Submodules

Abstract

The present invention is a submodule. The exterior of the submodule (10) of the present invention may be formed by a housing (20). A first opening (25) may be formed on one side (24) of the housing (20). A heat sink (30) may be installed in the first opening (25). An inner surface of the heat sink (30) may face the inside of the housing (20), and an outer surface of the heat sink (30) may form one outer surface of the housing (20). A heat generating element such as a power semiconductor (32) or a control board may be installed on the heat sink (30). An inlet (34) and an outlet (36) may be formed on one side edge of the heat sink (30) to communicate with a flow path formed inside to allow a cooling fluid to enter and exit.

Description

[Technical Field]

[0001] The present invention relates to a submodule. [Background technology]

[0002] An HVDC system is a system that converts AC power generated at a power plant into DC, transmits the power, and then converts it back into AC at the receiving point to supply electricity. Compared to AC transmission systems, HVDC systems have less loss and are more efficient in transmission, and can improve stability through system isolation. They are also advantageous for long-distance power transmission because they have less inductive interference.

[0003] In such an extra-high voltage DC transmission system, as shown in Fig. 1, a number of sub-modules 1 are installed on a frame 3 having a height of several meters and consisting of multiple layers. The frame 3 has a number of partition plates 7 installed to form multiple layers in a number of vertically installed columns 5. A number of the sub-modules 1 are installed on the partition plates 7 in rows.

[0004] The submodule 1 used here comprises a power supply unit 9 and a capacitor unit 9', and various power semiconductors and control boards are installed in the power supply unit 9. The power semiconductors and control boards installed in the power supply unit 9 generate a lot of heat during operation. A heat dissipation device that uses cooling water to discharge this heat to the outside is connected from the outside to the inside of the power supply unit 9. That is, there is a pipe that supplies cooling water to the inside of the power supply unit 9, and this pipe transfers the cooling water so that it can pass through a heat sink installed inside the power supply unit 9.

[0005] In such a configuration, if the cooling water leaks inside the submodule, it can cause electrical leakage or corrosion, and in severe cases, it can damage the power semiconductors and control boards.

[0006] Furthermore, since many components, including a heat dissipation device, are installed inside the power supply unit 9, the size of the sub-module 1 increases, which causes the size of the frame 3 for installing the sub-module 1 to increase, occupying a large amount of space.

[0007] Such a sub-module 1 is used in a similar form not only in a high voltage direct current (HVDC) system but also in a flexible alternative current (FACT) system in which power semiconductors are used.

[0008] Prior art documents related to the above-mentioned submodule include Korean Patent No. 10-1623347, Korean Patent No. 10-1295070, Korean Patent No. 10-1288679, and the like. Summary of the Invention [Problem to be solved by the invention]

[0009] The object of the present invention is to miniaturize the sub-module.

[0010] The object of the present invention is to prevent cooling water from entering the interior of the sub-module.

[0011] An object of the present invention is to simplify the connection structure between the sub-modules.

[0012] An object of the present invention is to make the submodule smaller while still allowing smooth heat dissipation to the outside. [Means for solving the problem]

[0013] To achieve the above object, the submodule of the present invention may include a housing having components installed therein and an opening formed on one outer surface, and a heat sink installed in the opening of the housing, with its inner surface inside the housing and at least one of the components installed therein, and its other surface outside the housing.

[0014] The opening may be formed in one of the side plates of the housing, and the heat sink may be installed in the opening.

[0015] The opening may be formed in the upper plate of the housing, and the heat sink may be installed in the opening.

[0016] The opening may be formed in a bottom plate of the housing, and the heat sink may be installed in the opening.

[0017] A flow path through which a cooling fluid flows may be formed inside the heat sink, and the flow path may be connected to the outside through an inlet and an outlet provided on one side of the heat sink.

[0018] The front panel of the housing may be provided with a first terminal and a second terminal for electrical connection with adjacent sub-modules.

[0019] A first terminal for electrical connection with an adjacent sub-module may be provided on the front panel of the housing, and a second terminal may be provided on the heat sink.

[0020] According to another feature of the present invention, the present invention may include a hexahedral housing having components installed therein and an opening formed on one outer surface thereof, and a heat sink installed in the opening of the housing, with its inner surface inside the housing and at least one of the components installed therein, forming the outer surface of one side of the housing, wherein a flow path through which a cooling fluid flows may be formed inside the heat sink, and the flow path may be connected to the outside via an inlet and an outlet provided on one side of the heat sink.

