Film forming device

Abstract

To provide a film deposition apparatus capable of suppressing an electronic component from being electrically charged when a protective sheet is peeled off from a cooling plate.SOLUTION: A film deposition apparatus comprises a film deposition processing part which deposits films on electronic components 60 on a protective sheet brought into contact with a cooling plate 63, and a plate release part 4 which detaches the cooling plate 63, wherein the cooling plate 63 has penetrating air holes formed within a range including a region where the electronic components 60 are arrayed, and the plate release part 4 has a mount table 42 having positive pressure generation holes, a ceiling part 41 which presses a part of the protective sheet apart from the region where the electronic components 60 are arrayed while the mount table 42 is pressing the region where the electronic components 60 are arrayed through the positive-pressure generation holes, and releases the protective sheet from being pressed after the region where the electronic components 60 are arrayed separates from the cooling plate 63, and a grounding part 41a which directly grounds the ceiling part 41.SELECTED DRAWING: Figure 12

Description

[Technical Field]

[0001] The present invention relates to a film forming apparatus. [Background technology]

[0002] Wireless communication devices, such as mobile phones, are equipped with a large number of electronic components, such as semiconductor devices. The electronic components are transported from processing equipment to processing equipment for various processes. A typical example of such processes is the formation of an electromagnetic wave shielding film. The electromagnetic wave shielding film suppresses the effects of electromagnetic waves both inside and outside, such as the leakage of electromagnetic waves to the outside, in order to prevent an impact on communication characteristics. Generally, the outer shape of electronic components is formed by a sealing resin, and a conductive electromagnetic wave shielding film is provided on the top and side surfaces of this sealing resin to shield against electromagnetic waves (see Patent Document 1).

[0003] Plating is a well-known method for forming electromagnetic wave shielding films. However, plating requires wet processes, such as pre-treatment, plating, and post-treatment such as washing, which inevitably increases the manufacturing costs of electronic components. Therefore, sputtering, a dry process, has attracted attention. In sputtering, an inert gas is introduced into a vacuum chamber containing a target, and a direct current voltage is applied. Plasma-generated ions of the inert gas then collide with the target of film-forming material, causing particles to be knocked out of the target and deposited on the electronic component. This deposited layer becomes the electromagnetic wave shielding film.

[0004] The deposition equipment for implementing the sputtering method has a cylindrical chamber with its interior serving as a vacuum chamber, a turntable housed within the chamber and having a rotation axis coaxial with the chamber, and deposition positions partitioned within the chamber. Electronic components are placed on the turntable, and the turntable is rotated circumferentially to bring the electronic components to the deposition positions where an electromagnetic wave shielding film is deposited. In this way, electronic components are rotated and transported even within the processing equipment.

[0005] When transporting electronic components inside and outside of such equipment, the components are subjected to inertial forces due to acceleration, deceleration, rotation, etc., which can cause the electronic components to tip over or fall off from their deposition positions. To address this issue, electronic components are attached to adhesive protective sheets while being transported and subjected to the deposition of the EMI shielding film. The adhesive force, which counteracts the inertial forces, keeps the electronic components in the correct position. Furthermore, the protective sheet not only improves the stability of the electronic components, but also prevents particles of the EMI shielding film from adhering to the electrodes during the deposition process, maintaining insulation between the electrodes. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2013 / 035819 [Patent Document 2] Japanese Patent Application Publication No. 6-97268 Summary of the Invention [Problem to be solved by the invention]

[0007] The protective sheet with the electronic components attached is placed in close contact with a cooling plate. While the cooling plate is rotated and transported, a film is formed on the electronic components on the cooling plate by sputtering. This allows the heat from the electronic components heated by the plasma to escape to the cooling plate, preventing the electronic components from overheating.

[0008] However, the protective sheet with the electronic components attached must be peeled off from the cooling plate after film formation, and the friction generated when peeling the protective sheet off the cooling plate can cause static electricity, which can potentially charge up and affect the electronic components.

[0009] An embodiment of the present invention has been proposed to solve the above-mentioned problems, and aims to provide a film forming apparatus that can suppress charging of electronic components when peeling off a protective sheet from a cooling plate. [Means for solving the problem]

[0010] In order to achieve the above object, an embodiment of the present invention is a film forming apparatus for electronic components arranged on a protective sheet in close contact with a cooling plate, the apparatus comprising: a film forming processing section that deposits a film forming material by sputtering on the electronic components on the protective sheet in close contact with the cooling plate to form a film; and a plate release section that removes the cooling plate after passing through the film forming processing section, wherein the cooling plate has air holes that penetrate from the front to the back in an area including an area where the electronic components are arranged, and the plate release section has a mounting table that faces the air holes of the cooling plate and has positive pressure generating holes that generate positive pressure, and while the mounting table applies pressure to the area where the electronic components are arranged through the positive pressure generating holes, it presses down on areas of the protective sheet that are outside the area where the electronic components are arranged, and releases the pressure after the area where the electronic components are arranged has been separated from the cooling plate. Conductive a fixed portion; and a grounding portion that directly grounds the fixed portion; a conductive member that is provided at a position that covers the electronic components arranged on the protective sheet, is electrically connected to the fixing portion, and has flexibility and breathability; It has. The conductive member is in contact with the electronic components while pressure is applied to the area where the electronic components are arranged. [Effects of the Invention]

[0011] According to an embodiment of the present invention, it is possible to provide a film forming apparatus that can suppress charging of electronic components when a protective sheet is peeled off from a cooling plate. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is a side view showing an electronic component that has been subjected to a film formation process. [Figure 2] FIG. 2 is a side view showing a state of an electronic component undergoing a film formation process. [Figure 3] FIG. 2 is an exploded perspective view showing the state of an electronic component when undergoing a film formation process. [Figure 4] FIG. 1 is a transition diagram showing a film formation process flow for an electronic component. [Figure 5] FIG. 2 is a block diagram showing the configuration of a film forming apparatus. [Figure 6] FIG. 2 is a schematic diagram illustrating a configuration of an embedding processing unit. [Figure 7] FIG. 10 is a transition diagram schematically illustrating the state in each step of the embedding processing unit. [Figure 8] FIG. 10 is an enlarged view of the space between electronic components in the embedded processing portion. [Figure 9] FIG. 2 is a schematic diagram showing the configuration of a plate mounting portion. [Figure 10] 10A to 10C are transition diagrams schematically illustrating the states of the plate mounting unit in each process. [Figure 11] FIG. 2 is a schematic diagram showing the configuration of a film forming processing unit. [Figure 12] FIG. 4 is a schematic diagram showing the configuration of a plate release unit. [Figure 13] 10 is a transition diagram schematically illustrating the state of the plate release unit in each step. FIG. [Figure 14] 10A and 10B are schematic diagrams showing other configurations of the plate release portion. [Figure 15] 10 is a schematic diagram showing still another configuration of the plate release portion. FIG. [Figure 16] FIG. 2 is a schematic diagram illustrating a configuration of a peeling processing unit. [Figure 17] 10 is a diagram showing the upper surface of the component-embedded sheet in the peeling processing section. FIG. [Figure 18] 5A to 5C are transition diagrams schematically illustrating states in each step of a peeling processing unit. DETAILED DESCRIPTION OF THE INVENTION

[0013] [Electronic Components] FIG. 1 is a side view showing an electronic component 60 that has undergone a film formation process. As shown in FIG. 1, an electromagnetic wave shielding film 605 is formed on the surface of the electronic component 60. The electronic component 60 is a surface-mounted component such as a semiconductor chip, diode, transistor, capacitor, or SAW filter. A semiconductor chip is an integrated circuit such as an IC or LSI that integrates multiple electronic elements. The electronic component 60 has a roughly rectangular parallelepiped shape such as a BGA, LGA, SSOP, QFP, or WLP, and one surface thereof serves as an electrode exposed surface 601. The electrode exposed surface 601 exposes electrodes 602 and is the surface that faces and is connected to a mounting substrate. The electrodes 602 are called ball bumps or solder ball bumps, and are formed by mounting solder (solder balls) formed into a spherical shape with a diameter of several tens to several hundreds of micrometers on pad electrodes.

[0014] The electromagnetic wave shielding film 605 shields electromagnetic waves. The electromagnetic wave shielding film 605 is formed of a material such as Cu, Al, Ag, Ti, Nb, Pd, Pt, or Zr. The electromagnetic wave shielding film 605 may also be formed of a magnetic material such as Ni, Fe, Cr, or Co. Furthermore, SUS, Ni, Ti, V, or Ta may be formed as an underlayer of the electromagnetic wave shielding film 605, and SUS, Au, or the like may be formed as an outermost protective layer. At least the surface that comes into contact with the electronic component 60 and the outermost surface of the electromagnetic wave shielding film 605 are conductive.

[0015] The electromagnetic wave shielding film 605 is formed on the top surface 603 and side surfaces 604 of the electronic component 60, i.e., on the outer surfaces other than the electrode exposed surface 601. The top surface 603 is the surface opposite to the electrode exposed surface 601. The side surfaces 604 are outer peripheral surfaces that connect the top surface 603 and the electrode exposed surface 601 and extend at a different angle from the top surface 603 and the electrode exposed surface 601. To obtain a shielding effect for blocking electromagnetic waves, the electromagnetic wave shielding film 605 only needs to be formed on at least the top surface 603. A ground pin (not shown) is present on the side surfaces 604. The electromagnetic wave shielding film 605 is formed on the side surfaces 604 also for the purpose of grounding the electromagnetic wave shielding film 605.

[0016] (During film formation process) FIG. 2 is a side view showing the state of the electronic component 60 after undergoing a film-forming process. FIG. 3 is an exploded perspective view showing the state of the electronic component 60 during the film-forming process. As shown in FIGS. 2 and 3, the electronic component 60 has an electrode 602 embedded in a protective sheet 61 in advance, and an electrode exposed surface 601 is in close contact with the protective sheet 61. Embedding the electrode 602 in the protective sheet 61 prevents particles of the electromagnetic wave shielding film 605 from reaching the electrode 602. Furthermore, the close contact between the electrode exposed surface 601 and the protective sheet 61 eliminates any room for particles of the electromagnetic wave shielding film 605 to get between the electrode exposed surface 601 and the protective sheet 61, reducing the possibility of particles of the electromagnetic wave shielding film 605 reaching the electrode 602.

[0017] Protective sheet 61 is made of a heat-resistant synthetic resin such as PEN (polyethylene naphthalate) or PI (polyimide). One surface of protective sheet 61 is an adhesive surface (adhesive layer) 611 that is flexible enough to fit electrode 602 and has adhesiveness that allows electrode exposed surface 601 to adhere to it. Adhesive surface 611 can be made of various adhesive materials such as silicone-based or acrylic-based resins, as well as urethane resins and epoxy resins.

[0018] The adhesive surface 611 is divided into an outer frame region 613 that extends a predetermined distance inward from the edge of the protective sheet 61, an inner frame region 614 that extends a predetermined distance inward from the inner periphery of the outer frame region 613, and a component arrangement region 615 that is more inward than the inner frame region 614. The electronic components 60 are attached to the component arrangement region 615. A frame-shaped frame 62 is attached to the outer frame region 613. The inner frame region 614 is an area where the protective sheet 61 bends, and neither the frame 62 nor the electronic components 60 are attached. The opposite side of the adhesive surface 611 is a non-adhesive surface 612.

[0019] The protective sheet 61 is attached to the cooling plate 63 via an adhesive sheet 64. The cooling plate 63 is made of metal such as SUS, ceramics, resin, or other materials with high thermal conductivity. This cooling plate 63 is a heat dissipation path that releases heat from the electronic component 60 and prevents excessive heat accumulation. The adhesive sheet 64 has adhesive properties on both sides, which improves adhesion between the protective sheet 61 and the cooling plate 63 and ensures a heat transfer area to the cooling plate 63.

[0020] The height H1 from the surface of the component arrangement area 615 to the top surface of the frame 62 is greater than the height H2 from the surface of the component arrangement area 615 to the top surface 603 of the electronic component 60 (see FIG. 4). For convenience, the height H1 may be referred to as the thickness H1, but this has the same meaning. In other words, if a flat plate is placed on the frame 62, the top surface 603 of the electronic component 60 does not reach the flat plate.

[0021] A guide portion insertion hole 621 is formed in one end of the frame 62. The guide portion insertion hole 621 has an opening that is a long oval, rectangular, round, or other shape along the end of the frame 62, and penetrates through the surface of the frame 62 that is attached to the protective sheet 61 and the exposed surface on the opposite side. That is, for example, when a rod-shaped member is inserted into the guide portion insertion hole 621 and the end of the protective sheet 61 is pressed (see FIG. 18 ), one end of the protective sheet 61 is peeled off from the frame 62.

