Method for manufacturing electronic components and method for manufacturing display devices

Abstract

A purpose of the present invention is to provide an electronic-component production method in which chip components are transferred to an operation circuit substrate from a multilayer structure for transfer comprising a substrate for transfer including a pressure-sensitive adhesive layer and the chip components arranged on the substrate for transfer, the method being capable of transferring the chip components in satisfactory yield while diminishing residues of the pressure-sensitive adhesive layer. The other purpose is to provide a display device production method which includes the electronic-component production method. This electronic-component production method comprises step (1), in which a multilayer structure for transfer comprising a substrate for transfer including a pressure-sensitive adhesive layer containing a gas generator and chip components arranged on the substrate for transfer is brought near an operation circuit substrate and the chip components are positioned with respect to the operation circuit substrate, and step (2), in which a stimulation is given to the pressure-sensitive adhesive layer containing a gas generator to thereby transfer the chip components from the multilayer structure for transfer to the operation circuit substrate.

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