Display module manufacturing method and display module

Abstract

The present technology relates to a display module production method and a display module which make it possible to more suitably produce an LED display. In this display module production method, a resin layer having formed thereon a plurality of light-emitting elements arranged in an array and first wiring for driving the light-emitting elements is formed on a glass substrate, then a printed substrate on which second wiring for driving the light-emitting elements is formed is joined to the surface on the opposite side of the resin layer from a light extraction surface either before or after detaching the glass substrate from the resin layer. The present technology is applicable, for example, to large direct view LED displays for displaying video content.

Description

[Technical Field]

[0001] The present technology relates to a display module manufacturing method and a display module, and more particularly to a display module manufacturing method and a display module that enable more suitable manufacturing of an LED display. [Background technology]

[0002] Generally, LED displays are made up of tiled PCB boards with LED chips evenly arranged on them. Compared to PCB boards for general LCD displays, LED display PCB boards have more layers and are more expensive.

[0003] It is also generally known that increasing wiring precision significantly increases the cost of PCB boards, making it difficult to mount μ-LEDs, which are being developed to reduce LED costs, on PCB boards.

[0004] To solve these problems, the use of a glass substrate instead of a PCB substrate has been considered. For example, Patent Document 1 describes a technique for obtaining an electronic device by peeling off a support substrate from a laminate including a glass support substrate, a polyimide resin substrate, and electronic device members. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-2622 Summary of the Invention [Problem to be solved by the invention]

[0006] Because there is no established technology for routing wiring on the back side of the glass substrate, it is difficult to manufacture LED displays by tiling the glass substrate. In addition, compared to PCB substrates, glass substrates are more susceptible to breakage when physical force is applied, so tiling glass substrates is not desirable.

[0007] The present technology has been made in view of such circumstances, and makes it possible to more suitably manufacture LED displays. [Means for solving the problem]

[0008] A manufacturing method of a display module according to one aspect of the present technology includes forming a resin layer on a glass substrate, the resin layer having a plurality of light-emitting elements arranged in an array and first wiring for driving the light-emitting elements, and bonding a printed circuit board having second wiring for driving the light-emitting elements to the surface of the resin layer opposite the light extraction surface before or after peeling the glass substrate from the resin layer.

[0009] A display module according to one aspect of the present technology is configured such that a resin layer having a plurality of light-emitting elements arranged in an array and first wiring for driving the light-emitting elements is formed on a glass substrate, and then, before or after the glass substrate is peeled off from the resin layer, a printed circuit board having second wiring for driving the light-emitting elements is bonded to the side opposite the light extraction surface of the resin layer.

[0010] In one aspect of the present technology, a resin layer having a plurality of light-emitting elements arranged in an array and a first wiring for driving the light-emitting elements formed thereon is formed on a glass substrate, and before or after the glass substrate is peeled off from the resin layer, a printed circuit board having a second wiring for driving the light-emitting elements formed thereon is bonded to the surface opposite the light extraction surface of the resin layer. [Brief explanation of the drawings]

[0011] [Figure 1]FIG. 1 is a diagram illustrating an example of the configuration of a display system equipped with a tiling display. [Figure 2] FIG. 2 is a block diagram showing a detailed configuration example of a video wall controller and a display module. [Figure 3] FIG. 2 is a plan view showing the configuration of a display module. [Figure 4] FIG. 2 is an enlarged cross-sectional view of a portion of the display module. [Figure 5] 1A to 1C are diagrams illustrating a manufacturing method of a display module. [Figure 6] 1A to 1C are diagrams illustrating a manufacturing method of a display module. [Figure 7] 1A to 1C are diagrams illustrating a manufacturing method of a display module. [Figure 8] 1A to 1C are diagrams illustrating a manufacturing method of a display module. [Figure 9] 1A to 1C are diagrams illustrating a manufacturing method of a display module. [Figure 10] FIG. 1 is an enlarged cross-sectional view of a portion of a typical display module. [Figure 11] FIG. 1 is an enlarged cross-sectional view showing a part of a display module using a glass substrate. [Figure 12] 1A to 1C are diagrams illustrating the structures of a general display module, a display module using a glass substrate, and a display module according to the present technology, in comparison with each other; [Figure 13] FIG. 10 is a cross-sectional view showing a first modified example of a display module. [Figure 14] 10A to 10C are diagrams illustrating a method for manufacturing a display module according to a first modified example. [Figure 15] FIG. 10 is a cross-sectional view showing a second modified example of the display module. [Figure 16] 10A to 10C are diagrams illustrating a method for manufacturing a display module according to a second modified example. [Figure 17] 10A to 10C are diagrams illustrating a method for manufacturing a display module according to a second modified example. [Figure 18] FIG. 10 is a cross-sectional view showing a third modified example of the display module. [Figure 19] 10A to 10C are diagrams illustrating a method for manufacturing a display module according to a third modified example. [Figure 20] 10A to 10C are diagrams illustrating a method for manufacturing a display module according to a third modified example. [Figure 21] FIG. 10 is a cross-sectional view showing a modified example of a laminate before being attached to a PCB board. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present technology will be described in the following order. 1. Display systems to which this technology can be applied 2. Display module structure 3. Display module manufacturing method 4. Variations

[0013] <1. Display systems to which this technology can be applied> FIG. 1 is a diagram showing an example of the configuration of a display system equipped with a tiling display, as an example of a display system to which the present technology can be applied.

