Component Mounting Equipment

Abstract

To provide a component mounting apparatus capable of increasing the anti-vibration performance.SOLUTION: A component mounting apparatus 1 includes: an apparatus body 10 that executes a positioning control of a head 16 for mounting a component 200 onto a substrate 100; and a support leg 30 that is placed between the apparatus body 10 and floor F to support the apparatus body 10. The support leg 30 includes: a pedestal part 40 that is placed on the floor F; a leg 50 that connects the pedestal part 40 and apparatus body 10 therebetween; and at least one damper 60 with one end 61 connected to the apparatus body 10 and the other end 62 connected to the pedestal part 40.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus. [Background technology]

[0002] BACKGROUND ART Conventionally, in component mounting devices, a configuration is known in which, in order to reduce vibration, a vibration-isolating rubber sheet is disposed between the legs of the mounting device and the floor surface (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2017 / 1085840 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been a demand for improved vibration isolation performance. Therefore, an object of the present invention is to provide a component mounting apparatus that can further improve vibration isolation performance. [Means for solving the problem]

[0005] In order to achieve the above object, a component mounting device according to one embodiment of the present invention comprises a device main body that performs positioning control of a head for mounting components on a substrate, and a support leg portion that is arranged between the device main body and a floor surface and supports the device main body, the support leg portion having a base portion that is installed on the floor surface, a leg portion that connects the base portion and the device main body, and at least one damper that has one end connected to the device main body and the other end connected to the base portion. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide a component mounting device with improved vibration isolation performance. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a schematic diagram showing a schematic configuration of a component mounting apparatus according to an embodiment; [Figure 2] 3A and 3B are schematic diagrams illustrating a schematic configuration of a support leg part according to an embodiment. [Figure 3] 10 is a schematic diagram showing a schematic configuration of a support leg part according to Modification 1. FIG. [Figure 4] 10 is a schematic diagram showing a schematic configuration of a support leg part according to Modification 2. FIG. [Figure 5] 10 is a schematic diagram showing a schematic configuration of a support leg part according to Modification 3. FIG. [Figure 6] 13 is a schematic diagram showing a schematic configuration of a support leg part according to Modification 4. FIG. [Figure 7] FIG. 13 is a schematic diagram showing a schematic configuration of a support leg part according to Modification 5. DETAILED DESCRIPTION OF THE INVENTION

[0008] (Inventor's Knowledge) When vibration is prevented by using a vibration-isolating rubber sheet, as in the conventional component mounting device described above, a relatively soft rubber sheet can reduce vibration on the floor side, but the vibration on the component mounting device side increases. On the other hand, a relatively hard rubber sheet can reduce vibration on the component mounting device side, but the vibration on the floor side increases. As such, vibration-isolating measures using a rubber sheet have difficulty simultaneously reducing vibration on both the component mounting device and the floor.

[0009] For this reason, the inventors considered the following three countermeasures. The first is to reduce the vibration energy by reducing the weight of the component mounting device. However, this countermeasure may result in a decrease in the rigidity of the component mounting device due to the weight reduction. The second is to increase the number of legs installed on the component mounting device to reduce the energy acting on each rubber sheet. However, this countermeasure increases the maintenance time for the component mounting device due to the increased number of legs. The third is to change the input command to the drive source (motor) when the component mounting head operates from a triangular waveform to a trapezoidal waveform, thereby reducing the occurrence of excessive shock. This may result in an increase in the component mounting time. Each countermeasure also raises new issues, so the inventors conducted extensive research and discovered a more suitable vibration-damping measure.

[0010] (Embodiment) Hereinafter, with reference to the drawings, component mounting devices according to embodiments and their modifications of the present invention will be described. Note that the embodiments and their modifications described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement positions, and connection forms shown in the following embodiments and their modifications are merely examples and are not intended to limit the present invention. Furthermore, each figure is a schematic diagram, and dimensions, etc. are not necessarily depicted precisely. Furthermore, in each figure, the same or similar components are designated by the same reference numerals.

[0011] Furthermore, expressions indicating relative directions or attitudes, such as "parallel" and "orthogonal," also include cases where the directions or attitudes are not strictly those. For example, "two directions are parallel" does not only mean that the two directions are completely parallel, but also means that the two directions are substantially parallel, i.e., that there is a difference of, for example, a few percent.

[0012] [Component mounting equipment] Fig. 1 is a schematic diagram showing the general configuration of a component mounting apparatus 1 according to an embodiment. As shown in Fig. 1, the component mounting apparatus 1 is an apparatus that mounts components 200 on a substrate 100 supplied from an upstream process side and transports the substrate 100 to a downstream process side. The component mounting apparatus 1 has an apparatus main body 10 and a plurality of support legs 30 that support the apparatus main body 10.

