Enclosure for providing a controlled environment during the manufacture of glass articles - Patent Application 20070122997

Abstract

The enclosure for providing a controlled environment has a central plane extending through an upper end of the enclosure and a lower end of the enclosure, bisecting the enclosure along a width of the enclosure, and an inlet opening of width W provided at the lower end of the enclosure. inlet a surrounding wall extending from the inlet to the upper end of the enclosure; an inlet port provided at the upper end of the enclosure; and an outlet provided between the inlet port and the chamber region of the surrounding wall. The surrounding wall includes a chamber region and a transition region between the inlet and the chamber region. The width W of the chamber region chamber is substantially constant over the chamber region. In the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio is 1:2 to 1:5.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Patent Application No. 63 / 071,570, filed August 28, 2020, the entire disclosure of which is incorporated herein by reference. [Technical Field]

[0002] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to controlled environments, and more particularly to controlled environments used in the manufacture of glass articles. [Background technology]

[0003] Glass articles can be used in a variety of applications, such as product packaging and specialty applications. Depending on the specific application of the glass article, a coating can be applied to the exterior of the glass article to impart specific properties, such as reducing or preventing scratches, reflecting ultraviolet light, or tinting the glass surface. Coatings can be applied during the glass manufacturing process using any of a variety of known techniques. However, the performance of some techniques, such as spray coating techniques, often depends on the environmental conditions during the glass manufacturing process and the environmental conditions to which the glass article is exposed immediately after the process. Furthermore, solvents used in coatings may vaporize from the surface of a freshly coated glass article. Summary of the Invention [Problem to be solved by the invention]

[0004] Therefore, there is a need for an enclosure that provides a controlled environment during the manufacture of coated glass articles. [Means for solving the problem]

[0005] Various embodiments provide an enclosure that surrounds a glass article and provides a controlled environment during at least a portion of a glass manufacturing process. The enclosure described herein can reduce the amount of temperature- and humidity-controlled filtered air required for the controlled environment and can effectively capture solvent evaporating from the glass article, thereby preventing contamination of the surrounding environment by solvent vapor. Furthermore, the enclosure according to various embodiments can reduce or prevent contamination of the glass article with particulates present in the surrounding environment that would render the glass article unsuitable for its end use.

[0006] According to one or more embodiments, an enclosure for providing a controlled environment may include a central plane extending through an upper end of the enclosure and a lower end of the enclosure, bisecting the enclosure along a width of the enclosure, and an inlet width W at the lower end of the enclosure. inlet a surrounding wall extending from the inlet to a top end of the enclosure; an inlet port disposed at the top end of the enclosure and configured to receive a component carrier; and an outlet disposed between the inlet port and a chamber region of the surrounding wall. The surrounding wall includes a chamber region and a transition region between the inlet and the chamber region. The width W of the chamber region chamber is substantially constant over the chamber region. In the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio may be between 1:2 and 1:5. The central plane passes through the inlet and inlet ports of the enclosure, and the outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane.

[0007] According to one or more embodiments, a manufacturing line for producing glass articles includes an enclosure and a part carrier, the enclosure having a central plane extending through an upper end of the enclosure and a lower end of the enclosure, the central plane bisecting the enclosure along a width of the enclosure, and an inlet opening width W at the lower end of the enclosure. inleta surrounding wall extending from the inlet to a top end of the enclosure; an inlet port disposed at the top end of the enclosure and configured to receive a component carrier; and an outlet disposed between the inlet port and a chamber region of the surrounding wall. The surrounding wall includes a chamber region and a transition region between the inlet and the chamber region. The width W of the chamber region chamber is substantially constant over the chamber region. In the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio can be between 1:2 and 1:5. The central plane passes through the inlet and the inlet port of the enclosure, and the outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane. The gripping members of the component carrier are positioned through the inlet port, and the component carrier is configured to move the glass article through the chamber region of the enclosure.

[0008] According to one or more embodiments, a method for transporting a coated article is provided. The method includes the steps of placing the coated article within an enclosure, supplying a fluid flow to the enclosure through an inlet, discharging the fluid flow out of the enclosure through an outlet, and moving the coated article along a path through the enclosure and substantially parallel to a central plane. The enclosure has a central plane extending through an upper end of the enclosure and a lower end of the enclosure, bisecting the enclosure along a width of the enclosure, and an inlet width W at the lower end of the enclosure. inlet a surrounding wall extending from the inlet to a top end of the enclosure; an inlet port disposed at the top end of the enclosure and configured to receive a component carrier; and an outlet disposed between the inlet port and a chamber region of the surrounding wall. The surrounding wall includes a chamber region and a transition region between the inlet and the chamber region. The width W of the chamber region chamber is substantially constant over the chamber region. In the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inletThe ratio may be between 1:2 and 1:5. The central plane passes through the inlet and inlet ports of the enclosure, and the outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane.

[0009] These embodiments are described in more detail in the following detailed description in conjunction with the accompanying drawings.

[0010] The following detailed description of specific embodiments of the present disclosure will be best understood when read in conjunction with the following drawings, in which like structure is designated with like reference numerals and in which: [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating an enclosure for providing a controlled environment according to one or more embodiments disclosed herein. [Figure 2] FIG. 1 is a schematic cross-sectional view illustrating airflow through an enclosure for providing a controlled environment, according to one or more embodiments disclosed herein. [Figure 3] FIG. 1 is a schematic cross-sectional view of an enclosure with a glass article therein, according to one or more embodiments disclosed herein. [Figure 4] 1 is a schematic diagram of another side view of an enclosure for manufacturing glass articles according to one or more embodiments disclosed herein. [Figure 5] FIG. 1 is a schematic side view illustrating a manufacturing line for producing glass articles according to one or more embodiments disclosed herein. [Figure 6] FIG. 1 illustrates a three-dimensional computational fluid dynamics (3D CFD) model of airflow through an enclosure for providing a controlled environment, according to one or more embodiments disclosed herein. [Figure 7] FIG. 1 illustrates a three-dimensional CFD model replicating airflow from a vial within an enclosure for providing a controlled environment, according to one or more embodiments disclosed herein. [Figure 8]FIG. 1 illustrates a three-dimensional CFD model of solvent evaporating from the surface of a vial and passing through an enclosure to provide a controlled environment, according to one or more embodiments disclosed herein. [Figure 9] FIG. 1 illustrates a three-dimensional CFD model of airflow through an enclosure for providing a controlled environment, according to one or more embodiments disclosed herein. [Figure 10] FIG. 1 illustrates a three-dimensional CFD model of particulate flow through an enclosure for providing a controlled environment, according to one or more embodiments disclosed herein. [Figure 11] FIG. 1 illustrates a three-dimensional CFD model of particulate flow through an enclosure for providing a controlled environment, according to one or more embodiments described herein. DETAILED DESCRIPTION OF THE INVENTION

[0012] Next, embodiments of enclosures for use in the manufacture of coated glass articles will be described in detail. The accompanying drawings illustrate examples of these embodiments. The same or similar parts will be designated, wherever possible, by the same reference numerals throughout the drawings. FIG. 1 is a schematic diagram illustrating one embodiment of an enclosure. The enclosure primarily comprises an enclosure wall, an inlet at the lower end of the enclosure, a transition region, a chamber region, an entry port at the top of the enclosure, and an outlet between the inlet port and the chamber region. A central plane extending through the upper and lower ends of the enclosure bisects the enclosure along its width. Various embodiments of enclosures for use in the manufacture of coated glass articles will now be described in detail with reference to the accompanying drawings.

[0013] It should be noted that one or more of the claims presented herein use the transitional phrase "wherein." This term is incorporated into a claim as an open-ended transitional phrase to introduce a recitation of structural features and should be interpreted similarly to the more general open-ended preamble term "comprising."

