Wafer processing device, semiconductor chip manufacturing method, and semiconductor chip

Abstract

This semiconductor-wafer-processing apparatus 100 (wafer processing apparatus) comprises: a cassette unit 202 for accommodating a wafer W1; a lift-up hand unit 203 for removing the wafer W1 from the cassette unit 202; a dicing device 1 for dicing the wafer W1; and a wafer processing unit for performing a process different from dicing on the wafer W1. The lift-up hand unit 203 is disposed so as to be sandwiched between the dicing device 1 and the wafer processing unit.

Description

[Technical Field]

[0001] The present invention relates to a wafer processing apparatus, a semiconductor chip manufacturing method, and a semiconductor chip, and more particularly to a wafer processing apparatus having a dicing unit for dicing a wafer, a semiconductor chip manufacturing method, and a semiconductor chip. [Background technology]

[0002] BACKGROUND ART Conventionally, wafer processing apparatuses equipped with a dicing unit for dicing a wafer have been known. Such a wafer processing apparatus is disclosed, for example, in Japanese Patent Application Laid-Open No. 2007-173587.

[0003] The above-mentioned Japanese Patent Application Laid-Open No. 2007-173587 discloses a dicing device (wafer processing device) including a cassette for storing wafers, an elevator for loading and unloading wafers from the cassette, a laser dicing unit for dicing the wafers, an expanding unit for expanding the diced wafer sheet, and a transport means for transporting the wafers from the elevator to the laser dicing unit and from the laser dicing unit to the expanding unit. In this dicing device, the cassette storing the wafers, the laser dicing unit, and the expanding unit are arranged in this order, and wafers removed from the cassette are transported sequentially by the transport means to the laser dicing unit and the expanding unit for processing. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-173587 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the dicing device disclosed in JP 2007-173587 A, the cassette containing the wafer, the laser dicing unit, and the expanding unit are arranged in this order, and the wafer is removed from the cassette and transported sequentially to the laser dicing unit and the expanding unit by a transport means for processing. Therefore, even when only dicing or only expanding is performed on the wafer, the wafer must be removed from the cassette and transported sequentially to the dicing unit and the expanding unit. Therefore, since the wafer is transported to a processing unit that does not require processing, it is difficult to efficiently process the wafer. Therefore, there is a need for a wafer processing device that can efficiently process wafers even when only some of the multiple processing operations are being performed.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a wafer processing apparatus, a semiconductor chip manufacturing method, and a semiconductor chip that are capable of efficiently processing wafers even when performing only a portion of multiple processing steps. [Means for solving the problem]

[0007] A wafer processing apparatus according to a first aspect of the present invention includes a cassette unit that stores wafers, a wafer loading / unloading unit that loads and unloads wafers from the cassette unit, a dicing unit that dices the wafers, and a wafer processing unit that performs processing other than dicing on the wafers. a single wafer transfer section that receives the wafer from the wafer loading / unloading section and transfers the wafer to the dicing section or wafer processing section; The wafer loading / unloading section is disposed between the dicing section and the wafer processing section. The wafer transfer position of the dicing section, the wafer transfer position of the wafer processing section, and the wafer transfer position from the wafer loading / unloading section to the wafer transport section are arranged in a straight line, and the wafer transport section is configured to be movable in a straight line along the direction in which the wafer loading / unloading section, dicing section, and wafer processing section are arranged. .

[0008] In the wafer processing apparatus according to the first aspect of the present invention, as described above, the wafer loading / unloading section is positioned between the dicing section and the wafer processing section. This allows wafers to be directly supplied from the cassette section to one of the dicing section and the wafer processing section without passing through the other of the dicing section and the wafer processing section, allowing independent processing when performing only one of the processing steps. As a result, wafer processing can be performed efficiently even when only one of multiple processing steps is being performed. Furthermore, when processing by the dicing section and the wafer processing section is performed consecutively, multiple processing steps can be performed by moving the wafer between the dicing section and the wafer processing section. A wafer processing apparatus according to a second aspect of the present invention comprises a cassette unit that stores wafers, a wafer loading / unloading unit that loads and unloads wafers from the cassette unit, a dicing unit that dices the wafers, and a wafer processing unit that performs processing on the wafers other than dicing, wherein the wafer loading / unloading unit is arranged so as to be sandwiched between the dicing unit and the wafer processing unit, and the wafer processing unit includes an expanding unit that stretches a sheet member on which the wafer is placed to divide the wafer, and the wafer cooling unit and wafer heating unit of the expanding unit as the wafer processing unit are arranged side by side along a direction perpendicular to the direction in which the wafer loading / unloading unit, dicing unit, and wafer processing unit are arranged, the cassette unit is arranged on one side of the wafer loading / unloading unit in the front-to-rear direction, and the wafer loading / unloading unit is arranged on the other side of the cassette unit in the front-to-rear direction, the wafer cooling unit of the expanding unit is arranged to the side of the wafer loading / unloading unit, and the wafer heating unit of the expanding unit is arranged on one side of the wafer cooling unit in the front-to-rear direction, and the apparatus further comprises a squeegee unit that breaks the divided wafers, and the squeegee unit is arranged between the wafer cooling unit and the wafer heating unit in the front-to-rear direction. A wafer processing apparatus according to a third aspect of the present invention comprises a cassette unit that stores wafers, a wafer loading / unloading unit that loads and unloads wafers from the cassette unit, a dicing unit that dices the wafers, and a wafer processing unit that performs processing on the wafers other than dicing, the wafer loading / unloading unit being disposed between the dicing unit and the wafer processing unit, the wafer processing unit including an expanding unit that stretches a sheet member on which the wafers are placed to divide the wafers, and a wafer loading / unloading unit that stretches and unfolds the sheet member along a direction perpendicular to the direction in which the wafer loading / unloading unit, the dicing unit, and the wafer processing unit are arranged. The wafer cooling section and wafer heating section of the expanding section as a wafer processing section are arranged side by side, the cassette section is arranged on one side of the wafer loading / unloading section in the front-to-back direction, the wafer loading / unloading section is arranged on the other side of the cassette section in the front-to-back direction, the wafer cooling section of the expanding section is arranged on the side of the wafer loading / unloading section, the wafer heating section of the expanding section is arranged on one side of the wafer cooling section in the front-to-back direction, and an ultraviolet irradiation section is further provided which irradiates ultraviolet rays onto the sheet member to which the wafer is attached, and the ultraviolet irradiation section is arranged in a position overlapping with the wafer heating section in the front-to-back direction.

[0009] In the wafer processing apparatus according to the first aspect, ,cormorant The wafer transfer section further includes a wafer transfer section that receives the wafer from the wafer loading / unloading section and transfers the wafer to the dicing section or the wafer processing section. This The wafer transfer section allows wafers to be easily transferred between the wafer loading / unloading section and the dicing section and wafer processing section.

[0010] In the wafer processing apparatus according to the first aspect, The wafer transfer position in the dicing section, the wafer transfer position in the wafer processing section, and the wafer transfer position from the wafer loading / unloading section to the wafer transport section are arranged in a straight line, and the wafer transport section is configured to be able to move linearly along the direction in which the wafer loading / unloading section, dicing section, and wafer processing section are arranged. This Since the wafer can be transported between the wafer transfer position in the dicing section, the wafer transfer position in the wafer processing section, and the wafer transfer position from the wafer loading / unloading section to the wafer transport section using a linear transport shaft, the wafer transport configuration can be prevented from becoming complicated. Also, the wafer can be easily transported directly between the dicing section and the wafer processing section by the wafer transport section.

[0011] In the wafer processing apparatus according to the first aspect,Preferably, the wafer transport unit is configured to transport a wafer ring structure including a stretchable sheet member to which a wafer is attached and a ring-shaped member attached to the sheet member while surrounding the wafer, between the wafer loading / unloading unit, the dicing unit, and the wafer processing unit. With this configuration, by making the shape of the ring-shaped member common even for wafers of different sizes, wafers of different sizes can be easily transported between the dicing unit and the wafer processing unit by the wafer transport unit.

[0012] In the wafer processing apparatus according to the first aspect, the wafer processing unit preferably includes an expanding unit that stretches the sheet member on which the wafer is placed to divide the wafer, or a grinding unit that grinds the wafer. With this configuration, the wafer can be subjected to dicing and expanding processing, or grinding and dicing processing, either individually or consecutively.

[0013] In the wafer processing apparatus according to the first aspect, the cassette unit and the wafer loading / unloading unit are preferably arranged side by side in a direction perpendicular to the direction in which the wafer loading / unloading unit, the dicing unit, and the wafer processing unit are arranged. With this configuration, it is possible to prevent the cassette unit from interfering with the wafer being moved when the wafer is moved to the dicing unit and the wafer processing unit.

[0014] In a configuration in which the wafer processing unit includes an expanding unit or a gliding unit, the wafer cooling unit and wafer heating unit of the expanding unit serving as the wafer processing unit are preferably arranged side by side in a direction perpendicular to the direction in which the wafer loading / unloading unit, dicing unit, and wafer processing unit are arranged. With this configuration, it is possible to prevent the members of the wafer heating unit from interfering with the moving wafer when the wafer is moved to the dicing unit and wafer processing unit.

[0015] In this case, the expanding section preferably includes a wafer moving section that holds the wafer and moves the wafer between the wafer cooling section and the wafer heating section. With this configuration, the wafer transported to the expanding section can be easily moved independently between the wafer cooling section and the wafer heating section within the expanding section by the wafer moving section.

