Resin supply device, resin molding device, and method for manufacturing resin molded product

Abstract

To eliminate clogging and other problems caused by the passage of vertically oriented resin tablets through a simple configuration.SOLUTION: A resin feeder 8 that supplies cylindrical resin tablets T used for resin molding is equipped with a resin feeder 81 that feeds resin tablets T by vibration, a resin passage section 821 through which resin tablets T fed by the feeder 81 pass, and a resin carry-out section 822 that carries out resin tablets T that have moved through the resin passage section 821, and the resin passage section 821 has a guide groove 111 that contacts the outer circumference of the resin tablet T in the horizontal direction and guides the resin tablet T in the horizontal direction to pass to the resin carry-out section 822, and an inclined contact surface 121 that is formed at an angle to the passing direction X in which the tablet T passes to the resin carry-out section 822 and can contact the outer circumference of the resin tablet T in the vertical direction.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a resin supplying device, a resin molding device, and a method for manufacturing a resin molded product. [Background technology]

[0002] In a conventional resin molding apparatus, cylindrical resin tablets are supplied to a mold and resin is molded using the resin tablets. In this resin molding apparatus, a plurality of resin tablets are held by a loader and transported to the mold, and the resin tablets are supplied to the loader by a resin supply device.

[0003] Here, when supplying resin tablets to the loader, the resin tablets must be aligned to match the loader, and if horizontal and vertical resin tablets are mixed, there is a risk of problems such as the tablets getting stuck before being supplied to the loader.

[0004] For this reason, it has been considered to align the resin tablets in one direction or the other before supplying them to the loader.For example, Patent Document 1 discloses a tablet supplying device that stores tablets in an upright position in a tablet holder, moves the tablet holder to a molding die, and supplies the tablets to the molding die.

[0005] This tablet supply device has a tablet pick-up unit that picks up tablets that have been placed in random orientations, and a tablet alignment unit that aligns the picked-up tablets, and the tablet alignment unit is provided with a lift mechanism that changes tablets that are in a horizontal position to an upright position. Specifically, the tablet alignment unit is provided with a confirmation sensor that determines whether the tablet is in a horizontal or upright position, and when the confirmation sensor determines that the tablet is in a horizontal position, the lift mechanism lifts the end of the tablet to change it to an upright position. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-317984 Summary of the Invention [Problem to be solved by the invention]

[0007] However, the mechanism for aligning the tablet in one orientation, such as changing the tablet from a horizontal orientation to an upright orientation, is complex and requires a large installation space.

[0008] Therefore, the present invention has been made to solve the above problems, and its main objective is to eliminate, with a simple structure, problems such as clogging that occurs when a vertically oriented resin tablet enters an area where a horizontally oriented resin tablet should pass through. [Means for solving the problem]

[0009] In other words, the resin supplying device of the present invention is a resin supplying device that supplies cylindrical resin tablets used in resin molding, and is equipped with a resin discharge section that discharges the resin tablets by vibration, a resin passage section through which the resin tablets discharged by the resin discharge section pass, and a resin discharge section that discharges the resin tablets that have moved through the resin passage section, and is characterized in that the resin passage section has a guide groove that contacts the outer peripheral surface of the horizontally oriented resin tablet and guides the horizontally oriented resin tablet to pass toward the resin discharge section, and an inclined contact surface that is formed at an angle with respect to the passing direction toward the resin discharge section and contacts the outer peripheral surface of the vertically oriented resin tablet. [Effects of the Invention]

[0010] According to the present invention configured in this way, problems such as clogging caused by a vertically oriented resin tablet entering a section where a horizontally oriented resin tablet should pass can be eliminated with a simple configuration. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram illustrating a configuration of a resin molding apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a partial cross-sectional view showing a main part of a press unit according to the embodiment. [Figure 3] FIG. 2 is a plan view schematically showing the configuration of the resin supplying device (resin supplying module) of the embodiment. [Figure 4] FIG. 2 is a front view schematically showing the configuration of the resin supply module of the embodiment. [Figure 5] FIG. 2 is a perspective view showing a unit member of the embodiment. [Figure 6] 1A is a plan view of a unit member of the embodiment, FIG. 1B is a view of the unit member as seen from a passing direction X, and FIG. 1C is a view showing the relationship between the center of gravity of a resin tablet and a cutout portion. [Figure 7] 10A and 10B are diagrams showing (a) a region R1 through which a horizontally oriented resin tablet passes, (b) a region R2 through which a vertically oriented resin tablet passes, and (c) a region R3 in which an inclined contact surface can be provided in the unit member of the same embodiment. [Figure 8] 10A and 10B are a perspective view and a plan view showing how a horizontally oriented resin tablet passes through a unit member in the embodiment. [Figure 9] 10A and 10B are a perspective view and a plan view showing how a vertically oriented resin tablet passes through a unit member in the embodiment. [Figure 10] FIG. 10 is a perspective view showing a unit member of a modified embodiment. [Figure 11] 1A is a perspective view showing a unit member of a modified embodiment, FIG. 1B is a view seen from the passing direction X (showing the passing area R1), and FIG. 1C is a view seen from the passing direction X (showing the passing area R2). DETAILED DESCRIPTION OF THE INVENTION