[0022] Pusher insertion holes 631 are formed in the cooling plate 63 and the adhesive sheet 64. The pusher insertion holes 631 do not coincide with the guide insertion holes 621 and are provided at positions blocked by the frame 62. A plurality of pusher insertion holes 631 are provided so that when, for example, a rod-shaped member is inserted into one of the pusher insertion holes 631 and the tip of the rod-shaped member pushes up the frame 62, the entire frame 62 is lifted up in a parallel position. For example, if the frame 62 is a rectangular frame, the pusher insertion holes 631 are located at the four corners or even at the center of each side. From the viewpoint of maintaining the parallel position of the frame 62, it is desirable for the rod-shaped member to have a rectangular tip surface, i.e., a thin plate shape or an L-shaped cross section, but this is not limited thereto and the pusher insertion hole 631 may also have a circular tip surface. The pusher insertion holes 631 have a corresponding rectangular, L-shaped, or circular shape.

[0023] Furthermore, the cooling plate 63 and the adhesive sheet 64 have numerous fine air holes 632 formed at equal intervals throughout the entire area where the inner frame area 614 and the component arrangement area 615 of the protective sheet 61 are attached. These air holes 632 are, for example, micro-cylindrical or slit-shaped. The air holes 632 are provided to evenly apply negative or positive pressure through the air holes 632 to at least the component arrangement area 615 of the protective sheet 61 attached to the cooling plate 63. The number, spacing, and range of the air holes 632 are not limited to those described above. For example, the air holes 632 may be provided only in the area corresponding to the component arrangement area 615, or the air holes 632 may be densely arranged in the center of the cooling plate 63 and the adhesive sheet 64 and sparsely arranged on the outside, or only one may be provided at a position corresponding to the center of the component arrangement area 615.

[0024] (Film formation process flow) In the film formation process, the electromagnetic wave shielding film 605 is formed and the separated electronic components 60 are obtained through a component placement process, a component embedding process, a plate mounting process, a film formation process, a plate removal process, and a component peeling process.

[0025] Fig. 4 is a diagram showing a film-forming process flow for electronic components 60. As shown in Fig. 4, in the component-mounting step, electronic components 60 are arranged in a component arrangement area 615 with electrode-exposed surfaces 601 of the electronic components 60 facing a component-free sheet 65 in which frames 62 are attached to a protective sheet 61. A state in which frames 62 are attached to protective sheet 61 and electronic components 60 are arranged, but electrodes 602 are not yet embedded, is called a component-mounted sheet 66.

[0026] In the component embedding process, electrodes 602 are embedded in protective sheet 61 of component-mounted sheet 66, and electrode exposed surface 601 is brought into close contact with protective sheet 61. Regardless of whether electromagnetic wave shielding film 605 is formed or not, the state in which electrodes 602 are embedded in protective sheet 61 is called component-embedded sheet 67. In the plate mounting process, component-embedded sheet 67 is brought into close contact with cooling plate 63 via adhesive sheet 64. The state in which cooling plate 63 is mounted is called component-mounted plate 68.

[0027] In the film formation process, particles of the electromagnetic wave shielding film 605 are deposited from the top surface 603 side of the electronic component 60, forming the electromagnetic wave shielding film 605 on the electronic component 60. At this time, the electrodes 602 of the electronic component 60 are buried in the protective sheet 61, and the exposed electrode surfaces 601 are in close contact with the protective sheet 61, preventing the particles of the electromagnetic wave shielding film 605 from adhering to the electrodes 602.

[0028] In the plate release process, the cooling plate 63 is removed, returning the sheet to its component-embedded form 67. Then, in the component peeling process, the electronic components 60 are peeled off from the protective sheet 61, separating the sheet into a component-empty sheet 65 and the individual electronic components 60. In addition, the protective sheet 61 is peeled off from the frame 62 in preparation for reuse of the frame 62. This completes the film formation process.

[0029] [Film forming equipment] Of the above-described film formation process flows, the film formation apparatus responsible for the component embedding process, plate mounting process, film formation process, plate release process, and component peeling process is shown in Figure 5. As shown in Figure 5, film formation apparatus 7 includes an embedding processing unit 1, a plate mounting unit 2, a film formation processing unit 3, a plate release unit 4, and a peeling processing unit 5. Each unit is connected by a transport unit 73, through which the necessary components for each process are input and the processed components are discharged. The transport unit 73 is, for example, a conveyor, but it may also be a transport table that is movable along a linear track using a ball screw or the like.

[0030] The film forming apparatus 7 also houses a control unit 74 such as a computer or microcomputer having a CPU, ROM, RAM, and signal transmission circuit that controls the operation timing of each component of the embedding processing unit 1, plate mounting unit 2, film forming processing unit 3, plate release unit 4, and stripping processing unit 5. The film forming apparatus 7 also houses an air pressure circuit 75 that supplies positive pressure and negative pressure to the embedding processing unit 1, plate mounting unit 2, film forming processing unit 3, plate release unit 4, and stripping processing unit 5. The control unit 74 also controls the solenoid valves in the air pressure circuit 75, switching between generating negative pressure, releasing negative pressure, generating positive pressure, and releasing positive pressure.

[0031] [Embedding processing section] The embedding processing unit 1, which is responsible for the component embedding process, will now be described. FIG. 6 is a schematic diagram showing the configuration of the embedding processing unit 1. A component-mounted sheet 66 is fed into the embedding processing unit 1. The embedding processing unit 1 pulls the protective sheet 61 toward the electronic component 60 while holding back the electronic component 60, and also presses the protective sheet 61 against the electronic component 60. In this way, the embedding processing unit 1 presses the electrodes 602 of the electronic component 60 into the protective sheet 61, and further presses the electrode exposed surface 601 into tight contact with the protective sheet 61.

[0032] As shown in FIG. 6, the embedding processing unit 1 includes a ceiling 11 and a mounting table 12. The ceiling 11 and the mounting table 12 are both blocks having internal spaces 111, 121. The ceiling 11 and the mounting table 12 are arranged opposite each other and have parallel flat surfaces 112, 122 on the opposing sides. The flat surfaces 112, 122 are either the same size and shape as the component-mounted sheet 66 or are wider than the component-mounted sheet 66. The mounting table 12 is stationary. Meanwhile, the ceiling 11 is movable up and down relative to the mounting table 12. The ceiling 11 approaches the mounting table 12 to a distance of at least the thickness H1 of the frame 62 of the component-mounted sheet 66.

[0033] A component-mounted sheet 66 is placed on this mounting table 12. A flat surface 122 of the mounting table 12 is the surface on which the component-mounted sheet 66 is placed. This flat surface 122 is made of an adhesive non-slip material. A large number of air holes 123 that communicate with the internal space 121 are formed through the flat surface 122 of the mounting table 12. The range in which the air holes 123 are formed is the same size and shape as the inside of the frame 62 of the component-mounted sheet 66, or at least the same size and shape as the component arrangement area 615. The positions of the air holes 123 are such that when the component-mounted sheet 66 is placed on the mounting table 12, they face the area inside the frame 62 or the component arrangement area 615.

[0034] An air pressure supply hole 124 is further formed through the internal space 121 of the mounting table 12 at a location different from the flat surface 122. The air pressure supply hole 124 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, a positive pressure supply pipe, etc. (not shown). Therefore, positive pressure or negative pressure is selectively generated in the air hole 123 through the air pressure supply hole 124 and the internal space 121. The air hole 123, the air pressure supply hole 124, and the air pressure circuit 75 function as a pressure adjustment unit.

[0035] Furthermore, pusher insertion holes 125 are formed in the flat surface 122 of the mounting table 12, penetrating the mounting table 12. The pusher insertion holes 125 are located outside the range of the air holes 123. Specifically, the pusher insertion holes 125 are positioned so that when the component-mounted sheet 66 is placed on the mounting table 12, they avoid the guide insertion holes 621 of the frame 62 and are blocked by the frame 62. Pushers 13 are inserted through the pusher insertion holes 125. The pushers 13 are retractable from the flat surface 122 of the mounting table 12. The pushers 13 are installed with sufficient rigidity, number, and spacing to lift and support the component-mounted sheet 66 parallel to the mounting table 12 when they protrude from the pusher insertion holes 125. For example, if the frame 62 has a rectangular outer shape, the rods are arranged at the corners of the frame 62.

[0036] Next, a large number of air holes 113 that communicate with the internal space 111 are also formed in the flat surface 112 of the ceiling portion 11. The range in which the air holes 113 are formed is the same size and shape as the inside of the frame 62 of the component-mounted sheet 66, or at least the same size and shape as the component arrangement area 615, and extends over the entire component arrangement area 615. The positions in which the air holes 113 are formed are positions that face the area inside the frame 62 or the component arrangement area 615 when the component-mounted sheet 66 is placed on the mounting table 12.

[0037] An air pressure supply hole 114 is formed through the internal space 111 of the ceiling portion 11 at a location different from the flat surface 112. The air pressure supply hole 114 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, etc. (not shown). Therefore, negative pressure is generated in the air hole 113 through the air pressure supply hole 114 and the internal space 111. The air hole 113, the air pressure supply hole 114, and the air pressure circuit 75 function as a pressure reducing section.

[0038] Furthermore, an O-ring 115 is installed on the flat surface 112 of the ceiling portion 11 along the frame 62 of the component-mounted sheet 66 placed on the mounting table 12, surrounding the area where the air hole 113 is inserted.

[0039] Fig. 7 shows the flow of operation of the embedding processing unit 1. Fig. 7 is a transition diagram that schematically shows the state of each step of the embedding processing unit 1. First, as shown in Fig. 7(a), a component-mounted sheet 66 is fed into the embedding processing unit 1. The ceiling 11 is sufficiently separated from the mounting table 12, and the tip of the pusher 13 protrudes from the flat surface 122 of the mounting table 12. When feeding the component-mounted sheet 66, the frame 62 of the component-mounted sheet 66 is aligned with the pusher 13, and the pusher 13 supports the component-mounted sheet 66.

[0040] Next, as shown in FIG. 7B, the pusher 13 is retracted into the pusher insertion hole 125. As a result, the component-mounted sheet 66 descends onto the flat surface 122 of the mounting table 12. The ceiling 11 is also moved toward the mounting table 12. The frame 62 of the component-mounted sheet 66 is then sandwiched between the flat surface 112 of the ceiling 11 and the flat surface 122 of the mounting table 12. The height H1 from the surface of the component arrangement area 615 to the top surface of the frame 62 is greater than the height H2 from the surface of the component arrangement area 615 to the top surfaces 603 of the electronic components 60. Therefore, when the frame 62 is sandwiched, the top surfaces 603 of the electronic components 60 do not reach the flat surface 112 of the ceiling 11. Therefore, the component arrangement area 615 on which the electronic components 60 are placed is enclosed in the sealed space 14 surrounded by the flat surface 112 of the ceiling portion 11, the protective sheet 61, and the frame 62 and sealed with the O-ring 115.

[0041] Once the component arrangement area 615 is enclosed in the sealed space 14, negative pressure is generated in the air holes 123 of the mounting table 12, sucking the protective sheet 61 to the flat surface 122, as shown in FIG. 7C. Next, negative pressure is also generated in the air holes 113 of the ceiling 11, as shown in FIG. 7D, to reduce the pressure in the sealed space 14 in which the component arrangement area 615 is enclosed. It is desirable that the pressures exerted by both air holes 113 and 123 be the same, close to a vacuum. The reason that the air holes 123 of the mounting table 12 generate negative pressure first is to prevent the air pressure below the protective sheet 61 from becoming excessively high compared to the air pressure above it during the process of reducing the pressure in the sealed space 14, thereby preventing the electronic components 60 from rushing forcefully onto the flat surface 112 of the ceiling 11. At this stage, the electronic component 60 is placed on the protective sheet 61 with the electrodes 602 not embedded in the adhesive surface 611 of the protective sheet 61, so there is a gap between the electrode exposed surface 601 and the adhesive surface 611, and this gap is also reduced in pressure.

[0042] 7(e), while maintaining the negative pressure on the ceiling 11 side, the air hole 123 on the mounting table 12 side is gradually changed from negative to positive pressure, and the air hole 123 of the mounting table 12 is converted to positive pressure. The electronic component 60 and the protective sheet 61 are gently sucked up to the flat surface 112 of the ceiling 11, and then gently pushed up again. The electronic component 60 is pressed against the flat surface 112 of the ceiling 11 and restrained. Meanwhile, because the adhesive surface 611 of the protective sheet 61 is flexible, it is further drawn to the flat surface 112 even after the electronic component 60 has been restrained, and is further pushed up toward the flat surface 112.

[0043] As a result, the electrodes 602 of the electronic components 60 become embedded in the protective sheet 61, more specifically, in the adhesive surface 611 of the protective sheet 61, and the electrode exposed surfaces 601 of the electronic components 60 come into close contact with the protective sheet 61. At this time, the flat surface 112 of the ceiling portion 11 encompasses the component arrangement area 615, making the component arrangement area 615 conform to the flat surface. In other words, the component arrangement area 615 does not curve. This prevents insufficient embedding of the electrodes 602 or insufficient adhesion of the electrode exposed surfaces 601 at the ends of the component arrangement area 615.