[0016] In the configuration in which the wafer cooling section and wafer heating section of the expanding section are arranged side by side along a direction perpendicular to the direction in which the wafer loading / unloading section, dicing section, and wafer processing section are arranged, preferably, the cassette section is arranged on one side of the wafer loading / unloading section in the front-to-rear direction, the wafer loading / unloading section is arranged on the other side of the cassette section in the front-to-rear direction, the wafer cooling section of the expanding section is arranged to the side of the wafer loading / unloading section, and the wafer heating section of the expanding section is arranged on one side of the wafer cooling section in the front-to-rear direction. With this configuration, the cassette section, wafer loading / unloading section, and the wafer cooling section and wafer heating section of the expanding section can be arranged compactly along the wafer movement path.

[0017] In a configuration in which the cassette unit is disposed on one side of the wafer loading / unloading unit in the front-rear direction, the wafer loading / unloading unit is disposed on the other side of the cassette unit in the front-rear direction, the wafer cooling unit of the expander unit is disposed to the side of the wafer loading / unloading unit, and the wafer heating unit of the expander unit is disposed on one side of the wafer cooling unit in the front-rear direction, preferably, the cassette unit, wafer loading / unloading unit, wafer cooling unit and wafer heating unit of the expander unit are disposed in a rectangular shape. With this configuration, the area of ​​the maintenance space provided around the apparatus can be reduced compared to when the cassette unit, wafer loading / unloading unit, and wafer cooling unit and wafer heating unit of the expander unit are disposed linearly along a predetermined direction, thereby preventing the area required for installing the wafer processing apparatus from becoming larger.

[0018] In a configuration in which the cassette unit is disposed on one side of the wafer loading / unloading unit in the front-to-rear direction, the wafer loading / unloading unit is disposed on the other side of the cassette unit in the front-to-rear direction, the wafer cooling unit of the expanding unit is disposed to the side of the wafer loading / unloading unit, and the wafer heating unit of the expanding unit is disposed on one side of the wafer cooling unit in the front-to-rear direction, the apparatus preferably further comprises a squeegee unit that breaks the divided wafers, the squeegee unit being disposed in a position that overlaps with the wafer heating unit in the front-to-rear direction. With this configuration, the size of the expanding unit in the front-to-rear direction can be made smaller than when the squeegee unit is disposed in a position that does not overlap with the wafer heating unit.

[0019] In a configuration in which the cassette unit is disposed on one side of the wafer loading / unloading unit in the front-rear direction, the wafer loading / unloading unit is disposed on the other side of the cassette unit in the front-rear direction, the wafer cooling unit of the expanding unit is disposed beside the wafer loading / unloading unit, and the wafer heating unit of the expanding unit is disposed on one side of the wafer cooling unit in the front-rear direction, preferably the apparatus further comprises a squeegee unit for breaking the divided wafers, the squeegee unit being disposed between the wafer cooling unit and the wafer heating unit in the front-rear direction. With this configuration, after the wafers are cooled in the wafer cooling unit, they can be moved sequentially to the squeegee unit and the wafer heating unit, whereby breaking and heating processes can be performed sequentially.

[0020] In the configuration in which the cassette unit is disposed on one side of the wafer loading / unloading unit in the front-to-rear direction, the wafer loading / unloading unit is disposed on the other side of the cassette unit in the front-to-rear direction, the wafer cooling unit of the expanding unit is disposed to the side of the wafer loading / unloading unit, and the wafer heating unit of the expanding unit is disposed on one side of the wafer cooling unit in the front-to-rear direction, preferably the device further comprises an ultraviolet irradiation unit that irradiates ultraviolet rays onto the sheet member to which the wafer is attached, the ultraviolet irradiation unit being disposed in a position overlapping the wafer heating unit in the front-to-rear direction. With this configuration, the size of the expanding unit in the front-to-rear direction can be made smaller than when the ultraviolet irradiation unit is disposed in a position not overlapping the wafer heating unit.

[0021] The first aspect of this invention 4 The method for manufacturing a semiconductor chip according to this aspect includes a step of loading and unloading a wafer from a cassette unit that stores the wafer by a wafer loading and unloading unit, a step of dicing the wafer by a dicing unit to divide the wafer into a plurality of semiconductor chips, and a step of performing processing on the wafer other than dicing by a wafer processing unit. receiving the wafer from the wafer loading / unloading section and transporting the wafer to the dicing section or wafer processing section by a single wafer transport section; The wafer loading / unloading section is disposed between the dicing section and the wafer processing section. The wafer transfer position of the dicing unit, the wafer transfer position of the wafer processing unit, and the wafer transfer position from the wafer loading / unloading unit to the wafer transport unit are arranged in a straight line, and the wafer transport unit is configured to be movable in a straight line along the direction in which the wafer loading / unloading unit, dicing unit, and wafer processing unit are arranged. .

[0022] The first aspect of this invention 4 In the semiconductor chip manufacturing method according to the aspect above, as described above, the wafer loading / unloading section is arranged to be sandwiched between the dicing section and the wafer processing section. This allows wafers to be directly supplied from the cassette section to one of the dicing section and the wafer processing section without passing through the other of the dicing section and the wafer processing section, so that when performing some processing, the processing can be performed independently. As a result, a semiconductor chip manufacturing method can be provided that allows wafer processing to be performed efficiently even when performing only some of multiple processing. Furthermore, when processing by the dicing section and the wafer processing section is performed consecutively, multiple processing can be performed by moving the wafer between the dicing section and the wafer processing section.

[0023] The first aspect of this invention 5 The semiconductor chip according to the aspect of the present invention includes a cassette unit that accommodates wafers, a wafer loading / unloading unit that loads / unloads wafers from the cassette unit, a dicing unit that dices the wafers, and a wafer processing unit that performs processing other than dicing on the wafers. a single wafer transfer unit that receives the wafer from the wafer loading / unloading unit and transfers the wafer to the dicing unit or the wafer processing unit; The wafer loading / unloading section is disposed between the dicing section and the wafer processing section. The wafer transfer position of the dicing section, the wafer transfer position of the wafer processing section, and the wafer transfer position from the wafer loading / unloading section to the wafer transport section are arranged in a straight line, and the wafer transport section is configured to be movable in a straight line along the direction in which the wafer loading / unloading section, dicing section, and wafer processing section are arranged. Manufactured using wafer processing equipment.

[0024] The first aspect of this invention 5In the semiconductor chip according to the aspect above, as described above, the wafer loading / unloading section is arranged to be sandwiched between the dicing section and the wafer processing section. This allows wafers to be directly supplied from the cassette section to one of the dicing section and the wafer processing section without passing through the other of the dicing section and the wafer processing section, so that when performing some processing, the processing can be performed independently. As a result, a semiconductor chip can be provided that allows wafer processing to be performed efficiently even when performing only some of multiple processing. Furthermore, when processing by the dicing section and the wafer processing section is performed consecutively, multiple processing can be performed by moving the wafer between the dicing section and the wafer processing section. [Effects of the Invention]

[0025] According to the present invention, as described above, even when only a part of a plurality of processing steps is performed, the processing steps of the wafer can be performed efficiently. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a plan view showing a semiconductor wafer processing device provided with a dicing device and an expanding device according to a first embodiment. [Figure 2] 1 is a plan view showing a wafer ring structure processed in the semiconductor wafer processing apparatus according to the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 2 is a plan view of a dicing device disposed adjacent to the expanding device according to the first embodiment. [Figure 5] 10 is a side view of the dicing device arranged adjacent to the expanding device according to the first embodiment, as viewed from the Y2 direction side. FIG. [Figure 6] FIG. 1 is a plan view of an expanding device according to a first embodiment. [Figure 7] FIG. 2 is a side view of the expanding device according to the first embodiment as viewed from the Y2 direction side. [Figure 8] FIG. 2 is a side view of the expanding device according to the first embodiment as viewed from the X1 direction side. [Figure 9] 1 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a first embodiment. [Figure 10] 4 is a flowchart of the first half of a semiconductor chip manufacturing process by the semiconductor wafer processing apparatus according to the first embodiment. [Figure 11] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [Figure 12] FIG. 2 is a side view showing a state in which a clamp unit is placed at a raised position in the expanding device according to the first embodiment. [Figure 13] FIG. 2 is a side view showing a state in which a clamping section is placed in a lowered position in the expanding device according to the first embodiment. [Figure 14] FIG. 2 is a side view showing a state in which an ultraviolet irradiating unit irradiates ultraviolet rays in the expanding device according to the first embodiment. [Figure 15] FIG. 10 is a plan view showing a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment. [Figure 16] 10 is a side view of a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment, as viewed from the Y2 direction. FIG. [Figure 17] 10 is a side view of a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment, as viewed from the X1 direction. FIG. [Figure 18] FIG. 10 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a second embodiment. [Figure 19] 10 is a flowchart of the first half of a semiconductor chip manufacturing process by the semiconductor wafer processing apparatus according to the second embodiment. [Figure 20] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. [Figure 21]FIG. 10 is a plan view showing a semiconductor wafer processing device provided with a dicing device and a grinding device according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0027] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0028] [First embodiment] The configuration of a semiconductor wafer processing apparatus 100 according to a first embodiment of the present invention will be described with reference to Figures 1 to 14. The semiconductor wafer processing apparatus 100 is an example of the "wafer processing apparatus" in the claims.

[0029] (Semiconductor wafer processing equipment) 1, the semiconductor wafer processing apparatus 100 is an apparatus for processing a wafer W1 provided in a wafer ring structure W. The semiconductor wafer processing apparatus 100 is configured to form a modified layer on the wafer W1 and to divide the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see FIG. 8).

[0030] 2 and 3, the wafer ring structure W will be described. The wafer ring structure W includes a wafer W1, a sheet member W2, and a ring-shaped member W3.

[0031] The wafer W1 is a thin, circular plate made of crystals of a semiconductor material that is used to make semiconductor integrated circuits. A modified layer is formed inside the wafer W1 along the dividing line by processing the wafer in the semiconductor wafer processing apparatus 100. That is, the wafer W1 is processed so that it can be divided along the dividing line. The sheet member W2 is a stretchable adhesive tape. An adhesive layer is provided on the upper surface W21 of the sheet member W2. The wafer W1 is attached to the adhesive layer of the sheet member W2. The ring-shaped member W3 is a metal frame that is ring-shaped in a plan view. The ring-shaped member W3 is attached to the adhesive layer of the sheet member W2 while surrounding the wafer W1.

