Mask plate and mask assembly

Abstract

The present application discloses a mask plate having a deposition region including at least one deposition opening, a substance region surrounding the deposition region, the substance region being provided with stress relief portions, and a peripheral region in which the stress relief portions are distributed in a circumferential direction to surround the deposition region. In the mask plate, the stress relief portions are formed in the peripheral region, and the stress relief portions reduce the volume of the stress concentration portion in the substance region. In addition, since the stress relief portions are distributed to surround the deposition region in a circumferential direction, the stress in the substance region is uniformly released. By forming the stress relief portions in the peripheral region, the distortion during tensioning of the mask plate becomes uniform, and further, wrinkles are less likely to occur during tensioning of the mask plate, improving the yield of deposition.

Description

[Technical Field]

[0001] This application claims priority to Chinese Patent Application No. 202111436501.0, entitled "Mask Plate and Mask Assembly," filed on November 29, 2021, the entire contents of which are incorporated herein by reference.

[0002] This application is in the field of display technology, and more particularly relates to mask plates and mask assemblies. [Background technology]

[0003] Organic Light-Emitting Diode (OLED) display panels are increasingly being used and have become the mainstream technology for display panels due to their advantages such as low driving voltage, active emission, wide viewing angle, high efficiency, and fast response time. In the manufacturing process of OLED display panels, vacuum deposition technology is required to form some of the film layers in the display panel. Vacuum deposition technology requires the use of mask plates to control the position of the organic materials used to form the film layers. Mask plates mainly include common metal mask plates (CMM) and fine metal mask plates (FMM). CMMs are used to deposit common layers, and FMMs are used to deposit light-emitting layers. Summary of the Invention [Problem to be solved by the invention]

[0004] The fine metal mask plate (FMM) has a mesh structure that includes display and non-display areas to fulfill the functions of different areas of the display panel. The fine metal mask plate is prone to wrinkles when stretched, and during deposition, it is prone to a phenomenon where it cannot be flattened due to localized magnetic field attraction, which affects the deposition effect.

[0005] Embodiments of the present application provide a mask plate and mask assembly that is less likely to wrinkle when tensioned, improving deposition yield. [Means for solving the problem]

[0006] A first aspect of the present application provides a mask plate comprising a deposition region including at least one deposition opening, and a peripheral region having a solid region surrounding the deposition region, wherein the solid region is provided with stress relief portions, and the stress relief portions are distributed circumferentially around the deposition region.

[0007] A second aspect of the present application further provides a mask assembly including any of the mask plates according to the first aspect of the present application, further comprising a mask plate frame and a support bar fixed to the mask plate frame, wherein the mask plate is provided on a side of the support bar away from the mask plate frame and is fixed to the mask plate frame. [Effects of the Invention]

[0008] Compared to the prior art, the mask plate according to the embodiment of the present application has a deposition region and a peripheral region. The peripheral region has a solid region surrounding the deposition region. The solid region is provided with stress relief portions distributed circumferentially around the deposition region, which reduce the volume of the stress concentration area in the solid region. Furthermore, by distributing the stress relief portions circumferentially around the deposition region, stress in the solid region is uniformly released. Forming stress relief portions in the peripheral region uniformly distributes strain during tensioning of the mask plate, further reducing the likelihood of wrinkles during tensioning of the mask plate, thereby improving deposition yield. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic structural diagram of a mask plate according to an embodiment of the present application; [Figure 2]FIG. 2 is an enlarged schematic view of region A in FIG. [Figure 3] FIG. 2 is a schematic structural diagram of a first mask plate according to an embodiment of the present application. [Figure 4] FIG. 2 is a schematic structural diagram of a second mask plate according to an embodiment of the present application. [Figure 5] FIG. 10 is a schematic structural diagram of a third mask plate according to an embodiment of the present application. [Figure 6] FIG. 10 is a schematic structural diagram of a fourth mask plate according to an embodiment of the present application. [Figure 7] FIG. 10 is a schematic structural diagram of a fifth mask plate according to an embodiment of the present application. [Figure 8] FIG. 10 is a schematic structural diagram of a sixth mask plate according to an embodiment of the present application. [Figure 9] FIG. 10 is a schematic structural diagram of a sixth mask plate according to an embodiment of the present application. [Figure 10] 1 is a schematic structural diagram of a mask assembly according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0010] The inventors have found through research that the reason why wrinkles tend to occur when a fine metal mask plate is stretched is that the fine metal mask plate is installed so that the non-display area surrounds the display area, the volume ratio of the fully etched area in the display area is relatively large, and the volume ratio of the unetched area in the non-display area is relatively large. The cross-sectional shapes of the display area and the non-display area are different, which causes uneven stress distribution at the boundary between the display area and the non-display area. When stretched, the strain distribution throughout the fine metal mask plate is uneven, which makes it easy for local wrinkles to occur. As a result, the fine metal mask plate is locally attracted by the magnetic field during deposition, preventing it from being flattened, which is likely to affect the stretching effect. Based on this analysis, the inventors have provided a mask plate and a mask plate assembly.

