Component mounting device and component mounting method

Abstract

To provide a component mounting device which can suppress reduction in mounting accuracy of a component by suppressing contact between components in the time of component mounting.SOLUTION: A component mounting device comprises: a head movement part which moves a head that holds a component; and a component mounting part which mounts the component to a substrate with the head. The component mounting device comprises: a frame setting part which sets a frame in the periphery of the mounting position where the component is mounted on the substrate on the basis of component mounting information for mounting the component on the substrate including information about an angle error with respect to the mounting posture of the component on the substrate; an overlapping determination part which determines whether or not the frame set by the frame setting part overlaps the mounted component that has been already mounted on the substrate; and a mounting condition decision unit which decides a mounting condition by the component mounting part according to the determination result by the overlapping determination part.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] A component mounting device that sets the movement speed during component mounting taking into account the distance between components is known. This component mounting device includes: a component mounting means that adjusts the relative position of a head having a nozzle holding a component to be mounted and the circuit board to mount the component on the circuit board in the horizontal and vertical directions in accordance with a mounting program; an adjacent distance calculation means that calculates the adjacent distance between the components to be mounted on the circuit board using the mounting program; and a mounting machine control means that automatically operates the component mounting means by changing one or more parameters (operating speed, acceleration, timing) of the component mounting means when the adjacent distance is within a predetermined range compared to when the adjacent distance is outside the predetermined range (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-252495 Summary of the Invention [Problem to be solved by the invention]

[0004] The component mounting device in Patent Document 1 does not take into account the orientation of the components when they are mounted. In other words, when mounting components on a circuit board using a head with a nozzle, the components may be mounted on the circuit board at an angle, deviating from the intended mounting orientation. In this case, even if the distance between components is within the allowable range, the components may come into contact with each other during mounting, potentially reducing the accuracy of component mounting.

[0005] The present disclosure provides a component mounting device and a component mounting method that can prevent components from coming into contact with each other during component mounting and prevent a decrease in component mounting accuracy. [Means for solving the problem]

[0006] One aspect of the present disclosure is a component mounting device having a head moving unit that moves a head that holds a component, and a component mounting unit that mounts the component on a board using the head, the component mounting device also comprising: a frame setting unit that sets a frame around a mounting position on the board where the component is to be mounted, based on component mounting information for mounting the component on the board, which includes information on an angle error with respect to the mounting attitude of the component on the board; an overlap determination unit that determines whether the frame set by the frame setting unit overlaps with a mounted component that has already been mounted on the board; and a mounting condition determination unit that determines mounting conditions for the component mounting unit in accordance with the determination result by the overlap determination unit.

[0007] One aspect of the present disclosure is a component mounting method for mounting a component on a board using a movable head that holds the component, the component mounting method including the steps of: setting a frame around a mounting position on the board where the component is to be mounted, based on component mounting information for mounting the component on the board, the frame including information on an angle error relative to the mounting attitude of the component on the board; determining whether the set frame overlaps with a mounted component already mounted on the board; and determining mounting conditions for mounting the component depending on the determination result of whether the frame overlaps with the already mounted component. [Effects of the Invention]

[0008] According to the present disclosure, contact between components during component mounting can be suppressed, thereby suppressing a decrease in component mounting accuracy. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a top view illustrating a mechanical configuration of a component mounting device according to a first embodiment; [Figure 2] FIG. 2 is a side view illustrating a mechanical configuration of the component mounting device shown in FIG. [Figure 3] FIG. 3 is a perspective view illustrating the operation of the moving head shown in FIG. 2; [Figure 4] FIG. 2 is a block diagram illustrating the functional configuration of a control unit of the component mounting device shown in FIG. 1; [Figure 5] FIG. 10 is a diagram showing an example of information stored in attachment data. [Figure 6] FIG. 10 is a diagram showing an example of information stored in part data. [Figure 7] FIG. 1 is a diagram showing an example of a frame and a plurality of components P mounted on a board. [Figure 8] Flowchart showing an example of operation of the component mounting device DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with appropriate reference to the drawings. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0011] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Furthermore, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0012] <Mechanical configuration of the component placement device> First, the mechanical configuration of the component mounting device 1 will be described with reference to Figures 1 and 2. Figure 1 is a top view illustrating the mechanical configuration of the component mounting device 1 according to the first embodiment. Figure 2 is a side view illustrating the mechanical configuration of the component mounting device 1 shown in Figure 1. In Figures 1 and 2, the front side of the component mounting device 1 (the lower side in Figure 1 and the left side in Figure 2) is also referred to as the front side, and the back side of the component mounting device 1 (the upper side in Figure 1 and the right side in Figure 2) is also referred to as the rear side.

