Indication device

Abstract

To enhance the rigidity of a display device, and to reduce the total weight of the display device by arranging a reinforcement substrate which allows omission of multi-layers for surface treatment.SOLUTION: A display device includes: a display panel including a display area and a non-display area surrounding the display area; a light-emitting element unit including a plurality of light-emitting elements that are arranged in the display area of the display panel; a rigid reinforcement layer disposed at an upper part of the display panel; and a polarization layer on the rigid reinforcement layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present specification relates to a display device that can improve durability. [Background technology]

[0002] Display devices are used in various electronic devices such as televisions, mobile phones, laptops, tablet PCs, etc. To this end, research is being continuously conducted to develop thinner, lighter, and less power-consuming display devices.

[0003] Examples of display devices include liquid crystal display devices (LCDs), plasma display panel devices (PDPs), field emission display devices (FEDs), electro-wetting display devices (EWDs), and organic light emitting displays (OLEDs).

[0004] An organic light emitting display (OLED), one of the display devices that displays various information as an image, includes a plurality of pixel regions arranged in a display area where an image is displayed, and organic light emitting elements arranged corresponding to the plurality of pixel regions. Since the organic light emitting element is a self-emitting element that emits light, the OLED has advantages over a liquid crystal display (LCD), such as a faster response speed, a wider luminous efficiency, a wider brightness, a wider viewing angle, and an excellent contrast ratio and color reproduction rate.

[0005] The description provided in the background of the invention should not be assumed to be prior art. The background of the invention may include information that describes one or more aspects of the subject technology, and this description does not limit the invention. Summary of the Invention [Problem to be solved by the invention]

[0006] The organic light emitting display device may include a first substrate on which organic light emitting elements are arranged and a second substrate arranged opposite the first substrate. The organic light emitting elements include an organic material that is easily deteriorated by moisture, oxygen, etc. Therefore, the first substrate and the second substrate are bonded together, and a frit sealant is arranged around the edge of the organic light emitting display device, and the organic light emitting elements arranged inside the frit sealant are sealed with an air gap.

[0007] However, the gap between the first and second substrates may open, and the frit sealant may separate from the first or second substrate, causing defects by acting as a foreign substance within the display device. In addition, the organic light emitting element disposed between the first and second substrates has limitations in that it is weak in rigidity and vulnerable to breakage due to the air gap between them.

[0008] Therefore, a problem to be solved by an embodiment of the present specification is to provide a display device with improved durability by arranging a reinforced substrate in a position relatively close to a display area that emits an image.

[0009] The problem to be solved by one embodiment of this specification is to provide a display device that can prevent defects caused by peeling between layers overlapping in the upper and lower directions by applying an adhesive member that covers the entire display area.

[0010] The problem to be solved by one embodiment of this specification is to reduce the overall weight of a display device by providing a reinforced substrate that can increase the rigidity of the display device and eliminate the need for multiple layers for surface treatment.

[0011] The problems to be solved by an embodiment of this specification are not limited to the above-mentioned objects, and other unmentioned objects and advantages of the present invention can be understood from the following description and can be more clearly understood from the embodiments of this specification. Furthermore, it can be easily understood that the objects and advantages of this specification can be achieved by the means and combinations thereof set forth in the claims.

[0012] Further details of the embodiments herein are included in the detailed description and drawings. [Means for solving the problem]

[0013] A display device according to one embodiment of the present specification may include a display panel including a display area and a non-display area surrounding the display area, a light-emitting element section including a plurality of light-emitting elements arranged on the display area of ​​the display panel, a rigidity reinforcement layer arranged on top of the display panel, and a polarizing layer on the rigidity reinforcement layer.

[0014] According to the embodiments of the present specification, the rigidity of the display device can be increased, and the durability can be improved.

[0015] According to an embodiment of the present specification, by arranging an adhesive member that covers the entire area of ​​the display panel and arranging a rigid reinforcement layer on top of it, it is possible to prevent defects from occurring in which the adhesive member peels off between the films and acts as a foreign object.

[0016] According to an embodiment of the present specification, a stiffness reinforcing layer for increasing the stiffness of a display device can be disposed under a polarizing layer disposed at the top of the display device, thereby eliminating the need for a multi-layered functional layer for surface treatment and realizing a lightweight display device, thereby reducing the overall weight of the product.

[0017] The effects of this specification are not limited to those mentioned above, and other effects not mentioned above will be clearly understood by those skilled in the art from the following description. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a plan view schematically illustrating a portion of a display device according to an embodiment of the present specification. [Figure 2] 2 is a cross-sectional view showing one side of the display device of FIG. 1. FIG. [Figure 3] FIG. 3 is an enlarged cross-sectional view showing region 3 in FIG. 2. [Figure 4] 4 is a cross-sectional view of the display device shown in FIG. 1 taken along line 4-4. [Figure 5] 5 is a cross-sectional view of the display device shown in FIG. 1 taken along line 5-5. [Figure 6] 6 is a cross-sectional view of the display device shown in FIG. 1 taken along line 6-6. [Figure 7] 1. FIG. 4 is a cross-sectional view showing one side of another embodiment of the display device of FIG. [Figure 8] FIG. 8 is an enlarged cross-sectional view showing region 8 in FIG. 7. [Figure 9] 9 is a cross-sectional view of another embodiment of the display device shown in FIG. 1 taken along line 9-9. [Figure 10] 1. FIG. 10 is a cross-sectional view of another embodiment of the display device shown in FIG. 1 taken along line 10-10. [Figure 11] 1. FIG. 11 is a cross-sectional view of another embodiment of the display device shown in FIG. 1 taken along line 11-11. [Figure 12] FIG. 1 illustrates the viewing angle distance of an embodiment herein. [Figure 13] 1. FIG. 4 is a cross-sectional view showing one side of another embodiment of the display device of FIG. [Figure 14] FIG. 14 is an enlarged cross-sectional view showing region 14 of FIG. 13. DETAILED DESCRIPTION OF THE INVENTION

[0019] The advantages and features of the present specification, as well as methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present specification is not limited to the embodiments disclosed below, and may be embodied in various different forms. However, the present embodiments are provided to complete the disclosure of the specification and to fully convey the scope of the invention to those skilled in the art to which the specification pertains.

[0020] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are illustrative only, and the specification is not limited to the illustrated matters. The same reference symbols throughout the specification refer to the same components. Furthermore, in explaining this specification, if a detailed description of related known technology is deemed to obscure the gist of this specification, such a detailed description will be omitted. When using words such as "include," "have," and "be," other parts can be added unless "only" is used. When a component is indicated in the singular, it also includes the plural unless otherwise explicitly stated.

[0021] When interpreting elements, they are interpreted as including a margin of error even if there is no explicit statement otherwise.

[0022] When describing the positional relationship between two parts, for example, when using "above," "at the top," "below," "to the side," etc., one or more other parts may be located between the two parts, unless "immediately" or "directly" is used.

[0023] When describing temporal relationships, for example, when describing temporal precedence using "after," "following," "next to," or "before," it is acceptable to include cases where the events are not consecutive, unless "immediately" or "directly" is used.

[0024] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a first component referred to below may be a second component within the technical concept of this specification.

[0025] The features of the multiple embodiments of this specification can be partially or wholly combined or combined with each other, and various technical interlocking and driving mechanisms are possible, and each embodiment can be implemented independently of each other or can be implemented together in a linked relationship.

