Power Conversion Device

Abstract

To provide a power conversion device in which vibration resistance of a control board is improved while suppressing an increase in size.SOLUTION: A power conversion device includes: a power module; a capacitor module that are connected to the power module; a control board that has a plurality of control electronic components for controlling the power module; a first case that accommodates a specific control electronic component and is formed into a bottomed cylindrical shape; and a housing that accommodates the power module, the capacitor module, the control board, and the first case. At least a part of the first case is accommodated together with other electronic components other than the control electronic component in a second case formed in a bottomed cylindrical shape via a sealing resin, the first case is arranged in an opening of the second case, and at least a part of the other electronic components is arranged closer to the side of a bottom portion of the second case than the first case.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present application relates to a power conversion device. [Background technology]

[0002] Electrically powered vehicles, such as hybrid vehicles, plug-in hybrid vehicles, electric vehicles, and fuel cell vehicles, are equipped with power conversion devices, which are components for electrification. Examples of power conversion devices include inverters that convert direct current (DC) power from a battery into alternating current (AC) power and supply it to a drive motor, and converters that increase or decrease the battery voltage. To ensure sufficient trunk space and passenger space in these vehicles, power conversion devices must be installed in limited spaces. Therefore, there is a growing demand for power conversion devices to be compact components. Furthermore, because the power conversion devices installed in these vehicles are connected to the housings of heat and vibration sources, such as engines, transmissions, or motors, the power conversion devices must be highly durable against heat and vibration.

[0003] The inverter and converter are composed of a control board, a capacitor module, multiple power modules, terminals connecting the multiple power modules, and insulating members arranged between the terminals. A structure in which these components can withstand severe vibration and heat has been disclosed (see, for example, Patent Document 1). In the structure disclosed in Patent Document 1, the capacitor module and the control board are installed in positions where they are not adjacent to each other, and a support member that supports the control board and a terminal cover that insulates the terminals of the power modules are provided integrally. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2017-112656 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above-mentioned Patent Document 1, a support member for supporting the control board and a terminal cover for insulating the terminals of the power module are integrally provided, thereby suppressing vibration of the control board. However, as the number of control electronic components tends to increase as the control board becomes more sophisticated, there is a problem that the durability of the control board against vibration decreases when the number of control electronic components is increased. Furthermore, if an additional support member for supporting the control board is provided as the number of control electronic components increases, there is a problem that the power conversion device becomes larger.

[0006] Therefore, an object of the present application is to obtain a power conversion device in which the vibration resistance of the control board is improved while suppressing an increase in size. [Means for solving the problem]

[0007] The power conversion device disclosed in the present application includes a power module, a capacitor module connected to the power module, a control board having a plurality of control electronic components for controlling the power module, a first case formed in a cylindrical shape with a bottom that houses specific control electronic components, and a housing that houses the power module, the capacitor module, the control board, and the first case, and at least a portion of the first case, together with other electronic components other than the control electronic components, is housed in a second case formed in a cylindrical shape with a bottom via a sealing resin, and the first case is arranged at an opening of the second case, and at least a portion of the other electronic components are arranged closer to the bottom of the second case than the first case. At least a part of the first case is accommodated in a second case via a sealing resin together with a capacitor element, which is another electronic component, and a capacitor module is formed by the capacitor element, the second case, and the sealing resin. The first case has an anchor portion on the outside of the first case, and the anchor portion is embedded in the sealing resin. The anchor portion is a protrusion protruding from the bottom of the first case toward the outer periphery. is. [Effects of the Invention]

[0008] The power conversion device disclosed herein includes a power module, a capacitor module, a control board having a plurality of control electronic components for controlling the power module, a first case formed into a cylindrical shape with a bottom and housing the specific control electronic components, and a housing housing the power module, the capacitor module, the control board, and the first case. At least a portion of the first case, together with other electronic components other than the control electronic components, is housed in a second case formed into a cylindrical shape with a bottom via a sealing resin. The first case is disposed at an opening of the second case, and at least a portion of the other electronic components are disposed closer to the bottom of the second case than the first case. Therefore, the control board is supported by the first case, the sealing resin, and the second case via the specific control electronic components, thereby improving the vibration resistance of the control board. Furthermore, because the control board is supported by the second case housing the other electronic components, the power conversion device is prevented from becoming large. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a plan view showing an outline of a power conversion device according to a first embodiment. [Figure 2] 1 is a plan view showing an outline of a power conversion device according to a first embodiment. [Figure 3] 3 is a cross-sectional view of the power converter taken along the line AA in FIG. 2. [Figure 4] FIG. 2 is a perspective view of a first case of the power conversion device according to the first embodiment. [Figure 5] 3 is a plan view of a first case of the power converter according to the first embodiment. FIG. [Figure 6] 1 is a perspective view of a power module of a power conversion device according to a first embodiment. [Figure 7] 4 is a cross-sectional view showing an outline of another power conversion device according to the first embodiment. FIG. [Figure 8] 5 is a plan view of another first case of the power converter according to the first embodiment. FIG. [Figure 9] 9 is a cross-sectional view of another first case taken along the line BB in FIG. 8. [Figure 10]1 is a diagram illustrating an example of an installation state of a power conversion device according to a first embodiment. [Figure 11] FIG. 10 is a cross-sectional view showing an outline of a power conversion device according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a power conversion device according to an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or equivalent members and parts are denoted by the same reference numerals.

[0011] Embodiment 1 Fig. 1 is a plan view showing an outline of a power conversion device 1 according to embodiment 1, with bus bars 54 omitted, Fig. 2 is a plan view showing an outline of the power conversion device 1, with the control board 6 removed, Fig. 3 is a cross-sectional view of the power conversion device 1 taken at cross section AA in Fig. 2, with the control board 6 added, Fig. 4 is a perspective view of a first case 52 of the power conversion device 1, Fig. 5 is a plan view of the first case 52 of the power conversion device 1, Fig. 6 is a perspective view of a power module 3 of the power conversion device 1, and Fig. 10 is a diagram showing an example of an installation state of the power conversion device 1. The power conversion device 1 is a device that converts an input current from DC to AC, AC to DC, or an input voltage to a different voltage.

[0012] The power conversion device 1 includes a power module 3, a capacitor module 4 connected to the power module 3, a control board 6 having a plurality of control electronic components 6a for controlling the power module 3, a first case 52 formed in a cylindrical shape with a bottom and accommodating specific control electronic components 51, and a housing 2 accommodating the power module 3, the capacitor module 4, the control board 6, and the first case 52. As shown in FIG. 1 , the power conversion device 1 in this embodiment is a device that receives DC power from a power supply side terminal 46 of the capacitor module 4 connected to a DC power source (not shown) and smoothes it in the capacitor module 4, converts the DC power in the power module 3, and outputs it from an output terminal 33. This embodiment illustrates the power conversion device 1 that outputs three-phase AC, and the power module is composed of three power modules 3 corresponding to each phase. While the power conversion device 1 includes three power modules 3, the number of power modules 3 included in the power conversion device 1 is not limited to this. Furthermore, the configuration of the power conversion device 1 is not limited to this, and the power conversion device 1 may also be a device that converts input current from AC to DC.

