Component mounting board

Abstract

To provide a component mounting circuit board of a structure with which it is possible to more reliably detect that the component mounting circuit board is immersed in a liquid.SOLUTION: A component mounting circuit board 100 includes a sheet-like wet detection sensor unit 90, the wet detection sensor unit 90 comprising a circuit board 10 that includes a substrate 11, a first conductive pattern 30 formed on the substrate 11, and a mounted component 50 which is electrically connected to the first conductive pattern 30, and a second conductive pattern 40 complementarily constituting a circuit 60 with the first conductive pattern 30. A region of the substrate 11 corresponding to the second conductive pattern 40 is a missing part 12 that is missing, and further includes a water absorbing expander 70. When the water absorbing expander 70 expands upon absorbing water, the water absorbing expander 70 pushes the substrate 11 or the second conductive pattern 40 in a direction perpendicular to the surface of the substrate 11, causing the second conductive pattern 40 to break.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a component mounting board. [Background technology]

[0002] Patent Document 1 describes a component mounting substrate (the sensor therein) that includes a first substrate and a tuned radio frequency circuit supported by the first substrate, the tuned radio frequency circuit having a first conductive pattern, a first capacitor, and a jumper, all disposed on the same side of the first substrate. The first capacitor includes a first capacitor plate, a second capacitor plate, and a first dielectric material disposed between the first capacitor plate and the second capacitor plate, the first dielectric material being soluble in a liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2014-529732 Summary of the Invention [Problem to be solved by the invention]

[0004] According to the investigations of the inventors of the present application, there is room for improvement in the reliability of the component mounting board of Patent Document 1 in detecting that the component mounting board has been immersed in liquid.

[0005] The present invention has been made in view of the above-mentioned problems, and provides a component mounting board having a structure that makes it possible to more reliably detect whether the component mounting board has been immersed in liquid. [Means for solving the problem]

[0006] According to the present invention, there is provided a component mounting substrate including a sheet-shaped wetness detection sensor portion, The wetness detection sensor unit a substrate having a base material, a first conductive pattern formed on the base material, and a mounting component electrically connected to the first conductive pattern; a second conductive pattern that forms a circuit complementary to the first conductive pattern; Equipped with a portion of the base material corresponding to the second conductive pattern is a missing portion; The component mounting board further includes a water-absorbing expansion material, When the water-absorbing expansion material expands by absorbing water, the water-absorbing expansion material presses the substrate or the second conductive pattern in a direction perpendicular to the surface of the substrate, thereby breaking the second conductive pattern, thereby providing a component mounting substrate. [Effects of the Invention]

[0007] According to the present invention, it is possible to more reliably detect whether a component mounting board has been immersed in liquid. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is an end view of a component mounting board according to a first embodiment, showing a wetness detection sensor unit and its peripheral structure. FIG. [Figure 2] 1 is an exploded end view of a component mounting board according to a first embodiment, showing a wetness detection sensor unit and its peripheral structure. [Figure 3] 1 is an end view of a component mounting board according to a first embodiment, showing a wetness detection sensor unit and its peripheral structure. FIG. [Figure 4] FIG. 1 is a plan view of a component mounting board according to a first embodiment. [Figure 5] FIG. 5 is a partial enlarged view of a portion D shown in FIG. [Figure 6] 1 is a plan view of a component mounting board according to a first embodiment, in which a water-absorbing expansion material is selectively indicated by solid lines. [Figure 7] FIG. 2 is a plan view of the substrate 10 in the first embodiment. [Figure 8] FIG. 5 is an end view taken along the line AA in FIG. 4, showing the expanded state of the water-absorbing swelling material. [Figure 9]FIG. 5 is an end view taken along line CC in FIG. 4, showing the expanded state of the water-absorbing swelling material. [Figure 10] 1 is a schematic development view of a disposable diaper including a component mounting board according to a first embodiment. FIG. [Figure 11] FIG. 10 is an end view of a component mounting board according to a second embodiment, showing a wetness detection sensor unit and its peripheral structure. DETAILED DESCRIPTION OF THE INVENTION

[0009] [First embodiment] A first embodiment of the present invention will be described below with reference to Figs. 1 to 10. In all the drawings, similar components are denoted by the same reference numerals, and descriptions thereof will be omitted where appropriate. Fig. 1 shows a cross-sectional end surface taken along line AA shown in Fig. 4, and Fig. 2 is an exploded end view of a portion corresponding to Fig. 1. Fig. 3 shows a cross-sectional end surface taken along line BB shown in Fig. 4.

[0010] As shown in FIGS. 1 and 2, a component mounting board 100 according to this embodiment includes a sheet-like wetness detection sensor unit 90. As shown in FIG. The wetness detection sensor unit 90 includes a substrate 10 having a base material 11, a first conductive pattern 30 formed on the base material 11, and a mounting component 50 electrically connected to the first conductive pattern 30, and a second conductive pattern 40 that forms a circuit 60 complementary to the first conductive pattern 30. As shown in FIG. 4, the portion of the base material 11 corresponding to the second conductive pattern 40 is a missing portion 12. The component mounting board 100 further includes a water-absorbing expansion material 70, and when the water-absorbing expansion material 70 expands by absorbing water, the water-absorbing expansion material 70 presses the base material 11 or the second conductive pattern 40 in a direction perpendicular to the surface of the base material 11, causing the second conductive pattern 40 to break. Here, the portion of the base material 11 that corresponds to the second conductive pattern 40 is the portion that corresponds to (overlaps with) the second conductive pattern 40 when viewed in the direction perpendicular to the surface of the component mounting board 100 in a plan view.

[0011] According to this embodiment, the component mounting substrate 100 is provided with a water-absorbing expansion material 70 that expands upon absorbing water, and the expanded water-absorbing expansion material 70 presses the base material 11 or the second conductive pattern 40 in a direction perpendicular to the surface of the base material 11. As a result, an external force is applied to the second conductive pattern 40, causing it to break. By detecting a change in the characteristics of the circuit 60 (mainly loss of function as the circuit 60), it is possible to indirectly detect the occurrence of a break in the second conductive pattern 40, and thereby detect that the component mounting board 100 has been immersed in liquid. Furthermore, the portion of the substrate 11 corresponding to the second conductive pattern 40 is a missing portion 12, i.e., a portion of the second conductive pattern 40 is not protected by the substrate 11, so that the second conductive pattern 40 can be more reliably broken by the water-absorbing expansion material 70. Moreover, a sufficient amount of liquid can be supplied to the water-absorbing expansion material 70 through the missing portion 12, so that the water-absorbing expansion material 70 can sufficiently absorb water and expand. As described above, according to this embodiment, it is possible to more reliably detect whether the component mounting board 100 has been immersed in liquid.

[0012] The component mounting substrate 100 is, for example, a laminate formed in a sheet shape. The planar shape of the component mounting substrate 100 is not particularly limited, but as an example, 4 As shown in FIG. 1, the shape can be made substantially rectangular (for example, rectangular with rounded corners). In the present embodiment, the mounted component 50 is, for example, a chip for RFID use (generally also called an IC chip), and the component mounting board 100 is an RFID tag.

