On-board chargers and inverters

Abstract

To enable, when using a heat dissipation mechanism integrally molded into a box shape and provided with an opening on only one side, dissipating heat of heat-generating electronic components while preventing increase in size of the heat dissipation mechanism.SOLUTION: A heat dissipation structure 1 of a heat-generating electronic component includes: a circuit board 9; electronic components 5a, 5b self-heating when the power is supplied and each having a lead wire 6a, 6b connected to the circuit board 9; an aluminum block 3 with which the heat dissipation surfaces of the electronic components 5a and 5b are in contact and on which the electronic components 5a and 5b are arranged; and a heat sink 2 that is integrally molded into a box shape with a bottom surface F2 on which the aluminum block 3 is arranged, and an opening surface F1 facing the bottom surface F2, for dissipating heat from the aluminum block 3. The electronic components 5a and 5b are fixed to the aluminum block 3 from directions other than a vertical direction D with respect to the bottom surface F2. The aluminum block 3 and the circuit board 9 are arranged in the order of the aluminum block 3 and the circuit board 9 along the vertical direction D from the bottom surface F2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an on-board charger and an inverter. [Background technology]

[0002] It is known that a circuit board and electronic components are housed in a roughly rectangular parallelepiped housing formed of a heat dissipation material, and heat generated by the electronic components is dissipated through the housing. Two methods are known for manufacturing such a roughly rectangular parallelepiped housing structure: a method in which a housing whose top and side surfaces are integrally molded into a box shape and whose bottom surface is open is placed over the other housing, and a method in which a housing whose bottom surface (bottom surface) and side surfaces are integrally molded into a box shape and whose top surface is open is placed over the other housing with a lid member (top surface).

[0003] When using a method in which a housing with a box-shaped top and sides integrally molded and an open bottom is placed over the housing from above, there are no sides when attaching boards or electronic components to the bottom, so it is possible to screw the electronic components in place from the side. However, this places restrictions on the placement of terminals (connectors) for electrically connecting electronic components stored inside the housing to electronic components outside the housing.

[0004] Generally, when providing a connector on a side surface, it is preferable to use a method in which the bottom surface and side surfaces are integrally molded into a box shape and the housing has an open top surface and is covered with a lid member (top surface).

[0005] However, in the method of covering a housing whose bottom and sides are integrally molded into a box shape and whose top is open with a lid member (top), since the bottom and sides are integrally molded into a box shape, it is not possible to screw electronic components in from the side, and they must be screwed in from the open top.

[0006] One possible method of screwing in order to secure an electronic component from the open top surface is to bend the lead wires of the heat-generating electronic component so that the heat dissipation surface of the heat-generating electronic component is placed in direct contact with the bottom surface, and then screw in an elastic member from above so that the elastic member, as disclosed in Patent Document 1, presses down on the surface opposite the heat dissipation surface. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-217343 Summary of the Invention [Problem to be solved by the invention]

[0008] However, in the method of placing heat-generating electronic components on the bottom surface of the heat dissipation mechanism described above, in order to ensure the heat dissipation effect, an area is required on the bottom surface of the heat dissipation mechanism where the heat dissipation surface of the heat-generating electronic components comes into contact and an area is required on the part where the elastic member is installed, which may result in an increase in the bottom surface area and ultimately in the size of the entire device.

[0009] The object of the present invention is to provide an on-board charger and inverter that can accommodate heat dissipation from heat-generating electronic components while preventing the charger and inverter from becoming too large when using a heat dissipation mechanism that is integrally molded into a box shape and has an opening on only one side. [Means for solving the problem]

