Circuit forming method and circuit forming device

Abstract

A circuit-forming method comprising: a first forming step for forming a resin layer including a recess by a first ejection device that ejects a curable resin; and a second forming step for forming an electrode inside the recess by a second ejection device that ejects a conductive paste with reference to a first mark formed by the first ejection device.　A circuit-forming apparatus comprising: a first ejection device that forms a resin layer including a recess by ejecting a curable resin, and a second ejection device that forms an electrode inside the recess by ejecting a conductive paste with reference to a first mark formed by the first ejection device.

Description

[Technical Field]

[0001] The present invention relates to a circuit forming method in which a resin layer including recesses is formed from a curable resin, and electrodes are formed in the recesses from a conductive paste. [Background technology]

[0002] The following Patent Document describes a technique in which a resin layer including recesses is formed from a curable resin, and electrodes are formed inside the recesses. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 250381 Summary of the Invention [Problem to be solved by the invention]

[0004] The present specification aims to appropriately form electrodes using a conductive paste inside recesses in a resin layer. [Means for solving the problem]

[0005] In order to solve the above problem, the present specification provides a method for forming a resin layer including a recess by a first discharge device that discharges a curable resin, the method comprising: a first forming step of forming a resin layer including a recess by the first discharge device; a first mark forming step of forming a first mark at a position different from the resin layer; a second forming step of discharging a conductive paste into the recess by a second discharging device that discharges a conductive paste while referring to the first mark; and a third forming step of discharging a conductive ink by a third discharging device that discharges a conductive ink. On the resin layer including the recesses a third forming step of forming wiring, and a second mark forming step of forming a second mark at a position different from the resin layer; and a discharging step of discharging conductive paste onto the wiring by the second discharging device with reference to the second mark.

[0006] The present specification also provides a method for manufacturing a resin layer including a recess by discharging a curable resin, a first discharging device for discharging a conductive paste into the recess and onto the wiring, and a method for manufacturing a resin layer including a recess by discharging a conductive ink. On the resin layer including the recesses a third discharge device that forms wiring, the first discharge device forms a first mark at a position different from the resin layer, and the third discharge device forms a second mark at a position different from the resin layer; The second discharge device discharges the conductive paste into the recess. Record number Refer to the mark 1 and when discharging conductive paste onto the wiring, Record number 2 marks, a circuit forming device is disclosed. [Effects of the Invention]

[0007] According to the present disclosure, a resin layer including a recess is formed by a first discharge device that discharges a curable resin, and an electrode is formed inside the recess by a second discharge device that discharges a conductive paste with reference to the first mark formed by the first discharge device. This allows an electrode to be appropriately formed inside the recess of the resin layer using the conductive paste. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing a circuit forming device. [Figure 2] FIG. 2 is a block diagram showing a control device. [Figure 3] FIG. 2 is a cross-sectional view showing a circuit in a state where a resin laminate is formed. [Figure 4] FIG. 10 is a diagram showing a metal mark. [Figure 5] FIG. 2 is a cross-sectional view showing a circuit in a state where wiring is formed on a resin laminate. [Figure 6] FIG. 2 is a cross-sectional view showing a circuit in a state where a resin laminate is formed on a resin laminate. [Figure 7] 10 is a cross-sectional view showing a circuit when a conductive resin paste is discharged into a hole in a resin laminate. FIG. [Figure 8] FIG. 2 is a cross-sectional view showing a circuit in which connection electrodes are formed inside holes in a resin laminate. [Figure 9]FIG. 2 is a cross-sectional view showing a circuit in a state where wiring is formed on a resin laminate. [Figure 10] FIG. 10 is a cross-sectional view showing a circuit in a state where a conductive resin paste is applied onto wiring. [Figure 11] FIG. 2 is a cross-sectional view showing a circuit with electronic components mounted thereon. [Figure 12] 10 is a cross-sectional view showing a circuit when a conductive resin paste is discharged into a hole in a resin laminate. FIG. [Figure 13] 3A and 3B are diagrams showing a metal mark and a resin mark of the first embodiment. [Figure 14] 10A and 10B are diagrams showing a metal mark and a resin mark of a second embodiment. [Figure 15] 10A and 10B are diagrams showing a metal mark and a resin mark of a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] 1 shows a circuit formation apparatus 10 of a first embodiment. The circuit formation apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a mounting unit 26, an imaging unit 27, and a control device (see FIG. 2) 28. The conveying device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the mounting unit 26, and the imaging unit 27 are arranged on a base 29 of the circuit formation apparatus 10. The base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 will be referred to as the X-axis direction, the lateral direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction as the Z-axis direction.