[0014] As used herein, directional terms (e.g., up, down, right, left, front, back, top, bottom, etc.) refer to the drawings only and are not intended to imply absolute orientations.

[0015] As used herein, ranges may be expressed as "about" a certain value or greater, "about" a certain value to "about" another particular value, or "about" a certain value or less. When a range is expressed in this manner, other embodiments including the particular value and the other particular value exist. Similarly, when a value is expressed as an approximation using "about," it will be understood that another embodiment consists of the particular value itself. It will also be understood that the endpoints of each range are both relative to and independent of each other.

[0016] Unless otherwise specified, no method described herein is intended to be construed as requiring the performance of its steps in a particular order, nor is any method described herein intended to require a particular orientation of any apparatus. Thus, except where a method claim actually recites the order of its steps, and an apparatus claim actually recites the order or orientation of individual components, or where a claim or detailed description of the invention explicitly states that the steps are limited to a particular order, and except where a particular order or orientation of apparatus components is recited, no order or orientation is intended to be inferred in any way. This applies to all implicit matters that may be a basis for interpretation, such as matters of reasoning regarding the order of steps, operational flow, component order, or component orientation, common sense derived from grammatical construction or punctuation, or the number or type of embodiments described herein.

[0017] As used herein, the singular forms "a," "an," and "the" are intended to include reference to the corresponding plural forms unless the context clearly dictates otherwise. Thus, for example, an expression introducing a certain element with the article "a" also encompasses embodiments having two or more of that element unless the context clearly dictates otherwise.

[0018] As used herein, a "controlled environment" refers to an enclosed or partially enclosed volume in which specific atmospheric conditions are maintained within a defined area. For example, temperature, pressure, and humidity may be maintained within predetermined ranges within a controlled environment. Additionally, the controlled environment may be restricted from introducing particulates (e.g., by filtering the incoming air).

[0019] As used herein, "laminar flow" refers to a fluid flow, and may include, for example, but is not limited to, a cross-current, an eddy, a swirl, and an airflow without side-to-side mixing.

[0020] As used herein, an "inflection point" refers to a point where curvature changes from concave to convex, or from convex to concave.

[0021] As used herein, "reflection symmetry" refers to the property of an object being symmetrical with respect to a plane, such that if the object is inverted along that plane, it will be indistinguishable from the object itself.

[0022] FIG. 1 illustrates one embodiment of an enclosure 100 for providing a controlled environment. The controlled environment may be provided, for example, along at least a portion of a glass manufacturing line for producing coated glass articles. Specifically, FIG. 1 is a schematic cross-sectional view of the enclosure 100 along an XY plane defined by the XY coordinate axes of FIG. 1. In various aspects of the enclosure 100, a central plane 101 provides a reference thereto. Specifically, the symmetry of the enclosure 100, the location of the inlet 104 and inlet port 108 of the enclosure 100, and the orientation of the outlet 109 of the enclosure 100 are defined relative to the central plane 101. In various embodiments, the central plane 101 extends in the ±X direction through the top end 102 and bottom end 103 of the enclosure 100. Additionally, the central plane 101 also extends in the Z direction across the length of the enclosure. In some embodiments, the central plane 101 bisects the enclosure 100 along the width of the enclosure, e.g., the width of the inlet (W inlet 110), the width of the chamber area (W chamber 111), or the width of the entrance (W entry 113), bisect the enclosure 100.

[0023] The enclosure 100 includes at least one enclosure wall 105. The enclosure wall 105 extends from a lower end 103 of the enclosure 100 to an upper end 102 of the enclosure 100 to define various regions of the enclosure 100. For example, the enclosure wall 105 defines a chamber region 106 and a transition region 107 of the enclosure 100. In some embodiments, the enclosure 100 includes two enclosure walls facing each other. For example, the enclosure 100 may include an enclosure wall on each side of a central plane 101. In several embodiments, the enclosure wall 105 includes one or more holes extending therethrough. The holes may include, for example, an inlet 104 and an outlet 109 of the enclosure 100. In various embodiments, the enclosure wall 105 may be constructed of any material that is sufficiently smooth to promote laminar airflow through the enclosure. For example, the enclosure wall 105 may be constructed of an opaque material, such as sheet metal or other similar materials. In some embodiments, the enclosure wall 105 may be constructed of a transparent material, such as a polymeric or plastic resin (e.g., PLEXIGLAS®, available from Arkema), to allow visual inspection of various regions of the enclosure 100, including the chamber region 106 and the transition region 107. In further embodiments, the enclosure wall 105 may be constructed of a combination of opaque and transparent materials, allowing at least a portion of the interior of the enclosure 100 to be visible from outside the enclosure. In such an embodiment, for example, at least a portion of the chamber region 106, the transition region 107, or both may be visible from outside the enclosure 100.

[0024] The inlet 104 is located at the bottom end 103 of the enclosure 100. In some embodiments, the inlet 104 is an opening in the enclosure wall 105 that allows air to enter the enclosure 100. Alternatively, the inlet 104 can be formed between two opposing enclosure walls rather than through a single enclosure wall. The inlet 104 has a width W inlet 110. In FIG. inlet110 is the width measured in the Y direction from the inner surface 155 of the surrounding wall 105 to the inner surface 155 of the opposite surrounding wall 105 (for example, this width W inlet 110 is the inner width of the inlet 104). inlet 110 is 4 mm or more and 45 mm or less. For example, W inlet 110 can be 4 mm to 45 mm, 4 mm to 40 mm, 4 mm to 35 mm, 4 mm to 30 mm, 4 mm to 25 mm, 4 mm to 20 mm, 4 mm to 15 mm, 4 mm to 10 mm, 10 mm to 45 mm, 15 mm to 45 mm, 20 mm to 45 mm, 25 mm to 45 mm, 30 mm to 45 mm, 35 mm to 45 mm, or 40 to 45 mm. In some embodiments, the central plane 101 passes through the inlet 104 and is inlet In such an embodiment, W inlet 110 is the width measured in a direction perpendicular to the central plane 101. Note that while FIG. 1 shows the inlet 104 as having a constant width throughout its height (±X direction), it is contemplated that in some embodiments the width of the inlet 104 may vary. In such embodiments, W inlet corresponds to the minimum inner width of the inlet 104.

[0025] 1, the enclosure wall 105 of the enclosure 100 defines a chamber region 106. In some embodiments, the enclosure wall 105 extends in the X and Z directions throughout the chamber region 106 and is substantially parallel to the central plane 101 throughout the chamber region 106.

[0026] The chamber region 106 has a width W chamber 111. In FIG. chamber 111 is the width measured in the Y direction from the inner surface 155 of the surrounding wall 105 to the inner surface 155 of the opposite surrounding wall 105 (for example, this width W chamber 111 is the inner width of the chamber region 106). In some embodiments, W chamber 111 is substantially constant. In some embodiments, W chamber111 is between 20mm and 90mm. For example, W chamber 111 can be 20 mm to 90 mm, 30 mm to 90 mm, 40 mm to 90 mm, 50 mm to 90 mm, 60 mm to 90 mm, 70 mm to 90 mm, or even 80 mm to 90 mm. chamber 111 can be 20 mm to 80 mm, 20 mm to 70 mm, 20 mm to 60 mm, 20 mm to 50 mm, 20 mm to 40 mm, or even 20 mm to 30 mm. It should be noted that other widths 111 of chamber region 106 are possible, provided that width 111 is large enough to ensure adequate airflow around the largest diameter of a part being transported through enclosure 100. In some embodiments, W chamber 111 is 2 to 3 times the maximum diameter of the part. Furthermore, in some embodiments, the central plane 101 passes through the chamber region 106 of the enclosure 100 and is chamber 111. In such an embodiment, W chamber 111 is the width measured in a direction perpendicular to the central plane 101.