[0011] For a better understanding of the present invention, a mask plate and a mask assembly according to an embodiment of the present invention will be described in detail below with reference to FIGS.

[0012] 1 , an embodiment of the present application provides a mask plate including a deposition region 1 and a peripheral region 2. Here, the deposition region 1 has at least one deposition opening 10. The peripheral region 2 has a solid region 20 that is disposed so as to surround the deposition region 1. The solid region 20 is provided with stress relief portions 21, which are disposed so as to be distributed in the circumferential direction so as to surround the deposition region 1.

[0013] Here, the peripheral region 2 is the entire region of the mask plate excluding the deposition region 1. Each deposition region 1 may include multiple fine deposition openings or one common deposition opening, which is not particularly limited in the present application.

[0014] The mask plate according to the present application has a deposition region 1 and a peripheral region 2. The peripheral region 2 has a substance region 20 that is provided so as to surround the deposition region 1. The substance region 20 is provided with stress relief portions 21 that are distributed in the circumferential direction so as to surround the deposition region 1, and the stress relief portions 21 reduce the volume of the stress concentration portion in the substance region 20. Furthermore, by distributing the stress relief portions 21 in the circumferential direction so as to surround the deposition region 1, stress in the substance region 20 is uniformly released. By forming stress relief portions in the peripheral region 2, distortion during tensioning of the mask plate is uniform, and further, wrinkles are less likely to occur during tensioning of the mask plate, improving the yield of deposition.

[0015] 1 , the substance region 20 includes a first shielding region 200 that is provided so as to at least partially surround the deposition region 1, and a second shielding region 210 that extends along the periphery of the peripheral region 2. The first shielding region 200 is connected to a portion of the second shielding region 210.

[0016] In one possible embodiment, the stress relief portion 21 has a plurality of first stress relief holes 211 and / or a plurality of second stress relief holes 212. The plurality of first stress relief holes 211 are located between the first shielding region 200 and the second shielding region 210 along the row direction, and / or the plurality of first stress relief holes 211 are located between the first shielding region 200 and the second shielding region 210 along the column direction. The plurality of second stress relief holes 212 are located within the first shielding region 200. Both the first stress relief holes 211 and the second stress relief holes 212 penetrate the solid region 20 along the thickness direction of the solid region 20.

[0017] In the above embodiment, the solid area 20 in the peripheral area 2 corresponds to the non-display area and defines the shape of the deposition area 1, which is the display area. The peripheral area 2 includes a solid area 20 for shielding the deposition material, which includes a first shielding area 200 and a second shielding area 210. Parts of the first shielding area 200 and the second shielding area 210 are connected to provide overall support for the mask plate. The provision of the first stress relief holes 211 and / or the second stress relief holes 212 reduces the volume of the solid area 20 in the peripheral area 2, i.e., reduces the volume of the area capable of providing support in the peripheral area 2. Because the volume of the area capable of providing support in the deposition area is much smaller than the volume of the portion capable of providing support in the peripheral area, reducing the volume of the solid area in the peripheral area can reduce the difference in shape between the peripheral area 2 and the deposition area 1. This reduces the difference in strain between the deposition area 1 and the peripheral area 2, uniforms the strain between the deposition area 1 and the peripheral area 2, and improves the overall uniformity of strain in the mask plate, thereby reducing the occurrence of wrinkles when the mask plate is tensioned and improving deposition yield.