[0032] The semiconductor wafer processing apparatus 100 is equipped with a dicing apparatus 1 and an expanding apparatus 2. Hereinafter, the vertical direction is referred to as the Z direction, the upward direction as the Z1 direction, and the downward direction as the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 2 are aligned is referred to as the X direction, the X direction toward the expanding apparatus 2 in the X direction is referred to as the X1 direction, and the X direction toward the dicing apparatus 1 in the X direction is referred to as the X2 direction. The horizontal direction perpendicular to the X direction is referred to as the Y direction, one side of the Y direction is referred to as the Y1 direction, and the other side of the Y direction is referred to as the Y2 direction.

[0033] (dicing equipment) As shown in Figures 1, 4, and 5, the dicing device 1 is configured to form a modified layer by irradiating a laser having a wavelength that is transparent to the wafer W1 along the parting lines (streets). The modified layer refers to cracks, voids, etc. formed inside the wafer W1 by the laser. The dicing device 1 is an example of a "dicing unit" in the claims.

[0034] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0035] The base 11 is a base on which the chuck table 12 is placed. The base 11 has a rectangular shape in a plan view.

[0036] <Chuck table section> The chuck table 12 includes a suction unit 12a, a clamp unit 12b, a rotation mechanism 12c, and a table movement mechanism 12d. The suction unit 12a is configured to suction the wafer ring structure W onto its upper surface on the Z1 side. The suction unit 12a is a table provided with suction holes and suction lines for suctioning the lower surface of the ring-shaped member W3 of the wafer ring structure W on the Z2 side. The suction unit 12a is supported by the table movement mechanism 12d via the rotation mechanism 12c. The clamp unit 12b is provided at the upper end of the suction unit 12a. The clamp unit 12b is configured to hold the wafer ring structure W held by the suction unit 12a. The clamp unit 12b holds the ring-shaped member W3 of the wafer ring structure W held by the suction unit 12a from the Z1 side. In this manner, the wafer ring structure W is gripped by the suction unit 12a and the clamp unit 12b.

[0037] The rotation mechanism 12c is configured to rotate the suction unit 12a in the circumferential direction around a rotation center axis C extending parallel to the Z direction. The rotation mechanism 12c is attached to the upper end of the table movement mechanism 12d. The table movement mechanism 12d is configured to move the wafer ring structure W in the X direction and the Y direction. The table movement mechanism 12d has an X-direction movement mechanism 121 and a Y-direction movement mechanism 122. The X-direction movement mechanism 121 is configured to move the rotation mechanism 12c in the X1 direction or the X2 direction. The X-direction movement mechanism 121 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Y-direction movement mechanism 122 is configured to move the rotation mechanism 12c in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 122 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0038] <Laser section> The laser unit 13 is configured to irradiate a wafer W1 of the wafer ring structure W held by the chuck table 12 with laser light. The laser unit 13 is disposed on the Z1 side of the chuck table 12. The laser unit 13 includes a laser irradiation unit 13a, a mounting member 13b, and a Z-direction movement mechanism 13c. The laser irradiation unit 13a is configured to irradiate a pulsed laser light. The mounting member 13b is a frame to which the laser unit 13 and the imaging unit 14 are attached. The Z-direction movement mechanism 13c is configured to move the laser unit 13 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 13c includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. Note that the laser irradiation unit 13a may be a laser irradiation unit that oscillates a continuous-wave laser light as the laser light, other than a pulsed laser light, as long as it can form a modified layer through multiphoton absorption.

[0039] <Imaging unit> The imaging unit 14 is configured to capture an image of the wafer W1 of the wafer ring structure W held by the chuck table 12. The imaging unit 14 is disposed on the Z1 direction side of the chuck table 12. The imaging unit 14 has a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0040] The high-resolution camera 14a and the wide-angle camera 14b are near-infrared imaging cameras. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation unit 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation unit 13a. In this way, the high-resolution camera 14a, the laser irradiation unit 13a, and the wide-angle camera 14b are arranged adjacent to each other in this order from the X1 direction side to the X2 direction side.

[0041] The Z-direction movement mechanism 14c is configured to move the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 14d is configured to move the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14d has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0042] (Expanding device) As shown in FIGS. 1, 6, and 7, the expanding device 2 is configured to divide the wafer W1 to form a plurality of semiconductor chips Ch (see FIG. 8). The expanding device 2 is also configured to form sufficient gaps between the plurality of semiconductor chips Ch. Here, a modified layer is formed on the wafer W1 by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets) in the dicing device 1. In the expanding device 2, the wafer W1 is divided along the modified layer that was previously formed in the dicing device 1, thereby forming a plurality of semiconductor chips Ch.

[0043] Therefore, in the expanding device 2, the wafer W1 is divided along the modified layer by expanding the sheet member W2. In addition, in the expanding device 2, the sheet member W2 is expanded, and thus the gaps between the plurality of semiconductor chips Ch formed by division are widened.

[0044] The expanding device 2 includes an expanding main body section 200, a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expanding section 208, a base 209, an expansion maintaining member 210, a heat shrink section 211, an ultraviolet irradiation section 212, a squeegee section 213, and a clamp section 214. The expanding main body section 200 performs a process of dividing the wafer W1 by stretching the sheet member W2 on which the wafer W1 is placed. The expanding main body section 200 is an example of the "wafer processing section" and "expanding section" in the claims.

[0045] <base> The base 201 is a base on which the cassette unit 202 and the lift-up hand unit 203 are installed. The base 201 has a rectangular shape in a plan view.

[0046] <Cassette section> The cassette unit 202 accommodates a wafer W1 (wafer ring structure W). The cassette unit 202 is configured to be able to accommodate a plurality of wafer ring structures W. The cassette unit 202 includes a wafer cassette 202a, a Z-direction movement mechanism 202b, and a pair of mounting units 202c.

[0047] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. Each wafer cassette 202a has a storage space capable of storing a plurality of (five) wafer ring structures W. The wafer ring structures W are manually supplied and placed in the wafer cassette 202a. The wafer cassette 202a may store one to four wafer ring structures W, or may store six or more wafer ring structures W. One, two, or four or more wafer cassettes 202a may be arranged in the Z direction.

[0048] The Z-direction movement mechanism 202b is configured to move the wafer cassette 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 202b also has a mounting table 202d that supports the wafer cassette 202a from below. Multiple mounting tables 202d (three in total) are arranged to match the positions of the multiple wafer cassettes 202a.

[0049] A plurality (five) of pairs of mounting portions 202c are arranged inside the wafer cassette 202a. The ring-shaped member W3 of the wafer ring structure W is placed on the pair of mounting portions 202c from the Z1 direction side. One of the pair of mounting portions 202c protrudes in the X2 direction from the inner surface of the wafer cassette 202a on the X1 direction side. The other of the pair of mounting portions 202c protrudes in the X1 direction from the inner surface of the wafer cassette 202a on the X2 direction side.

[0050] <Lift-up hand part> The lift-up hand section 203 loads and unloads the wafer W1 (wafer ring structure W) from the cassette section 202. The lift-up hand section 203 is configured to be able to remove the wafer ring structure W from the cassette section 202. The lift-up hand section 203 is also configured to be able to store the wafer ring structure W in the cassette section 202. The lift-up hand section 203 is an example of a "wafer loading / unloading section" in the claims.

[0051] Specifically, the lift-up hand unit 203 includes a Y-direction movement mechanism 203a and a lift-up hand 203b. The Y-direction movement mechanism 203a has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The lift-up hand 203b is configured to support the ring-shaped member W3 of the wafer ring structure W from the Z2 direction side.

[0052] <Suction hand section> The suction hand section 204 is configured to suck the ring-shaped member W3 of the wafer ring structure W from the Z1 direction side. The suction hand section 204 is an example of the "wafer transfer section" in the claims.

[0053] The suction hand unit 204 receives the wafer W1 (wafer ring structure W) from the lift-up hand unit 203 and transports the wafer W1 to the expander main body unit 200. Specifically, the suction hand unit 204 includes an X-direction movement mechanism 204a, a Z-direction movement mechanism 204b, and a suction hand 204c. The X-direction movement mechanism 204a is configured to move the suction hand 204c in the X direction. The Z-direction movement mechanism 204b is configured to move the suction hand 204c in the Z direction. The X-direction movement mechanism 204a and the Z-direction movement mechanism 204b each include a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The suction hand 204c is configured to suck and support the ring-shaped member W3 of the wafer ring structure W from the Z1 direction. Here, the suction hand 204c generates negative pressure to support the ring-shaped member W3 of the wafer ring structure W.

[0054] <base> 7 and 8, the base 205 is a base on which the expander main body 200, the expander 208, the cooling unit 207, the ultraviolet irradiation unit 212, and the squeegee unit 213 are mounted. The base 205 has a rectangular shape in a plan view. In FIG. 8, the clamp unit 214, which is positioned in the Z1 direction of the cooling unit 207, is indicated by a dotted line.

[0055] <Cold air supply section> The cool air supplying section 206 is configured to supply cool air to the sheet member W2 from the Z1 direction side when the expanding section 208 expands the sheet member W2.

[0056] Specifically, the cold air supply unit 206 has a supply unit main body 206a, a cold air supply port 206b, and a movement mechanism 206c. The cold air supply port 206b is configured to allow cold air supplied from the cold air supply device to flow out. The cold air supply port 206b is provided at the end of the supply unit main body 206a on the Z2 direction side. The cold air supply port 206b is located in the center of the end of the supply unit main body 206a on the Z2 direction side. The movement mechanism 206c has, for example, a linear conveyor module or a motor with a ball screw and an encoder.

