Part appearance inspection device and part appearance inspection method

Abstract

This component appearance inspection device comprises an imaging device, a projection device, and an information processing device. The information processing device inspects the flatness of specific parts of an electronic component by using a captured image of the electronic component captured by an imaging device while a pattern image is being projected thereto. The information processing device determines whether height data exist in measurement areas set to correspond to the specific parts in the captured image. Also, the information processing device determines whether height data exist in halation determination areas set in the vicinity of the measurement areas. In addition, even when a determination is made that height data exist in the measurement areas, if a determination is made that height data exist in the halation determination areas, a determination is made that the flatness inspection using the captured image has failed.

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a component appearance inspection device and a component appearance inspection method. [Background technology]

[0002] Component mounters equipped with component visual inspection devices are known. The component visual inspection device targets electronic components to be mounted on a board and determines whether the condition of specific portions (e.g., terminals) of the electronic components is suitable for the intended use of the electronic components. For example, Japanese Patent Application Laid-Open No. 2016-151538 discloses a component mounter equipped with a component visual inspection device that performs flatness inspections of multiple terminals (so-called coplanarity checks). This component visual inspection device includes an imaging device capable of capturing images of electronic components, a projection device that projects a pattern image onto the electronic components, and an information processing device that measures the three-dimensional shape of the electronic components based on the captured image of the electronic components when the pattern image is projected, and inspects the flatness of the terminals of the electronic components. The component visual inspection device determines whether the electronic components are suitable, thereby preventing the mounting of defective electronic components with deformed terminals, etc. Summary of the Invention [Problem to be solved by the invention]

[0003] When performing flatness inspection using a component visual inspection system, errors can occur due to failure to measure the three-dimensional shape based on captured images. Possible causes of errors include: a) an inappropriate shutter speed of the imaging device (e.g., too bright or too dark), b) inadequate light from the projection device, c) an inappropriate positioning of the set measurement point, or d) the electronic component captured is actually defective. The above two causes a) and b) can potentially be resolved by reviewing the imaging conditions of the imaging device. However, currently, the only way to resolve these issues is for users to determine the imaging conditions themselves through trial and error. In particular, even if three-dimensional shape measurement based on captured images fails, height data (three-dimensional shape data) may be acquired in the area to be measured, making it difficult to determine whether the flatness inspection failed. Therefore, it is difficult to immediately eliminate imaging conditions that result in unsuccessful three-dimensional shape measurement. Therefore, conventional component visual inspection systems have difficulty automatically determining appropriate imaging conditions.

[0004] Therefore, this specification provides a technique for automatically determining appropriate imaging conditions for an imaging device used in component visual inspection. [Means for solving the problem]

[0005] This specification discloses a component appearance inspection apparatus including an imaging device, a projection device, and an information processing device. The imaging device is capable of capturing an image of an electronic component. The projection device projects a pattern image onto the electronic component. The information processing device performs a flatness inspection of a specific portion of the electronic component using a captured image of the electronic component captured by the imaging device at the time the pattern image is projected. The information processing device includes a measurement area determination unit, a halation determination unit, and a success / failure determination unit. The measurement area determination unit determines whether height data exists for a measurement area set corresponding to the specific portion in the captured image. The halation determination unit determines whether height data exists for a halation determination area set near the measurement area. The success / failure determination unit determines that the flatness inspection using the captured image has failed if the measurement area determination unit determines that height data exists in the measurement area but the halation determination unit determines that height data exists in the halation determination area. In the above-described configuration, providing a halation determination area makes it possible to appropriately determine whether the flatness inspection has failed.

[0006] This specification also discloses another component appearance inspection apparatus including an imaging device, a projection device, and an information processing device. The imaging device is capable of capturing an image of an electronic component. The projection device projects a pattern image onto the electronic component. The information processing device performs a flatness inspection of a specific portion of the electronic component using a captured image of the electronic component captured by the imaging device at the time the pattern image is projected. The information processing device includes a measurement area determination unit, an effective measurement area determination unit, and a success / failure determination unit. The measurement area determination unit determines whether height data exists for a measurement area set corresponding to the specific portion in the captured image. The effective measurement area determination unit determines whether height data exists for a measurement effective area set within the measurement area. The success / failure determination unit determines that the flatness inspection using the captured image has failed if the measurement area determination unit determines that height data exists in the measurement area but the effective measurement area determination unit determines that height data does not exist in the measurement effective area. With the above-described configuration, setting the effective measurement area within the measurement area makes it possible to appropriately determine whether the flatness inspection has failed. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a plan view showing the entire component mounter of an embodiment; [Figure 2] 1 is a block diagram showing a control device of a component mounter to which a component appearance inspection device according to an embodiment of the present invention is applied; [Figure 3] FIG. 2 is a schematic diagram showing the positional relationship between a suction nozzle and a coplanarity unit. [Figure 4] FIG. 2 is a diagram showing an inspection surface of an electronic component whose three-dimensional shape has been measured. [Figure 5] (a) is a schematic diagram for explaining the positional relationship between the definition lead, the measurement point, and the halation determination area, (b) is an enlarged view of a main part showing the inspection surface of an electronic component whose three-dimensional shape was measured when halation was occurring, and (c) is an enlarged view of a main part showing the inspection surface of an electronic component whose three-dimensional shape was measured when halation was not occurring. [Figure 6] (a) is a schematic diagram for explaining the positional relationship between the definition lead, the measurement location, and the effective measurement area, (b) is an enlarged view of a main part showing the inspection surface of an electronic component whose three-dimensional shape has been measured outside the effective measurement area, and (c) is an enlarged view of a main part showing the inspection surface of an electronic component whose three-dimensional shape has been measured within the effective measurement area. [Figure 7] 10 is a flowchart for explaining a procedure for automatically determining imaging conditions for a component visual inspection device. [Figure 8] 10 is a table showing the results of a flatness inspection when images are taken at different shutter speeds. [Figure 9] 10 is a table showing the results of a flatness inspection when images of a plurality of electronic components are taken at different shutter speeds. [Figure 10] 10 is a table showing the results of a flatness inspection when images are captured in a plurality of imaging modes with different shutter speeds. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the part appearance inspection device disclosed in the present specification, the success / failure determination unit may determine that the flatness inspection using the captured image has been successful when the measurement area determination unit determines that height data exists in the measurement area and the halation determination unit determines that height data does not exist in the halation determination area. With this configuration, it is possible to appropriately determine that the flatness inspection has been successful.