[0014] The display system 11 in FIG. 1 displays video content on a large direct-view LED display configured by arranging a plurality of display modules in a tiled pattern, for example.

[0015] The display system 11 is made up of a PC 30 , a video server 31 , a video wall controller 32 , and a video wall 33 .

[0016] The PC (Personal Computer) 30 is a general-purpose computer that accepts operation inputs from a user and supplies a command corresponding to the operation content to the video wall controller 32.

[0017] The video server 31 is, for example, a server computer, and supplies video signal data such as video content to the video wall controller 32 .

[0018] The video wall controller 32 operates in response to commands supplied from the PC 30, and distributes data consisting of video content image signals to the display modules 51-1 to 51-n that make up the video wall 33 for display.

[0019] Hereinafter, when there is no need to distinguish between the display modules 51-1 to 51-n, they will simply be referred to as display modules 51.

[0020] 1, the video wall 33 is configured by arranging display modules 51-1 to 51-n, each having an array of pixels made of LEDs (Light Emitting Diodes), in a tiled pattern. In the video wall 33, images displayed by the individual display modules 51 are combined in a tiled pattern, so that a single image is displayed on the video wall 33 as a whole.

[0021] The video wall controller 32 and the video wall 33 may be integrated into one unit, or may be an integrated display device.

[0022] FIG. 2 is a block diagram showing a detailed configuration example of the video wall controller 32 and the display module 51. As shown in FIG.

[0023] The video wall controller 32 includes a LAN terminal 71, an HDMI (registered trademark) terminal 72, a DP terminal 73, and a DVI terminal 74. The video wall controller 32 also includes a network IF (Interface) 75, an MPU 76, a signal input IF 77, a signal processing unit 78, a DRAM 79, a signal distribution unit 80, and output IFs 81-1 through 81-n.

[0024] The LAN (Local Area Network) terminal 71 is, for example, a connection terminal for a LAN cable, etc. The LAN terminal 71 realizes communication with the PC 30, which supplies control commands and the like according to the user's operation content to the video wall controller 32, and supplies the input control commands and the like to the MPU 76 via the network IF 75.

[0025] The LAN terminal 71 may be configured to be physically connected by a wired LAN cable, or may be configured to be connected by a so-called wireless LAN realized by wireless communication.

[0026] The MPU (Micro Processor Unit) 76 receives input of a control command supplied from the PC 30 via the LAN terminal 71 and the network IF 75, and supplies a control signal corresponding to the control command to a signal processing unit 78.

[0027] The HDMI (High Definition Multimedia Interface) terminal 72, DP (Display Port) terminal 73, and DVI (Digital Visual Interface) terminal 74 are all input terminals for data consisting of video signals. The HDMI terminal 72, DP terminal 73, and DVI terminal 74 are connected to a server computer functioning as the video server 31, and supply data consisting of video signals to a signal processing unit 78 via a signal input IF 77. Note that the video wall controller 32 may also be equipped with input terminals based on other standards, such as an SDI (Serial Digital Interface) terminal.

[0028] FIG. 2 shows an example in which the video server 31 is connected to an HDMI terminal 72, but the HDMI terminal 72, DP terminal 73, and DVI terminal 74 all have basically the same functions and differ only in their standards, so any one of them can be selected and connected as needed.

[0029] Based on the control signal supplied from the MPU 76, the signal processing unit 78 adjusts the color temperature, contrast, brightness, etc. of the data made up of the video signal supplied via the signal input IF 77, and supplies the adjusted data to the signal distribution unit 80. At this time, the signal processing unit 78 uses a connected DRAM (Dynamic Random Access Memory) 79 to expand the data made up of the video signal, executes signal processing based on the control signal, and supplies the signal processing result to the signal distribution unit 80.

[0030] The signal distribution unit 80 distributes data made up of signal-processed video signals supplied from the signal processing unit 78, and distributes the data individually to the display modules 51-1 to 51-n via output IFs 81-1 to 81-n.

[0031] The display module 51 includes a driver control unit 91 and an LED block 92 .

[0032] The driver control unit 91 supplies data consisting of video signals that control the light emission of the LEDs that make up the LED arrays 122-1 to 122-N to the plurality of LED drivers 121-1 to 121-N that make up the LED block 92.

[0033] The driver control unit 91 includes a signal input IF 111, a signal processing unit 112, and output IFs 113-1 through 113-N.

[0034] The signal input IF 111 receives input of video signal data supplied from the video wall controller 32 and supplies it to the signal processing unit 112 .