[0026] Hereinafter, display devices according to embodiments of the present invention will be described with reference to the accompanying drawings.

[0027] FIG. 1 is a plan view schematically illustrating a portion of a display device according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view illustrating one side of the display device of FIG. 1. FIG. 3 is an enlarged cross-sectional view illustrating region 3 of FIG. 2. For convenience of explanation, FIG. 1 illustrates only a display panel (PNL), a printed circuit board 1020, a flexible printed circuit board 1010, and an integrated circuit chip 1015 disposed on the flexible printed circuit board 1010 among various components of the display device 1000, but the components of the display device 1000 of the present disclosure are not limited thereto. However, the components of each display device according to any embodiment of the present disclosure are operatively coupled to one another.

[0028] 1 to 3, a display device 1000 according to an embodiment of the present specification may include a display panel (PNL), a cover substrate 160 on the upper side of the display panel (PNL), and a back plate unit 180 on the lower side of the display panel (PNL). A polarizing layer 153 may be disposed between the display panel (PNL) and the cover substrate 160, and a protective coating layer 170 may be disposed between the display panel (PNL) and the back plate unit 180. The display panel (PNL) and the polarizing layer 153 may be bonded to each other via a first adhesive member 150, and the back plate unit 180 may be bonded to the protective coating layer 170 via a second adhesive member 173.

[0029] The display panel (PNL) includes a base substrate 101. The base substrate 101 may include a transparent material such as plastic or glass. In some exemplary embodiments, the base substrate 101 is made of a flexible plastic material or a flexible polymer film. For example, the flexible polymer film may be made from one of polyimide (PI), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), polyarylate (PAR), polysulfone (PSF), cyclic olefin copolymer (COC), triacetylcellulose (TAC), polyvinyl alcohol (PVA), and polystyrene (PS), but the present disclosure is not limited thereto.

[0030] In a plan view, the base substrate 101 may have a rectangular shape with a long side in a first direction and a short side in a second direction. Alternatively, the base substrate 101 may have a square shape with rounded corners, but is not limited to this. The first direction may be, for example, the X-axis direction or the horizontal direction of the base substrate 101, and the second direction may be, for example, the Y-axis direction or the vertical direction of the first substrate 100, but is not limited to this.

[0031] The display panel (PNL) may include a display area (AA) and a non-display area (NAA) located outside the display area (AA). For example, but not limited to, the non-display area (NAA) may be located near the display area (AA), surround the display area (AA), or be located on the periphery of the display area (AA).

[0032] A plurality of sub-pixels (P) may be arranged in the display area (AA) of the base substrate 101. A video or image may be displayed in the display area (AA) through the plurality of sub-pixels (P). The plurality of sub-pixels (P) is the smallest unit constituting the display area (AA), and n sub-pixels (P) may form one pixel. Each of the plurality of sub-pixels (P) may emit light having a different wavelength. The plurality of sub-pixels may include first to third sub-pixels that emit light of different colors. For example, the plurality of sub-pixels (P) may include a first red sub-pixel (PR), a second green sub-pixel (PG), and a third blue sub-pixel (PB). The plurality of sub-pixels (SP) may also include a white sub-pixel.

[0033] For example, the plurality of subpixels (P) may include red, green, and blue subpixels, where the red, green, and blue subpixels may be arranged alternately. Alternatively, the plurality of subpixels (P) may include red, green, blue, and white subpixels, where the red, green, blue, and white subpixels may be arranged alternately, or the red, green, blue, and white subpixels may be arranged in a quad type. For example, the red, blue, and green subpixels may be arranged sequentially along the row direction, or the red, blue, green, and white subpixels may be arranged sequentially along the row direction. However, in the embodiments of the present specification, the color type, arrangement type, and arrangement order of the subpixels are not limitative and may be configured in various forms depending on the light-emitting characteristics, device lifetime, and device specifications.

[0034] Meanwhile, the subpixels may have different light-emitting regions depending on their light-emitting characteristics. For example, a subpixel emitting light of a different hue from a blue subpixel may have a different light-emitting region from the blue subpixel. For example, the red, blue, and green subpixels, or the red, blue, white, and green subpixels may have different light-emitting regions.

[0035] The non-display area (NAA) may have a plurality of drivers arranged therein to drive the plurality of sub-pixels (P) arranged in the display area (AA). The drivers may include, but are not limited to, a gate driver, a data driver, a touch driver, and a timing controller.

[0036] The non-display area (NAA) may be defined as an area surrounding the display area (AA) where no video or image is displayed. The non-display area (NAA) may include, for example, the upper, lower, left, and right edge areas of the display panel (PNL). A flexible circuit board 1010 and a printed circuit board 1020 may be disposed on at least one edge of the non-display area (NAA).

[0037] An integrated circuit chip 1015 may be disposed on the flexible circuit board 1010. One side of the flexible circuit board 1010 is coupled to the base substrate 101, and the other side is coupled to the printed circuit board 1020, and power and various signals for driving the light emitting element units supplied from the printed circuit board 1020 can be provided to the display area (AA) of the base substrate 101. The various signals may include, for example, high potential voltage, low potential voltage, scan signal, data signal, or touch sensing signal.

[0038] The printed circuit board 1020 can supply signals to the integrated circuit chip 1015 disposed on the flexible circuit board 1010. Various components may be disposed on the printed circuit board 1020 to supply various signals to the integrated circuit chip 1015. Although the flexible circuit board 1010 and the printed circuit board 1020 are shown as being one each in FIG. 1, this is not limiting. For example, a plurality of flexible circuit boards 1010 and a plurality of printed circuit boards 1020 may be disposed on one side edge of the base substrate 101.

[0039] 1, a plurality of data lines (DL) and a plurality of scan lines (SL) may be arranged in a display area (AA) of the base substrate 101. Each of the plurality of data lines (DL) may be arranged to intersect with each of the plurality of scan lines (SL). A sub-pixel (P) is defined by the data lines (DL) and the scan lines (SL) that intersect with each other, and a plurality of sub-pixels (P) may be arranged in the display area (AA). One sub-pixel (P) may be electrically connected to, for example, a gate line and a data line.

[0040] One scan line (SL) extends along a first direction of the base substrate 101. Each of the multiple scan lines (SL) may be spaced apart from one another in a second direction intersecting the first direction. One data line (DL) extends along the second direction. Each of the multiple data lines (DL) may be spaced apart from one another in the first direction intersecting the second direction. The first direction may be, for example, the X-axis direction or the horizontal direction of the base substrate 101, and the second direction may be, for example, the Y-axis direction or the vertical direction of the first substrate 100, but is not limited thereto.

[0041] The plurality of sub-pixels (P) arranged on the display area (AA) may be arranged in a matrix (M*N, where M and N are natural numbers) on the display area (AA) of the base substrate 101. A light-emitting element is located in each of the sub-pixels (P) and may emit light of different colors, such as, but not limited to, red, green, or blue.

[0042] 2 and 3, a transistor (TR) for driving a subpixel, a light-emitting element unit (EL), and a touch sensor unit (TS) may be included on a base substrate 101. The base substrate 101 may include a first surface and a second surface opposite to the first surface. Circuit elements including a transistor (TR) may be arranged on the first surface of the base substrate 101, and a protective coating layer 170 may be arranged on the second surface on which the transistor (TR) and the like are not arranged.

