A bridge structure and an electric energy converter

Abstract

The embodiment of the present disclosure provides a bridge structure and an electric energy converter. The bridge structure comprises a first circuit board, a second circuit board, a plurality of transmission boards and a plurality of devices. The first circuit board and the second circuit board are oppositely arranged. The plurality of transmission boards are located between the first circuit board and the second circuit board and are electrically connected with the first circuit board and the second circuit board respectively. A hollow region for airflow passing through is formed between the first circuit board, the second circuit board and the plurality of transmission boards. The plurality of devices comprise first-type devices and second-type devices. The heat generation of the first-type devices is greater than or equal to a first threshold value, and the heat generation of the second-type devices is less than the first threshold value. The first-type devices are distributed in the hollow region. The second-type devices are distributed in the hollow region and / or the remaining region of the bridge structure, so that the process of the bridge structure is simple, the safety is improved, the reliability is improved, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This disclosure relates to the field of power electronics technology, and in particular to a bridge structure and a power converter. Background Technology

[0002] In a stacked structure of two printed circuit boards (PCBs), the technology often uses multiple metal pillars (e.g., copper pillars) to fix and support the two PCBs. However, metal pillars only serve a supporting function, and additional connection methods (e.g., ribbon cables and / or flying wires) are needed to electrically connect the two PCBs, leading to problems such as process complexity. Furthermore, using ribbon cables and / or flying wires can result in poor security, poor signal consistency, and poor reliability. Summary of the Invention

[0003] This disclosure provides a cable tray structure and a power converter.

[0004] In a first aspect, embodiments of this disclosure provide a first circuit board, a second circuit board, multiple transmission boards, and multiple devices; the first circuit board and the second circuit board are placed opposite each other; the multiple transmission boards are located between the first circuit board and the second circuit board, and are electrically connected to the first circuit board and the second circuit board respectively; a hollow area for airflow is formed between the first circuit board, the second circuit board, and the multiple transmission boards;

[0005] The plurality of devices include a first type of device and a second type of device, wherein the heat generation of the first type of device is greater than or equal to a first threshold, and the heat generation of the second type of device is less than the first threshold; the first type of device is distributed in the hollow region; and the second type of device is distributed in the hollow region and / or the remaining region of the cable tray structure.

[0006] In some embodiments, within the hollow region, the first type of device and the second type of device are distributed on the upper surface of the first circuit board and / or the lower surface of the second circuit board.

[0007] In some embodiments, the cable tray structure further includes a fan, the fan blowing air toward the hollow area;

[0008] In the case where the first type of device includes multiple first sub-devices, the distance between the first sub-device and the fan is positively correlated with the heat generation of the first sub-device, and / or the distance between the first sub-device and the fan is positively correlated with the volume of the first sub-device.

[0009] In some embodiments, the plurality of first sub-devices are provided with a plurality of air ducts through which airflow passes; the airflow from the fan is diverted along the plurality of air ducts to the outer wall of the plurality of first sub-devices.

[0010] In some embodiments, when only the first type of device is distributed within the hollow region, the volume of the hollow region is positively correlated with the sum of the volumes of the plurality of first sub-devices.

[0011] In some embodiments, the second circuit board includes a connection area and a non-connection area, the projection of the connection area covering the area where the plurality of transmission boards contact the second circuit board; when the second type of device includes a plurality of second sub-devices, on the second circuit board:

[0012] The second sub-devices with a weight greater than or equal to the second threshold are distributed in the connected region, and the second sub-devices with a weight less than the second threshold are distributed in the unconnected region.

[0013] In some embodiments, the length of the multiple transmission boards along the wind direction is positively correlated with the number of the second sub-devices distributed in the connection area.

[0014] In some embodiments, the plurality of devices further include plug-in devices distributed in the areas where the plurality of transmission boards contact the first circuit board and / or the second circuit board.

[0015] In some embodiments, the connector-type device includes a first type of connector and a second type of connector;

[0016] The multiple transmission boards are electrically connected to the first circuit board via the first type of connector, and the multiple transmission boards are electrically connected to the second circuit board via the second type of connector.

[0017] In some embodiments, when the volume of the second sub-device is greater than or equal to a third threshold, the second sub-device is distributed within the hollow region and / or on the second circuit board.

[0018] In some embodiments, the distance between the first sub-device with a volume greater than or equal to the third threshold and the wind turbine is greater than the distance between the first sub-device with a volume less than the third threshold and the wind turbine.

[0019] In some embodiments, the plurality of devices further include transmission devices, which are electrically connected to the remaining devices in the cable tray structure, and / or the transmission devices are electrically connected to devices outside the cable tray structure;

[0020] When the transmission devices are electrically connected to devices outside the bridge structure, the transmission devices are distributed on the multiple transmission boards.

[0021] In some embodiments, the height of the transmission device located on the corresponding transmission board and the height of the device outside the bridge structure meet a preset range.

[0022] In some embodiments, the cable tray structure further includes signal lines, which are used by the multiple transmission boards to transmit signals.