[0009] In the component visual inspection device disclosed in this specification, the information processing device may further include a measurement effective area determination unit that determines whether height data exists for an effective measurement area set within the measurement area. The success / failure determination unit may further determine that the flatness inspection using the captured image has failed if the measurement effective area determination unit determines that height data does not exist in the effective measurement area. With this configuration, it is possible to appropriately determine that the flatness inspection has failed.

[0010] In the part visual inspection device disclosed in the present specification, the success / failure determination unit may determine that the flatness inspection using the captured image has been successful when the measurement area determination unit determines that height data exists in the measurement area, the halation determination unit determines that height data does not exist in the halation determination area, and the effective measurement area determination unit determines that height data exists in the effective measurement area. With this configuration, it is possible to appropriately determine that the flatness inspection has been successful.

[0011] In the component visual inspection apparatus disclosed herein, the imaging device may be capable of imaging electronic components under multiple imaging conditions. The information processing device may perform a flatness inspection on each of multiple captured images obtained by imaging the electronic component under each of the multiple imaging conditions. The information processing device may further include an imaging condition setting unit that sets imaging conditions for imaging the electronic component with the imaging device based on the imaging conditions used when capturing an image for which the success / failure determination unit determines that the flatness inspection was successful. With this configuration, appropriate imaging conditions can be automatically set based on the results of the flatness inspection, which appropriately determine whether the flatness inspection was successful or not.

[0012] In the component visual inspection device disclosed in this specification, the specific portion may be a terminal provided on the electronic component, and the imaging condition may be the shutter speed of the imaging device.

[0013] (Example 1) Hereinafter, an example of the component mounter 11 will be described with reference to the drawings. In the following description, the horizontal width direction of the component mounter 11 (left and right direction in FIG. 1) will be referred to as the X-axis direction, the horizontal length direction of the component mounter 11 (up and down direction in FIG. 1) will be referred to as the Y-axis direction, and the vertical direction perpendicular to the X-axis and Y-axis (front and back direction in FIG. 1) will be referred to as the Z-axis direction.

[0014] As shown in FIG. 1, the component mounter 11 includes a board transport device 15, a component supply device 21, a component transfer device 30, a part camera 41, a mark camera 42, a coplanarity unit 51, and a control device 61.

[0015] The board transport device 15 is composed of a pair of belt conveyors 16 and the like, and transports the circuit board 2 sequentially in a transport direction. The board transport device 15 positions the circuit board 2 at a predetermined position inside the component mounter 11. Then, after the component mounter 11 has performed the mounting process, the board transport device 15 transports the circuit board 2 out of the component mounter 11.

[0016] The component supply device 21 supplies electronic components to be mounted on the circuit board 2. The component supply device 21 has a plurality of slots arranged side by side in the X-axis direction. A feeder 22 is detachably set in each of the plurality of slots. The component supply device 21 feeds and moves the carrier tape using the feeder 22, and supplies electronic components at a take-out section located on the tip side of the feeder 22 (upper side in FIG. 1).

[0017] Furthermore, component supply device 21 supplies relatively large electronic components such as lead components arranged on trays 23. Component supply device 21 stores a plurality of trays 23 in storage shelves 24 that are partitioned vertically, and pulls out a predetermined tray 23 according to the mounting process to supply electronic components such as lead components.

[0018] The component transfer device 31 is configured to be movable in the X-axis and Y-axis directions. The component transfer device 31 is arranged from the rear side (upper side in FIG. 1) in the longitudinal direction of the component mounter 11 to above the component supply device 21 on the front side. The component transfer device 31 includes a head drive device 32, a movable table 33, and a mounting head 34. The head drive device 32 is configured to be able to move the movable table 33 in the X-axis and Y-axis directions using a linear motion mechanism. The mounting head 34 is a holding device that holds electronic components and is detachably attached to the movable table 33 of the head drive device 32. The mounting head 34 supports a plurality of suction nozzles 35 (see FIG. 3) that are detachably attached to a plurality of nozzle holders. The suction nozzles 35 suction and hold electronic components supplied at the take-out section of the feeder 22 and electronic components supplied from the tray 23.

[0019] The part camera 41 and the mark camera 42 are digital imaging devices having imaging elements such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), etc. The part camera 41 and the mark camera 42 capture images based on control signals from a control device 61 that is communicatively connected, and send image data acquired by the image capture to the control device 61.