[0013] 1 and 2, and in some parts described below, the X direction (left-right direction in FIG. 1) in the board transport direction and the Y direction (up-down direction in FIG. 1) perpendicular to the board transport direction are shown as two axial directions that are perpendicular to each other in a horizontal plane. The Z direction is also shown as a height direction perpendicular to the horizontal plane. The Z direction is the vertical direction or the perpendicular direction when the component mounting apparatus 1 is installed on a horizontal plane.

[0014] One or more component mounting devices 1 are arranged in a mounting board manufacturing line for attaching various components P to a board W to manufacture the board, and mount the components P in a predetermined position and posture on the board W transported from upstream of the mounting board manufacturing line.

[0015] As shown in Figures 1 and 2, the component mounting apparatus 1 is mainly configured to include a main body mechanism unit 10 that mounts (mounts) components P (e.g., electronic components such as ICs (Integrated Circuits), transistors, and capacitors, BGA (Ball Grid Array) components, or CSPs (Chip Size Packages)) on a board W through the operation of each mechanism, and a control unit 40 that controls the operation of the main body mechanism unit 10. The main body mechanism unit 10 has a mounting machine main body 11 that is configured with a base 12 and the like, and a head unit 23 that is configured to be movable relative to the mounting machine main body 11. The control unit 40 is housed inside the base 12 (see below) of the component mounting apparatus 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

[0016] 1 (the conveying direction of the board W). The board conveying mechanism 13 has a pair of conveyor units 14 extending along the X direction, and conveys the board W placed on the pair of conveyor units 14, and positions and holds the board W at a predetermined mounting position.

[0017] A pair of front and rear component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13 (on the top and bottom sides in the plane of FIG. 1, and on the left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and a plurality of tape feeders 18 are attached in parallel to the slot 17 as component feeders.

[0018] The component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage unit 20 having a plurality of wheels disposed on its underside, and a plurality of reel stock units (not shown) disposed above the carriage unit 20. A reel 21 is housed in each of the plurality of reel stock units. A carrier tape 22 containing a component P is drawn out from each of the reels 21, and the component P is supplied to a tape feeder 18 of the component supply mechanism 15. As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feed direction, thereby supplying the component P to a pick-up position where the component P is picked up by a moving head 26 of a head unit 23, which will be described below.

[0019] Head unit 23 is disposed above base 12 and is configured to be movable between a mounting position and a removal position where component supply mechanism 15 and substrate W are disposed. Specifically, head unit 23 is movable linearly along the X and Y directions by an X-axis table mechanism 25 and a Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of substrate W.

[0020] A Y-axis table mechanism 24 is disposed on the upper surface of the base 12 along the Y direction. A pair of front and rear X-axis table mechanisms 25 are also disposed along the X direction and are attached to the Y-axis table mechanisms 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 can be arbitrarily positioned on a plane substantially parallel to the surface of the substrate W, i.e., on a horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured by linear guide drive mechanisms.

[0021] A component recognition camera 28 (an example of an imaging unit) is disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. A component holding nozzle 27 (see below) attached to the moving head 26 picks up and holds a component P from the component supply mechanism 15 and passes above the component recognition camera 28. At this time, the component recognition camera 28 captures an image of the component P sucked and held by the component holding nozzle 27 as it passes by, at least once at a predetermined timing. The imaging result (captured image) is subjected to a recognition process to identify and detect the position of the component P.

[0022] Furthermore, a nozzle holder 38 and a disposal box 37 are disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores multiple types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (described below) suitable for the component to be held is attached to the moving head 26. The disposal box 37 is formed in a box shape and has an internal space, into which components P, etc. determined to be defective as a result of image recognition by the component recognition camera 28, are discarded.

[0023] <Configuration and operation of the moving head> Next, the configuration and operation of the moving head 26 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 shown in Fig. 2.

[0024] As shown in FIG. 3, the moving head 26 is a multiple head (not shown) having a plurality of moving heads 26, and a plurality of component holding nozzles 27 are arranged side by side at the lower end of each moving head 26.

[0025] Each of the component holding nozzles 27 individually lifts and lowers a component P from the tape feeder 18 of the component supply mechanism 15 by vacuum suction, for example, using air pressure. The moving head 26 also includes a Z-axis lifting mechanism (not shown) that individually lifts and lowers each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) that individually rotates each of the component holding nozzles 27 about its nozzle axis. The Y-axis table mechanism 24 and the X-axis table mechanism 25 are driven to position the moving head 26 arbitrarily in the horizontal plane (XY plane). This movement causes the moving head 26 to pick up a component P from the pick-up position of the tape feeder 18 of the component supply mechanism 15 using the component holding nozzles 27.