[0012] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0013] The resin supply device of technology 1 according to the present invention is a resin supply device that supplies cylindrical resin tablets used in resin molding, and is equipped with a resin discharge section that discharges the resin tablets by vibration, a resin passage section through which the resin tablets discharged by the resin discharge section pass, and a resin discharge section that discharges the resin tablets that have moved through the resin passage section, and is characterized in that the resin passage section has a guide groove that contacts the outer peripheral surface of the horizontally oriented resin tablet and guides the horizontally oriented resin tablet to pass toward the resin discharge section, and an inclined contact surface that is formed at an angle with respect to the passing direction toward the resin discharge section and contacts the outer peripheral surface of the vertically oriented resin tablet. This resin supply device has a guide groove in the resin passage section that guides the passage of horizontally oriented resin tablets, allowing horizontally oriented resin tablets to pass stably. Furthermore, it has an inclined contact surface that is inclined relative to the passage direction toward the resin discharge section and contacts the outer peripheral surface of the vertically oriented resin tablet. As the vertically oriented resin tablet advances through the resin passage section, it moves in a direction deviating from the passage direction while contacting the inclined contact surface, and is removed from the resin passage section. This eliminates problems such as clogging caused by vertically oriented resin tablets entering a section where horizontally oriented resin tablets should pass. Therefore, resin tablets can be stably supplied to the loader. Furthermore, the present invention is configured to feed resin tablets by vibration, and is particularly effective for resin tablets with a shape that is prone to becoming vertically oriented due to vibration (for example, a resin tablet whose axial length is less than one time its diameter).

[0014] In addition to the configuration of the above-described first technique, the resin supplying device of the second technique according to the present invention is preferably configured such that the inclined contact surface crosses the guide groove in a plan view of the guide groove. With this configuration, the inclined contact surface is formed so as to cross the guide groove, so that a vertically oriented resin tablet can be easily removed from the resin passage portion.

[0015] In addition to the configuration of the above-mentioned technology 1 or 2, the resin supply device of technology 3 according to the present invention desirably has a cutout portion on the side where the vertically oriented resin tablet comes into contact with the inclined contact surface and moves, for allowing the vertically oriented resin tablet to fall from the resin passage portion. By providing such a cutout portion, it becomes easier to remove a vertically oriented resin tablet from the resin passage portion.

[0016] In addition to the configuration of any one of the above-mentioned techniques 1 to 3, the resin supply device of technique 4 according to the present invention is preferably such that the inclined contact surface is provided outside the passage area of ​​the horizontally oriented resin tablet when viewed from the passage direction in the resin passage section. With this configuration, the inclined contact surface can allow the resin tablet to pass through without coming into contact with the resin tablet.

[0017] Since a cylindrical resin tablet has a circular shape when viewed from the axial direction and a rectangular shape when viewed from a direction perpendicular to the axial direction, the passage area for a horizontally oriented resin tablet is circular and the passage area for a vertically oriented resin tablet is rectangular when viewed from the passage direction in the resin passage section. In order to utilize this and preferably remove a vertically oriented resin tablet, the resin supply device of Technology 5 according to the present invention preferably has the configuration of any one of Technologies 1 to 4 above, and further preferably has the inclined contact surface that contacts the lower or upper part of the outer peripheral surface of the vertically oriented resin tablet.

[0018] In addition to the configuration of any one of the above-mentioned techniques 1 to 5, the resin supply device of technique 6 according to the present invention desirably has a flat portion in which the resin passage portion contacts the bottom surface of the vertically oriented resin tablet until the vertically oriented resin tablet contacts the inclined contact surface. With this configuration, the vertically oriented resin tablet moves to the inclined contact surface while remaining in the vertical position and comes into contact with the inclined contact surface, thereby ensuring the removal of the vertically oriented resin tablet by the inclined contact surface.

[0019] In addition to the configuration of any one of the above-mentioned techniques 1 to 6, it is desirable that the resin supply device of technique 7 according to the present invention has the guide groove and the inclined contact surface formed in a unit member that constitutes a part of the resin passage portion. With this configuration, simply by providing the unit member in the resin passage section, it is possible to easily install a configuration for removing vertically oriented resin tablets in the resin passage section.

[0020] The following are possible specific embodiments of the guide groove and the inclined contact surface in the unit member. In other words, in addition to the configuration of Technology 6 described above, the resin supply device of Technology 8 according to the present invention is such that the guide groove is formed in the unit member from one end to the other along the passing direction passing through to the resin discharge section side, and the inclined contact surfaces are provided on both sides of the guide groove in the unit member and are thought to come into contact with the lower part of the outer peripheral surface of the resin tablet in a vertical orientation.