[0057] The cold air supply device is a device for generating cold air. The cold air supply device supplies air cooled by, for example, a heat pump. Such a cold air supply device is installed on base 205. Cold air supply unit 206 and the cold air supply device are connected by a hose (not shown).

[0058] <Cooling unit> The cooling unit 207 is configured to cool the sheet member W2 from the Z2 direction side. The cooling unit 207 is an example of the "wafer cooling section" in the claims.

[0059] The cooling unit 207 is provided at a wafer cooling position P4 of the expander main body portion 200. The wafer cooling position P4 is located on the Y2 side of the expander main body portion 200. The cooling unit 207 includes a cooling member 207a having a cooling body 271 and a Peltier element 272, and a Z-direction movement mechanism 207b. The cooling body 271 is made of a material having a large heat capacity and high thermal conductivity. The cooling body 271 is made of a metal such as aluminum. The Peltier element 272 is configured to cool the cooling body 271. Note that the cooling body 271 is not limited to aluminum and may be made of another material having a large heat capacity and high thermal conductivity. The Z-direction movement mechanism 207b is a cylinder.

[0060] The cooling unit 207 is configured to be movable in the Z1 direction or the Z2 direction by a Z-direction movement mechanism 207b, which allows the cooling unit 207 to move to a position where it contacts the sheet member W2 and a position away from the sheet member W2.

[0061] <Expanding section> The expanding section 208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing lines.

[0062] The expanding section 208 is provided at a wafer heating position P5 of the expanding main body section 200. The wafer heating position P5 is located on the Y1 direction side of the expanding main body section 200. The expanding section 208 has an expanding ring 281. The expanding ring 281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expanding ring 281 has a ring shape in a plan view. The structure of the expanding ring 281 will be described in detail later.

[0063] <base> The base 209 is a base material on which the cold air supply unit 206, the expansion and retention member 210 and the heat shrink unit 211 are mounted.

[0064] <Expansion maintenance member> As shown in FIGS. 7 and 8, the expansion maintaining member 210 is configured to press the sheet member W2 from the Z1 direction side so that the sheet member W2 near the wafer W1 does not shrink due to heating by the heating ring 211a.

[0065] Specifically, the expansion-retaining member 210 includes a pressure ring portion 210a, a lid portion 210b, and an intake portion 210c. The pressure ring portion 210a has a ring shape in a plan view. The lid portion 210b is attached to the pressure ring portion 210a so as to close the opening of the pressure ring portion 210a. The intake portion 210c is an intake ring having a ring shape in a plan view. Multiple intake ports are formed on the underside of the intake portion 210c on the Z2 direction side. The pressure ring portion 210a is configured to move in the Z direction by a Z-direction movement mechanism 210d. That is, the Z-direction movement mechanism 210d is configured to move the pressure ring portion 210a to a position where it presses the sheet member W2 and to a position away from the sheet member W2. The Z-direction movement mechanism 210d includes, for example, a linear conveyor module or a drive unit including a ball screw and a motor with an encoder.

[0066] <Heat shrink section> The heat shrink unit 211 is configured to heat and shrink the sheet member W2 expanded by the expanding unit 208 while maintaining the gaps between the semiconductor chips Ch. The heat shrink unit 211 is an example of a "wafer heating unit" in the claims.

[0067] The heat shrink unit 211 is provided at the wafer heating position P5 of the expander main body 200. The heat shrink unit 211 has a heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in a plan view. The heating ring 211a also has a sheathed heater that heats the sheet member W2. The Z-direction movement mechanism 211b is configured to move the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0068] <Ultraviolet irradiation section> The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays Ut in order to reduce the adhesive strength of the adhesive layer of the sheet member W2. Specifically, the ultraviolet irradiating unit 212 has an ultraviolet illuminator. The ultraviolet irradiating unit 212 is disposed at the end of the squeegee unit 213 on the Z1 direction side of a pressing unit 213a (described later). The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays Ut while moving together with the squeegee unit 213.

[0069] <Squeegee Section> The squeegee unit 213 is configured to expand the sheet member W2 and then locally press the wafer W1 from the Z2 direction side to further divide the wafer W1 along the modified layer. In other words, the squeegee unit 213 breaks the divided wafer W1. Specifically, the squeegee unit 213 has a pressing unit 213a, a Z-direction movement mechanism 213b, an X-direction movement mechanism 213c, and a rotation mechanism 213d.

[0070] The pressing unit 213a is configured to press the wafer W1 from the Z2 direction side via the sheet member W2 and move using the rotation mechanism 213d and the X-direction movement mechanism 213c, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. The pressing unit 213a presses the wafer W1 by contacting the wafer W1 via the sheet member W2 when raised to an elevated position on the Z1 direction side by the Z-direction movement mechanism 213b. The pressing unit 213a is lowered to a lower position on the Z2 direction side by the Z-direction movement mechanism 213b, thereby releasing the pressing unit 213a from contact with the wafer W1 and no longer pressing the wafer W1. The pressing unit 213a is a squeegee.

[0071] The pressing unit 213a is attached to the Z1-direction end of the Z-direction movement mechanism 213b. The Z-direction movement mechanism 213b is configured to move the pressing unit 213a linearly in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 213b is, for example, a cylinder. The Z-direction movement mechanism 213b is attached to the Z1-direction end of the X-direction movement mechanism 213c.

[0072] The X-direction movement mechanism 213c is attached to the end of the rotation mechanism 213d on the Z1 direction side. The X-direction movement mechanism 213c is configured to move the pressing unit 213a linearly in one direction. The X-direction movement mechanism 213c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0073] In the squeegee unit 213, the pressing unit 213a is raised to a raised position by the Z-direction movement mechanism 213b. In the squeegee unit 213, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction movement mechanism 213c moves the pressing unit 213a in the Y direction, thereby dividing the wafer W1. In the squeegee unit 213, the Z-direction movement mechanism 213b lowers the pressing unit 213a to a lowered position. In the squeegee unit 213, after the movement of the pressing unit 213a in the Y direction has finished, the rotation mechanism 213d rotates the pressing unit 213a by 90 degrees.

[0074] In the squeegee unit 213, the pressing unit 213a is raised to an elevated position by the Z-direction movement mechanism 213b. In the squeegee unit 213, after the pressing unit 213a rotates 90 degrees, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the pressing unit 213a is moved in the X direction by the X-direction movement mechanism 213c, thereby dividing the wafer W1.

[0075] <Clamp section> The clamp unit 214 is provided in the expander main body 200. The clamp unit 214 is configured to grip the ring-shaped member W3 of the wafer ring structure W. Specifically, the clamp unit 214 has a gripping unit 214a, a Z-direction movement mechanism 214b, and a Y-direction movement mechanism 214c. The gripping unit 214a supports the ring-shaped member W3 from the Z2 direction side and presses the ring-shaped member W3 from the Z1 direction side. In this manner, the ring-shaped member W3 is gripped by the gripping unit 214a. The gripping unit 214a is attached to the Z-direction movement mechanism 214b. The clamp unit 214 holds the wafer W1 and moves the wafer W1 between the cooling unit 207 at the wafer cooling position P4 and the heat shrink unit 211 at the wafer heating position P5. The clamp unit 214 is an example of a "wafer moving unit" in the claims.

[0076] The Z-direction movement mechanism 214b is configured to move the clamp unit 214 in the Z direction. Specifically, the Z-direction movement mechanism 214b is configured to move the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 214b is attached to the Y-direction movement mechanism 214c. The Y-direction movement mechanism 214c is configured to move the Z-direction movement mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 214c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0077] (Control configuration of semiconductor wafer processing equipment) As shown in FIG. 9, the semiconductor wafer processing apparatus 100 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 104, a fifth control unit 105, a sixth control unit 106, a seventh control unit 107, an eighth control unit 108, an expansion control calculation unit 109, a handling control calculation unit 110, a dicing control calculation unit 111, and a memory unit 112.

[0078] The first control unit 101 is configured to control the squeegee unit 213. The first control unit 101 includes a central processing unit (CPU) and a storage unit having a read-only memory (ROM) and a random access memory (RAM). The first control unit 101 may include a hard disk drive (HDD) as the storage unit, in which stored information is retained even after the voltage is cut off. The HDD may be shared by the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108.

[0079] The second control unit 102 is configured to control the cool air supply unit 206 and the cooling unit 207. The second control unit 102 includes a CPU and a storage unit having a ROM, RAM, etc. The third control unit 103 is configured to control the heat shrink unit 211 and the ultraviolet ray irradiation unit 212. The third control unit 103 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the second control unit 102 and the third control unit 103 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0080] The fourth control unit 104 is configured to control the cassette unit 202 and the lift-up hand unit 203. The fourth control unit 104 includes a CPU and a storage unit having a ROM, RAM, etc. The fifth control unit 105 is configured to control the suction hand unit 204. The fifth control unit 105 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the fourth control unit 104 and the fifth control unit 105 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0081] The sixth control unit 106 is configured to control the chuck table unit 12. The sixth control unit 106 includes a CPU and a storage unit having a ROM, RAM, etc. The seventh control unit 107 is configured to control the laser unit 13. The seventh control unit 107 includes a CPU and a storage unit having a ROM, RAM, etc. The eighth control unit 108 is configured to control the imaging unit 14. The eighth control unit 108 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108 may each include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0082] The expansion control calculation unit 109 is configured to perform calculations related to the expansion process of the sheet member W2 based on the processing results of the first control unit 101, the second control unit 102, and the third control unit 103. The expansion control calculation unit 109 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0083] The handling control calculation unit 110 is configured to perform calculations related to the movement process of the wafer ring structure W based on the processing results of the fourth control unit 104 and the fifth control unit 105. The handling control calculation unit 110 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0084] The dicing control calculation unit 111 is configured to perform calculations related to the dicing process of the wafer W1 based on the processing results of the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108. The dicing control calculation unit 111 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0085] The storage unit 112 stores programs for operating the dicing device 1 and the expanding device 2. The storage unit 19 includes a ROM, a RAM, an HDD, and the like.

