Expanding device and method for manufacturing semiconductor chips

Abstract

To provide an expanding device, a method for manufacturing a semiconductor chip, and a semiconductor chip that can suppress the size increase of the device even when both a squeegee section and a UV irradiation section are provided.SOLUTION: An expanding device 1 has a UV irradiation section 212 that irradiates UV light onto a sheet member W2 corresponding to the location of a wafer W1 among the sheet members W2 expanded by an expanding section 208, a squeegee section 213 that locally presses the wafer W1 after having the sheet member W2 expanded by the expanding section 208 to divide the wafer W1 into multiple semiconductor chips Ch, and common moving mechanisms 213c and 213d that can move both the UV irradiation section 212 and the squeegee section 213.SELECTED DRAWING: Figure 15

Description

[Technical Field]

[0001] The present invention relates to an expanding device, and, How semiconductor chips are manufactured By law In particular, an expanding device having an expanding section that divides a wafer into a plurality of semiconductor chips, and, How semiconductor chips are manufactured By law Regarding. [Background technology]

[0002] BACKGROUND ART Conventionally, an expanding device having an expanding section that divides a wafer into a plurality of semiconductor chips has been known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses a dividing device equipped with an expansion means (expanding unit) that divides a workpiece (wafer) into multiple chips. This dividing device includes a holding table, a UV irradiation means, and a moving means. The holding table is configured to hold an expanded sheet to which multiple chips that have been expanded and divided by the expansion means are attached. The UV irradiation means is configured to irradiate the expanded sheet held on the holding table with ultraviolet light to weaken the adhesive strength of the expanded sheet. The moving means is configured to move the expanded sheet to which multiple chips are attached from the holding table to the ultraviolet irradiation unit to irradiate the expanded sheet with ultraviolet light. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6298635 Summary of the Invention [Problem to be solved by the invention]

[0005] Although not explicitly stated in Patent Document 1, the dividing device of Patent Document 1 not only divides the expandable sheet into multiple chips by expanding it with an expansion means, but also includes a squeegee unit for dividing any wafers that were not divided during expansion by the expansion means. Here, the squeegee unit is configured to divide any wafers that were not divided by locally pressing the sheet member after expansion by the expansion means.

[0006] However, when a squeegee unit is provided in the dividing device as described above, because the squeegee unit is configured to locally press the sheet member, a movement mechanism for moving the squeegee unit is required in order for the squeegee unit to press the entire portion of the sheet member corresponding to the wafer. Therefore, in such a case, a squeegee unit and a movement mechanism for the squeegee unit are required separately from the UV irradiation means and the movement means for moving the expanded sheet with multiple chips attached to the UV irradiation means. Therefore, if both the squeegee unit and the UV irradiation means are provided in the dividing device, there is a problem in that the dividing device (expanding device) equipped with the expanding unit will become larger.

[0007] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide an expanding device that can prevent the device from becoming large even when both a squeegee unit and an ultraviolet irradiation unit are provided. and a method for manufacturing a semiconductor chip. The purpose is to provide [Means for solving the problem]

[0008] In order to achieve the above object, an expanding device in a first aspect of the present invention includes an expanding unit that divides a wafer into a plurality of semiconductor chips by expanding an elastic sheet member to which a wafer is attached, an ultraviolet irradiation unit that irradiates ultraviolet rays onto the sheet member expanded by the expanding unit that corresponds to the position of the wafer, a squeegee unit that locally presses the wafer after the expanding unit expands the sheet member to divide the wafer into a plurality of semiconductor chips, and a common moving mechanism that can move both the ultraviolet irradiation unit and the squeegee unit.

[0009] In the expanding device according to a first aspect of the present invention, as described above, after the expanding unit expands the sheet member to divide the wafer into multiple semiconductor chips, a squeegee unit that locally presses the wafer and a common moving mechanism that can move both the ultraviolet irradiator and the squeegee unit are provided. This allows the common moving mechanism to locally press the wafer with the squeegee unit and irradiate ultraviolet rays with the ultraviolet irradiator, thereby preventing the device from becoming too large even when both the squeegee unit and the ultraviolet irradiator are provided. Furthermore, the squeegee unit presses the sheet member corresponding to the position of the wafer to divide the wafer into multiple semiconductor chips. The ultraviolet irradiator irradiates ultraviolet rays onto the sheet member corresponding to the position of the wafer to harden the adhesive on the sheet member corresponding to the position of the wafer. Therefore, since the portion of the sheet member pressed by the squeegee unit and the portion of the sheet member irradiated with ultraviolet rays by the ultraviolet irradiator are the same, by moving the ultraviolet irradiator unit in accordance with the movement of the squeegee unit and irradiating ultraviolet rays, it is possible to both separate the wafer with the squeegee unit and cure the adhesive with ultraviolet rays irradiated from the ultraviolet irradiator unit for the portion of the sheet member corresponding to the wafer position. As a result, compared to when the two components are moved separately, it is possible to prevent the number of parts in the expanding device and the device from becoming larger.

[0010] In the expanding device according to the first aspect, the movement mechanism preferably includes a first linear movement mechanism that moves both the ultraviolet irradiation unit and the squeegee unit in one of the horizontal directions, and a rotation mechanism that rotates at least the squeegee unit about a rotation axis that extends along the vertical direction. With this configuration, the number of movement mechanisms required to realize both the irradiation of ultraviolet rays by the ultraviolet irradiation unit and the pressing of the wafer by the squeegee unit is relatively small, consisting of only the first linear movement mechanism and the rotation mechanism, and therefore it is possible to prevent the expanding device from increasing in number of parts and size.

[0011] In this case, preferably, the first linear movement mechanism is attached to a rotation mechanism, and the rotation mechanism is configured to rotate the first linear movement mechanism from a position where both the ultraviolet irradiator and the squeegee can be moved in one direction to a position where they can be moved in another direction perpendicular to the one direction. With this configuration, rotation by the rotation mechanism allows the squeegee to press the wafer and the ultraviolet irradiator to irradiate ultraviolet rays in both the one direction and the other direction, so that the squeegee can sufficiently separate the semiconductor chips and the ultraviolet irradiator can sufficiently harden the adhesive on the sheet member.

[0012] In the expanding device according to the first aspect, the expanding section preferably includes an expanding ring that expands the sheet member, and the ultraviolet irradiating section, the squeegee section, and the moving mechanism are arranged radially inward of the expanding ring in plan view. With this configuration, the space within the expanding ring that is difficult to use for other purposes can be effectively utilized to house the ultraviolet irradiating section, the squeegee section, and the moving mechanism within the expanding ring, thereby further preventing the expanding device from becoming large.

[0013] The expanding device according to the first aspect preferably further includes a control unit configured to control the ultraviolet irradiation by the ultraviolet irradiation unit and the local pressing of the wafer by the squeegee unit to be carried out in parallel while moving both the ultraviolet irradiation unit and the squeegee unit using a common movement mechanism. With this configuration, the ultraviolet irradiation by the ultraviolet irradiation unit and the local pressing of the wafer by the squeegee unit can be carried out efficiently, thereby improving the efficiency of the work carried out in the expanding device.

[0014] In this case, preferably, the control unit is configured to control the ultraviolet irradiation unit to irradiate ultraviolet rays in parallel when at least one of the following pressing operations is performed: when the squeegee unit is moved in one horizontal direction by the movement mechanism to locally press the wafer; and when the squeegee unit is moved in another horizontal direction perpendicular to the one horizontal direction to locally press the wafer. With this configuration, ultraviolet irradiation by the ultraviolet irradiation unit can be performed once by irradiating ultraviolet rays only when the squeegee unit is moved in one horizontal direction to locally press the wafer, or by irradiating ultraviolet rays only when the squeegee unit is moved in the other horizontal direction to locally press the wafer. Furthermore, ultraviolet irradiation by the ultraviolet irradiation unit can be performed twice by irradiating ultraviolet rays both when the squeegee unit is moved in one horizontal direction to locally press the wafer and when the squeegee unit is moved in the other horizontal direction to locally press the wafer. This allows the number of times that the ultraviolet irradiation unit irradiates ultraviolet rays to be selected from one or two times, so that the ultraviolet irradiation unit can irradiate ultraviolet rays an appropriate number of times depending on the type of adhesive used in the sheet member, etc.

[0015] In the expanding device according to the first aspect, the ultraviolet ray irradiation unit is preferably attached to a common moving mechanism separately from the squeegee unit. With this configuration, the squeegee unit does not need a configuration for providing the ultraviolet ray irradiation unit therein, and therefore the structure of the squeegee unit can be prevented from becoming complicated.

[0016] In the expanding device according to the first aspect, the ultraviolet irradiation unit is preferably attached to the common moving mechanism while being integrally provided within the squeegee unit. This configuration allows the ultraviolet irradiation unit and the squeegee unit to be arranged in only the space required for arranging the squeegee unit, thereby preventing an increase in the space required for arranging the ultraviolet irradiation unit and the squeegee unit in the common moving mechanism. As a result, the common moving mechanism can be prevented from becoming larger, further preventing an increase in the size of the expanding device.

[0017] The expanding device having the first linear movement mechanism and the rotation mechanism preferably further includes a second linear movement mechanism that moves the expanding device in a direction perpendicular to one horizontal direction, the first linear movement mechanism being attached to the second linear movement mechanism, the rotation mechanism being attached to the first linear movement mechanism, the ultraviolet irradiation unit being attached to the first linear movement mechanism or the rotation mechanism, and the squeegee unit being attached to the rotation mechanism. With this configuration, the first linear movement mechanism and the second linear movement mechanism are not attached to the rotation mechanism, so that an increase in the driving force of the motor required to rotate the rotation mechanism can be suppressed. As a result, the rotation mechanism can be rotated using a relatively small motor, thereby further suppressing an increase in the size of the expanding device.

[0018] In the expanding device according to the first aspect, the expanding section preferably includes an expanding ring that expands the sheet member, and the ultraviolet irradiating section, the squeegee section, and the moving mechanism are disposed outside the expanding ring. This configuration alleviates restrictions on the space required for arranging the ultraviolet irradiating section, the squeegee section, and the moving mechanism, thereby improving the degree of freedom in arranging the ultraviolet irradiating section, the squeegee section, and the moving mechanism.