[0013] Hereinafter, when describing the positional relationship between the components of component mounting board 100, the upper side in FIG. 1 will be referred to as the upper side or upper direction, and the opposite side will be referred to as the lower side or lower direction. Furthermore, a direction perpendicular to the up-down direction will be referred to as the horizontal direction. However, these directional specifications are for convenience only and do not limit the directions during manufacture or use of component mounting board 100. Also, Figs. 2The left - right direction in [reference] is referred to as the X - direction, and the left and right direction in FIG. 3 is referred to as the Y - direction. The X - direction and the Y - direction are directions (horizontal directions) parallel to the plane direction of the component mounting substrate 100 and are orthogonal to the up - down direction (the direction perpendicular to the plane of the component mounting substrate 100) in FIG. 1.

[0014] As shown in FIGS. 1 to 3, the wet - detection sensor unit 90 is disposed to face the base material 11 and further includes a soluble layer 21 that is soluble in a liquid or vulnerable to wetting by a liquid. The soluble layer 21 holds, for example, a part of the second conductive pattern 40. According to such a configuration, since the soluble layer 21 holding the second conductive pattern 40 dissolves due to sufficient contact with the liquid, the base material 11 or the second conductive pattern 40 is pressed in the direction perpendicular to the plane of the base material 11 by the expanded water - swelling material 70, so that the second conductive pattern 40 can be easily broken. That is, it is possible to more reliably detect that the component mounting substrate 100 has been immersed in a liquid.

[0015] As shown in FIGS. 1 and 2, in the wet - detection sensor unit 90, the first conductive pattern 30 is directly laminated on one surface 11a of the base material 11, and the second conductive pattern 40 is directly laminated on the first conductive pattern 30. Further, the base material 11 is directly laminated on the soluble layer 21.

[0016] As shown in FIGS. 4 and 6, in the case of this embodiment, the missing portion 12 is formed in a substantially H - shape in plan view. More specifically, the missing portion 12 includes, for example, a first extending portion 13a and a second extending portion 13b that extend in parallel to each other along the plane direction of the base material 11, and a third extending portion 14 that extends from the intermediate portion in the extending direction of the first extending portion 13a to the intermediate portion in the extending direction of the second extending portion 13b. Each of the first extending portion 13a and the second extending portion 13b is arranged in the same shape as each other and is arranged symmetrically. More specifically, each of the first extending portion 13a and the second extending portion 13b is formed, for example, in a substantially rectangular shape (for example, a rectangular shape with rounded corners) that is long in the Y - direction. The third extending portion 14 extends, for example, in the X direction. One end portion in the longitudinal direction of the third extending portion 14 is connected to a middle portion in the extension direction of the first extending portion 13a, and the other end portion is connected to a middle portion in the extension direction of the second extending portion 13b. However, the shape of the notch 12 is not limited to the above example. The notches 12 are openings formed in the substrate 11. That is, the notches 12 penetrate the substrate 11 from the front to the back. In the area where each notch 12 exists, the first conductive pattern 30 is not formed. Each notch 12 may be slit-shaped.

[0017] In the present embodiment, the first conductive pattern 30 includes, as an example, an antenna wiring portion and a component mounting wiring portion, which will be described below.

[0018] The antenna wiring portion has a first antenna wiring portion located on the left side and a second antenna wiring portion located on the right side in Fig. 4. The first antenna wiring portion has, for example, a wide portion 31a and a narrow portion 32a that is narrower than the wide portion 31a and extends in the X direction. The wide portion 31a includes, for example, a first portion that is generally rectangular in plan view, and a second portion that extends from the upper end of the left edge of the first portion to one side in the Y direction (upward in Figure 4) and further extends to one side in the X direction (to the right in Figure 4). The narrow width portion 32a is formed in a shape in which, for example, an intermediate portion in the longitudinal direction of the narrow width portion 32a is bent in the Y direction in a plan view. More specifically, the left and right longitudinal ends of the narrow portion 32a extend in the X direction, while the intermediate portion in the longitudinal direction extends in the Y direction, for example, from the right end of the left end to the left end of the right end. The left end of narrow portion 32a is connected to wide portion 31a, and the right end of narrow portion 32a is connected to the component mounting wiring portion. The second antenna wiring portion is formed, for example, symmetrically with the first antenna wiring portion, and has wide portion 31b and narrow portion 32b. The right end of narrow portion 32b is connected to wide portion 31b, and the left end of narrow portion 32b is connected to the component mounting wiring portion.

[0019] The component mounting wiring portion is a circular pattern configuration portion 34a, which will be described below. 、3 7a, 38a, 39a, 34b 、3 7b, 38b and 39b, and a connecting portion 36. The annular pattern component 39a is connected to the right end of the narrow width portion 32a and slopes upward from the right end of the narrow width portion 32a toward one side in the Y direction (upward in FIG. 4). The annular pattern component 38a extends from one end of the annular pattern component 39a toward one side in the Y direction (upward in FIG. 4) (i.e., extends in the Y direction). The annular pattern component 37a extends rightward from one end of the annular pattern component 38a (i.e., extends in the X direction). The annular pattern component 34a is disposed on an extension of the annular pattern component 37a with the first extension portion 13a on the left side sandwiched therebetween and extends in the X direction. The annular pattern component 39b is connected to the left end of the narrow width portion 32b and slopes upward from the left end of the narrow width portion 32b toward one side in the Y direction (upward in FIG. 4). The annular pattern component 38b extends from one end of the annular pattern component 39b toward one side in the Y direction (upward in FIG. 4) (i.e., extends in the Y direction). The annular pattern component 37b extends leftward from one end of the annular pattern component 38b (i.e., extends in the X direction). The annular pattern component 34b is disposed on an extension of the annular pattern component 37b with the second extension portion 13b on the right side sandwiched therebetween and extends in the X direction. The annular pattern component 34a and the annular pattern component 34b are arranged on extensions of each other. The connecting portion 36 extends in the X direction. More specifically, the left end of the connecting portion 36 is disposed on an extension of the boundary between the annular pattern component 39a and the narrow portion 32a, with the first extending portion 13a on the left side sandwiched therebetween. 6 The right end of the annular pattern component 39b is located on an extension of the boundary between the annular pattern component 39b and the narrow width component 32b, with the right second extension component 13b sandwiched therebetween.

[0020] The soluble layer 21 contains, for example, PVA (polyvinyl alcohol). When the soluble layer 21 contains PVA, a structure can be realized in which the soluble layer 21 dissolves well when the component mounting board 100 comes into contact with moisture. However, when the soluble layer 21 is water-soluble, the material of the soluble layer 21 is not limited to PVA, but may be, for example, polyvinylpyrrolidone, water-soluble polyester, water-soluble paper material, or sheet material derived from starch components. Furthermore, in this embodiment, the fusible layer 21 contains a resin having hot-melt properties, and is hot-melt bonded to the base material 11. That is, the fusible layer 21 is fusion-bonded to the base material 11. However, the present invention is not limited to this example, and the soluble layer 21 may be bonded to the substrate 11 by, for example, a water-soluble adhesive (not shown).