[0027] The enclosure 100 further includes a transition region 107 between the inlet 104 and the chamber region 106. In some embodiments, the transition region 107 is bounded by a portion of the enclosure wall 105 that is not parallel to the central plane 101. In the transition region 107, the width (e.g., inner width) of the enclosure 100 is W chamber 111 to W inlet1. In some embodiments, the width of enclosure 100 decreases over distance 112 parallel to central plane 101 (e.g., measured in the ±X direction in FIG. 1). In some embodiments, distance 112 is greater than or equal to 200 mm and less than or equal to 900 mm. For example, distance 112 can be 200 mm to 900 mm, 300 mm to 900 mm, 400 mm to 900 mm, 500 mm to 900 mm, 600 mm to 900 mm, 700 mm to 900 mm, or even 800 mm to 900 mm. In further examples, distance 112 can be 200 mm to 800 mm, 200 mm to 700 mm, 200 mm to 600 mm, 200 mm to 500 mm, 200 mm to 400 mm, or even 200 mm to 300 mm. In further embodiments, distance 112 is greater than or equal to W. chamber 111. However, other distances are possible and contemplated, provided that one-dimensional fluid flow is maintained at both the chamber end and the inlet end of the transition region 107. In some embodiments, W inlet 110 and W chamber The ratio of W to W is 1:2 to 1:5, or 1:3 to 1:4. Without being bound by theory, it is believed that the dimensions of the transition region 107 are set as described above (i.e., W inlet 110 and W chamber It is believed that using a ratio of 1:2 to 1:5 between widths of the enclosure 100 ensures that the width of the enclosure 100 does not change so abruptly as to create turbulent flow patterns, such as vortices, in the airflow entering the chamber region 106 from the inlet 104, thereby promoting laminar air flow through the enclosure 100. However, in some embodiments, while the fluid flow at the chamber end and the fluid flow at the inlet end of the transition region 107 are both one-dimensional, it is contemplated that the flow through the transition region 107 may include transitional (turbulent) flow.

[0028] As shown in FIG. 1 , in some embodiments, the enclosure wall 105 includes an S-shaped bend within the transition region 107 of the enclosure 100. In some embodiments, the S-shaped bend includes an inflection point 157 where the direction of the bend changes. Without being bound by theory, it is believed that the presence of the S-shaped bend in the transition region 107 provides a smooth transition from the inlet 104 to the chamber region 106 of the enclosure 100, which aids in laminar air flow through the enclosure 100. While an S-shaped bend is specifically illustrated and described herein, it should be understood that other smooth curves and transition shapes are possible and contemplated, provided that the air flowing through the enclosure 100 does not recirculate or turbulently enter the chamber region 106. For example, in some embodiments, the transition region 107 can be straight, provided that the distance 112 is large enough to maintain one-dimensional fluid flow without backflow.

[0029] The enclosure 100 also includes an inlet port 108 at the top of the enclosure 100. The inlet port 108 is configured to receive a component carrier (not shown in FIG. 1). The inlet port 108 may be, for example, an opening (slot) through which the component may be transported. The inlet port 108 has a width W entry 113. This width W entry 113 is the width measured in the Y direction from the inner surface 158 of one inlet port 108 to the inner surface 158 of the opposite inlet port 108. In some embodiments, W entry 113 is dependent on the dimensions of the component carrier. entry 113 is between 1.0 cm and 5.0 cm. For example, W entry 113 can be 1.0 cm to 5.0 cm, 1.5 cm to 5.0 cm, 2.0 cm to 5.0 cm, 2.5 cm to 5.0 cm, 3.0 cm to 5.0 cm, 3.5 cm to 5.0 cm, 4.0 cm to 5.0 cm, or even 4.5 cm to 5.0 cm. entry113 can be 1.0 cm to 4.5 cm, 1.0 cm to 4.0 cm, 1.0 cm to 3.5 cm, 1.0 cm to 3.0 cm, 1.0 cm to 2.5 cm, 1.0 cm to 2.0 cm, or 1.0 cm to 1.5 cm. Note that other dimensions of W are possible as long as the component carrier can move freely within the inlet port 108 (e.g., in the ±Z direction in FIG. 1). entry It should be understood that 113 is also contemplated and possible. entry 113 is W chamber 1, the central plane 101 passes through the inlet port 108 and, in some embodiments, is smaller than W entry 113 bisects the inlet port 108. In such an embodiment, W entry 113 is the width measured in a direction perpendicular to the central plane.

[0030] In some embodiments, the enclosure 100 further includes at least one exhaust port 109. The exhaust port 109 is disposed between the inlet port 108 and the chamber region 106 of the enclosure 100. In some embodiments, the width of the exhaust port 109 is between 0.5 cm and 3.0 cm. For example, the width of the exhaust port 109 can be between 0.5 cm and 3.0 cm, between 1.0 cm and 3.0 cm, between 1.5 cm and 3.0 cm, between 2.0 cm and 3.0 cm, or between 2.5 cm and 3.0 cm. In further examples, the width of the exhaust port 109 can be between 0.5 cm and 2.5 cm, between 0.5 cm and 2.0 cm, between 0.5 cm and 1.5 cm, or between 0.5 cm and 1.0 cm. The exhaust port 109 extends along an exhaust port axis 112. In embodiments, the outlet axis 112 is oriented at a non-zero angle relative to the central plane 101. For example, the outlet axis 112 can be perpendicular to the central plane 101. In the embodiments shown in FIG. 1 , the outlet axis 112 extends in the ±Y direction from the central plane 101 and lies in the YZ plane. In some embodiments, the enclosure 100 can include two outlets 109. The two outlets 109 are located on opposite sides of the central plane 101 and extend away from the central plane 101 along the outlet axis 112. For example, in embodiments in which the left and right walls of the enclosure 100 are separate walls spaced apart from each other at the ends of the enclosure 100, the outlets 109 can be located on each wall such that the outlets are symmetrically positioned. As another example, in embodiments in which the "left wall" and "right wall" of the enclosure are separate regions extending along the length of the enclosure material (e.g., in embodiments in which one wall has a circular or oval shape), the outlet 109 can be a single flow path extending along the length of the wall.

[0031] In various embodiments, the enclosure 100 has mirror symmetry about the central plane 101. Without wishing to be bound by theory, it is believed that the symmetry of the enclosure 100 promotes airflow through the enclosure 100 with a symmetrical airflow pattern, which in turn promotes smooth (laminar) airflow through the enclosure 100.

[0032] 2, there is shown a diagram of a fluid flow through the enclosure 100. The fluid flow is generally indicated by flow lines 201-204. It should be understood that flow lines 201-204 are illustrative of exemplary paths that a fluid, such as air, may take as it flows through the enclosure 100, and that in the embodiments described herein, the fluid flow is not particularly limited to flow lines 201-204.

[0033] Fluid enters enclosure 100 through inlet 104, as indicated by flow line 201. The fluid is supplied to inlet 104 from a fluid source, such as fluid source 503 (FIG. 5), at a predetermined temperature and humidity. In some embodiments, the fluid has a temperature of 20° C. to 25° C. and a relative humidity (RH) of less than 60%. For example, the fluid can be supplied at a temperature of 20° C. to 25° C., 21° C. to 25° C., 22° C. to 25° C., 23° C. to 25° C., or 24° C. to 25° C. In some embodiments, the temperature is measured by any suitable means, such as a thermometer, thermography, or the like. As further examples, the fluid can be supplied at a relative humidity of less than 60%, less than 55%, less than 50%, less than 45%, or even less than 40%. In some embodiments, the relative humidity is measured by any suitable means, such as a hygrometer. Without being bound by theory, it is believed that placing the glass article immediately after coating in an environment having a temperature of 20°C to 25°C and a relative humidity of less than 60% promotes evaporation of the solvent used in the coating process, resulting in a uniform, high-quality coating on the glass article.

