Manufacturing method of electronic components

Abstract

To provide a manufacturing method for an electronic component, in which the deterioration in electric characteristic can be suppressed.SOLUTION: A manufacturing method for an electronic component includes: preparing a plurality of electronic component main bodies each having an element assembly and a pair of external electrodes facing each other in a first direction on the element assembly; preparing a pair of metal terminals; performing solder bonding between each of the pair of metal terminals and the corresponding external electrode out of the pair of external electrodes of the electronic component main bodies by using a flux and heating a solder in a state where the electronic component main bodies are arranged so that the element assemblies of the electronic component main bodies are adjacent to each other in a second direction that intersects with the first direction; and removing the flux existing between the element assemblies of the electronic component main bodies when the solder bonding is performed.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an electronic component. [Background technology]

[0002] A known electronic component includes multiple electronic component bodies and a pair of metal terminals (see, for example, Patent Document 1). Each of the multiple electronic component bodies has an element body and a pair of external electrodes facing each other in a first direction on the element body. The multiple electronic component bodies are arranged so that the element bodies of the multiple electronic component bodies are adjacent to each other in a second direction intersecting the first direction. The pair of metal terminals is solder-joined to corresponding ones of the pair of external electrodes of each of the multiple electronic component bodies. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-3837 Summary of the Invention [Problem to be solved by the invention]

[0004] Flux is typically used to solder a pair of metal terminals and external electrodes. The flux softens due to the heat generated when heating the solder. During soldering, the softened flux may spread into the space between adjacent elements. For example, in a configuration where the spacing between elements is small, the softened flux tends to spread into the space between the elements more than in a configuration where the spacing between elements is large. The flux that spreads into the space between the elements may come into contact with the pair of external electrodes. Flux that comes into contact with the pair of external electrodes may reduce the insulation resistance between the pair of external electrodes. A reduction in the insulation resistance between the pair of external electrodes may degrade the electrical characteristics of an electronic component.

[0005] An object of one aspect of the present invention is to provide a method for manufacturing an electronic component that can suppress deterioration of electrical characteristics. [Means for solving the problem]

[0006] A method for manufacturing an electronic component according to one embodiment includes preparing a plurality of electronic component bodies, each having an element body and a pair of external electrodes facing each other in a first direction on the element body, and preparing a pair of metal terminals. The method includes arranging the plurality of electronic component bodies so that the element bodies of the plurality of electronic component bodies are adjacent to each other in a second direction intersecting the first direction, and then using flux and heating solder to solder each of the pair of metal terminals to a corresponding one of the pair of external electrodes of each of the plurality of electronic component bodies. The method also includes removing flux present between the element bodies of the plurality of electronic component bodies when soldering.

[0007] In the above-described one aspect, when each of the pair of metal terminals is soldered to the corresponding external electrode, flux present between the element body is removed. In the electronic component obtained by the above-described one aspect, flux is unlikely to be present between the element body. Therefore, the above-described one aspect provides an electronic component that can suppress deterioration of electrical characteristics.

[0008] In the above-mentioned one aspect, removing the flux may include moving a fluid between the elements. When the step of removing the flux includes moving a fluid between the elements, the flux present between the elements is reliably removed, thereby reliably obtaining an electronic component in which the deterioration of electrical characteristics can be suppressed.

[0009] In the one aspect described above, moving the fluid may include at least one of discharging the fluid between the element bodies and sucking the fluid present between the element bodies. When moving the fluid includes at least one of discharging the fluid between the element bodies and suctioning the fluid present between the element bodies, the fluid moves reliably between the element bodies, and in this case, the flux present between the element bodies is more reliably removed, thereby more reliably obtaining electronic components that can suppress deterioration of electrical characteristics.

[0010] In one of the above aspects, ejecting a fluid between the element bodies may include ejecting the fluid between the element bodies using a nozzle that ejects the fluid, with the nozzle abutting against each of the element bodies so that the opening of the nozzle faces the space between the element bodies. When discharging the fluid between the element bodies includes using a nozzle for discharging the fluid between the element bodies while the nozzle is abutted against each of the element bodies so that the opening of the nozzle faces the space between the element bodies, the fluid is reliably discharged between the element bodies.

[0011] In one aspect above, sucking the fluid present between the element bodies may include using a nozzle for sucking the fluid to suck the fluid present between the element bodies while the nozzle is abutted against each of the element bodies so that the opening of the nozzle faces the space between the element bodies. When sucking the fluid present between the element bodies includes sucking the fluid present between the element bodies using a nozzle for sucking the fluid while the nozzle is abutted against each of the element bodies so that the opening of the nozzle faces the space between the element bodies, the fluid present between the element bodies is reliably sucked.

[0012] In one of the above aspects, moving the fluid may include ejecting the fluid between the elements from one opening of the space between the elements, and sucking the fluid present between the elements from the other opening of the space between the elements. When the step of moving the fluid includes discharging the fluid between the element bodies from one opening in the space between the element bodies and sucking the fluid present between the element bodies from the other opening in the space between the element bodies, the direction in which the fluid moves between the element bodies is easily determined. In this case, the fluid tends to move between the element bodies in the direction from the one opening to the other opening, so that the flux is reliably removed.

[0013] In one aspect, preparing the plurality of electronic component bodies may include preparing at least a first electronic component body, a second electronic component body, and a third electronic component body, each having an element body and a pair of external electrodes. Performing soldering may include arranging the first electronic component body, the second electronic component body, and the third electronic component body so that the element body of the first electronic component body and the element body of the second electronic component body are adjacent to each other in the second direction and the element body of the second electronic component body and the element body of the third electronic component body are adjacent to each other in the second direction. Removing the flux may include using a nozzle that ejects a fluid, positioning the nozzle so that an opening of the nozzle faces a space between the element body of the first electronic component body and the element body of the second electronic component body, and a space between the element body of the second electronic component body and the element body of the third electronic component body, and ejecting the fluid from the opening of the nozzle into each space. When at least a first electronic component body, a second electronic component body, and a third electronic component body are provided, the number of spaces between the element bodies is at least 2. Hereinafter, the space between the element body of the first electronic component body and the element body of the second electronic component body may be referred to as a "first space," and the space between the element body of the second electronic component body and the element body of the third electronic component body may be referred to as a "second space." When the nozzle is positioned so that the opening faces the first space and the second space, the fluid is ejected more efficiently into the first space and the second space than when the nozzle is positioned so that multiple openings face corresponding spaces out of the first space and the second space.

