layer. Furthermore, if a recovery device were to be provided when attempting to form a water film on the surface of the workpiece W1, it is thought that there would be adverse effects on the formation of the water film, such as a reduction in the effects described in the documents.

[0018] The second invention is provided with a recovery device that recovers fumes. As described above, the effects of suppressing the diffusion of fumes, recovering the fumes, and suppressing air pollution caused by fumes can be obtained. However, other effects can also be obtained. In the case of processing objects made of rare metals or processing objects that partially use rare metals, there is an effect of suppressing the diffusion of the rare metals into the air and recovering them. In this case, not only is contamination prevented, but the great effect of being able to reuse rare metals, which are valuable resources, is obtained.

[0019] [Third Invention] The third invention to solve the above problem is a processing apparatus according to one of the first and second inventions, This processing device is characterized in that the mist cover layer has a first mist layer and a second mist layer, the first mist layer is formed to cover the outer periphery of the heating area, and the second mist layer (44) is formed to cover the outer periphery of the first mist layer.

[0020] [Effects of the third invention] The mist cover layer is made up of very fine liquid particles and is prone to turbulence. By using two mist cover layers, the effectiveness of trapping and recovering fumes can be greatly improved. For example, the amount of fumes generated is not necessarily constant. It varies depending on the local condition and the shape of the processing location. For example, if the processing location is not straight but bent at an acute angle, the amount of fumes generated may fluctuate, or may be generated in one direction. Even if such changes occur, it is preferable to be able to stably trap fumes. By using at least two mist cover layers, a stable effect can be obtained even if the local condition changes as described above.

[0021] Furthermore, by having at least two mist cover layers, important functions can be shared between the first and second mist layers. Fumes have high energy immediately after generation and are in a very fine particle state. Therefore, the first mist layer first cools the high-temperature fumes. The second mist layer then captures the fumes. By having the first and second mist layers in this way, the efficiency of suction and collection of fumes can be greatly improved.

[0022] [Fourth Invention] The fourth invention to solve the above problem is the processing apparatus of the third invention, the mist layer forming device includes a first mist spray nozzle that sprays a first mist to form the first mist layer and a second mist spray nozzle that sprays a second mist to form the second mist layer, The processing device is characterized in that the diameter of the first mist sprayed from the first mist spray nozzle is smaller than the diameter of the second mist sprayed from the second mist spray nozzle.

[0023] [Effects of the fourth invention] In a fourth aspect of the present invention, the diameter of the first mist for forming the first mist layer is smaller than that of the second mist for forming the second mist layer. The fumes that come into contact with the first mist layer are hotter and smaller in diameter than the fumes that come into contact with the second mist layer. Therefore, by reducing the diameter of the first mist that forms the first mist layer, gaps that form within the first mist layer itself can be further reduced. Therefore, leakage of small-diameter fumes from the first mist layer to the outside can be more effectively prevented.

[0024] Fumes generated from localized areas of the workpiece are fine and at a high temperature. When these fumes are cooled by coming into contact with the first mist in the first mist layer, the fume particles bond together and become larger in diameter. As the diameter of the fume particles increases, their mass also increases. To capture the larger fumes, it is preferable for the mist to also have a larger diameter. For this reason, the diameter of the second mist in the second mist layer is made larger than the diameter of the first mist used to form the first mist layer. This significantly improves the effects of the first mist layer and the second mist layer.

[0025] As described in the fourth aspect of the present invention, the diameter of the first mist for forming the first mist layer is made smaller than the diameter of the second mist for forming the second mist layer, thereby achieving the above-mentioned significant effects. A specific example of the diameter of the first mist and the diameter of the second mist will now be described. Here, the mist diameter refers to, for example, the diameter of the mist, or the size of the mist.

[0026] The first mist and the second mist that form the first mist layer and the second mist layer are not uniform in size, but consist of a mixture of large and small mist particles. However, when the distribution of the number of mist particles that make up each of the first mist and the second mist is examined using the size as a parameter, the number of mist particles peaks in a certain size range, and the number of mist particles in that range decreases as the distance from the peak increases.

[0027] As described above, the first mist layer and the second mist layer function to confine or capture the generated fumes. From this perspective, when focusing on the size of the particles of the first mist and the second mist that form the first mist layer and the second mist layer, the size of the mist in the region where the number of mist particles is the highest, in other words, the size of the mist in the region where the distribution of the number of mist particles described above peaks, is important in terms of their function. In the fourth invention, when the first mist forming the first mist layer and the second mist forming the second mist layer are compared in terms of the size of the mist contained in the respective regions where the distribution number peaks, the size of the second mist is larger than the size of the first mist. In this way, comparing the diameter of the mist present in the region where the distribution number peaks, using size as a parameter, is effective in terms of the function of the first mist layer and the second mist layer. The mist in the region where the number of mist particles is the highest or in a region nearby plays a significant role in achieving the above-described functions and effects.

[0028] [Fifth Invention] The fifth invention to solve the above problem is a processing apparatus according to one of the third and fourth inventions, the mist layer forming device includes a first mist spray nozzle that sprays a first mist to form the first mist layer and a second mist spray nozzle that sprays a second mist to form the second mist layer, The second mist spray nozzle is provided at a position farther from the object to be processed than the first mist spray nozzle, and the amount of the second mist sprayed from the second mist spray nozzle per unit time is made larger than the amount of the first mist sprayed from the first mist spray nozzle per unit time. The processing device is characterized by the above.

[0029] [Operation and effect of the fifth invention] It is desirable to confine fumes emitted due to local heating of the workpiece within the mist cover layer using the first and second mist layers, thereby suppressing the amount of fumes leaking into the atmosphere. Experiments conducted by the inventors have clearly shown that increasing the amount of mist sprayed is extremely effective in reducing fume leakage into the atmosphere. However, it is obviously impossible to increase the amount of mist sprayed from the first and second mist spray nozzles without limit, and this is not a practical solution.

[0030] In the fifth aspect of the invention, the second mist spray nozzle is positioned farther from the workpiece than the first mist spray nozzle, so that the second mist layer covers the entire first mist layer, in other words, the entire workpiece from its base. This allows fumes leaking from the first mist layer to be trapped in the second mist layer, and also reduces leakage from the second mist layer. Furthermore, increasing the amount of mist sprayed from the second mist spray nozzle improves reliability.

[0031] [Sixth Invention] In the processing apparatus of one of the third and fourth inventions that solves the above problem, the mist layer forming device includes a first mist spray nozzle that sprays a first mist to form the first mist layer and a second mist spray nozzle that sprays a second mist to form the second mist layer, The second mist spray nozzle is provided at a position closer to the object to be processed than the first mist spray nozzle, and the second mist spray nozzle covers the vicinity of the first mist spray nozzle in the first mist layer. The processing device is characterized by the above.

[0032] [Operation and effect of the sixth invention] In a sixth aspect of the present invention, the second mist spray nozzle is positioned closer to the workpiece than the first mist spray nozzle, and the second mist spray nozzle covers the first mist layer around the first mist spray nozzle. Positioning the first mist spray nozzle and the second mist spray nozzle, which form the mist cover layer, closer to the workpiece stabilizes the mist cover layer and reduces fumes leaking into the atmosphere from the mist cover layer. However, it is desirable to determine the distance between the heating head and the local area with priority given to optimal processing of the workpiece. Therefore, there is a limit to how short the distance between the first mist spray nozzle and the workpiece can be. In contrast, the second mist spray nozzle has greater flexibility and can be positioned closer to the workpiece than the first mist spray nozzle.

[0033] Bringing the second mist spray nozzle closer to the workpiece allows the second mist layer to be maintained in a more stable state. In this case, the first mist layer near the first mist spray nozzle is structured to be encompassed by the second mist spray nozzle. By doing so, as described above, the second mist layer can stably capture fine dust, including fumes, and significantly reduce leakage into the atmosphere.

