Interchangeable modules for charged particle devices

Abstract

To provide a module replaceable in a charged particle apparatus.SOLUTION: Disclosed herein is a module for supporting a device configured to manipulate charged particle paths in a charged particle apparatus, the module comprising: a support arrangement configured to support the device, wherein the device is configured to manipulate a charged particle path within the charged particle apparatus; and a support positioning system configured to move the support arrangement within the module; wherein the module is arranged to be field replaceable in the charged particle apparatus.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Patent Application No. 63 / 037,481, filed June 10, 2020, and European Patent Application No. 20197510.9, filed September 22, 2020, each of which is incorporated herein by reference in its entirety.

[0002]

[0002] Embodiments provided herein generally describe the provision of an electron-optical assembly in a charged particle device. The electron-optical assembly is configured to manipulate one or more charged particle beams, such as by deflecting and / or focusing the beams. Embodiments provide an electron-optical device in a replaceable module in the charged particle device. Embodiments also provide techniques for properly aligning the electron-optical assembly with an incident source beam. [Background technology]

[0003]

[0003] When manufacturing semiconductor integrated circuit (IC) chips, undesired pattern defects inevitably occur on substrates (i.e., wafers) or masks during the fabrication process, for example, as a result of optical effects and accidental particles, thereby reducing yield. Therefore, monitoring the extent of undesired pattern defects is an important process in the manufacture of IC chips. More generally, inspection and / or measurement of the surface of a substrate or other object / material is an important process during and / or after its manufacture.

[0004]

[0004] Pattern inspection tools using charged particle beams have been used to inspect objects, for example, to detect pattern defects. These tools typically use electron microscopy techniques, such as scanning electron microscopes (SEMs). In an SEM, a primary electron beam of relatively high-energy electrons is targeted with a final deceleration step to land on a sample with a relatively low landing energy. The electron beam is focused as a probing spot on the sample. Interaction of the landing electrons from the electron beam with material structures at the probing spot causes electrons, such as secondary electrons, backscattered electrons, or Auger electrons, to be emitted from the surface. The generated secondary electrons can be emitted from the material structures of the sample. By scanning the primary electron beam as a probing spot across the sample surface, secondary electrons can be emitted across the surface of the sample. By collecting these emitted secondary electrons from the sample surface, the pattern inspection tool can obtain an image representative of the material structure characteristics of the surface of the sample.

[0005] Another application of charged particle beams is lithography. The charged particle beam reacts with a resist layer on the surface of a substrate. A desired pattern in the resist can be created by controlling the location on the resist layer where the charged particle beam is directed. A charged particle apparatus may be an apparatus for generating one or more charged particle beams, for illuminating, projecting, and / or detecting one or more charged particle beams. Within a charged particle apparatus, one or more electron-optical devices are provided for manipulating the one or more charged particle beams. There is a general need to improve the known techniques for providing electron-optical devices in charged particle apparatus. Summary of the Invention

[0006]

[0006] The embodiments provided herein disclose a module including an electron-optical device. The module is replaceable in the charged particle instrument in the field. Thus, the electron-optical device can be easily replaced by removing the module from the charged particle instrument and reinstalling the module with a different electron-optical device attached. Alternatively, a different module including a different electron-optical device can be installed.

[0007]

[0007] Embodiments also provide techniques for aligning an electron-optical device with other components in a charged particle device.

[0008]

[0008] According to a first aspect of the present invention, there is provided a module for supporting a device configured to manipulate a charged particle path in a charged particle apparatus, the module comprising: a support structure configured to support the device, the device configured to manipulate a charged particle path in the charged particle apparatus; and a support positioning system configured to move the support structure within the module, the module being arranged in the charged particle apparatus so as to be replaceable in field.

[0009]

[0009] According to a second aspect of the present invention, there is provided a module for supporting a device configured to manipulate the path of charged particles in a charged particle device, the module including a module flange configured to be attached to and detached from a housing flange of a housing of the charged particle device so that the module is field replaceable within the charged particle device.

[0010] According to a third aspect of the present invention there is provided a charged particle device including a field replaceable module according to the first or second aspect.

[0011]

[0011] According to a fourth aspect of the present invention, there is provided a method for installing an electron-optical device in a charged particle apparatus, the method comprising attaching the electron-optical device to a module, making coarse adjustments to the Rx state, Ry state, and / or z position of the electron-optical device relative to the body of the module, and fixing the module to the charged particle apparatus.

[0012]

[0012] According to a fifth aspect of the present invention, there is provided a method for aligning an electron-optical device with a charged particle beam or multi-beam in a charged particle apparatus, the method comprising fixing a module including the electron-optical device to the charged particle apparatus, thereby installing the electron-optical device in the charged particle apparatus, making one or more fine adjustments to the x-position, y-position and / or Rz state of the electron-optical device relative to the body of the module, and making adjustments to the path of the charged particle beam or multi-beam in the charged particle apparatus.

[0013]

[0013] According to a sixth aspect of the present invention, there is provided an electron optical column configured to project an electron beam onto a sample, the column comprising: a frame configured to define a coordinate system of the column; a chamber for receiving a field replaceable module including an electron optical device; an engagement arrangement configured to engage with the field replaceable module to align the field replaceable module with the frame; and an active positioning system configured to position the beam and device relative to each other for fine alignment.

[0014]

[0014] According to a seventh aspect of the present invention, there is provided a field replaceable module arranged for removably insertion into an electron optical column, the field replaceable module including an electron optical element configured to manipulate the path of an electron beam in the electron optical column, a support configured to support the electron optical element, and an engagement arrangement configured to align the support with a frame of the electron optical column in all degrees of freedom.

[0015]

[0015] Modules according to embodiments advantageously allow the electron-optical devices to be easily replaced without substantial disassembly of the charged particle apparatus.

[0016]

[0016] Other advantages of the present invention will become apparent from the following description, taken in conjunction with the accompanying drawings, in which are set forth, by way of illustration and example, certain embodiments of the invention.

[0017]

[0017] The above and other aspects of the present disclosure will become more apparent from the description of exemplary embodiments taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a schematic diagram illustrating an exemplary charged particle beam inspection apparatus. [Figure 2]

[0019] 2 is a schematic diagram illustrating an example multi-beam device that is part of the example charged particle beam inspection system of FIG. 1. [Figure 3]

[0020] 2 is a schematic diagram of an exemplary multi-beam apparatus illustrating an exemplary configuration of a source conversion unit of the exemplary charged particle beam inspection apparatus of FIG. 1. [Figure 4A]

[0021] 1 is a schematic diagram of a portion of a charged particle device according to an embodiment; [Figure 4B]

[0022] 1 is a schematic diagram of a portion of a charged particle device according to an embodiment; [Figure 5]

[0023] 1 is a schematic diagram of a cross section through a module according to an embodiment installed in a charged particle device. [Figure 6]

[0024] 1 is a schematic diagram of a cross section through an electron-optical device according to an embodiment installed in a charged particle instrument; [Figure 7]

[0025] 1 is a schematic diagram of a cross section through a module according to an embodiment in the process of being inserted into a charged particle device. [Figure 8]

[0026] 1 is a schematic diagram of a cross section through part of a module according to a first embodiment; [Figure 9]

[0027] 1 is a schematic diagram of a cross section through part of a module according to a first embodiment; [Figure 10A]

[0028] FIG. 4 is a schematic diagram of a cross section through part of a module according to a second embodiment. [Figure 10B]

[0029] FIG. 4 is a schematic diagram of a cross section through part of a module according to a second embodiment. [Figure 11A]

[0030] FIG. 10 is a schematic diagram of a cross section through a module according to one implementation of the third embodiment. [Figure 11B]

[0031] FIG. 10 is a schematic diagram of a cross section through a portion of a module according to one implementation of the third embodiment. [Figure 11C]

[0032] FIG. 11 is a schematic plan view of a stage showing an operating state of a piezoelectric actuator according to one implementation of the third embodiment. [Figure 11D]

[0032] FIG. 10 is a schematic plan view of a stage showing an operating state of a piezoelectric actuator according to one implementation of the third embodiment. [Figure 11E]

[0032] FIG. 10 is a schematic plan view of a stage showing an operating state of a piezoelectric actuator according to one implementation of the third embodiment. [Figure 11F]

[0033] FIG. 10 is a schematic diagram of a cross section through a module according to one implementation of the third embodiment. [Figure 11G]

[0034] FIG. 11 is a schematic plan view of a stage showing an operating state of a piezoelectric actuator according to one implementation of the third embodiment. [Figure 11H]

[0034] FIG. 10 is a schematic plan view of a stage showing an operating state of a piezoelectric actuator according to one implementation of the third embodiment. [Figure 11I]

[0034] FIG. 10 is a schematic plan view of a stage showing an operating state of a piezoelectric actuator according to one implementation of the third embodiment. [Figure 12A]

[0035] FIG. 10 is a schematic diagram of a cross section through a module according to one implementation of the fourth embodiment. [Figure 12B]

[0036] FIG. 10 is a schematic diagram of a cross section through a portion of a module according to one implementation of the fourth embodiment. [Figure 12C]

[0037] FIG. 10 is a schematic diagram of a cross section through a portion of a module according to one implementation of the fourth embodiment. [Figure 12D]

[0038] FIG. 10 is a schematic diagram of a cross section through a portion of a module according to one implementation of the fourth embodiment. [Figure 13]

[0039] FIG. 10 is a schematic diagram of a cross section through part of a module according to a fifth embodiment. [Figure 14A]

[0040] 10 is a schematic diagram of a module fixed to a charged particle device according to a sixth embodiment. [Figure 14B]

[0041] 10 is a schematic diagram of a flange on a charged particle device according to a sixth embodiment. [Figure 15A]

[0042] 12 is a schematic view of a part of a module according to a seventh embodiment in a charged particle device. [Figure 15B]

[0043] FIG. 10 is a schematic diagram of a clamping bolt configuration according to a seventh embodiment. [Figure 16]

[0044] 1 is a schematic diagram of a charged particle device according to an embodiment; [Figure 17]

[0045] 1 is a flowchart of a method according to an embodiment. [Figure 18]

[0046] 1 is a flowchart of a method according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019]

[0047] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings, in which like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following description of exemplary embodiments do not represent all implementations consistent with the present invention. Instead, the implementations are merely examples of apparatus and methods consistent with aspects related to the present invention, as set forth in the appended claims.

[0020]

[0048] The reduction in physical size of devices and the increase in computing power of electronic devices can be achieved by significantly increasing the packing density of circuit components such as transistors, capacitors, and diodes on IC chips. This has been made possible by improvements in resolution, which allow for the creation of even smaller structures. For example, an IC chip in a smartphone the size of a thumbnail, available before 2019, can contain over 2 billion transistors, each less than 1 / 1000 the size of a human hair. It is therefore not surprising that semiconductor IC manufacturing is a complex and time-consuming process with hundreds of individual steps. An error in even a single step can dramatically affect the functionality of the final product. Just one "killer defect" can cause device failure. The goal of a manufacturing process is to improve the overall yield of the process. For example, to achieve a 75% yield for a 50-step process (where steps can refer to the number of layers formed on a wafer), each individual step must have a yield of greater than 99.4%. If each individual step has a yield of 95%, the overall process yield is as low as 7-8%.

[0021]

[0049] While high process yields are desirable in IC chip manufacturing facilities, maintaining high substrate (i.e., wafer) throughput, defined as the number of substrates processed per hour, is also essential. High process yields and high substrate throughput can be affected by the presence of defects. This is especially true when operator intervention is required to investigate the defects. Therefore, high-throughput detection and identification of microscale and nanoscale defects by inspection tools, such as scanning electron microscopes ("SEMs"), is essential to maintaining high yields and low costs.

[0022]

[0050] An SEM includes a scanning device and a detector. The scanning device includes an illumination device, which includes an electron source for generating primary electrons, and a projection device for scanning a sample, such as a substrate, with one or more focused beams of primary electrons. The primary electrons interact with the sample and generate interaction products, such as secondary electrons and / or backscattered electrons. The detector captures the secondary electrons and / or backscattered electrons from the sample as it is scanned so that the SEM can generate an image of the scanned area of ​​the sample. For high-throughput inspection, some inspection systems use multiple focused beams of primary electrons, or multibeams. The component beams of a multibeam are sometimes called subbeams or beamlets. A multibeam can simultaneously scan different portions of the sample. Therefore, a multibeam inspection system can inspect a sample much faster than a single-beam inspection system.

[0023]

[0051] In a multi-beam inspection apparatus, some paths of the primary electron beam are displaced away from the central axis of the scanning device, i.e., the midpoint of the primary electron optical axis (also referred to herein as the charged particle axis). To ensure that all electron beams reach the sample surface at substantially the same angle of incidence, sub-beam paths with a greater radial distance from the central axis need to be steered to move through a larger angle than sub-beam paths closer to the central axis. This stronger steering can cause aberrations that blur the resulting image and defocus the image. One example is spherical aberration, which causes the focal point of each sub-beam path to a different focal plane. Specifically, for sub-beam paths that are not on the central axis, the change in the focal plane of the sub-beam increases with radial displacement from the central axis. Such aberrations and defocusing effects can remain associated with secondary electrons from the target when they are detected, for example, affecting the shape and size of the spot formed by the sub-beam on the target. Therefore, such aberrations degrade the quality of the resulting image produced during inspection.

[0024]

[0052] Known implementations of multi-beam inspection devices are described below.

[0025]

[0053] The figures are schematic. Accordingly, in the drawings, the relative dimensions of components are exaggerated for clarity. In the following description of the drawings, the same or similar reference numbers refer to the same or similar components or entities, and only differences relative to individual embodiments are described. While the description and drawings are directed to electron-optical devices, it is understood that the embodiments are not used to limit the present disclosure to specific charged particles. Thus, throughout this document, references to electrons can be considered to be references to charged particles more generally, and charged particles are not necessarily electrons.

[0026]

[0054] 1, which is a schematic diagram illustrating an exemplary charged particle beam inspection system 100. The charged particle beam inspection system 100 of FIG. 1 includes a main chamber 10, a load lock chamber 20, an electron beam tool 40, a front end equipment module (EFEM) 30, and a controller 50.

[0027]

[0055] The EFEM 30 includes a first load port 30a and a second load port 30b. The EFEM 30 may include one or more additional load ports. The first load port 30a and the second load port 30b can, for example, receive substrate front opening unified pods (FOUPs) containing substrates (e.g., semiconductor substrates or substrates made of other materials) or samples to be inspected (hereinafter, substrates, wafers, and samples are collectively referred to as "samples"). One or more robotic arms (not shown) of the EFEM 30 transport the samples to the load lock chamber 20.

[0028]

[0056] The load lock chamber 20 is used to remove gas from around the sample. This creates a vacuum, which is a local gas pressure lower than the pressure of the surrounding environment. The load lock chamber 20 may be connected to a load lock vacuum pumping system (not shown), which removes gas particles within the load lock chamber 20. Operation of the load lock vacuum pumping system allows the load lock chamber to reach a first pressure below atmospheric pressure. After the first pressure is reached, one or more robotic arms (not shown) transport the sample from the load lock chamber 20 to the main chamber 10. The main chamber 10 is connected to the main chamber vacuum pumping system (not shown). The main chamber vacuum pumping system removes gas molecules within the main chamber 10 so that the pressure around the sample reaches a second pressure below the first pressure. After the second pressure is reached, the sample is transported to an electron beam tool, where it can be inspected. The electron beam tool 40 may include a single-beam or multi-beam electron optical device.

[0029]

[0057] The controller 50 is electronically connected to the electron beam tool 40. The controller 50 may be a processor (e.g., a computer) configured to control the charged particle beam inspection apparatus 100. The controller 50 may also include processing circuitry configured to perform various signal and image processing functions. While FIG. 1 illustrates the controller 50 as external to the structure including the main chamber 10, the load lock chamber 20, and the EFEM 30, it is understood that the controller 50 may be part of the structure. The controller 50 may be located within one of the component elements of the charged particle beam inspection apparatus, or the controller 50 may be distributed among at least two of the component elements. While the present disclosure provides an example of a main chamber 10 housing an electron beam inspection tool, it should be noted that aspects of the present disclosure, in a broad sense, are not limited to chambers housing electron beam inspection tools. Rather, it is understood that the principles described above may also be applied to other tools and other arrangements of apparatus operating under a second pressure.

[0030]

[0058] Referring now to FIG. 2, FIG. 2 is a schematic diagram illustrating an exemplary electron beam tool 40, including a multi-beam inspection tool that is part of the exemplary charged particle beam inspection apparatus 100 of FIG. 1. The multi-beam electron beam tool 40 (also referred to herein as apparatus 40) includes an electron source 201, a gun aperture plate 271, a condenser lens 210, a source transformation unit 220, a primary projection apparatus 230, a motorized stage 209, and a sample holder 207. The electron source 201, the gun aperture plate 271, the condenser lens 210, and the source transformation unit 220 are components of an illumination apparatus encompassed by the multi-beam electron beam tool 40. The sample holder 207 is supported by the motorized stage 209 to hold a sample 208 (e.g., a substrate or mask) for inspection. The multi-beam electron beam tool 40 may further include a secondary projection apparatus 250 and an associated electron detection device 240. The primary projection apparatus 230 may include an objective lens 231. The electronic detection device 240 may include a plurality of detection elements 241, 242, and 243. The beam separator 233 and the deflection scanning unit 232 may be located within the primary projection arrangement 230.

[0031]

[0059] The components used to generate the primary beam may be aligned with the primary electron optical axis of apparatus 40. These components may include electron source 201, gun aperture plate 271, condenser lens 210, source conversion unit 220, beam separator 233, deflection scanning unit 232, and primary projection apparatus 230. Secondary projection apparatus 250 and its associated electron detection device 240 may be aligned with the secondary electron optical axis 251 of apparatus 40.

[0032]

[0060] The primary electron optical axis 204 is constituted by the electron optical axis of the portion of the electron beam tool 40 that is the illumination device. The secondary electron optical axis 251 is the electron optical axis of the portion of the electron beam tool 40 that is the detection device. The primary electron optical axis 204 is sometimes referred to herein (for ease of reference) as the main optical axis or the primary charged particle optical axis. The secondary electron optical axis 251 is sometimes referred to herein as the secondary optical axis or the secondary charged particle optical axis.

[0033]

[0061] The electron source 201 may include a cathode (not shown) and an extractor or anode (not shown). During operation, the electron source 201 is configured to emit electrons from the cathode as primary electrons. The primary electrons are extracted or accelerated by the extractor and / or anode to form a primary electron beam 202 that forms a primary beam crossover (virtual or real image) 203. The primary electron beam 202 can be visualized as it emerges from the primary beam crossover 203.

[0034]

[0062] The formed primary electron beam 202 may be a single beam, or multiple beams may be generated from this single beam. Thus, at different locations along the beam path, the primary electron beam 202 may be either a single beam or multiple beams. By the time it reaches the sample, preferably before it reaches the projection device, the primary electron beam 202 is multiple beams. Such multiple beams can be generated from the primary electron beam in many different ways. For example, multiple beams can be generated by a multibeam array located before the crossover 203, a multibeam array located in the source conversion unit 220, or a multibeam array located anywhere in between. The multibeam array may include multiple electron beam steering elements arranged in an array across the beam path. Each steering element can influence at least a portion of the primary electron beam to generate sub-beams. Thus, the multibeam array generates multiple beam paths by interacting with the incident primary beam path, down the multibeam array. The interaction of the multi-beam array with the primary beam may include one or more aperture arrays, individual deflectors (e.g., per sub-beam), lenses, astigmatism correctors and (aberration) correctors (again, e.g., per sub-beam).

[0035]

[0063] In operation, the gun aperture plate 271 is configured to block peripheral electrons of the primary electron beam 202 to reduce the Coulomb effect, which can increase the size of the probe spots 221, 222, and 223 of the primary sub-beams 211, 212, 213, respectively, and thus reduce the inspection resolution. The gun aperture plate 271 can also include multiple openings for generating primary sub-beams (not shown) even before the source conversion unit 220, and may also be referred to as a Coulomb aperture array.