[0014] In one aspect, preparing the plurality of electronic component bodies may include preparing at least a first electronic component body, a second electronic component body, and a third electronic component body, each having an element body and a pair of external electrodes. Performing soldering may include arranging the first electronic component body, the second electronic component body, and the third electronic component body so that the element body of the first electronic component body and the element body of the second electronic component body are adjacent to each other in the second direction and the element body of the second electronic component body and the element body of the third electronic component body are adjacent to each other in the second direction. Removing the flux may include using a nozzle that suctions a fluid, positioning the nozzle so that an opening of the nozzle faces a space between the element body of the first electronic component body and the element body of the second electronic component body, and a space between the element body of the second electronic component body and the element body of the third electronic component body, and suctioning the fluid present in each space through the nozzle opening. When the nozzle is positioned so that the opening faces the first space and the second space, the fluid present in each of the first space and the second space is sucked in more efficiently than when the nozzle is positioned so that multiple openings face corresponding spaces of the first space and the second space.

[0015] In the above aspect, preparing the pair of metal terminals may include preparing a pair of metal terminals each having a first portion connected to a corresponding external electrode and a second portion extending from the first portion in a third direction intersecting the first direction and the second direction. Moving the fluid may include either discharging the fluid between the element bodies from an opening in the space between the element bodies in a direction opposite to the third direction, or sucking the fluid present between the element bodies. When moving the fluid includes discharging the fluid between the element bodies from an opening in the space between the element bodies in a direction opposite to the third direction, the second portion is unlikely to hinder the discharging of the fluid, and in this case, the fluid is reliably discharged into the space between the element bodies. When moving the fluid includes sucking the fluid present between the elements through an opening in the space between the elements in a direction opposite to the third direction, the second portion is unlikely to hinder the sucking of the fluid, and in this case, the fluid is reliably sucked from the space between the elements.

[0016] In the one aspect, performing the soldering may include heating the solder through the metal terminal by bringing a heating member into contact with the metal terminal to heat the metal terminal. When the soldering step includes heating the solder through the metal terminal by contacting a heating member with the metal terminal to heat the metal terminal, the metal terminal and the corresponding external electrode are easily soldered together.

[0017] In one aspect, removing the flux may include moving a heated fluid between the elements. If the flux removal step involves moving a heated fluid between the element body, a temperature difference is unlikely to occur between the external electrodes and the element body, making it difficult for thermal shock to act on the electronic component body.

[0018] In the one aspect, performing the soldering may include performing the soldering using a solder paste containing solder and flux. When the soldering step involves using a solder paste containing solder and flux, the metal terminals and the corresponding external electrodes can be easily soldered together. [Effects of the Invention]

[0019] One aspect of the present invention provides a method for manufacturing an electronic component that can suppress deterioration of electrical characteristics. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a perspective view of an electronic component manufactured by a method for manufacturing an electronic component according to one embodiment. [Figure 2]FIG. 2 is a diagram showing a cross-sectional configuration of the electronic component. [Figure 3] FIG. 3 is a side view of the electronic component. [Figure 4] FIG. 4 is a flowchart showing a method for manufacturing an electronic component according to this embodiment. [Figure 5] FIG. 5 is a diagram showing the configuration of the electronic component, the heating member, and the nozzle. [Figure 6] FIG. 6 is a diagram showing the configuration of the electronic component and the nozzle. [Figure 7] FIG. 7 is a diagram showing the configuration of the electronic component and the nozzle. [Figure 8] FIG. 8 is a diagram showing the configuration of the electronic component, the heating member, and the nozzle. [Figure 9] FIG. 9 is a perspective view of an electronic component manufactured by a method for manufacturing an electronic component according to a modified example. [Figure 10] FIG. 10 is a diagram showing the configuration of the electronic component and the nozzle. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and redundant description will be omitted.

[0022] The configuration of an electronic component 1 manufactured by the method for manufacturing an electronic component according to this embodiment will be described with reference to Figures 1 to 3. Figure 1 is a perspective view of an electronic component manufactured by the method for manufacturing an electronic component according to this embodiment. Figure 2 is a diagram showing a cross-sectional configuration of the electronic component. Figure 3 is a side view of the electronic component.

[0023] As shown in FIGS. 1 to 3, the electronic component 1 includes a plurality of electronic component bodies 3, a pair of metal terminals 5, and a plurality of solders 7. In this embodiment, the electronic component 1 includes two electronic component bodies 3 and four solders 7. In this embodiment, the electronic component body 3 is a multilayer capacitor. In the electronic component 1, the plurality of electronic component bodies 3 are arranged adjacent to one another with a gap in between in direction D2. The plurality of electronic component bodies 3 are arranged along direction D2. The electronic component 1 is mounted, for example, in an electronic device (not shown). The electronic device on which the electronic component 1 is mounted includes, for example, a circuit board or another electronic component.

[0024] As shown in FIGS. 1 to 3, the electronic component body 3 has an element body 31 , a plurality of internal electrodes 33 and 35 , and a pair of external electrodes 37 . The element body 31 has a rectangular parallelepiped shape. Examples of rectangular parallelepiped shapes include a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The element body 31 includes a pair of end faces 31a, a pair of side faces 31c, and a pair of side faces 31e. The pair of end faces 31a face each other in direction D1. The pair of side faces 31c face each other in direction D2. The pair of side faces 31e face each other in direction D3. The pair of end faces 31a, the pair of side faces 31c, and the pair of side faces 31e form the outer surface of the element body 31. The pair of side faces 31c and the pair of side faces 31e are adjacent to the pair of end faces 31a, respectively, and extend in direction D1 to connect the pair of end faces 31a.

[0025] Direction D1 is the length direction of element body 31, direction D2 is the width direction of element body 31, and direction D3 is the height direction of element body 31. The length of each element body 31 is, for example, 4.0 mm or more and 8.0 mm or less. The width of each element body 31 is, for example, 2.0 mm or more and 3.2 mm or less. The height of each element body 31 is, for example, 4.0 mm or more and 6.5 mm or less. In this embodiment, the length of element body 31 is 5.7 mm, the width of element body 31 is 2.5 mm, and the height of element body 31 is 5.0 mm.

[0026] The element body 31 is configured by laminating multiple dielectric layers (not shown). The element body 31 includes multiple laminated dielectric layers. Each dielectric layer is configured, for example, from a sintered ceramic green sheet containing a dielectric material. The dielectric material is, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, (Ba,Ca)TiO3-based, CaZrO3-based, or (Ca,Sr)ZrO3-based dielectric ceramic. The dielectric layers are integrated to the extent that the boundaries between the dielectric layers are not visible.