[0018] 1 , the first shielding region 200 includes a first shielding section 201 that at least partially surrounds the deposition region 1, a second shielding section 202 that at least partially surrounds the first shielding section 201, and a third shielding section 203 that at least partially surrounds the second shielding section 202. The first shielding section 201, the second shielding section 202, and the third shielding section 203 are distributed in order from the deposition region 1 toward the stress relief section 21.

[0019] In the above embodiment, the first shielding area 200 includes a first shielding section 201, a second shielding section 202, and a third shielding section 203. Here, the first shielding section 201 at least partially surrounds the deposition area 1 to define the deposition area 1. Some or all of the first shielding section 201, the second shielding section 202, and the third shielding section 203 are connected to the second shielding area 210 to provide overall support.

[0020] In one possible embodiment, the first shielding section 201, the second shielding section 202 and the third shielding section 203 have the same thickness for ease of manufacturing.

[0021] In one alternative possible embodiment, the thickness of the first shielding section 201 and the third shielding section 203 are the same, and the thickness of the second shielding section 202 is smaller than the thickness of the first shielding section 201 .

[0022] In the above embodiment, the first and third shielding sections 201 and 203 are unetched regions, and the second shielding section 202 is a half-etched region. That is, during the manufacturing process, the second shielding section 202 is formed by forming a half-etched region in the solid portion. The thickness of the second shielding section 202 is set smaller than the thicknesses of the first and third shielding sections 201 and 202, thereby reducing the volume of the solid portion and the volume of the area of ​​the solid portion that can provide support. Because the volume of the area of ​​the mask plate that can provide support in the deposition region 1 is much smaller than the volume of the area that can provide support in the peripheral region 2, reducing the volume of the solid region in the peripheral region 2 can reduce the difference in stress distribution between the peripheral region 2 and the deposition region 1. This makes the distortion of each region of the mask plate uniform during the tensioning process. Furthermore, wrinkles are less likely to occur during tensioning of the mask plate, improving the positioning accuracy of the deposition material and the deposition yield.

[0023] The mask plate according to the present application has a plurality of deposition regions 1 arranged in a matrix. The arrangement of the deposition regions 1 on the mask plate may be rationally arranged depending on the area of ​​the mask plate and the area of ​​each deposition region 1, and is not particularly limited in the present application.

[0024] In one possible embodiment, the edge of the first stress relief hole 211 located between the first shielding area 200 and the second shielding area 210 along the row or column direction, facing the deposition area 1, matches the shape of the edge of the deposition area 1, or the shape of the first stress relief hole 211 is rectangular. The second stress relief hole 212 is formed in the third shielding section 203, and the edge of the second stress relief hole 212 facing the deposition area 1 matches the shape of the edge of the deposition area 1, or the shape of the second stress relief hole 212 is rectangular.

[0025] In one possible embodiment, the edge of the first stress relief hole 211 located between the first shielding area 200 and the second shielding area 210 along the column direction, facing the deposition area 1, matches the shape of the edge of the deposition area 1.

[0026] In one specific embodiment, as shown in FIG. 1, the edges of the two first stress relief holes 211 located at the top and bottom ends of FIG. 1, i.e., arranged along the column direction, facing the deposition region 1 match the shape of the edge of the deposition region 1, and the shapes of the two first stress relief holes 211 located at the left and right ends, i.e., distributed along the row direction, are rectangular.