[0019] In the expanding device in which the ultraviolet irradiation unit is attached to the common moving mechanism separately from the squeegee unit, preferably, the ultraviolet irradiation unit is configured to irradiate the expanded sheet member from below, and the ultraviolet irradiation unit includes an ultraviolet light emitter that emits ultraviolet light, and the ultraviolet light emitter is positioned at a position below the pressing surface of the sheet member where the squeegee unit applies localized pressure, and further away from the upper surface of the ring-shaped member attached to the sheet member while surrounding the wafer, when the sheet member is in an expanded state after being expanded by the expanding unit. This configuration allows ultraviolet light to be irradiated from a location somewhat distant from the sheet member, thereby preventing the ultraviolet light from hitting specific areas of the sheet member. As a result, the ultraviolet light can be evenly applied to the sheet member.

[0020] A method for manufacturing semiconductor chips in a second aspect of the present invention includes a step of forming a modified layer in a wafer by irradiating a wafer having a plurality of semiconductor chips with laser light from a laser irradiation unit that irradiates the laser light, a step of dividing the wafer into a plurality of semiconductor chips by an expanding unit that expands an elastic sheet member to which the wafer is attached, and a step of irradiating ultraviolet light onto a portion of the sheet member that corresponds to the position of the wafer and locally pressing the wafer by moving the ultraviolet irradiation unit and squeegee unit with a common moving mechanism.

[0021] In the semiconductor chip manufacturing method according to the second aspect of the present invention, as described above, a step is provided in which the ultraviolet ray irradiation unit and the squeegee unit are moved by a common moving mechanism to irradiate ultraviolet rays onto the sheet member corresponding to the position of the wafer, and to locally press the wafer. This allows the common moving mechanism to locally press the wafer with the squeegee unit and to irradiate ultraviolet rays with the ultraviolet ray irradiation unit, so that a semiconductor chip manufacturing method can be obtained that can prevent the device from becoming large even when both the squeegee unit and the ultraviolet ray irradiation unit are provided. [Effects of the Invention]

[0024] According to the present invention, even when both the squeegee unit and the ultraviolet ray irradiation unit are provided as described above, it is possible to prevent the device from becoming large. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a plan view showing a semiconductor wafer processing device provided with a dicing device and an expanding device according to a first embodiment. [Figure 2] 1 is a plan view showing a wafer ring structure processed in the semiconductor wafer processing apparatus according to the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 2 is a plan view of a dicing device disposed adjacent to the expanding device according to the first embodiment. [Figure 5] 10 is a side view of the dicing device arranged adjacent to the expanding device according to the first embodiment, as viewed from the Y2 direction side. FIG. [Figure 6] FIG. 1 is a plan view of an expanding device according to a first embodiment. [Figure 7] FIG. 2 is a side view of the expanding device according to the first embodiment as viewed from the Y2 direction side. [Figure 8] FIG. 2 is a side view of the expanding device according to the first embodiment as viewed from the X1 direction side. [Figure 9]1 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a first embodiment. [Figure 10] 4 is a flowchart of the first half of a semiconductor chip manufacturing process by the semiconductor wafer processing apparatus according to the first embodiment. [Figure 11] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [Figure 12] FIG. 2 is a side view showing a state before the wafer is pressed by the squeegee unit in the expanding device according to the first embodiment. [Figure 13] FIG. 2 is a side view showing a state in which ultraviolet rays are being irradiated by an ultraviolet irradiating unit in the expanding device according to the first embodiment. [Figure 14] 3 is a schematic diagram showing a pressing portion of a squeegee unit and a wafer ring structure in the expanding device according to the first embodiment. FIG. [Figure 15] 1 is a side view showing a state in which a wafer is being pressed by a squeegee unit in the expanding device according to the first embodiment. FIG. [Figure 16] FIG. 2 is a plan view showing a state in which the squeegee part is oriented in one direction in the expanding device according to the first embodiment. [Figure 17] FIG. 10 is a plan view showing a state in which the squeegee part is facing in another direction in the expanding device according to the first embodiment. [Figure 18] 1 is a side view showing a state in which the squeegee unit is moving in one direction in the expanding device according to the first embodiment and pressing the wafer. FIG. [Figure 19] 1 is a plan view showing a state in which the squeegee unit in the expanding device according to the first embodiment is pressing the wafer while moving in one direction. FIG. [Figure 20] FIG. 10 is a side view showing a state in which the squeegee unit is moving in another direction in the expanding device according to the first embodiment and pressing the wafer. [Figure 21]10 is a plan view showing a state in which the squeegee unit is moving in another direction in the expanding device according to the first embodiment and pressing the wafer. FIG. [Figure 22] 10 is a flowchart of the first half of a squeegee breaking process of the semiconductor wafer processing apparatus according to the first embodiment. [Figure 23] 10 is a flowchart of the second half of the squeegee breaking process of the semiconductor wafer processing apparatus according to the first embodiment. [Figure 24] FIG. 10 is a side view showing a state in which the squeegee part is oriented in one direction in the expanding device according to the second embodiment. [Figure 25] FIG. 10 is a side view showing a state in which the squeegee part is facing in another direction in the expanding device according to the second embodiment. [Figure 26] FIG. 10 is a plan view showing a state in which the squeegee unit is moving in another direction in the expanding device according to the second embodiment and pressing the wafer. [Figure 27] FIG. 10 is a side view showing a state in which the squeegee unit is moving in one direction and pressing the wafer in the expanding device according to the second embodiment. [Figure 28] FIG. 10 is a plan view showing a state in which the squeegee unit is moving in one direction in the expanding device according to the second embodiment and pressing the wafer. [Figure 29] FIG. 11 is a plan view showing a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a third embodiment. [Figure 30] 11 is a side view of a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a third embodiment, as viewed from the Y2 direction. FIG. [Figure 31] 11 is a side view of a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a third embodiment, as viewed from the X1 direction. FIG. [Figure 32] FIG. 10 is a plan view showing a squeegee unit, an ultraviolet irradiation unit, and a common moving mechanism in an expanding device according to a third embodiment. [Figure 33]FIG. 10 is a plan view showing a squeegee unit, an ultraviolet irradiation unit, and a common moving mechanism in an expanding device according to a fourth embodiment. [Figure 34] FIG. 10 is a side view showing the squeegee unit, the ultraviolet irradiation unit, and a common moving mechanism in the expanding device according to the fourth embodiment. [Figure 35] FIG. 10 is a plan view showing the squeegee unit, the ultraviolet irradiation unit, and the common moving mechanism after the squeegee unit has rotated in the expanding device according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0026] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0027] [First embodiment] The configuration of a semiconductor wafer processing apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0028] (Semiconductor wafer processing equipment) 1, the semiconductor wafer processing apparatus 100 is an apparatus for processing a wafer W1 provided in a wafer ring structure W. The semiconductor wafer processing apparatus 100 is configured to form a modified layer on the wafer W1 and to divide the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see FIG. 8).

[0029] 2 and 3, the wafer ring structure W will be described. The wafer ring structure W includes a wafer W1, a sheet member W2, and a ring-shaped member W3.

[0030] The wafer W1 is a thin, circular plate made of crystals of a semiconductor material that is used to make semiconductor integrated circuits. A modified layer is formed inside the wafer W1 along the dividing line by processing the wafer in the semiconductor wafer processing apparatus 100. That is, the wafer W1 is processed so that it can be divided along the dividing line. The sheet member W2 is a stretchable adhesive tape. An adhesive layer is provided on the upper surface W21 of the sheet member W2. The wafer W1 is attached to the adhesive layer of the sheet member W2. The ring-shaped member W3 is a metal frame that is ring-shaped in a plan view. The ring-shaped member W3 is attached to the adhesive layer of the sheet member W2 while surrounding the wafer W1.

[0031] The semiconductor wafer processing apparatus 100 is equipped with a dicing apparatus 1 and an expanding apparatus 2. Hereinafter, the vertical direction is referred to as the Z direction, the upward direction as the Z1 direction, and the downward direction as the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 2 are aligned is referred to as the X direction, the X direction toward the expanding apparatus 2 in the X direction is referred to as the X1 direction, and the X direction toward the dicing apparatus 1 in the X direction is referred to as the X2 direction. The horizontal direction perpendicular to the X direction is referred to as the Y direction, one side of the Y direction is referred to as the Y1 direction, and the other side of the Y direction is referred to as the Y2 direction.

[0032] (dicing equipment) As shown in Figures 1, 4, and 5, the dicing device 1 is configured to form a modified layer by irradiating a laser having a wavelength that is transparent to the wafer W1 along the parting lines (streets). The modified layer refers to cracks and voids formed inside the wafer W1 by the laser. The method of forming a modified layer on the wafer W1 in this way is called dicing.

[0033] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0034] The base 11 is a base on which the chuck table 12 is placed. The base 11 has a rectangular shape in a plan view.

[0035] <Chuck table section> The chuck table 12 includes a suction unit 12a, a clamp unit 12b, a rotation mechanism 12c, and a table movement mechanism 12d. The suction unit 12a is configured to suction the wafer ring structure W onto its upper surface on the Z1 side. The suction unit 12a is a table provided with suction holes and suction lines for suctioning the lower surface of the ring-shaped member W3 of the wafer ring structure W on the Z2 side. The suction unit 12a is supported by the table movement mechanism 12d via the rotation mechanism 12c. The clamp unit 12b is provided at the upper end of the suction unit 12a. The clamp unit 12b is configured to hold the wafer ring structure W held by the suction unit 12a. The clamp unit 12b holds the ring-shaped member W3 of the wafer ring structure W held by the suction unit 12a from the Z1 side. In this manner, the wafer ring structure W is gripped by the suction unit 12a and the clamp unit 12b.

[0036] The rotation mechanism 12c is configured to rotate the suction unit 12a in the circumferential direction around a rotation center axis C extending parallel to the Z direction. The rotation mechanism 12c is attached to the upper end of the table movement mechanism 12d. The table movement mechanism 12d is configured to move the wafer ring structure W in the X direction and the Y direction. The table movement mechanism 12d has an X-direction movement mechanism 121 and a Y-direction movement mechanism 122. The X-direction movement mechanism 121 is configured to move the rotation mechanism 12c in the X1 direction or the X2 direction. The X-direction movement mechanism 121 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Y-direction movement mechanism 122 is configured to move the rotation mechanism 12c in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 122 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0037] <Laser section> The laser unit 13 is configured to irradiate a wafer W1 of the wafer ring structure W held by the chuck table 12 with laser light. The laser unit 13 is disposed on the Z1 side of the chuck table 12. The laser unit 13 includes a laser irradiation unit 13a, a mounting member 13b, and a Z-direction movement mechanism 13c. The laser irradiation unit 13a is configured to irradiate a pulsed laser light. The mounting member 13b is a frame to which the laser unit 13 and the imaging unit 14 are attached. The Z-direction movement mechanism 13c is configured to move the laser unit 13 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 13c includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. Note that the laser irradiation unit 13a may be a laser irradiation unit that oscillates a continuous-wave laser light as the laser light, other than a pulsed laser light, as long as it can form a modified layer through multiphoton absorption.