[0034] [Seventh Invention] The seventh invention to solve the above problem is a processing apparatus according to any one of the second to sixth inventions, the recovery device has a suction device for sucking the mist cover layer, the suction device has a plurality of suction ports for sucking the mist forming the mist cover layer, and the plurality of suction ports are each arranged in the mist cover layer near the object to be processed, the suction device is supported by a suction device support mechanism so as to move together with the heating head; The processing device is characterized by the above.

[0035] [Operation and effect of the seventh invention] In the seventh invention, the suction device automatically moves based on the movement of the local area where fumes are generated. This allows a mist cover layer including the first mist layer and the second mist layer to be automatically formed to cover the local area. This not only prevents fumes from leaking into the atmosphere from the mist cover layer, but also significantly improves reliability.

[0036] [Eighth Invention] The eighth invention to solve the above problem is the processing apparatus according to the seventh invention, The opening direction of each of the plurality of suction ports of the suction device faces the circumferential direction of the mist cover layer. The processing device is characterized by the above.

[0037] [Effects of the eighth invention] In an eighth aspect of the present invention, the opening direction of each of the suction ports of the suction device faces the circumferential direction of the mist cover layer. If the suction ports face the localized area, the second mist layer will be sucked in from a direction perpendicular to the outer circumferential surface. In this case, the mist cover layer is likely to become disturbed, and the mist cover layer's function of covering the outside of the heated area may be lost due to the disturbance.

[0038] On the other hand, when the suction ports are opened in the circumferential direction of the mist cover layer, the mist cover layer can be sucked while maintaining laminar flow as much as possible, which has the effect of suppressing the generation of turbulence. As a result, it is possible to effectively suppress fume leakage from the mist cover layer and also stabilize the suction operation.

[0039] [Ninth Invention] The ninth invention to solve the above problems is: a heating device having a heating head for melting a local portion at a processing location of the object to be processed; a mist layer forming device for forming a mist cover layer outside a heating area connecting the local portion of the object to the heating head of the heating device; a processing position moving mechanism that moves the local portion along the processing location of the object by changing a relative positional relationship between the heating head and the object; a control device that controls the heating device, the mist layer forming device, and the processing position moving mechanism; A control method for a processing apparatus for processing an object to be processed, comprising: The mist cover layer is formed by the mist layer forming device, After the mist cover layer is formed, a local portion at a processing location of the object to be processed is melted by the heating head of the heating device. The present invention relates to a method for controlling a processing device.

[0040] [Operation and effect of the ninth invention] In the ninth aspect of the present invention, first, a mist cover layer is formed outside the heating area connecting the local portion of the workpiece and the heating head of the heating device. After the mist cover layer is formed, the local portion is melted. In this way, the mist cover layer can be formed before fumes are emitted from the local portion. This makes it possible to prevent fumes emitted from the local portion from leaking to the outside.

[0041] [Tenth Invention] The tenth aspect of the present invention that solves the above problem is a method for controlling a processing apparatus according to the ninth aspect of the present invention, After the mist cover layer is formed by the mist layer forming device, the local portion at the processing location of the object to be processed is melted by the heating head of the heating device; further changing a relative positional relationship between the heating head and the workpiece by the processing position moving mechanism, thereby moving the molten local portion along the processing location of the workpiece; When the processing is completed or stopped, the melting operation of melting the local portion by the heating head is stopped, After the melting operation is stopped, the mist cover layer forming operation of forming the mist cover layer by the mist layer forming device is stopped. The present invention provides a method for controlling a processing device.

[0042] [Operation and effect of the tenth invention] When the processing of the workpiece is completed or temporarily stopped, the melting operation of the local area is stopped, which stops the generation of fumes from the local area. Therefore, the formation of the mist cover layer can be stopped. However, in this case, fumes that have already been generated must be prevented from leaking to the outside. Therefore, when the generation of fumes stops, the mist cover layer formation operation is continued, and after waiting for the melting operation of the local area to stop, the mist cover layer formation operation is stopped. In this way, the leakage of fumes to the outside can be prevented.

[0043] [Eleventh Invention] The eleventh aspect of the present invention that solves the above problem is a control method for a processing apparatus according to the tenth aspect of the present invention, comprising: the processing apparatus further includes a recovery device having a suction device for sucking the mist cover layer, forming the mist cover layer by the mist layer forming device, and then starting to suck the mist cover layer by the suction device of the recovery device; After the mist cover layer is formed by the mist layer forming device, the heating head of the heating device starts the melting operation of the local portion at the processing location of the object to be processed, When the processing is completed or stopped, the melting operation of the local portion by the heating head of the heating device is stopped, the mist cover layer forming operation by the mist layer forming device is stopped after a predetermined time has elapsed since the melting operation on the local portion was stopped; After the mist cover layer forming operation by the mist layer forming device is stopped, the suction operation on the mist cover layer by the suction device of the recovery device is stopped. The present invention provides a method for controlling a processing device.

[0044] [Operation and effect of the eleventh invention] When processing of the workpiece is completed or when the processing is temporarily stopped, the melting operation of the local area is stopped. As a result, fume generation in the local area stops. However, fumes that have already been generated remain trapped inside the mist cover layer. It is desirable to suck and collect the fumes trapped inside the mist cover layer using the suction device. When sucking fumes, the suction device alone cannot effectively suck them in. By containing the fumes in the mist cover layer and sucking the fumes while they are combined with the mist that makes up the mist cover layer, fume leakage can be reduced and the mist can be efficiently sucked and collected.

[0045] In the eleventh aspect of the present invention, the time required to suck and collect the fumes that have already been generated and are floating after the generation of fumes is stopped is preset, and the formation of the mist cover layer is maintained for the preset time even after the generation of fumes is stopped, thereby significantly improving the suction and collection of fumes.

[0046] [12th Invention] The twelfth invention that solves the above problem is a control method for a processing apparatus according to any one of the ninth to eleventh inventions, comprising: performing an abnormality diagnosis operation for the processing device together with a processing operation for the workpiece; If an abnormal state is detected in the abnormality diagnosis operation, the operation of melting the local portion by the heating head is stopped, and stopping the formation of the mist cover layer by the mist layer forming device after the predetermined time has elapsed since the melting operation of the local portion was stopped. The present invention provides a method for controlling a processing device.

[0047] [Operation and effect of the twelfth invention] Diagnosing abnormalities in processing equipment is important, and it is essential to immediately stop operation when an abnormality is detected. However, depending on the cause of the abnormality, it is desirable to prevent fumes from diffusing into the atmosphere as much as possible even when an abnormality is detected. In the present invention, the melting operation for the localized area is stopped. However, depending on the cause of the abnormality, the formation of the mist cover layer is first maintained and the fume collection operation is continued. A dangerous state associated with an abnormality is an abnormal high temperature state. By stopping the melting of the localized area, the abnormal high temperature state can be suppressed. Furthermore, the formation of the mist cover layer, which is intended to diffuse and collect fumes, not only prevents the diffusion and collection of fumes, but also has the effect of suppressing the occurrence and continuation of abnormal high temperature states. [Effects of the Invention]

[0048] According to the present invention, it is possible to obtain a processing device having a function of suppressing the diffusion of fumes generated in the processing of materials such as metals. Furthermore, according to the present invention, it is possible to obtain a control method for a processing device that can effectively suppress the diffusion of generated fumes. [Brief explanation of the drawings]

[0049] [Figure 1] 1 is an explanatory diagram illustrating an outline of a processing device according to an embodiment of the present invention; [Figure 2] 2 is an explanatory diagram illustrating the state of a mist layer in the embodiment shown in FIG. 1 and the operation of a mist suction device that sucks the mist. FIG. [Figure 3] 10 is an explanatory diagram for explaining the trapping action of the mist cover layer for the generated fumes. FIG. [Figure 4] FIG. 1 is an explanatory diagram for explaining collection of fine dust containing fumes. [Figure 5] FIG. 10 is an explanatory diagram illustrating another embodiment. [Figure 6] 1 is an explanatory diagram illustrating an embodiment in which the present invention is applied to a processing device using a plasma arc. [Figure 7] FIG. 10 is an explanatory diagram illustrating another embodiment. [Figure 8] 4 is a flowchart showing processing before the start of processing, at the end of processing, etc., in the control content of the processing device according to the present invention. [Figure 9] 4 is a flowchart showing processing during a machining operation and when an emergency state occurs in the control content of the machining apparatus according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0050] 1. Introduction In the following examples, components with the same reference numerals have the same functions and effects, and redundant explanations may be omitted. Furthermore, the following examples have various problems to be solved and various effects to be achieved, and these effects are not limited to the scope of the objects and effects described in the "Object of the Invention" and "Effects of the Invention" columns, but may also solve problems outside of these scopes and achieve effects outside of these scopes.

