Processing equipment

Abstract

To provide a processor that can convey only a proper frame to a post process.SOLUTION: A processor 2 includes: frame storage means 4 in which a plurality of frames F are loaded; frame conveying means 6 that conveys the frames F from the frame storage means 4; a frame support table 8 that supports the frames F conveyed by the frame conveying means 6; and control means 10. A thickness measurement unit 10b of the control means 10 measures, when the uppermost frame F in the frame storage means 4 is carried out, and the frame F immediately below the uppermost frame F is raised so that a frame detection sensor 14 detects the frame F, the thickness of the frame F carried out from the amount of rise of a frame raising and lowering table 12. A determination unit 10c of the control means 10 compares a thickness stored in a thickness storage unit 10a of the control means 10 with the thickness measured by the thickness measurement unit 10b. When a result of the comparison is within an allowable value, the determination unit determines that the frame F carried out is proper, and when the result of the comparison is not within the allowable value, determines that the frame F carried out is improper.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for handling a frame having a central opening for receiving a wafer. [Background technology]

[0002] A wafer has on its surface a device region where a plurality of devices such as ICs and LSIs are partitioned by planned division lines, and a peripheral excess region surrounding the device region.The back surface of the wafer is ground to a desired thickness, and then the wafer is divided into individual device chips using a dicing machine and a laser processing machine, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

[0003] In order to facilitate the transportation of ground wafers, the applicant has proposed a technology in which a ring-shaped reinforcing portion is left on the back surface corresponding to the peripheral excess area, and the wafer is subjected to a predetermined processing, and then a dicing tape is attached to the back surface of the wafer, the wafer is supported by a frame, and the ring-shaped reinforcing portion is removed from the wafer (see, for example, Patent Document 1).

[0004] However, the technology disclosed in Patent Document 1 has the problem that it is difficult to attach dicing tape to the back surface of a wafer that has a convex ring-shaped reinforcing portion formed on the back surface corresponding to the peripheral excess area, and to integrate it with a frame, and it is also difficult to cut and remove the ring-shaped reinforcing portion from the wafer, resulting in low productivity.

[0005] Therefore, the present applicant has developed a processing device for removing a convex ring-shaped reinforcing portion from a wafer having the convex ring-shaped reinforcing portion formed on the back surface corresponding to the peripheral excess region (see, for example, Patent Document 2).

[0006] This processing equipment is a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed; a wafer carrying-out means for carrying out wafers from a wafer cassette placed on the wafer cassette table; a wafer table that supports the front surface side of the wafer carried out by the wafer carrying-out means; a frame receiving means for receiving a plurality of ring-shaped frames each having an opening for receiving a wafer; a frame unloading means for unloading the frame from the frame storage means; a frame table for supporting the frame carried out by the frame carrying-out means; a tape applying means disposed above the frame table for applying tape to the frame; a tape-attached frame transport means for transporting the frame with the tape attached to the wafer table and placing the tape-attached frame on the wafer table by positioning the opening of the frame over the backside of the wafer supported on the wafer table; a tape pressing means for pressing the tape of the tape-attached frame onto the back surface of the wafer; a frame unit carrying-out means for carrying out, from the wafer table, the frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure-bonded by the tape pressure-bonding means; a reinforcing portion removing means for cutting and removing the ring-shaped reinforcing portion from the wafer of the frame unit carried out by the frame unit carrying-out means; a ring-free unit carrying-out means for carrying out the ring-free unit from the reinforcing part removing means; and a frame cassette table on which a frame cassette containing the ring-less unit carried out by the ring-less unit carrying-out means is placed. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-62375 [Patent Document 2] Japanese Patent Publication No. 2022-19392 Summary of the Invention [Problem to be solved by the invention]

[0008] However, the frame storage means stores multiple frames stacked on top of each other, and although it is intended to store only thin stainless steel frames, thick resin frames may also be mixed in. In such cases, there is a problem that the tape cannot be applied only to the appropriate frames (in the above example, only the relatively thin stainless steel frames).

[0009] The above-mentioned problem can occur not only in the processing device disclosed in Patent Document 2, but also in any processing device that includes a frame storage means on which frames are loaded and stored and from which the frames are discharged through an upper discharge port.