[0027] As described above, in the electronic component 1, the multiple electronic component bodies 3 are arranged adjacent to each other with a gap in the direction D2. Two adjacent electronic component bodies 3 are arranged so that their respective side surfaces 31c face each other. Therefore, the element bodies 31 of adjacent electronic component bodies 3 are also arranged with a gap in the direction D2. A space S corresponding to the gap in the direction D2 is defined between adjacent element bodies 31. The space S is defined by the side surfaces 31c of the adjacent element bodies 31. The interval between adjacent element bodies 31 is, for example, 0.01 mm or more and 0.5 mm or less. In this embodiment, the interval between adjacent element bodies 31 is 0.1 mm.

[0028] As shown in FIG. 2, multiple internal electrodes 33, 35 are arranged inside the element body 31. Each internal electrode 33, 35 is an internal conductor arranged inside the element body 31. The internal electrodes 33 and 35 are arranged at different positions in the direction D2. The internal electrodes 33 and 35 are arranged alternately within the element body 31 so as to face each other with a gap in the direction D2. The internal electrodes 33 and 35 may also be arranged alternately within the element body 31 so as to face each other with a gap in the direction D3. The internal electrodes 33 and 35 have opposite polarities. One end of each of the internal electrodes 33, 35 is exposed at the corresponding end face 31a. Each of the internal electrodes 33, 35 has one end exposed at the corresponding one of the pair of end faces 31a. The internal electrodes 33, 35 contain a conductive material such as Cu, Ni, or Sn, and are formed as a sintered body of a conductive paste containing the conductive material.

[0029] The pair of external electrodes 37 face each other in direction D1 on the element body 31. The pair of external electrodes 37 are spaced apart in direction D1. The external electrodes 37 are arranged at the end of the element body 31 on the end face 31a side. The external electrodes 37 are arranged on the end face 31a. The external electrodes 37 are also arranged on a pair of side faces 31c and a portion of a pair of side faces 31e. The portion of the side face 31c on which the external electrode 37 is arranged is located closer to the end face 31a. The portion of the side face 31e on which the external electrode 37 is arranged is located closer to the end face 31a. The external electrodes 37 are arranged over the entire end face 31a and on the ends of the pair of side faces 31c and the pair of side faces 31e closer to the end face 31a. The external electrodes 37 are arranged on five surfaces: one end face 31a, a pair of side faces 31c, and a pair of side faces 31e.

[0030] The portions of the external electrodes 37 located on the end faces 31 a are arranged to cover the ends of the corresponding internal electrodes 33, 35 that are exposed on the end faces 31 a. The portions of the external electrodes 37 located on the end faces 31 a are directly connected to the corresponding internal electrodes 33, 35. The internal electrodes 33, 35 are electrically connected to the corresponding external electrodes 37.

[0031] As shown in FIG. 2, the external electrode 37 has an electrode layer E. The electrode layer E includes a sintered metal layer. The sintered metal layer is formed by drying and baking a conductive paste applied to the surface of the element body 31. In this embodiment, the sintered metal layer is made of Cu. The sintered metal layer may also be made of Ag. The conductive paste contains, for example, metal powder made of Cu or Ag, glass, resin, and an organic solvent. The electrode layer E may also include a plating layer formed on the sintered metal layer. The electrode layer E may also include a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer.

[0032] As shown in FIGS. 1 to 3, the metal terminal 5 is arranged to face the end face 31a of the element body 31 in the direction D1. The pair of metal terminals 5 face each other in the direction D1. The pair of metal terminals 5 are electrically connected to corresponding external electrodes 37. The metal terminals 5 are electrically connected to corresponding internal electrodes 33, 35 via the corresponding external electrodes 37. One metal terminal 5 is electrically connected to the internal electrode 33 via one external electrode 37. The other metal terminal 5 is electrically connected to the internal electrode 35 via the other external electrode 37.

[0033] The metal terminal 5 has a portion 51 and a portion 53 extending from the portion 51. The portion 51 extends in a direction D3. When viewed from the direction D1, the portion 51 has a rectangular shape. The portion 51 is connected to a portion located on the end surface 31a of the external electrode 37 by the solder 7. The metal terminal 5 is connected to the corresponding external electrode 37. For example, if the portion 51 constitutes a first portion, the portion 53 constitutes a second portion.

[0034] Portion 51 includes arm portions 51a and 51c. Arm portions 51a and 51c sandwich electronic component body 3 in direction D3. Arm portions 51a and 51c extend from portion 51 in direction D1. Arm portion 51a is located closer to portion 53. Arm portion 51a supports a portion of external electrode 37 located on one side surface 31e. This one side surface 31e is the side surface 31e of the pair of side surfaces 31e that is located closer to portion 53. Arm portion 51c is located on the opposite side to arm portion 51a. Arm portion 51c supports a portion of external electrode 37 located on the other side surface 31e.

[0035] As described above, portion 53 extends from portion 51. Portion 53 extends from one end of portion 51 in direction D3. In the present embodiment, portion 53 extends in direction D3, in a direction from the other side surface 31e toward the one side surface 31e. For example, when direction D1 is defined as a first direction, direction D2 is defined as a second direction, and the direction in which portion 53 extends from portion 51 is defined as a third direction.

[0036] Portion 53 includes regions 53a and 53c. Region 53a extends in direction D3 from one end of portion 51. Region 53a extends in direction D3 similarly to portion 51, and portion 51 and region 53a are located on approximately the same plane.

[0037] Region 53c extends in direction D1 from one end of region 53a. Region 53c has a rectangular shape when viewed from direction D3. Regions 53a and 53c extend in directions that intersect with each other. In this embodiment, regions 53a and 53c extend in directions that are perpendicular to each other. Regions 53c of a pair of metal terminals 5 are located on approximately the same plane. Region 53c is connected to an electronic device in which electronic component 1 is mounted. In this embodiment, regions 53c extend in directions that face each other. Regions 53c may also extend in opposite directions.

[0038] Region 53a connects portion 51 and region 53c. Region 53a extends in direction D3 to connect one end of portion 51 and one end of region 53c. Portion 51 and region 53c are spaced apart by the length of region 53a when viewed in direction D3. Portion 51 and region 53c are integrally formed.

[0039] The solder 7 is disposed between the portion of the external electrode 37 located on the end face 31a and the portion 51 of the metal terminal 5. The portion of the external electrode 37 located on the end face 31a and the portion 51 of the metal terminal 5 face each other via the solder 7 in the direction D1. The solder 7 joins the external electrode 37 and the metal terminal 5. The solder 7 is conductive and electrically connects the external electrode 37 and the metal terminal 5. The solder 7 electrically and physically connects the external electrode 37 and the metal terminal 5.