[0035] The signal processing unit 112 corrects the color and brightness of each display module 51 based on the video signal data supplied from the signal input IF 111, and generates data for setting the light emission intensity of each LED constituting the LED arrays 122-1 to 122-N. The generated data is distributed to the LED drivers 121-1 to 121-N of the LED block 92 via the output IFs 113-1 to 113-N.

[0036] The LED block 92 includes LED drivers 121-1 to 121-N and LED arrays 122-1 to 122-N.

[0037] Hereinafter, when there is no need to distinguish between the LED drivers 121-1 to 121-N, they will simply be referred to as LED drivers 121, and when there is no need to distinguish between the LED arrays 122-1 to 122-N, they will simply be referred to as LED arrays 122.

[0038] Based on data for setting the light emission intensity of the LEDs supplied from the driver control unit 91, the LED driver 121 drives the LEDs arranged in the corresponding LED array 122 and controls the light emission by PWM (Pulse Width Modulation).

[0039] 2. Display module structure FIG. 3 is a plan view showing the configuration of the display module 51. As shown in FIG.

[0040] 3, the display module 51 is configured by arranging LED arrays 122 in an array on the front surface of a PCB (Printed Circuit Board) substrate 161. Each of the LED arrays 122 constitutes a pixel in the display module 51.

[0041] The LED array 122 is equipped with LED chips 141R, 141G, and 141B, which are made up of μ-LEDs, which are ultra-small LEDs measured in micrometers. The μ-LEDs (micro LEDs) that make up the LED chips 141R, 141G, and 141B are light-emitting elements that emit red, green, and blue light, respectively. These red, blue, and green LEDs form RGB subpixels that make up pixels in the display module 51.

[0042] Next, the detailed structure of the display module 51 will be described with reference to Fig. 4. Fig. 4 is an enlarged cross-sectional view showing a part of the display module 51.

[0043] As shown in FIG. 4, the display module 51 is configured by laminating a PCB substrate 161, a support substrate 162, a multilayer wiring layer 163, and an element layer 164.

[0044] The PCB substrate 161 is configured by, for example, a two-layer through-hole substrate made of glass epoxy. The PCB substrate 161 is formed with through-hole electrodes 181 that penetrate the PCB substrate 161. The through-hole electrodes 181 connect circuits and components provided in the multilayer wiring layer 163 and the element layer 164 to an LED driver 121 provided on the underside of the PCB substrate 161. For example, a Si-Driver is used as the LED driver 121.

[0045] A film such as PET (Polyethylene Terephthalate) is used as the support substrate 162. A connection conductor 191 is embedded in the support substrate 162, connecting the through electrode 181 to the signal pad 203 formed on the multilayer wiring layer 163. The connection conductor 191 functions as a through electrode that electrically connects the PCB substrate 161 and the multilayer wiring layer 163.

[0046] The multilayer wiring layer 163 is composed of multiple wiring layers, each consisting of a wiring layer 201a on the PCB substrate 161 side and a wiring layer 201b on the element layer 164 side, and a resin 202 formed to seal each wiring layer. The multiple wiring layers are composed of circuits and wiring using TFTs (Thin Film Transistors), for example. The TFTs are made of LTPS (Low Temperature Polycrystalline Silicon), for example. Signal pads 203 are formed on the lower surface (surface on the PCB substrate 161 side) of the wiring layer 201b.

[0047] In the example of FIG. 4, the multilayer wiring layer 163 is composed of two wiring layers, but the number of wiring layers constituting the multilayer wiring layer 163 can be any number depending on the circuit scale.

[0048] The element layer 164 is formed by sealing the LED array 122 with a sealing film 211 such as resin. The light extraction surface from which light from the LEDs constituting the LED array 122 is emitted is the surface on the element layer 164 side of the display module 51. Between the LED array 122 and the wiring layer 201b, electrodes 212 are formed to connect the LED array 122 and the wiring layer 201b.

[0049] As described above, the display module 51 is formed by joining a resin layer composed of a multilayer wiring layer 163 provided with wiring for driving the LEDs that make up the LED array 122 and an element layer 164 on which the LED array 122 is formed, to a PCB substrate 161 on which through electrodes 181 for driving the LEDs are formed via a support substrate 162.

[0050] 3. Display module manufacturing method Next, a method for manufacturing the display module 51 will be described with reference to FIGS.

[0051] 5A, a support substrate 162 is formed on a glass substrate 251, and a multilayer wiring layer 163 is formed on the support substrate 162. An electrode 212 is formed so as to be partially exposed from the upper surface of the multilayer wiring layer 163 and connect to the wiring layer 201b, and a sealing film 211 is formed to flatten the multilayer wiring layer 163. An LED array 122 is formed on the sealing film 211 so as to connect to the electrode 212.

[0052] Next, as shown in B of Fig. 5, the LED array 122 is sealed with a sealing film 211. The structure of the laminate including the glass substrate, the support substrate, and the multilayer wiring layer is the same as the structure used in flexible OLED (Organic LED) displays, etc. In the structure of the laminate including the glass substrate 251, the support substrate 162, the multilayer wiring layer 163, and the element layer 164 of the present technology, the LED array 122 is mounted on the multilayer wiring layer 163 instead of depositing an organic EL (Electro-Luminescence) film on the multilayer wiring layer.