[0010] SUMMARY OF THE INVENTION An object of the present invention is to provide a processing apparatus that can transport only suitable frames to a subsequent process. [Means for solving the problem]

[0011] According to the present invention, the following processing apparatus is provided to solve the above problems: "A processing apparatus that handles a frame having an opening in the center for accommodating a wafer, The apparatus includes a frame storage means for storing a plurality of frames and having an exit formed at the top thereof, a frame transport means for holding and transporting the frames from the frame storage means, a frame support table for supporting the frames transported by the frame transport means, and a control means, The frame storage means includes a frame lifting table that supports the lowest frame and lifts and lowers the loaded frames, and a frame detection sensor that detects the uppermost frame, The control means includes a thickness storage unit that stores an appropriate frame thickness, a thickness measurement unit that measures the frame thickness, and a determination unit that determines whether the frame is appropriate, the thickness measuring unit measures the thickness of the frame carried out by the frame transport means from the amount of lift of the frame lifting table when the uppermost frame is carried out by the frame transport means and the frame directly below it is lifted and the frame is detected by the frame detection sensor; The judgment unit compares the thickness stored in the thickness memory unit with the thickness measured by the thickness measurement unit, and if it is within an allowable value, judges that the frame transported by the frame transport means is proper, and if it is outside the allowable value, judges that the frame transported by the frame transport means is improper.

[0012] Preferably, when the determining unit determines that the frame is unsuitable, the frame carried out by the frame transport means is placed on an NG frame table.

[0013] The frame detection sensor is preferably a light emitting element and a light receiving element disposed on either side of the center of the frame. [Effects of the Invention]

[0014] The processing device of the present invention comprises: A processing apparatus for handling a frame having an opening in the center for accommodating a wafer, The apparatus includes a frame storage means for storing a plurality of frames and having an exit formed at the top thereof, a frame transport means for holding and transporting the frames from the frame storage means, a frame support table for supporting the frames transported by the frame transport means, and a control means, The frame storage means includes a frame lifting table that supports the lowest frame and lifts and lowers the loaded frames, and a frame detection sensor that detects the uppermost frame, The control means includes a thickness storage unit that stores an appropriate frame thickness, a thickness measurement unit that measures the frame thickness, and a determination unit that determines whether the frame is appropriate, the thickness measuring unit measures the thickness of the frame carried out by the frame transport means from the amount of lift of the frame lifting table when the uppermost frame is carried out by the frame transport means and the frame directly below it is lifted and the frame is detected by the frame detection sensor; The judgment unit compares the thickness stored in the thickness memory unit with the thickness measured by the thickness measurement unit, and if it is within the allowable value, judges that the frame transported by the frame transport means is proper, and if it is outside the allowable value, judges that the frame transported by the frame transport means is improper, so that only proper frames can be transported to the subsequent process. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a perspective view of a processing device constructed in accordance with the present invention; [Figure 2] FIG. 2 is a side view of the frame receiving means shown in FIG. 1. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, preferred embodiments of the processing apparatus of the present invention will be described with reference to the drawings.

[0017] (Processing device 2) As shown in Figure 1, the processing device 2 includes a frame storage means 4 that stores multiple frames F and has an exit port formed at the top, a frame transport means 6 that holds and transports the frames F from the frame storage means 4, a frame support table 8 that supports the frames F transported by the frame transport means 6, and a control means 10.

[0018] (Frame F) The frame F handled by the processing device 2 is annular and has a circular opening Fa in the center for accommodating a disk-shaped wafer (not shown). The frame F can be made of a metal material (e.g., stainless steel) or a resin material. The thickness of the frame F is an appropriate thickness (e.g., about 1 to 2 mm) depending on the diameter of the wafer to be accommodated in the opening Fa and the material of the frame F.

[0019] (Frame accommodating means 4) The frame storage means 4 includes a frame lifting table 12 that supports the lowest frame F and lifts and lowers the loaded frames F, and a frame detection sensor 14 that detects the topmost frame F.

[0020] (Frame lift table 12) The frame lifting table 12 is supported so as to be able to move up and down freely within a housing 16 which has an outlet 16a at the top. The housing 16 is provided with a door 18 with a handle 18a. By gripping the handle 18a and opening the door 18, the frame F can be loaded and stored on the frame lifting table 12 inside the housing 16.

[0021] 2 together with Fig. 1, the housing 16 is provided with a Z-axis guide member 20 (see Fig. 1) that guides the elevation of the frame lifting table 12, and an elevation means 22 (see Fig. 2) that raises and lowers the frame lifting table 12. Note that the Z-axis guide member 20 is omitted from Fig. 2.