[0013] <Case 2> The housing 2 is made of a metal such as aluminum. As shown in Fig. 3, the housing 2 is formed, for example, in the shape of a cylinder with a bottom. The control board 6 is disposed closer to the opening of the housing 2 than the power module 3 and the capacitor module 4, and the specific control electronic components 51 are disposed closer to the bottom of the housing 2 than the control board 6. With this configuration, the height of the housing 2 can be reduced, thereby preventing the power conversion device 1 from becoming larger.

[0014] The housing 2 has a first surface 2b to which the power module 3 is thermally connected, and a second surface 2c to which the capacitor module 4 is thermally connected. The housing 2 has a refrigerant flow path 21 on the back side of the first surface 2b for cooling the first surface 2b. The portion of the housing 2 where the refrigerant flow path 21 is provided is a flow path forming portion 23. The refrigerant flow path 21 is a flow path through which a refrigerant flows. For example, water or ethylene glycol liquid is used as the refrigerant. With this configuration, the first surface 2b is cooled by the refrigerant, and therefore the power module 3 thermally connected to the first surface 2b can be efficiently cooled.

[0015] Here, the direction opposite to the normal direction of the first surface 2b is referred to as the anti-normal direction, a specific direction parallel to the first surface 2b is referred to as the first direction, and a direction parallel to the first surface 2b and perpendicular to the first direction is referred to as the second direction. In the figure, the X1 direction is one side of the first direction, the X2 direction is the other side of the first direction, the Y direction is the second direction, the Z1 direction is the normal direction, and the Z2 direction is the anti-normal direction. In this embodiment, the second surface 2c faces the normal direction and is located on one side of the first surface 2b in the first direction and on the anti-normal side of the first surface 2b, and the housing 2 has a step portion 2a between the first surface 2b and the second surface 2c. The normal direction position of the end of the power module 3 on the normal direction side is equivalent to the normal direction position of the end of the capacitor module 4 on the normal direction side. The term "equivalent" means that the position of the capacitor module 4 in the normal direction is within 10% of the width of the power module 3 in the normal direction relative to the position of the power module 3 in the normal direction.

[0016] By forming the step portion 2a in this manner, it is possible to align the heights of the power module 3 and the capacitor module 4 in the normal direction without providing any extra space in which components of the power conversion device 1 are not placed. Since the heights of the power module 3 and the capacitor module 4 in the normal direction are aligned, it is possible to prevent the power conversion device 1 from becoming larger in size in the normal direction.

[0017] The control board 6 is arranged to at least partially overlap one or both of the capacitor module 4 and the power module 3 when viewed in a direction perpendicular to the plate surface of the control board 6. In the present embodiment, the control board 6 is arranged to partially overlap both of the capacitor module 4 and the power module 3. With this configuration, the control board 6 is arranged adjacent to one or both of the capacitor module 4 and the power module 3, thereby preventing the power conversion device 1 from becoming larger. Furthermore, since one or both of the capacitor module 4 and the power module 3 are arranged in a stacked configuration with the control board 6, a large control board 6 can be arranged, improving the layout flexibility of these components. Since a large control board 6 can be arranged, both the control circuit and the driver circuit can be integrated onto a single board. Furthermore, since the control board 6 is adjacent to one or both of the capacitor module 4 and the power module 3, an increase in wiring inductance of the power conversion device 1 can be prevented. Furthermore, in this embodiment, the normal heights of the power module 3 and the capacitor module 4 are the same, so that the large control board 6 can be placed adjacent to the power module 3 and the capacitor module 4 without leaving any extra space where the components that make up the power conversion device 1 are not placed.

[0018] The portion of the housing 2 having the first surface 2b is the base portion 22 formed in a plate shape. The base portion 22 is made of, for example, a metal such as aluminum, like the main body portion of the housing 2, but is not limited to this and may be made of a resin member with excellent thermal conductivity. The back surface of the base portion 22 opposite the first surface 2b constitutes part of the inner surface of the refrigerant flow path 21. One or more cooling fins 22a are provided on the back surface of the base portion 22 in an area that overlaps with the module main body portion 32 when viewed in the normal direction. The refrigerant flow path 21 has an upstream flow path 21a, a downstream flow path 21b, and an intermediate flow path 21c. The intermediate flow path 21c is a flow path through which the refrigerant flows from one side in the first direction to the other side in the first direction through the cooling fin 22a. The upstream flow path 21a is connected to one side in the first direction of the intermediate flow path 21c and extends in the second direction. The downstream flow path 21b is a flow path that is connected to the other side of the intermediate flow path 21c in the first direction and extends in the second direction.

[0019] The refrigerant flows through the upstream flow path 21a, the intermediate flow path 21c, and the downstream flow path 21b in this order. As shown in FIG. 1, the flow path forming portion 23 has a header 24. The header 24 is an inlet / outlet port through which the refrigerant flows into or out of the refrigerant flow path 21. The header 24 protrudes from the outer wall surface of the housing 2. The upstream flow path 21a is arranged so as to overlap the area between the module main body 32 and the capacitor module 4 when viewed in the normal direction. With this configuration, a low-temperature refrigerant flows through the upstream flow path 21a before cooling the power module 3, and therefore the second surface 2c disposed adjacent to the first surface 2b is also efficiently cooled by the upstream flow path 21a. Because the second surface 2c is cooled, the capacitor module 4 thermally connected to the second surface 2c can be cooled.

[0020] <Power Module 3> The power module 3 will be described using Fig. 6. Although Fig. 6 shows only one power module 3, the other power modules 3 have the same configuration. The power module 3 includes a module main body 32 that houses one or more semiconductor elements (not shown), a power terminal 31, an output terminal 33, and a control terminal 34 (not shown in Fig. 6).

[0021] The power module 3 is formed in a rectangular parallelepiped shape having a first surface 3a, a second surface 3b opposite the first surface 3a, and four side surfaces surrounding the first surface 3a and the second surface 3b. The four side surfaces are a first side surface 3c, a second side surface 3d opposite the first side surface 3c, a third side surface 3e, and a fourth side surface 3f opposite the third side surface 3e. The first surface 3a of the power module 3 is thermally connected to the first surface 2b via a bonding member (not shown). The bonding member is, for example, solder. A control board 6 is disposed in the normal direction of the second surface 3b.

[0022] As shown in Fig. 1, the three power modules 3 are arranged side by side in the same direction in the second direction, with the direction from the first side surface 3c to the second side surface 3d of the power module 3 being parallel to the second direction. The arrangement of the multiple power modules 3 is not limited to an arrangement in which they are arranged side by side in the same direction in the second direction, but by configuring them in this way, the multiple power modules 3 are arranged in alignment in the same direction, which makes it possible to reduce the size of the power conversion device 1. When more than one power module 3 is provided, the power modules 3 may be arranged in two rows.