[0043] The transistor (TR) may include a gate electrode 103, a gate insulating layer 105, a semiconductor layer 107, and source / drain electrodes 111. The gate insulating layer 105 may be disposed between the gate electrode 103 and the semiconductor layer 107. FIG. 3 illustrates the transistor (TR) as having a bottom gate structure, but the present invention is not limited to this. The transistor (TR) may also have, for example, a top gate structure or a double gate structure.

[0044] The gate electrode 103 may be formed from a single layer or multiple layers of any of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0045] The semiconductor layer 107 may be made of an oxide semiconductor or a silicon-based semiconductor material. The semiconductor layer 107 may include a transparent oxide semiconductor material such as indium-gallium-zinc-oxide (IGZO) or indium-zinc-oxide (IZO). The semiconductor layer 107 may also include a low-temperature grown silicon semiconductor material. The semiconductor layer 107 may include a channel region and source / drain regions disposed on both sides of the channel region. The gate insulating layer 105 may be made of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. For example, the gate insulating layer 105 may be formed from a single-layer or multi-layer inorganic film, and for example, the single-layer inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and the multi-layer inorganic film may be formed by alternately stacking one or more silicon oxide (SiOx) films, one or more silicon nitride (SiNx) films, and one or more amorphous silicon (a-Si) films, but the present specification is not limited thereto.

[0046] Between the base substrate 101 and the gate electrode 103, a buffer layer containing an insulating material that reduces or prevents the penetration of moisture or impurities through the base substrate 101, and a light-shielding layer arranged to block external light from entering the semiconductor layer 107 may be further included.

[0047] A light-shielding layer may be disposed on the base substrate 101. The light-shielding layer blocks light incident on the semiconductor layer 107 of the plurality of transistors to minimize leakage current. For example, the light-shielding layer is disposed under the semiconductor layer 107 of the drive transistor (TR) to block light incident on the semiconductor layer 107. When light irradiates the semiconductor layer 107, leakage current occurs, reducing the reliability of the drive transistor (TR). Therefore, the light-shielding layer is disposed on the base substrate 101 to improve the reliability of the transistor. The light-shielding layer may be made of an opaque conductive material such as, but not limited to, copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or an alloy thereof.

[0048] A buffer layer may be disposed on the light-shielding layer. The buffer layer can reduce the penetration of moisture or impurities through the base substrate 101. For example, the buffer layer may be composed of a single layer, a double layer, or more layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. For example, the buffer layer may be formed of a single-layer or multi-layer inorganic film. For example, the single-layer inorganic film may be a silicon oxide (SiOx) film or a silicon nitride (SiNx) film, and the multi-layer inorganic film may be formed by alternately stacking one or more silicon oxide (SiOx) films, one or more silicon nitride (SiNx) films, and one or more amorphous silicon (a-Si) films, but the present disclosure is not limited thereto. However, the buffer layer may be omitted depending on the type of base substrate 101 or the type of drive transistor (TR), but is not limited thereto.

[0049] An interlayer insulating layer 109 may be disposed on the gate electrode 103. Source / drain electrodes 111 may be disposed to penetrate the interlayer insulating layer 109 and connect to source / drain regions of the semiconductor layer 107. The source / drain electrodes 111 may be disposed so as to cover a portion of the upper surface of the interlayer insulating layer 109.

[0050] A planarization layer 115 may be disposed on the interlayer insulating layer 109 and the source / drain electrodes 111. The planarization layer 115 may be configured as a single layer or multiple layers. The planarization layer 115 can planarize steps caused by underlying circuit elements including transistors (TR). The planarization layer 115 may include an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. However, the planarization layer 115 is not limited thereto, and may include any organic insulating material capable of planarizing steps.

[0051] The planarization layer 115 exposes a portion of the surface of one of the source / drain electrodes 111 of the transistor (TR) and may include a contact hole 117 penetrating the planarization layer 115. The contact hole 117 may also be referred to as a pixel contact hole.

[0052] A light-emitting element section (EL) may be disposed on the planarization layer 115. The light-emitting element section (EL) may include an organic light-emitting element (ED) including a first electrode 120, an organic light-emitting layer 123, and a second electrode 125, and a bank 121 having a bank hole 122. The first electrode 120 of the organic light-emitting element (ED) may also be referred to as an anode electrode or a pixel electrode, and the second electrode 125 may also be referred to as a cathode electrode or a counter electrode.

[0053] The first electrode 120 may be disposed on the planarization layer 115. For example, the first electrode 120 may extend into the contact hole 117 to contact the source / drain electrode 111 whose surface is exposed by the contact hole 117. A portion of the first electrode 120 extending into the contact hole 117 may be a contact electrode. This allows the first electrode 120 to be electrically connected to the transistor (TR).

[0054] The first electrode 120 may include a transparent metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), or may include a single layer or multi-layer structure including a reflective metal film formed from, but not limited to, silver (Ag), aluminum (Al), gold (Au), nickel (Ni), chromium (Cr), and compounds thereof.

[0055] A bank 121 having a bank hole 122 may be disposed on the planarization layer 115. The bank 121 may separate each sub-pixel (P, see FIG. 1). To this end, the bank 121 may cover the edge of the first electrode 120. The bank 121 may also prevent light of different colors from being mixed and output between adjacent sub-pixels. For example, the bank 121 may be made of a black bank having high light absorption rate to prevent color mixing between adjacent sub-pixels. For example, the bank 121 may include an organic insulating film such as polyimide or epoxy, but is not limited thereto.

[0056] The bank hole 122 may expose a portion of the first electrode 120. The exposed portion of the first electrode 120 may become a light-emitting region. An organic light-emitting layer 123 may be disposed on the first electrode 120. In one example, the organic light-emitting layer 123 may include an organic material that emits a different color for each subpixel. The organic light-emitting layer 123 may emit any of red, green, blue, and white, for example, but is not limited thereto. In another example, the organic light-emitting layer 123 may be made of an organic material that emits white light, and may exhibit any of red, green, and blue colors using a color filter.

[0057] In one embodiment, the organic light-emitting layer 123 may be formed so as to cover the first electrodes 120 and also to cover part of the side surfaces of the banks 121. In another embodiment, the organic light-emitting layer 123 may extend over the entire display area (AA) so as to cover the exposed surfaces of the first electrodes 120 and the banks 121.

[0058] The organic light-emitting layer 123 may have a stack structure including a hole transporting layer (HTL), an emission material layer (EML), an electron transporting layer (ETL), a hole blocking layer (HBL), a hole injection layer (HIL), an electron blocking layer (EBL), and an electron injection layer (EIL). The emission layer (EML) of the organic light-emitting layer 123 can emit light by recombination of holes injected from the first electrode 120 and electrons injected from the second electrode 125.

[0059] A second electrode 125 may be disposed on the organic light-emitting layer 123. The second electrode 125 may be formed to cover the organic light-emitting layer 123. The second electrode 125 may be formed in common on a plurality of sub-pixels (SP). The second electrode 125 may include a transparent metal oxide such as indium-tin-oxide (ITO) or indium-zinc-oxide (IZO). Alternatively, the second electrode 125 may include, but is not limited to, a single-layer or multi-layer structure including a reflective metal film formed from silver (Ag), aluminum (Al), gold (Au), nickel (Ni), chromium (Cr), or a compound thereof.

