Electronic component module and wireless communication device including same

Abstract

This electronic component module that is attached using a hot melt adhesive agent to a member provided with a conductor pattern comprises: a first base; a coupling electrode that is provided on a first surface of the first base for electromagnetic coupling with the conductor pattern; and a second base that is provided on the first surface of the first base to cover the coupling electrode. The thermal resistance between the coupling electrode and the second base is smaller than the thermal resistance between the coupling electrode and the first base.

Description

[Technical Field]

[0001] The present disclosure relates to an electronic component module and a wireless communication device including the same. [Background technology]

[0002] For example, Patent Document 1 discloses a method for manufacturing an RFID tag (wireless communication device) in which a base film (member) provided with an antenna pattern (conductor pattern) is transported to a mounting position, and an RFIC (Radio-Frequency Integrated Circuit) element (electronic component module) with a seal is attached to the antenna pattern at the mounting position. The RFIC element with a seal attached to tape is picked up, and the picked-up RFIC element with a seal is attached (fixed) to the antenna pattern. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 012391 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the manufacturing method described in Patent Document 1, the RFIC element with the seal needs to be picked up while being peeled off from the tape, which takes time to pick up, and there are also cases where peeling of the RFIC element fails.

[0005] One possible method for attaching electronic component modules to components is to use hot melt adhesive. Hot melt adhesives are easier to handle than stickers because they remain in a hardened state except when being attached. However, the hot melt adhesive must be heated to soften the entire surface during attachment, which takes time.

[0006] Therefore, an object of the present disclosure is to attach an electronic component module to a member having a conductive pattern via a hot melt adhesive in a short time. [Means for solving the problem]

[0007] In order to solve the above technical problem, according to one aspect of the present disclosure, An electronic component module that is attached to a member having a conductor pattern via a hot melt adhesive, a first substrate; a coupling electrode provided on a first surface of the first base material on the member side and electromagnetically coupled to the conductor pattern; a second substrate provided on the first surface of the first substrate so as to cover the coupling electrode; An electronic component module is provided in which the thermal resistance between the coupling electrode and the second substrate is smaller than the thermal resistance between the coupling electrode and the first substrate.

[0008] According to another aspect of the present disclosure, the electronic component module; and an antenna member having an antenna pattern that is electromagnetically coupled with the coupling electrode of the electronic component module, the antenna member being attached to the electronic component module via a hot melt adhesive. [Effects of the Invention]

[0009] According to the present disclosure, an electronic component module can be attached to a member having a conductive pattern via a hot melt adhesive in a short time. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view of a wireless communication device according to an embodiment of the present disclosure; [Figure 2] Top view of a wireless communication device [Figure 3] Exploded perspective view of RFIC module [Figure 4] Exploded perspective view of electronic components in an RFIC module [Figure 5] Equivalent circuit diagram of a wireless communication device [Figure 6] A cross-sectional view of a portion of a wireless communication device including an RFIC module immediately before attachment. [Figure 7] FIG. 10 is an exploded perspective view of an RFIC module according to another embodiment of the present disclosure. [Figure 8] 1 is a top view of a wireless communication device according to another embodiment of the present disclosure; [Figure 9] 1 is an exploded perspective view of an RFIC module in a wireless communication device according to a different embodiment; [Figure 10] 1 is an exploded perspective view of electronic components in an RFIC module of a wireless communication device according to a different embodiment; [Figure 11] 10 is a top view of a wireless communication device according to a modified example of a different embodiment. [Figure 12] 10 is a top view of a wireless communication device according to another modified example of a different embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0012] Fig. 1 is a perspective view of a wireless communication device according to an embodiment of the present disclosure, and Fig. 2 is a top view of the wireless communication device. The XYZ coordinate system in the figures is provided to facilitate understanding of the present disclosure and is not intended to limit the present disclosure. The X-axis direction indicates the longitudinal direction of the wireless communication device, the Y-axis direction indicates the width direction, and the Z-axis direction indicates the thickness direction.

[0013] As shown in FIGS. 1 and 2, the wireless communication device 10 is strip-shaped and is used as a so-called RFID (Radio-Frequency Identification) tag.

