Thermally conductive millable silicone rubber composition and thermally conductive sheet

Abstract

The present invention provides a thermally conductive millable silicone rubber composition comprising: (A)(A-1) a raw-rubber organopolysiloxane that has an alkenyl group at only both ends of a molecular chain, (A-2) a raw-rubber organopolysiloxane that has an alkenyl group at both ends of a molecular chain and in a side chain, and (A-3) a liquid organopolysiloxane that has two or more alkenyl groups per molecule; (B)(B-1) an organohydrogen polysiloxane that has 2-5 hydrosilyl groups per molecule and only in a side chain of the molecule and (B-2) an organohydrogen polysiloxane that has two or more hydrosilyl groups per molecule, two of which are at ends of a molecular chain; (C) a thermally conductive filler; (E) an addition reaction catalyst; and (F) an addition reaction control agent. The present invention provides a thermally conductive millable silicone rubber composition that provides a heat dissipation sheet which has a low contact thermal resistance and which is excellent in long-term stability.

Description

[Technical Field]

[0001] The present invention relates to a heat-conductive millable silicone rubber composition and a heat-conductive sheet. [Background technology]

[0002] Heat-generating components and integrated circuit devices used in various electronic devices can generate heat, which can degrade their performance and shorten their lifespan. The placement of components within an electronic device is important for smooth heat dissipation. In addition, heat-generating components and the entire device are forced to cool with cooling fins, and heat generated by integrated circuit devices is dissipated outside the device via a heat dissipation sheet.

[0003] However, in recent years, highly portable electronic devices, such as smartphones and tablet devices, have become increasingly highly integrated, resulting in increased heat generation from the heat-generating components and integrated circuit elements within the devices. As a result, conventional cooling methods may not be sufficient to cool or dissipate heat from these components and elements. In particular, these electronic devices require cooling methods other than forced air cooling to maintain portability. Furthermore, because the printed circuit boards on which the elements are formed use materials with poor thermal conductivity, conventional heat dissipation sheets are unable to adequately dissipate the heat generated by the elements to the board. Therefore, a method has been adopted in which a heat sink, such as a natural-cooling or forced-cooling type heat sink or heat pipe, is installed near the element, and the heat generated by the element is transferred to the heat sink via a heat dissipation medium and dissipated.

[0004] In this type of heat dissipation medium, a heat dissipation sheet with a thickness of approximately 0.2 to 10.0 mm is used to improve thermal conduction between the device and the heat sink. A well-known heat dissipation sheet is one made of a highly filled, high-hardness silicone rubber layer reinforced with a fabric-like reinforcing material such as glass cloth (Patent Document 1). This type of heat dissipation sheet is highly useful because the rubber layer has a high hardness, which not only provides thermal conductivity but also ensures insulation. However, to prevent a decrease in insulation due to thickness changes caused by pressure during mounting, the insulating heat dissipation sheet must be hard. This results in poor adhesion between the electronic component and the heat sink, resulting in high contact thermal resistance.

[0005] To reduce contact thermal resistance, a heat dissipation sheet has been proposed in which a low-hardness heat-conductive silicone rubber layer is laminated onto a high-hardness heat-conductive silicone rubber sheet reinforced with the aforementioned reinforcing material (Patent Document 2). However, in the case of this composite heat dissipation sheet, the low-hardness layer is compressed and deformed by pressure, which can lead to thinning or a decrease in insulation due to cracks or breaks in the low-hardness layer.

[0006] In addition, in order to achieve both excellent strength and high thermal conductivity, a thermally conductive silicone composite sheet has also been proposed in which a thermally conductive silicone cured product is laminated on both sides of a metal foil (Patent Documents 3 and 4). [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-233104 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-193598 [Patent Document 3] Japanese Patent Application Laid-Open No. 2013-095023 [Patent Document 4] Japanese Patent Application Publication No. 2017-092322 Summary of the Invention [Problem to be solved by the invention]

[0008] As described above, high-hardness heat-dissipating sheets have excellent heat dissipation properties and insulation reliability due to their strength, but they have the problem of not being able to achieve efficient heat conduction due to high contact thermal resistance. Furthermore, low-hardness and high-hardness composite sheets tend to become thin under high pressure, making it difficult to ensure insulation. Furthermore, when attempting to apply the method of laminating thin metal films such as metal foil to silicone rubber sheets, problems arise, such as increased contact thermal resistance, concerns about poor insulation, and increased manufacturing costs. The present invention has been made to solve the above problems, and aims to provide a thermally conductive millable-type silicone rubber composition that provides a heat dissipation sheet with excellent thermal conductivity, strength, and insulation properties, moderate hardness, low contact thermal resistance, and excellent long-term stability. [Means for solving the problem]

[0009] In order to solve the above problems, the present invention provides: (A) an organopolysiloxane containing the following components (A-1) to (A-3): (A-1) A crude rubber-like organopolysiloxane having alkenyl groups only at both ends of the molecular chain (A-2) A crude rubber-like organopolysiloxane having alkenyl groups at both molecular chain terminals and in side chains. (A-3) Organopolysiloxane that is liquid at 25°C and has two or more alkenyl groups per molecule 100 parts by mass of linear organopolysiloxane having an alkenyl group, (B) an organohydrogenpolysiloxane containing the following components (B-1) and (B-2): (B-1) Organohydrogenpolysiloxane having hydrosilyl groups only in side chains of the molecular chain and having 2 to 5 hydrosilyl groups per molecule (B-2) Organohydrogenpolysiloxane having two or more hydrosilyl groups per molecule, two of which are at the ends of the molecular chain. an organohydrogenpolysiloxane containing: an amount such that the total number of hydrosilyl groups in component (B) is 0.5 to 4.0 moles per mole of the total number of alkenyl groups in component (A); (C) Thermally conductive filler: 150 to 2,400 parts by mass (E) Addition reaction catalyst: an amount equivalent to 0.01 to 1,000 ppm in terms of platinum group metal atomic mass (F) Addition reaction inhibitor: effective amount The present invention provides a heat-conductive millable silicone rubber composition comprising:

[0010] The thermally conductive millable silicone rubber composition of the present invention can provide a heat dissipation sheet that has excellent thermal conductivity, strength, and insulation properties, moderate hardness, low contact thermal resistance, and excellent long-term stability.