[0060] Meanwhile, depending on whether the display device is a bottom emission type or a top emission type, one of the first electrode and the second electrode may include a single layer or multiple layers including an opaque conductive material having a relatively high reflection efficiency, while the other of the first electrode and the second electrode may include a transparent conductive material or a semi-transparent conductive material, but is not limited thereto.

[0061] For example, the opaque conductive material may include a material having a relatively low work function, such as aluminum (Al), silver (Ag), copper (Cu), lead (Pb), molybdenum (Mo), titanium (Ti), and alloys thereof. For example, the transparent conductive material may include indium tin oxide (ITO) or indium zinc oxide (IZO), although the present disclosure is not limited thereto.

[0062] Sealing layers 127, 129, and 130 may be disposed on the light-emitting element portion (EL). The sealing layers 127, 129, and 130 can protect the light-emitting element portion (EL) and the transistor (TR) from external oxygen or moisture. The sealing layers 127, 129, and 130 may cover the display area (AA, see FIG. 1) and extend to the non-display area (NAA, see FIG. 1) surrounding the display area (AA). The sealing layers 127, 129, and 130 may include a multilayer structure in which a first sealing layer 127, a second sealing layer 129, and a third sealing layer 130 are stacked.

[0063] The first sealing layer 127 may be disposed so as to cover the second electrode 125 of the light-emitting element portion (EL). The first sealing layer 127 may contain an insulating material. For example, the first sealing layer 127 may contain at least one inorganic insulating material selected from the group consisting of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0064] The second encapsulating layer 129 may have a thickness sufficient to cover the first encapsulating layer 127 and have a flat surface. The second encapsulating layer 129 can prevent foreign matter from penetrating into the light-emitting element portion (EL) or the transistor (TR). The second encapsulating layer 129 may include an insulating material. The second encapsulating layer 129 may include at least one material selected from the group consisting of epoxy, polyimide, polyethylene, and acrylate.

[0065] A third sealing layer 130 may be disposed on the second sealing layer 129. The third sealing layer 130 may cover the second sealing layer 129 and include an inorganic insulating material. The third sealing layer 130 may include at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON), for example.

[0066] On the other hand, the sealing layer is not limited to three layers, and may include, for example, n layers (where n is an integer greater than 3) alternately stacked between the inorganic sealing layer and the organic sealing layer.

[0067] The base substrate 101 may include a dam structure 126 disposed between the display region and a pad region where the pad electrodes 145 are disposed. The dam structure 126 is intended to prevent the second sealing layer 129 from flowing and overflowing into the pad region. The dam structure 126 may include, for example, a structure in which a first dam formed on the same plane as the planarization layer 115 and a second dam formed on the same plane as the bank 121 are stacked one above the other. For example, the first dam may be formed of the same material as the planarization layer 115, but is not limited to this. For example, the second dam may be formed of the same material as the bank 121, but is not limited to this.

[0068] The first encapsulation layer 127 can extend to the portion of the dam structure 126 of the display panel (PNL) and cover the side surfaces of the planarization layer 115 and the dam structure 126 .

[0069] A touch sensor unit (TS) may be disposed on the third sealing layer 130. The touch sensor unit (TS) may include a touch buffer film 130, a touch sensor disposed on the touch buffer film 130 and including a plurality of touch electrodes 135, 137 and a plurality of bridge electrodes 139, a touch interlayer insulating layer 136, and a touch protection film 143.

[0070] The touch inter-layer insulating layer 136 is disposed between the plurality of touch electrodes 135 and 137 and the plurality of bridge electrodes 139 to insulate them from each other. The touch inter-layer insulating layer 136 may include contact holes that expose portions of the surfaces of the bridge electrodes 139. The plurality of touch electrodes 135 and 137 may be electrically connected to adjacent touch electrodes through the contact holes.

[0071] The plurality of touch electrodes 135, 137 may include a plurality of first touch electrodes 135 and a plurality of second touch electrodes 137. The plurality of first touch electrodes 135, the plurality of second touch electrodes 137, and the plurality of bridge electrodes 139 may be located in different layers. For example, the plurality of first touch electrodes 135 may be arranged spaced apart from each other in a first direction of the base substrate 101, and the plurality of second touch electrodes 137 may be arranged spaced apart from each other in a second direction of the base substrate 101 intersecting the first direction. The second touch electrode 137 may be located between the plurality of first touch electrodes 135 arranged adjacent to each other. The plurality of first touch electrodes 135 arranged adjacent to each other may be electrically connected via bridge electrodes 139 located in another layer.

[0072] The plurality of touch electrodes 135 and 137 may be electrically connected to the pad electrode 145 via a plurality of touch link wirings 140 disposed on the periphery of the display area (AA). The touch link wirings 140 may be disposed in the same layer as the plurality of touch electrodes 135 and 137, but are not limited thereto. The touch link wirings 140 may extend along the exposed surface of the touch interlayer insulating layer 136 and be connected to the pad electrode 145.

[0073] The touch protection film 143 may be disposed to cover the plurality of touch electrodes 135 and 137. The touch protection film 143 may include an organic insulating material.

[0074] A polarizing layer 153 may be disposed on the touch protection film 143. The polarizing layer 153 can suppress external light reflection and change the polarization state of light emitted from the light emitting element unit (EL). The polarizing layer 153 may be bonded to the display panel (PNL) via a first adhesive member 150. The first adhesive member 150 may include, for example, a pressure sensitive adhesive (PSA).

[0075] A cover substrate 160 may be disposed on the polarizing layer 153. The cover substrate 160 covers the display panel (PNL) including the base substrate 101 and can protect the transistors (TR), light-emitting element (EL), and circuit elements on the base substrate 101. The cover substrate 160 may also be called a cover window, a window cover, or a cover glass.

[0076] The cover substrate 160 may include a glass substrate. An optical adhesive member 155 may be further included between the polarizing layer 153 and the cover substrate 160. The optical adhesive member 155 may include, but is not limited to, an optically clear adhesive film (OCA).

[0077] The front face of the cover substrate 160 may be a light-emitting surface through which light emitted from the light-emitting element (EL) is emitted to the outside. A user can view an image displayed on the display panel (PNL) through the front face of the cover substrate 160. A plurality of functional layers, such as an anti-fingerprint coating layer, an anti-reflection layer, and an anti-glare layer, may be arranged on the front face of the cover substrate 160 in a multi-layer structure, but is not limited thereto.

[0078] The rear face of the cover substrate 160, which faces the front face, may be a light incident surface onto which light emitted from the light emitting element (EL) is incident. A light blocking pattern 157 may be disposed on the rear face of the cover substrate 160. The light blocking pattern 157 functions to prevent a circuit pattern disposed on the non-display area (NAA) from being viewed by a user. For example, the circuit pattern disposed on the non-display area (NAA) may include, but is not limited to, metal wiring, pad electrodes, integrated circuit chips, flexible circuit boards, or printed circuit boards.

[0079] For this purpose, the light-shielding pattern 157 may be located on the non-display area (NAA) and have a closed loop shape surrounding the four edges of the rear surface of the cover substrate 160. The light-shielding pattern 157 may be arranged, for example, in the upper edge region, the lower edge region, the left edge region, and the right edge region. The light-shielding pattern 157 may include a film mixed with an opaque pigment. The opaque pigment may include, for example, but is not limited to, carbon black or titanium black.