[0040] Next, a method for manufacturing the electronic component 1 according to this embodiment will be described with reference to Fig. 4 to Fig. 6. Fig. 4 is a flowchart showing the method for manufacturing the electronic component according to this embodiment. Fig. 5 is a diagram showing the configuration of the electronic component, heating member, and nozzle. Fig. 6 is a diagram showing the configuration of the electronic component and nozzle.

[0041] In step S10, a plurality of electronic component bodies 3 are prepared. In this manufacturing method, a plurality of electronic component bodies 3 are prepared, each having an element body 31 and a pair of external electrodes 37 facing each other in direction D1 on the element body 31. The number of electronic component bodies 3 prepared in step S10 is "2." The plurality of electronic component bodies 3 may be newly produced in step S10, or a plurality of electronic component bodies 3 that have already been produced may be prepared.

[0042] In step S20, a pair of metal terminals 5 is prepared. In this manufacturing method, a pair of metal terminals 5 is prepared, each having a portion 51 connected to a corresponding external electrode 37 and a portion 53 extending from portion 51 in direction D3. The pair of metal terminals 5 may be newly produced in step S20, or a pair of metal terminals 5 that have already been produced may be prepared.

[0043] In step S30, soldering and flux removal are performed. First, the soldering performed in step S30 will be described below. In the soldering performed in step S30, a solder paste 7a containing solder and flux is used. The solder paste 7a is applied to the portion located on the end face 31a of the external electrode 37 and to the portion 51 of the metal terminal 5. The solder paste 7a may contain a solvent. The flux used may be, for example, rosin.

[0044] Next, heating member 100 is brought into contact with metal terminal 5 to heat metal terminal 5, thereby heating solder paste 7a through metal terminal 5. In this manufacturing method, as shown in FIG. 5 , heating member 100 is brought into contact with portion 51 of metal terminal 5, and portion 51 is pressed toward electronic component body 3. This causes heating member 100 to heat solder paste 7a containing solder and flux through portion 51. Heating member 100 is, for example, a resistance heating portion, and generates heat to heat solder paste 7a.

[0045] When heating is performed by the heating member 100, the supporting member 110 supports the electronic component 1 on the side opposite the heating member 100. The supporting member 110 supports the electronic component 1 with the external electrodes 37 and the metal terminals 5 in contact with each other. The supporting member 110 supports the portions 51 of the electronic component 1 that correspond to the metal terminals 5.

[0046] As described above, with the electronic component 1 supported by the support member 110, the heating member 100 heats the solder paste 7a containing solder and flux through the portion 51. After heating by the heating member 100, the solder contained in the solder paste 7a cools and solidifies, forming the solder 7. This forms a soldered joint between the metal terminal 5 and the external electrode 37.

[0047] Next, the removal of flux performed in step S30 will be described. The flux contained in the solder paste 7a is softened by the heat generated when the heating member 100 heats the solder paste 7a. The softened flux may spread into the space S between adjacent element bodies 31 during the above-described solder bonding. In step S30, the flux present between adjacent element bodies 31 is removed when performing the solder bonding. In this manufacturing method, solder bonding and flux removal are performed simultaneously in step S30. In this specification, "removing flux" includes not only removing all of the flux present in the space S between adjacent element bodies 31, but also reducing the amount of flux present in the space S between adjacent element bodies 31.

[0048] In step S30, flux present between the element bodies 31 is removed by moving a fluid between the element bodies 31. The fluid moved between the element bodies 31 includes, for example, a gas or a liquid. The gas includes, for example, air gas or nitrogen gas. In step S30, when moving the fluid between the element bodies 31, at least one of discharging the fluid between the element bodies 31 and suctioning the fluid present between the element bodies 31 is performed. In this manufacturing method, when moving the fluid between the element bodies 31, either the fluid is discharged between the element bodies 31 from an opening Sa in the space S between the element bodies 31 in a direction opposite to the direction in which the portion 53 extends from the portion 51, or the fluid present between the element bodies 31 is suctioned from the opening Sa.

[0049] In step S30, a nozzle 200 and a pump 210 connected to the nozzle 200 are used to move a fluid between the element bodies 31. As described above, in this manufacturing method, the fluid is moved by discharging the fluid from the opening Sa between the element bodies 31. Therefore, in this manufacturing method, the nozzle 200 functions as a nozzle that discharges the fluid, and the pump 210 functions as a pump that sends the fluid to be discharged to the nozzle 200. The nozzle 200 has an opening 200a that discharges the fluid. In this manufacturing method, the number of openings 200a is "1." In this manufacturing method, as shown in FIG. 6, the opening 200a has a circular shape when viewed from direction D3. The circular shape includes a perfect circle, an oval shape, or an ellipse shape. The shape of the opening 200a is not limited to a circular shape. For example, the opening 200a may have a rectangular shape when viewed from direction D3.

[0050] 6, in step S30, nozzle 200 is brought into contact with each of element bodies 31 so that opening 200a faces space S between element bodies 31. In this manufacturing method, nozzle 200 is brought into contact with each of element bodies 31 so that the center of opening 200a faces space S. Nozzle 200 is brought into contact with each of element bodies 31 so that opening 200a straddles space S when viewed from direction D3. Nozzle 200 is brought into contact with each of element bodies 31 from a direction in direction D3 opposite to the direction in which portion 53 extends from portion 51.

[0051] The width of opening 200a is equal to or greater than 1 / 8 and less than 2 / 3 of the length of element body 31. In this manufacturing method, the width of opening 200a is 1 / 5 of the length of element body 31. The width of opening 200a is determined by the length of opening 200a in direction D1.

[0052] Next, a fluid is ejected from the opening 200a of the nozzle 200 between the element bodies 31. In step S30, the fluid is ejected between the element bodies 31 while the nozzle 200 is in contact with each of the element bodies 31 so that the opening 200a of the nozzle 200 faces the space S between the element bodies 31. As described above, the nozzle 200 is brought into contact with each of the element bodies 31 from the direction D3 opposite to the direction in which the portion 53 extends from the portion 51. In this manufacturing method, a heated fluid is ejected from the opening Sa between the element bodies 31. That is, in this manufacturing method, a heated fluid is moved between the element bodies 31 to remove the flux.

[0053] The temperature of the fluid is set to correspond to the heating temperature when the heating member 100 heats the solder paste 7a. For example, the temperature of the fluid is 50° C. or more and 200° C. or less. In this manufacturing method, the temperature of the fluid is 50° C.