[0021] Further, the following is another specific embodiment of the guide groove and the inclined contact surface in the unit member. In other words, in addition to the configuration of Technology 6 described above, the resin supply device of Technology 9 according to the present invention is such that the guide portion is formed in the unit member from one end to the other end along the passing direction passing through to the resin discharge portion side, and the inclined contact surface is provided above the guide groove in the unit member and is thought to come into contact with the upper part of the outer peripheral surface of the resin tablet in a vertical orientation.

[0022] In addition to the configuration of any one of the above-mentioned techniques 1 to 9, the resin supplying device of technique 10 according to the present invention preferably further includes a collection box for collecting the resin tablets removed by the inclined contact surface. With this configuration, not only can the resin tablets be recovered, but the recovered resin tablets can also be reused by returning them to the resin delivery section.

[0023] Furthermore, a resin molding apparatus having the resin supplying device according to any one of the above techniques 1 to 10 is also an aspect of the present invention.

[0024] Furthermore, one aspect of the present invention is a method for manufacturing a resin molded product by resin molding onto a molding object, which includes a resin supplying step in which the resin tablet is supplied to the loader by a resin supplying device of any one of technologies 1 to 10 above, a transporting step in which the loader transports the resin tablet and the molding object to a molding mold, and a molding step in which the molding mold is clamped to perform resin molding.

[0025] <One embodiment of the present invention> An embodiment of a resin molding apparatus according to the present invention will be described below with reference to the drawings. Note that, for ease of understanding, all of the drawings shown below are drawn in a schematic manner with appropriate omissions or exaggerations. Identical components are designated by the same reference numerals, and their descriptions will be omitted where appropriate.

[0026] <Overall configuration of resin molding equipment> The resin molding apparatus 100 of this embodiment resin-moldes a molding object W1 having an electronic component fixed thereto by transfer molding using a resin material. The resin molding apparatus 100 uses a cylindrical tablet-shaped composite material containing, for example, a thermosetting resin (hereinafter referred to as a "resin tablet T") as the resin material. Furthermore, the resin tablet T has, for example, an axial length L of 1 time or less of its diameter D (L / D≦1.0). The shape of the resin tablet T is not limited to L / D≦1.0.

[0027] The molding object W1 may be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, or the like, with or without wiring.The electronic component may be, for example, an electronic component such as a semiconductor chip, a resistor element, or a capacitor element, or an electronic component in which at least one of these electronic components is sealed with resin.

[0028] 1, the resin molding apparatus 100 includes, as its components, a supply module 2 that supplies a molding target W1 and a resin tablet T before molding, two resin molding modules 3A and 3B, for example, that perform resin molding, and a storage module 4 that stores a molding target W2 (hereinafter referred to as a "resin molded product W2") after molding. Note that the components of the supply module 2, the resin molding modules 3A and 3B, and the storage module 4 can be attached to and detached from the other components, and can be replaced.

[0029] The resin molding apparatus 100 also includes a conveying mechanism 5 (hereinafter referred to as "loader 5") that conveys the molding object W1 and resin tablet T supplied by the supply module 2 to the resin molding modules 3A and 3B, and a conveying mechanism 6 (hereinafter referred to as "unloader 6") that conveys the resin molded product W2 resin-molded by the resin molding modules 3A and 3B to the storage module 4.

[0030] The supply module 2 of this embodiment is an integrated module of a molding object supply module 7 and a resin supply module 8.

[0031] The molding object supply module 7 has a molding object delivery section 71 and a molding object supply section 72. The molding object delivery section 71 delivers the molding objects W1 in the magazine to the molding object supply section 72. The molding object supply section 72 receives the molding objects W1 from the molding object delivery section 71, aligns the received molding objects W1 in a predetermined direction, and hands them over to the loader 5.

[0032] The resin supply module 8 is a resin supply device that supplies resin tablets T to the loader 5, and has a resin sending-out section 81 and a resin supply section 82. The resin sending-out section 81 receives the resin tablets T from a stocker 83 that stores a plurality of resin tablets T, and sends out the resin tablets T to the resin supply section 82. The resin supply section 82 receives the resin tablets T from the resin sending-out section 81, aligns the received resin tablets T in a predetermined direction, and passes them to the loader 5. The detailed configuration of the resin supply module 8 will be described later.

[0033] Resin molding modules 3A and 3B each have a press unit 31. As shown in Fig. 2, each press unit 31 has a lower mold 311 which is a molding mold that can be raised and lowered, an upper mold 312 which is a molding mold fixed above lower mold 311 so as to face each other, and a mold clamping mechanism 313 for clamping lower mold 311 and upper mold 312 together. Lower mold 311 is fixed to the upper surface of movable platen 314, and upper mold 312 is fixed to the lower surface of upper fixed platen 315. Mold clamping mechanism 313 clamps or opens upper mold 312 and lower mold 311 by moving movable platen 314 up and down.

