Circuit Board Socket
The socket design with a resilient contact presser substrate addresses miscontact and deformation issues by absorbing reaction forces, ensuring stable and reliable electrical connections.
Patent Information
- Application Number
- JP2022184044
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-11-17
- Publication Date
- 2026-02-19
- Estimated Expiration
- 2042-11-17
AI Technical Summary
Existing socket designs for circuit boards can cause miscontact and deformation of the board due to reaction forces from resilient contacts, leading to potential damage and poor electrical connectivity.
A socket design with a resilient contact presser substrate that absorbs reaction forces, preventing deformation of the contact fixing substrate by providing a space between the resilient contact presser substrate and the contact fixing substrate, ensuring stable contact and preventing misalignment.
Prevents erroneous contact and deformation of the socket components, maintaining stable electrical connections and reducing the risk of damage to electronic devices.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present invention relates to a socket for a circuit board, and more particularly to a socket for a circuit board that, when mounted on the circuit board, provides elastic connection between the circuit board and contacts of the socket. [Background technology]
[0002] Conventional methods for mounting electronic components such as semiconductor devices on circuit boards include fixing them to the board by soldering and fixing them by contacting an elastic member with the board electrodes. The latter method uses elastic force to press the contacts on the electronic component against the circuit board, thereby achieving electrical continuity between the electronic component and the circuit board. When connecting an electronic component to a circuit board via a socket, the contacts in the socket elastically contact the circuit board, ensuring good contact.
[0003] Patent Document 1 describes that contact pins 15 as contactors are inserted through a pressure plate 26 in a socket body 13 of an IC socket 11 and press-fit into press-fit holes 13a. Contact pins 15 are structured so that their positions do not change when they come into contact with solder balls 12b of an IC package 12. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-311756 Summary of the Invention [Problem to be solved by the invention]
[0005] In Patent Document 1, if an attempt is made to fix contact pins 15 (contactors) to board electrodes by bringing an elastic member into contact with them in order to achieve electrical continuity between IC package 12 (electronic component) and the circuit board, the resulting elastic force may act on pressure plate 26 (board) through the contactors, potentially deforming the board. If this deformation is significant, the contactor positions may be displaced due to the board deformation, potentially causing a problem (miscontact) in which the contactors come into contact with areas of IC package 12 (electronic component) that they should not be in contact with.
[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a socket for a circuit board that has a simple structure and is capable of preventing erroneous contacts due to reaction forces acting on the resilient contacts. [Means for solving the problem]
[0007] A socket for a circuit board comprising: a plurality of contacts; a contact fixing substrate that fixes and holds each of the plurality of contacts; a resilient contact presser substrate that is connected to the contact fixing substrate and has a plurality of through holes through which each of the plurality of contacts passes; and a plurality of resilient contacts that are arranged on the opposite side of the resilient contact presser substrate from the contact fixing substrate and that make contact with each of the plurality of contacts, wherein the resilient contacts make contact with the resilient contact presser substrate in a direction in which the elastic force of the resilient contacts acts.