[0023] In a second aspect, embodiments of this disclosure provide a power converter, the power converter including the bridge structure as described in any one of the first aspects;

[0024] The power converter is used at least to convert DC power into AC power, or AC power into DC power.

[0025] This disclosure provides a cable tray structure and a power converter. The cable tray structure includes a first circuit board, a second circuit board, multiple transmission boards, and multiple devices. The first and second circuit boards are placed opposite each other. The multiple transmission boards are located between the first and second circuit boards and are electrically connected to both the first and second circuit boards. A hollow region for airflow is formed between the first circuit board, the second circuit board, and the multiple transmission boards. The multiple devices include first-type devices and second-type devices. The heat generation of the first-type devices is greater than or equal to a first threshold, and the heat generation of the second-type devices is less than the first threshold. The first-type devices are distributed within the hollow region, and the second-type devices are distributed within the hollow region and / or the remaining areas of the cable tray structure. In this way, the multiple transmission boards can provide support and electrical connection for the first and second circuit boards, simplifying the process, improving safety, and increasing reliability. Furthermore, the first-type devices, which generate more heat, can be arranged within the hollow region, improving heat dissipation efficiency. Attached Figure Description

[0026] Figure 1 A three-dimensional structural diagram of a semiconductor structure;

[0027] Figure 2 A three-dimensional structural diagram of a cable tray structure provided in this embodiment of the present disclosure. Figure 1 ;

[0028] Figure 3 A three-dimensional structural diagram of a cable tray structure provided in this embodiment of the present disclosure. Figure 2 ;

[0029] Figure 4 A three-dimensional structural diagram of a cable tray structure provided in this embodiment of the present disclosure. Figure 3 ;

[0030] Figure 5 This is a schematic diagram of the composition of a cable tray structure provided in an embodiment of the present disclosure;

[0031] Figure 6 A three-dimensional structural schematic diagram of a connector device provided in an embodiment of this disclosure;

[0032] Figure 7 This is a schematic diagram of the composition structure of a power converter provided in an embodiment of this disclosure. Detailed Implementation

[0033] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only for explaining the relevant applications and are not intended to limit the scope of this disclosure. Furthermore, it should be noted that, for ease of description, only the parts relevant to the relevant applications are shown in the accompanying drawings.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing embodiments of this disclosure only and is not intended to be limiting of this disclosure.

[0035] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0036] It should be noted that the terms "first, second, third" used in the embodiments of this disclosure are merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, third" can be interchanged in a specific order or sequence where permitted, so that the embodiments of this disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0037] In related technologies, multiple metal pillars are often used to support two PCB boards placed opposite each other. See also Figure 1 It provides a three-dimensional structural diagram of a semiconductor structure. For example... Figure 1 As shown, the semiconductor structure 10 includes a first circuit board 11, a second circuit board 12, and multiple metal pillars 13. Figure 1 Only one label 13 is shown in the image, along with multiple ribbon cable terminals 14. Figure 1Only one reference numeral 14 is shown in the figure; the first circuit board 11 and the second circuit board 12 are placed opposite each other along a first direction, which is perpendicular to the plane where the first circuit board 11 and / or the second circuit board 12 are located; multiple metal pillars 13 are located between the first circuit board 11 and the second circuit board 12; multiple ribbon cable terminals 14 are located on the first circuit board 11 and the second circuit board 12 respectively.

[0038] For example, Figure 1 The circuit includes four metal pillars 13, which are located around the second circuit board 12. However, the number and position of the metal pillars 13 are not specifically limited. Specifically, the metal pillars 13 can be copper pillars, and this is also not specifically limited.

[0039] For example, Figure 1 The circuit includes four ribbon cable terminals 14, two of which are located on the first circuit board 11 and two on the second circuit board 12. However, the number and location of the ribbon cable terminals 14 are not specifically limited. Furthermore, the ribbon cable terminals 14 on the first circuit board 11 and the ribbon cable terminals 14 on the second circuit board 12 are connected by ribbon cables to electrically connect the first circuit board 11 and the second circuit board 12.

[0040] It should be noted that, Figure 1 The example uses ribbon cable terminal 14, but the first circuit board 11 and the second circuit board 12 can also be electrically connected by a flying wire, and there is no specific limitation on this.

[0041] It should also be noted that, although Figure 1 The components are not shown in the diagram, but they can also be arranged on the first circuit board 11 and the second circuit board 12 as needed.

[0042] In summary, along the first direction, the upper PCB board (i.e., the second circuit board 12) is fixed to the lower PCB board (i.e., the first circuit board 11) by the metal pillar 13. The metal pillar 13 only serves a supporting function and does not provide electrical connection. In related technologies, additional connection methods (e.g., ribbon cables and / or flying wires) are required to electrically connect the two PCB boards, leading to problems such as complex manufacturing processes. Furthermore, using ribbon cables and / or flying wires can result in issues such as failure to meet safety regulations, poor safety, poor signal consistency, interference with other devices, and poor reliability.