[0020] The part camera 41 is fixed to the base of the component mounter 11 so that its optical axis is in the vertical direction (Z-axis direction), and is configured to be able to capture images from below the component transfer device 31. More specifically, the part camera 41 is configured to be able to capture images of the underside of the electronic component held by the suction nozzle 35.

[0021] The mark camera 42 is provided on the movable stage 33 of the component transfer device 31 so that its optical axis faces downward in the vertical direction (Z-axis direction). The mark camera 42 is configured to be able to capture an image of the circuit board 2. The control device 61 acquires image data from the mark camera 42 and recognizes the positioning state of the circuit board 2 by the board transport device 15 by recognizing, for example, a positioning mark attached to the board through image processing. The control device 61 corrects the position of the movable stage 33 in accordance with the positioning state of the circuit board 2, and controls the mounting process to mount the electronic components.

[0022] The coplanarity unit 51 measures the three-dimensional positions (spatial positions indicated by three-dimensional coordinates) of measurement points set on an electronic component. In this embodiment, the coplanarity unit 51 measures the three-dimensional position of each measurement point by measuring the shape (three-dimensional shape) of the inspection surface indicated by three-dimensional coordinates. The coplanarity unit 51 constitutes a part of a component visual inspection apparatus 81, which will be described later.

[0023] The control device 61 is mainly composed of a CPU, various memories, and control circuits. The control device 61 controls the mounting process of mounting electronic components on the circuit board 2 based on image data acquired by image capture by the part camera 41 and the mark camera 42 and the judgment result of the electronic component conformance by the component appearance inspection device 81. As shown in Fig. 2, the control device 61 has an input / output interface 68 connected to a mounting control unit 62, a shape measurement unit 63, a plane calculation unit 64, a flatness inspection unit 65, a conformance judgment unit 66, and a storage device 67 via a bus. A motor control circuit 69, an imaging control circuit 70, and a projection control circuit 71 are connected to the input / output interface 68.

[0024] The mounting control unit 62 controls the position of the mounting head 34 and the operation of the suction mechanism via the motor control circuit 69. More specifically, the mounting control unit 62 receives information output from various sensors provided in the component mounter 11 and the results of various recognition processes. The mounting control unit 62 sends a control signal to the motor control circuit 69 based on the control program stored in the storage device 67, the information from the various sensors, and the results of image processing and recognition processing. This controls the position and rotation angle of the suction nozzle 35 supported by the mounting head 34.

[0025] The shape measurement unit 63, plane calculation unit 64, flatness inspection unit 65, and conformity determination unit 66 are elements that make up the component appearance inspection device 81, and will be described in detail below. The storage device 67 is composed of an optical drive device such as a hard disk drive, or a flash memory. The storage device 67 stores a control program for operating the component mounter 11, image data transferred from the part camera 41 and mark camera 42 to the control device 61 via the bus or communication cable, temporary data from image processing by the component appearance inspection device 81, and the like. The input / output interface 68 is located between the CPU, storage device 67, and each unit, and converts data formats and adjusts signal strength.

[0026] The motor control circuit 69 is used to control the motors of each axis provided in the component transfer device 31 based on control signals from the mounting control unit 62. This positions the mounting head 34 in the directions of each axis. Furthermore, by controlling the motors of each axis, the lift position (position in the Z-axis direction) and rotation angle of a given suction nozzle 35 are determined.

[0027] The imaging control circuit 70 controls imaging by the part camera 41, the mark camera 42, and the measurement camera 54 of the coplanarity unit 51 based on an imaging control signal sent from the control device 61. The imaging control circuit 70 also acquires image data obtained by imaging by the part camera 41, the mark camera 42, and the measurement camera 54, and stores the image data in the storage device 67 via the input / output interface 68.

[0028] The projection control circuit 71 controls the projection by the projection devices (projectors 52 and 53) of the coplanarity unit 51 based on the projection control signal sent by the control device 61.

[0029] Next, the configuration of the component visual inspection device 81 will be described. The component visual inspection device 81 of this embodiment is a device that inspects the appearance of electronic components to determine whether they are normal components, and is configured as a part of the component mounter 11. The electronic components that are the subject of visual inspection are, for example, electronic components that have a component body and multiple terminals provided on the component body, and specific examples include semiconductor packages such as QFPs (Quad Flat Packages) and BGAs (Ball Grid Arrays). A QFP is an electronic component with multiple lead terminals protruding from the side of the component body. A BGA is an electronic component with multiple bumps protruding from the bottom surface of the component body. The following description will be given focusing on an electronic component 3 in a form similar to the QFP shown in FIG. 3.

[0030] The top surface of the electronic component 3 having lead terminals 4 is the surface that is held by suction on the mounting head 34, and the bottom surface, located opposite the top surface, is defined as the inspection surface that is visually inspected. In this case, specifically, the bottom surfaces of the component body 5 and each of the lead terminals 4 are the inspection surfaces.

[0031] As shown in Figure 2, component visual inspection apparatus 81 includes coplanarity unit 51, plane calculation section 64, flatness inspection section 65, and conformance determination section 66. Coplanarity unit 51 measures the three-dimensional position of measurement point P1 set on electronic component 3. Coplanarity unit 51 of this embodiment measures the three-dimensional shape of the inspection surface indicated by three-dimensional coordinates, thereby measuring the three-dimensional position of each measurement point P1. Coplanarity unit 51 includes measurement camera 54, two projectors 52 and 53, and shape measurement section 63 (see Figure 2) that constitutes part of control device 61.