[0013] The device main body 10 includes a base 11, a substrate transport unit 12, a feeder cart 13, a parts feeder 14, a head moving mechanism 15, a head 16, a parts camera 17, and a control device 18. For ease of explanation, in the embodiment, the flow direction of the substrate 100 is defined as the X-axis direction, the horizontal direction perpendicular to the X-axis direction is defined as the Y-axis direction, and the vertical direction is defined as the Z-axis direction.

[0014] The substrate transport unit 12 is composed of a conveyor device and is provided extending in the X-axis direction on the upper surface side of the base 11. The substrate transport unit 12 transports the substrate 100 supplied from the upstream process side in the X-axis direction and positions it at a predetermined working position.

[0015] Feeder cart 13 is connected to both sides of base 11 in the Y-axis direction. A flat feeder base 13B extending in a horizontal plane is provided on the top of feeder cart 13. Multiple part feeders 14 are attached to feeder base 13B of feeder cart 13, and each feeds parts 200 to part supply positions 14K.

[0016] The head moving mechanism 15 is composed of a fixed beam 15a extending in the Y-axis direction above the base 11, a moving beam 15b extending in the X-axis direction with one end supported by the fixed beam 15a, and a moving plate 15c that is movable in the X-axis direction along the moving beam 15b. The head 16 is attached to the moving plate 15c, and is moved in a horizontal plane by the movement of the moving beam 15b in the Y-axis direction relative to the fixed beam 15a, and the movement of the moving plate 15c in the X-axis direction relative to the moving beam 15b.

[0017] A plurality of nozzles 16a are attached to the head 16 facing downward. Each of the plurality of nozzles 16a can move in the vertical direction (Z-axis direction) and rotate around the Z-axis relative to the head 16. A vacuum suction force can be generated at the bottom end of each nozzle.

[0018] The component cameras 17 are provided in both the front and rear regions on the base 11. Each component camera 17 has an imaging field of view facing upward, and captures an image of the component 200 sucked and held by the head 16 with the nozzle 16a from below.

[0019] Control device 18 is provided in base 11 of component mounting apparatus 1 (FIG. 1), and controls the operation of each section of component mounting apparatus 1. When component mounting apparatus 1 performs a component mounting operation to mount components 200 on board 100, first, board transport unit 12 operates to carry in board 100 sent from the upstream process side and position board 100 at a predetermined work position. After board transport unit 12 has positioned board 100 at the work position, each part feeder 14 supplies component 200 to component supply position 14K, and head 16 suction-holds component 200 with nozzle 16a.

[0020] After nozzle 16a suctions and holds component 200, head 16 moves above component camera 17, which captures an image of component 200. Control device 18 detects the position of component 200 based on the image captured by component camera 17 and uses the detection result to move head 16 and position component 200 above the target position on board 100. This operation is the positioning control of head 16. After controlling device 18 positions component 200 above the target position on board 100, it raises and lowers nozzle 16a to mount component 200 held by nozzle 16a onto board 100. In this way, in component mounting apparatus 1 of embodiment 1, head 16 serves as a work unit that performs a predetermined operation (component mounting operation) on base 11. The above-described mounting operation of component 200 onto board 100 is repeatedly performed, and when the mounting operation of component 200 onto board 100 is completed, board transport unit 12 is activated to transport board 100 to the downstream process side.

[0021] It should be noted that the control device 18 does not execute machine base vibration compensation control when controlling the positioning of the head 16. Machine base vibration compensation control is a control for reducing residual vibration and shortening the movement time when controlling the positioning of the head 16.

[0022] [Support part] Next, the support leg 30 will be described in detail. Here, one of the multiple support leg parts 30 provided in the component mounting apparatus 1 will be described as an example, but the other support leg parts 30 have a similar structure. FIG. 2 is a schematic diagram showing the general configuration of the support leg part 30 according to the embodiment. In FIG. 2, the outer shape of the base 11 is shown by a two-dot chain line. A frame body 111 extending horizontally is provided within the base 11, and a part of the support leg part 30 is connected to this frame body 111.

[0023] The support leg 30 has a base 40, a leg 50, and a pair of dampers 60. The base 40 is a base placed on a floor F. On the upper surface of the base 40, the leg 50 is placed in the center, and the dampers 60 are placed at both ends.

[0024] The leg 50 is a portion that connects the base 40 and the device main body 10. Specifically, the leg 50 has a support portion 51 that is fixed to the bottom surface of the base 11 and supports the base 11, and a pillar portion 52 that extends downward from the center of the support portion 51 and has a lower end portion fixed to the base 40.