[0080] Referring further to FIG. 2 , a protective coating layer 170 may be disposed on the second surface of the base substrate 101. During processes such as a deposition process for forming transistors (TR, see FIG. 3 ) on the first surface of the base substrate 101, fine damage may occur on the second surface. The portions of the second surface of the base substrate 101 where the fine damage remains may have lower rigidity than portions without the damage. As a result, defects such as breakage of the base substrate 101 due to even a small impact may occur. Therefore, the damaged portions of the second surface of the base substrate 101 may be removed by an etching process, and the protective coating layer 170 may be disposed on the surface of the removed second surface. The protective coating layer 170 may improve the rigidity of the base substrate 101. The protective coating layer 170 may be formed by coating an opaque insulating material. The protective coating layer 170 may include, for example, a black resin, but is not limited thereto.

[0081] A backplate portion 180 may be disposed on the second surface of the base substrate 101 on which the protective coating layer 170 is disposed. The backplate portion 180 reinforces the rigidity of the base substrate 101 and can dissipate heat and absorb external shocks. For this purpose, the backplate portion 180 may include a multilayer structure of a second adhesive member 173, a shock absorbing layer 175, a third adhesive member 177, and a heat dissipation layer 179, but is not limited to this.

[0082] The second adhesive member 173 can attach the shock absorbing layer 175 to the protective coating layer 170. The second adhesive member 173 may include a pressure-sensitive adhesive (PSA). The shock absorbing layer 175 is made of a foam material and can absorb shocks applied from the outside. The shock absorbing layer 175 may include, for example, polyurethane (PU), but is not limited thereto. The shock absorbing layer 175 can prevent the display panel (PNL) from being damaged by external shocks.

[0083] The heat dissipation layer 179 may be attached to the shock absorbing layer 175 via a third adhesive member 177. The second adhesive member 173 may include a pressure-sensitive adhesive (PSA). The heat dissipation layer 179 can dissipate heat generated inside the display panel (PNL) when the light emitting element unit (EL) is driven to the outside. The heat dissipation layer 179 includes a metal material with high thermal conductivity and can also function as a grounding member for circuit elements arranged on the display panel (PNL). The heat dissipation layer 179 also includes a metal material with relatively high rigidity and can reinforce the rigidity of the display panel (PNL). The heat dissipation layer 179 may include, for example, aluminum (Al), but is not limited thereto.

[0084] Fig. 4 is a cross-sectional view of the display device shown in Fig. 1 taken along line 4-4. Fig. 5 is a cross-sectional view of the display device shown in Fig. 1 taken along line 5-5. Fig. 6 is a cross-sectional view of the display device shown in Fig. 1 taken along line 6-6. For convenience of explanation, Figs. 4 to 6 only show the display panel (PNL) and the plate unit 180.

[0085] 1 together with FIGS. 4 to 6, the display device 1000 may include a display area (AA) and a non-display area (NAA) surrounding the outer periphery of the display area (AA). The non-display area (NAA) may be a first area (dt-a1, ds-a1, db-a1) between the outermost end portion 160E of the cover substrate 160 and the boundary of the display area (AA). The first areas (dt-a1, ds-a1, db-a1) of the non-display area (NAA) may be a first area (dt-a1, see FIG. 4) on the upper edge of the display panel (PNL), first areas (ds-a1, see FIG. 5) on the left and right edges, and a first area (db-a1, see FIG. 6) on the lower edge of the display panel (PNL).

[0086] The non-display area (NAA) may be positioned overlapping the viewing area (V / A). The viewing area (V / A) may be an area visible to a user. The active area (AA) may be an area where a video or image is displayed. To form the viewing area (V / A), a light-shielding pattern 157 may be disposed surrounding four portions of the outer frame of the cover substrate 160. The viewing area (V / A) may be located between an inner end 157E of the light-shielding pattern 157 disposed close to the boundary of the display area (AA) and the boundary of the display area (AA). The viewing area (V / A) may be, for example, a first separation distance (dt-a2, ds-a2, db-a2) between the inner end 157E of the light-shielding pattern 157 and the boundary of the display area (AA). The first separation distances (dt-a2, ds-a2, db-a2) of the viewing area (V / A) may be the first separation distance at the upper edge of the display panel (PNL) (dt-a2, see FIG. 4), the first separation distances at the left and right edges (ds-a2, see FIG. 5), and the first separation distance at the lower edge of the display panel (PNL) (db-a2, see FIG. 6). For example, the length of the first area (dt-a1) at the upper edge of the display panel (PNL) in the second direction of the base substrate 101 is the same as the sum of the first separation distance (dt-a2) at the upper edge of the display panel (PNL) and the length of the light-shielding pattern 157 (see FIG. 4). For example, the length of the first region (ds-a1) at the left and right edges of the display panel (PNL) in the first direction of the base substrate 101 is the same as the sum of the first separation distance (ds-a2) at the left and right edges of the display panel (PNL) and the length of the light-shielding pattern 157 (see FIG. 5). For example, the length of the first region (db-a1) at the bottom edge of the display panel (PNL) in the second direction of the base substrate 101 is the same as the sum of the first separation distance (db-a2) at the bottom edge of the display panel (PNL) and the length of the light-shielding pattern 157 (see FIG. 6). However, the present specification is not limited thereto.

[0087] In a display device according to an embodiment of the present disclosure, the cover substrate 160 may be located as the uppermost layer of the display device 1000. The cover substrate 160 may include glass, which requires a functional layer for surface treatment of the cover substrate 160. For example, a plurality of functional layers, such as an anti-fingerprint coating layer, an anti-reflection layer, and an anti-glare layer, may be arranged in a multi-layer structure on the front surface of the cover substrate 160. However, forming these functional layers in a multi-layer structure requires separate processes, which increases manufacturing costs. Furthermore, foreign matter may be generated during each process to form the multi-layer structure, which may cause defects. As a result, the quality of the image or video of the display device may be reduced.

[0088] This requires a structure that reduces manufacturing costs and can reduce the quality of the display's video or image.

[0089] Figure 7 is a cross-sectional view showing one side of another embodiment of the display device of Figure 1. And Figure 8 is an enlarged cross-sectional view showing region 8 of Figure 7. In Figures 7 and 8, the same components as those in Figures 2 and 3 may have the same reference numerals, so redundant explanations will be omitted or explained briefly, and differences will be explained.

[0090] 7 and 8, in a display device according to another embodiment of the present specification, a rigidity reinforcing layer 200 may be disposed on the upper side of the display panel (PNL). A polarizing layer 153 may be disposed on the upper side of the rigidity reinforcing layer 200. The display panel (PNL) may include a light-emitting element unit (EL) and a touch sensor unit (TS) disposed on a base substrate 101 having a transistor (TR). The light-emitting element unit (EL) may be sealed with a sealing layer including a first sealing layer 127, a second sealing layer 129, and a third sealing layer 130. A touch sensor unit (TS) may be disposed on the sealing layers 127, 129, and 130. A plate unit 180 may be disposed below the display panel (PNL).

[0091] The rigidity reinforcing layer 200 has a polarizing layer 153 disposed on top thereof, so that the polarization characteristics of light passing through the rigidity reinforcing layer 200 can be changed as it passes through the polarizing layer 153. In addition, the polarizing layer 153 can prevent external incident light from being reflected by metal wiring or the like disposed on the display panel (PNL) and reducing visibility in the display area (AA). The polarizing layer 153 may be, for example, a quarter-wave retardation film, but is not limited to this.