[0038] <Imaging unit> The imaging unit 14 is configured to capture an image of the wafer W1 of the wafer ring structure W held by the chuck table 12. The imaging unit 14 is disposed on the Z1 direction side of the chuck table 12. The imaging unit 14 has a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0039] The high-resolution camera 14a and the wide-angle camera 14b are near-infrared imaging cameras. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation unit 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation unit 13a. In this way, the high-resolution camera 14a, the laser irradiation unit 13a, and the wide-angle camera 14b are arranged adjacent to each other in this order from the X1 direction side to the X2 direction side.

[0040] The Z-direction movement mechanism 14c is configured to move the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 14d is configured to move the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14d has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0041] (Expanding device) As shown in FIGS. 1, 6, and 7, the expanding device 2 is configured to divide the wafer W1 to form a plurality of semiconductor chips Ch (see FIG. 8). The expanding device 2 is also configured to form sufficient gaps between the plurality of semiconductor chips Ch. Here, a modified layer is formed on the wafer W1 by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets) in the dicing device 1. In the expanding device 2, the wafer W1 is divided along the modified layer that was previously formed in the dicing device 1, thereby forming a plurality of semiconductor chips Ch.

[0042] Therefore, in the expanding device 2, the wafer W1 is divided along the modified layer by expanding the sheet member W2. In addition, in the expanding device 2, the sheet member W2 is expanded, and thus the gaps between the plurality of semiconductor chips Ch formed by division are widened.

[0043] The expansion device 2 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 212, a squeegee section 213, and a clamp section 214.

[0044] <base> The base 201 is a base on which the cassette unit 202 and the lift-up hand unit 203 are installed. The base 201 has a rectangular shape in a plan view.

[0045] <Cassette section> The cassette unit 202 is configured to be able to accommodate a plurality of wafer ring structures W. The cassette unit 202 includes a wafer cassette 202a, a Z-direction moving mechanism 202b, and a pair of mounting units 202c.

[0046] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. Each wafer cassette 202a has a storage space capable of storing a plurality of (five) wafer ring structures W. The wafer ring structures W are manually supplied and placed in the wafer cassette 202a. The wafer cassette 202a may store one to four wafer ring structures W, or may store six or more wafer ring structures W. One, two, or four or more wafer cassettes 202a may be arranged in the Z direction.

[0047] The Z-direction movement mechanism 202b is configured to move the wafer cassette 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 202b also has a mounting table 202d that supports the wafer cassette 202a from below. Multiple mounting tables 202d (three in total) are arranged to match the positions of the multiple wafer cassettes 202a.

[0048] A plurality (five) of pairs of mounting portions 202c are arranged inside the wafer cassette 202a. The ring-shaped member W3 of the wafer ring structure W is placed on the pair of mounting portions 202c from the Z1 direction side. One of the pair of mounting portions 202c protrudes in the X2 direction from the inner surface of the wafer cassette 202a on the X1 direction side. The other of the pair of mounting portions 202c protrudes in the X1 direction from the inner surface of the wafer cassette 202a on the X2 direction side.

[0049] <Lift-up hand part> The lift-up hand section 203 is configured to be able to take out the wafer ring structure W from the cassette section 202. The lift-up hand section 203 is also configured to be able to store the wafer ring structure W in the cassette section 202.

[0050] Specifically, the lift-up hand unit 203 includes a Y-direction movement mechanism 203a and a lift-up hand 203b. The Y-direction movement mechanism 203a has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The lift-up hand 203b is configured to support the ring-shaped member W3 of the wafer ring structure W from the Z2 direction side.

[0051] <Suction hand section> The suction hand portion 204 is configured to suck the ring-shaped member W3 of the wafer ring structure W from the Z1 direction side.

[0052] Specifically, the suction hand unit 204 includes an X-direction movement mechanism 204a, a Z-direction movement mechanism 204b, and a suction hand 204c. The X-direction movement mechanism 204a is configured to move the suction hand 204c in the X direction. The Z-direction movement mechanism 204b is configured to move the suction hand 204c in the Z direction. The X-direction movement mechanism 204a and the Z-direction movement mechanism 204b each have a drive unit including, for example, a linear conveyor module or a ball screw and a motor with an encoder. The suction hand 204c is configured to suck and support the ring-shaped member W3 of the wafer ring structure W from the Z1 direction. Here, the suction hand 204c generates negative pressure to support the ring-shaped member W3 of the wafer ring structure W.

[0053] <base> 7 and 8, the base 205 is a base on which the expanding section 208, the cooling unit 207, the ultraviolet irradiation section 212, and the squeegee section 213 are mounted. The base 205 has a rectangular shape in a plan view. In FIG. 8, the clamp section 214, which is positioned in the Z1 direction of the cooling unit 207, is indicated by a dotted line.

[0054] <Cold air supply section> The cool air supplying section 206 is configured to supply cool air to the sheet member W2 from the Z1 direction side when the expanding section 208 expands the sheet member W2.

[0055] Specifically, the cold air supply unit 206 has a supply unit main body 206a, a cold air supply port 206b, and a movement mechanism 206c. The cold air supply port 206b is configured to allow cold air supplied from the cold air supply device to flow out. The cold air supply port 206b is provided at the end of the supply unit main body 206a on the Z2 direction side. The cold air supply port 206b is located in the center of the end of the supply unit main body 206a on the Z2 direction side. The movement mechanism 206c has, for example, a linear conveyor module or a motor with a ball screw and an encoder.

[0056] The cold air supply device is a device for generating cold air. The cold air supply device supplies air cooled by, for example, a heat pump. Such a cold air supply device is installed on base 205. Cold air supply unit 206 and the cold air supply device are connected by a hose (not shown).

[0057] <Cooling unit> The cooling unit 207 is configured to cool the sheet member W2 from the Z2 direction side.

[0058] Specifically, the cooling unit 207 includes a cooling member 207a having a cooling body 271 and a Peltier element 272, and a Z-direction movement mechanism 207b. The cooling body 271 is made of a material with a large heat capacity and high thermal conductivity. The cooling body 271 is made of a metal such as aluminum. The Peltier element 272 is configured to cool the cooling body 271. Note that the cooling body 271 is not limited to aluminum, and may be made of another material with a large heat capacity and high thermal conductivity. The Z-direction movement mechanism 207b is a cylinder.

[0059] The cooling unit 207 is configured to be movable in the Z1 direction or the Z2 direction by a Z-direction movement mechanism 207b, which allows the cooling unit 207 to move to a position where it contacts the sheet member W2 and a position away from the sheet member W2.

[0060] <Expanding section> The expanding section 208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing lines.

[0061] Specifically, the expanding section 208 has an expanding ring 281. The expanding ring 281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expanding ring 281 has a ring shape in a plan view. The structure of the expanding ring 281 will be described in detail later.

[0062] <base> The base 209 is a base material on which the cold air supply unit 206, the expansion and retention member 210 and the heat shrink unit 211 are mounted.

[0063] <Expansion maintenance member> As shown in FIGS. 7 and 8, the expansion maintaining member 210 is configured to press the sheet member W2 from the Z1 direction side so that the sheet member W2 near the wafer W1 does not shrink due to heating by the heating ring 211a.

[0064] Specifically, the expansion-retaining member 210 includes a pressure ring portion 210a, a lid portion 210b, and an intake portion 210c. The pressure ring portion 210a has a ring shape in a plan view. The lid portion 210b is attached to the pressure ring portion 210a so as to cover the opening of the pressure ring portion 210a. The intake portion 210c is an intake ring having a ring shape in a plan view. Multiple intake ports are formed on the underside of the intake portion 210c on the Z2 direction side. The pressure ring portion 210a is configured to move in the Z direction by a Z-direction movement mechanism 210d. That is, the Z-direction movement mechanism 210d is configured to move the pressure ring portion 210a to a position where it presses the sheet member W2 and to a position away from the sheet member W2. The Z-direction movement mechanism 210d includes, for example, a linear conveyor module or a drive unit including a ball screw and a motor with an encoder.

[0065] <Heat shrink section> The heat shrink section 211 is configured to shrink the sheet member W2 expanded by the expanding section 208 by heating while maintaining the gaps between the plurality of semiconductor chips Ch.

[0066] The heat shrink unit 211 has a heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in a plan view. The heating ring 211a also has a sheathed heater that heats the sheet member W2. The Z-direction movement mechanism 211b is configured to move the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0067] <Ultraviolet irradiation section> The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays Ut in order to reduce the adhesive strength of the adhesive layer of the sheet member W2. Specifically, the ultraviolet irradiating unit 212 has an ultraviolet illuminator. The ultraviolet irradiating unit 212 is disposed at the end of the squeegee unit 213 on the Z1 direction side of a pressing unit 213a (described later). The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays Ut while moving together with the squeegee unit 213.

[0068] <Squeegee Section> The squeegee unit 213 is configured to expand the sheet member W2 and then locally press the wafer W1 from the Z2 direction, thereby further dividing the wafer W1 along the modified layer. Specifically, the squeegee unit 213 has a pressing unit 213a, a Z-direction movement mechanism 213b, an X-direction movement mechanism 213c, and a rotation mechanism 213d. The Z-direction movement mechanism 213b, the X-direction movement mechanism 213c, and the rotation mechanism 213d are examples of a "common movement mechanism" in the claims. The X-direction movement mechanism 213c is an example of a "first linear movement mechanism" in the claims.

[0069] The pressing unit 213a is configured to press the wafer W1 from the Z2 direction side via the sheet member W2 while moving using the rotation mechanism 213d and the X-direction movement mechanism 213c, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. When the pressing unit 213a is raised to an upper position Up (see FIG. 18) on the Z1 direction side by the Z-direction movement mechanism 213b, the wafer W1 is pressed via the sheet member W2. When the pressing unit 213a is lowered to a lower position Lw (see FIG. 20) on the Z2 direction side by the Z-direction movement mechanism 213b, the pressing unit 213a no longer presses the wafer W1. The pressing unit 213a is a squeegee.