[0023] The power terminal 31, the output terminal 33, and the control terminal 34 are provided to protrude from the main body of the power module 3. These terminals are made of, for example, copper, which has low electrical resistivity and excellent conductivity. The control terminal 34, which is connected to the control board 6, is a terminal related to driving the power module 3. The power terminal 31 and the output terminal 33 are terminals related to input and output of the power module 3. The power terminal 31 is electrically connected to the capacitor bus bar 42 and connected to a DC power source via the capacitor module 4. The output terminal 33 is connected to, for example, a motor, which is a load. The control terminal 34 protrudes from at least one of the second surface 3b, the third side surface 3e, and the fourth side surface 3f of the power module 3, and then extends toward the control board 6 as shown in FIG. 3 and is connected to the control board 6 at a board connection portion 6b of the control board 6. In this embodiment, the control terminal 34 is provided on the third side surface 3e of the power module 3.

[0024] The power module 3 is formed by transfer molding. Therefore, the semiconductor elements are covered with mold resin. This configuration makes it possible to easily protect the semiconductor elements from the outside. Note that the power module 3 is not limited to a configuration formed by transfer molding, and may be configured such that the semiconductor elements are housed in a second case (described later) and the inside of the second case is filled with sealing resin.

[0025] <Capacitor module 4> The capacitor module 4 includes a capacitor element 41, which is an electronic component other than the control electronic component 6a, a second case 45 formed in a cylindrical shape with a bottom, and the sealing resin 44. The capacitor module 4 also includes a capacitor bus bar 42 protruding from the second case 45 and connected to the power terminal 31. The capacitor element 41 has capacitor electrodes 43 at both ends. Each of the capacitor electrodes 43 is a positive electrode or a negative electrode. One end of the capacitor bus bar 42 is electrically connected to the capacitor element 41, and the other end is connected to the power terminal 31. The capacitor bus bar 42 is made of, for example, copper, which has low electrical resistivity and excellent conductivity. The capacitor bus bar 42 and the power terminal 31 are connected by welding at a power terminal connection portion 47 where the capacitor bus bar 42 and the power terminal 31 meet. The connection between the capacitor bus bar 42 and the power terminal 31 is not limited to welding, and may be connected by soldering, fitting, or screw fastening.

[0026] The second case 45 is made of aluminum by die-casting, for example. The sealing resin 44 is an insulating member made of epoxy resin or the like. In this embodiment, the bottom wall 45b of the second case 45 is formed in a rectangular shape. The material and shape of the second case 45 are not limited to this. The second case 45 has an opening 45a, which is an open portion on the side opposite the bottom wall 45b of the second case 45. The capacitor bus bar 42 protrudes from the sealing resin 44 at the opening 45a. In this embodiment, the second case 45 is arranged so that the opening 45a faces the normal direction, and the capacitor bus bar 42 protrudes from the sealing resin 44 in the normal direction. The arrangement of the second case 45 is not limited to this. As shown in FIG. 7 , the second case 45 may be arranged so that the opening 45a faces the other side of the first direction, so that the capacitor bus bar 42 protrudes from the sealing resin 44 toward the power module 3.

[0027] The capacitor element 41 smoothes DC power. The capacitor element 41 is a wound-type film capacitor having a laminated structure. The capacitor element 41 is an element configured by laminating a metal film and a dielectric, which is an insulating member. The capacitor element 41 has capacitor electrodes 43 on end surfaces in a normal direction and an opposite direction to the normal direction, which intersects with a first direction in which the metal film is laminated. In this embodiment, one capacitor electrode 43 is disposed on the bottom wall 45b side, and the other capacitor electrode 43 is disposed on the opening 45a side. The arrangement of the capacitor electrodes 43 is not limited thereto. The capacitor electrode 43 may be disposed on a side of the capacitor element 41 between the bottom wall 45b side and the opening 45a side of the capacitor element 41.

[0028] The thermal conductivity of a metal film is higher than that of a dielectric. Therefore, the thermal conductivity of capacitor element 41 is higher in a direction intersecting the direction in which the metal film is laminated than in the first direction, which is the direction in which the metal film is laminated. When capacitor electrode 43 and bottom wall 45b are arranged in the direction opposite the normal, as in this embodiment, the thermal conductivity of capacitor element 41 is higher in the direction opposite the normal. Therefore, by aligning the direction of high thermal conductivity of capacitor element 41 with the direction of the heat dissipation path in which bottom wall 45b of second case 45 is arranged, heat from capacitor element 41 can be more efficiently dissipated to the bottom wall 45b of second case 45.

[0029] The capacitor element in this embodiment is a film capacitor. The capacitor element is not limited to a film capacitor. When the capacitor element is a film capacitor, the change in capacitance due to temperature is smaller than that of other capacitor elements. Therefore, even if the specific control electronic component 51 housed in the first case 52 generates heat, it does not affect the performance of the power conversion device 1.

[0030] The capacitor module 4 is thermally connected to the housing 2 at the bottom wall 45b or the side wall 45c of the second case 45. In the embodiment shown in FIG. 3, the bottom wall 45b of the second case 45 is thermally connected to the second surface 2c of the housing 2. In the embodiment shown in FIG. 7, the side wall 45c of the second case 45 is thermally connected to the second surface 2c of the housing 2. The thermal connection is not limited to a configuration in which the bottom wall 45b or the side wall 45c and the second surface 2c are connected through direct contact. The bottom wall 45b or the side wall 45c and the second surface 2c may also be thermally connected via a heat transfer member 49. By thermally connecting the second case 45 to the housing 2, heat from the capacitor element 41 can be dissipated to the housing 2 from the bottom wall 45b or the side wall 45c of the second case 45, thereby improving the heat dissipation performance of the capacitor element 41. When bottom wall 45b or side wall 45c is thermally connected to second surface 2c via heat transfer member 49, the heat dissipation performance of capacitor element 41 can be further improved.

[0031] The heat transfer member 49 is, for example, a heat dissipation sheet or grease. When a heat dissipation sheet is used for the heat transfer member 49, the assembly of the power conversion device 1 is simplified, thereby improving the productivity of the power conversion device 1. When a resilient heat dissipation sheet is used for the heat transfer member 49, the vibration resistance of the capacitor module 4 can be improved. When grease is used for the heat transfer member 49, the adhesion between the capacitor module 4 and the housing 2 is improved, and the occurrence of gaps that may occur between the capacitor module 4 and the housing 2 can be suppressed. Since the occurrence of gaps between the capacitor module 4 and the housing 2 is suppressed, an increase in thermal resistance between the capacitor module 4 and the housing 2 can be suppressed.

[0032] In this embodiment, the second case 45 accommodates three capacitor elements 41. In Fig. 2, the outline of the capacitor elements 41 is indicated by a dashed line. Each of the three capacitor elements 41 is connected to each of the three power modules 3. The number of capacitor elements 41 is not limited to three. A plurality of power modules 3 may be connected to one capacitor element 41, or a plurality of capacitor elements 41 may be connected to one power module 3.