[0034] In several embodiments, the fluid supplied to the enclosure 100 is filtered before entering the enclosure 100. This can be accomplished by passing the fluid through a high-efficiency particulate air (HEPA) filter before providing the fluid to the inlet 104. Any suitable HEPA filtration system known in the art can be used to filter the fluid entering the enclosure 100. It is further contemplated that filters other than HEPA filters can be used depending on the particular embodiment. Without being bound by theory, it is believed that passing the fluid through a HEPA filter can remove particulates from the fluid that could interfere with the coating of glass articles within the enclosure. Therefore, filtering the fluid before entering the enclosure can improve the quality of the coating on the glass articles. Furthermore, passing the fluid entering the enclosure through a HEPA filter can also prevent particulates from entering the enclosure that could contaminate the glass articles. Therefore, filtering the fluid before entering the enclosure can ensure that the glass articles are not contaminated with foreign matter, ensuring that the glass articles are suitable for use in, for example, medical applications.

[0035] Referring again to FIG. 2 , fluid supplied to the enclosure 100 through the inlet 104 travels along flow line 201 through the transition region 107 of the enclosure 100. In some embodiments, the fluid flow through the transition region 107 is substantially laminar (i.e., lacks turbulent flow patterns, such as vortices). In such embodiments, the fluid flowing from the inlet 104 through the transition region 107 moves toward the top end 102 of the enclosure 100 (e.g., in the +X direction), regardless of the fluid's movement in the Y and Z directions. In other words, the fluid flow through the transition region 107 does not exhibit vortices or currents that would otherwise cause air to flow toward the bottom end 103 of the enclosure 100 (e.g., in the −X direction). Without wishing to be bound by theory, it is believed that the smooth contours of the transition region and the W inlet 110 and W chamber A ratio of 111 is believed to ensure that fluid flow through the transition region remains substantially laminar.

[0036] 2 represents the flow of fluid through the chamber region 106 of the enclosure 100. Similar to the transition region 107, the flow of fluid through the chamber region 106 is substantially laminar. As represented by the flow line 202, the fluid continues to move toward the top end 102 of the enclosure 100 (e.g., in the +X direction) until it reaches the outlet 109. At that point, the fluid flows through the outlet 109 and is expelled from the enclosure 100. To help maintain this continuous flow of fluid from the inlet 104 to the outlet 109 in the +X direction, in some embodiments, a vacuum is applied to the outlet 109 to create a pressure differential within the enclosure 100, as described in more detail below.

[0037] In various embodiments, the fluid flow through the enclosure 100 is symmetrical about the central plane 101. As shown in FIG. 3 , when a glass article 302, such as a glass vial, is placed within the enclosure 100, the conditioned fluid entering the enclosure through the inlet 104 uniformly envelopes the surface of the glass article 302 with a symmetrical fluid flow. This ensures that the glass article 302 is protected from ambient air, which may contain particulates that could cause coating defects or contamination of the glass article 302. That is, introducing a fluid into and passing through the enclosure 100 displaces ambient air from the volume of the enclosure and provides the interior volume of the enclosure with conditioned fluid (i.e., a fluid having a desired temperature and / or relative humidity) that aids in uniform treatment of the coating applied to the glass article. In various embodiments, the glass article 302 can be a pharmaceutical container, such as a vial or a syringe. However, the glass article 302 is not limited to these containers.

[0038] Returning to FIG. 2 , it is contemplated that a certain amount of outside air may enter the enclosure 100 through the inlet port 108, as indicated by flow line 203. Unlike the fluid supplied through the inlet 104, the outside air entering the enclosure 100 through the inlet port 108 is not temperature or humidity controlled or filtered to remove particulates. Therefore, in some embodiments, the exhaust port 109 is located near the top end 102 of the enclosure 100 to mitigate the inflow of outside air through the inlet port 108 into the chamber region 106. As indicated by flow line 204, the outside air is exhausted out of the enclosure 100 through the exhaust port 109, preventing it from advancing into the chamber region 106.

[0039] As mentioned above, in some embodiments, the exhaust port 109 is fluidly coupled to a vacuum source (e.g., vacuum source 504 in FIG. 5 ). As mentioned above, this helps maintain a flow of fluid through the enclosure 100. In particular, the vacuum can help ensure that ambient air is expelled from the enclosure 100 before it enters the chamber region 106 and that fluid provided through the inlet 104 continues to move toward the top end 102 of the enclosure 100. Furthermore, the vacuum can also create a sub-ambient pressure within the enclosure 100. As described in more detail below, this, in some embodiments, can ensure that solvent evaporating from the coating on the glass article within the enclosure 100 is expelled through the exhaust port 109. The pressure within the enclosure 100 can be maintained below ambient pressure by controlling the vacuum fluidly coupled to the outlet 109 and the flow rate of fluid supplied to the enclosure 100 through the inlet 104 so that the flow rate of fluid supplied to the enclosure 100 through the inlet 104 is equal to or less than the flow rate of fluid exhausted out of the enclosure 100 through the outlet 109. Thus, the overall flow of fluid through the outlet 109 is greater than the flow of fluid entering the enclosure through the inlet, and a negative pressure can be maintained within the chamber region 106. Any suitable method of controlling fluid flow (e.g., a vacuum pump, etc.) known and utilized in the art can be used to maintain the pressure within the enclosure 100 below ambient pressure.

[0040] 3 and 4, a glass article 302 is coupled to a workpiece carrier 300 by a gripping member 301. The gripping member 301 is configured to move the glass article 302 through the enclosure 100 along the manufacturing line. Specifically, the gripping member 301 of the workpiece carrier 300 extends through the inlet port 108 of the enclosure 100 to hold the glass article 302 within the chamber region 106 of the enclosure 100. Suitable gripping members and workpiece carriers are described in detail in U.S. Pat. No. 10,576,494, the entire contents of which are incorporated herein by reference. As shown in FIGS. 3 and 4, the workpiece carrier 300 moves the glass article 302 within the chamber region 106 of the enclosure 100 along the manufacturing line path (e.g., in the +Z direction). In some embodiments, the workpiece carrier 300 moves the glass article 302 through the chamber region 106 along the central plane 101. In embodiments, the placement of the glass article 302 within the enclosure 100 may be such that the glass article 302 is approximately bisected by the central plane 101 .

[0041] In some embodiments, the component carrier 300 includes a plate 303. The plate 303 is positioned between the inlet port 108 and the chamber region 106 of the enclosure 100. The gripping member 301 is attached to the plate 303, so that the plate 303 moves with the gripping member 301 within the enclosure 100. In some embodiments, the plate 303 can be oriented such that the surface of the plate facing the inlet port 108 is in a plane perpendicular to the central plane 101.

[0042] The plate 303 has a width W plate 304. In this specification, W plate 304 refers to the maximum distance between two points on the edge of plate 303 measured across plate 303 (rather than on the perimeter of plate 303). plate 304 is W chamber It is larger than 111. plate 304 is Wchamber 111, the plate 303 extends into the outlet 109. plate 304 is W entry 113 or larger. In such embodiments, the plate 303 ensures that there is no direct, straight path between the inlet port 108 and the glass article 302. Thus, the plate 303 can redirect the outside air entering the enclosure 100 through the inlet port 108 toward the outlet 109. Furthermore, the plate 303 can also ensure that any particulates entering the enclosure 100 through the inlet port 108 are trapped, preventing them from contacting the glass article 302. In some embodiments, the W plate 304, W entry Larger than 113 and W chamber It can also be smaller than 111.