[0051] 2. Configuration of the processing device 100, which is an embodiment to which the present invention is applied (1) Description of the processing device to which the present invention can be applied FIG. 1 is an explanatory diagram illustrating an overview of a processing apparatus 100 according to an embodiment of the present invention. FIG. 2 is an explanatory diagram illustrating the state of a mist cover layer 40 and the operation of a suction device 160. This embodiment is an example of a processing apparatus using a laser beam 50 to which the present invention is applied. Note that the processing apparatus to which the present invention is applicable is not limited to this. For example, the present invention can also be applied to a processing apparatus using a plasma arc. Processing operations performed by a processing apparatus to which the present invention is applicable include, for example, cutting a workpiece 10 or joining multiple workpieces 10. The workpiece 10 is, for example, a metal material, and processing of the workpiece 10 is performed by heating a local portion 16 at a processing location 12, where processing is performed. The present invention can be applied to any apparatus that performs processing by heating, and can be highly effective.

[0052] In the embodiment of FIG. 1 , the workpiece 10 is depicted small, but this is done for convenience of the drawing. In application of the present invention, the workpiece 10 may be large or small, and there are no restrictions on the size of the workpiece 10. In this embodiment, the workpiece 10 is fixed on the processing table 31 of the processing device 100. However, this is just one example and is not limiting. For example, the present invention may be applied to a processing device that processes floors or walls of large buildings. The present invention may also be applied to a processing device that processes materials used in ships, vehicles, aircraft, etc. The actions and effects of this embodiment described below also apply to the above-mentioned processing device.

[0053] 1, a first mist layer 42 exists inside a second mist layer 44, which will be described below, and inside the first mist layer 42 exists a heating area 20, which is a space for emitting a laser beam 50 toward a local portion 16 of a workpiece 10. To make these configurations easier to understand, the second mist layer 44 and the first mist layer 42 are shown in cross section in FIG.

[0054] (2) Description of the configuration of a processing apparatus 100 according to an embodiment of the present invention (2-1) Explanation of the configuration of the processing position moving mechanism 30 The processing apparatus 100 has a processing table 31 on which the workpiece 10 is fixed. A desired cutting process can be performed by moving a local portion 16, which is a processing point, along a processing location 12, which is a cutting location when, for example, cutting the workpiece 10. The processing apparatus 100 is provided with a processing position movement mechanism 30 to move the local portion 16, which is a processing point, along the processing location 12. The processing position movement mechanism 30 includes an X-direction movement mechanism 32 for moving the local portion 16 in the X direction, a Y-direction movement mechanism 34 for moving the local portion 16 in the Y direction, and a Z-direction movement mechanism 36 for adjusting the distance between the local portion 16 and a heating head 122 of a heating device 120. Specifically, the heating device 120 for heating the local portion 16 of the workpiece 10 is fixed to a processing unit support table 38, and the processing unit support table 38 is configured to be moved in the X, Y, and Z directions by the processing position movement mechanism 30. The processing unit support table 38 is provided with a heating device 120, a mist generating device 130, a laser oscillator 70, and a recovery device 170.

[0055] In the embodiment shown in FIG. 1 and the embodiments described below, for simplicity and ease of understanding, the workpiece 10 is shown as being maintained in a fixed position, and the heating head 122 of the heating device 120 moves relative to the workpiece 10. However, when moving the local area 16 along the processing location 12 of the workpiece 10, the position of the heating head 122 of the heating device 120 may be fixed and the workpiece 10 may be moved. Instead of moving the processing unit support table 38 that holds the heating device 120 with the X-direction movement mechanism 32 or the Y-direction movement mechanism 34, the processing table 31 may be moved to change the positional relationship between the heating head 122 and the local area 16 on the workpiece 10. Furthermore, when adjusting the distance between the local area 16 and the heating head 122, the processing unit support table 38 may be raised or lowered with the Z-direction movement mechanism 36, or the position of the processing unit support table 38 may be fixed and the height of the processing table 31 may be changed. Furthermore, it is possible to move either the processing unit support table 38 or the processing table 31, but it is also possible to move both to adjust the distance between the local area 16 and the heating head 122 and the relative positional relationship of the heating head 122 with respect to the workpiece 10 in the X and Y directions.

[0056] (2-2) Explanation of processing operation by heating device 120 The laser oscillator 70 provided on the processing unit support table 38 generates a laser beam by applying energy to it, and the generated laser beam is then amplified to supply a high-energy laser beam to the heating device 120. In this embodiment, the laser oscillator 70 is provided on the processing unit support table 38 in order to make the entire device, including the laser oscillator 70 and the heating device 120, compact. However, in applying the present invention, the location of the laser oscillator 70 is not a constraint.

[0057] The laser beam introduced into the heating device 120 is irradiated as a laser beam 50 toward the local area 16 from the heating head 122 of the heating device 120 through the heating area 20. The heating device 120 is provided with, for example, a lens, which focuses the laser beam 50 at the local area 16. The energy of the laser beam 50 is concentrated on the local area 16, which is heated to a high temperature and melted. To move the local area 16, where the energy is concentrated, along the processing location 12, the processing position movement mechanism 30 moves the heating device 120 relative to the workpiece 10. In this way, the workpiece 10 can be cut along the processing location 12. The processing device 100 is provided with a control device 110 having an operation unit 112 and a display unit 114. Although the wiring between the control device 110 and the laser oscillator 70, the mist generating device 130, and the recovery device 170 is not shown, these are connected via communication lines. The operation of the processing device 100 is comprehensively controlled by the control device 110. A method for controlling the processing device 100 by the control device 110 will be described below with reference to FIGS.

[0058] 3. Explanation of the generation of fume 13 and how to prevent its leakage into the atmosphere (1) Explanation of the emission of fumes 13 and spatter from a local area 16 By irradiating the local area 16 of the workpiece 10 with the laser beam 50, the local area 16 is heated to a high temperature and melts. At this time, fumes 13 and spatter are generated and emitted from the local area 16. Because the fumes 13 are light, fine dust particles with a very small diameter, if these fumes 13 are emitted into the atmosphere, they will remain suspended in the atmosphere for a long time, making them difficult to collect. In addition, spatter with a large particle size is also emitted from the local area 16. If this spatter is released into the atmosphere, it can cause problems such as adhering to surrounding equipment and other objects. Note that in Figures 1 and 2, not only fumes 13 but also spatter is generated as described above, but the spatter is not shown.

[0059] (2) Explanation of the method for suppressing the diffusion of fumes 13 and spatters by the mist cover layer 40 As shown in Figures 1 and 2, when a localized area 16 is heated to a high temperature, fumes 13 and spatter are generated and emitted from the localized area 16. In this embodiment, a mist cover layer 40 made of a liquid such as water is formed to surround the heating area 20 for irradiation with a laser beam 50. The tip of the mist cover layer 40 may reach the surface of the workpiece 10. By generating this mist cover layer 40, the fumes 13 and spatter emitted from the localized area 16 can be efficiently and reliably contained within the mist cover layer 40. As will be explained below, not only can the fumes 13 be simply contained, but the first mist 43 and second mist 45 constituting the mist cover layer 40 can also trap the fumes 13. Furthermore, scattering of spatter with low mass and momentum is reduced. In this way, the fumes 13 and spatter with low mass and momentum trapped by the first mist 43 and second mist 45 can be collected together with the first mist 43 and second mist 45. Specific methods for this are explained below.