[0026] A board recognition camera 36 (see FIG. 1) is fixed to the moving head 26 and is disposed on the underside of the X-axis table mechanism 25, moving integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and captures an image of the board W. This image capture result (image capture information) is similarly subjected to recognition processing, and the position and posture of the board W are detected.

[0027] As a result of detecting the position of the board W, the moving head 26 places components P at their respective placement points (e.g., placement positions and placement orientations on the board W where the components P should be placed) using their component holding nozzles 27 in accordance with instructions from the control unit 40. This placement of components P at one time is carried out until all of the components P sucked and held by each of the component holding nozzles 27 of the moving head 26 are placed on the board W. In this way, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the take-out position and the placement operation position, and are finally placed on the board W.

[0028] The component mounting device 1 repeatedly performs a series of operations, such as removing multiple components P using the component holding nozzle 27 of the moving head 26, placing them, and then moving the moving head 26 back to the removal position, until placement at all of the multiple placement points on the board W is completed. By repeating this operation, a large number of components P are sequentially placed on each of the sequentially transported boards W, and after placement, the boards W on which all of the components P have been placed are transported to a downstream process. In this way, the mounting machine main body 11 and the head unit 23 operate in coordination, and this coordinated operation is executed in accordance with instructions from the control unit 40.

[0029] In addition, in the first embodiment, a series of work units consisting of the forward movement from the removal of component P at the removal position to the mounting operation position of component P, and the subsequent return movement to the removal position, is also referred to as a work unit of "one turn." The forward movement from the removal position to the mounting operation position in one turn is also referred to simply as "forward movement in one turn" below.

[0030] <Software configuration of component placement device> Next, the software configuration (functional configuration) of the control unit 40 of the component mounting device 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram illustrating an example of the functional configuration of the control unit 40 of the component mounting device 1 shown in Fig. 1.

[0031] The control unit 40 of the component mounting apparatus 1 is configured by a general-purpose computer, and a program as software stored in a storage device such as a ROM (Read Only Memory) or RAM (Random Access Memory) of the computer is executed by an arithmetic unit such as a CPU (Central Processing Unit). That is, each block shown in the control unit 40 in Fig. 4 represents a function realized by software such as a program. However, the function represented by each block is not limited to software, and each may be configured by hardware as a physical configuration of the "apparatus."

[0032] 4, the control unit 40 includes a memory unit 41, a mechanism driving unit 46, an image capturing processing unit 47, a frame setting unit 51, an overlap determination unit 52, and a placement condition determination unit 53. The memory unit 41 stores and holds at least placement data 42 and component data 43. The image capturing processing unit 47 includes a camera control unit 48 and a component recognition unit 50. The placement data 42 and the component data 43 are examples of component placement information for placing components P on a board W.

[0033] 5 is a diagram showing an example of information stored in the placement data 42. The placement data 42 includes information related to the placement of components P. The placement data 42 stores, for example, information about each component P to be placed on each board W, as well as information such as the placement position and placement orientation (placement posture) of each component P on the board W. In FIG. 5, the information in the placement data 42 is shown in a table format, and may be displayed on a display unit (not shown) of the component placement apparatus 1.

[0034] The placement data 42 includes, for example, information on a sequence number, a component code, a placement position, and a placement orientation. The sequence number indicates the placement order; for example, sequence number 1 indicates that the component is placed first. The component code is a code indicating the type of the component P to be placed. Detailed information on the component P is stored in the component data 43. The placement position is information indicating the placement position of the component P to be placed. The placement position is indicated, for example, by X and Y coordinates on a two-dimensional plane, and is the relative coordinate of the component P with respect to the board W, but the placement position may be indicated by other coordinates. The placement orientation is information indicating the inclination with respect to a reference orientation (reference posture) (e.g., the front direction of the component placement device 1). The placement orientation is indicated, for example, by an angle θ1 with respect to the reference orientation. The angle θ1 is an angle indicating the correct placement posture, such as 0 degrees or 90 degrees, and is not an unintended angle (angle error). The placement data 42 may be acquired as production data from an external device via communication or the like.

[0035] 6 is a diagram showing an example of information stored in the component data 43. The component data 43 includes information about the component P to be mounted. The component data 43 stores information such as the outer shape of each type of component P, the presence or absence of electrodes, or the number of electrodes. In FIG. 6, the information in the component data 43 is shown in a table format, and may be displayed on a display unit (not shown) of the component mounting apparatus 1.