[0092] When an external light source is incident on a display device in which the polarizing layer 153 is disposed on the rigidity reinforcement layer 200 according to an embodiment of the present specification, only light that coincides with an axial direction of the polarizing layer 153, for example, a first axis direction, can pass through the polarizing layer 153. The first axis direction may be the x-axis direction. When the light that is aligned with the first axis direction of the polarizing layer 153 passes through the polarizing layer 153, its phase is shifted by 45 degrees and it can enter the rigidity reinforcement layer 200.

[0093] The light that has passed through the rigidity reinforcing layer 200 may be reflected by metal wiring or the like arranged on the display panel (PNL), and may further pass through the rigidity reinforcing layer 200 and be emitted in the direction of the polarizing layer 153. The rigidity reinforcing layer 200 may include an optical layer that does not generate a phase difference when light passes through it.

[0094] Light that passes through the rigidity reinforcing layer 200 without changing its phase and then enters the polarizing layer 153 may have a second axis direction different from the first axis direction while its phase is changed in the polarizing layer 153. The second axis direction may be, for example, the y-axis direction. As a result, the light in the second axis direction is different from the axis direction of the polarizing layer 153 and is not emitted to the outside, and can be prevented from being viewed by the user in the display area (AA). This can prevent a decrease in visibility in the display area (AA). In another example, the first axis direction may be the y-axis direction, and the second axis direction may be the x-axis direction.

[0095] Here, if the rigidity reinforcing layer 200 includes an optical layer that changes the phase, the phase of light passing through the rigidity reinforcing layer 200 is changed, and the phase of light may be further changed in the polarizing layer 153. In this case, light aligned in the axial direction with the polarizing layer 153 may be emitted to the outside, which may reduce visibility in the display area (AA).

[0096] Therefore, the rigidity reinforcing layer 200 may include an optical layer that does not generate a phase difference when light passes through it. For example, the rigidity reinforcing layer 200 may include an optical layer that does not generate a phase difference when light emitted from the light emitting element (EL) of the display panel (PNL), light incident from the outside, or internally reflected light of the display panel (PNL) passes through it.

[0097] When the polarizing layer 153 is disposed under the rigidity reinforcing layer 200, a surface treatment process is further required to improve the abrasion resistance of the surface of the rigidity reinforcing layer 200. For example, a hard coat layer may be formed on the surface of the rigidity reinforcing layer 200. If a surface treatment process is further performed, the manufacturing cost may increase.

[0098] In contrast, when the polarizing layer 153 is disposed on the upper side of the rigidity reinforcing layer 200 according to the embodiment of the present specification, it is possible to omit an additional surface treatment process for the rigidity reinforcing layer 200. This reduces the manufacturing cost of the rigidity reinforcing layer 200.

[0099] The rigidity reinforcing layer 200 may include tempered glass, polycarbonate (PC), or polymethylmethacrylate (PMMA). The rigidity reinforcing layer 200 may have a thickness in the range of 0.2 mm to 0.5 mm to ensure the rigidity of the display device. For example, the rigidity reinforcing layer 200 may have a thickness of 0.25 mm to 0.45 mm, but is not limited thereto.

[0100] The rigidity reinforcing layer 200 can be bonded to the display panel (PNL) via an optical adhesive member 155. The optical adhesive member 155 may include an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR). When the optically clear adhesive film (OCA) or the optically clear adhesive resin (OCR) is used as the optical adhesive member 155, the manufacturing cost of the display device can be reduced.

[0101] One surface of the optical adhesive member 155 may be in contact with the upper surface of the touch protection film 143 of the touch sensor unit (TS), and the other surface may be in contact with the rear surface of the rigidity reinforcing layer 200. The rigidity reinforcing layer 200 may be attached to the entire area of ​​the display panel (PNL) via the optical adhesive member 155, thereby increasing the rigidity of the display device.

[0102] The rigidity reinforcing layer 200 may include a first surface which is a light incident surface onto which light emitted from the light-emitting element section (EL) is incident, and a second surface which faces the first surface and is a light exit surface from which the incident light is emitted to the outside. The first surface of the rigidity reinforcing layer 200 may be located opposite the light-emitting element section (EL), and the second surface may be located opposite the polarizing layer 153, for example.

[0103] A light-shielding pattern 157 may be disposed on an edge portion of the first surface of the rigid reinforcement layer 200. The light-shielding pattern 157 can prevent a circuit pattern disposed on the non-display area (NAA) from being visible to a user. For example, the circuit pattern disposed on the non-display area (NAA) may include, but is not limited to, metal wiring, pad electrodes, integrated circuit chips, flexible circuit boards, or printed circuit boards.

[0104] For this purpose, the light-blocking pattern 157 may be located on the non-display area (NAA) of the rigidity reinforcement layer 200. The light-blocking pattern 157 may have a closed loop shape surrounding the four sides of the first surface of the rigidity reinforcement layer 200. The light-blocking pattern 157 may be arranged, for example, in the upper edge region, lower edge region, left edge region, and right edge region of the rigidity reinforcement layer 200. The light-blocking pattern 157 may include a film mixed with an opaque pigment. The opaque pigment may include, for example, carbon black or titanium black, but is not limited to these.

[0105] A polarizing layer 153 may be disposed on the second surface of the rigidity reinforcing layer 200. The polarizing layer 153 may be attached to the second surface of the rigidity reinforcing layer 200 via a first adhesive member 150. The first adhesive member 150 may include, for example, a pressure-sensitive adhesive (PSA), but is not limited to this.

[0106] According to an embodiment of the present specification, the rigidity reinforcing layer 200 may be disposed below the polarizing layer 153. The polarizing layer 153 may be disposed as the uppermost layer of the display device. As a result, the rigidity reinforcing layer 200 can omit multi-layer structures such as an anti-fingerprint coating layer, an anti-reflection layer, and an anti-glare layer, which are functional layers for surface treatment. This simplifies the manufacturing process of the display device and reduces manufacturing costs. Furthermore, forming a multi-layer structure can omit multiple processes, and it is possible to prevent the generation of foreign matter during each process. This allows the quality of the image or video of the display device to be maintained.

[0107] The rigidity reinforcing layer 200 is disposed relatively closer to the display panel (PNL), and the polarizing layer 153 protrudes from the outermost portion 200E of the rigidity reinforcing layer 200, thereby realizing a three-sided borderless design. This provides a relatively larger display area (AA) for the user compared to a display device using a bezel. As a result, the user's sense of immersion in the image or video can be further improved.

[0108] In addition, the distance between the viewing area and the display area can be reduced by disposing the rigidity reinforcing layer 200 at a position relatively closer to the display panel (PNL). Hereinafter, the present invention will be described with reference to the drawings.

[0109] Fig. 9 is a cross-sectional view of another embodiment of the display device shown in Fig. 1 taken along line 9-9. Fig. 10 is a cross-sectional view of another embodiment of the display device shown in Fig. 1 taken along line 10-10. And Fig. 11 is a cross-sectional view of another embodiment of the display device shown in Fig. 1 taken along line 11-11. For convenience of explanation, Figs. 9 to 11 schematically show the display panel (PNL) and the plate unit 180.