[0070] The pressing unit 213a is attached to the Z1-direction end of the Z-direction movement mechanism 213b. The Z-direction movement mechanism 213b is configured to move the pressing unit 213a linearly in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 213b is, for example, a cylinder. The Z-direction movement mechanism 213b is attached to the Z1-direction end of the X-direction movement mechanism 213c.

[0071] The X-direction movement mechanism 213c is attached to the end of the rotation mechanism 213d on the Z1 direction side. The X-direction movement mechanism 213c is configured to move the pressing unit 213a linearly in one direction. The X-direction movement mechanism 213c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0072] In the squeegee unit 213, the pressing unit 213a is raised to an elevated position Up (see FIG. 18) by the Z-direction movement mechanism 213b. In the squeegee unit 213, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction movement mechanism 213c moves the pressing unit 213a in the Y direction, thereby dividing the wafer W1. In the squeegee unit 213, the Z-direction movement mechanism 213b lowers the pressing unit 213a to a lowered position Lw (see FIG. 20). In the squeegee unit 213, after the movement of the pressing unit 213a in the Y direction has finished, the rotation mechanism 213d rotates the pressing unit 213a by 90 degrees.

[0073] In the squeegee unit 213, the pressing unit 213a is raised to an elevated position Up (see FIG. 18) by the Z-direction movement mechanism 213b. In the squeegee unit 213, after the pressing unit 213a rotates 90 degrees, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction movement mechanism 213c moves the pressing unit 213a in the X direction, thereby dividing the wafer W1.

[0074] <Clamp section> The clamp unit 214 is configured to grip the ring-shaped member W3 of the wafer ring structure W. Specifically, the clamp unit 214 has a gripping unit 214a, a Z-direction movement mechanism 214b, and a Y-direction movement mechanism 214c. The gripping unit 214a supports the ring-shaped member W3 from the Z2 direction side and presses the ring-shaped member W3 from the Z1 direction side. In this manner, the ring-shaped member W3 is gripped by the gripping unit 214a. The gripping unit 214a is attached to the Z-direction movement mechanism 214b.

[0075] The Z-direction movement mechanism 214b is configured to move the clamp unit 214 in the Z direction. Specifically, the Z-direction movement mechanism 214b is configured to move the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 214b is attached to the Y-direction movement mechanism 214c. The Y-direction movement mechanism 214c is configured to move the Z-direction movement mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 214c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0076] (Control configuration of semiconductor wafer processing equipment) 9, semiconductor wafer processing apparatus 100 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 104, a fifth control unit 105, a sixth control unit 106, a seventh control unit 107, an eighth control unit 108, an expansion control calculation unit 109, a handling control calculation unit 110, a dicing control calculation unit 111, and a memory unit 112. The expansion control calculation unit 109 is an example of the "control unit" in the claims.

[0077] The first control unit 101 is configured to control the squeegee unit 213. The first control unit 101 includes a central processing unit (CPU) and a storage unit having a read-only memory (ROM) and a random access memory (RAM). The first control unit 101 may include a hard disk drive (HDD) as the storage unit, in which stored information is retained even after the voltage is cut off. The HDD may be shared by the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108.

[0078] The second control unit 102 is configured to control the cool air supply unit 206 and the cooling unit 207. The second control unit 102 includes a CPU and a storage unit having a ROM, RAM, etc. The third control unit 103 is configured to control the heat shrink unit 211 and the ultraviolet ray irradiation unit 212. The third control unit 103 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the second control unit 102 and the third control unit 103 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0079] The fourth control unit 104 is configured to control the cassette unit 202 and the lift-up hand unit 203. The fourth control unit 104 includes a CPU and a storage unit having a ROM, RAM, etc. The fifth control unit 105 is configured to control the suction hand unit 204. The fifth control unit 105 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the fourth control unit 104 and the fifth control unit 105 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0080] The sixth control unit 106 is configured to control the chuck table unit 12. The sixth control unit 106 includes a CPU and a storage unit having a ROM, RAM, etc. The seventh control unit 107 is configured to control the laser unit 13. The seventh control unit 107 includes a CPU and a storage unit having a ROM, RAM, etc. The eighth control unit 108 is configured to control the imaging unit 14. The eighth control unit 108 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108 may each include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0081] The expansion control calculation unit 109 is configured to perform calculations related to the expansion process of the sheet member W2 based on the processing results of the first control unit 101, the second control unit 102, and the third control unit 103. The expansion control calculation unit 109 includes a CPU and a storage unit having a ROM, a RAM, etc. The detailed configuration of the expansion control calculation unit 109 will be described in detail later.

[0082] The handling control calculation unit 110 is configured to perform calculations related to the movement process of the wafer ring structure W based on the processing results of the fourth control unit 104 and the fifth control unit 105. The handling control calculation unit 110 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0083] The dicing control calculation unit 111 is configured to perform calculations related to the dicing process of the wafer W1 based on the processing results of the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108. The dicing control calculation unit 111 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0084] The storage unit 112 stores programs for operating the dicing device 1 and the expanding device 2. The storage unit 112 includes a ROM, a RAM, an HDD, and the like.

[0085] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 100 will be described below with reference to FIGS.

[0086] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W accommodated in the cassette unit 202 is supported by the lift-up hand 203b, the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, thereby removing the wafer ring structure W from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the dicing apparatus 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction movement mechanism 204a while being sucked by the suction hand 204c. Then, the wafer ring structure W moved in the X2 direction is transferred from the suction hand 204c to the chuck table unit 12, and then gripped by the chuck table unit 12.

[0087] In step S3, a modified layer is formed on the wafer W1 by the laser unit 13. In step S4, the wafer ring structure W having the wafer W1 on which the modified layer has been formed is transferred to the clamp unit 214 by the suction hand 204c. In step S5, the sheet member W2 is cooled by the cold air supply unit 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamp unit 214 is moved (lowered) in the Z2 direction by the Z-direction movement mechanism 214b so as to contact the cooling unit 207, and cold air is supplied from the Z1 direction by the cold air supply unit 206, thereby cooling the sheet member W2.

[0088] In step S6, the wafer ring structure W is moved to the expanding unit 208 by the clamping unit 214. That is, the wafer ring structure W, from which the sheet member W2 has been cooled, is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. In step S7, the sheet member W2 is expanded by the expanding unit 208. That is, the wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 281 and is expanded by being pulled by the expanding ring 281. As a result, the wafer W1 is divided along the dividing lines (modified layers).

[0089] In step S8, the sheet member W2 in the expanded state is pressed from the Z1 direction side by the expansion maintaining member 210. That is, the pressing ring portion 210a is moved (lowered) in the Z2 direction by the Z direction moving mechanism 210d until it abuts against the sheet member W2. Then, the process proceeds from point A in FIG. 10 via point A in FIG. 11 to step S9.

[0090] 11, in step S9, after the sheet member W2 is pressed by the expansion maintaining member 210, the ultraviolet ray Ut is irradiated onto the sheet member W2 by the ultraviolet ray irradiating unit 212 while the wafer W1 is pressed by the squeegee unit 213. As a result, the wafer W1 is further divided by the squeegee unit 213. In addition, the adhesive strength of the sheet member W2 is reduced by the ultraviolet ray Ut irradiated from the ultraviolet ray irradiating unit 212.

[0091] In step S10, the sheet material W2 is heated and shrunk by the heat shrink unit 211, while the clamp unit 214 is raised. At this time, the intake unit 210c sucks in air near the heated sheet material W2. In step S11, the wafer ring structure W is transferred from the clamp unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction movement mechanism 214c while being held by the clamp unit 214. Then, at a position on the Z1 direction side of the cooling unit 207, the wafer ring structure W is released from the clamp unit 214 and then sucked by the suction hand 204c.

[0092] In step S12, the wafer ring structure W is transferred to the lift-up hand 203b by the suction hand 204c. In step S13, the wafer ring structure W is accommodated in the cassette unit 202. That is, the wafer ring structure W supported by the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, and the wafer ring structure W is accommodated in the cassette unit 202. This completes the processing performed on one wafer ring structure W. Then, the process returns to step S1 from point B in FIG. 11 via point B in FIG. 10.

[0093] (Detailed configuration of the ultraviolet irradiation unit and squeegee unit) 12, the expanding device 2 includes the expanding section 208, the expansion maintaining member 210, the ultraviolet ray irradiation section 212, and the squeegee section 213. Note that Fig. 12 shows a state after the expanding section 208 has finished expanding the sheet member W2 and before the squeegee section 213 presses the wafer W1.

[0094] <Expanding section> The expanding unit 208 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch by expanding the stretchable sheet member W2 to which the wafer W1 is attached. The expanding unit 208 has an expanding ring 281.

[0095] The expand ring 281 is configured to support the sheet member W2 from the Z2 direction side when expanding the sheet member W2.

[0096] Specifically, the expand ring 281 has a support ring portion 281a and a movement mechanism accommodating portion 281b.

[0097] The support ring portion 281a is a portion on the Z1 direction side of the movement mechanism accommodating portion 281b of the expand ring 281. The support ring portion 281a has a cylindrical shape with a through-hole 1281a formed therein that penetrates in the Z direction.

[0098] The movement mechanism accommodating section 281b is a portion of the expand ring 281 on the Z2 direction side of the support ring section 281a. In the radial direction of the expand ring 281, the movement mechanism accommodating section 281b has a larger diameter than the support ring section 281a. The movement mechanism accommodating section 281b is provided integrally with the support ring section 281a. The movement mechanism accommodating section 281b has a substantially cylindrical shape with an accommodating space 1281b formed therein. In the radial direction of the expand ring 281, the accommodating space 1281b has a larger diameter than the through-hole 1281a. The end of the movement mechanism accommodating section 281b on the Z2 direction side is fixed to the base 205.

[0099] In plan view, the ultraviolet irradiation unit 212 and the squeegee unit 213 are disposed radially inside the expanding ring 281. The accommodation space 1281b accommodates a Z2-direction side portion of the Z-direction movement mechanism 213b, an X-direction movement mechanism 213c, and a rotation mechanism 213d. The through-hole 1281a accommodates a portion of the Z-direction movement mechanism 213b that is closer to the Z1-direction side than the Z2-direction side portion, and the pressing unit 213a. In the Z direction, the Z-direction movement mechanism 213b is configured to move the pressing unit 213a in the Z1 direction so that the upper end of the pressing unit 213a of the squeegee unit 213 does not protrude from the expanding ring 281.

[0100] <Expansion maintenance member> The expansion-retaining member 210 has the pressure ring portion 210a, the lid portion 210b, and the intake portion 210c.