[0053] 5C, an adhesive 252 for fixing the support substrate is applied onto the element layer 164. It is preferable that a water-soluble material be used as the adhesive 252.

[0054] 6D, the support substrate 253 and the element layer 164 are bonded together via an adhesive 252. The support substrate 253 and the element layer 164 are bonded together using, for example, a vacuum bonding machine. Here, for example, a glass substrate or a PET film is used as the support substrate 253. Considering the subsequent process of bonding the PCB substrate 161 and the support substrate 162, it is desirable to use a glass substrate as the support substrate 253.

[0055] 6E, a laser beam is irradiated from the glass substrate 251 side onto a laminate including the glass substrate 251, the support substrate 162, the multilayer wiring layer 163, the element layer 164, and the support substrate 253. The laser beam passes through the glass substrate 251 and is irradiated onto the support substrate 162 (the interface between the support substrate 162 and the glass substrate 251). A gap is formed between the support substrate 162 and the glass substrate 251 by the irradiation of the laser beam.

[0056] For example, by irradiating the entire surface of the support substrate 162 with laser light, the glass substrate 251 is peeled off from the support substrate 162 as shown in F of Fig. 6. As a method for peeling off the glass substrate 251, LLO (Laser Lift Off) in which laser light is irradiated as described above is generally used, but the glass substrate 251 may be peeled off using other methods.

[0057] Next, as shown in FIG. 7G, a stacked body made up of the support substrate 162, the multilayer wiring layer 163, the element layer 164, and the support substrate 253 is arranged upside down.

[0058] 7H, the laminate is irradiated with laser light from the support substrate 162 side. By irradiating with the laser light, an opening H1 is formed in the support substrate 162. The laser light is irradiated until the signal pad 203 of the multilayer wiring layer 163 is exposed, and the opening H1 is formed so that its cross section is, for example, rectangular.

[0059] Next, as shown in I of Fig. 7, a connecting conductor 191 is applied to the opening H1. The connecting conductor 191 is formed of a material such as solder, anisotropic conductive paste, anisotropic conductive adhesive, or other conductive bonding material. The material of the connecting conductor 191 is determined based on the pressure condition constraints in the subsequent process of bonding the PCB substrate 161 and the support substrate 162.

[0060] 8J, the PCB substrate 161 on which the through electrode 181 is formed is bonded to the support substrate 162. The bonding of the PCB substrate 161 and the support substrate 162 is performed by a method depending on the material of the connection conductor 191, such as reflow or pressure.

[0061] Next, as shown in FIG. 8K, a laminate consisting of the PCB substrate 161, the support substrate 162, the multilayer wiring layer 163, the element layer 164, and the support substrate 253 is arranged upside down.

[0062] 9L, the laminate is irradiated with laser light from the support substrate 253 side. The laser light passes through the support substrate 253 and is irradiated onto the adhesive 252 (the interface between the adhesive 252 and the support substrate 253).

[0063] For example, by irradiating the entire surface of the adhesive 252 with laser light, the support substrate 253 is peeled off from the adhesive 252 as shown by M in Fig. 9. Although the above-mentioned LLO is generally used as a method for peeling off the support substrate 253, other methods may also be used to peel off the support substrate 253.

[0064] 9N, the adhesive 252 is removed by, for example, washing with water. Thereafter, the LED driver 121 and the like are formed on the lower surface side of the PCB substrate 161. Note that the LED driver 121 may be formed on the PCB substrate 161 in advance before the PCB substrate 161 and the support substrate 162 are bonded together. In this manner, the display module 51 is completed.

[0065] The detailed structure of a typical display module will be described with reference to Fig. 10. Fig. 10 is an enlarged cross-sectional view showing a portion of a typical display module.

[0066] 10, a typical display module is configured such that LED chips 141R, 141G, and 141B are arranged on the upper surface of a PCB substrate 161A, and an LED driver 121 is arranged on the lower surface of the PCB substrate 161A. A through electrode 181A that penetrates the PCB substrate 161A is formed on the PCB substrate 161A. The through electrode 181A connects the LED chips 141R, 141G, and 141B to the LED driver 121.

[0067] The PCB substrate 161A used in such a display module has more layers and is more expensive than the PCB substrates used in general LCD displays. It is also generally known that the cost of the PCB substrate 161A increases significantly as the wiring precision increases. Therefore, from a cost perspective, it is difficult to mount the LED chips 141R, 141G, and 141B, which are μ-LEDs that are being developed to reduce the cost of LEDs, on the PCB substrate 161A.

[0068] To solve these problems, the use of a glass substrate instead of the PCB substrate 161A has been considered. Generally, glass substrates are cheaper than PCB substrates and have better wiring accuracy than PCB substrates. In addition, because it is possible to form a circuit using TFTs on the LED chip side of the glass substrate, it is expected that the cost of the display module can be reduced by using cheaper LED drivers provided on the glass substrate.

