Electronic Components

Abstract

To provide an electronic component in which deterioration of a terminal electrode is deteriorated.SOLUTION: In a chip varistor 1 as one kind of electronic components, a magnetic field concentration occurs in both of corner parts between terminal electrodes 20A to 20C at the time of the driving of them. However, in the chip varistor 1, it is designed so that a distance between third electrodes 20C and 20D and the first electrode 20A and the second electrode 20B becomes long in side surfaces 10c and 10d. Since the distance between a first part 21 of the third electrodes 20C and 20D and a first part 23 of the first electrode 20A and the second electrode 20B is the maximum distance d2 in a ridge line of an element 10, the magnetic field concentration between the corners of the third electrodes 20C and 20D and the corners of the first electrode 20A and the second electrode 20B, that are positioned near from the ridge line of the element 10 is suppressed. Thus, deterioration of each of the terminal electrodes 20A to 20C caused by the magnetic field concentration is suppressed.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] Conventionally, there has been known a multi-terminal electronic component in which, in addition to a pair of terminal electrodes provided on the end faces of an element body, terminal electrodes are provided on the side faces of the element body. For example, Patent Document 1 listed below discloses an electronic component (multilayer ceramic element) in which, in addition to a pair of terminal electrodes provided on the end faces of the element body, terminal electrodes are also provided on the side faces of the element body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 144987 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-251010 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-described electronic component, when the component is operated, electric field concentration occurs particularly at the corners of the terminal electrodes provided on the end faces and side faces of the element body, and electric field concentration can also occur at the corners between these terminal electrodes, which can cause deterioration of the terminal electrodes.

[0005] An object of the present invention is to provide an electronic component in which deterioration of terminal electrodes is suppressed. [Means for solving the problem]

[0006] An electronic component according to one embodiment of the present invention comprises: an element body having a first surface and a second surface that face each other in a first direction, a third surface and a fourth surface that face each other in a second direction that is perpendicular to the first direction, and a fifth surface and a sixth surface that face each other in a third direction that is perpendicular to the first and second directions; a plurality of conductors provided within the element body; a first electrode provided on the first surface of the element body and having a first portion that wraps around to the third and fourth surfaces and covers the edges of the third and fourth surfaces on the first surface side; a second electrode provided on the second surface of the element body and having a first portion that wraps around to the third and fourth surfaces and covers the edges of the third and fourth surfaces on the second surface side; and a third electrode provided on at least one of the third and fourth surfaces of the element body and having a first portion that extends between the ridge lines with the fifth and sixth surfaces, wherein the distance between the first portion of the third electrode and the first portions of the first and second electrodes is longer and greatest at the ridge lines with the fifth and sixth surfaces than at a midpoint in the third direction of the element body.

[0007] In the above electronic component, the distance between the first portion of the third electrode and the first portions of the first and second electrodes is greatest at the ridge of the body, thereby suppressing the electric field concentration and suppressing deterioration of the first, second, and third electrodes.

[0008] In another embodiment of the electronic component, the length of the first portion of the third electrode in the first direction is maximum at the middle position in the third direction of the body, and is minimum at the ridge line between the fifth surface and the sixth surface.

[0009] In an electronic component according to another embodiment, the first portion of the third electrode gradually narrows in width in a barrel shape toward a ridge line between the fifth surface and the sixth surface.

[0010] In another embodiment of the electronic component, the lengths of the first and second electrodes in the first direction are maximum at the middle position in the third direction of the body, and are minimum at the ridge line between the fifth and sixth surfaces.

[0011] In another embodiment of the electronic component, the third electrode further has a second portion that wraps around the fifth and sixth surfaces and gradually narrows in a semicircular shape as it moves away from the ridge between the fifth and sixth surfaces.