[0043] In some embodiments, the plate 303 may be disk-shaped, although other shapes for the plate 303 are contemplated. When the plate 303 has a circular shape, W plate corresponds to the diameter of plate 303. In some embodiments, the disk has the advantage of uniformly directing the flow of outside air entering through inlet port 108 away from glass articles 302 being transported within enclosure 100. Furthermore, in embodiments in which gripping member 301 rotates within enclosure 100 (e.g., about axes extending in the ±X directions in the figures), the use of a disk allows for the rotation of gripping member 301 to be controlled by W plate and W chamber Relationship with or W plate and W entry The relationship will remain constant.

[0044] Figure 4 is a schematic side view of the enclosure 100 shown in Figure 3 to better illustrate the central plane 101 and the component carrier 300. As can be seen in Figure 4, the component carrier 300 is part of a manufacturing line for producing glass articles 302. The central plane 101 is an XZ plane and extends through the inlet 104 at the bottom end 103 of the enclosure 100 and through the inlet port 108 at the top end 102 of the enclosure 100. Furthermore, the central plane 101 also extends along the length of the enclosure 100, measured in the ±Z directions.

[0045] 4, the workpiece carrier 300 includes a plurality of gripping members 301 that can be transported through the enclosure 100. Each gripping member 301 is coupled to a glass article 302 and moves the glass article 302 through the chamber region 106 of the enclosure 100. The plurality of gripping members 301 move sequentially along the length of the enclosure 100 and along the manufacturing line path. In one or more embodiments, the gripping members 301 move the glass article 302 through the chamber region 106 along the central plane 101.

[0046] 5 , the component carrier 300 is positioned to facilitate the movement of the glass article 302 from the coating device 501 where the glass article 302 is coated, through the enclosure 100, and into the curing device 502 where the coating on the surface of the glass article 302 is cured. It is contemplated and possible, depending on the particular embodiment, to position the component carrier 300 (and the enclosure 100) at other locations within the glass article manufacturing line. It is further contemplated that, in some embodiments, the gripping member 301 of the component carrier 300 may be replaced by another connection for engaging the glass article 302. Such a connection may include, for example, a platform on which the glass article 302 rests, a suction device, or the like.

[0047] 5 , in use, the gripping members 301 of the component carrier 300 engage the glass article 302, such as by a vacuum chuck or by grasping the neck region of the glass article 302 with robotic fingers. Engagement with the glass article 302 can occur, for example, within the coating apparatus 501 or upstream of the coating apparatus 501 (e.g., before the glass article 302 enters the coating apparatus 501) as the glass article 302 moves along the glass article production line. The gripping members 301 move along the production line path into the enclosure 100, thereby laterally moving the glass article 302 into and through the enclosure 100.

[0048] In some embodiments, the enclosure 100 has an open end (not shown) that allows the glass article 302 to be placed within the chamber region 106 and moved between the enclosure walls 105 of the enclosure 100 while the gripping member 301 remains through the inlet port 108. In such embodiments, a fluid knife, such as an air knife, can be positioned along the open end to prevent particulates and ambient air from entering the enclosure 100. In embodiments in which the enclosure 100 includes a single enclosure wall 105 that is curved at one or both ends of the enclosure 100, the enclosure wall 105 having first and second portions of the inner surface 155 of the enclosure 105, the first and second portions of the inner surface 155 facing each other and parallel to each other, the inlet port 108 can have an area near the end of the enclosure 100 that is wider than the glass article 302 and the component carrier 300 (including the gripping member 301 and plate 303). In such embodiments, the component carrier 300 can move the glass article 302 along the manufacturing line path (e.g., in ±Z directions) while vertically lowering the glass article 302 (e.g., moving the glass article 302 in ±X directions) to deposit the glass article 302 through the inlet port 108 into the chamber region 106 of the enclosure 100.

[0049] As shown in FIG. 5 , conditioned fluid enters enclosure 100 from fluid source 503 through inlet 104. In some embodiments, fluid source 503 is coupled to inlet 104 by manifold 510. In some embodiments, manifold 510 can include baffles or perforated plates to promote uniform fluid flow through inlet 104. The fluid is conditioned to a predetermined temperature, humidity, and particulate concentration. Such conditioning can be achieved through various heating, humidity, and filtration systems. In some embodiments, the conditioned fluid is supplied to inlet 104 at a predetermined flow rate and pressure and flows through enclosure 100 to outlet 109, as described above with reference to FIG. 2 .

[0050] As discussed above, in some embodiments, the enclosure 100 further includes a vacuum source 504 attached to the outlet 109. Accordingly, the vacuum source 504, such as a vacuum pump, is fluidly coupled to the outlet 109 by a manifold 511, thereby enabling fluid to be drawn from the enclosure 100 through the outlet 109. Furthermore, in some embodiments, the vacuum source 504, as discussed above, establishes a negative pressure within the enclosure 100, thereby assisting the conditioned fluid to flow from the lower end 103 of the enclosure 100 toward the upper end 102 of the enclosure 100 and out the outlet 109.

[0051] The component carrier 300 moves the glass article 302 along the manufacturing line path and through the enclosure 100. Additionally, in some embodiments, the component carrier 300 can rotate the glass article 302 about an axis of rotation that extends in the ±X direction through the center of the glass article 302 and resides within the central plane 101. In some embodiments, the component carrier 300, and more particularly, the gripping member 301, rotates the glass article 302 at a speed of 1000 to 3000 revolutions per minute (RPM).

[0052] In some embodiments, when the glass article 302 enters the enclosure 100, the coating on the glass article 302 contains one or more solvents. The solvent evaporates from the surface of the glass article 302 as the coated glass article 302 moves through the enclosure 100, resulting in the generation of solvent vapor within the enclosure 100. For example, the solvent vapor may be released from the surface of the glass article 302 as the coating semi-cures due to the temperature and / or humidity of the environment within the enclosure 100. In some embodiments, the solvent vapor is vented from the enclosure 100 via a fluid and discharged to the outside of the enclosure 100 through the exhaust port 109. Without being bound by theory, it is believed that, as described above, maintaining a pressure within the enclosure 100 below atmospheric pressure prevents the solvent from escaping into the atmosphere. By creating a negative pressure within the enclosure 100, almost all of the fluid within the enclosure 100 is discharged out of the enclosure 100 through the outlet 109, allowing the solvent to be removed from the fluid before it is released into the environment.

[0053] In some embodiments, the solvent vapor-laden fluid is directed from outlet 109 through manifold 511 and vacuum source 504 to solvent recovery system 505 (i.e., air purification system), which removes solvent vapor from the fluid flowing from outlet 109, such as by filtration or adsorption, before discharging the fluid into the environment or sending it for recycling. This solvent capture reduces solvent in the environment and aids in the reuse and recycling of fluids and solvents.

[0054] In some embodiments, the temperature of the enclosure 100 can be controlled to allow the enclosure 100 to function as a curing chamber. In such embodiments, the temperature within the enclosure is maintained at a temperature above 300°C, depending on the curing temperature of the coating. Accordingly, in some embodiments, the air entering the enclosure 100 is heated. For example, a heater can be installed outside the metal passageway supplying air to the enclosure 100 to raise the temperature of the air entering the enclosure to above 300°C. Alternatively, the air can be brought to the desired temperature by passing it through a heating unit. Using the enclosure 100 as a curing chamber can prevent particles from adhering to the coating on the glass article before the coating is cured. Additionally or alternatively, in some embodiments, the enclosure 100 is temperature-controlled to control the ignition of the solvent. In such embodiments, the temperature of the enclosure 100 is limited by the flammability limits of the solvent used to coat the glass article 302, but is typically in the range of 60°C to 100°C.