[0032] The two projectors 52, 53 and the measurement camera 54 are fixed to the base of the component mounter 11. The two projectors 52, 53 are arranged at positions offset by 90° in the circumferential direction around the optical axis of the measurement camera 54, and are devices that project a predetermined pattern image onto the electronic component 3 that is the object of measurement for three-dimensional shape. In this embodiment, for example, a striped pattern image whose brightness changes sinusoidally is used.

[0033] The measurement camera 54 is a digital camera having an image sensor, similar to the part camera 41 and the mark camera 42. The measurement camera 54 captures the pattern image projected onto the electronic component 3. The measurement camera 54 captures the image based on a control signal from the control device 61 that is communicatively connected to the measurement camera 54, and sends the image data acquired by capturing the image to the control device 61.

[0034] The shape measuring unit 63 measures the three-dimensional shape of the electronic component 3 based on multiple image data acquired by imaging with the measurement camera 54. In this embodiment, the shape measuring unit 63 measures the three-dimensional shape of the electronic component 3 using a phase shift method. The plane calculation unit 64 calculates a reference plane based on the three-dimensional positions of measurement points P1 set on each of the multiple lead terminals 4. Here, the reference plane refers to a virtual plane that indicates the position of the plane relative to the multiple lead terminals 4 when the electronic component 3 is placed on a plane.

[0035] FIG. 4 visualizes the three-dimensional shape of the electronic component 3 measured by the shape measuring unit 63. The brightness of each part (shading in FIG. 4) indicates the height (Z coordinate) of the part. In the electronic component 3 of this embodiment, one measurement point P1 is set for each lead terminal 4. In FIG. 5, the rectangular area forming the outline of each lead terminal 4 represents the lead terminal (hereinafter referred to as the "defined lead T1") defined by the Shape Data. The measurement point P1 is set on the inner periphery of the area surrounded by the defined lead T1, and is preferably set at a distance inward from the edge of the defined lead T1. In FIG. 4, the measurement point P1 is represented by a square frame with an "x" mark. The shape measuring unit 63 calculates the Z coordinate relative to the X and Y coordinates of the set measurement point P1, for example, based on the coordinate system of the coplanarity unit 51, and measures the three-dimensional position of the measurement point P1.

[0036] The flatness inspection unit 65 performs a flatness inspection (coplanarity check) of the multiple lead terminals 4 based on the distances between the measurement points P1 set on each of the multiple lead terminals 4 and the reference plane. The suitability determination unit 66 determines the suitability of the electronic component 3. In this embodiment, it determines whether the flatness of the electronic component 3 is within an acceptable range. Specifically, if the flatness of the electronic component 3 is within the acceptable range, it is determined to be a normal product suitable for mounting, and if it is outside the acceptable range, it is determined to be a defective product unsuitable for mounting. The suitability determination unit 66 determines the suitability of the electronic component 3, and if it is appropriate, it determines that the electronic component 3 is suitable for mounting by the component mounter 11. On the other hand, if it is not appropriate, the suitability determination unit 66 determines that the electronic component 3 is not suitable for mounting by the component mounter 11.

[0037] Here, the mounting process of the electronic components 3 by the component mounter 11 will be described. The mounting control unit 62 first performs a suction process in which the electronic components 3 are sequentially picked up by the suction nozzles 35 supported by the mounting head 34 and held thereon. Next, the control device 61 operates the component transfer device 31 to move the mounting head 34 above the part camera 41 and performs an imaging process to capture images of the picked-up electronic components 3. The coplanarity unit 51 performs a conformance assessment process on the electronic components 3 held by the suction nozzles 35. The control device 61 determines whether or not there are any non-conforming components based on the results of the conformance assessment process. If the conformance assessment process determines that the electronic components 3 are non-conforming, the electronic components 3 are discarded or repaired. If the electronic components 3 are not non-conforming, the mounting control unit 62 performs a mounting process in which the electronic components 3 are sequentially mounted on the circuit board 2. Then, based on the control program, the mounting control unit 62 determines whether or not the mounting process for all electronic components 3 has been completed, and repeats the above process until the mounting process is completed.

[0038] Next, the conformity assessment process performed by the coplanarity unit 51 will be described. The coplanarity unit 51 first performs an imaging process using the measurement camera 54. Specifically, the coplanarity unit 51 moves the electronic component 3 above the measurement camera 54 by operating the component transfer device 31. The coplanarity unit 51 then performs the imaging process by repeatedly projecting pattern images using the two projectors 52 and 53 and capturing images using the measurement camera 54. Next, the shape measurement unit 63 uses the image data acquired by the imaging process to perform a measurement process of the three-dimensional shape of the inspection surface of the electronic component 3, which is represented by three-dimensional coordinates. Through this process, the coplanarity unit 51 acquires the three-dimensional position of the measurement point P1 for each of the multiple lead terminals 4. At this time, the coplanarity unit 51 adjusts the positional deviation of the measurement point P1 in accordance with the amount of deformation of the lead terminal 4 based on the acquired shape of the inspection surface. As a result, the coplanarity unit 51 acquires the three-dimensional position of the measurement point P1 displaced due to the deformation of the lead terminal 4. Next, the plane calculation unit 64 calculates a reference plane based on the three-dimensional positions of the measurement points P1 of each of the multiple lead terminals 4. The suitability determination unit 66 executes a flatness inspection process for the multiple lead terminals 4. In the flatness inspection process, the flatness of the lead terminals 4 is inspected based on whether the three-dimensional positions of the measurement points P1 set for all of the lead terminals 4 fall within the flatness tolerance range. The suitability determination unit 66 determines the suitability of the electronic component 3 based on the inspection results of the flatness inspection. If it is determined that the flatness of the lead terminals 4 is insufficient, the suitability determination unit 66 requests a recovery process from the control device 61 and terminates the suitability determination process for the electronic component 3. On the other hand, if the flatness of the lead terminals 4 meets the required flatness requirement, the suitability determination unit 66 terminates the suitability determination process without requesting a recovery process.