[0036] Component data 43 specifically includes information on the component code of component P, the type (component type) of component P, the size of component P, and the angular error θ2 (estimated angular error) expected when component P is mounted. The component code is a code indicating the type of component P to be mounted. The component type is a name (e.g., BGA) that specifically indicates the type of component P corresponding to the component code. The size information includes, for example, information on the horizontal length, vertical length, and height length of component P. The horizontal direction is one direction in a two-dimensional plane along the surface of the board W when the component is mounted, the vertical direction is a direction perpendicular to that direction in the two-dimensional plane, and the height direction is a direction perpendicular to the two-dimensional plane. The angular error θ2 indicates an angular deviation from the mounting orientation (mounting direction) of the component P to be mounted on the board W. The angular error θ2 may be information determined according to the type or size of component P. For example, the angular error θ2 in FIG. 6 may indicate information on the maximum angular error expected for the component P to be mounted.

[0037] 4, camera control unit 48 of imaging processing unit 47 controls component recognition camera 28, for example, controlling the timing of imaging by component recognition camera 28. Component recognition unit 50 recognizes the position, orientation, polarity, etc. of component P based on the image captured by component recognition camera 28. Based on the recognition result by component recognition unit 50, head unit 23 uses its moving head 26 to mount component P on board W in a predetermined position and orientation.

[0038] The imaging information of the board recognition camera 36 is also transmitted to the imaging processing unit 47. Similar to the component recognition unit 50, the imaging processing unit 47 recognizes the position and posture of the board W based on the imaging information (images captured by the board recognition camera 36) and transmits the recognition result to the mechanism driving unit 46. The mechanism driving unit 46 controls the main body mechanism unit 10, for example, controlling the driving of the board transport mechanism 13, the component supply mechanism 15, and the head unit 23 so that they operate in coordination with one another. The mechanism driving unit 46 may control the main body mechanism unit 10 based on the recognition result of the position and posture of the board W recognized by the imaging processing unit 47.

[0039] The frame setting unit 51 sets a frame WK around a placement position (placement area) on the board W where a component P will be placed. In other words, the frame WK is set around an unplaced component P1 that has not yet been placed on the board W. The frame WK is a virtual frame, not an actual physical frame installed on the board to be placed. The frame setting unit 51 sets the frame WK based on component placement information. The frame setting unit 51 may set the frame WK based on, for example, the distance between adjacent components or an angular error θ2 expected when placing the component P to be placed. When placing the component P on the board W, there is a possibility that the component P will have some angular variation (error) with respect to the specified placement orientation, and this angular variation is the angular error θ2. The angular error θ2 is, for example, an angle of 10 degrees or less. The frame setting unit 51 may also set the frame WK based on the distance between an already-placed component P2 that has already been placed on the board W and an unplaced component P1 that is the target of placement. The area of ​​the frame WK corresponds to the area where each component P is expected to be mounted on the board W, taking into account the positional deviation and the angle error θ2.

[0040] The frame WK may include an angular error consideration frame WK1 that is a frame that takes the angular error θ2 into account, and an angular error non-consideration frame WK2 that is a frame that does not take the angular error θ2 into account. The frame setting unit 51 may determine the type of frame WK based on the type of component P (i.e., the component code). That is, based on the type of component P, it may determine whether to set the angular error consideration frame WK1 or the angular error non-consideration frame WK2. Furthermore, the frame setting unit 51 may display the frame WK on a display unit (not shown), and may, for example, display the frame WK together with at least one of the board W and the component P.

[0041] Furthermore, the frame setting unit 51 may determine the type of frame WK based on the size of the part P. If the size of the part P is equal to or greater than a predetermined size threshold, the frame setting unit 51 may set an angle error consideration frame WK1. If the size of the part P is less than the predetermined size threshold, the frame setting unit 51 may set an angle error non-consideration frame WK2.

[0042] For example, the frame setting unit 51 may determine the type of frame WK based on the type of component P. When the type of component P is a relatively complex component (e.g., a package component such as a BGA or CSP), the frame setting unit 51 may set an angle error consideration frame WK1. When the type of component P is a relatively simple component (e.g., a simple element or chip component such as a resistor or capacitor), the frame setting unit 51 may set an angle error non-consideration frame WK2.