[0036]

[0064] The condenser lens 210 is configured to focus (or collimate) the primary electron beam 202. In an embodiment, the condenser lens 210 can be designed to focus (or collimate) the primary electron beam 202 into a substantially parallel beam and substantially perpendicularly incident on the source conversion unit 220. The condenser lens 210 can be a movable condenser lens, which can be configured such that the position of its principal plane is movable. In an embodiment, the movable condenser lens can be configured to physically move, for example, along the optical axis 204. Alternatively, the movable condenser lens can be composed of two or more electro-optical elements, where the principal plane of the condenser lens moves in response to variations in the strength of the individual electro-optical elements (lenses). The (movable) condenser lens can be configured to be magnetic, electrostatic, or a combination of magnetic and electrostatic lenses. In a further embodiment, the condenser lens 210 can be an anti-rotation condenser lens. The anti-rotation focusing lens may be configured to keep the rotation angle constant when the focusing power (collimating power) of the focusing lens 210 changes and / or when the major plane of the focusing lens moves.

[0037]

[0065] In one embodiment of the source conversion unit 220, the source conversion unit 220 may include an image forming element array, an aberration compensator array, a beam-limiting aperture array, and a pre-bending micro-deflector array. The pre-bending micro-deflector array may, for example, be optional and may be present in embodiments in which the focusing lens does not ensure substantially normal incidence of the sub-beams originating from the Coulomb aperture array onto the beam-limiting aperture array, the image forming element array, and / or the aberration compensator array. The image forming element array may be configured to generate multiple sub-beams of the multi-beam path, i.e., primary sub-beams 211, 212, 213. The image forming element array may include, for example, multiple electron beam manipulators, such as micro-deflectors, micro-lenses (or a combination of both), for influencing multiple primary sub-beams 211, 212, 213 of the primary electron beam 202 and for forming multiple parallel images (virtual or real) of the primary beam crossover 203 (one for each of the primary sub-beams 211, 212, and 213). The aberration compensator array may include, for example, a field curvature compensator array (not shown) and an astigmatism compensator array (not shown). The field curvature compensator array may include, for example, multiple micro-lenses for compensating for field curvature aberration of the primary sub-beams 211, 212, and 213. The astigmatism compensator array may include multiple micro-astigmatism correctors for compensating for astigmatism of the primary sub-beams 211, 212, and 213. The beam-limiting aperture array may be configured to define the diameters of the individual primary sub-beams 211, 212, and 213. While Figure 2 shows three primary sub-beams 211, 212, and 213 by way of example, it will be understood that the source conversion unit 220 may be configured to form any number of primary sub-beams. The controller 50 may be connected to various parts of the charged particle beam inspection apparatus 100 of Figure 1, such as the source conversion unit 220, the electron detection device 240, the primary projection arrangement 230, or the motorized stage 209. As will be described in more detail below, the controller 50 may perform various image and signal processing functions.The controller 50 can also generate various control signals for controlling the operation of a charged particle beam inspection device, including a charged particle multi-beam device.

[0038]

[0066] The condenser lens 210 may further be configured to adjust the current of the primary sub-beams 211, 212, 213 in the down beam of the source conversion unit 220 by varying the focusing (collimating) power of the condenser lens 210. Alternatively or additionally, the current of the primary sub-beams 211, 212, 213 may be changed by varying the radial size of the beam-limiting apertures in the beam-limiting aperture array corresponding to the individual primary sub-beams.

[0039]

[0067] The objective lens 231 can be configured to focus the sub-beams 211, 212, and 213 onto the sample 208 for inspection, which in this embodiment can form three probe spots 221, 222, and 223 on the surface of the sample 208.

[0040]

[0068] The beam separator 233 may be, for example, a Wien filter including an electrostatic dipole field and a magnetic dipole field (not shown in FIG. 2 ). In operation, the beam separator 233 may be configured to exert an electrostatic force on individual electrons of the primary sub-beams 211, 212, and 213 by the electrostatic dipole field. In an embodiment, the electrostatic force is equal in magnitude but opposite in direction to the magnetic force exerted on individual primary electrons of the primary sub-beams 211, 212, and 213 by the magnetic dipole field of the beam separator 233. Thus, the primary sub-beams 211, 212, and 213 may pass at least substantially straight through the beam separator 233 with at least substantially zero deflection angle. The direction of the magnetic force depends on the direction of electron motion, and the direction of the electrostatic force is independent of the direction of electron motion. Therefore, because the secondary and backscattered electrons generally travel in the opposite direction compared to the primary electrons, the magnetic force on the secondary and backscattered electrons no longer cancels out the electrostatic force, and as a result, the secondary and backscattered electrons traveling through the beam separator 233 are deflected away from the optical axis 204.

[0041]

[0069] The deflection scanning unit 232 is configured, in operation, to deflect the primary sub-beams 211, 212, and 213 to scan the probe spots 221, 222, and 223 over respective scan areas of a section of the surface of the sample 208. In response to the incidence of the primary sub-beams 211, 212, and 213 on the probe spots 221, 222, and 223 on the sample 208, electrons, including secondary electrons and backscattered electrons, are generated from the sample 208. In this embodiment, the secondary electrons propagate in three secondary electron beams 261, 262, and 263. The secondary electron beams 261, 262, and 263 typically comprise secondary electrons (having electron energies of 50 eV or less) and may also comprise at least a portion of backscattered electrons (having electron energies between 50 eV and the landing energies of the primary sub-beams 211, 212, and 213). The beam separator 233 is positioned to deflect the paths of the secondary electron beams 261, 262, and 263 towards the secondary projection arrangement 250. The secondary projection arrangement 250 then focuses the paths of the secondary electron beams 261, 262, and 263 onto a plurality of detection areas 241, 242, and 243 of the electron detection device 240. The detection areas may be, for example, separate detection elements 241, 242, and 243 positioned to detect corresponding secondary electron beams 261, 262, and 263. The detection areas may generate corresponding signals that are sent to, for example, the controller 50 or a signal processing system (not shown), for example, to construct an image of the corresponding scanned area of ​​the sample 208.

[0042]

[0070] Detector elements 241, 242, and 243 can detect corresponding secondary electron beams 261, 262, and 263. Upon incidence of the secondary electron beams on detector elements 241, 242, and 243, the elements can generate corresponding intensity signal outputs (not shown). The outputs can be directed to an image processing system (e.g., controller 50). Each detector element 241, 242, and 243 can include one or more pixels. The intensity signal output of a detector element can be the sum of the signals generated by all pixels within the detector element.

[0043]

[0071] The controller 50 may include an image processing system including an image acquirer (not shown) and a storage device (not shown). For example, the controller may include a processor, a computer, a server, a mainframe host, a terminal, a personal computer, any type of mobile computing device, etc., or a combination thereof. The image acquirer may include at least a portion of the processing functionality of the controller. Thus, the image acquirer may include at least one or more processors. The image acquirer may be a device such as an electrical conductor, a fiber optic cable, a portable storage medium, IR, Bluetooth, among others. (registered trademark) The image capture device 208 may be communicatively coupled to the electronic detection device 240 of the apparatus 40, enabling signal communication via a network such as the Internet, a wireless network, a wireless radio, or a combination thereof. The image capture device may receive signals from the electronic detection device 240, process the data contained in the signals, and construct an image therefrom. Thus, the image capture device may capture an image of the sample 208. The image capture device may also perform various post-processing functions, such as generating contours and overlaying indicators on the captured image. The image capture device may be configured to adjust the brightness and contrast of the captured image, etc. The storage may be a storage medium such as a hard disk, a flash drive, cloud storage, random access memory (RAM), or other type of computer-readable memory. The storage may be coupled to the image capture device and may be used to store raw scanned image data as the original image or to store post-processed images.

[0044]

[0072] The image acquirer can acquire one or more images of the sample based on the imaging signal received from the electronic detection device 240. The imaging signal can correspond to a scanning operation to perform charged particle imaging. The acquired image can be a single image including multiple imaging areas. The single image can be saved to storage. The single image can be an original image that can be divided into multiple regions. Each region can include one imaging area that includes a feature of the sample 208. The acquired image can include multiple images of a single imaging area of ​​the sample 208 sampled multiple times over a period of time. The multiple images can be saved to storage. The controller 50 can be configured to perform image processing steps using multiple images of the same location on the sample 208.

[0045]

[0073] The controller 50 may include measurement circuitry (e.g., an analog-to-digital converter) to obtain a distribution of detected secondary electrons. The electron distribution data collected during the detection time window, in combination with the corresponding scan path data of each of the primary sub-beams 211, 212, and 213 incident on the sample surface, may be used to reconstruct an image of the sample structure under inspection. The reconstructed image may be used to reveal various features of the internal or external structure of the sample 208. Thus, the reconstructed image may be used to reveal any defects that may be present in the sample.

[0046]

[0074] The controller 50 may, for example, further control the motorized stage 209 to move the sample 208 during, before, or after inspection of the sample 208. In an embodiment, the controller 50 may enable the motorized stage 209 to move the sample 208 in a direction, e.g., continuously, e.g., at a constant speed, at least during inspection of the sample. The controller 50 may, for example, control the movement of the motorized stage 209 such that the speed of movement of the sample 208 varies depending on various parameters. For example, the controller may control the stage velocity (including its direction) depending on the characteristics of the inspection step of the scanning process.

[0047]

[0075] 2 shows apparatus 40 using three primary electron sub-beams, it is understood that apparatus 40 may use two or more primary electron sub-beams, and the present disclosure does not limit the number of primary electron beams used in apparatus 40.

[0048]

[0076]

[0033] Referring now to Figure 3, Figure 3 is a schematic diagram of an exemplary multi-beam apparatus illustrating an exemplary configuration of a source conversion unit of the exemplary charged particle beam inspection apparatus of Figure 1. Apparatus 300 may include an electron source 301, a pre-sub-beam forming aperture array 372 (also referred to as a Coulomb aperture array 372), a condenser lens 310 (similar to condenser lens 210 of Figure 2), a source conversion unit 320, an objective lens 331 (similar to objective lens 231 of Figure 2), and a sample 308 (similar to sample 208 of Figure 2). Electron source 301, Coulomb aperture array 372, and condenser lens 310 may be components of an illumination apparatus included by apparatus 300. Source conversion unit 320 and objective lens 331 may be components of a projection apparatus included by apparatus 300. The source conversion unit 320 may be similar to the source conversion unit 220 of FIG. 2 , except that the image forming element array of FIG. 2 is image forming element array 322, the aberration compensator array of FIG. 2 is aberration compensator array 324, the beam limiting aperture array of FIG. 2 is beam limiting aperture array 321, and the pre-bent micro-deflector array of FIG. 2 is pre-bent micro-deflector array 323. The electron source 301, Coulomb aperture array 372, condenser lens 310, source conversion unit 320, and objective lens 331 are aligned with a primary electron optical axis 304 of the apparatus. The electron source 301 generates a primary electron beam 302 generally along the primary electron optical axis 304 and with a (virtual or real) source crossover 301S. The Coulomb aperture array 372 filters out peripheral electrons from the primary electron beam 302 to reduce the resulting Coulomb effect. The primary electron beam 302 may be reduced into a specified number of sub-beams (such as three sub-beams 311, 312, and 313) by a pre-sub-beam forming mechanism Coulomb aperture array 372. Although three sub-beams and their paths are referred to above and in the following description, it is understood that the description is intended to apply to an apparatus, tool, or system using any number of sub-beams.

[0049]

[0077] The source conversion unit 320 may include a beamlet-limiting aperture array 321 with beam-limiting apertures configured to define the outer dimensions of the sub-beams 311, 312, and 313 of the primary electron beam 302. The source conversion unit 320 may also include an imaging element array 322 with image-forming micro-deflectors 322_1, 322_2, and 322_3. There is a respective micro-deflector associated with the path of each sub-beam. The micro-deflectors 322_1, 322_2, and 322_3 are configured to deflect the paths of the sub-beams 311, 312, and 313 toward the electron optical axis 304. The deflected sub-beams 311, 312, and 313 form a virtual image (not shown) of the source crossover 301S. In this embodiment, these virtual images are projected onto the sample 308 by the objective lens 331 and form probe spots on the sample, three probe spots 391, 392, and 393. Each probe spot corresponds to an incidence location of a sub-beam path on the sample surface. The source transformation unit 320 may further include an aberration compensator array 324 configured to compensate for aberrations that may be present in each sub-beam. The aberration compensator array 324 may include, for example, a field curvature compensator array (not shown) with microlenses. The field curvature compensators and microlenses may be configured to compensate the individual sub-beams for field curvature aberrations that are significant at the probe spots 391, 392, and 393. The aberration compensator array 324 may include an astigmatism compensator array (not shown) with micro-astigmatism correctors. The micro-stigmatizers may be controlled to act on the sub-beams, for example, to compensate for astigmatism that would otherwise be present in the probe spots 391, 392, and 393.

[0050]

[0078] The source conversion unit 320 may further include a pre-bent micro-deflector array 323 having pre-bent micro-deflectors 323_1, 323_2, and 323_3 for bending the sub-beams 311, 312, and 313, respectively. The pre-bent micro-deflectors 323_1, 323_2, and 323_3 can bend the paths of the sub-beams onto the beamlet-limiting aperture array 321. In an embodiment, the pre-bent micro-deflector array 323 can be configured to bend the sub-beam paths of the sub-beams toward an orthogonal direction of the plane on the beamlet-limiting aperture array 321. In an alternative embodiment, the condenser lens 310 can adjust the path directions of the sub-beams onto the beamlet-limiting aperture array 321. The collecting lens 310 may, for example, focus (collimate) the three sub-beams 311, 312, and 313 into substantially parallel beams along the primary electron optical axis 304, such that the three sub-beams 311, 312, and 313 are substantially perpendicularly incident on the source conversion unit 320, which may correspond to the beamlet-limiting aperture array 321. In such an alternative embodiment, the pre-bent micro-deflector array 323 may not be necessary.

[0051]

[0079] The image forming element array 322, the aberration compensator array 324, and the pre-bent micro-deflector array 323 may include multiple layers of sub-beam steering devices, some of which may be in the form of an array (e.g., micro-deflectors, micro-lenses, or micro-astigmatists).

[0052]

[0080] In this example of source conversion unit 320, sub-beams 311, 312, and 313 of primary electron beam 302 are deflected by micro-deflectors 322_1, 322_2, and 322_3, respectively, of imaging element array 322 toward primary electron optical axis 304. It is to be understood that the path of sub-beam 311 does not have to be deflected by micro-deflector 322_1, as the path of sub-beam 311 may already coincide with electron optical axis 304 before reaching micro-deflector 322_1.

[0053]

[0081] The objective lens 331 focuses the sub-beams onto the surface of the sample 308, i.e., the objective lens 331 projects three virtual images onto the sample surface. The three images formed on the sample surface by the three sub-beams 311-313 form three probe spots 391, 392, and 393 on the sample surface. In one embodiment, the deflection angles of the sub-beams 311-313 are adjusted to pass through or approach the front focus of the objective lens 331 to reduce or limit off-axis aberrations of the three probe spots 391-393.

[0054]

[0082] In the embodiment of multi-beam inspection tool 300 as shown in Figure 3, the secondary electron beam path, beam separator (similar to Wien filter 233), secondary projection optics (similar to secondary projection optics 250 in Figure 2), and electron detection device (similar to electron detection device 240) have been omitted for clarity. However, it should be apparent that similar beam separators, secondary projection optics, and electron detection devices may be present in this embodiment of Figure 3 to register and generate an image of the sample surface using secondary electrons or backscattered electrons.

[0055]

[0083] At least some of the above components of Figures 2 and 3 may be referred to individually or in combination with one another as manipulator arrays or manipulators because they manipulate one or more charged particle beams or sub-beams.

[0056]

[0084] The above-described embodiments of the multi-beam inspection tool include a multi-beam charged particle device (sometimes referred to as a multi-beam charged particle optical device) with a single charged particle source. The multi-beam charged particle device includes an illumination device and a projection device. The illumination device can generate multiple charged particle beams from an electron beam of the source. The projection device projects the multiple charged particle beams toward a sample. At least a portion of the surface of the sample can be scanned with the multiple charged particle beams.

[0057]

[0085] The multi-beam charged particle device comprises one or more electron-optical devices for manipulating sub-beams of the charged particle multi-beam. The applied manipulation may for example be a deflection of the path of the sub-beams and / or a focusing action applied to the sub-beams. The one or more electron-optical devices may comprise MEMS.

[0058]

[0086] The charged particle device may include a beam path manipulator located in the up-beam of the electron-optical device, and optionally within the electron-optical device. The beam path may be linearly manipulated in a direction perpendicular to the charged particle axis, i.e., the optical axis, by, for example, two sets of electrostatic deflectors operating across the entire beam. The two sets of electrostatic deflectors may be configured to deflect the beam path in orthogonal directions. Each set of electrostatic deflectors may include two electrostatic deflectors arranged consecutively along the beam path. The first electrostatic deflector of each set provides a corrective deflection, and the second electrostatic deflector restores the beam to the correct angle of incidence on the electron-optical device. The corrective deflection provided by the first electrostatic deflector may be overcorrective, so that the second electrostatic deflector can provide a deflection to ensure the desired angle of incidence on the MEMS. The locations of the sets of electrostatic deflectors may be several locations in the up-beam of the electron-optical device. The beam path may be rotationally manipulated. The rotational correction may be provided by a magnetic lens. Additionally or alternatively, rotation correction may be achieved by existing magnetic lenses, such as focusing lens arrangements.

[0059]

[0087] In charged particle instruments, such as multi-beam charged particle instruments, it may be necessary to replace an electron-optical device. For example, a different electron-optical device may be required for a particular application, such as requiring a different beam specification of the charged particle instrument. Another example is when an electron-optical device in a charged particle instrument fails and needs to be replaced.

[0060]

[0088] Known techniques for replacing electron-optical devices in charged particle instruments involve at least partially disassembling the charged particle instrument so that a replacement electron-optical device can be installed. A consequence of at least partial disassembly is that the vacuum within the charged particle instrument is lost. After the replacement electron-optical device is installed, the charged particle instrument must be reassembled. This then requires that the vacuum within the charged particle instrument be restored, a process that can take many hours. Therefore, known techniques for replacing electron-optical devices in charged particle instruments are complex and time-consuming.

[0061]

[0089] The replacement electron-optical device also needs to be properly positioned within the charged particle instrument so that it is properly aligned with the beam or multi-beams of the charged particle path.

[0062]

[0090] Embodiments improve upon known techniques for exchanging electron-optical devices in charged particle instruments. Embodiments also provide coarse and / or fine positioning techniques, with up to six degrees of freedom, for properly aligning an electron-optical device with a beam or multiple beams in a charged particle path.

[0063]

[0091] According to an embodiment, an electron-optical device is supported by a module in a charged particle device, such as a multi-beam charged particle device. The module can be easily removed from the charged particle device and reinserted into the charged particle device. The module is therefore a field-replaceable component of the charged particle device. Field-replaceable is intended to mean that the component can be replaced in a factory where the charged particle device is operated, without the need to remove the charged particle device. The component can be easily removed and efficiently replaced, with little tool downtime and with a mechanical process as simple as possible. This advantageously attempts to maximize uptime and reduce repair time and the resources required for component replacement. Thus, the process of replacing an electron-optical device in a charged particle device includes removing the module, replacing the electron-optical device supported by the module, and then reinserting the module into the charged particle device. Alternatively, a different module including a different electron-optical device may be inserted into the charged particle device. Substantial disassembly and reassembly of at least part of the charged particle device is advantageously not required. If an electron-optical device needs to be replaced, for example due to a change in the use of the charged particle device or due to an electron-optical device failure occurring, the downtime of the charged particle device can be significantly reduced.

[0064]

[0092] The electro-optical device supported by the module according to the embodiment may include a MEMS device and a PCB. The PCB may provide a stage for the MEMS device. The MEMS device of the electro-optical device may be for manipulating a charged particle beam or multiple beams. The electro-optical device may be fixed to the stage of the module.

[0065]

[0093] Embodiments include providing a vacuum lock in the charged particle device so that the portion of the charged particle device housing the replaceable module can be isolated from the vacuum of the rest of the charged particle device, and the time required to establish a vacuum after the module is inserted is advantageously significantly less than the time required to establish a vacuum for the entire charged particle device.