[0086] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 100 will be described below with reference to FIGS.

[0087] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W accommodated in the cassette unit 202 is supported by the lift-up hand 203b, the Y-direction movement mechanism 31 moves the lift-up hand 203b in the Y1 direction, thereby removing the wafer ring structure W from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the dicing apparatus 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction movement mechanism 204a while being sucked by the suction hand 204c. Then, the wafer ring structure W moved in the X2 direction is transferred from the suction hand 204c to the chuck table unit 12, and then gripped by the chuck table unit 12.

[0088] In step S3, a modified layer is formed on the wafer W1 by the laser unit 13. In step S4, the wafer ring structure W having the wafer W1 on which the modified layer has been formed is transferred to the clamp unit 214 by the suction hand 204c. In step S5, the sheet member W2 is cooled by the cold air supply unit 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamp unit 214 is moved (lowered) in the Z2 direction by the Z-direction movement mechanism 214b so as to contact the cooling unit 207, and cold air is supplied from the Z1 direction by the cold air supply unit 206, thereby cooling the sheet member W2.

[0089] In step S6, the wafer ring structure W is moved to the expanding unit 208 by the clamping unit 214. That is, the wafer ring structure W, from which the sheet member W2 has been cooled, is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. In step S7, the sheet member W2 is expanded by the expanding unit 208. That is, the wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 281 and is expanded by being pulled by the expanding ring 281. As a result, the wafer W1 is divided along the dividing lines (modified layers).

[0090] In step S8, the sheet member W2 in the expanded state is pressed from the Z1 direction side by the expansion maintaining member 210. That is, the pressing ring portion 210a is moved (lowered) in the Z2 direction by the Z direction moving mechanism 210d until it abuts against the sheet member W2. Then, the process proceeds from point A in FIG. 10 via point A in FIG. 11 to step S9.

[0091] 11, in step S9, after the sheet member W2 is pressed by the expansion maintaining member 210, the ultraviolet ray Ut is irradiated onto the sheet member W2 by the ultraviolet ray irradiating unit 212 while the wafer W1 is pressed by the squeegee unit 213. As a result, the wafer W1 is further divided by the squeegee unit 213. In addition, the adhesive strength of the sheet member W2 is reduced by the ultraviolet ray Ut irradiated from the ultraviolet ray irradiating unit 212.

[0092] In step S10, the sheet material W2 is heated and shrunk by the heat shrink unit 211, while the clamp unit 214 is raised. At this time, the intake unit 210c sucks in air near the heated sheet material W2. In step S11, the wafer ring structure W is transferred from the clamp unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction movement mechanism 214c while being held by the clamp unit 214. Then, at a position on the Z1 direction side of the cooling unit 207, the wafer ring structure W is released from the clamp unit 214 and then sucked by the suction hand 204c.

[0093] In step S12, the wafer ring structure W is transferred to the lift-up hand 203b by the suction hand 204c. In step S13, the wafer ring structure W is accommodated in the cassette unit 202. That is, the wafer ring structure W supported by the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, and the wafer ring structure W is accommodated in the cassette unit 202. This completes the processing performed on one wafer ring structure W. Then, the process returns to step S1 from point B in FIG. 11 via point B in FIG. 10.

[0094] (Detailed configuration of the expansion unit, expansion maintaining member, ultraviolet irradiation unit, and squeegee unit) 12 and 13, the detailed configurations of the expanding section 208, the expansion-maintaining member 210, the ultraviolet irradiation section 212, and the squeegee section 213 will be described. For convenience, the heat shrink section 211 of the expanding device 2 is not shown in FIG.

[0095] 12 shows the expanding device 2 in a state before the sheet member W2 is expanded by the expanding ring 281. Here, the clamping portion 214 is disposed at the raised position Up. That is, the gripping portion 214a is disposed at the raised position Up by the Z-direction moving mechanism 214b.

[0096] 13 shows the expanding device 2 in a state where the sheet member W2 is being expanded by the expansion ring 281. Here, the clamp portion 214 is disposed at the lowered position Lw. That is, the gripping portion 214a has been moved in the Z2 direction from the raised position Up toward the lowered position Lw by the Z-direction moving mechanism 214b.

[0097] When the gripping portion 214a is moved in the Z2 direction from the raised position Up to the lowered position Lw, the sheet member W2 comes into contact with the upper end 281a of the expand ring 281 and stretches. At this time, the wafer W1 is pulled by the sheet member W2, generating tensile stress within the wafer W1, causing the wafer W1 to be divided along the modified layer formed on the wafer W1. As a result, multiple semiconductor chips Ch are formed.

[0098] <Expanding section> The expanding unit 208 has an expanding ring 281 that divides the wafer W1 into a plurality of semiconductor chips Ch spaced apart by a distance Mr by expanding the sheet member W2 while the clamping unit 214 grips the wafer ring structure W. That is, the expanding ring 281 is configured to expand the sheet member W2 by the clamping unit 214 that is moved in the Z2 direction from the raised position Up toward the lowered position Lw by the Z-direction moving mechanism 214b.

[0099] The expand ring 281 is fixed on the base 205. An upper end 281a of the expand ring 281 is disposed at a predetermined height position Hd in the Z direction. The predetermined height position Hd is a height position based on the upper surface of the base 205. In this way, the upper end 281a of the expand ring 281 is maintained at the predetermined height position Hd.

[0100] 14, the expansion maintaining member 210 is configured to maintain the expanded state of the sheet member W2 near the wafer W1. For convenience, the heat shrink section 211 of the expanding device 2 is not shown in FIG.

[0101] Specifically, the expansion-retaining member 210 has a pressure ring portion 210a and a cover portion 210b.

[0102] The pressure ring portion 210a has a cylindrical shape in a plan view and is disposed so as to surround the wafer W1. The lid portion 210b is provided so as to cover the opening of the pressure ring portion 210a in the Z1 direction. The lid portion 210b is provided on the inner side 1210a of the pressure ring portion 210a so as to close the opening of the pressure ring portion 210a in the Z1 direction. The lid portion 210b is provided at the end of the inner side 1210a of the pressure ring portion 210a on the Z1 direction side. The inner side 1210a is the radially inner side of the cylindrical pressure ring portion 210a.

[0103] The ultraviolet irradiating unit 212 is configured to irradiate the expanded sheet member W2 with ultraviolet rays Ut from the Z2 direction side. The ultraviolet irradiating unit 212 is also disposed at a position on the expanded sheet member W2 in the Z2 direction relative to the wafer W1.

[0104] The ultraviolet rays Ut irradiated from the ultraviolet irradiation unit 212 are prevented from leaking out of the expansion maintaining member 210 by covering the wafer W1 from the Z1 direction side with the cylindrical pressure ring portion 210a and the lid portion 210b. In this way, the expansion maintaining member 210 not only has the function of maintaining the expanded state of the sheet member W2 near the wafer W1, but also the function of blocking the ultraviolet rays Ut. Furthermore, the expansion maintaining member 210 is made of a metal such as stainless steel to suppress deterioration of the material caused by blocking the ultraviolet rays Ut.

[0105] 1, in the first embodiment, the lift-up hand unit 203 is arranged so as to be sandwiched between the dicing apparatus 1 and the expanding main body unit 200. Specifically, the lift-up hand unit 203 is arranged on the X1 direction side of the dicing apparatus 1 in the X direction. Moreover, the lift-up hand unit 203 is arranged on the X2 direction side of the expanding main body unit 200 in the X direction.

[0106] In other words, the method for manufacturing semiconductor chips using this semiconductor wafer processing apparatus 100 includes the steps of using a lift-up hand unit 203 to take the wafer W1 in and out of a cassette unit 202 that stores the wafer W1, dicing the wafer W1 using a dicing apparatus 1 to divide the wafer W1 into multiple semiconductor chips Ch, and performing processing on the wafer W1 other than dicing using an expander main body unit 200, and the lift-up hand unit 203 is positioned so as to be sandwiched between the dicing apparatus 1 and the expander main body unit 200.

[0107] Furthermore, the semiconductor chip Ch manufactured by this semiconductor wafer processing apparatus 100 comprises a cassette section 202 that stores the wafer W1, a lift-up hand section 203 that takes the wafer W1 in and out of the cassette section 202, a dicing device 1 that dices the wafer W1, and an expander main body section 200 that performs processing on the wafer other than dicing, and the lift-up hand section 203 is manufactured by the semiconductor wafer processing apparatus 100 that is arranged so as to be sandwiched between the dicing device 1 and the expander main body section 200.

[0108] The suction hand unit 204 also receives the wafer W1 from the lift-up hand unit 203 and transports the wafer to the dicing apparatus 1 or the expanding main body unit 200. Specifically, the suction hand unit 204 delivers the wafer W1 to the lift-up hand unit 203 at a transfer position P1 located on the Y2-direction side of the cassette unit 202. The suction hand unit 204 also delivers the wafer W1 to the dicing apparatus 1 at a transfer position P2 located on the X2-direction side of the transfer position P1. The suction hand unit 204 also delivers the wafer W1 to the expanding main body unit 200 at a transfer position P3 located on the X1-direction side of the transfer position P1.

[0109] Moreover, a wafer transfer position P2 of the dicing device 1, a wafer transfer position P3 of the expanding main body section 200, and a wafer transfer position P1 from the lift-up hand section 203 to the suction hand section 204 are arranged in a straight line. Moreover, the suction hand section 204 is configured to be movable in a straight line along the direction in which the lift-up hand section 203, the dicing device 1, and the expanding main body section 200 are arranged (X direction).

