Drive circuit and solid-state image sensor

Abstract

The present invention achieves both an increase in transmission speed and noise suppression in a circuit in which a driver is disposed.　This drive circuit comprises a drive unit and a transformer. In the drive circuit comprising the drive unit and the transformer, the transformer is provided with a plurality of magnetically coupled coils. Further, in the drive circuit, the drive unit supplies a non-differential signal or a differential signal to the transformer provided with the plurality of magnetically coupled coils.

Description

[Technical Field]

[0001] The present technology relates to a drive circuit, and more particularly to a drive circuit that transmits a differential signal or a single-phase signal, and a solid-state imaging device. [Background technology]

[0002] Conventionally, a driver such as a differential driver has been arranged in the transmission circuit of an interface such as MIPI (Mobile Industry Processor Interface). The larger the output capacitance of this circuit, the longer the rise time and fall time of the transmitted signal, resulting in a decrease in transmission speed. Therefore, in order to shorten the rise time and fall time, an electronic component has been proposed in which a coil is inserted in the transmission path on the output side of the differential driver (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5872710 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned conventional technology, the transmission speed is improved by inserting a coil. However, if the inductance of the coil is large, the rise and fall times become steep, making it difficult to suppress noise caused by EMI (Electro Magnetic Interference). As such, it is difficult to achieve both an improvement in transmission speed and noise suppression with the above-mentioned electronic components.

[0005] This technology was developed in light of these circumstances, and aims to achieve both improved transmission speed and noise suppression in circuits in which drivers are placed. [Means for solving the problem]

[0006] The present technology has been made to solve the above-mentioned problems, and a first aspect thereof is a drive circuit including a transformer having a plurality of magnetically coupled coils and a drive unit that supplies either a non-differential signal or a differential signal to the transformer, the plurality of coils including first and second coils that are magnetically coupled, the drive unit being connected to one end of the first coil and one end of the second coil, such that when a common-mode current is caused to flow into the one end of each of the first and second coils, the magnetic fluxes generated by the first and second coils weaken each other, thereby reducing inductance during non-differential signal transmission.

[0007] In addition, in this first aspect, the drive unit may supply the differential signal to one end of the first coil and one end of the second coil, and the drive unit may supply the differential signal to one end of the first coil and one end of the second coil, thereby providing an effect of transmitting a signal via two wires.

[0008] In addition, in this first aspect, a first ESD protection diode connected to a node between both ends of the first coil and a second ESD protection diode connected to a node between both ends of the second coil may be further provided, thereby improving the waveform.

[0009] In addition, in this first aspect, the drive unit may include a shared driver that supplies either the differential signal or the non-differential signal, and an output voltage control unit that controls an output voltage of the shared driver, thereby providing an effect of reducing the number of drivers.

[0010] In this first aspect, the drive unit may be disposed on a predetermined semiconductor chip, and the transformer may be disposed outside the semiconductor chip, thereby reducing the circuit scale of the semiconductor chip.

[0011] In addition, in this first aspect, the drive unit may include a differential driver that supplies the differential signal and a non-differential driver that supplies the non-differential signal, thereby providing an effect that control of the output voltage of the driver is not required.

[0012] In addition, in this first aspect, the output terminal of the non-differential driver may be connected to a node between both ends of either the first or second coil, thereby eliminating the need for connection to a center tap.

[0013] In addition, in this first aspect, the output terminal of the non-differential driver may be connected to the one end of either the first or second coil, thereby providing an effect of improving the waveform.

[0014] In this first aspect, the drive unit may be disposed on a predetermined semiconductor chip, and the transformer may be disposed outside the semiconductor chip, thereby reducing the circuit scale of the semiconductor chip.

[0015] In addition, in this first aspect, the plurality of coils may include magnetically coupled first, second, and third coils, and the driving unit may supply the differential signal to one end of the first coil, one end of the second coil, and one end of the third coil, so that when a common-mode current flows into the one end of each of the second and third coils, the magnetic fluxes generated by the second and third coils weaken each other, thereby providing an effect of transmitting a signal via three wires.

[0016] In addition, in this first aspect, the antenna may further include a receiver that receives a differential signal via first and second signal lines, the driver has first and second output terminals, one end of the first coil is connected to the first output terminal and the other end is connected to the first signal line, and the one end of the second coil is connected to the second output terminal and the other end is connected to the second signal line, thereby providing an effect that the differential signal from the driver is input to the receiver via the first and second coils.

[0017] In addition, in this first aspect, the first and second coils may share a predetermined winding axis, and when viewed from the direction of the winding axis, the winding direction around the winding axis from one end of the first coil connected to the wiring output terminal to the other end connected to the signal line may be opposite to the winding direction around the winding axis from one end of the second coil connected to the wiring output terminal to the other end connected to the signal line. This brings about an effect that when currents of the same phase are applied to the one end connected to the drive of the first coil and the one end connected to the drive unit of the second coil, the magnetic fluxes generated by the respective coils weaken each other.