[0012] An electronic component according to another embodiment is a chip varistor, having an element body having a laminated structure laminated in a third direction, and including a plurality of conductors: a first conductor extending from a first surface along the first direction and connected to a first electrode in a predetermined layer of the element body; a second conductor extending from a second surface along the first direction in a layer different from the first conductor of the element body and connected to a second electrode, forming an overlapping portion overlapping with the first conductor in the third direction; and a third conductor extending from the third surface to a fourth surface in a layer located between the first conductor and the second conductor of the element body and connected to a third electrode, having a functional portion overlapping with the overlapping portion in the third direction. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide an electronic component in which deterioration of terminal electrodes is suppressed. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a schematic perspective view showing an electronic component according to an embodiment. [Figure 2] 2 is a perspective view showing each conductor inside the element body shown in FIG. 1. FIG. [Figure 3] 2 is a cross-sectional view showing each conductor inside the element body shown in FIG. 1. [Figure 4] FIG. 10 is a diagram showing only the first conductor and the second conductor. [Figure 5] 10 is a diagram showing the positional relationship between a third conductor and a third electrode. FIG. [Figure 6] FIG. 3 is a cross-sectional view showing the positional relationship of each conductor. [Figure 7] FIG. 3 is a cross-sectional view showing the positional relationship of each conductor. [Figure 8] FIG. 10 is a side view showing a third electrode provided on a side surface of the element body. [Figure 9] 1A to 1C are diagrams showing electronic components of different forms; [Figure 10] 1A to 1C are diagrams showing electronic components of different forms; [Figure 11] 1A to 1C are diagrams showing electronic components of different forms; DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and redundant description will be omitted.

[0016] First, the configuration of a chip varistor 1, which is a type of electronic component, will be described with reference to FIGS.

[0017] The chip varistor 1 is a multi-terminal type laminated chip varistor, and is configured to include an element body 10 and four terminal electrodes 20A to 20D. The chip varistor 1 has a substantially rectangular parallelepiped outer shape, and is of the so-called 2012 size (longitudinal length 2.0 mm, lateral length 1.25 mm, height 0.8 mm).

[0018] The element body 10 is a laminated structure having a substantially rectangular parallelepiped outer shape. The element body 10 has rectangular end faces 10a and 10b that face each other in the longitudinal direction (first direction) and four rectangular side faces 10c to 10f that are perpendicular to the end faces 10a and 10b. The four side faces 10c to 10f extend to connect the end faces 10a and 10b. The end faces 10a and 10b extend parallel to the stacking direction of the element body 10. Of the four side faces 10c to 10f, side faces 10c and 10d extend parallel to the stacking direction of the element body 10 and face each other in the short direction (second direction). Of the four side faces 10c to 10f, side faces 10e and 10f extend perpendicular to the stacking direction of the element body 10 and face each other in the stacking direction of the element body 10 (third direction).

[0019] The element body 10 is made of a sintered body (semiconductor ceramic) that exhibits varistor characteristics. The element body 10 is a laminated structure consisting of multiple layers made of a sintered body that exhibits varistor characteristics. In an actual element body 10, the constituent layers are integrated to the extent that the boundaries between them are not visible. The element body 10 contains ZnO (zinc oxide) as a primary component, and also contains, as secondary components, elemental metals such as Co, rare earth metal elements, IIIb group elements (B, Al, Ga, In), Si, Cr, Mo, alkali metal elements (K, Rb, Cs), and alkaline earth metal elements (Mg, Ca, Sr, Ba), as well as oxides of these metals. In this embodiment, the element body 10 contains, as secondary components, Co, Pr, Cr, Ca, K, and Al. The ZnO content in the element body 10 is not particularly limited, but is typically 99.8 to 69.0 mass% when the total mass of all materials constituting the element body 10 is taken as 100 mass%. The rare earth metal element (for example, Pr) acts as a substance that exhibits varistor characteristics. The content of the rare earth metal element in element body 10 is set to, for example, about 0.01 to 10 atomic %.

[0020] The chip varistor 1 includes a plurality of conductors within the element body 10, specifically a first conductor 30A, a second conductor 30B, and a third conductor 30C. The first conductor 30A, the second conductor 30B, and the third conductor 30C each contain a conductive material. The conductive material contained in each of the conductors 30A, 30B, and 30C is not particularly limited, but is preferably made of Pd or an Ag-Pd alloy. The thickness (length in the stacking direction) of each of the conductors 30A, 30B, and 30C is, for example, approximately 0.1 to 10 μm.

[0021] The first conductors 30A have a strip-like shape with a uniform width, and extend in the opposing direction of the end faces 10a, 10b (i.e., the first direction) within the layers constituting the element body 10. One end 30a of the first conductors 30A is exposed at the end face 10a (first surface), and the other end 30b is located within the element body 10. The width of the first conductors 30A is, for example, 0.4 mm.

[0022] The second conductors 30B have a strip-like shape with a uniform width and extend in a layer different from the layer in which the first conductors 30A are formed, along the opposing direction of the end faces 10a, 10b. One end 30a of the second conductors 30B is exposed to the end face 10b (second surface), and the other end 30b is located within the element body 10. The width of the second conductors 30B is designed to be the same as the width of the first conductors 30A, and is, for example, 0.4 mm.