[0101] The lid portion 210b has a nitrogen supply hole 1210b. The nitrogen supply hole 1210b is a hole that allows nitrogen to flow into the space inside the expansion maintaining member 210 immediately before ultraviolet irradiation by the ultraviolet irradiation unit 212, so that oxygen is not supplied to the portion of the sheet member W2 where the adhesive strength is to be reduced during ultraviolet irradiation by the ultraviolet irradiation unit 212. The nitrogen supply hole 1210b penetrates the lid portion 210b in the Z direction. The nitrogen supply hole 1210b is connected to a nitrogen supply source (not shown) via a nitrogen supply hose 1211b.

[0102] The pressure ring portion 210a has an air release hole 1210a. The air release hole 1210a is a hole that allows oxygen inside the expansion-retaining member 210 to flow out using nitrogen supplied from the nitrogen supply hole 1210b. The air release hole 1210a penetrates the pressure ring portion 210a in the radial direction. The air release hole 1210a is formed on the Z2 direction side of the pressure ring portion 210a. The nitrogen supply hole 1210b is connected to a nitrogen supply source (not shown).

[0103] As a result, the oxygen in the expansion maintenance member 210 is expelled by nitrogen through the air escape hole 1210a, and oxygen is not supplied to the part of the sheet member W2 where the adhesive strength is to be reduced during ultraviolet irradiation, so that the adhesive strength of the sheet member W2 can be reduced by ultraviolet irradiation by the ultraviolet irradiation unit 212.

[0104] <Ultraviolet irradiation section> As shown in FIGS. 13 and 14, the ultraviolet ray irradiation unit 212 is configured to irradiate ultraviolet rays Ut onto the sheet member W2 expanded by the expanding unit 208 at a position corresponding to the position of the wafer W1.

[0105] Specifically, the ultraviolet irradiation unit 212 has an ultraviolet light-emitting unit 212a in which a plurality of LEDs (Light Emitting Diodes) are arranged in a row. The ultraviolet irradiation unit 212 is arranged at the end of the squeegee unit 213 on the Z1 direction side of a pressing unit 213a (described later). The ultraviolet irradiation unit 212 is integrally provided within the squeegee unit 213. The ultraviolet irradiation unit 212 is configured to irradiate ultraviolet light Ut on the Z1 direction side. The ultraviolet irradiation unit 212 is arranged in a position between the upper surface W31 of the ring-shaped member W3 and the pressing surface W22 of the sheet member W2 where local pressing is performed by the squeegee unit 213 when the sheet member W2 is in an expanded state in which the expanding unit 208 has expanded it.

[0106] <Squeegee Section> As shown in Figures 14 and 15, the squeegee unit 213 is configured to locally press the wafer W1 after the sheet member W2 is expanded by the expansion unit 208 to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0107] Specifically, the squeegee unit 213 has a pressing unit 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotation mechanism 213d.

[0108] The pressing portion 213a has a plate shape that extends linearly in a plan view. The pressing portion 213a is configured to be moved by the X-direction moving mechanism 213c and the rotating mechanism 213d and to press the wafer W1 via the sheet member W2. The pressing portion 213a presses a pressing surface W22, which is the lower surface of a portion of the sheet member W2 that corresponds to the wafer W1.

[0109] In the Ex direction, the pressing portion 213a has a length L that is greater than the diameter Wd1 of the wafer W1 and smaller than the inner diameter Wd2 of the ring-shaped member W3. In addition, in the Ex direction, the length L of the pressing portion 213a is smaller than the inner diameter Re of the expand ring 281. Note that the Ex direction indicates the extension direction of the plate-shaped pressing portion 213a that extends in a straight line in a plan view.

[0110] As shown in FIGS. 15 and 16, the Z-direction movement mechanism 213b, the X-direction movement mechanism 213c, and the rotation mechanism 213d are a common movement mechanism that can move both the ultraviolet irradiating unit 212 and the squeegee unit 213.

[0111] The X-direction movement mechanism 213c is configured to move both the ultraviolet irradiation unit 212 and the squeegee unit 213 in the M11 direction (one direction) of the horizontal direction. The X-direction movement mechanism 213c has a mounting unit 2131c, a linear unit 2132c, and a motor 2133c. The mounting unit 2131c is attached to the linear unit 2132c so as to be slidable in the M11 direction and the M12 direction (the opposite direction of the one direction). The Z-direction movement mechanism 213b is attached to the upper end of the mounting unit 2131c. The motor 2133c is a drive source for sliding the mounting unit 2131c in the M11 direction and the M12 direction.

[0112] 16 and 17, the rotation mechanism 213d is configured to rotate the ultraviolet irradiator 212 and the squeegee unit 213 in the Rt direction about a rotation axis Ac extending along the Z direction. The rotation mechanism 213d is also configured to rotate the X-direction movement mechanism 213c from a position where both the ultraviolet irradiator 212 and the squeegee unit 213 can be moved in the M11 direction to a position where both can be moved in the M21 direction (another direction) perpendicular to the M11 direction.

[0113] Specifically, the rotation mechanism 213d has a rotation table 2131d and a motor 2132d. An X-direction movement mechanism 213c is attached to the upper end of the rotation table 2131d. The motor 2132d is a drive source for rotating the rotation table 2131d in the Rt direction.

[0114] (Detailed configuration of the expansion control calculation unit) 18 to 21, the control of the ultraviolet ray irradiation unit 212 and the squeegee unit 213 by the expansion control calculation unit 109 will be described.

[0115] The expansion control calculation unit 109 is configured to perform control in which the ultraviolet irradiation unit 212 and the squeegee unit 213 are moved in parallel by a common movement mechanism. Here, the common movement mechanism is the Z-direction movement mechanism 213b, the X-direction movement mechanism 213c, and the rotation mechanism 213d.

[0116] 18 and 19, the expansion control calculation unit 109 is configured to perform control so that when the pressing portion 213a of the squeegee unit 213 is moved in the M11 direction of the horizontal direction by a common moving mechanism to locally press the wafer W1, the expansion control calculation unit 109 simultaneously performs control so as to irradiate ultraviolet rays Ut by the ultraviolet irradiation unit 212. Note that this control is performed after nitrogen is introduced into the space within the expansion maintaining member 210 through the nitrogen supply hole 1210b and oxygen is released from the space within the expansion maintaining member 210 through the air release hole 1210a.

[0117] Specifically, the expansion control calculation unit 109 is configured to control the Z-direction movement mechanism 213b to raise the pressing unit 213a to the raised position Up. Based on the reaching of the pressing unit 213a to the raised position Up, the expansion control calculation unit 109 is configured to control the pressing unit 213a to locally press the wafer W1 from the Z2 direction side via the sheet member W2 while the X-direction movement mechanism 213c moves the pressing unit 213a in the M11 direction, thereby dividing the wafer W1. At this time, the expansion control calculation unit 109 is configured to control the ultraviolet ray irradiation unit 212 to simultaneously irradiate the wafer W1 with ultraviolet ray Ut.

[0118] The expansion control calculation unit 109 is configured to stop the irradiation of ultraviolet rays Ut by the ultraviolet irradiation unit 212 based on the completion of the movement of the pressing unit 213a in the M11 direction, and to control the Z-direction movement mechanism 213b to lower the pressing unit 213a to the lowered position Lw (see Figure 20).

[0119] As shown in Figures 20 and 21, the expansion control calculation unit 109 is configured to control the irradiation of ultraviolet rays Ut by the ultraviolet irradiation unit 212 in parallel when the pressing portion 213a of the squeegee unit 213 is moved in the M21 direction in the horizontal direction to locally press the wafer W1.

[0120] Specifically, the expansion control calculation unit 109 is configured to perform control such that the pressing unit 213a is rotated 90 degrees by the rotation mechanism 213d based on the fact that the pressing unit 213a has reached the lowered position Lw. The expansion control calculation unit 109 is configured to perform control such that the pressing unit 213a is raised to the raised position Up (see FIG. 18) by the Z-direction movement mechanism 213b based on the fact that the pressing unit 213a has completed the 90-degree rotation.

[0121] When the pressing unit 213a reaches the raised position Up (see FIG. 18), the expanding control calculation unit 109 causes the pressing unit 213a to locally press the wafer W1 from the Z2 direction side via the sheet member W2 while the X-direction moving mechanism 213c moves the pressing unit 213a in the M21 direction, thereby dividing the wafer W1. At this time, the expanding control calculation unit 109 is configured to control the ultraviolet irradiation unit 212 to concurrently irradiate the wafer W1 with ultraviolet rays Ut.

[0122] The expansion control calculation unit 109 is configured to stop the irradiation of ultraviolet rays Ut by the ultraviolet irradiation unit 212 based on the completion of the movement of the pressing unit 213a in the M21 direction, and to control the Z-direction movement mechanism 213b to lower the pressing unit 213a to the lowered position Lw.

[0123] (Squeegee breaking process) 22 and 23, the squeegee breaking process performed by controlling the ultraviolet irradiation unit 212 and the squeegee unit 213 by the expansion control calculation unit 109 will be described below. Note that the squeegee breaking process is performed after nitrogen is introduced into the space within the expansion-maintaining member 210 through the nitrogen supply hole 1210b and oxygen in the space within the expansion-maintaining member 210 is released through the air release hole 1210a.

[0124] In step S101, the pressing portion 213a of the squeegee unit 213 is raised to the raised position Up. In step S102, it is determined whether the pressing portion 213a has reached the raised position Up. If the pressing portion 213a has reached the raised position Up, the process proceeds to step S103; if the pressing portion 213a has not reached the raised position Up, step S102 is repeated. In step S103, the ultraviolet ray irradiation unit 212 irradiates the wafer W1 with ultraviolet rays Ut while the squeegee unit 213 presses the wafer W1. At this time, the pressing portion 213a is moved in the M11 direction by the X-direction movement mechanism 213c.

[0125] In step S104, it is determined whether or not the movement of the pressing portion 213a in the M11 direction has finished. If the movement of the pressing portion 213a in the M11 direction has finished, the process proceeds to step S105; if the movement of the pressing portion 213a in the M11 direction has not finished, step S104 is repeated. In step S105, the pressing portion 213a of the squeegee portion 213 is lowered to the lowered position Lw. In step S106, it is determined whether or not the pressing portion 213a has reached the lowered position Lw. If the pressing portion 213a has reached the lowered position Lw, the process proceeds to step S107; if the pressing portion 213a has not reached the lowered position Lw, step S106 is repeated.