[0110] The suction hand unit 204 is configured to transport a wafer ring structure W, which includes an elastic sheet member W2 to which a wafer W1 is attached and a ring-shaped member W3 attached to the sheet member W2 while surrounding the wafer W1, between the lift-up hand unit 203, the dicing device 1 and the expander main body unit 200.

[0111] Also, as shown in FIG. 1, the cassette section 202 and the lift-up hand section 203 are arranged side by side along a direction (Y direction) perpendicular to the direction in which the lift-up hand section 203, the dicing device 1 and the expander main body section 200 are arranged.

[0112] In addition, along a direction (Y direction) perpendicular to the direction in which the lift-up hand section 203, dicing device 1 and expanded main body section 200 are arranged, a cooling unit 207 at a wafer cooling position P4 of the expanded main body section 200 as a wafer processing section and a heat shrink section 211 at a wafer heating position P5 are arranged side by side.

[0113] In addition, the cassette section 202 is arranged on one side in the front-to-back direction (Y1 direction side) of the lift-up hand section 203, the lift-up hand section 203 is arranged on the other side in the front-to-back direction (Y2 direction side) of the cassette section 202, the cooling unit 207 at the wafer cooling position P4 of the expand main body section 200 is arranged on the side (X1 direction side) of the lift-up hand section 203, and the heat shrink section 211 at the wafer heating position P5 of the expand main body section 200 is arranged on one side in the front-to-back direction (Y1 direction side) of the wafer cooling position P4.

[0114] Specifically, the cassette section 202, the lift-up hand section 203, the cooling unit 207 at the wafer cooling position P4 of the expander main body section 200, and the heat shrink section 211 at the wafer heating position P5 are arranged in a rectangular shape.

[0115] The squeegee portion 213 is disposed at a position overlapping the heat shrink portion 211 at the wafer heating position P5 in the front-rear direction (Y direction).

[0116] The ultraviolet irradiation section 212 is disposed at a position overlapping the heat shrink section 211 at the wafer heating position P5 in the front-rear direction (Y direction).

[0117] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0118] In the first embodiment, as described above, the lift-up hand unit 203 is disposed so as to be sandwiched between the dicing device 1 and the expanding main body unit 200. This allows the wafer W1 to be directly supplied from the cassette unit 202 to one of the dicing device 1 and the expanding main body unit 200 without passing through the other of the dicing device 1 and the expanding main body unit 200, so that when performing some processing, the processing can be performed independently. As a result, even when performing only some of multiple processing, the processing of the wafer W1 can be performed efficiently. Furthermore, when performing processing by the dicing device 1 and the expanding main body unit 200 consecutively, the wafer can be moved between the dicing device 1 and the expanding main body unit 200 to perform multiple processing.

[0119] Moreover, as described above, the first embodiment further includes a suction hand unit 204 that receives the wafer W1 from the lift-up hand unit 203 and transports the wafer to the dicing device 1 or the expanding main body unit 200. This allows the suction hand unit 204 to easily transport the wafer between the lift-up hand unit 203 and the dicing device 1 and the expanding main body unit 200.

[0120] In the first embodiment, as described above, the wafer transfer position P2 of the dicing apparatus 1, the wafer transfer position P3 of the expanding main body 200, and the wafer transfer position P1 from the lift-up hand unit 203 to the suction hand unit 204 are arranged in a straight line, and the suction hand unit 204 is configured to be movable in a straight line along the direction in which the lift-up hand unit 203, the dicing apparatus 1, and the expanding main body 200 are arranged (the X direction). This allows the wafer W1 to be transported between the wafer transfer position P2 of the dicing apparatus 1, the wafer transfer position P3 of the expanding main body 200, and the wafer transfer position P1 from the lift-up hand unit 203 to the suction hand unit 204 using a straight transfer shaft, thereby preventing the configuration for transporting the wafer W1 from becoming complicated. Furthermore, the suction hand unit 204 allows the wafer W1 to be easily transported directly between the dicing apparatus 1 and the expanding main body 200.

[0121] Furthermore, in the first embodiment, as described above, the suction hand unit 204 is configured to transport the wafer ring structure W, which includes the stretchable sheet member W2 to which the wafer W1 is attached and the ring-shaped member W3 attached to the sheet member W2 while surrounding the wafer W1, between the lift-up hand unit 203, the dicing device 1, and the expanding main body unit 200. As a result, by making the shape of the ring-shaped member W3 common even for wafers W1 of different sizes, wafers W1 of different sizes can be easily transported between the dicing device 1 and the expanding main body unit 200 by the suction hand unit 204.

[0122] In the first embodiment, as described above, the expander main body 200 divides the wafer W1 by stretching the sheet member W2 on which the wafer W1 is placed. This allows the dicing and expanding processes to be performed on the wafer W1 individually or consecutively.

[0123] Furthermore, in the first embodiment, as described above, the cassette unit 202 and the lift-up hand unit 203 are arranged side by side along the direction (Y direction) perpendicular to the direction in which the lift-up hand unit 203, the dicing device 1, and the expanding main body unit 200 are arranged. This makes it possible to prevent the cassette unit 202 from interfering with the wafer W1 being moved when the wafer W1 is moved to the dicing device 1 and the expanding main body unit 200.

[0124] Furthermore, in the first embodiment, as described above, the cooling unit 207 at the wafer cooling position P4 of the expand main body 200 as a wafer processing unit and the heat shrink unit 211 at the wafer heating position P5 are arranged side by side along the direction (Y direction) perpendicular to the direction in which the lift-up hand unit 203, the dicing apparatus 1, and the expand main body 200 are arranged. This makes it possible to prevent the members of the heat shrink unit 211 at the wafer heating position P5 from interfering with the wafer W1 being moved when the wafer W1 is moved to the dicing apparatus 1 and the expand main body 200.

[0125] Furthermore, in the first embodiment, as described above, the expander main body section 200 includes the clamp section 214 that holds the wafer W1 and moves the wafer W1 between the cooling unit 207 at the wafer cooling position P4 and the heat shrink section 211 at the wafer heating position P5. This allows the wafer W1 transferred to the expander main body section 200 to be easily moved independently within the expander main body section 200 by the clamp section 214 between the cooling unit 207 at the wafer cooling position P4 and the heat shrink section 211 at the wafer heating position P5.

[0126] Furthermore, in the first embodiment, as described above, the cassette unit 202 is disposed on one side (Y1 direction side) of the lift-up hand unit 203 in the front-rear direction, the lift-up hand unit 203 is disposed on the other side (Y2 direction side) of the cassette unit 202 in the front-rear direction, the cooling unit 207 at the wafer cooling position P4 of the expand main body unit 200 is disposed on the lateral side (X1 direction side) of the lift-up hand unit 203, and the heat shrink unit 211 at the wafer heating position P5 of the expand main body unit 200 is disposed on one side (Y1 direction side) of the wafer cooling position P4 in the front-rear direction. This allows the cassette unit 202, the lift-up hand unit 203, the cooling unit 207 at the wafer cooling position P4 of the expand main body unit 200, and the heat shrink unit 211 at the wafer heating position P5 to be compactly disposed along the movement path of the wafer W1.

[0127] Furthermore, in the first embodiment, as described above, the cassette unit 202, the lift-up hand unit 203, the cooling unit 207 at the wafer cooling position P4 of the expander main body 200, and the heat shrink unit 211 at the wafer heating position P5 are arranged in a rectangular shape. This reduces the area of ​​the maintenance space provided around the apparatus compared to when the cassette unit 202, the lift-up hand unit 203, the cooling unit 207 at the wafer cooling position P4 of the expander main body 200, and the heat shrink unit 211 at the wafer heating position P5 are arranged linearly along a predetermined direction, thereby preventing the area required for installing the semiconductor wafer processing apparatus 100 from becoming larger.

[0128] Furthermore, in the first embodiment, as described above, the squeegee unit 213 that breaks the divided wafer W1 is provided, and the squeegee unit 213 is disposed at a position that overlaps with the heat shrink unit 211 at the wafer heating position P5 in the front-to-rear direction (Y direction). This allows the size of the expand main body 200 in the front-to-rear direction to be smaller than when the squeegee unit 213 is disposed at a position that does not overlap with the heat shrink unit 211 at the wafer heating position P5.

[0129] Furthermore, in the first embodiment, as described above, there is provided an ultraviolet ray irradiation unit 212 that irradiates ultraviolet rays onto the sheet member W2 to which the wafer W1 is attached, and the ultraviolet ray irradiation unit 212 is arranged at a position that overlaps with the heat shrink unit 211 at the wafer heating position P5 in the front-to-rear direction (Y direction). This allows the size of the expanded main body portion 200 in the front-to-rear direction to be smaller than when the ultraviolet ray irradiation unit 212 is arranged at a position that does not overlap with the heat shrink unit 211 at the wafer heating position P5.

[0130] [Second embodiment] 15 to 20, the configuration of a semiconductor wafer processing apparatus 300 according to the second embodiment will be described. In the second embodiment, unlike the first embodiment, a squeegee unit 3213 is disposed outside an expand ring 3281. Note that in the second embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0131] (Semiconductor wafer processing equipment) 15 and 16, semiconductor wafer processing apparatus 300 is an apparatus that processes wafer W1 provided in wafer ring structure W. Note that semiconductor wafer processing apparatus 300 is an example of the "wafer processing apparatus" in the claims.

[0132] The semiconductor wafer processing apparatus 300 is equipped with a dicing apparatus 1 and an expanding apparatus 302. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 302 are lined up is the X direction, the X1 direction is the expanding apparatus 302 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0133] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating a laser having a wavelength that is transparent to the wafer W1 along the parting lines (streets). The dicing device 1 is an example of the "dicing unit" in the claims.