[0010] An on-board charger according to one embodiment of the present invention includes a circuit board, a heat-generating electronic component connected to the circuit board, and a heat transfer body in which the heat-generating electronic component is disposed. The heat transfer body has an accommodation section with a space for accommodating a reactor component, the reactor component is thermally connected to a heat-dissipating component, and a potting material is filled between the reactor component and the accommodation section, so that the reactor component and the heat transfer body are thermally connected by the potting material. The heat transfer body has a second surface and a third surface, and the heat transfer body is thermally connected to the heat-generating electronic component via the second surface and the heat transfer body is thermally connected to the reactor component by the potting material via the third surface. The heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to the first surface of the heat-dissipating component. a circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body on which the heat-generating electronic component is disposed, the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component being thermally connected to a heat-dissipating component, a potting material being filled between the reactor component and the accommodation section, whereby the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component by the potting material via the third surface, and a heat-dissipating member being disposed between the heat transfer body and the circuit board. a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component thermally connected to a heat-dissipating component; a potting material filled between the reactor component and the accommodation section, whereby the reactor component and the heat transfer body are thermally connected by the potting material; the heat transfer body having a second surface and a third surface, the heat transfer body thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body thermally connected to the reactor component via the potting material via the third surface; an insulating and heat-dissipating member disposed between the heat transfer body and the circuit board; and a pattern formed on the circuit board at a location corresponding to the insulating and heat-dissipating member.

[0011] An inverter according to one embodiment of the present invention includes a circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body in which the heat-generating electronic component is disposed, the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component being thermally connected to a heat-dissipating component, and a potting material being filled between the reactor component and the accommodation section, so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component by the potting material via the third surface, and the heat-generating electronic component being fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat-dissipating component. a circuit board, a heat-generating electronic component connected to the circuit board, a heat transfer body on which the heat-generating electronic component is disposed, the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component being thermally connected to a heat-dissipating component, a potting material being filled between the reactor component and the accommodation section, so that the reactor component and the heat transfer body are thermally connected by the potting material, the heat transfer body having a second surface and a third surface, the heat transfer body being thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body being thermally connected to the reactor component by the potting material via the third surface, the heat-generating electronic component being fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat-dissipating component. a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; the heat transfer body having an accommodation section with a space for accommodating a reactor component, the reactor component thermally connected to a heat-dissipating component; a potting material filled between the reactor component and the accommodation section, whereby the reactor component and the heat transfer body are thermally connected by the potting material; the heat transfer body having a second surface and a third surface, the heat transfer body thermally connected to the heat-generating electronic component via the second surface, and the heat transfer body thermally connected to the reactor component by the potting material via the third surface; an insulating and heat-dissipating member disposed between the heat transfer body and the circuit board; and a pattern formed on the circuit board at a location corresponding to the insulating and heat-dissipating member. [Effects of the Invention]

[0012] According to the present invention, when a heat dissipation mechanism that is integrally molded into a box shape and has an opening on only one side is used, it is possible to suppress an increase in size while still being able to dissipate heat from heat-generating electronic components. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; [Figure 2] FIG. 1 is a front view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; [Figure 3] 1 is a side view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; [Figure 4] FIG. 1 is a top perspective view showing an example of a heat dissipation structure for a heat-generating electronic component according to an embodiment of the present invention; [Figure 5] FIG. 1 is a top perspective view showing an example of the configuration of a heat dissipation structure for a heat-generating electronic component according to a first modified example of the present invention; [Figure 6] FIG. 10 is a top perspective view showing an example of the configuration of a heat dissipation structure for a heat-generating electronic component according to a second modified example of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] (Embodiment) Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0015] First, an example of the configuration of a heat dissipation structure 1 for a heat-generating electronic component according to this embodiment will be described with reference to Figures 1 to 4. Figure 1 is a perspective view showing an example of the heat dissipation structure 1 for a heat-generating electronic component. Figure 2 is a front view showing an example of the heat dissipation structure 1 for a heat-generating electronic component. Figure 3 is a side view showing an example of the heat dissipation structure 1 for a heat-generating electronic component. Figure 4 is a top perspective view showing an example of the heat dissipation structure 1 for a heat-generating electronic component. Note that the front portion of the heat sink 2 is not shown in Figures 1 and 2, and the side portion of the heat sink 2 is not shown in Figure 3. Furthermore, the circuit board 9 shown in Figures 1 to 3 is not shown in Figure 4.