[0043] The overlap determination unit 52 determines whether the frame WK set by the frame setting unit 51 overlaps with the already-placed component P2 on the board W. The frame WK overlaps with the already-placed component P2 means that the range in which the not-yet-placed component P1 to be placed, which is assumed taking into account positional and orientation deviations (angle errors), overlaps with the range in which the already-placed component P2 has been placed. Therefore, when the frame WK overlaps with the already-placed component P2, this means that there is a possibility that the already-placed component P2 and the not-yet-placed component P1 to be placed may come into contact with each other, depending on the positional and orientation deviations that occurred during placement.

[0044] The placement condition determination unit 53 determines the placement conditions for placing components P on the board W. The placement conditions include, for example, the placement speed, placement acceleration, or placement timing for placing components P on the board W. The placement speed can also be referred to as the operating speed of the component placement operation. The placement speed may include at least one of the movement speed of the moving head 26 in the X and Y directions along the board W and the movement speed of the moving head 26 in the Z direction perpendicular to the board W. In other words, the movement speed of the component P in the X, Y, and Z directions may be adjusted. This allows the component placement apparatus 1 to improve the accuracy of the placement operation of the components P and prevent adjacent components from contacting each other.

[0045] The placement condition determination unit 53 determines the placement conditions according to the determination result by the overlap determination unit 52. For example, if the placement condition determination unit 53 determines that the frame WK and the already-placed component P2 overlap, it may set the placement speed to speed V1 (low speed) and place the component P at a predetermined placement position in a predetermined placement orientation (placement posture). If the placement condition determination unit 53 determines that the frame WK and the already-placed component P2 do not overlap, it may set the placement speed to speed V2 (high speed) that is faster than speed V1 and place the component P at a predetermined placement position in a predetermined placement orientation.

[0046] When the mounting speed is low, the component mounting device 1 can easily mount the component P while maintaining the desired mounting posture, since the posture of the component P is stable when the component P is moved using the head unit 23 or when the component P comes into contact with the board W and is mounted. Conversely, when the mounting speed is high, the posture of the component P is less stable when it is moved or mounted, but the time required for mounting can be reduced.

[0047] For example, when it is determined that the frame WK and the already-placed component P2 overlap, the placement condition determination unit 53 may set the placement acceleration to acceleration AC1 (small acceleration) and place the component P at a predetermined placement position in a predetermined placement orientation. When it is determined that the frame WK and the already-placed component P2 do not overlap, the placement condition determination unit 53 may set the placement acceleration to acceleration AC2 (large acceleration) greater than acceleration AC1 and place the component P at a predetermined placement position in a predetermined placement orientation.

[0048] When the mounting acceleration is small, the component P is more easily mounted while maintaining the desired mounting posture when it is moved using the head unit 23 or when it is placed in contact with the board W. However, when the mounting acceleration is large, it becomes more difficult to stabilize the posture of the component P when it is moved or placed, but the time required for mounting can be reduced.

[0049] For example, if it is determined that the frame WK and the already-placed component P2 overlap, the placement condition determination unit 53 may set the placement timing to a first timing T1 (late timing) and place the component P at a predetermined placement position in a predetermined placement orientation. If it is determined that the frame WK and the already-placed component P2 do not overlap, the placement condition determination unit 53 may set the placement timing to a second timing T2 (early timing) that is earlier than the first timing T1 and place the component P at a predetermined placement position in a predetermined placement orientation. The placement condition determination unit 53 can reduce the placement speed and the placement acceleration by setting the placement timing to a later timing, and can increase the placement speed and the placement acceleration by setting the placement timing to a faster timing.

[0050] 7 is a diagram showing an example of a plurality of components P and a frame WK to be mounted on a board W. Here, an example is shown in which the frame setting unit 51 determines the type of frame WK taking into account the size of the component P.

[0051] 7 shows three components P (components "A", "B", and "C"). Here, "A", "B", and "C" correspond to, for example, the component codes included in the placement data 42 of FIG. 5. In FIG. 7, component "A" is a placed component P2, and components "B" and "C" are unplaced components P1. Components "B" and "C" have not yet been placed on the board W, so when components "B" and "C" become placement targets, a frame WK is set around components "B" and "C". On the other hand, component "A" has already been placed on the board W, so a frame WK is not set around component "A".

[0052] The size of component "B" is approximately the same as component "A" and is less than the size threshold. Therefore, the frame setting unit 51 sets an angle error non-consideration frame WK2. In this case, the frame setting unit 51 sets the angle error non-consideration frame WK2 for component "B" by connecting each position that is a predetermined distance away from the outer periphery of component "B" without taking the angle error θ2 into account. The fact that only one region for component "B" is shown indicates that the posture deviation (angle error) of component "B" when it is mounted is not taken into account.