[0066]

[0094] Modules according to embodiments may be configured such that the electron-optical device 404 can be moved relative to the body of the module, allowing the electron-optical device to be repositioned after the module is installed so that the electron-optical device 404 can be properly aligned with the charged particle beam or multi-beam.

[0067]

[0095] The embodiments are described in more detail below.

[0068]

[0096] Figure 4A is a schematic diagram of a portion of a charged particle device 401 according to an embodiment. Figure 4B is a schematic diagram of a portion of the charged particle device 401 shown in Figure 4A.

[0069]

[0097] Charged particle device 401 includes a source 402. Source 402 emits a charged particle beam, referred to herein as the source beam. Similar to optical axes 204 and 304 described above, there is a charged particle axis within charged particle device 401. Charged particle beam path 403, which may be multiple beam paths, referred to herein as charged particle path 403, may be substantially along the charged particle axis.

[0070]

[0098] An electron-optical device 404 is provided in the charged particle path 403. The electron-optical device 404 may be supported in the charged particle path 403 by a module 405. An opening is present in a wall of the charged particle device 401 so that the module 405, and consequently the electron-optical device 404 supported by the module 405, are replaceable components of the charged particle device 401. The charged particle device 401 includes an up-beam vacuum lock 406. The up-beam vacuum lock 406 is closer to the source 402 than the module 405. The charged particle device 401 also includes a down-beam vacuum lock 407. The down-beam vacuum lock 407 is further from the source 402 than the module 405. In operation, a sample / substrate 408 is irradiated with a charged particle beam or multi-beams emitted from the charged particle device 401.

[0071]

[0099] Embodiments include several techniques for ensuring that the electron-optical device 404 is properly aligned with the charged particle path 403. Proper alignment may require positioning of the electron-optical device 404 and / or the charged particle path 403 in several degrees of freedom. Specifically, the charged particle path 403 may define a z-direction. In a plane orthogonal to the charged particle path 403, orthogonal x- and y-directions may be defined. Up to six degrees of freedom may be defined: linear positioning in the x-, y-, and z-directions, and rotational positioning about the x-axis (i.e., Rx), y-axis (i.e., Ry), and z-axis (i.e., Rz). It may be noted that some of the devices that may be mounted on the field-replaceable module may be planar or have a planar structure. In operation, this structure may be alignable with a plane orthogonal to the beam path; thus, the planar structure may lie in the x-axis and y-axis and be rotatable about Rz.

[0072]

[0100] Embodiments include coarse and fine alignment techniques for applying position adjustments. The coarse alignment techniques may include pre-calibration techniques.

[0073]

[0101] The coarse alignment technique may position the electron-optical device 404 in a known area relative to the physical structure of the charged particle device 401. For example, the coarse alignment technique may position the electron-optical device 404 in a known area relative to the housing of the charged particle device 401 and / or a vacuum chamber of the charged particle device 401 for receiving the module 405. The coarse alignment technique is provided by a connection between a flange 701 of the module 405 and the charged particle device 401, as shown by 411 in FIG. 4B . That is, the coarse alignment technique allows for fixing the module 405 to the charged particle device 401, such as by a frame (not shown), to fix the module in the coordinate system of the charged particle device 401. Alignment pins are used in the connection between the flange 701 and the charged particle device 401. The alignment pins may allow for the position of the module 405 relative to the charged particle device 401 to be known in up to six degrees of freedom. The position of module 405 is known to be subject to the tolerances of the coarse alignment process. A description of the coarse positioning technique is given in more detail below in the sixth embodiment.

[0074]

[0102] A pre-calibration technique according to an embodiment may be applied before the module 405 is inserted into the charged particle device 401. The pre-calibration technique is indicated by 410 in FIG. 4B . The pre-calibration technique adjusts the position of the electron-optical device 404 fixed to the module 405 relative to the body of the module 405, and in particular relative to the flange 701 of the module 405. The pre-calibration technique may adjust the position of the electron-optical device 404 relative to the flange 701 in up to six degrees of freedom. A description of the pre-calibration technique is given in more detail below in the seventh embodiment.

[0075]

[0103] The fine alignment technique is for aligning the electro-optical device 404 with the charged particle path 403 .

[0076]

[0104] The fine alignment technique may include mechanically adjusting the position of the electro-optical device 404 relative to the body of the module 405 when the module 405 is installed in the charged particle device 401, as shown by 409 in FIG. 4B. The mechanical fine alignment technique may adjust the position of the electro-optical device 404 in up to six degrees of freedom. In a preferred implementation, the mechanical fine alignment technique may adjust the position of the electro-optical device 404 in three degrees of freedom (i.e., x, y, and Rz). The mechanical fine alignment technique will be described in more detail in the first to fifth embodiments.

[0077]

[0105] The fine alignment technique may additionally or alternatively include electronically adjusting the position of the charged particle path 403 relative to the electron-optical device 404 when the electron-optical device 404 is installed in the charged particle device 401, as shown by 412 in FIG. 4B . The electronic fine alignment technique may, for example, use electrostatic and magnetic manipulators and lenses to adjust the position of the charged particle path 403 in up to six degrees of freedom. In a preferred implementation, the electronic fine alignment technique may adjust the position of the electron-optical device 404 in four degrees of freedom (i.e., x, y, z, and Rz). Adjustment of the charged particle path 403 in the z-direction may be performed by changing the focus of the charged particle beam or multi-beam. The electronic fine alignment technique will be described in more detail in the eighth embodiment.

[0078]

[0106] The coarse alignment techniques and pre-calibration techniques are passive techniques in that they are applied before and during the process of fixing the electron-optical device 404 to the charged particle device 401. The fine alignment techniques are active techniques in that they are applied mechanically or electronically after the electron-optical device 404 is installed in the charged particle device 401.

[0079]

[0107] Although not shown in FIGS. 4A and 4B , the charged particle device 401 may include alternative and / or additional components on the charged particle path 403, such as lenses and other components as previously described with reference to FIGS. 1-3 . Specifically, embodiments also include a charged particle projection device that splits a charged particle beam from a source into multiple sub-beams. Multiple respective objective lenses can project the sub-beams onto a sample. In some embodiments, multiple condenser lenses are provided from the objective lens to the up-beam. The condenser lenses focus each sub-beam to an intermediate focus at the up-beam of the objective lens. In some embodiments, a collimator is provided from the objective lens to the up-beam. Correctors may be provided to reduce focus errors and / or aberrations. In some embodiments, such correctors are integrated into the objective lens or positioned directly adjacent to the objective lens. If a collecting lens is provided, such a corrector may additionally or alternatively be integrated into the collecting lens or positioned directly adjacent to the collecting lens and / or positioned at or positioned directly adjacent to the intermediate focus. A detector is provided to detect charged particles emitted by the sample. The detector may be integrated into the objective lens. The detector may be located on the bottom surface of the objective lens facing the sample in use. The collecting lens, objective lens, and / or detector may be formed as MEMS or CMOS devices.

[0080]

[0108] As shown in FIG. 4A, an up beam vacuum lock 406 and a down beam vacuum lock 407 allow the vacuum chamber of the charged particle device to be isolated from the vacuum conditions of the rest of the charged particle device 401 .

[0081]

[0109] The process of replacing the module 405 may include the following steps: The power supply to the source may be cut off so that charged particles are not emitted; the up beam vacuum lock 406 and the down beam vacuum lock 407 may be closed so that the region of the charged particle device 401 containing the module 405 may be isolated from the vacuum state of the rest of the charged particle device 401; the region of the charged particle device 401 containing the module 405 may then be vented, and the module 405 may be removed from the charged particle device 401; a pre-calibrated new module may then be inserted and secured to the charged particle device 401 using coarse positioning techniques according to an embodiment; a pumping process may be performed to return the region of the charged particle device 401 containing the module 405 to a vacuum state, and a baking process may also be performed; then, both the up beam vacuum lock 406 and the down beam vacuum lock 407 may be opened; the power supply to the source may be turned on so that charged particles are emitted. When the up beam vacuum lock 406 and the down beam vacuum lock 407 are open, they do not present an obstacle to the charged particle path 403. Therefore, the charged particle path 403 can pass through both the up beam vacuum lock 406 and the down beam vacuum lock 407 when both are open. A mechanical fine alignment process according to an embodiment can be performed. A high voltage test can be performed. An electrical fine alignment process according to an embodiment can be performed. Once it is determined that the electron optical device is properly aligned with the charged particle path 403, the charged particle device 401 is ready for use.

[0082]

[0110] 5 and 6 are schematic diagrams of a module 405 installed in the charged particle device 401. FIG.

[0083]

[0111] 5 shows a schematic cross-section through module 405 and the portion of charged particle device 401 that includes module 405. The cross-section is in a plane that may be orthogonal to charged particle path 403.

[0084]

[0112] For module 405 to be replaceable, it is preferable that module 405 can both be removed and inserted into charged particle device 401 without substantial movement of the substantial components of charged particle device 401. In FIG. 5, components 501, 502, and 504 are depictions of components of charged particle device 401. Component 504 may be a structure that defines a volume in which the module must fit. For example, component 504 may be a vacuum chamber wall. Components 501 and 502 may also be substantial components of the charged particle device, such as a flood column or other substantial component, that limit the maximum size of component 504.

[0085]

[0113] The closest spacing across the components 504 may be, for example, in the range of 80 mm to 120 mm. The maximum width of the modules 405 should be less than or equal to the closest spacing across the components 504.

[0086]

[0114] The module 405 includes the electro-optical device 404. The module may include a flange 701. Within the flange, support circuitry and connections for the electro-optical device 404 may reside.

[0087]

[0115] 6 shows another schematic cross-section through a portion of the charged particle device 401 including a module 405. The cross-section is in a plane that may include the charged particle path 403. The electron-optical devices supported by the module are shown, but the body of the module is not.

[0088]

[0116] 6, components 601 and 602 are components of the charged particle device 401 between which the module 405 must fit. Component 601 may be, for example, a component of the illumination device, such as the up-beam vacuum lock 406 or another component. Component 602 may be, for example, the down-beam vacuum lock 407 or another component. The closest spacing along the charged particle path 403 between portions of the charged particle device 401 between which the module 405 must fit may be in the range of 40 mm to 70 mm. The maximum height of the module 405 should be equal to or less than this closest spacing along the charged particle path 403.

[0089]

[0117] Figure 7 shows a further schematic cross-section through module 405 and the portion of the charged particle device 401 that includes module 405. The cross-section is in the same plane as that shown in Figure 6. As indicated by the arrows, Figure 7 shows module 405 in the process of being installed in the charged particle device 401.

[0090]

[0118] The module 405 includes a body 702 that supports the electron-optical device 404. The body 702 is the portion of the module 405 that is inserted into the charged particle device 401. The body 702 of the module 405 can be inserted into a vacuum chamber to receive the module 405 within the charged particle device 401. The module 405 also includes a flange 701, referred to herein as the module flange 701. The module flange 701 can be the portion of the module 405 that can be secured to and removed from the charged particle device 401. The module flange 701 remains outside of the charged particle device 401 and is not inserted into the charged particle device 401. Several electrical connectors may be provided between the electron-optical device 404 and supporting circuitry within the flange 701.

[0091]

[0119] The positions of the other components in the charged particle device 401 define the charged particle path 403. The module 405 may position the electron optical device 404 within the charged particle device 401 such that the electron optical device 404 may be on the charged particle path 403. After the module 405 is secured to the charged particle device 401, fine adjustments to the position of the electron optical device 404 and / or the charged particle path may be made so that the electron optical device is properly aligned with the charged particle path 403.

[0092]

[0120] The embodiments include several different techniques for fine-tuning the position of the electron-optical device 404 relative to the charged particle path 403 when the module 405 is fixed to the charged particle device 401 .

[0093]

[0121] The module 405 may include a support structure arranged to support the electro-optical device 404 in the module 405. The electro-optical device 404 is held by the support structure such that it is fixed to the support structure. The electro-optical device 404 may include a PCB / stage fixed to the support structure. Additionally or alternatively, the support structure may include a stage to which the electro-optical device 404 is fixed.

[0094]

[0122] The module 405 may further include a support positioning system arranged to move the support structure relative to the body 702 of the module 405. The electro-optical device 404 is fixed to the support structure and thereby moved when the support positioning system moves the support structure.

[0095]

[0123] The electro-optical device 404 may be a substantially planar structure that is substantially perpendicular to the charged particle path 403. The plane of the electro-optical device 404 may also be referred to as the xy plane. The charged particle axis may also be referred to as the z-axis. The module may also be considered to be a substantially planar structure that is substantially in the xy plane.

[0096]

[0124] The support arrangement and support positioning system may also be substantially planar structures in the xy plane.

[0097]

[0125] The support positioning system may include a position detection system for determining the movement and / or position of the support structure. Using the position detection system may improve the accuracy of the movement and positioning of the support structure. The position detection system may use grid marks, such as an encoder, to determine the position of the support structure. The position detection system may use features of the support structure and / or the electro-optical device 404 to determine the movement and / or position of the support structure and / or the electro-optical device 404. For example, the support structure and / or the electro-optical device 404 may include features such as markers (e.g., fiducials), alignment openings (e.g., for use in manufacturing the electro-optical device 404), and functional features (e.g., openings through beam manipulators). Any of these features may be used to determine the movement and / or position of the support structure and / or the electro-optical device 404, thereby determining the accuracy of the applied movement.

[0098]

[0126] 8 shows a schematic diagram of a cross section through module 405 according to the first embodiment. The cross section is in a plane containing charged particle path 403 and shows some details of the support positioning system 801 of the first embodiment.

[0099]

[0127] 9 shows a schematic diagram of a cross section through module 405 according to the first embodiment. The cross section is in a plane perpendicular to the charged particle path 403 and shows some further details of the support positioning system 801 of the first embodiment.

[0100]

[0128] The support structure 807 is positioned to hold the electro-optical device 404. The support structure 807 is fixed to the support positioning system 801. In this embodiment, the support structure 807 may be a separate component from the support positioning system 801, or may be fixed to the support positioning system 801. For example, the support structure may include a flexure structure to accommodate thermal expansion of the electro-optical device. Alternatively, the support structure 807 may be integrated with the support positioning system 801, such that the support structure 807 and the support positioning system 801 are part of the same structure.

[0101]

[0129] The support positioning system 801 comprises a substantial disk. The disk has an up beam surface and a down beam surface. The up beam surface and the down beam surface are opposite major surfaces of the disk. In this embodiment, the up beam surface of the disk is the major surface of the disk closest to the electro-optical device 404. The down beam surface of the disk is the major surface of the disk furthest from the electro-optical device 404, and faces a portion of the base 805 of the module 405. However, it should become apparent that this is simply a design choice in this design, and the electro-optical device 404 may be positioned closer to the down beam surface of the disk.

[0102]

[0130] The disk may be substantially annular and may include a preferably central opening 806 for the charged particle path 403. The support structure 807 may also be substantially annular and may include a central opening for the charged particle path 403. In plan view, the outer periphery of the disk may be substantially circular. However, embodiments also include disk outer peripheries that are not substantially circular in plan view. For example, the outer periphery of the disk may be substantially hexagonal or may have an irregular shape.

[0103]

[0131] The disk in this embodiment is supported in the module 405 by a plurality of ball bearings 803, 804 or other types of load-bearing rotatable objects. There may be one or more ball bearings 804 in contact with the up beam surface of the disk. For example, there may be three ball bearings 804 in contact with the up beam surface of the disk. There may be at least three ball bearings 803 in contact with the down beam surface of the disk. Alternatively, instead of ball bearings, a spring may be provided in contact with the up beam surface of the disk. The spring may be arranged to apply a force to the up beam surface that is directed toward the base 805 of the module 405.

[0104]

[0132] Each ball bearing 803 in contact with the down beam surface may contact the base 805 of the module 405. Each ball bearing 804 in contact with the up beam surface of the disk may contact a plate 808 in contact with a spring 802, such as a leaf spring, compression spring, or other type of elastic member. Each spring 802 may be an axial spring. Each spring 802 may be fixed to the housing of the module 405, including the base 805 of the module 405. The spring 802 applies a force that presses all of the ball bearings 803, 804 against the disk. The ball bearing 803 in contact with the down beam surface also presses against the base of the module 405, thereby holding all of the ball bearings 803, 804 under compression by the spring 802.

[0105]

[0133] There may be one corresponding spring for each plate 808, although embodiments also include a single annular axial spring acting on all plates. Alternatively, two or more springs may be used, with the number of springs used not being limited to the number of plates 808.

[0106]

[0134] In an alternative implementation, an axial spring is provided where plate 808 is shown in Figure 8, and a rigid plate is provided where spring 802 is shown. The axial spring, which may be a compression spring or other type of resilient member, similarly applies a force pressing all of the ball bearings 803, 804 against the disk.

[0107]

[0135] A plurality of actuators 901, 902, 903 are provided to move the disks within the plane of the module 405. Each actuator 901, 902, 903 may include an actuator arm. Each actuator arm may be part of the actuator 901, 902, 903. Alternatively, each actuator arm may be a separate component from each actuator 901, 902, 903, with each actuator arm connected to the actuator 901, 902, 903. There may be roller bearings on the end of each actuator arm or other means that allow the actuator to move along the disk 801 with relatively little friction. Each actuator 901, 902, 903 may be a linear actuator having a longitudinal axis, for example, such that the actuator arm is configured to move along the longitudinal axis. Some or all of the actuators 901, 902, 903 may be operated, for example, manually and / or automatically. Alternatively, some or all of the actuators 901, 902, and 903 may be motorized, pneumatically controlled, or otherwise movable so that the actuator arms can be moved automatically. The disk in this embodiment includes multiple receiving portions 906, 907, and 908 in the sidewall of the disk. Each receiving portion 906, 907, and 908 may be positioned to receive one end of an actuator arm so that the actuator arm can apply a force to the disk. Each of the receiving portions 906 and 908 may be a substantially smooth surface in the cylindrical sidewall of the disk. Roller bearings at the end of each actuator arm allow movement along the sidewall. The receiving portion 907 may comprise, for example, a recess, groove, or other structural element in the sidewall of the disk. Alternatively, each receiving portion 906, 907, and 908 may comprise, for example, a recess, groove, or other structural element in the sidewall of the disk.

[0108]

[0136] The first actuator 901 may be arranged to move the disc in a first linear direction which may lie in the xy plane. The second actuator 902 may be arranged to move the disc in a second direction which is orthogonal to the first direction and which may also lie in the xy plane. The third actuator 903 may be arranged to impart a rotation to the disc in the xy plane, which may be, for example, an Rz rotation (i.e., movement of the disc about the z axis).

[0109]

[0137] In this embodiment, the first actuator 901 can be oriented such that the longitudinal axis of the first actuator 901 is aligned with the first direction and the center of Rz rotation of the disk. Thus, movement of the arm of the first actuator 901 along the longitudinal axis moves the disk only in the first direction and does not substantially rotate the disk. Movement by the arm in the first direction causes relative motion between the receiving portions 908, 907, and 906 and their corresponding rollers such that the rollers can roll on the surfaces of the receiving portions 908, 907, and 906.

[0110]

[0138] In this embodiment, the second actuator 902 can be oriented such that the longitudinal axis of the second actuator 902 is aligned with the second direction and the center of Rz rotation of the disk. Thus, movement of the arm of the second actuator 902 along the longitudinal axis moves the disk only in the second direction and does not substantially rotate the disk. Movement by the arm in the second direction causes relative motion between the receiving portions 908, 907, and 906 and their corresponding rollers such that the rollers can roll on the surfaces of the receiving portions 908, 907, and 906.

[0111]

[0139] This embodiment further illustrates a third actuator 903 that can be oriented such that its longitudinal axis is not aligned with the center of Rz rotation of the disk. The longitudinal axis receiving portion 907 of the arm of the third actuator can protrude from a sidewall of the disk. Thus, movement of the arm of the third actuator 903 along the longitudinal axis rotates the disk. The rotational movement of the disk causes relative rotational motion between the receiving portions 908, 907, and 906 and their corresponding rollers such that the rollers can roll on the surfaces of the receiving portions 908, 907, and 906.