[0054] As described above, in the method for manufacturing an electronic component according to this embodiment, flux present between element bodies 31 is removed when soldering each of a pair of metal terminals 5 to the corresponding external electrode 37. In an electronic component 1 obtained by the method for manufacturing an electronic component according to this embodiment, flux is unlikely to be present between element bodies 31. Therefore, the method for manufacturing an electronic component according to this embodiment can obtain an electronic component 1 that can suppress deterioration of electrical characteristics. Flux generally has a high electrical resistance. However, for example, if the insulation resistance of the electronic component body 3 is low, the electrical resistance of the flux may affect the insulation resistance of the electronic component body 3. In an electronic component body 3 with low insulation resistance, the effect of flux adhesion on the insulation resistance may not be negligible. According to the manufacturing method of this embodiment, an electronic component 1 can be reliably obtained that can suppress deterioration of electrical characteristics, even if the insulation resistance of the electronic component body 3 is low. When the flux adheres to a side surface 31c other than the side surface 31c that defines the space S, or to the side surface 31e, the softened flux is unlikely to spread over the surface to which it adheres. When the flux adheres to the side surface 31c that defines the space S, the softened flux tends to spread throughout the space S. In a configuration in which the distance between the opposing side surfaces 31c is small, the softened flux tends to spread throughout the space S compared to a configuration in which the distance between the opposing side surfaces 31c is large.

[0055] In conventional methods for manufacturing electronic components, after the soldering, the flux present between element bodies 31 is cleaned. In the method for manufacturing an electronic component according to this embodiment, the flux present between element bodies 31 is removed when the soldering is performed, so the above-mentioned cleaning of the flux can be omitted or simplified. Therefore, the method for manufacturing an electronic component according to this embodiment makes it possible to easily obtain an electronic component 1 that can suppress deterioration of electrical characteristics.

[0056] In the method for manufacturing an electronic component according to this embodiment, removing the flux includes moving a fluid between element bodies 31 . The method for manufacturing an electronic component according to this embodiment reliably removes flux present between element bodies 31. In this case, an electronic component 1 capable of suppressing deterioration of electrical characteristics can be reliably obtained.

[0057] In the method for manufacturing an electronic component according to this embodiment, moving the fluid includes at least one of ejecting the fluid between the element bodies 31 or sucking the fluid present between the element bodies 31. In the method for manufacturing an electronic component according to this embodiment, fluid moves reliably between element bodies 31. In this case, flux present between element bodies 31 is more reliably removed, and therefore, electronic component 1 capable of suppressing degradation of electrical characteristics is more reliably obtained.

[0058] In the method for manufacturing an electronic component according to this embodiment, ejecting a fluid between the element bodies 31 includes using a nozzle 200 for ejecting the fluid to eject the fluid between the element bodies 31 while the nozzle 200 is abutted against each of the element bodies 31 so that the opening 200a of the nozzle 200 faces the space S between the element bodies 31. In the method for manufacturing an electronic component according to this embodiment, the fluid is reliably discharged between element bodies 31 .

[0059] In the method for manufacturing an electronic component according to this embodiment, moving the fluid includes either ejecting the fluid from the opening Sa to the element body 31 in the space S between the element bodies 31, or sucking the fluid present between the opening Sa and the element body 31. When a fluid is ejected between the element bodies 31 from an opening located on the opposite side of the opening 200a in the space S between the element bodies 31, or when a fluid is sucked between the element bodies 31 from the opening, part 53 may hinder the ejection or sucking of the fluid. When discharging the fluid between element bodies 31 to move the fluid, portions 53 are unlikely to obstruct the discharging of the fluid in the method for manufacturing an electronic component according to this embodiment. In this case, the fluid is reliably discharged into spaces S between element bodies 31. When the method for manufacturing an electronic component according to this embodiment involves suctioning the fluid present between element bodies 31 in order to move the fluid, portions 53 are unlikely to impede the suction of the fluid. In this case, the fluid is reliably suctioned from spaces S between element bodies 31.

[0060] In the manufacturing method of an electronic component according to this embodiment, performing soldering includes heating the solder through the metal terminal 5 by contacting the heating member 100 with the metal terminal 5 and heating the metal terminal 5. In the method for manufacturing an electronic component according to this embodiment, metal terminals 5 and corresponding external electrodes 37 are easily soldered together.

[0061] In the method for manufacturing an electronic component according to this embodiment, removing the flux includes moving a heated fluid between element bodies 31 . When the heating member 100 heats the solder through the metal terminal 5, the external electrode 37 of the electronic component body 3 is also heated along with the solder. Therefore, if an unheated fluid is moved between the element bodies 31, a temperature difference occurs between the external electrode 37 and the element body 31. This temperature difference may cause a thermal shock to act on the electronic component body 3. In the method for manufacturing an electronic component according to this embodiment, a temperature difference is unlikely to occur between the external electrode 37 and the element body 31. In this case, a thermal shock is unlikely to act on the electronic component body 3.

[0062] In the method for manufacturing an electronic component according to this embodiment, performing soldering includes performing soldering using solder paste 7a containing solder and flux. In the method for manufacturing an electronic component according to this embodiment, the metal terminals 5 and the corresponding external electrodes 37 are easily soldered together.

[0063] Next, a modified example of moving the fluid will be described. This modified example differs from the above-described embodiment in the method of moving the fluid. The following mainly describes the differences between the above-described embodiment and this modified example.

[0064] In this modified example, to move the fluid, the fluid present between the opening Sa and the element bodies 31 is sucked. Therefore, in this modified example, the nozzle 200 functions as a nozzle that sucks the fluid, and the pump 210 functions as a pump that generates a suction force that sucks the fluid through the opening 200a of the nozzle 200. In this modified example as well, first, the nozzle 200 is brought into contact with each of the element bodies 31 so that the opening 200a faces the space S between the element bodies 31. The nozzle 200 is brought into contact with each of the element bodies 31 from a direction, within direction D3, opposite to the direction in which the portion 53 extends from the portion 51.

[0065] Next, the fluid present between the opening 200a of the nozzle 200 and the element bodies 31 is sucked. In this modified example, when the fluid present between the element bodies 31 is sucked, the nozzle 200 is abutted against each of the element bodies 31 so that the opening 200a of the nozzle 200 faces the space S between the element bodies 31, and the fluid present between the element bodies 31 is sucked. As described above, the nozzle 200 is abutted against each of the element bodies 31 from the direction D3 opposite to the direction in which the portion 53 extends from the portion 51. Therefore, in this modified example, the fluid present between the opening Sa and the element bodies 31 is sucked.

[0066] In this modified example, sucking the fluid present between the element bodies 31 includes sucking the fluid present between the element bodies 31 while the nozzle 200 is abutted against each of the element bodies 31 so that the opening 200a of the nozzle 200 faces the space S between the element bodies 31. In this modification, the fluid present between the element bodies 31 is reliably sucked.