[0010] The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on a base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. The X-axis slide mechanism 30 also includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by the drive of the electromagnetic motor 38. The Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. The stage 52 is held by the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to any position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to any position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

[0011] The stage 52 has a base 60, a holding device 62, and an elevating device 64. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The holding devices 62 clamp both edges in the X-axis direction of a pallet 70 (see FIG. 3) placed on the base 60, thereby fixedly holding the pallet 70. The elevating device 64 is disposed below the base 60 and raises and lowers the base 60.

[0012] The first modeling unit 22 is a unit that models wiring on a pallet 70 placed on the base 60 of the stage 52, and includes a first printing unit 72 and a baking unit 74. The first printing unit 72 has an inkjet head (see FIG. 2) 76 that ejects metal ink in a linear pattern. The metal ink is a dispersion of nanometer-sized metal particles, such as silver particles, in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent aggregation in the solvent. The inkjet head 76 ejects the metal ink from multiple nozzles using, for example, a piezoelectric method using piezoelectric elements.

[0013] The baking unit 74 has an infrared irradiation device 78 (see FIG. 2). The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays, and the metal ink irradiated with infrared rays is baked to form wiring. Note that baking of metal ink is a phenomenon in which, by applying energy, the solvent is vaporized and the protective film on the metal particles, i.e., the dispersant, is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.

[0014] The second modeling unit 23 is a unit that models a resin layer on the pallet 70 placed on the base 60 of the stage 52, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88 that ejects ultraviolet curable resin. The ultraviolet curable resin is a resin that hardens when irradiated with ultraviolet light. The inkjet head 88 may be, for example, a piezo type that uses a piezoelectric element, or a thermal type that heats the resin to generate bubbles and ejects the resin from multiple nozzles.

[0015] The curing unit 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curing resin discharged by the inkjet head 88, for example, by leveling the surface of the ultraviolet curing resin and scraping off excess resin with a roller or blade, thereby making the thickness of the ultraviolet curing resin uniform. The irradiation device 92 is equipped with a mercury lamp or LED as a light source and irradiates the discharged ultraviolet curing resin with ultraviolet light. This hardens the discharged ultraviolet curing resin, forming a resin layer.

[0016] The third modeling unit 24 is a unit that models connections between electrodes and wiring of electronic components on a pallet 70 placed on a base 60 of the stage 52, and includes a third printing unit 100 and a first heating unit 102. The third printing unit 100 includes a dispenser 106 (see FIG. 2) that dispenses conductive resin paste. The conductive resin paste is a resin that hardens when heated at a relatively low temperature and has micrometer-sized metal particles dispersed in it. The metal particles are flake-shaped, and the viscosity of the conductive resin paste is relatively high compared to metal ink. The amount of conductive resin paste dispensed by the dispenser 106 is controlled by the inner diameter of the needle, the pressure during dispensing, and the dispensing time.

[0017] The first heating unit 102 has a heater 108 (see FIG. 2). The heater 108 is a device that heats the conductive resin paste applied by the dispenser 106, and the resin in the heated conductive resin paste hardens. At this time, the resin in the conductive resin paste hardens and shrinks, causing the flake-shaped metal particles dispersed in the resin to come into contact with each other. This allows the conductive resin paste to exhibit conductivity. The resin in the conductive resin paste is an organic adhesive, and exhibits adhesive strength when hardened by heating.

[0018] Furthermore, mounting unit 26 is a unit that mounts electronic components onto pallet 70 placed on base 60 of stage 52, and has supply section 120 and mounting section 122. Supply section 120 has a plurality of tape feeders (see FIG. 2) 124 that feed taped electronic components one by one, and supplies the electronic components at a supply position. Note that supply section 120 is not limited to tape feeders 124, and may also be a tray-type supply device that picks up and supplies electronic components from a tray. Furthermore, supply section 120 may be configured to include both tape-type and tray-type supply devices, or other types of supply devices.