[0027] In the above embodiment, the edge of the second shielding region 210 facing the deposition region 1 is linear. The shape of at least part of the edge of the first shielding region 200 on the side away from the deposition region 1 along the column direction matches the shape of the edge of the deposition region 1. The first stress relief holes 211 are formed between the first shielding region 200 and the second shielding region 210. This achieves a match between the shape of the edge of some of the first stress relief holes 211 facing the deposition region 1 and the shape of the edge of the deposition region 1. When the shape of the deposition region 1 is circular, the part of the edge of some of the first stress relief holes 211 facing the deposition region 1 is arc-shaped, and the other part is linear.

[0028] The second stress relief holes 212 are located within the first shielding region 200, and the mask plate includes one column and three rows of deposition regions 1. The edges of the second stress relief holes 212 located between adjacent deposition regions 1 along the column direction, facing the deposition regions 1, match the shape of the edges of the deposition regions 1. This increases the proportion of the second stress relief holes 212 in the peripheral region, further reduces the volume of the solid portion in the peripheral region, and reduces the volume of the portion available for support in the peripheral region and the deposition regions, thereby further improving the uniformity of distortion of the mask plate.

[0029] As shown in FIGS. 1 and 2, when the deposition area 1 is circular, the second stress relief hole 212 located between two adjacent deposition areas 1 has an arcuate side matching one deposition area 1 and an arcuate side matching the other deposition area 1. Along the column direction, the minimum distance between the screens respectively corresponding to two adjacent deposition areas 1 is b, the minimum width of the second stress relief hole 212 located between adjacent deposition areas 1 is c, and b / 2 < c < b. Along the column direction, the minimum distance between adjacent deposition areas 1 is d, the minimum width of the second shielding section 202 is e, and 0 < e < (d - b) / 2.

[0030] When the mask plate includes deposition areas 1 arranged in two columns and three rows, as shown in FIG. 3, the first stress relief hole 211 located between the first shielding area 200 and the second shielding area 210 along the column direction has an edge facing the deposition area 1 that matches the shape of the edge of the deposition area 1, and the shape of the first stress relief hole 211 located between the first shielding area 200 and the second shielding area 210 along the row direction is rectangular. The shape of the second stress relief hole 212 located between adjacent columns is rectangular, and the rectangle extends along the column direction, which can better reduce the volume of the peripheral area 2 between adjacent columns. The edge of the second stress relief hole 212 located between adjacent deposition areas 1 along the column direction matches the shape of the edge of the deposition area 1 facing it. Thereby, the ratio of the second stress relief hole 212 in the peripheral area 2 can be increased, the volume of the solid part in the peripheral area 2 can be further reduced, the volume of the parts available for support in the peripheral area 2 and the deposition area 1 can be reduced, and the uniformity of the distortion of the mask plate can be further improved.

[0031] In another specific embodiment, the edge of the first stress relief hole 211 facing the deposition area 1, which is located between the first shielding area 200 and the second shielding area 210 along the row direction, matches the shape of the edge of the deposition area 1.

[0032] 4, the edges of the first stress relief holes 211 located on both the left and right sides of FIG. 4, i.e., arranged along the row direction, facing the deposition region 1 match the shape of the edges of the deposition region 1. This increases the proportion of the second stress relief holes 212 in the peripheral region, further reducing the volume of the solid portion in the peripheral region 2 and the volume of the portion available for support in the peripheral region 2 and deposition region 1, thereby further improving the distortion uniformity of the mask plate. The two first stress relief holes 211 located on both the top and bottom sides, i.e., distributed along the column direction, are rectangular in shape.

[0033] In the above embodiment, the edge of the second shielding region 210 facing the deposition region 1 is linear, and the shape of at least a portion of the edge of the first shielding region 200 on the side away from the deposition region 1 along the row direction matches the shape of the edge of the deposition region 1. The first stress relief holes 211 are formed between the first shielding region 200 and the second shielding region 210. This allows the edge of some of the first stress relief holes 211 facing the deposition region 1 to match the shape of the edge of the deposition region 1. When the shape of the deposition region 1 is circular, the edge of some of the first stress relief holes 211 facing the deposition region 1 is arc-shaped, and the other portion is linear.