[0021] 5, the component mounting board 100 has, as the second conductive patterns 40, bridge portions 41a, 41b, and 42 each extending in the X direction, for example. That is, the component mounting board 100 has, for example, a plurality of second conductive patterns 40. figure 5As shown in Fig. 1, the bridge portion 41a interconnects the right end of the annular pattern component 37a and the left end of the annular pattern component 34a. The bridge portion 41b interconnects the left end of the annular pattern component 37b and the right end of the annular pattern component 34b. As a result, the first antenna wiring portion and the second antenna wiring portion are interconnected by the annular pattern component 37a, the bridge portion 41a, the annular pattern component 34a, the annular pattern component 34b, the bridge portion 41b, and the annular pattern component 37b. The bridge portion 42 interconnects the boundary between the annular pattern component 39a and the narrow portion 32a, and the annular pattern component 39b and the narrow portion 32b, and extends along the connecting portion 36. As a result, the annular pattern component 3 8 a, annular pattern component 37a, bridge portion 41a, annular pattern component 34a, annular pattern component 34b, bridge portion 41b, annular pattern component 37b, annular pattern component 38b, annular pattern component 39b, bridge portion 42 and annular pattern component 39 a The annular pattern is configured by the annular pattern forming portion 34a and the annular pattern forming portion 34b. The annular pattern is formed, for example, in a substantially annular shape in a plan view. The annular pattern is discontinuous between the annular pattern forming portion 34a and the annular pattern forming portion 34b. That is, the annular pattern has a shape with an opening (an open annular shape). As shown in FIGS. 1 and 5, the mounting component 50 is disposed straddling the annular pattern forming portion 34a and the annular pattern forming portion 34b.

[0022] Here, the bridge portion 41a is disposed across the first extension portion 13a on the left side, and the bridge portion 41b, right The second extension portion 13b is disposed so as to straddle the second extension portion 13b on the side. figure 51, the bridge portion 41a is provided between the annular pattern component 38a and the annular pattern component 34a to electrically connect the annular pattern component 38a and the annular pattern component 34a to each other. Similarly, the bridge portion 41b is provided between the annular pattern component 38b and the annular pattern component 34b to electrically connect the annular pattern component 38b and the annular pattern component 34b to each other. The bridge portion 42 spans the first extension portion 13a on the left side and the second extension portion 13b on the right side. More specifically, the left end of the bridge portion 42 is disposed so as to straddle the first extension portion 13a on the left side, and the right end of the bridge portion 42 is disposed so as to straddle the second extension portion 13b on the right side. The left end of the bridge portion 42 electrically connects the boundary between the annular pattern component 39a and the narrow width portion 32a to the left end of the connecting portion 36, and the right end of the bridge portion 42 electrically connects the boundary between the annular pattern component 39b and the narrow width portion 32b to the right end of the connecting portion 36.

[0023] In this way, the second conductive pattern 40 (each of the bridge portions 41a, 41b, 42) is disposed across the missing portion 12 and bridges between a first portion of the first conductive pattern 30 and a second portion of the first conductive pattern 30 that is separated from the first portion with the missing portion 12 in between, electrically connecting the first portion and the second portion to each other. That is, each of the second conductive patterns 40 forms a bridge wiring. In a side view, the second conductive pattern 40 extends over a portion of the peripheral edge of the missing portion 12, a portion of the inner circumferential surface of the missing portion 12, a portion of one surface 21a of the fusible layer 21 that corresponds to the missing portion 12, and another portion of the periphery of the missing portion 12.

[0024] The component mounting board 100 may have two portions other than the bridge portions 41a to 41a as the second conductive pattern 40, but the bridge portions 41a to 41a are wiring portions that constitute the circuit 60. That is, the portions of the second conductive pattern 40 corresponding to the missing portions 12 (bridge portions 41a to 42) are wiring portions that constitute the circuit 60, and are not electrodes or the like.

[0025] The second conductive pattern 40 (each of the bridge portions 41a, 41b, and 42) is preferably formed to be wider than the portions (annular pattern components 34a, 34b, 37a, 37b, 39a, 39b) of the first conductive pattern 30 that are connected to the second conductive pattern 40. By doing so, when the substrate 10 and the fusible layer 21 are aligned and assembled to each other, and when the second conductive pattern 40 and the first conductive pattern 30 are electrically connected to each other, even if the substrate 10 and the fusible layer 21 are slightly misaligned relative to each other in the surface direction, the second conductive pattern 40 can be appropriately aligned and connected to the first conductive pattern 30. In addition, if the first conductive pattern 30 is, for example, a pattern derived from metal foil and has a low finished impedance, and the second conductive pattern 40 is a coating film formed by printing, it is expected that the impedance of the second conductive pattern 40 will be higher than the impedance of the pattern made of the metal foil. However, by forming the second conductive pattern 40 to be wider than the portion of the first conductive pattern 30 that is connected to the second conductive pattern 40, as described above, it is advantageous in that the impedances of the first conductive pattern 30 and the second conductive pattern 40 can be matched at a low level. However, the second conductive pattern 40 may be formed to have the same width as the portion of the first conductive pattern 30 that is connected to the second conductive pattern 40, or may be formed to have a width narrower than that portion.

[0026] The length of each second conductive pattern 40 is determined by the length of the portion of the first conductive pattern 30 that is connected to the second conductive pattern 40 (annular pattern components 34a, 34b 、3 It is preferable that the length is longer than the width dimension of the connecting portion 36), the width dimension is preferably at least twice the width dimension, and more preferably at least three times the width dimension. In particular, it is preferable that the length (bridge length) of the portion of each second conductive pattern 40 that bridges between the first conductive patterns 30 (between the first portion and the second portion) is longer than the width dimension of the portion of the first conductive pattern 30 that is connected to the second conductive pattern 40, and it is preferable that the length is at least twice the width dimension, and more preferably at least three times the width dimension.

[0027] In this embodiment, the second conductive pattern 40 is insoluble in liquid. The second conductive pattern 40 is, for example, a coating formed by printing or a metal foil. More specifically, the second conductive pattern 40 is, for example, a silver pattern. The thickness of the second conductive pattern 40 is not particularly limited, but is preferably, for example, 10 μm or more and 50 μm or less. When the thickness of the second conductive pattern 40 is 10 μm or more, stable characteristics of the circuit 60 can be obtained before the component mounting substrate 100 comes into contact with a liquid. When the thickness of the second conductive pattern 40 is 50 μm or less, the second conductive pattern 40 can be easily broken when the component mounting substrate 100 comes into contact with a liquid.

[0028] However, the present invention is not limited to the above example, and for example, the second conductive pattern 40 may be soluble in liquid. In this case, it is expected that the second conductive pattern 40 will dissolve or become weak and break due to sufficient contact with the liquid, causing the circuit 60 to lose its initial characteristics. This makes it possible to detect that the component mounting board 100 has been immersed in liquid.

[0029] In this embodiment, the second conductive patterns 40 are arranged as bridge wiring in multiple locations on the circuit 60, which increases the likelihood that any of the second conductive patterns 40 will break when the component mounting board 100 comes into contact with liquid.