[0039] Next, a configuration for automatically determining the imaging conditions of the component appearance inspection device 81 in the component mounter 11 of this embodiment will be described.

[0040] The control device 61, which is an information processing device, further includes a measurement area determination unit 91, a halation determination unit 92, a success / failure determination unit 93, an effective measurement area determination unit 94, and an imaging condition setting unit 95. Here, the measurement camera 54 of the coplanarity unit 51 is capable of capturing images of the electronic component 3 under a plurality of imaging conditions. In this embodiment, the plurality of imaging conditions are the shutter speed and imaging mode of the measurement camera 54.

[0041] The shutter speed can be set in 1ms increments within a range of 1ms to 9ms. A short shutter speed results in a short exposure time, making the image darker. Conversely, a long shutter speed results in a long exposure time, making the image brighter.

[0042] The imaging mode is determined by a combination of the number of images taken by the measurement camera 54 and the angle setting of the electronic component at the time of imaging. In this embodiment, four imaging modes ("Auto," "Fine," "Auto+45°," and "Fine+45°") can be set. The "Auto" mode is automatically selected and performs inspection by capturing an image only once. The "Fine" mode is an imaging mode in which the electronic component 3 is captured twice at different angles. Specifically, this mode performs inspection by capturing an image of the electronic component 3, then rotating it 180° in the θ direction and capturing it again. The "Auto+45°" mode is an imaging mode in which the imaging mode is automatically selected and then rotating the electronic component 3 45° in the θ direction and capturing it again. The "Fine+45°" mode is an imaging mode in which the electronic component 3 is rotated 45° in the θ direction and capturing it twice. The control device 61 then captures the electronic component 3 under each of a plurality of imaging conditions and performs a flatness inspection on each of the captured images.

[0043] The measurement area determination unit 91 determines whether height data exists for a measurement area set corresponding to a specific part in the captured image. In this embodiment, it determines whether height data exists for a measurement point P1 set corresponding to each defined lead T1 in the captured image. Note that "determining whether height data exists for a measurement point P1" refers to calculating the Z coordinate relative to the XY coordinates of the set measurement point P1 and determining whether the result has been obtained (i.e., determining whether the three-dimensional position of the measurement point P1 has been grasped).

[0044] The halation determination unit 92 determines whether height data exists in a halation determination area set near the measurement area. In this embodiment, a halation determination area A1 is set in a roughly U-shaped manner at a position surrounding the lead tip side of each defined lead T1 (see FIGS. 5(a) to 5(c)). The halation determination unit 92 determines whether height data exists in the halation determination area A1. For example, FIG. 5(b) shows a state in which height data exists in the halation determination area A1. In the state shown in FIG. 5(b), the light-colored area (high-brightness area) indicating the presence of height data extends to the outer area of ​​the defined lead T1 and reaches the halation determination area A1, causing halation. Since the measurement point P1 is set in the part of the halation determination area A1 that reaches the high-brightness area, height data is obtained by measuring there. In other words, the measurement was successful in the halation area where measurement should not have been performed, which can be said to be an erroneous measurement. On the other hand, FIG. 5(c) shows a state in which no height data exists in the halation determination area A1. In the state shown in Figure 5(c), the high-intensity area indicating the presence of height data does not extend to the outer area of ​​the defining lead T1 and does not reach the halation determination area A1. The measurement point P1 is set on the inner side of the defining lead T1. Therefore, in this case, no height data is obtained in the halation determination area A1. The halation determination area A1 may be automatically generated based on the shape of the defining lead T1, or may be arbitrarily set by the user.

[0045] The measurement effective area determination unit 94 determines whether height data exists for the measurement effective area set within the measurement area. In this embodiment, a rectangular measurement effective area A2 is set on the inner periphery of the lead tip side of each defined lead T1 (see FIGS. 6(a) to 6(c)). The measurement effective area A2 is set spaced inward from the edge of the defined lead T1. FIG. 6(b) shows a state in which the measurement point P1 is set outside the measurement effective area A2. On the other hand, FIG. 6(c) shows a state in which the measurement point P1 is set within the measurement effective area A2. The measurement effective area A2 may be automatically generated based on the shape of the defined lead T1, or may be arbitrarily set by the user.