[0023] 3 and 4, the first conductors 30A and the second conductors 30B are aligned with each other when viewed from the stacking direction of the element body 10, and the ends 30b located within the element body 10 completely overlap in the stacking direction. The overlapping portion 40 formed by the overlapping ends 30b of the first conductors 30A and the second conductors 30B has a rectangular shape with its long side parallel to the opposing direction of the end faces 10a, 10b when viewed from the stacking direction.

[0024] The third conductor 30C has a shape extending along the opposing direction of the side surfaces 10c and 10d (i.e., the second direction), and extends from the side surface 10c (third surface) to the side surface 10d (fourth surface). As shown in Fig. 5, the third conductor 30C has a pair of end portions 31, a main body portion 32, and a pair of widened portions 33.

[0025] Each end 31 of the third conductor 30C is located near the side surfaces 10c and 10d and is exposed from the side surfaces 10c and 10d. Each end 31 has a uniform width W1 (the length in the opposing direction of the end surfaces 10a and 10b), and the width W1 is, for example, 0.1 mm.

[0026] The main body portion 32 of the third conductor 30C is located between the end portions 31 and at the center of the third conductor 30C. It intersects with the first conductor 30A and the second conductor 30B (orthogonal in this embodiment). The main body portion 32 has a functional portion 34, which is a portion that overlaps with the overlapping portion 40 of the first conductor 30A and the second conductor 30B in the stacking direction of the element body 10. The third conductor 30C overlaps with the first conductor 30A only at the overlapping portion 40, and also overlaps with the second conductor 30B only at the overlapping portion 40. Therefore, the area of ​​the functional portion 34 is equal to the overlapping area between the third conductor 30C and the first conductor 30A, and also equal to the overlapping area between the third conductor 30C and the second conductor 30B. The main body portion 32 has a uniform width W2, which is designed to be wider than the width W1 of the end portion 31 (W2 > W1). The width W2 of the main body portion 32 is, for example, 0.2 mm. The width of the functional portion is equal to the width W2 of the main body portion 32, and the ESD resistance is adjusted (for example, increased) depending on the width of the functional portion .

[0027] A widened portion 33 is interposed between each of the end portions 31 and the main body portion 32. The widened portion 33 is a portion whose width gradually increases from the end portion 31 toward the main body portion 32.

[0028] As shown in FIGS. 6 and 7, the third conductors 30C extend within a layer located between the first conductors 30A and the second conductors 30B. Therefore, the distance between the third conductors 30C and the first conductors 30A in the stacking direction of the element body 10 is substantially the same as the distance between the third conductors 30C and the second conductors 30B. The functional unit 34 forms a first functional layer 42 between itself and the end 30b of the first conductor 30A. The first functional layer 42 is a part of the element body sandwiched between the functional unit 34 and the end 30b of the first conductor 30A. The first functional layer 42 has a capacitance of, for example, approximately 20 to 50 pF. Furthermore, the functional unit 34 forms a second functional layer 44 between itself and the end 30b of the second conductor 30B. The second functional layer 44 is a part of the element body sandwiched between the functional unit 34 and the end 30b of the second conductor 30B. As described above, the third conductor 30C is spaced substantially the same distance as the first conductor 30A and the second conductor 30B, and has substantially the same overlapping area as the first conductor 30A and the second conductor 30B, so that the second functional layer 44 has substantially the same capacitance as the capacitance of the first functional layer 42.

[0029] Of the four terminal electrodes 20A to 20D, the third electrodes 20C and 20D form a pair and are arranged on the side surface 10c and side surface 10d of the element body 10, respectively. The third electrodes 20C and 20D are formed so as to cover both end portions 31 of the third conductor 30C exposed on the side surfaces 10c and 10d of the element body 10, respectively, and the third electrodes 20C and 20D are directly connected to the third conductor 30C. The pair of third electrodes 20C and 20D and the third conductor 30C are arranged symmetrically, thereby achieving uniform discharge. In this embodiment, the third electrodes 20C and 20D have an overall shape that is approximately spindle-shaped.