[0014] Specifically, as shown in FIGS. 1 and 2, the wireless communication device 10 has an antenna member 12 and an RFIC (Radio-Frequency Integrated Circuit) module 14 provided on the antenna member 12.

[0015] The antenna member 12 of the wireless communication device 10 is strip-shaped (long, thin rectangular) and comprises an antenna substrate 16 and antenna patterns 18A and 18B provided on one surface 16a of the antenna substrate 16 (first main surface 12a of the antenna member 12).

[0016] The antenna substrate 16 is a flexible sheet-like member made of an insulating material such as polyimide resin. As shown in Figures 1 and 2, the antenna substrate 16 also has surfaces 16a and 16b that function as the first and second main surfaces 12a and 12b of the antenna member 12. Since the antenna substrate 16, which is a main component of the antenna member 12, is flexible, the antenna member 12 can also be flexible.

[0017] The antenna patterns 18A and 18B are used as antennas for wireless communication between the wireless communication device 10 and an external communication device (for example, a reader / writer device when the wireless communication device 10 is used as an RFID tag). In this embodiment, the antenna patterns 18A and 18B are conductor patterns made of metal foil such as silver, copper, or aluminum.

[0018] The antenna patterns 18A and 18B include radiating portions 18Aa and 18Ba for transmitting and receiving radio waves, and coupling portions 18Ab and 18Bb for electrically connecting to the RFIC module 14.

[0019] In this embodiment, the radiating portions 18Aa and 18Ba of the antenna patterns 18A and 18B are dipole antennas having a meandering shape, and extend from coupling portions 18Ab and 18Bb, respectively, provided at the center of the antenna substrate 16 in the longitudinal direction (X-axis direction) toward both ends of the antenna substrate 16.

[0020] The coupling portions 18Ab and 18Bb of the antenna patterns 18A and 18B, which will be described in detail later, are electrically connected to coupling electrodes of the RFIC module 14. Each of the coupling portions 18Ab and 18Bb is a rectangular land.

[0021] Fig. 3 is an exploded perspective view of the RFIC module, Fig. 4 is an exploded perspective view of electronic components in the RFIC module, and Fig. 5 is an equivalent circuit diagram of the wireless communication device.

[0022] As shown in FIGS. 3 and 4, the RFIC module 14 is a device that performs wireless communication via antenna patterns 18A and 18B at a communication frequency in the 900 MHz band, ie, the UHF band.

[0023] 3, in this embodiment, the RFIC module 14 is an electronic component module with a multilayer structure including an electronic component 20. Specifically, the RFIC module 14 includes the electronic component 20 and a hot melt adhesive layer 22 for attaching the electronic component 20 to the antenna member 12. Furthermore, in this embodiment, the RFIC module 14 includes a bottom sheet 24 (second substrate) interposed between the electronic component 20 and the hot melt adhesive layer 22, a top sheet 26, and an adhesive sheet 28 for adhering the top sheet 26 to the electronic component 20.

[0024] As shown in FIG. 4, the electronic component 20 in the RFIC module 14 includes a base sheet 30 (first substrate), an RFIC chip 32 mounted on one surface 30a of the base sheet 30, a conductive pattern 34 formed on one surface 30a of the base sheet 30, and a conductive pattern 36 formed on the other surface 30b (first surface) of the base sheet 30 opposite the one surface 30a.

[0025] The base sheet 30 in the electronic component 20 of the RFIC module 14 is a thin insulating sheet made of an insulating material such as polyimide or liquid crystal polymer.

[0026] The RFIC chip 32 is an IC chip that operates at a UHF frequency (communication frequency) and has a structure in which various elements are built into a semiconductor substrate made of a semiconductor such as silicon. The RFIC chip 32 also has a first input / output terminal 32a and a second input / output terminal 32b. Furthermore, as shown in Fig. 5, the RFIC chip 32 has an internal capacitance (capacitance: self-capacitance of the RFIC chip itself) C1.

[0027] The conductive pattern 34 is a pattern made of a conductive material such as silver, copper, aluminum, etc. The conductive pattern 34 includes two spiral coil portions 38 and 40.