[0053] The size of the part "C" is larger than that of the part "A" and is equal to or larger than the size threshold. Therefore, the frame setting unit 51 sets the angular error consideration frame WK1. FIG. 7 shows three states of the part "C" taking into account three tilts. Specifically, the state shows a state in which there is no angular error θ2, a state in which the angular error θ2 is maximum in a first rotation direction (e.g., clockwise), and a state in which the angular error θ2 is maximum in a second rotation direction (e.g., counterclockwise) that is opposite to the first rotation direction. In each state of the part "C," a temporary frame wkt (wkt1, wkt2, wkt3) is generated by connecting positions spaced a predetermined distance from the outer periphery of the part "C." The mounting posture of the part "C" can change between a state in which the angular error θ2 is maximum in the first rotation direction and a state in which the angular error θ2 is maximum in the second rotation direction, sandwiching the state in which there is no angular error θ2. Accordingly, the temporary frame wkt can change between the temporary frame wkt2 and the temporary frame wkt3, with the temporary frame wkt1 in between. Therefore, the frame setting unit 51 generates the angular error consideration frame WK1 so as to include the entire range of the temporary frame wkt that can change taking the angular error θ2 into account. In this case, the frame setting unit 51 generates and sets the outer periphery of the range that the temporary frame wkt can reach as the angular error consideration frame WK1, within the range of possible values ​​of the angular error θ2 of the part "C." Note that the shape of the angular error consideration frame WK1 is not limited to this, as long as the range that the temporary frame wkt can reach is included within the angular error consideration frame WK1.

[0054] In FIG. 7, component "A," which is already placed component P2, does not overlap with the angular error non-consideration frame WK2 for component "B." Therefore, component "B" is placed on board W, for example, at a high placement speed. This is because even if component "B" shifts slightly in position during placement, it is unlikely to come into contact with component "A." Furthermore, component "A," which is already placed component P2, overlaps with the angular error consideration frame WK1 for component "C." Therefore, component "C" is placed on board W, for example, at a low placement speed. This stabilizes the position of component "C" during placement, reducing the likelihood of component "C" coming into contact with component "A."

[0055] Next, the operation of the component mounting apparatus 1 will be described. Fig. 8 is a flowchart showing an example of the operation of the component mounting apparatus 1. The process of Fig. 8 may be performed for each component P to be mounted. When the component mounting apparatus 1 mounts multiple components P at the same time, the process of Fig. 8 may be performed for each component P at the same time.

[0056] First, the mechanism driver 46 controls the head unit 23 to suck and hold the component P to be placed on the board W by the component holding nozzle 27 based on the placement data 42 (S11). The frame setting unit 51 determines whether the component P to be placed is a component that takes into account (adds) the angular error θ2 based on the component data 43 (e.g., the size and type of the component P) (S12). If the component P to be placed is a component that takes into account the angular error θ2 (Yes in step S12), the frame setting unit 51 sets the angular error consideration frame WK1 as the frame WK (S13). On the other hand, if the component P to be placed is a component that does not take into account the angular error θ2 (No in step S12), the frame setting unit 51 sets the angular error non-consideration frame WK2 as the frame WK (S14).

[0057] After processing step S13 or S14, the overlap determination unit 52 determines whether the set frame WK and the already-placed component P2 overlap (S15). If the set frame WK and the already-placed component P2 overlap (Yes in step S15), the placement condition determination unit 53 sets the placement speed to V1 (low speed) and places the component P at a predetermined placement position in a predetermined placement posture (S16). On the other hand, if the set frame WK and the already-placed component P2 do not overlap (No in step S15), the placement condition determination unit 53 sets the placement speed to V2 (high speed), which is faster than V1, and places the component P at a predetermined placement position in a predetermined placement posture (S17).

[0058] The mounting condition determination unit 53 may determine the mounting speed in multiple stages, such as three or more stages, instead of determining the mounting speed as either low speed or high speed, i.e., in two stages. In this case, the mounting condition determination unit 53 may adjust the mounting speed in multiple stages based on the component data 43 of the mounting target (e.g., the size and type of the component P).

[0059] 7 illustrates an example in which the angular error consideration frame WK1 or the angular error non-consideration frame WK2 is set depending on whether the component P to be mounted is a component for which the angular error θ2 is taken into consideration, but this is not limiting. For example, the angular error consideration frame WK1 may be set as the frame WK regardless of the size or type of the component P to be mounted.