[0060] (3) Description of the method for forming the mist cover layer 40 The processing device 100 receives a supply of liquid such as water from a liquid supply device (not shown), generates mist in a mist generating device 130, and supplies the mist to a mist layer forming device 140. The mist supplied from the mist layer forming device 140 is sprayed so as to surround the outer periphery of the heating area 20, thereby forming a mist cover layer 40 around the outer periphery of the heating area 20.

[0061] In this embodiment, the mist cover layer 40 has a first mist layer 42 formed to surround at least the outer periphery of the heating area 20 and a second mist layer 44 formed to surround the outer periphery of the first mist layer 42. The first mist layer 42 is formed by a large number of first mist particles 43 sprayed from a first mist spray nozzle 144. The second mist layer 44 is formed by a large number of second mist particles 45 sprayed from a second mist spray nozzle 154. When the large number of first mist particles 43 constituting the first mist layer 42 and the large number of second mist particles 45 constituting the second mist layer 44 are compared, the large number of first mist particles 43 constituting the first mist layer 42 have smaller particle sizes than the large number of second mist particles 45 constituting the second mist layer 44. This improves the fume 13 trapping effect of the mist cover layer 40, as will be described below.

[0062] (4) Description of the diameter of the first mist 43 constituting the first mist layer 42 and the diameter of the second mist 45 constituting the second mist layer 44 In this embodiment, as described above, the diameter of the multiple first mist particles 43 that form the first mist layer 42 is smaller than the diameter of the multiple second mist particles 45 that form the second mist layer 44. Here, the diameters of the first mist particles 43 and the second mist particles 45 refer to, for example, the diameter of the mist, or the size of the mist.

[0063] The numerous first mist particles 43 and second mist particles 45 that make up the first mist layer 42 and second mist layer 44 are not uniform in size, but exist as a mixture of large and small mist particles. When the distribution of the number of mist particles that make up each of the first mist 43 and second mist 45 is examined using size as a parameter, a peak in the number of mist particles exists in a certain size range, and the number of mist particles decreases as one moves away from the peak range.

[0064] As described above, the first mist layer 42 and the second mist layer 44 function to confine or capture generated fumes. From this perspective, when focusing on the size of the first mist 43 and the second mist 45 that form the first mist layer 42 and the second mist layer 44, the size of the mist with the greatest amount of mist present—in other words, the size of the mist in the region where the mist count distribution peaks—is important in terms of their function. When comparing the size of the mist in the peak count region of the first mist 43 that forms the first mist layer 42 and the second mist 45 that forms the second mist layer 44, the size of the second mist 45 is larger than the size of the first mist 43. Thus, comparing the diameter of the mist in the peak count region, using size as a parameter, is effective in terms of the function of the first mist layer 42 and the second mist layer 44. The mist contained in the most numerous area, and further the mist present in the area adjacent to the most numerous area, exerts the above-mentioned action and brings about the effect.

[0065] (5) Explanation of the trapping effect for Hume 13 As described above, when a laser beam 50 is irradiated onto a local area 16 of the workpiece 10, fumes 13 are emitted from the local area 16 that is heated to a high temperature. These fumes 13 are trapped by the mist cover layer 40. By configuring the mist cover layer 40 to have a first mist layer 42 formed of a large number of first mist particles 43 with small particle sizes and a second mist layer 44 with particle sizes larger than the first mist particles 43, the function and effect of trapping the fumes 13 by the mist cover layer 40 is greatly improved.

[0066] Referring to Figure 3, the reason why the mist cover layer 40 described above improves the trapping state will be explained. By forming the first mist layer 42 inside the mist cover layer 40 with a large number of small particle diameter first mist particles 43, the distance between the many first mist particles 43 can be reduced. Because the fumes 13 generated from the localized area 16 are very small, if the distance between them were large, the proportion of fumes 13 leaking from the first mist layer 42 would increase. In this embodiment, the particle diameter of the many first mist particles 43 that form the first mist layer 42 is small, which prevents fumes 13 from leaking.

[0067] In this embodiment, the particle size of the numerous first mists 43 that form the first mist layer 42 is set to be approximately the same as the particle size distribution of the fumes 13. This allows efficient collisions with the fumes 13, allowing the first mists 43 to capture particles of multiple fumes 13, and further allowing the first mists 43 and multiple fumes 13 to combine to form clusters 48.

[0068] In this embodiment, a second mist layer 44 is provided outside the first mist layer 42, and the diameter of the second mist 45 forming the second mist layer 44 is larger than the diameter of the first mist 43 forming the first mist layer 42. Preferably, the diameter of the second mist 45 is several times or even several tens of times larger than the diameter of the first mist 43. Clusters 48 formed based on the first mist 43 have large masses and diameters (cross-sectional areas). Therefore, in order to efficiently capture the clusters 48, it is desirable that the mass and diameter of the second mist 45 are similarly large. Furthermore, in this embodiment, the mass per unit time of the second mist 45 sprayed from the second mist spray nozzle 154 is greater than the mass per unit time of the first mist 43 sprayed from the first mist spray nozzle 144. This stabilizes the second mist layer 44 and improves the collection efficiency of fumes 13 and clusters.

[0069] Not all of the fine dust containing fumes 13 emitted from the local area 16 will necessarily form clusters 48 together with the first mist 43. Fine dust that passes through the first mist layer 42 and does not form clusters 48 will diffuse due to Brownian motion, etc. In this diffusion process, there is a high probability that the fine dust will come into contact with the clusters 48, and it is expected that it will be taken up by the clusters 48. It is also expected that the fine dust will be taken up by the second mist layer 44. The fine dust containing fumes 13 trapped in the second mist layer 44 in this way is sucked in through the suction port 162 and collected, as will be explained below.

[0070] (5) Explanation of the effect of forming the mist cover layer 40 In this embodiment, the mist cover layer 40 is expected to absorb the energy of fine dust particles, including fumes 13, generated by high-temperature heating of the localized area 16, and further capture the fine dust particles, thereby suppressing the dispersion of the fine dust particles into the atmosphere.

[0071] Since the mist cover layer 40 has the first mist layer 42 and the second mist layer 44, the effect of suppressing the diffusion of fine dust into the atmosphere is enhanced.

[0072] The diameter of the second mist 45 forming the second mist layer 44 is larger than the diameter of the first mist 43 forming the first mist layer 42. By doing so, fine dust containing fumes 13 can be captured efficiently.

[0073] Furthermore, the diameter of the first mist 43 forming the first mist layer 42 is set to a particle size distribution that generally encompasses the particle size distribution of fine dust. This is expected to significantly improve the capture effect of fine dust, including the fumes 13. For example, it is expected that clusters 48 based on the first mist 43 will be generated, and the capture ability will be improved.

[0074] The diameter of the second mist 45 forming the second mist layer 44 is set to be several times or even several tens of times larger than the diameter of the first mist 43 forming the first mist layer 42. This makes it possible to expect that the clusters 48 based on the first mist 43 forming the first mist layer 42 will be captured by the second mist 45.

[0075] The above explanation has focused on fumes 13, but spatter is also emitted from localized area 16. It is preferable to suppress the diffusion of spatter into the atmosphere. The mist cover layer 40 described above, and further the action of the first mist layer 42 and second mist layer 44 that make up the mist cover layer 40, can be expected to suppress the diffusion of spatter with small mass and momentum into the atmosphere. Furthermore, spatter is captured by the mist cover layer 40, sucked by the suction device 160 described below, and collected by the collection device 170.