[0008] 1. A socket for a circuit board comprising: a plurality of contacts; a contact fixing substrate that fixes and holds each of the plurality of contacts; a plurality of contact elastic portions formed by elastically deforming lower portions of the plurality of contacts; and a contact elastic portion holding substrate that is connected to the contact fixing substrate and has a plurality of through holes through which each of the plurality of contacts passes, wherein the contact elastic portions are arranged on the opposite side of the contact elastic portion holding substrate from the contact fixing substrate, and come into contact with the contact elastic portion holding substrate in a direction in which the elastic force of the contact elastic portions acts. [Effects of the Invention]
[0009] According to the above-described embodiment, in the socket for a circuit board, it is possible to prevent, with a simple configuration, erroneous contact between the contacts and the electronic device due to reaction forces acting on the resilient contacts. [Brief explanation of the drawings]
[0010] [Figure 1] FIG. 1 is an overall perspective view of a circuit board socket according to an embodiment of the present invention coupled to a circuit board. [Figure 2] FIG. 2 shows an exploded view of the circuit board socket of FIG. [Figure 3] FIG. 3(a) is a cross-sectional view showing insertion mounting using a conventional contactor fixing substrate for comparison, and FIG. 3(b) is a cross-sectional view showing the problems that arise when insertion mounting using a conventional contactor fixing substrate is modified so that an elastic member is brought into contact with and fixed to the circuit board for comparison. [Figure 4] FIG. 4 is a diagram showing a portion of a cross section along the arrangement of contacts of the socket for a circuit board in FIG. 2, where FIG. 4(a) shows the state before the contacts come into contact with the printed circuit board, and FIG. 4(b) shows the state after the contacts have come into contact with the printed circuit board. [Figure 5] Figure 5 shows a side cross-sectional view of a socket for a circuit board according to another embodiment of the present invention, where Figure 5(a) is a side cross-sectional view of the socket for a circuit board according to another embodiment of the present invention in a state before contact with the circuit board, and Figure 5(b) is a side cross-sectional view of the socket for a circuit board according to another embodiment of the present invention in a state after contact with the circuit board. [Figure 6] Figure 6 shows contact at two points between a contact and a contact spring in an embodiment of the present invention, where Figure 6(a) shows a schematic view of one side along the arrangement of the contacts, Figure 6(b) shows a schematic view of the other side along the arrangement of the contacts, Figure 6(c) shows an enlarged cross-sectional view in the direction of line VIc, and Figure 6(d) shows an enlarged cross-sectional view in the direction of line VId. [Figure 7]Figure 7 shows contact at two points between a contact and a contact spring in an embodiment of the present invention, where Figure 7(a) shows a schematic view of one side along the arrangement of the contacts, Figure 7(b) shows a schematic view of the other side along the arrangement of the contacts, Figure 7(c) shows an enlarged cross-sectional view in the direction of line VIIc, and Figure 7(d) shows an enlarged cross-sectional view in the direction of line VIId. [Figure 8] Figure 8 shows contact at two points between a contact and a contact spring in an embodiment of the present invention, where Figure 8(a) shows a schematic view of one side along the arrangement of the contacts, Figure 8(b) shows a schematic view of the other side along the arrangement of the contacts, Figure 8(c) shows an enlarged cross-sectional view in the direction of line VIIIc, and Figure 8(d) shows an enlarged cross-sectional view in the direction of line VIIId. [Figure 9] Figure 9 shows contact at two points between a contact and a contact spring in an embodiment of the present invention, where Figure 9(a) shows a schematic view of one side along the arrangement of the contacts, Figure 9(b) shows a schematic view of the other side along the arrangement of the contacts, Figure 9(c) shows an enlarged cross-sectional view in the direction of line IXc, and Figure 9(d) shows an enlarged cross-sectional view in the direction of line IXd. [Figure 10] Figure 10 is a diagram showing contact at two points between a contact and a contact spring in an embodiment of the present invention, where Figure 10(a) shows a schematic view of one side along the arrangement of the contacts, Figure 10(b) shows a schematic view of the other side along the arrangement of the contacts, Figure 10(c) shows an enlarged cross-sectional view in the Xc line direction, and Figure 10(d) shows an enlarged cross-sectional view in the Xd line direction. [Figure 11] Figure 11 is a graph showing the insertion loss characteristics when the contactor according to the embodiment of the present invention and the contact spring contact each other at one or two points. Figure 11(a) shows the insertion loss characteristics when the conventional contactor and the contact spring contact each other at one point, and Figure 11(b) shows the insertion loss characteristics when the contactor and the contact spring contact each other at two points. DETAILED DESCRIPTION OF THE INVENTION
[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0012] (Embodiment 1) <Outline of circuit board sockets> Fig. 1 is a perspective view showing the appearance of a circuit board socket according to one embodiment of the present invention, mounted on a circuit board. In Fig. 1, the circuit board socket 10 includes a contact fixing substrate 12, the four peripheral side surfaces of which form the outer shell of the circuit board socket 10. The circuit board socket 10 has a resilient contact housing member 16 disposed below the contact fixing substrate 12, and is connected to a circuit board 2 via this substrate 16. A cover 9 is provided above the contact fixing substrate 12, with a portion of the cover 9 fixed by the contact fixing substrate 12. A guide 8 for guiding an electronic device is located inside the cover 9, and an electronic device (not shown) is mounted inside the cover 9, so that the electronic device is electrically connected to the circuit board socket 10.