[0126] In step S107, the pressing unit 213a is rotated 90 degrees by the rotation mechanism 213d. In step S108, if the pressing unit 213a reaches the raised position Up, the process proceeds to step S109, and if the pressing unit 213a has not reached the raised position Up, step S108 is repeated. In step S109, the ultraviolet ray Ut is irradiated by the ultraviolet ray irradiation unit 212 while the squeegee unit 213 presses the wafer W1. At this time, the pressing unit 213a is moved in the M21 direction by the X-direction movement mechanism 213c.

[0127] In step S109, it is determined whether or not the movement of the pressing portion 213a in the M21 direction has ended. If the movement of the pressing portion 213a in the M21 direction has ended, the process proceeds to step S110 via point C in FIG. 22 and point C in FIG. 23, and if the movement of the pressing portion 213a in the M21 direction has not ended, step S109 is repeated. In step S110, the pressing portion 213a of the squeegee portion 213 is lowered to the lowered position Lw. In step S111, it is determined whether or not the pressing portion 213a has reached the lowered position Lw. If the pressing portion 213a has reached the lowered position Lw, the squeegee braking process is ended, and if the pressing portion 213a has not reached the lowered position Lw, step S111 is repeated.

[0128] Here, as a process other than the squeegee breaking process in the manufacturing method for semiconductor chips Ch (the semiconductor chip manufacturing process described above), which is a manufacturing method for manufacturing semiconductor chips Ch, the semiconductor chip manufacturing process includes a step of forming a modified layer in the wafer W1 by irradiating laser light from a laser irradiation unit 13a that irradiates laser light onto the wafer W1 on which multiple semiconductor chips Ch are provided. The semiconductor chip manufacturing process includes a step of dividing the wafer W1 into multiple semiconductor chips Ch by an expanding unit 208 that expands a stretchable sheet member W2 to which the wafer W1 is attached. The semiconductor chip manufacturing process includes a step of irradiating ultraviolet light onto the sheet member W2 corresponding to the position of the wafer W1 and locally pressing the wafer W1 by moving the ultraviolet irradiation unit 212 and the squeegee unit 213 using a common moving mechanism.

[0129] In this way, the semiconductor chip Ch manufactured by the semiconductor chip manufacturing process is manufactured by the expanding device 2 which includes the expanding section 208, the ultraviolet irradiation section 212, the squeegee section 213, and the common moving mechanism.

[0130] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0131] In the first embodiment, as described above, the expanding device 2 includes a common X-direction movement mechanism 213c and a rotation mechanism 213d that can move both the ultraviolet irradiator 212 and the squeegee 213. This allows the squeegee 213 to locally press the wafer W1 and the ultraviolet irradiator 212 to irradiate it with ultraviolet rays Ut using the common X-direction movement mechanism 213c and the rotation mechanism 213d (common movement mechanism). Therefore, even when both the squeegee 213 and the ultraviolet irradiator 212 are provided, the device can be prevented from becoming large. Furthermore, the squeegee 213 presses the sheet member W2 that corresponds to the position of the wafer W1 in order to divide the wafer W1 into multiple semiconductor chips Ch. The ultraviolet irradiator 212 irradiates the sheet member W2 that corresponds to the position of the wafer W1 with ultraviolet rays in order to harden the adhesive of the sheet member W2 that corresponds to the position of the wafer W1. Therefore, the portion of sheet member W2 pressed by squeegee unit 213 and the portion of sheet member W2 irradiated with ultraviolet rays by ultraviolet irradiation unit 212 are the same, so by moving ultraviolet irradiation unit 212 in accordance with the movement of squeegee unit 213 and irradiating ultraviolet rays, it is possible to perform both the division of wafer W1 by squeegee unit 213 and the curing of adhesive by ultraviolet rays irradiated from ultraviolet irradiation unit 212 on the portion of sheet member W2 corresponding to the position of wafer W1. As a result, it is possible to prevent an increase in the number of parts of expanding device 2 and an increase in the size of the device, compared to when the two members are moved separately.

[0132] Furthermore, in the first embodiment, as described above, the common movement mechanism includes the X-direction movement mechanism 213c and the rotation mechanism 213d that move both the ultraviolet irradiation unit 212 and the squeegee unit 213 in one of the horizontal directions, and the rotation mechanism 213d that rotates at least the squeegee unit 213 about the rotation axis Ac that extends along the up-down direction. As a result, the number of common movement mechanisms required to realize both the irradiation of ultraviolet rays Ut by the ultraviolet irradiation unit 212 and the pressing of the wafer W1 by the squeegee unit 213 is relatively small, only the X-direction movement mechanism 213c and the rotation mechanism 213d, and therefore it is possible to suppress an increase in the number of parts of the expanding device 2 and an increase in size.

[0133] Furthermore, in the first embodiment, as described above, the X-direction movement mechanism 213c is attached to the rotation mechanism 213d. The rotation mechanism 213d is configured to rotate the X-direction movement mechanism 213c from a position where both the ultraviolet irradiator 212 and the squeegee unit 213 can be moved in one direction to a position where both can be moved in another direction perpendicular to the one direction. This allows the rotation by the rotation mechanism 213d to press the wafer W1 with the squeegee unit 213 and irradiate the wafer W1 with ultraviolet rays Ut with the ultraviolet irradiator 212 in both the one direction and the other direction, thereby allowing the squeegee unit 213 to sufficiently divide the semiconductor chips Ch and the ultraviolet irradiator 212 to sufficiently harden the adhesive of the sheet member W2.

[0134] Furthermore, in the first embodiment, as described above, the expanding unit 208 includes the expanding ring 281 that expands the sheet member W2. The ultraviolet irradiating unit 212, the squeegee unit 213, the X-direction moving mechanism 213c, and the rotating mechanism 213d are arranged radially inside the expanding ring 281 in a plan view. This makes it possible to effectively utilize the space inside the expanding ring 281 that is difficult to use for other purposes and to accommodate the ultraviolet irradiating unit 212, the squeegee unit 213, the X-direction moving mechanism 213c, and the rotating mechanism 213d inside the expanding ring 281, thereby further preventing the expansion device 2 from becoming larger.

[0135] Furthermore, in the first embodiment, as described above, the expanding device 2 includes the expanding control calculation unit 109 configured to control the ultraviolet irradiation by the ultraviolet irradiation unit 212 and the local pressing of the wafer W1 by the squeegee unit 213 to be performed in parallel while moving both the ultraviolet irradiation unit 212 and the squeegee unit 213 using the common X-direction moving mechanism 213c and the rotating mechanism 213d. This allows the ultraviolet irradiation by the ultraviolet irradiation unit 212 and the local pressing of the wafer W1 by the squeegee unit 213 to be performed efficiently, thereby improving the efficiency of the work performed in the expanding device 2.

[0136] Furthermore, in the first embodiment, as described above, the ultraviolet irradiation unit 212 is attached to the common X-direction movement mechanism 213c and rotation mechanism 213d while being integrally provided within the squeegee unit 213. This allows the ultraviolet irradiation unit 212 and the squeegee unit 213 to be arranged in only the space required for arranging the squeegee unit 213, thereby preventing an increase in the arrangement space required for the ultraviolet irradiation unit 212 and the squeegee unit 213 for the common X-direction movement mechanism 213c and rotation mechanism 213d. As a result, it is possible to prevent the common X-direction movement mechanism 213c and rotation mechanism 213d from becoming larger, thereby further preventing an increase in the size of the expanding device 2.

[0137] Furthermore, in the first embodiment, as described above, a process is provided in which ultraviolet rays are irradiated onto a portion of the sheet member W2 corresponding to the position of the wafer W1 and the wafer W1 is locally pressed by moving the ultraviolet irradiation unit 212 and the squeegee unit 213 using a common moving mechanism. This allows the squeegee unit 213 to locally press the wafer W1 and the ultraviolet irradiation unit 212 to irradiate the wafer W1 with ultraviolet rays using a common moving mechanism, so that even when both the squeegee unit 213 and the ultraviolet irradiation unit 212 are provided, a method for manufacturing semiconductor chips Ch can be obtained that can prevent the apparatus from becoming large.

[0138] Furthermore, in the first embodiment, as described above, the semiconductor chips Ch are manufactured by the expanding device 2 that includes a common moving mechanism that can move both the ultraviolet irradiation unit 212 and the squeegee unit 213. This allows the common moving mechanism to locally press the wafer W1 with the squeegee unit 213 and irradiate ultraviolet rays with the ultraviolet irradiation unit 212, so that even when both the squeegee unit 213 and the ultraviolet irradiation unit 212 are provided, it is possible to obtain semiconductor chips Ch that can prevent the device from becoming too large.

[0139] [Second embodiment] 24 to 28, the configuration of a semiconductor wafer processing apparatus 300 according to the second embodiment will be described. Unlike the first embodiment, the second embodiment has an ultraviolet irradiation unit 3212 disposed separately from a squeegee unit 3213. Note that in the second embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0140] (Semiconductor wafer processing equipment) The semiconductor wafer processing apparatus 300 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0141] The semiconductor wafer processing apparatus 300 is equipped with a dicing apparatus 1 and an expanding apparatus 302. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 302 are lined up is the X direction, the X1 direction is the expanding apparatus 302 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0142] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets).

[0143] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0144] (Expanding device) The expanding device 302 is configured to divide the wafer W1 to form a plurality of semiconductor chips Ch.

[0145] The expansion device 302 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 3212, a squeegee section 3213, and a clamp section 214.

[0146] (Detailed configuration of the ultraviolet irradiation unit and squeegee unit) As shown in FIG. 25, the ultraviolet ray irradiation unit 3212 is configured to irradiate with ultraviolet rays Ut a portion of the sheet member W2 expanded by the expanding unit 208 that corresponds to the position of the wafer W1.

[0147] Specifically, the ultraviolet irradiation unit 3212 has an ultraviolet light-emitting unit 3212a in which multiple LEDs are arranged in a row. The ultraviolet light irradiation unit 3212 is attached to a common movement mechanism separately from the squeegee unit 3213. The ultraviolet light irradiation unit 212 is disposed at the end of the X-direction movement mechanism 213c on the Z1 direction side. The ultraviolet light-emitting unit 3212a is disposed at a position farther away in the Z2 direction from the pressing surface W22 of the sheet member W2, where local pressing is performed by the squeegee unit 3213, than the upper surface W31 of the ring-shaped member W3 when the sheet member W2 is in an expanded state in which the expanding unit 208 has expanded it.