[0076] 4. Explain how to collect fine dust containing fume 13 (1) Outline of the fine dust collection method 1 is captured by the mist cover layer 40 as described above. The captured fine dust containing fumes 13 is sucked from the suction port 162 of the suction device 160 together with the mist and air that form the mist cover layer 40. After being sucked, the fine dust containing fumes 13 is collected by a filter 180 provided inside the collection device 170, and the clean air after the fine dust has been collected is discharged from the collection device 170.

[0077] (2) Explanation of suction method The suction method will be explained using Figure 2. The first mist layer 42 and second mist layer 44 that make up the mist cover layer 40 function to prevent fine dust containing fumes 13 from leaking into the atmosphere. To maintain this function of preventing fine dust containing fumes 13 from leaking into the atmosphere, it is important not to disturb the mist cover layer 40. For example, if suction is performed perpendicular to the outer peripheral surface of the mist cover layer 40 through the suction port 162, holes may be created in the mist cover layer 40. It is preferable to suppress the generation of turbulence and maintain a laminar flow state.

[0078] As shown in FIG. 2, multiple suction ports 162 are provided along the outer periphery of the second mist layer 44, minimizing changes in flow velocity at each suction port 162. Furthermore, to suppress turbulence, each of the multiple suction ports 162 is uniformly open in either a clockwise or counterclockwise direction. Therefore, the mist cover layer 40 maintains a rotating state and is sucked into the suction ports 162 while rotating. Rotating the mist cover layer 40, particularly the second mist layer 44, in one direction increases the probability that fine dust particles and clusters 48 containing fumes 13 collide with the colliding second mist 45. This increases the proportion of fine dust particles and clusters 48 containing fumes 13 trapped by the second mist 45. This enhances the effectiveness of suppressing the leakage of fine dust particles and clusters 48 containing fumes 13 into the atmosphere.

[0079] In this embodiment, eight suction ports 162 are provided along the outer periphery of the second mist layer 44. As described above, it is desirable for the mist cover layer 40, including the second mist layer 44, to maintain a laminar flow state. If the number of suction ports 162 is small, it becomes difficult to maintain laminar flow. At least four or more ports are preferable. The more suction ports 162 there are, the more stable the flow of the second mist layer 44 will be. Therefore, eight ports is more preferable, and the more ports there are, the more stable the flow of the second mist layer 44 will be.

[0080] In this embodiment, a suction device 160 having a suction port 162 is fixed to the heating device 120 by a suction device support mechanism 166. A mist layer forming device 140 for forming the mist cover layer 40 is also fixed to the heating device 120. As the suction device 160 moves together with the heating device 120, a constant relationship is always maintained between the suction port 162 and the second mist layer 44. Therefore, the laminar flows of the mist cover layer 40 and the second mist layer 44 described above are maintained in a stable state by the suction port 162. In this embodiment, the suction device 160 is fixed directly to the heating device 120 by the suction device support mechanism 166, but substantially the same effect can be obtained by fixing the suction device support mechanism 166 to the processing unit support base 38 on which the heating device 120 is supported.

[0081] (3) Explanation of the collection method and effectiveness of fine dust and cluster 48, including fume 13 The collection of fine dust particles and clusters 48 containing fumes 13 sucked through the suction port 162 will be described with reference to Fig. 4. Note that the method described in Fig. 4 is just one example, and there are various other methods.

[0082] If fine dust particles, including the clusters 48 and fumes 13, can be removed using a filter 180, air pollution by harmful substances can be prevented. In this embodiment, the filter 180 is provided in the collection device 170. When a predetermined amount of fine dust particles adhere to the filter 180, the used filter 180 can be removed through a replacement port (not shown) and replaced with a new filter 180. The collection device 170 is also provided with a venturi scrubber 164. The venturi scrubber 164 is formed with a throttle 174 for accelerating the sucked fluid. Therefore, the clusters 48 and fine dust particles taken in through the suction port 162 are accelerated by the action of the throttle 174 along with the taken-in air. When a third mist 178 is supplied from the mist generating device 130 through a third mist spray nozzle 176 to the accelerating clusters 48 and fine dust particles, the clusters 48 and fine dust particles collide with the third mist 178 and form water droplets 49.

[0083] The third mist 178 sprayed from the third mist injection nozzle 176 has very large particle diameters and is sprayed so as to block the flow path. Therefore, almost all of the clusters 48 and fine dust particles accelerated by the orifice 174 collide with the third mist 178. This causes large clumps of water droplets to be formed.

[0084] The larger the particle size, the more reliably the filter 180 captures the particles. For example, a HEPA (High Efficiency Particulate Air) filter can be used as the filter 180. Using this filter, it is possible to capture the above substances with a very high particle capture rate. Therefore, if the mist cover layer 40 can capture fine dust containing fumes 13 with a high probability, it can also prevent the fine dust containing fumes 13 from diffusing into the atmosphere with a high probability. As described above with respect to the embodiments shown in FIGS. 1 and 2, forming the mist cover layer 40 can capture fine dust with a high probability. Furthermore, if the mist cover layer 40 has a first mist layer 42 and a second mist layer 44, it can capture fine dust with a higher probability.

[0085] (4) Explanation of application examples As explained using Fig. 3, the suction port 162 provided in the suction device 160 efficiently and stably sucks in fine dust containing fumes 13, thereby preventing the fine dust from being dispersed into the atmosphere. In order to efficiently suck in the fine dust, it is preferable to position the suction port 162 provided in the suction device 160 close to the surface of the workpiece 10. However, it is also desirable to consider the relationship with the amount of mist sprayed from the first mist spray nozzle 144 and the second mist spray nozzle 154.

[0086] Although detailed configuration is omitted, the control device 110 shown in FIG. 1 controls the suction device support mechanism 166 that supports the suction device 160, thereby controlling the distance between the suction port 162 of the suction device 160 shown in FIGS. 2 and 3 and the workpiece 10, thereby appropriately controlling the suction force at the suction port 162 and the amount of mist sprayed from the first mist spray nozzle 144 and the second mist spray nozzle 154. In this embodiment, the diameter and amount of mist sprayed from the first mist spray nozzle 144 and the second mist spray nozzle 154 are set based on these instructions from the control device 110. Furthermore, the control device 110 sends control commands to the suction device support mechanism 166 and the recovery device 170 in accordance with the settings related to the mist to be sprayed, thereby optimally setting the position of the suction port 162 of the suction device 160 in the Z direction relative to the workpiece 10 and setting the suction force. This greatly improves adaptability to various materials, thicknesses, usage conditions, etc. of the workpiece 10.

[0087] 5. Description of other embodiments of the first mist spray nozzle 144 and the second mist spray nozzle 154 (1) Explanation of the basic configuration As will be explained below using FIG. 5, the differences between the embodiment in FIG. 1 and the embodiment in FIG. 5 are that the second mist spray nozzle 154 is positioned closer to the workpiece 10 than the first mist spray nozzle 144 and that a cover 156 is provided for the second mist spray nozzle 154. Other differences are the same as in FIG. 1, but some components have been omitted from the configuration in FIG. 1 to avoid cluttering the drawing. Furthermore, the second mist spray nozzle 154 and the cover 156 are shown with dashed lines to facilitate understanding of their relationship to the internal components. In reality, the components arranged inside the second mist spray nozzle 154 and the cover 156 cannot be seen from the outside. Furthermore, the second mist layer 44 and the first mist layer 42 are each shown in cross section to allow the configuration of the mist cover layer 40 to be understood.

[0088] According to the results of experiments conducted by the inventors, it has been confirmed that when the first mist spray nozzle 144 and the second mist spray nozzle 154 are closer to the workpiece 10, the first mist layer 42 and the second mist layer 44 can more effectively suppress the diffusion of fine dust into the atmosphere, even though the amount of mist sprayed is the same. The heating head 122 is set so that the relationship between the local area 16 and the heating head 122 is optimized. This sets the heating area 20. The first mist layer 42 is formed by the first mist 43 sprayed from the first mist spray nozzle 144 so as to surround the heating area 20. It is preferable to position the first mist spray nozzle 144 closer to the workpiece 10, but various constraints must be considered, and there are limitations.