[0013] Additionally, the upper end portions of contacts 11 are disposed on the upper surface of the slider 7, and can be connected to electrical contacts of an electronic device. For simplicity of illustration, only one row is shown in Fig. 1, but in reality, the upper end portions of the contacts 11 protrude from the entire surface of the slider 7. An elastic contact holder substrate 14 is provided below the contactor fixing substrate 12, as will be described in detail later with reference to Fig. 2.
[0014] <Detailed configuration of circuit board socket> FIG. 2 is an exploded perspective view of the circuit board socket shown in FIG. 1, and also shows the positional relationship between the electronic device 1 and the circuit board 2.
[0015] The circuit board socket 10 is configured to have three substrate layers: a contact fixing substrate 12, a resilient contact presser substrate 14, and a resilient contact accommodating member 16. The upper portions (excluding the upper ends) of the contacts 11 are held in a fixed state by the contact fixing substrate 12. As shown in FIG. 3, a plurality of the contacts 11 are arranged in one direction. For simplicity of illustration, only two rows of the contacts are shown in the circuit board socket of this embodiment. Each of the contacts 11 held by the contact fixing substrate 12 is arranged to pass through a corresponding through-hole 18 (see FIG. 4) in the resilient contact presser substrate 14. Furthermore, the contacts 11 are arranged so that their lower ends come into contact with the resilient contacts 15 arranged in the corresponding holes in the resilient contact accommodating member 16.
[0016] In the above arrangement, the upper end of each contactor 11 can make electrical contact with a lead (not shown) of the electronic device 1 mounted on the circuit board socket 10, and the lower end of each contactor 11 can make electrical contact with the resilient contactor 15. As will be described later, the resilient contactor 15 can make electrical contact with a predetermined connection portion of the circuit board 2, thereby enabling electrical conduction between the electronic device 1 and the circuit board 2. Furthermore, since the contactor 11 is supported by the contactor fixing substrate 12, the contact height of the upper end of the contactor can be maintained constant, allowing stable contact between the leads of the electronic device 1 and the contactor 11. In this embodiment, a coil spring is used as the resilient contactor 15, but the present invention is not limited to this form.
[0017] The circuit board socket having the above-described configuration is one type of method for fixing by bringing an elastic member into contact with the board electrodes. That is, in the circuit board socket, the contactors 11 are fixed by the contact-fixing substrate 12, and the contact configuration allows a reaction force from the circuit board 2 to act on the contact-fixing substrate 12 when the elastic contactors 15 contact the circuit board 2. In such a configuration, the reaction force may deform the contact-fixing substrate 12, which may result in erroneous contact with the electronic device attached to the socket. In contrast, in the embodiment of the present invention, as described above, the elastic contact presser substrate 14 is provided between the contact-fixing substrate 12 and the elastic contact accommodating member 16, and the elastic contactors 15 contact the lower end of the elastic contact presser substrate 14. In this way, the elastic contact presser substrate 14 bears the reaction force from the circuit board 2 when the elastic contactors 15 contact the circuit board 2, preventing this reaction force from being directly applied to the contact-fixing substrate 12. Furthermore, by providing a space between the elastic contact presser substrate 14 and the contact fixing substrate 12, the reaction force is prevented from acting on the contact fixing substrate 12 that fixes and holds the contacts 11. This embodiment will be described in detail below.
[0018] Before describing the socket structure of this embodiment that prevents deformation, we will explain how the contact fixing substrate is deformed by the reaction force of the elastic contacts. Figures 3(a) and 3(b) are cross-sectional views showing a socket structure according to a comparative example.