[0044] This process of bringing the electrode exposed surface 601 and the protective sheet 61 into close contact with each other is carried out in a reduced pressure environment, and there is no air or very little air in the sealed space 14. Therefore, there is little possibility of air bubbles entering between the electrode exposed surface 601 and the protective sheet 61.

[0045] 8 is an enlarged view of the gap between electronic components 60 in the embedding processing unit 1. As shown in FIG. 8, the positive pressure generated by the mounting table 12 evenly pushes up at least the component arrangement region 615 of the protective sheet 61. As a result, the flexible protective sheet 61 is further pushed toward the flat surface 112 of the ceiling portion 11 in each gap between adjacent electronic components 60 without being blocked by the electronic components 60. As a result, the adhesive surface 611 of the protective sheet 61 rises up to the lower part of the side surface of the electronic components 60, and the protective sheet 61 also adheres to the lower part of the side surface of the electronic components 60. This more reliably prevents particles of the electromagnetic wave shielding film 605 from entering between the electrode exposed surface 601 and the protective sheet 61.

[0046] Once the electrodes 602 of the electronic component 60 are embedded in the protective sheet 61 and the electrode-exposed surface 601 and the lower side surfaces of the electronic component 60 are in close contact with the protective sheet 61, as shown in FIG. 7(f), the pusher 13 is moved axially along the pusher insertion hole 125 and re-emerges from the flat surface 122 of the mounting table 12. At the same time, the ceiling portion 11 is moved away from the mounting table 12 at a speed equal to the moving speed of the pusher 13. Finally, as shown in FIG. 7(g), the pusher 13 is stopped and the ceiling portion 11 is further moved away from the mounting table 12, thereby releasing the component-embedded sheet 67 from its clamping position. This completes the embedding of the electronic component 60 into the protective sheet 61 by the embedding processing unit 1.

[0047] The negative pressure on the ceiling 11 side and the positive pressure on the mounting table 12 side may be released between the time when the electrode exposed surface 601 of the electronic component 60 is completely attached to the protective sheet 61 in Fig. 7(e) and the time when the ceiling 11 is raised in Fig. 7(g). It is preferable to release the negative pressure on the ceiling 11 side just before the ceiling 11 is raised in Fig. 7(g), because this allows the electronic component 60 to be stably held on the protective sheet 61 when the pusher 13 is raised in Fig. 7(f).

[0048] In this way, the ceiling 11 and the mounting table 12 sandwich the frame 62 from both sides, thereby forming a fixed portion that sandwiches the component-mounted sheet 66. The ceiling 11, protective sheet 61, and frame 62 also define an enclosed space 14 that confines the component arrangement area 615. The O-ring 115 enhances the reliability of the enclosed space 14 by sealing it. Furthermore, the air hole 113 in the ceiling 11 serves as a pressure reducing portion that reduces the pressure in the enclosed space 14.

[0049] The flat surface 122 of the mounting table 12 serves as a mounting surface for the component-mounted sheet 66. The air holes 123 opening in the flat surface 122 of the mounting table 12 generate negative pressure in advance when the sealed space 14 is depressurized, and serve as a collision prevention means for preventing the electronic components 60 from rushing onto the flat surface 112 of the ceiling portion 11, and as a pressing means for pressing the component arrangement area 615 against the flat surface 112 of the ceiling portion 11 by positive pressure in combination with the negative pressure of the ceiling portion 11, thereby embedding the electrodes 602 of the electronic components 60.

[0050] Furthermore, flat surface 112 of ceiling portion 11 serves as flattening means for conforming component arrangement region 615 to the flat surface and enhancing the embedding effect of electrodes 602 and the adhesion effect of electrode exposed surface 601. Air holes 113 opening into flat surface 112 of ceiling portion 11 serve as suction means that, in combination with the positive pressure of mounting table 12, presses component arrangement region 615 against flat surface 112 of ceiling portion 11 by negative pressure to embed electrodes 602 of electronic components 60, and as side lower covering means that, in combination with the positive pressure of mounting table 12, sucks protective sheet 61 into gaps between electronic components 60 and adheres it to the lower side surfaces of electronic components 60.

[0051] In this way, the embedding processing unit 1 embeds the electrodes 602 of the electronic component 60 in the adhesive surface 611 of the protective sheet 61, and also has a decompression unit that decompresses the space including the electronic component 60 and the component arrangement area 615. After decompression, the electronic component 60 and the protective sheet 61 are pressed together. This prevents air bubbles from getting between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61, resulting in insufficient adhesion, reduces the risk of gaps being generated between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61, and prevents particles of the electromagnetic wave shielding film 605 from adhering to the electrodes 602.

[0052] The embedding processing unit 1 also includes a pressure adjusting unit that adjusts the pressure in the space between the flat surface 112 of the ceiling unit 11 and the opposite side of the flat surface 112 across the protective sheet 61. The flat surface 112 is located on the opposite side of the electronic component 60 from the protective sheet 61, and faces the electronic component 60. Examples of the pressure adjusting unit include the air hole 123, the air pressure supply hole 124, and the air pressure circuit 75. This pressure adjusting unit makes the pressure in the space between the mounting table 12 and the protective sheet 61, i.e., the space on the opposite side of the flat surface 112 across the protective sheet 61, relatively higher than the pressure in the space between the protective sheet 61 and the flat surface 112.

[0053] This causes the electronic component 60 and the protective sheet 61 to face the flat surface 112, and the flat surface 112 acts as a stopper to press the electronic component 60 and the protective sheet 61 against each other. Therefore, the component arrangement area 615 of the protective sheet 61 conforms to the flat surface, and the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 press against each other in a parallel state. This further reduces the possibility of air bubbles getting in.

[0054] The thicknesses of the electronic components 60 and the protective sheet 61 are not uniform and vary. The pressure difference between the pressure in the sealed space 14 and the pressure between the mounting table 12 and the protective sheet 61 applies a force to the electronic components 60 and the protective sheet 61 to press them together evenly, regardless of the variation in thickness. This ensures that a sufficient pressing force is applied between the multiple electrodes 602 of each of the multiple electronic components 60 and the adhesive surface 611 of the protective sheet 61, and each electrode 602 of each electronic component 60 can be embedded in the protective sheet 61.

[0055] Furthermore, the embedding processing unit 1 has a flat surface 122 of the mounting table 12, i.e., a mounting surface located on the opposite side of the protective sheet 61 from the flat surface 112. The mounting table 12 is formed with air holes 123 that open to this mounting surface and generate negative pressure before the sealed space 14 is depressurized to separate the protective sheet 61 from the flat surface 112. This makes it possible to prevent the electronic component 60 from being damaged by rushing forcefully into the flat surface 112 while the sealed space 14 is being depressurized.

[0056] The air hole 113 in the ceiling portion 11, which presses the electronic component 60 and the protective sheet 61 together, and the air hole 123 in the mounting table 12 are used as pressure reducing sections, but a third air hole may be formed separately in the sealed space 14, and a negative pressure may be generated in the third air hole to reduce the pressure.

[0057] Furthermore, the air holes 123 on the mounting table 12 generate positive pressure after the sealed space 14 is decompressed, further pressing the protective sheet 61 against the electronic components 60 held by the flat surface 112. This causes the adhesive surface 611 to protrude along with the protective sheet 61 in the gaps between the electronic components 60, allowing the protective sheet 61 to cover the lower side surfaces of the electronic components 60. This reliably prevents gaps from forming between the electrode exposed surface 601 and the protective sheet 61. Furthermore, even for electronic components 60 such as SSOPs and QFPs that have thin plate-shaped electrodes on the lower side surfaces, the electrodes 602 can be covered with the protective sheet 61 to prevent particles from adhering to the electromagnetic wave shielding film 605, making this film forming apparatus 7 applicable.

[0058] In this embodiment, negative pressure is generated on the ceiling 11, and positive pressure is generated on the mounting table 12 on the opposite side of the ceiling 11 with the protective sheet 61 sandwiched between them. First, this is to press the electronic components 60 and the protective sheet 61 together, and second, this is to raise the adhesive surface 611 in the gaps between the electronic components 60 to cover the lower parts of the sides of the electronic components 60.

[0059] However, this magnitude of pressure difference is not essential to achieve pressing the electronic component 60 and the protective sheet 61 against each other. The pressure difference at which the electrodes 602 of the electronic component 60 are embedded in the protective sheet 61 depends on the flexibility of the protective sheet 61. The negative pressure on the mounting table 12 side may be made weaker than the negative pressure on the ceiling 11 side, without changing the pressure on the mounting table 12 side to a positive pressure. In other words, "relatively large" includes a case where the ceiling 11 side is under negative pressure and the mounting table 12 is under positive pressure including atmospheric pressure, and a case where the negative pressure on the mounting table 12 is higher than the negative pressure on the ceiling 11 side but lower than atmospheric pressure. It is sufficient that a pressure difference can be created between the ceiling 11 side and the mounting table 12 side that allows the electrodes 602 to be embedded in the protective sheet 61.

[0060] However, when the electronic components 60 and the protective sheet 61 are pressed together by the differential pressure between the negative pressure on the ceiling 11 side and atmospheric pressure or a pressure exceeding atmospheric pressure generated on the mounting table 12 on the opposite side of the ceiling 11 with the protective sheet 61 in between, a large pressing force can be applied, so that a sufficient pressing force can be reliably applied between the multiple electrodes 602 of each of the multiple electronic components 60 and the adhesive surface 611 of the protective sheet 61, and each electrode 602 of each electronic component 60 can be embedded in the protective sheet 61.

[0061] Furthermore, the protective sheet 61 is pushed up by the pressure difference, but the amount of pushing up in the component arrangement region 615 is determined by the flat surface 112. In other words, the amount of deformation of the protective sheet 61 is determined by the flat surface 112, so the pushing-up force due to the pressure difference is also applied to the protective sheet 61 located in the gaps between the electronic components 60 in the component arrangement region 615. At this time, the protective sheet 61 located in the gaps between the electronic components 60 is not in contact with the flat surface 112, so a reduced pressure space exists above it. For this reason, the adhesive surface 611 in the gap portion together with the protective sheet 61 rises due to the pressure difference, and the lower side surfaces of the electronic components 60 can also be covered with the protective sheet 61.

[0062] Therefore, in this embodiment, to cover the lower side surfaces of the electronic components 60, negative pressure is generated in the ceiling 11 and positive pressure is generated in the mounting table 12, so that the component arrangement area 615 is pressed against the flat surface 112 of the ceiling 11. However, depending on the flexibility of the protective sheet 61, the adhesive surface 611 may be able to protrude into the gaps between the electronic components 60 even without a differential pressure between a near-vacuum pressure on the ceiling 11 side and atmospheric pressure or a pressure exceeding atmospheric pressure on the mounting table 12 side. Therefore, while it is desirable to change the mounting table 12 side to a positive pressure in order to cover the lower side surfaces of the electronic components 60, it is not essential to adjust the mounting table 12 side to a positive pressure. In other words, it is sufficient to adjust the differential pressure according to the flexibility of the protective sheet 61. Depending on the flexibility of the protective sheet 61, after the pressure on the ceiling 11 side has been reduced, the negative pressure on the mounting table 12 side may be weakened even if it does not reach atmospheric pressure.

[0063] Furthermore, the electromagnetic wave shielding film 605, which will be described later, can improve shielding performance by connecting it to the ground wiring of the electronic component 60. This ground wiring is a wiring for dissipating unnecessary electromagnetic waves to the outside, and is generally formed on the side surface 604 of the electronic component 60. It is necessary to avoid obstructing the connection between the electromagnetic wave shielding film 605 and the ground wiring due to a protrusion of the adhesive surface 611 that reaches the lower part of the side surface of the electronic component 60.

[0064] This embedding processing unit 1 can independently adjust the pressure on the ceiling 11 side and the mounting table 12 side to create a desired pressure difference, and therefore can adjust the height of the protrusion extending to the lower part of the side of the electronic component 60, thereby enabling uniform control over the lower part of the side of the electronic component 60. That is, by tightly adhering the lower part of the side to the protective sheet 61, it is possible to more reliably seal the gap leading to the electrode 602, or, in the case of electronic component 60 being an SOI or QFP, it is possible to embed the electrodes on the lower part of the side in the protective sheet 61 while leaving the ground wiring on the side 604 exposed because the protective sheet 61 does not reach the ground wiring.

[0065] It should be noted that known mechanisms can be applied to the operating mechanism of the ceiling portion 11 and the operating mechanism of the pusher 13, and the present invention is not limited to the mechanisms.

[0066] For example, ceiling 11 is connected to a ball screw whose axis extends from ceiling 11 toward mounting table 12, and to a rail guide that extends from ceiling 11 toward mounting table 12. Ceiling 11 moves toward mounting table 12 along the rail in accordance with the rotation direction of the screw shaft. The ball screw and rail guide extend so that ceiling 11 approaches mounting table 12 up to a distance equal to thickness H1 of frame 62 of component-mounted sheet 66. Note that it is sufficient if ceiling 11 and mounting table 12 can move relative to each other; therefore, the arrangement is not limited to one in which ceiling 11 moves; mounting table 12 may also move, or both ceiling 11 and mounting table 12 may move.