[0069] 11, when the LED chips 141R, 141G, and 141B are arranged on the upper surface of the glass substrate 251B and the LED driver 121 is arranged on the lower surface of the glass substrate 251B, it is difficult to form the wiring 181B that connects the LED chips 141R, 141G, and 141B to the LED driver 121 so as to penetrate the glass substrate 251B. In this case, for example, the wiring 181B is formed so as to follow the surface or side surface of the glass substrate 251B, but forming the wiring 181B on the side surface of the glass substrate 251B is not desirable for tiling the glass substrate 251B.

[0070] As described above, since there is no established technology for routing wiring on the back side of the tiled glass substrate, it has been difficult to manufacture an LED display by tiling the glass substrate 251B. Furthermore, compared to the PCB substrate 161A, the glass substrate 251B is more susceptible to breaking when physical force is applied, so tiling the glass substrate 251B is not desirable.

[0071] The display module 51 of the present technology is manufactured by forming a laminate consisting of a support substrate 162, a multilayer wiring layer 163, and an element layer 164 on a glass substrate 251, peeling the glass substrate 251 from the laminate, and then bonding the laminate to the PCB substrate 161.

[0072] Since circuits and wiring using TFTs can be formed in the multilayer wiring layer 163 on the glass substrate 251, it is possible to reduce the amount of wiring to be formed on the PCB substrate 161. This makes it possible to reduce the number of layers of the PCB substrate 161 and reduce the cost of the substrate. Furthermore, since the glass substrate 251 is not included in the final structure of the display module 51, there is no need to consider the problem of the glass substrate 251 breaking.

[0073] FIG. 12 is a diagram for explaining the structures of a general display module, a display module using a glass substrate, and a display module 51 according to the present technology, in comparison with each other.

[0074] A general display module structure is called CoB (Chip on Board), and a display module structure using a glass substrate is called CoG (Chip on Glass). The structure of the display module 51 of the present technology is called CoFoB (Chip on Film on Board).

[0075] CoB uses an expensive 8-layer PCB substrate as the substrate. For example, it is possible to implement Mini-LEDs with a chip size of 100 μm or more from a cost perspective, but since the cost increases as the wiring precision of the PCB substrate increases, it is difficult to implement μ-LEDs with a chip size of less than 100 μm from a cost perspective. In addition, the LEDs are driven using a Si-Driver.

[0076] CoG uses an inexpensive glass substrate as the substrate. Because glass substrates have better wiring accuracy than PCB substrates, both Mini-LEDs and μ-LEDs can be mounted on them. LEDs are driven using Si-Drivers or TFTs.

[0077] In CoFoB, an inexpensive two-layer through-hole PCB board is used as the substrate. Since LEDs are mounted on a glass substrate 251 with good wiring accuracy, it is possible to mount both Mini-LEDs and μ-LEDs. In addition, since a circuit using TFTs is formed on the glass substrate 251 with good wiring accuracy, it is possible to drive the LEDs using Si-Drivers or TFTs.

[0078] Therefore, in this technology, it is possible to reduce the cost of the display module 51 by using an inexpensive LED driver provided on the PCB substrate 161 or by implementing μ-LEDs, which are cheaper than Mini-LEDs.

[0079] <4. Modifications> An example in which a double-sided electrode structure is formed on the support substrate 162 FIG. 13 is a cross-sectional view showing a first modified example of the display module 51. As shown in FIG.

[0080] In the structure of the display module 51 described in Fig. 4 and elsewhere, the connection conductor 191 is embedded in the opening H1 formed in the support substrate 162. In contrast to this, in the display module 51 according to the first modification shown in Fig. 13, the signal pad 301a connected to the through electrode 181 is formed on the lower surface of the support substrate 162, and the signal pad 301b connected to the wiring layer 201 is formed on the support substrate 162. In the support substrate 162, the signal pad 301a and the signal pad 301b are connected via wiring.

[0081] 13, a black layer 321 (light absorbing layer) is formed on the element layer 164. The black layer 321 is formed on the light extraction surface side of the display module 51, and has the function of absorbing external light irradiated from the outside. For example, the black layer 321 is made of a black light absorbing material such as resin, carbon nanotubes, or urethane foam.

[0082] An opening H11 for emitting light from the LEDs constituting the LED array 122 to the light extraction surface side is formed in the black layer 321. The opening H11 is formed in the element layer 164 at a position corresponding to the LED array 122.

[0083] 13, one wiring layer 201, electrodes 212, and wiring connecting them are simply shown as a structure formed in the multilayer wiring layer 163, but in reality, multiple wiring layers are formed in the multilayer wiring layer 163, as in the example of FIG. 4. The same applies to the following explanations of the figures.

[0084] A method for manufacturing a display module 51 according to a first modification will be described with reference to FIG.