[0011] In this case, it is preferable that the proportion of particles with a particle size of 45 μm or more contained in the component (C) be 5% by mass or less.

[0012] When such a thermally conductive millable silicone rubber composition is used to coat a thermally conductive sheet, the thermally conductive filler (filling material) does not protrude from the coating surface, impairing the smoothness of the sheet surface, and contact thermal resistance does not increase.

[0013] The composition preferably further contains 5 to 100 parts by mass of a polysiloxane modified with a trialkoxysilyl group at one end, represented by the following formula (1), as a wetter component (D). [ka] (In the formula, R 1 is an alkyl group having 1 to 6 carbon atoms, and n is an integer of 5 to 100.

[0014] By incorporating such a component (D), the component (C) is subjected to a hydrophobic treatment during the preparation of the composition, thereby improving the wettability with the component (A), and enabling the component (C) to be uniformly dispersed in the matrix made of the component (A).

[0015] The present invention also provides a thermally conductive sheet comprising a cured product of the above-mentioned thermally conductive millable silicone rubber composition and a reticulated reinforcing material.

[0016] Such a thermally conductive sheet has excellent thermal conductivity, strength, and insulating properties, has a suitable hardness, has low contact thermal resistance, and is also excellent in long-term stability.

[0017] In this case, it is preferable that the mesh-like reinforcing material is sealed.

[0018] Such a thermally conductive sheet can improve the contact at the interface between the reinforcing material and the cured product of the thermally conductive millable silicone rubber composition, thereby further reducing the contact thermal resistance. [Effects of the Invention]

[0019] As described above, the thermally conductive millable silicone rubber composition of the present invention can be used as a thermally conductive sheet suitable for heat dissipation in electronic devices, etc. Furthermore, a thermally conductive sheet containing a cured product of the millable silicone rubber composition and a mesh-like reinforcing material can be formed into a sheet with low thermal resistance due to good contact without sacrificing insulation. Furthermore, by controlling the particle size of the thermally conductive material, continuous coating molding can be performed, resulting in low-cost, simple manufacturing processes and stable product characteristics over the long term. DETAILED DESCRIPTION OF THE INVENTION

[0020] As mentioned above, there has been a demand for the development of a thermally conductive sheet that not only has excellent heat dissipation properties and insulation reliability, but also has low contact thermal resistance.

[0021] As a result of extensive research into the above-mentioned problems, the present inventors have discovered that the above-mentioned problems can be solved by a thermally conductive millable-type silicone rubber composition characterized by containing the following components (A), (B), (C), (E), and (F), and a thermally conductive sheet using said composition, and have thus completed the present invention.

[0022] That is, the present invention provides: (A) an organopolysiloxane containing the following components (A-1) to (A-3): (A-1) A crude rubber-like organopolysiloxane having alkenyl groups only at both ends of the molecular chain (A-2) A crude rubber-like organopolysiloxane having alkenyl groups at both molecular chain terminals and in side chains. (A-3) Organopolysiloxane that is liquid at 25°C and has two or more alkenyl groups per molecule 100 parts by mass of linear organopolysiloxane having an alkenyl group, (B) an organohydrogenpolysiloxane containing the following components (B-1) and (B-2): (B-1) Organohydrogenpolysiloxane having hydrosilyl groups only in side chains of the molecular chain and having 2 to 5 hydrosilyl groups per molecule (B-2) Organohydrogenpolysiloxane having two or more hydrosilyl groups per molecule, two of which are at the ends of the molecular chain. an organohydrogenpolysiloxane containing: an amount such that the total number of hydrosilyl groups in component (B) is 0.5 to 4.0 moles per mole of the total number of alkenyl groups in component (A); (C) Thermally conductive filler: 150 to 2,400 parts by mass (E) Addition reaction catalyst: an amount equivalent to 0.01 to 1,000 ppm in terms of platinum group metal atomic mass (F) Addition reaction inhibitor: effective amount The thermally conductive millable silicone rubber composition is characterized by comprising:

[0023] The present invention will be described in detail below, but the present invention is not limited thereto.

[0024] [Thermal conductive millable silicone rubber composition] The thermally conductive millable silicone rubber composition of the present invention (hereinafter also referred to as "thermally conductive silicone rubber composition") contains (A) an organopolysiloxane having alkenyl groups, (B) an organohydrogenpolysiloxane, (C) a thermally conductive filler, (E) an addition reaction catalyst, and (F) an addition reaction inhibitor. Furthermore, additives such as (D) a wetter may also be included as needed. The components contained in the composition of the present invention will be described below.

[0025] [(A) Organopolysiloxane having an alkenyl group] The linear organopolysiloxane having alkenyl groups, component (A), is the main component of the composition of the present invention. Component (A) is selected from the following components (A-1) to (A-3): (A-1) a crude rubber-like organopolysiloxane having alkenyl groups only at both ends of the molecular chain; (A-2) a crude rubber-like organopolysiloxane having alkenyl groups at both molecular chain terminals and in side chains; (A-3) Organopolysiloxane that is liquid at 25°C and has two or more alkenyl groups per molecule It is characterized by including three types:

[0026] The structure of these three types of organopolysiloxanes having alkenyl groups is a linear diorganopolysiloxane whose main chain is made up of repeating diorganosiloxane units.

[0027] The alkenyl group contained in these three types of organopolysiloxane is preferably an alkenyl group having 2 to 8 carbon atoms, such as a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, a hexenyl group, a cyclohexenyl group, etc. Of these, a vinyl group and an allyl group are preferred, with a vinyl group being particularly preferred.

[0028] Furthermore, the functional groups other than alkenyl groups bonded to silicon atoms in these three types of organopolysiloxanes are preferably monovalent hydrocarbon groups selected from alkyl groups having 1 to 10 carbon atoms, preferably 1 to 6 carbon atoms, aryl groups having 6 to 10 carbon atoms, and aralkyl groups having 7 to 10 carbon atoms. Examples include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, heptyl, and octyl; cycloalkyl groups such as cyclopentyl, cyclohexyl, and cycloheptyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; and aralkyl groups such as benzyl, phenylethyl, and phenylpropyl. Furthermore, the functional groups other than alkenyl groups bonded to silicon atoms do not necessarily have to be the same.