[0067] The rear end of the pusher 13 is a cam follower. The cam follower follows the circumferential surface of an egg-shaped cam. The cam is journaled by a rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulge of the cam, pushing up the pusher 13, causing the tip of the pusher 13 to protrude from the insertion hole.

[0068] Furthermore, the method of fixing the component-mounted sheet 66 is described above by sandwiching the frame 62 between the ceiling 11 and the mounting table 12, defining the sealed space 14 between the ceiling 11, the protective sheet 61, and the frame 62, and selectively generating both positive and negative pressures in the air holes 123 of the mounting table 12. However, this is not limiting. For example, one or both of the ceiling 11 and the mounting table 12 may be cup-shaped, and the component-mounted sheet 66 may be accommodated in the internal space defined by the ceiling 11 and the mounting table 12. Block bodies may be provided to sandwich the frame 62 from both sides, and the component-mounted sheet 66 may be sandwiched between the block bodies. In this case, the height of the frame 62 is not important. Both through-holes for generating negative pressure and through-holes for generating positive pressure may be formed in the flat surface 122 of the mounting table 12.

[0069] [Plate mounting part] Next, the plate mounting unit 2, which is responsible for the plate mounting step, will be described. Fig. 9 is a schematic diagram showing the configuration of the plate mounting unit 2. The component-embedded sheet 67 prepared in the embedding processing unit 1 and the cooling plate 63 to which an adhesive sheet 64 has been attached in advance are fed into the plate mounting unit 2. The plate mounting unit 2 presses the component-embedded sheet 67 against the cooling plate 63 and also attracts the component-embedded sheet 67 to the cooling plate 63, thereby bringing the component-embedded sheet 67 into close contact with the cooling plate 63 via the adhesive sheet 64.

[0070] As shown in Figure 9, this plate mounting unit 2 has a ceiling portion 21 and a mounting table 22. The ceiling portion 21 and the mounting table 22 are arranged opposite each other. The mounting table 22 is fixed in position. On the other hand, the ceiling portion 21 can be raised and lowered relative to the mounting table 22. The ceiling portion 21 approaches the mounting table 22 to at least a distance equal to the thickness H1 of the frame 62 of the component-embedded sheet 67.

[0071] The ceiling portion 21 is a block having an internal space 211, and has a flat surface 212 facing the mounting table 22. The mounting table 22 has a cup shape with a bottom. An opening 221 of the mounting table 22 faces the ceiling portion 21. The flat surface 212 of the ceiling portion 21 is the same size and shape as the component-embedded sheet 67, or is wider than the component-embedded sheet 67. On the other hand, the opening 221 of the mounting table 22 has an encompassing area equal to or larger than the component arrangement area 615 and equal to or smaller than the inner frame area 614. The edge 222 around the opening 221 of the mounting table 22 has a width equal to or larger than the width of the frame 62.

[0072] In this mounting table 22, the edge 222 supports the cooling plate 63, and the opening 221 is closed by the cooling plate 63. The cooling plate 63 has a surface opposite to the surface to which the adhesive sheet 64 is attached abutting the edge 222. Furthermore, the component-embedded sheet 67 is placed on the cooling plate 63 with the adhesive sheet 64 facing it. An air pressure supply hole 223 penetrates the bottom of the mounting table 22. The air pressure supply hole 223 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, etc. (not shown). Therefore, negative pressure is generated in the air hole 632 of the cooling plate 63 placed with the opening 221 closed. In other words, the opening 221 functions as a mounting surface-side air hole. The adhesive sheet 64 may be previously attached to the non-adhesive surface 612 of the protective sheet 61 before being inserted into the plate mounting unit 2.

[0073] Furthermore, a pusher insertion hole 224 is formed in the edge 222 of the mounting table 22, penetrating the mounting table 22. The position of the pusher insertion hole 224 coincides with the pusher insertion hole 631 of the cooling plate 63, and is located at a position that is blocked by the frame 62 when the component-embedded sheet 67 is placed thereon, avoiding the guide portion insertion hole 621 of the frame 62. A pusher 23 is inserted through the pusher insertion hole 224. The pusher 23 is capable of penetrating the mounting table 22, the cooling plate 63, and the adhesive sheet 64 and retracting therefrom.

[0074] The pushers 23 are installed with sufficient rigidity, number, and positional relationship to support the component-embedded sheet 67 in parallel and spaced apart from the cooling plate 63 while protruding from the cooling plate 63. For example, if the outer shape of the frame 62 is rectangular, the pushers 23 are arranged as rods corresponding to the corners of the frame 62. The pusher insertion holes 224 are also provided in accordance with the number and positional relationship of the pushers 23.

[0075] Next, a large number of air holes 213 are formed through flat surface 212 of ceiling portion 21, leading to internal space 211. The range in which air holes 213 are formed is the same size and shape as the inside of frame 62 of component-embedded sheet 67, or at least the same size and shape as component arrangement area 615. The positions at which air holes 213 are formed are positions that will be covered by component arrangement area 615 when component-embedded sheet 67 is placed on mounting table 22 (see FIG. 10(a)).

[0076] An air pressure supply hole 214 penetrates the internal space 211 of the ceiling portion 21 at a location different from the flat surface 212. The air pressure supply hole 214 is connected to an air pressure circuit 75 that includes a compressor, a positive pressure supply pipe, a negative pressure supply pipe, etc. (not shown). Therefore, positive pressure and negative pressure are selectively generated in the air hole 213 through the air pressure supply hole 214 and the internal space 211. That is, the internal space 211 of the ceiling portion 21, the flat surface 212, the air hole 213, the air pressure supply hole 214, and the air pressure circuit 75 function as both a protective sheet holding portion and a positive pressure portion. When the air pressure circuit 75 generates negative pressure in the air hole 213, it functions as a protective sheet holding portion, and when the air pressure circuit 75 generates positive pressure in the air hole 213, it functions as a positive pressure portion.

[0077] Furthermore, an O-ring 215 is installed on the flat surface 212 of the ceiling portion 21, along the frame 62 of the component-embedded sheet 67 placed on the mounting table 22, surrounding the area where the air holes 213 are inserted. That is, the outer periphery of the flat surface 212 of the ceiling portion 21 presses against the frame 62 via the O-ring 215, and presses the outer periphery of the protective sheet 61 against the cooling plate 63. In other words, the ceiling portion 21 functions as a pressing portion that presses the outer periphery of the protective sheet 61 against the cooling plate 63.

[0078] FIG. 10 shows the flow of operation of the plate mounting unit 2. FIG. 10 is a transition diagram that schematically shows the state of the plate mounting unit 2 in each process. First, as shown in FIG. 10(a), the ceiling 21 is separated from the mounting table 22. A cooling plate 63 is placed on the mounting table 22 in advance. The pusher 23 is also inserted through the mounting table 22, the cooling plate 63, and the adhesive sheet 64 and protrudes toward the ceiling 21. In this state, the frame 62 of the component-embedded sheet 67 is aligned with the pusher 23, and the pusher 23 supports the component-embedded sheet 67. The ceiling 21 is then lowered toward the pusher 23, and the frame 62 of the component-embedded sheet 67 is sandwiched between the ceiling 21 and the pusher 23.

[0079] At this time, height H1 from the surface of component arrangement area 615 to the upper surface of frame 62 is higher than height H2 from the surface of component arrangement area 615 to top surface 603 of electronic component 60. Therefore, when frame 62 is sandwiched, top surface 603 of electronic component 60 does not reach flat surface 212 of ceiling portion 21. Therefore, at least component arrangement area 615 is enclosed in sealed space 24a defined by ceiling portion 21, protective sheet 61, and frame 62 and sealed with O-ring 215.

[0080] When the component arrangement area 615 is enclosed in the sealed space 24a, a negative pressure is generated on the flat surface 212 of the ceiling portion 21. The electronic components 60 are attracted to the flat surface 212. The component-embedded sheet 67 is distorted in the inner frame area 614, and the entire component arrangement area 615 is attracted to the flat surface 212 while remaining flat. Therefore, the component arrangement area 615 does not bend or curve, and the embedded electrodes 602 do not detach from the protective sheet 61. Note that the negative pressure on the flat surface 212 of the ceiling portion 21 is preferably generated by gradually reducing the pressure so that the electronic components 60 do not rush toward the flat surface 212 with great force. The magnitude of the negative pressure at this time is preset in the control unit 74. Considering the relationship with the reduced pressure in the sealed space 24b described below, a pressure close to a vacuum (0 atmospheres) is preferable.

[0081] 10(b), pusher 23 and ceiling portion 21 are lowered toward mounting table 22 at a constant speed. Then, the frame 62 area of ​​component-embedded sheet 67 is brought into contact with adhesive sheet 64 on cooling plate 63. Furthermore, ceiling portion 21 is moved toward mounting table 22 and pressed against it, thereby adhering the frame 62 area to adhesive sheet 64. When the frame 62 area of ​​component-embedded sheet 67 is brought into contact with adhesive sheet 64 on cooling plate 63, the negative pressure on ceiling portion 21 is maintained, and component-embedded sheet 67 is attracted to flat surface 212 of ceiling portion 21, so that component arrangement area 615 is not in contact with (is separated from) adhesive sheet 64.

[0082] If negative pressure is not generated in the ceiling portion 21, the component-embedded sheet 67 will come into contact with the adhesive sheet 64 in an air-containing environment. This can lead to the risk of air bubbles getting trapped between the component-embedded sheet 67 and the adhesive sheet 64. If air bubbles get trapped, the heat transfer area to the cooling plate 63 will decrease, and the heat dissipation effect of the electronic components 60 during film formation will decrease. However, in this plate attachment portion 2, in an air-containing environment, the component-embedded sheet 67 is raised in a direction away from the adhesive sheet 64, preventing air bubbles from getting trapped.

[0083] When the frame 62 is brought into close contact with, or pressed against, the adhesive sheet 64 via the protective sheet 61, the protective sheet 61, the cooling plate 63, and the frame 62 define a sealed space 24b between the non-adhesive surface 612 of the protective sheet 61 and the adhesive sheet 64 side of the cooling plate 63. When the sealed space 24b is formed, as shown in FIG. 10(c), a negative pressure is also generated in the mounting table 22 while maintaining the negative pressure in the ceiling 21. In other words, the sealed space 24b is depressurized while the outer periphery (outer frame region 613) of the protective sheet 61 is pressed by the ceiling 21. The sealed space 24b between the cooling plate 63 on which the adhesive sheet 64 is placed and the protective sheet 61 is depressurized through the air holes 632 in the cooling plate 63 and the air holes 632 in the adhesive sheet 64. In other words, the air holes 632 in the cooling plate 63 and the air holes 632 in the adhesive sheet 64 function as plate-side air holes on the plate mounting unit 2. At this time, the negative pressure generated on the mounting table 22 should be slightly closer to atmospheric pressure than the negative pressure generated on the ceiling 21, and should be large enough to maintain the electronic component 60 attached to the ceiling 21. This negative pressure is preset in the control unit 74.

[0084] When the sealed space 24b between the cooling plate 63 on which the adhesive sheet 64 is placed and the protective sheet 61 has been depressurized to the preset negative pressure, the negative pressure in the ceiling 21 is gradually changed to a positive pressure while maintaining the negative pressure in the mounting table 22, as shown in FIG. 10(d). In other words, while the reduced pressure in the sealed space 24b is maintained, the ceiling 21 is released from its hold on the protective sheet 61. The component-embedded sheet 67 is slowly sucked down toward the adhesive sheet 64 and then pushed down again, and the component-embedded sheet 67 is pressed against the adhesive sheet 64 attached to the cooling plate 63. The component-embedded sheet 67 is then attached to the cooling plate 63 via the adhesive sheet 64.

[0085] If the negative pressure on the mounting table 22 side and the negative pressure on the ceiling 21 side are made the same or approximately the same, the protective sheet 61 will elastically contract and come into contact with the adhesive sheet 64. Therefore, the negative pressure on the mounting table 22 side may be made the same or approximately the same as the negative pressure on the ceiling 21 side, and after contact occurs, the negative pressure on the ceiling 21 side may be gradually changed to a positive pressure.

[0086] 10(e), the ceiling 21 is moved away from the mounting table 22, thereby releasing the overlapping sandwich of the component-embedded sheet 67, the adhesive sheet 64, and the cooling plate 63. This completes the production of the component-mounting plate 68 made up of the electronic components 60, the protective sheet 61, the adhesive sheet 64, and the cooling plate 63. The positive pressure generated in the ceiling 21 and the negative pressure generated in the mounting table 22 can be released while the ceiling 21 is being moved away from the mounting table 22.