[0030] The third electrode 20C extends in the stacking direction and wraps around the side surface 10e (fifth surface) and the side surface 10f (sixth surface). In this embodiment, the third electrode 20C extends in the stacking direction at the midpoint of the long side of the rectangular side surface 10c and wraps around the side surface 10e and the side surface 10f, but may be positioned to a certain extent away from the midpoint of the long side. More specifically, the third electrode 20C includes a first portion 21 that extends between the ridges between the side surface 10c and the side surfaces 10e and 10f, and a second portion 22 that extends integrally from the first portion 21 and wraps around each of the side surfaces 10e and 10f of the element body 10. The first portion 21 of the third electrode 20C provided on the side surface 10c of the element body 10 has a maximum width w1 at the center position in the stacking direction of the element body 10, and its side edges gradually narrow toward the ridge line (minimum width w2) between the side surface 10c and the side surfaces 10e and 10f, such that the width is barrel-shaped. The first portion 21 of the third electrode 20C has a shape that is line-symmetric (vertically symmetric) with respect to the center position in the stacking direction on the side surface 10c. Therefore, the width w2 at the ridge line between the side surface 10c and the side surface 10e is the same as the width w2 at the ridge line between the side surface 10c and the side surface 10f. All four corners of the first portion 21 of the third electrode 20C located near the ridge line of the element body 10 form obtuse angles. The second portions 22 of the third electrode 20C provided on the side surfaces 10e, 10f of the element body 10 each have a gradually narrower width with their side edges curved in a substantially semicircular shape as they move away from the ridge between the side surfaces 10e, 10f and the side surface 10c.

[0031] Similarly, the third electrode 20D also extends in the stacking direction and wraps around the side surfaces 10e and 10f. In this embodiment, the third electrode 20D extends in the stacking direction from the midpoint of the long side of the rectangular side surface 10d and wraps around the side surfaces 10e and 10f, but may be positioned to a certain extent away from the midpoint of the long side. More specifically, the third electrode 20D includes a first portion 21 that extends between the ridges between the side surface 10d and the ridges between the side surfaces 10e and 10f, and a second portion 22 that extends integrally from the first portion 21 and wraps around each of the side surfaces 10e and 10f of the element body 10. The first portion 21 of the third electrode 20D provided on the side surface 10d of the element body 10 has a maximum width w1 at the midpoint in the stacking direction of the element body 10, and its side edges gradually narrow toward the ridges (minimum width w2) between the side surfaces 10d and 10e, 10f, such that the width is curved in a barrel shape. The first portion 21 of the third electrode 20D has a shape that is line-symmetric (vertically symmetric) with respect to the midpoint of the side surface 10d in the stacking direction. Therefore, the width w2 at the ridge line between the side surfaces 10d and 10e is the same as the width w2 at the ridge line between the side surfaces 10d and 10f. All four corners of the first portion 21 of the third electrode 20D located near the ridge line of the element body 10 form obtuse angles. The second portions 22 of the third electrode 20D provided on the side surfaces 10e and 10f of the element body 10 gradually narrow in width as they move away from the ridge line between the side surfaces 10e, 10f and 10d, with their side edges curved in a substantially semicircular shape.

[0032] That is, the width (i.e., the length in the first direction) of the first portions 21 of the third electrodes 20C, 20D is the maximum width w1 at the middle position in the stacking direction on the side surfaces 10c, 10d of the element body 10. The middle positions in the stacking direction on the side surfaces 10c, 10d of the element body 10 are positions where the ends 31 of the third conductors 30C are exposed, and the first portions 21 of the third electrodes 20C, 20D have the maximum width w1 at the positions where the ends 31 of the third conductors 30C are exposed. Furthermore, the width of the first portions 21 of the third electrodes 20C, 20D is the minimum width w2 at the ridge lines between the side surfaces 10c, 10d and the side surfaces 10e, 10f.

[0033] 5, the second portions 22 of the third electrodes 20C, 20D overlap at least a portion of the widened portion 33 of the third conductor 30C when viewed from the stacking direction of the element body 10. In the embodiment shown in FIG. 5, the second portion 22 of the third electrode 20D overlaps with the entire widened portion 33 of the third conductor 30C when viewed from the stacking direction of the element body 10.

[0034] The first electrode 20A, which is one of the four terminal electrodes 20A to 20D, is arranged on the end face 10a side of the element body 10. The first electrode 20A is formed to cover the end face 10a and portions of the four side faces 10c to 10f closer to the end face 10a. The first electrode 20A is also formed to cover one end 30a of the first conductor 30A exposed at the end face 10a of the element body 10, and the first electrode 20A is directly connected to the first conductor 30A. The second electrode 20B, which is one of the four terminal electrodes 20A to 20D, is arranged on the end face 10b side of the element body 10. The second electrode 20B is formed to cover the end face 10b and portions of the four side faces 10c to 10f closer to the end face 10b. The second electrode 20B is also formed so as to cover one end 30a of the second conductor 30B exposed on the end surface 10b of the element body 10, and the second electrode 20B is directly connected to the second conductor 30B.