[0034] The second stress relief holes 212 are located in the first shielding region 200. Here, the shape of the edge of the second stress relief holes 212 located between the deposition regions 1 arranged along the row direction matches the shape of the edge of the deposition region 1. This increases the proportion of the second stress relief holes 212 in the peripheral region 2, further reducing the volume of the solid portion in the peripheral region 2 and the volume of the portion available for support in the peripheral region 2 and the deposition region 1, thereby further improving the uniformity of distortion of the mask plate. The shape of the second stress relief holes 212 located between adjacent rows, i.e., arranged along the column direction, is rectangular, which further reduces the volume of the solid portion in the peripheral region.

[0035] In one possible embodiment, the shape of the deposition area 1 may be circular as shown in Figure 3 or rectangular with rounded corners as shown in Figure 5. The shape of the deposition area 1 may be set according to the shape of the screen display area in the actual application process, and is not particularly limited in this application.

[0036] 6, the second stress relief hole 212 includes a first subhole 213 and a second subhole 214. The first subhole 213 is located in the third shielded section 203 and between adjacent deposition zones 1. The second subhole 214 is located in the second shielded section 202.

[0037] In one possible embodiment, the first stress relief holes 211 and the first sub-holes 213 are both rectangular in shape, and the second sub-holes 214 are circular or elliptical in shape.

[0038] In the above embodiment, the edge of the second shielding region 210 facing the deposition region 1 is rectangular, and the edge of the first shielding region 200 away from the deposition region 1 is parallel to the edge of the second shielding region 210 facing the deposition region 1. The edge of the second shielding section 202 facing the deposition region 1 matches the shape of the edge of the deposition region 1. The edge of the second shielding section 202 away from the deposition region 1 is linear, and the first stress relief hole 211 is a rectangular hole formed between the first shielding region 200 and the second shielding region 210. The second stress relief hole 212 includes a first sub-hole 213 and a second sub-hole 214. The first sub-hole 213 is a rectangular hole formed in the third shielded section 203 and located between adjacent deposition regions 1, and the second sub-hole 214 is a circular or elliptical hole formed in the second shielded section 202.

[0039] In one possible embodiment, the number of second sub-holes 214 is plural and uniformly distributed in the second shielding section 202, thereby further reducing the volume available for the support portion in the second shielding section, reducing the difference between the volume available for the support portion in the deposition area 1 and the peripheral area, and uniformizing the stress in each area of ​​the mask plate.

[0040] 7, the stress relief portion 21 further includes a plurality of third stress relief holes 215. The mask plate has a first end 11 and a second end 12 for tensioning. The first end 11 and the second end 12 are aligned along the first direction x. A third stress relief hole 215 is formed in the second shielding region 210 . The third stress relief hole 215 , th 2 is formed on the side of the shielding region 210 away from the deposition region 1. Along the first direction x, the third stress relief holes 215 are arranged away from the center of the deposition zone 1. That is, in a second direction y perpendicular to the first direction x, the orthogonal projection of the deposition zone 1 does not cover the orthogonal projection of the third stress relief holes 215, or a part of the edge of the orthogonal projection of the deposition zone 1 covers the orthogonal projection of the third stress relief holes 215. Specifically, in the first direction x, each of the third stress relief holes 215 is located between two adjacent deposition zones 1.

[0041] In one possible embodiment, the third stress relief holes 215 are distributed along the edge of the second shielding region 210. The cross-sectional shape of the third stress relief holes 215 is semicircular or semi-elliptical. The maximum dimension of the third stress relief holes 215 along the first direction x is 1.6 mm to 3.0 mm. When the third stress relief holes 215 are semicircular, the outer peripheral edge of the peripheral region 2 overlaps with the diameter of the semicircle, and when the third stress relief holes 215 are semi-elliptical, the outer peripheral edge of the peripheral region 2 overlaps with the major axis of the semi-ellipse.

[0042] In one possible embodiment, the mask plate must be fitted to the support bar 4, which is located opposite the area between adjacent deposition zones 1. The third stress relief hole 215 is located in the support bar 4, with its orthogonal projection on the support bar 4.