[0089] (2) Explanation of the effects In the embodiment shown in FIG. 5 , the second mist spray nozzle 154 is positioned closer to the workpiece 10 than the first mist spray nozzle 144. The second mist layer 44 formed by the second mist spray nozzle 154 reliably captures fine dust particles, which are then sucked up by the suction device 160, thereby preventing the fine dust particles from leaking into the atmosphere. From this perspective, improving the fine dust capturing ability of the second mist layer 44 is very important, and favorable results can be obtained. Furthermore, the suction action of the suction device 160 has a greater effect on the second mist layer 44 than on the first mist layer 42. It is preferable that the second mist layer 44 be stable even when subjected to the suction action of the suction device 160. By positioning the second mist spray nozzle 154 closer to the workpiece 10 than the first mist spray nozzle 144, the above-mentioned effects can be achieved. In this embodiment, the outer periphery of the first mist layer 42 near the first mist spray nozzle 144 is covered by the second mist spray nozzle 154. The entire first mist spray nozzle 144 may be covered by the second mist spray nozzle 154, or a cover 156 may be provided on the second mist spray nozzle 154 and the outer periphery of the first mist spray nozzle 144 may be covered by the cover 156.

[0090] 5. Description of the application of the present invention to a processing device using a plasma arc (1) Preface When applied to a processing device that heats a local area 16 to a high temperature for processing a workpiece 10, the present invention is highly effective in preventing the dispersion of fine dust particles, including fumes 13, into the atmosphere. A typical example of a processing device that heats a local area 16 to a high temperature for processing is a processing device that uses a laser beam, and an example of this device has been described using Figures 1 to 5. Another typical example of a processing device that heats a local area 16 to a high temperature for processing is a processing device that uses a plasma arc. This example is shown in Figure 6. The basic configuration, operation, and effect are almost the same as those of the above-mentioned example. Therefore, the same reference numerals are used for the same components. The operation and effect of components with the same reference numerals are almost the same, so description thereof will be omitted.

[0091] (2) Explanation of the basic configuration and effects of the embodiment shown in FIG. 6 Gas is supplied from the gas supply device 72 to the heating device 120 in order to eject a plasma arc 52 from the heating head 122 toward the local area 16 of the workpiece 10. Furthermore, a voltage is applied from the power supply device 74 between the heating device 120 and the workpiece 10. The gas supplied from the gas supply device 72 is ionized into a plasma state, generating a plasma arc 52, which is ejected from the heating head 122 toward the local area 16. In this embodiment, the structure of the heating device 120 for generating and ejecting the plasma arc 52 is the same as that of a commonly used plasma processing machine.

[0092] The central temperature of the plasma arc 52 is very high, heating the local area 16 to a high temperature. As in the embodiment described with reference to Figures 1 to 5, fine dust containing fumes 13 is emitted from the local area 16. As in the previous embodiment, a first mist layer 42 is formed by a first mist spray nozzle 144 so as to surround the heated area 20 where the plasma arc 52 is formed, and a second mist layer 44 is formed outside the first mist layer 42 by a second mist spray nozzle 154. The effects of the first mist layer 42 and the second mist layer 44, the effects of the mist cover layer 40, and the effects of the suction device 160 and the recovery device 170 are the same as those described in the above-mentioned embodiment.

[0093] 6. Explanation of the effect of processing the contaminated workpiece 10 (1) Explanation of basic effects In the above-described embodiment, the effect of suppressing the dispersion of fine dust particles generated from the workpiece 10 into the atmosphere has been described. When the workpiece 10 itself is contaminated with harmful substances, etc., applying the processing device 100 to which the present invention is applied provides even greater effects. For example, when the workpiece 10 is contaminated with radioactive materials, the fine dust particles emitted from the local area 16 are also contaminated with radioactive materials. It is desirable to suppress the release of such contaminants into the atmosphere as much as possible.

[0094] In the above-described embodiment, the fine dust particles released during the processing of the workpiece 10 are trapped by the mist cover layer 40 and then collected by the suction device 160. As described above, when harmful substances adhere to the workpiece 10 and are released during processing, not only can the leakage of the harmful substances into the atmosphere be suppressed, but the released harmful substances can also be collected. The above-described embodiment has a very significant effect.

[0095] (2) Explanation of an alternative to the processing device described in the above embodiment In the above-described embodiment, emphasis is placed on explaining the basic effects, and a small plate-like object is described as the workpiece 10. However, the application of the present invention is not limited to such small materials. For example, the present invention can be used to demolish structures to which hazardous substances have adhered, and the above-described effects provide significant benefits.

[0096] FIG. 7 shows an embodiment for processing a large workpiece 10, and differs from the embodiments described using FIGS. 1 to 6 in the following ways. In the above-described embodiments, the workpiece 10 is fixed to a processing table 31. In the embodiment of FIG. 7, a fixing device 39 is fixed to the workpiece 10 or a building or other structure that houses the workpiece 10, and the processing position movement mechanism 30 is fixed by the fixing device 39. The fixed processing position movement mechanism 30 moves the processing unit support table 38, which supports the heating device 120 and other components, in the X, Y, and Z directions relative to the workpiece 10. When performing processing, including cutting, on a building or other structure that is contaminated by pollutants, the above-described effects can suppress air pollution. The same applies even if the workpiece 10 itself is a pollutant.

[0097] 7. Explanation of the effects when the workpiece 10 is a rare metal or when a rare metal is used In the above-described embodiment, if the workpiece 10 is made of gold, silver, or other rare metals, or if the workpiece 10 contains a rare metal, the fine dust particles of the rare metal released during processing of the workpiece 10 can be trapped by the mist cover layer 40 and then sucked up by the suction device 160, allowing the rare metal to be recovered. This not only prevents the rare metal from leaking into the atmosphere, but also allows the released rare metal to be recovered. By using the processing apparatus 100 described in the above embodiment, rare metals can be more actively recovered. For example, when rare metals are used in electronic devices or batteries, the heating head 122 of the processing apparatus 100 described in the above embodiment can melt the portion of the workpiece 10 containing the rare metal as a localized portion 16 before disposal. This melts the rare metal into fine dust particles, which are then trapped by the mist cover layer 40 and extracted by the recovery device 170. For example, when rare metals are used in electronic circuits, the rare metals may exist discretely as small clumps. Even in such a state, the processing device 100 of the above embodiment can accurately detect the location of the rare metal and accurately melt the rare metal, thereby enabling efficient recovery of the rare metal.

[0098] 8. Description of the method for controlling the machining operation of the machining device 100 by the control device 110 (1) Basic structure of the flowchart S300 8 and 9 is an example of control of the main devices constituting the machining apparatus 100, performed by the control device 110 shown in FIGS. 1 and 5 to 7. The flowchart S300 sends control commands to control the operation of the main devices constituting the machining apparatus 100. For this purpose, the flowchart S300 includes an input task S310, a machining start task S330, a machining end / machining stop task S350, a machining execution task S410, and an error processing task S440. The flowchart S300 further includes a task execution control unit S302 and a task end processing unit S304 for starting the above tasks, i.e., starting, stopping, or interrupting execution.

[0099] Each task has a preset execution start condition, and when the execution start condition is met, the task execution control unit S302 starts executing the corresponding task. If the start condition is met for multiple tasks, execution starts from the task with the highest priority. When the execution of a task ends, the task termination processing unit S304 performs termination processing to report that the execution of the corresponding task has ended.

[0100] (2) Explanation of the execution contents of input task S310 Before machining of the workpiece 10 begins, an input task S310 is used to input machining conditions for the workpiece 10 from the operation unit 112 of the control device 110. There are various possible conditions for starting execution of the input task S310, and execution may be started under any condition. As an example, an interrupt process is performed by an input operation on the operation unit 112, and execution of the input task S310 is started. When execution starts, items to be entered are displayed on the display unit 114 of the control device 110, and conditions are entered according to these items. In the case of inputting machining conditions, execution transitions from step S312 to step S314, and the material of the workpiece 10 is input in step S314, and the thickness of the workpiece 10 is input in step S316. Furthermore, in step S318, the machining location on the workpiece 10 is input.