[0033] A first capacitor bus bar and a second capacitor bus bar are provided as the capacitor bus bars 42. One of the first capacitor bus bar and the second capacitor bus bar is a positive bus bar 42a, and the other of the first capacitor bus bar and the second capacitor bus bar is a negative bus bar 42b. The positive bus bar 42a is connected to the positive power terminal 31, and the negative bus bar 42b is connected to the negative power terminal 31 at a portion protruding from the sealing resin 44 to the outside.

[0034] Capacitor element 41 has a first electrode, which is capacitor electrode 43 connected to the first capacitor bus bar, and a second electrode, which is capacitor electrode 43 connected to the second capacitor bus bar. One of the first and second electrodes is disposed on the bottom wall 45b side of capacitor element 41 of second case 45, and the other of the first and second electrodes is disposed on the opening 45a side of capacitor element 41 of second case 45. In this embodiment, one of the first and second electrodes is bottom wall-side electrode 43b, and the other of the first and second electrodes is open-side electrode 43a. Within sealing resin 44, negative electrode bus bar 42b is connected to bottom wall-side electrode 43b, and positive electrode bus bar 42a is connected to open-side electrode 43a. In this embodiment, open-side electrode 43a is the positive electrode and bottom wall-side electrode 43b is the negative electrode, but it does not matter whether open-side electrode 43a or bottom wall-side electrode 43b is the positive electrode. The capacitor bus bar 42 connected to the positive electrode becomes the positive electrode bus bar 42a, and the capacitor bus bar 42 connected to the negative electrode becomes the negative electrode bus bar 42b.

[0035] 1, the capacitor module 4 has a power supply terminal 46, one end of which extends outward from the second case 45 and is electrically connected to a DC power supply. The other end of the power supply terminal 46 is connected to the positive bus bar 42a or the negative bus bar 42b within the sealing resin 44. The power supply terminal 46 is made of, for example, copper, which has low electrical resistivity and excellent conductivity.

[0036] 3, the exposed portion of the capacitor bus bar 42 protruding to the outside from the sealing resin 44 extends outside the side wall 45c of the second case 45, then extends along the outer surface of the side wall 45c of the second case 45 toward the second surface 2c, and then extends along the first surface 2b toward the module main body 32. This configuration makes it possible to shorten the length of the capacitor bus bar 42. Because the length of the capacitor bus bar 42 is shortened, the capacitor module 4 and the power module 3 can be connected with low wiring inductance.

[0037] The capacitor bus bar 42 has a board connection terminal 48 that extends in the normal direction at a portion exposed to the outside from the sealing resin 44 and is electrically connected to the control board 6. The board connection terminal 48 is a control terminal different from the control terminal 34 that is provided protruding outward from the module main body 32, and is a DESAT terminal that is connected to a driver circuit on the control board 6 that supplies power to the power module 3. In this embodiment, the board connection terminal 48 is formed on the positive bus bar 42a. The board connection terminal 48 is omitted in FIGS. 1 and 2. The capacitor bus bar 42 has an end that is connected to the capacitor electrode 43, the board connection terminal 48, a power terminal connection portion 47 that is connected to the power terminal 31, and a portion that is connected to the power supply side terminal 46.

[0038] <Case 1 52> A first case 52 accommodating a specific control electronic component 51, which is a key feature of the present application, will now be described. At least a portion of the first case 52, together with other electronic components other than the control electronic component 6a, is accommodated in a second case formed in a bottomed, cylindrical shape via a sealing resin. The first case 52 is disposed in an opening of the second case, and at least a portion of the other electronic components are disposed closer to the bottom of the second case than the first case 52. In this embodiment, as described above, an example will be described in which the other electronic component other than the control electronic component 6a is a capacitor element 41. At least a portion of the first case 52, together with the capacitor element 41, which is another electronic component, is accommodated in a second case 45 via a sealing resin 44, and the first case 52 is disposed in an opening 45a of the second case 45. In the example shown in FIG. 3, the entire capacitor element 41 is disposed closer to the bottom wall 45b, which is the bottom of the second case 45, than the first case 52. In the embodiment shown in FIG. 7, a portion of the capacitor element 41 is disposed closer to the bottom wall 45b of the second case 45 than the first case 52. The electronic components other than the control electronic component 6a are not limited to the capacitor element 41, but may be semiconductor elements included in the power module 3, or other elements. When the other electronic components are semiconductor elements, at least a portion of the first case 52 is housed together with the semiconductor elements in the second case via a sealing resin. In this embodiment, the first case 52 is disposed opposite the control board 6.

[0039] In this manner, a specific control electronic component 51 among the multiple control electronic components 6a is housed in the first case 52, and at least a portion of the first case 52 is housed in the second case 45 via the sealing resin 44, along with other electronic components. Therefore, the control board 6 is supported by the first case 52, the sealing resin 44, and the second case 45 via the specific control electronic component 51, thereby improving the vibration resistance of the control board 6. Furthermore, since the second case 45 housing the other electronic components is used to support the control board 6, an increase in size of the power conversion device 1 can be suppressed. Furthermore, if the other electronic component is a capacitor element 41 and the capacitor element 41, the second case 45, and the sealing resin 44 form a capacitor module 4, the case of the capacitor module 4 can be used as the second case 45, thereby further suppressing an increase in size of the power conversion device 1. Furthermore, since the first case 52 is installed within the capacitor module 4, when the control board 6 is located on the side of the opening 45a of the capacitor module 4, the specific control electronic component 51 can be easily connected to the control board 6.

[0040] The specific control electronic component 51 housed in the first case 52 is, for example, the largest or heaviest component among the multiple control electronic components 6a electrically connected to the control board 6. The largest or heaviest component among the control electronic components 6a is the component that most easily transmits vibrations applied to the power conversion device 1 to the control board 6. If the specific control electronic component 51 is the largest or heaviest component among the multiple control electronic components 6a, the largest or heaviest component is not supported by other components and is not mounted alone on the control board 6, thereby further improving the vibration resistance of the control board 6.

[0041] The specific control electronic component 51 is, for example, a transformer or a PCB insertion component. A transformer is a component used for power backup and has an iron core and a coil, making it a large and heavy component. A large and heavy component is a component that easily transmits vibrations applied to the large and heavy component to the control board 6. A PCB insertion component is a component that is mounted on the control board 6 via a through hole provided in the control board 6. A PCB insertion component is, for example, an electrolytic capacitor, a noise filter, a film capacitor, or an electrical resistor. A PCB insertion component is connected to the control board 6 by a metal wire protruding from the main body of the PCB insertion component. Therefore, when the main body of the PCB insertion component shakes due to vibration, the component is a component that easily transmits the vibration to the control board 6. When the specific control electronic component 51 is a transformer or a board-inserted component, the specific control electronic component 51 is supported by the first case 52, the sealing resin 44, and the second case 45, and vibrations applied to the specific control electronic component 51 are less likely to be transmitted to the control board 6, thereby reliably improving the vibration resistance of the control board 6.

[0042] In this embodiment, the specific control electronic component 51 is housed in the first case 52 via a component sealing resin 53. The component sealing resin 53 is an insulating material made of epoxy resin or the like. This configuration allows the specific control electronic component 51 to be stably fixed to the first case 52. In addition, heat from the capacitor element 41 can be easily dissipated to the housing 2 side.