[0019] The mounting unit 122 has a mounting head 126 (see FIG. 2) and a moving device 128 (see FIG. 2). The mounting head 126 has a suction nozzle (not shown) for suctioning and holding electronic components. The suction nozzle sucks and holds the electronic components by air when negative pressure is supplied from a positive / negative pressure supply device (not shown). The positive / negative pressure supply device then supplies a slight positive pressure to the suction nozzle, which then releases the electronic components. The moving device 128 moves the mounting head 126 between the position where the tape feeder 124 supplies electronic components and the pallet 70 placed on the base 60. As a result, in the mounting unit 122, the electronic components supplied from the tape feeder 124 are held by the suction nozzle, and the electronic components held by the suction nozzle are mounted on the pallet 70.

[0020] The imaging unit 27 is a unit that images the pallet 70 placed on the base 60 of the stage 52, and has a camera 130. The camera 130 is disposed above the base 29 in a downward facing position, and images the upper surface of the pallet 70 placed on the base 60 of the stage 52 from above.

[0021] 2, the control device 28 includes a controller 150, multiple drive circuits 152, and an image processing device 154. The multiple drive circuits 152 are connected to the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispenser 106, the heater 108, the tape feeder 124, the mounting head 126, and the moving device 128. The controller 150 includes a CPU, ROM, RAM, etc., and is primarily a computer, and is connected to the multiple drive circuits 152. As a result, the controller 150 controls the operations of the conveyance device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, and the mounting unit 26. The controller 150 is also connected to the image processing device 154. The image processing device 154 processes image data obtained by the camera 130, and the controller 150 acquires various information from the image data.

[0022] In the circuit-forming apparatus 10, a resin laminate is formed on the pallet 70 using the above-described configuration, and wiring is formed on the upper surface of the resin laminate. Then, electrodes of electronic components are electrically connected to the wiring via the conductive resin paste.

[0023] Specifically, the pallet 70 is set on the base 60 of the stage 52, and the stage 52 is moved to below the second modeling unit 23. Then, in the second modeling unit 23, a resin laminate 160 is formed on the pallet 70, as shown in Fig. 3. The resin laminate 160 is formed by repeatedly discharging an ultraviolet curable resin from the inkjet head 88 and irradiating the discharged ultraviolet curable resin with ultraviolet rays by the irradiation device 92.

[0024] More specifically, in the second printing unit 84 of the second modeling unit 23, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the upper surface of the pallet 70. Then, after the ultraviolet curable resin has been ejected in the form of a thin film, in the curing unit 86, the surface of the ultraviolet curable resin is flattened by a flattening device 90 so that the film thickness of the ultraviolet curable resin is uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curable resin with ultraviolet rays. As a result, a thin film resin layer 162 is formed on the pallet 70.

[0025] Next, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film resin layer 162. The thin film of ultraviolet curable resin is then flattened by a flattening device 90, and an irradiation device 92 irradiates the ejected thin film of ultraviolet curable resin with ultraviolet light, thereby laminating a thin film of resin layer 162 on top of the thin film of resin layer 162. In this manner, the ejection of ultraviolet curable resin onto the thin film of resin layer 162, the flattening of the surface of the ultraviolet curable resin, and the curing of the ultraviolet curable resin are repeated, and a plurality of resin layers 162 are laminated to form a resin laminate 160.

[0026] As shown in FIG. 4, the resin laminate 160 is formed in a generally rectangular shape when viewed from above. Then, generally block-shaped first bases 166 are formed on the pallet 70 adjacent to the four corners of the rectangular resin laminate 160. The first bases 166 are formed by the same method as the resin laminate 160. That is, an ultraviolet curable resin is dispensed in a thin film, the surface of the ultraviolet curable resin is flattened by a flattening device 90, and then the ultraviolet curable resin is cured by irradiating the ultraviolet curable resin with ultraviolet rays. This forms a resin layer. Then, by repeating the dispensing of the ultraviolet curable resin, flattening the surface of the ultraviolet curable resin, and curing the ultraviolet curable resin, resin layers are laminated to form the first base 166.

[0027] After the resin laminate 160 and the first base 166 are formed by the above-described procedure, the stage 52 is moved to below the first modeling unit 22. Then, in the first printing unit 72 of the first modeling unit 22, the inkjet head 76 ejects metal ink 168 in a line shape according to the circuit pattern onto the upper surface of the resin laminate 160, as shown in FIG. 5 . Next, in the baking unit 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates infrared rays onto the metal ink 168 ejected according to the circuit pattern. As a result, the metal ink 168 is baked, and wiring 170 is formed on the resin laminate 160.