[0016] The heat dissipation structure 1 for a heat-generating electronic component is used, for example, in a charger or inverter mounted on a vehicle, etc. The heat dissipation structure 1 for a heat-generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5a and 5b, and a circuit board 9.

[0017] The heat sink 2 (an example of a heat dissipation mechanism) is integrally molded in a box shape, with an opening on only one side. F1 is the opening side (an example of a second side), and F2 is the bottom side (an example of a first side) opposite the opening side F1.

[0018] Support pillars 2a, 2b, 2c, and 2d are provided along a direction D (hereinafter simply referred to as the "vertical direction") perpendicular to the bottom surface F2 at the four corners of the bottom surface F2 of the heat sink 2. Screw holes (not shown) are formed in each of the support pillars 2a to 2d, and a circuit board 9 (described later) is screwed into the support pillars.

[0019] The aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum. The aluminum block 3 is disposed inside the heat sink 2 so that its longitudinal direction is aligned with the vertical direction D.

[0020] The aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at its bottom. This fastening portion 3a is fastened to the bottom surface F2 by screws 4a and 4b (an example of a fixing member). This causes the aluminum block 3 to come into contact with and be fixed to the bottom surface F2.

[0021] The electronic components 5a and 5b (examples of heat-generating electronic components) are electronic components that generate heat by themselves when energized, such as discrete components, FETs (Field Effect Transistors), etc. The electronic components 5a and 5b have lead wires 6a and 6b, respectively.

[0022] Electronic components 5a and 5b are attached to aluminum block 3 so that their heat dissipation surfaces contact the side surfaces of aluminum block 3. For example, electronic components 5a and 5b are pressed down from the surfaces facing the heat dissipation surfaces by springs 7a and 7b (an example of a holding member), respectively, and are fixedly held on the side surfaces of aluminum block 3. Springs 7a and 7b are fastened to the side surfaces of aluminum block 3 by screws 8a and 8b, respectively.

[0023] The electronic components 5a and 5b fixed to the aluminum block 3 are in an upright position along the vertical direction D. Furthermore, the electronic components 5a and 5b fixed to the aluminum block 3 do not come into contact with the heat sink 2.

[0024] As described above, heat generated from the electronic components 5a and 5b fixed to the aluminum block 3 is transferred to the heat sink 2 via the aluminum block 3. This allows heat dissipation from the electronic components 5a and 5b.

[0025] 1 to 4, two electronic components are fixed to the aluminum block 3 as an example, but the number may be one, or three or more. Furthermore, the multiple electronic components may be fixed to multiple surfaces of the aluminum block 3, not just one surface.

[0026] The circuit board 9 is a printed circuit board on which a pattern is formed and on which a predetermined semiconductor element (not shown) is mounted. The circuit board 9 is placed on the above-mentioned supports 2a to 2d. The circuit board 9 is then fastened to the supports 2a to 2d with screws 10a, 10b, 10c, and 10d. In this way, the circuit board 9 is fixed to the supports 2a to 2d.

[0027] Furthermore, the circuit board 9 is connected to the lead wires 6a of the electronic component 5a and the lead wires 6b of the electronic component 5b by, for example, soldering.

[0028] The aluminum block 3 and the circuit board 9 are arranged in the vertical direction D in the order of the aluminum block 3 and the circuit board 9 from the bottom surface F2.

[0029] The aluminum block 3 and the circuit board 9 are bonded and fixed to each other with bonds 11a and 11b (an example of an adhesive member). This increases the number of fixing points on the circuit board 9, preventing the lead wires 6a and 6b from breaking. This is particularly effective when the support posts 2a to 2d are high and vibrations are frequent.