[0029] Specific examples of organopolysiloxanes having alkenyl groups include dimethylsiloxane-methylvinylsiloxane copolymers capped at both molecular chain terminals with trimethylsiloxy groups, methylvinylpolysiloxanes capped at both molecular chain terminals with trimethylsiloxy groups, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymers capped at both molecular chain terminals with trimethylsiloxy groups, dimethylpolysiloxanes capped at both molecular chain terminals with dimethylvinylsiloxy groups, methylvinylpolysiloxanes capped at both molecular chain terminals with dimethylvinylsiloxy groups, and dimethyl Examples include organosiloxane copolymers consisting of siloxane-methylvinylsiloxane copolymer, dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer terminated at both molecular chain ends with dimethylvinylsiloxy groups, dimethylpolysiloxane terminated at both molecular chain ends with divinylmethylsiloxy groups, dimethylsiloxane-methylvinylsiloxane copolymer terminated at both molecular chain ends with divinylmethylsiloxy groups, dimethylpolysiloxane terminated at both molecular chain ends with trivinylsiloxy groups, and dimethylsiloxane-methylvinylsiloxane copolymer terminated at both molecular chain ends with trivinylsiloxy groups.

[0030] (A-1) A crude rubber-like organopolysiloxane having alkenyl groups only at both ends of the molecular chain Component (A-1) is a crude rubber-like organopolysiloxane having alkenyl groups only at both ends of the molecular chain. In the present invention, "raw rubber-like" means either a highly viscous liquid having a viscosity of 200,000 mPa s or more at room temperature (25°C), or a non-liquid (paste or solid) state with no self-flowing properties. The viscosity in the present invention refers to the value measured using a rotational viscometer according to the method described in JIS Z8803:2011.

[0031] The degree of polymerization of the component (A-1) is preferably 2,000 to 20,000, and more preferably 3,000 to 15,000. In the present invention, the degree of polymerization generally refers to a value calculated from the weight-average degree of polymerization in terms of polystyrene measured by gel permeation chromatography (GPC) analysis using toluene as a developing solvent. [Measurement conditions] Developing solvent: toluene Flow rate: 1mL / min Detector: Refractive index detector (RI) Column: KF-805L x 2 (Shodex) Column temperature: 25℃ Sample injection volume: 30 μL (0.2% by mass toluene solution)

[0032] (A-2) A crude rubber-like organopolysiloxane having alkenyl groups at both molecular chain terminals and in side chains. Component (A-2) is a crude rubber-like organopolysiloxane having alkenyl groups at both ends of the molecular chain and on side chains. The degree of polymerization of the component (A-2) is preferably 2,000 to 20,000, and more preferably 3,000 to 15,000.The number of side chain alkenyl groups in one molecule is preferably 1 to 200, and more preferably 2 to 100.

[0033] (A-3) Organopolysiloxane that is liquid at 25°C and has two or more alkenyl groups per molecule Component (A-3) is an organopolysiloxane that contains two or more alkenyl groups per molecule and is liquid at 25°C. In the present invention, "liquid" means that the material has self-flowing properties at 25°C. The degree of polymerization of component (A-3) is preferably 100 to 2,000, and more preferably 500 to 1,500. The number of alkenyl groups in one molecule is characterized by being 2 or more, preferably 2 to 10, and more preferably 2 to 5. The alkenyl groups may be located at the terminals of the molecular chain or in side chains, but it is preferable that the alkenyl groups be located only at the terminals of the molecular chain. Furthermore, the structure of component (A-3) is a straight-chain main chain made up of repeating diorganosiloxane units. Component (A-3) is characterized by being liquid at 25° C. Its viscosity is preferably 500 to 200,000 mPa·s, and more preferably 10,000 to 150,000 mPa·s. The blending ratio of (A-1) to (A-3) is preferably such that, when the total amount of component (A) is 100% by mass, component (A-1) accounts for 20 to 45% by mass, component (A-2) accounts for 20 to 45% by mass, and component (A-3) accounts for 10 to 40% by mass.

[0034] [(B) Organohydrogenpolysiloxane] The organohydrogenpolysiloxane, component (B), reacts with component (A) and acts as a crosslinking agent. The component (B) is the following components (B-1) and (B-2): (B-1) an organohydrogenpolysiloxane having hydrosilyl groups only in side chains of the molecular chain and having 2 to 5 hydrosilyl groups per molecule; (B-2) Organohydrogenpolysiloxane having two or more hydrosilyl groups per molecule, two of which are at the ends of the molecular chain. The organohydrogenpolysiloxane is characterized by using two of the above.

[0035] The functional groups other than hydrosilyl groups in the organohydrogenpolysiloxane of component (B) are preferably monovalent hydrocarbon groups selected from alkyl groups having 1 to 10 carbon atoms, preferably 1 to 6 carbon atoms, aryl groups having 6 to 10 carbon atoms, and aralkyl groups having 7 to 10 carbon atoms. Examples include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl, and decyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; and aralkyl groups such as benzyl, phenylethyl, and phenylpropyl. Among these, alkyl groups and aryl groups are preferred, and methyl and phenyl groups are more preferred from the standpoint of flame retardancy. Furthermore, the functional groups other than the hydrogen atoms (hydrosilyl groups) bonded to silicon atoms do not necessarily have to be all the same.

[0036] (B-1) Organohydrogenpolysiloxane having hydrosilyl groups only in side chains of the molecular chain and having 2 to 5 hydrosilyl groups per molecule Component (B-1) is an organohydrogenpolysiloxane that has hydrosilyl groups only on side chains of the molecular chain, with each molecule having 2 to 5, and preferably 2 to 4, hydrosilyl groups. In the present invention, "having hydrosilyl groups on side chains of the molecular chain" means that the D unit or T unit constituting the polysiloxane main chain has an Si-H bond, or the polysiloxane side chain has an Si-H bond.

[0037] The structure of component (B-1) may be either linear or branched, but is preferably linear. The degree of polymerization of the component (B-1) is preferably 4 to 350, and more preferably 10 to 200.