[0087] That is, the ceiling 21, pusher 23, and mounting table 22 function as a drive unit that brings the component-embedded sheet 67 and the cooling plate 63 closer together. The ceiling 21 and mounting table 22 function as a fixing unit that sandwiches the component-embedded sheet 67 and the cooling plate 63, and also as a pressing unit that presses the frame 62 and the cooling plate 63 together to tightly contact them. The air pressure supply hole 223 of the mounting table 22 functions as a pressure reducing unit that reduces the pressure in the sealed space 24b between the component-embedded sheet 67 and the cooling plate 63. The air hole 213 of the ceiling 21 functions as a pressure reducing unit that reduces the pressure in the sealed space 24a between the flat surface 212 of the ceiling 21 and the component-embedded sheet 67.

[0088] The flat surface 212 of the ceiling portion 21 generates a negative pressure prior to the reduction in pressure between the component-embedded sheet 67 and the cooling plate 63, thereby holding the component-embedded sheet 67 and serving as a separating means for preventing air bubbles from getting between the component-embedded sheet 67 and the cooling plate 63, and serves as a pressing means for pressing the component-embedded sheet 67 against the cooling plate 63 by the positive pressure acting as a positive pressure portion in combination with the suction caused by the negative pressure of the mounting table 22. The mounting table 22 also serves as a suction means for pressing the component-embedded sheet 67 against the cooling plate 63 by the negative pressure in combination with the pressing caused by the positive pressure of the ceiling portion 21.

[0089] In this way, the plate mounting unit 2 attaches the protective sheet 61, in which the electrodes 602 of the electronic components 60 are embedded, to the cooling plate 63. The plate mounting unit 2 has a ceiling portion 21 as a pressing portion that presses the outer periphery of the frame 62, etc. of the protective sheet 61, against the cooling plate 63, and also has a pressure reducing portion that reduces the pressure in the space between the component arrangement area 615 and the cooling plate 63. The plate mounting unit 2 also presses the protective sheet 61 and the cooling plate 63 together via the adhesive sheet 64 while the pressure reducing portion is in a state where the pressure is reduced. This allows the protective sheet 61 and the cooling plate 63 to be tightly attached without any air bubbles being trapped between them, ensuring a sufficient heat transfer area to the cooling plate 63.

[0090] The plate mounting unit 2 also has air holes 213 on the flat surface 212 of the ceiling portion 21, i.e., on the opposite side of the cooling plate 63 across the protective sheet 61, that use negative pressure to suck up the protective sheet 61 and separate the cooling plate 63 from the protective sheet 61. The flat surface 212 with the air holes 213 serves as a protective sheet holding unit, and when the pressing unit brings the outer periphery of the protective sheet 61 into contact with the cooling plate 63, holds the protective sheet 61 so as to separate the area of ​​the protective sheet 61 where the electronic components 60 are arranged from the cooling plate 63. The negative pressure is maintained until the pressure reduction unit reduces the pressure between the component-embedded sheet 67 and the cooling plate 63, and the holding is released under reduced pressure. This prevents the protective sheet 61 and the cooling plate 63 from adhering to each other before the pressure reduction is complete, further reduces the risk of air bubbles being trapped between the protective sheet 61 and the cooling plate 63, and ensures a sufficient heat transfer area to the cooling plate 63.

[0091] Furthermore, air holes 213 opening in flat surface 212 of ceiling 21 are configured to generate negative pressure before pusher 23 descends and ceiling 21 abuts against mounting table 22 via frame 62 of component-embedded sheet 67, that is, before component-embedded sheet 67 and cooling plate 63 approach each other, or at the latest before a space is formed between cooling plate 63 provided with adhesive sheet 64 and protective sheet 61. This makes it possible to prevent protective sheet 61 from accidentally sticking to cooling plate 63 before pusher 23, on which protective sheet 61 (component-embedded sheet 67) is set, begins to descend.

[0092] The plate mounting section 2 also has a flat surface 212 on the ceiling section 21. This flat surface 212 is located on the opposite side of the protective sheet 61 from the cooling plate 63, facing the electronic components 60. Air holes 213, which keep the cooling plate 63 and the protective sheet 61 apart until the decompression between the component-embedded sheet 67 and the cooling plate 63 is complete, are opened to this flat surface 212. This prevents the protective sheet 61 from bending and warping due to the pressure difference between the front and back of the protective sheet 61 during decompression, and allows the protective sheet 61 to conform flat, preventing the electronic components 60 from peeling off the protective sheet 61 during plate mounting.

[0093] This air hole 213 on the ceiling 21 side functions as a positive pressure section, and after the pressure between the component-embedded sheet 67 and the cooling plate 63 reaches a predetermined set value, it switches from generating negative pressure to generating positive pressure, pressing the protective sheet 61 toward the cooling plate 63. In other words, this air hole 213 serves as a section for keeping the protective sheet 61 spaced apart from the cooling plate 63, a decompression section for decompressing the sealed space 24a, and a positive pressure section for generating positive pressure, thereby pressing the protective sheet 61 against the cooling plate 63. However, the functions of the separation, decompression, and contact section may be performed by an air hole provided in a separate member.

[0094] For example, as in this embodiment, the cooling plate 63 is provided with air holes 632. The plate mounting unit 2 has a mounting table 22 on which the cooling plate 63 is placed and which generates negative pressure. The protective sheet 61 may be pulled to the cooling plate 63 through the mounting table 22 on which the cooling plate 63 is placed and the air holes 632 of the cooling plate 63.

[0095] The operating mechanism of the ceiling portion 21 and the operating mechanism of the pusher 23 may be any known mechanism, and the present invention is not limited to the mechanism.

[0096] For example, a ball screw having an axis extending from the ceiling 21 toward the mounting table 22 and a rail guide extending from the ceiling 21 toward the mounting table 22 are connected to the ceiling 21. In this case, the ceiling 21 moves toward the mounting table 22 along the rail in accordance with the rotation direction of the screw axis. The ball screw and rail guide extend so that the ceiling 21 approaches the mounting table 22 up to a distance equivalent to the thickness H1 of the frame 62 of the component-embedded sheet 67.

[0097] The rear end of the pusher 23 is a cam follower. The cam follower follows the circumferential surface of an egg-shaped cam. The cam is journaled by a rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulge of the cam, pushing up the pusher 23.

[0098] Furthermore, the sealed spaces 24a and 24b may be defined by the ceiling 21 and the mounting table 22, rather than by the component-embedded sheet 67 and the cooling plate 63. For example, one or both of the ceiling 21 and the mounting table 22 may be cup-shaped, and the component-embedded sheet 67 and the cooling plate 63 may be accommodated in a single space defined by the ceiling 21 and the mounting table 22 to encompass them. The ceiling 21 and the mounting table 22 may further define the front and back of the component-embedded sheet 67. In this case, however, it is preferable that the ceiling 21 has a side wall extending toward the mounting table 22, surrounding the flat surface 212 with the air hole 213. This side wall is in close contact with the flat surface of the mounting table 22 to define a single sealed space. An O-ring 215 is attached to the end face of the side wall.

[0099] [Film forming processing section] Next, the film formation processing unit 3 that is responsible for the film formation process will be described. FIG. 11 is a schematic diagram showing the configuration of the film formation processing unit 3. The film formation processing unit 3 forms an electromagnetic wave shielding film 605 by sputtering on each electronic component 60 on a component mounting plate 68. As shown in FIG. 11, the film formation processing unit 3 has a chamber 31 and a load lock chamber 32. The chamber 31 is a cylindrical vacuum chamber whose diameter is wider in the radial direction than in the axial direction. The interior of the chamber 31 is divided into multiple fan-shaped compartments by partitions 33 that extend along the radial direction. Some of the fan-shaped compartments are assigned processing positions 311 and film formation positions 312.

[0100] The partition 33 extends from the ceiling surface of the chamber 31 toward the bottom surface, but does not reach the bottom surface. A turntable 34 is installed in the bottom side space where the partition 33 does not exist. The turntable 34 has a disk shape coaxial with the chamber 31 and rotates in a circumferential direction. A component-mounted plate 68 loaded into the chamber 31 from the load lock chamber 32 is placed on the turntable 34 and moves around a circular trajectory, traveling between the processing position 311 and the film-forming position 312.

[0101] In addition, in order to maintain the position of the component mounting plate 68 relative to the rotary table 34, the rotary table 34 is provided with a holding means for holding the component mounting plate 68, such as a groove, hole, protrusion, jig, holder, mechanical chuck, or adhesive chuck.

[0102] A surface treatment unit 35 is installed in the treatment position 311. A process gas such as argon gas is introduced into this surface treatment unit 35, and the process gas is converted into plasma by applying a high-frequency voltage, thereby generating electrons, ions, radicals, etc. For example, this surface treatment unit 35 is a cylindrical electrode that opens on the side of the turntable 34, and a high-frequency voltage is applied from an RF power supply.

[0103] A target 361 constituting the sputtering source 36 is installed in the film formation position 312, and a sputtering gas, which is an inert gas such as argon gas, is introduced into the sputtering source 36. The sputtering source 36 applies power to the target 361 to convert the sputtering gas into plasma, and the generated ions collide with the target 361 to knock out particles. The target 361 is made of the material of the electromagnetic wave shielding film 605. That is, particles of the electromagnetic wave shielding film 605 are knocked out from the target 361, and the knocked out particles of the electromagnetic wave shielding film 605 are deposited on the electronic components 60 on the turntable 34.

[0104] For example, two film formation positions 312 are provided. The target materials at each film formation position 312 may be the same material, or different materials may be used to form a laminated electromagnetic wave shielding film 605. Well-known power supplies such as a DC power supply, a DC pulse power supply, or an RF power supply may be used as the power supply that applies power to the sputtering sources 36 at each film formation position 312. Furthermore, a power supply that applies power to each sputtering source 36 may be provided for each sputtering source 36, or a common power supply may be used that is switched by a switch.

[0105] In this film formation processing unit 3, the electronic component 60 is subjected to surface cleaning and roughening by etching or ashing at the processing position 311 to improve adhesion of the electromagnetic wave shielding film 605 to the electronic component 60, and particles from the target 361 are deposited on the electronic component 60 at the film formation position 312 to form the electromagnetic wave shielding film 605 on the electronic component 60. Since the electrode 602 is embedded in the protective sheet 61 and the exposed electrode surface 601 is in close contact with the protective sheet 61, particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602 and from entering between the exposed electrode surface 601 and the protective sheet 61. Furthermore, heat from the electronic component 60 is transferred to the cooling plate 63, suppressing excessive heat accumulation in the electronic component 60.

[0106] Although the film forming unit 3 forms a film on the electronic component 60 by sputtering, the film forming method is not limited to this. For example, the film forming unit 3 may form the electromagnetic wave shielding film 605 on the electronic component 60 by vapor deposition, spray coating, painting, or the like.

[0107] [Plate release part] Next, the plate releasing unit 4, which is responsible for the plate releasing step, will be described. Fig. 12 is a schematic diagram showing the configuration of the plate releasing unit 4. After the electromagnetic wave shielding film 605 has been formed, the component-mounted plate 68 is introduced into the plate releasing unit 4. As the first step in obtaining individual electronic components 60, the plate releasing unit 4 peels off the component-embedded sheet 67 from the cooling plate 63.

[0108] As shown in Figure 12, the plate release unit 4 includes a ceiling 41 and a mounting table 42. The ceiling 41 and mounting table 42 are arranged opposite each other. The mounting table 42 is stationary. Meanwhile, the ceiling 41 can move up and down relative to the mounting table 42. The ceiling 41 approaches the mounting table 42 to at least a distance equal to the thickness H1 of the frame 62 of the component mounting plate 68.

[0109] The ceiling 41 is a block with an internal space 411, and has a flat surface 412 facing the mounting table 42. The mounting table 42 has a cup shape with a bottom, and an opening 421 faces the ceiling 41. The flat surface 412 of the ceiling 41 is the same size and shape as the component mounting plate 68, or is wider than the component mounting plate 68. Meanwhile, the opening 421 of the mounting table 42 has an encompassing area that is equal to or larger than the component arrangement area 615 and equal to or smaller than the inner frame area 614. The edge 422 around the opening 421 of the mounting table 42 has a width that is equal to or larger than the width of the frame 62.

[0110] In this mounting table 42, the edge 422 supports the component mounting plate 68, and the opening 421 is closed by the component mounting plate 68. The cooling plate 63 abuts against the edge 422. An air pressure supply hole 423 penetrates the bottom of the mounting table 42. The air pressure supply hole 423 is connected to an air pressure circuit 75 including a compressor, a positive pressure supply pipe, etc. (not shown). Therefore, positive pressure is generated in the air hole 632 of the component mounting plate 68, which is placed with the opening 421 closed.

[0111] Furthermore, a pusher insertion hole 424 is formed in an edge portion 422 of the mounting table 42, penetrating the mounting table 42. The position of the pusher insertion hole 424 coincides with the pusher insertion hole 631 of the cooling plate 63, and is located at a position that is blocked by the frame 62 when the component mounting plate 68 is placed thereon, avoiding the guide portion insertion hole 621 of the frame 62. A pusher 43 is inserted through this pusher insertion hole 424. The pusher 43 moves axially so that its tip can protrude to a position higher than the frame 62 of the component mounting plate 68 placed on the mounting table 42.