[0019] 3(a), in the socket structure according to the comparative example, the contacts 31 are press-fitted and fixed to the contact fixing substrate 33. The upper ends of the contacts 31 are arranged to sandwich the external contacts 32 of the electronic device 5, thereby enabling electrical connection between the electronic device 5 and the contacts 31.
[0020] On the other hand, as shown in FIG. 3(b), the lower ends of the contacts 31 connect with the resilient contacts 34 (the resilient contact housing member is not shown), and the resilient contacts 34 come into contact with the circuit board 6. As the resilient contact housing member and the circuit board 6 connect, a reaction force from the resilient contacts 34 acts via the contacts 31 on the contact fixing substrate 33 to which the contacts 31 are fixed. This reaction force from the resilient contacts 34 causes the contact fixing substrate 33 to deform toward the electronic device 5, as shown in FIG. 3(b). As a result, the upper ends of the contacts 31 become misaligned, causing miscontact with the electronic device 5, which can result in poor electrical contact or damage to the electronic device 5. Note that the deformation of the contact fixing substrate 33 is simply shown, and in this example, an array of three contacts 31 is shown, with the central contact 31 in the array deforming the most.
[0021] <Deformation prevention structure of the contactor fixing substrate according to the embodiment> 4(a) and (b) are diagrams showing a part of a cross section along the arrangement of contacts 11 of the three substrates 12, 14, and 16 shown in FIG. 2, and only two of the arrangement of contacts 11 are shown.
[0022] As shown in Figures 4(a) and (b), the circuit board socket 10 has three substrate layers: a contact fixing substrate 12, a resilient contact presser substrate 14, and a resilient contact accommodating member 16. The resilient contacts 15 are disposed on the opposite side of the resilient contact presser substrate 14 from the contact fixing substrate 12, and contact the resilient contact presser substrate in the direction in which the resilient force of the resilient contacts 15 acts. The upper portions of the contacts 11 are fixed by contact-substrate fixing portions 13 provided in corresponding holes in the contact fixing substrate 12, and are arranged to be relatively movable via the resilient contact presser substrate 14 and its through-holes 18. The lower ends of the contacts 11 contact the contact-resilient contact portions 17 of the resilient contacts 15 in the holes of the resilient contact accommodating member 16. As described above, the contacts 11 are fixed to the contact fixing substrate 12, but are not fixed to the resilient contact presser substrate 14 or the resilient contact accommodating member 16. Furthermore, the upper ends of the resilient contacts 15 are larger in size than the diameter of the through-holes 18, so that the upper ends of the resilient contacts 15 come into contact with the lower surface of the resilient contact presser substrate 14. However, the present invention is not limited to this, and the upper tapered portions of the resilient contacts 15 may fit into the through-holes 18, so that the tapered portions come into contact with the resilient contact presser substrate 14. Alternatively, a recess for receiving the upper portions of the resilient contacts 15 may be formed in the lower portion of the resilient contact presser substrate 14, so that the upper portions of the resilient contacts 15 come into contact with the resilient contact presser substrate 14 within this recess. Furthermore, a protrusion for coming into contact with the upper portions of the resilient contacts 15 may be formed in the lower portion of the resilient contact presser substrate 14, so that the upper portions of the resilient contacts 15 come into contact with the resilient contact presser substrate 14 at this protrusion.
[0023] Fig. 4(a) shows the state before the circuit board socket 10 of this embodiment is connected to the circuit board 2 (connection portion 2a), in which the resilient contacts 15 are in an expanded state and protrude below the circuit board socket 10. In contrast, Fig. 4(b) shows the state after the circuit board socket 10 is connected to the circuit board 2 (connection portion 2a), in which the resilient contacts 15 are in a contracted state due to their connection to the circuit board 2 (connection portion 2a). In this contracted state, the resilient contacts 15 apply a reaction force from the circuit board 2 to the resilient contact presser board 14 via the upper ends of the resilient contacts 15.