[0038] A specific example of the component (B-1) is the organohydrogenpolysiloxane (o=27, p=2) shown by the following formula: [ka]

[0039] (B-2) Organohydrogenpolysiloxane having two or more hydrosilyl groups per molecule, two of which are at the ends of the molecular chain. Component (B-2) is an organohydrogenpolysiloxane having two or more, preferably 2 to 50, and more preferably 2 to 20, hydrosilyl groups per molecule, two of which are at the ends of the molecular chain. The hydrosilyl groups may be at the end of the main chain (the longest polysiloxane chain) or at the end of a side chain. Thus, in the present invention, the term "ends of the polysiloxane molecular chain" refers to both the end of the polysiloxane main chain and the end of the polysiloxane side chain, and simply referring to both ends refers to both ends of the polysiloxane main chain.

[0040] The structure of component (B-2) may be either linear or branched, but is preferably linear. The degree of polymerization of the component (B-2) is preferably 4-200, and more preferably 10-100.

[0041] A specific example of the component (B-2) is the organohydrogenpolysiloxane (q=65, r=1) shown by the following formula: [ka]

[0042] The content of the organohydrogenpolysiloxane (B) is such that the total number of hydrosilyl groups in component (B) is 0.5 to 4.0 moles, preferably 0.6 to 3.0 moles, per mole of the total number of alkenyl groups in component (A). If the content of this component is less than 0.5 moles, the resulting thermally conductive silicone rubber may be tacky, potentially causing blocking when wound. Furthermore, the increased thickness change upon compression may result in a decrease in insulating properties. On the other hand, if the content of this component is greater than 4.0 moles but less than 6.0 moles, the resulting thermally conductive silicone rubber composition may have a shorter pot life and may harden before the curing step. Furthermore, the resulting cured product may be too hard, preventing sufficient reduction in contact resistance. Furthermore, if the content of this component is greater than 6.0 moles, the component that does not contribute to the crosslinking reaction acts as a plasticizer, softening the cured product and increasing the thickness change, resulting in a decrease in insulating properties. The blend ratio of (B-1) and (B-2) is preferably such that, when the total amount of the (B) component is 100% by mass, the (B-1) component is 30 to 95% by mass and the (B-2) component is 5 to 70% by mass.

[0043] As described above, by using three types of component (A) and two types of component (B) of the present invention in combination, it is possible to precisely control the crosslinked structure (chain extension, crosslinking density) of the polysiloxane while maintaining good handleability of the raw rubber-like organopolysiloxane in component (A).

[0044] [(C) Thermally conductive filler] Component (C) is a thermally conductive filler that imparts thermal conductivity to the thermally conductive silicone rubber composition. Suitable examples of thermally conductive fillers include inorganic powders such as aluminum oxide, zinc oxide, silicon oxide, silicon carbide, aluminum nitride, and boron nitride. Component (C) can be used either alone or in combination of two or more.

[0045] The blending amount of component (C) should be 150 to 2,400 parts by mass, preferably 200 to 2,300 parts by mass, per 100 parts by mass of component (A). If the blending amount is less than 150 parts by mass, the thermal conductivity is likely to be insufficient, while if it is more than 2,400 parts by mass, it may be difficult to blend component (C) uniformly into the composition and moldability may be impaired.

[0046] While there are no particular restrictions on the particle size distribution of component (C), it is preferable that the proportion of particles with a particle size of 45 μm or larger be 5% by mass or less, and even more preferably 2% by mass or less. If the proportion of particles with a particle size of 45 μm or larger is 5% by mass or less, when a thermally conductive sheet is obtained by coating the thermally conductive millable silicone rubber composition, there is no risk of the thermally conductive filler (filling material) protruding from the coating surface, impairing the smoothness of the sheet surface, or increasing contact thermal resistance.

[0047] In component (C), fillers with multiple particle size distributions may be used as long as the proportion of particles with a particle size of 45 μm or more is 5% by mass or less. For example, a filler with peaks at 1 μm and 10 μm on its particle size distribution curve may be used, or a filler with an average particle size of 5 μm and a filler with an average particle size of 20 μm may be used in combination.

[0048] The average particle size of component (C) is preferably 0.1 to 30 μm, and more preferably 0.1 to 10 μm. If the average particle size is 30 μm or less, when a thermally conductive sheet is obtained by coating the thermally conductive silicone rubber composition, the thermally conductive filler will not protrude from the coating surface, impairing the smoothness of the sheet surface, and there is no risk of an increase in contact thermal resistance. Thermally conductive fillers with an average particle size of 0.1 μm or more are easily available.

[0049] The above average particle size is usually the cumulative volume average diameter D 50Specifically, it can be determined as the cumulative 50% particle diameter (D ) on a volume basis measured using a particle size distribution analyzer MT3000II manufactured by Microtrac Bell Corporation. 50 The proportion of particles having a specific particle size (for example, a particle size of 45 μm) or more can be determined from the particle size distribution measurement described above.

[0050] [(D) Wetter] The thermally conductive silicone rubber composition of the present invention preferably contains a wetter (D). Component (D) hydrophobizes component (C) during composition preparation, improving wettability with component (A) and allowing component (C) to be uniformly dispersed in the matrix of component (A). Component (D) is preferably a polysiloxane modified with a trialkoxysilyl group at one end, as shown in formula (1): [ka]

[0051] In the above formula (1), R 1 is an alkyl group having 1 to 6 carbon atoms, and preferably an alkyl group having 1 to 3 carbon atoms. Furthermore, n is an integer of 5 to 100, and preferably 10 to 50.

[0052] When component (D) is added, the amount added is preferably 5 to 100 parts by mass, and more preferably 10 to 60 parts by mass, per 100 parts by mass of component (A). If the proportion of this component is within the above range, there is no risk of inducing oil separation.

[0053] [(E) Addition reaction catalyst] The addition reaction catalyst for component (E) promotes the addition reaction between the silicon-bonded alkenyl group in component (A) and the hydrosilyl group in component (B). This addition reaction catalyst is a platinum group metal or a platinum group metal compound. Examples include platinum group metals such as platinum, palladium, and rhodium; chloroplatinic acid; alcohol-modified chloroplatinic acid; coordination compounds of chloroplatinic acid with olefins, vinylsiloxanes, or acetylene compounds; and platinum group metal compounds such as tetrakis(triphenylphosphine)palladium and chlorotris(triphenylphosphine)rhodium. Of these, platinum group metal compounds are preferred. The content of component (E) in this composition is 0.01 to 1,000 ppm, preferably 0.1 to 500 ppm, of component (A) in terms of platinum group metal atomic mass. If the content of this component is too low, the resulting thermally conductive silicone rubber composition may not cure sufficiently, whereas using a large amount will not improve the cure rate of the resulting silicone rubber composition, which may be economically disadvantageous.