[0034] The lower mold 311 is formed with a mounting portion 311a to which the molding object W1 transported by the loader 5 is mounted. The lower mold 311 is formed with a plurality of pots 311b to which the resin tablets T transported by the loader 5 are mounted. The lower mold 311 is also provided with a plunger 316 for injecting the resin tablets T into the pots 311b, for example, into a resin flow path 312a and a cavity 312b formed in the upper mold 312.

[0035] Additionally, a heating unit such as a heater (see heater 317 in FIG. 2) is embedded in each of upper mold 312 and lower mold 311. Upper mold 312 and lower mold 311 are usually heated to about 180°C by these heating units.

[0036] <Resin molding operation of resin molding device 100> The basic operation of resin molding by the resin molding apparatus 100 of this embodiment will be described below.

[0037] The molding object delivery section 71 delivers the molding objects W1 in the magazine to the molding object supply section 72. The molding object supply section 72 aligns the received molding objects W1 in a predetermined direction and delivers them to the loader 5. Concurrently, the resin delivery section 81 delivers the resin tablets T received from the stocker 83 to the resin supply section 82. The resin supply section 82 delivers the required number of received resin tablets T (four in FIG. 1 ) to the loader 5.

[0038] Next, the loader 5 simultaneously transports the received two molding objects W1 and four resin tablets T to the press unit 31. The loader 5 supplies the molding objects W1 to the mounting unit 311a of the lower mold 311 and the resin tablets T to the inside of the pot 311b formed in the lower mold 311, respectively.

[0039] Thereafter, the upper mold 312 and the lower mold 311 are clamped together using the mold clamping mechanism 313. Then, the resin tablets T in each pot 311b are heated and melted to generate molten resin, and the molten resin is pressed by the plunger 316. As a result, the molten resin is injected into the interior of the cavity 312b formed in the upper mold 312 through the resin flow path 312a. Subsequently, the molten resin is heated for the required time required for hardening, thereby hardening the molten resin to form a hardened resin. As a result, the electronic component in the cavity 312b and its surroundings are sealed in hardened resin (sealing resin) molded to correspond to the shape of the cavity 312b.

[0040] Next, after the required time for curing has elapsed, the upper mold 312 and the lower mold 311 are opened to release the resin molded product W2. Thereafter, the unloader 6 is used to store the resin molded product W2 that has been resin-sealed by the press unit 31 in the resin molded product storage unit 41 of the storage module 4.

[0041] The overall operation of the resin molding apparatus 100, including the above-described series of operations, is controlled by a control unit 9. In Fig. 1, this control unit 9 is provided in the supply module 2, but it may be provided in another module. The control unit 9 is configured, for example, by a dedicated or general-purpose computer having a CPU, internal memory, AD converter, input / output inverter, etc.

[0042] <Specific Configuration of Resin Supply Module 8> Next, as shown in Figures 1, 3 and 4, the resin supply module 8 of this embodiment has a resin delivery section 81 that delivers resin tablets T by vibration, and a resin supply section 82 that supplies the resin tablets T delivered by the resin delivery section 81 to the loader 5.

[0043] The resin delivery unit 81 uses a so-called parts feeder, and as shown in FIGS. 1, 3, and 4, has a resin receiving unit 811 that stores a plurality of resin tablets T, a vibration unit 812 that vibrates the resin receiving unit 811 to move the resin tablets T, and an arrangement unit 813 that arranges the resin tablets T moved by the vibration in a line. The resin receiving unit 811 is replenished with resin tablets T from a stocker 83 provided above the resin receiving unit 811. The arrangement unit 813 arranges the resin tablets T in a horizontal position. Here, "horizontal" can also be referred to as lying on its side or horizontal position, and the central axis of the cylindrical resin tablets T is horizontal. Note that "vertical" described below can also be referred to as standing or upright position, and the central axis of the cylindrical resin tablets T is vertical.

[0044] The arrangement section 813 is provided with a detection sensor (for example, a light transmission type sensor, not shown) that detects whether a predetermined number of resin tablets T are arranged in the arrangement section 813. When a detection signal from the detection sensor indicates that the predetermined number of resin tablets T are not arranged in the arrangement section 813, the control section 9 activates the vibration section 812 so that the predetermined number of resin tablets T are arranged in the arrangement section 813.

[0045] As shown in Figures 1, 3 and 4, the resin supply section 82 has a resin passage section 821 through which the resin tablet T sent out from the resin delivery section 81 passes, and a resin delivery section 822 that delivers the resin tablet T that has moved through the resin passage section 821 by handing it over to the loader 5.