[0018] A second aspect of the present technology is a solid-state imaging device including: a transformer having a plurality of magnetically coupled coils; a driver that supplies either a non-differential signal or a differential signal to the transformer in accordance with a predetermined control signal; and a logic circuit that specifies either the non-differential signal or the differential signal by the control signal and causes the driver to supply the signal, wherein the plurality of coils include first and second magnetically coupled coils, and the driver is connected to one end of the first coil and one end of the second coil, such that when a common-mode current is applied to the one end of each of the first and second coils, magnetic fluxes generated by the first and second coils weaken each other. This reduces inductance to the non-differential signal when the logic circuit transmits the non-differential signal. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a block diagram showing an example of the configuration of an imaging device according to a first embodiment of the present technology. [Figure 2] 1 is a block diagram showing an example of the configuration of a solid-state imaging device according to a first embodiment of the present technology. [Figure 3] 1 is a circuit diagram showing a configuration example of a drive circuit according to a first embodiment of the present technology. [Figure 4] 1 is a plan view showing a winding direction of a coil according to a first embodiment of the present technology; [Figure 5] FIG. 10 is a circuit diagram showing a configuration example of a drive circuit in a comparative example. [Figure 6] 10 is a diagram for comparing inductance between the first embodiment of the present technology and a comparative example. FIG. [Figure 7] 4 is a timing chart showing an example of the operation of the drive circuit according to the first embodiment of the present technology and a comparative example. [Figure 8] FIG. 10 is a circuit diagram showing a configuration example of a drive circuit according to a second embodiment of the present technology. [Figure 9] FIG. 11 is a circuit diagram showing a configuration example of a drive circuit according to a third embodiment of the present technology. [Figure 10] FIG. 13 is a circuit diagram showing a configuration example of a drive circuit according to a fourth embodiment of the present technology. [Figure 11] FIG. 13 is a circuit diagram showing a configuration example of a drive circuit according to a fifth embodiment of the present technology. [Figure 12] FIG. 20 is a circuit diagram showing a configuration example of a drive circuit according to a sixth embodiment of the present technology. [Figure 13] FIG. 20 is a circuit diagram showing a configuration example of a drive circuit according to a seventh embodiment of the present technology. [Figure 14] FIG. 20 is a circuit diagram showing a configuration example of a drive circuit according to an eighth embodiment of the present technology. [Figure 15] FIG. 13 is a circuit diagram showing a configuration example of a drive circuit according to a ninth embodiment of the present technology. [Figure 16] 1 is a block diagram illustrating a schematic configuration example of a vehicle control system. [Figure 17]FIG. 2 is an explanatory diagram showing an example of an installation position of an imaging unit. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described in the following order. 1. First embodiment (example in which two magnetically coupled coils are provided) 2. Second embodiment (example in which two magnetically coupled coils are provided and a driver is connected to the center tap) 3. Third embodiment (example in which two magnetically coupled coils are provided and a diode is connected) 4. Fourth embodiment (example in which a driver is shared and two magnetically coupled coils are provided) 5. Fifth embodiment (example in which two magnetically coupled coils are arranged outside the chip) 6. Sixth Embodiment (Example in which the third embodiment is applied to the second embodiment) 7. Seventh embodiment (example in which the fourth embodiment is applied to the third embodiment) 8. Eighth embodiment (example in which the fifth embodiment is applied to the fourth embodiment) 9. Ninth embodiment (example in which three magnetically coupled coils are provided) 10. Mobile application examples

[0021] <1. First embodiment> [Configuration example of imaging device] 1 is a block diagram showing an example configuration of an imaging device 100 according to a first embodiment of the present technology. The imaging device 100 is a device for capturing image data, and includes a solid-state imaging element 200 and a receiving unit 130 provided on a mounting substrate 110.

[0022] The solid-state imaging element 200 generates image data by photoelectric conversion. The solid-state imaging element 200 supplies the image data to the receiving unit 130 via a transmission path 120 on a mounting substrate 110. For example, MIPI is used as a standard for the communication interface between the solid-state imaging element 200 and the receiving unit 130. Note that a communication interface other than MIPI can also be used.

[0023] The receiving unit 130 receives image data and performs predetermined image processing on the image data. For example, an application processor is used as the receiving unit 130. As the image processing, image recognition processing and the like are executed.

[0024] [Configuration example of a solid-state imaging device] 2 is a block diagram showing an example of a configuration of a solid-state imaging device 200 according to the first embodiment of the present technology. This solid-state imaging device 200 includes a pixel chip 201 and a circuit chip 202 that are stacked. These chips are electrically connected through a connection portion such as a via. In addition to the via, the chips can also be connected by Cu-Cu bonding or bumps. Connection can also be made by other methods (such as magnetic coupling). Furthermore, although two chips are stacked, three or more layers can also be stacked.

[0025] A plurality of pixels 210 are arranged in a two-dimensional grid pattern on the pixel chip 201. Furthermore, vertical signal lines 219 are wired to the pixel chip 201 for each column of the pixels 210. The pixels 210 generate analog pixel signals using photoelectric conversion elements. The pixels 210 supply the pixel signals to the circuit chip 202 via the vertical signal lines 219.

[0026] The circuit chip 202 includes an analog-to-digital conversion unit 220, a logic circuit 230, a serializer 240, and a drive circuit 300. The analog-to-digital conversion unit 220 performs AD (Analog to Digital) conversion on each pixel signal. The analog-to-digital conversion unit 220 has, for example, an ADC (Analog to Digital Converter) arranged for each column, which converts analog pixel signals into digital signals for each column. The analog-to-digital conversion unit 220 supplies the digital signals for each pixel to the logic circuit 230.

[0027] The logic circuit 230 performs predetermined signal processing on the digital signal. As the signal processing, CDS (Correlated Double Sampling) processing, etc. is executed. The logic circuit 230 outputs the processed digital signal to the serializer 240 in parallel.

[0028] The logic circuit 230 also supplies control signals DIF and SC to the drive circuit 300. These control signals are signals for controlling the drive circuit 300 to either a differential signal output state or a non-differential signal output state.