[0024] In this embodiment, deformation of the contact fixing substrate 12 due to the reaction force is prevented by providing a space 19 above the resilient contact presser substrate 14. Specifically, a recess is provided in an area on the upper part of the resilient contact presser substrate 14, the area corresponding to the arrangement range of the contacts 11. This recess forms a space 19 between the contact fixing substrate 12 and the resilient contact presser substrate 14. As a result, even if the resilient contact presser substrate 14 is deformed toward the contact fixing substrate 12 due to the reaction force of the resilient contacts 15, this deformation can be prevented from affecting the contact fixing substrate 12. As a result, it is possible to prevent the contacts 11 from coming into contact with the electronic device 1 and damage to the electronic device 1. In addition, since this structure is simpler than a structure in which pressure receiving portions are provided in through holes, it is possible to arrange the contacts at a high density. Note that in this embodiment, a recess is provided in an area on the upper part of the resilient contact presser substrate 14, the area corresponding to the arrangement range of the contacts 11, but this is not limited to this, and a recess may be provided on the contact fixing substrate 12 side.
[0025] The size of this space 19 is determined so that the contactor fixing substrate 12 and the elastic contactor pressing substrate 14 will not come into contact with each other even if the elastic contactor pressing substrate 14 is deformed toward the contactor fixing substrate 12 due to the reaction force of the elastic contactor 15.
[0026] (Embodiment 2) <Outline of Circuit Board Socket According to Another Embodiment> A circuit board socket 20 according to another embodiment will now be described. The circuit board socket 20 is composed of contacts 21, a contact fixing substrate 22, a contact elastic portion holding substrate 24, contact elastic portions 25, and a contact elastic portion accommodating member 26. The contact fixing substrate 22 has a contact-substrate fixing portion 23 for fixing the contacts 21. A contact elastic portion 25 is provided below the contacts 21, continuing from the contacts 21 and as part of the contacts 21. The contact elastic portion accommodating member 26 has an accommodating portion 27 formed to receive the contact elastic portion 25. The upper end of the contact elastic portion 25 contacts the lower end of the contact elastic portion holding substrate 24. The contact elastic portion holding substrate 24 bears the reaction force from the circuit board 4 when the contact elastic portion 25 contacts the circuit board 4, preventing this reaction force from being directly applied to the contact fixing substrate 22. Furthermore, by providing a space between the contact elastic portion holding board 24 and the contact fixing board 22, the reaction force is prevented from being exerted on the contact fixing board 22 that fixes and holds the contacts 21. Note that a description of parts that overlap with the above-mentioned circuit board socket 10 will be omitted.
[0027] <Detailed Configuration of Circuit Board Socket According to Another Embodiment> FIG. 5 is a cross-sectional view of a circuit board socket 20 according to another embodiment of the present invention, showing a detailed configuration of the circuit board socket 20, which differs from the circuit board socket 10 described above. FIG. 5(a) is a side cross-sectional view of the circuit board socket 20 according to another embodiment of the present invention before contact with the circuit board 4 (connection portion 4a). In this state, the contactor elastic portions 25 are in an expanded state and protrude downward from the circuit board socket 10. In contrast, FIG. 5(b) shows the state after connection with the circuit board 4 (connection portion 4a). In this state, the contactor elastic portions 25 are in a contracted state due to connection with the circuit board 4 (connection portion 4a). In this contracted state, the contactor elastic portions 25 apply a reaction force from the circuit board 4 (connection portion 4a) to the contactor elastic portion holding substrate 24 via the upper ends of the contactor elastic portions 25. That is, the contact elastic portion 25 is arranged on the opposite side of the contact elastic portion pressing substrate 24 from the contact fixing substrate 22, and contacts the contact elastic portion pressing substrate 24 in the direction in which the elastic force of the contact elastic portion 25 acts.