[0043] 7, the edge of the second shielding area 210 facing the deposition area 1 is rectangular, and a portion of the edge of the first shielding area 200 away from the deposition area 1 is parallel to the edge of the second shielding area 210 facing the deposition area 1. The first stress relief hole 211 is formed between the first shielding area 200 and the second shielding area 210 and is rectangular in shape. The second stress relief hole 212 is formed in the third shielding section 203 and is also rectangular in shape. The third stress relief hole 215 is formed in the second shielding area 210 and corresponds to the second stress relief hole 212 and the first stress relief holes 211 near the first and second ends.

[0044] 8 , the edge of the second shielding region 210 facing the deposition region 1 is rectangular, and a portion of the edge of the first shielding region 200 away from the deposition region 1 is parallel to the edge of the second shielding region 210 facing the deposition region 1. The edge of the second shielding section 202 facing the deposition region 1 matches the shape of the edge of the deposition region 1, and the edge of the second shielding section 202 away from the deposition region 1 is linear. The first stress relief hole 211 is a rectangular hole formed between the first shielding region 200 and the second shielding region 210. The second stress relief hole 212 includes a first subhole 213 and a second subhole 214. The first subhole 213 is a rectangular hole formed in the third shielding section 203 and located between adjacent deposition regions 1. The second sub-holes 214 are circular or elliptical holes formed in the second shielding section 202. The third stress relief holes 215 are formed in the second shielding region 210 and correspond to the second stress relief holes 212 and the first stress relief holes 211 near the first and second ends.

[0045] In the above embodiment, the second shielding region 210 is provided with third stress relief holes 215. This reduces the volume of the portion of the second shielding region 210 that can be used for support, reduces the difference in stress distribution between the second shielding region 210 and the deposition region, and makes the stress area uniform across the entire mask plate.

[0046] In one possible embodiment, as shown in FIG. 9 , the solid region 20 further includes a third shielding region 220 extending from the first shielding region 200 toward the deposition region 1. The third shielding region 220 defines a notch region in a profiled screen, such as a notch screen (i.e., a notch in the non-display region of the profiled screen for arranging a photosensitive module, etc.). The stress relief portion 21 further includes a fourth stress relief hole 216 formed in the third shielding region 220. The fourth stress relief hole 216 is a through hole penetrating the third shielding region 220 along the thickness direction of the third shielding region 220, or a blind hole whose depth along the thickness direction of the third shielding region 220 is smaller than the thickness of the third shielding region 220. Preferably, when the fourth stress relief hole 216 is a blind hole, the depth of the blind hole is greater than half the thickness of the third shielding region 220.

[0047] In one possible embodiment, the fourth stress relief hole 216 is a circular hole with a radius of 0.1 mm to 0.5 mm.

[0048] In the above embodiment, the fourth stress relief holes 216 can relieve stress at the stress concentration positions in the third shielding area 220, reduce the difference in cross-sectional shape between the third shielding area 220 and the deposition area 1, and improve the overall distortion uniformity in the deposition area 1. This reduces the occurrence of wrinkles when the mask plate is tensioned, and improves deposition yield.

[0049] The present application further provides a mask assembly, as shown in FIG. 10, including any of the mask plates according to the above embodiments of the present application, and further including a mask plate frame and a support bar fixed to the mask plate frame, wherein the mask plate is provided on a side of the support bar away from the mask plate frame and fixed to the mask plate frame.

[0050] During the operation of the mask assembly, the deposition surface of the mask plate faces the deposition source, the glass of the mask plate faces the substrate, and the support bar is located on the deposition surface of the mask plate, thereby preventing the mask plate from sagging during the deposition process and further reducing the wrinkle phenomenon during the tensioning process of the mask plate.