[0043] Based on this, the present disclosure provides a cable tray structure, which includes a first circuit board, a second circuit board, multiple transmission boards, and multiple devices. The first and second circuit boards are placed opposite each other. The multiple transmission boards are located between the first and second circuit boards and are electrically connected to the first and second circuit boards respectively. A hollow area for airflow is formed between the first circuit board, the second circuit board, and the multiple transmission boards. The multiple devices include first-type devices and second-type devices, where the heat generation of the first-type devices is greater than or equal to a first threshold, and the heat generation of the second-type devices is less than the first threshold. The first-type devices are distributed within the hollow area, and the second-type devices are distributed within the hollow area and / or the remaining areas of the cable tray structure. In this way, the multiple transmission boards can provide support and electrical connection for the first and second circuit boards, simplifying the process, improving safety, and increasing reliability. In addition, the first-type devices with higher heat generation can be arranged within the hollow area to improve heat dissipation efficiency.

[0044] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0045] In one embodiment of this disclosure, see Figure 2 It shows a three-dimensional structural schematic of a cable tray structure provided in an embodiment of this disclosure. Figure 1 .like Figure 2 As shown, the cable tray structure 20 includes a first circuit board 21, a second circuit board 22, and multiple transmission boards 23. Figure 2 Only one label 23 is shown in the figure, and multiple devices 24 (labels not shown in the figure); the first circuit board 21 and the second circuit board 22 are placed opposite each other; multiple transmission plates 23 are located between the first circuit board 21 and the second circuit board 22, and are electrically connected to the first circuit board 21 and the second circuit board 22 respectively; a hollow area 25 for airflow is formed between the first circuit board 21, the second circuit board 22 and the multiple transmission plates 23;

[0046] Multiple devices 24 include first-type devices 241 and second-type devices 242. Figure 2 Only one label (241, 242) is shown. The heat generation of the first type of device 241 is greater than or equal to the first threshold, and the heat generation of the second type of device 242 is less than the first threshold. The first type of device 241 is distributed in the hollow region 25. The second type of device 242 is distributed in the hollow region 25 and / or the remaining areas of the bridge structure 20.

[0047] like Figure 2As shown, the first circuit board 21 and the second circuit board 22 are placed opposite each other along a first direction, which is perpendicular to the plane containing the first circuit board 21 and / or the second circuit board 22. That is, along the first direction, the second circuit board 22 is located above the first circuit board 21. On the surface of the first circuit board 21 or the second circuit board 22, two intersecting (e.g., perpendicular) directions are defined, namely the second direction and the third direction.

[0048] It should be noted that the first circuit board 21, the second circuit board 22, and the multiple transmission boards 23 are all PCBs, and the transmission board 23 can also be called a bridge board. In this embodiment, the dimensions of the first circuit board 21, the second circuit board 22, and the multiple transmission boards 23, as well as the positions of the multiple transmission boards 23 electrically connected to the first circuit board 21 and the second circuit board 22, are not specifically limited. For example, Figure 2 The second circuit board 22 is smaller than the first circuit board 21, and the two transmission boards 23 are electrically connected at the edge of the second circuit board 22 along a third direction.

[0049] It should also be noted that if the cable tray structure 20 includes two transmission boards 23, then a hollow region 25 can be formed between the first circuit board 21, the second circuit board 22, and the two transmission boards 23; if the cable tray structure 20 includes three transmission boards 23, then two hollow regions 25 can be formed between the first circuit board 21, the second circuit board 22, and the three transmission boards 23. This embodiment does not specifically limit the number of transmission boards 23. Exemplarily, the specific implementation of this embodiment will be described in detail using the example of a cable tray structure 20 including two transmission boards 23 and one hollow region 25.

[0050] It should also be noted that device 24 can be distributed on the first circuit board 21, and / or the second circuit board 22, and / or multiple transmission boards 23, and is electrically connected to the corresponding circuit board. Figure 2 In this embodiment, different shaped devices 24 can represent different devices, and the type of device is not specifically limited in this embodiment. Furthermore, compared to related technologies, the type and quantity of devices remain unchanged, but based on the cable tray structure 20 of this disclosure, the devices 24 are rearranged according to their attributes; that is, the devices 24 on the transmission board 23 are... Figure 1 Devices on the first circuit board 11 and / or the second circuit board 12. Here, the device attributes are at least one or more of the following: heat generation, weight, volume, device type, and connection type.

[0051] In this embodiment, a first threshold can be set according to actual needs to place the device 24 with higher heat generation (i.e., the first type of device 241) in the hollow region 25, and the device 24 with lower heat generation (i.e., the second type of device 242) in the hollow region 25 and / or the remaining areas of the bridge structure 20. The value of the first threshold is not specifically limited. That is, the first type of device 241 with higher heat generation needs to be placed in the hollow region 25 to improve heat dissipation efficiency; while the second type of device 242 with lower heat generation can be placed in the hollow region 25 and / or the remaining areas of the bridge structure 20 according to actual needs. For example, the specific implementation of this embodiment will be described in detail with the example of the second type of device 242 being placed in the remaining areas of the bridge structure 20 (e.g., on the second circuit board 22). Furthermore, the first type of device 241 with higher heat generation may include capacitors, inductors, switching devices, etc.