[0028] A land portion 38a is provided at the outer peripheral end of the coil portion 38 of the conductor pattern 34, and is electrically connected to the first input / output terminal 32a of the RFIC chip 32 via, for example, solder (not shown). A land portion 38b is provided at the center end of the coil portion 38, and is electrically connected to the conductor pattern 36. A land portion 38d is also provided at the tip of a branch portion 38c that branches off from a portion of the coil portion 38 between the outer peripheral end (land portion 38a) and the center end (land portion 38b), and is electrically connected to the conductor pattern 36.

[0029] As shown in FIG. 5, the coil portion 38 functions as an inductance element having an inductance L1.

[0030] A land portion 40a is provided at the outer peripheral end of the coil portion 40 of the conductor pattern 34, and is electrically connected to the second input / output terminal 32b of the RFIC chip 32 via, for example, solder (not shown). A land portion 40b is provided at the center end of the coil portion 40, and is electrically connected to the conductor pattern 36. A land portion 40d is also provided at the tip of a branch portion 40c that branches off from a portion of the coil portion 40 between the outer peripheral end (land portion 40a) and the center end (land portion 40b), and is electrically connected to the conductor pattern 36.

[0031] As shown in FIG. 5, the coil portion 40 functions as an inductance element having an inductance L2.

[0032] The conductive pattern 36 is a pattern made of a conductive material such as silver, copper, aluminum, etc. The conductive pattern 36 includes two spiral coil portions 42 and 44 and two coupling electrodes 46 and 48.

[0033] A land portion 42a is provided at the center side end of the coil portion 42 in the conductor pattern 36. The land portion 42a is electrically connected to the land portion 38b of the coil portion 38 in the conductor pattern 34 via an interlayer connection conductor 50 such as a through-hole conductor that penetrates the base sheet 30.

[0034] As shown in FIG. 5, the coil portion 42 functions as an inductance element having an inductance L3.

[0035] A land portion 44a is provided at the center side end of the coil portion 44 of the conductor pattern 36. The land portion 44a is connected to the land portion 40b of the coil portion 40 of the conductor pattern 34 via an interlayer connection conductor 52 such as a through-hole conductor that penetrates the base sheet 30.

[0036] As shown in FIG. 5, the coil portion 44 functions as an inductance element having an inductance L4.

[0037] The outer circumferential ends of the two coil portions 42, 44 are electrically connected via a connecting portion 54. The connecting portion 54 functions as an inductance element having an inductance L5.

[0038] The coupling electrodes 46, 48 of the conductor pattern 36 are electrodes for capacitive coupling with the coupling portions 18Ab, 18Bb of the antenna patterns 18A, 18B of the antenna member 12. In this embodiment, the coupling electrodes 46, 48 are rectangular and arranged with a gap between them. The coil portions 42, 44 and the connection portion 54 are arranged between the coupling electrodes 46, 48.

[0039] The coupling electrode 46 is electrically connected to the land portion 38d of the coil portion 38 in the conductor pattern 34 via an interlayer connection conductor 56 such as a through-hole conductor that penetrates the base sheet 30. The coupling electrode 48 is electrically connected to the land portion 40d of the coil portion 40 via an interlayer connection conductor 58.

[0040] 5, a matching circuit 60 is formed by the coil portions 38, 40 in the conductor pattern 34, the coil portions 42, 44 and the connection portion 54 in the conductor pattern 36, and the self-capacitance C1 of the RFIC chip 32. This matching circuit 60 matches the impedance between the RFIC chip 32 and the coupling electrodes 46, 48 at a predetermined frequency (communication frequency).

[0041] 3, a hot melt adhesive layer 22 is provided on the other surface 30b (i.e., the surface on the antenna member 12 side) of the base sheet 30 of the electronic component 20 of the RFIC module 14. Specifically, in the case of the present embodiment, the hot melt adhesive layer 22 is provided on the other surface 30b of the base sheet 30 with a bottom sheet 24 (second substrate) interposed between the other surface 30b of the base sheet 30 and the hot melt adhesive layer 22. In addition, the hot melt adhesive layer 22 is provided on the base sheet 30 so as to cover the coupling electrodes 46, 48.