[0051] According to the above-described embodiments of the present application, these embodiments do not describe all details in detail, and the present application is not limited to only specific embodiments. From the above description, it is apparent that many modifications and variations are possible. These examples are selected and specifically described in this specification to better understand the principles and practical applications of the present application and to enable those skilled in the art to modify and use the present application and the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A mask plate, a deposition region including at least one deposition opening; a peripheral region having a solid region surrounding the deposition region; stress relief portions are provided in the solid region, and the stress relief portions are provided so as to be distributed in a circumferential direction so as to surround the vapor deposition region; the mask plate has a plurality of the deposition regions; The deposition regions are arranged in rows or columns, The shape of the deposition region is a circle or a rounded rectangle, the substantial region includes a first shielding region provided so as to at least partially surround the vapor deposition region, and a second shielding region extending along a circumferential direction of the peripheral region, the stress relief portion has a plurality of first stress relief holes and a plurality of second stress relief holes, the plurality of first stress relief holes are located between the first shielding region and the second shielding region along a row direction or a column direction, the plurality of second stress relief holes are located within the first shielding region, and the first stress relief holes and the second stress relief holes each penetrate the solid region along a thickness direction of the solid region; the stress relief portion further includes a plurality of third stress relief holes; the mask plate has a first end and a second end for tensioning; the first end and the second end are aligned along a first direction, the third stress relief holes are formed in the second shielding region and are located between two adjacent deposition regions in the first direction; the first shielding region is connected to the second shielding region by the first end and the second end; Mask plate.

2. The mask plate of claim 1 , wherein each deposition region includes a plurality of fine deposition openings or a common deposition opening.

3. the first shielding region includes a first shielding section that at least partially surrounds the deposition region, a second shielding section that at least partially surrounds the first shielding section, and a third shielding section that at least partially surrounds the second shielding section, and the first shielding section, the second shielding section, and the third shielding section are distributed in order from the deposition region toward the stress relief section; the first shielding section and the third shielding section have the same thickness, and the second shielding section has a thickness smaller than the thickness of the first shielding section; the first shielding section and the third shielding section are unetched areas; The mask plate of claim 1 , wherein the second shielding section is a half-etched area.

4. The second shielding section and the third shielding section are connected to the second shielding area by the first end and the second end, the edge of each of the first stress relief holes located between the first and second shielding regions along the row or column direction, facing the deposition region, matches the shape of the edge of the deposition region, or the shape of each of the first stress relief holes is rectangular; the second stress relief hole is formed in the third shielding section; 4. The mask plate of claim 3, wherein the edge of the second stress relief hole facing the deposition area matches the shape of the edge of the deposition area, or the shape of the second stress relief hole is rectangular.

5. the second stress relief hole includes a first subhole and a second subhole; the first subhole is located within the third shielded section and between adjacent deposition regions; the second sub-hole is located within the second shielded section; the first stress relief hole and the first sub-hole are both rectangular in shape; the second sub-holes are circular or elliptical in shape; The mask plate according to claim 3 , wherein the number of the second sub-holes is plural and uniformly distributed within the second shielding section.

6. the third stress relief hole has a semicircular cross-sectional shape; the outer periphery of the peripheral region overlaps with the diameter of the semicircle; The mask plate according to claim 1 .

7. The cross-sectional shape of the third stress relief hole is semi-elliptical, The outer periphery of the peripheral region overlaps with the major axis of the semi-ellipse. The mask plate according to claim 1 .

8. the solid region further includes a third shielding region extending from the first shielding region toward the vapor deposition region; the stress relief portion further includes a fourth stress relief hole formed in the third shielding region, the fourth stress relief hole is a through hole that penetrates the third shielding region along a thickness direction of the third shielding region, or a blind hole whose depth along the thickness direction of the third shielding region is smaller than the thickness of the third shielding region, 2. The mask plate according to claim 1, wherein the fourth stress relief hole is a circular hole with a radius of 0.1 mm to 0.5 mm.

9. 9. The mask plate according to claim 7, wherein the third stress relief holes are distributed along an edge of the second shielding area.

10. A mask assembly comprising at least one mask plate according to any one of claims 1 to 8, A mask plate frame, a support bar fixed to the mask plate frame, The mask plate is provided on a side of the support bar away from the mask plate frame and is fixed to the mask plate frame.

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