[0021] The opening may be formed in one of the top, side, and bottom plates of the housing, and the heat sink may be installed to close the opening, thereby forming an outer surface of one side of the housing.

[0022] The front panel of the housing may be provided with a first terminal and a second terminal for electrical connection between adjacent sub-modules.

[0023] A first terminal for electrical connection with an adjacent sub-module may be provided on the front panel of the housing, and a second terminal for electrical connection with an adjacent sub-module may be provided on the heat sink. [Effects of the Invention]

[0024] The sub-module according to the present invention can have at least one of the following effects.

[0025] In the present invention, a heat sink can be installed to form one surface of the housing that forms the exterior of the submodule. Therefore, the heat sink forms part of the housing and does not occupy space inside the housing, and space for installing the heat sink is not required inside the housing of the submodule, so the size of the housing can be reduced.

[0026] In the present invention, a heat sink forms an outer surface of one side of the housing, with one surface of the heat sink facing the inside of the housing and the other surface exposed to the outside of the housing. An inlet and outlet for a cooling fluid to enter and exit the inside of the heat sink may be provided on one side of the heat sink that is located outside the housing. This structure prevents the cooling fluid from entering the inside of the housing, thereby preventing the cooling fluid from affecting components installed inside the housing.

[0027] In the present invention, the heat sink forms one outer surface of the housing, and the outer surface of the heat sink can be exposed to the outside, which allows for smoother heat exchange with the outside air and more efficient heat dissipation from the heat sink.

[0028] In another embodiment of the present invention, a terminal for connecting a bus bar connecting adjacent sub-modules can be placed on the heat sink. This configuration allows the terminal to be integrally placed on one side of the heat sink, which has the effect of reducing the overall number of parts. [Brief explanation of the drawings]

[0029] [Figure 1] FIG. 1 is a perspective view showing an installation state of a general sub-module.

[0030] [Figure 2] 1 is a perspective view showing the configuration of a preferred embodiment of a submodule according to the present invention;

[0031] [Figure 3] FIG. 3 is an exploded perspective view showing the configuration of the embodiment shown in FIG. 2.

[0032] [Figure 4] FIG. 10 is a perspective view showing the configuration of another embodiment of a submodule according to the present invention.

[0033] [Figure 5] FIG. 5 is a perspective view showing the use of the embodiment shown in FIG.

[0034] [Figure 6] FIG. 10 is a perspective view showing the configuration of another embodiment of a submodule according to the present invention.

[0035] [Figure 7] FIG. 7 is a perspective view showing the embodiment shown in FIG. 6 from another direction.

[0036] [Figure 8] FIG. 7 is an exploded perspective view showing the configuration of the embodiment shown in FIG. 6. DETAILED DESCRIPTION OF THE INVENTION

[0037] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. When assigning reference numerals to components in each drawing, it should be noted that the same reference numerals are used to the same components as much as possible, even if they are displayed in different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of related known structures or functions is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0038] Furthermore, when describing components of an embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are merely used to distinguish the component from other components, and do not limit the nature, order, or sequence of the components. When a component is described as being "coupled," "coupled," or "connected" to another component, it should be understood that the component can be directly coupled or connected to the other component, but that another component can also be "coupled," "coupled," or "connected" between the components.

[0039] Hereinafter, the configuration of a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0040] 2 and 3 show the configuration of a submodule according to a preferred embodiment of the present invention. The exterior of the submodule 10 of this embodiment may be formed by a housing 20. The housing 20 forms the exterior of the submodule 10, and may have an internal space in which various components can be installed. The housing 20 may have a hexahedral shape.

[0041] The front surface of the housing 20 may be formed by a front plate 21. The front plate 21 may be provided with a first terminal 21' and a second terminal 21''. The first terminal 21' and the second terminal 21'' may be electrically connected to components inside the housing 20. The first terminal 21' and the second terminal 21'' may also be electrically connected to an adjacent sub-module 10 via a connecting bus bar 40 (see FIG. 5). The front plate 21 may have a component for connecting the sub-module 10 to the outside and a component for operating the sub-module 10.

[0042] An upper plate 22 may form the upper surface of the housing 20. The upper plate 22 may be connected to the upper end of the front plate 21. The upper plate 22 has a rectangular shape in this embodiment. However, the shape of the upper plate 22 may vary depending on the overall configuration of the housing 20. A bottom plate 23 may be located on the opposite side of the upper plate 22. The bottom plate 23 may form the bottom of the housing 20. The bottom plate 23 may have the same shape and area as the upper plate 22.