[0046] The success / failure determination unit 93 determines that the flatness inspection using the captured image has been successful when the measurement area determination unit 91 determines that height data exists in the measurement area and the halation determination unit 92 determines that height data does not exist in the halation determination area. Specifically, when the measurement area determination unit 91 determines that height data exists in the measurement point P1 and the halation determination unit 92 determines that height data does not exist in the halation determination area A1 (for example, the state in FIG. 5(c)), the success / failure determination unit 93 determines that the flatness inspection using the captured image has been successful.

[0047] In contrast, the success / failure determination unit 93 determines that the flatness inspection using the captured image has failed if the measurement area determination unit 91 determines that height data exists in the measurement area but the halation determination unit 92 determines that height data exists in the halation determination area. Specifically, even if the measurement area determination unit 91 determines that height data exists in the measurement point P1, the success / failure determination unit 93 determines that the flatness inspection using the captured image has failed if the halation determination unit 92 determines that height data exists in the halation determination area A1 (for example, the state of FIG. 5(b)). Furthermore, the success / failure determination unit 93 determines that the flatness inspection using the captured image has failed if the measurement effective area determination unit 94 determines that no height data exists in the measurement effective area. Specifically, the success / failure determination unit 93 determines that the flatness inspection using the captured image has failed if the measurement effective area determination unit 94 determines that no height data exists in the measurement effective area A2 (for example, the state of FIG. 6(b)).

[0048] The imaging condition setting unit 95 sets imaging conditions for imaging the electronic component 3 with the imaging device based on the imaging conditions used to capture an image for which the success / failure determination unit 93 determines that the flatness inspection was successful. In this embodiment, the shutter speed and imaging mode used to capture an image for which the success / failure determination unit 93 determines that the flatness inspection was successful are used to set the shutter speed and imaging mode used to capture an image for which the success / failure determination unit 93 determines that the flatness inspection was successful.

[0049] Next, the procedure for automatically determining the imaging conditions of the component visual inspection apparatus 81 according to this embodiment will be described with reference to the flowchart in FIG. 7 . In this embodiment, an automatic imaging condition determination program is stored in the storage device 67, and the control device 61 reads and executes this program from the storage device 67. First, in step S110, the control device 61 performs a measurement area determination process for a normal electronic component 3. The measurement area determination process determines whether height data exists for a measurement area (measurement point P1) set corresponding to a specific portion (each defined lead T1) in the captured image. Specifically, the control device 61 operates the two projectors 52 and 53 and the measurement camera 54 constituting the coplanarity unit 51 to capture images of each lead terminal 4 of the electronic component 3, and operates the shape measurement unit 63 to measure the three-dimensional shape of each lead terminal 4 based on the captured image data. The control device 61 also operates the plane calculation unit 64 to calculate a reference plane and the flatness inspection unit 65 to perform a flatness inspection (coplanarity check) of each lead terminal 4.

[0050] Next, the control device 61 proceeds to step S120 and operates the halation determination unit 92 to execute a halation determination process. In the halation determination process, it determines whether height data exists in a halation determination region (halation determination area A1) set near the definition lead T1. Next, the control device 61 operates the success / failure determination unit 93 to determine whether the flatness inspection was successful or unsuccessful based on the determination result of the halation determination process. Here, even if the measurement region determination unit 91 determines that height data exists in the measurement region (measurement point P1), if the halation determination unit 92 determines that height data exists in the halation determination area A1, it determines that the flatness inspection using the captured image has failed. If it is determined that the flatness inspection has failed in step S120, the control device 61 skips step S130 and proceeds to step S140. On the other hand, if the measurement area determination unit 91 determines that height data exists in the measurement area (measurement point P1) and the halation determination unit 92 determines that height data does not exist in the halation determination area A1, the process proceeds to the determination process of step S130.

[0051] Next, the control device 61 proceeds to step S130, and operates the measurement effective area determination unit 94 to execute a measurement effective area determination process. In the measurement effective area determination process, it determines whether height data exists for the measurement effective area (measurement effective area A2) set within the definition lead T1. Next, the control device 61 operates the success / failure determination unit 93 to determine whether the flatness inspection was successful or failed based on the determination result of the measurement effective area determination process. Here, even if the measurement area determination process determines that height data exists in the measurement area (measurement point P1) within the definition lead T1, if the measurement effective area determination process determines that height data does not exist in the measurement effective area A2, it determines that the flatness inspection using the captured image has failed. Therefore, if it is determined that height data exists in the measurement effective area A2 and that height data does not exist in the halation determination area A1, the flatness inspection is determined to be successful.

[0052] Thereafter, the control device 61 proceeds to step S140, where it outputs the results of the flatness inspection to the storage device 67 and temporarily stores them in the storage device 67. Note that the processes of steps S110 to S140 are repeated for the range of shutter speeds (i.e., 1 ms to 9 ms). Similar processes are repeated for the number of different imaging modes. Examples of output results of the flatness inspection are shown in the tables of FIGS. 8 to 10, respectively.

[0053] The table in Figure 8 shows, for example, the results of a flatness inspection when the shutter speed is set in 1 ms increments within the range of 1 ms to 9 ms and imaging is performed in the "Auto" mode, which is automatically selected by default. In the coplanarity result column in the table, "OK" means that the flatness inspection was successful, while "Error" means that the flatness inspection failed. The table also lists the CPH value, which is an index of productivity. In the table in Figure 8, a shutter speed in the range of 4 ms to 6 ms is "OK," and any other range is "Error." The median value of the "OK" range is 5 ms.