[0030] In the present embodiment, the base material 11 is insoluble in liquids. Therefore, even if the component mounting board 100 unintentionally comes into contact with liquid during storage, etc., it is possible to prevent the first conductive pattern 30 from being broken or cracked due to dissolution of the base material 11, which would cause a change in the characteristics of the circuit 60. The liquid-insoluble substrate 11 can be made of, for example, paper or a resin film. The resin material constituting this resin film is not particularly limited, but examples thereof include polyethylene terephthalate, polyethylene, polystyrene, polypropylene, and polyester. However, the present invention is not limited to this example, and the substrate 11 may be soluble in liquid. The thickness of base material 11 is not particularly limited, but is preferably, for example, 10 μm or more and 100 μm or less. When base material 11 has a thickness of 10 μm or more, base material 11 can stably support first conductive pattern 30, and component mounting board 100 can have sufficient structural strength. By making the thickness of the base material 11 100 μm or less, the component mounting board 100 can have good flexibility.

[0031] In the present embodiment, the first conductive pattern 30 is also insoluble in liquid. Therefore, even if the component mounting board 100 unintentionally comes into contact with liquid during storage, etc., it is possible to prevent the characteristics of the circuit 60 from changing due to dissolution of the first conductive pattern 30. In particular, it is preferable that the majority of the circuit 60 be formed of the first conductive pattern 30 that is insoluble in liquid. However, the present invention is not limited to this example, and the first conductive pattern 30 may be soluble in liquid. The first conductive pattern 30 is, for example, a coating formed by printing or a metal foil. The first conductive pattern 30 is, for example, a coating film containing a conductive filler and a binder containing a thermoplastic resin. The conductive filler is made of, for example, gold, silver, copper, or carbon. Examples of the thermoplastic resin include polyester resin, acrylic resin, and urethane resin. The first conductive pattern 30 of metal foil can be formed, for example, by stamping or etching. The thickness of the first conductive pattern 30 is not particularly limited, but is preferably, for example, not less than 5 μm and not more than 30 μm.

[0032] The outer shape of the substrate 10 (base material 11) and the outer shape of the fusible layer 21 may be the same or different. In the case of this embodiment, for example, in a plan view, the substrate 10 (base material 11) is formed in a substantially rectangular shape that is elongated in the X direction, and the fusible layer 21 is formed in a substantially rectangular shape with smaller outer dimensions than the substrate 10 (base material 11). More specifically, in plan view, the fusible layer 21 is disposed at a position corresponding to the missing portion 12 in the substrate 10 (base material 11), and the entire missing portion 12 is contained inside the outline of the fusible layer 21. Furthermore, in plan view, the entire second conductive pattern 40 and the component mounting wiring portion (annular pattern component 34a 、3 7a, 38a, 39a, 34b 、3 7b, 38b, 39b and the connecting portion 36) are contained within the outline of the fusible layer 21.

[0033] Although detailed illustrations are omitted, the mounting component 50 comprises, for example, a component body formed by resin-molding an element, and a mounting terminal provided along the underside of the component body, and the element and the mounting terminal are electrically connected to each other inside the resin mold. The number of mounting terminals provided on the mounting component 50 is not particularly limited, but in this embodiment, the mounting component 50 has two mounting terminals, each of which is electrically connected to the first conductive pattern 30. More specifically, one mounting terminal of the mounting component 50 is electrically connected to the right end of the annular pattern component 34a, and the other mounting terminal of the mounting component 50 is electrically connected to the left end of the annular pattern component 34b. In other words, the mounting component 50 is arranged across the annular pattern component 34a and the annular pattern component 34b. In this manner, the mounted component 50 is mounted on the component mounting wiring section.

[0034] The antenna wiring section transmits and receives signals to and from, for example, an external device (e.g., an RFID reader / writer) not shown. A signal or radio wave received by the antenna wiring section from the external device is input to the mounted component 50. The mounted component 50 transmits a signal to the external device via the component mounting wiring section and the antenna wiring section. Note that a part or the entire component mounting wiring section may also function as an antenna in cooperation with the antenna wiring section. The mounted component 50 is, for example, a passive type that operates by power excited from an external device via an antenna wiring portion.

[0035] In the present embodiment, when the component mounting board 100 comes into contact with a liquid, the second conductive pattern 40 breaks (described in detail below), causing a loss or deterioration of the communication function of the component mounting board 100. When an external device detects the loss or deterioration of the communication function, it can detect that the component mounting board 100 has come into contact with a liquid.

[0036] 1 to 3, the water-absorbing swelling material 70 is disposed on the other surface 21b of the soluble layer 21. In FIG. 3, the water-absorbing swelling material 70 is indicated by a two-dot chain line. The water-absorbing expansion material 70 is formed, for example, in a sheet shape and is arranged along the other surface 21b of the soluble layer 21. In plan view, the water-absorbing expansion material 70 is formed in, for example, a substantially rectangular shape that is elongated in the Y direction. In plan view, the entire water-absorbing expansion material 70 is arranged inside the outline of the soluble layer 21. Here, the water-absorbing swelling material 70 is disposed, for example, at a position on the base material 11 corresponding to a portion located between the first extending portion 13a and the second extending portion 13b. In this embodiment, the "portion of the base material 11 located between the first extending portion 13a and the second extending portion 13b" refers to, for example, a portion of the base material 11 located between the right edge of the first extending portion 13a and the left edge of the second extending portion 13b. More specifically, as shown in FIG. 5, for example, the left edge of the water-absorbing expansion material 70 substantially coincides with the right edge of the first extending portion 13a on the left side, and the right edge of the water-absorbing expansion material 70 substantially coincides with the left edge of the second extending portion 13b on the right side. In addition, in a plan view, the entire third extending portion 14 is disposed inside the outline of the water-absorbing expansion material 70. More specifically, as shown in FIG. 6, in plan view, the annular pattern component 34a and the annular pattern component in the bridge portion 41a 34 The portion corresponding to a and the annular pattern component 3 4b and a portion of bridge portion 41b corresponding to annular pattern component 34b are arranged inside the outline of the water-absorbing swelling material 70. Similarly, in plan view, connecting portion 36 and a portion of bridge portion 42 corresponding to connecting portion 36 are arranged inside the outline of the water-absorbing swelling material 70. With this configuration, as will be described later, the bridge portions 41a, 41b, and 42 connecting the first antenna wiring portion and the second antenna wiring portion to each other can be easily broken by the water-absorbing and expanding material 70. This makes it possible to more reliably detect that the component mounting board 100 has come into contact with a liquid. In the present invention, the component mounting board 100 may be configured so that the water-absorbing expansion material 70, which has absorbed water and expanded, breaks at least one of the bridge portions 41a and 41b. That is, in the present invention, the water-absorbing expansion material 70 may be disposed in at least a region that includes the bridge portion 41a or the bridge portion 41b in a plan view. For example, the outer edge of the water-absorbing expansion material 70 may be positioned in a region that overlaps with the missing portion 12, beyond the portion of the base material 11 that is located between the first extending portion 13a and the second extending portion 13b in a plan view.