[0030] Furthermore, it is preferable that the bonds 11a and 11b have at least one of insulating properties and heat dissipation properties. If the bonds 11a and 11b have insulating properties, it is possible to form patterns or mount semiconductor elements at the locations on the circuit board 9 that correspond to the bonds 11a and 11b. If the bonds 11a and 11b have heat dissipation properties, it is possible to transfer heat generated on the circuit board 9 to the aluminum block 3 via the bonds 11a and 11b.

[0031] Although not shown in FIGS. 1 to 4, a cover may be provided above the circuit board 9 to close the opening F1.

[0032] As described above, the heat dissipation structure 1 for heat-generating electronic components of this embodiment is arranged so that the heat dissipation surfaces of the electronic components 5a, 5b are in contact with the aluminum block 3, which is arranged in contact with the heat sink 2. Therefore, compared to when the heat dissipation surfaces of the electronic components 5a, 5b are arranged in contact with the bottom surface F2 of the heat sink 2, it is possible to accommodate heat dissipation from the electronic components while suppressing enlargement in size.

[0033] The above describes an example of the configuration of the heat dissipation structure 1 for a heat-generating electronic component.

[0034] Next, a method for manufacturing the heat dissipation structure 1 for a heat-generating electronic component will be described with reference to FIGS.

[0035] First, the electronic components 5a and 5b are fixed and bonded to the aluminum block 3 using springs 7a and 7b and screws 8a and 8b. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat dissipation insulation sheet (not shown) between the heat dissipation surfaces of the electronic components 5a and 5b and the aluminum block 3.

[0036] Next, the aluminum block 3 with the electronic components 5a and 5b fixed thereto is placed inside the heat sink 2 through the opening F1 of the heat sink 2, and the aluminum block 3 is placed on the bottom surface F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using the screws 4a and 4b.

[0037] Next, the circuit board 9 is housed inside the heat sink 2 through the opening of the heat sink 2 and placed on the supports 2a to 2d. At this time, the lead wires 6a and 6b are soldered to the circuit board 9. Then, the circuit board 9 is fastened to the supports 2a to 2d using the screws 10a to 10d.

[0038] By the above manufacturing method, the heat dissipation structure 1 for a heat-generating electronic component shown in FIGS. 1 to 4 is manufactured.

[0039] After the circuit board 9 is fastened with the screws, a cover (not shown) may be provided above the circuit board 9 to close the opening F1.

[0040] Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and various modifications are possible. Modifications will be described below.

[0041] (Variation 1) A heat dissipation structure 1 for a heat-generating electronic component according to this modified example will be described with reference to Fig. 5. Fig. 5 is a top perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component according to this modified example. In Fig. 5, the same components as those in Figs. 1 to 4 are designated by the same reference numerals, and their description will be omitted. Also, in Fig. 5, the circuit board 9 shown in Figs. 1 to 3 is not shown.

[0042] As shown in FIG. 5, this modification differs from the modifications shown in FIGS. 1 to 4 in that the heat sink 2 includes an aluminum block 30 and an electronic component 32.

[0043] The aluminum block 30 has a substantially rectangular parallelepiped fastening portion 30a at its bottom. Although Fig. 5 only shows the fastening portion 30a between support columns 2a and 2b, a similar fastening portion 30a also exists between support columns 2d and 2c.

[0044] The fastening portion 30a is screwed to the bottom surface F2 by the screw 31. As a result, the aluminum block 30 is fixed in contact with the bottom surface F2.

[0045] The aluminum block 30 also has a housing portion 30b that is provided with a substantially rectangular parallelepiped space. An electronic component 32 (for example, a reactor component, an example of a tall component) is housed in the space of this housing portion 30b. The bottom surface of the electronic component 32 is in contact with and fixed to the bottom surface F2 of the heat sink 2. Although not shown in the figure, a potting material is filled between the electronic component 32 and the housing portion 30b.

[0046] The electronic component 32 is disposed upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) with the longitudinal direction of the electronic component 32 aligned along the vertical direction D (see FIGS. 1 to 3). The length of the electronic component 32 in the vertical direction D (the longitudinal length of the electronic component 32) is longer than the length of the electronic components 5a and 5b in the vertical direction D (the longitudinal lengths of the electronic components 5a and 5b).