[0067] Next, a modified example of the nozzle 200 will be described with reference to Fig. 7. Fig. 7 is a diagram showing the configuration of an electronic component and a nozzle. This modified example differs from the above-described embodiment and modified example in terms of the configuration of the nozzle 200. Below, the differences between this modified example and the above-described embodiment and modified example will be mainly described.

[0068] As shown in FIG. 7 , the nozzle 200 has a plurality of openings 200a. In this modification, the number of openings 200a is two. In this modification, in step S30, the nozzle 200 is first brought into contact with each of the element bodies 31 so that each of the plurality of openings 200a faces the space S. The plurality of openings 200a are spaced apart from one another in the direction D1. The plurality of openings 200a are spaced apart from one another in the direction D1. The spacing is, for example, greater than or equal to one-quarter and less than two-thirds of the length of the element body. Next, at least one of ejecting a fluid from the nozzle openings 200a between the element bodies 31 and sucking a fluid present between the element bodies 31 is performed. In this modification, the nozzle 200 may function as a nozzle that ejects a fluid or as a nozzle that sucks a fluid.

[0069] Next, another modified example of moving a fluid will be described with reference to Fig. 8. Fig. 8 is a diagram showing the configuration of an electronic component, a heating member, and a nozzle. This modified example differs from the above-described embodiment and modified example in the method of moving the fluid. Below, the differences between this modified example and the above-described embodiment and modified example will be mainly described.

[0070] In this modified example, when moving a fluid between the element bodies 31, the fluid is discharged between the element bodies 31 from one opening in the space S between the element bodies 31, and the fluid present between the element bodies 31 is sucked from the other opening in the space S between the element bodies 31. In this modified example, the fluid is discharged between the element bodies 31 from an opening Sa in the space S, and the fluid present between the element bodies 31 is sucked from another opening in the space S that is located on the opposite side from the opening Sa. The relationship between the discharge and suction of the fluid and the openings in the space S is not limited to the relationship described above. The fluid may be discharged between the element bodies 31 from the other opening, and the fluid present between the element bodies 31 may be sucked from the opening Sa.

[0071] 8, in this modification, nozzle 200A, pump 210A connected to nozzle 200A, and nozzle 200B, pump 210B connected to nozzle 200B are used to move fluid between element bodies 31. Nozzle 200A functions as a nozzle that discharges fluid, and pump 210A functions as a pump that sends out the fluid to be discharged to nozzle 200A. Nozzle 200B functions as a nozzle that sucks in fluid, and pump 210B functions as a pump that generates a suction force that sucks in the fluid from the opening of nozzle 200B.

[0072] In this modification, in step S30, nozzle 200A is brought into contact with each of element bodies 31 from the direction D3 opposite to the direction in which portion 53 extends from portion 51. Nozzle 200B is brought into contact with each of element bodies 31 from the direction in which portion 53 extends from portion 51. Next, fluid is ejected from the opening of nozzle 200A between element bodies 31, and fluid present between element bodies 31 and the opening of nozzle 200B is sucked in.

[0073] In this modified example, the direction in which the fluid moves is easily determined between the element bodies 31. In this case, the fluid easily moves between the element bodies 31 in the direction from one opening of the space S to the other opening of the space S, so that the flux is reliably removed.

[0074] Next, another modified example of moving a fluid will be described with reference to Figs. 9 and 10. Fig. 9 is a perspective view of an electronic component. Fig. 10 is a diagram showing the configuration of the electronic component and the nozzle. This modified example differs from the above-described embodiment and each of the modified examples in the configuration of the electronic component body 3 and the configuration of the nozzle 200 to be prepared. Below, the differences from the above-described embodiment and each of the modified examples will be mainly described.

[0075] In step S10, when preparing a plurality of electronic component bodies, at least electronic component body 3A, electronic component body 3B, and electronic component body 3C are prepared, each having the above-described element body 31 and a pair of external electrodes 37. In this modification, electronic component bodies 3A, 3B, and 3C are also multilayer capacitors. In this modification, the number of electronic component bodies prepared in step S10 is "3." Therefore, electronic component 1A manufactured by the electronic component manufacturing method according to this modification includes electronic component body 3A, electronic component body 3B, and electronic component body 3C. For example, if electronic component body 3A constitutes a first electronic component body, electronic component body 3B constitutes a second electronic component body, and electronic component body 3C constitutes a third electronic component body.

[0076] In step S30, when performing solder bonding, first, the electronic component body 3A and the electronic component body 3B are arranged so that the element body 31 of the electronic component body 3A and the element body 31 of the electronic component body 3B are adjacent to each other in direction D2. The two adjacent electronic component bodies 3 are arranged so that their respective side surfaces 31c face each other. Next, the electronic component body 3C is arranged so that the element body 31 of the electronic component body 3B and the element body 31 of the electronic component body 3C are adjacent to each other in direction D2. The electronic component body 3A, the electronic component body 3B, and the electronic component body 3C are arranged adjacent to each other with a gap in between in direction D2.

[0077] As described above, the electronic component body 3A, the electronic component body 3B, and the electronic component body 3C are arranged adjacent to each other with a gap in the direction D2. The adjacent electronic component bodies 3A and 3B are arranged so that their respective side surfaces 31c face each other. The adjacent electronic component bodies 3B and 3C are arranged so that their respective side surfaces 31c face each other. Therefore, a space S1 is defined between the element body 31 of the electronic component body 3A and the element body 31 of the electronic component body 3B. A space S2 is defined between the element body 31 of the electronic component body 3B and the element body 31 of the electronic component body 3C.

[0078] In step S30, as shown in FIG. 10 , to remove the flux, the nozzle 200 is positioned so that the opening 200a of the nozzle 200 faces the space S1 and the space S2. That is, the nozzle 200 is brought into contact with the element body 31 of each electronic component body 3A, 3B, 3C so that the opening 200a faces the space S1 and the space S2. The nozzle 200 is brought into contact with each of the element bodies 31 so that the opening 200a straddles the space S1 and the space S2 as viewed from the direction D3. Next, at least one of ejecting a fluid from the nozzle opening 200a into each of the spaces S1 and S2 and sucking the fluid present in each of the spaces S1 and S2 is performed. In this modification, the nozzle 200 may function as a nozzle that ejects a fluid or as a nozzle that sucks a fluid.

[0079] When nozzle 200 functions as a nozzle for ejecting fluid, in this modified example, the fluid is ejected more efficiently into space S1 and space S2 than when the nozzle is positioned so that multiple openings face corresponding spaces of space S1 and space S2. When nozzle 200 functions as a nozzle for sucking fluid, in this modified example, the fluid present in each of space S1 and space S2 is sucked in more efficiently than when the nozzle is positioned so that multiple openings face corresponding spaces of space S1 and space S2.