[0028] 4, in the first modeling unit 22, a metal mark 172 is formed on the first base 166. That is, in the first printing unit 72 of the first modeling unit 22, the inkjet head 76 ejects metal ink 174 in a circular shape onto the first base 166. Next, in the baking unit 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates infrared rays onto the metal ink 174 ejected in a circular shape. As a result, the metal ink 174 is baked, and the metal mark 172 is formed on the first base 166.

[0029] After the wiring 170 and the metal mark 172 are formed, the resin layer 176 is moved below the second modeling unit 23. Then, in the second modeling unit 23, as shown in FIG. 6 , a resin layer 176 is formed on the resin layer 160. The resin layer 176 is formed by the same method as the resin layer 160, but the resin layer 176 has holes 178, and the ends of the wiring 170 formed on the resin layer 160 are exposed in the holes 178. Therefore, when forming the resin layer 176, ultraviolet-curable resin is dispensed onto the upper surface of the resin layer 160 so that the ends of the wiring 170 are exposed. Then, after the surface of the ultraviolet-curable resin is planarized by the planarization device 90, the ultraviolet-curable resin is irradiated with ultraviolet light and cured. This forms a resin layer. The dispensing of the ultraviolet-curable resin onto areas other than the ends of the wiring 170, the planarization of the surface of the ultraviolet-curable resin, and the curing of the ultraviolet-curable resin are repeated, thereby forming the resin layer 176 having the holes 178.

[0030] Once the resin laminate 176 having the holes 178 is formed in this manner, the stage 52 is moved to below the third modeling unit 24. Then, in the third printing unit 100 of the third modeling unit 24, the dispenser 106 dispenses the conductive resin paste into the holes 178 of the resin laminate 176. At this time, the dispenser 106 dispenses the conductive resin paste onto the end of the wiring 170 while referring to the metal mark 172.

[0031] Specifically, after the metal marks 172 are formed in the first modeling unit 22, the stage 52 is moved below the imaging unit 27. Then, in the imaging unit 27, the camera 130 captures images of the four metal marks 172 formed on the first base 166. The imaging data from the captured images is then analyzed in the controller 150, and the positions of the four metal marks 172 are calculated based on the imaging data. This makes it possible to appropriately recognize the formation positions of the wiring 170 formed by the same inkjet head 76 as the metal marks 172.

[0032] The stage 52 moves below the third modeling unit 24, and the operation of the conveying device 20 is controlled based on the position of the metal mark 172 so that the dispenser 106 is positioned above the end of the wiring 170 in the third printing section 100 of the third modeling unit 24. This allows the dispenser 106 and the end of the wiring 170 to be properly aligned. Then, the stage 52 is raised by the operation of the lifting device 64, and as shown in FIG. 7, the tip of the nozzle 180 of the dispenser 106 enters the inside of the hole 178 of the resin laminate 176. This is because the end of the wiring 170 is exposed in the hole 178. When the tip of the nozzle 180 of the dispenser 106 enters the inside of the hole 178, the dispenser 106 dispenses the conductive resin paste. At this time, the dispenser 106 dispenses an amount of conductive resin paste 182 that fills the inside of the hole 178, as shown in FIG. 8. Then, in the first heating section 102 of the third modeling unit 24, the conductive resin paste 182 is heated by the heater 108. As a result, the conductive resin paste 182 becomes conductive and functions as an electrode, thereby electrically connecting the conductive resin paste 182 and the wiring 170. The conductive resin paste 182 is referred to as a connection electrode 184.

[0033] Once the wiring 170 and the connection electrodes 184 are electrically connected in this manner, the stage 52 is moved below the first modeling unit 22. Then, in the first printing unit 72 of the first modeling unit 22, the inkjet head 76 ejects the metal ink 186 in lines in accordance with the circuit pattern onto the upper surface of the resin laminate 176, as shown in FIG. 9 . At this time, the inkjet head 76 ejects the metal ink 186 onto the upper surface of the resin laminate 176 so that one end of the metal ink 186 comes into contact with the connection electrodes 184. Then, in the baking unit 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates the metal ink 186 with infrared rays. As a result, the metal ink 186 is baked, and wiring 188 that is electrically connected to the wiring 170 via the connection electrodes 184 is formed on the resin laminate 176.