[0148] <Squeegee Section> The squeegee unit 3213 is configured to locally press the wafer W1 after the sheet member W2 is expanded by the expanding unit 208 to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0149] Specifically, the squeegee unit 3213 has a pressing unit 3213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotation mechanism 213d.

[0150] Here, the X-direction moving mechanism 213c and the rotation mechanism 213d are a common moving mechanism that can move both the ultraviolet irradiating unit 3212 and the squeegee unit 3213.

[0151] (Detailed configuration of the expansion control calculation unit) 26 to 28, the control of the ultraviolet ray irradiation unit 212 and the squeegee unit 213 by the expansion control calculation unit 109 will be described.

[0152] The expansion control calculation unit 109 is configured to perform control in parallel while moving both the ultraviolet irradiation unit 3212 and the squeegee unit 3213 using a common movement mechanism. Note that the above control is performed after nitrogen is introduced into the space within the expansion-maintaining member 210 through the nitrogen supply hole 1210b and oxygen is released from the space within the expansion-maintaining member 210 through the air release hole 1210a.

[0153] As shown in Figures 26 and 27, the expansion control calculation unit 109 is configured to control the irradiation of ultraviolet rays Ut by the ultraviolet irradiation unit 3212 in parallel when the pressing portion 3213a of the squeegee unit 3213 is moved in the M22 direction in the horizontal direction by a common moving mechanism to locally press the wafer W1.

[0154] 28 and 29, the expansion control calculation unit 109 is configured to perform control such that when the pressing portion 3213a of the squeegee unit 3213 is moved in the M11 direction among the horizontal directions to locally press the wafer W1, the expansion control calculation unit 109 concurrently performs irradiation of ultraviolet rays Ut by the ultraviolet irradiation unit 3212. Note that other configurations of the second embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0155] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0156] In the second embodiment, similarly to the first embodiment, the expanding device 302 includes a common X-direction moving mechanism 213c and a rotating mechanism 213d that can move both the ultraviolet ray irradiation unit 3212 and the squeegee unit 3213. This makes it possible to prevent the device from becoming large even when both the squeegee unit 3213 and the ultraviolet ray irradiation unit 3212 are provided.

[0157] Furthermore, in the second embodiment, as described above, the ultraviolet ray irradiation unit 3212 is attached to the common X-direction movement mechanism 213c and rotation mechanism 213d separately from the squeegee unit 3213. This eliminates the need for a configuration in the squeegee unit 213 for providing the ultraviolet ray irradiation unit 3212 therein, thereby preventing the structure of the squeegee unit 213 from becoming complicated.

[0158] Furthermore, in the second embodiment, as described above, the ultraviolet irradiation unit 3212 is configured to irradiate the expanded sheet member W2 from below. The ultraviolet irradiation unit 3212 includes an ultraviolet light emitter 3212a that emits ultraviolet light Ut. The ultraviolet light emitter 3212a is positioned below the pressing surface W22 of the sheet member W2, where the squeegee unit 213 applies localized pressure, and further away from the upper surface W31 of the ring-shaped member W3 that is attached to the sheet member W2 while surrounding the wafer W1 when the sheet member W2 is in an expanded state after being expanded by the expanding unit 208. This allows the ultraviolet light Ut to be irradiated from a location somewhat away from the sheet member W2, preventing the ultraviolet light Ut from hitting a specific location on the sheet member W2. As a result, the ultraviolet light Ut can be evenly applied to the sheet member W2. Note that other advantages of the second embodiment are similar to those of the first embodiment, and therefore will not be described further.

[0159] [Third embodiment] 29 to 32, the configuration of a semiconductor wafer processing apparatus 400 according to the third embodiment will be described. Unlike the first embodiment, the second embodiment has a squeegee unit 4213 disposed outside an expand ring 4281. Note that in the third embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0160] (Semiconductor wafer processing equipment) As shown in FIGS. 30 and 31, a semiconductor wafer processing apparatus 400 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0161] The semiconductor wafer processing apparatus 400 is equipped with a dicing apparatus 1 and an expanding apparatus 402. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 402 are lined up is the X direction, the X1 direction is the expanding apparatus 402 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0162] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets).

[0163] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0164] (Expanding device) As shown in FIGS. 31 and 32, the expanding apparatus 402 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0165] The expansion device 402 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 4208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 4212, a squeegee section 4213, and a clamp section 214.

[0166] <Expanding section> The expanding section 4208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing lines.

[0167] Specifically, the expanding section 4208 has an expanding ring 4281 and a Z-direction moving mechanism 4282 .

[0168] The expand ring 4281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding the sheet member W2. The expand ring 4281 has a ring shape in a plan view. The Z-direction movement mechanism 4282 is configured to move the expand ring 4281 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 4282 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 4282 is attached to the base 201.

[0169] <Ultraviolet irradiation section> The ultraviolet ray irradiation section 4212 is configured to irradiate with ultraviolet rays Ut a portion of the sheet member W2 expanded by the expanding section 4208 that corresponds to the position of the wafer W1.

[0170] Specifically, the ultraviolet irradiation unit 4212 has an ultraviolet light emitting unit (not shown) in which a plurality of LEDs are arranged in a row. The ultraviolet irradiation unit 4212 is attached to a common moving mechanism separately from the squeegee unit 4213.

[0171] <Squeegee Section> 32 and 33, the squeegee unit 4213 is configured to expand the sheet member W2 and then press the wafer W1 from the Z2 direction to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 4213 has a pressing unit 4213a, a Y-direction movement mechanism 4213b, an X-direction movement mechanism 4213c, a Z-direction movement mechanism 4213d, and a rotation mechanism 4213e. The X-direction movement mechanism 4213c is an example of a "first linear movement mechanism" in the claims. The Y-direction movement mechanism 4213b is an example of a "second linear movement mechanism" in the claims.

[0172] The pressing unit 4213a is configured to move in the Z1 direction by the Z-direction moving mechanism 4213d, and then move by the rotation mechanism 4213e, the Y-direction moving mechanism 4213b, and the X-direction moving mechanism 4213c while pressing the wafer W1 from the Z2 direction via the sheet member W2, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. The pressing unit 4213a is a squeegee.

[0173] The Y-direction movement mechanism 4213b is a linear movement mechanism that moves the pressing unit 4213a and the ultraviolet light irradiation unit 4212 linearly in the Y direction (other direction). The Y-direction movement mechanism 4213b is fixed to the base 205. The Y-direction movement mechanism 4213b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0174] The X-direction movement mechanism 4213c is a linear movement mechanism that moves the pressing unit 4213a and the ultraviolet ray irradiation unit 4212 linearly in the X direction (one direction). The X-direction movement mechanism 4213c is attached to the Y-direction movement mechanism 4213b. The X-direction movement mechanism 4213c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0175] The Z-direction movement mechanism 4213d is a linear movement mechanism that moves the pressing unit 4213a and the ultraviolet ray irradiation unit 4212 linearly in the Z direction. The Z-direction movement mechanism 4213d is attached to the X-direction movement mechanism 4213c. The Z-direction movement mechanism 4213d is formed of, for example, a cylinder.

[0176] The rotation mechanism 4213e is configured to rotate the pressing unit 4213a and the ultraviolet ray irradiation unit 4212. The rotation mechanism 4213e is attached to the X-direction movement mechanism 4213c via the Z-direction movement mechanism 4213d. The ultraviolet ray irradiation unit 4212 and the pressing unit 4213a are attached to the end of the rotation mechanism 4213e on the Z1 direction side.

[0177] (Detailed configuration of the expansion control calculation unit) As in the first embodiment, the expansion control calculation unit 109 is configured to perform control in parallel while moving both the ultraviolet irradiating unit 4212 and the squeegee unit 4213 using a common movement mechanism. Note that other configurations of the third embodiment are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0178] (Effects of the third embodiment) In the third embodiment, the following effects can be obtained.

[0179] In the third embodiment, similarly to the first embodiment, the expanding device 402 includes a common Y-direction moving mechanism 4213b, an X-direction moving mechanism 4213c, and a rotation mechanism 4213e that are capable of moving both the ultraviolet ray irradiation unit 4212 and the squeegee unit 4213. This makes it possible to prevent the device from becoming too large even when both the squeegee unit 4213 and the ultraviolet ray irradiation unit 4212 are provided.

[0180] Furthermore, in the third embodiment, as described above, the expanding device 402 includes a Y-direction movement mechanism 4213b that moves the expanding device 402 in one direction perpendicular to one horizontal direction. The X-direction movement mechanism 4213c is attached to the Y-direction movement mechanism 4213b. The rotation mechanism 4213e is attached to the X-direction movement mechanism 4213c. The ultraviolet light irradiation unit 212 is attached to the rotation mechanism 4213e. The squeegee unit 4213 is attached to the rotation mechanism 4213e. As a result, the X-direction movement mechanism 4213c and the Y-direction movement mechanism 4213b are not attached to the rotation mechanism 4213e, which prevents an increase in the driving force of the motor required to rotate the rotation mechanism 4213e. As a result, the rotation mechanism 3213e can be rotated using a relatively small motor, which further prevents the expanding device 402 from becoming larger.

[0181] Furthermore, in the third embodiment, as described above, the expanding unit 4208 includes an expanding ring 4281 that expands the sheet member W2. The ultraviolet ray irradiation unit 4212, the squeegee unit 4213, the Y-direction movement mechanism 4213b, the X-direction movement mechanism 4213c, and the rotation mechanism 4213e are disposed outside the expanding ring 4281. This alleviates restrictions on the space required for arranging the ultraviolet ray irradiation unit 4212, the squeegee unit 4213, the Y-direction movement mechanism 4213b, the X-direction movement mechanism 4213c, and the rotation mechanism 4213e, thereby improving the degree of freedom in arranging the ultraviolet ray irradiation unit 4212, the squeegee unit 4213, the Y-direction movement mechanism 4213b, the X-direction movement mechanism 4213c, and the rotation mechanism 4213e. Note that other effects of the third embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0182] [Fourth embodiment] 33 to 35, the configuration of a semiconductor wafer processing apparatus 500 according to the fourth embodiment will be described. In the fourth embodiment, unlike the third embodiment, an ultraviolet irradiator 5212 is not attached to a rotation mechanism 4213e but to an X-direction movement mechanism 4213c. Note that in the fourth embodiment, detailed description of the same configuration as in the third embodiment will be omitted.

[0183] (Semiconductor wafer processing equipment) As shown in FIGS. 33 and 34, the semiconductor wafer processing apparatus 500 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0184] The semiconductor wafer processing apparatus 500 is equipped with a dicing apparatus 1 and an expanding apparatus 502. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 402 are lined up is the X direction, the X1 direction is the expanding apparatus 402 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0185] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets).