[0037] One example of the water-absorbing swelling material 70 is a compressed cellulose sponge. However, the present invention is not limited to this example, and the water-absorbing swelling material 70 may be a material that expands by absorbing water other than a compressed cellulose sponge, such as a water-absorbent polymer.

[0038] Furthermore, as shown in FIGS. 1 and 2, the component mounting board 100 includes, for example, a water guide sheet 86 that is arranged on the opposite side to the wetness detection sensor unit 90 with the water-absorbing expansion material 70 sandwiched therebetween. This allows the water guide sheet 86 to absorb liquid (for example, water), so that the liquid can be supplied to the water-absorbing expansion material 70 in a sufficient amount. The water guide sheet 86 is preferably disposed in at least a region that includes the water-absorbing expansion material 70 in a plan view. The water guide sheet 86 may be disposed over the entire surface of the component mounting board 100, or may be selectively disposed in a partial region of the component mounting board 100. In this embodiment, as an example, the water guide sheet 86 is disposed in a region that includes the entire first conductive pattern 30 in a plan view.

[0039] Here, the component mounting board 100 includes, for example, a first constraining sheet (in this embodiment, a first water-permeable sheet 85 described later) arranged on one side (in this embodiment, one side 11a) of the wetness detection sensor unit 90, and a second constraining sheet (in this embodiment, a second water-permeable sheet 87 described later) arranged on the other side (in this embodiment, the other side 21b). The first and second constraining sheets constrain at least the periphery of the arrangement area of ​​the second conductive pattern 40 in the wetness detection sensor unit 90. In this embodiment, as an example, the first and second constraining sheets constrain at least the periphery of the arrangement area of ​​the first conductive pattern 30 in the wetness detection sensor unit 90. Here, the periphery of the region where the second conductive pattern 40 is arranged refers to the periphery of the region that envelops the entirety of the missing portion 12.

[0040] More specifically, in this embodiment, as shown in FIG. 7, the substrate 11 includes, for example, a main body portion 111a that is elongated in the X direction and has a generally rectangular shape in a plan view, and a plurality of fixing pieces 111b that protrude outward from the periphery of the main body portion 111a and are spaced apart from each other. A portion of the first constraining sheet is directly or indirectly fixed to one surface of each of the plurality of fixing pieces 111b, and a portion of the second constraining sheet is directly or indirectly bonded to the other surface of each of the plurality of fixing pieces 111b. Meanwhile, between the plurality of fixing pieces 111b in the surface direction of the base material 11, the first constraining sheet and the second constraining sheet are bonded to each other directly or indirectly without the fixing pieces 111b interposed therebetween. As a result, the peripheral edge of the wetness detection sensor unit 90 is restrained by the first restraining sheet and the second restraining sheet. Furthermore, the multiple fixing pieces 111b include those arranged with the main body portion 111a sandwiched between them in the X direction and those arranged with the main body portion 111a sandwiched between them in the Y direction. Therefore, the first constraining sheet and the second constraining sheet can constrain the substrate 11 at both ends of the substrate 11 in the X direction and both ends of the substrate 11 in the Y direction.

[0041] In the present embodiment, the component mounting board 100 includes, for example, a first water-permeable sheet 85 as the first constraining sheet and a second water-permeable sheet 87 as the second constraining sheet. Note that in Fig. 4, the first water-permeable sheet 85 and the second water-permeable sheet 87 are each illustrated by a two-dot chain line. This allows the first water-permeable sheet 85 or the second water-permeable sheet 87 to quickly supply liquid to the water-absorbing expansion material 70. More specifically, in both cases where the surface of the component mounting board 100 on which the first water-permeable sheet 85 is arranged is mainly immersed in liquid, and where the surface of the component mounting board 100 on which the second water-permeable sheet 87 is arranged is mainly immersed in liquid, the first water-permeable sheet 85 or the second water-permeable sheet 87 can quickly supply liquid to the water-absorbing expansion material 70.

[0042] More specifically, in this embodiment, as shown in Figure 1, a wetness detection sensor unit 90, a water-absorbing expansion material 70, and a water-conducting sheet 86 are arranged in this order from top to bottom between the first water-permeable sheet 85 and the second water-permeable sheet 87. Furthermore, a double-sided tape 91 is arranged between the other surface (the other surface 21b of the soluble layer 21) of the wetness detection sensor unit 90 and one surface (the upper surface) of the water-absorbing expansion material 70. Similarly, a double-sided tape 92 is arranged between the other surface (the lower surface) of the water-absorbing expansion material 70 and one surface (the upper surface) of the water-guiding sheet 86. In this way, the water-absorbing expansion material 70 is fixed between the other surface (the other surface 21b) of the wetness detection sensor unit 90 and one surface (the upper surface) of the water-guiding sheet 86.

[0043] In the present embodiment, for example, the outer shape of the first water permeable sheet 85 and the outer shape of the second water permeable sheet 87 are identical and coincide with each other in a plan view. A portion of the peripheral edge of the first water permeable sheet 85 and a portion of the peripheral edge of the second water permeable sheet 87 are bonded to each other (for example, by thermocompression bonding). More specifically, the peripheral edges of the first water permeable sheet 85 and the second water permeable sheet 87 are directly bonded to each other between the plurality of fixing pieces 111b in the surface direction of the substrate 11, without the fixing pieces 111b interposed therebetween. Furthermore, the portions of the peripheral edge of the first water permeable sheet 85 corresponding to the plurality of fixing pieces 111b are bonded to one side of the fixing pieces 111b, and the portions of the peripheral edge of the second water permeable sheet 87 corresponding to the plurality of fixing pieces 111b are bonded to the other side of the fixing pieces 111b. In this way, the peripheral edge of the wetness detection sensor unit 90 is restrained by the first water-permeable sheet 85 and the second water-permeable sheet 87.

[0044] The water guide sheet 86 is not particularly limited, but as an example, it is a highly water-absorbent (highly water-retentive) nonwoven fabric made of rayon, with a basis weight of, for example, 40 g / m 2 More than 80g / m 2 Less than or equal to 50 g / m 2 More than 70g / m 2 The water guide sheet 86 may be made of, for example, pulp, cotton, or hemp. Each of the first water-permeable sheet 85 and the second water-permeable sheet 87 is not particularly limited, but may be made of polyester, polypropylene, or polyethylene terephthalate, and may have a basis weight of, for example, 5 g / m 2 More than 100g / m 2 less than 10 g / m 2 More than 50g / m 2 The nonwoven fabric is as follows: This makes it possible to ensure good water permeability of each of the first water-permeable sheet 85 and the second water-permeable sheet 87.