[0035] More specifically, the first electrode 20A and the second electrode 20B include a first portion 23 that wraps around the side surfaces 10c and 10d of the element body 10 and covers the edges of the side surfaces 10c and 10d on the side of the end surfaces 10a and 10b, and a second portion 24 that wraps around the side surfaces 10e and 10f of the element body 10 and covers the edges of the side surfaces 10e and 10f on the side of the end surfaces 10a and 10b. In this embodiment, the first portion 23 covers the entire edges of the side surfaces 10c and 10d on the side of the end surfaces 10a and 10b, and the second portion 24 covers the entire edges of the side surfaces 10e and 10f on the side of the end surfaces 10a and 10b, but the first portion 23 and the second portion 24 may cover only part of the edges. The width (i.e., length in the first direction) of the first portion 23 provided on the side surfaces 10c, 10d of the element body 10 is maximum width w3 at the midpoint in the stacking direction of the element body 10 and minimum width w4 at the ridge line between the side surfaces 10c, 10d and the side surfaces 10e, 10f. The width gradually narrows from the midpoint in the stacking direction of the element body 10 toward the ridge line, such that the side edges curve in a D-shape. The shapes of the first portion 23 and the second portion 24 may be, for example, D-shaped, semicircular, or semi-elliptical. The first portion 23 has a shape that is line-symmetric (vertically symmetric) with respect to the midpoint in the stacking direction of the side surfaces 10c, 10d. Therefore, the width w4 at the ridge line between the side surfaces 10c, 10d and the side surface 10e is the same as the width w4 at the ridge line between the side surfaces 10c, 10d and the side surface 10f. The corners of first portion 23 located near the ridge of element body 10 and facing third electrodes 20C, 20D are all obtuse. Second portion 24 provided on side surface 10e and second portion 24 provided on side surface 10f may have the same shape or different shapes.

[0036] 8, the distance (more specifically, the distance in the first direction) between first portions 21 of third electrodes 20C, 20D and first portions 23 of first electrode 20A and second electrode 20B is a minimum distance d1 at a midpoint in the stacking direction (i.e., the third direction) on side surfaces 10c, 10d of element body 10. The distance between first portions 21 of third electrodes 20C, 20D and first portions 23 of first electrode 20A and second electrode 20B is a maximum distance d2 at the ridge line between side surfaces 10c, 10d and side surfaces 10e, 10f of element body 10. Distance d2 at the ridge line of element body 10 is longer than distance d1 at a midpoint in the stacking direction on side surfaces 10c, 10d. The distance between the first portions 21 of the third electrodes 20C and 20D and the first portions 23 of the first electrode 20A and second electrode 20B gradually increases from the middle position in the stacking direction on the side surfaces 10c and 10d toward the ridge line.

[0037] In the chip varistor 1, electric field concentration can occur at the corners between the terminal electrodes 20A to 20C when it is driven. However, the chip varistor 1 is designed so that the distance between the third electrodes 20C, 20D and the first electrode 20A and the second electrode 20B is long on the side surfaces 10c, 10d, and the distance between the first portions 21 of the third electrodes 20C, 20D and the first portions 23 of the first electrode 20A and the second electrode 20B is a maximum distance d2 at the ridge line of the element body 10, so electric field concentration is suppressed between the corners of the third electrodes 20C, 20D located near the ridge line of the element body 10 and the corners of the first electrode 20A and the second electrode 20B. This suppresses deterioration of the terminal electrodes 20A to 20C due to electric field concentration.

[0038] Furthermore, the terminal electrodes 20A to 20C are narrow (i.e., minimum widths w2 and w4) at the ridges of the side surfaces 10c and 10d of the element body 10, and the corners are obtuse, thereby suppressing electric field concentration at the corners of each of the terminal electrodes 20A to 20C.

[0039] Furthermore, the width W3 of the third electrodes 20C, 20D is designed to be wider than the width W1 of the end portion 31 of the third conductor 30C (W3>W1). The width W3 of the third electrodes 20C, 20D is designed to be wider than the width W2 of the main body portion 32 of the third conductor 30C (W3>W2). The width W3 of the third electrodes 20C, 20D is, for example, 0.5 mm. In this embodiment, the width W3 of the third electrode 20C is the same as the width W3 of the third electrode 20D. The width W3 of the third electrode 20C may be different from the width W3 of the third electrode 20D.