[0054] [(F) Addition reaction regulator] The addition reaction inhibitor is not particularly limited as long as it is a compound that inhibits the curing reaction of the addition reaction catalyst of component (E), and conventionally known compounds can be used. Specific examples include phosphorus-containing compounds such as triphenylphosphine; nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole; sulfur-containing compounds; acetylene-based compounds such as 1-ethynyl-1-cyclohexanol, 3-butyn-1-ol, 2-methyl-3-butyn-2-ol, and 3-methyl-1-tridecyn-3-ol; vinyl-containing siloxanes such as 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane; hydroperoxy compounds; and maleic acid derivatives. The amount of addition reaction inhibitor used is preferably adjusted to an optimal amount for each addition reaction inhibitor used, since the degree of curing reaction inhibition of the addition reaction inhibitor varies depending on its chemical structure. By incorporating an optimal amount of reaction inhibitor, the composition will have excellent long-term storage stability and curability at room temperature. Thus, the amount of component (F) incorporated is not particularly limited, but it can be incorporated in an amount that is 50 to 150 times the amount of platinum group metal atoms contained in the addition reaction catalyst of component (E). For example, when an acetylene compound such as 3-methyl-1-tridecyn-3-ol is used as component (F), it is preferable to incorporate an amount within the above range.

[0055] [Other ingredients] The thermally conductive silicone rubber composition of the present invention may further contain other components as needed, such as a heat resistance improver such as iron oxide, a viscosity modifier such as silica, a colorant, or a mold release agent.

[0056] [Cured product of thermally conductive silicone rubber composition and its hardness] The thermally conductive silicone rubber composition can be cured under known conditions, which are not particularly limited, but are, for example, at 80 to 150° C. for about 30 seconds to 1 hour. The hardness of the cured product of the thermally conductive silicone rubber composition is 40 to 70, more preferably 50 to 60, in terms of durometer A hardness measured according to the method described in JIS K 6253:2012. If the hardness is 40 or more, the cured product is less likely to deform (become thinner) under pressure, making it easier to maintain its insulating properties. If the hardness is 70 or less, the contact thermal resistance is sufficiently low, and sufficient heat dissipation properties can be exhibited.

[0057] [Thermal conductive sheet] The thermally conductive sheet of the present invention comprises a cured product of the above-mentioned thermally conductive millable silicone rubber composition and a network reinforcing material. Such a thermally conductive sheet contains a cured product obtained by curing the thermally conductive millable silicone rubber composition of the present invention and a mesh-like reinforcing material, and therefore has excellent thermal conductivity, strength, and insulation properties, moderate hardness, low contact thermal resistance, and excellent long-term stability.

[0058] [Mesh reinforcement material] The mesh-like reinforcing material used to reinforce the present thermally conductive sheet is not particularly limited, but examples include inorganic fiber cloths such as glass cloth and ceramic cloth, organic fiber cloths such as nylon and polyester, and composites of these. To improve the contact at the interface between the reinforcing material and the cured product of the thermally conductive silicone rubber composition and reduce contact thermal resistance, it is preferable to seal the reinforcing material. By sealing, the openings in the mesh-like reinforcing material are filled, increasing the adhesive strength with the cured product of the thermally conductive silicone rubber composition, and also fixing the mesh of the reinforcing material, making the shape more stable. The sealing material is not particularly limited, and for example, addition reaction curing type or peroxide curing type materials can be used. Among these, a thermally conductive silicone rubber material is the most suitable. As the thermally conductive silicone rubber material, the above-mentioned thermally conductive millable type silicone rubber composition may be used, regardless of the curing type, or other materials may be used. It is particularly preferable that the thermally conductive millable type silicone rubber composition that gives the cured product that constitutes the thermally conductive sheet is the same as the sealing material, as this provides excellent thermal conductivity, strength, and insulation, has appropriate hardness, low contact thermal resistance, and improves productivity.

[0059] The thickness of the reinforcing material is, for example, 20 to 100 μm, and more preferably 30 to 80 μm. If the thickness of the reinforcing material is 20 μm or more, the strength of the thermally conductive sheet is sufficient. On the other hand, if the thickness is 100 μm or less, the thermal conductivity is sufficient.

[0060] [Contact thermal resistance] The thermal contact resistance of the thermally conductive sheet of the present invention to the adherend is 40 mm when measured under the conditions of 50°C / 700 kPa in accordance with ASTM D5470. 2 K / W or less is preferable, and 5 to 35 mm is more preferable. 2 K / W. The contact thermal resistance is 40mm 2 If the contact resistance is .K / W or less, the adherend and the thermal conductive sheet will be in sufficient contact, resulting in good thermal conduction efficiency. The contact thermal resistance of the thermal conductive sheet to the adherend can be determined by the method described in the examples below.

[0061] [Thermal conductive sheet thickness change rate] The thermally conductive sheet becomes thinner as pressure is applied, and its insulating performance deteriorates. In other words, the smaller the rate of change in thickness of the thermally conductive sheet, the better, from the viewpoint of maintaining the insulating properties. In the thermally conductive sheet of the present invention, the thickness change rate after 20 minutes of compressing the thermally conductive sheet under a pressure of 700 kPa is 20% or less, and more preferably 10% or less, of the initial thickness. If the thickness change rate is 20% or less, the thickness change rate is small under high-pressure mounting, making it easier to maintain the insulating properties.

[0062] [Manufacturing of thermally conductive sheets] The method for producing the thermally conductive sheet of the present invention is not particularly limited, but a pressing method, a coating method, or the like can be applied, and the coating method is generally effective.

[0063] In the production of a thermally conductive sheet by the coating method, for example, the following steps (1) to (3) are carried out. (1) Coating composition preparation step: In this step, components (A) to (F), a solvent, and, if necessary, additives are added and mixed. The resulting mixture is treated as necessary, and then stirred and mixed to prepare a coating composition. (2) Filling process: In this step, the coating composition obtained in the above step is applied to a reinforcing material as needed, and heated as needed to obtain a sealed reinforcing material. (3) Coating process: This is a process in which a thermally conductive silicone rubber composition is applied to the filled reinforcing material, and then heated to laminate (coat) the cured product of the composition.