[0112] The pushers 43 are installed with sufficient rigidity, number, and positional relationship to peel the component-embedded sheet 67 from the cooling plate 63 against the adhesive force between the outer frame region 613 and the adhesive sheet 64, separate the component-embedded sheet 67 from the cooling plate 63, and lift and support the component-embedded sheet 67 in a parallel manner. For example, if the outer shape of the frame 62 is rectangular, the pushers 43 are arranged as rods corresponding to the respective corners of the frame 62. The pusher insertion holes 424 are also provided in accordance with the number and positional relationship of the pushers 43.

[0113] A pair of clamping blocks 44 are disposed on both sides of the mounting table 42. The clamping blocks 44 sandwich only the cooling plate 63 of the component mounting plate 68 placed on the mounting table 42. That is, the pair of clamping blocks 44 are disposed at the same height as the cooling plate 63 placed on the mounting table 42, and have the same thickness as the cooling plate 63. The clamping blocks 44 can move toward and away from each other with the cooling plate 63 at the center. However, the clamping blocks 44 are immovable in the direction in which the ceiling 41 and the mounting table 42 are aligned.

[0114] Next, a large number of air holes 413 that communicate with the internal space 411 are formed through the flat surface 412 of the ceiling portion 41. The range in which the air holes 413 are formed is the same size and shape as the inside of the frame 62 of the protective sheet 61, or at least the same size and shape as the component arrangement area 615. The positions in which the air holes 413 are formed are positions that will be covered by the component arrangement area 615 when the component mounting plate 68 is placed on the mounting table 42.

[0115] An air pressure supply hole 414 is formed through the internal space 411 of the ceiling portion 41 at a location different from the flat surface 412. The air pressure supply hole 414 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, etc. (not shown). Therefore, negative pressure is generated in the air hole 413 through the air pressure supply hole 414 and the internal space 411.

[0116] Furthermore, an O-ring 415 is installed on the flat surface 412 of the ceiling portion 41, along the frame 62 of the component mounting plate 68 placed on the mounting table 42, surrounding the area where the air hole 413 is inserted. The peripheral edge of the flat surface 412 of the ceiling portion 41 facing the frame 62 functions as a fixing portion that presses down portions of the protective sheet 61 that are outside the component arrangement area 615 where the electronic components 60 are arranged. This fixing portion presses down the protective sheet 61 over the entire peripheral edge that faces the frame 62, that is, presses down the frame 62 over the entire area, but it is not necessary to press down the entire area, and there may be some areas that are not pressed down.

[0117] The peripheral edge of the flat surface 412 of the ceiling portion 41 facing the frame 62 functions as a fixing portion that presses down a portion of the protective sheet 61 that is outside the component arrangement area 615 where the electronic components 60 are arranged. This fixing portion is directly grounded by the grounding portion 41a. In other words, the ceiling portion 41 is made of a conductive material, and the grounding portion 41a is configured, for example, by fixing a cable connected to a ground potential portion to the outer surface of the ceiling portion 41. The cable has flexibility that allows it to displace in accordance with the movement of the ceiling portion 41.

[0118] A conductive member 416 is provided between the flat surface 412 and the electronic components 60 arranged on the protective sheet 61. The conductive member 416 is electrically connected to the fixing portion and has breathability. More specifically, the conductive member 416 is a flexible metal mesh. The conductive member 416 covers the area of ​​the protective sheet 61 where the electronic components 60 are arranged, and is fixed to the flat surface 412 of the ceiling portion 41. A groove 412a is formed in the flat surface 412 along the inside of the installation area of ​​the O-ring 415, and the conductive member 416 is fixed by a fixing frame 412b that is aligned with the groove 412a so that the vicinity of the outer edge thereof is embedded in the groove 412a.

[0119] The conductive member 416 is in contact with the electronic components 60 while pressure is being applied to the area of ​​the protective sheet 61 where the electronic components 60 are arranged. The contact between the electronic components 60 and the conductive member 416 here is achieved via the electromagnetic wave shielding film 605. At this time, the conductive member 416 deforms in accordance with the protective sheet 61 and the electronic components 60, thereby ensuring electrical connection between all of the electronic components 60 arranged on the protective sheet 61 and the electromagnetic wave shielding film 605.

[0120] Fig. 13 shows the flow of operation of the plate release unit 4. Fig. 13 is a transition diagram that schematically shows the state of each process of the plate release unit 4. First, as shown in Fig. 13(a), the ceiling part 41 is separated from the mounting table 42, and the pusher 43 is sunk into the pusher insertion hole 424 of the mounting table 42. Then, the component mounting plate 68 is placed on the mounting table 42. Once the component mounting plate 68 is placed, the clamping block 44 fixes the cooling plate 63.

[0121] Next, as shown in FIG. 13(b), the ceiling portion 41 is lowered toward the mounting table 42, and the flat surface 412 of the ceiling portion 41, i.e., the fixed portion, is brought into contact with the frame 62 of the component mounting plate 68. At this time, the height H1 from the surface of the component arrangement area 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component arrangement area 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 is sandwiched, the top surface 603 of the electronic component 60 does not reach the flat surface 412 of the ceiling portion 41. Therefore, at least the component arrangement area 615 is enclosed in the sealed space 45 defined by the ceiling portion 41, the protective sheet 61, and the frame 62 and sealed with the O-ring 415. In addition, the conductive member 46 provided on the ceiling portion 41 is arranged to cover the component arrangement area 615.

[0122] 13(c), when the component arrangement area 615 is enclosed in the sealed space 45, a negative pressure is generated in the ceiling 41 and a positive pressure is generated in the mounting table 42. As a result, the component arrangement area 615 inside the frame 62 is subjected to a force that sucks it up to the flat surface 412 of the ceiling 41 and a force that pushes it up away from the mounting table 42 and toward the flat surface 412 of the ceiling 41. These suction and push-up forces act on the component arrangement area 615 with a force sufficient to separate the component arrangement area 615 from the cooling plate 63, and the component arrangement area 615 is peeled off from the cooling plate 63. The magnitude of the negative pressure in the ceiling 41 and the positive pressure in the mounting table 42 at this time is preset in the control unit 74.

[0123] At the time when component arrangement region 615 is peeled off, protective sheet 61 is flat and not distorted, so the force with which component arrangement region 615 moves toward flat surface 412 of ceiling portion 41 is small, preventing electronic components 60 from peeling off protective sheet 61 or electronic components 60 from flying out of protective sheet 61. Even if component arrangement region 615 is peeled off forcefully, flat surface 412 of ceiling portion 41 is in the way, and electronic components 60 are stopped by flat surface 412, reducing the risk of electronic components 60 peeling off protective sheet 61 or falling off protective sheet 61.

[0124] To further enhance the effect of reducing the risk of electronic component 60 peeling off or falling off protective sheet 61, it is preferable that the distance between top surface 603 of electronic component 60 and flat surface 412 be as small as possible before protective sheet 61 is peeled off from cooling plate 63. Therefore, the distance between top surface 603 and flat surface 412 of electronic component 60 should be set to the minimum distance required to peel protective sheet 61 off cooling plate 63.

[0125] Furthermore, a plurality of systems for generating positive pressure may be provided by dividing the space within the opening 421 of the mounting table 42 into a plurality of sections so that the number of air holes 632 to which positive pressure acts gradually increases with respect to the plurality of air holes 632 of the cooling plate 63, for example, so that the number of air holes 632 to which positive pressure acts increases from one end of the cooling plate 63 to the other end, or so that the range of air holes 632 to which positive pressure acts gradually expands from the air holes 632 located in the center to the outer periphery. This prevents the component arrangement area 615 from suddenly peeling off from the cooling plate 63 and suppresses the electronic components 60 from rushing forcefully onto the flat surface 412 of the ceiling portion 41.

[0126] Furthermore, when the component arrangement region 615 peels off, static electricity is generated. However, because the electromagnetic wave shielding film 605 is in contact with the ceiling 41 in the portion where the protective sheet 61 is sandwiched between the ceiling 41 and the frame 62, the static electricity is eliminated via the grounding portion 41a. Then, the electronic components 60 contact the flat surface 412 of the ceiling 41 via the conductive member 416, and only the inner frame region 614 of the protective sheet 61 bends, while at least the component arrangement region 615 remains flat. In other words, if the flat surface 412 of the ceiling 41 were not present, the protective sheet 61 would bend in a curved manner, containing air. This raises the risk of the electronic components 60 peeling off the protective sheet 61, but because the component arrangement region 615 remains flat, peeling of the electronic components 60 is suppressed.

[0127] 13(d), the pusher 43 is brought into contact with the frame 62 via the protective sheet 61 through the pusher insertion holes 424 of the mounting table 42, the pusher insertion holes 631 of the cooling plate 63, and the pusher insertion holes 631 of the adhesive sheet 64. The pusher 43 is then advanced further, and at the same time, the ceiling portion 41 is separated from the mounting table 42 at the same speed as the pusher 43. Since the cooling plate 63 is held by the clamping block 44 and is immobile, the outer frame region 613 to which the frame 62 is attached is also peeled off from the cooling plate 63, and the entire protective sheet 61 is peeled off from the cooling plate 63.

[0128] At this time, the positive pressure on the mounting table 42 and the negative pressure on the ceiling 41 are maintained. This prevents the component arrangement region 615 from sagging toward the cooling plate 63 due to its own weight and re-adhering to the cooling plate 63. Furthermore, when the protective sheet 61 is peeled off from the cooling plate 63, the electromagnetic wave shielding film 605 of the electronic component 60 remains in contact with the conductive member 416, and therefore is neutralized via the ceiling 41 and the grounding portion 41a, which are in contact with the conductive member 416. Furthermore, the positive pressure on the mounting table 42 is maintained, which also assists in peeling off the outer frame region 613, to which the frame 62 is attached, from the cooling plate 63.

[0129] 13(e), the pusher 43 is stopped and the ceiling 41 is moved further away from the mounting table 42, thereby releasing the clamping of the component-embedded sheet 67 and completing the peeling of the protective sheet 61 from the cooling plate 63. Note that the positive pressure on the mounting table 42 and the negative pressure on the ceiling 41 may be released during this time.

[0130] That is, the ceiling 41 serves as a fixing part that holds down the frame 62 that is positioned outside the component arrangement area 615. The air pressure supply holes 423 of the mounting table 42 also serve as positive pressure generating holes that apply pressure to the component arrangement area 615 through the air holes 632 of the cooling plate 63, thereby serving as a pressure applying means that peels the component arrangement area 615 off the cooling plate 63 before the frame 62. The air holes 413 of the ceiling 41 also serve as negative pressure generating holes that act as a suction means that attracts the component arrangement area 615 and assists in peeling it off the cooling plate 63.

[0131] Furthermore, the flat surface 412 of the ceiling portion 41 serves as a restraining means for preventing the electronic components 60 from peeling or falling off from the protective sheet 61 when the component arrangement area 615 is peeled off, and also serves as a flattening means for making the protective sheet 61 flat to prevent the electronic components 60 from peeling off from the protective sheet 61. The pusher 43 serves as a pushing-up means for peeling the frame 62 off the cooling plate 63 after the component arrangement area 615 is peeled off.

[0132] In this way, the plate releasing unit 4 removes the cooling plate 63 after the film formation process. This plate releasing unit 4 includes a mounting table 42 having positive pressure generating holes, such as air pressure supply holes 423, and a fixing unit, such as ceiling 41. The positive pressure generating holes face the cooling plate 63 and generate positive pressure. While the positive pressure of the mounting table 42 presses the component arrangement area 615, the fixing unit presses down on a portion of the protective sheet 61 that is outside the component arrangement area 615, such as the frame 62, and then releases the pressing force after the component arrangement area 615 is separated from the cooling plate 63.

[0133] As a result, when the component arrangement area 615 is peeled off, the protective sheet 61 remains flat, preventing the component arrangement area 615 from bouncing up in reaction to the protective sheet 61 returning to a flat state. This prevents the electronic components 60 from peeling off the protective sheet 61 and falling off.

[0134] More specifically, when positive pressure is supplied from a plurality of air holes 632 provided in the cooling plate 63 in areas corresponding to the inner frame region 614 and the component arrangement region 615, the protective sheet 61 begins to peel from the cooling plate 63 due to this positive pressure. The resulting peeled portion of the protective sheet 61 gradually expands and connects from the starting point due to the continued supply of positive pressure, spreading outward. Eventually, this peeled portion reaches the boundary between the outer frame region 613 and the inner frame region 614, which is the inner periphery of the frame 62 held down by the fixing portion, and the component arrangement region 615 and the inner frame region 614 of the protective sheet 61 are completely separated from the cooling plate 63. At this time, the boundary between the outer frame region 613 and the inner frame region 614, where the peeled portion of the protective sheet 61 ultimately reaches, is held down via the frame 62 by the flat surface 412 serving as the fixing portion. This prevents the protective sheet 61 from jumping up forcefully even if the component arrangement region 615 and the inner frame region 614 peel off. Furthermore, by interposing the conductive member 416 between the electronic component 60 and the ceiling portion 41, the conductive member 416 functions as a buffer material, and impacts on the protective sheet 61 are suppressed.