[0034] Subsequently, when the wiring 188 is formed on the resin laminate 176, the stage 52 is moved below the third modeling unit 24. Then, in the third printing unit 100 of the third modeling unit 24, the dispenser 106 dispenses the conductive resin paste 190 onto the end of the wiring 188, as shown in FIG. 10 . At this time, the dispenser 106 dispenses the conductive resin paste 190 onto the end of the wiring 188 by referring to the metallic mark 172. That is, the operation of the conveying device 20 is controlled based on the position of the metallic mark 172 so that the dispenser 106 is positioned above the end of the wiring 188. As a result, the dispenser 106 and the end of the wiring 188 are appropriately aligned. Then, after the stage 52 is raised by the operation of the lifting device 64, the dispenser 106 dispenses the conductive resin paste 190 onto the end of the wiring 188.

[0035] Once conductive resin paste 190 has been dispensed onto the ends of wiring 188 in this manner, stage 52 is moved below mounting unit 26. In mounting unit 26, tape feeder 124 supplies electronic component 200 (see FIG. 11 ), which is then held by the suction nozzle of mounting head 126. As shown in FIG. 11 , electronic component 200 is composed of a component body 202 and two electrodes 204 disposed on the underside of component body 202. Mounting head 126 is then moved by moving device 128, and electronic component 200 held by the suction nozzle is mounted on the top surface of resin laminate 176. At this time, electronic component 200 is mounted on the top surface of resin laminate 176 so that electrodes 204 of electronic component 200 come into contact with conductive resin paste 190 dispensed onto wiring 188.

[0036] Once the electronic component 200 is mounted on the resin laminate 176 in this manner, the stage 52 is moved to below the third modeling unit 24. Then, in the first heating section 102 of the third modeling unit 24, the conductive resin paste 190 is heated by the heater 108. As a result, the conductive resin paste 190 exhibits conductivity, and the electrodes 204 are electrically connected to the wiring 188 via the conductive resin paste 190. Furthermore, the adhesive force of the conductive resin paste 190 causes the electronic component 200 to adhere to the wiring 188, thereby fixing the electronic component 200 to the resin laminate 176.

[0037] In this manner, in the circuit forming apparatus 10, the wiring 170 formed on the resin laminate 160 and the wiring 188 formed on the resin laminate 176 are electrically connected via the connection electrode 184 formed in the hole 178 of the resin laminate 176. Then, the electrode 204 of the electronic component 200 is electrically connected to the wiring 188 via the conductive resin paste 190, thereby forming the circuit 210. In particular, the conductive resin paste 182, which is dispensed when forming the connection electrode 184 that connects the wiring 170 and the wiring 188, and the conductive resin paste 190 that connects the wiring 188 and the electrode 204 of the electronic component 200, are dispensed with reference to the metal mark 172. This allows the conductive resin pastes 182 and 190 to be appropriately dispensed onto the wirings 170 and 188, ensuring continuity in the circuit 210.

[0038] However, when the conductive resin paste 182 is dispensed onto the wiring 170, the tip of the nozzle 180 of the dispenser 106 may come into contact with the inner wall surface defining the hole 178 of the resin laminate 176, as shown in FIG. 12 , which may result in damage to the nozzle 180. Even if the nozzle 180 does not come into contact with the inner wall surface defining the hole 178, the nozzle 180 may not properly enter the interior of the hole 178, and the conductive resin paste 182 may not be dispensed into the interior of the hole 178. In such cases, there is a risk of poor dispensing of the conductive resin paste 182, resulting in poor conduction in the circuit. Such poor dispensing, such as the nozzle 180 coming into contact with the inner wall surface defining the hole 178 or the conductive resin paste 182 not being dispensed into the interior of the hole 178, is caused by a relative misalignment between the formation position of the wiring 170 and the formation position of the hole 178 of the resin laminate 176.

[0039] Specifically, the ultraviolet curable resin, which is the material of the resin laminate 176, is heated to approximately 80°C in the inkjet head 88. On the other hand, the metal ink, which is the material of the wiring 170, is heated to approximately 30°C in the inkjet head 76. As described above, the inkjet head 76 and the inkjet head 88 have different heating temperatures, and therefore different expansion coefficients due to heating, resulting in a misalignment in the nozzle pitch between the inkjet head 76 and the inkjet head 88. This causes a relative misalignment between the formation position of the wiring 170 and the formation position of the hole 178 in the resin laminate 176. Furthermore, the mechanical installation accuracy of the inkjet head and individual variations in the inkjet head itself can also cause a relative misalignment between the formation position of the wiring 170 and the formation position of the hole 178. If there is a relative misalignment between the formation position of the wiring 170 and the formation position of the hole 178, when the dispenser 106 discharges the conductive resin paste by referring to the metal mark 172, problems such as abutment of the nozzle 180 and poor discharge of the conductive resin paste can occur.