[0052] In summary, please refer to Figure 1 In related technologies, multiple metal pillars 13 arranged in a dispersed manner cannot form an area for airflow between the first circuit board 11 and the second circuit board 12, and the metal pillars 13 cannot serve as electrical connections.

[0053] In contrast, please see Figure 2 Multiple transmission boards 23 can support and electrically connect the first circuit board 21 and the second circuit board 22, reducing problems such as non-compliance with safety regulations, poor signal consistency, and interference with other devices caused by ribbon cables and / or flying wires in related technologies. This simplifies the process, improves safety, and enhances reliability. Secondly, the surface of the multiple transmission boards 23 creates a hollow area 25 for airflow between the first circuit board 21, the second circuit board 22, and the multiple transmission boards 23, constructing an air duct. The first type of device 241, which generates a lot of heat, is arranged in the hollow area 25, improving heat dissipation efficiency. In addition, compared with related technologies, the bridge structure 20 increases the surface area of ​​the multiple transmission boards 23, which can also increase power density.

[0054] In some embodiments, such as Figure 3 As shown, within the hollow region 25, the first type of device 241 and the second type of device 242 are distributed on the upper surface of the first circuit board 21 and / or the lower surface of the second circuit board 22.

[0055] It should be noted that, in this embodiment, the devices being distributed on the upper surface of the circuit board means that they are distributed on the circuit board and that the devices are electrically connected to the circuit board.

[0056] It should also be noted that the first circuit board 21 and the second circuit board 22 are placed opposite each other along the first direction. Specifically, the upper surface of the first circuit board 21 and the lower surface of the second circuit board 22 are placed opposite each other.

[0057] It should also be noted that if the second type of device 242 is distributed within the hollow region 25, the second type of device 242 can be distributed on the upper surface of the first circuit board 21 and / or the lower surface of the second circuit board 22. For example... Figure 3 As shown, exemplarily, only the first type of device 241 is distributed within the hollow region 25 and on the lower surface of the second circuit board 22. The first type of device 241 can be hung upside down on the lower surface of the second circuit board 22 using hooks (as shown in the dashed box), or it can be placed on the lower surface of the second circuit board 22 within the hollow region 25 in other ways; no specific limitation is made in this regard. Exemplarily, the specific implementation of this embodiment is described in detail using the example of the first type of device 241 being distributed within the hollow region 25 and located on the first circuit board 21.

[0058] In some embodiments, such as Figure 2 As shown, the cable tray structure 20 may also include a fan 26 (not shown in the figure), and the fan 26 blows air into the hollow area 25;

[0059] In the case where the first type of device 241 includes multiple first sub-devices, the distance between the first sub-device and the fan 26 is positively correlated with the heat generation of the first sub-device, and / or the distance between the first sub-device and the fan 26 is positively correlated with the volume of the first sub-device.

[0060] Specifically, the wind from the fan 26 blows towards the hollow region 25 in the second direction, that is, the wind direction is the second direction.

[0061] Here, the distance between the first sub-device with higher heat generation and the fan 26 is greater than the distance between the first sub-device with lower heat generation and the fan 26, so that the air blown by the fan 26 towards the first sub-device that is farther away from the fan 26 will not be overheated and will not affect the heat dissipation efficiency; the distance between the first sub-device with larger volume and the fan 26 is greater than the distance between the first sub-device with smaller volume and the fan 26, so that the first sub-device with larger volume will not block the airflow in the hollow area 25 and will not affect the heat dissipation efficiency.

[0062] It should be noted that, when the cross-sectional area of ​​the first sub-devices is equal, the volume of the first sub-device is positively correlated with the height of the first sub-device. In other words, the distance between the first sub-device and the fan 26 is positively correlated with the height of the first sub-device. The shorter first sub-device is closer to the fan 26 than the relatively taller first sub-device.

[0063] It should also be noted that the cable tray structure 20 may include one or more fans 26. The air from the fan 26 can be directed towards the first type of device 241 within the hollow area 25 and / or the unobstructed blank area, without specific limitations. Here, the fan 26 can be a turbulence fan, but this is not specifically limited. A turbulence fan is a technology that uses resistance and disturbance to improve the efficiency of gas conveying and save energy. Its main principle is to change the gas flow field characteristics to keep the gas at a high speed during the conveying process and to recover as much energy as possible after the gas is sent out by the fan. The working principle of a turbulence fan is that various forms of disturbance structures such as baffles, honeycomb packing, or spiral bodies are installed inside the fan, which can prevent gas flow, change the flow field characteristics, and thus improve working efficiency.

[0064] Furthermore, in some embodiments, such as Figure 2 As shown, there are multiple air ducts between the multiple first sub-devices for airflow to pass through; the air from the fan 26 is diverted along the multiple air ducts to the outer walls of the multiple first sub-devices.

[0065] like Figure 2 As shown, the air ducts through which the airflow passes are indicated by arrows. When the air from the fan 26 is distributed along multiple air ducts to the outer walls of multiple first sub-devices, it can carry away the heat from the first type of device 241 and improve the heat dissipation efficiency.