[0022] 2, the lifting means 22 has a ball screw 24 that is connected to the frame lifting table 12 and extends in the Z-axis direction, and a motor 26 that rotates the ball screw 24. The lifting means 22 converts the rotational motion of the motor 26 into linear motion using the ball screw 24 and transmits it to the frame lifting table 12, thereby lifting and lowering the frame lifting table 12 in the Z-axis direction.

[0023] The Z-axis direction is the up-down direction indicated by the arrow Z in Fig. 1. The X-axis direction indicated by the arrow X in Fig. 1 is a direction perpendicular to the Z-axis direction, and the Y-axis direction indicated by the arrow Y in Fig. 1 is a direction perpendicular to the X-axis and Z-axis directions. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0024] 2, the illustrated embodiment is provided with a position detector 28 that detects the position of the frame lifting table 12 in the Z-axis direction. The position detector 28 has a scale 30 fixed to an appropriate bracket (not shown) and extending in the Z-axis direction, and a scale reading unit 32 attached to the frame lifting table 12. If the motor 26 of the lifting means 22 is a pulse motor, the position of the frame lifting table 12 in the Z-axis direction can also be detected based on the count value of the drive pulses that drive the pulse motor.

[0025] (Frame detection sensor 14) The frame detection sensor 14 will be described with reference to Figure 1. The frame detection sensor 14 has a light-emitting element 34 and a light-receiving element 36. The light-emitting element 34 and the light-receiving element 36 are attached to the upper end of the housing 16 and are arranged so as to sandwich the center of the frame F loaded on the frame lifting table 12.

[0026] When the light-receiving element 36 receives the light emitted by the light-emitting element 34, the frame detection sensor 14 detects that the top frame F is in the predetermined position when the top frame F is not in the predetermined position (at the same height as the top end of the housing 16) and the light-receiving element 36 can no longer receive the light emitted by the light-emitting element 34.

[0027] (Frame conveying means 6) As shown in FIG. 1, the frame conveying means 6 includes an X-axis guide member 38 extending in the X-axis direction, an X-axis movable member 40 supported by the X-axis guide member 38 so as to be movable in the X-axis direction, an X-axis feed means (not shown) that moves the X-axis movable member 40 in the X-axis direction, a Z-axis movable member 42 supported by the X-axis movable member 40 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) that moves the Z-axis movable member 42 in the Z-axis direction.

[0028] The X-axis feed means of the frame conveying means 6 may be configured to have a ball screw connected to the X-axis movable member 40 and extending in the X-axis direction, and a motor for rotating this ball screw, and the Z-axis feed means may be configured to have a ball screw connected to the Z-axis movable member 42 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0029] The Z-axis movable member 42 of the frame transport means 6 includes a holding portion 44 that holds the frame F. In the illustrated embodiment, the holding portion 44 has a rectangular base plate 46 and a plurality of suction pads 48 provided on the underside of the base plate 46, and the suction pads 48 are connected to a suction means (not shown).

[0030] In the frame transport means 6, the top frame F (frame F located at the above-mentioned predetermined position) housed in the frame housing means 4 is held by suction with the suction pad 48 of the holding portion 44, and then the X-axis movable member 40 and the Z-axis movable member 42 are moved to transport the top frame F held by suction out of the frame housing means 4.

[0031] (Frame support table 8) Continuing the explanation with reference to Figure 1, frame support table 8 is supported by Z-axis guide member 50 so as to be able to move up and down freely. Although not shown, Z-axis guide member 50 is provided with an appropriate lifting mechanism (for example, an air drive source or an electric drive source) for lifting and lowering frame support table 8.

[0032] The frame support table 8 is raised and lowered by a lifting mechanism to a lower position (position shown by a solid line in Figure 1) where it receives the frame F transported by the frame transporting means 6, and an upper position (position shown by a two-dot chain line in Figure 1) where dicing tape can be applied to the frame F on the frame support table 8 by a tape application means (not shown).

[0033] (Control means 10) The control means 10 is composed of a computer having a processor and a memory. As shown in Fig. 1, the control means 10 includes a thickness storage unit 10a that stores the appropriate thickness of the frame F, a thickness measurement unit 10b that measures the thickness of the frame F, and a determination unit 10c that determines whether the frame F is appropriate.

[0034] (Thickness memory unit 10a) The thickness memory unit 10a stores the thickness of the frame F for each type of frame F. For example, it can be stored in advance in the thickness memory unit 10a that the thickness of a stainless steel frame F for supporting a wafer with a diameter of 200 mm is 1.2 mm, and the thickness of a resin frame F for supporting a wafer with a diameter of 200 mm is 1.8 mm.