[0025] The dampers 60 are shock absorbers that attenuate vibrations by expanding and contracting. The direction of expansion and contraction of the dampers 60 is a direction connecting one end 61 and the other end 62 of the dampers 60. In this embodiment, the dampers 60 are disposed in an orientation in which the expansion and contraction direction is along the vertical direction (Z-axis direction). A pair of dampers 60 are disposed at positions sandwiching the leg 50 in the Y-axis direction. One end 61 of each damper 60 is connected to the frame body 111 of the device main body 10, and the other end 62 is connected to the base 40. The one end 61 of each damper 60 is disposed above the upper end of the leg 50, and the other end 62 is disposed at the same height as the lower end of the leg 50. More specifically, the one end 61 of each damper 60 is rotatably connected to the frame body 111 via a link member 611. The other end 62 of each damper 60 is rotatably connected to the base 40 via a link member 621. Since one end 61 and the other end 62 of each damper 60 are rotatably connected, when the device body 10 vibrates, each damper 60 can change its posture in response to the horizontal component of the vibration. Note that one end 61 and the other end 62 of each damper 60 may be fixed to each link member 611, 621. In this case, the damper 60 moves only by expanding and contracting.

[0026] Furthermore, the vertical component of the vibration is damped by the expansion and contraction of each damper 60. The vertical component of the vibration is the main cause of vibration occurring on the floor surface F. In other words, the vibration transmitted to the floor surface F is reduced by each damper 60, and the vibration of the device main body 10 itself is also reduced by each damper 60. Here, since the relative displacement between the device main body 10 and the legs 50 during vibration is minute (on the order of microns), it is preferable to use dampers 60 that can accommodate such minute displacement.

[0027] [effect] As described above, the component mounting apparatus 1 includes the device main body 10 that controls the positioning of the head 16 for mounting the component 200 on the substrate 100, and the support leg 30 that is disposed between the device main body 10 and the floor F and supports the device main body 10. The support leg 30 includes a base 40 that is placed on the floor F, legs 50 that connect the base 40 and the device main body 10, and at least one damper 60 that has one end 61 connected to the device main body 10 and the other end 62 connected to the base 40.

[0028] According to this, at least one damper 60 connected to the device body 10 and the base 40 is provided on the support leg 30 that supports the device body 10, so that the damper 60 can reduce vibrations transmitted to the floor surface F while also reducing vibrations of the device body 10 itself. In this way, it is possible to improve vibration isolation performance by installing the damper 60, without taking the three vibration isolation measures described above.

[0029] Moreover, one end 61 of the damper 60 is disposed above the upper end of the leg 50 .

[0030] According to this, one end 61 of the damper 60 is disposed higher than the upper end of the leg 50, so that the damper 60 receives vibrations from the device main body 10 earlier than the leg 50. In other words, it is possible for the damper 60 to reduce vibrations earlier than the vibrations are transmitted from the leg 50 to the floor surface F. Therefore, it is possible to more reliably reduce vibrations transmitted to the floor surface F.

[0031] The damper 60 is disposed in a position along the vertical direction.

[0032] According to this, since the damper 60 is disposed in a position along the vertical direction, the vertical component of the vibration can be more reliably reduced, that is, the vibration transmitted to the floor surface F can be more reliably reduced.

[0033] Each damper 60 is disposed on either side of the leg 50 .

[0034] According to this, since each damper 60 is disposed on both sides of the leg 50, the pair of dampers 60 can reliably reduce vibrations transmitted from the leg 50 to the floor surface F.

[0035] The device main body 10 can perform positioning control without performing machine base vibration compensation.

[0036] As described above, the damper 60 can suppress vibrations of the device body 10 itself, so components can be mounted with high precision even if positioning control of the head 16 is performed without performing machine base vibration compensation.

[0037] (Variation) Although the component mounting device 1 according to the embodiment of the present invention has been described above, the present invention is not limited to this embodiment. In other words, the embodiment disclosed here is an example in all respects, and the scope of the present invention includes all modifications that are equivalent to the meaning and scope of the claims. Below, modified examples of the component mounting device 1 according to this embodiment will be described. Hereinafter, parts that are the same as those in the above embodiment will be assigned the same reference numerals, and their description may be omitted.

[0038] [Variations 1 and 2] In the above embodiment, the support leg 30 in which the dampers 60 are arranged on both sides of the leg 50 has been exemplified. However, the dampers 60 may be arranged on only one of the both sides of the leg 50. FIG. 3 is a schematic diagram showing the general configuration of the support leg 30A according to Modification 1. FIG. 3 is a diagram corresponding to FIG. 2. As shown in FIG. 3, in the support leg 30A, the dampers 60 are arranged only on the inner lateral sides of the leg 50.