[0066] In some embodiments, when only the first type of device 241 is distributed in the hollow region 25, the volume of the hollow region 25 is positively correlated with the sum of the volumes of the plurality of first sub-devices.

[0067] In other words, when the sum of the volumes of all the first sub-devices included in the first type of device 241 is small, the volume of the hollow region 25 can be reduced by adjusting the position of the multiple transmission boards 23 electrically connected to the first circuit board 21 and the second circuit board 22; when the sum of the volumes of all the first sub-devices included in the first type of device 241 is large, the volume of the hollow region 25 can be increased.

[0068] based on Figure 2 The cable tray structure 20 shown is as follows: Figure 4 As shown, by adjusting the positions of the multiple transmission boards 23 electrically connected to the first circuit board 21 and the second circuit board 22, the two transmission boards 23 are brought closer to each other along a third direction, so as to reduce the volume of the hollow region 25.

[0069] In some embodiments, when the first type of device 241 and the second type of device 242 are distributed in the hollow region 25, the volume of the hollow region 25 is positively correlated with the sum of the volumes of the first type of device 241 and the second type of device 242.

[0070] When the second type of device 242 includes multiple second sub-devices, the volume of the hollow region 25 can be reduced when the sum of the volumes of all the first sub-devices included in the first type of device 241 and all the second sub-devices included in the second type of device 242 is small; and the volume of the hollow region 25 can be increased when the sum of the volumes of all the first sub-devices included in the first type of device 241 and all the second sub-devices included in the second type of device 242 is large.

[0071] It should be noted that the first circuit board 21 is located at the lower part of the bridge structure 20 and has good load-bearing capacity. When the first type of device 241 is heavy, placing it on the first circuit board 21 can improve the stability of the bridge structure 20.

[0072] Additionally, for ease of illustration, for Figures 2 to 4 The first circuit board 21, the second circuit board 22, and multiple transmission boards 23 are adaptively filled. Please refer to the text description for further understanding.

[0073] In some embodiments, see Figure 5 The diagram illustrates a structural composition of a cable tray structure according to an embodiment of this disclosure, specifically a top view along a first direction. Figure 5 As shown, the second circuit board 22 may include a connection area 221 and a non-connection area 222 (not shown in the figure). The projection of the connection area 221 covers the area where multiple transmission boards 23 contact the second circuit board 22. When the second type of device 242 includes multiple second sub-devices, on the second circuit board 22:

[0074] Second sub-devices with a weight greater than or equal to the second threshold are distributed in the connection region 221, and second sub-devices with a weight less than the second threshold are distributed in the non-connection region 222.

[0075] In this embodiment, a second threshold can be set according to actual needs to place the heavier second sub-device in the connection area 221 and the lighter second sub-device in the non-connection area 222. The value of the second threshold is not specifically limited.

[0076] It should be noted that the size of the connection area 221 is larger than the size of the area where the multiple transmission boards 23 contact the second circuit board 22. The difference in size between the two areas can be set according to actual needs, such as based on the number and volume of the second sub-devices placed therein. In other words, the size of the connection area 221 can be set according to actual needs. Figure 5 The dimensions of the connection area 221 are for illustrative purposes only. Additionally, on the second circuit board 22, apart from the connection area 221, the remaining area is the non-connection area 222.

[0077] It should also be noted that because the projection of the connection area 221 covers the area where multiple transmission boards 23 contact the second circuit board 22, the load-bearing capacity of the connection area 221 is better than that of the non-connection area 222. Therefore, the second sub-device with lower heat generation and higher weight is placed in the connection area 221 of the second circuit board 22, while the second sub-device with lower heat generation and lower weight is placed in the non-connection area 222 of the second circuit board 22, such as the middle area of ​​the second circuit board 22, thereby improving the stability of the cable tray structure 20.

[0078] Furthermore, the layout of the entire cable tray structure 20 and the positional relationship of the fan 26 can be optimized so that the transmission plate 23 has a longer dimension along the wind direction, so that the connection area 221 of the second circuit board 22 can support more second sub-devices with a weight greater than or equal to the second threshold.

[0079] In some embodiments, the length of the multiple transmission boards 23 along the wind direction is positively correlated with the number of second sub-devices distributed in the connection area 221.

[0080] In other words, when the number of second sub-devices to be placed in the connection area 221 is large, the length of the transmission board 23 along the wind direction can be increased; when the number of second sub-devices to be placed in the connection area 221 is small, the length of the transmission board 23 along the wind direction can also be smaller. For example, Figure 5 The length of the transmission plate 23 along the wind direction is greater than Figure 2 The length of the transmission plate 23 along the wind direction.

[0081] It should be noted that when the requirements for the number of second sub-devices in the connection area 221 and the stability requirements of the bridge structure 20 are met, the lengths of multiple transmission boards 23 along the wind direction can be adjusted synchronously, or only some of the transmission boards 23 can be adjusted; there are no specific limitations on either.