[0112]

[0140] The support positioning system 801 may also include a number of planar springs 904, 905 or other force applying devices or resilient members for biasing the position of the disk to the actuator in the xy plane of the module 405.

[0113]

[0141] Each planar spring 904, 905 may be, for example, a linear spring arranged to exert a force along a longitudinal axis. An end of each planar spring 904, 905 may be fixed to the base 805 of the module 405, and the opposite end of each spring 904, 905 may be fixed to or pressed against a side wall of the disk.

[0114]

[0142] The longitudinal axis of the xy-plane spring 905 may be aligned with the center of Rz rotation of the disk (which is located at the center of the opening 806 as shown in FIG. 9 ). The xy-plane spring 905 may be described as being located on an opposite side of the disk to the receiving portion 908 of the actuator arm of the first actuator 901 and the receiving portion 906 of the actuator arm of the second actuator 902, for example. That is, the connection of the xy-plane spring 905 may be positioned on the disk such that the xy-plane spring can counteract forces applied to the disk 901 at the first and second receiving portions 906, 908 by the actuators 901, 902. The xy-plane spring may be configured, for example, to contribute to holding the disk under compression in first and second directions.

[0115]

[0143] In this embodiment, the longitudinal axis of the rotational planar spring 904 is not aligned with the center of Rz rotation of the disk. The rotational planar spring 904 may be fixed, for example, to a protrusion 909 on the side of the disk. The rotational planar spring may be positioned such that the rotational planar spring expands when the actuator arm of the third actuator 903 extends to rotate the disk. In one embodiment, the third actuator arm acts against a third receiving surface 907 on the side of the disk. As shown in FIG. 9 , the actuator arm extends to rotate the disk in a clockwise direction. The rotational planar spring 904 is connected to the disk such that it expands when the disk is rotated in a clockwise direction and compresses when the disk is rotated in a counterclockwise direction. The rotational planar spring 904 is thereby biased against the rotation imparted when the actuator arm of the third actuator 903 extends.

[0116]

[0144] In an alternative implementation of this embodiment, a single planar spring is used to hold the disk under compression in the first and second directions, as well as to bias the rotation imparted when the actuator arm of the third actuator 903 extends. One end of the planar spring may be fixed to the base 805 of the module 405, and the opposite end of the spring may be fixed near the edge of the central opening of the disk. The spring may be positioned so that it is not aligned with the center of Rz rotation of the disk.

[0117]

[0145] Actuators 901, 902, 903 may be part of charged particle device 401, or such actuators may not be part of module 405. The actuator arms may contact receiving portions 906, 907, 908 by extending through openings in module 405. Alternatively, actuators 901, 902, 903 may be entirely contained within module 405 or may be an integrated part of module 405.

[0118]

[0146] A position detection system may be configured and arranged to determine the movement and / or position of each actuator arm. Alternatively or additionally, the position detection system may be configured and arranged to determine the movement and / or position of each roller bearing at the end of the actuator arm. Changes in position and / or movement may be determined by encoders. A position detection system may be located on each actuator arm and / or each roller bearing, on the body of each actuator at the end opposite the roller bearing of the actuator. These position and / or movement determinations may be used to estimate the movement and / or position of the support structure 807, and thereby the movement and / or position of the electro-optical device 404. Alternatively, the position detection system may be configured and arranged to determine the movement and / or position of a rotating disk including the support structure 807, in order to determine the movement and / or position of the electro-optical device 404.

[0119]

[0147] Therefore, operation of the first actuator 901, the second actuator 902, and the third actuator 903 can move the support structure relative to the body 702 of the module 405, particularly the flange 701 of the module 405, in the xy plane and can also impart an Rz rotation to the support structure.

[0120]

[0148] According to a second embodiment, the support positioning system includes an Rz flexure configuration and an xy flexure configuration. The Rz flexure configuration and the xy flexure configuration may be arranged in a stacked manner. Each flexure configuration may be a substantially planar structure arranged in the xy plane. The support positioning system according to the second embodiment may be used in place of the support positioning system described in the first embodiment. Embodiments also include using elements of the support positioning system according to the second embodiment in addition to those described in the first embodiment.

[0121]

[0149] 10A shows a schematic diagram of a cross section through an Rz flexure configuration according to a second embodiment. The cross section is in a plane perpendicular to the charged particle path 403.

[0122]

[0150] Figure 10B shows a schematic diagram of a cross section through an xy flexure arrangement according to a second embodiment, the cross section being in a plane perpendicular to the charged particle path 403 and at a different location along the charged particle path than the cross section shown in Figure 10A.

[0123]

[0151] 10A, the Rz flexure configuration preferably includes a substantially circular structure 1005 that defines an aperture 1017 of the Rz flexure configuration at its center. The aperture 1017 allows the charged particle path 403 to pass through the Rz flexure configuration. In use, the Rz flexure configuration may be positioned such that the center of the aperture 1017 is preferably substantially aligned with the center of the charged particle path 403. The substantially circular structure may be circular in plan view or may be substantially cylindrical along the beam path.

[0124]

[0152] In this embodiment, the Rz flexure configuration also includes cross bars arranged to form a cross shape. The cross is formed by a first cross bar and a second cross bar. The first and second cross bars intersect each other in a substantially circular configuration 1005.

[0125]

[0153] The first and second crossbars are preferably both in the xy plane. The first crossbar may be aligned in a first direction. The second crossbar may be aligned in a second direction. The first and second directions may be orthogonal to each other.

[0126]

[0154] The first crossbar may include a first portion 1001 and a second portion 1003. The substantially circular structure 1005 may be located between and supported by the first portion 1001 and the second portion 1003 of the first crossbar. The second crossbar may include a first portion 1004 and a second portion 1002. The substantially circular structure 1005 may be located between and supported by the first portion 1004 and the second portion 1002 of the second crossbar. The substantially circular structure 1005 may be a cylindrical structure that is circular in plan view.

[0127]

[0155] The flexure arrangement includes a flexure base 1011 and a movable body 1010. The flexure base 1011 is fixed to the body 702 of the module 405 and cannot move substantially relative to the body 702 of the module 405.

[0128]

[0156] The movable body 1010 may be substantially C-shaped or crescent-shaped.

[0129]

[0157] One end of the first portion 1001 of the first crossbar may be fixed to the flexure base 1011, with the other end of the first portion 1001 fixed to the substantially circular structure 1005. One end of the second portion 1003 of the first crossbar may be fixed to the movable body 1010, with the other end of the second portion 1003 fixed to the substantially circular structure 1005.

[0130]

[0158] One end of the first portion 1004 of the second crossbar may be fixed to the flexure base 1011, with the other end of the first portion 1004 fixed to the substantially circular structure 1005. One end of the second portion 1002 of the second crossbar may be fixed to the moveable body 1010, with the other end of the second portion 1002 fixed to the substantially circular structure 1005. Thus, the moveable body 1010 is attached to the flexure base 1011 by the first crossbar, the second crossbar, and the substantially circular structure 1005.

[0131]

[0159] The first and second crossbars can bend to allow the movable body 1010 to rotate in Rz. The center of Rz rotation of the movable body 1010 can be near or at the center point of the substantially circular structure 1005.

[0132]

[0160] The support positioning system may include a spring 1006 or other force-applying device or elastic member. One end of the spring 1006 may be fixed to the flexure base 1011, and the other end may be fixed to an end of the movable portion 1010. The one end of the spring 1006 fixed to the flexure base 1011 may be fixed in substantially the same position as one end of the first portion 1004 of the second crossbar fixed to the flexure base 1011. When the spring is compressed, the bias force exerted by the spring 1006 may be perpendicular to the sidewall of the flexure base and in a direction that is not aligned with the substantially circular structure 1005. Thus, the force exerted by the spring 1006 is not directed toward the center of rotation of the movable body 1010. Thus, the effect of the spring 1006 is to exert a bias force that rotates the movable body 1010 about the z-axis.

[0133]

[0161] As described with respect to the first embodiment, a third linear actuator 1009 may be provided for rotating the Rz flexure configuration. The third linear actuator 1009 may be operated manually or automatically. The Rz flexure configuration includes a receiving portion 1018. The receiving portion 1018 is positioned to receive an end of an actuator arm of the third actuator 1009 such that the actuator arm can apply a force to rotate the Rz flexure configuration.

[0134]

[0162] The moveable body 1010 may be fixed (eg, bolted) in an xy flexure arrangement.

[0135]

[0163] 10B, the xy flexure configuration includes an outer structure 1014 that can be fixed in an Rz flexure configuration. The outer structure 1014 can be substantially L-shaped. The outer structure 1014 can be rigid.

[0136]

[0164] The xy-flexure arrangement includes a central structure 1012 including a substantially circular structure 1017 that defines an aperture in the xy-flexure arrangement. The central structure 1012 may be rigid. The aperture allows a charged particle path 403 to pass through the xy-flexure arrangement. In use, the xy-flexure arrangement may be positioned such that the center of the aperture is substantially aligned with the charged particle path 403.

[0137]

[0165] As described with respect to the first embodiment, a first linear actuator 1007 and a second linear actuator 1008 are provided for moving the x-y flexure arrangement in orthogonal directions in the x-y plane. The first linear actuator 1007 and the second linear actuator 1008 may be operated manually or automatically. The x-y flexure arrangement includes a first receiving portion 1015 and a second receiving portion 1016. Each receiving portion 1015, 1016 is positioned to receive the end of one of the actuator arms such that the actuator arms can apply a force to the x-y flexure arrangement.

[0138]

[0166] The xy flexure configuration includes an intermediate structure 1013. The intermediate structure 1013 may have a substantially square perimeter around a substantially square opening. The intermediate structure 1013 may be rigid. The central structure 1012 may be disposed in the opening of the intermediate structure 1013 such that the central structure 1012 is surrounded by the intermediate structure 1013 in the xy plane. The intermediate structure 1013 may be at least partially surrounded by an outer structure 1014, a receiving portion 1015, and a receiving portion 1016.

[0139]

[0167] The receiving portion 1015 may be directly connected to the central structure 1012 by a first connector, such as a rod or bar. A spring 1019 or other type of biasing device may be provided between the intermediate structure 1013 and the outer structure 1014, substantially aligned with the longitudinal axis of the second linear actuator 1008 and opposite the connection point of the first connector on the central structure.

[0140]

[0168] The receiving portion 1016 may be directly connected to the central structure 1012 by a second connector, such as a rod or bar. A spring 1020 or other type of biasing device may be provided between the central structure 1012 and the outer structure 1014, substantially aligned with the longitudinal axis of the first linear actuator 1007 and opposite the connection point of the second connector on the central structure.

[0141]

[0169] The xy flexure arrangement includes leaf springs 1021, 1022, 1023, and 1024. Alternatively, leaf springs 1021, 1022, 1023, and 1024 may be other types of elastic members.

[0142]

[0170] The intermediate structure 1013 may be connected to the outer structure 1014 by leaf springs 1021 and 1024. The leaf springs 1021 and 1024 may be disposed on opposite sides of the intermediate structure 1013. Both leaf springs 1021 and 1024 may be disposed such that they are aligned substantially perpendicular to the longitudinal axis of the second linear actuator 1008.

[0143]

[0171] The intermediate structure 1013 may be connected to the central structure 1012 by leaf springs 1022 and 1023. The leaf springs 1022 and 1023 may be disposed on either side of the intermediate structure 1013. Both leaf springs 1022 and 1023 may be disposed such that they are aligned substantially perpendicular to the longitudinal axis of the first linear actuator 1007.

[0144]

[0172] The leaf springs 1022 and 1023 allow movement of the central structure 1012 relative to the intermediate structure 1013, thereby moving the central structure 1012 relative to the outer structure 1014. Thus, linear extension of the arm of the first actuator 1007 can move the central structure 1012 in a second direction against the bias of the spring 1020. Similarly, the bias of the spring 1020 can move the central structure 1012 in the opposite direction when the arm of the first actuator 1007 is retracted.

[0145]

[0173] Leaf springs 1021 and 1024 allow movement of intermediate structure 1013, and thus central structure 1012, relative to outer structure 1014. Thus, linear extension of the arm of second actuator 1008 can move central structure 1012 in a second direction against the bias of spring 1019. Similarly, the bias of spring 1019 can move central structure 1012 in the opposite direction when the arm of second actuator 1008 is retracted.

[0146]

[0174] Thus, the first actuator 1007 and the second actuator 1008 may be configured to move the central structure 1012 in orthogonal directions in the xy plane.

[0147]

[0175] As noted above, the flexure configuration in this embodiment may be a stack of an Rz flexure configuration and an xy flexure configuration. The Rz flexure configuration may be fixed to the base of the module, and the xy flexure configuration may be fixed above the Rz flexure configuration (e.g., to the up beam). The circular structure 1005 of the Rz flexure configuration may be substantially aligned with the circular structure 1017 of the xy flexure configuration.

[0148]

[0176] The longitudinal axis of the arm of the first actuator 1007 may be substantially aligned with the longitudinal axis of the first crossbar of the Rz flexure configuration and the center of Rz rotation of the moveable body 1010. Thus, movement of the arm along the longitudinal axis moves the moveable body 1010 only in a first direction and does not substantially rotate the moveable body 1010.

[0149]

[0177] The longitudinal axis of the arm of the second actuator 1008 may be substantially aligned with the longitudinal axis of the second crossbar of the Rz flexure configuration and the center of Rz rotation of the moveable body 1010. Thus, movement of the arm along the longitudinal axis moves the moveable body 1010 only in the second direction and does not substantially rotate the moveable body 1010.

[0150]

[0178] The longitudinal axis of the arm of the third actuator 1009 is not aligned with the center of Rz rotation of the movable body 1010. The receiving portion for the longitudinal axis of the arm of the third actuator 1009 may be a recess or notch in the side of the movable body 1010. Thus, movement of the arm along the longitudinal axis rotates the flexure configuration in Rz. The Rz rotation imparted by extension of the arm of the third actuator 1009 may compress the spring 1006 such that the movable body 1010 is held under rotational compression.

[0151]

[0179] The xy flexure arrangement is fixed to the moveable body 1010 in an Rz flexure arrangement, so when the moveable body 1010 is rotated, the entire xy flexure arrangement is rotated.

[0152]

[0180] The central structure 1012 of the xy flexure arrangement may be a support structure and may include features for holding the electro-optical device 404 .

[0153]

[0181] 10B and may be secured to the central structure 1012. The support structure may be secured to the central structure 1012 such that there is substantially no relative movement between the support structure and the central structure 1012.

[0154]

[0182] The flexure arrangement therefore includes a moveable body 1010 that can be moved in the xy plane and in Rz by actuators 1007, 1008, 1009. As described with respect to the first embodiment, a position detection system can determine the movement and / or position of each actuator arm or moveable body. These determinations can be used to estimate the movement and / or position of the support arrangement and, ultimately, the movement and / or position of the electro-optical device 404 (not shown).

[0155]

[0183] The xy flexure arrangement may be a single structure. Alternatively, the xy flexure arrangement may include multiple stacked flexures. For example, it may include a first flexure for movement in a first direction by a first actuator 1007 and a second linear flexure for movement in a second direction by a second actuator 1008.

[0156]

[0184] In an alternative implementation of the xy flexure configuration, the receiving portion 1015 may be connected directly to the intermediate structure 1013 by a first connector instead of the first connector connecting to the central structure 1012. Movement in a first direction by the first actuator 1007 advantageously exerts a smaller force on the leaf spring 1022. The spring 1020 may also be located between the central structure 1012 and the intermediate structure 1013 instead of between the central structure 1012 and the outer structure 1014. Movement in a second direction by the second actuator 1008 advantageously exerts a smaller force on the leaf spring 1021.

[0157]

[0185] In a preferred implementation of the second embodiment, the Rz flexure arrangement is fixed directly to the body of the module, and the xy flexure arrangement is provided above and fixed only to the Rz flexure arrangement. In this implementation, the forces applied by the first linear actuator 1007 and the second linear actuator 1008 are substantially along the longitudinal axes of the crossbars of the Rz flexure arrangement. However, embodiments also include the xy flexure arrangement being fixed directly to the body of the module, and the Rz flexure arrangement being provided above and fixed only to the xy flexure arrangement.

[0158]

[0186] According to the third embodiment, the support positioning system includes a plurality of piezo actuator arrangements configured to move the stage. The support positioning system according to the third embodiment may be used instead of the support positioning system described in the first and / or second embodiments. Unlike the first and second embodiments, the actuators may be included within the module. Embodiments also include using elements of the support positioning system according to the third embodiment in addition to those described in the first and / or second embodiments. In such a configuration, the actuators may be located both within the module and external to the module.

[0159]

[0187] The third embodiment is shown in Figures 11A-11I. Figure 11A shows a schematic plan view of a cross section through module 405 in a plane orthogonal to charged particle path 403. Figure 11B shows a schematic plan view of a cross section through module 405 in a plane containing charged particle path 403. Figures 11C-11E show schematic plan views of stage 1109 illustrating the operating state of the piezo actuator arrangement of a first implementation of the third embodiment.

[0160]

[0188] As shown in FIGS. 11C-11E, for example, there may be three piezoelectric actuator configurations 1101, 1102, and 1103 equidistantly spaced around the periphery of the stage 1109. All of the piezoelectric actuator configurations 1101, 1102, and 1103 may contact the same major surface of the stage 1109, for example, the major surface of the stage 1109 facing the module 405 as shown in FIG. 11B. In a plan view, all of the piezoelectric actuator configurations 1101, 1102, and 1103 overlap the stage 1109. For each of the piezoelectric actuator configurations 1101, 1102, and 1103, a contact pad may be provided between the piezoelectric actuator and the stage 1109. The contact pad may be ceramic or a different material along with an insulating layer.

[0161]

[0189] Each piezo actuator configuration 1101, 1102, 1103 may be, for example, a dual-axis shear-mode piezo actuator. As shown in FIG. 11B, each piezo actuator configuration 1101, 1102, 1103 may include two stacks of piezo actuators. Each piezo actuator in each stack may be arranged to move the stage in two opposing directions. Each piezo actuator configuration 1101, 1102, 1103 may include two piezo actuators arranged such that movement of the stage by one piezo actuator is orthogonal to movement of the stage by the other piezo actuator.

[0162]

[0190] Each piezo element 1101, 1102, 1103 may be acted upon by a resilient member, such as a spring 1104, 1105, or other force-applying device. Although not shown in FIG. 11B , each spring may be a coil spring. Each spring 1104, 1105 is positioned to contact a major surface of the stage 1109 opposite the corresponding piezo actuator 1101, 1102, 1103 acted upon by the spring 1104, 1105. The springs 1104, 1105 thereby press the stage 1109 against the piezo actuators 1101, 1102, 1103. As shown in FIGS. 11A and 11B , the piezo element 1101 is acted upon by the spring 1104, and the piezo element 1102 is acted upon by the spring 1105.

[0163]

[0191] The piezo arrangements 1101, 1102, 1103 can be controlled to linearly move the stage in a first direction (which may be the x direction), to linearly move the stage in a second direction (which may be orthogonal to the first direction, i.e., the y direction), and to rotate the stage 1109 in the plane of the stage 1109 (which may be an Rz movement).

[0164]

[0192] As shown in Figure 11C, all of the piezo arrangements 1101, 1102, 1103 can be operated to generate differently induced linear forces, the net effect of which is a force that rotates the stage. The direction of rotation can be changed by changing the direction of linear movement of all of the piezo arrangements 1101, 1102, 1103.

[0165]

[0193] As shown in Figure 11D, all of the piezo arrangements 1101, 1102, 1103 can be operated to generate differently induced linear forces, the net effect of which is a force that moves the stage linearly in the x-direction. The direction of movement can be changed by changing the direction of linear movement of all of the piezo arrangements 1101, 1102, 1103.

[0166]

[0194] 11E, all of the piezo arrangements 1101 and 1102 can be operated to generate differently induced linear forces, the net effect of which is a force that moves the stage linearly in the y direction. The direction of movement can be changed by changing the direction of linear movement of the piezo arrangements 1101 and 1102.