[0040] In consideration of this, when the conductive resin paste is dispensed onto the wiring 170 through the holes 178 of the resin laminate 176, the dispenser 106 dispenses the conductive resin paste by referring to marks formed with the ultraviolet curable resin, which is the material of the resin laminate 176. Specifically, when the resin laminate 160 and four first bases 166 are formed in the second modeling unit 23, four second bases 220 are also formed adjacent to the four first bases 166, as shown in FIG. 13 . The second bases 220 are formed by the same method as the first bases 166. That is, the ultraviolet curable resin is dispensed in a thin film form, the surface of the ultraviolet curable resin is planarized by the planarization device 90, and then the ultraviolet curable resin is cured by irradiating the ultraviolet curable resin with ultraviolet light. This forms a resin layer. Then, by repeating the dispensing of the ultraviolet curable resin, planarizing the surface of the ultraviolet curable resin, and curing the ultraviolet curable resin, resin layers are stacked to form the second bases 220.

[0041] When the four second bases 220 are formed in this manner, a resin mark 222 is formed on each second base 220 using ultraviolet curing resin. The resin mark 222 is formed by a method different from that used for forming the second base 220. Specifically, the ultraviolet curing resin is discharged in the form of a thin film, and the surface of the ultraviolet curing resin is not planarized by the planarization device 90, but is cured by irradiating the ultraviolet curing resin with ultraviolet rays. This forms a resin layer. Then, by repeating the discharging of the ultraviolet curing resin and the curing of the ultraviolet curing resin, resin layers are stacked and the resin mark 222 is formed. The resin mark 222 is formed in a generally circular shape.

[0042] Then, once the resin marks 222 are formed on the second bases 220, the stage 52 is moved below the imaging unit 27. Then, in the imaging unit 27, the camera 130 captures images of the four resin marks 222 formed on the four second bases 220. The imaging data from the capture is then analyzed by the controller 150, and the positions of the four resin marks 222 are calculated based on the imaging data. This makes it possible to appropriately recognize the formation positions of the holes 178 in the resin laminate 176, which are formed by the same inkjet head 88 as the resin marks 222.

[0043] The resin mark 222 is formed from the same material as the second base 220, i.e., UV-curable resin, but is formed using a different method than the second base 220. Therefore, the position of the resin mark 222 can be appropriately calculated using the imaging data of the resin mark 222. Specifically, if the resin mark is formed using the same method as the second base, the reflectance of the surface of the resin mark and the reflectance of the surface of the second base are substantially the same because the resin mark is formed from the same material as the second base. When the reflectance of the surface of the resin mark and the reflectance of the surface of the second base are substantially the same, it is difficult to recognize the outer edge of the resin mark formed on the second base based on the imaging data. Meanwhile, during the formation of the second base 220, as described above, the surface of the UV-curable resin is planarized by the planarization device 90 before UV light is irradiated onto the UV-curable resin. Therefore, although the surface of the second base 220 is flat, there are very small microscopic irregularities. On the other hand, when forming the resin mark 222, the surface of the ultraviolet curing resin is irradiated with ultraviolet rays without being planarized by the planarization device 90. Therefore, although the surface of the resin mark 222 is not flat, there are almost no microscopic irregularities due to the surface tension of the ultraviolet curing resin, etc. Therefore, the reflectance of the surface of the resin mark 222 and the reflectance of the surface of the second base 220 differ, and the outer edge of the resin mark 222 formed on the second base 220 can be properly recognized based on the imaging data. As a result, the position of the resin mark 222 can be properly calculated based on the imaging data of the resin mark 222.