[0043] Side plates 24 may be provided at both widthwise ends of the top plate 22 and the bottom plate 23. The side plates 24 may form both side surfaces of the housing 20. One of the side plates 24 may have a first opening 25. The first opening 25 may connect the inside and outside of the housing 20. In this embodiment, a heat sink 30 (described below) may be installed to close the first opening 25. The first opening 25 may be formed over the entire area of ​​the side plate 24 or may be formed over a partial area. In the illustrated embodiment, it is formed over almost the majority of the area of ​​the side plate 24.

[0044] The other of the side plates 24 may have a second opening 26. The second opening 26 is a portion through which an operator can access the inside of the housing 20 for maintenance. The second opening 26 may be covered by a cover 26'. In this embodiment, the second opening 26 is formed over almost most of the area of ​​the side plate 24. However, the second opening 26 may have an area and shape necessary for accessing the inside of the housing 20. Although not shown, the cover 26' may be formed with a number of louvers to allow air to flow between the inside and outside of the housing 20.

[0045] A third opening 28 may be formed on the rear surface of the housing 20, which is opposite to the front panel 21. The third opening 28 may be formed over the entire rear surface of the housing 20. However, the third opening 28 does not necessarily have to be formed over the entire rear surface of the housing 20. The third opening 28 may be formed only in a partial area of ​​the rear surface of the housing 20. A capacitor unit (not shown) and components inside the housing 20 may be connected through the third opening 28.

[0046] A heat sink 30 may be installed in the housing 20 to cover the first opening 25. The heat sink 30 may play a role in dissipating heat generated from components inside the housing 20 to the outside. The heat sink 30 may be made of a metal material. Power semiconductors 32 inside the housing 20 may be installed on the inner surface of the heat sink 30. An example of the power semiconductors 32 is an IGBT. A control board (not shown) located inside the housing 20 may also be installed on the heat sink 30. A heating element including the power semiconductors 32 may be installed on the inner surface of the heat sink 30. Of course, the heating element may be located inside the housing 20 instead of on the heat sink 30.

[0047] One side of the heat sink 30 faces the inside of the housing 20, and the other side of the heat sink 30 is located outside the housing 20 and can be in contact with the outside air. Therefore, the heat sink 30 can transfer heat generated inside the housing 20 to the outside of the housing 20.

[0048] 2, the heat sink 30 may have an inlet 34 and an outlet 36. The inlet 34 and the outlet 36 are for delivering a cooling fluid such as cooling water. A pipe (not shown) for supplying the cooling fluid is connected to the inlet 34, so that the cooling fluid can be delivered to the inside of the heat sink 30. The outlet 36 may be connected to a pipe (not shown) for discharging the cooling fluid and delivering it to a heat dissipation component.

[0049] A flow path (not shown) communicating with the inlet 34 and the outlet 36 may be formed inside the heat sink 30. A cooling fluid flows through the flow path while absorbing heat generated inside the housing 20. The flow path is formed in a zigzag shape inside the heat sink 30, allowing heat to be uniformly absorbed across the entire area of ​​the heat sink 30.

[0050] The heat sink 30 may be relatively thicker than the front plate 21, the top plate 22, the bottom plate 23, the side plate 24, etc., which constitute the housing 20. This is to allow a flow path for a cooling fluid to be formed inside the heat sink 30.

[0051] 2 and 3, the heat sink 30 may be installed on the opposite side of the housing 20. In this case, the cover 26' may be installed on the first opening 25.

[0052] Meanwhile, Figures 4 and 5 show another embodiment of the present invention. The embodiment shown here has an overall configuration similar to that shown in Figure 2. Therefore, for ease of explanation, the same reference numerals are used to designate the same components as those in the embodiment shown in Figure 2.

[0053] In this embodiment, a first terminal 21′ may be installed on a front plate 21 that forms the front surface of the housing 20. In this embodiment, a second terminal 37 may be provided on the heat sink 30 that is installed on the outer surface of the housing 20. The second terminal 37 may be integrally formed on one side of the heat sink 30.

[0054] In this embodiment, the second terminal 37 may be located at a predetermined height on the leading edge of the heat sink 30, which corresponds to the same height as the first terminal 21′. The first terminal 21′ and the second terminal 37 may be located side by side at the same height from the bottom plate 23.