[0135] Furthermore, outer frame region 613 is pressed down via frame 62 by flat surface 412 as a fixing portion, which prevents positive pressure from leaking out from between protective sheet 61 and cooling plate 63, allowing the entire component arrangement region 615 to be peeled off reliably and stably. These factors make it possible to prevent electronic components 60 from peeling off and falling off protective sheet 61.

[0136] Furthermore, the plate release unit 4 has a flat surface 412 of the ceiling portion 41 spaced apart from the protective sheet 61 on the ceiling portion 41 side, i.e., on the opposite side of the cooling plate 63 with the protective sheet 61 sandwiched therebetween. This flat surface 412 presses down on any bulges in the component arrangement region 615 while the component arrangement region 615 is being pressurized. This allows the component arrangement region 615 to conform to the flat surface, more reliably preventing the electronic components 60 from peeling off. Furthermore, this flat surface 412 restrains the electronic components 60 even if the component arrangement region 615 should jump up, further preventing the electronic components 60 from peeling off and falling off the protective sheet 61.

[0137] Furthermore, the plate release unit 4 has negative pressure generating holes that generate negative pressure so as to face the protective sheet 61. As an example, air holes 413 that generate negative pressure are provided on the flat surface 412 of the ceiling unit 41. These air holes 413 attract the protective sheet 61 in addition to the pressure applied to the component arrangement area 615 by the air holes 632. This therefore helps apply pressure to the component arrangement area 615, allowing the protective sheet 61 to be peeled off from the cooling plate 63, making peeling errors less likely to occur.

[0138] The plate release unit 4 also includes a pusher 43. After the component arrangement area 615 is separated from the cooling plate 63, the pusher 43 advances within the cooling plate 63 and pushes up the pressed portions of the frame 62, etc., in a direction away from the cooling plate 63. This allows the entire protective sheet 61 to be peeled off after the component arrangement area 615 has been peeled off. Note that the fixing portion, such as the ceiling portion 41, may be separated from the protective sheet 61 as the pusher 43 advances to release the pressure.

[0139] The operating mechanism of the ceiling portion 41, the operating mechanism of the clamping block 44, and the operating mechanism of the pusher 43 may be any known mechanism, and the present invention is not limited to the mechanisms.

[0140] For example, a ball screw having an axis extending from the ceiling 41 toward the mounting table 42 and a rail guide extending from the ceiling 41 toward the mounting table 42 are connected to the ceiling 41. In this case, the ceiling 41 moves toward the mounting table 42 along the rail in accordance with the rotation direction of the screw axis. The ball screw and rail guide extend so that the ceiling 41 approaches the mounting table 42 up to a distance equivalent to the thickness H1 of the frame 62 of the component mounting plate 68.

[0141] Further outside the clamping blocks 44, the peripheral surfaces of egg-shaped cams are individually placed in contact with the pair of clamping blocks 44. The cams are journaled by a rotary motor and are rotatable in the circumferential direction. When the rotary motor is driven and the cams rotate, the bulging portions of the cams come into contact with the clamping blocks 44, pushing the clamping blocks 44 toward the cooling plate 63 and clamping the cooling plate 63.

[0142] The rear end of the pusher 43 is a cam follower. The cam follower follows the circumferential surface of an egg-shaped cam. The cam is journaled by a rotary motor and is rotatable in the circumferential direction. When the rotary motor is driven and the cam rotates, the cam follower climbs the bulge of the cam, pushing up the pusher 43.

[0143] Furthermore, the plate release unit 4 peels off the protective sheet 61 from the cooling plate 63 by generating a positive pressure on the mounting table 42. The flat surface 412 of the ceiling 41 has an additional function of making the peeled protective sheet 61 flat, and the air holes 413 opening in the flat surface 412 of the ceiling 41 also have an additional function of assisting the pressure applied by the mounting table 42. Therefore, as shown in FIG. 14, the ceiling 41 may have a rectangular cylindrical shape with the opening edge abutting against the frame 62, and the flat surface 412 may be omitted. Furthermore, as shown in FIG. 15, the air holes 413 may be omitted from the flat surface 412 of the ceiling 41.

[0144] [Stripping processing section] Finally, we will explain the removal processing unit 5, which is responsible for the component removal step. Fig. 16 is a schematic diagram showing the configuration of the removal processing unit 5. The component-embedded sheet 67, from which the cooling plate 63 has been removed via the plate release unit 4, is fed into the removal processing unit 5, and in the final stage, the individual electronic components 60 are removed from the protective sheet 61. When the removal processing unit 5 is separated from the film forming device 7, it may also be called a removal processing device.

[0145] As shown in Figure 16, this peeling processing unit 5 includes a mounting table 51 on which the component-embedded sheet 67 is placed, a chuck 52 that grips the protective sheet 61 and moves continuously, a guide unit 53 that hooks the end of the protective sheet 61 to create an opportunity for the chuck 52 to grip the protective sheet 61, a sheet stopper 54 that creates a peeling base point for the protective sheet 61, and a component stopper 55 that prevents the electronic components 60 from floating up.

[0146] The mounting table 51 has a flat surface 511 on which the component-embedded sheet 67 is placed. The component-embedded sheet 67 is placed on the flat surface 511 with the electronic components 60 facing the flat surface 511, the top surfaces 603 of the electronic components 60 in contact with the mounting surface, and the protective sheet 61 facing upward. The flat surface 511 is made of an adhesive non-slip material, improving the ability to restrain the electronic components 60. The outer periphery of the flat surface 511 is recessed by one level to accommodate the frame 62, to a depth equivalent to the difference between the height H1 from the surface of the component arrangement region 615 to the end face of the frame 62 and the height H2 from the surface of the component arrangement region 615 to the top surfaces 603 of the electronic components 60. The electronic components 60 are placed on the flat surface 511 while the protective sheet 61 remains flat.

[0147] This mounting table 51 is a block having an internal space 512. A large number of air holes 513 are formed through the flat surface 511 of the mounting table 51 in an area facing the component arrangement area 615. The air holes 513 are in communication with the internal space 512 of the mounting table 51. An air pressure supply hole 514 is formed through the internal space 512 of the mounting table 51 in a location different from the flat surface 511. The air pressure supply hole 514 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, etc. (not shown). Therefore, negative pressure is generated in the air hole 513 through the air pressure supply hole 514 and the internal space 512.

[0148] The chuck 52 is a pair of blocks with gripping surfaces facing each other. The pair of blocks can be moved toward and away from each other. The chuck 52 is supported by a moving device that can move horizontally and vertically, and moves continuously along the protective sheet 61 placed on the flat surface 511 of the mounting table 51 at an angle of attack of 45 degrees relative to the flat surface 511. That is, the chuck 52 moves away from the mounting table 51 while traversing the flat surface 511 of the mounting table 51. "Continuous movement" does not include stops along the way, and preferably moves at a constant speed. The range of movement of the chuck 52 is from the end of the protective sheet 61 where the gripping trigger was created to the opposite end of that end.

[0149] The sheet stopper 54 is a roller that has a cylindrical shape with a long axis that crosses one side of the protective sheet 61 and is axially rotatable. The sheet stopper 54 can be made of metal such as stainless steel. The diameter of the sheet stopper 54 can be set to 5 mm to several tens of mm when the length crossing the protective sheet 61 is about 200 mm to 300 mm. In this embodiment, the sheet stopper 54 is a stainless steel cylinder with a diameter of 6 mm.

[0150] The sheet stopper 54 maintains a constant height relative to the flat surface 511 of the mounting table 51, remains directly below the chuck 52, and moves across the protective sheet 61 placed on the mounting table 51 in a direction perpendicular to the long axis. The height of the sheet stopper 54 is the same as the combined height of the electronic component 60 excluding the electrodes 602 and the protective sheet 61. That is, the sheet stopper 54 moves while pressing against the non-adhesive surface 612 of the protective sheet 61. The degree of pressure is set so as not to scratch, scrape, or crush the electrodes 602. The movement range of the sheet stopper 54 is from the very edge of the guide portion 53, i.e., the edge of the guide portion insertion hole 621 of the frame 62, to the opposite end of the protective sheet 61.

[0151] The component stopper 55 is a roller that has a cylindrical shape with a long axis that crosses at least the entire component arrangement area 615 of the protective sheet 61 and is axially rotatable. The component stopper 55 can be made of metal such as stainless steel. The diameter of the component stopper 55 can be determined taking into consideration the diameter of the sheet stopper 54 and the size of the electronic component 60, but if the diameter of the component stopper 55 is set smaller than that of the sheet stopper 54, it can be placed closer to the sheet stopper 54. In this embodiment, the component stopper 55 is a stainless steel cylinder with the same diameter as the sheet stopper 54.

[0152] The component stopper 55 is arranged so that it can move toward and away from the sheet stopper 54. While the chuck 52 and the sheet stopper 54 move vertically across the mounting table 51, the component stopper 55 follows the sheet stopper 54 while maintaining a fixed distance therebetween. The fixed distance is less than the length of the electronic component 60 attached to the protective sheet 61 (the length in the direction of movement of the component stopper 55). When the chuck 52 and the sheet stopper 54 are positioned at the end of the mounting table 51, the component stopper 55 is spaced apart from the sheet stopper 54 so as to be positioned on the opposite side of the guide insertion hole 621.

[0153] The guide portion 53 is arranged at a position where it shares a common axis with the guide portion insertion hole 621 of the frame 62. The tip of the guide portion 53 faces the guide portion insertion hole 621 of the frame 62. This guide portion 53 is movable in the axial direction, protrudes toward the end of the protective sheet 61, pushes the end of the protective sheet 61 toward the chuck 52, and advances through the guide portion insertion hole 621 of the frame 62 until the end of the protective sheet 61 reaches the chuck 52. This guide portion 53 peels off one side of the protective sheet 61 by pushing it up. For this reason, the guide portion insertion holes 621 have a pin shape and are provided at multiple locations along one side of the protective sheet 61.

[0154] 17, for example, the positions where the guide portion insertion holes 621 are provided are equidistantly spaced apart from each other around the center of one side of the frame 62. The guide portions 53 are provided corresponding to the guide portion insertion holes 621, and the guide portions 53 are formed in a round rod shape. Then, the chuck 52 and the sheet stopper 54 are moved vertically in a direction perpendicular to one side of the frame 62, and the electronic component 60 is peeled off from the protective sheet 61.

[0155] FIG. 18 shows the flow of operation of the peeling processing unit 5. FIG. 18 is a transition diagram that schematically illustrates the states of each step of the peeling processing unit 5. First, as shown in FIG. 18(a), the component-embedded sheet 67 is placed on the mounting table 51 with the top surface 603 of the electronic component 60 in contact with the flat surface 511. That is, between the plate releasing unit 4 and the peeling processing unit 5, an inverting device is provided that inverts the component-embedded sheet 67, which has been separated from the cooling plate 63 by the plate releasing unit 4, and the component-embedded sheet 67 is placed on the mounting table 51 in an inverted state. Negative pressure is generated in the air holes 513 of the mounting table 51 to suck the electronic component 60 onto the flat surface 511. The sheet stopper 54 is moved to the edge of the guide insertion hole 621 of the frame 62, and the chuck 52 is positioned directly above the guide insertion hole 621 of the frame 62. The component stopper 55 is opened relative to the sheet stopper 54 and positioned outside the guide portion insertion hole 621 of the frame 62.

[0156] As shown in (b) of Figure 18, the guide portion 53 is moved axially upward. The guide portion 53 moves within the guide portion insertion hole 621 of the frame 62 and reaches the end of the protective sheet 61 attached to the frame 62. The guide portion 53 advances further and protrudes the end of the protective sheet 61 in a direction away from the frame 62. As a result, the end of the protective sheet 61 begins to peel off by the guide portion 53. As the guide portion 53 advances further, the end of the protective sheet 61 is guided toward the chuck 52 while being clamped between the guide portion 53 and the sheet stopper 54. Note that while the guide portion 53 is guiding the end of the protective sheet 61, the chuck 52 may also move toward the end of the protective sheet 61 to pick up the end of the protective sheet 61.

[0157] 18(c), when the end of protective sheet 61 reaches chuck 52, the pair of blocks close and chuck 52 grips the end of protective sheet 61. Once chuck 52 grips the end of protective sheet 61, as shown in FIG. 18(d), guide portion 53 is embedded in guide portion insertion hole 621 of frame 62, and then component stopper 55 is moved so that component stopper 55 and sheet stopper 54 approach each other to a distance less than the length of electronic component 60.

[0158] 18(e), the chuck 52 is pulled up while the chuck 52 and the sheet stopper 54 are moved along the protective sheet 61. The edge of the protective sheet 61 is gripped by the chuck 52, and the sheet stopper 54 runs over the protective sheet 61. Therefore, the protective sheet 61 is pulled up by the chuck 52, with the sheet stopper 54 as the base point, and the electronic components 60 are peeled off from the protective sheet 61, with the sheet stopper 54 as the base point. If the peeled protective sheet 61 is to be peeled off while maintaining a vertical state, for example, the speed components of the horizontal and vertical movements of the chuck 52 may be kept the same. If both speed components are the same, peeling can be performed continuously without stopping even if the movement speed changes as long as it is not stopped; however, it is preferable to maintain both movement speeds at a constant speed.