[0167]

[0195] A second implementation of the third embodiment is shown in Figures 11F-11I. The second implementation can differ from the first implementation by having at least two of the piezoelectric actuator arrangements 1106, 1107, 1108 be three-axis shear-mode piezoelectric actuators. The stacked arrangement of three piezoelectric actuators provides additional mobility, which can improve the precision of the movement imparted by the piezoelectric actuator arrangements 1106, 1107, 1108 in the x and y directions, as well as the rotational movement about Rz.

[0168]

[0196] The second implementation may also differ from the first implementation in the orientation of the piezo actuator arrangements 1106, 1107, 1108. In the second implementation, each of the piezo arrangements 1106, 1107, 1108 may be preloaded by springs 1104, 1105 or other force application devices, as described with respect to the first implementation.

[0169]

[0197] FIG. 11F shows a schematic plan view of the stage 1109 showing the orientation of the piezo actuator arrangements 1106, 1107, 1108 in the second implementation.

[0170]

[0198] FIG. 11G illustrates possible operating states of the first piezo actuator 1106a, the second piezo actuator 1106b, and the third piezo actuator 1106c in the piezo actuator configuration 1106. Each piezo actuator is arranged to linearly move the stage 1109 in two opposing directions. The movement imparted by the first piezo actuator 1106a may be in the y-direction. The movement imparted by the second piezo actuator 1106b may be in the x-direction. The third piezo actuator 1106c may impart linear movement oblique to the directions of movement imparted by the first and second piezo actuators, i.e., not parallel or orthogonal to the directions of movement imparted by the first and second piezo actuators. The direction of movement imparted by the third piezo actuator 1106c may be substantially tangential to the nearest portion of the periphery of the stage 1109, thereby being arranged to impart rotation to the stage 1109.

[0171]

[0199] FIG. 11H illustrates possible operating states of the first piezo actuator 1107a, the second piezo actuator 1107b, and the third piezo actuator 1107c in the piezo actuator configuration 1107. Each piezo actuator is arranged to linearly move the stage in two opposing directions. The movement imparted by the first piezo actuator 1107a may be in the y-direction. The movement imparted by the second piezo actuator 1107b may be in the x-direction. The third piezo actuator 1107c may impart linear movement oblique to the directions of movement imparted by the first and second piezo actuators, i.e., not parallel or perpendicular. The direction of movement imparted by the third piezo actuator 1107c may be substantially tangential to the nearest portion of the periphery of the stage 1109, thereby being arranged to impart rotation to the stage 1109.

[0172]

[0200] The piezoelectric actuator arrangement 1108 may include only a stack of two piezoelectric actuators. Figure 11I illustrates possible operating states of the first piezoelectric actuator 1108a and the second piezoelectric actuator 1108b in the piezoelectric actuator arrangement 1108. Each piezoelectric actuator arrangement is arranged to move the stage linearly in two opposite directions. The movement provided by the first piezoelectric actuator 1108a may be in the y-direction. The movement provided by the second piezoelectric actuator 1108b may be in the x-direction.

[0173]

[0201] The stack may include a spacer 1108c, or blank, so that it is the same height as the other stacks.

[0174]

[0202] 11F-11I allows the stage to be moved in the x and y directions simply by actuating the piezo actuators in each stack arranged to provide movement in those directions. The stage can be rotated by providing movement by the third piezo actuators 1106c and 1107c and movement by the second piezo actuator 1108b.

[0175]

[0203] In the first and second implementations of this embodiment, the end of the preload spring may move on the surface of the stage 1109 when the stage is moved. To avoid this, the first and second implementations of this embodiment may alternatively have corresponding piezo actuator arrangements arranged to act on both the up beam principal surface and the down beam principal surface of the stage. That is, a preload spring, or other force application device, may contact a first piezo actuator arrangement in contact with the up beam principal surface stage 1109. A second piezo actuator arrangement corresponding to the first piezo actuator arrangement and arranged in line with the first piezo actuator arrangement in the z-direction may contact the down beam principal surface stage 1109 and the base of the module. Contact pads may be provided between each component.

[0176]

[0204] In this embodiment, the support structure may be part of the stage 1109 configured to hold the electro-optical device 404. Alternatively, the support structure may be a separate component secured to the stage 1109.

[0177]

[0205] According to a fourth embodiment shown in Figures 12A-12D, a support positioning system includes a plurality of piezoelectric actuator arrangements 1201, 1202, 1205, 1206 configured to move a stage. The support positioning system according to the fourth embodiment may be used in place of the support positioning systems described in the first, second, and / or third embodiments. Embodiments also include where elements of the support positioning system according to the fourth embodiment are used in addition to those described in the first, second, and / or third embodiments.

[0178]

[0206]

[0179]

[0207] 12A shows a schematic plan view of module 405. The module includes piezo arrangement 1205 and piezo arrangement 1206. Piezo arrangement 1205 can be arranged such that it can move piezo arrangement 1206 bidirectionally in the x direction. Piezo arrangement 1206 can be arranged such that it can move the portion of module 405 that includes the stage bidirectionally in the y direction. Embodiments also include piezo arrangement 1205 alternatively imparting movement in the y direction and piezo arrangement 1206 alternatively imparting movement in the x direction. Module 405 also includes one or more piezo arrangements for imparting bidirectional rotation to the stage about Rz.

[0180]

[0208] FIG. 12B is a schematic plan view of the portion of module 405 that includes the stage and piezo actuator arrangements 1201, 1202.

[0181]

[0209] 12B, the support positioning system can include two piezo arrangements 1201, 1202. In this embodiment, the piezo arrangements 1201, 1202 can be on opposite sides of the stage. That is, the piezo actuator arrangement 1201 can contact the sidewall of the stage at a first location, and the piezo actuator arrangement 1202 can contact the sidewall of the stage at a second location, e.g., diametrically opposite the first location.

[0182]

[0210] In the fourth embodiment, each piezo arrangement 1201, 1202 may include one or more piezo actuators arranged to move in both linear directions along a first axis (which may be the x-axis). Each piezo actuator arrangement 1201, 1202 may also include a block that is the portion of the piezo actuator arrangement 1201, 1202 that is moved by the piezo actuator arrangement 1201, 1202 and presses against a sidewall of the stage. Contact pads may be provided between each piezo actuator arrangement and the stage, as described above with respect to the third embodiment.

[0183]

[0211] Each of the piezoelectric actuator configurations 1201, 1202 may be preloaded by a spring 1203, 1204, or other force-applying device. The spring 1203 is positioned on the opposite side of the piezoelectric actuator configuration 1201 from the stage and is positioned to press the piezoelectric actuator configuration 1201 against the stage. Similarly, the spring 1204 is positioned on the opposite side of the piezoelectric actuator configuration 1202 from the stage and is positioned to press the piezoelectric actuator configuration 1202 against the stage, thereby holding the stages under compression by the piezoelectric actuator configurations 1201, 1202. As shown in FIG. 12B , the piezoelectric actuator configuration 1201 is preloaded by the spring 1203, and the piezoelectric configuration 1202 is preloaded by the spring 1204.

[0184]

[0212] In the fourth embodiment, the stage can be moved in the x-direction by a piezo actuator arrangement 1205. The stage can be moved in the y-direction by a piezo actuator arrangement 1206.

[0185]

[0213] If piezo actuator arrangement 1201 and piezo actuator arrangement 1202 are arranged to move in opposite directions but by the same amount, the stage will be rotated about Rz.

[0186]

[0214] 12C, the piezoelectric actuator arrangements 1201 and 1202 may be provided in the same plane as the stage. The piezoelectric actuator arrangements 1201 and 1202 may be arranged as bearings that support the stage and may impart rotation to the stage.

[0187]

[0215] Figure 12D shows an alternative configuration to that shown in Figure 12C. The stage is mounted on mechanical bearings to support the stage. Piezo actuator arrangements 1201 and 1202 can impart rotation to the stage without being the primary support for the stage.

[0188]

[0216] Embodiments also include support configurations for the stage that are alternatives to using mechanical bearings. The stage may include a circular groove located on a fixed support. One or more biasing members, such as leaf springs, may be provided to urge the stage against the support.

[0189]

[0217] In this embodiment, the support structure may be part of a stage configured to hold the electro-optical device 404. Alternatively, the support structure may be a separate component fixed to the stage.

[0190]

[0218] The fifth embodiment shown in Figure 13 differs from the fourth embodiment by the support positioning system including a single piezo actuator arrangement 1302 configured to rotate the stage.

[0191]

[0219] FIG. 13 shows a schematic plan view of the stage and the portion of the module 405 that contains the piezo actuator arrangement 1302 for rotating the stage.

[0192]

[0220] The piezo actuator arrangement 1302 may be the same as one of the piezo actuator arrangements 1201, 1202 as already described in the fifth embodiment. The piezo actuator arrangement is therefore capable of linear movement.

[0193]

[0221] The piezoelectric actuator arrangement 1302 is adjacent to and in contact with the stage in a plan view. The piezoelectric actuator arrangement 1302 may be preloaded by a spring 1301 or other force application device. The spring 1301 is positioned on the opposite side of the piezoelectric actuator arrangement 1302 from the stage and is positioned to press the piezoelectric actuator arrangement 1302 against the stage.

[0194]

[0222] Linear translation of the piezo actuator arrangement 1302 in a direction tangential to the stage causes the stage to rotate.

[0195]

[0223] Linear movement of the stage may be provided by a piezo actuator arrangement 1205, 1206 as previously described with respect to the fourth embodiment.

[0196]

[0224] The stage may be mounted on mechanical bearings to support the stage, as shown in Figure 12D. Alternatively, the stage may include a circular groove, as previously described with respect to the fourth embodiment.

[0197]

[0225] In this embodiment, the support structure may be part of a stage configured to hold the electro-optical device 404. Alternatively, the support structure may be a separate component fixed to the stage.

[0198]

[0226] In all of the above third to fifth embodiments, a position detection system may be provided, which may include an encoder for determining the movement and / or position of each piezo arrangement and, therefore, the stage.

[0199]

[0227] The first to fifth embodiments described above allow for repositioning of the support structure within the module 405. The electron-optical device 404, which is secured to the support structure, can thereby have fine adjustments made to its position, as may be needed to properly align the electron-optical device 404 with other components of the charged particle device 401. The first to fifth embodiments described above may be capable of moving the electron-optical device 404 in several degrees of freedom. Specifically, the first to fifth embodiments described above may be capable of making fine adjustments to the position of the electron-optical device 404 in the x-y plane and rotating it about the z-axis. Embodiments also include adapting the described first to fifth embodiments to provide only one or two degrees of freedom of fine alignment. For example, embodiments include configurations capable of providing bidirectional fine position adjustments along a single axis in the x-y plane, or orthogonal fine position adjustments in the x-y plane but without Rz movement, or only Rz movement.

[0200]

[0228] Embodiments also include the following techniques for positioning the electro-optical device 404 within the module 405.

[0201]

[0229] According to the sixth embodiment, a technique is provided for engaging a module 405 with a housing of a charged particle device 401. The technique of the sixth embodiment may be applied together with any of the techniques of the first to fifth embodiments described above.

[0202]

[0230] FIG. 14A shows a schematic diagram of a module 405 fixed to a charged particle device 401 according to a sixth embodiment.

[0203]

[0231] As described above with reference to Figure 7, the module 405 includes a module flange 701 and a body 702. As shown in Figures 14A and 14B, the charged particle device 401 also includes a flange 1401, referred to herein as the housing flange 1401. The process of securing the module 405 to the charged particle device 401 includes inserting the module 405 into the charged particle device 401 and engaging the module flange 701 with the housing flange 1401. After the module flange 701 is engaged with the housing flange 1401, the module flange 701 may be secured to the housing flange 1401 by any known technique. For example, the module flange 701 may be bolted onto the housing flange 1401.

[0204]

[0232] The module flange 701 and the housing flange 1401 include corresponding mating surfaces that engage with each other. As shown in FIG. 14B , in the plane of the mating surface of the housing flange 1401, the shape of the mating surface may be that of a rectangular mating surface surrounding a rectangular opening. The mating surface of the module flange 701 may have a corresponding shape. The opposing surfaces of the module flange 701 and the housing flange 1401 may match each other to provide a seal when secured together. The opposing surfaces may be coplanar and flat. A vacuum seal may be provided to ensure that the connection between the module flange 701 and the housing flange 1401 is airtight when closed, so that a vacuum can be created in the portion of the charged particle device 401 that includes the module 405. The vacuum seal may be opened when the module is removed from the charged particle device 401.

[0205]

[0233] As also shown in FIG. 14B , the housing flange 1401 can include two or more alignment pins 1402, 1403 protruding from its surface. Preferably, there are two alignment pins, and the alignment pins are provided on either side of the opening in the housing flange 1401. The module flange 701 can include corresponding recesses for receiving the alignment pins. The alignment pins can be inserted into the corresponding recesses when the module 405 is inserted into the charged particle device 401. Insertion of the alignment pins into the respective recesses advantageously enables coarse positioning of the module 405 in the charged particle device 401. Specifically, through direct engagement between the module flange 701 and the housing flange 1401, the module 405 is positioned along the charged particle path 403, which may be in the z-direction. In this embodiment, the module 405 can also be coarsely positioned in the direction between the alignment pins, which may be in the y-direction. The module 405 may also be coarsely positioned relative to the direction of insertion of the module 405 into the charged particle path 403, which may be the x-direction. The module 405 may also be coarsely positioned relative to rotation about the x-direction (i.e., Rx), rotation about the y-direction (i.e., Ry), and rotation about the z-direction (i.e., Rz). Thus, the module 405 may be coarsely positioned with six degrees of freedom in a plane orthogonal to the charged particle path of the charged particle device.

[0206]

[0234] Embodiments also include alternative implementations in which module flange 701 includes alignment pins and housing flange 1401 includes corresponding recesses. Alternatively, both module flange 701 and housing flange 1401 may include alignment pins and corresponding recesses.

[0207]

[0235] The alignment pins and corresponding recesses may both have circular cross sections. However, embodiments also include alignment pins having elliptical cross sections. Alternatively or additionally, the recesses may be slot-shaped instead of circular. The use of non-circular alignment pins and / or recesses may allow alignment tolerances to be smaller than manufacturing tolerances.

[0208]

[0236] According to the seventh embodiment, the module 405 is configured so that the position of the support positioning system within the module 405 can be adjusted.

[0209]

[0237] 15A shows a cross section through a portion of the body 702 of the module 405 in a plane containing the charged particle path 403. The support positioning system of the module 405 is in accordance with the first embodiment of the module as described above with reference to FIGS.

[0210]

[0238] The support positioning system is supported on the body 702 of the module 405 by a plurality of adjustable supports 1501, 1502. The adjustable supports 1501, 1502 may be, for example, adjustable spring-loaded bolts or adjustable fasteners (such as pins with tightening bolts). There may be a corresponding adjustable support 1501, 1502 for each ball bearing 804 in contact with the up beam and / or down beam faces of the disk. For example, there may be three adjustable supports equally spaced around the support positioning system.

[0211]

[0239] Each adjustable support 1501, 1502 may include a hemispherical end and a longitudinal body. The longitudinal body may be an unthreaded pin. The hemispherical end of each adjustable support 1501, 1502 may be received by a conical or V-shaped recess in the base plate 1505. The body 702 of the module 405 may include portions 1503, 1504 with channels for receiving the longitudinal body of each adjustable support 1501, 1502. The extent to which each adjustable support 1501, 1502 is inserted into the channel may be adjustable. For example, the longitudinal body of each adjustable support 1501, 1502 may be moved anywhere within the corresponding channel and then secured in place. The longitudinal body of each adjustable support 1501, 1502 may be secured in place within the channel by a tightening bolt arrangement such as that shown in FIG. 15B. 15B includes a threaded bolt 1506 and a press piece 1507. The threaded bolt 1506 and press piece 1507 are disposed in a channel that may be perpendicular to the channel for the longitudinal body of the adjustable support 1501. When the bolt is rotated so that the end of the bolt presses against the press piece 1507, the press piece 1507 presses against the longitudinal body, thereby fixing the position of the longitudinal body within the channel. Rotating the bolt 1506 in the opposite direction releases the force applied to the longitudinal body, allowing it to move along the channel.

[0212]

[0240] Thus, the z-direction separation of each portion 1503, 1504 and base plate 1505 can be adjusted by adjusting the extent to which each adjustable support 1501, 1502 is inserted into its respective channel.

[0213]

[0241] 15A, ball bearings 804 may contact the upbeam surfaces of the disks and also module plates 802. Each module plate 802 is biased to apply a force to ball bearings 804 such that ball bearings 804, disks, and ball bearings 803 are all held under compression between module plate 802 and base plate 1505. Thus, the plane of the disks, and thus the entire support positioning system, can be held parallel to and in a substantially fixed relationship with the upper surface of base plate 1505.

[0214]

[0242] Sections 1503, 1504 may be fixedly connected to flange 701 of module 405 such that they cannot move substantially relative to flange 701. The base plate may only be connected to the rest of the module by adjustable supports 1501, 1502. As a result, the z-position of the base plate relative to flange 701 can be adjusted by adjusting the amount that adjustable supports 1501, 1502 are inserted into the corresponding sections 1503, 1504. By making different adjustments to all of the adjustable supports 1501, 1502, the base plate, and thus the entire support positioning system, can be tilted in Rx and Ry as well as adjusted in the z-direction.

[0215]

[0243] As a result, in this embodiment, when the module 405 is outside the charged particle device 401, each adjustable support 1501, 1502 can be manually and / or automatically operated to adjust the position of the support positioning system relative to the flange 701 of the module 405. Thereby, the z position and tilt, i.e., Rx and Ry states, of the support positioning system and thus the electron-optical device 404 can be set by the adjustable supports 1501, 1502 before the module 405 is inserted into the charged particle device 401. Thus, the position of the electron-optical device 404 and its support arrangement can be adjusted in z, Rx, and Ry relative to the flange 701 of the module 405, and also relative to the housing flange 1401 if the two flanges are fixed to each other. Thus, the position of the electron-optical device 404 can be pre-calibrated (i.e., pre-adjusted) relative to the charged particle device, for example, to a frame (not shown) of the charged particle device, before the module 405 is inserted into the charged particle device 401. Thus, after mounting the module 405 on the charged particle device 401, the support arrangement and the supported electron-optical device 404 are coarsely positioned at a desired location relative to the frame.

[0216]

[0244] The adjustment of the z position and / or tilt, i.e., the Rx and Ry states, of the electro-optical device 404 relative to the flange 701 of the module 405 according to the seventh embodiment may be referred to as a pre-calibration operation. In addition to the techniques of the sixth embodiment and any of the first to fifth embodiments, the technique of the seventh embodiment may be applied.

[0217]

[0245] According to the eighth embodiment, further techniques are applied for aligning the electron-optical device 404 with the source beam. After the module 405 containing the electron-optical device 404 is fixed to the charged particle apparatus 401, electron-optical alignment techniques can be used to align the source beam with the electron-optical device 404. For example, electric and magnetic charged particle manipulators, such as deflectors and lenses (not shown), may be used in the up-beam of the module 405 to control the path of the source beam so that it is properly aligned with the electron-optical device 404. For example, a manipulator, such as a multipole-type deflector, may be used to adjust the beam path in an axis perpendicular to the beam path, such as the x-axis and / or y-axis. A set of two deflectors may be used along the beam path to adjust in each axis. The first deflector of each pair applies a correction to the path, and the second deflector of each set redirects the beam along a path corresponding to the desired angle of incidence to the device (which may correspond to the angle of incidence of the beam path relative to the first deflector of the set). Due to the redirection of the second deflector of the set, the correction of the first deflector of each set is effectively an overcorrection. A micro-deflector array 323 may be used for this electrostatic correction, for example, if it were located in the up-beam of the module. A condenser lens arrangement, such as condenser lens 210 or 310, may be controlled to apply a correction in Rz to the path of the beam. Electric and magnetic charged particle manipulators, such as deflectors and lenses (not shown), may additionally and / or alternatively be used in the down-beam of module 405 to control one or more paths of the beam or multi-beams output from module 405.