[0040] Each of the terminal electrodes 20A to 20D may have a single-layer structure or a multi-layer structure. Each of the terminal electrodes 20A to 20D is, for example, a fired electrode, and is formed by applying a conductive paste to the surface of the element body 10 and firing it. The conductive paste is made by mixing a powder made of a metal (for example, Pd, Cu, Ag, or an Ag-Pd alloy) with a glass component, an organic binder, and an organic solvent. A plating layer can also be formed on such a fired electrode. The plating layer may include a Ni plating layer and a Sn plating layer formed on the Ni plating layer.

[0041] In the chip varistor 1, the ESD resistance is improved by increasing the width W2 of the functional portion 34 of the third conductor 30C. The width W1 of the end portion 31 of the third conductor 30C is shorter than the width W3 of the third electrodes 20C and 20D (W3>W1), and is also shorter than the width W2 of the functional portion 34 of the third conductor 30C (W2>W1). Therefore, for example, when forming the third electrodes 20C and 20D, even if there is a relative positional deviation between the third electrodes 20C and 20D and the third conductor 30C in the opposing direction of the end faces 10a and 10b, it is unlikely that a part of the third conductor 30C will not be covered by the third electrodes 20C and 20D. In other words, even if there is a relative positional deviation between the third conductor 30C and the third electrodes 20C and 20D, the size of the connection area between the third conductor 30C and the third electrodes 20C and 20D does not change, and good connection can be achieved.

[0042] If the width W1 of the end portion 31 of the third conductor 30C is greater than or equal to the width W3 of the third electrodes 20C and 20D (W3 ≤ W1), when there is a relative positional deviation between the third electrodes 20C and 20D and the third conductor 30C with respect to the facing direction of the end faces 10a and 10b, a part of the third conductor 30C may not be covered by the third electrodes 20C and 20D, and the end portion 31 of the third conductor 30C may be exposed from the third electrodes 20C and 20D. When the end portion 31 of the third conductor 30C is exposed from the third electrodes 20C and 20D, it may result in a defective product. Or, the size of the connection region between the third conductor 30C and the third electrodes 20C and 20D may vary for each product, and characteristic deviations for each product may occur.

[0043] Also, in the chip varistor 1, as shown in FIG. 5, the width W3 of the third electrodes 20C and 20D is wider than the width W2 of the main body portion 32 of the third conductor 30C (W3 > W2). By making the third electrodes 20C and 20D wide in this way, a good connection between the third conductor 30C and the third electrodes 20C and 20D can be realized even when the above-described relative positional deviation is large.

[0044] The width W3 of the third electrodes 20C and 20D may be narrower than the width W2 of the main body portion 32 of the third conductor 30C (W3 < W2), as shown in FIG. 9. By making the width (i.e., width W2) of the functional portion 34 in the main body portion 32 of the third conductor 30C wider than the width W3 of the third electrodes 20C and 20D, a high ESD tolerance can be realized. The width W3 of the third electrode 20C and the width W3 of the third electrode 20D may be the same or different.

[0045] Also, in the above-described chip varistor 1, since the third conductor 30C has the widened portion 33, even when the widths of the end portion 31 and the main body portion 32 are different, stress concentration at the boundary between the end portion 31 and the main body portion 32 is suppressed, and a situation where defects such as cracks occur is suppressed.

[0046] Furthermore, since the second portions 22 of the third electrodes 20C, 20D extend from the ridge line of the element body 10 to such an extent that they overlap at least a portion of the widened portion 33 of the third conductor 30C when viewed in the stacking direction of the element body 10, heat generated within the element body 10 (for example, the third conductor 30C) can be efficiently dissipated to the outside from the second portions 22 of the third electrodes 20C, 20D. The heat generated within the element body 10 may be conducted directly to the second portion 22 through the inside of the element body 10, or indirectly to the second portion 22 via the first portion 21.

[0047] Although the preferred embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0048] The plurality of conductors provided within element body 10 are not limited to the above-described configuration, and may take various forms.

[0049] For example, the multiple conductors provided within the element body 10 may be in the form shown in Figures 10 and 11. In Figures 10 and 11, a pair of first conductors 30A, a pair of second conductors 30B, and a third conductor 30C are provided within the element body 10.