[0035] (Thickness measuring unit 10b) When the top frame F in the frame storage means 4 is carried out by the frame transport means 6, and the frame F directly below the carried-out frame F is raised together with the frame lifting table 12 by the lifting means 22, and the frame detection sensor 14 detects the raised frame F, the thickness measuring unit 10b measures the thickness of the frame F that was just carried out by the frame transport means 6 from the amount of lift of the frame lifting table 12.

[0036] (Judgment part 10c) The judgment unit 10c compares the thickness of the frame F stored in the thickness memory unit 10a with the thickness of the frame F measured by the thickness measurement unit 10b, and if it is within the allowable value, judges that the frame F transported by the frame transport means 6 is appropriate, and if it is outside the allowable value, judges that the frame F transported by the frame transport means 6 is inappropriate.

[0037] For example, if the thickness of the frame F to be compared among the frames F stored in the thickness memory unit 10a is 1.2 mm and the tolerance is 0.2 mm, if the thickness of the frame F measured by the thickness measurement unit 10b is 1.2 mm or more and 1.4 mm or less, it is within the tolerance, and the judgment unit 10c judges the unloaded frame F to be appropriate. On the other hand, in the above example, if the measured thickness of the frame F is less than 1.2 mm or more than 1.4 mm, it is outside the tolerance, and the judgment unit 10c judges the unloaded frame F to be inappropriate.

[0038] The tolerance value may be stored in the determining unit 10c. The tolerance value may be a constant value regardless of the type of frame F, or may be set to an arbitrary value for each type of frame F.

[0039] The control means 10 controls the operation of the processing device 2. Specifically, it controls the operation of the lifting means 22 of the frame lifting table 12, the suction means of the frame transport means 6, the X- and Z-axis feed means, and the lifting mechanism of the frame support table 8. In addition, information acquired by the frame detection sensor 14 and the position detector 28 is sent to the control means 10.

[0040] Furthermore, a monitor 52 is electrically connected to the control means 10. The monitor 52 displays screens in response to commands from the control means 10 (for example, an operation screen for operating the processing device 2, an error screen for notifying an operator of an error when an error occurs in the processing device 2, etc.).

[0041] (NG Frame Table 54) 1, an NG frame table 54 is provided between the frame storage means 4 and the frame support table 8. When the judgment unit 10c of the control means 10 judges that the frame F carried out by the frame transport means 6 is unsuitable, the frame F judged to be unsuitable is placed on the NG frame table 54.

[0042] (Operation of processing device 2) The operation of the processing device 2 (control by the control means 10) as described above will now be described.

[0043] Before operating the processing device 2, a plurality of identical frames F are loaded and stored on the frame lifting table 12 of the frame storage means 4, and the type of the stored frames F is input to the control means 10. Then, the judgment unit 10c of the control means 10 selects the frame F to be compared and the thickness of the frame F from among the frames F stored in the thickness memory unit 10a.

[0044] When the operator instructs the processing device 2 to start operating, the control means 10 causes the lifting means 22 to raise the frame lifting table 12 until the top frame F is detected by the frame detection sensor 14, and then stops the frame lifting table 12 when the top frame F is detected.

[0045] Next, the Z-axis position (vertical position) of the frame lifting table 12 is detected by the position detector 28. In the illustrated embodiment, when the frame lifting table 12 is stopped, the value on the scale 30 is read by the scale reading unit 32, and the read value is stored as a first value in the thickness measuring unit 10b.

[0046] After the thickness measuring unit 10b stores the first value, the control means 10 moves the X-axis movable member 40 of the frame transport means 6 to position the holding unit 44 above the frame accommodating means 4, and then lowers the holding unit 44 so that the suction pad 48 of the holding unit 44 comes into contact with the upper surface of the uppermost frame F accommodated in the frame accommodating means 4. Next, the suction means generates a suction force on the suction pad 48, and the uppermost frame F is suction-held by the suction pad 48. Then, the holding unit 44 is raised, and the frame F suction-held by the suction pad 48 is carried out of the frame accommodating means 4.

[0047] After the frame F has been carried out, the control means 10 raises the frame lifting table 12 until the uppermost frame F is detected by the frame detection sensor 14. Then, when the uppermost frame F in the frame storage means 4 (the frame F that was directly below the frame F carried out by the frame transport means 6) is detected, the frame lifting table 12 is stopped.