[0054] The table in Figure 9 illustrates the results of a flatness inspection performed using multiple electronic components 3 ("Component 1," "Component 2," and "Component 3") in the "Auto" mode. In the table in Figure 9, the range of 2 ms to 6 ms for "Component 1," the range of 4 ms to 6 ms for "Component 2," and the range of 3 ms to 7 ms for "Component 3" are all "OK." That is, when comparing the OK ranges, "Component 3" has the widest range, "Component 1" has the next widest, and "Component 2" has the narrowest. The median of the common "OK" range for each component is 5 ms.

[0055] The table in FIG. 10 illustrates the results of flatness inspections performed using four imaging modes ("Auto," "Fine," "Auto+45°," and "Fine+45°"). In the table in FIG. 10, the "OK" range is 4 ms to 6 ms for the "Auto" mode, 2 ms to 8 ms for the "Fine" mode, 3 ms to 6 ms for the "Auto+45°" mode, and 3 ms to 8 ms for the "Fine+45°" mode. That is, comparing the OK ranges, "Fine" is the widest, "Fine+45°" is the next widest, "Auto+45°" is the next widest, and "Auto" is the narrowest. The median of the "OK" range when imaging in "Fine" mode, which has the widest "OK" range, is 5 ms. After outputting the results of the flatness inspection, the control device 61 proceeds to step S150.

[0056] In step S150, the control device 61 refers to the output result of the flatness inspection and selects an imaging mode with a wide "OK" range. For example, based on the results of the table in FIG. 10, the "Fine" mode is selected as the optimal imaging mode. Next, the control device 61 proceeds to step S160 and selects a shutter speed. In this embodiment, it is predefined that the median value of the "OK" range is the optimal value. Therefore, in the example of the table in FIG. 10, the control device 61 selects "5 ms" as the optimal shutter speed. Furthermore, the control device 61 operates the imaging condition setting unit 95 to adopt an imaging condition of capturing an image in "Fine" mode with a shutter speed of "5 ms," and sets this as the imaging condition for subsequent image capture, thereby completing the series of processes.

[0057] As described above, the component appearance inspection device 81 constituting the component mounter 11 of this embodiment determines whether height data exists for the measurement point P1 set corresponding to the defined lead T1 in the captured image, and further determines whether height data exists for the halation determination area A1 set near the defined lead T1. Even if height data is determined to exist at the measurement point P1, if height data is determined to exist in the halation determination area A1, the flatness inspection using the captured image is determined to have failed. Therefore, as shown in FIG. 5(b), it is possible to avoid erroneously determining that the flatness inspection was successful when height data is acquired due to halation. Since the optimal imaging conditions are determined after excluding erroneous inspection results due to halation, the optimal imaging conditions can be determined stably.

[0058] Furthermore, the component visual inspection device 81 of this embodiment further determines whether height data exists in the measurement effective area (measurement effective area A2) set within the definition lead T1, which is the measurement area. If it is determined that height data does not exist in the measurement effective area A2, it is determined that the flatness inspection using the captured image has failed. On the other hand, if it is determined that height data exists in the definition lead T1, that height data does not exist in the halation determination area A1, and that height data exists in the measurement effective area A2, it is determined that the flatness inspection using the captured image has been successful. Therefore, it is possible to more accurately determine whether valid height data has been acquired.

[0059] Furthermore, in the component visual inspection device 81 of this embodiment, a flatness inspection is performed on each of a plurality of captured images obtained by capturing images of the electronic component 3 under each of a plurality of imaging conditions, and the imaging conditions for capturing an image of the electronic component 3 with the measurement camera 54 are set based on the imaging conditions used to capture an image for which the flatness inspection is determined to be successful. Therefore, the optimal imaging conditions for the measurement camera 54 used in the component visual inspection can be automatically determined. This eliminates the need for the user to determine the imaging conditions through trial and error, eliminating the hassle of determining the optimal imaging conditions.

[0060] Although the first embodiment has been described above, the specific aspects are not limited to the first embodiment. For example, in the first embodiment, the median value of the "OK" range is defined as the optimal value to determine the optimal imaging conditions, but the present invention is not limited to this configuration. For example, in other embodiments, the smallest "CPH value" within the "OK" range may be defined as the optimal value to determine the optimal imaging conditions.

[0061] In the first embodiment described above, the imaging condition setting unit 95 sets the imaging conditions for imaging the electronic component 3 with the measuring camera 54, but the present invention is not limited to this configuration. For example, in other embodiments, the user may set the imaging conditions for imaging the electronic component 3 with the measuring camera 54 based on the results of flatness measurement, without relying on the imaging condition setting unit 95.

[0062] In the first embodiment described above, the component appearance inspection device 81 is embodied as a part of the component mounter 11, but this is not intended to be limiting. For example, in other embodiments, the component appearance inspection device 81 may be embodied as a part of a substrate-related device other than the component mounter 11. That is, in this embodiment, the component mounter 11 is configured to store an automatic imaging condition determination program and the control device 61 of the component mounter 11 is configured to execute this program, but this is not intended to be limiting. For example, in other embodiments, the automatic imaging condition determination program may be stored in a substrate-related device other than the component mounter 11 and the control device of the substrate-related device may be configured to execute this program. Alternatively, the automatic imaging condition determination program may be stored in a production management computer and the production management computer may be configured to execute this program.