[0039] Fig. 4 is a schematic diagram showing the general configuration of the support leg 30B according to Modification 2. Fig. 4 is a diagram corresponding to Fig. 2. As shown in Fig. 4, in the support leg 30B, the damper 60 is arranged only on the outer side of the leg 50. Note that Modification 1 is preferable because it can increase the relative displacement between the device body 10 and the leg 50 more than Modification 2.

[0040] [Variation 3] In the above embodiment, the damper 60 is disposed in a vertical orientation. However, the damper 60 may be disposed in a tilted orientation with respect to the floor surface F. FIG. 5 is a schematic diagram showing the overall configuration of a support leg 30C according to Modification 3. FIG. 5 corresponds to FIG. 2. As shown in FIG. 5, in the support leg 30C, the damper 60 is disposed only on the inner side of the leg 50. Here, the device main body 10 has a frame body 112 disposed at a lower position than the frame body 111. One end 61 of the damper 60 is rotatably connected to the frame body 112. As a result, the damper 60 is disposed in a position where the one end 61 faces the center of the device main body 10. In other words, the damper 60 is disposed in a position where its extension / contraction direction is tilted with respect to the floor surface F. In this case, even a single damper 60 can efficiently reduce both the vertical and horizontal components of vibration.

[0041] It is preferable that the damper 60 is disposed in a position where one end 61 faces the drive source of the head 16. In this case, the damper 60 can more reliably reduce vibrations from the drive source, which are the cause of vibrations.

[0042] [Variation 4] In the above embodiment, the damper 60 is oriented in the vertical direction. However, the damper 60 may be oriented along the floor surface F. FIG. 6 is a schematic diagram showing the overall configuration of a support leg 30D according to Modification 4. FIG. 6 is a diagram corresponding to FIG. 2. As shown in FIG. 6, in the support leg 30D, the damper 60 is arranged only on the inner lateral side of the leg 50. Here, a connecting portion 113 to which one end 61 of the damper 60 is connected is attached to the bottom surface of the base 11. As a result, the damper 60 is oriented such that its extension / contraction direction is along the floor surface F. In this case, it is possible to efficiently reduce the horizontal component of the vibration.

[0043] [Variation 5] In the above embodiment, the case where each damper 60 is arranged in the same orientation has been exemplified. However, multiple dampers may be arranged in different orientations. FIG. 7 is a schematic diagram showing a general configuration of a support leg 30E according to Modification 5. FIG. 7 is a diagram corresponding to FIG. 2. As shown in FIG. 7, in the support leg 30E, of the pair of dampers 60, the inner damper 60 is arranged in an orientation along the floor surface F, and the outer damper 60 is arranged in an orientation along the vertical direction. In this case, the horizontal component of vibration is reduced by the inner damper 60, and the vertical component is reduced by the outer damper 60.

[0044] Furthermore, the scope of the present invention also includes configurations constructed by arbitrarily combining the components included in the above-described embodiments and their modifications. In this case, any number of dampers may be provided for each leg. [Industrial Applicability]

[0045] The present invention can be applied to a component mounting apparatus that mounts components on a board. [Explanation of symbols]

[0046] 1. Component mounting equipment 10. Device body 11 Foundation 12 Substrate transport section 13 Feeder cart 13B Feeder base part 14 Parts feeder 14K Parts supply location 15 Head movement mechanism 15a Fixed beam 15b Moving beam 15c moving plate 16 heads 16a nozzle 17 Parts Camera 18 Control Device 30, 30A, 30B, 30C, 30D, 30E Support legs 40 Base 50 Legs 51 Support part 52 Pillar section 60 Damper 61 One end 62 Other end 100 boards 111, 112 frame body 113 Connecting part 200 parts 611, 621 Link members F Floor

Claims

1. a device main body that controls the positioning of a head for mounting components on a substrate; a support leg portion disposed between the device body and a floor surface and supporting the device body; The support leg portion is a base portion installed on the floor surface; a leg portion connecting the base portion and the device body; at least one damper having one end connected to the device body and the other end connected to the base; Component mounting equipment.

2. The one end of the damper is disposed above the upper end of the leg. The component mounting device according to claim 1 .

3. The damper is disposed in a vertical orientation.

3. The component mounting device according to claim 1 or 2.

4. The damper is disposed on at least one of both sides of the leg.

3. The component mounting device according to claim 1 or 2.

5. The damper is disposed in an inclined position relative to the floor surface.

3. The component mounting device according to claim 1 or 2.

6. The other end of the damper is rotatably connected to the base via a link member. The component mounting device according to claim 5 .

7. The damper is disposed in a position along the floor surface.

3. The component mounting device according to claim 1 or 2.

8. The device body can perform the positioning control without performing machine stand vibration compensation.

3. The component mounting device according to claim 1 or 2.

Images