[0048] After the frame lifting table 12 is stopped, the position of the frame lifting table 12 in the Z-axis direction is detected by the position detector 28. In the illustrated embodiment, when the frame lifting table 12 is stopped, the value on the scale 30 is read by the scale reading unit 32, and the read value is stored as a second value in the thickness measuring unit 10b.

[0049] After storing the second value, the thickness measurement unit 10b calculates the difference between the first value and the second value. The calculated difference corresponds to the thickness of the frame F most recently carried out by the frame transport means 6. In this way, the thickness measurement unit 10b measures the thickness of the frame F most recently carried out.

[0050] The judgment unit 10c then compares the thickness t1 (the thickness of the frame F to be compared) stored in the thickness memory unit 10a with the thickness t2 (the difference between the first value and the second value) of the frame F measured by the thickness measurement unit 10b, and if the value of t2-t1 is within the tolerance, judges that the frame F most recently carried out by the frame transport means 6 is appropriate. Specifically, if the thickness t1 stored in the thickness memory unit 10a is 1.2 mm and the tolerance is 0.2 mm, and the thickness t2 of the frame F measured by the thickness measurement unit 10b is 1.2 mm or more and 1.4 mm or less, the value of t2-t1 is within the tolerance, and therefore the judgment unit 10c judges that the carried-out frame F is appropriate.

[0051] When the determining unit 10c determines that the frame F is appropriate, the carried-out frame F is transported to the frame support table 8. Then, a dicing tape is attached to the frame F that has been transported to the frame support table 8 by a tape attaching means (not shown).

[0052] On the other hand, if the value of t2-t1 is outside the allowable range, the judgment unit 10c judges that the frame F most recently carried out by the frame carrying means 6 is unsuitable. That is, in the case of the above example, if the measured thickness t2 of the frame F is less than 1.2 mm or greater than 1.4 mm, the value of t2-t1 is outside the allowable range, and the judgment unit 10c judges that the carried-out frame F is unsuitable.

[0053] If the determining unit 10c determines that the frame F is unsuitable, the carried-out frame F is not transported to the frame support table 8, but is placed on the NG frame table 54. Also, an error may be displayed to notify the operator that an unsuitable frame F has been found. The error may be displayed, for example, by displaying an error screen on the monitor 52, or by lighting or flashing a lamp, emitting a warning sound, or the like.

[0054] As described above, in the processing device 2 of the illustrated embodiment, it is possible to determine whether the frame F transported by the frame transport means 6 is suitable or unsuitable, and therefore only suitable frames F can be transported to the subsequent process. [Explanation of symbols]

[0055] 2: Processing equipment F: Frame Fa: Frame opening 4: Frame accommodation means 6: Frame transport means 8: Frame support table 10: Control means 12: Frame lift table 14: Frame detection sensor 34: Light-emitting element 36: Light receiving element 54:NG Frame Table

Claims

1. A processing apparatus for handling a frame having an opening in the center for accommodating a wafer, The apparatus includes a frame storage means for storing a plurality of frames and having an exit formed at the top thereof, a frame transport means for holding and transporting the frames from the frame storage means, a frame support table for supporting the frames transported by the frame transport means, and a control means, The frame storage means includes a frame lifting table that supports the lowest frame and lifts and lowers the loaded frames, and a frame detection sensor that detects the uppermost frame, The control means includes a thickness storage unit that stores an appropriate frame thickness, a thickness measurement unit that measures the frame thickness, and a determination unit that determines whether the frame is appropriate, the thickness measuring unit measures the thickness of the frame carried out by the frame transport means from the amount of lift of the frame lifting table when the uppermost frame is carried out by the frame transport means and the frame directly below it is lifted and the frame is detected by the frame detection sensor; The judgment unit compares the thickness stored in the thickness memory unit with the thickness measured by the thickness measurement unit, and if it is within the allowable value, judges the frame transported by the frame transport means to be appropriate, and if it is outside the allowable value, judges the frame transported by the frame transport means to be inappropriate.

2. 2. The processing apparatus according to claim 1, wherein when the determining section determines that the frame is unsuitable, the frame carried out by the frame transport means is placed on an NG frame table.

3. 2. The processing apparatus according to claim 1, wherein said frame detection sensor comprises a light emitting element and a light receiving element disposed on opposite sides of the center of the frame.

Images