[0055] FIG. 5 shows a state in which adjacent sub-modules 10 are electrically connected using the first terminal 21′ and the second terminal 37. Accordingly, the first terminal 21′ and the second terminal 37 may be electrically connected by a connecting bus bar 40. The connecting bus bar 40 may be made of a metal plate. A bus bar body 41 may form the framework of the connecting bus bar 40. The bus bar body 41 may have a predetermined plate shape. In this embodiment, the bus bar body 41 is a rectangular plate. The bus bar body 41 may have a first connecting portion 42 and a second connecting portion 43 at both ends for connecting to the first terminal 21′ and the second terminal 37. The first connecting portion 42 and the second connecting portion 43 may be connected to the first terminal 21′ and the second terminal 37 by screws. The first connecting portion 42 may be perpendicular to the bus bar body 41.

[0056] 6 to 8 show another embodiment of the present invention. In this embodiment, the exterior of the sub-module 110 may be formed by a housing 120. The housing 120 forms the exterior of the sub-module 110, and may have a space therein in which various components can be installed. The housing 120 may have a hexahedral shape.

[0057] A front plate 121 may form the front surface of the housing 120. The front plate 121 may be provided with a first terminal 121' and a second terminal 121''. The first terminal 121' and the second terminal 121'' may be electrically connected to components inside the housing 120. The first terminal 121' and the second terminal 121'' may also be electrically connected to an adjacent sub-module 110 via a connecting bus bar 40 (see FIG. 5). The front plate 121 may have a component for connecting the sub-module 110 to the outside and a component for operating the sub-module 110.

[0058] An upper surface of the housing 120 may be formed as an upper plate 122. The upper plate 122 may be connected to an upper end of the front plate 121. The upper plate 122 has a rectangular shape in this embodiment. However, the shape of the upper plate 122 may vary depending on the overall configuration of the housing 120. A bottom plate 123 may be located on the opposite side of the upper plate 122. The bottom plate 123 may form the bottom of the housing 120. The bottom plate 123 may have the same shape and area as the upper plate 122.

[0059] An open bottom portion 123′ may be formed in the bottom plate 123. The open bottom portion 123′ may be formed to occupy most of the area of ​​the bottom plate 123. A heat sink 130, which will be described later, may be installed in the open bottom portion 123′ of the bottom plate 123.

[0060] Side plates 124 may be provided at both widthwise ends of the top plate 122 and the bottom plate 123. The side plates 124 may form both side surfaces of the housing 120. One of the side plates 124 may have a first opening 125. The first opening 125 may connect the inside and the outside of the housing 120. In this embodiment, a heat sink 130 (described below) may be installed to cover the first opening 125. The first opening 125 may be formed over the entire area of ​​the side plate 124 or over a portion of the area. In the illustrated embodiment, the first opening 125 is formed over almost the majority of the area of ​​the side plate 124. A worker can access the interior for maintenance through the first opening 125. The first opening 125 may have an area and shape necessary for a worker to access the interior of the housing 120.

[0061] A first cover 125' may be installed in the first opening 125. The first cover 125' may close the first opening 125 to prevent the interior space of the housing 120 from being seen from the outside. A number of louvers may also be formed on the first cover 125'.

[0062] The other of the side plates 124 may have a second opening 126. The second opening 126 is a portion through which an operator can access the inside of the housing 120 for maintenance. The second opening 126 may be covered by a second cover 126'. In this embodiment, the second opening 126 is formed over almost most of the area of ​​the side plate 124. However, the second opening 126 may have an area and shape necessary for accessing the inside of the housing 120. Although not shown, the cover 126' may be formed with a number of louvers to allow air to circulate between the inside and outside of the housing 120.

[0063] It is not necessary that both the first opening 125 and the second opening 126 are provided, and either one of the first opening 125 and the second opening 126 may be omitted.

[0064] A third opening 128 may be formed on the rear surface of the housing 120, which is opposite to the front panel 121. The third opening 128 may be formed over the entire rear surface of the housing 120. However, the third opening 128 does not necessarily have to be formed over the entire rear surface of the housing 120. The third opening 128 may be formed only in a partial area of ​​the rear surface of the housing 120. A capacitor unit (not shown) and components inside the housing 120 may be connected via the third opening 128.

[0065] A heat sink 130 may be installed on the housing 120 to cover the bottom opening 123′. The heat sink 130 may play a role in dissipating heat generated from components inside the housing 120 to the outside. The heat sink 130 may be made of a metal material. Power semiconductors 132 inside the housing 120 may be installed on the inner surface of the heat sink 130. An example of the power semiconductors 132 is an IGBT. A control board (not shown) located inside the housing 120 may also be installed on the heat sink 130. Heat-generating elements including the power semiconductors 132 may be installed on the inner surface of the heat sink 130. Of course, the heat-generating elements may be located inside the housing 120 instead of on the heat sink 130.