[0082] In some embodiments, such as Figure 2 As shown, the multiple devices 24 also include plug-in devices 243 (not shown in the figure), which are distributed in the areas where the multiple transmission boards 23 contact the first circuit board 21 and / or the second circuit board 22.

[0083] For example, Figure 2 Only one of the connectors 243 is shown around one of the transmission boards 23, but each transmission board 23 has connectors 243 around it.

[0084] It should be noted that the projections of the areas where the multiple transmission boards 23 contact the second circuit board 22 and the areas where the multiple transmission boards 23 contact the first circuit board 21 overlap along the first direction. Furthermore, because the projection of the connection area 221 of the second circuit board 22 covers the area where the multiple transmission boards 23 contact the second circuit board 22, when a heavier second sub-device is placed in the connection area 221, the weight of the second sub-device allows for a more secure connection between the connector 243 and the first circuit board 21, the second circuit board 22, and the multiple transmission boards 23. In other words, the connector 243 not only secures the various PCBs but also improves the stability of the cable tray structure 20.

[0085] Furthermore, in some embodiments, such as Figure 2 As shown, the connector type device 243 includes a first type connector 2431 and a second type connector 2432;

[0086] Multiple transmission boards 23 are electrically connected to the first circuit board 21 via a first type of connector 2431, and multiple transmission boards 23 are electrically connected to the second circuit board 22 via a second type of connector 2432.

[0087] It should be noted that the first type of connector 2431 is distributed in the area where multiple transmission boards 23 contact the first circuit board 21, and the second type of connector 2432 is distributed in the area where multiple transmission boards 23 contact the second circuit board 22. The entire cable tray structure 20 can be electrically connected through the first type of connector 2431 and the second type of connector 2432.

[0088] Here, the first type of connector 2431 and the second type of connector 2432 have the same structure.

[0089] See Figure 6 This illustration shows a three-dimensional structural diagram of a connector-type device provided in an embodiment of this disclosure. Figure 6 As shown, the pin terminals of the connector device 243 are distributed at 90°. The two parts of the terminals are respectively inserted into the transmission board 23 and the first circuit board 21 or the second circuit board 22. The PCB board into which the two parts of the terminals are inserted can be selected according to actual needs. For example, the longer part of the terminal can be inserted into the first circuit board 21 or the second circuit board 22, and the shorter part of the terminal can be inserted into the transmission board 23, thereby providing strength support and improving the stability of the cable tray structure 20.

[0090] In some embodiments, a soldering process can be used to solder the first type connector 2431 onto the first circuit board 21 and the corresponding transmission board 23. This soldering process on the lower first circuit board 21 makes it more secure and robust compared to… Figure 1 The relevant technologies used in this study reduce the number of potential failure points caused by contact by half, thus improving the reliability of the cable tray structure 20.

[0091] In other embodiments, a soldering process can be used to solder the first type of connector 2431 onto the first circuit board 21 and the corresponding transmission board 23, and the second type of connector 2432 can be soldered onto the second circuit board 22 and the corresponding transmission board 23, thereby making compared Figure 1 The relevant technologies used in this system virtually eliminate contact-related failure points, further improving the reliability of the cable tray structure 20.

[0092] In some embodiments, when the volume of the second sub-device is greater than or equal to a third threshold, the second sub-device is distributed within the hollow region 25 and / or on the second circuit board 22.

[0093] In this embodiment, a third threshold can be set according to actual needs to place the larger second sub-device in the hollow area 25 and / or on the second circuit board 22. The value of the third threshold is not specifically limited.

[0094] Specifically, in one possibility, if the volume of the second sub-device is greater than or equal to the third threshold, the second sub-device may be distributed on the second circuit board 22.

[0095] It should be noted that by placing the second sub-device, whose volume is greater than or equal to the third threshold, on the second circuit board 22, the area of ​​the first circuit board 21 constituting the hollow region 25 can be preferentially expanded to increase the volume of the hollow region 25, given that the area of ​​the first circuit board 21 is the same. This allows more first sub-devices to be placed within the hollow region 25. In other words, placing the second sub-device, which has lower heat generation (i.e., heat generation less than the first threshold) and larger volume (i.e., volume greater than or equal to the third threshold), on the second circuit board 22 does not affect the use of the hollow region 25, thus improving the overall heat dissipation efficiency.

[0096] In another possibility, if the volume of the second sub-device is greater than or equal to the third threshold, the second sub-device can be distributed within the hollow region 25.

[0097] It should be noted that when the number of first sub-devices requiring heat dissipation is small and there is extra space in the hollow area 25, a second sub-device with a larger volume (i.e., a volume greater than or equal to the third threshold) can be placed in the hollow area 25, making the layout of the bridge structure 20 more compact.

[0098] In another possibility, if the volume of the second sub-device is greater than or equal to the third threshold, the second sub-device may be distributed within the hollow region 25 and on the second circuit board 22, without specific limitations.

[0099] It should be noted that smaller sub-devices (i.e., smaller than the third threshold) are preferably placed on the second circuit board 22 and the remaining areas of the first circuit board 21 except for the hollow area 25. However, they can also be placed in the hollow area 25 as needed, and no specific limitation is made.