[0043] The specific control electronic component 51 is not limited to a component mounted on the control board 6 via a through-hole provided in the control board 6. As shown in FIG. 7 , the main body of the specific control electronic component 51 may be connected to the control board 6 via a lead wire or a connector terminal, and the main body and the control board 6 may be spaced apart. The lead wire may be, for example, a harness 58. By using a lead wire or a connector terminal that can be flexibly connected to a connection point provided on the control board 6 to connect the specific control electronic component 51 to the control board 6, the specific control electronic component 51 and the control board 6 can be easily connected. Furthermore, because the capacitor module 4 is configured by stacking multiple components within the second case 45, the positional tolerance of the specific control electronic component 51 may be large. However, by connecting the control board 6 and the specific control electronic component 51 via a harness or a connector, the control board 6 and the specific control electronic component 51 can be easily connected without relying on the positional tolerance.

[0044] In this embodiment, the specific control electronic component 51 is disposed at a distance from the inner surface of the first case 52. With this configuration, it is possible to stably provide an insulation distance between the capacitor element 41 and the specific control electronic component 51.

[0045] In this embodiment, component sealing resin 53 has a lower thermal conductivity than sealing resin 44. In this embodiment, both component sealing resin 53 and sealing resin 44 are epoxy resins, but resins with different thermal conductivities can be produced by adjusting the filler materials of each component. In this way, by interposing component sealing resin 53, which has a lower thermal conductivity than sealing resin 44, between specific control electronic component 51 and first case 52, even if specific control electronic component 51 in first case 52 generates heat, thermal damage to capacitor element 41 due to the heat generated by specific control electronic component 51 can be suppressed.

[0046] When the capacitor element 41 is housed in the second case 45 via the sealing resin 44, a space must be provided between the opening 45a of the second case 45 and the open-side electrode 43a of the capacitor element 41, and the space must be filled with the sealing resin 44 to reduce the effects of moisture absorption by the sealing resin 44 that seals the capacitor element 41. In the present embodiment shown in FIG. 3 , the bottom of the first case 52 and the capacitor element 41 are disposed opposite each other via the sealing resin 44. This configuration allows the placement of a specific control electronic component 51 by utilizing the space provided between the opening 45a of the second case 45 and the open-side electrode 43a of the capacitor element 41, thereby enabling the miniaturization of the power converter 1. Furthermore, the amount of sealing resin 44 filled into the second case 45 is reduced, thereby enabling the cost of the power converter 1 to be reduced.

[0047] The structure of the first case 52 in this embodiment will be described with reference to FIGS. 4 and 5. The upper, bottomed, cylindrical portion of the first case 52 in FIG. 4 is formed in a rectangular parallelepiped shape. The first case 52 is made of a metal such as aluminum. The material of the first case 52 is not limited to metal, and the first case 52 may be made of a resin member. When the first case 52 is made of metal, it is possible to easily manufacture a first case 52 with excellent thermal conductivity. Furthermore, the first case 52 can be easily manufactured by die casting.

[0048] The first case 52 is fixed to the control board 6 by fixing portions 55 provided on the first case 52. The fixing portions 55 are provided so as to protrude toward the control board 6 from the portion of the peripheral wall 52a that faces the control board 6 around the opening of the first case 52. In the present embodiment, four fixing portions 55 are provided, but the number of fixing portions 55 is not limited to this. The first case 52 is thermally connected to the control board 6 at the fixing portions 55 by screws, solder, or the like. Since no insulating member such as a heat dissipation sheet or grease is provided between the fixing portions 55 and the control board 6, there is no electrical insulation between the fixing portions 55 and the control board 6.

[0049] The connection between the first case 52 and the control board 6 is not limited to the connection via the fixing portion 55, and the first case 52 and the control board 6 may be connected only by a specific control electronic component 51. When the first case 52 is fixed to the control board 6 by the fixing portion 55, the number of fixing points between the first case 52 and the control board 6 increases, thereby improving the vibration resistance of the control board 6. Furthermore, since there is no need to provide a separate vibration control component to improve the vibration resistance of the control board 6, an increase in the size of the power conversion device 1 can be suppressed. Note that the connection between the first case 52 and the control board 6 is not limited to the connection via the fixing portion 55, and the portion of the peripheral wall 52a around the opening of the first case 52 that faces the control board 6 may be directly connected to the control board 6.

[0050] In this embodiment, as shown in FIG. 3 , the first case 52 has a bus bar 54 made of metal and thermally connected to the housing 2. The bus bar 54 is made of, for example, copper or aluminum, which have excellent thermal conductivity. The bus bar 54 is attached to the first case 52 and the housing 2 with screws or solder. This configuration allows heat generated by the capacitor element 41 to be dissipated not only from the second case 45 and the second surface 2c of the housing 2, but also from the first case 52 to the housing 2 via the bus bar 54. This improves the heat resistance of the capacitor module 4. Furthermore, since the control board 6 is electrically connected to the housing 2 via the bus bar 54, the control board 6 can be grounded via the first case 52.

[0051] The first case 52 has anchor portions 56 on the outside thereof, and the anchor portions 56 are embedded in the sealing resin 44. In this embodiment, as shown in FIG. 4 , the anchor portions 56 are protruding from the bottom of the first case 52 toward the outer periphery. While the protruding portions are annular, the shape of the protruding portions is not limited thereto, and multiple protruding portions may protrude from the bottom of the first case 52 toward the outer periphery. Vibrations from the control board 6 are transmitted to the first case 52, and the first case 52 itself may vibrate due to vibrations applied to the power conversion device 1. By providing the anchor portions 56 in this manner, detachment of the first case 52 from the sealing resin 44 due to vibrations of the first case 52 can be suppressed. When the anchor portions 56 are protruding from the bottom of the first case 52 toward the outer periphery, the anchor portions 56 can be easily manufactured together with the main body of the first case 52 by, for example, die casting.

[0052] The shape of the anchor portion 56 is not limited to the shape shown in Fig. 4, and may be the shapes shown in Figs. 8 and 9. Fig. 8 is a plan view of another first case 52 of the power converter 1, and Fig. 9 is a cross-sectional view of another first case 52 of the power converter 1 taken along the line BB in Fig. 8. The anchor portion 56 is a portion that protrudes from the bottom of the outer periphery of the first case 52 to the other side in the Z direction and then extends inward. With this configuration, the anchor portion 56 does not protrude from the first case 52 to the outer periphery, and therefore the outer periphery of the first case 52 can be made smaller.

[0053] <Installation example of power conversion device 1> An example of installation of the power conversion device 1 will be described. The power conversion device 1 is, for example, equipment mounted on a vehicle 7. The vehicle 7 has a vibration generating source 8 such as an engine, a transmission, or a motor. When the power conversion device 1 is mounted on the vehicle 7, the housing 2 is fixed to the vibration generating source 8 in the vehicle 7 as shown in FIG. 10. In FIG. 10, the housing 2 is the part indicated by the dashed line. With the power conversion device 1 configured as described above, the vibration resistance of the control board 6 can be ensured even if the housing 2 of the power conversion device 1 is fixed to the vibration generating source 8 of the vehicle 7, which has strict vibration resistance requirements.