[0101] Next, execution proceeds to step S320, where major control conditions are determined based on the information input in steps S314 to S318. Internally stored data is retrieved based on the material and thickness of the workpiece 10, and the output of the heating head 122 and the diameter and amount of the first mist 43 sprayed from the first mist spray nozzle 144 are determined. Furthermore, the diameter and amount of the second mist 45 sprayed from the second mist spray nozzle 154 are determined. Furthermore, for control at the end of operation, the time M from when the heating head 122 stops melting the local area 16 to when the first mist spray nozzle 144 and the second mist spray nozzle 154 stop spraying mist, and the time S from when the heating head 122 stops melting the local area 16 to when the suction device 160 stops suctioning are set.

[0102] (3) Description of machining operation start control of machining device 100 After setting the machining conditions in step S320, the machining operation is ready to begin. To start the machining operation of the machining device 100, the input task S310 is started by operating the operation unit 112 of the control device 110. Execution proceeds from step S312 to step S322 and then to step S324, where an instruction to start machining is input. This input allows task S330 to start execution. In other words, the execution stop condition of task S330 is released. If it is desired to stop the machining operation of the machining device 100 during the machining operation, the input task S310 is executed by interrupt processing by operating the operation unit 112 of the control device 110, and an instruction to stop machining can be input in step S324. This instruction to stop machining enables control to stop the machining operation of the machining device 100 by task S350, which will be described later. By executing task S350, the machining operation of the machining device 100 can be stopped. This will be described below. When the execution of the input task S310 for starting the operation of the processing device 100 in the input task S310 is completed, the task completion processing unit S304 reports the completion of the execution of the input task S310, which was started at the instruction of the task execution control unit S302, to the task execution control unit S302.

[0103] When the pause in execution of the machining start task S330, which starts the machining operation of the machining apparatus 100, is canceled by an input operation in step S324 of the input task S310, the task execution control unit S302 can start executing the machining start task S330. The machining start task S330 is executed at a 100-msec cycle, as an example. Upon this execution start, execution of the machining start task S330 proceeds from step S332 to step S334, and in step S318, the positional relationship between the workpiece 10 and the heating head 122 is set based on the input data for the machining location 12. This setting is performed by a control command from the control device 110 to the machining position movement mechanism 30. Next, step S336 is executed, in which the control device 110 sends a control command to the laser oscillator 70, gas supply device 72, or heating device 120, and the output power of the heating head 122 is set. However, the actual melting operation of the heating head 122 is stopped at this stage. Control commands are also sent to the mist generation device 130 and the mist layer forming device 140 to set the diameter and spray amount of the first mist 43 sprayed from the first mist spray nozzle 144. Also, the diameter and spray amount of the second mist 45 sprayed from the second mist spray nozzle 154 are set. Furthermore, the suction force of the suction device 160 is set.

[0104] When step S336 is executed, the processing operation actually begins. First, the suction device 160 operates and begins suction. Because the mist cover layer 40 has not yet been formed, mist is not suctioned. However, as the mist cover layer 40 is formed, suction can begin without delay. Next, the mist layer forming device 140 begins operation and begins forming the mist cover layer 40. Because the heating head 122 has not yet begun melting the local area 16, no fumes to be captured have been generated. However, if fumes are generated, a system is in place to prevent them from leaking outside and capture them. After the suction device 160 and the mist layer forming device 140 begin operation and preparations for preventing fume leakage and capturing the fumes are completed, the heating head 122 begins melting the local area 16. This control makes it possible to perform the fume leakage prevention and capture operations with high reliability.

[0105] Since the machining start operation by the machining start task S330 ends in steps S334 to S338, processing is performed in step S340 to stop the execution of the machining start task S330, and a completion report is made in the task end processing unit S304. Since the machining start operation is completed, this execution stop processing stops the continuous repeated execution of the machining start task S330. However, as described above, if the start processing is performed in step S324 of the input task S310, the stop of execution of the machining start task S330 by step S340 is released in step S324, so the machining start task S330 becomes executable again.

[0106] (4) Explanation of the machining execution task S410 In step S340 of the machining start task S330, the execution stop of the machining execution task S410 is released, and the machining execution task S410 becomes executable. The machining execution task S410 shown in FIG. 9 becomes executable and is executed, for example, every 10 msec. When the machining execution task S410 is executed, in step S412, the local portion 16 moves along the machining location 12 at a predetermined speed based on the machining location 12 input in step S318 of the input task S310. As described above, the movement of this local portion 16 is controlled by controlling the relative positional relationship between the heating head 122 and the workpiece 10. Next, in step S416, it is determined whether machining at the machining location 12 has been completed for the entire machining location 12. If not, the task end processing unit S304 is executed. Since the machining execution task S410 is executed every 10 msec, in step S412 the local part 16 moves along the machining location 12 every 10 msec, and by repeating this, machining work is performed on the machining location 12. When machining of the machining location 12 is eventually completed, step S416 is executed, the stop of execution of the machining stop / machining end task S350 shown in Fig. 8 is released, and machining end control is performed by executing the machining stop / machining end task S350.

[0107] (5) Explanation of the abnormality processing task S440 The abnormality processing task S440 shown in FIG. 9 constantly diagnoses whether an abnormal condition has occurred during the operation of the processing apparatus 100, and if an abnormal condition is detected, performs risk avoidance action. This task is repeatedly executed at very short intervals, for example, every 2 msec. Although a detailed description is omitted, the processing apparatus 100 is equipped with a number of temperature detection devices and measuring devices for measuring the supply current values ​​required for operation. The presence or absence of abnormalities in temperature and current values ​​is monitored at very short intervals in the laser oscillator 70, heating device 120, mist generation device 130, collection device 170, etc. Step S442 detects whether an abnormality has occurred. If an abnormality has occurred, execution proceeds from step S444 to step S446 and then to step S448.

[0108] If an abnormality occurs, it is necessary to stop the operation of the machining device 100, and a report of the abnormality is made, which allows the start of execution of the machining stop / machining end task S350 shown in the figure. Furthermore, in step S444, a display of the abnormality occurrence and an alarm of the occurrence of danger are issued. Note that if no abnormality is detected in step S442, execution transitions from step S444 to the task end processing unit S304, and a report of the end of execution of the abnormality processing task S440 is made.

[0109] (5) Explanation of the machining stop / machining end task S350 The control details of the machining stop / machining end task S350 shown in FIG. 8 will now be described. If a machining operation at the machining location 12 is to be stopped during the operation, a machining stop operation is performed in step S324 of the input task S310. Furthermore, in step S416 shown in FIG. 9, when all machining operations at the machining location 12 have been completed, a machining end report is issued. When the machining operation is stopped or completed, the machining stop / machining end task S350 shown in FIG. 8 is executed, and execution proceeds from the start of step S350 to step S352 and step S364 to step S370, where the melting operation of the localized area 16 by the heating head 122 is stopped. Therefore, new fume generation is stopped. However, fumes that have already been generated still remain. To capture these fumes with the mist cover layer 40 and collect them by suction with the suction device 160, it is necessary to continue operation even after the melting operation by the heating head 122 has stopped. Therefore, the mist layer forming device 140 and the suction device 160 continue to operate. Since the duration varies depending on various conditions, the duration M and duration S are determined in step S320 based on the processing conditions. In other words, they are determined based on the input conditions entered in steps S314 to S318 of the input task S310.