[0110] 1 together with FIGS. 9 to 11, the display device 1000 may include a display area (AA) and a non-display area (NAA) surrounding the outer periphery of the display area (AA). The non-display area (NAA) may be a second area (dt-b1, ds-b1, db-b1) between the outermost end portion 200E of the rigidity reinforcing layer 200 and the boundary of the display area (AA). The second areas (dt-b1, ds-b1, db-b1) of the non-display area (NAA) may be a second area (dt-b1, see FIG. 9) at the upper edge of the display panel (PNL), a second area (ds-b1, see FIG. 10) at the left and right edges, and a second area (db-b1, see FIG. 11) at the lower edge of the display panel (PNL).

[0111] The non-display area (NAA) may be positioned overlapping the viewing area (V / A). The viewing area (V / A) may be an area visible to a user. The active area (AA) may be an area where a video or image is displayed. To form the viewing area (V / A), a light-shielding pattern 157 may be disposed surrounding four portions of the outer frame of the rigidity reinforcement layer 200. The viewing area (V / A) may be located between an inner end 157E of the light-shielding pattern 157 disposed close to the boundary of the display area (AA) and the boundary of the display area (AA). The viewing area (V / A) may be, for example, a second separation distance (dt-b2, ds-b2, db-b2) between the inner end 157E of the light-shielding pattern 157 and the boundary of the display area (AA). The second separation distances (dt-b2, ds-b2, db-b2) of the viewing area (V / A) may be the second separation distance at the upper edge of the display panel (PNL) (dt-b2, see FIG. 9), the second separation distance at the left and right edges (ds-b2, see FIG. 10), and the second separation distance at the lower edge of the display panel (PNL) (db-b2, see FIG. 11). For example, the length of the second area (dt-b1) at the upper edge of the display panel (PNL) in the second direction of the base substrate 101 is the same as the sum of the second separation distance (dt-b2) at the upper edge of the display panel (PNL) and the length of the light-shielding pattern 157 (see FIG. 9). For example, the length of the second region (ds-b1) at the left and right edges of the display panel (PNL) in the first direction of the base substrate 101 is the same as the second separation distance (ds-b2) at the left and right edges of the display panel (PNL) and the length of the light-shielding pattern 157 (see FIG. 10). For example, the length of the second region (db-b1) at the bottom edge of the display panel (PNL) in the second direction of the base substrate 101 is greater than the sum of the second separation distance (db-b2) at the bottom edge of the display panel (PNL) and the length of the light-shielding pattern 157 (see FIG. 11). However, the present specification is not limited thereto.

[0112] By positioning the rigidity reinforcement layer 200 relatively closer to the display panel (PNL), the second separation distance (dt-b2, ds-b2, db-b2) between the viewing area and the display area can be further reduced compared to the first separation distance (dt-a2, ds-a2, db-a2) between the viewing area and the display area when the cover substrate 160 is positioned at the top.

[0113] 12A and 12B are diagrams showing the viewing angle distance of a display device according to one embodiment of the present specification. (a) of FIG. 12 shows the viewing angle distance of a display device according to another embodiment of the present specification. (b) of FIG. 12 shows the viewing angle distance of a display device according to another embodiment of the present specification.

[0114] Referring to FIG. 12, the viewing angle (θ) may be a viewing range in which, when the display device is viewed by moving it at an angle of 45 degrees from the front, there is no difference in brightness or color reproduction ratio compared to when the display device is viewed from the front.

[0115] 12(a), the viewing angle distance (VDref) of a display device according to an embodiment of the present disclosure may be the sum of a first gap (G1) where the viewing angle (θ) reaches from the inner end 157E of the light-shielding pattern 157 and a second gap (G2) between the inner end 157E of the light-shielding pattern 157 and the surface of the display panel (PNL). Also, referring to FIG. 12(b), the viewing angle distance (VDex) of a display device according to another embodiment of the present disclosure may be the sum of a third gap (G3) where the viewing angle (θ) reaches from the inner end 157E of the light-shielding pattern 157 and a fourth gap (G4) from the inner end 157E of the light-shielding pattern 157 to the surface of the display panel (PNL).

[0116] In display devices according to other embodiments of the present specification, a rigidity reinforcing layer 200 may be disposed below the polarizing layer 153. As the distance between the light-blocking pattern 157 on the rigidity reinforcing layer 200 and the display panel (PNL) becomes shorter, the fourth gap (G4) between the light-blocking pattern 157 and the display panel (PNL) may be smaller than the second gap (G2). Thus, when the rigidity reinforcing layer 200 is disposed, the second separation distance (dt-b2) of the viewing area (V / A) may be shorter than the first separation distance (dt-a2) when the cover substrate 160 is disposed on the top layer of the display device.

[0117] The rigidity reinforcing layer 200 according to the embodiment of this specification can also be applied to a display panel (PNL) on which no touch sensor unit (TS) is arranged.

[0118] Figure 13 is a cross-sectional view showing one side of another embodiment of the display device of Figure 1. And Figure 14 is an enlarged cross-sectional view showing region 14 of Figure 13. In Figures 13 and 14, the same components as those in Figures 8 and 9 have the same reference numerals, so redundant explanations will be omitted or will be briefly explained, and differences will be explained.

[0119] 13 and 14, a display device according to another embodiment of the present specification may have a rigidity reinforcing layer 200 disposed on the upper side of a display panel (PNL). The display panel (PNL) may include a light-emitting element unit (EL) disposed on a base substrate 101 including a transistor (TR). The light-emitting element unit (EL) may include an organic light-emitting element (ED) including a first electrode 120, an organic light-emitting layer 123, and a second electrode 125, and a bank 121 including a bank hole 122. The light-emitting element unit (EL) may be sealed with sealing layers 127, 129, and 130. The sealing layers 127, 129, and 130 may include a first sealing layer 127, a second sealing layer 129, and a third sealing layer 130. A plate unit 180 for reinforcing the rigidity of the display device and absorbing external impacts may be disposed below the base substrate 101 of the display panel (PNL). In addition, the plate part 180 can dissipate heat generated inside the display panel (PNL) to the outside.

[0120] The base substrate 101 may include a dam structure 126 disposed between the display region and the pad region in which the pad electrodes 145 are disposed. The dam structure 126 may include, for example, a structure in which a first dam made of the same layer as the planarization layer 115 and a second dam made of the same layer as the bank 121 are stacked on top of and below each other. The dam structure 126 may be covered with a first sealing layer 127 and a third sealing layer 130.

[0121] A rigidity reinforcing layer 200 may be disposed on the third encapsulation layer 130. The rigidity reinforcing layer 200 may be attached to the third encapsulation layer 130 of the display panel (PNL) via an optical adhesive member 155. The optical adhesive member 155 may include an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR). The optical adhesive member 155 may be disposed so that the rigidity reinforcing layer 200 contacts the entire area of ​​the display panel (PNL). By disposing the rigidity reinforcing layer 200 in close contact with the entire area of ​​the display panel (PNL), the rigidity of the display device can be increased.

[0122] A light-shielding pattern 157 may be disposed on the edge portion of the first surface of the rigidity reinforcing layer 200. The light-shielding pattern 157 may have a closed loop shape that surrounds the four edge portions of the outer frame portion of the rigidity reinforcing layer 200.