[0046] One end of the resin passage section 821 is provided at the outlet of the arrangement section 813 of the resin feed section 81, and the resin tablets T fed from the arrangement section 813 move through the resin passage section 821. Here, one end (entrance) of the resin passage section 821 is provided with a gap so as not to come into contact with the outlet of the arrangement section 813. This prevents vibrations of the resin feed section 81 from being transmitted to the resin passage section 821 via the arrangement section 813. In addition, the gap between the outlet of the arrangement section 813 and one end of the resin passage section 821 is large enough (for example, 2 mm) so as not to hinder the movement of the resin tablets T from the arrangement section 813 to the resin passage section 821.

[0047] 4, the resin feed-out portion 81 is supported by the resin molding apparatus 100 via vibration-isolating rubber 85, which prevents vibrations from the resin feed-out portion 81 from being transmitted to the resin passage portion 821 via peripheral members. Note that FIG. 4 shows an example in which the vibration-isolating rubber 85 is provided on the bottom surface of the support leg 84 that supports the resin feed-out portion 81.

[0048] 3 and 4, the resin passage section 821 arranges the horizontally oriented resin tablets T sent out from the arranging section 813 in a line and moves them in a straight line to a transfer position DP to the loader 5 by the resin carrying-out section 822. Specifically, the horizontally oriented resin tablets T sent out from the arranging section 813 enter the resin passage section 821 one by one, and the resin tablets T sent out from the arranging section 813 push the resin tablets T already in the resin passage section 821. As a result, the horizontally oriented resin tablets T enter the resin passage section 821 one after another, and while being arranged in a line, they pass through the resin passage section 821 and move to the transfer position DP.

[0049] The resin carrying-out section 822 carries out the horizontally oriented resin tablets T that have passed through the resin passage section 821 by aligning them in groups of multiple tablets and delivering them to the loader 5. This resin carrying-out section 822 aligns the resin tablets T in correspondence with the resin tablet storage section 51 (see FIG. 4) provided in the loader 5. Specifically, the resin carrying-out section 822 aligns the horizontally oriented resin tablets T at the delivery position DP of the resin passage section 821 so that they are parallel to each other while remaining in the horizontal orientation. Then, after this alignment, the resin carrying-out section 822 rotates the resin tablets T so that they are vertically oriented, and stores and delivers the vertically oriented, aligned resin tablets T to the resin tablet storage section 51 of the loader 5.

[0050] <Configuration for Removing Vertically Oriented Resin Tablets T in Resin Passage Portion 821> The resin supply module 8 of this embodiment has a configuration for removing the resin tablets T from the resin passage portion 821 in a vertical orientation.

[0051] 5 and 6, the resin passage section 821 of the resin supply module 8 has a guide section 11 that comes into contact with the outer peripheral surface of the horizontally oriented resin tablet T to guide the passage of the horizontally oriented resin tablet T, and a removal section 12 that comes into contact with the outer peripheral surface of the vertically oriented resin tablet T to prevent the passage of the vertically oriented resin tablet T and remove it. Here, the outer peripheral surface of the resin tablet T refers to the side surface excluding both axial end faces of the resin tablet T, and is a side surface having a circular cross section perpendicular to the axial direction.

[0052] In this embodiment, as shown in Figures 3 and 4, a unit member 10 having a guide portion 11 and a removal portion 12 is provided at one end (entrance) of the resin passage portion 821. Note that the guide portion 11 and the removal portion 12 are not shown on the unit member 10 in Figures 3 and 4. The unit member 10 constitutes a part of the resin passage portion 821. Since this unit member 10 forms one end of the resin passage portion 821, the unit member 10 is provided with a gap therebetween so as not to come into contact with the outlet of the arrangement portion 813.

[0053] 5 and 6, the unit member 10 is configured so that the resin tablet T enters from one end 10a and exits horizontally from the other end 10b, and the resin tablet T moves along the upper surface of the unit member 10. Specifically, the unit member 10 is provided with a guide portion 11 and a removal portion 12 on its upper surface. In the unit member 10 of this embodiment, the guide portion 11 and the removal portion 12 are integrally formed.

[0054] As shown in FIGS. 5 and 6, the guide portion 11 moves the resin tablet T, which is oriented sideways, linearly along its axial direction on the upper surface of the unit member 10.

[0055] Specifically, the guide portion 11 has a guide groove 111 formed on the upper surface of the unit member 10, from one end 10a to the other end 10b along the passing direction X passing through the resin passage portion 821 toward the resin discharge portion 822. The cross-sectional shape of the guide groove 111 perpendicular to the passing direction X may be an arc shape along the outer peripheral surface of the horizontally oriented resin tablet T, or may be a polygonal groove shape having, for example, a V-shaped cross section that contacts the outer peripheral surface of the horizontally oriented resin tablet T at multiple points in the circumferential direction.