[0042] The hot melt adhesive constituting the hot melt adhesive layer 22 softens (partially melts) when heated from a hardened state, and hardens again when cooled in the softened state. In this embodiment, the hot melt adhesive is, for example, an EVA-based thermoplastic resin that maintains its hardened state and does not deform at the temperature of the environment in which the wireless communication device 10 is used. In this embodiment, the hot melt adhesive layer 22 in its hardened state has insulating properties. Furthermore, in this embodiment, the hot melt adhesive layer 22 has a melting temperature that is lower than that of other components of the RFIC module 14, such as the base sheet 30, for example, a melting temperature of 70 to 200 degrees Celsius. When bonding, the hot melt adhesive layer 22 is softened by heating to, for example, about 95 degrees Celsius.

[0043] FIG. 6 is a cross-sectional view of a part of a wireless communication device including an RFIC module immediately before attachment.

[0044] As shown in FIG. 6, the hot melt adhesive layer 22 is interposed between the RFIC module 14 and the antenna member 12, bonding them together. Specifically, the RFIC module 14 is bonded to the antenna member 12 with the coupling electrode 46 facing the coupling portion 18Ab of the antenna pattern 18A and the coupling electrode 48 facing the coupling portion 18Bb of the antenna pattern 18B. Therefore, the coupling electrode 46 and the coupling portion 18Ab are capacitively coupled with the hot melt adhesive layer 22 and the bottom sheet 24 interposed therebetween (forming capacitance C2 as shown in FIG. 5). Furthermore, the coupling electrode 48 and the coupling portion 18Bb are capacitively coupled with the hot melt adhesive layer 22 and the bottom sheet 24 interposed therebetween (forming capacitance C3).

[0045] The bottom sheet 24 (second substrate) interposed between the base sheet 30 and the hot melt adhesive layer 22 is made of an insulating material such as epoxy resin. The bottom sheet 24 is provided on the other surface 30b of the base sheet 30 so as to cover the coupling electrodes 46, 48. The hot melt adhesive layer 22 is provided on the surface of the bottom sheet 24 opposite the surface facing the base sheet 30. The bottom sheet 24 is bonded to the base sheet 30 by, for example, thermocompression bonding.

[0046] The bottom sheet 24 protects the conductor pattern 36, including the coupling electrodes 46, 48, on the other surface 30b of the base sheet 30. At the same time, the bottom sheet 24 suppresses variations in the distance between the coupling electrode 46 and the coupling portion 18Ab of the antenna pattern 18A and the distance between the coupling electrode 48 and the coupling portion 18Bb of the antenna pattern 18B, i.e., variations in the capacitance therebetween.

[0047] For example, if only the hot melt adhesive layer 22 is present between the coupling electrode 46 and the coupling portion 18Ab, it is difficult to control the distance therebetween. That is, when the RFIC module 14 is attached to the antenna member 12, it is necessary to control the thickness of the hot melt adhesive layer 22 so as not to short-circuit the coupling electrode 46 and the coupling portion 18Ab. In contrast, if the bottom sheet 24 is present between the coupling electrode 46 and the coupling portion 18Ab, the thickness of the bottom sheet 24 is constant, so that the coupling electrode 46 and the coupling portion 18Ab are not short-circuited. This makes it possible to suppress variations in the distance between the coupling electrode 46 and the coupling portion 18Ab that could cause a short circuit.

[0048] The top sheet 26 is a sheet-like member made of a resin material such as PET (polyethylene terephthalate) and is provided on one surface 30a of the base sheet 30. The top sheet 26 is adhered to the base sheet 30 via an adhesive sheet 28 made of, for example, epoxy resin. This allows the top sheet 26 (and adhesive sheet 28) to protect the IC chip 32 and conductor pattern 34 provided on one surface 30a of the base sheet 30. Here, the adhesive sheet 28 is not limited to a thermosetting resin material. An adhesive other than a thermosetting resin material, such as a hot melt adhesive, may also be used. This improves the adhesive strength between the top sheet 26 and the base sheet 30, and also improves the flexibility of the RFIC module if the hot melt adhesive is softer than the thermosetting resin.