[0044] In this way, when the position of the resin mark 222 is calculated based on the imaging data, the dispenser 106 dispenses the conductive paste onto the wiring 170 through the hole 178 of the resin laminate 176 based on the calculated position of the resin mark 222. In other words, when the conductive resin paste is dispensed onto the wiring 170 through the hole 178, the operation of the conveyance device 20 is controlled based on the position of the resin mark 222 so that the dispenser 106 is positioned above the hole 178 in the third printing unit 100 of the third modeling unit 24. As a result, the nozzle 180 of the dispenser 106 and the hole 178 are appropriately aligned in the vertical direction. Then, when the stage 52 is raised by the operation of the lifting device 64, the tip of the nozzle 180 of the dispenser 106 appropriately enters the inside of the hole 178, as shown in FIG. 7 . At this time, the dispenser 106 dispenses the conductive resin paste, and the conductive resin paste is dispensed onto the wiring 170 exposed inside the hole 178. In this way, the dispenser 106 discharges the conductive resin paste by referring to the resin mark 222, so that the conductive resin paste can be appropriately discharged onto the wiring 170 through the hole 178 of the resin laminate 176. This makes it possible to prevent the nozzle 180 from coming into contact with the inner wall surface that defines the hole 178, and prevent the conductive resin paste from being discharged improperly.

[0045] 10 , when the conductive resin paste is dispensed onto the wiring 188 without passing through the hole 178, dispenser 106 dispenses the conductive resin paste while referring to metal mark 172. This makes it possible to appropriately dispense the conductive resin paste onto wiring 188, and ensures electrical continuity between wiring 188 and electrode 204 of electronic component 200.

[0046] That is, in circuit forming apparatus 10, when the conductive resin paste is dispensed into hole 178, dispenser 106 dispenses the conductive resin paste while referring to resin mark 222, and when the conductive resin paste is dispensed onto wiring 188, dispenser 106 dispenses the conductive resin paste while referring to metal mark 172. This prevents nozzle 180 from coming into contact with the inner wall surface defining hole 178, preventing poor discharge of the conductive resin paste, and ensuring electrical continuity between wiring 188 and electrode 204 of electronic component 200.

[0047] In the first embodiment, as shown in FIG. 13, the metal mark 172 is formed on the first base 166, and the resin mark 222 is formed on the second base 220. On the other hand, in the second embodiment, as shown in FIG. 14, the metal mark 172 is formed on the first base 166, and the resin mark 222 is formed on the metal mark 172. The outer diameter of the resin mark 222 is smaller than that of the metal mark 172. By forming the resin mark 222 on the metal mark 172 in this way, it is possible to reduce the arrangement space for the metal mark 172 and the resin mark 222. Furthermore, there is no need to form the second base 220, which can shorten the production time and reduce costs.

[0048] In the second embodiment, as shown in FIG. 15 , a metal mark 172 is formed on a first base 166, and a circular resin mark 250 is formed on the metal mark 172. The outer diameter of the resin mark 250 is smaller than the outer diameter of the metal mark 172. When the circular resin mark 250 is formed on the metal mark 172 in this manner, the metal mark 172 is exposed through a central cavity 252 of the resin mark 250 when viewed from above. The controller 150 then calculates the position of the resin mark 250 by recognizing the boundary between the inner wall surface defining the central cavity 252 of the resin mark 250 and the outer edge of the metal mark 172 exposed through the cavity 252 based on the imaging data. This allows the position of the resin mark 250 to be calculated appropriately.

[0049] 2, the controller 150 of the control device 28 has a first forming unit 260, a second forming unit 262, a third forming unit 264, a fourth forming unit 266, and a discharging unit 268. The first forming unit 260 is a functional unit for forming the resin laminates 160 and 176, the first base 166, the second base 220, and the resin mark 222. The second forming unit 262 is a functional unit for forming the connection electrode 184 inside the hole 178 by referring to the resin mark 222. The third forming unit 264 is a functional unit for forming the wiring 188. The fourth forming unit 266 is a functional unit for forming the resin mark 222 on the metal mark 172. The discharging unit 268 is a functional unit for discharging the conductive resin paste onto the wiring 188 by referring to the metal mark 172.