[0028] In this embodiment, unlike the circuit board socket 10 described above, the contacts 21 themselves also function as resilient contacts. The contact resilient portion 25, which is the lower portion of the contact 21, is resiliently deformed and formed into a helical spring shape, as shown in FIG. 5( a). When the contact resilient portion 25 is contracted, as shown in FIG. 5( b), the reaction force of the contact resilient portion 25 presses the contact 21 against (the connection portion 4 a) of the circuit board 4, electrically connecting the contact 21 and the circuit board 4. At this time, the lower portion of the contact resilient portion 25 is fitted into and accommodated in an accommodating portion 27 provided in the contact resilient portion accommodating member 26, restricting downward movement. Therefore, the contact 21 pressed against (the connection portion 4 a) of the circuit board 4 does not move away from (the connection portion 4 a) of the circuit board 4, and thus the electrical connection is not released. Furthermore, the contact 21 pressed against (the connection portion 4 a) of the circuit board 4 can be prevented from coming into contact with the circuit board 4 at any point other than the lower end. The contact elastic portion 25 is not particularly limited as long as it has an elastic shape. For example, it may be in the shape of a spring, and more specifically, it may be in the shape of a helical spring or a bow spring.
[0029] In this embodiment, deformation of the contact fixing substrate 22 due to the reaction force is prevented by providing a space 29 above the contact elastic portion presser substrate 24. More specifically, a recess is provided in an area above the contact elastic portion presser substrate 24, the area corresponding to the arrangement range of the contacts 21. This recess forms a space 29 between the contact fixing substrate 22 and the contact elastic portion presser substrate 24. As a result, even if the contact elastic portion presser substrate 24 deforms toward the contact fixing substrate 22 due to the reaction force of the contact elastic portions 25, this deformation can be prevented from reaching the contact fixing substrate 22. As a result, it is possible to prevent the contacts 21 from coming into contact with the electronic device 3 and damage to the electronic device 3. Here, in this embodiment, a recess is provided in an area above the contact elastic portion presser substrate 24, the area corresponding to the arrangement range of the contacts 21, but this is not limited to this, and a recess may be provided on the contact fixing substrate 22 side.
[0030] The size of this space 29 is determined so that even if the contact elastic portion holding substrate 24 is deformed toward the contact fixing substrate 22 due to the reaction force of the contact elastic portion 25, the contact fixing substrate 22 and the contact elastic portion holding substrate 24 will not come into contact with each other.
[0031] <Two contact points: the contact piece and the contact spring> Figures 6 to 10 show contacts and resilient contacts (contact springs) according to another embodiment of the present invention, each having contact portions at two locations. Figures 6(a) to 10(a) show schematic views of one side along the arrangement of the contacts, and Figures 6(b) to 10(b) show schematic views of the other side along the arrangement of the contacts. Figures 6(c) to 10(c) show enlarged cross-sectional views along lines VIc and Xc, respectively, and Figures 6(d) to 10(d) show enlarged cross-sectional views along lines VId and Xd, respectively. Note that common parts of Figures 6 to 10 will be described using Figure 6 as a representative, and descriptions of other parts will be omitted.
[0032] As shown in Figures 6(a) and (b), in this embodiment, the contactor 41 and the resilient contactor 45 have contact portions 48 and 49 at the top and bottom of the resilient contactor 45, respectively. As shown in Figure 6(c), at the contact portion 48 between the contactor 41 and the resilient contactor 45, the two split contactor 41 are in point contact at two points. This ensures that the contactor 41 and the resilient contactor 45 are in contact with each other securely at the contact portion 48. In contrast, as shown in Figure 6(d), at the contact portion 49, the split contactor has a semicircular cross section, and the arc portion is in point contact with the resilient contactor 45. Note that the contact between the contactor 41 and the resilient contactor 45 at the contact portion 48 is such that the load at the contact is applied horizontally, and the reaction force of the resilient contactor 45 does not push the contactor 41 upward at the contact portion 48. This prevents the reaction force of the resilient contactor 45 from pushing the contactor 41 upward at the contact portion 48, thereby preventing deformation of the contactor fixing substrate (not shown). As shown in FIG. 6(a), the contactor 41 has a width corresponding to the diameter of the resilient contactor 45. That is, as shown in FIG. 6(c), the contactor 41 has a cross-sectional shape that contacts the resilient contactor 45 at the contact portion 48, which is farther from the tip of the contactor 41 out of at least two contact portions 48, 49. This ensures that the contactor 41 comes into reliable contact with the resilient contactor 45 at the contact portion 48. In this embodiment, the contactor 41 has such a configuration by being tapered.