[0100] The distance between the first sub-device and the fan 26 is positively correlated with the volume of the first sub-device. Specifically, in some embodiments, the distance between the first sub-device with a volume greater than or equal to the third threshold and the fan 26 is greater than the distance between the first sub-device with a volume less than the third threshold and the fan 26.

[0101] In other words, the smaller first sub-device is closer to the fan 26 than the larger first sub-device.

[0102] In some embodiments, such as Figure 2 As shown, the plurality of devices 24 may also include transmission devices 244 (only one numeral 244 is shown in the figure), which are electrically connected to the other devices in the bridge structure 20, and / or are electrically connected to devices outside the bridge structure 20.

[0103] When the transmission device 244 is electrically connected to the device outside the bridge structure 20, the transmission device 244 is distributed on multiple transmission boards 23.

[0104] It should be noted that there is no specific limitation on the type of transmission device 244, and it can be set according to actual needs. For example, the transmission device 244 is a network port terminal, which needs to be electrically connected to devices outside the cable tray structure 20.

[0105] In related technologies, transmission devices are generally placed on the lower circuit board (first circuit board 11), while the connection points of external devices that need electrical connection are higher, thus requiring adapter processing. In this embodiment, when the transmission device 244 needs to be electrically connected to a device outside the bridge structure 20, it is placed on the transmission board 23 arranged along the first direction, and the height of the transmission device 244 can be adjusted according to the height of the device outside the bridge structure 20, thus eliminating the need for adapter processing.

[0106] Furthermore, in some embodiments, the height of the transmission device 244 located on the corresponding transmission board 23 is within a preset range from the height of the device outside the bridge structure 20.

[0107] In other words, the height of the transmission device 244 on the transmission board 23 can be adjusted to meet the height requirements of the transmission device 244 for external wiring.

[0108] It should be noted that the preset range can be 0, that is, the height of the transmission device 244 on the corresponding transmission board 23 is the same as the height of the device outside the bridge structure 20. It can also be set according to actual needs, as long as the transmission device 244 and the device outside the bridge structure 20 can be directly electrically connected. There is no specific limitation on this.

[0109] In some embodiments, the cable tray structure 20 may also include signal lines, and multiple transmission boards 23 utilize the signal lines to transmit signals.

[0110] It should be noted that signal lines can be processed accordingly to isolate, shield, or modify the current carrying capacity of related signals. For example, wrapping a shielding layer around the signal line can shield the transmitted signal.

[0111] In some embodiments, the cable tray structure 20 may further include multiple metal pillars located between the first circuit board 21 and the second circuit board 22.

[0112] It should be noted that when the surface area of ​​the first circuit board 21 and the second circuit board 22 is large, and multiple transmission boards 23 are electrically connected at the edge of the second circuit board 22 along a third direction, metal pillars can be placed in the middle area of ​​the second circuit board 22 to further increase the strength and stability of the cable tray structure 20. There are no specific limitations on the number and location of the metal pillars. Specifically, the metal pillars can be copper pillars, but this is not specifically limited.

[0113] In summary, this disclosure provides a cable tray structure 20, which, compared to... Figure 1 The semiconductor structure 10 and bridge structure 20 shown can construct airflow channels, increase the board surface area (i.e., the board surface area of ​​multiple transmission boards 23), improve power density, and reduce problems such as non-compliance with safety requirements, poor signal consistency, and interference with other devices caused by flying wires. Specific details are as follows:

[0114] (1) In the plate-and-plate structure, a cable tray (i.e., transmission plate 23) is used for signal connection and support, and copper pillars can be used for auxiliary support, replacing... Figure 1 The copper pillar support and ribbon cable connection scheme in the related technology optimizes the process design and PCB board design, resulting in a strong sense of craftsmanship.

[0115] (2) From a process perspective, the PCB board (i.e., transmission board 23) in this disclosure is used instead. Figure 1The cabling technology can reduce the cabling process and improve reliability; it can also flexibly adapt to the number of connecting wires in the cable tray structure 20; in addition, since the first type of connector 2431 can be soldered to the lower first circuit board 21 and the corresponding transmission board 23 using a soldering process, the failure points caused by contact are reduced by half.

[0116] (3) From the perspective of the line, the transmission board 23 is used as a connector to ensure the consistency of the line batch; and the relevant signals can be isolated, shielded, and current-carrying processed.

[0117] (4) From the perspective of PCB design, adding a bridge board to the bridge structure 20 is equivalent to increasing the area of ​​the PCB board, thereby reducing the area of ​​other boards (i.e., the first circuit board 21 and the second circuit board 22), which is beneficial to reducing the chassis size using the bridge structure 20 and making the design easier.

[0118] (5) A hollow area 25 can be constructed through the cable tray plate.

[0119] In another embodiment of this disclosure, see Figure 7 This illustration shows a schematic diagram of the structure of a power converter provided in an embodiment of this disclosure. Figure 7 As shown, the power converter 30 includes the aforementioned bridge structure 20;

[0120] The power converter 30 is used at least to convert DC power into AC power, or AC power into DC power.