[0123] A polarizing layer 153 may be disposed on a second surface of the rigidity reinforcing layer 200 opposite to the first surface on which the light-shielding pattern 157 is disposed. The polarizing layer 153 may be bonded to the second surface of the rigidity reinforcing layer 200 via a first adhesive member 150. The first adhesive member 150 may include, for example, a pressure-sensitive adhesive (PSA).

[0124] The stiffening layer 200 is attached to the display panel (PNL) instead of being disposed on the top layer of the display device, and the polarizing layer 153 is disposed on the top layer of the display device, thereby eliminating the need for a functional layer for surface treatment. The functional layer may include, but is not limited to, a multi-layer structure such as an anti-fingerprint coating layer, an anti-reflection layer, and an anti-glare layer.

[0125] By omitting a functional layer for surface treatment, the manufacturing cost of the display device can be reduced and the occurrence of defects can be reduced or eliminated. Therefore, the quality of the image of the display device can be maintained. In addition, the rigidity reinforcing layer 200 is disposed relatively closer to the display panel (PNL), thereby reducing the distance between the viewing area and the display area, thereby further improving the user's immersion in the image.

[0126] A display device according to an embodiment of the present specification may include a display panel including a display area and a non-display area surrounding the display area, a light-emitting element section including a plurality of light-emitting elements arranged on the display area of ​​the display panel, a rigidity reinforcing layer arranged on an upper portion of the display panel, and a polarizing layer on the rigidity reinforcing layer. The polarizing layer may be arranged so as to protrude further than the outermost portion of the rigidity reinforcing layer with respect to the display panel. The polarizing layer may be bonded to an upper surface of the rigidity reinforcing layer via an adhesive member.

[0127] In the display device according to some embodiments of the present disclosure, the substrate may further include a touch sensor portion disposed above the light emitting element portion and including a plurality of touch electrodes.

[0128] The display device according to some embodiments of the present disclosure may further include an optical adhesive member that is in contact with the rear surface of the rigid reinforcing layer and that is disposed over the entire area of ​​the display panel.

[0129] In the display device according to some embodiments of the present disclosure, the optical adhesive member may include an optically transparent adhesive resin.

[0130] In the display device according to some embodiments of the present specification, the rigid reinforcement layer includes a material that does not generate a phase difference when light passes through it, and may include tempered glass, polycarbonate, or polymethyl methacrylate.

[0131] In the display device according to some embodiments of the present specification, the rigidity reinforcing layer may have a thickness in the range of 0.2 mm to 0.5 mm.

[0132] In display devices according to some embodiments of the present specification, the rigidity reinforcement layer may include a first surface facing the light-emitting element section and a second surface opposite the first surface facing the polarizing layer, and may further include a light-shielding pattern arranged on an edge portion of the first surface of the rigidity reinforcement layer.

[0133] In the display device according to some embodiments herein, the light-blocking pattern may include a film mixed with an opaque pigment.

[0134] In displays according to some embodiments herein, the opaque pigment may include carbon black or titanium black.

[0135] In the display device according to some embodiments of the present specification, the light-shielding pattern may be located on the non-display area and may include a closed loop shape surrounding the four sides of the rigidity reinforcing layer.

[0136] In the display device according to some embodiments of the present specification, the light-shielding patterns may be arranged to surround the upper edge, left edge, right edge, and lower edge of the display panel.

[0137] In some embodiments of the display device of the present specification, the display device may further include a viewing area located outside the display area and overlapping with the non-display area, and the viewing area may include a separation distance between the boundary of the display area and the inner end of the light-blocking pattern.

[0138] In the display device according to some embodiments of the present disclosure, the separation distance can be reduced as the light-shielding pattern disposed on the rigid reinforcing layer is closer to the display panel.

[0139] In a display device according to some embodiments of the present specification, the light-emitting element unit may include an organic light-emitting element including a first electrode located on a display area of ​​the display panel, an organic light-emitting layer covering the exposed first electrode, and a second electrode on the organic light-emitting layer, and a bank covering an edge of the first electrode and including a bank hole exposing a portion of the first electrode.

[0140] Although the embodiments of the present specification have been described in more detail above with reference to the accompanying drawings, the present specification is not necessarily limited to these embodiments, and various modifications are possible within the scope of the technical concept of the present specification. Therefore, the embodiments disclosed in the present specification are for illustrative purposes only, and do not limit the technical concept of the present specification. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting. [Explanation of symbols]

[0141] 101 Base board 153 Polarizing Layer 157 Blackout Pattern 160 Cover board 180 Back plate part 200 Rigid reinforcement layer PNL display panel TR transistor EL light emitting element TS Touch sensor section AA display area NAA Hidden Area

Claims

1. a display panel including a display area and a non-display area adjacent to the display area; a light-emitting element section including a plurality of light-emitting elements arranged on the display area of ​​the display panel; a rigidity reinforcing layer disposed on an upper portion of the display panel; a polarizing layer on the rigidity reinforcing layer; Including, the polarizing layer is disposed so as to protrude further than the outermost portion of the rigidity reinforcing layer relative to the display panel; Display device.

2. The polarizing layer is bonded to the upper surface of the rigidity reinforcing layer via an adhesive member. The display device according to claim 1 .

3. the display panel further includes a touch sensor unit disposed above the light-emitting element unit and including a plurality of touch electrodes; The display device according to claim 1 .

4. The display panel further includes an optical adhesive member disposed in contact with the rear surface of the rigid reinforcing layer and covering the entire area of ​​the display panel. The display device according to claim 1 .

5. The optical adhesive member includes an optically transparent adhesive resin. The display device according to claim 4 .

6. The rigidity reinforcing layer includes a material that does not generate a phase difference when light passes through it. The display device according to claim 1 .

7. The rigid reinforcing layer comprises tempered glass, polycarbonate, or polymethyl methacrylate. The display device according to claim 1 .

8. The stiffness reinforcement layer has a thickness in the range of 0.2 mm to 0.5 mm. The display device according to claim 1 .

9. the rigidity reinforcing layer has a first surface facing the light emitting element component; a second surface opposite the first surface and facing the polarizing layer; Including, Further, a light-shielding pattern is disposed on an edge portion of the first surface of the rigidity reinforcing layer. The display device according to claim 1 .

10. The light-blocking pattern includes a film mixed with an opaque pigment; The display device according to claim 9 .

11. The opacifying pigment comprises carbon black or titanium black. The display device according to claim 10.

12. the light-blocking pattern is located on the non-display area and includes a closed loop shape surrounding four sides of the rigidity reinforcing layer; The display device according to claim 9 .

13. the light-blocking pattern surrounds an upper edge, a left edge, a right edge, and a lower edge of the display panel; The display device according to claim 12.

14. a viewing area located outside the display area and overlapping the non-display area; The viewing area includes a separation distance between the boundary of the display area and the inner end of the light-blocking pattern. The display device according to claim 9 .

15. the separation distance decreases as the light-shielding pattern disposed on the rigidity reinforcing layer approaches the display panel; The display device according to claim 14.

16. The light-emitting element portion is an organic light-emitting element including a first electrode located on the display area of ​​the display panel, an organic light-emitting layer covering an exposed portion of the first electrode, and a second electrode on the organic light-emitting layer; a bank covering an edge of the first electrode, the bank including a bank hole exposing a portion of the first electrode; Including, The display device according to claim 1 .

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