[0060] In this way, the component mounting apparatus 1 of this embodiment can set the frame WK and determine the mounting conditions to mount the component P, taking into account not only the intended mounting position, size, and type of the component P to be mounted, but also the possibility that the component P will be tilted horizontally from its intended orientation during mounting (angular error θ2). If an angular error θ2 occurs, the actual distance between adjacent components may be smaller than the initially expected distance, potentially increasing the likelihood of contact between adjacent components. In response to this, for example, if an already-mounted component P2 is located near the intended mounting position of an unmounted component P1 and there is a high probability that the unmounted component P1 will come into contact with the already-mounted component P2 during component mounting, the component mounting apparatus 1 can set a larger angular error consideration frame WK1. The range of this angular error consideration frame WK1 includes the mounting range of the component P with the angular error θ2. Therefore, if the range of the angular error consideration frame WK1 does not overlap with the range of the already-mounted component P2, the possibility of the unmounted component P1 coming into contact with the already-mounted component P2 during component mounting can be reduced. Furthermore, if there is a low possibility that the unplaced component P1 will come into contact with the placed component P2 during component placement, the component placement device 1 can set a small angle error non-consideration frame WK2. In other words, the component placement device 1 can calculate the distance between the adjacent placed component P2 taking into account the angle error θ2 and set a frame WK corresponding to this distance.

[0061] When the set frame WK overlaps with the already-placed component P2, for example, by setting the speed of the component placement operation (placement speed) to a low speed, the actual placement posture of the unplaced component P1 is less likely to deviate from the planned placement posture (angle θ1), that is, the angle error θ2 is less likely to occur, and the possibility of the unplaced component P1 coming into contact with the already-placed component P2 is reduced. Therefore, the component placement device 1 can prevent contact between components during component placement and prevent a decrease in the placement accuracy of the component P.

[0062] If contact with other components P (already-placed components P2) is anticipated using the frame WK, slowing the placement speed can reduce the takt time. However, if component placement is performed without reducing the takt time, i.e., without slowing the placement speed, the distance between the already-placed components P2 and the target components P may not be maintained properly, resulting in contact. In this case, the generated component mounting board (component-mounted board) may be unusable. Furthermore, to prevent such contact between adjacent components, it may be necessary to regenerate placement data 42 (production data for producing component mounting boards) by, for example, increasing the distance between adjacent components. This requires time to modify the production data, and as a result, the time required to produce a target quantity of component mounting boards without changing the placement speed is longer than the time required to produce the target quantity of component mounting boards with a slow placement speed. Therefore, component mounting apparatus 1 can improve productivity of component mounting boards even when components P are placed at a slow placement speed using the frame WK.

[0063] As described above, the component mounting apparatus 1 of this embodiment includes a mechanism drive unit 46 (an example of a head moving unit) that moves the moving head 26 that holds the component P, and a head unit 23 (an example of a component mounting unit) that mounts the component P on the board W using the moving head 26. The component mounting apparatus 1 includes a frame setting unit 51 that sets a frame WK around a mounting position on the board W where the component P is to be mounted, based on component mounting information (e.g., mounting data 42 and component data 43) for mounting components on the board W, including information on the angle error θ2 with respect to the mounting orientation of the component P on the board W. The component mounting apparatus 1 also includes an overlap determination unit 52 that determines whether the frame WK set by the frame setting unit 51 overlaps with an already-mounted component P2 that has been mounted on the board W. The component mounting apparatus 1 also includes a mounting condition determination unit 53 that determines mounting conditions for the head unit 23 based on the determination result by the overlap determination unit 52.

[0064] As a result, the component mounting device 1 can set a frame WK assuming that the component P will be tilted from the intended mounting orientation (angle error θ2), and can determine the mounting conditions using this frame WK. For example, if the set frame WK overlaps with an already-mounted component P2, setting the mounting speed to a low speed makes it easier to stably mount the component P in a stable mounting orientation, and can prevent the mounting orientation of the component P from deviating from the originally planned orientation during mounting. Therefore, the component mounting device 1 can prevent contact between components during component mounting, and prevent a decrease in the mounting accuracy of the component P.

[0065] Furthermore, the frame setting unit 51 may determine whether or not to set an angular error consideration frame WK1 (an example of a first frame) that takes into account the angular error θ2 as the frame WK, based on the component mounting information. If it is determined that the angular error consideration frame WK1 should be set, the frame setting unit 51 may set the angular error consideration frame WK1, and if it is determined that the angular error consideration frame WK1 should not be set, the frame setting unit 51 may set an angular error non-consideration frame WK2 (an example of a second frame) that does not take into account the angular error θ2.