[0055] The part carrier 300 continues to move the plurality of glass articles 302 along the manufacturing line path until it reaches the next manufacturing station or location (in embodiments, a curing device 502). In embodiments, the coating on each glass article 302 may be cured within the enclosure 100, or the glass articles 302 may be introduced into the curing device 502 after exiting the enclosure 100. Thus, it is contemplated that the curing device 502 may be located within the enclosure 100 or adjacent to the enclosure 100, depending on the particular embodiment. The curing device 502 may be any suitable type of curing device, depending on the specific coating to be applied to the glass articles 302. For example, the curing device 502 may be an oven or a light source (e.g., an infrared or ultraviolet light source). The glass articles 302 may then be removed from the enclosure 100 in a manner similar to that in which they were placed within the enclosure 100. [Example]

[0056] The examples are representative embodiments of the subject matter of this disclosure and are not intended to limit the scope of the claims.

[0057] ANSYS FLUENT™ software (Ansys, Inc.) was used to model a three-dimensional computational fluid dynamics (3D CFD) model of fluid flow through an enclosure according to one or more embodiments described in the detailed description of the invention. inlet 2.54 cm, W chamber The model was based on an enclosure with a diameter of 7.62 cm and two 2.54 cm wide outlets. entry The clearance between the gripping element and the inlet port was 3.81 cm, with a 0.41 cm clearance on each side of the gripping element. The air velocity entering the inlet was 1.8 m / s, and the air velocity exiting the outlet was 1.0 m / s per outlet, creating an imbalance between the air flow through the inlet and the air flow through the outlet. This 3D CFD model was used to predict in detail the flow patterns through the enclosure during steady-state operation. Figures 6-10 show the flow patterns of various fluids and particulates as shown by the path lines.

[0058] Figure 6 is a diagram illustrating a pathline generated by a three-dimensional CFD model that visualizes the flow of fluid entering through the inlet 104 and passing through the enclosure 100. As shown in Figure 6, all of the fluid entering through the inlet 104 exits the enclosure 100 through the outlet 109. Furthermore, the pathline shows that the fluid flow was consistently in an upward direction toward the top end 102 of the enclosure 100. The pathline depicting the fluid flow entering through the inlet 104 and passing through the enclosure 100 does not include any swirls or vortices, suggesting that the fluid flow from the inlet 104 to the outlet 109 was substantially laminar.

[0059] FIG. 7 illustrates the path lines emanating from a glass article 302. In this example, the glass article 302 takes the form of a glass vial. The path lines represent fluid flow from the surface of the glass article 302. This simulation replicates the case where the glass article 302 is rotated at 2000 RPM within the enclosure 100. Thus, the path lines wrap around the glass article 302. As with FIG. 6, the path lines in FIG. 7 all point toward the outlet 109, suggesting that none of the fluid that came into contact with the glass article 302 exited the enclosure 100 through the inlet port 108.

[0060] 8 is a diagram showing the concentration of solvent vapor inside enclosure 100 when the concentration of solvent vapor on the surface of the glass article is 11% by mass. From FIG. 8, it can be seen that the solvent vapor rising from the surface of the glass article is discharged outside enclosure 100 from outlet 109, not from inlet port 108.

[0061] 9 is a diagram illustrating the flow of outside air from inlet port 108 into enclosure 100. Specifically, the path lines in FIG. 9 show that the outside air that entered enclosure 100 from inlet port 108 was exhausted to the outside of enclosure 100 through outlet 109, and that such outside air did not enter chamber region 106 of enclosure 100 or come into contact with glass article 302. Furthermore, it is believed that the flow of outside air from inlet port 108 into enclosure 100 prevented solvent vapor from escaping outside enclosure 100 from inlet port 108.

[0062] Next, a diameter of 100 μm and a density of 2000 kg / m 3A simulation was performed in which spherical particles of size 100 entered enclosure 100 through inlet port 108. The path lines shown in FIG. 10 indicate that the majority of these particles were removed from enclosure 100 via outlet 109 before entering chamber region 106 of enclosure 100. However, some particles entered chamber region 106 of enclosure 100 and contacted glass article 302. It is believed that providing a disk or plate, such as plate 303 (FIG. 3), on the part carrier can capture these larger particles before they enter the chamber region and also direct smaller particles and air entering through inlet port 108 to outlet 109 to help remove them from the enclosure.

[0063] Additionally, fluid flow through the enclosure 100 without the part carrier 300 or glass article 302 was also modeled. 3 A simulation was carried out in which spherical particles of 100 μm diameter and 2000 kg / m density were allowed to enter the enclosure 100 through the inlet port 108. FIG. 11 shows the path of the particles entering the enclosure 100 through the inlet port 108 and being discharged to the outside of the enclosure 100 through the outlet 109. Even without providing the gripping member 301 occupying the space within the inlet port 108, the particles did not enter the chamber region 106. Therefore, a simulation was carried out in which spherical particles of 100 μm diameter and 2000 kg / m density were allowed to enter the enclosure 100 through the outlet 109. 3 It is unlikely that such foreign matter would enter the enclosure 100 through the gap between the gripping members 301 at the inlet port 108.

[0064] In a first aspect of the present disclosure, an enclosure for providing a controlled environment includes a central plane extending through an upper end of the enclosure and a lower end of the enclosure, bisecting the enclosure along a width of the enclosure, and an inlet opening of width W provided at the lower end of the enclosure. inlet a surrounding wall extending from the inlet to a top end of the enclosure; an inlet port disposed at the top end of the enclosure and configured to receive a component carrier; and an outlet disposed between the inlet port and a chamber region of the surrounding wall. The surrounding wall includes a chamber region and a transition region between the inlet and the chamber region. The width W of the chamber regionchamber is substantially constant over the chamber region. In the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio may be between 1:2 and 1:5. The central plane passes through the inlet and the inlet port of the enclosure. The outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane.

[0065] A second aspect of the present disclosure may include the first aspect, which has mirror symmetry about a central plane.

[0066] In a third aspect of the present disclosure, the width of the enclosure is W over a distance of 200 mm to 900 mm. inlet From W chamber The present invention may include either the first or second aspect, which changes to:

[0067] A fourth aspect of the present disclosure is a method for manufacturing a semiconductor device comprising: inlet The present invention may include any of the first to third aspects, wherein the thickness is 4 mm to 45 mm.

[0068] A fifth aspect of the present disclosure is a method for manufacturing a semiconductor device comprising: chamber The present invention may include any of the first to fourth aspects, in which the distance is 20 mm to 90 mm.

[0069] A sixth aspect of the present disclosure may include any of the first to fifth aspects, wherein the surrounding wall includes an S-shaped curve with an inflection point in the transition region.

[0070] A seventh aspect of the present disclosure may include any of the first to sixth aspects, in which the outlet axis is perpendicular to the central plane.

[0071] In an eighth aspect of the present disclosure, a manufacturing line for manufacturing glass articles includes an enclosure and a part carrier, the enclosure having a central plane extending through an upper end of the enclosure and a lower end of the enclosure, the central plane bisecting the enclosure along a width of the enclosure, and an inlet width W provided at the lower end of the enclosure. inleta surrounding wall extending from the inlet to a top end of the enclosure; an inlet port disposed at the top end of the enclosure and configured to receive a component carrier; and an outlet disposed between the inlet port and a chamber region of the surrounding wall. The surrounding wall includes a chamber region and a transition region between the inlet and the chamber region. The width W of the chamber region chamber is substantially constant over the chamber region. In the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio can be between 1:2 and 1:5. The central plane passes through the inlet and the inlet port of the enclosure. The outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane. The gripping members of the workpiece carrier are positioned through the inlet port, and the workpiece carrier is configured to move the glass article through the chamber region of the enclosure.