[0064] <Preparation of Coating Composition> First, the alkenyl group-containing organopolysiloxane (A), the thermally conductive filler (C), and the wetter (D) are kneaded together using a mixer such as a kneader, Banbury mixer, planetary mixer, or Shinagawa mixer, while heating to a temperature of about 100°C or higher as necessary. During this kneading step, reinforcing silica such as fumed silica or precipitated silica, platinum, titanium oxide, or a flame retardant such as benzotriazole may be added and mixed, if desired. The homogeneous mixture obtained in the kneading step is cooled to room temperature and then filtered through a strainer, etc. Next, a colorant such as an organic pigment or an inorganic pigment, a heat resistance improver such as iron oxide or cerium oxide, an internal mold release agent, a catalyst, etc. may be added and mixed into the mixture, if desired, using a two-roll mill, a Shinagawa mixer, etc. To the composition obtained in this second kneading step, a curing agent, an acetylene compound-based addition reaction inhibitor (component (F)) such as 1-ethynyl-1-cyclohexanol, a catalyst (component (E)), etc. are added to prepare a coating composition, and a solvent such as toluene is further added and mixed with a stirrer such as a planetary mixer or kneader. Finally, a crosslinking agent (component (B)) is added and further mixed to prepare a coating composition.

[0065] <Sealing of reinforcement materials> The coating composition obtained by the above process is applied to the reinforcing material to seal it. After the coating composition is applied continuously to the reinforcing material using a coating device such as a knife coater or kiss coater equipped with a drying oven, a heating oven, and a winding device, the solvent is dried and evaporated, and the coating is heated to 80 to 200°C, preferably 100 to 150°C in the case of an addition reaction curing type, or to 100 to 200°C, preferably 110 to 180°C in the case of a peroxide curing type, to obtain a sealed reinforcing material.

[0066] <Coating> A coating composition that will become a cured product of the thermally conductive silicone rubber composition is applied to one or both sides of the filled reinforcing material obtained by the above process. After the coating composition is applied to one side of the filled reinforcing material in succession using a coating device such as a knife coater or kiss coater equipped with a drying oven, a heating oven, and a winding device, the solvent is dried and evaporated, and the material is heated to 80 to 200°C, preferably 100 to 150°C, and laminated. [Example]

[0067] The present invention will be described in detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples. The average degree of polymerization, viscosity, particle size and average particle size were measured by the methods described above.

[0068] The materials used in the examples and comparative examples are as follows.

[0069] [Component (A): Vinyl polysiloxane] (A-1) An organopolysiloxane gum having an average degree of polymerization of 8,000, which contains 7,998 dimethylsiloxane units and 2 dimethylvinylsiloxane units per molecule. (A-2) An organopolysiloxane gum having an average degree of polymerization of 8,000, which contains 7,960 dimethylsiloxane units, 38 methylvinylsiloxane units, and 2 dimethylvinylsiloxane units per molecule. (A-3) An organopolysiloxane that is liquid at 25°C and has an average degree of polymerization of 1,130, with 1,128 dimethylsiloxane units and 2 dimethylvinylsiloxane units per molecule, and a viscosity of 105,000 mPa·s.

[0070] [Component (B): Hydrogen polysiloxane] The following (B-1) and (B-2) were mixed in a ratio of 3:1. (B-1) Methylhydrogenpolysiloxane represented by the following formula: The crosslinking agent is an organohydrogenpolysiloxane (o=27, p=2) represented by the following formula: [ka] (B-2) Methylhydrogenpolysiloxane represented by the following structural formula: The crosslinking agent is an organohydrogenpolysiloxane (q=65, r=1) represented by the following formula: [ka]

[0071] [Component (C): Thermally conductive filler] (C-1) Irregular aluminum oxide having an average particle size of 1 μm and containing 0.8% by mass of particles with a particle size of 45 μm or more (C-2) Spherical aluminum oxide having an average particle size of 1 μm and containing particles with a particle size of 45 μm or more at 0.6% by mass (C-3) Spherical aluminum oxide having an average particle size of 10 μm and containing 1.2% by mass of particles with a particle size of 45 μm or more (C-4) Boron nitride having an average particle size of 5 μm and having 0.9 mass% of particles with a particle size of 45 μm or more (C-5) Aluminum nitride having an average particle size of 1 μm and a particle size of 45 μm or more of 1.1 mass % (C-6) Spherical aluminum oxide having an average particle size of 10 μm and containing 8.3% by mass of particles with a particle size of 45 μm or more

[0072] [(D) Component: Wetter] Dimethylpolysiloxane with one end capped with a trimethoxysilyl group, represented by the following formula and having an average degree of polymerization of 30 [ka]

[0073] [Component (E): Platinum group metal catalyst] 5% by mass solution of chloroplatinic acid in 2-ethylhexanol

[0074] [Component (F): Addition reaction inhibitor] 3-Methyl-1-tridecyn-3-ol

[0075] [Component (G): Peroxide curing agent (for comparative examples)] Bis(4-methylbenzoyl) peroxide

[0076] Mesh reinforcement: Glass cloth equivalent to IPC spec 1080 (thickness: 55 μm).

[0077] [Examples 1 to 5 and Comparative Examples 1 to 5] The thermally conductive sheets of Examples 1 to 5 and Comparative Examples 1 to 5 were produced as follows.

[0078] [Preparation of Thermally Conductive Silicone Rubber Composition] (Preparation Example 1) The components in the amounts (parts by mass) shown in Tables 1 and 2 were charged into a Banbury mixer and kneaded for 20 minutes to prepare thermally conductive silicone rubber compositions (A) to (D) and (F) to (J).

[0079] [Manufacturing of thermally conductive sheets] (Production Example 1) Glass cloth sealing The thermally conductive silicone rubber composition obtained in Preparation Example 1 above was used as a sealing composition, to which 20% by mass of toluene was added and kneaded using a planetary mixer to prepare a coating material. This coating material was applied to one side of a glass cloth using a comma coater to seal the glass cloth. The glass cloth was then dried at 80°C for 10 minutes and further cured at 170°C for 15 minutes. The thickness of the sealed glass cloth was 80 μm.