[0049] According to such wireless communication device 10, when antenna patterns 18A, 18B receive radio waves (signals) at a predetermined frequency (communication frequency) in the UHF band, a current corresponding to the signal flows from antenna patterns 18A, 18B to RFIC chip 32. RFIC chip 32 is driven by the current and outputs a current (signal) corresponding to information stored in its internal storage unit (not shown) to antenna patterns 18A, 18B. Then, radio waves (signals) corresponding to the current are radiated from antenna patterns 18A, 18B.

[0050] So far, the configuration of the wireless communication device 10 according to this embodiment has been described. From here on, a method for adhering the RFIC module 14 to the antenna member 12 via the hot melt adhesive layer 22 will be described.

[0051] 6, when adhering the RFIC module 14 to the antenna member 12, first, the RFIC module 14 is placed on the antenna member 12. For example, the RFIC module 14 is placed on the antenna member 12 by a mounting device (not shown). When the RFIC module 14 is placed on the antenna member 12, the hot melt adhesive layer 22 is in a cured state and does not have any adhesive properties.

[0052] When the RFIC module 14 is placed on the antenna member 12, the hot melt adhesive layer 22 is heated and softened. In the present embodiment, a heating device (not shown) that emits laser light LL (white arrow) is used to heat the hot melt adhesive layer 22. The RFIC module 14 is configured so that the hot melt adhesive layer 22 can be heated using the laser light LL.

[0053] Specifically, as shown in FIG. 6 , laser light LL has a wavelength of, for example, approximately 900 nm and is irradiated not on the hot melt adhesive layer 22 but on the coupling electrodes 46, 48 covered by the hot melt adhesive layer 22. The coupling electrodes 46, 48 are heated by the laser light LL and reach a high temperature throughout. Heat H (indicated by black arrows) is transferred from the coupling electrodes 46, 48, which are in a high temperature state throughout, to the hot melt adhesive layer 22, resulting in the hot melt adhesive layer 22 being heated and softened throughout. In other words, the coupling electrodes 46, 48 function as a heat spreader. In contrast, if the laser light LL were directly irradiated on the hot melt adhesive layer 22, there is a possibility that the portion irradiated with the laser light LL would excessively melt, e.g., liquefy, before the hot melt adhesive layer 22 softens throughout.

[0054] When the coupling electrodes 46, 48 functioning as heat spreaders are heated using laser light LL in this manner, it is preferable that the coupling electrodes 46, 48 be made of a material with high light absorption. For this reason, it is preferable that the coupling electrodes 46, 48 be made of copper. If the coupling electrodes 46, 48 are made of copper, an oxide film (copper oxide layer) with high light absorption is formed on the surface of the coupling electrodes 46, 48. As a result, the laser light LL is absorbed by the coupling electrodes 46, 48 without being reflected.

[0055] In order to efficiently heat the hot melt adhesive layer 22 via the coupling electrodes 46, 48, the thermal resistance between the coupling electrodes 46, 48 and the hot melt adhesive layer 22 is set smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30. Note that the term "thermal resistance" used in this specification refers to a numerical value that indicates how difficult it is for heat to be transmitted, and the larger the value, the more difficult it is for heat to be transmitted.

[0056] In this embodiment, the bottom sheet 24 is interposed between the coupling electrodes 46, 48 and the hot melt adhesive layer 22. Therefore, the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24 is smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30.

[0057] Due to this difference in thermal resistance, most of the heat generated in the coupling electrodes 46, 48 heated by the laser light LL is transferred to the hot melt adhesive layer 22 via the bottom sheet 24. This allows the hot melt adhesive layer 22 to be softened efficiently in a short time.

[0058] In order to make the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24 smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30, in this embodiment, conductive particles such as carbon particles and aluminum particles are dispersed in the bottom sheet 24.