[0072] A ninth aspect of the present disclosure may include the eighth aspect, wherein the component carrier comprises a plate disposed between the inlet port and the chamber region and extending along a plane perpendicular to the central plane, and wherein the gripping member extends through the plate.

[0073] A tenth aspect of the present disclosure is a method for manufacturing a plate comprising: chamber Width W greater than or equal to plate A ninth aspect may include the ninth aspect, wherein

[0074] An eleventh aspect of the present disclosure is a method for manufacturing a suction port, the suction port having a width W entry and the plate width W plate is the width of the inlet port W entry The present invention may include any of the ninth or tenth aspects, which are greater than or equal to:

[0075] A twelfth aspect of the present disclosure is a method for manufacturing a valve having an inlet port width W entry is the width of the chamber area W chamber The present invention may include any of the ninth to eleventh aspects, wherein the total length is smaller than

[0076] A thirteenth aspect of the present disclosure may include any of the ninth to twelfth aspects, in which the plate extends into the outlet.

[0077] A fourteenth aspect of the present disclosure is a method for manufacturing a plate comprising: chamber A ninth embodiment may include a circular plate having a diameter of at least one of the above.

[0078] A fifteenth aspect of the present disclosure may include any of the eighth to fourteenth aspects, in which the outlet axis is perpendicular to the central plane.

[0079] In a sixteenth aspect of the present disclosure, a method for transporting a coated article includes the steps of placing the coated article within an enclosure, supplying a fluid flow to the enclosure through an inlet, discharging the fluid flow out of the enclosure through an outlet, and moving the coated article along a path through the enclosure and substantially parallel to a central plane. The enclosure has a central plane extending through an upper end of the enclosure and a lower end of the enclosure, bisecting the enclosure along a width of the enclosure, and an inlet width W at the lower end of the enclosure. inlet a surrounding wall extending from the inlet to a top end of the enclosure; an inlet port disposed at the top end of the enclosure and configured to receive a component carrier; and an outlet disposed between the inlet port and a chamber region of the surrounding wall. The surrounding wall includes a chamber region and a transition region between the inlet and the chamber region. The width W of the chamber region chamber is substantially constant over the chamber region. In the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio may be between 1:2 and 1:5. The central plane passes through the inlet and inlet ports of the enclosure, and the outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane.

[0080] A seventeenth aspect of the present disclosure may include the sixteenth aspect, wherein during the step of moving the coated article through the enclosure, vapor is released from the coated article and the vapor is removed from the enclosure through an exhaust port.

[0081] An eighteenth aspect of the present disclosure may include any of the sixteenth or seventeenth aspects, wherein the step of moving the coated article further includes the step of rotating the coated article about an axis located at the center of the coated article and substantially parallel to the central plane.

[0082] A nineteenth aspect of the present disclosure may include the eighteenth aspect, wherein the coated article is rotated at a speed of 1000 to 3000 rpm.

[0083] A twentieth aspect of the present disclosure may include any of the sixteenth to eighteenth aspects, in which the pressure inside the enclosure is lower than the external atmospheric pressure.

[0084] A twenty-first aspect of the present disclosure may include any of the sixteenth to twentieth aspects, in which the step of exhausting the fluid flow outside the enclosure includes applying a vacuum to the exhaust port.

[0085] A twenty-second aspect of the present disclosure may include any of the sixteenth to twenty-first aspects, in which the flow of fluid through the enclosure is substantially laminar.

[0086] A 23rd aspect of the present disclosure may include any of the 16th to 22nd aspects, wherein the fluid supplied to the enclosure has a temperature of 20 to 25° C. and a relative humidity of less than 60%.

[0087] A twenty-fourth aspect of the present disclosure may include any of the sixteenth to twenty-third aspects, in which the step of supplying a flow of fluid to the enclosure further includes the step of passing the air through a HEPA filter.

[0088] A 25th aspect of the present disclosure may include any of the 16th to 24th aspects, wherein the fluid supplied to the enclosure has a temperature of 300°C or higher at which the coated article hardens within the enclosure.

[0089] It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments described herein without departing from the spirit and scope of the embodiments. It is believed that those skilled in the art can conceive of variations, combinations, subcombinations, and modifications of the embodiments while incorporating the intent and spirit of the embodiments of the present disclosure, and therefore the embodiments of the present disclosure should be construed as including all within the scope of the appended claims and their equivalents.

[0090] Preferred embodiments of the present invention will be described below in detail.

[0091] Embodiment 1 1. An enclosure for providing a controlled environment, comprising: a central plane extending through the upper end of the enclosure and the lower end of the enclosure and bisecting the enclosure along the width of the enclosure; An inlet width W inlet an inlet having an enclosure wall extending from the inlet to the upper end of the enclosure, the enclosure wall including a chamber region and a transition region between the inlet and the chamber region, the chamber region having a width W chamber is substantially constant throughout the chamber region, and in the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio of the surrounding wall is 1:2 to 1:5; an inlet port at the top end of the enclosure configured to receive a component carrier; an outlet disposed between the inlet port and the chamber region of the enclosure wall; Equipped with the central plane passes through the inlet and the inlet port of the enclosure; The enclosure, wherein the outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane.

[0092] Embodiment 2 2. The enclosure of claim 1, having mirror symmetry about the central plane.

[0093] Embodiment 3 The width of the enclosure is W over a distance of 200 mm to 900 mm. inlet From W chamber The enclosure of claim 1 .

[0094] Embodiment 4 W inlet 2. The enclosure of embodiment 1, wherein the thickness is 4 mm to 45 mm.

[0095] Embodiment 5 W chamber The enclosure according to embodiment 1, wherein the thickness is 20 mm to 90 mm.

[0096] Embodiment 6 2. The enclosure of claim 1, wherein the enclosure wall comprises an S-shaped curve with an inflection point within the transition region.

[0097] Embodiment 7 2. The enclosure of embodiment 1, wherein the outlet axis is perpendicular to the central plane.

[0098] Embodiment 8 an enclosure; A parts carrier; A production line for producing glass articles, comprising: The enclosure is a central plane extending through the upper end of the enclosure and the lower end of the enclosure and bisecting the enclosure along the width of the enclosure; An inlet width W inlet an inlet having an enclosure wall extending from the inlet to the upper end of the enclosure, the enclosure wall including a chamber region and a transition region between the inlet and the chamber region, the chamber region having a width W chamberis substantially constant throughout the chamber region, and in the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio of the surrounding wall is 1:2 to 1:5; an inlet port at the top end of the enclosure configured to receive a component carrier; an outlet disposed between the inlet port and the chamber region of the surrounding wall; the central plane passes through the inlet and the inlet port of the enclosure; the outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane; a gripping member of the workpiece carrier is positioned through the inlet port; The manufacturing line, wherein the workpiece carrier is configured to move glass articles through the chamber region of the enclosure.

[0099] Embodiment 9 the component carrier includes a plate disposed between the inlet port and the chamber region and extending along a plane perpendicular to the central plane; 9. The manufacturing line of claim 8, wherein the gripping members extend through the plate.

[0100] Embodiment 10 The plate is W chamber Width W greater than or equal to plate 10. The manufacturing line of embodiment 9, comprising:

[0101] Embodiment 11 The inlet port has a width W entry It has The width W of the plate plate is the width W of the inlet port entry 10. The manufacturing line of embodiment 9, wherein the manufacturing line is larger than

[0102] Embodiment 12 The width W of the inlet portentry is the width W of the chamber region chamber 12. The manufacturing line of embodiment 11, wherein the manufacturing line is smaller than

[0103] Embodiment 13 10. The manufacturing line of claim 9, wherein the plate extends into the outlet.