[0045] An example of the operation when water-absorbing expansion material 70 expands by absorbing water and presses substrate 11 or second conductive pattern 40 in the direction perpendicular to the surface of substrate 11 to break second conductive pattern 40 will be described below. As shown in Figures 8 and 9, when the component mounting substrate 100 is immersed in liquid, the water-absorbing expansion material 70 absorbs the liquid and expands. Note that the soluble layer 21 may be completely dissolved by contact with the liquid, or only a portion of the soluble layer 21 may be dissolved. In the example shown in Figure 8, the portion of the soluble layer 21 corresponding to the water-absorbing expansion material 70 does not dissolve and maintains its shape. In the example shown in Figure 9, the soluble layer 21 is completely dissolved. The expanded water-absorbing expansion material 70 presses a portion of the base material 11 located between the first extension portion 13a and the second extension portion 13b and a portion of the second conductive pattern 40 located between the first extension portion 13a and the second extension portion 13b in a direction perpendicular to the surface of the base material 11 (upward in FIG. 8 in this embodiment). This causes relative displacement between the two portions of the base material 11 that sandwich the missing portion 12 therebetween. More specifically, as mentioned above, Wet The peripheral edge of the detection sensor unit 90 is restrained by the first water-permeable sheet 85 and the second water-permeable sheet 87 . Therefore, a portion of the base material 11 located between the right edge of the first extending portion 13a and the left edge of the second extending portion 13b is displaced upward relative to a portion of the base material 11 to the left of the left edge of the first extending portion 13a and a portion of the base material 11 to the right of the right edge of the second extending portion 13b. Also, a portion of the bridge portion 41a to the right of the right edge of the first extending portion 13a is displaced upward relative to a portion of the bridge portion 41a to the left of the left edge of the first extending portion 13a. Similarly, a portion of the bridge portion 41b to the left of the left edge of the second extending portion 13b is displaced upward relative to a portion of the bridge portion 41b to the right of the right edge of the second extending portion 13b. The portion of the bridge portion 42 located between the right edge of the first extension portion 13a and the left edge of the second extension portion 13b is displaced upward relative to the portion of the bridge portion 42 to the left of the left edge of the first extension portion 13a and the portion of the bridge portion 42 to the right of the right edge of the second extension portion 13b. As a result, bridge portion 41a spanning the left and right edges of first extension portion 13a, bridge portion 41b spanning the right and left edges of second extension portion 13b, and bridge portion 42 spanning the left edge of first extension portion 13a and the right edge of second extension portion 13b are each broken.

[0046] As described above, in this embodiment, the missing portion 12 includes the third extending portion 14 extending from the middle of the first extending portion 13 a in the extending direction to the middle of the second extending portion 13 b in the extending direction. In plan view, the substantially entire third extending portion 14 is disposed inside the outline of the water-absorbing expansion material 70. Therefore, the expanded water-absorbing expansion material 70 presses against the third extension portion 14, displacing the portion of the base material 11 located between the first extension portion 13a and the second extension portion 13b upward with a smaller moment. In other words, the two portions of the base material 11 sandwiching the missing portion 12 can be smoothly displaced relative to each other. 9, the third extension portion 14 and the area surrounding the third extension portion 14 in the base material 11 can be displaced upward relative to other areas by the pressure of the water-absorbing expansion material 70. This makes it possible to more reliably break the bridge portions 41a and 41b that are arranged sandwiching the third extension portion 14 in the Y direction.

[0047] Furthermore, the water-absorbing expansion material 70 is arranged so that, for example, the expansion rate in a first direction (in this embodiment, the thickness direction of the water-absorbing expansion material 70) is greater than the expansion rate in a second direction (in this embodiment, the width direction of the water-absorbing expansion material 70) perpendicular to the first direction, and the first direction coincides with the direction perpendicular to the surface of the substrate 11. This allows the two portions of the substrate 11 sandwiching the missing portion 12 to be sufficiently displaced relative to each other in the direction perpendicular to the surface of the substrate 11 (up and down direction), so that the second conductive pattern 40 (bridge portions 41a, 41b, 42) is more reliably broken.

[0048] As an example, the thickness of the water-absorbing expansion material 70 before expansion is, for example, 0.2 mm. m Preferably, the thickness is 3 mm or less, and more preferably, 0.5 mm or less. m It is preferable that the thickness is 2 mm or more. As an example, the thickness of the water-absorbing expansion material 70 in an expanded state is preferably 1 mm or more and 20 mm or less, and more preferably 5 mm or more and 15 mm or less.

[0049] In this way, the water-absorbing swelling material 70 presses a portion of the base material 11, causing relative displacement between two portions of the base material 11 that sandwich the missing portion 12 therebetween. Furthermore, the missing portion 12 includes, for example, a first extension portion 13a and a second extension portion 13b extending parallel to each other along the surface direction of the substrate 11, and the water-absorbing expansion material 70 is arranged at a position corresponding to the portion of the substrate 11 located between the first extension portion 13a and the second extension portion 13b, and presses against that portion of the substrate 11. The water-absorbing expansion material 70 is formed in a sheet shape, and the first direction is the thickness direction of the water-absorbing expansion material 70.

[0050] As an example, the component mounting board 100 according to this embodiment is attached to an absorbent article (for example, a disposable diaper 300 shown in FIG. 10) that is configured to be able to absorb liquid. Note that FIG. 10 shows the surface of the disposable diaper 300 that comes into contact with the wearer's skin. Also, FIGS. 1, 3, 8, and 9 show, as an example, a state in which the component mounting board 100 is attached to the disposable diaper 300. When the wearer urinates into the disposable diaper 300 and the water-absorbing swelling material 70 expands due to the urine, this expansion can be detected, thereby detecting the wearer's urination. In other words, the component mounting board 100 is used as a urination sensor that notifies the caregiver when it is time to change the disposable diaper 300.

[0051] 10, the disposable diaper body 301 includes a rear section 310 that is placed on the back side of the user, a front section 320 that is placed on the belly side of the user, a connecting section 330 that connects the rear section 310 and the front section 320, and a plurality of hook-and-loop fastener sections 340 formed on the sides of the rear section 310. By connecting both sides of the rear section 310 and the front section 320 via the hook-and-loop fastener sections 340, the disposable diaper 300 can be put on by the user. In the disposable diaper 300, an absorbent body 350 configured to be able to absorb liquid is formed on the surface that comes into contact with the skin of the user. The absorber 350 extends in the front-rear direction across the rear portion 310, the front portion 320, and the connecting portion 330, for example. When the disposable diaper 300 is worn by a user, the absorber 350 is positioned in contact with the user's external urethral meatus, and when the user urinates, the urine is absorbed by the absorber 350.

[0052] Each of the component mounting boards 100 is preferably disposed on the surface of the disposable diaper body 301 that comes into contact with the skin of the user, for example. In the present embodiment, as an example, each of the component mounting substrates 100 is attached with double-sided tape. 93、94 The cover 301 is adhered to the disposable diaper body 301 via a hook-and-loop fastener (not shown) or the like. In addition, in each of the component mounting boards 100, for example, one surface (one surface 11a) of the wetness detection sensor unit 90 is disposed on the side that comes into contact with the user's skin, and the other surface (other surface 21b) of the wetness detection sensor unit 90 is disposed on the side opposite to the side that comes into contact with the user's skin (i.e. paper In the example shown in FIG. 1, the second water-permeable sheet 87 is attached to the disposable diaper body 301 in a position where it is disposed on the side of the diaper body 301. 93、94 The protective sheet 304 is attached to the surface of the disposable diaper body 301 that comes into contact with the user's skin via the protective sheet 304 .