[0080] The above describes the embodiments and modifications of the present invention, but the present invention is not necessarily limited to the above-described embodiments and modifications, and various modifications are possible within the scope of the gist of the present invention.

[0081] In the method for manufacturing electronic component 1 , removing flux does not necessarily involve moving a fluid between element bodies 31 . In a manufacturing method of an electronic component 1 in which removing the flux includes moving a fluid between the elements 31, as described above, an electronic component 1 can be reliably obtained that can suppress deterioration of electrical characteristics.

[0082] In the manufacturing method of electronic component 1, moving the fluid does not have to include at least one of discharging the fluid between element bodies 31 or sucking the fluid present between element bodies 31. In the manufacturing method of electronic component 1 in which moving the fluid includes at least one of ejecting the fluid between element bodies 31 or sucking the fluid present between element bodies 31, as described above, the flux present between element bodies 31 is more reliably removed, so that electronic component 1 capable of suppressing deterioration of electrical characteristics can be more reliably obtained.

[0083] In the manufacturing method of electronic component 1, ejecting a fluid between element bodies 31 may not include ejecting the fluid between element bodies 31 using a nozzle 200 that ejects the fluid, while abutting the nozzle 200 against each of the element bodies 31 so that the opening 200a of the nozzle 200 faces the space S between the element bodies 31. In the manufacturing method of electronic component 1, in which the ejection of fluid between element bodies 31 includes using a nozzle 200 for ejecting fluid to eject fluid between element bodies 31 while the nozzle 200 is abutted against each of the element bodies 31 so that the opening 200a of the nozzle 200 faces the space S between the element bodies 31, the fluid is reliably ejected between the element bodies 31 as described above.

[0084] In the manufacturing method of electronic component 1, moving the fluid does not have to include either ejecting the fluid from the opening Sa to the space S between the element bodies 31, or sucking the fluid present between the opening Sa and the element bodies 31. In the manufacturing method of electronic component 1, in which moving the fluid includes ejecting the fluid from opening Sa into space S between element bodies 31, the fluid is reliably ejected into space S between element bodies 31, as described above. In the manufacturing method of electronic component 1, in which moving the fluid includes sucking the fluid present between element bodies 31 through opening Sa in the space S between element bodies 31, as described above, the fluid is reliably sucked from the space S between element bodies 31.

[0085] In the manufacturing method of the electronic component 1, performing soldering may not include heating the solder through the metal terminal 5 by contacting the heating member 100 with the metal terminal 5 and heating the metal terminal 5. In the manufacturing method of the electronic component 1, in which the soldering step includes heating the solder through the metal terminal 5 by contacting the heating member 100 with the metal terminal 5 to heat the metal terminal 5, the metal terminal 5 and the corresponding external electrode 37 are easily soldered together as described above.

[0086] In the method for manufacturing electronic component 1 , removing flux does not necessarily involve moving a heated fluid between element bodies 31 . In a manufacturing method of an electronic component 1 in which removing the flux involves moving a heated fluid between the element bodies 31, as described above, thermal shock is less likely to affect the electronic component body 3.

[0087] In the method for manufacturing electronic component 1, performing soldering may include performing soldering using solder paste 7a containing solder and flux. In the method for manufacturing the electronic component 1, in which the soldering step includes performing the soldering using the solder paste 7a containing solder and flux, the metal terminal 5 and the corresponding external electrode 37 are easily soldered together, as described above.

[0088] In the above-described embodiment and each modified example, the electronic component bodies 3, 3A, 3B, and 3C included in the electronic component 1 have been described as multilayer capacitors, but the electronic component bodies included in electronic components to which the present invention can be applied are not limited to multilayer capacitors. Examples of electronic component bodies included in electronic components to which the present invention can be applied include multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, and multilayer solid-state batteries.

[0089] In the above-described embodiment and each modified example, the multiple electronic component bodies 3 and the electronic component bodies 3A, 3B, and 3C are arranged adjacent to one another with a gap in the direction D2. However, the direction in which the multiple electronic component bodies 3 and the electronic component bodies 3A, 3B, and 3C are arranged is not limited to the above-described direction. For example, the multiple electronic component bodies 3 and the electronic component bodies 3A, 3B, and 3C may be arranged adjacent to one another with a gap in the direction D3.

[0090] As can be understood from the above description of the embodiment and each modification, this specification includes disclosure of the following aspects. (Appendix 1) preparing a plurality of electronic component bodies each including an element body and a pair of external electrodes facing each other in a first direction on the element body; providing a pair of metal terminals; a plurality of electronic component bodies are arranged such that the element bodies of the plurality of electronic component bodies are adjacent to each other in a second direction intersecting the first direction, and then, using flux and heating solder, solder-joining each of the pair of metal terminals to a corresponding one of the pair of external electrodes of each of the plurality of electronic component bodies; a step of removing the flux present between the element bodies of the plurality of electronic component bodies when performing the soldering. (Appendix 2) 2. The method for manufacturing an electronic component according to claim 1, wherein removing the flux includes moving a fluid between the elements. (Appendix 3) 3. The method for manufacturing an electronic component described in Appendix 2, wherein moving the fluid includes at least one of discharging a fluid between the element bodies or sucking a fluid present between the element bodies. (Appendix 4) The method for manufacturing an electronic component described in Appendix 3, wherein discharging the fluid between the element bodies includes using a nozzle for discharging a fluid to discharge the fluid between the element bodies while abutting the nozzle against each of the element bodies so that an opening of the nozzle faces the space between the element bodies. (Appendix 5) 4. The method for manufacturing an electronic component described in Appendix 3, wherein sucking the fluid present between the element bodies includes using a nozzle for sucking a fluid to suck the fluid present between the element bodies while abutting the nozzle against each of the element bodies so that an opening of the nozzle faces the space between the element bodies. (Appendix 6) A method for manufacturing an electronic component according to any one of appendices 3 to 5, wherein moving the fluid includes discharging the fluid between the element bodies from one opening of the space between the element bodies and sucking the fluid present between the element bodies from the other opening of the space between the element bodies. (Appendix 7) preparing the plurality of electronic component bodies includes preparing at least a first electronic component body, a second electronic component body, and a third electronic component body, each having the element body and the pair of external electrodes; performing the soldering includes arranging the first electronic component body, the second electronic component body, and the third electronic component body so that the element body of the first electronic component body and the element body of the second electronic component body are adjacent to each other in the second direction, and the element body of the second electronic component body and the element body of the third electronic component body are adjacent to each other in the second direction, The flux is removed by using a nozzle that ejects a fluid. positioning the nozzle so that an opening of the nozzle faces a space between the element body of the first electronic component body and the element body of the second electronic component body, and a space between the element body of the second electronic component body and the element body of the third electronic component body; 4. The method for manufacturing an electronic component according to claim 3, further comprising ejecting the fluid from the opening of the nozzle into each of the spaces. (Appendix 8) preparing the plurality of electronic component bodies includes preparing at least a first electronic component body, a second electronic component body, and a third electronic component body, each having the element body and the pair of external electrodes; performing the soldering includes arranging the first electronic component body, the second electronic component body, and the third electronic component body so that the element body of the first electronic component body and the element body of the second electronic component body are adjacent to each other in the second direction, and the element body of the second electronic component body and the element body of the third electronic component body are adjacent to each other in the second direction, The flux removal step includes: positioning the nozzle so that an opening of the nozzle faces a space between the element body of the first electronic component body and the element body of the second electronic component body, and a space between the element body of the second electronic component body and the element body of the third electronic component body; 4. The method for manufacturing an electronic component according to claim 3, further comprising sucking the fluid present in each of the spaces through the opening of the nozzle. (Appendix 9) preparing the pair of metal terminals includes preparing a pair of metal terminals each having a first portion connected to the corresponding external electrode and a second portion extending from the first portion in a third direction intersecting the first direction and the second direction; A method for manufacturing an electronic component described in any one of Appendices 2 to 5, wherein moving the fluid includes either ejecting the fluid between the element bodies from an opening in the space between the element bodies in a direction opposite to the third direction, or sucking the fluid present between the element bodies from the opening. (Appendix 10) The method for manufacturing an electronic component according to any one of appendices 1 to 9, wherein performing the soldering includes heating the solder through the metal terminal by bringing a heating member into contact with the metal terminal to heat the metal terminal. (Appendix 11) 11. The method for manufacturing an electronic component according to claim 10, wherein removing the flux comprises moving a heated fluid between the elements. (Appendix 12) 13. The method for manufacturing an electronic component according to any one of appendices 1 to 12, wherein performing the soldering includes performing the soldering using a solder paste containing the solder and the flux. [Explanation of symbols]