[0085] 14A, a support substrate 162 is formed on a glass substrate 251, and a multilayer wiring layer 163 is formed on the support substrate 162. An electrode 212 is formed on the upper surface of the multilayer wiring layer 163, and an LED array 122 is formed on the multilayer wiring layer 163 so as to be connected to the electrode 212.

[0086] 14B, the LED array 122 is sealed with the sealing film 211. Furthermore, a black layer 321 is formed so as to have an opening at a position corresponding to the LED array 122.

[0087] Next, a laser beam is irradiated from the glass substrate 251 side onto the laminated body including the glass substrate 251, the support substrate 162, the multilayer wiring layer 163, the element layer 164, and the black layer 321. By irradiating the laser beam, the glass substrate 251 is peeled off from the support substrate 162, as shown in C of FIG.

[0088] 14D, the PCB substrate 161 on which the through electrodes 181 and the LED driver 121 are formed is bonded to the support substrate 162. The PCB substrate 161 and the support substrate 162 are bonded together using, for example, a prepreg substrate. The PCB substrate 161 and the support substrate 162 may also be bonded together using the B2it (Buried Bump Interconnection Technology) method. In this manner, the display module 51 is completed.

[0089] As described above, it is possible to form signal pads 301a and 301b on the front and back surfaces of support substrate 162, respectively, for electrically connecting PCB substrate 161 and multilayer wiring layer 163.

[0090] Example in which the support substrate 162 is not formed FIG. 15 is a cross-sectional view showing a second modified example of the display module 51. As shown in FIG.

[0091] 14 and other drawings, a support substrate 162 is formed, but in the display module 51 according to the second modification shown in FIG. 15, the PCB substrate 161 and the multilayer wiring layer 163 are joined together without the support substrate 162. Here, the through electrodes of the PCB substrate 161 are connected to the wiring layer 201 via signal pads 331 formed on the multilayer wiring layer 163.

[0092] A method for manufacturing a display module 51 according to the second modification will be described with reference to FIGS.

[0093] 16A, a multilayer wiring layer 163 is formed on a glass substrate 251. An electrode 212 is formed on the upper surface of the multilayer wiring layer 163, and an LED array 122 is formed on the multilayer wiring layer 163 so as to connect to the electrode 212.

[0094] 16B, the LED array 122 is sealed with the sealing film 211. Furthermore, a black layer 321 is formed on the element layer 164 so as to leave an opening at a position corresponding to the LED array 122.

[0095] 16C, the support substrate 341 and the black layer 321 are bonded together. The support substrate 253 and the black layer 321 are bonded together, for example, via an adhesive (not shown). Here, the support substrate 341 is, for example, a glass substrate or a PET film.

[0096] Thereafter, a laser beam is irradiated from the glass substrate 251 side onto the laminated body including the glass substrate 251, the multilayer wiring layer 163, the element layer 164, and the black layer 321. The glass substrate 251 is peeled off from the multilayer wiring layer 163 by the irradiation of the laser beam.

[0097] 17D, the PCB substrate 161 on which the through electrode 181 and the LED driver 121 are formed is bonded to the multilayer wiring layer 163. The PCB substrate 161 and the multilayer wiring layer 163 are bonded to each other by using, for example, a prepreg substrate or a B2it method.

[0098] 17E, the support substrate 341 is removed. Note that the support substrate 341 is removed as necessary, and it is also possible for the display module 51 to have a structure in which the support substrate 341 remains. In this manner, the display module 51 is completed.

[0099] As described above, the display module 51 can be manufactured by supporting the resin layer using the support substrate 341 as an interposer substrate, peeling the resin layer off the glass substrate 251, and then joining it to the PCB substrate 161.

[0100] An example in which the surface of the display module 51 on the support substrate 162 side is used as the light extraction surface FIG. 18 is a cross-sectional view showing a third modified example of the display module 51. As shown in FIG.

[0101] In the structure of the display module 51 described in Figure 14 and elsewhere, the PCB substrate 161 is bonded to the support substrate 162, and the black layer 321 is formed on the element layer 164. In contrast, in the display module 51 according to the third modification shown in Figure 18, the PCB substrate 161 is bonded to the element layer 164, and the black layer 321 is formed on the lower surface side of the support substrate 162. In this case, as indicated by the outline arrow, light from the LEDs that make up the LED array 122 is emitted from the support substrate 162 side of the display module 51.

[0102] In the element layer 164, an electrode 212 is formed on the LED array 122, and the electrode 212 is connected via a wiring to an LED pad 361 formed on the lower surface of the element layer 164. The LED pad 361 is connected via a wiring to the wiring layer 201 of the multilayer wiring layer 163.

[0103] Furthermore, a signal pad 362 is formed on the lower surface of the element layer 164, and the signal pad 362 is connected to the wiring layer 201 via wiring. A signal pad 363 is formed on the element layer 164, and the signal pad 363 is connected to the signal pad 362 via wiring. The signal pad 362 is also connected to the LED driver 121 via the through electrode 181. In this way, the signal pads 362 and 363 electrically connect the PCB substrate 161 and the multilayer wiring layer 163.