[0053] The component mounting board 100 is provided, for example, in the absorber 350 of the disposable diaper main body 301. The component mounting board 100 may be provided in a portion of the absorber 350 corresponding to the connecting portion 330 or in a portion corresponding to the front portion 320, as long as it is within the range of the portion 302 corresponding to the external urethral meatus. In other words, the position of the component mounting board 100 can be changed as desired within the range of the portion 302 corresponding to the external urethral meatus, making it suitable for use by any gender of user. In the example shown in FIG. 10, the component mounting board 100 is placed in a position where the longitudinal direction of the component mounting board 100 is the front-rear direction.

[0054] However, in the present invention, the position of the component mounting board 100 in the disposable diaper 300 is not limited to the above example, and the component mounting board 100 may be arranged, for example, along the periphery of a portion of the disposable diaper body 301 other than the portion 302 corresponding to the external urethral meatus (for example, the upper edge 310a of the rear portion 310 or the lower edge of the front portion 320). In this way, urine leaking from the disposable diaper body 301 can be more reliably detected by the component mounting board 100. Furthermore, in the present invention, the shape, direction, arrangement, posture, etc. of each component mounting board 100 are not particularly limited, and can be set appropriately depending on the size, use, etc. of the disposable diaper body 301. Furthermore, in the present invention, the number of component mounting boards 100 arranged on the disposable diaper 300 is not particularly limited, and the number of component mounting boards 100 arranged on the disposable diaper 300 may be two or more. In this case, for example, the component mounting board 100 may be disposed at the portion 302 corresponding to the external urethral meatus and on the periphery of a portion other than the portion 302 corresponding to the external urethral meatus.

[0055] Next, a method for manufacturing the component mounting board 100 in this embodiment will be described. The manufacturing method of the component mounting board 100 in this embodiment includes the steps of preparing the board 10, assembling the board 10 and the soluble layer 21 together, printing and forming the second conductive pattern 40 on the board 10 and the soluble layer 21, and joining the first water-permeable sheet 85 and the second water-permeable sheet 87 together. In the step of preparing the substrate 10, the substrate 10 (see FIG. 7) is prepared, which has a base material 11, a first conductive pattern 30 formed on the base material 11, and a mounting component 50 electrically connected to the first conductive pattern 30. In the step of assembling the substrate 10 and the fusible layer 21 to each other, the substrate 10 and the fusible layer 21 are assembled to each other so that the fusible layer 21 is arranged in a region that includes the missing portion 12 in a plan view. That is, the substrate 10 and the fusible layer 21 are aligned so as to face each other, and then the substrate 10 and the fusible layer 21 are bonded to each other. In the process of printing and forming the second conductive pattern 40 on the substrate 10 and the fusible layer 21, the first conductive pattern 30 and the second conductive pattern 40 form a complementary circuit 60, and the second conductive pattern 40 is arranged to straddle the corresponding missing portion 12. In this way, a wetness detection sensor unit 90 is obtained. In the step of joining the first water-permeable sheet 85 and the second water-permeable sheet 87 to each other, , wet Leak detection sensor unit 90 , both Velcro 91, Water-absorbing expansion material 70 , both Velcro tape 92, Water conduction sheet 86, The first water-permeable sheet 85 and the second water-permeable sheet 87 are laminated in this order from the top, and a part of the peripheral edge of the first water-permeable sheet 85 and a part of the peripheral edge of the second water-permeable sheet 87 are joined to each other. As a result, the component mounting board 100 of this embodiment is obtained.

[0056] The substrate 10 and the fusible layer 21 can be bonded together by thermocompression bonding (thermal lamination) the substrate 10 and the fusible layer 21 to each other. For example, the step of thermocompression bonding the substrate 10 and the fusible layer 21 to each other is preferably carried out at a temperature of 80°C or higher and 150°C or lower, more preferably 100°C or higher and 120°C or lower. The heating time can be, for example, about 5 to 10 seconds. The thermocompression bonding step is preferably carried out under a pressure of 0.3 MPa or higher and 3.0 MPa or lower, and more preferably under a pressure of 1.0 MPa or higher and 2.0 MPa or lower. By bonding the substrate 10 and the fusible layer 21 together in this manner, the second conductive pattern 40 can be electrically connected to the first conductive pattern 30 in a satisfactory manner.

[0057] Similarly, the first water-permeable sheet 85 and the second water-permeable sheet 87 can be bonded together by thermocompression bonding (thermal lamination) the first water-permeable sheet 85 and the second water-permeable sheet 87 to each other.

[0058] The method for forming the notched portion 12 in the substrate 10 is not particularly limited, but as an example, it is formed by punching, and a typical method is to mainly use a blade or punch. However, the present invention is not limited to this example, and for example, laser processing or the like can also be applied.

[0059] Second Embodiment Next, a second embodiment will be described with reference to Fig. 11. Fig. 11 shows a cross-sectional end surface of a portion corresponding to Fig. 1. The component mounting board 100 according to this embodiment differs from the component mounting board 100 according to the first embodiment in the points described below, but is otherwise configured in the same way as the component mounting board 100 according to the first embodiment.

[0060] In this embodiment, the water-absorbing expansion material 70 is disposed at a position corresponding to the second conductive pattern 40 and presses the second conductive pattern 40 at the missing portion 12. Even with this configuration, the expanded water-absorbing expansion material 70 breaks the second conductive pattern 40, making it possible to more reliably detect that the component mounting board 100 has been immersed in liquid.

[0061] As shown in FIG. 11, the component mounting board 100 includes a plurality of water-absorbing expansion materials 70, which are arranged on the side of the base material 11 opposite to the soluble layer 21 side. 11, the component mounting board 100 includes a pair of left and right water-absorbing expansion materials 71 and 72, with the left water-absorbing expansion material 71 being disposed inside the first extending portion 13a and the right water-absorbing expansion material 72 being disposed inside the second extending portion 13b. The left water-absorbing expansion material 71 is directly laminated on the bridge portion 41a at a location corresponding to the first extending portion 13a, and the right water-absorbing expansion material 72 is disposed inside the second extending portion 13b. 2 is directly laminated on the bridge portion 41b at a location corresponding to the second extending portion 13b. Furthermore, for example, double-sided tape 91 is provided on each of the left and right pair of water-absorbing expansion materials 71, 72 at the end facing the first water-permeable sheet 85, and the left and right pair of water-absorbing expansion materials 71, 72 are fixed to the first water-permeable sheet 85 by the double-sided tape 91. When the component mounting board 100 is immersed in liquid, the expanded water-absorbing expansion materials 71, 72 directly press the corresponding bridge portions 41a, 41b in the direction perpendicular to the surface of the base material 11 (in this embodiment, downward in Figure 11), causing the bridge portions 41a, 41b to break. That is, even with this configuration, it is possible to more reliably detect that the component mounting board 100 has been immersed in liquid.