[0091] 1, 1A...electronic component, 3, 3A, 3B, 3C...electronic component body, 5...metal terminal, 7...solder, 7a...solder paste, 31...element body, 37...external electrode, 100...heating member, 200, 200A, 200B...nozzle, 200a...nozzle opening, D1, D2, D3...direction, S, S1, S2...space, Sa...space opening.

Claims

1. preparing a plurality of electronic component bodies each including an element body and a pair of external electrodes facing each other in a first direction on the element body; providing a pair of metal terminals; a plurality of electronic component bodies are arranged such that the element bodies of the plurality of electronic component bodies are adjacent to each other in a second direction intersecting the first direction, and then, using flux and heating solder, solder-joining each of the pair of metal terminals to a corresponding one of the pair of external electrodes of each of the plurality of electronic component bodies; a step of removing the flux present between the element bodies of the plurality of electronic component bodies when performing the soldering.

2. The method for manufacturing an electronic component according to claim 1 , wherein removing the flux includes moving a fluid between the elements.

3. 3. The method for manufacturing an electronic component according to claim 2, wherein the moving of the fluid includes at least one of discharging the fluid between the element bodies and sucking the fluid present between the element bodies.

4. 4. The method for manufacturing an electronic component according to claim 3, wherein discharging the fluid between the element bodies includes using a nozzle for discharging a fluid to discharge the fluid between the element bodies while the nozzle is abutted against each of the element bodies so that an opening of the nozzle faces into the space between the element bodies.

5. 4. The method for manufacturing an electronic component according to claim 3, wherein suctioning the fluid present between the element bodies includes using a nozzle for suctioning a fluid to suction the fluid present between the element bodies while abutting the nozzle against each of the element bodies so that an opening of the nozzle faces into the space between the element bodies.

6. 4. The method for manufacturing an electronic component according to claim 3, wherein moving the fluid includes discharging the fluid between the element bodies from one opening of the space between the element bodies and sucking the fluid present between the element bodies from the other opening of the space between the element bodies.

7. preparing the plurality of electronic component bodies includes preparing at least a first electronic component body, a second electronic component body, and a third electronic component body, each of which has the element body and the pair of external electrodes; performing the soldering includes arranging the first electronic component body, the second electronic component body, and the third electronic component body so that the element body of the first electronic component body and the element body of the second electronic component body are adjacent to each other in the second direction, and the element body of the second electronic component body and the element body of the third electronic component body are adjacent to each other in the second direction, The flux is removed by using a nozzle that ejects a fluid. positioning the nozzle so that an opening of the nozzle faces a space between the element body of the first electronic component body and the element body of the second electronic component body, and a space between the element body of the second electronic component body and the element body of the third electronic component body; The method for manufacturing an electronic component according to claim 3 , further comprising ejecting the fluid from the opening of the nozzle into each of the spaces.

8. preparing the plurality of electronic component bodies includes preparing at least a first electronic component body, a second electronic component body, and a third electronic component body, each of which has the element body and the pair of external electrodes; performing the soldering includes arranging the first electronic component body, the second electronic component body, and the third electronic component body so that the element body of the first electronic component body and the element body of the second electronic component body are adjacent to each other in the second direction, and the element body of the second electronic component body and the element body of the third electronic component body are adjacent to each other in the second direction, The flux removal step includes: positioning the nozzle so that an opening of the nozzle faces a space between the element body of the first electronic component body and the element body of the second electronic component body, and a space between the element body of the second electronic component body and the element body of the third electronic component body; The method for manufacturing an electronic component according to claim 3 , further comprising sucking the fluid present in each of the spaces through the openings of the nozzle.

9. preparing the pair of metal terminals includes preparing a pair of metal terminals each having a first portion connected to the corresponding external electrode and a second portion extending from the first portion in a third direction intersecting the first direction and the second direction; 3. The method for manufacturing an electronic component according to claim 2, wherein moving the fluid includes either ejecting the fluid between the element bodies from an opening in the space between the element bodies in a direction opposite to the third direction, or sucking the fluid present between the element bodies.

10. 2. The method for manufacturing an electronic component according to claim 1, wherein the soldering step includes heating the solder through the metal terminals by bringing a heating member into contact with the metal terminals and heating the metal terminals.

11. The method for manufacturing an electronic component according to claim 10, wherein removing the flux includes moving a heated fluid between the elements.

12. The method for manufacturing an electronic component according to claim 1 , wherein the step of performing the soldering includes performing the soldering using a solder paste containing the solder and the flux.

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