[0159] 18(f), when the chuck 52 and the sheet stopper 54 completely traverse the component arrangement area 615 of the protective sheet 61, all of the electronic components 60 are peeled off from the protective sheet 61 and lined up on the flat surface 511 of the mounting table 51. The electronic components 60 are collected, completing the formation of the electromagnetic wave shielding film 605 in the film forming apparatus 7. The angle of attack at which the chuck 52 moves away from the mounting table 51 while traversing the flat surface 511 of the mounting table 51 is not limited to 45 degrees. The position of the chuck 52 may be fixed, and the mounting table 51 may move continuously to peel off the protective sheet 61, or both the chuck 52 and the mounting table 51 may be movable. That is, it is sufficient that the chuck 52 and the mounting table 51 move relative to each other.

[0160] [effect] (1) The film forming apparatus 7 of this embodiment is a film forming apparatus 7 for forming a film on electronic components 60 arranged on a protective sheet 61 that is in close contact with a cooling plate 63, and includes a film forming processing section 3 that deposits a film forming material by sputtering on the electronic components 60 on the protective sheet 61 that is in close contact with the cooling plate 63 to form a film, and a plate release section 4 that removes the cooling plate 63 after passing through the film forming processing section 3. The cooling plate 63 has air holes 123 that penetrate from the front to the back in a range including the area where the electronic components 60 are arranged, and the plate release section 4 Unit 4 has a mounting table 42 that faces air hole 123 of cooling plate 63 and has air pressure supply hole 423, which is a positive pressure generating hole that generates positive pressure, a ceiling part 41 that is a fixed part that presses down on parts of protective sheet 61 that are outside the area where electronic components 60 are arranged while mounting table 42 applies pressure to the area where electronic components 60 are arranged through air pressure supply hole 423, and releases the pressure after the area where electronic components 60 are arranged moves away from cooling plate 63, and a grounding part 41a that directly grounds ceiling part 41.

[0161] Therefore, static electricity generated when the area where electronic components 60 are arranged moves away from cooling plate 63 is neutralized via grounding portion 41a provided on ceiling portion 41 that is in contact with the deposited film. This suppresses charging of electronic components 60, reducing the effects of charging, such as changes in electrical characteristics.

[0162] (2) The plate release portion 4 is positioned to cover the electronic components 60 arranged on the protective sheet 61, is electrically connected to the ceiling portion 41 which is the fixed portion, and has a breathable conductive member 416, and the conductive member 416 is in contact with the electronic components 60 while the area where the electronic components 60 are arranged is pressurized.

[0163] Therefore, static electricity generated when areas other than the area where the electronic components 60 are arranged move away from the cooling plate 63 is discharged from the grounding portion 41a connected to the conductive member 416 via the ceiling portion 41. This suppresses charging of the electronic components 60, reducing the effects of charging, such as changes in electrical characteristics. Cracks in the electromagnetic wave shielding film 605 may occur at the portion connecting the side surface 604 of the electronic components 60 and the adhesive surface of the protective sheet 61, and the electromagnetic wave shielding film may not entirely cover the protective sheet 61 and the side surface 604 and top surface 603 of the electronic components 60. In this case, without the conductive member 416, electrical connection between the film of each electronic component 60 and the ceiling portion 41 may not be ensured. However, in this embodiment, the conductive member 416 contacts the film of each electronic component 60, enabling discharge. Furthermore, depending on the size and position of the air holes 413 in the ceiling portion 41, there may be areas where contact between the membrane of each electronic component 60 and the ceiling portion 41 cannot be ensured. However, in this embodiment, the conductive member 416 comes into contact with the membrane of each electronic component 60, making it possible to eliminate static electricity.

[0164] (3) The plate release portion 4 is located on the opposite side of the protective sheet 61 from the cooling plate 63, and has a flat surface 412 spaced apart from the protective sheet 61 and a negative pressure generating hole that opens into the flat surface 412 and generates negative pressure. The negative pressure generating hole applies pressure to the area where the electronic components 60 are arranged through the positive pressure generating hole, and also attracts the protective sheet 61 via the conductive member 416.

[0165] Therefore, the protective sheet 61 can be more reliably separated from the cooling plate 63, and the conductive member 416 acts as a buffer, mitigating the impact applied to the electronic component 60.

[0166] (4) The conductive member 416 is a metal mesh, which ensures flexibility and conductivity of the conductive member 416, and can eliminate static electricity from the electronic component 60 and reduce impacts.

[0167] [Variations] The present invention is not limited to the above-described embodiment, but also includes the following modifications. (1) The conductive member 416 may be a porous member. For example, a conductive sponge with internal air bubbles communicating with the outside can be used. This reduces the impact when the electronic component 60 comes into contact with the conductive member 416 and allows the conductive member 416 to easily deform to conform to the shape of the electronic component 60, thereby maintaining contact with the electromagnetic wave shielding film 605 and enabling static elimination. The position and thickness of the conductive member 416 may be set so that the conductive member 416 comes into contact with the electromagnetic wave shielding film 605 of the electronic component 60 when the ceiling portion 41 is lowered toward the mounting table 42. This ensures that contact between the conductive member 416 and the electromagnetic wave shielding film 605 is maintained, enabling static elimination. Furthermore, the conductive member 416 may be omitted. In this case, due to the presence of the grounding portion 41a, static elimination is possible as long as contact between the flat surface 412 of the ceiling portion 41 and the electromagnetic wave shielding film 605 is maintained.

[0168] (2) A conductive material may be used as the O-ring 415. In this case, it is easy to maintain the connection with the ceiling portion 41. However, even in this case, there may be cases where the connection between the film of each electronic component 60 and the ceiling portion 41 cannot be secured due to cracks in the film or the like. Therefore, it is preferable to provide a conductive member 416.

[0169] (3) The pusher 43 may be made of a conductive material and may be grounded via the operating mechanism. The protective sheet 61 may be made conductive by kneading carbon into it, for example. This allows static electricity generated when the protective sheet 61 is peeled off from the cooling plate 63 to be removed via the pusher 43 in contact with the protective sheet 61.

[0170] (4) As shown in FIG. 24 , the film forming apparatus 7 may further include a transfer unit 71 that performs a component placement process. The transfer unit 71 performs the component placement process and transfers the electronic components 60 from a tray on which the electronic components 60 before film formation are placed to a component-free sheet 65. For example, the tray and the component-free sheet 65 may be arranged side by side, and the transfer unit 71 may be a robot that can move vertically and horizontally within an area that includes the tray and the component-free sheet 65. The tip of the robot's arm may be equipped with, for example, a vacuum chuck. The transfer unit 71 generates negative pressure on the tray to hold the electronic components 60, releases the negative pressure on the component-free sheet 65 by breaking the vacuum or opening to the atmosphere, and then arranges the electronic components 60 on the component-free sheet 65.

[0171] (5) The film forming apparatus 7 is an apparatus including the embedding processing unit 1, the plate mounting unit 2, the film forming processing unit 3, the plate release unit 4, and the stripping processing unit 5, but each of these units may be configured as an independent device and systemized. That is, the embedding processing unit 1 may be an independent embedding processing device, the plate mounting unit 2 may be an independent plate mounting device, the film forming processing unit 3 may be an independent film forming processing device, the plate release unit 4 may be an independent plate release device, and the stripping processing unit 5 may be an independent stripping processing device.

[0172] (6) In the above embodiment, height H1 from the surface of component arrangement area 615 to the upper end surface of frame 62 is set to be higher than height H2 from the surface of component arrangement area 615 to top surface 603 of electronic component 60, but this is not limited thereto and may be lower than height H2. In this case, the area of ​​flat surface 112, 212, 412 of ceiling portion 11, 21, 41 facing component arrangement area 615 may be formed as a recess that is recessed by an amount that allows for the difference between height H1 and height H2, thereby forming sealed space 14, 24a, 45.

[0173] [Other embodiments] Although the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and modifications are included within the scope and spirit of the invention, and are also included in the invention described in the claims. [Explanation of symbols]

[0174] 1 Embedding processing section 11 Ceiling 111 Interior Space 112 Flat surface 113 Air vent 114 Air pressure supply hole 115 O-ring 12 Mounting table 121 Interior Space 122 Flat surface 123 Air vent 124 Air pressure supply hole 125 Pusher insertion hole 13 Pusher 14 Closed space 2 Plate mounting part 21 Ceiling 211 Interior Space 212 Flat surface 213 Air vent 214 Air pressure supply hole 215 O-ring 22 Mounting table 221 Aperture 222 Edge 223 Air pressure supply hole 224 Pusher insertion hole 23 Pusher 24a Confined space 24b Confined space 3. Film forming processing section 31 Chamber 311 Processing Position 312 deposition position 32 Load Lock Chamber 33 Separator 34 Rotating Table 35 Surface treatment section 36 Sputter Source 361 Target 4 Plate release section 41 Ceiling 411 Interior Space 412 Flat surface 412a Groove 412b Fixed Frame 413 Air vent 414 Air pressure supply hole 415 O-ring 416 Conductive materials 42 Mounting table 421 Aperture 422 Edge 423 Air pressure supply hole 424 Pusher insertion hole 43 Pusher 44 Clamping Block 45 Closed space 5 Peeling processing section 51 Mounting table 511 Flat surface 512 Interior Space 513 Air vent 514 Air pressure supply hole 52 Zipper 53 Information Department 54 Seat stopper 55 Parts stopper 60 Electronic Components 60a Peel start 601 Electrode exposed surface 602 Electrode 603 Top 604 Side 605 Electromagnetic wave shielding film 61 Protective Sheet 611 Adhesive surface 612 Non-adhesive surface 613 Outer Frame Area 614 Middle frame area 615 Parts Layout Area 62 frames 621 Guide insertion hole 622 Notch 63 Cooling Plate 631 Pusher insertion hole 632 Air vent 64 adhesive sheet 65 Sheet with no parts 66 Parts-mounted sheet 67 Parts embedded seat 68 Parts mounting plate 7 Film deposition equipment 71 Transfer section 73 Conveyor 74 Control Unit 75 Pneumatic circuit

Claims

1. A film forming apparatus for forming electronic components on a protective sheet that is in close contact with a cooling plate, a film forming unit that deposits a film forming material by sputtering onto the electronic components on the protective sheet that is in close contact with the cooling plate; a plate release unit that removes the cooling plate after passing through the film formation processing unit; Equipped with The cooling plate has air holes penetrating from the front to the back in a range including an area where the electronic components are arranged, The plate release portion is a mounting table having a positive pressure generating hole facing the air hole of the cooling plate and generating a positive pressure; a conductive fixing portion that holds down a portion of the protective sheet that is outside the area where the electronic components are arranged while the mounting table applies pressure to the area where the electronic components are arranged through the positive pressure generating holes, and that releases the pressing force after the area where the electronic components are arranged is separated from the cooling plate; a grounding portion that directly grounds the fixed portion; a conductive member that is provided at a position that covers the electronic components arranged on the protective sheet, is electrically connected to the fixing portion, and has flexibility and breathability; the conductive member is in contact with the electronic components while pressure is applied to the region where the electronic components are arranged; A film forming apparatus characterized by the above.

2. The plate release portion is a flat surface located on the opposite side of the protective sheet from the cooling plate and spaced apart from the protective sheet; a negative pressure generating hole that opens onto the flat surface and generates a negative pressure; and the negative pressure generating hole applies pressure to the region where the electronic components are arranged through the positive pressure generating hole and also attracts the protective sheet via the conductive member; 2. The film forming apparatus according to claim 1, wherein:

3. 3. The film forming apparatus according to claim 1, wherein the conductive member is a metal mesh.

4. 3. The film forming apparatus according to claim 1, wherein the conductive member is a porous member.

5. the cooling plate has an insertion hole at a location outside an area where the electronic components are arranged and where the cooling plate is pressed by the fixing portion, The plate release portion is a pusher that advances into the insertion hole of the cooling plate after the region in which the electronic components are arranged is separated from the cooling plate and pushes up the portion of the protective sheet that is pressed by the fixing portion in a direction away from the cooling plate, the fixing portion moves away from the cooling plate as the pusher advances when the pressing is released; 5. The film forming apparatus according to claim 1, wherein:

6. the pusher is electrically conductive; 6. The film forming apparatus according to claim 5, wherein the protective sheet is attached to the cooling plate via a conductive adhesive sheet.

7. a component embedding portion for embedding electrodes of the electronic component in the protective sheet and bringing exposed surfaces of the electrodes into close contact with the protective sheet; a plate mounting portion that mounts the protective sheet on the cooling plate; a peeling processing unit that peels the protective sheet from the electronic component; 7. The film forming apparatus according to claim 1, further comprising:

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