[0033] In this way, when the contactor 41 and the resilient contactor 45 have contact portions 48 and 49 at the top and bottom of the resilient contactor 45, respectively, the occurrence of stubs can be suppressed compared to when there is only one contact portion, and as will be explained in the next section, the insertion loss characteristics of signals input from an electronic device to a circuit board can be improved.
[0034] 7(c), the contactor 51 is divided into three parts near the contact portion 58, one of which has a curved surface portion 52 at its tip that is convex in a vertical cross section, and the curved surface portion 52 is in point contact with the resilient contactor 55. The curved surface portion 52 ensures that the contactor 51 makes reliable contact with the resilient contactor 55 at the contact portion 58.
[0035] 8(c), one of the two split contacts 61 has a protrusion 62 formed by bending a portion of the contact in the longitudinal direction so that the contactor 61 makes point contact with the resilient contactor 65 at the contact portion 68 in the longitudinal direction of the contactor 61. This protrusion 62 ensures that the contactor 61 makes contact with the resilient contactor 65 at the contact portion 68.
[0036] As shown in Figure 9(c), both of the two split contacts 71 have protrusions 72 and 73 formed by bending a portion of the contact in the longitudinal direction so that the contactor 71 makes point contact with the resilient contactor 75 at the contact portion 78 in the longitudinal direction of the contactor 71. On the other hand, as shown in Figures 9(a) and 9(d), at the contact portion 79, the tip of the contactor 71 has a twisted shape while being split into two. As a result, the tip of the contactor 71 is pressed against the resilient contactor 75 with a stronger force than if it were simply split into two, resulting in reliable contact between the contactor 71 and the resilient contactor 75 at the contact portion 79.
[0037] 10(c), the contactor 81 is divided into three parts near the contact portion 88, and has a semicircular cross section. One of the three parts of the contactor 81 comes into point contact with the elastic contactor 85 at the contact portion 88.
[0038] As shown in FIGS. 7(d) to 8(d) and 10(d), the contact portions 59 to 69 and 89 are the same as those in FIG. 6(d).
[0039] In this way, by providing multiple contact points at the contact portion between the contactor and the resilient contactor, and by pressing the contactor firmly against the resilient contactor, it is possible to ensure high and reliable conductivity between the contactor and the resilient contactor, and further reduce the occurrence of stubs. Note that in this embodiment, two contact points between the contactor and the resilient contactor are exemplified, but three or more contact points may also be used.
[0040] <Differences in insertion loss due to differences in the number of contact points between the contact and the contact spring> 11A and 11B are graphs showing insertion loss characteristics for an input signal from an electronic device when the contactor and contact spring according to an embodiment of the present invention have one or two contact points. Fig. 11A shows the insertion loss characteristics for a conventional contactor and contact spring having one contact point, with the vertical axis representing insertion loss (dB) and the horizontal axis representing frequency (Hz). Fig. 11B shows the insertion loss characteristics for a contactor and contact spring according to an embodiment of the present invention having two contact points, with the vertical axis representing insertion loss (dB) and the horizontal axis representing frequency (Hz). In this embodiment, an S-parameter measurement simulation was performed, and it was confirmed that, for all four input signal frequency steps, the insertion loss dropped around 2 GHz for single-contact, but dropped around 5 GHz for double-contact.
[0041] Looking at Figure 11(a), we can see that at each of the four steps, a sudden increase in insertion loss occurs for the input signal at a frequency of around 2 GHz. When a conventional contactor and contact spring have a single contact point, the spring part exists above the contact point, and this part acts as a stub, causing the signal to flow from the contact point, reflect at the free end, and return to the contact point, adversely affecting the original signal. This is thought to be the cause of the increase in insertion loss.
[0042] In contrast, Figure 11(b) shows that the insertion loss at frequencies around 2 GHz is eliminated. Furthermore, up to a frequency of 4 GHz, the waveform is smooth, the occurrence of stubs is suppressed, and the insertion loss characteristics are improved.