[0218]

[0246] In addition to or instead of one or more of the techniques of the first to seventh embodiments, the electron-optical alignment technique of the eighth embodiment may be applied. Specifically, the alignment process of the electron-optical device 404 with the charged particle beam or multi-beams may include determining the locations of one or more beams that have passed through the electron-optical device and / or one or more beams that have been reflected by the electron-optical device, and then applying fine position adjustments according to the determined beam locations. The fine position adjustments may include mechanical adjustments using the techniques of the first to fifth embodiments and / or the electron / electron-optical alignment technique of the eighth embodiment.

[0219]

[0247] The range of repositioning provided by the pre-calibration technique of the seventh embodiment depends on the module design. The z-direction adjustment may range from less than 50 μm to more than 200 μm. The Rx and Ry adjustments may range from less than 0.1 mrad to more than 1 mrad.

[0220]

[0248] The sixth embodiment may be referred to as a coarse positioning technique. The sixth embodiment may be used to position the electron-optical device 404 in x, y, and z to within 50 μm to 200 μm relative to the vacuum chamber for a module in a charged particle instrument. The Rx, Ry, and Rz positions may be between 1 mrad and 5 mrad relative to the vacuum chamber.

[0221]

[0249] The techniques of the sixth and seventh embodiments can position the electron-optical device within a known range of locations relative to the vacuum chamber. However, due to variations in the position of the charged particle beam path, the electron-optical device may be within 1 mm in the x and / or y directions of the charged particle beam path and within 100 mrad in Rz of the charged particle beam path.

[0222]

[0250] The first to fifth and eighth embodiments are sometimes referred to as fine positioning techniques, and can be used to align the electro-optical device 404 with a charged particle beam or multi-beam.

[0223]

[0251] The first to fifth embodiments may be capable of moving the electro-optical device in the x and / or y directions by 0.5 μm to 100 μm, and of imparting a rotation of up to 1 rad in Rz.

[0224]

[0252] The eighth embodiment may be able to move the charged particle beam path in the x and / or y directions by up to 2 mm and to provide a rotation in Rz of up to 1 rad. The eighth embodiment may be able to move the charged particle beam path in the z direction by changing the focus of the charged particle beam or multi-beam.

[0225]

[0253] Embodiments also include applying manual and / or automated repositioning techniques to other components of the charged particle device 401. For example, the source 402 and / or the objective lens may be moved. For example, the source beam may first be aligned with the objective lens, and then techniques according to any of the embodiments described herein may be applied to align the charged particle beam or multi-beam with the electron-optical device 404.

[0226]

[0254] The embodiment also includes a method of installing an electron-optical device 404 in a charged particle device 401. The method may include one or more of the following steps: attaching the electron-optical device 404 to a module 405; performing a pre-calibration process to adjust the relative positions of the electron-optical device 404 and the module 405; making a coarse adjustment to an Rx state of the electron-optical device 404 relative to a body 702 of the module 405; making a coarse adjustment to an Ry state of the electron-optical device 404 relative to a body 702 of the module 405; making a coarse adjustment to a z position of the electron-optical device 404 relative to a body 702 of the module 405; and / or fixing the module 405 to the charged particle device 401. The module 405 may be a module according to any of the first to fifth embodiments described above. The pre-calibration process may be according to the seventh embodiment described above. The coarse alignment process may be according to the sixth embodiment described above.

[0227]

[0255] After a module 405 including an electron-optical device 404 is secured to the charged particle instrument 401, embodiments include a method for aligning the electron-optical device 404 with a charged particle beam or multi-beam within the charged particle instrument 401. The method may include one or more of the following steps: making fine adjustments to an x-position of the electron-optical device 404 relative to a body 702 of the module 405; making fine adjustments to a y-position of the electron-optical device 404 relative to a body 702 of the module 405; making fine adjustments to an Rz state of the electron-optical device 404 relative to a body 702 of the module 405; and / or making adjustments to a path of the charged particle beam or multi-beam within the charged particle instrument 401. The module 405 may be a module 405 according to any of the first to fifth embodiments described above. The adjustments made to the path of the charged particle beam or multi-beam within the charged particle instrument may be according to the techniques of the eighth embodiment described above.

[0228]

[0256] The above method of installing the electron-optical device 404 in the charged particle device 401 may be applied together with the above method of aligning the electron-optical device 404 with a charged particle beam or multi-beam within the charged particle device 401 .

[0229]

[0257] A method for replacing an electron-optical device 404 in a charged particle device 401 may include turning off the power supply to the source, closing a valve isolating a vacuum chamber containing the module 405, venting the vacuum chamber, releasing the vacuum seal of the vacuum chamber, removing the module 405 from the charged particle device 401, inserting a replacement module 405 into the charged particle device 401, sealing the vacuum seal of the vacuum chamber, pumping the vacuum chamber to restore the vacuum chamber to a vacuum state and baking the module 405, opening the valve isolating the vacuum chamber, performing mechanical fine alignment, turning on the power supply to the source, performing a high voltage test, and performing electrical fine alignment of the electron-optical device 404 and the charged particle path 403.

[0230]

[0258] FIG. 17 shows a flowchart of a method for installing an electron-optical device in a charged particle instrument according to an embodiment.

[0231]

[0259] In step 1701, the method begins.

[0232]

[0260] In step 1703, an electro-optical device is attached to the module.

[0233]

[0261] In step 1705, coarse adjustments are made to the Rx state, Ry state, and / or z position of the electro-optical device relative to the body of the module.

[0234]

[0262] In step 1707, the module is secured to the charged particle device.

[0235]

[0263] In step 1709, the method ends.

[0236]

[0264] FIG. 18 shows a flowchart of a method for aligning an electron optical device with a charged particle beam or multi-beams in a charged particle device according to an embodiment.

[0237]

[0265] In step 1801, the method begins.

[0238]

[0266] In step 1803, a module containing the electron-optical device is secured to the charged particle instrument, thereby installing the electron-optical device within the charged particle instrument.

[0239]

[0267] In step 1805, one or more fine adjustments are made to the x position, y position, and / or Rz state of the electro-optical device relative to the body of the module.

[0240]

[0268] In step 1807, adjustments are made to the path of the charged particle beam or multi-beams within the charged particle device.

[0241]

[0269] In step 1809, the method ends.

[0242]

[0270] The embodiments include numerous modifications and variations to the above techniques.

[0243]

[0271] In the above embodiment, the body 702 of the module 405 is permanently fixed to the module flange 701. Embodiments also include the fixed, and optionally permanent, presence of a body-equivalent feature of the module 405 within the charged particle device 401. The flange-equivalent feature (not shown) is separate from the body and is effectively a removable cover for accessing the body-equivalent feature. The electronic optical device can be replaced by removing the flange, thereby accessing the electronic optical device on the body-equivalent feature. In such an arrangement, where the flange is separate and mechanically independent from the rest of the module, including the support and device, the module has engagement features, preferably columns, that interact with engagement features within the device for coarse alignment of the module, and thus the device, with respect to the frame of the device. The device and module engagement features may take the form of drawers that allow alignment of the module with respect to the frame in all degrees of freedom and may include flange and pin features adapted for this configuration and adapted from the sixth embodiment.

[0244]

[0272] Throughout several embodiments, techniques for positioning electro-optical devices are described.

[0245]

[0273] Vacuum locks may also be provided elsewhere in the charged particle device 401 and the tool that includes the charged particle device 401. For example, as shown in Figure 16, there may be a source vacuum lock (not shown) between the upbeam vacuum lock 406 and the source 402. The source vacuum lock allows the area of ​​the charged particle device 401 that includes the source 402 to be isolated from the rest of the charged particle device 401, allowing for reduced time to replace the source 402. The source 402 may be contained by a replaceable module such that the source 402 is field replaceable.

[0246]

[0274] 16, a vent / pump valve 1601 may be provided in a module region 1607 separated by an up beam valve 406 and a down beam valve 407. When a module 405 is replaced, the vent / pump valve 1601 can be used to both vent and pump the module region 1607. With the up beam valve 406 open and the down beam valve 407 closed, the vent / pump valve 1601 can also be used to vent and pump the source region 1606. With the module region 1607 vented, the module 405 can be removed.

[0247]

[0275] With the source region vented and the upbeam valve closed, the source module including source 402 and source region 1606 can be removed from the apparatus. In another arrangement, the source region can have a designated vent / pump valve. The source region can be operated independently from module region 1607. The source module may be field replaceable.

[0248]

[0276] As shown in FIG. 16 , a tool including the charged particle device 401 may also include a secondary column 1605 including a detector (not shown) and a probe (not shown). The detector may be configured to detect electrons, e.g., secondary electrons, from the sample. An up-beam vacuum lock 1602 and a down-beam vacuum lock 1603 may be provided in the up-beam and down-beam of the detector, providing a separated detector region 1608 in the secondary column. A vent / pump valve 1604 may be provided in the detector region 1608 separated by the up-beam valve 1602 and the down-beam valve 1603. Thus, the detector may also be field replaceable. The vent / pump valve 1604 may also be used to vent and pump the probe region 1609 with the up-beam valve 1602 closed and the down-beam valve 1603 open.

[0249]

[0277] In some arrangements, the device may include two or more modules 405, which may be located in one or more separable and / or independently operable module areas. A detector column may have one or more modules in one or more separable and / or independently operable module areas. Each additional module may be field replaceable.

[0250]

[0278] Embodiments also include where the device supported by module 405 is a different type of device than electro-optical device 404 .

[0251]

[0279] The charged particle device 401 may in particular be a multi-beam charged particle device, which may include any of the components of the devices described above with reference to FIGS.

[0252]

[0280] The multi-beam charged particle device may be a component of an inspection (or metro inspection) tool or part of an electron beam lithography tool. Multi-beam charged particle devices can be used in many different applications, including not only SEM but also electron microscopy in general, and lithography.

[0253]

[0281] A multi-beam charged particle device may include two or more charged particle sources.

[0254]

[0282] Throughout the embodiments, a charged particle axis is described. This axis represents the path of the charged particles through and output from the source 201, 301. The output sub-beams of the multi-beam may all be substantially parallel to the charged particle optical axis 403. The charged particle optical axis 204, 304 may be the same as or different from the mechanical axis of the illumination device.

[0255]

[0283] The embodiments include the following:

[0256]

[0284] According to a first aspect of the present invention, there is provided a module for supporting a device configured to manipulate a charged particle path in a charged particle device, the module comprising: a support structure configured to support the device, the device configured to manipulate a charged particle path in the charged particle device; and a support positioning system configured to move the support structure within the module, the module being arranged in the charged particle device so as to be field replaceable.

[0257]

[0285] Preferably, when the module is in use in a charged particle instrument with the device held by the support arrangement, the charged particle path is substantially parallel to the charged particle axis of the charged particle instrument.

[0258]

[0286] Preferably, the support positioning system is configured to move the support arrangement with at least three degrees of freedom of movement.

[0259]

[0287] Preferably, the charged particle axis coincides with the z-axis, the module is a substantially planar structure in the xy-plane, and the at least three degrees of freedom of movement include movement in the xy-plane and rotation about the z-axis (Rz).

[0260]

[0288] Preferably, the support positioning system is a manual and / or automatic positioning system.

[0261]

[0289] Preferably, the support positioning system is configured to move the support structure to within about 0.5 μm to 100 μm of a desired position of the support structure and / or to impart a rotation of up to 1 rad in Rz to the support structure.

[0262]

[0290] Preferably, the module further comprises a position detection system configured to determine the movement and / or position of the support structure and / or a device carried by the support structure.

[0263]

[0291] Preferably, the position detection system includes grid marks, such as encoders, for use in determining the movement and / or position of the support structure and / or a device carried by the support structure.

[0264]

[0292] Preferably, the position detection system is configured to determine movement and / or position of the support structure and / or a device held by the support structure based on one or more features of the device held by the support structure.

[0265]

[0293] Preferably, the one or more features of the device include an array of apertures and / or one or more fiducials.

[0266]

[0294] Preferably, the array of apertures is for use in aligning substrates of a substrate stack comprised by the device during manufacture of the device.

[0267]

[0295] Preferably, the array of apertures is for charged particle paths through a beam manipulator contained by the device.

[0268]

[0296] Preferably, the module further includes a receiving portion configured to receive a respective end of the actuator arm.

[0269]

[0297] Preferably, the actuator arm is contained by an actuator external to the module, and the support positioning system is configured to be moved by the actuator.

[0270]

[0298] Preferably, the first receiving portion is arranged to receive an end of a first actuator arm for moving the support positioning system in a first direction, the second receiving portion is arranged to receive an end of a second actuator arm for moving the support structure by the support positioning system in a second direction which may be perpendicular to the first direction, and the third receiving portion is arranged to receive an end of a third actuator arm for rotating the support structure.

[0271]

[0299] Preferably, the first and second directions are in the xy plane and the rotation is about an axis, such as the z axis, that is orthogonal to the xy plane.

[0272]

[0300] Preferably, the support positioning system includes a disk and a plurality of load-bearing rotatable objects configured to support the disk within the module.

[0273]

[0301] Preferably, the disk has an up beam surface and a down beam surface, and a first set of one or more load-bearing rotatable objects is arranged to contact the up beam surface of the disk, and a second set of the plurality of load-bearing rotatable objects is arranged to contact the down beam surface of the disk.

[0274]

[0302] Preferably, the first set of load-bearing rotatable objects comprises one, two or three load-bearing rotatable objects, and the second set of load-bearing rotatable objects comprises three load-bearing rotatable objects.

[0275]

[0303] Preferably, the disk is arranged such that, in plan view, when the module is installed in a charged particle device, the charged particle path passes through an opening defined in the disk.

[0276]

[0304] Preferably, in plan view, the disc is substantially annular.

[0277]

[0305] Preferably, the disc is a substantially planar structure, preferably in the xy plane.

[0278]

[0306] Preferably, the disc includes a support structure.

[0279]

[0307] Preferably, the module includes a first force application device arranged to apply a force to the disk, the force being substantially in the same plane as the disk and for moving the disk in the plane, and the module includes a second force application device arranged to apply a force to the disk, the force being substantially in the same plane as the disk and for rotating the disk.

[0280]

[0308] Preferably, the first force application device is configured such that the force applied by the first force application device is substantially in a direction passing through the axis of rotation of the disc so that the force does not substantially rotate the disc.

[0281]

[0309] Preferably, in use the disc is compressed by a force from the first force application device, a force applied to the first receiving portion, and a force applied to the second receiving portion.

[0282]

[0310] Preferably, in use the second force applying device is arranged to apply a force urging the third receiving portion against the end of the third actuator arm.

[0283]

[0311] Preferably, the second force applying device is arranged to apply a force to a first protrusion from the side wall of the disc, and / or the third receiving portion comprises a second protrusion from the side wall of the disc.

[0284]

[0312] Preferably, the module includes a force application device arranged to apply a force to the disk, the applied force being substantially in the same plane as the disk, the applied force being for linearly moving the disk in the plane, and the applied force being for rotating the disk.

[0285]

[0313] Preferably, the module includes one or more axial force application devices arranged to hold the disk under compression between the first set of load-bearing rotatable objects and the second set of load-bearing rotatable objects.

[0286]

[0314] Preferably, each axial force applying device comprises a plate in contact with one of the load-bearing rotatable objects, and / or one or more of the axial force applying devices is a resilient member such as a spring.

[0287]

[0315] Preferably, the support positioning system includes a flexure arrangement.

[0288]

[0316] Preferably, the flexure configuration includes an Rz flexure configuration and an xy flexure configuration.

[0289]

[0317] Preferably, both the Rz flexure arrangement and the xy flexure arrangement are substantially planar structures, preferably in the xy plane.

[0290]

[0318] Preferably, the Rz flexure configuration and the xy flexure configuration are arranged in a stacked manner, with the Rz flexure configuration preferably being on the down beam of the xy flexure configuration.

[0291]

[0319] Preferably, in plan, the Rz flexure configuration includes a substantially circular structure that defines an opening in the Rz flexure configuration.

[0292]

[0320] Preferably, the centre of the substantially circular structure is substantially aligned with the z-axis.

[0293]

[0321] Preferably, in a plan view, the Rz flexure configuration comprises a cross, the cross comprising first and second cross bars intersecting at a cross point, the first cross bar aligned in a first direction in the plane of the Rz flexure configuration, and the second cross bar aligned in a second direction in the plane of the Rz flexure configuration, the second direction being orthogonal to the first direction.

[0294]

[0322] Preferably, the circular structure is located at the intersection of the first and second crossbars, and the circular structure is supported between the first and second portions of the first crossbar and between the first and second portions of the second crossbar.

[0295]

[0323] Preferably, the first cross bar is aligned with the first receiving portion and the second cross bar is aligned with the second receiving portion.

[0296]

[0324] Preferably, the Rz flexure arrangement includes a base and a moveable body.

[0297]

[0325] Preferably, the third receiving portion comprises a recess in a sidewall of the Rz flexure configuration.

[0298]

[0326] Preferably, the Rz flexure arrangement includes a rotational force application device configured to apply a force to rotate the moveable body.

[0299]

[0327] Preferably, in use, the rotational force applied by the rotational force application device is configured to urge the third receiving portion against the end of the third actuator arm.

[0300]

[0328] Preferably, the xy-flexure arrangement includes an outer structure, an intermediate structure, a central structure, and a plurality of leaf springs, wherein in the plane of the xy-flexure arrangement, the intermediate structure is substantially surrounded by the outer structure, the first receiving portion, and the second receiving portion, and wherein in the plane of the xy-flexure arrangement, the central structure is substantially surrounded by the intermediate structure, and the outer structure is connected to the intermediate structure by at least one leaf spring, and the intermediate structure is connected to the central structure by at least one leaf spring.

[0301]

[0329] Preferably, at least one leaf spring connecting the intermediate structure to the central structure is arranged such that the central structure is arranged to move in a first direction relative to the outer structure in response to a force applied to the first receiving portion, and at least one leaf spring connecting the outer structure to the intermediate structure is arranged such that the intermediate structure is arranged to move in a second direction relative to the outer structure in response to a force applied to the second receiving portion.

[0302]

[0330] Preferably, the intermediate structure is connected to the central structure by two leaf springs positioned on either side of the central structure, and the intermediate structure is connected to the outer structure by two leaf springs positioned on either side of the intermediate structure.

[0303]

[0331] Preferably, the module further includes a first biasing device arranged to apply a force such that the intermediate structure and / or the central structure are held under compression in a first direction, and a second biasing device arranged to apply a force such that the intermediate structure and / or the central structure are held under compression in a second direction.

[0304]

[0332] Preferably, the outer structure in an xy flexure configuration is fixed to the movable body in an Rz flexure configuration.

[0305]

[0333] Preferably, the first and / or second biasing devices are elastic members such as springs.

[0306]

[0334] Preferably, the support positioning system includes one or more linear actuators.

[0307]

[0335] Preferably, each actuator is a piezoelectric actuator arrangement.

[0308]

[0336] Preferably, each piezo actuator arrangement includes a dual-axis shear mode piezo device.

[0309]

[0337] Preferably, the support positioning system includes a plurality of actuators.

[0310]

[0338] Preferably, the number of actuators included by the support positioning system is three.

[0311]

[0339] Preferably, the support positioning system includes a stage.

[0312]

[0340] Preferably, in plan, the stage is substantially annular.

[0313]

[0341] Preferably, the actuators are spaced at substantially equal angular positions about the midpoint of the stage.

[0314]

[0342] Preferably, the actuators are aligned so that the angle between the longitudinal axes of adjacent actuators is 60 degrees.

[0315]

[0343] Preferably, the actuators are configured so that all of the actuators can be operated together to rotate the stage in the plane of the stage.

[0316]

[0344] Preferably, the actuators are configured such that all of the actuators can be operated together to move the stage in a first direction that is in the plane of the stage.

[0317]

[0345] Preferably, the actuators are configured such that all of the actuators can be operated together to move the stage in a second direction that is in the plane of the stage, the second direction being orthogonal to the first direction.

[0318]

[0346] Preferably, the module further includes one or more force applying devices, each force applying device arranged to apply a force urging the actuator against the stage.