[0047] By disposing the electronic component 32 on the bottom surface F2 in this manner, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be disposed in that space. Therefore, the heat dissipation structure 1 for a heat-generating electronic component does not become larger in its height direction (vertical direction D).

[0048] According to this modification, in addition to the effects described in the first embodiment, it is also possible to fix (countermeasure against vibration) the electronic components 32 arranged on the bottom surface F2 of the heat sink 2. Furthermore, if the potting material is a heat-dissipating potting material, it is possible to fix (countermeasure against vibration) the electronic components 32 and also dissipate heat.

[0049] (Variation 2) A heat dissipation structure 1 for a heat-generating electronic component according to this modified example will be described with reference to Fig. 6. Fig. 6 is a top perspective view showing an example of a heat dissipation structure 1 for a heat-generating electronic component according to this modified example. In Fig. 6, the same components as those in Figs. 1 to 4 are designated by the same reference numerals, and their description will be omitted. Also, in Fig. 6, the circuit board 9 shown in Figs. 1 to 3 is not shown.

[0050] As shown in FIG. 6, this modification differs from FIGS. 1 to 4 in that the heat sink 2 is provided with electronic components 33 and 34.

[0051] The electronic components 33 and 34 (for example, reactor components, which are an example of tall components) are fixed in contact with the bottom surface F2 of the heat sink 2, respectively.

[0052] The electronic components 33, 34 are arranged upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) with the longitudinal direction of the electronic components 33, 34 aligned along the vertical direction D (see FIGS. 1 to 3). The lengths of the electronic components 33, 34 in the vertical direction D (the longitudinal lengths of the electronic components 33, 34) are longer than the lengths of the electronic components 5a, 5b in the vertical direction D (the longitudinal lengths of the electronic components 5a, 5b).

[0053] By arranging the electronic components 33 and 34 on the bottom surface F2 in this manner, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be placed in that space. Therefore, the heat dissipation structure 1 for a heat-generating electronic component does not become larger in its height direction (vertical direction D).

[0054] In this modification, in addition to the effects described in the first embodiment, heat from the electronic components 33 and 34 arranged on the bottom surface F2 of the heat sink 2 can also be dissipated.

[0055] (Variation 3) In the embodiment, an example has been described in which air cooling is performed using the heat sink 2, but water cooling may be applied instead of air cooling.

[0056] (Variation 4) In the embodiment, an example has been described in which screws are used to fasten the aluminum block 3 to the bottom surface F2, the springs 7a and 7b to the aluminum block 3, and the circuit board 9 to the supports 2a to 2d, but bonds may be used instead of screws. Also, in the embodiment, an example has been described in which springs are used to secure the electronic components 5a and 5b to the aluminum block 3, but screws may be used instead of springs.

[0057] (Variation 5) Furthermore, although the aluminum block 3 and the circuit board 9 have been described as being bonded and fixed to each other with bonds 11a and 11b (an example of an adhesive material), a non-adhesive heat dissipation material such as grease or a gap filler (an example of a heat dissipation material) may be provided between the aluminum block 3 and the circuit board 9. This allows heat generated in the circuit board 9 to be transferred to the aluminum block 3 via the grease or gap filler. Furthermore, if the grease or gap filler has insulating properties, it is possible to form a pattern or mount a semiconductor element on the circuit board 9 at a location corresponding to the grease or gap filler. [Industrial Applicability]

[0058] The present invention is useful for on-board chargers and inverters. [Explanation of symbols]

[0059] 1. Heat dissipation structure for heat-generating electronic components 2 heat sinks 2a, 2b, 2c, 2d posts 3, 30 aluminum block 3a, 30a fastening section 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 screws 5a, 5b Electronic components 6a, 6b lead wires 7a, 7b springs 9 Circuit Board 30b Storage section 32, 33, 34 Electronic Components

Claims

1. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; the heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, the reactor component is thermally connected to a heat dissipation component, a potting material is filled between the reactor part and the housing part, whereby the reactor part and the heat transfer body are thermally connected by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat-dissipating component; On-board charger.