[0043] This configuration makes it possible to create a state where there are almost no stubs (a state where there are no factors that cause signal degradation), which leads to an improvement in insertion loss. [Explanation of symbols]
[0044] 1, 3, 5 Electronic Devices 2, 4, 6 Circuit Board 7 Slider 8 Guide 9 Cover 10 Circuit board socket 11 Contactor 12 Contactor fixing board 13 Contactor-board fixing part 14 Elastic contact holder board 15 Elastic contact 16 Elastic contact housing member 17 Contactor-elastic contactor contact part 18 Through holes 19, 29 Space section 20 Circuit board socket 21 Contactor 22 Contactor fixing board 23 Contactor-board fixing part 24 Contact elastic part holding board 25 Elastic part of contact 26 Contact elastic portion housing member 27 Storage section 31 Contactor 32 External Contacts 33 Contactor fixing board 34 Elastic contact 41, 51, 61, 71, 81 contacts 45, 55, 65, 75, 85 elastic contacts 48, 58, 68, 78, 88 contact parts 49, 59, 69, 79, 89 Contact parts 52 Convex curved surface 62, 72, 73 convex parts
Claims
1. A socket for a circuit board, A plurality of contacts; a contact fixing substrate that fixes and holds each of the plurality of contacts; an elastic contact pressing substrate connected to the contact fixing substrate and having a plurality of through holes through which the plurality of contacts pass; a plurality of elastic contacts arranged on the opposite side of the elastic contact holder substrate from the contact fixing substrate, the elastic contacts being in contact with the plurality of contacts, respectively; Equipped with The socket for a circuit board, wherein the elastic contacts come into contact with the elastic contact pressing board in a direction in which the elastic force of the elastic contacts acts.
2. 2. The socket for a circuit board according to claim 1, wherein a space is provided between an area of said elastic contact presser substrate corresponding to the arrangement of said plurality of contacts and said contact fixing substrate.
3. 3. The socket for a circuit board according to claim 2, further comprising a resilient contact receiving member having a plurality of holes each containing one of the resilient contacts.
4. 4. The socket for a circuit board according to claim 1, wherein the elastic contact is a coil spring, and is in contact with the contact at least at two contact portions.
5. 5. The socket for a circuit board according to claim 4, wherein each of the at least two contact portions contacts the contact piece at least at two locations.
6. 5. The socket for a circuit board according to claim 4, wherein the contact has a cross-sectional shape that allows contact with the coil spring at one of the at least two contact portions that is farther from the tip of the contact.
7. 5. The socket for a circuit board according to claim 4, wherein the contactor has a curved portion at the tip portion that is convex in longitudinal cross section, so that at least one of the at least two contact portions comes into contact with the coil spring.
8. 5. The socket for a circuit board according to claim 4, wherein the contactor has at least one protrusion, so that at least one of the at least two contact portions comes into contact with a coil spring.
9. 5. The socket for a circuit board according to claim 4, wherein the tip of the contactor is split into two and twisted so that at least one of the at least two contact portions comes into contact with the coil spring.
10. A socket for a circuit board, A plurality of contacts; a contact fixing substrate that fixes and holds each of the plurality of contacts; a plurality of contact elastic portions formed by elastically deforming lower portions of the plurality of contacts; a contact elastic portion holding substrate connected to the contact fixing substrate and having a plurality of through holes through which the plurality of contacts pass; Equipped with A socket for a circuit board, characterized in that the contact elastic portion is arranged on the opposite side of the contact elastic portion holding substrate from the contact fixing substrate, and contacts the contact elastic portion holding substrate in the direction in which the elastic force of the contact elastic portion acts.
11. 11. The socket for a circuit board according to claim 10, further comprising a contact elastic portion accommodating member having a plurality of accommodating portions for accommodating the lower portions of the plurality of contact elastic portions, respectively.
12. 12. The socket for a circuit board according to claim 10, wherein a space is provided between an area of the contact elastic portion pressing substrate corresponding to the arrangement of the plurality of contacts and the contact fixing substrate.
Citation Information
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