[0104] A method for manufacturing a display module 51 according to the third modification will be described with reference to FIGS.

[0105] 19A, a support substrate 162 is formed on a glass substrate 251, and a multilayer wiring layer 163 is formed on the support substrate 162. An LED array 122, LED pads 361, and signal pads 362 are formed on the multilayer wiring layer 163, and electrodes 212 are formed on the LED array 122.

[0106] 19B, the LED array 122 is sealed with the sealing film 211. Wiring is formed in the element layer 164, and signal pads 363 are formed on the element layer 164.

[0107] 19C, the PCB substrate 161 on which the through electrode 181 and the LED driver 121 are formed is bonded to the element layer 164. The PCB substrate 161 and the element layer 164 are bonded to each other by using, for example, a prepreg substrate or a B2it method.

[0108] Next, a laser beam is irradiated from the glass substrate 251 side onto the laminated body including the glass substrate 251, the support substrate 162, the multilayer wiring layer 163, the element layer 164, and the PCB substrate 161. By irradiating the laser beam, the glass substrate 251 is peeled off from the support substrate 162, as shown in D of FIG.

[0109] 20E, a black layer 321 is formed on the lower surface side of the support substrate 162 so as to leave an opening at a position corresponding to the LED array 122. In this manner, the display module 51 is completed.

[0110] As described above, it is possible to make the display module 51 have a bottom emission structure in which the support substrate 162 side serves as the light extraction surface.

[0111] An example in which a micro LED driver is formed on the device layer 164 FIG. 21 is a cross-sectional view showing a modified example of the laminate before being bonded to the PCB substrate 161. As shown in FIG.

[0112] In the structure of the display module 51 described in Fig. 13 and elsewhere, the LED driver 121 is formed on the PCB substrate 161. In contrast, in the laminated body made up of the support substrate 162, the multilayer wiring layer 163, and the element layer 164 that constitutes the display module 51 according to the modified example of Fig. 21, the LED driver 381 is formed on the element layer 164.

[0113] The LED driver 381 is configured by, for example, a micro-Si-Driver, and is connected to the wiring layer 201 of the multi-layer wiring layer 163 via wiring.

[0114] In this case, part of the function of the circuit using TFTs that constitutes wiring layer 201 is transferred to LED driver 381, and the circuit using TFTs has a simplified structure. Since Si-Drivers have higher performance than circuits using TFTs, transferring part of the function of the circuit using TFTs to LED driver 381 makes it possible to improve the overall performance of display module 51 for driving LEDs.

[0115] ·others In this specification, a system refers to a collection of multiple components (devices, modules (components), etc.), regardless of whether all the components are contained in the same housing. Therefore, multiple devices housed in separate housings and connected via a network, and a single device with multiple modules housed in a single housing, are both systems.

[0116] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0117] The embodiments of the present technology are not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present technology.

[0118] Configuration combination examples The present technology can also be configured as follows.

[0119] (1) forming a resin layer on a glass substrate, the resin layer having a plurality of light-emitting elements arranged in an array and first wiring for driving the light-emitting elements; Before or after peeling the glass substrate from the resin layer, a printed circuit board on which a second wiring for driving the light emitting element is formed is bonded to the surface of the resin layer opposite to the light extraction surface. A manufacturing method for a display module. (2) A circuit using TFTs is formed on the resin layer. A method for manufacturing the display module described in (1) above. (3) forming a first support substrate on the glass substrate to support the resin layer; The resin layer is formed on the first support substrate. A method for manufacturing the display module according to (1) or (2) above. (4) After forming the resin layer on the first support substrate, the glass substrate is peeled off from the first support substrate; The resin layer and the printed circuit board are joined via the first support substrate. A method for manufacturing the display module described in (3) above. (5) The first support substrate has a through electrode formed therein as an electrode for electrically connecting the resin layer and the printed circuit board. A method for manufacturing the display module according to (3) or (4) above. (6) The first support substrate has electrodes formed on the front and back surfaces thereof for electrically connecting the resin layer and the printed circuit board. A method for manufacturing the display module according to (3) or (4) above. (7) a second support substrate for supporting the resin layer is formed on the light extraction surface side of the resin layer; peeling the glass substrate from the resin layer; The surface of the resin layer opposite to the light extraction surface is bonded to the printed circuit board. A method for manufacturing the display module according to any one of (1) to (6). (8) the resin layer is configured by laminating a wiring layer in which the first wiring is formed and an element layer in which the light-emitting element is formed, forming the wiring layer on the glass substrate; The element layer is formed on the wiring layer. A method for manufacturing the display module according to any one of (1) to (3). (9) The printed circuit board is bonded to the element layer. A method for manufacturing the display module according to (8) above. (10) The element layer has pads formed thereon for electrically connecting the wiring layer and the printed circuit board. A method for manufacturing the display module according to (9) above. (11) The element layer includes a driver for driving the light emitting element. A method for manufacturing a display module according to any one of (8) to (10) above. (12) A driver for driving the light emitting element is formed on the opposite side of the printed circuit board to the surface bonded to the resin layer. A method for manufacturing a display module according to any one of (1) to (10) above. (13) The light emitting element is a micro LED. A method for manufacturing a display module according to any one of (1) to (11) above. (14) The printed circuit board is composed of a two-layer through-hole board. A method for manufacturing the display module according to any one of (1) to (13) above. (15) A light absorbing layer having an opening for absorbing external light irradiated from the outside and emitting light from the light emitting element toward the light extraction surface is formed on the light extraction surface side of the resin layer. A method for manufacturing a display module according to any one of (1) to (14) above. (16) A resin layer having a plurality of light-emitting elements arranged in an array and a first wiring for driving the light-emitting elements formed thereon is formed on a glass substrate, and then Before or after the glass substrate is peeled off from the resin layer, a printed circuit board on which a second wiring for driving the light emitting element is formed is bonded to the opposite side of the light extraction surface of the resin layer. Display module. (17) Configuring a tiling display The display module according to (16) above. (18) a resin layer on which a plurality of light-emitting elements arranged in an array and first wiring for driving the light-emitting elements are formed; a printed circuit board composed of a two-layer through-hole board on which second wiring for driving the light-emitting element is formed; A display module comprising: (19) Configuring a tiling display The display module according to (18) above. [Explanation of symbols]