[0066] One side of the heat sink 130 faces the inside of the housing 120, and the other side of the heat sink 130 is located outside the housing 120 and may be in contact with the outside air. Therefore, the heat sink 130 can transfer heat generated inside the housing 120 to the outside of the housing 120.

[0067] 6, the heat sink 130 may have an inlet 134 and an outlet 136. The inlet 134 and the outlet 136 are for transmitting a cooling fluid such as cooling water. A pipe (not shown) for supplying the cooling fluid is connected to the inlet 134, so that the cooling fluid can be transmitted to the inside of the heat sink 130. A pipe (not shown) for discharging the cooling fluid and transmitting it to a heat dissipation structure may be connected to the outlet 136.

[0068] A flow path (not shown) communicating with the inlet 134 and the outlet 136 may be formed inside the heat sink 130. A cooling fluid flows through the flow path while absorbing heat generated inside the housing 120. The flow path is formed in a zigzag shape inside the heat sink 130, so that heat can be uniformly absorbed across the entire area of ​​the heat sink 130.

[0069] The heat sink 130 may be relatively thicker than the front plate 121, the top plate 122, the bottom plate 123, the side plate 124, etc., which constitute the housing 120. This is to allow a flow path for a cooling fluid to be formed inside the heat sink 130.

[0070] An opening 121e may be formed on one side of the front plate 121 to prevent the inlet 134 and the outlet 136 of the heat sink 130 from interfering with the front plate 121. The opening 121e may be formed by removing a portion of the lower edge of the front plate 121.

[0071] The use of the sub-module according to the present invention having the above-described configuration will be described below.

[0072] In the submodules 10, 110 according to the present invention, the heat sinks 30, 130 may be installed so as to be exposed on the outer surface of one side of the housing 20, 120. That is, they may be installed on one of the side plates 24 of the housing 20 or the bottom plate 123 of the housing 120. Although not shown in the drawings, an opening may be formed in the top plate 22, 122 of the housing 20, 120, and the heat sinks 30, 130 may be installed in the opening. Alternatively, an opening may be formed in the front plate 21, 121, and the heat sinks 30, 130 may be installed in the opening.

[0073] The sub-modules 10, 110 configured in this manner are installed in a row on partition plates that form multiple layers on the frame, and adjacent sub-modules 10, 110 can be connected by connecting bus bars 40 for use.

[0074] During use of the submodule 10, 110, heat is generated from the power semiconductors 32, 132, etc., and it is necessary to dissipate this heat to the outside of the submodule 10, 110. In the present invention, the heat generated from the power semiconductors 32, 132, etc. can be conducted to the heat sink 30, 130, one surface of which is exposed to the outside of the submodule 10, 110, and the heat can be transferred to the cooling fluid flowing inside the heat sink 30, 130. Of course, the heat can also be dissipated to the outside air through the outer surface of the heat sink 30, 130.

[0075] The cooling fluid flows between the inside and outside of the heat sinks 30, 130 through the inlets 34, 134 and outlets 36, 136. In the present invention, the inlets 34, 134 and outlets 36, 136 do not enter the inside of the housings 20, 120, but are connected to the heat sinks 30, 130 outside the housings 20, 120.

[0076] Therefore, the cooling fluid does not enter the inside of the housings 20 and 120, and therefore the cooling fluid is not transmitted to the components inside the housings 20 and 120 due to leakage of the cooling fluid.

[0077] 5, when the second terminal 37 is provided on the heat sink 30, only the first terminal 21' may be provided on the front panel 21. That is, there is no need to provide a separate second terminal 21'' on the front panel 21, and electrical connection with an adjacent sub-module 10 can be made using the second terminal 37 integrally provided on the heat sink 30. By integrally forming the second terminal 37 on the heat sink 30 in this manner, the number of parts can be relatively reduced.

[0078] Although it has been described above that all components constituting the embodiments of the present invention are combined or operate in combination, the present invention is not necessarily limited to such embodiments. That is, all components may operate in selective combination with one or more other components within the scope of the present invention. Furthermore, unless specifically stated to the contrary, the terms "comprise," "comprise," "have," etc., used above, mean that the component in question may be inherent, and should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless otherwise defined. Commonly used terms, such as dictionary-defined terms, should be interpreted in accordance with the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly defined in the present invention.