[0134] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0135] (Expanding device) As shown in FIGS. 16 and 17, the expanding apparatus 302 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0136] The expansion device 302 includes an expansion main body section 200, a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 3208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 212, a squeegee section 3213, a clamp section 214, an imaging section 215, and an alarm section 216.

[0137] <Expanding section> The expanding section 3208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing line.

[0138] Specifically, the expanding section 3208 has an expanding ring 3281 and a Z-direction moving mechanism 3282 .

[0139] The expand ring 3281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expand ring 3281 has a ring shape in a plan view. The Z-direction movement mechanism 3282 is configured to move the expand ring 3281 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 3282 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 3282 is attached to the base 205. In the expanded state, the upper end 3281a of the expand ring 3281 is maintained at a predetermined height position Hd by the Z-direction movement mechanism 3282.

[0140] <Squeegee Section> The squeegee unit 3213 is configured to expand the sheet member W2 and then press the wafer W1 from the Z2 direction to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 3213 has a pressing unit 3213a, an X-direction moving mechanism 3213b, a Z-direction moving mechanism 3213c, and a rotating mechanism 3213d.

[0141] The pressing unit 3213a is configured to move in the Z1 direction by the Z-direction moving mechanism 3213c, and then move by the rotating mechanism 3213d and the X-direction moving mechanism 3213b while pressing the wafer W1 from the Z2 direction via the sheet member W2, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. The pressing unit 3213a is a squeegee. The pressing unit 3213a is attached to the Z1 direction end of the rotating mechanism 3213d. The Z-direction moving mechanism 3213c is configured to move the rotating mechanism 3213d in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 3213c has, for example, a cylinder. The Z-direction moving mechanism 3213c is attached to the Z1 direction end of the X-direction moving mechanism 3213b. The X-direction moving mechanism 3213b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The X-direction movement mechanism 3213b is attached to the end of the base 205 on the Z1 direction side.

[0142] In the squeegee unit 3213, after being moved in the Z1 direction by the Z-direction moving mechanism 3213c, the pressing unit 3213a presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction moving mechanism 3213b moves the pressing unit 3213a in the Y direction, thereby dividing the wafer W1. In addition, in the squeegee unit 3213, after the pressing unit 3213a has finished moving in the Y direction, the rotating mechanism 3213d rotates the pressing unit 3213a by 90 degrees. In addition, in the squeegee unit 3213, after being rotated 90 degrees, the X-direction moving mechanism 3213b moves the pressing unit 3213a in the X direction while the pressing unit 3213a presses the wafer W1 from the Z2 direction side via the sheet member W2, thereby dividing the wafer W1.

[0143] (Control configuration of semiconductor wafer processing equipment) As shown in FIG. 18, semiconductor wafer processing apparatus 300 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 3104, a fifth control unit 3105, a sixth control unit 3106, a seventh control unit 3107, an eighth control unit 3108, a ninth control unit 3109, an expansion control calculation unit 3110, a handling control calculation unit 3111, a dicing control calculation unit 3112, and a memory unit 3113. The first control unit 101, the second control unit 102, the third control unit 103, the fifth control unit 3105, the sixth control unit 3106, the seventh control unit 3107, the eighth control unit 3108, the ninth control unit 3109, the expansion control calculation unit 3110, the handling control calculation unit 3111, the dicing control calculation unit 3112, and the memory unit 3113 have the same configuration as the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, the eighth control unit 108, the expansion control calculation unit 109, the handling control calculation unit 110, the dicing control calculation unit 111, and the memory unit 112 of the first embodiment, respectively, and therefore their explanations will be omitted.

[0144] The fourth control unit 3104 is configured to control the expanding unit 3208. The fourth control unit 3104 includes a CPU and a storage unit having a ROM, a RAM, etc. The fourth control unit 3104 may include, as the storage unit, an HDD or the like that retains stored information even after the voltage is cut off.

[0145] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 300 will now be described with reference to FIGS.

[0146] Steps S1 to S6, step S8, and step S11 are the same as steps S1 to S6, step S8, and step S11 in the semiconductor chip manufacturing process of the first embodiment, respectively, and therefore will not be described.

[0147] In step S307, the sheet member W2 is expanded by the expanding unit 3208. That is, the expanding ring 3281 is moved in the Z1 direction by the Z-direction moving mechanism 3282. The wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 3281 and is pulled by the expanding ring 3281, thereby expanding. As a result, the wafer W1 is divided along the division lines (modified layers).

[0148] 20, in step S309, the heat shrink unit 211 heats and shrinks the sheet member W2, and the ultraviolet irradiation unit 212 irradiates the sheet member W2 with ultraviolet rays Ut while the clamp unit 214 rises. At this time, the air intake unit 210c sucks in air near the heated sheet member W2. In step S310, the clamp unit 214 moves the wafer ring structure W to the squeegee unit 3213. That is, the wafer ring structure W, while held by the clamp unit 214, is moved in the Y2 direction by the Y-direction movement mechanism 214c.

[0149] In step S311, after the wafer ring structure W is moved to the squeegee portion 3213, the wafer W1 is pressed by the squeegee portion 3213. As a result, the wafer W1 is further divided by the squeegee portion 3213.

[0150] 15, in the second embodiment, the lift-up hand unit 203 is arranged so as to be sandwiched between the dicing apparatus 1 and the expanding main body unit 200. Specifically, the lift-up hand unit 203 is arranged on the X1 direction side of the dicing apparatus 1 in the X direction. Moreover, the lift-up hand unit 203 is arranged on the X2 direction side of the expanding main body unit 200 in the X direction.

[0151] In addition, in the second embodiment, as shown in FIG. 17, the squeegee portion 3213 that breaks the divided wafer W1 is arranged in the front-to-back direction (Y direction) between the cooling unit 207 at the wafer cooling position P4 and the heat shrink portion 211 at the wafer heating position P5.

[0152] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0153] In the second embodiment, similar to the first embodiment, the wafer W1 can be directly supplied from the cassette unit 202 to one of the dicing device 1 and the expanding main body unit 200 without passing through the other of the dicing device 1 and the expanding main body unit 200, so that when performing some processing, the processing can be performed independently. As a result, even when performing only some of multiple processing, the processing of the wafer W1 can be performed efficiently. Furthermore, when performing processing by the dicing device 1 and the expanding main body unit 200 consecutively, multiple processing can be performed by moving the wafer between the dicing device 1 and the expanding main body unit 200.

[0154] Furthermore, in the second embodiment, as described above, the squeegee unit 3213 that breaks the divided wafer W1 is provided, and the squeegee unit 3213 is disposed in the front-to-rear direction (Y direction) between the cooling unit 207 at the wafer cooling position P4 and the heat shrink unit 211 at the wafer heating position P5. As a result, after the wafer W1 is cooled in the cooling unit 207 at the wafer cooling position P4, the wafer W1 can be sequentially moved to the squeegee unit 3213 and the heat shrink unit 211 at the wafer heating position P5, whereby breaking and heating processes can be sequentially performed.

[0155] The other effects of the second embodiment are the same as those of the first embodiment.

[0156] [Third embodiment] The configuration of a semiconductor wafer processing apparatus 400 according to the third embodiment will be described with reference to Figure 21. Unlike the first and second embodiments, the third embodiment is provided with a gliding device as a wafer processing unit that performs processing other than dicing. Note that in the third embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0157] (Semiconductor wafer processing equipment) 21, the semiconductor wafer processing apparatus 400 is an apparatus that processes a wafer W1 provided in a wafer ring structure W. The semiconductor wafer processing apparatus 400 is an example of the "wafer processing apparatus" in the claims.

[0158] The semiconductor wafer processing apparatus 400 includes a dicing apparatus 1, a cassette unit 202, a lift-up hand unit 203, a suction hand unit 204, and a gliding apparatus 410. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the gliding apparatus 410 are aligned is the X direction, the X1 direction is the side of the gliding apparatus 410 in the X direction, and the X2 direction is the side of the dicing apparatus 1 in the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0159] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating a laser having a wavelength that is transparent to the wafer W1 along the parting lines (streets). The dicing device 1 is an example of the "dicing unit" in the claims.

[0160] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0161] (gliding device) The gliding device 410 is configured to polish and process the wafer W1. The gliding device 410 is an example of the "wafer processing unit" and "gliding unit" in the claims.

[0162] The gliding device 410 includes a base 411 , a wafer holder 412 , and a polishing unit 413 .

[0163] <base> The base 411 is a substrate on which the wafer holder 412 and the polishing part 413 are mounted.

[0164] <Wafer holding part> The wafer holding part 412 holds the wafer ring structure W. Furthermore, the wafer holding part 412 delivers the wafer W1 (wafer ring structure W) to the lift-up hand part 203 at the wafer delivery position P6.

[0165] <Polishing section> The polishing unit 413 polishes the wafer W1 held by the wafer holding unit 412. The polishing unit 413 is disposed above the wafer holding unit 412 (on the Z1 direction side).

[0166] 21, in the third embodiment, the lift-up hand unit 203 is disposed so as to be sandwiched between the dicing apparatus 1 and the gliding apparatus 410. Specifically, the lift-up hand unit 203 is disposed on the X1 direction side of the dicing apparatus 1 in the X direction. Moreover, the lift-up hand unit 203 is disposed on the X2 direction side of the gliding apparatus 410 in the X direction.

[0167] (Effects of the third embodiment) In the third embodiment, the following effects can be obtained.

[0168] In the third embodiment, similar to the first embodiment, the wafer W1 can be directly supplied from the cassette unit 202 to one of the dicing apparatus 1 and the gliding apparatus 410 without passing through the other of the dicing apparatus 1 and the gliding apparatus 410, so that when performing some processing, the processing can be performed independently. As a result, even when performing only some of multiple processing, the processing of the wafer W1 can be performed efficiently. Furthermore, when performing processing by the dicing apparatus 1 and the gliding apparatus 410 consecutively, the wafer can be moved between the dicing apparatus 1 and the gliding apparatus 410 to perform multiple processing.