[0050] In the above embodiment, the circuit forming apparatus 10 is an example of a circuit forming apparatus. The inkjet head 76 is an example of a third discharging apparatus. The inkjet head 88 is an example of a first discharging apparatus. The flattening apparatus 90 is an example of a flattening apparatus. The dispenser 106 is an example of a second discharging apparatus. The metal mark 172 is an example of a second mark. The resin laminate 176 is an example of a resin layer. The hole 178 is an example of a recess. The connection electrode 184 is an example of an electrode. The wiring 188 is an example of a wiring. The second base 220 is an example of a base. The resin mark 222 is an example of a first mark. The resin mark 250 is an example of a first mark. The process performed by the first forming unit 260 is an example of a first forming process. The process performed by the second forming unit 262 is an example of a second forming process. The process performed by the third forming unit 264 is an example of a third forming process. The process performed by the fourth forming unit 266 is an example of a fourth forming process. The process performed by the discharging unit 268 is an example of a discharging process.

[0051] The present invention is not limited to the above-described embodiments, and can be embodied in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the second embodiment, the resin mark 222 is formed on the metal mark 172, but the metal mark 172 may be formed on the resin mark 222. Furthermore, in the second embodiment, the annular resin mark 250 is formed on the metal mark 172, but the annular metal mark may be formed on the resin mark 222.

[0052] Furthermore, in the above embodiment, when forming the second base 220, the surface of the ultraviolet curing resin is planarized before ultraviolet rays are irradiated onto the ultraviolet curing resin, and when forming the resin mark 222, the surface of the ultraviolet curing resin is irradiated with ultraviolet rays without being planarized. On the other hand, when forming the resin mark 222, the surface of the ultraviolet curing resin may be planarized before ultraviolet rays are irradiated onto the ultraviolet curing resin, and when forming the second base 220, the surface of the ultraviolet curing resin may be irradiated with ultraviolet rays without being planarized.

[0053] Furthermore, in the above embodiment, the connection electrode 184 is formed inside the hole 178 of the resin laminate 176, i.e., inside a through hole that penetrates the resin laminate 176, but the connection electrode may also be formed inside a bottomed hole of the resin laminate 176.

[0054] Furthermore, in the above embodiment, the resin laminates 160, 176 are formed from ultraviolet curable resin, but the resin laminates may also be formed from various curable resins such as thermosetting resin, thermoplastic resin, and two-component mixed curable resin. [Explanation of symbols]

[0055] 10: Circuit forming device (modeling device) 76: Inkjet head (third discharging device) 88: Inkjet head (first discharging device) 90: Flattening device 106: Dispenser (second discharging device) 172: Metal mark (second mark) 176: Resin laminate (resin layer) 178: Hole (recess) 184: Connection electrode (electrode) 220: Second base (base) 222: Resin mark (first mark) 250: Resin mark (first mark) 260: First forming unit (first forming process) 262: Second forming unit (second forming process) 264: Third forming unit (third forming process) 266: Fourth forming unit (fourth forming process) 268: Discharging unit (discharging process)

Claims

1. a first forming step of forming a resin layer including recesses by a first ejection device that ejects a curable resin; a first mark forming step of forming a first mark at a position different from the resin layer by the first discharge device; a second forming step of discharging a conductive paste into the recess by a second discharging device that discharges the conductive paste while referring to the first mark; a third forming step of forming wiring on the resin layer including the recesses by a third ejection device that ejects conductive ink; a second mark forming step of forming a second mark at a position different from the resin layer by the third discharge device; a discharging step of discharging conductive paste onto the wiring by the second discharging device with reference to the second mark; A circuit forming method comprising:

2. 2. The circuit forming method according to claim 1, further comprising a fourth forming step of forming one of the first mark and the second mark in a state where the one of the first mark and the second mark is superimposed on the other.

3. The fourth forming step includes:

3. The circuit forming method according to claim 2, wherein one of the first mark and the second mark is formed in a ring shape.

4. a step of discharging a curable resin using the first discharging device, flattening a surface of the curable resin using a flattening device, and then curing the curable resin to form a base; a step of discharging a curable resin onto the base by the first discharging device, and curing the curable resin without planarizing a surface of the curable resin by the planarizing device, thereby forming the first mark; 4. The circuit forming method according to claim 1, further comprising the first forming step including:

5. a first ejection device that ejects a curable resin to form a resin layer including recesses; a second discharge device that discharges conductive paste into the recess and onto the wiring; a third ejection device that ejects a conductive ink to form wiring on the resin layer including the recesses; Equipped with the first discharge device forms a first mark at a position different from the resin layer; the third discharge device forms the second mark at a position different from the resin layer; The second discharge device refers to the first mark when discharging the conductive paste inside the recess, and refers to the second mark when discharging the conductive paste onto the wiring.

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