[0050] Each of the pair of first conductors 30A has a band-like shape with a uniform width, and extends in the opposing direction of the end faces 10a, 10b within the layers that make up the element body 10. The pair of first conductors 30A are located in different layers of the element body 10. One end 30a of each first conductor 30A is exposed at the end face 10a, and the other end 30b is located within the element body 10. The pair of first conductors 30A have the same size and shape when viewed in the stacking direction of the element body 10, and are completely aligned.

[0051] Each of the pair of second conductors 30B has a band-like shape with a uniform width, and extends in the same layer as the layer in which the first conductors 30A are formed, along the opposing direction of the end faces 10a, 10b. One end 30a of the second conductors 30B is exposed at the end face 10b (second surface), and the other end 30b is located within the element body 10. The pair of second conductors 30B have the same size and shape when viewed from the stacking direction of the element body 10, and are completely aligned.

[0052] The first conductors 30A and the second conductors 30B are aligned with each other when viewed from the stacking direction of the element body 10, and extend toward each other along the opposing direction of the end faces 10a, 10b. However, the end 30b of the first conductor 30A and the end 30b of the second conductor 30B located within the element body 10 are spaced apart in the opposing direction of the end faces 10a, 10b, and do not overlap in the stacking direction of the element body 10.

[0053] The third conductor 30C has a shape extending in the opposing direction of the side surfaces 10c and 10d, and extends from the side surface 10c to the side surface 10d. As shown in FIG. 11, the third conductor 30C has a pair of end portions 31 and an intersection portion 32.

[0054] Each end 31 of the third conductor 30C is located near the side surfaces 10c and 10d and is exposed from the side surfaces 10c and 10d. Each end 31 has a uniform width (length in the first direction).

[0055] The intersection 32 of the third conductor 30C is located at the center of the third conductor 30C between both end portions 31, and extends in a direction intersecting the opposing direction of the side surfaces 10c, 10d. In this embodiment, the intersection 32 of the third conductor 30C extends in a direction perpendicular to the opposing direction of the side surfaces 10c, 10d, and is designed so that the width of the intersection 32 (length in the first direction) is wider than the width of the end portion 31. The third conductor 30C as a whole has a cross shape when viewed from the stacking direction of the element body 10. In this embodiment, the length (width) of the intersection 32 in the opposing direction of the side surfaces 10c, 10d is designed to be the same as the width of the first conductor 30A and the second conductor 30B.

[0056] The intersections 32 of the third conductors 30C overlap the ends 30b of the first conductors 30A at their tips extending toward the end face 10a, forming overlapping portions 40A. Similarly, the intersections 32 of the third conductors 30C overlap the ends 30b of the second conductors 30B at their tips extending toward the end face 10b, forming overlapping portions 40B. The third conductors 30C overlap with the pair of first conductors 30A only at the overlapping portions 40A, and also with the pair of second conductors 30B only at the overlapping portions 40B.

[0057] The third conductor 30C extends within a layer located midway between the pair of first conductors 30A. Therefore, in the stacking direction of the element body 10, the distance between the third conductor 30C and one of the first conductors 30A is substantially the same as the distance between the third conductor 30C and the other first conductor 30A. The intersections 32 form first functional layers 42 between the ends 30b of the pair of first conductors 30A. Similarly, in the stacking direction of the element body 10, the distance between the third conductor 30C and one of the second conductors 30B is substantially the same as the distance between the third conductor 30C and the other second conductor 30B. The intersections 32 form second functional layers 44 between the ends 30b of the pair of second conductors 30B. In this embodiment, the overlapping portions 40A and 40B have the same overlapping area, and therefore the first functional layer 42 and the second functional layer 44 have substantially the same capacitance.

[0058] Furthermore, the plurality of conductors provided within element body 10 may function as capacitor elements in addition to conductors that function as varistor elements. In this case, the electronic component according to the present invention becomes a capacitor.

[0059] In the electronic component described above, the number of third electrodes may be one or two (a pair).