[0054] As described above, the power conversion device 1 according to the first embodiment includes the power module 3, the capacitor module 4, the control board 6 having a plurality of control electronic components 6a that control the power module 3, the first case 52 formed in a cylindrical shape with a bottom that houses a specific control electronic component 51, and the housing 2 that houses the power module 3, the capacitor module 4, the control board 6, and the first case 52. At least a portion of the first case 52, together with other electronic components other than the control electronic component, is housed in the second case 45 formed in a cylindrical shape with a bottom via the sealing resin 44. The first case 52 is disposed in the opening 45a of the second case 45, and at least some of the other electronic components are disposed closer to the bottom of the second case 45 than the first case 52. Therefore, the control board 6 is supported by the first case 52, the sealing resin 44, and the second case 45 via the specific control electronic component 51, thereby improving the vibration resistance of the control board 6. Furthermore, since the second case 45 that houses other electronic components is used to support the control board 6, it is possible to prevent the power conversion device 1 from becoming larger.

[0055] When at least a portion of the first case 52 is housed in the second case 45 via the sealing resin 44 together with the capacitor element 41, which is another electronic component, and the capacitor element 41, the second case 45, and the sealing resin 44 form a capacitor module 4, the case of the capacitor module 4 can be used as the second case 45, thereby further preventing the power conversion device 1 from becoming larger. Furthermore, when the bottom of the first case 52 and the capacitor element 41 are arranged opposite each other via the sealing resin 44, the space provided between the opening 45a of the second case 45 and the open-side electrode 43a of the capacitor element 41 can be used to arrange a specific control electronic component 51, thereby reducing the size of the power conversion device 1.

[0056] When the specific control electronic component 51 housed in the first case 52 is the largest or heaviest component among the multiple control electronic components electrically connected to the control board 6, and the specific control electronic component 51 is housed in the first case 52 via the component sealing resin 53, the largest or heaviest component is not mounted alone on the control board 6 without being supported by other components, which further improves the vibration resistance of the control board 6. In addition, the specific control electronic component 51 can be stably fixed to the first case 52.

[0057] The main body of the specific control electronic component 51 is connected to the control board 6 via a lead wire or a connector terminal, and when the main body and the control board 6 are separated from each other, the specific control electronic component 51 can be easily connected to the control board 6 by using a lead wire or a connector terminal that can be flexibly connected to a connection point provided on the control board 6. In addition, by connecting the control board 6 and the specific control electronic component 51 with a harness or a connector, the control board 6 and the specific control electronic component 51 can be easily connected without being dependent on the positional tolerance of the specific control electronic component 51.

[0058] When the specific control electronic component 51 is disposed at a distance from the inner surface of the first case 52, it is possible to stably provide an insulation distance between the capacitor element 41 and the specific control electronic component 51. Furthermore, when the first case 52 is fixed to the control board 6 by the fixing portion 55 of the first case 52, the number of fixing points between the first case 52 and the control board 6 increases, thereby improving the vibration resistance of the control board 6.

[0059] When the first case 52 has anchor portions 56 on the outside of the first case 52 and the anchor portions 56 are embedded in the sealing resin 44, it is possible to prevent the first case 52 from becoming detached from the sealing resin 44 due to vibration of the first case 52. Furthermore, when the anchor portions 56 are protrusions that protrude from the bottom of the first case 52 toward the outer periphery, the anchor portions 56 can be easily produced together with the main body of the first case 52 by, for example, die casting.

[0060] When first case 52 is made of metal, it is possible to easily manufacture first case 52 with excellent thermal conductivity. Furthermore, when first case 52 has bus bar 54 made of metal that is thermally connected to housing 2, heat generated by capacitor element 41 can be dissipated not only from second case 45 and second surface 2c of housing 2 but also from first case 52 via bus bar 54 to housing 2, thereby improving the heat resistance of capacitor module 4.

[0061] When the housing 2 is formed in a cylindrical shape with a bottom, the control board 6 is arranged closer to the opening of the housing 2 than the power module 3 and the capacitor module 4, and the specific control electronic component 51 is arranged closer to the bottom of the housing 2 than the control board 6, the height of the housing 2 can be reduced, thereby preventing the power conversion device 1 from becoming larger. Furthermore, when the control board 6 is arranged so that at least a portion of it overlaps with one or both of the capacitor module 4 and the power module 3 when viewed in a direction perpendicular to the plate surface of the control board 6, the capacitor module 4 and / or the power module 3 and the control board 6 are arranged in a stacked manner, so a large control board 6 can be arranged, and the layout of these components can be improved.

[0062] When the capacitor module 4 is thermally connected to the housing 2 at the bottom wall 45b or the side wall 45c of the second case 45 via the heat transfer member 49, heat can be dissipated from the capacitor element 41 via the heat transfer member 49 from the bottom wall 45b or the side wall 45c of the second case 45, thereby improving the heat dissipation performance of the capacitor element 41. Furthermore, when the housing 2 has a first surface 2b to which the power module 3 is thermally connected and a second surface 2c to which the capacitor module 4 is thermally connected, the housing 2 has a step portion 2a between the first surface 2b and the second surface 2c, and the normal direction position of the end of the power module 3 on the normal direction is equal to the normal direction position of the end of the capacitor module 4 on the normal direction, the normal heights of the power module 3 and the capacitor module 4 can be made equal without providing any extra space in which components of the power conversion device 1 are not disposed, thereby preventing the power conversion device 1 from becoming larger in size in the normal direction.

[0063] If the housing 2 has a refrigerant flow path on the back side of the first surface 2b that cools the first surface 2b, the first surface 2b is cooled by the refrigerant, and the power module 3 that is thermally connected to the first surface 2b can be cooled efficiently. Also, if the specific control electronic component 51 is a transformer or a board-inserted component, the vibration resistance of the control board 6 can be reliably improved.

[0064] If the component sealing resin 53 has a lower thermal conductivity than the sealing resin 44, even if a specific control electronic component 51 in the first case 52 generates heat, thermal damage to the capacitor element 41 due to the heat generated by the specific control electronic component 51 can be suppressed. Furthermore, if a heat dissipation sheet is used for the heat transfer member 49, the assembly of the power conversion device 1 is simplified, thereby improving the productivity of the power conversion device 1. Furthermore, if grease is used for the heat transfer member 49, the adhesion between the capacitor module 4 and the housing 2 is improved, and the occurrence of gaps that may occur between the capacitor module 4 and the housing 2 can be suppressed.

[0065] If capacitor element 41 is a film capacitor, its capacitance changes less with temperature than other capacitor elements, and therefore even if specific control electronic component 51 housed in first case 52 generates heat, it does not affect the performance of power conversion device 1. Furthermore, if housing 2 is fixed to vibration generating source 8 in vehicle 7, with power conversion device 1 disclosed in the present application, the vibration resistance of control board 6 can be ensured even if housing 2 of power conversion device 1 is fixed to vibration generating source 8 of vehicle 7, which has strict vibration resistance requirements.