[0029] The differential signal output state is an operating state in which the drive circuit 300 supplies differential signals. The non-differential signal output state is an operating state in which the drive circuit 300 supplies a pair of signals that undergo either an in-phase transition or a single-phase transition. An in-phase transition means that both of the pair of signals simultaneously transition to a high level or a low level. A single-phase transition means that only one of the pair of signals transitions to a high level or a low level. Hereinafter, a signal that undergoes an in-phase transition will be referred to as an "in-phase signal," and a signal that undergoes a single-phase transition will be referred to as a "single-phase signal." In addition, in-phase signals and single-phase signals will be collectively referred to as "non-differential signals." Note that in the non-differential signal output state, the drive circuit 300 supplies both a single-phase signal and an in-phase signal, but it can also supply only one of them.

[0030] The serializer 240 performs parallel-to-serial conversion on the digital signal from the logic circuit 230. The serializer 240 sequentially supplies the digital signal after parallel-to-serial conversion to the drive circuit 300 bit by bit via signal lines 241 to 244. A differential signal, an in-phase signal, or a single-phase signal is supplied under the control of the logic circuit 230. Two of these four signal lines are used to transmit differential signals, and the remaining two are used to transmit non-differential signals (in-phase signals or single-phase signals). The transmission speed of the differential signal from the serializer 240 is faster than that of the non-differential signal.

[0031] The driver circuit 300 adjusts the amplitude, fall time, and rise time of the digital signal from the serializer 240 to drive the transmission path 120 and the receiving circuit. The technique for adjusting the fall time and rise time is called peaking. The driver circuit 300 supplies the peaked digital signal to the receiving unit 130 via signal lines 121 and 122 in the transmission path 120. Either a differential signal or a non-differential signal is supplied under the control of the logic circuit 230. The amplitude of the differential signal from the driver circuit 300 is assumed to be smaller than that of the non-differential signal.

[0032] [Driver circuit configuration example] 3 is a circuit diagram showing an example of a configuration of a drive circuit 300 according to the first embodiment of the present technology. The drive circuit 300 includes a drive unit 305 and a transformer 360.

[0033] Driver 305 supplies either a non-differential signal (in-phase signal or single-phase signal) having a larger amplitude than the differential signal or a differential signal to transformer 360 in accordance with control signals DIF and SC. Driver 305 includes non-differential drivers 310 and 320 and differential driver 330. Differential driver 330 includes drivers 331 and 332.

[0034] Transformer 360 is provided with magnetically coupled coils 361 and 362. Coils 361 and 362 have approximately the same inductance.

[0035] Here, let us assume that coil 361 is the primary side. When a primary voltage is applied across the primary side, a secondary voltage of opposite polarity to the primary voltage is generated across coil 362. However, in transformer 360, coils 361 and 362 are not used as the primary side and secondary side. One end of coil 361 is connected to the output terminal of driver 331, and the other end is connected to output signal line 121. One end of coil 362 is connected to the output terminal of driver 332, and the other end is connected to output signal line 122. Driver 305 supplies a differential signal to one end of coil 361 and one end of coil 362. When an in-phase current flows into one end of coil 361 connected to driver 305 and one end of coil 362 connected to driver 305, the magnetic fluxes generated by each coil weaken each other. Furthermore, when a differential current is applied to one end of coil 361 connected to drive unit 305 and one end of coil 362 connected to drive unit 305, the magnetic fluxes created by the coils reinforce each other.

[0036] The coil 361 is an example of a first coil as defined in the claims, and the coil 362 is an example of a second coil as defined in the claims.

[0037] The winding directions of the coils 361 and 362 will be described in detail with reference to FIG. 4. The coils 361 and 362 share a predetermined winding axis W, and the respective wires are wound around that axis. One end of the wire 361-1 constituting the coil 361 is designated 361-2, and the other end is designated 361-3. One end of the wire 362-1 constituting the coil 362 is designated 362-2, and the other end is designated 362-3. One ends 361-2 and 362-2 are connected to the driving unit 305. The other ends 361-3 and 362-3 are connected to the receiving unit 130. The figure is a plan view of the coils 361 and 362 as viewed from the direction of the winding axis W. The arrows indicate the direction of current flow when in-phase currents flow from 361-2 and 362-2. The winding direction of the wire 361-1 of the coil 361 around the winding axis W is opposite to the winding direction of the wire 362-1 of the coil 362 around the winding axis W. For example, as illustrated in the figure, the wire 361-1 is wound clockwise, while the wire 362-1 is wound counterclockwise.

[0038] Returning to FIG. 3 , the non-differential driver 310 adjusts the amplitude of the non-differential signal from the serializer 240 and supplies it to one end of the coil 361. The non-differential driver 310 includes, for example, an inverter 311, switches 312 to 315, a p-channel metal oxide semiconductor (pMOS) transistor 316, and an n-channel MOS (nMOS) transistor 317. The inverter 311 inverts the signal input to the non-differential driver 310. The switch 312 opens and closes the path between the output terminal of the inverter 311 and the gate of the pMOS transistor 316 in accordance with a control signal SC. The switch 313 opens and closes the path between the output terminal of the inverter 311 and the gate of the nMOS transistor 317 in accordance with a control signal SC. The switch 314 opens and closes the path between the power supply terminal and the gate of the pMOS transistor 316 in accordance with the control signal SC. The switch 315 opens and closes the path between the ground terminal and the gate of the nMOS transistor 317 in accordance with the control signal SC. The pMOS transistor 316 and the nMOS transistor 317 are connected in series between a power supply terminal and a ground terminal, and the voltage at their connection node is output as the output signal of the non-differential driver 310. When the switches 312 and 313 are closed, the switches 314 and 315 are open, and the non-differential driver 310 is in a driven state. When the switches 312 and 313 are open, the switches 314 and 315 are closed, and the non-differential driver 310 is in a stopped state. The circuit configurations of the non-differential driver 320, the driver 331, and the driver 332 are the same as that of the non-differential driver 310. A non-differential signal is input to the non-differential drivers 310 and 320 via signal lines 241 and 244. A differential signal is input to the drivers 331 and 332 via signal lines 242 and 243.