[0056] 6(a) and 6(c), the guide groove 111 has an opening width WD (width dimension perpendicular to the passing direction X) that is less than the diameter of the resin tablet T, specifically, less than half the diameter D of the resin tablet T, on the one end 10a (entrance) side of the removal unit 12. The opening width WD of the guide groove 111 is wider on the other end 10b side of the removal unit 12, but the opening width may be constant from the one end 10a to the other end 10b.

[0057] The removal unit 12 has an inclined contact surface 121 that comes into contact with the outer peripheral surface of a vertically oriented resin tablet T. This inclined contact surface 121 is formed so as to be inclined with respect to the passing direction X of the resin passage portion 821 toward the resin discharge portion 822 in a plan view. Here, the inclination angle θ of the inclined contact surface 121 with respect to the passing direction X (see FIG. 6(a)) is, for example, 20 to 60°, and preferably 30 to 45°. The inclined contact surface 121 of this embodiment is a vertical plane formed on the upper surface portion of the unit member 10.

[0058] 5 and 6, the inclined contact surfaces 121 of this embodiment are formed so as to cross the guide groove 111 in a plan view of the guide groove 111, and are provided on both sides of the guide groove 111. One inclined contact surface 121a is provided on the one end 10a side (upstream side) with the guide groove 111 in between, and the other inclined contact surface 121b is provided on the other end 10b side (downstream side) with the guide groove 111 in between. These inclined contact surfaces 121a and 121b are formed so as to be on a straight line in a plan view (see FIG. 6(a)).

[0059] Here, when viewed from the passing direction X, the passing region R1 of the horizontally oriented resin tablet T in the unit member 10 is as shown in FIG. 7(a). When viewed from the passing direction X, the passing region R2 of the vertically oriented resin tablet T in the unit member 10 is as shown in FIG. 7(b). Therefore, when viewed from the passing direction X, the inclined contact surface 121 is provided in a region R3 outside the passing region R1 of the horizontally oriented resin tablet T and inside the passing region R2 of the vertically oriented resin tablet T (see FIG. 7(c)). Then, the inclined contact surface 121 comes into contact with the lower or upper part of the outer peripheral surface of the vertically oriented resin tablet T to guide the removal of the vertically oriented resin tablet T. In this embodiment, it comes into contact with the lower part of the outer peripheral surface of the vertically oriented resin tablet T.

[0060] 5 and 6, the unit member 10 of this embodiment has a flat portion 13 that contacts the bottom surface of a vertically oriented resin tablet T until the vertically oriented resin tablet T contacts the inclined contact surface 121 of the removal unit 12. The flat portion 13 is formed on both sides of the guide groove 111 that constitutes the guide unit 11, on the one end 10a (entrance) side of the unit member 10 relative to the inclined contact surface 121 of the removal unit 12. The height position of the flat portion 13 is set to be the same as or slightly lower than the height position of the bottom surface of the arrangement unit 813. The width dimension of the flat portion 13 perpendicular to the passing direction X is set to be larger than the diameter D of the resin tablet T. This prevents the vertically oriented resin tablet T from getting caught on the unit member 10 when entering the unit member 10 from the arrangement unit 813. As described above, the opening width WD of the guide groove 111 in the width direction Y is less than the diameter of the resin tablet T (specifically, less than half the diameter D of the resin tablet T), so the vertically oriented resin tablet T moves on the flat portion 13 while straddling the guide groove 111. Then, the vertically oriented resin tablet T moves toward the inclined contact surface 121 while maintaining the vertical orientation and comes into contact with the inclined contact surface 121.

[0061] 5 and 6, the unit member 10 of this embodiment has a cutout portion 14 for dropping the vertically oriented resin tablet T from the unit member 10 on the side (removed side) where the vertically oriented resin tablet T comes into contact with the inclined contact surface 121 and moves. Here, the cutout portion 14 is formed by cutting out the side surface of the unit member 10 toward the guide groove 111 on the side where the vertically oriented resin tablet T is removed.

[0062] Furthermore, the cutout portion 14 of this embodiment is formed so that the resin tablet T in the vertical direction does not engage with a corner of the inclined contact surface 121b on the other end side (downstream side) of the guide groove 111 after the resin tablet T comes into contact with the inclined contact surface 121a on one end side (upstream side) of the guide groove 111 and moves across the guide groove 111. Specifically, the cutout portion 14 is formed so that the center of gravity G of the resin tablet T in the vertical direction is located outside the cutout portion 14 when the resin tablet T comes into contact with the inclined contact surface 121a on one end side (upstream side) of the guide groove 111 and moves across the guide groove 111, and before the resin tablet T comes into contact with the inclined contact surface 121b on the other end side (downstream side) of the guide groove 111 (see FIG. 6(c)). As a result, the resin tablet T in the vertical direction rotates outward from the cutout portion 14 and falls due to a rotation moment caused by its own weight before coming into contact with the inclined contact surface 121b on the other end side.