[0110] Step S372 determines whether a predetermined time M, which is the elapsed time M, has elapsed since the melting operation of the heating head 122 was stopped. Once the predetermined time M has elapsed, step S374 is executed, and the operation for forming the mist layer forming device 140 is stopped. Even when the operation of the mist layer forming device 140 is stopped, the already formed mist cover layer 40 remains, and it is desirable to continue the suction operation by the suction device 160 thereafter. Once the predetermined time S, which is the elapsed time S, has elapsed since the operation of the heating head 122 was stopped, the operation of the suction device 160 is stopped. The elapsed time S is longer than the elapsed time M, and due to this difference in length, the suction device 160 continues to operate even after the operation of the mist layer forming device 140 is stopped. The difference between the elapsed time S and the elapsed time M may be used as a set time to control the duration until the suction device 160 is stopped after the mist layer forming device 140 is stopped, but either method is acceptable as it will produce the same result.

[0111] In this way, the reliability of fume collection can be improved by stopping the operation of the mist layer forming device 140 with a predetermined delay after the melting operation of the heating head 122 has stopped, and then stopping the operation of the suction device 160 with a further predetermined delay. Furthermore, if the collection device 170 is stopped with a delay after the operation of the suction device 160 has stopped, fumes and mist can be collected even more reliably.

[0112] When an abnormal state occurs in step S446 shown in Fig. 9, the machining stop / machining end task S350 shown in Fig. 8 becomes operable, and the machining stop / machining end task S350 is executed at intervals of 10 msec. This execution interval is extremely short, and essentially, when an abnormality is detected in step S444 of the abnormality processing task S440, execution of the machining stop / machining end task S350 is started without delay.

[0113] In the event of an abnormality, execution proceeds from the machining stop / machining end task S350 via step S352 to step S354, immediately halting the melting of the localized area 16 by the heating head 122. Following this, the mist layer forming device 140, suction device 160, and collection device 170 may be immediately stopped, but fumes remain floating even after the heating head 122 has stopped operating. The mist cover layer 40 formed by the mist layer forming device 140 not only functions to capture fumes but also to suppress temperature increases and even provide cooling. Therefore, although depending on the cause of the abnormality, reducing the temperature often leads to improved safety. Therefore, in this embodiment, the operation of the mist layer forming device 140 is continued for a predetermined time to capture and collect floating fumes, etc. Furthermore, the operation of the suction device 160 and collection device 170 is also continued for a predetermined time.

[0114] After the time M required to capture floating fumes, suck them up by the suction device 160, and collect them by the collection device 170 has elapsed, the operation of the mist layer forming device 140 is first stopped in step S358. Furthermore, in order to collect any mist cover layer 40 that remains after the mist layer forming device 140 has stopped operating, the suction device 160 is stopped after the time S, which is longer than the time M, has elapsed, and then the operation of the collection device 170 is stopped after a predetermined time has elapsed. In this way, even when an abnormality occurs, fumes can be collected well while ensuring safety.

[0115] 8. Although the embodiments of the present invention have been described above using the drawings, the specific configuration is not limited to this embodiment, and even if there are design changes, etc. within the scope that does not deviate from the gist of the present invention, they are included in the present invention. [Explanation of symbols]

[0116] 10. Workpieces to be processed; 12 Processing location, 13 Hume, 30 Processing position movement mechanism, 31 Processing table, 32 X-direction movement mechanism, 34 Y direction movement mechanism, 36 Z direction movement mechanism, 39 Fixation devices; 40 mist cover layers, 42 First Mist Layer, 43 First Mist, 44 Second Mist Layer, 45 Second Mist, 48 clusters, 49 water drops, 50 laser beams, 52 plasma arc, 70 laser oscillator, 72 Gas supply equipment, 74 Power supply, 100 processing equipment, 120 heating equipment; 122 heating head, 130 mist generating device, 144 first mist spray nozzle, 154 second mist spray nozzle, 160 Suction device, 162 Suction port, 164 Venturi scrubber, 166 Suction device support mechanism, 170 recovery equipment, 174 aperture, 176 Third mist spray nozzle, 178 Third Mist,

Claims

1. A heating device having a heating head for melting a localized portion at a processing location of an object to be processed; a mist layer forming device that sprays mist to form a mist cover layer outside a heating area that connects the local portion of the object to the heating head of the heating device; a processing position moving mechanism that moves the local portion along the processing location of the object by relatively changing a positional relationship between the heating head and the object; a collection device that sucks and collects the mist that forms the mist cover layer, The collection device sucks and collects the fumes generated in the local area together with the mist forming the mist cover layer. A processing device characterized by:

2. In the processing device described in claim 1, the recovery device includes a suction device having a suction port; The collection device sucks and collects the fumes together with the mist forming the mist cover layer through the suction port by the suction device. A processing device characterized by:

3. In the processing device described in claim 2, A laser oscillator is provided, a laser beam is irradiated from the heating head to the local portion of the object through the heating area based on the output of the laser oscillator; The fumes generated from the local area are sucked and collected together with the mist forming the mist cover layer through the suction port of the collection device. A processing device characterized by:

4. In the processing device described in claim 2, the collection device includes a filter; The mist and the fumes sucked from the suction port are guided to the filter, and the fumes are collected by the filter. A processing device characterized by:

5. In the processing device described in claim 2, a support mechanism is provided that supports the heating head and the mist layer forming device in a first predetermined positional relationship; the mist layer forming device supported by the support mechanism sprays the mist in a cylindrical shape to form the cylindrical mist cover layer; The heating head forms the heating area inside the cylindrical mist cover layer, the heating head and the mist layer forming device supported by the support mechanism are moved by the processing position moving mechanism while maintaining the first predetermined positional relationship with each other; A processing device characterized by:

6. In the processing device described in claim 5, The suction device has a plurality of the suction ports, a suction device support mechanism that supports the plurality of suction ports while maintaining a second predetermined positional relationship with respect to the mist layer forming device; As the mist layer forming device is moved by the processing position moving mechanism while maintaining the first predetermined positional relationship with respect to the heating head, the plurality of suction ports supported by the suction device support mechanism move while maintaining the second predetermined positional relationship with respect to the mist layer forming device. A processing device characterized by:

7. In the processing device according to claim 6, The opening directions of the plurality of suction ports of the suction device are each oriented in the circumferential direction of the cylindrical mist cover layer. A processing device characterized by:

8. In the processing device according to claim 2, The mist cover layer includes a first mist layer and a second mist layer formed on the outer periphery of the first mist layer, The particle size of the second mist for forming the second mist layer is larger than the particle size of the first mist for forming the first mist layer. A processing device characterized by:

9. In the processing device according to claim 2, a control device is provided for controlling the operations of the heating device, the mist layer forming device, the processing position moving mechanism, and the recovery device that sucks and recovers the mist, the control device stores a time M from when the melting operation of the local portion by the heating head is stopped until when the spraying operation of the mist from the mist layer forming device is stopped, the control device stops the mist spraying operation from the mist layer forming device after the time M has elapsed since the melting operation of melting the local portion by the heating head was stopped; A processing device characterized by:

10. In the processing device according to claim 9, the control device starts the spraying operation of the mist from the mist layer forming device based on the instruction to start processing, and further starts the suction operation of the mist from the mist cover layer by the suction device; After the mist cover layer forming device starts forming the mist cover layer, the heating head of the heating device starts melting the local portion at the processing location of the object to be processed. A processing device characterized by:

11. In the processing device according to claim 10, the control device stops the melting operation of the local portion by the heating head of the heating device based on an instruction to end processing; After the predetermined time M has elapsed since the melting operation on the local portion was stopped, the operation of forming the mist cover layer by the mist layer forming device is stopped, After the mist cover layer forming device stops forming the mist cover layer, the suction device of the recovery device stops suctioning the mist from the mist cover layer. A processing device characterized by:

12. In the processing device according to claim 9, the control device executes an abnormality diagnosis operation of the processing device together with a processing operation of the workpiece; If an abnormality is detected in the abnormality diagnosis operation, the melting operation of the local portion by the heating head is stopped, the operation of forming the mist cover layer by the mist layer forming device is stopped after the time M has elapsed since the operation of melting the local portion is stopped; A processing device characterized by:

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