[0060] As can be understood from the above description, the present specification discloses the following. [Appendix 1] an element body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction; a plurality of conductors provided within the element body; a first electrode provided on the first surface of the element body and having a first portion that wraps around the third surface and the fourth surface to cover edges of the third surface and the fourth surface on the first surface side; a second electrode provided on the second surface of the element body and having a first portion that wraps around the third surface and the fourth surface to cover edges of the third surface and the fourth surface on the second surface side; a third electrode provided on at least one of the third surface and the fourth surface of the element body, the third electrode having a first portion extending between ridges between the fifth surface and the sixth surface; Equipped with An electronic component in which the distance between the first portion of the third electrode and the first portion of the first and second electrodes is longer and greatest at the ridge line between the fifth and sixth surfaces than at the intermediate position in the third direction of the body. [Appendix 2] 2. An electronic component as described in Appendix 1, wherein the length of the first portion of the third electrode in the first direction is maximum at a middle position of the body in the third direction and is minimum at the ridge line between the fifth surface and the sixth surface. [Appendix 3] 3. The electronic component of claim 2, wherein the first portion of the third electrode gradually narrows in a barrel shape toward a ridge line between the fifth surface and the sixth surface. [Appendix 4] 2. The electronic component of claim 1, wherein the lengths of the first electrode and the second electrode in the first direction are greatest at a middle position in the third direction of the body, and are smallest at the ridge line between the fifth surface and the sixth surface. [Appendix 5] 2. The electronic component of claim 1, wherein the third electrode further has a second portion that wraps around the fifth surface and the sixth surface and gradually narrows in a semicircular shape as it moves away from the ridge between the fifth surface and the sixth surface. [Appendix 6] the element body has a layered structure in which layers are stacked in the third direction, the plurality of conductors include a first conductor that extends from the first surface along the first direction and is connected to the first electrode in a predetermined layer of the element body; a second conductor that extends from the second surface along the first direction in a layer of the element body different from the first conductor and is connected to the second electrode, forming an overlapping portion that overlaps with the first conductor in the third direction; and a third conductor that extends from the third surface to the fourth surface in a layer of the element body located between the first conductor and the second conductor and is connected to the third electrode, and has a functional portion that overlaps with the overlapping portion in the third direction, 2. The electronic component according to claim 1, which is a chip varistor. [Explanation of symbols]

[0061] 1...chip varistor, 10...element body, 20A...first electrode, 20B...second electrode, 20C, 20D...third electrode, 30A...first conductor, 30B...second conductor, 30C...third conductor, 31...end, 32...main body portion, 33...widened portion, 34...functional portion, 40...overlapping portion, 42...first functional layer, 44...second functional layer.

Claims

1. an element body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction; a plurality of conductors provided within the element body; a first electrode provided on the first surface of the element body and having a first portion that wraps around the third surface and the fourth surface to cover edges of the third surface and the fourth surface on the first surface side; a second electrode provided on the second surface of the element body and having a first portion that wraps around the third surface and the fourth surface to cover edges of the third surface and the fourth surface on the second surface side; a third electrode provided on at least one of the third surface and the fourth surface of the element body, the third electrode having a first portion extending between ridges between the fifth surface and the sixth surface; Equipped with a distance between the first portion of the third electrode and the first portion of the first electrode and the second electrode at a ridge line between the fifth surface and the sixth surface is longer and at a maximum than a distance at an intermediate position in the third direction of the element body, a length of the first portion of the third electrode in the first direction is maximum at a middle position of the element body in the third direction and is minimum at a ridge line between the fifth surface and the sixth surface, the lengths of the first electrode and the second electrode in the first direction are maximum at an intermediate position of the element body in the third direction and are minimum at ridges between the first electrode and the fifth surface and the sixth surface, the element body has a layered structure in which layers are stacked in the third direction, the plurality of conductors include a first conductor that extends from the first surface along the first direction in a predetermined layer of the element body and is connected to the first electrode; a second conductor that extends from the second surface along the first direction in a layer of the element body different from the first conductor and is connected to the second electrode, forming an overlapping portion that overlaps with the first conductor in the third direction; and a third conductor that extends from the third surface to the fourth surface in a layer of the element body located between the first conductor and the second conductor and is connected to the third electrode, and has a functional portion that overlaps with the overlapping portion in the third direction, A chip varistor, an electronic component.

2. The electronic component according to claim 1 , wherein the first portion of the third electrode has a barrel-like shape that gradually narrows toward a ridge line between the fifth surface and the sixth surface.

3. 2. The electronic component according to claim 1, wherein the third electrode further includes a second portion that extends around the fifth surface and the sixth surface and gradually narrows in a semicircular shape with increasing distance from a ridge between the fifth surface and the sixth surface.

4. An electronic component as described in claim 1, wherein the first electrode and the first portion of the second electrode gradually narrow in width in a D-shape, semicircular shape or semi-elliptical shape toward the ridge line between the fifth surface and the sixth surface.

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