[0063] In the above-described first embodiment, the part appearance inspection device 81 performs a halation judgment to determine whether height data exists or not, and a measurement effective area judgment to determine whether height data exists or not for the measurement effective area, but is not limited to this configuration. For example, in other embodiments, the part appearance inspection device 81 may perform only one of the halation judgment and the measurement effective area judgment.

[0064] In the first embodiment described above, a flatness inspection is performed on each of a plurality of captured images obtained by capturing images of the electronic component 3 under each of two imaging conditions (shutter speed and imaging mode), but the present invention is not limited to this configuration. For example, in other embodiments, a flatness inspection may be performed under three or more imaging conditions by adding another imaging condition to the shutter speed and imaging mode.

[0065] Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The claimed technology includes various modifications and variations of the specific examples exemplified above. The technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings can achieve multiple objectives simultaneously, and achieving one of these objectives alone is technically useful. [Explanation of symbols]

[0066] 3: Electronic Components 4: Lead terminals as specific parts of electronic components 52, 53: Projector as a projection device 54: Measuring camera as an imaging device 61: Control device as information processing device 81: Parts appearance inspection equipment 91: Measurement area determination section 92: Halation detection section 93: Success / failure determination section 94: Measurement effective area determination unit 95: Imaging condition setting section A1: Halation judgment area as halation judgment area A2: Measurement effective area as the measurement effective region P1: Measurement point as measurement area

Claims

1. an imaging device capable of imaging an electronic component; a projection device that projects a pattern image onto the electronic component; an information processing device that performs a flatness inspection of a specific portion of the electronic component using a captured image of the electronic component captured by the imaging device when the pattern image is projected; The information processing device includes: a measurement area determination unit that determines whether height data exists for a measurement area set corresponding to the specific portion in the captured image; a halation determination unit that determines whether height data exists in a halation determination area set in the vicinity of the measurement area; a success / failure determination unit that determines that the flatness inspection using the captured image has failed when the measurement area determination unit determines that height data exists in the measurement area but the halation determination unit determines that height data exists in the halation determination area; and A part appearance inspection device comprising:

2. 2. The part visual inspection device according to claim 1, wherein the success / failure determination unit determines that the flatness inspection using the captured image is successful when the measurement area determination unit determines that height data exists in the measurement area and the halation determination unit determines that height data does not exist in the halation determination area.

3. the information processing device further includes a measurement effective area determination unit that determines whether height data exists for an effective measurement area set within the measurement area; 2. The part visual inspection device according to claim 1, wherein the success / failure determination unit further determines that the flatness inspection using the captured image has failed when the measurement effective area determination unit determines that no height data exists in the measurement effective area.

4. 4. The part visual inspection device according to claim 3, wherein the success / failure determination unit determines that the flatness inspection using the captured image is successful when the measurement area determination unit determines that height data exists in the measurement area, the halation determination unit determines that height data does not exist in the halation determination area, and the effective measurement area determination unit determines that height data exists in the effective measurement area.

5. the imaging device is capable of imaging the electronic component under a plurality of imaging conditions; the information processing device performs the flatness inspection on each of a plurality of captured images obtained by capturing images of the electronic component under each of the plurality of imaging conditions; 5. The component visual inspection apparatus according to claim 2, wherein the information processing device further includes an imaging condition setting unit that sets imaging conditions for imaging the electronic component with the imaging device based on imaging conditions used when an image for which the flatness inspection is determined by the success / failure determination unit to be successful is captured.

6. the specific portion is a terminal included in the electronic component, 6. The component visual inspection device according to claim 5, wherein the imaging condition is a shutter speed of the imaging device.

7. an imaging device capable of imaging an electronic component; a projection device that projects a pattern image onto the electronic component; an information processing device that performs a flatness inspection of a specific portion of the electronic component using a captured image of the electronic component captured by the imaging device when the pattern image is projected; The information processing device includes: a measurement area determination unit that determines whether height data exists for a measurement area set corresponding to the specific portion in the captured image; a measurement effective area determination unit that determines whether height data exists in an effective measurement area set within the measurement area; a success / failure determination unit that determines that the flatness inspection using the captured image has failed when the measurement area determination unit determines that height data exists in the measurement area but the measurement effective area determination unit determines that height data does not exist in the measurement effective area; A part appearance inspection device comprising:

8. A component appearance inspection method for inspecting flatness of a specific portion of an electronic component using a captured image of the electronic component when a pattern image is projected onto the electronic component, the method comprising: a measurement area determination step of determining whether height data exists for a measurement area set corresponding to the specific portion in the captured image; a halation determination step of determining whether height data exists in a halation determination area set in the vicinity of the measurement area; a success / failure determination step of determining that the flatness inspection using the captured image has failed when the measurement area determination step determines that height data exists in the measurement area but the halation determination step determines that height data exists in the halation determination area; A component appearance inspection method comprising:

9. A component appearance inspection method for inspecting flatness of a specific portion of an electronic component using a captured image of the electronic component when a pattern image is projected onto the electronic component, the method comprising: a measurement area determination step of determining whether height data exists for a measurement area set corresponding to the specific portion in the captured image; a measurement effective area determination step of determining whether height data exists in an effective measurement area set within the measurement area; a success / failure determination step of determining that the flatness inspection using the captured image has failed when the measurement area determination step determines that height data exists in the measurement area but the measurement effective area determination step determines that height data does not exist in the measurement effective area; A component appearance inspection method comprising:

Images