[0066] Embodiment 2 A power conversion device 1 according to embodiment 2 will be described. Fig. 11 is a cross-sectional view showing an outline of the power conversion device 1 according to embodiment 2, in which the power conversion device 1 is cut at a position equivalent to the cut position shown in Fig. 2. The power conversion device 1 according to embodiment 2 has a different configuration for fixing a specific control electronic component 51 to a first case 52 from that of embodiment 1.

[0067] The specific control electronic component 51 housed in the first case 52 is the largest or heaviest component among the multiple control electronic components electrically connected to the control board 6. The specific control electronic component 51 is fixed to the first case 52 by a connecting member. In this embodiment, the specific control electronic component 51 is fixed to the bottom of the first case 52 by a screw 57. The connecting member is not limited to a screw, and the specific control electronic component 51 may be fixed to the bottom of the first case 52 by solder or adhesive. Furthermore, the fixing location of the specific control electronic component 51 is not limited to the bottom of the first case 52, and may be a side wall within the first case 52.

[0068] With this configuration, the specific control electronic component 51 is fixed to the first case 52 by an inexpensive joining member, thereby reducing the cost of the power conversion device 1. Since the specific control electronic component 51 can be easily fixed to the first case 52 by an inexpensive joining member, the productivity of the power conversion device 1 can be improved. Furthermore, when the specific control electronic component 51 generates heat, the heat can be easily dissipated from the first case 52 to the housing 2 via the bus bar 54.

[0069] The main body of the specific control electronic component 51 is connected to the control board 6 via a lead wire or a connector terminal, and the main body and the control board 6 are spaced apart. The lead wire is, for example, a harness 58. By using a lead wire or a connector terminal that can be flexibly connected to a connection point provided on the control board 6 to connect the specific control electronic component 51 to the control board 6, the specific control electronic component 51 and the control board 6 can be easily connected. Furthermore, because the capacitor module 4 is configured by stacking multiple components within the second case 45, there is a possibility that the positional tolerance of the specific control electronic component 51 will be large. However, by connecting the control board 6 and the specific control electronic component 51 with a harness or a connector, the control board 6 and the specific control electronic component 51 can be easily connected without relying on the positional tolerance.

[0070] Furthermore, although the present application describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to application to a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless variations not illustrated are conceivable within the scope of the technology disclosed in the present specification, including, for example, cases where at least one component is modified, added, or omitted, and cases where at least one component is extracted and combined with components of another embodiment.

[0071] Various aspects of the present disclosure are summarized below as appendices. (Appendix 1) a power module, a capacitor module connected to the power module, a control board having a plurality of electronic control components for controlling the power module, a first case formed in a cylindrical shape with a bottom and accommodating certain of the electronic control components, and a housing accommodating the power module, the capacitor module, the control board, and the first case; At least a portion of the first case is accommodated in a second case formed in a bottomed cylindrical shape via a sealing resin together with other electronic components other than the control electronic component, A power conversion device in which the first case is arranged in an opening of the second case, and at least some of the other electronic components are arranged closer to the bottom of the second case than the first case. (Appendix 2) A power conversion device as described in Appendix 1, wherein at least a portion of the first case, together with a capacitor element which is the other electronic component, is housed in the second case via the sealing resin, and the capacitor element, the second case, and the sealing resin form the capacitor module. (Appendix 3) 3. The power conversion device according to claim 2, wherein the bottom of the first case and the capacitor element are disposed opposite each other with the sealing resin interposed therebetween. (Appendix 4) the specific control electronic component housed in the first case is the largest or heaviest component among the plurality of control electronic components electrically connected to the control board, 4. The power conversion device according to claim 2, wherein the specific electronic component for control is accommodated in the first case via a component sealing resin. (Appendix 5) A power conversion device as described in Appendix 4, wherein the main body of the specific control electronic component is connected to the control board via a lead wire or a connector terminal, and the main body and the control board are spaced apart. (Appendix 6) 6. The power conversion device according to claim 4, wherein the specific electronic component for control is disposed at a distance from the inner surface of the first case. (Appendix 7) the specific control electronic component housed in the first case is the largest or heaviest component among the plurality of control electronic components electrically connected to the control board, 3. The power conversion device according to claim 2, wherein the specific control electronic component is fixed to the first case by a connecting member. (Appendix 8) A power conversion device as described in Appendix 7, wherein a main body of the specific control electronic component is connected to the control board via a lead wire or a connector terminal, and the main body and the control board are spaced apart. (Appendix 9) 9. The power conversion device according to claim 2, wherein the first case is fixed to the control board by a fixing portion of the first case. (Appendix 10) the first case has an anchor portion on the outside of the first case, 10. The power converter according to claim 2, wherein the anchor portion is embedded in the sealing resin. (Appendix 11) The power conversion device according to claim 10, wherein the anchor portion is a protrusion that protrudes from the bottom of the first case toward the outer periphery. (Appendix 12) 10. The power conversion device according to claim 9, wherein the first case is made of metal. (Appendix 13) 13. The power conversion device according to claim 12, wherein the first case has a bus bar made of metal and thermally connected to the housing. (Appendix 14) The housing is formed in a cylindrical shape with a bottom, the control board is disposed closer to the opening of the housing than the power module and the capacitor module, 14. The power conversion device according to any one of claims 1 to 13, wherein the specific control electronic component is arranged closer to the bottom of the housing than the control board. (Appendix 15) The power conversion device according to any one of appendixes 1 to 14, wherein the control board is arranged so as to overlap at least a portion of one or both of the capacitor module and the power module when viewed in a direction perpendicular to the plate surface of the control board. (Appendix 16) 16. The power conversion device according to any one of claims 2 to 15, wherein the capacitor module is thermally connected to the housing at a bottom wall or a side wall of the second case via a heat transfer member. (Appendix 17) the housing has a first surface to which the power module is thermally connected and a second surface to which the capacitor module is thermally connected, a direction opposite to the normal direction of the first surface is defined as an anti-normal direction; a specific direction parallel to the first surface is defined as a first direction, and a direction parallel to the first surface and perpendicular to the first direction is defined as a second direction; the second surface faces the normal direction and is disposed on one side of the first surface in the first direction and on a side opposite to the normal direction from the first surface, and the housing has a step portion between the first surface and the second surface, 17. The power conversion device according to any one of claims 1 to 16, wherein the normal direction position of the end portion of the power module on the normal direction side is equivalent to the normal direction position of the end portion of the capacitor module on the normal direction side. (Appendix 18) 18. The power conversion device according to claim 17, wherein the housing has a coolant flow path on the back side of the first surface for cooling the first surface. (Appendix 19) 19. The power conversion device according to any one of appendices 1 to 18, wherein the specific control electronic component is a transformer or a board-inserted component. (Appendix 20) 7. The power converter according to claim 4, wherein the component sealing resin has a lower thermal conductivity than the sealing resin. (Appendix 21) 17. The power conversion device according to claim 16, wherein the heat transfer member is a heat dissipation sheet or grease. (Appendix 22) 22. The power conversion device according to claim 2, wherein the capacitor element is a film capacitor. (Appendix 23) 23. The power conversion device according to any one of claims 1 to 22, wherein the housing is fixed to a vibration generating source in a vehicle. [Explanation of symbols]