[0039] When transmitting in a differential signal output state, logic circuit 230 drives drivers 331 and 332 with a control signal DIF and stops non-differential drivers 310 and 320 with a control signal SC.

[0040] Furthermore, when transmitting in a non-differential signal output state, logic circuit 230 drives non-differential drivers 310 and 320 with control signal SC and stops drivers 331 and 332 with control signal DIF.

[0041] In the non-differential signal output state, the non-differential drivers 310 and 320 provide a non-differential signal Dsc consisting of Dsc1 and Dsc2.

[0042] The driver 331 adjusts the amplitude of the positive phase signal Dp of the differential signals and supplies it to one end of the coil 361. The driver 332 adjusts the amplitude of the negative phase signal Dn of the differential signals and supplies it to one end of the coil 362.

[0043] Furthermore, the DC (Direct Current) output voltages of non-differential drivers 310 and 320 are higher than those of drivers 331 and 332 in differential driver 330. This makes the amplitude of the low-speed non-differential signal larger than the amplitude of the high-speed differential signal.

[0044] With the circuit configuration illustrated in the figure, in a differential signal output state, differential driver 330 is driven to supply a high-speed, small-amplitude differential signal to receiving unit 130 via transformer 360. In a non-differential signal output state, non-differential drivers 310 and 320 are driven to supply a low-speed, large-amplitude common-mode signal or single-phase signal to receiving unit 130 via transformer 360.

[0045] Furthermore, by inserting coils 361 and 362, the rise time and fall time of the differential signal can be shortened in the differential signal output state. This peaking allows the transmission speed of the differential signal to be improved compared to when coils 361 and 362 are not inserted. Furthermore, even in the non-differential signal output state, although the rise time and fall time are shortened by inserting coils 361 and 362, the inductance of these coils is smaller than when these coils are not magnetically coupled. Therefore, the decrease in the rise time and fall time is smaller than when they are not magnetically coupled, and EMI noise can be sufficiently suppressed. The reason why the inductance is relatively small in the non-differential signal output state will be described later.

[0046] Here, a drive circuit in which a pair of coils that are not magnetically coupled are inserted instead of the magnetically coupled coils 361 and 362 is considered as a comparative example.

[0047] 5 is a circuit diagram showing an example of the configuration of a drive circuit in a comparative example. As shown in the diagram, in the comparative example, a pair of coils that are not magnetically coupled are inserted between the output terminals of drivers 331 and 332 and signal lines 121 and 122.

[0048] 6 is a diagram for comparing the inductance between the first embodiment of the present technology and a comparative example. In the first embodiment, the inductance of the transformer 360 for a differential signal corresponds to the combined inductance of the coils 361 and 362. If the inductance of each of the coils 361 and 362 is L, the inductance L of the transformer 360 for a differential signal is diff is expressed by the following formula: L diff =2L+2M ···Formula 1 In the above equation, M is the mutual inductance, which is expressed by the following equation: M=kL...Equation 2 In the above equation, k is a coupling coefficient, and is, for example, a positive real number less than 1. Substituting equation 2 into equation 1, the following equation is obtained. L diff =2(1+k)L ···Equation 3

[0049] On the other hand, in the comparative example, the inductance of the pair of coils for the differential signal is 2L in total.

[0050] Next, in the first embodiment, the combined inductance of the transformer 360 for an in-phase signal is expressed by the following equation because the polarity of the mutual inductance is opposite. (1-k)L / 2...Equation 4

[0051] On the other hand, in the comparative example, the inductance of the pair of coils for the in-phase signal is L / 2.

[0052] To compare the inductance for a common-mode signal, the inductance of the first embodiment in differential mode is matched to that of the comparative example. For example, the inductance of coils 361 and 362 in the first embodiment is adjusted to L' expressed by the following equation: L'=L / (1+k)...Equation 5

[0053] From Equation 5, the inductance L of the first embodiment after adjustment is com is expressed by the following formula: L com ={(1-k) / (1+k)}L / 2 ···Equation 6

[0054] According to Equation 6, in the first embodiment using magnetically coupled coils 361 and 362, the inductance for an in-phase signal is smaller than L / 2 in the comparative example. This increases the rise time and fall time compared to the comparative example, making it possible to suppress noise caused by EMI. Since the inductance for a single-phase signal is L / (1+k), it is possible to suppress noise caused by EMI in the same way in single-phase mode.

[0055] On the other hand, since the inductance of the first embodiment for the differential signal after adjustment is the same as that of the comparative example, the transmission speed can be improved by inserting a coil, as in the comparative example.

[0056] As described above, by using magnetically coupled coils 361 and 362, it is possible to suppress noise and improve transmission speed at the same time.

[0057] [Drive circuit operation example] 7 is a timing chart showing an example of the operation of the drive circuit according to the first embodiment of the present technology and a comparative example. In the figure, "a" is a timing chart showing an example of the operation of the drive circuit 300 according to the first embodiment. In the figure, "b" is a timing chart showing an example of the operation of the comparative example.