[0104] Embodiment 14 The plate is W chamber 10. The manufacturing line of embodiment 9, comprising a disk having a diameter of at least

[0105] Embodiment 15 9. The manufacturing line of claim 8, wherein the outlet axis is perpendicular to the central plane.

[0106] Embodiment 16 1. A method of transporting a coated article, the method comprising: placing the coated article within an enclosure; The enclosure is a central plane extending through the upper end of the enclosure and the lower end of the enclosure and bisecting the enclosure along the width of the enclosure; An inlet width W inlet an inlet having an enclosure wall extending from the inlet to the upper end of the enclosure, the enclosure wall including a chamber region and a transition region between the inlet and the chamber region, the chamber region having a width W chamber is substantially constant throughout the chamber region, and in the transition region, the width of the enclosure is W chamber From W inlet W chamber and W inlet The ratio of the surrounding wall is 1:2 to 1:5; an inlet port at the top end of the enclosure configured to receive a component carrier; an outlet disposed between the inlet port and the chamber region of the surrounding wall; the central plane passes through the inlet and the inlet port of the enclosure; arranging the outlet to extend along an outlet axis oriented at a non-zero angle relative to the central plane; providing a fluid flow into the enclosure through the inlet; Discharging the fluid flow out of the enclosure through the outlet; moving the coated article through the enclosure and along a path substantially parallel to the central plane; A method comprising:

[0107] Embodiment 17 vapor is released from the coated article during the step of moving the coated article through the enclosure; 17. The method of embodiment 16, wherein the vapor is removed from the enclosure through the outlet.

[0108] Embodiment 18 17. The method of claim 16, wherein moving the coated article further comprises rotating the coated article about an axis located at the center of the coated article and substantially parallel to the central plane.

[0109] Embodiment 19 19. The method of embodiment 18, wherein the coated article is rotated at a speed of 1000 to 3000 rpm.

[0110] Embodiment 20 17. The method of embodiment 16, wherein the pressure within the enclosure is less than the ambient atmospheric pressure.

[0111] Embodiment 21 17. The method of claim 16, wherein exhausting the fluid flow outside the enclosure comprises applying a vacuum to the exhaust port.

[0112] Embodiment 22 17. The method of embodiment 16, wherein the fluid flow through the enclosure is substantially laminar.

[0113] Embodiment 23 17. The method of claim 16, wherein the fluid provided to the enclosure has a temperature of 20-25°C and a relative humidity of less than 60%.

[0114] Embodiment 24 17. The method of claim 16, wherein the step of providing the fluid flow to the enclosure further comprises passing the air through a HEPA filter.

[0115] Embodiment 25 17. The method of claim 16, wherein the fluid supplied to the enclosure has a temperature of 300° C. or greater. [Explanation of symbols]

[0116] 100 Enclosure 101 Center plane 102 Upper end 103 Lower end 104 Inlet 105 Siege Wall 106 Chamber Area 107 Transient region 108 Inlet Port 109 Outlet 110 W inlet 111 W chamber 113 W entry 155 (of a siege wall) inner surface 157 Inflection point (of the curvature of the siege wall) 158 (inlet port) inner surface 201, 202, 203, 204 flow lines 300 Parts Carrier 301 Gripping member 302 Glass articles 303 Plate 304 W plate 501 Coating equipment 502 Curing equipment 503 Fluid Source 504 Vacuum source 505 Solvent Recovery System 510, 511 Manifold

Claims

1. 1. An enclosure for providing a controlled environment, comprising: a central plane extending through the upper end of the enclosure and the lower end of the enclosure and bisecting the enclosure along the width of the enclosure; An inlet width W inlet an inlet having an enclosure wall extending from the inlet to the upper end of the enclosure, the enclosure wall including a chamber region and a transition region between the inlet and the chamber region, the chamber region having a width W chamber is substantially constant throughout the chamber region, and in the transition region, the width of the enclosure is W chamber From W inlet It decreases to W chamber and W inlet a ratio of 1:2 to 1:5; and an inlet port at the top end of the enclosure configured to receive a component carrier; an outlet disposed between the inlet port and the chamber region of the enclosure wall; Equipped with the central plane passes through the inlet and the inlet port of the enclosure; the outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane; the component carrier includes a plate disposed between the inlet port and the chamber region and extending along a plane perpendicular to the central plane; a gripping member extending through the plate; the inlet port has a width W entry and the plate has a width W plate ; An enclosure wherein the width of the plate, W plate , is equal to or greater than W chamber or greater than the width of the inlet port, W entry .

2. The enclosure of claim 1 having mirror symmetry about the central plane.

3. The enclosure of claim 1 , wherein the enclosure wall comprises an S-shaped curve with an inflection point in the transition region.

4. an enclosure; A parts carrier; A production line for producing glass articles, comprising: The enclosure is a central plane extending through the upper end of the enclosure and the lower end of the enclosure and bisecting the enclosure along the width of the enclosure; An inlet width W inlet an inlet having an enclosure wall extending from the inlet to the upper end of the enclosure, the enclosure wall including a chamber region and a transition region between the inlet and the chamber region, the chamber region having a width W chamber is substantially constant throughout the chamber region, and in the transition region, the width of the enclosure is W chamber From W inlet It decreases to W chamber and W inlet a ratio of 1:2 to 1:5; and an inlet port at the top end of the enclosure configured to receive a component carrier; an outlet disposed between the inlet port and the chamber region of the surrounding wall; the central plane passes through the inlet and the inlet port of the enclosure; the outlet extends along an outlet axis oriented at a non-zero angle relative to the central plane; a gripping member of the workpiece carrier is positioned through the inlet port; the workpiece carrier is configured to move glass articles through the chamber region of the enclosure; the component carrier includes a plate disposed between the inlet port and the chamber region and extending along a plane perpendicular to the central plane; the gripping member extends through the plate; the inlet port has a width W entry and the plate has a width W plate ; A manufacturing line in which the width of the plate W plate is equal to or greater than W chamber or greater than the width of the inlet port W entry .

5. The width W of the inlet port entry is the width W of the chamber region chamber The manufacturing line of claim 4, wherein the

6. 1. A method of transporting a coated article, the method comprising: placing the coated article within an enclosure; The enclosure is a central plane extending through the upper end of the enclosure and the lower end of the enclosure and bisecting the enclosure along the width of the enclosure; An inlet width W inlet an inlet having an enclosure wall extending from the inlet to the upper end of the enclosure, the enclosure wall including a chamber region and a transition region between the inlet and the chamber region, the chamber region having a width W chamber is substantially constant throughout the chamber region, and in the transition region, the width of the enclosure is W chamber From W inlet It decreases to W chamber and W inlet a ratio of 1:2 to 1:5; and an inlet port at the top end of the enclosure configured to receive a component carrier; an outlet disposed between the inlet port and the chamber region of the surrounding wall; the central plane passes through the inlet and the inlet port of the enclosure; arranging the outlet to extend along an outlet axis oriented at a non-zero angle relative to the central plane; providing a fluid flow into the enclosure through the inlet; Discharging the fluid flow out of the enclosure through the outlet; moving the coated article through the enclosure and along a path substantially parallel to the central plane; Including, vapor is released from the coated article during the step of moving the coated article through the enclosure; The vapor is removed from the enclosure through the outlet.

7. 7. The method of claim 6, wherein moving the coated article further comprises rotating the coated article about an axis located at the center of the coated article and substantially parallel to the central plane.

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