[0079] The above description merely exemplifies the technical concept of the present invention, and various modifications and variations may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are for illustrative purposes only, and are not intended to limit the technical concept of the present invention. The scope of the present invention should be interpreted by the following claims, and all technical concepts within the scope of the claims should be interpreted as being within the scope of the present invention.

[0080] For example, in the illustrated embodiment, the heat sinks 30, 130 are disclosed as being installed on one side plate 24 and bottom plate 123 of the housing 20, 120, but the heat sinks 30, 130 can also be located on the top plate 21, 121 of the housing 20, 120. The inventions described in the original claims of this application are set forth below. [Appendix 1] a housing in which components are installed and an opening is formed on one outer surface; a heat sink disposed in the open portion of the housing, the heat sink having an inner surface inside the housing and having at least one of the components disposed thereon, and the other surface outside the housing. [Appendix 2] The submodule described in Appendix 1, wherein the opening is formed in one of the side panels of the housing, and the heat sink is installed therein. [Appendix 3] The submodule described in Appendix 1, wherein the opening is formed in the upper plate of the housing and the heat sink is installed therein. [Appendix 4] 2. The submodule described in Appendix 1, wherein the opening is formed in the bottom plate of the housing and the heat sink is installed therein. [Appendix 5] A submodule as described in Appendix 1, wherein a flow path through which a cooling fluid flows is formed inside the heat sink, and the flow path is connected to the outside via an inlet and an outlet provided on one side of the heat sink. [Appendix 6] 6. The submodule according to any one of claims 1 to 5, wherein a first terminal and a second terminal for electrical connection with adjacent submodules are provided on the front panel of the housing. [Appendix 7] A submodule described in any one of appendix 1 to 5, wherein a first terminal for electrical connection with an adjacent submodule is provided on the front panel of the housing, and a second terminal is provided on the heat sink. [Appendix 8] a housing having a hexahedral shape, with components installed inside and an opening formed on one outer surface; a heat sink disposed in the opening of the housing, the inner surface of which is inside the housing and on which at least one of the components is disposed, and which forms an outer surface of one side of the housing; A flow path through which a cooling fluid flows is formed inside the heat sink, and the flow path communicates with the outside through an inlet and an outlet provided on one side of the heat sink. [Appendix 9] The submodule described in Appendix 8, wherein the opening is formed in one of the top plate, side plate, and bottom plate of the housing, and the heat sink is installed to cover the opening and forms an outer surface of one side of the housing. [Appendix 10] 10. The submodule of claim 9, wherein a first terminal and a second terminal for electrical connection between adjacent submodules are provided on the front panel of the housing. [Appendix 11] A submodule as described in Appendix 9, wherein a first terminal for electrical connection with an adjacent submodule is provided on the front panel of the housing, and a second terminal for electrical connection with an adjacent submodule is also provided on the heat sink.

Claims

1. a housing in which components are installed and an opening is formed on one outer surface; a heat sink disposed in the open portion of the housing, the heat sink having an inner surface inside the housing on which at least one of the components is disposed and the other surface outside the housing; a first terminal for electrical connection with an adjacent sub-module is provided on a front panel of the housing, and a second terminal for electrical connection with an adjacent sub-module is provided integrally with the heat sink on an outer surface of the heat sink located outside the housing; A submodule is provided inside the heat sink, through which a cooling fluid flows, and the flow path communicates with the outside through an inlet and an outlet provided on one side of the heat sink.

2. The sub-module according to claim 1 , wherein the opening is formed in one of the side plates of the housing, and the heat sink is installed in the opening.

3. The sub-module according to claim 1 , wherein the opening is formed in an upper plate of the housing, and the heat sink is disposed in the opening.

4. a housing having a hexahedral shape, with components installed inside and an opening formed on one outer surface; a heat sink disposed in the opening of the housing, the inner surface of which is inside the housing and on which at least one of the components is disposed, and which forms an outer surface of one side of the housing; A flow path through which a cooling fluid flows is formed inside the heat sink, and the flow path communicates with the outside through an inlet and an outlet provided on one side of the heat sink, A submodule in which a first terminal for electrical connection with an adjacent submodule is provided on the front panel of the housing, and a second terminal for electrical connection with an adjacent submodule is integrally provided on the outer surface of a heat sink located outside the housing.

5. The submodule according to claim 4 , wherein the opening is formed in one of the top plate and the side plate of the housing, and the heat sink is installed to close the opening and forms an outer surface of one side of the housing.

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