[0186] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0187] (Expanding device) The expanding device 502 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0188] The expansion device 502 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 4208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 5212, a squeegee section 4213, and a clamp section 214.

[0189] <Ultraviolet irradiation section> As shown in FIGS. 33 to 35, the ultraviolet ray irradiation section 5212 is configured to irradiate with ultraviolet rays Ut a portion of the sheet member W2 expanded by the expanding section 4208 that corresponds to the position of the wafer W1.

[0190] Specifically, the ultraviolet irradiation unit 5212 has an ultraviolet light emitting unit (not shown) in which a plurality of LEDs are arranged in a row. The ultraviolet irradiation unit 5212 is attached to a common movement mechanism separately from the squeegee unit 4213. The ultraviolet irradiation unit 5212 is attached to the X-direction movement mechanism 4213c, not to the rotation mechanism 4213e.

[0191] (Expansion control calculation unit) The expansion control calculation unit (not shown) is configured to perform control so that, when the pressing portion 4213a of the squeegee unit 4213 is moved in the M11 direction of the horizontal direction by a common movement mechanism to locally press the wafer W1, the ultraviolet irradiation unit 5212 simultaneously irradiates the wafer with ultraviolet rays Ut. Furthermore, when the pressing portion 4213a of the squeegee unit 4213 is moved in the M22 direction of the horizontal direction by a common movement mechanism to locally press the wafer W1, the expansion control calculation unit is configured to perform control so that the ultraviolet irradiation unit 5212 does not irradiate the wafer with ultraviolet rays Ut. The X-direction movement mechanism 4213c is an example of a "first linear movement mechanism" in the claims. The other configurations of the fourth embodiment are similar to those of the third embodiment, and therefore description thereof will be omitted.

[0192] (Effects of the fourth embodiment) In the fourth embodiment, the following effects can be obtained.

[0193] In the fourth embodiment, similarly to the third embodiment, the expanding device 502 includes a common Y-direction movement mechanism 4213b, an X-direction movement mechanism 4213c, and a rotation mechanism 4213e that are capable of moving both the ultraviolet ray irradiation unit 5212 and the squeegee unit 4213. This makes it possible to prevent the device from becoming large even when both the squeegee unit 4213 and the ultraviolet ray irradiation unit 5212 are provided. Note that other effects of the fourth embodiment are similar to those of the third embodiment, and therefore description thereof will be omitted.

[0194] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than the description of the above embodiments, and further includes all modifications (variations) within the meaning and scope of the claims.

[0195] For example, in the above-described first to third embodiments, the expansion control calculation unit 109 (control unit) is configured to control the ultraviolet irradiation by the ultraviolet irradiation unit 212 (3212, 4212, 5212) and the local pressing of the wafer W1 by the squeegee unit 213 (3213, 4213) to be performed in parallel while moving the ultraviolet irradiation unit 212 (3212, 4212, 5212) and the squeegee unit 213 (3213, 4213) together using the common moving mechanisms 213c, 213d (4213b, 4213c, 4213e), but the present invention is not limited to this. In the present invention, the control unit may be configured to control the ultraviolet irradiation by the ultraviolet irradiation unit and the local pressing of the wafer by the squeegee unit to be performed sequentially while moving the ultraviolet irradiation unit and the squeegee unit together using the common moving mechanism. For example, the squeegee unit and the ultraviolet irradiation unit may be moved together by a common moving mechanism to apply local pressure to the wafer, and then the squeegee unit and the ultraviolet irradiation unit may be moved together by a common moving mechanism to irradiate ultraviolet rays onto the sheet member corresponding to the wafer by the ultraviolet irradiation unit.

[0196] In the above-described first to third embodiments, the expansion control calculation unit 109 (control unit) is configured to control the ultraviolet irradiation unit 212 (3212, 4212, 5212) to irradiate ultraviolet rays Ut in parallel in both cases where the squeegee unit 213 (3213, 4213) is moved in one direction to locally press the wafer W1 and where the squeegee unit 213 (3213, 4213) is moved in another direction perpendicular to one of the horizontal directions to locally press the wafer W1, but the present invention is not limited to this. In the present invention, the control unit may be configured to control the ultraviolet irradiation unit to irradiate ultraviolet rays in parallel in either case where the squeegee unit is moved in one direction to locally press the wafer, or where the squeegee unit is moved in another direction perpendicular to one of the horizontal directions to locally press the wafer. In this way, the control unit is configured to control the ultraviolet irradiation unit to irradiate ultraviolet rays in parallel when at least one of the following pressing operations is performed: when the squeegee unit is moved in one horizontal direction by the common moving mechanism to locally press the wafer, and when the squeegee unit is moved in another horizontal direction perpendicular to the one horizontal direction to locally press the wafer. This allows the ultraviolet irradiation unit to irradiate ultraviolet rays only when the squeegee unit is moved in one horizontal direction to locally press the wafer, or only when the squeegee unit is moved in the other horizontal direction to locally press the wafer, thereby performing ultraviolet irradiation once. Furthermore, by irradiating ultraviolet rays from the ultraviolet irradiation unit both when the squeegee unit is moved in one horizontal direction to locally press the wafer and when the squeegee unit is moved in the other horizontal direction to locally press the wafer, ultraviolet irradiation from the ultraviolet irradiation unit can be performed twice. This allows the number of times that the ultraviolet irradiation unit irradiates ultraviolet rays to be selected from one or two times, so that the ultraviolet irradiation unit can irradiate ultraviolet rays an appropriate number of times depending on the type of adhesive used in the sheet member, etc.

[0197] Furthermore, in the above first to fourth embodiments, for convenience of explanation, an example has been shown in which the control processing of the expansion control calculation unit 109 is explained using a flow-driven flowchart in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing of the expansion control calculation unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed by combining event-driven and flow-driven processing. [Explanation of symbols]

[0198] 2, 302, 402, 502 Expanding device 109 Expand control calculation unit (control unit) 208, 4208 Expanded section 212, 3212, 4212, 5212 UV irradiation unit 213, 3213, 4213 Squeegee part 213a Pressing part (plate-shaped pressing part) 213c, 4213c X-direction movement mechanism (common movement mechanism, first linear movement mechanism) 213d, 4213e Rotation mechanism (common movement mechanism) 281, 4281 Expanding ring 212a, 3212a UV light emitting part 4213b Y-direction movement mechanism (common movement mechanism, second linear movement mechanism) Ac rotation axis Ch semiconductor chip Ut ultraviolet light W1 wafer W2 sheet material W22 pressing surface W3 Ring-shaped member W31 top surface

Claims

1. an expanding section that divides the wafer into a plurality of semiconductor chips by expanding an elastic sheet member to which the wafer is attached; an ultraviolet irradiation unit that irradiates ultraviolet rays onto the sheet member expanded by the expanding unit at a position corresponding to the wafer; a squeegee unit that locally presses the wafer after the sheet member is expanded by the expanding unit to divide the wafer into the plurality of semiconductor chips; and a common moving mechanism capable of moving both the ultraviolet irradiation unit and the squeegee unit.

2. The moving mechanism includes: a first linear movement mechanism that moves both the ultraviolet irradiating unit and the squeegee unit in one of horizontal directions; The expanding device according to claim 1 , further comprising: a rotation mechanism that rotates at least the squeegee portion about a rotation axis that extends along the vertical direction.

3. the first linear movement mechanism is attached to the rotation mechanism, The expanding device described in claim 2, wherein the rotation mechanism is configured to rotate the first linear movement mechanism from a position where both the ultraviolet irradiation unit and the squeegee unit can be moved in the one direction to a position where they can be moved in another direction perpendicular to the one direction.

4. The expanding section includes an expanding ring that expands the sheet member, The expanding device according to claim 1 , wherein the ultraviolet irradiation unit, the squeegee unit, and the movement mechanism are arranged radially inside the expanding ring in a plan view.

5. The expanding device according to claim 1, further comprising a control unit configured to control the ultraviolet irradiation by the ultraviolet irradiation unit and the local pressing of the wafer by the squeegee unit to be carried out in parallel while moving both the ultraviolet irradiation unit and the squeegee unit using the common moving mechanism.

6. The control unit is configured to control the ultraviolet irradiation unit to perform ultraviolet irradiation in parallel when performing at least one of the following pressing operations: when the squeegee unit is moved in one horizontal direction by the moving mechanism to locally press the wafer; and when the squeegee unit is moved in another horizontal direction perpendicular to the one horizontal direction to locally press the wafer. The expanding device described in claim 5.

7. The expanding device according to claim 1 , wherein the ultraviolet irradiation unit is attached to the common moving mechanism separately from the squeegee unit.

8. The expanding device according to claim 1 , wherein the ultraviolet irradiation unit is integrally provided within the squeegee unit and attached to the common moving mechanism.

9. a second linear movement mechanism for moving the device in another direction perpendicular to the one direction in the horizontal direction; the first linear movement mechanism is attached to the second linear movement mechanism, and the rotation mechanism is attached to the first linear movement mechanism; the ultraviolet irradiation unit is attached to the first linear movement mechanism or the rotation mechanism, The expanding device according to claim 2 , wherein the squeegee unit is attached to the rotating mechanism.

10. The expanding section includes an expanding ring that expands the sheet member, The expanding device according to claim 1 , wherein the ultraviolet irradiation unit, the squeegee unit, and the movement mechanism are arranged outside the expanding ring.

11. The ultraviolet irradiation unit is configured to irradiate the sheet member in an expanded state from below, the ultraviolet irradiation unit includes an ultraviolet light emitting unit that emits ultraviolet light, The expansion device described in claim 7, wherein the ultraviolet light emitting unit is positioned at a position further downward and away from the pressing surface of the sheet member where local pressing of the squeegee unit is performed than the upper surface of a ring-shaped member attached to the sheet member in a state surrounding the wafer when the sheet member is expanded by the expanding unit.

12. a step of irradiating a wafer having a plurality of semiconductor chips with laser light from a laser irradiation unit that irradiates the laser light, thereby forming a modified layer in the wafer; dividing the wafer into the plurality of semiconductor chips by an expanding section that expands an elastic sheet member to which the wafer is attached; A method for manufacturing a semiconductor chip, comprising the steps of: moving an ultraviolet irradiation unit and a squeegee unit using a common moving mechanism to irradiate ultraviolet light onto the sheet member corresponding to the position of the wafer, and locally pressing the wafer.

Images