[0058] Assume that the differential signal output state is set during the period up to timing T1, and the non-differential signal output state is set after timing T1. As illustrated in FIG. 1A, in the differential signal output state, differential signals of a positive-phase signal Dp and a negative-phase signal Dn, which have smaller amplitudes and higher speeds than the in-phase signal and single-phase signal, are transmitted. In the non-differential signal output state, a non-differential signal Dsc, which has larger amplitudes and lower speeds than the differential signal, is transmitted. In FIG. 1A, an in-phase signal is transmitted as the non-differential signal.

[0059] As illustrated in Fig. 1B, the rise time and fall time of the differential signal in the comparative example are the same as those in the first embodiment. However, the rise time dT1 of the common-mode signal is shorter than the rise time dT0 in the first embodiment.

[0060] As shown in the figure, differential transitions are prohibited for low-speed, large-amplitude signals, and they are transmitted using single-phase or common-phase transitions. Furthermore, as mentioned above, transformer 360 acts as an inductor only for differential waveforms, reducing the contribution of output capacitance. This allows for a steeper rise of high-speed, small-amplitude differential signals while suppressing peaking of low-speed, large-amplitude single-phase and common-phase signals, enabling both high-speed operation and EMI suppression.

[0061] As described above, according to the first embodiment of the present technology, the provision of the magnetically coupled coils 361 and 362 makes it possible to reduce the inductance for an in-phase signal and the inductance for a single-phase signal compared to the case where non-magnetically coupled coils are used. This makes it possible to suppress peaking of in-phase transitions and single-phase transitions, thereby achieving both an improvement in transmission speed and noise suppression.

[0062] <2. Second embodiment> In the first embodiment described above, the output terminals of non-differential drivers 310 and 320 are connected to one end of coils 361 and 362. However, this configuration may not be able to sufficiently reduce the influence of the output capacitance of non-differential drivers 310 and 320 on the waveform. Drive circuit 300 of this second embodiment differs from the first embodiment in that the destinations to which the output terminals of non-differential drivers 310 and 320 are connected are changed.

[0063] As described above, according to the second embodiment of the present technology, the output terminals of the non-differential driver 321 and the like are connected to the node (such as the center tap) between both ends of the coil, so that the influence of the output capacitance of the non-differential drivers 310 and 320 can be sufficiently reduced. Toga can.

[0064] When the output terminals of the non-differential drivers 310 and 320 are connected to the center taps 365 and 366, the inductance L com is expressed by the following formula: L com =(1-k){L / 4}...Equation 7

[0065] Although the output terminals of the non-differential drivers 310 and 320 are connected to the center taps 365 and 366, the connection destination is not limited to the center tap as long as it is a node between both ends of the coils 361 and 362.

[0066] As described above, according to the second embodiment of the present technology, the output terminals of the non-differential driver 310 and the like are connected to a node (such as a center tap) between both ends of the coil, so that the influence of the output capacitance of the non-differential drivers 310 and 320 can be sufficiently reduced.

[0067] <3. Third Embodiment> In the first embodiment described above, the inductance in the non-differential signal output state is reduced by using magnetically coupled coils 361 and 362. However, this configuration may not be able to sufficiently reduce the effect of the driver's output capacitance on the waveform. The drive circuit 300 of this third embodiment differs from the first embodiment in that ESD (Electro-Static Discharge) protection diodes are connected to the coils 361 and 362.

[0068] 9 is a circuit diagram showing a configuration example of a drive circuit 300 according to a third embodiment of the present technology. The drive circuit 300 according to the third embodiment differs from the first embodiment in that it further includes ESD protection diodes 371 to 374.

[0069] The ESD protection diodes 371 and 372 are connected in series between the power supply terminal and the ground terminal, and the connection node of the ESD protection diodes 371 and 372 is connected to the center tap 365 of the coil 361.

[0070] The ESD protection diodes 373 and 374 are connected in series between the power supply terminal and the ground terminal, and the connection node of the ESD protection diodes 373 and 374 is connected to the center tap 366 of the coil 362.

[0071] The ESD protection diodes 371 and 372 are an example of a first ESD protection diode recited in the claims. The ESD protection diodes 373 and 374 are an example of a second ESD protection diode recited in the claims.

[0072] By connecting the ESD protection diodes 371 to 374, the influence of the output capacitance of the driver on the waveform can be sufficiently reduced, and the waveform can be improved in the same way as in the second embodiment.

[0073] Although the ESD protection diodes 371 to 374 are connected to the center tap, the connection destination is not limited to the center tap as long as it is a node between both ends of the coils 361 and 362 .

[0074] As described above, according to the third embodiment of the present technology, the ESD protection diodes 371 to 374 are connected to the coils 361 and 362, so that the influence of the output capacitance of the driver on the waveform can be sufficiently reduced.

[0075] <4. Fourth embodiment> In the first embodiment described above, different drivers are used for the differential signal output state and the non-differential signal output state, but a common driver can also be used for both states. The drive circuit 300 of this fourth embodiment differs from the first embodiment in that a common driver is used for each operating state.

[0076] 10 is a circuit diagram showing a configuration example of a drive circuit 300 according to a fourth embodiment of the present technology. The drive circuit 300 according to the fourth embodiment differs from the first embodiment in that an output voltage control unit 341, switches 353 to 356, and shared drivers 351 and 352 are arranged in a drive unit 305.

[0077] The output voltage control unit 341 controls the DC output voltage of the shared drivers 351 and 352 in accordance with the control signal DIF. The output voltage control unit 341 reduces the output voltage in the differential signal output state to a value lower than that in the non-differential signal output state.