[0062] As shown in FIG. 11, in this embodiment, the component mounting board 100 further includes a spacer 76 that is arranged along the other surface 21b of the fusible layer 21. In the spacer 76, portions corresponding to the first extending portion 13a and the second extending portion 13b are respectively missing to form second missing portions 77. This ensures that each of the pair of left and right water-absorbing expansion materials 71, 72 has sufficient space to expand in the direction perpendicular to the surface of the substrate 11 (thickness direction of the water-absorbing expansion materials 71, 72), so that the expanded water-absorbing expansion materials 71, 72 can more reliably break the second conductive pattern 40.

[0063] In this embodiment, for example, an insoluble sheet material (not shown) may be disposed instead of the soluble layer 21. In this case, it is preferable that the sheet material is configured so that when the expanded water-absorbing and swelling materials 71 and 72 rupture the second conductive pattern 40, the sheet material is also ruptured by the water-absorbing and swelling materials 71 and 72.

[0064] Although the embodiments have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted.

[0065] For example, in the above description, an example has been given in which the mounted component 50 is an RFID chip, but the present invention is not limited to this example, and the mounted component 50 may be other electronic components, such as a capacitor or resistor.

[0066] Furthermore, in the above description, an example has been described in which the second conductive pattern 40 is provided between a first portion of the first conductive pattern 30 and a second portion of the first conductive pattern 30 that is separated from the first portion with the missing portion 12 sandwiched therebetween, but the present invention is not limited to this example, and the second conductive pattern 40 may not be provided between the first conductive patterns 30 but may simply be connected to the first conductive pattern 30. A simple example is one in which the left half of the circuit 60 shown in FIG. 1 is formed by the first conductive pattern 30 and the right half is formed by the second conductive pattern 40.

[0067] Furthermore, in the above description, an example has been described in which the substrate 10 has one missing portion 12, but the number of missing portions 12 that the substrate 10 has is not particularly limited, and may be, for example, two or more.

[0068] The present embodiment encompasses the following technical ideas. (1) A component mounting board having a sheet-shaped wetness detection sensor unit, The wetness detection sensor unit a substrate having a base material, a first conductive pattern formed on the base material, and a mounting component electrically connected to the first conductive pattern; a second conductive pattern that forms a circuit complementary to the first conductive pattern; Equipped with a portion of the base material corresponding to the second conductive pattern is a missing portion; The component mounting board further includes a water-absorbing expansion material, When the water-absorbing expansion material expands by absorbing water, the water-absorbing expansion material presses against the substrate or the second conductive pattern in a direction perpendicular to the surface of the substrate, thereby breaking the second conductive pattern. (2) The component mounting board according to (1), wherein the water-absorbing expansion material presses a portion of the base material, causing relative displacement between two portions of the base material that sandwich the missing portion therebetween. (3) The missing portion includes a first extending portion and a second extending portion extending parallel to each other along a surface direction of the base material, The component mounting board described in (2) is such that the water-absorbing expansion material is positioned at a position on the base material corresponding to the portion located between the first extension portion and the second extension portion, and presses against that portion of the base material. (4) The component mounting board according to (3), wherein the missing portion includes a third extending portion extending from a middle portion in the extending direction of the first extending portion to a middle portion in the extending direction of the second extending portion. (5) The component mounting board according to (1), wherein the water-absorbing expansion material is disposed at a position corresponding to the second conductive pattern and presses the second conductive pattern at the missing portion. (6) A component mounting substrate according to any one of (1) to (5), wherein the expansion coefficient of the water-absorbing expansion material in a first direction is greater than the expansion coefficient in a second direction perpendicular to the first direction, and the first direction is arranged so as to coincide with the direction perpendicular to the surface of the substrate. (7) The water-absorbing swelling material is formed into a sheet shape, The component mounting board according to (6), wherein the first direction is a thickness direction of the water-absorbing expansion material. (8) The component mounting board according to any one of (1) to (7), further comprising a water guide sheet disposed on the opposite side of the wetness detection sensor unit with the water-absorbing expansion material sandwiched therebetween. [Explanation of symbols]

[0069] 10 Substrate 11 Base material 11a One side 11b The other side 111a Main body 111b Fixed piece 12 Missing parts 13a 1st extension part 13b Second extension part 14 Third extension part 21 Soluble layer 21a One side 21b The other side 30 First conductive pattern 31a, 31b wide section 32a, 32b narrow part 34a, 34b 、3 7a, 37b, 38a, 38b, 39a, 39b Circular pattern components 36 Connecting part 40 Second conductive pattern 41a, 41b, 42 Bridge section 50 Mounting parts 60 circuits 70, 71, 72 Water-absorbing expansion material 76 Spacer 77 Second Missing Department 8 5. First permeable sheet 86 Water Conduction Sheet 87 Second permeable sheet 90 Wetness detection sensor 91, 92 double-sided tape 93, 94 Double-sided tape 100 component mounting board 300 disposable diapers 301 Disposable diaper body 302 Area corresponding to the external urethral meatus 310 rear 310a Upper edge 320 front 330 Connection section 340 hook-and-loop fastener 350 absorber

Claims

1. A component mounting board having a sheet-shaped wetness detection sensor unit, The wetness detection sensor unit a substrate having a base material, a first conductive pattern formed on the base material, and a mounting component electrically connected to the first conductive pattern; a second conductive pattern that forms a circuit complementary to the first conductive pattern; Equipped with a portion of the base material corresponding to the second conductive pattern is a missing portion; The component mounting board further includes a water-absorbing expansion material, When the water-absorbing expansion material expands by absorbing water, the water-absorbing expansion material presses against the substrate or the second conductive pattern in a direction perpendicular to the surface of the substrate, thereby breaking the second conductive pattern.

2. The component mounting board according to claim 1 , wherein the water-absorbing expansion material presses a portion of the base material, causing relative displacement between two portions of the base material that sandwich the missing portion therebetween.

3. the missing portion includes a first extending portion and a second extending portion extending parallel to each other along a surface direction of the base material, The component mounting board according to claim 2, wherein the water-absorbing expansion material is arranged at a position on the base material corresponding to a portion located between the first extension portion and the second extension portion, and presses against that portion of the base material.

4. The component mounting board according to claim 3 , wherein the missing portion includes a third extending portion that extends from a middle portion in the extending direction of the first extending portion to a middle portion in the extending direction of the second extending portion.

5. The component mounting board according to claim 1 , wherein the water-absorbing expansion material is disposed at a position corresponding to the second conductive pattern and presses the second conductive pattern at the missing portion.

6. 6. A component mounting substrate according to claim 1, wherein the expansion coefficient of the water-absorbing expansion material in a first direction is greater than the expansion coefficient in a second direction perpendicular to the first direction, and the first direction is aligned with the direction perpendicular to the surface of the substrate.

7. The water-absorbing swelling material is formed into a sheet shape, The component mounting board according to claim 6 , wherein the first direction is a thickness direction of the water-absorbing expansion material.

8. The component mounting board according to claim 1 , further comprising a water guide sheet disposed on the opposite side of the wetness detection sensor unit with the water-absorbing expansion material sandwiched therebetween.

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