[0319]

[0347] Preferably, in plan view, at least one actuator is arranged beside the stage and configured such that linear movement of the actuator rotates the stage, and for each actuator beside the stage there is a force application device configured to apply a force that presses the actuator against the stage.

[0320]

[0348] Preferably, there are two actuators beside the stage, one on each side of the stage.

[0321]

[0349] Preferably, the module further includes first and second linear actuators, the first linear actuator arranged to move the second linear actuator in a first direction, and the second linear actuator arranged to move at least one actuator arranged beside the stage in a second direction orthogonal to the first direction.

[0322]

[0350] According to a second aspect of the present invention, there is provided a module for supporting a device configured to manipulate the path of charged particles in a charged particle device, the module including a module flange configured to be attached to and detached from a housing flange of a housing of the charged particle device such that the module is field replaceable within the charged particle device.

[0323]

[0351] Preferably, with the module supporting the device, when the module is in use in the charged particle device, the device is configured to steer charged particle paths substantially along a charged particle axis of the charged particle device.

[0324]

[0352] Preferably, the charged particle axis coincides with the z-axis and the module is a substantially planar structure in the xy-plane.

[0325]

[0353] Preferably, the module flange includes one or more holes for receiving alignment pins of the housing flange, and / or the module flange includes one or more alignment pins for insertion into holes in the housing flange.

[0326]

[0354] Preferably, the module flange includes one or more alignment pins for insertion into the housing flange.

[0327]

[0355] Preferably, the module includes a device support structure for supporting a device, and a mechanism for adjusting the position of the device support structure with at least one degree of freedom of movement.

[0328]

[0356] Preferably, the device support system allows the position of the device support structure to be adjusted with three degrees of freedom of movement, preferably the z, Rx, and Ry position of the device support structure.

[0329]

[0357] Preferably, the mechanism for adjusting the z, Rx, and Ry positions of the device support arrangement includes one or more adjustable supports, such as an adjustable spring-loaded bolt, an adjustable fastener, or an adjustable pin.

[0330]

[0358] Preferably, the adjustable support is disposed around the device support arrangement.

[0331]

[0359] Preferably, the adjustable supports are spaced at substantially equal angular positions about a midpoint of the device support arrangement.

[0332]

[0360] Preferably, there are three adjustable supports.

[0333]

[0361] Preferably, the adjustable supports are individually adjustable.

[0334]

[0362] Preferably, the mechanisms for adjusting the z, Rx and Ry position of the device support arrangement are configured to be operated when the module is outside the charged particle device.

[0335]

[0363] Preferably, the module is a module according to either the first and / or second aspect.

[0336]

[0364] Preferably, the device support arrangement comprises a support positioning system and a support arrangement according to the first aspect.

[0337]

[0365] According to a third aspect of the present invention there is provided a charged particle device comprising a field replaceable module according to either the first and / or second aspect.

[0338]

[0366] Preferably, the module includes a device configured to manipulate charged particle paths in the charged particle instrument.

[0339]

[0367] Preferably, the charged particle device includes an actuator for moving the support positioning system of the module, the actuator being a linear actuator.

[0340]

[0368] Preferably, each actuator includes an actuator arm configured to engage a corresponding receiving portion included by the module.

[0341]

[0369] Preferably, the end of the actuator arm includes a roller bearing.

[0342]

[0370] Preferably, the device includes a beam manipulator arranged to manipulate sub-beams of the multi-beam of charged particles.

[0343]

[0371] Preferably, the charged particle device includes a housing flange configured to be attachable to and detachable from a module flange of the module.

[0344]

[0372] Preferably, the housing flange includes one or more alignment pins for insertion into corresponding openings in the module flange.

[0345]

[0373] Preferably, the module flange includes one or more alignment pins for insertion into corresponding openings in the housing flange.

[0346]

[0374] Preferably, the charged particle device further comprises a position detection system configured to determine the movement and / or position of the device.

[0347]

[0375] Preferably, the charged particle device further comprises a charged particle source and one or more manipulator arrangements configured to manipulate charged particle paths in the up beam and / or down beam of the device.

[0348]

[0376] Preferably, the one or more manipulator arrangements are configured to adjust the charged particle path and / or the module is configured to adjust the position of the device such that the charged particle path is aligned with the device.

[0349]

[0377] Preferably, the charged particle system further comprises a control system configured to control the one or more manipulator arrangements.

[0350]

[0378] Preferably, a first set of manipulator arrangements is provided on the up beam of the module and a second set of manipulator arrangements is provided on the down beam of the module.

[0351]

[0379] Preferably, one or more of the manipulator arrangements includes an electrostatic deflector for deflecting the charged particle path.

[0352]

[0380] Preferably, one or more of the manipulator arrangements includes a magnetic lens for deflecting the charged particle path.

[0353]

[0381] Preferably, the charged particle device further includes a source moving mechanism for adjusting the position of the source.

[0354]

[0382] Preferably, the charged particle device further includes an objective lens, and the charged particle device further includes a lens moving mechanism for adjusting the position of the objective lens.

[0355]

[0383] Preferably, at least one of the manipulator arrangements is configured to be controllable to manipulate the charged particle path from the source so as to be aligned with the device and the objective lens.

[0356]

[0384] Preferably, the charged particle device further includes an up beam vacuum lock on the up beam side of the module and a down beam vacuum lock on the down beam side of the module.

[0357]

[0385] Preferably, the up beam vacuum lock and the down beam vacuum lock are operable to isolate the region of the charged particle device containing the module from vacuum conditions in adjacent regions of the charged particle device.

[0358]

[0386] Preferably, the charged particle system further includes a source vacuum lock down the beam from the source.

[0359]

[0387] Preferably, the source vacuum lock is operable to isolate a region of the charged particle device including the source from vacuum conditions in adjacent regions of the charged particle device.

[0360]

[0388] Preferably, the source is contained by a field replaceable module.

[0361]

[0389] Preferably, the charged particle device further comprises a secondary column, the secondary column comprising a detector configured to detect electrons from the sample.

[0362]

[0390] Preferably, the secondary column further includes one or more vacuum locks for isolating the region of the secondary column including the detector from the vacuum conditions in one or more adjacent regions of the secondary column.

[0363]

[0391] Preferably, the detector is contained by a field replaceable module.

[0364]

[0392] According to a fourth aspect of the present invention, there is provided a method for installing an electron-optical device in a charged particle instrument, the method comprising: attaching the electron-optical device to a module; making coarse adjustments to the Rx state, Ry state and / or z position of the electron-optical device relative to a body of the module; and fixing the module to the charged particle instrument.

[0365]

[0393] Preferably, the module is a module according to the first and / or second aspect and may be a charged particle device.

[0366]

[0394] According to a fifth aspect of the present invention, there is provided a method for aligning an electron-optical device with a charged particle beam or multi-beam in a charged particle apparatus, the method comprising fixing a module including the electron-optical device to the charged particle apparatus, thereby installing the electron-optical device in the charged particle apparatus, making one or more fine adjustments to the x-position, y-position and / or Rz state of the electron-optical device relative to the body of the module, and making adjustments to the path of the charged particle beam or multi-beam in the charged particle apparatus.

[0367]

[0395] Preferably, before the electron-optical device is installed in the charged particle device, a module receiving area in the charged particle device for receiving the module is isolated from the substantial vacuum conditions of the adjacent area in the charged particle device by a closed internal vacuum seal so that the module receiving area can be vented and exposed to the atmospheric conditions outside the charged particle device.

[0368]

[0396] Preferably, the method further includes, after the module is secured to the charged particle device, closing an external vacuum seal of the module receiving area so that the module receiving area is isolated from atmospheric conditions outside the charged particle device, pumping the module receiving area so that the module receiving area is in a substantial vacuum state, baking the module, opening the internal vacuum seal, and activating a source of the charged particle device so that a charged particle beam or multiple beams are present within the charged particle device.

[0369]

[0397] Preferably, the module is a module according to the first and / or second aspect and the charged particle device is a charged particle device according to the third aspect.

[0370]

[0398] According to a sixth aspect of the present invention, there is provided an electron optical column configured to project an electron beam onto a sample, the column including a frame configured to define a coordinate system of the column and a chamber for receiving a field-replaceable module including an electron-optical device. The electron optical column may include an engagement arrangement configured to engage with the field-replaceable module to align the field-replaceable module with the frame. The electron optical column may include an active positioning system configured to position the beam and device relative to each other for fine alignment.

[0371]

[0399] Preferably, the active positioning system includes electronic optical elements in the up-beam of field replaceable modules, such as lenses, that are controllable to manipulate the path of the electron beam or to deflect the electron beam path.

[0372]

[0400] Preferably, the active positioning system includes an actuator configured to be engageable with the field replaceable module and controllable to move the device relative to the path of the electron beam, preferably with degrees of freedom of the device in a plane perpendicular to the path of the electron beam, and preferably the device is a planar structure in a plane perpendicular to the path of the electron beam.

[0373]

[0401] Preferably, the electron optical column further includes an upbeam valve for sealing the column from the upbeam of the chamber, and a downbeam valve for sealing the chamber from the downbeam portion of the column, preferably so that the chamber is segmented from the remainder of the column.

[0374]

[0402] Preferably, the chamber defines an opening in a side of the column configured to receive the field replaceable module and is configured to be sealable with the field replaceable module.

[0375]

[0403] According to a seventh aspect of the present invention there is provided a field replaceable module arranged for removably insertion into an electron optical column, the field replaceable module comprising an electron optical element configured to manipulate a path of an electron beam in the electron optical column and a support configured to support the electron optical element, The field replaceable module may include engagement arrangements configured to align the support with a frame of the electron optical column in all degrees of freedom.

[0376]

[0404] Preferably, the field replaceable module further includes a support positioning system configured to displace the element relative to the rest of the module to enable the element to be positioned relative to the path of the electron beam through the column.

[0377]

[0405] Preferably, the element is a planar structure arranged perpendicular to the path of the charged particle beam, and the support positioning system is configured to displace the support in at least one degree of freedom in the plane of the planar structure, preferably in the x-axis, in the y-axis and / or in rotation about the z-axis.

[0378]

[0406] Preferably, the support positioning system is configured to be engageable with an actuator associated with a frame of the electron-optical column, the actuator being associated with a planar degree of freedom of the planar structure, and the support being controllably operable by the actuator such that the position of the support relative to the frame is adjusted.

[0379]

[0407] Preferably, the engagement formation includes a flat surface and two interlocking features, each assigned to an axial degree of freedom.

[0380]

[0408] Preferably, the engagement formation is configured to seal against a side of the column.

[0381]

[0409] Preferably, the field replaceable module further includes a pre-calibration system configured to be adjustable to adjust the alignment of the support relative to the frame, preferably in degrees of freedom other than those adjusted by the support positioning system and / or preferably in degrees of freedom out of the plane of the planar structure of the device.

[0382]

[0410] While the invention has been described in connection with various embodiments, other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

[0383]

[0411] The above description is intended to be illustrative rather than limiting. Thus, it will be apparent to one skilled in the art that modifications may be made as described without departing from the scope of the claims set out below.

[0384]

[0412] A number of provisions are provided.

[0385]

[0413] Clause 1: A module for supporting a device configured to manipulate a charged particle path in a charged particle device, the module comprising: a support structure configured to support the device, the device configured to manipulate a charged particle path in the charged particle device; and a support positioning system configured to move the support structure within the module, the module being arranged in the charged particle device so as to be replaceable in the field.

[0386]

[0414] Clause 2: A module as described in clause 1, wherein when the module is in use in a charged particle device with a device held by the support structure, the charged particle path is substantially parallel to the charged particle axis of the charged particle device.

[0387]

[0415] Clause 3: The module of clause 1 or 2, wherein the support positioning system is configured to move the support arrangement with at least three degrees of freedom of movement.

[0388]

[0416] Clause 4: A module described in any one of the preceding clauses, wherein the charged particle axis coincides with the z-axis, the module is a substantially planar structure in the xy-plane, and the at least three degrees of freedom of movement include movement in the xy-plane and rotation around the z-axis (Rz).

[0389]

[0417] Clause 5: A module according to any one of the preceding clauses, wherein the support positioning system is a manual and / or automatic positioning system.

[0390]

[0418] Clause 6: A module described in any one of the preceding clauses, wherein the support positioning system is configured to move the support structure to within approximately 0.5 μm to 100 μm of a desired position of the support structure and / or to impart a rotation of up to 1 rad in Rz to the support structure.

[0391]

[0419] Clause 7: A module according to any one of the preceding clauses, wherein the module further comprises a position detection system configured to determine the movement and / or position of the support structure and / or a device carried by the support structure.

[0392]

[0420] Clause 8: The module of clause 7, wherein the position detection system includes grid marks, such as encoders, for use in determining the movement and / or position of the support structure and / or a device carried by the support structure.

[0393]

[0421] Clause 9: The module described in clause 7 or 8, wherein the position detection system is configured to determine the movement and / or position of the support structure and / or a device held by the support structure based on one or more features of the device held by the support structure.

[0394]

[0422] Clause 10: The module of clause 9, wherein one or more features of the device include an array of apertures and / or one or more fiducials.

[0395]

[0423] Clause 11: The module of clause 10, wherein the array of apertures is an array of apertures for use in aligning substrates of a substrate stack included by the device during manufacture of the device.

[0396]

[0424] Clause 12: A module as described in clause 10, wherein the array of apertures is for charged particles to pass through a beam manipulator contained by the device.

[0397]

[0425] Clause 13: A module according to any one of the preceding clauses, wherein the module further comprises a receiving portion configured to receive an end of each of the actuator arms.

[0398]

[0426] Clause 14: The module of clause 13, wherein the actuator arm is comprised by an actuator external to the module, and the support positioning system is configured to be moved by the actuator.

[0399]

[0427] Clause 15: A module as described in Clause 14, wherein the first receiving portion is arranged to receive an end of a first actuator arm for moving the support positioning system in a first direction, the second receiving portion is arranged to receive an end of a second actuator arm for moving the support structure by the support positioning system in a second direction which may be perpendicular to the first direction, and the third receiving portion is arranged to receive an end of a third actuator arm for rotating the support structure.

[0400]

[0428] Clause 16: The module of clause 15, wherein the first and second directions are in an xy plane and the rotation is about an axis, such as the z axis, that is orthogonal to the xy plane.

[0401]

[0429] Clause 17: A module according to any one of the preceding clauses, wherein the support positioning system comprises a disk and a plurality of load-bearing rotatable objects configured to support the disk within the module.

[0402]

[0430] Clause 18: The module described in clause 17, wherein the disk has an up beam surface and a down beam surface, a first set of one or more load-bearing rotatable objects arranged to contact the up beam surface of the disk, and a second set of multiple load-bearing rotatable objects arranged to contact the down beam surface of the disk.

[0403]

[0431] Clause 19: A module as described in clause 17 or 18, wherein the first set of load-bearing rotatable objects comprises one, two or three load-bearing rotatable objects and the second set of load-bearing rotatable objects comprises three load-bearing rotatable objects.

[0404]

[0432] Clause 20: A module described in any one of clauses 17 to 19, wherein the disk is positioned such that, in a plan view, when the module is installed in a charged particle device, the charged particle path passes through an opening defined in the disk.

[0405]

[0433] Clause 21: The module of any one of clauses 17 to 20, wherein, in plan view, the disc is substantially annular.

[0406]

[0434] Clause 22: A module according to any one of clauses 17 to 21, wherein the disc is a substantially planar structure, preferably in the xy plane.

[0407]

[0435] Clause 23: The module of any one of clauses 17 to 22, wherein the disk includes a supporting structure.

[0408]

[0436] Clause 24: A module described in any one of clauses 17 to 23, wherein the module includes a first force application device arranged to apply a force to the disk, the force being substantially in the same plane as the disk and for moving the disk in the plane, and the module includes a second force application device arranged to apply a force to the disk, the force being substantially in the same plane as the disk and for rotating the disk.

[0409]

[0437] Clause 25: The module of clause 24, wherein the first force application device is configured such that the force applied by the first force application device is substantially in a direction passing through the axis of rotation of the disc so that the force does not substantially rotate the disc.

[0410]

[0438] Clause 26: A module as described in clause 24 or 25, wherein in use the disc is compressed by a force from the first force application device, a force applied to the first receiving portion, and a force applied to the second receiving portion.

[0411]

[0439] Clause 27: A module described in any one of clauses 24 to 26, wherein, in use, the second force application device is arranged to apply a force pressing the third receiving portion against the end of the third actuator arm.

[0412]

[0440] Clause 28: A module described in any one of clauses 24 to 27, wherein the second force application device is arranged to apply a force to a first protrusion from the side wall of the disk, and / or the third receiving portion includes a second protrusion from the side wall of the disk.

[0413]

[0441] Clause 29: A module described in any one of clauses 17 to 23, wherein the module includes a force application device arranged to apply a force to the disk, the applied force being substantially in the same plane as the disk, the applied force being for linearly moving the disk in the plane, and the applied force being for rotating the disk.

[0414]

[0442] Clause 30: A module described in any one of clauses 17 to 29, wherein the module includes one or more axial force application devices arranged to hold the disk under compression between a first set of load-bearing rotatable objects and a second set of load-bearing rotatable objects.

[0415]

[0443] Clause 31: A module as described in clause 30, wherein each axial force application device comprises a plate in contact with one of the load-bearing rotatable objects, and / or one or more of the axial force application devices is an elastic member such as a spring.

[0416]

[0444] Clause 32: The module of any one of clauses 1 to 16, wherein the support positioning system includes a flexure arrangement.

[0417]

[0445] Clause 33: The module of clause 32, wherein the flexure configuration includes an Rz flexure configuration and an xy flexure configuration.

[0418]

[0446] Clause 34: The module of clause 33, wherein both the Rz flexure arrangement and the xy flexure arrangement are substantially planar structures, preferably in the xy plane.

[0419]

[0447] Clause 35: A module according to clause 33 or 34, wherein the Rz flexure configuration and the xy flexure configuration are arranged in a stacked manner, the Rz flexure configuration preferably being on the down beam of the xy flexure configuration.

[0420]

[0448] Clause 36: The module of any one of clauses 33 to 35, wherein, in plan, the Rz flexure configuration includes a substantially circular structure that defines an opening in the Rz flexure configuration.

[0421]

[0449] Clause 37: The module of clause 36, wherein the center of the substantially circular structure is substantially aligned with the z-axis.

[0422]

[0450] Clause 38: A module described in clause 36 or 37, wherein, in a plan view, the Rz flexure configuration includes a cross, the cross including first and second crossbars intersecting at an intersection, the first crossbar being aligned in a first direction within the plane of the Rz flexure configuration, and the second crossbar being aligned in a second direction within the plane of the Rz flexure configuration, the second direction being orthogonal to the first direction.

[0423]

[0451] Clause 39: A module described in any one of clauses 36 to 38, wherein a circular structure is located at the intersection of the first and second crossbars, and the circular structure is supported between the first and second portions of the first crossbar and between the first and second portions of the second crossbar.

[0424]

[0452] Clause 40: The module of clause 39, wherein the first crossbar is aligned with the first receiving portion and the second crossbar is aligned with the second receiving portion.

[0425]

[0453] Clause 41: The module of any one of clauses 33 to 40, wherein the Rz flexure arrangement includes a base and a moveable body.

[0426]

[0454] Clause 42: The module of clause 41, wherein the third receiving portion includes a recess in a sidewall of the Rz flexure configuration.

[0427]

[0455] Clause 43: The module of clause 41 or 42, wherein the Rz flexure arrangement includes a rotational force application device configured to apply a force to rotate the movable body.

[0428]

[0456] Clause 44: A module as described in clause 43, configured such that, in use, a rotational force applied by the rotational force application device presses the third receiving portion against the end of the third actuator arm.

[0429]

[0457] Clause 45: A module described in any one of clauses 33 to 44, wherein the xy flexure configuration includes an outer structure, an intermediate structure, a central structure, and a plurality of leaf springs, and within the plane of the xy flexure configuration, the intermediate structure is substantially surrounded by the outer structure, the first receiving portion, and the second receiving portion, and within the plane of the xy flexure configuration, the central structure is substantially surrounded by the intermediate structure, and the outer structure is connected to the intermediate structure by at least one leaf spring, and the intermediate structure is connected to the central structure by at least one leaf spring.