[0078] The shared driver 351 supplies a differential signal (such as a positive-phase signal) or a non-differential signal from the serializer 240 to one end of the coil 361. The shared driver 352 supplies a differential signal (such as a negative-phase signal) or a non-differential signal from the serializer 240 to one end of the coil 362.

[0079] The switch 353 opens and closes the path between the input signal line 241 and the input terminal of the shared driver 351 in accordance with the control signal SC. The switch 352 opens and closes the path between the input signal line 242 and the input terminal of the shared driver 351 in accordance with the control signal DIF. The switch 353 opens and closes the path between the input signal line 243 and the input terminal of the shared driver 352 in accordance with the control signal DIF. The switch 354 opens and closes the path between the input signal line 244 and the input terminal of the shared driver 352 in accordance with the control signal SC.

[0080] When transmitting in a non-differential signal output state, logic circuit 230 closes switches 353 and 356 using control signal SC and opens switches 354 and 355 using control signal DIF. When transmitting in a differential signal output state, logic circuit 230 closes switches 354 and 355 using control signal DIF and opens switches 353 and 356 using control signal SC.

[0081] By using the shared drivers 351 and 352 in common in each operating state, the number of drivers can be reduced compared to the first embodiment.

[0082] As described above, according to the fourth embodiment of the present technology, the shared drivers 351 and 352 are commonly used in each operating state, so that the number of drivers can be reduced compared to when different drivers are used in each operating state.

[0083] <5. Fifth Embodiment> In the first embodiment described above, the driving unit 305 and the transformer 360 are arranged on the circuit chip 202, but this configuration makes it difficult to further reduce the circuit scale of the circuit chip 202. The driving circuit 300 of this fifth embodiment differs from the first embodiment in that the transformer 360 is arranged outside the circuit chip 202.

[0084] 11 is a circuit diagram showing a configuration example of a drive circuit 300 according to a fifth embodiment of the present technology. The drive circuit 300 according to the fifth embodiment differs from the first embodiment in that a transformer 360 is arranged on a transmission path 120 outside a circuit chip 202. Squares in the figure indicate pads. By arranging the transformer 360 outside the circuit chip 202, the circuit scale of the circuit chip 202 can be reduced. The circuit chip 202 is an example of a semiconductor chip as defined in the claims.

[0085] As described above, according to the fifth embodiment of the present technology, the transformer 360 is disposed outside the circuit chip 202, and therefore the circuit scale of the circuit chip 202 can be reduced.

[0086] 6. Sixth Embodiment In the second embodiment described above, the inductance in the non-differential signal output state is reduced by using magnetically coupled coils 361 and 362. However, this configuration may not be able to sufficiently reduce the influence of the driver's output capacitance on the waveform. The drive circuit 300 of this sixth embodiment differs from the second embodiment in that the third embodiment is applied to the second embodiment.

[0087] 12 is a circuit diagram showing a configuration example of a drive circuit 300 according to a sixth embodiment of the present technology. The drive circuit 300 according to the sixth embodiment differs from the second embodiment in that it further includes the ESD protection diodes 371 to 374 according to the third embodiment.

[0088] By connecting the ESD protection diodes 371 to 374, the influence of the output capacitance of the driver on the waveform can be sufficiently reduced.

[0089] Although the output terminals of the non-differential drivers 310 and 320 are connected to the center tap, the connection destination is not limited to the center tap as long as it is a node between both ends of the coils 361 and 362. The same applies to the ESD protection diodes 371 to 374.

[0090] As described above, according to the sixth embodiment of the present technology, the ESD protection diodes 371 to 374 are connected to the coils 361 and 362, so that the influence of the output capacitance of the driver on the waveform can be sufficiently reduced.

[0091] 7. Seventh Embodiment In the third embodiment described above, different drivers are used for the differential signal output state and the non-differential signal output state, but a common driver can also be used for both operating states. The drive circuit 300 of this seventh embodiment differs from the third embodiment in that the fourth embodiment is applied to the third embodiment.

[0092] 13 is a circuit diagram showing a configuration example of a drive circuit 300 according to a seventh embodiment of the present technology. The drive circuit 300 according to the seventh embodiment differs from the third embodiment in that the output voltage control unit 341, switches 353 to 356, and shared drivers 351 and 352 according to the fourth embodiment are arranged in a drive unit 305.

[0093] By using the shared drivers 351 and 352 in common in each operating state, the number of drivers can be reduced compared to the third embodiment.

[0094] As described above, according to the seventh embodiment of the present technology, the shared drivers 351 and 352 are commonly used in each operating state, so that the number of drivers can be reduced compared to when different drivers are used in each operating state.

[0095] 8. Eighth Embodiment In the above-described fourth embodiment, the driving unit 305 and the transformer 360 are arranged on the circuit chip 202, but this configuration makes it difficult to further reduce the circuit scale of the circuit chip 202. The driving circuit 300 of this eighth embodiment differs from the fourth embodiment in that the fifth embodiment is applied to the fourth embodiment.

[0096] 14 is a circuit diagram showing a configuration example of a drive circuit 300 according to an eighth embodiment of the present technology. The drive circuit 300 according to the eighth embodiment differs from the fourth embodiment in that a transformer 360 is disposed on a transmission path 120 outside the circuit chip 202. This allows the circuit scale of the circuit chip 202 to be reduced.

[0097] As described above, according to the eighth embodiment of the present technology, the transformer 360 is disposed outside the circuit chip 202, and therefore the circuit scale of the circuit chip 202 can be reduced.