[0063] 4, the resin supply module 8 of this embodiment further includes a collection box 15 that collects the resin tablets T removed by the inclined contact surface 121. Specifically, the collection box 15 is provided below the unit member 10 and receives the resin tablets T that have fallen from the unit member 10. The resin tablets T collected in the collection box 15 may be discarded or may be returned to the stocker 83 or the resin receiving section 811 of the resin sending section 81.

[0064] In addition, a weighing unit (not shown) that measures the weight of the resin tablet T is provided in the resin passage section 821 of the resin supply module 8. If the weight of the resin tablet T is not within the allowable range as a result of being weighed by this weighing unit, the resin tablet T is discarded from the resin passage section 821. Here, as shown in FIG. 4, an openable and closable disposal section 16 is formed in the bottom part of the resin passage section 821, and when the disposal section 16 is opened, a resin tablet T whose weight is not within the allowable range falls and is discarded in a disposal box 17. The disposal section 16 in this embodiment is provided between the unit member 10 and the delivery position DP in the resin passage section 821. Note that the disposal box 17 is provided separately from the collection box 15.

[0065] <Behavior of Resin Tablet T in Unit Member 10> Next, the behavior of the resin tablets T when the horizontally oriented resin tablets T and the vertically oriented resin tablets T are inserted into the unit member 10 will be briefly described.

[0066] First, when a horizontally oriented resin tablet T enters the unit member 10 (FIG. 8(a)), the horizontally oriented resin tablet T is guided by the guide groove 111 formed in the unit member 10. Then, a part of the circumferential direction of the outer peripheral surface of the horizontally oriented resin tablet T contacts the guide groove 111, and passes toward the resin discharge part 822 while maintaining its horizontal orientation (FIG. 8(b)→(c)). At this time, the horizontally oriented resin tablet T does not contact the inclined contact surface 121.

[0067] Next, when a vertically oriented resin tablet T enters the unit member 10 (FIG. 9(a)), the vertically oriented resin tablet T moves along the flat portion 13 formed on the unit member 10. Then, the vertically oriented resin tablet T that has moved along the flat portion 13 comes into contact with the inclined contact surface 121a on one end side (upstream side) across the guide groove 111, and moves in a direction deviating from the passing direction X (FIG. 9(b)), and moves toward the cutout portion 14. When the center of gravity position G of the vertically oriented resin tablet T moves outward from the cutout portion 14 (see FIG. 6(c)), the tablet rotates outward due to a rotational moment caused by its own weight and falls (FIG. 9(c)).

[0068] <Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, the resin passage section 821 of the resin supply module 8 is provided with the guide groove 111 for guiding the passage of the horizontally oriented resin tablet T, thereby enabling the horizontally oriented resin tablet T to pass stably. Furthermore, the resin discharge section 822 is provided with an inclined contact surface 121 that is inclined with respect to the passage direction X of the resin tablet T passing therethrough and that contacts the outer peripheral surface of the vertically oriented resin tablet T. As the vertically oriented resin tablet T advances through the resin passage section 821, the vertically oriented resin tablet T moves in a direction deviating from the passage direction X while contacting the inclined contact surface 121, and is removed from the resin passage section 821. In this way, the inclined contact surface 121 of the removal section 12 prevents the vertically oriented resin tablet T from passing through the resin passage section 821, thereby eliminating problems such as clogging that occurs when the vertically oriented resin tablet T enters a section where the horizontally oriented resin tablet T should pass. Therefore, the resin tablet T can be stably supplied to the loader 5. In particular, this embodiment is configured to send out the resin tablet T by vibration, and is effective for resin tablets T having a shape that is prone to becoming vertical due to vibration (for example, resin tablets T whose axial length L is less than 1 time the diameter D (L / D≦1.0)).

[0069] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0070] For example, in the unit member 10 of the above embodiment, inclined contact surfaces 121a and 121b are provided on both sides of the guide groove 111, but it is also possible to provide only inclined contact surface 121a on one end side across the guide groove 111, without providing inclined contact surface 121b on the other end side across the guide groove 111.

[0071] In addition, in the above embodiment, the unit member 10 is configured to have the cutout portion 14, but as shown in Fig. 10, the unit member 10 may be configured without the cutout portion 14. In this configuration, the resin tablet T in a vertical position first contacts the inclined contact surface 121a on one end side (upstream side) with the guide groove 111 between them, moves in a direction deviating from the passing direction X, and then contacts the inclined contact surface 121b on the other end side (downstream side) with the guide groove 111 between them, drops from the unit member 10, and is removed.