[0121] It should be noted that the power converter 30 may include an inverter, a converter, and a rectifier. The inverter can convert DC power into AC power; the rectifier can convert AC power into DC power; and the converter can convert fixed-frequency AC power into adjustable-frequency AC power, or it can convert DC power into AC power.

[0122] The power converter 30, since it includes the aforementioned bridge structure 20, has at least the same advantages as the bridge structure 20, which can simplify the process, improve safety, improve reliability, and improve heat dissipation efficiency.

[0123] For details not disclosed in the embodiments of this disclosure, please refer to the description of the foregoing embodiments for understanding.

[0124] The above description is merely a preferred embodiment of this disclosure and is not intended to limit the scope of protection of this disclosure.

[0125] It should be noted that, in this disclosure, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0126] The sequence numbers of the embodiments disclosed above are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0127] The methods disclosed in the several method embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method embodiments.

[0128] The features disclosed in the several product embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new product embodiments.

[0129] The features disclosed in the several method or device embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method or device embodiments.

[0130] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A cable tray structure, characterized in that, The cable tray structure includes a first circuit board, a second circuit board, multiple transmission boards, and multiple devices; the first circuit board and the second circuit board are placed opposite each other; the multiple transmission boards are located between the first circuit board and the second circuit board, and are electrically connected to the first circuit board and the second circuit board respectively; the first circuit board and the second circuit board are connected by signals through the multiple transmission boards; a hollow area for airflow is formed between the first circuit board, the second circuit board, and the multiple transmission boards. The plurality of devices includes a first type of device and a second type of device, wherein the heat generation of the first type of device is greater than or equal to a first threshold, and the heat generation of the second type of device is less than the first threshold; the first type of device is distributed in the hollow region; the second type of device is distributed in the hollow region and / or the remaining region of the cable tray structure; The plurality of devices also include plug-in devices, which are distributed in the areas where the plurality of transmission boards contact the first circuit board and / or the second circuit board; The plurality of devices also includes transmission devices, which are electrically connected to the other devices in the cable tray structure, and / or electrically connected to devices outside the cable tray structure; when the transmission devices are electrically connected to devices outside the cable tray structure, the transmission devices are distributed on the plurality of transmission boards.

2. The cable tray structure according to claim 1, characterized in that, Within the hollow region, the first type of device and the second type of device are distributed on the upper surface of the first circuit board and / or the lower surface of the second circuit board.

3. The cable tray structure according to claim 1, characterized in that, The cable tray structure also includes a fan, and the fan blows air into the hollow area; In the case where the first type of device includes multiple first sub-devices, the distance between the first sub-device and the fan is positively correlated with the heat generation of the first sub-device, and / or the distance between the first sub-device and the fan is positively correlated with the volume of the first sub-device.

4. The cable tray structure according to claim 3, characterized in that, The plurality of first sub-devices are provided with a plurality of air ducts through which airflow passes; the air from the fan is diverted along the plurality of air ducts to the outer wall of the plurality of first sub-devices.

5. The cable tray structure according to claim 3, characterized in that, When only the first type of device is distributed within the hollow region, the volume of the hollow region is positively correlated with the sum of the volumes of the plurality of first sub-devices.

6. The cable tray structure according to claim 3, characterized in that, The second circuit board includes a connection area and a non-connection area, the projection of which covers the area where the plurality of transmission boards contact the second circuit board; when the second type of device includes a plurality of second sub-devices, on the second circuit board: The second sub-devices with a weight greater than or equal to the second threshold are distributed in the connected region, and the second sub-devices with a weight less than the second threshold are distributed in the unconnected region.

7. The cable tray structure according to claim 6, characterized in that, The length of the multiple transmission boards along the wind direction is positively correlated with the number of the second sub-devices distributed in the connection area.

8. The cable tray structure according to claim 1, characterized in that, The connector-type devices include first-type connectors and second-type connectors; The multiple transmission boards are electrically connected to the first circuit board via the first type of connector, and the multiple transmission boards are electrically connected to the second circuit board via the second type of connector.

9. The cable tray structure according to claim 6, characterized in that, When the volume of the second sub-device is greater than or equal to the third threshold, the second sub-device is distributed within the hollow area and / or on the second circuit board.

10. The cable tray structure according to claim 9, characterized in that, The distance between the first sub-device with a volume greater than or equal to the third threshold and the wind turbine is greater than the distance between the first sub-device with a volume less than the third threshold and the wind turbine.

11. The cable tray structure according to claim 1, characterized in that, The height of the transmission device is located within a preset range between the height of the corresponding transmission board and the height of the device outside the bridge structure.

12. The cable tray structure according to claim 1, characterized in that, The cable tray structure also includes signal lines, and the multiple transmission boards use the signal lines to transmit signals.

13. A power converter, characterized in that, The power converter includes a bridge structure as described in any one of claims 1 to 12; The power converter is used at least to convert DC power into AC power, or AC power into DC power.

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