[0098] 9. Ninth Embodiment In the first embodiment described above, the driving circuit 300 outputs signals to two lines, the signal lines 121 and 122, but it is also possible to output signals to three lines. The driving circuit 300 of this ninth embodiment differs from the first embodiment in that it outputs signals to three lines.

[0099] 15 is a circuit diagram showing a configuration example of a drive circuit 300 according to a ninth embodiment of the present technology. The drive circuit 300 according to the ninth embodiment differs from the first embodiment in that it further includes a non-differential driver 321, a driver 333, and a coil 363.

[0100] The driver 333 constitutes a differential driver together with the drivers 331 and 332. The output voltage of the non-differential driver 321 is higher than that of the differential driver. The driver 333 and the non-differential driver 321 supply Dq constituting a differential signal or Dsc3 constituting a non-differential signal to one end of the coil 363.

[0101] Coil 363 is magnetically coupled to coil 362, and the other end thereof is connected to receiving unit 130 via signal line 123. Furthermore, the inductance of coil 363 is substantially the same as that of coil 362, and the winding direction of coil 363 from driver 333 to signal line 123 is different from the winding direction of coil 362 from driver 332 to signal line 122.

[0102] When transmitting in a differential signal output state, the logic circuit 230 drives the drivers 331 to 333 with the control signal DIF and stops the non-differential drivers 310, 320, and 321 with the control signal SC.

[0103] Furthermore, when transmitting in a non-differential signal output state, the logic circuit 230 stops the drivers 331 to 333 using the control signal DIF, and drives the non-differential drivers 310, 320, and 321 using the control signal SC.

[0104] Although the driving circuit 300 transmits signals via three wires, it is also possible to transmit signals via four or more wires. Also, each of the second to eighth embodiments can be applied to the ninth embodiment.

[0105] As described above, according to the ninth embodiment of the present technology, the non-differential driver 321, the driver 333, and the coil 363 are further provided, so that signals can be transmitted over three wires.

[0106] <10. Mobile Application Examples> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of moving body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0107] FIG. 16 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0108] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 16, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0109] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, a braking device for generating a braking force of the vehicle, etc.

[0110] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches may be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0111] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc., based on the received images.

[0112] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0113] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0114] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drivetrain control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including avoiding or mitigating collisions between vehicles, following based on the distance between vehicles, maintaining vehicle speed, warning of vehicle collisions, or warning of vehicle lane departure.

[0115] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0116] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information about the outside of the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control for the purpose of preventing glare, such as switching from high beams to low beams.

[0117] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to passengers in the vehicle or to the outside of the vehicle. In the example of Fig. 16, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as output devices. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0118] FIG. 17 is a diagram showing an example of the installation position of the imaging unit 12031.

[0119] In FIG. 17, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0120] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided at the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided at the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0121] 17 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 viewed from above can be obtained.

[0122] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera made up of multiple imaging elements, or may be an imaging element having pixels for phase difference detection.

[0123] For example, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (for example, 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of automatic driving, which runs autonomously without relying on driver operation.

[0124] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drivetrain control unit 12010.

[0125] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the images captured by the image capturing units 12101 to 12104. The pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104, which are infrared cameras, and then performing pattern matching on a series of feature points that indicate the outline of an object to determine whether or not the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0126] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to, for example, the image capturing unit 12031 of the above-described configuration. Specifically, the image capturing device 100 of FIG. 1 can be applied to the image capturing unit 12031. By applying the technology according to the present disclosure to the image capturing unit 12031, it is possible to improve the transmission speed while reducing noise and obtain a captured image that is easier to view, thereby reducing driver fatigue.

[0127] Note that the above-described embodiment shows an example for realizing the present technology, and the matters in the embodiment and the matters specifying the invention in the claims correspond to each other. Similarly, the matters specifying the invention in the claims and the matters in the embodiment of the present technology having the same name correspond to each other. However, the present technology is not limited to the embodiment, and can be realized by applying various modifications to the embodiment within the scope of the gist thereof.

[0128] The effects described in this specification are merely examples and are not limiting, and other effects may also be obtained.

[0129] The present technology can also be configured as follows. (1) a transformer having a plurality of magnetically coupled coils; a driver that supplies either a non-differential signal or a differential signal to the transformer; Equipped with the plurality of coils includes first and second coils that are magnetically coupled; the driving unit is connected to one end of the first coil and one end of the second coil, When a common-mode current is applied to the one end of each of the first and second coils, the magnetic fluxes generated by the first and second coils weaken each other. Drive circuit. (2) The driving unit supplies the differential signal to one end of the first coil and one end of the second coil, and the driving unit supplies the differential signal to one end of the first coil and one end of the second coil. The drive circuit according to (1) above. (3) a first ESD protection diode connected to a node between both ends of the first coil; a second ESD protection diode connected to a node between both ends of the second coil; The driving circuit according to (2) above, further comprising: (4) The drive unit is a shared driver that supplies either the differential signal or the non-differential signal; an output voltage control unit that controls an output voltage of the shared driver; The drive circuit according to (2) or (3) above, comprising: (5) the driving unit is disposed on a predetermined semiconductor chip; The transformer is disposed outside the semiconductor chip. The drive circuit according to (4) above. (6) The drive unit is a differential driver for providing the differential signals; a non-differential driver for providing said non-differential signal; The drive circuit according to (2) above, comprising: (7) The output terminal of the non-differential driver is connected to a node between both ends of either the first or second coil. The drive circuit according to (6) above. (8) The output terminal of the non-differential driver is connected to the one end of either the first or second coil. The drive circuit according to (7) above. (9) The driving unit is disposed on a predetermined semiconductor chip, The transformer is disposed outside the semiconductor chip. The drive circuit according to (8) above. (10) The plurality of coils includes first, second, and third coils that are magnetically coupled; the driving unit supplies the differential signal to one end of the first coil, one end of the second coil, and one end of the third coil; The drive circuit according to (1), wherein when a current of the same phase is flowed into the one end of each of the second and third coils, the magnetic fluxes generated by the second and third coils weaken each other. (11) Further comprising a receiver that receives a differential signal via the first and second signal lines; the driver includes first and second output terminals; the first coil has one end connected to the first output terminal and the other end connected to the first signal line; The one end of the second coil is connected to the second output terminal, and the other end is connected to the second signal line. The drive circuit according to (1) above. (12) The first and second coils share a predetermined winding axis; When viewed from the direction of the winding axis, the winding direction around the winding axis from one end of the first coil connected to the output terminal of the wiring to the other end connected to the signal line is opposite to the winding direction around the winding axis from one end of the second coil connected to the output terminal of the wiring to the other end connected to the signal line. The drive circuit according to (1) above. (13) A transformer having a plurality of magnetically coupled coils; a driver that supplies either a non-differential signal or a differential signal to the transformer in accordance with a predetermined control signal; a logic circuit that specifies either the non-differential signal or the differential signal by the control signal and supplies it to the driver; Equipped with the plurality of coils includes first and second coils that are magnetically coupled; the driving unit is connected to one end of the first coil and one end of the second coil, A solid-state imaging device in which, when a current of the same phase is applied to the one end of each of the first and second coils, the magnetic fluxes generated by the first and second coils weaken each other. [Explanation of symbols]