[0059] In this embodiment, the base sheet 30 is made of polyimide, and the bottom sheet 24 is made of epoxy resin. The thermal conductivity of the former is 0.28 to 0.34 [W / m·K], and the latter is 0.3 [W / m·K]. Therefore, the thermal conductivities of the materials themselves of the base sheet 30 and the bottom sheet 24 are almost the same. In other words, the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30 is substantially the same as the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24. Therefore, in this embodiment, conductive particles are dispersed in the bottom sheet 24.

[0060] When conductive particles with high thermal conductivity are dispersed in the bottom sheet 24, heat is more easily transferred from the coupling electrodes 46, 48 into the bottom sheet 24. On the other hand, conductive particles are not dispersed in the base sheet 30. This allows the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24 to be smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet, even if the thermal conductivity of the materials of the bottom sheet 24 and the base sheet 30 is substantially the same. Therefore, most of the heat H generated in the coupling electrodes 46, 48 can be transferred to the bottom sheet 24, rather than to the base sheet 30.

[0061] In addition to or instead of dispersing conductive particles within the bottom sheet 24, the bottom sheet 24 may be made from a material with a thermal conductivity that is higher than that of the material of the base sheet 30. This also allows the thermal resistance between the coupling electrodes 46, 48 and the bottom sheet 24 to be lower than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30.

[0062] 6, in the present embodiment, the laser light LL passes through the top sheet 26, the adhesive sheet 28, and the base sheet 30 to reach the coupling electrodes 46, 48. For this reason, the top sheet 26, the adhesive sheet 28, and the base sheet 30 are made of materials that are light-transmitting. In particular, the base sheet 30 is preferably made of a material with a lower light absorptance than that of the coupling electrodes 46, 48. This allows a higher amount of laser light LL to reach the coupling electrodes 46, 48.

[0063] 2 and 3, the RFIC chip 32 is provided on one surface 30a of the base sheet 30. The RFIC chip 32 is provided on the one surface 30a so as not to overlap the coupling electrodes 46, 48 in a plan view of the base sheet 30 (viewed in the Z-axis direction). Specifically, in this embodiment, the coupling electrodes 46, 48 are arranged at intervals in the longitudinal direction (X-axis direction). The RFIC chip 32 is located between the coupling electrodes 46, 48. This prevents the laser light LL from hitting the RFIC chip 32 and allows the laser light LL to reach the coupling electrodes 46, 48 without being obstructed by the RFIC chip 32.

[0064] As described above, according to this embodiment, the RFIC module 14 can be attached to the antenna member 12 including the antenna patterns 18A and 18B via the hot melt adhesive layer 22 in a short time.

[0065] Although the present disclosure has been described above with reference to the above-described embodiment, the present disclosure is not limited to this embodiment.

[0066] For example, in the above-described embodiment, as shown in Fig. 3, in the RFIC module 14, an insulating bottom sheet 24 is interposed between the electronic component 20 and the hot melt adhesive layer 22. However, the embodiment of the present disclosure is not limited to this.

[0067] FIG. 7 is an exploded perspective view of an RFIC module according to another embodiment of the present disclosure.

[0068] 7 , in an RFIC module 114 according to another embodiment, a hot melt adhesive layer 122 is provided directly on the electronic component 20, similar to the bottom sheet 24 of the above-described embodiment, and covers the coupling electrodes 46, 48. In this case, the thermal resistance between the coupling electrodes 46, 48 and the hot melt adhesive layer 122 is made smaller than the thermal resistance between the coupling electrodes 46, 48 and the base sheet 30.

[0069] 3, the hot melt adhesive layer 22 that bonds the RFIC module 14 and the antenna member 12 is provided on the RFIC module 14. However, the embodiment of the present disclosure is not limited to this. The hot melt adhesive layer 22 may be provided on the antenna member 12.

[0070] Furthermore, in the above-described embodiment, the coupling electrodes 46, 48 are heated by irradiation with laser light LL, as shown in Fig. 6. This is because the coupling electrodes 46, 48 are not exposed to the outside. However, the embodiment of the present disclosure is not limited to this. For example, a portion of the coupling electrodes 46, 48 may be exposed, a heat transfer member may be brought into contact with the exposed portion, and the heat transfer member may be heated.