[0120] 11 Display system, 51 Display module, 121 LED driver, 122 LED array, 141B, 141G, 141R LED chip, 161 PCB substrate, 162 Support substrate, 163 Multilayer wiring layer, 164 Device layer, 181 Through electrode, 191 Connecting conductor, 201 Wiring layer, 202 Resin, 203 Signal pad, 211 Sealing film, 212 Electrode, 251 Glass substrate, 252 Adhesive, 253 Support substrate, 301a, 301b Electrode, 321 Black layer, 331 Signal pad, 361 LED pad, 362, 363 Signal pad, 381 LED driver

Claims

1. forming a resin layer on a glass substrate, the resin layer having a plurality of light-emitting elements arranged in an array and first wiring for driving the light-emitting elements; Before or after peeling the glass substrate from the resin layer, a printed circuit board on which second wiring for driving the light emitting element is formed is bonded to the surface of the resin layer opposite to the light extraction surface. A manufacturing method for a display module.

2. A circuit using TFTs is formed on the resin layer. A method for manufacturing the display module according to claim 1 .

3. forming a first support substrate on the glass substrate to support the resin layer; The resin layer is formed on the first support substrate. A method for manufacturing the display module according to claim 1 or 2.

4. After forming the resin layer on the first support substrate, the glass substrate is peeled off from the first support substrate; The resin layer and the printed circuit board are joined via the first support substrate. A method for manufacturing the display module according to claim 3 .

5. The first support substrate has a through electrode formed therein as an electrode for electrically connecting the resin layer and the printed circuit board. A method for manufacturing the display module according to claim 3 or 4.

6. The first support substrate has electrodes formed on both the front and back surfaces thereof for electrically connecting the resin layer and the printed circuit board. A method for manufacturing the display module according to claim 3 or 4.

7. forming a second support substrate supporting the resin layer on the light extraction surface side of the resin layer; peeling the glass substrate from the resin layer; The surface of the resin layer opposite to the light extraction surface is bonded to the printed circuit board. A method for manufacturing the display module according to any one of claims 1 to 6.

8. the resin layer is configured by laminating a wiring layer in which the first wiring is formed and an element layer in which the light-emitting element is formed, forming the wiring layer on the glass substrate; The element layer is formed on the wiring layer. A method for manufacturing the display module according to any one of claims 1 to 3.

9. The printed circuit board is bonded to the element layer. The method for manufacturing the display module according to claim 8 .

10. The element layer has pads formed thereon for electrically connecting the wiring layer and the printed circuit board. A method for manufacturing the display module according to claim 9.

11. The element layer includes a driver for driving the light emitting element. A method for manufacturing the display module according to any one of claims 8 to 10.

12. A driver for driving the light emitting element is formed on the opposite side of the printed circuit board to the surface bonded to the resin layer. A method for manufacturing the display module according to any one of claims 1 to 10.

13. The light emitting element is a micro LED. A method for manufacturing the display module according to any one of claims 1 to 12.

14. The printed circuit board is composed of a two-layer through-hole board. A method for manufacturing the display module according to any one of claims 1 to 13.

15. A light absorbing layer having an opening for absorbing external light irradiated from the outside and emitting light from the light emitting element toward the light extraction surface is formed on the light extraction surface side of the resin layer. A method for manufacturing the display module according to any one of claims 1 to 14.

16. a resin layer on which a plurality of light-emitting elements arranged in an array and first wiring for driving the light-emitting elements are formed; a printed circuit board composed of a two-layer through-hole board on which second wiring for driving the light-emitting element is formed; A display module comprising:

17. Configuring a tiling display 17. The display module of claim 16.

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