[0080] (Production Example 2) Coating on sealed glass cloth (thermal conductive sheet with a total thickness of 0.2 mm) To the thermally conductive silicone rubber composition obtained in Preparation Example 1 above, 20% by mass of toluene was added, and the mixture was kneaded using a planetary mixer to obtain a coating material. This coating material was then applied to one side (front side) of the sealed glass cloth obtained above using a comma coater to a thickness of 0.06 mm after curing, cured, and wound up. The other side (back side) was then similarly coated, cured, and wound up to obtain a thermally conductive sheet with a total thickness of 0.2 mm. The comma coater and coating and curing conditions used were the same as those used in the sealing (Production Example 1) above.

[0081] (Production Example 3) Coating on sealed glass cloth (thermal conductive sheet with a total thickness of 0.3 mm) To the thermally conductive silicone rubber composition obtained in Preparation Example 1 above, 20% by mass of toluene was added, and the mixture was kneaded using a planetary mixer to obtain a coating material. This coating material was then applied to one side (front side) of the sealed glass cloth obtained above using a comma coater to a thickness of 0.11 mm after curing, cured, and wound up. The other side (back side) was then similarly coated, cured, and wound up to obtain a thermally conductive sheet with a total thickness of 0.3 mm. The comma coater and coating and curing conditions used were the same as those used in the sealing (Production Example 1) above.

[0082] (Production Example 4) Coating on sealed glass cloth (thermal conductive sheet with a total thickness of 0.45 mm) To the thermally conductive silicone rubber composition obtained in Preparation Example 1 above, 20% by mass of toluene was added, and the mixture was kneaded using a planetary mixer to obtain a coating material. This coating material was then applied to one side (front side) of the sealed glass cloth obtained above using a comma coater to a thickness of 0.185 mm after curing, cured, and wound up. The other side (back side) was then similarly coated, cured, and wound up to obtain a thermally conductive sheet with a total thickness of 0.45 mm. The comma coater and coating and curing conditions used were the same as those used in the sealing (Production Example 1) above.

[0083] [Methods for evaluating various characteristics] The properties of the thermally conductive sheet were measured using the following methods. The measurement results are shown in Tables 1 and 2.

[0084] [General characteristics] <Initial thickness> Measurements were taken using a Mitutoyo Digimatic Thickness Gauge.

[0085] <Thermal resistance, contact thermal resistance, thickness under pressure> The thermal resistance of the thermally conductive sheet was measured in accordance with ASTM D 5470 by the following procedure. Thermally conductive sheets of 0.2mm, 0.3mm, and 0.45mm thick were prepared and pressurized at 50℃ / 700kPa to measure the thermal resistance of the thermally conductive sheets of each thickness. Furthermore, the contact thermal resistance was calculated from the intercept of a graph plotting the thickness (mm) of the thermally conductive sheet under pressure (700kPa or less) on the horizontal axis and the thermal resistance on the vertical axis.

[0086] <Thickness change rate> The thickness of the thermally conductive sheet under pressure was measured in the same manner as in the measurement of thermal resistance, and the rate of change in thickness was calculated using the following formula:

number

[0087] <Hardness of the cured product of the thermally conductive silicone rubber composition> Using each cured product, a sample for hardness measurement was separately prepared, and the hardness was measured using a Type A durometer in accordance with JIS K 6253:2012 (measurement temperature: 25°C).

[0088] The thermally conductive silicone rubber composition obtained in (Preparation Example 1) was used as a sealing composition to seal glass cloth according to (Production Example 1), and the sealed glass cloth was then coated according to (Production Examples 2) to (Production Examples 4), thereby producing the thermally conductive sheets of Examples 1 to 5 and Comparative Examples 1 to 5. Example 1 The glass cloth was sealed with the composition (A), and then the sealed glass cloth was coated with the composition (A) to obtain a thermally conductive sheet.

[0089] <Example 2> The glass cloth was sealed with the composition (a), and then the sealed glass cloth was coated with the composition (a) to obtain a thermally conductive sheet.

[0090] Example 3 The glass cloth was sealed with the composition (c), and then the sealed glass cloth was coated with the composition (c) to obtain a thermally conductive sheet.

[0091] Example 4 The glass cloth was sealed with the composition (d), and then the sealed glass cloth was coated with the composition (d) to obtain a thermally conductive sheet.

[0092] <Example 5> After the glass cloth was sealed with composition (f), the sealed glass cloth was coated with composition (a) to obtain a thermally conductive sheet.

[0093] <Comparative Example 1> The glass cloth was sealed with composition (f), and then the sealed glass cloth was coated with composition (f) to obtain a thermally conductive sheet.

[0094] <Comparative Example 2> After sealing the glass cloth with composition (K), the glass cloth that had been sealed with composition (K) was coated to obtain a thermally conductive sheet. The hardness of the obtained sheet was very low and the adhesion was strong, so accurate measurements of thermal resistance and thickness were not possible.

[0095] <Comparative Example 3> Glass cloth was sealed with composition (K), and then the sealed glass cloth was coated with composition (K) to obtain a thermally conductive sheet. However, filler agglomerates were observed on the surface of the sheet, and accurate measurements of thermal resistance and thickness were not possible.

[0096] <Comparative Example 4> Composition (I) contained too much thermally conductive filler, making it impossible to obtain a uniform composition.

[0097] <Comparative Example 5> The composition (K) was used to fill the pores of glass cloth, and then the glass cloth that had been filled with the composition (K) was coated to obtain a thermally conductive sheet. The thickness of the obtained sheet changed significantly under pressure, and there was concern about a decrease in insulating properties.

[0098] [Table 1]

[0099] [Table 2]

[0100] The thermally conductive sheets of Examples 1 to 5 use the thermally conductive millable silicone rubber composition of the present invention. As shown in Table 1, they have low contact thermal resistance, excellent thermal conductivity, and moderate hardness. Furthermore, because the thermally conductive sheet is composed of a highly flexible mesh-like reinforcing material, it has excellent strength, and because there is little change in thickness under pressure, there is little deterioration in insulating properties (i.e., excellent insulating properties). Furthermore, the thermally conductive millable silicone rubber composition of the present invention contains an effective amount of (F) an addition reaction inhibitor, resulting in excellent long-term stability. Furthermore, because the present invention does not involve lamination of a thin metal film such as a metal foil, there are no problems such as increased contact thermal resistance, concerns about poor insulation, or increased manufacturing costs. Furthermore, by appropriately adjusting the particle size of the (C) thermally conductive filler, continuous coating molding can be performed, resulting in low-cost, simple manufacturing processes and stable product properties over the long term.