[0066] As a result, the component mounting apparatus 1 can set, for example, a large angle error consideration frame WK1 when there is an already-placed component P2 located near the intended mounting position of the component P to be mounted and there is a high possibility that the component P to be mounted will come into contact with the already-placed component P2 during component mounting. Also, when there is a low possibility that the component P to be mounted will come into contact with the already-placed component P2 during component mounting, it can set, for example, a small angle error non-consideration frame WK2. Thus, the component mounting apparatus 1 can determine the type of frame WK according to the characteristics of the component P, and can perform component mounting while suppressing a decrease in component mounting accuracy using the determined type of frame WK.

[0067] Furthermore, the component mounting information may include information about the size of the component P. The frame setting unit 51 may determine, based on the size of the component P, whether or not to set the angle error consideration frame WK1.

[0068] It is believed that the stability of holding the component P by the component holding nozzle 27 and the likelihood of the angle error θ2 occurring vary depending on the size of the component P. Therefore, by determining the type of frame WK taking into account the size of the component P, the component mounting device 1 can set the frame WK taking into account the stability of holding the component P.

[0069] Furthermore, the component mounting information may include information on the type of the component P. The frame setting unit 51 may determine, based on the type of the component P, whether or not to set the angle error consideration frame WK1.

[0070] It is believed that the stability of holding the component P by the component holding nozzle 27 and the likelihood of the angle error θ2 occurring vary depending on the type of component P. Therefore, by determining the type of frame WK taking into account the size of the component P, the component mounting device 1 can set the frame WK taking into account the stability of holding the component P.

[0071] The mounting conditions may also include the mounting speed for mounting the component P. This allows the component mounting device 1 to mount the component P on the board W in a state close to the desired mounting position and posture by adjusting the mounting speed, i.e., by suppressing deviation from the desired mounting position and posture.

[0072] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components in the above-described embodiments may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0073] The present disclosure is useful for a component mounting apparatus and a component mounting method that can prevent components from contacting each other during component mounting and prevent a decrease in component mounting accuracy. [Explanation of symbols]

[0074] 1. Component placement device 10 Main body mechanism section 11 Mounting machine body 12 Foundation 13 Substrate transport mechanism 14 Conveyor section 15 Parts supply mechanism 16 Feeder Base 17 slots 18 Tape Feeder 19 Feeder Cart 20 Bogie section 21 reels 22 Carrier tape 23 Head Unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving Head 27 Component holding nozzle 28 Parts Recognition Camera 36 Circuit Board Recognition Camera 37 Disposal Box 38 Nozzle holder 40 Control Unit 41 Storage section 42 Installation data 43 Parts Data 46 Mechanism drive unit 47 Imaging processing section 48 Camera control unit 50 Parts Recognition Unit 51 Frame setting section 52 Overlap judgment section 53 Mounting condition determination unit P parts P1 Uninstalled parts P2 Installed parts W substrate WK Frame WK1 angle error consideration frame WK2 Angle error not considered frame wkt temporary frame

Claims

1. A component mounting device having a head moving unit that moves a head that holds a component, and a component mounting unit that mounts the component onto a board using the head, a frame setting unit that sets a frame around a mounting position on the board where the component is to be mounted, based on component mounting information for mounting the component on the board, the frame including information on an angle error relative to the mounting orientation of the component on the board; an overlap determination unit that determines whether the frame set by the frame setting unit overlaps with a component already placed on the board; a mounting condition determination unit that determines mounting conditions to be used by the component mounting unit in accordance with a determination result by the overlap determination unit; A component mounting device comprising:

2. The frame setting unit determining whether or not to set a first frame that takes into account the angle error as the frame based on the component mounting information; If it is determined that the first frame is to be set, the first frame is set; If it is determined that the first frame should not be set, a second frame that does not take the angle error into consideration is set.

2. The component mounting device according to claim 1.

3. the component mounting information includes information about the size of the component, the frame setting unit determines whether to set the first frame based on a size of the component.

3. The component mounting device according to claim 2.

4. the component mounting information includes information on the type of the component, the frame setting unit determines whether to set the first frame based on the type of the part.

3. The component mounting device according to claim 2.

5. the mounting conditions include a mounting speed at which the components are mounted; 2. The component mounting device according to claim 1.

6. A component mounting method for mounting a component on a board using a movable head that holds the component, comprising: setting a frame around a mounting position on the board where the component is to be mounted, based on component mounting information for mounting the component on the board, the frame including information on an angle error relative to the mounting orientation of the component on the board; a step of determining whether the set frame overlaps with a component already placed on the board; determining a placement condition for placing the component according to the result of the determination of whether or not the component overlaps with an already placed component; A component mounting method comprising:

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