[0072] REFERENCE SIGNS LIST 1 power converter, 2 housing, 2a step portion, 2b first surface, 2c second surface, 21 refrigerant flow path, 21a upstream flow path, 21b downstream flow path, 21c intermediate flow path, 22 base portion, 22a cooling fin, 23 flow path forming portion, 24 header, 3 power module, 3a first surface, 3b second surface, 3c first side surface, 3d second side surface, 3e third side surface, 3f fourth side surface, 31 power terminal, 32 module main body portion, 33 output terminal, 34 control terminal, 4 capacitor module, 41 capacitor element, 42 capacitor bus bar, 42a positive bus bar, 42b negative bus bar, 43 capacitor electrode, 43a open side electrode, 43b bottom wall side electrode, 44 sealing resin, 45 second case, 45a opening, 45b bottom wall, 45c side wall, 46 Power supply side terminal, 47 Power terminal connection portion, 48 Board connection terminal, 49 Heat transfer member, 51 Specific control electronic component, 52 First case, 52a Surrounding wall, 53 Part sealing resin, 54 Bus bar, 55 Fixing portion, 56 Anchor portion, 57 Screw, 58 Harness, 6 Control board, 6a Control electronic component, 6b Board connection portion, 7 Vehicle, 8 Vibration source

Claims

1. a power module, a capacitor module connected to the power module, a control board having a plurality of electronic control components for controlling the power module, a first case formed in a cylindrical shape with a bottom and accommodating specific electronic control components, and a housing accommodating the power module, the capacitor module, the control board, and the first case; At least a portion of the first case is accommodated in a second case formed in a bottomed cylindrical shape via a sealing resin together with other electronic components other than the control electronic component, the first case is disposed in an opening of the second case, and at least a part of the other electronic component is disposed closer to a bottom of the second case than the first case; At least a portion of the first case is accommodated in the second case together with a capacitor element, which is the other electronic component, via the sealing resin, and the capacitor element, the second case, and the sealing resin form the capacitor module; the first case has an anchor portion on the outside of the first case, the anchor portion is embedded in the sealing resin, The anchor portion is a protrusion that protrudes from the bottom of the first case toward the outer periphery of the power conversion device.

2. The power conversion device according to claim 1 , wherein the bottom of the first case and the capacitor element are disposed opposite each other with the sealing resin interposed therebetween.

3. the specific control electronic component housed in the first case is the largest or heaviest component among the plurality of control electronic components electrically connected to the control board, The power conversion device according to claim 1 , wherein the specific control electronic component is housed in the first case via a component sealing resin.

4. The power conversion device according to claim 3 , wherein a main body of the specific control electronic component is connected to the control board via a lead wire or a connector terminal, and the main body and the control board are spaced apart.

5. The power conversion device according to claim 3 , wherein the electronic component for specific control is arranged apart from the inner surface of the first case.

6. the specific control electronic component housed in the first case is the largest or heaviest component among the plurality of control electronic components electrically connected to the control board, The power conversion device according to claim 1 , wherein the specific control electronic component is fixed to the first case by a connecting member.

7. The power conversion device according to claim 6 , wherein a main body of the specific control electronic component is connected to the control board via a lead wire or a connector terminal, and the main body and the control board are spaced apart.

8. The power conversion device according to claim 1 , wherein the first case is fixed to the control board by a fixing portion provided on the first case.

9. The power conversion device according to claim 8 , wherein the first case is made of metal.

10. The power conversion device according to claim 9 , wherein the first case has a bus bar made of metal and thermally connected to the housing.

11. The housing is formed in a cylindrical shape with a bottom, the control board is disposed closer to the opening of the housing than the power module and the capacitor module, The power conversion device according to claim 1 , wherein the electronic component for specific control is arranged closer to the bottom of the housing than the control board.

12. The power conversion device according to claim 1 , wherein the control board is arranged to at least partially overlap one or both of the capacitor module and the power module when viewed in a direction perpendicular to a surface of the control board.

13. The power conversion device according to claim 1 , wherein the capacitor module is thermally connected to the housing via a heat transfer member at a bottom wall or a side wall of the second case.

14. A power module, a capacitor module connected to the power module, a control board having a plurality of control electronic components for controlling the power module, a first case formed in a cylindrical shape with a bottom and accommodating specific control electronic components, and a housing accommodating the power module, the capacitor module, the control board, and the first case; At least a portion of the first case is accommodated in a second case formed in a bottomed cylindrical shape via a sealing resin together with other electronic components other than the control electronic component, the first case is disposed in an opening of the second case, and at least a part of the other electronic component is disposed closer to a bottom of the second case than the first case; the housing has a first surface to which the power module is thermally connected and a second surface to which the capacitor module is thermally connected, a direction opposite to the normal direction of the first surface is defined as an anti-normal direction; a specific direction parallel to the first surface is defined as a first direction, and a direction parallel to the first surface and perpendicular to the first direction is defined as a second direction; the second surface faces the normal direction and is disposed on one side of the first surface in the first direction and on a side opposite to the normal direction from the first surface, and the housing has a step portion between the first surface and the second surface, A power conversion device in which the position in the normal direction of the end portion of the power module on the side of the normal direction is equivalent to the position in the normal direction of the end portion of the capacitor module on the side of the normal direction.

15. The power conversion device according to claim 14 , wherein the housing has a coolant flow path on a rear side of the first surface, the coolant flow path cooling the first surface.

16. The power conversion device according to claim 1 , wherein the specific control electronic component is a transformer or a board insert component.

17. A power module, a capacitor module connected to the power module, a control board having a plurality of control electronic components for controlling the power module, a first case formed in a cylindrical shape with a bottom and accommodating specific control electronic components, and a housing accommodating the power module, the capacitor module, the control board, and the first case; At least a portion of the first case is accommodated in a second case formed in a bottomed cylindrical shape via a sealing resin together with other electronic components other than the control electronic component, the first case is disposed in an opening of the second case, and at least a part of the other electronic component is disposed closer to a bottom of the second case than the first case; At least a portion of the first case is accommodated in the second case together with a capacitor element, which is the other electronic component, via the sealing resin, and the capacitor element, the second case, and the sealing resin form the capacitor module; the specific control electronic component housed in the first case is the largest or heaviest component among the plurality of control electronic components electrically connected to the control board, the specific control electronic component is accommodated in the first case via a component sealing resin, The power conversion device, wherein the component sealing resin has a lower thermal conductivity than the sealing resin.

18. The power conversion device according to claim 13 , wherein the heat transfer member is a heat dissipation sheet or grease.

19. The power conversion device according to claim 1 , wherein the capacitor element is a film capacitor.

20. The power conversion device according to claim 1 , wherein the housing is fixed to a vibration generating source in a vehicle.

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