[0071] Furthermore, in the above-described embodiment, in the wireless communication device 10, the coupling electrodes 46, 48 of the electronic component 20 in the RFIC module 14 are capacitively coupled to the coupling portions 18Ab, 18Bb of the antenna patterns 18A, 18B of the antenna member 12. Therefore, as shown in FIGS. 2 and 6, the coupling electrodes 46, 48 face the coupling portions 18Ab, 18Bb at an interval in the thickness direction (Z-axis direction) of the wireless communication device 10. That is, they are electric field coupled. However, the embodiments of the present disclosure are not limited to electric field coupling.

[0072] Fig. 8 is a top view of a wireless communication device according to another embodiment of the present disclosure, Fig. 9 is an exploded perspective view of an RFIC module in the wireless communication device according to another embodiment, and Fig. 10 is an exploded perspective view of electronic components in the RFIC module of the wireless communication device according to another embodiment.

[0073] 8, in a wireless communication device 210 according to a different embodiment, an antenna member 212 includes an antenna pattern 218 that is magnetically coupled with an RFIC module 214. When viewed in the thickness direction (Z-axis direction) of the wireless communication device 210, the antenna pattern 218 includes a substantially C-shaped coupling portion 218a that is provided so as to surround the RFIC module 214, and linear radiation portions 218b and 218c that extend in opposite directions from both ends of the coupling portion 218a.

[0074] 9, the RFIC module 214 includes an electronic component 220, a bottom sheet 24 interposed between the electronic component 220 and the hot melt adhesive layer 22, a top sheet 26, and an adhesive sheet 28 for adhering the top sheet 26 to the electronic component 220. The bottom sheet 24 may be omitted.

[0075] 10 , electronic component 220 includes base sheet 230, RFIC chip 232 provided on base sheet 230, and coil conductor 246 (coupling electrode) provided on base sheet 230 and electrically connected to RFIC chip 232. Coil conductor 246 includes a spiral conductor pattern 248 provided on one surface 230a of base sheet 230, a spiral conductor pattern 250 provided on the other surface 230b, and interlayer connection conductors 252, 254 such as through-hole conductors that penetrate base sheet 230 and electrically connect conductor patterns 248, 250. Coil conductor 246 is provided on base sheet 230 so as to surround RFIC chip 232 when viewed in the thickness direction (Z-axis direction) of wireless communication device 210.

[0076] In such wireless communication device 210, when antenna pattern 218 receives radio waves, a current flows through coupling portion 218a of antenna pattern 218, causing coupling portion 218a to generate a magnetic field. This magnetic field causes a current to flow through coil conductor 246 of electronic component 220 of RFIC module 214. RFIC chip 232 is driven by the current and outputs a current corresponding to information stored in its internal memory (not shown) to coil conductor 246. Coil conductor 246 generates a magnetic field corresponding to the output current, and this magnetic field causes a current to flow through coupling portion 218a of antenna pattern 218. As a result, antenna pattern 218 radiates radio waves corresponding to the current.

[0077] Furthermore, in the RFIC module 214, the coil conductor 246 is heated by irradiation with laser light. The hot melt adhesive layer 22 is heated and softened by the coil conductor 246, and as a result, the RFIC module 214 is bonded to the antenna member 212 via the hot melt adhesive layer 22.

[0078] There are various types of antenna patterns that can be magnetically coupled with the RFIC module 214.

[0079] 11 and 12 are top views of wireless communication devices according to different modified embodiments.

[0080] For example, as shown in FIG. 11, in one modified example of a wireless communication device 310, an antenna pattern 318 includes a substantially "C"-shaped coupling portion 318a arranged to surround the RFIC module 214, and meandering radiating portions 318b and 318c extending in opposite directions from both ends of the coupling portion 318a.

[0081] 12 , in a wireless communication device 410 according to another modification, an antenna pattern 418 includes linear radiating portions 418a and 418b extending parallel to each other with a gap therebetween, and a connecting portion 418c connecting one ends of the radiating portions 418a and 418b to each other. The RFIC module 214 is surrounded by the two radiating portions 418a and 418b and the connecting portion 418c. This allows the RFIC module 214 to be magnetically coupled to the antenna pattern 418.