[0130] 100 Imaging device 110 Mounting board 120 Transmission Line 130 Receiving unit 200 solid-state image sensor 201 pixel chip 202 Circuit Chip 210 pixels 220 Analog-to-digital conversion section 230 Logic Circuits 240 Serializer 300 Drive Circuit 305 Drive unit 310, 320, 321 Non-differential Drivers 311 Inverter 312~315, 353~356 Switches 316 pMOS transistors 317 nMOS transistor 330 Differential Driver 331~333 Driver 341 Output voltage control section 351, 352 shared driver 360 Transformers 361~363 Coil 371~374 ESD Protection Diodes 12031 Imaging unit

Claims

1. a transformer having a plurality of magnetically coupled coils; a driver that supplies either a non-differential signal or a differential signal to the transformer; a first ESD protection diode connected to a first node between both ends of the first coil; a second ESD protection diode connected to a second node between both ends of the second coil; Equipped with the plurality of coils includes the first and second coils that are magnetically coupled; the driving unit is connected to one end of the first coil and one end of the second coil, When a current of the same phase is applied to the one end of each of the first and second coils, the magnetic fluxes generated by the first and second coils weaken each other, The drive unit is a differential driver for providing the differential signals; a non-differential driver for providing said non-differential signal; Equipped with the non-differential driver includes a first non-differential driver and a second non-differential driver; an output terminal of the first non-differential driver connected to the first node; The output terminal of the second non-differential driver is connected to the second node. Drive circuit.

2. 2. The drive circuit according to claim 1, wherein the drive unit supplies the differential signal to one end of the first coil and one end of the second coil, and the differential signal is output from the other end of each of the first and second coils.

3. the driving unit is disposed on a predetermined semiconductor chip, The transformer is disposed outside the semiconductor chip.

2. The drive circuit according to claim 1.

4. a receiver that receives a differential signal via the first and second signal lines; the driver includes first and second output terminals; the first coil has one end connected to the first output terminal and the other end connected to the first signal line; The one end of the second coil is connected to the second output terminal, and the other end is connected to the second signal line.

2. The drive circuit according to claim 1.

5. the first and second coils share a predetermined winding axis; When viewed from the direction of the winding axis, the winding direction of the first coil around the winding axis from one end connected to the output terminal of the wiring to the other end connected to the signal line is opposite to the winding direction of the second coil around the winding axis from one end connected to the output terminal of the wiring to the other end connected to the signal line.

2. The drive circuit according to claim 1.

6. A transformer having a plurality of magnetically coupled coils; a driver that supplies either a non-differential signal or a differential signal to the transformer; Equipped with the plurality of coils includes first, second, and third coils that are magnetically coupled; the driving unit supplies the differential signal to one end of the first coil, one end of the second coil, and one end of the third coil; When a current of the same phase is applied to the one end of each of the first and second coils, the magnetic fluxes generated by the first and second coils weaken each other, When a common-mode current is applied to the one end of each of the second and third coils, the magnetic fluxes generated by the second and third coils weaken each other. Drive circuit.

7. a transformer having a plurality of magnetically coupled coils; a driver that supplies either a non-differential signal or a differential signal to the transformer in accordance with a predetermined control signal; a first ESD protection diode connected to a first node between both ends of the first coil; a second ESD protection diode connected to a second node between both ends of the second coil; a logic circuit that specifies either the non-differential signal or the differential signal by the control signal and supplies it to the driver; Equipped with the plurality of coils includes the first and second coils that are magnetically coupled; the driving unit is connected to one end of the first coil and one end of the second coil, When a current of the same phase is applied to the one end of each of the first and second coils, the magnetic fluxes generated by the first and second coils weaken each other, The drive unit is a differential driver for providing the differential signals; a non-differential driver for providing said non-differential signal; Equipped with the non-differential driver includes a first non-differential driver and a second non-differential driver; an output terminal of the first non-differential driver connected to the first node; The output terminal of the second non-differential driver is connected to the second node. Solid-state imaging element.

Images