[0430]

[0458] Clause 46: A module as described in Clause 45, wherein at least one leaf spring connecting the intermediate structure to the central structure is arranged so that the central structure is arranged to move in a first direction relative to the outer structure in response to a force applied to the first receiving portion, and at least one leaf spring connecting the outer structure to the intermediate structure is arranged so that the intermediate structure is arranged to move in a second direction relative to the outer structure in response to a force applied to the second receiving portion.

[0431]

[0459] Clause 47: A module as described in clause 46, wherein the intermediate structure is connected to the central structure by two leaf springs arranged on either side of the central structure, and the intermediate structure is connected to the outer structure by two leaf springs arranged on either side of the intermediate structure.

[0432]

[0460] Clause 48: A module described in any one of clauses 45 to 47, further comprising a first biasing device arranged to apply a force to the intermediate structure and / or central structure so that the intermediate structure and / or central structure are held under compression in a first direction, and a second biasing device arranged to apply a force to the intermediate structure and / or central structure so that the intermediate structure and / or central structure are held under compression in a second direction.

[0433]

[0461] Clause 49: The module of any one of clauses 45 to 48 when dependent on clause 41, wherein the outer structure is of an xy flexure configuration and is fixed to the movable body of an Rz flexure configuration.

[0434]

[0462] Clause 50: The module of any one of clauses 32 to 49, wherein the first and / or second biasing device is a resilient member such as a spring.

[0435]

[0463] Clause 51: A module according to any one of clauses 1 to 16, wherein the support positioning system comprises one or more linear actuators or actuator arrangements.

[0436]

[0464] Clause 52: The module of clause 51, wherein each actuator is a piezoelectric actuator configuration.

[0437]

[0465] Clause 53: The module of clause 52, wherein each piezo actuator arrangement includes a dual-axis shear mode piezo device.

[0438]

[0466] Clause 54: A module according to any one of clauses 51 to 53, wherein the support positioning system comprises a plurality of actuators.

[0439]

[0467] Clause 55: The module according to clause 54, wherein the number of actuators included by the support positioning system is three.

[0440]

[0468] Clause 56: The module of any one of clauses 51 to 55, wherein the support positioning system includes a stage.

[0441]

[0469] Clause 57: The module of clause 56, wherein, in plan view, the stage is substantially annular.

[0442]

[0470] Clause 58: A module according to clause 56 or 57, wherein the actuators are spaced at substantially equal angular positions about a midpoint of the stage.

[0443]

[0471] Clause 59: The module of clause 58, wherein the actuators are aligned such that the angle between the longitudinal axes of adjacent actuators is 60 degrees.

[0444]

[0472] Clause 60: A module according to any one of clauses 51 to 59, wherein the actuators are configured such that all of the actuators or an arrangement of actuators can be operated together to rotate the stage in the plane of the stage.

[0445]

[0473] Clause 61: A module described in any one of clauses 51 to 60, wherein the actuators are configured such that all of the actuators can be operated together to move the stage in a first direction that is in the plane of the stage.

[0446]

[0474] Clause 62: A module described in any one of clauses 51 to 61, wherein the actuators are configured such that all of the actuators can be operated together to move the stage in a second direction within the plane of the stage, the second direction being orthogonal to the first direction.

[0447]

[0475] Clause 63: A module described in any one of clauses 51 to 62, further comprising one or more force application devices, each force application device being arranged to apply a force that presses the actuator against the stage.

[0448]

[0476] Clause 64: A module described in any one of clauses 51 to 57, wherein, in a plan view, at least one actuator is arranged beside the stage and linear movement of the actuator is configured to rotate the stage, and for each actuator beside the stage there is a force application device configured to apply a force pressing the actuator against the stage.

[0449]

[0477] Clause 65: The module of clause 64, wherein there are two actuators beside the stage, the actuators being on either side of the stage.

[0450]

[0478] Clause 66: A module described in Clause 64 or 65, further comprising first and second linear actuators, the first linear actuator being arranged to move the second linear actuator in a first direction, and the second linear actuator being arranged to move at least one actuator arranged near the stage in a second direction perpendicular to the first direction.

[0451]

[0479] Clause 67: A module for supporting a device configured to manipulate the path of charged particles in a charged particle device, the module including a module flange configured to be attached to and detached from a housing flange of a housing of the charged particle device such that the module is field replaceable within the charged particle device.

[0452]

[0480] Clause 68: A module as described in clause 67, wherein when the module supports a device and the module is in use in a charged particle device, the device is configured to manipulate a charged particle path substantially along a charged particle axis of the charged particle device.

[0453]

[0481] Clause 69: A module according to clause 68, wherein the charged particle axis coincides with the z-axis and the module is a substantially planar structure in the xy-plane.

[0454]

[0482] Clause 70: A module described in any one of clauses 67 to 69, wherein the module flange includes one or more holes for receiving alignment pins of the housing flange, and / or the module flange includes one or more alignment pins for insertion into holes in the housing flange.

[0455]

[0483] Clause 71: The module of clause 70, wherein the module flange includes one or more alignment pins for insertion into the housing flange.

[0456]

[0484] Clause 72: A module described in any one of clauses 67 to 71, wherein the module includes a device support structure for supporting a device and a mechanism for adjusting the position of the device support structure with at least one degree of freedom of movement.

[0457]

[0485] Clause 73: A module as described in clause 72, wherein the device support system enables the position of the device support structure to be adjusted with three degrees of freedom of movement, the three degrees of freedom of movement preferably being the z, Rx, and Ry positions of the device support structure.

[0458]

[0486] Clause 74: A module as described in clause 72 or 73, wherein the mechanism for adjusting the z, Rx, and Ry positions of the device support configuration includes one or more adjustable supports, such as adjustable spring-loaded bolts, adjustable fasteners, or adjustable pins.

[0459]

[0487] Clause 75: The module of clause 74, wherein an adjustable support is positioned around the device support arrangement.

[0460]

[0488] Clause 76: A module as described in clause 74 or 75, wherein the adjustable supports are spaced at substantially equal angular positions about a midpoint of the device support arrangement.

[0461]

[0489] Clause 77: A module according to any one of clauses 74 to 76, wherein there are three adjustable supports.

[0462]

[0490] Clause 78: A module according to any one of clauses 74 to 76, wherein the adjustable supports are individually adjustable.

[0463]

[0491] Clause 79: A module described in any one of clauses 72 to 78, wherein the mechanism for adjusting the z, Rx, and Ry positions of the device support arrangement is configured to be operated when the module is outside the charged particle device.

[0464]

[0492] Clause 80: A module according to any one of clauses 67 to 79, wherein the module is a module according to any one of clauses 1 to 66.

[0465]

[0493] Clause 81: The module of clause 80, wherein the device support arrangement includes a support positioning system and a support arrangement as described in any one of clauses 1 to 67.

[0466]

[0494] Clause 82: A charged particle device comprising a field replaceable module according to any one of clauses 1 to 81.

[0467]

[0495] Clause 83: A charged particle device according to clause 82, wherein the module comprises a device configured to manipulate a charged particle path in the charged particle device.

[0468]

[0496] Clause 84: A charged particle device according to clause 83, wherein the charged particle device comprises an actuator for moving the support positioning system of the module, the actuator being a linear actuator.

[0469]

[0497] Clause 85: A charged particle device according to clause 84, wherein each actuator comprises an actuator arm configured to engage with a corresponding receiving portion comprised by the module.

[0470]

[0498] Clause 86: A charged particle device according to clause 85, wherein the end of the actuator arm comprises a roller bearing.

[0471]

[0499] Clause 87: A charged particle apparatus according to any one of clauses 83 to 86, wherein the device comprises a beam manipulator arranged to manipulate sub-beams of the multi-beam of charged particles.

[0472]

[0500] Clause 88: A charged particle device according to any one of clauses 82 to 86, wherein the charged particle device includes a housing flange configured to be attachable to and detachable from a module flange of the module.

[0473]

[0501] Clause 89: A charged particle device as described in clause 88, wherein the housing flange includes one or more alignment pins for insertion into corresponding openings in the module flange.

[0474]

[0502] Clause 90: A charged particle device according to clause 88 or 89, wherein the module flange includes one or more alignment pins for insertion into corresponding openings in the housing flange.

[0475]

[0503] Clause 91: A charged particle device according to any one of clauses 83 to 90, wherein the charged particle device further comprises a position detection system configured to determine the movement and / or position of the device.

[0476]

[0504] Clause 92: A charged particle device described in any one of clauses 83 to 91, further comprising a charged particle source and one or more manipulator arrangements configured to manipulate charged particle paths in the up beam and / or down beam of the device.

[0477]

[0505] Clause 93: A charged particle device as described in Clause 92, wherein one or more manipulator arrangements are configured to adjust the charged particle path and / or the module is configured to adjust the position of the device so that the charged particle path is aligned with the device.

[0478]

[0506] Clause 94: A charged particle device according to clause 92 or 93, wherein the charged particle system further comprises a control system configured to control the one or more manipulator arrangements.

[0479]

[0507] Clause 95: A charged particle device according to any one of clauses 92 to 94, wherein a first set of manipulator arrangements is provided in the up beam of the module and a second set of manipulator arrangements is provided in the down beam of the module.

[0480]

[0508] Clause 96: A charged particle device according to any one of clauses 92 to 95, wherein one or more of the manipulator arrangements comprises an electrostatic deflector for deflecting the charged particle path.

[0481]

[0509] Clause 97: A charged particle device according to any one of clauses 92 to 96, wherein one or more of the manipulator arrangements includes a magnetic lens for deflecting the charged particle path.

[0482]

[0510] Clause 98: The charged particle device of any one of Clauses 92 to 97, wherein the charged particle device further comprises a source moving mechanism for adjusting the position of the source.

[0483]

[0511] Clause 99: A charged particle device according to any one of clauses 92 to 98, wherein the charged particle device further includes an objective lens, and the charged particle device further includes a lens moving mechanism for adjusting the position of the objective lens.

[0484]

[0512] Clause 100: A charged particle apparatus as described in clause 99, wherein at least one of the manipulator arrangements is configured to be controllable to manipulate the charged particle path from the source so as to be aligned with the device and the objective lens.

[0485]

[0513] Clause 101: The charged particle device of any one of clauses 92 to 100, wherein the charged particle device further comprises an up beam vacuum lock on the up beam side of the module and a down beam vacuum lock on the down beam side of the module.

[0486]

[0514] Clause 102: The charged particle device of clause 101, wherein the up beam vacuum lock and the down beam vacuum lock are operable to isolate a region of the charged particle device containing the module from vacuum conditions in adjacent regions of the charged particle device.

[0487]

[0515] Clause 103: A charged particle device according to any one of clauses 92 to 102, wherein the charged particle system further comprises a source vacuum lock down the beam from the source.

[0488]

[0516] Clause 104: The charged particle device of clause 103, wherein the source vacuum lock is operable to isolate a region of the charged particle device including the source from vacuum conditions in adjacent regions of the charged particle device.

[0489]

[0517] Clause 105: A charged particle device according to clause 104, wherein the source is contained by a field replaceable module.

[0490]

[0518] Clause 106: A charged particle device according to any one of clauses 92 to 105, wherein the charged particle device further comprises a secondary column, the secondary column comprising a detector configured to detect electrons from the sample.

[0491]

[0519] Clause 107: A charged particle device as described in clause 106, wherein the secondary column further comprises one or more vacuum locks for isolating a region of the secondary column including the detector from the vacuum condition of one or more adjacent regions of the secondary column.

[0492]

[0520] Clause 108: A charged particle device according to clause 107, wherein the detector is contained by a field replaceable module.

[0493]

[0521] Clause 109: A method of installing an electron-optical device in a charged particle instrument, the method comprising: attaching the electron-optical device to a module; making coarse adjustments to the Rx state, Ry state, and / or z position of the electron-optical device relative to the body of the module; and fixing the module to the charged particle instrument.

[0494]

[0522] Clause 110: A method according to clause 109, wherein the module is a module according to any one of clauses 1 to 81 and the charged particle device is a charged particle device according to any one of clauses 82 to 108.

[0495]

[0523] Clause 111: A method for aligning an electron-optical device with a charged particle beam or multi-beam in a charged particle apparatus, the method comprising: fixing a module including the electron-optical device to the charged particle apparatus, thereby installing the electron-optical device in the charged particle apparatus; making one or more fine adjustments to the x-position, y-position and / or Rz state of the electron-optical device relative to the body of the module; and making adjustments to the path of the charged particle beam or multi-beam in the charged particle apparatus.

[0496]

[0524] Clause 112: A method as described in clause 111, wherein before the electron optical device is installed in the charged particle device, a module receiving area in the charged particle device for receiving the module is isolated from the substantial vacuum conditions of the adjacent area in the charged particle device by a closed internal vacuum seal so that the module receiving area can be vented and exposed to the atmospheric conditions outside the charged particle device.

[0497]

[0525] Clause 113: The method described in Clause 112, wherein the method further includes, after the module is fixed to the charged particle device, closing an external vacuum seal of the module receiving area so that the module receiving area is isolated from atmospheric conditions outside the charged particle device, pumping the module receiving area so that the module receiving area is in a substantial vacuum state, baking the module, opening the internal vacuum seal, and activating a source of the charged particle device so that a charged particle beam or multiple beams are present in the charged particle device.

[0498]

[0526] Clause 114: A method according to any one of clauses 111 to 113, wherein the module is a module according to any one of clauses 1 to 81, and the charged particle device is a charged particle device according to any one of clauses 82 to 108.

[0499]

[0527] Clause 115: An electron optical column configured to project an electron beam onto a sample, the column comprising: a frame configured to define a coordinate system of the column; a chamber for receiving a field replaceable module including an electron optical device; an engagement arrangement configured to engage the field replaceable module to align the field replaceable module with the frame; and an active positioning system configured to position the beam and device relative to each other for fine alignment.

[0500]

[0528] Clause 116: An electron optical column as described in clause 115, wherein the active positioning system includes electron optical elements in the up-beam in field replaceable modules, such as lenses, that are controllable to manipulate the path of the electron beam or to deflect the electron beam path.

[0501]

[0529] Clause 117: An electron optical column as described in clause 115 or 116, wherein the active positioning system includes an actuator configured to be engageable with the field replaceable module and to be controllable to move the device relative to the path of the electron beam, preferably with degrees of freedom of the device in a plane perpendicular to the path of the electron beam, and preferably the device is a planar structure in a plane perpendicular to the path of the electron beam.

[0502]

[0530] Clause 118: An electron optical column as described in any one of clauses 115 to 117, further comprising an upbeam valve for sealing the column from the upbeam of the chamber, and a downbeam valve for sealing the chamber from the downbeam portion of the column, preferably so that the chamber is segmented from the remainder of the column.

[0503]

[0531] Clause 119: An electron optical column described in any one of clauses 115 to 118, wherein the chamber defines an opening in a side of the column configured to receive a field replaceable module and is configured to be sealable with the field replaceable module.

[0504]

[0532] Clause 120: A field replaceable module arranged for removably insertion into an electron optical column, the field replaceable module comprising: a) an electron optical element configured to manipulate a path of an electron beam in the electron optical column; b) a support configured to support the electron optical element; and c) an engagement arrangement configured to align the support with a frame of the electron optical column in all degrees of freedom.

[0505]

[0533] Clause 121: A field replaceable module according to clause 120, further comprising a support positioning system configured to displace the element relative to the remainder of the module to enable the element to be positioned relative to a path of the electron beam through the column.

[0506]

[0534] Clause 122: A field replaceable module according to clause 121, wherein the element is a planar structure arranged perpendicular to the path of the charged particle beam, and the support positioning system is configured to displace the support in at least one degree of freedom in the plane of the planar structure, preferably in the x-axis, in the y-axis and / or in rotation about the z-axis.

[0507]

[0535] Clause 123: A field replaceable module as described in clause 121 or 122, wherein the support positioning system is configured to be engageable with an actuator associated with a frame of the electron optical column, the actuator being associated with a planar degree of freedom of the planar structure, and the support being controllably operable by the actuator so that the position of the support relative to the frame is adjusted.

[0508]

[0536] Clause 124: A field replaceable module described in any one of clauses 120 to 123, wherein the engagement configuration includes a flat surface and two interlocking features, each assigned to an axial degree of freedom.

[0509]

[0537] Clause 125: A field replaceable module according to any one of clauses 120 to 124, wherein the engagement arrangement is configured to seal against a side of the column.

[0510]

[0538] Clause 126: A field replaceable module according to any one of clauses 120 to 125, further comprising a pre-calibration system configured to be adjustable to adjust the alignment of the support relative to the frame, preferably in degrees of freedom other than those adjusted by the support positioning system and / or preferably in degrees of freedom out of the plane of the planar structure of the device.

Claims

1. a field replaceable module arranged for removably insertion into an electron optical column, a) electron optical elements configured to steer an electron beam in the electron optical column; b) a support configured to support the electro-optical element; c) an engagement arrangement configured to align the support with a frame of the electron-optical column in all degrees of freedom, the engagement arrangement including a plane and two interlocking features, each assigned to an axial degree of freedom; d) a mechanism for adjusting the position of the support, the mechanism having one or more adjustable supports, the mechanism being configured to be operated when the module is outside the charged particle device, the one or more adjustable supports being inside the electron optical column when the module is inside the electron optical column; and e) a support positioning system configured to displace the support in at least one degree of freedom and engageable with an actuator associated with the frame of the electron-optical column, the support positioning system operable to be controlled by the actuator; Including, the electron-optical column includes the frame configured to define a coordinate system of the electron-optical column and to serve as a reference for coarse positioning of a field-replaceable module, the electron-optical column further configured to receive the field-replaceable module. Field replaceable modules.

2. and a support positioning system configured to displace the electron optical element relative to the rest of the module to enable the electron optical element to be positioned with respect to a path of an electron beam through the electron optical column.

10. The field replaceable module of claim 1.

3. the electron optical element is a planar structure arranged perpendicular to the path of the charged particle beam; a support positioning system configured to displace the support in at least one degree of freedom in the plane of the planar structure in an x-axis, in a y-axis, and / or in rotation about a z-axis; 3. The field replaceable module of claim 2.

4. the support positioning system is configured to displace the support in at least one degree of freedom in the plane of the planar structure in the x-axis, in the y-axis, and / or in the rotation about the z-axis.

4. The field replaceable module of claim 3.

5. The actuator is associated with a degree of freedom in the plane of the planar structure, and the support is controllably operable by the actuator such that the position of the support relative to the frame is adjusted.

4. The field replaceable module of claim 3.

6. The support positioning system is configured to displace the support in at least three degrees of freedom to align the electro-optical device with the electron beam path, the at least three degrees of freedom including displacement in the x-direction, displacement in the y-direction, and rotation about the z-axis.

10. The field replaceable module of claim 1.

7. the engagement formation is configured to seal against a side of the electron optical column; 10. The field replaceable module of claim 1.

8. and a pre-calibration system configured to be adjustable to adjust the alignment of the support relative to the frame in degrees of freedom other than those adjusted by the support positioning system.

4. A field replaceable module according to claim 2 or 3.

9. a pre-calibration system configured to be adjustable to adjust the alignment of the support relative to the frame in a degree of freedom out of the plane of the planar structure of the device; 4. The field replaceable module of claim 3.

10. The field replaceable module of claim 5 , wherein the support positioning system includes a stage.

11. The field replaceable module of claim 10 , wherein the actuators are equally angularly spaced about a midpoint of the stage.

12. 12. The field replaceable module of claim 11, wherein the actuators are aligned such that the angle between the longitudinal axes of adjacent actuators is 60 degrees.

13. 13. The field replaceable module of claim 12, wherein the actuators are configured such that all or an arrangement of the actuators can be operated together to rotate the stage in a plane of the stage.

14. 13. The field replaceable module of claim 12, wherein the actuators are configured such that all of the actuators can be operated together to move the stage in a first direction that is in the plane of the stage.

15. 15. The module of claim 14, wherein the actuators are configured such that all of the actuators can be operated together to move the stage in a second direction that is in the plane of the stage, the second direction being orthogonal to the first direction.

Images