[0072] Furthermore, the removal portion 12 (inclined contact surface 121) in the unit member 10 may be configured to be provided above the guide groove 111 of the guide portion 11 and to contact the upper portion of the outer peripheral surface of the vertically oriented resin tablet T, as shown in FIG. 11(a). Specifically, this unit member 10 has a lower member 10P in which the guide groove 111 of the guide portion 11 is formed, and an upper member 10Q in which the inclined contact surface 121 serving as the removal portion 12 is formed and provided above the lower member 10P. In this configuration, the inclined contact surface 121 of the removal portion 12 is formed so as to surround the upper portion of the passage region R1 of the horizontally oriented resin tablet T when viewed from the passage direction X in the resin passage portion 821, as shown in FIG. 11(b). When a vertically oriented resin tablet T enters the unit member 10, as shown in Figure 11(c), an inclined contact surface 121 is present in the passage area R2 of the vertically oriented resin tablet T, and the inclined contact surface 121 contacts the upper part of the outer peripheral surface of the vertically oriented resin tablet T to remove the vertically oriented resin tablet T.

[0073] In the above embodiment, the unit member 10 was configured to be provided at one end of the resin passage portion 821, but the position at which the unit member 10 is provided can be changed as appropriate as long as it is upstream of the transfer position DP of the resin passage portion 821.

[0074] Furthermore, in the above embodiment, a unit member 10 having a guide portion 11 and a removal portion 12 is used, but it is also possible to configure the guide portion 11 and the removal portion 12 in the resin passage portion 821 without using the unit member 10.

[0075] In the above embodiment, the resin discharge unit 822 aligns horizontally oriented resin tablets T that have passed through the resin passage unit 821 in groups, delivers them to the loader 5, and discharges them. However, other configurations are also possible. For example, the resin discharge unit 822 may discharge the horizontally oriented resin tablets T that have passed through the resin passage unit 821 through a conveying path formed, for example, of a resin tube. In this configuration, the horizontally oriented resin tablets T that have passed through the resin passage unit 821 are sent out to the conveying path. The multiple tablets T sent out to the conveying path are carried out through the conveying path by suction force due to negative pressure. In this case, it is possible to configure the resin supply device 8 having the resin discharge unit 822 and the resin molding apparatus 100 to be located in separate locations. For example, even if the resin molding apparatus 100 is installed in a clean room, the resin tablets T can be supplied to the resin molding apparatus 100 from the resin supply device 8 installed outside the clean room through the conveying path.

[0076] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0077] 100...Resin molding equipment W1: Molding object W2: Resin molded product T···Resin Tablet 311...Lower mold (molding mold) 5. Loader 8. Resin supply module (resin supply device) 81 Delivery section 821···Resin passage 822 Resin discharge section 10 Unit member X...passing direction 11 Guide section 111 Guide groove 12...removal part 121... Inclined contact surface R1: Passage area for horizontally oriented resin tablets R2: Passage area for vertically oriented resin tablets 13...Plane part 14 Notch 15 Collection Box

Claims

1. A resin supplying device that supplies cylindrical resin tablets used in resin molding, a resin delivery unit that delivers the resin tablets by vibration; a resin passage portion through which the resin tablet fed by the resin feeding portion passes; a resin discharge section that discharges the resin tablet that has moved through the resin passage section, The resin passage portion is a guide groove that contacts an outer peripheral surface of the horizontally oriented resin tablet and guides the horizontally oriented resin tablet to pass through the resin discharge portion; an inclined contact surface formed at an angle with respect to the direction of passage of the resin tablet toward the resin discharge portion and in contact with the outer peripheral surface of the resin tablet oriented vertically; the guide groove and the inclined contact surface are formed in a unit member that constitutes a part of the resin passage portion, The guide groove is formed in the unit member from one end to the other end along a passing direction of the unit member toward the resin discharge portion, A resin supply device in which the inclined contact surfaces are provided on both sides of the guide groove in the unit member, or on one end side of the guide groove, and contact the lower part of the outer peripheral surface of the resin tablet when it is oriented vertically.

2. The resin supplying device according to claim 1 , wherein the inclined contact surface is formed so as to cross the guide groove in a plan view of the guide groove.

3. The resin supply device according to claim 1, wherein the resin passage section has a notch on the side where the vertically oriented resin tablet comes into contact with the inclined contact surface and moves, for allowing the vertically oriented resin tablet to fall from the resin passage section.

4. The resin supplying device according to claim 1 , wherein the inclined contact surface is provided outside a passage area of ​​the resin tablet oriented sideways when viewed from the direction of passage in the resin passage portion.

5. The resin supply device according to claim 1 , wherein the resin passage portion has a flat portion that contacts a bottom surface of the vertically oriented resin tablet until the vertically oriented resin tablet contacts the inclined contact surface.

6. The resin supplying device according to claim 1 , further comprising a collection box for collecting the resin tablets removed by the inclined contact surface.

7. A resin molding apparatus comprising the resin supply device according to any one of claims 1 to 6.

8. A method for manufacturing a resin molded product by resin molding a molding object, comprising: a resin supplying step of supplying the resin tablet to a loader for transporting the molding object and the resin tablet by the resin supplying device according to any one of claims 1 to 6; a conveying step of conveying the resin tablet and the molding object to a molding die by the loader; and a molding step of clamping the mold to perform resin molding.

Images