[0082] Additionally, in the above-described embodiment, the electronic component module and member bonded via the hot melt adhesive layer 22 are the RFIC module 14 and antenna member 12 in the wireless communication device, but the embodiments of the present disclosure are not limited to this.

[0083] That is, various aspects of the present disclosure are as follows.

[0084] The first aspect is an electronic component module that is attached to a member having a conductor pattern via a hot melt adhesive, and that has: a first substrate; a coupling electrode that is provided on a first surface of the first substrate on the member side and that is electromagnetically coupled to the conductor pattern; and a second substrate that is provided on the first surface of the first substrate so as to cover the coupling electrode, and the thermal resistance between the coupling electrode and the second substrate is smaller than the thermal resistance between the coupling electrode and the first substrate.

[0085] A second aspect is the electronic component module of the first aspect, further comprising a layer of the hot melt adhesive provided on the surface of the second substrate opposite the surface facing the first substrate.

[0086] A third aspect is the electronic component module of the first or second aspect, wherein conductive particles are dispersed in the second base material.

[0087] A fourth aspect is an electronic component module according to any one of the first to third aspects, wherein the second substrate is made of a material having a thermal conductivity higher than that of the material of the first substrate.

[0088] A fifth aspect is the electronic component module of the first aspect, in which the second substrate is a layer of the hot melt adhesive.

[0089] A sixth aspect is an electronic component module of any one of the first to fifth aspects, wherein the first substrate is made of a material having a lower optical absorbance than the optical absorbance of the coupling electrode.

[0090] A seventh aspect is an electronic component module according to any one of the first to sixth aspects, further comprising an IC chip provided on a second surface of the first substrate opposite the first surface and electrically connected to the coupling electrode, the IC chip being provided on the second surface so as not to overlap the coupling electrode in a planar view of the first substrate.

[0091] An eighth aspect is a wireless communication device having an electronic component module according to any one of the first to seventh aspects, and an antenna member having an antenna pattern that is electromagnetically coupled with a coupling electrode of the electronic component module, and to which the electronic component module is attached via a hot melt adhesive. [Industrial Applicability]

[0092] The present disclosure is applicable when an electronic component module including a coupling electrode and a member including a conductor pattern that is capacitively or magnetically coupled to the coupling electrode are attached via a hot melt adhesive.

Claims

1. An electronic component module that is attached to a member having a conductor pattern via a hot melt adhesive, a first substrate; a coupling electrode provided on a first surface of the first base material on the member side and electromagnetically coupled to the conductor pattern; a second substrate provided on the first surface of the first substrate so as to cover the coupling electrode; an electronic component module, wherein the thermal resistance between the coupling electrode and the second substrate is smaller than the thermal resistance between the coupling electrode and the first substrate;

2. The electronic component module according to claim 1 , further comprising a layer of the hot melt adhesive provided on a surface of the second substrate opposite to the surface facing the first substrate.

3. The electronic component module according to claim 1 , wherein conductive particles are dispersed within the second base material.

4. 10. The electronic component module of claim 1, wherein the second substrate is made of a material with a thermal conductivity that is higher than the thermal conductivity of the material of the first substrate.

5. The electronic component module according to claim 1 , wherein the second substrate is a layer of the hot melt adhesive.

6. The electronic component module according to claim 1 , wherein the first substrate is made of a material having a lower optical absorption rate than that of the coupling electrodes.

7. an IC chip provided on a second surface of the first substrate opposite to the first surface and electrically connected to the coupling electrode; The electronic component module according to claim 1 , wherein the IC chip is provided on the second surface so as not to overlap the coupling electrodes in a plan view of the first base material.

8. The electronic component module according to any one of claims 1 to 7; an antenna member having an antenna pattern that is electromagnetically coupled with a coupling electrode of the electronic component module, and to which the electronic component module is attached via a hot melt adhesive; Wireless communication devices.

Images