[0101] From the above results, it can be seen that the products of the present invention all have low contact thermal resistance, excellent flexibility, little deterioration in insulating properties under pressure, and can be manufactured at low cost using a simple manufacturing process, whereas the comparative examples that do not meet the requirements of the present invention have problems such as high contact thermal resistance and insufficient material strength. In Comparative Example 1, in which a thermally conductive sheet was obtained by sealing and coating glass cloth with a peroxide-curing composition (F), the contact thermal resistance was too high. In Comparative Example 2, in which a composition (Gi) not containing the (A-2) component was used to seal and coat the glass cloth, and in Comparative Example 3, in which a composition (Hu) containing too much of the (C) component was used to seal and coat the glass cloth, a thermally conductive sheet was obtained, but accurate measurements of the contact thermal resistance and thickness were not possible. In Comparative Example 5, in which the glass cloth was sealed and coated with a composition (J) containing a significantly excessive amount of the (B) component, the (B) component, which does not contribute to the crosslinking reaction, acted like a plasticizer, so the resulting thermally conductive sheet changed significantly in thickness under pressure, raising concerns about a decline in insulating properties.

[0102] The present specification includes the following aspects. [1]: (A) an organopolysiloxane containing the following components (A-1) to (A-3): (A-1) A crude rubber-like organopolysiloxane having alkenyl groups only at both ends of the molecular chain (A-2) A crude rubber-like organopolysiloxane having alkenyl groups at both molecular chain terminals and in side chains. (A-3) Organopolysiloxane that is liquid at 25°C and has two or more alkenyl groups per molecule 100 parts by mass of linear organopolysiloxane having an alkenyl group, (B) an organohydrogenpolysiloxane containing the following components (B-1) and (B-2): (B-1) Organohydrogenpolysiloxane having hydrosilyl groups only in side chains of the molecular chain and having 2 to 5 hydrosilyl groups per molecule (B-2) Organohydrogenpolysiloxane having two or more hydrosilyl groups per molecule, two of which are at the ends of the molecular chain. an organohydrogenpolysiloxane containing: an amount such that the total number of hydrosilyl groups in component (B) is 0.5 to 4.0 moles per mole of the total number of alkenyl groups in component (A); (C) Thermally conductive filler: 150 to 2,400 parts by mass (E) Addition reaction catalyst: an amount equivalent to 0.01 to 1,000 ppm in terms of platinum group metal atomic mass (F) Addition reaction inhibitor: effective amount A thermally conductive millable silicone rubber composition comprising: [2]: The thermally conductive millable silicone rubber composition according to [1], characterized in that the proportion of particles with a particle size of 45 μm or more contained in component (C) is 5 mass % or less. [3]: (D) a wetter component, a polysiloxane modified with a trialkoxysilyl group at one end, represented by the following formula (1): 5 to 100 parts by mass [ka] (In the formula, R1 is an alkyl group having 1 to 6 carbon atoms, and n is an integer of 5 to 100. The thermally conductive millable silicone rubber composition according to [1] or [2], characterized in that it contains: [4]: A thermally conductive sheet comprising a cured product of the thermally conductive millable silicone rubber composition according to any one of [1] to [3] and a mesh-like reinforcing material. [5]: The thermally conductive sheet according to [4], characterized in that the mesh-like reinforcing material is sealed.

[0103] The present invention is not limited to the above-described embodiments. The above-described embodiments are merely examples, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits similar effects is included within the technical scope of the present invention.

Claims

1. (A) an organopolysiloxane containing the following components (A-1) to (A-3): (A-1) A crude rubber-like organopolysiloxane having alkenyl groups only at both ends of the molecular chain (A-2) A crude rubber-like organopolysiloxane having alkenyl groups at both molecular chain terminals and in side chains. (A-3) Organopolysiloxane that is liquid at 25°C and has two or more alkenyl groups per molecule 100 parts by mass of linear organopolysiloxane having an alkenyl group, (B) an organohydrogenpolysiloxane containing the following components (B-1) and (B-2): (B-1) Organohydrogenpolysiloxanes that have hydrosilyl groups only in side chains on the molecular chain and have 2 to 5 hydrosilyl groups per molecule (B-2) Organohydrogenpolysiloxane having two or more hydrosilyl groups per molecule, two of which are at the ends of the molecular chain. an organohydrogenpolysiloxane containing the following: an amount such that the total amount of hydrosilyl groups in component (B) is 0.5 to 4.0 moles per mole of the total amount of alkenyl groups in component (A); (C) Thermally conductive filler: 150 to 2,400 parts by mass (E) Addition reaction catalyst: an amount equivalent to 0.01 to 1,000 ppm in terms of platinum group metal atomic mass (F) Addition reaction inhibitor: effective amount A thermally conductive millable silicone rubber composition comprising:

2. 2. The thermally conductive millable silicone rubber composition according to claim 1, wherein the proportion of particles with a particle size of 45 μm or more contained in component (C) is 5% by mass or less.

3. Furthermore, (D) a polysiloxane modified with a trialkoxysilyl group at one end, represented by the following formula (1), as a wetter component: 5 to 100 parts by mass 【Chemistry 1】 (In the formula, R １ is an alkyl group having 1 to 6 carbon atoms, and n is an integer from 5 to 100.

2. The thermally conductive millable silicone rubber composition according to claim 1, comprising:

4. Further, (D) a wetter component, a polysiloxane modified with a trialkoxysilyl group at one end, represented by the following formula (1): 5 to 100 parts by mass 【Chemistry 2】 (wherein R 1 is an alkyl group having 1 to 6 carbon atoms, and n is an integer of 5 to 100.) 3. The thermally conductive millable silicone rubber composition according to claim 2, comprising:

5. A thermally conductive sheet comprising a cured product of the thermally conductive millable silicone rubber composition according to any one of claims 1 to 4 and a reticulated reinforcing material.

6. 6. The thermally conductive sheet according to claim 5, wherein the mesh-like reinforcing material is sealed.

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