[0169] In the third embodiment, as described above, the gliding device 410 polishes the wafer, thereby allowing the dicing and polishing processes to be performed on the wafer W1 either individually or consecutively.

[0170] The other effects of the third embodiment are the same as those of the first embodiment.

[0171] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and includes all modifications (variations) within the meaning and scope of the claims.

[0172] For example, in the first and second embodiments, a dicing device that dices the wafer and an expanding main body that divides the wafer are provided, and in the third embodiment, an example of a configuration is shown in which a dicing device that dices the wafer and a grinding device that polishes the wafer are provided, but the present invention is not limited to this. In the present invention, a dicing device that dices the wafer, an expanding main body that divides the wafer, and a grinding device that polishes the wafer may be provided.

[0173] In the first to third embodiments, the dicing device irradiates a wafer with a laser to generate cracks and perform dicing, but the present invention is not limited to this. In the present invention, the dicing device may cut the wafer by irradiating a laser, or may cut the wafer with a blade.

[0174] In the first to third embodiments, the expansion-retaining member has a lid portion, but the present invention is not limited to this. In the present invention, the expansion-retaining member does not have to have a lid portion.

[0175] In the first and second embodiments, the expanding device includes an ultraviolet ray irradiation unit, but the present invention is not limited to this. In the present invention, the expanding device does not necessarily have to include an ultraviolet ray irradiation unit.

[0176] In the first and second embodiments, the expanding device includes a squeegee unit, but the present invention is not limited to this. In the present invention, the expanding device does not necessarily include a squeegee unit.

[0177] In the first to third embodiments, for convenience of explanation, examples have been shown in which the control processing is explained using a flow-driven flowchart in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing may be performed by an event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven. [Explanation of symbols]

[0178] 1 Dicing equipment (dicing section) 100, 300, 400 Semiconductor wafer processing equipment (wafer processing equipment) 200 Expander main body (wafer processing section, expander section) 202 Cassette section 203 Lift-up hand section (wafer loading / unloading section) 204 Suction hand unit (wafer transport unit) 207 Cooling unit (wafer cooling section) 211 Heat shrink section (wafer heating section) 212 Ultraviolet irradiation unit 213, 3213 Squeegee part 214 Clamping section (wafer moving section) 410 Gliding device (wafer processing section, gliding section) W wafer ring structure W1 wafer

Claims

1. a cassette unit for accommodating wafers; a wafer loading / unloading unit for loading / unloading the wafer from / to the cassette unit; a dicing unit that dices the wafer; a wafer processing unit that performs processing other than dicing on the wafer; a single wafer transfer unit that receives the wafer from the wafer loading / unloading unit and transfers the wafer to the dicing unit or the wafer processing unit, the wafer loading / unloading section is disposed between the dicing section and the wafer processing section, a transfer position of the wafer in the dicing unit, a transfer position of the wafer in the wafer processing unit, and a transfer position of the wafer from the wafer loading / unloading unit to the wafer transport unit are arranged in a straight line; The wafer processing device, wherein the wafer transport unit is configured to be movable linearly along a direction in which the wafer loading / unloading unit, the dicing unit, and the wafer processing unit are arranged.

2. A cassette unit for accommodating wafers; a wafer loading / unloading unit for loading / unloading the wafer from / to the cassette unit; a dicing unit that dices the wafer; a wafer processing unit that performs processing other than dicing on the wafer, the wafer loading / unloading section is disposed between the dicing section and the wafer processing section, the wafer processing unit includes an expanding unit that stretches a sheet member on which the wafer is placed to divide the wafer, a wafer cooling unit and a wafer heating unit of the expanding unit serving as the wafer processing unit are arranged side by side along a direction perpendicular to a direction in which the wafer loading / unloading unit, the dicing unit, and the wafer processing unit are arranged; the cassette unit is disposed on one side of the wafer loading / unloading unit in the front-rear direction, the wafer loading / unloading unit is disposed on the other side of the cassette unit in the front-rear direction, the wafer cooling unit of the expanding unit is disposed on a side of the wafer loading / unloading unit, and the wafer heating unit of the expanding unit is disposed on one side of the wafer cooling unit in the front-rear direction, Further, a squeegee unit is provided for breaking the divided wafer, The wafer processing device, wherein the squeegee unit is disposed between the wafer cooling unit and the wafer heating unit in the front-rear direction.

3. A cassette unit for accommodating wafers; a wafer loading / unloading unit for loading / unloading the wafer from / to the cassette unit; a dicing unit that dices the wafer; a wafer processing unit that performs processing other than dicing on the wafer, the wafer loading / unloading section is disposed between the dicing section and the wafer processing section, the wafer processing unit includes an expanding unit that stretches a sheet member on which the wafer is placed to divide the wafer, a wafer cooling unit and a wafer heating unit of the expanding unit serving as the wafer processing unit are arranged side by side along a direction perpendicular to a direction in which the wafer loading / unloading unit, the dicing unit, and the wafer processing unit are arranged; the cassette unit is disposed on one side of the wafer loading / unloading unit in the front-rear direction, the wafer loading / unloading unit is disposed on the other side of the cassette unit in the front-rear direction, the wafer cooling unit of the expanding unit is disposed on a side of the wafer loading / unloading unit, and the wafer heating unit of the expanding unit is disposed on one side of the wafer cooling unit in the front-rear direction, further comprising an ultraviolet irradiation unit that irradiates the sheet member to which the wafer is attached with ultraviolet rays; The wafer processing apparatus, wherein the ultraviolet irradiation unit is disposed at a position overlapping the wafer heating unit in the front-rear direction.

4. 2. The wafer processing apparatus of claim 1, wherein the wafer transport unit is configured to transport a wafer ring structure including an elastic sheet member to which the wafer is attached and a ring-shaped member attached to the sheet member while surrounding the wafer, between the wafer loading / unloading unit, the dicing unit, and the wafer processing unit.

5. 2. The wafer processing apparatus according to claim 1, wherein the wafer processing unit includes an expanding unit that stretches a sheet member on which the wafer is placed to divide the wafer, or a grinding unit that grinds the wafer.

6. 2. The wafer processing apparatus according to claim 1, wherein the cassette unit and the wafer loading / unloading unit are arranged side by side along a direction perpendicular to a direction in which the wafer loading / unloading unit, the dicing unit, and the wafer processing unit are arranged.

7. 6. The wafer processing apparatus of claim 5, wherein the wafer cooling section and wafer heating section of the expanding section as the wafer processing section are arranged side by side along a direction perpendicular to the direction in which the wafer loading / unloading section, the dicing section, and the wafer processing section are arranged.

8. 8. The wafer processing apparatus according to claim 7, wherein the expanding section includes a wafer moving section that holds the wafer and moves the wafer between the wafer cooling section and the wafer heating section.

9. 8. The wafer processing apparatus of claim 7, wherein the cassette unit is disposed on one side of the wafer loading / unloading unit in the front-to-rear direction, the wafer loading / unloading unit is disposed on the other side of the cassette unit in the front-to-rear direction, the wafer cooling unit of the expanding unit is disposed to the side of the wafer loading / unloading unit, and the wafer heating unit of the expanding unit is disposed on one side of the wafer cooling unit in the front-to-rear direction.

10. 10. The wafer processing apparatus according to claim 9, wherein the cassette section, the wafer loading / unloading section, the wafer cooling section of the expanding section, and the wafer heating section are arranged in a rectangular shape.

11. Further, a squeegee unit is provided for breaking the divided wafer, The wafer processing apparatus according to claim 9 , wherein the squeegee unit is disposed at a position overlapping the wafer heating unit in the front-rear direction.

12. Further, a squeegee unit is provided for breaking the divided wafer, 10. The wafer processing apparatus according to claim 9, wherein the squeegee unit is disposed between the wafer cooling unit and the wafer heating unit in the front-rear direction.

13. further comprising an ultraviolet irradiation unit that irradiates the sheet member to which the wafer is attached with ultraviolet rays; 10. The wafer processing apparatus according to claim 9, wherein the ultraviolet irradiating unit is disposed at a position overlapping the wafer heating unit in the front-rear direction.

14. a step of loading and unloading the wafer from a cassette unit that accommodates the wafer by a wafer loading and unloading unit; dicing the wafer by a dicing unit to divide the wafer into a plurality of semiconductor chips; a step of performing a process other than dicing on the wafer by a wafer processing unit; receiving the wafer from the wafer loading / unloading section and transporting the wafer to the dicing section or the wafer processing section by a single wafer transport section; the wafer loading / unloading section is disposed between the dicing section and the wafer processing section, a transfer position of the wafer in the dicing unit, a transfer position of the wafer in the wafer processing unit, and a transfer position of the wafer from the wafer loading / unloading unit to the wafer transport unit are arranged in a straight line; A method for manufacturing semiconductor chips, wherein the wafer transport section is configured to be movable linearly along the direction in which the wafer loading / unloading section, the dicing section, and the wafer processing section are arranged.

15. a wafer processing device comprising: a cassette unit that stores wafers; a wafer loading / unloading unit that loads and unloads the wafers from the cassette unit; a dicing unit that dices the wafers; a wafer processing unit that performs processing on the wafer other than dicing; and a single wafer transport unit that receives the wafer from the wafer loading / unloading unit and transports the wafer to the dicing unit or the wafer processing unit, wherein the wafer loading / unloading unit is positioned so as to be sandwiched between the dicing unit and the wafer processing unit, and the wafer transfer position of the dicing unit, the wafer transfer position of the wafer processing unit, and the wafer transfer position from the wafer loading / unloading unit to the wafer transport unit are arranged in a straight line, and the wafer transport unit is configured to be able to move linearly along the direction in which the wafer loading / unloading unit, the dicing unit, and the wafer processing unit are arranged.

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