2. The heat transfer body is The adhesive member is adhered and fixed to the circuit board. The on-board charger according to claim 1 .

3. The adhesive member is At least one of insulating property and heat dissipation property is present. The on-board charger according to claim 2 .

4. a heat dissipation member is disposed between the heat transfer body and the circuit board; The on-board charger according to any one of claims 1 to 3.

5. a member having insulating and heat-dissipating properties is disposed between the heat transfer body and the circuit board; a pattern is formed on the circuit board at a location corresponding to the insulating and heat-dissipating member; The on-board charger according to any one of claims 1 to 4.

6. The member having insulating properties and heat dissipation properties also has adhesive properties. The on-board charger according to claim 5 .

7. The reactor component is a high-profile component, The length of the tall component in the first direction is longer than the length of the heat-generating electronic component in the first direction. The on-board charger according to claim 1 .

8. the reactor component is thermally connected to the heat dissipation component by the potting material having heat dissipation properties; The on-board charger according to claim 1 .

9. the heat transfer body holds the reactor component in a housing portion provided with a space for housing the reactor component. The on-board charger according to claim 1 .

10. the reactor component is thermally connected to the heat dissipation component via the accommodation portion; The on-board charger according to claim 9.

11. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; the heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, the reactor component is thermally connected to a heat dissipation component, a potting material is filled between the reactor part and the housing part, whereby the reactor part and the heat transfer body are thermally connected by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, a heat dissipation member is disposed between the heat transfer body and the circuit board; On-board charger.

12. a member having insulating and heat-dissipating properties is disposed between the heat transfer body and the circuit board; a pattern is formed on the circuit board at a location corresponding to the insulating and heat-dissipating member; The on-board charger according to claim 11.

13. The member having insulating properties and heat dissipation properties also has adhesive properties. The on-board charger according to claim 12.

14. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; the heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, the reactor component is thermally connected to a heat dissipation component, a potting material is filled between the reactor part and the housing part, whereby the reactor part and the heat transfer body are thermally connected by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, a member having insulating and heat-dissipating properties is disposed between the heat transfer body and the circuit board; a pattern is formed on the circuit board at a location corresponding to the insulating and heat-dissipating member; On-board charger.

15. The member having insulating properties and heat dissipation properties also has adhesive properties. The on-board charger according to claim 14.

16. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; the heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, the reactor component is thermally connected to a heat dissipation component, a potting material is filled between the reactor part and the housing part, whereby the reactor part and the heat transfer body are thermally connected by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat-dissipating component; Inverter.

17. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; the heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, the reactor component is thermally connected to a heat dissipation component, a potting material is filled between the reactor part and the housing part, whereby the reactor part and the heat transfer body are thermally connected by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, the heat-generating electronic component is fixed to the heat transfer body with its longitudinal direction parallel to a first direction perpendicular to a first surface of the heat-dissipating component; Inverter.

18. A circuit board; a heat-generating electronic component connected to the circuit board; a heat transfer body on which the heat-generating electronic component is disposed; the heat transfer body has an accommodating portion provided with a space for accommodating a reactor component, the reactor component is thermally connected to a heat dissipation component, a potting material is filled between the reactor part and the housing part, whereby the reactor part and the heat transfer body are thermally connected by the potting material; the heat transfer body has a second surface and a third surface; the heat transfer body is thermally connected to the heat-generating electronic component via the second surface; the heat transfer body is thermally connected to the reactor part by the potting material via the third surface, a member having insulating and heat-dissipating properties is disposed between the heat transfer body and the circuit board; a pattern is formed on the circuit board at a location corresponding to the insulating and heat-dissipating member; Inverter.

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